WO2022199081A1 - 显示面板和显示装置 - Google Patents
显示面板和显示装置 Download PDFInfo
- Publication number
- WO2022199081A1 WO2022199081A1 PCT/CN2021/132197 CN2021132197W WO2022199081A1 WO 2022199081 A1 WO2022199081 A1 WO 2022199081A1 CN 2021132197 W CN2021132197 W CN 2021132197W WO 2022199081 A1 WO2022199081 A1 WO 2022199081A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- base substrate
- electrode plate
- conductive
- conductive pattern
- display panel
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 119
- 239000003990 capacitor Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000005286 illumination Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
Definitions
- the present disclosure relates to the field of display technology, and in particular, to a display panel and a display device.
- Self-luminous display devices such as organic light-emitting diode (Organic Light-Emitting Diode, OLED) display panels have the advantages of self-luminescence, lightness, low power consumption, good color reproduction, sensitive response and wide viewing angle, etc., and have been more and more widely used.
- OLED Organic Light-Emitting Diode
- display devices such as mobile phones, notebook computers and TVs, it has become the mainstream of the current market.
- a display panel comprising: a base substrate; and a pixel driving circuit disposed on the base substrate, the pixel driving circuit comprising: a driving transistor and a capacitor; the driving transistor comprising: a gate and a an active layer, the active layer of the driving transistor includes an active part, a first conductive part and a second conductive part, the gate is farther from the base substrate than the active layer, the The active part includes an edge that is flush with the gate; the capacitor includes: a first electrode plate and a second electrode plate opposite to each other along the thickness direction of the base substrate, the first electrode plate and the The gate of the driving transistor is coupled, the second electrode plate is disposed on the side of the gate away from the base substrate, and the second electrode plate can shield light, and the active portion is aligned with the gate.
- the orthographic projection of the flat edge on the base substrate is located within the orthographic projection of the second plate on the base substrate.
- the active part of the driving transistor is located within the orthographic projection of the second electrode plate on the base substrate; or, an opening is provided on the second electrode plate, the The second electrode plate has an inner edge and an outer edge, the edge of the opening constitutes the inner edge of the second electrode plate, and the edge of the active part of the driving transistor that is flush with the gate is on the base substrate
- the orthographic projection on the second pole plate is located between the orthographic projection of the outer edge of the second pole plate on the base substrate and the orthographic projection of the inner edge of the second pole plate on the base substrate.
- the driving transistor further includes: a first conductive pattern; the first conductive portion of the driving transistor has a first contact, and the second conductive portion of the driving transistor has a second contact part; the first contact part is in contact with the first conductive pattern, and the second contact part is in contact with the second electrode plate.
- the first conductive pattern and the second electrode plate are disposed in the same layer, and the first contact portion is farther from the active portion than the second contact portion.
- the pixel driving circuit further includes: a first switch transistor; the first switch transistor includes an active layer, and the active layer of the first switch transistor includes an active part, a first conductive part, and a second conductive part; the first conductive part of the first switch transistor is used to receive a reset signal or provide a sensing signal, and the second conductive part of the first switch transistor is coupled to the second plate catch.
- the pixel driving circuit further includes: a light-shielding metal layer disposed on the side of the active layer of the driving transistor close to the substrate; the active part of the driving transistor is on the substrate
- the orthographic projection on the substrate is located within the orthographic projection of the light-shielding metal layer on the base substrate, and the light-shielding metal layer is coupled to the second electrode plate.
- the pixel driving circuit when the pixel driving circuit further includes a first switching transistor, the pixel driving circuit further includes: a second conductive pattern; the second conductive portion of the first switching transistor has a second conductive pattern. Three contact parts, the third contact part is in contact with the second conductive pattern; the second electrode plate and the second conductive pattern are connected in an integrated structure, or the second electrode plate is on the substrate There is a gap between the orthographic projection on the substrate and the orthographic projection of the second conductive pattern on the base substrate, and the second conductive pattern and the second electrode plate are respectively coupled to the light-shielding metal layer .
- the active layer of the first switching transistor and the active layer of the driving transistor are arranged in the same layer, and the second conductive pattern and the second electrode plate are arranged in the same layer;
- the pixel driving The circuit further includes a first insulating layer disposed between the active layer of the first switching transistor and the second conductive pattern, and a second insulating layer disposed between the active layer of the first switching transistor and the light-shielding metal layer an insulating layer;
- the first insulating layer is provided with a first via hole
- the second insulating layer is provided with a second via hole, and the first via hole and the second via hole are located in the base substrate
- the orthographic projections on the top overlap, the second conductive pattern is in contact with the third contact portion through the first via hole, and the light-shielding metal layer is coupled with the third contact portion through the second via hole.
- the second conductive pattern faces the second electrode plate in both a first direction and a second direction, the first direction and the second direction being parallel to the substrate The plane on which the substrate is located, and two directions that are perpendicular to each other.
- the first electrode plate is disposed in the same layer as the active layer of the driving transistor, and the orthographic projection of the first electrode plate on the base substrate is at the same level as the second electrode plate.
- the orthographic projections on the base substrate overlap.
- the pixel driving circuit further includes: a second switch transistor; the second switch transistor includes an active layer, and the active layer of the second switch transistor includes an active part, a first conductive part, and a second conductive part; the first conductive part of the second switch transistor is used for receiving a data signal, and the second conductive part of the second switch transistor is coupled to the gate of the driving transistor.
- the method further includes: a power supply line disposed on the base substrate; and the first conductive portion of the driving transistor in the pixel driving circuit is coupled to the power supply line.
- the driving transistor when the driving transistor further includes a first conductive pattern, the power line and the first conductive pattern are disposed in the same layer, and the power line is in contact with the first conductive pattern.
- the display panel when the pixel driving circuit further includes a light-shielding metal layer, the display panel further includes: a third conductive pattern provided in the same layer as the light-shielding metal layer, the third conductive patterns are respectively is coupled to the first conductive portion of the driving transistor and the power supply line.
- the method further includes: a sensing signal line disposed on the base substrate; and a first conductive portion of the first switch transistor is coupled to the sensing signal line.
- the method further includes: a fourth conductive pattern provided in the same layer as the light-shielding metal layer, the fourth conductive pattern is respectively connected with the first conductive portion of the first switching transistor and the sensing The signal line is coupled.
- the method further includes: a light emitting device disposed on the base substrate and coupled to the pixel driving circuit; the light emitted by the light emitting device is emitted from a side away from the base substrate.
- a display device comprising: the above-mentioned display panel.
- FIG. 1 is a top structural view of a display panel according to some embodiments
- FIG. 2 is a top-view structural diagram of a pixel driving circuit according to some embodiments.
- FIG. 3 is a cross-sectional structural view in the direction A-A' based on FIG. 2 according to some embodiments;
- FIG. 5 is a top-view structural view of another pixel driving circuit provided by the related art.
- Fig. 6 is a kind of cross-sectional structure diagram in A-A' direction based on Fig. 4 and Fig. 5 that the related art provides;
- Fig. 7 is a kind of cross-sectional structure diagram in B-B' direction based on Fig. 4 and Fig. 5 that the related art provides;
- Fig. 8 is a kind of cross-sectional structure diagram in the C-C' direction based on Fig. 4 and Fig. 5 that the related art provides;
- FIG. 9 is a top structural view of another pixel driving circuit according to some embodiments.
- Figure 10 is a cross-sectional structural view in the direction A-A' based on Figure 9 according to some embodiments;
- FIG. 11 is a top structural view of yet another pixel driving circuit according to some embodiments.
- FIG. 12 is a cross-sectional structural view in the direction B-B' based on FIG. 11 according to some embodiments;
- 13 is an equivalent circuit diagram of a 3T1C pixel drive circuit according to some embodiments.
- FIG. 14 is a block diagram of two capacitors in parallel, according to some embodiments.
- FIG. 15 is a top structural view of a display panel according to some embodiments.
- first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
- plural means two or more.
- At least one of A, B, and C has the same meaning as “at least one of A, B, or C”, and both include the following combinations of A, B, and C: A only, B only, C only, A and B , A and C, B and C, and A, B, and C.
- a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
- the "first electrode” is, for example, the source of the thin film transistor
- the “second electrode” is, for example, the drain of the thin film transistor, and vice versa.
- the same reference numerals may refer to both signal lines and signal terminals and the signals corresponding to the signal lines and signal terminals.
- Exemplary embodiments are described herein with reference to cross-sectional and/or plan views that are idealized exemplary drawings.
- the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes of the drawings due to, for example, manufacturing techniques and/or tolerances, are contemplated.
- example embodiments should not be construed as limited to the shapes of the regions shown herein, but to include deviations in shapes due, for example, to manufacturing. For example, an etched area shown as a rectangle will typically have curved features.
- the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
- the display device may be an OLED (Organic Light-Emitting Diode) display device, a QLED (Quantum Dot Light Emitting Diodes, quantum dot light-emitting diode) display device, a MicroLED (Micro Light Emitting Diodes, micro light-emitting diodes), miniLED (mini Light Emitting Diodes, mini light-emitting diodes) display devices and the like.
- OLED Organic Light-Emitting Diode
- QLED Quantum Dot Light Emitting Diodes, quantum dot light-emitting diode
- MicroLED Micro Light Emitting Diodes, micro light-emitting diodes
- miniLED mini Light Emitting Diodes, mini light-emitting diodes
- the structure of the display device will be introduced by taking the display device as an OLED display device as an example.
- the display device includes, for example, a display panel. As shown in FIG. 1 , the display panel has a display area A and a peripheral area S disposed around the display area A.
- the display area A includes a plurality of sub-pixel areas P, and the peripheral area S is used for wiring, such as the gate driving circuit 100 .
- the display panel includes: a base substrate 1 , a pixel driving circuit 10 disposed on the base substrate 1 and located in the sub-pixel region P, and a pixel driving circuit 10 coupled to the pixel driving circuit 10 .
- the light emitting device 20 and the gate driving circuit 100 are connected to the pixel driving circuit 10 , and the light emitting device 20 emits light under the driving of the pixel driving circuit 10 .
- the above-mentioned pixel driving circuit 10 can be, for example, a 2T1C type pixel driving circuit, a 3T1C type pixel driving circuit, or a 7T1C type pixel driving circuit, wherein T represents a thin-film transistor (TFT), and C Representing the storage capacitor, the 2T1C type represents the pixel driving circuit 10 including two TFTs and one storage capacitor Cst, and so on.
- T represents a thin-film transistor (TFT)
- the 2T1C type represents the pixel driving circuit 10 including two TFTs and one storage capacitor Cst, and so on.
- the TFT especially the metal oxide semiconductor TFT, will degrade the characteristics of the TFT device under illumination conditions.
- NBS namely NBIS (Negative gate bias illumination stress, negative gate bias illumination stress, negative gate bias illumination stress, negative gate bias illumination stress, negative gate bias illumination stress, negative gate bias illumination stress, negative gate bias illumination stress) stress
- TFT device transfer characteristics will have a significant negative shift, which is manifested as a negative shift of the threshold voltage (V th ) under NBIS. Therefore, it is particularly important to improve the threshold voltage stability of TFTs under NBIS.
- the pixel driving circuit 10 includes a driving transistor T1 and a capacitor Cst.
- the driving transistor T1 includes a gate g and an active layer 11
- the active layer 11 of the driving transistor T1 includes an active part 11 a , a first conductive part 11 b and a second conductive part 11 c
- the gate g is farther away from the active layer 11
- the active portion 11a includes an edge i that is flush with the gate g.
- the driving transistor T1 is a top-gate transistor
- the active portion 11a is the channel region (referring to the region where the active layer 11 and the gate g overlap)
- the material of the active portion 11a can be a metal semiconductor material,
- IGZO indium gallium zinc oxide, indium gallium zinc oxide
- the first conductive portion 11b and the second conductive portion 11c can be made of materials after conducting IGZO treatment, and serve as the source region and the drain region of the driving transistor T1 ( As shown in FIG. 2, the source region and the drain region are regions located on both sides of the active portion 11a).
- the capacitor Cst includes a first pole plate C1 and a second pole plate C2 that are oppositely disposed along the thickness direction of the base substrate 1 .
- the first plate C1 is coupled to the gate g of the driving transistor T1
- the second plate C2 is disposed on the side of the gate g away from the base substrate 1, and the second plate C2 can shield light
- the active portion 11a is connected to the gate g.
- the orthographic projection of the flush edge i of the pole g on the base substrate 1 is located within the orthographic projection of the second pole plate C2 on the base substrate 1 .
- the orthographic projection of the edge i of the active portion 11a flush with the gate g on the base substrate 1 is located within the orthographic projection of the second electrode plate C2 on the base substrate 1, which means that the active portion 11a and the gate
- the orthographic projection of the edge i that is flush with the electrode g on the base substrate 1 overlaps with the orthographic projection of the second electrode plate C2 on the base substrate 1, and the edge i of the active portion 11a that is flush with the gate g is on the substrate.
- the edge of the active portion 11a may include two parts, the first part is the part that is flush with the edge of the gate g , the second part is the part j that is flush with the edge of the active layer 11 .
- the portion where the edge of the active portion 11A is flush with the edge of the gate g is the edge i where the active portion 11a is flush with the edge of the gate g.
- the edge i of the active portion 11a that is flush with the gate g may include an upper edge i1 and a lower edge i2.
- the orthographic projection of the edge i of the active portion 11a flush with the gate g on the base substrate 1 is located within the orthographic projection of the second electrode plate C2 on the base substrate 1, which means that the upper edge i1 and
- the orthographic projection of the lower edge i2 on the base substrate 1 is located within the orthographic projection of the second pole plate C2 on the base substrate 1 .
- the light emitted by the light emitting device 20 is emitted from a side away from the base substrate 1 . That is, the display panel may be a top emission type display panel.
- the orthographic projection of the edge i of the active portion 11a flush with the gate g on the base substrate 1 is located within the orthographic projection of the second electrode plate C2 on the base substrate 1, and there are two possibilities.
- the orthographic projection of the active portion 11 a on the base substrate 1 is located within the orthographic projection of the second electrode plate C2 on the base substrate 1 . That is, the orthographic projection of the active portion 11a on the base substrate 1 overlaps with the orthographic projection of the second plate C2 on the base substrate 1, and all the edges (including the edge i and the edge j) of the active portion 11a and There is a gap between the edges of the second electrode plate C2.
- the second situation is provided with opening K on the second pole plate C2, the second pole plate C2 has an inner edge and an outer edge, and the edge of the opening K constitutes the inner edge of the second pole plate C2 , the orthographic projection of the edge i of the active portion 11a flush with the gate g on the base substrate 1 is located in the orthographic projection of the outer edge of the second electrode plate C2 on the base substrate 1, and the inner portion of the second electrode plate C2 The edges are between orthographic projections on the base substrate 1 .
- the orthographic projection of the edge i of the active portion 11a flush with the gate g on the base substrate 1 overlaps with the orthographic projection of the second electrode plate C2 on the base substrate 1, and the active portion 11a and the gate g
- the orthographic projection of the flush edge i on the base substrate 1 and the orthographic projection of the outer edge of the second electrode plate C2 on the base substrate 1 and the flush edge i of the active portion 11a and the gate g is between There is a gap between the orthographic projection on the base substrate 1 and the orthographic projection of the inner edge of the second electrode plate C2 on the base substrate 1 .
- the opening K may be closed, that is, as shown in FIG. 9 , the edge of the opening K constitutes the inner edge of the second pole plate C2, the inner edge of the second pole plate C2 and the second pole plate There is a gap between the outer edges of C2.
- the opening K may also be a notch formed on the outer edge of the second electrode plate C2. The portion j) of the edge of 11a that is flush with the edge of the active layer 11 is not covered by the second electrode plate C2.
- the light emitted from the light emitting device 20 is irradiated from the edge i of the active portion 11a flush with the gate g to
- the active portion 11a is shielded, and the active portion 11a can be illuminated through the opening K under the condition of reducing light as much as possible, which facilitates the optical detection of TFT channel region defects in subsequent production lines.
- the source and drain regions of the driving transistor T1 serve as the source and drain of the driving transistor T1, respectively.
- the driving transistor T1 may further include: a first conductive pattern 12a.
- the first conductive portion 11b of the driving transistor T1 has a first contact portion M
- the second conductive portion 11c of the driving transistor T1 has a second contact portion L
- the first contact portion M is in contact with the first conductive pattern 12a
- the second contact portion L contact with the second plate C2. That is, the first conductive pattern 12a and a portion on the second electrode plate C2 serve as the source and drain of the driving transistor T1, respectively.
- the second electrode plate C2 is arranged on the side of the grid g away from the base substrate 1, it can be known that an insulating layer is provided between the second electrode plate C2 and the second conductive portion 11c, therefore, the second electrode plate C2 is provided with an insulating layer.
- the plate C2 and the second conductive portion 11c can be contacted by via holes provided in the insulating layer, and the first conductive pattern 12a can be arranged in the same layer as the second plate C2, or can be arranged in a different layer from the second plate C2.
- the first conductive pattern 12a can also be in contact with the first conductive portion 11b through the via hole provided in the insulating layer, and the first conductive pattern 12a In the case of a different layer from the second electrode plate C2, for example, the first conductive pattern 12a may be in direct contact with the first conductive portion 11b, that is, there is no other layer between the first conductive pattern 12a and the first conductive portion 11b. .
- the first conductive pattern 12a and the second electrode plate C2 are disposed in the same layer, and the first contact portion M is farther from the active portion 11a than the second contact portion L.
- the first conductive pattern 12a and the second electrode plate C2 are disposed in the same layer, the first conductive pattern 12a and the first conductive portion 11b, as well as the second electrode plate C2 and the second conductive portion 11c are all disposed on the insulating
- the vias in the layer are in contact with the first contact portion M and the second contact portion L respectively. It can be known that when the first contact portion M is farther from the active portion 11a than the second contact portion L, it is beneficial to the first contact portion M. There is a large gap between a conductive pattern 12a and the second electrode plate C2 to avoid short circuit between the first conductive pattern 12a and the second electrode plate C2.
- the pixel driving circuit 10 further includes a first switch transistor T2 , the first switch transistor T2 includes an active layer 13 , and the active layer of the first switch transistor T2 13 includes an active part 13a, a first conductive part 13b and a second conductive part 13c.
- the first conductive portion 13b of the first switching transistor T2 is used for receiving a reset signal or providing a sensing signal Sense, wherein the reset signal is used to reset the anode of the light emitting device, and the sensing signal is used to calculate the threshold voltage of the driving transistor T1.
- the second conductive portion 13c of the first switching transistor T2 is coupled to the second electrode plate C2.
- the above-mentioned pixel driving circuit 10 may be a 3T1C type pixel driving circuit, and the equivalent circuit diagram of the 3T1C type pixel driving circuit is shown in FIG. 13 .
- the electrode plate C2 and the anode of the light emitting device 20 intersect at point S. Based on this, the parameters of the driving transistor T1 can be sensed through the sensing signal line Sense to perform threshold voltage compensation in an external manner.
- the first conductive portion 13b and the second conductive portion 13c of the first switching transistor T2 can also serve as the source and drain of the first switching transistor T2, which are respectively connected with the sense
- the test signal line Sense is coupled to the second plate C2.
- the pixel driving circuit 10 further includes: a light shielding metal layer 14 disposed on the side of the active layer 11 a of the driving transistor T1 close to the base substrate 1 .
- the orthographic projection of the active portion 11 a of the driving transistor T1 on the base substrate 1 is located within the orthographic projection of the light-shielding metal layer 14 on the base substrate 1 .
- the light-shielding metal layer 14 is coupled to the second electrode plate C2.
- the orthographic projection of the active portion 11a of the driving transistor T1 on the base substrate 1 is located within the orthographic projection of the light-shielding metal layer 14 on the base substrate 1, which means that the active portion 11a of the driving transistor T1 is on the base substrate 1.
- the orthographic projection on 1 is completely within the orthographic projection of the light-shielding metal layer 13 on the base substrate 1, and the orthographic projection of the edge of the active portion 11a of the driving transistor T1 on the base substrate 1 is within the edge of the light-shielding metal layer 14. There are gaps between the orthographic projections on the base substrate 1 .
- the light-shielding metal layer 14 by providing the light-shielding metal layer 14, light can be prevented from being irradiated on the active portion 11a from the side of the base substrate 1, thereby further improving the light stability of the TFT and avoiding the threshold voltage of the driving transistor under NBIS. drift.
- the light-shielding metal layer 14 in the case where the first electrode plate C1 and the active layer 11a of the driving transistor T1 are arranged in the same layer, as shown in FIG.
- the light-shielding metal layer 13 and the first electrode plate C1 can also be By forming another capacitor in parallel with the capacitor Cst, the capacitance of the storage capacitor of the capacitor Cst in the pixel driving circuit 10 can be increased, thereby further avoiding uneven display of the display panel.
- the first switching transistor T2 further includes: a second conductive pattern 15 .
- the second conductive portion 13 c of the first switching transistor T2 has a third contact portion V, and the third contact portion V is in contact with the second conductive pattern 15 .
- the second electrode plate C2 is connected to the second conductive pattern 15 as an integral structure. At this time, the second conductive pattern 15 and/or the second electrode plate C2 can be coupled with the light-shielding metal layer 14 to realize the The second electrode plate C2 is coupled to the light-shielding metal layer 14 .
- the second conductive portion 13 c of the first switching transistor T2 has a third contact portion V, and the third contact portion V is in contact with the second conductive pattern 15 .
- the second electrode plate C2 is connected to the second conductive pattern 15 as an integral structure.
- the second conductive pattern 15 and/or the second electrode plate C2 can be coupled with the light-s
- the light-shielding metal layer 14 also functions as an auxiliary electrode, which can improve the conductive effect of the connection between the second electrode plate C2 and the second conductive portion 14c of the first switching transistor T1.
- the active layer 13 of the first switching transistor T2 and the active layer 11 of the driving transistor T1 are disposed in the same layer, and the second conductive pattern 15 and the second electrode
- the board C2 is disposed on the same layer, and the pixel driving circuit 10 further includes a first insulating layer 16 disposed between the active layer 13a of the first switching transistor T2 and the second conductive pattern 15, and an active layer disposed in the first switching transistor T2
- the second insulating layer 17 between the layer 13 a and the light-shielding metal layer 14 .
- a first via hole h1 is provided in the first insulating layer 16
- a second via hole h2 is provided in the second insulating layer 17
- the orthographic projections of the first via hole h1 and the second via hole h2 on the base substrate 1 overlap.
- the second conductive pattern 15 is coupled to the third contact portion V through the first via hole h1
- the light-shielding metal layer 14 is coupled to the third contact portion V through the second via hole h2 .
- the first via hole h1 and the second via hole h2 occupy a certain space respectively, so as to realize the coupling between the second conductive portion 14c of the first switching transistor T2 and the second conductive pattern 15 and the light-shielding metal layer 14, respectively, the second conductive portion 14c is used as the overlap connection. layer, the second conductive portion 14c of the first switching transistor T2 can be respectively coupled to the light-shielding metal layer 14 and the second conductive pattern 15 through the via hole at the same position, thereby saving space.
- the second conductive pattern 15 is arranged in a first direction (the direction shown by arrow a in FIG. 9 and FIG. 11 ) and a second direction (arrow in FIG. 9 and FIG. 11 )
- the directions shown in b) are opposite to the second electrode plate C2, and the first direction and the second direction are two directions parallel to the plane where the base substrate 1 is located and perpendicular to each other.
- FIG. 9 and FIG. 11 it is an example of the positional relationship between the second conductive pattern 15 and the second electrode plate C2.
- the second conductive pattern 15 passes through the The two via holes h2 are coupled to the light-shielding metal layer 14 , and the second conductive pattern 15 is only directly opposite to the second electrode plate C2 in the first direction, which can increase the area of the second electrode plate C2 .
- the area of the first electrode plate C1 can also be increased, thereby increasing the capacitance of the storage capacitor of the capacitor Cst.
- the first electrode plate C1 and the active layer 11a are disposed in the same layer, and the orthographic projection of the first electrode plate C1 on the base substrate 1 is the same as that of the second electrode plate C2 The orthographic projections on the base substrate 1 overlap.
- the pixel driving circuit further includes: a second switch transistor T3.
- the second switching transistor T3 includes an active layer 18, and the active layer 18 of the second switching transistor T3 includes an active part 18a, a first conductive part 18b and a second conductive part 18c.
- the first conductive portion 18b of the second switch transistor T3 is used for receiving data signals, and the second conductive portion 18c of the second switch transistor T3 is coupled to the gate g of the driving transistor T1.
- first conductive portion 18b and the second conductive portion 18c of the second switching transistor T3 can also serve as the source and drain of the second switching transistor T3.
- the second conductive portion 18c of the second switching transistor T3 and the gate g of the driving transistor T1 are connected to point G.
- the display panel further includes: a power line ELVDD disposed on the base substrate.
- the first conductive portion 11b of the driving transistor T1 in the pixel driving circuit is coupled to the power line ELVDD.
- the ELVDD signal is written to the driving transistor T1 through the power supply line ELVDD.
- the driving transistor T1 when the driving transistor T1 further includes the first conductive pattern 12a, the power supply line ELVDD and the first conductive pattern 12a may be disposed in the same layer, and the power supply line ELVDD and the first conductive pattern 12a may be disposed in the same layer.
- the pattern 12a is in contact.
- the display panel when the pixel driving circuit 10 further includes a light-shielding metal layer 14 , the display panel further includes: a third conductive pattern 19 disposed on the same layer as the light-shielding metal layer 14 .
- the third conductive patterns 19 are respectively coupled to the first conductive portion 11b of the driving transistor T1 and the power supply line ELVDD.
- the third conductive pattern 19 can be used as an auxiliary electrode, which is beneficial to improve the conductive effect of the connection between the first conductive portion 11b of the driving transistor T1 and the power line ELVDD.
- each power supply line ELVDD is arranged along the column direction of the sub-pixel region P, and at least one column of pixel driving circuits 10 is connected to one power supply line ELVDD.
- the display panel may further include: a sensing signal line Sense disposed on the base substrate.
- the first conductive portion 13b of the first switching transistor T2 is coupled to the sensing signal line Sense.
- the sensing signal line Sense provides a reset signal to the node S to reset the anode of the driving element 2.
- the signal of the node S is transmitted to the signal of the sensing signal line Sense through the first switching transistor T2 It is the sensing signal Sense, and the sensing signal is used to calculate the threshold voltage of the driving transistor T1.
- the sensing signal line Sense may be parallel to the power line ELVDD and disposed in the same layer as the power line ELVDD.
- the display panel further includes: a fourth conductive pattern 30 provided in the same layer as the light-shielding metal layer 14 , and the fourth conductive pattern 30 is respectively connected with the first conductive portion 13 b of the first switching transistor T2 The part is coupled to the sensing signal line Sense.
- the fourth conductive pattern 30 can be used as an auxiliary electrode, which is beneficial to improve the conductive effect of the connection between the first conductive portion 13b of the first switching transistor T2 and the sensing signal line Sense.
- the display panel may further include: data lines Data disposed on the base substrate 1 .
- the first conductive portion 18b of the second switch transistor T3 is coupled to the data line Data.
- a data signal is written to the second switching transistor T3 through the data line Data.
- the data line Data, the sensing signal line Sense and the power line ELVDD may be disposed on the same layer as the second plate C2.
- the materials of the data line Data, the sensing signal line Sense, the power line ELVDD and the second plate C2 can be selected from copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), and chromium (Cr) and tungsten (W) metal elements and metal alloys composed of these metal elements.
- the first gate signal terminal G1 is configured to receive the first gate signal G1
- the second gate signal terminal G2 is configured to receive the second gate signal G2
- the data line Data is configured to receive a data signal Data
- the data signal Data includes, for example, a detection data signal Data 1 and a display data signal Data 2
- the power supply line ELVDD is configured to receive a power supply voltage signal ELVDD
- the range of the power supply voltage signal ELVDD is, for example, -5V ⁇ 5V
- the power supply voltage signal terminal ELVSS is configured to receive the power supply voltage signal ELVSS, for example, the power supply voltage signal ELVSS is a fixed voltage signal, such as a voltage signal less than or equal to 0V
- the sensing signal line Sense is configured to provide a reset signal or obtain The sensing signal Sense, wherein the reset signal is used to reset the anode of the light emitting device 20, and the sensing signal is used to calculate the threshold voltage of the driving transistor T1.
- the working process of the pixel driving circuit is, for example: under the control of the first gate signal G11 provided by the first gate signal terminal G1 , the second The switch transistor T3 is turned on, and the detection data signal Data 1 is transmitted to the node G through the data line Data; under the control of the second gate signal G2 1 provided by the second gate signal terminal G2, the first switch transistor T2 is turned on, and the node S is turned on.
- the signal is transmitted to the sensing signal line Sense through the first switching transistor T2; when the detection data signal Data 1 and the power supply voltage signal ELVDD make the node G control the second switching transistor T3 to turn off, the sensing signal on the sensing signal line Sense is measured.
- the magnitude of the signal Sense can calculate the threshold voltage Vth of the driving transistor T1 according to the difference between the detection data signal Data 1 and the sensing signal Sense.
- the sensing signal Sense is measured by controlling the sensing transistor, thereby calculating the threshold voltage of the driving transistor, and then compensating the threshold voltage into the display data signal Data 2 after calculating the threshold voltage of the driving transistor.
- the external compensation to the pixel drive circuit is completed. Referring to FIG. 15 , when performing external compensation, the pixel driving circuit needs to receive the first gate signal G1 1 and the second gate signal G2 1 to turn on the first switching transistor T2 and the second switching transistor T3.
- the sensing signal terminal Sense is in a floating state, which is equivalent to a capacitor; after the sensing data signal Data 1 controls the driving transistor T1 to turn on, the power supply voltage signal ELVDD will be transmitted to the node S, and the node S will be charged until the potential of the node S does not change any more.
- the difference between the potential of the node G and the potential of the node S is equal to the threshold voltage of the driving transistor T1, and the first switching transistor T2 is also in an on state, the signal of the node S is transmitted to the sensing signal terminal Sense through the first switching transistor T2.
- the signal is the sensing signal Sense, and the magnitude of the sensing signal Sense is equal to the potential of the node S, so the threshold voltage of the driving transistor T1 can be calculated by calculating the difference between the sensing data signal Data 1 and the sensing signal Sense.
- the working process of the pixel driving circuit includes, for example, a reset phase, a data writing phase, and a light-emitting phase.
- the first switching transistor T2 is turned on, and the reset signal provided by the sensing signal terminal Sense is transmitted to the node S, so as to control the light emission
- the anode of device 20 is reset.
- the second switching transistor T3 is turned on, and the display data signal Data2 provided by the data line Data is transmitted to the node G, And the storage capacitor Cst is charged.
- the driving transistor T3 under the control of node G, the driving transistor T3 is turned on, and the storage capacitor Cst begins to discharge to the node G, so that the potential of the node G is maintained for a period of time, thereby ensuring the turning-on time of the driving transistor T3.
- a driving signal is output to the light-emitting device 20.
- the driving signal is, for example, a driving current. Under the control of the driving signal, the light-emitting device 20 Start to shine.
- the gate signals received by the first gate signal terminal G1 and the second gate signal terminal G2 are both provided by the gate driving circuit.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (18)
- 一种显示面板,包括:衬底基板;以及设置于所述衬底基板上的像素驱动电路,所述像素驱动电路包括:驱动晶体管和电容器;所述驱动晶体管包括:栅极和有源层,所述驱动晶体管的所述有源层包括有源部、第一导电部和第二导电部,所述栅极相比于所述有源层远离所述衬底基板,所述有源部包括与所述栅极齐平的边沿;所述电容器包括:沿所述衬底基板的厚度方向,相对设置的第一极板和第二极板,所述第一极板与所述驱动晶体管的栅极耦接,所述第二极板设置于所述栅极远离所述衬底基板的一侧,且所述第二极板能够遮光,所述有源部与栅极齐平的边沿在所述衬底基板上的正投影位于所述第二极板在所述衬底基板上的正投影以内。
- 根据权利要求1所述的显示面板,其中,所述驱动晶体管的所述有源部位于所述第二极板在所述衬底基板上的正投影以内;或者,所述第二极板上设置有开口,所述第二极板具有内边沿和外边沿,所述开口的边沿构成所述第二极板的内边沿,所述有源部与栅极齐平的边沿在所述衬底基板上的正投影位于所述第二极板的外边沿在所述衬底基板上的正投影,和所述第二极板的内边沿在所述衬底基板上的正投影之间。
- 根据权利要求1或2所述的显示面板,其中,所述驱动晶体管还包括:第一导电图案;所述驱动晶体管的所述第一导电部具有第一接触部,所述驱动晶体管的所述第二导电部具有第二接触部;所述第一接触部与所述第一导电图案接触,所述第二接触部与所述第二极板接触。
- 根据权利要求3所述的显示面板,其中,所述第一导电图案和所述第二极板同层设置,且所述第一接触部相比于所述第二接触部远离所述有源部。
- 根据权利要求1~4任一项所述的显示面板,其中,所述像素驱动电路还包括:第一开关晶体管;所述第一开关晶体管包括有源层,所述第一开关晶体管的有源层包括有源部、第一导电部和第二导电部;所述第一开关晶体管的所述第一导电部用于接收复位信号或提供感测信号,所述第一开关晶体管的所述第二导电部与所述第二极板耦接。
- 根据权利要求1~5任一项所述的显示面板,其中,所述像素驱动电路还包括:设置于所述驱动晶体管的有源层靠近所述衬底基板一侧的遮光金属层;所述驱动晶体管的有源部在所述衬底基板上的正投影位于所述遮光金属层在所述衬底基板上的正投影以内,且所述遮光金属层与所述第二极板耦接。
- 根据权利要求6所述的显示面板,其中,在所述像素驱动电路还包括第一开关晶体管的情况下,所述像素驱动电路还包括:第二导电图案;所述第一开关晶体管的所述第二导电部具有第三接触部,所述第三接触部与所述第二导电图案接触;所述第二极板与所述第二导电图案连接为一体结构,或者,所述第二极板在所述衬底基板上的正投影和所述第二导电图案在所述衬底基板上的正投影之间具有间隙,且所述第二导电图案和所述第二极板分别与所述遮光金属层耦接。
- 根据权利要求7所述的显示面板,其中,所述第一开关晶体管的有源层和所述驱动晶体管的有源层同层设置,所述第二导电图案和所述第二极板同层设置;所述像素驱动电路还包括设置于所述第一开关晶体管的有源层和所述第二导电图案之间的第一绝缘层,以及设置于第一开关晶体管的有源层和遮光金属层之间的第二绝缘层;所述第一绝缘层中设置有第一过孔,所述第二绝缘层中设置有第二过孔,所述第一过孔和所述第二过孔在所述衬底基板上的正投影重叠,所述第二导电图案通过所述第一过孔与所述第三接触部接触,所述遮光金属层通过所述第二过孔与所述第三接触部耦接。
- 根据权利要求7或8所述的显示面板,其中,所述第二导电图案在第一方向和第二方向上均与所述第二极板正对,所述第一方向和所述第二方向是平行于所述衬底基板所在的平面,且相互垂直的两个方向。
- 根据权利要求1~9任一项所述的显示面板,其中,所述第一极板与所述有源层同层设置,且所述第一极板在所述衬底基板上的正投影与所述第二极板在所述衬底基板上的正投影重叠。
- 根据权利要求5~10任一项所述的显示面板,其中,所述像素驱动电路还包括:第二开关晶体管;所述第二开关晶体管包括有源层,所述第二开关晶体管的有源层包括有 源部、第一导电部和第二导电部;所述第二开关晶体管的第一导电部用于接收数据信号,所述第二开关晶体管的第二导电部与所述驱动晶体管的栅极耦接。
- 根据权利要求1~11任一项所述的显示面板,还包括:设置于衬底基板上的电源线;所述像素驱动电路中所述驱动晶体管的第一导电部与所述电源线耦接。
- 根据权利要求12所述的显示面板,其中,在所述驱动晶体管还包括第一导电图案的情况下,所述电源线与所述第一导电图案同层设置,且所述电源线与所述第一导电图案接触。
- 根据权利要求12或13所述的显示面板,其中,在所述像素驱动电路还包括遮光金属层的情况下,所述显示面板还包括:与所述遮光金属层同层设置的第三导电图案,所述第三导电图案分别与所述驱动晶体管的第一导电部和所述电源线耦接。
- 根据权利要求5~14任一项所述的显示面板,还包括:设置于所述衬底基板上的感测信号线;所述第一开关晶体管的第一导电部与所述感测信号线耦接。
- 根据权利要求15所述的显示面板,还包括:与所述遮光金属层同层设置的第四导电图案,所述第四导电图案分别与所述第一开关晶体管的所述第一导电部和所述感测信号线耦接。
- 根据权利要求1~16任一项所述的显示面板,还包括:设置于所述衬底基板上,且与所述像素驱动电路耦接的发光器件;所述发光器件发出的光自远离所述衬底基板的一侧出射。
- 一种显示装置,包括:如权利要求1~17任一项所述的显示面板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110308898.9A CN113066804B (zh) | 2021-03-23 | 2021-03-23 | 显示面板和显示装置 |
CN202110308898.9 | 2021-03-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022199081A1 true WO2022199081A1 (zh) | 2022-09-29 |
Family
ID=76563171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2021/132197 WO2022199081A1 (zh) | 2021-03-23 | 2021-11-22 | 显示面板和显示装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN113066804B (zh) |
WO (1) | WO2022199081A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113066804B (zh) * | 2021-03-23 | 2023-04-18 | 合肥鑫晟光电科技有限公司 | 显示面板和显示装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150097856A (ko) * | 2014-02-17 | 2015-08-27 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
CN108206010A (zh) * | 2016-12-16 | 2018-06-26 | 乐金显示有限公司 | 薄膜晶体管基板及包括薄膜晶体管基板的显示装置 |
CN110190091A (zh) * | 2019-05-15 | 2019-08-30 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制作方法 |
CN111276499A (zh) * | 2020-03-26 | 2020-06-12 | 合肥鑫晟光电科技有限公司 | 显示用基板及其制备方法、显示装置 |
CN111834465A (zh) * | 2019-12-09 | 2020-10-27 | 云谷(固安)科技有限公司 | 阵列基板、显示面板及显示装置 |
CN111863837A (zh) * | 2020-07-13 | 2020-10-30 | 武汉华星光电半导体显示技术有限公司 | 阵列基板和显示面板 |
CN112259595A (zh) * | 2020-10-30 | 2021-01-22 | 武汉天马微电子有限公司 | 一种阵列基板以及显示面板 |
CN113066804A (zh) * | 2021-03-23 | 2021-07-02 | 合肥鑫晟光电科技有限公司 | 显示面板和显示装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102690047B1 (ko) * | 2017-11-29 | 2024-07-29 | 엘지디스플레이 주식회사 | 박막트랜지스터 어레이 기판 및 그를 포함하는 유기발광표시장치 |
CN208753327U (zh) * | 2018-11-08 | 2019-04-16 | 京东方科技集团股份有限公司 | 显示基板和显示装置 |
CN210984240U (zh) * | 2019-12-12 | 2020-07-10 | 京东方科技集团股份有限公司 | 驱动背板及显示面板 |
CN111180491B (zh) * | 2020-01-02 | 2023-04-07 | 京东方科技集团股份有限公司 | 显示装置及其显示面板、显示面板的制作方法 |
CN111341814A (zh) * | 2020-03-11 | 2020-06-26 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及显示面板的制作方法 |
-
2021
- 2021-03-23 CN CN202110308898.9A patent/CN113066804B/zh active Active
- 2021-11-22 WO PCT/CN2021/132197 patent/WO2022199081A1/zh active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150097856A (ko) * | 2014-02-17 | 2015-08-27 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
CN108206010A (zh) * | 2016-12-16 | 2018-06-26 | 乐金显示有限公司 | 薄膜晶体管基板及包括薄膜晶体管基板的显示装置 |
CN110190091A (zh) * | 2019-05-15 | 2019-08-30 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制作方法 |
CN111834465A (zh) * | 2019-12-09 | 2020-10-27 | 云谷(固安)科技有限公司 | 阵列基板、显示面板及显示装置 |
CN111276499A (zh) * | 2020-03-26 | 2020-06-12 | 合肥鑫晟光电科技有限公司 | 显示用基板及其制备方法、显示装置 |
CN111863837A (zh) * | 2020-07-13 | 2020-10-30 | 武汉华星光电半导体显示技术有限公司 | 阵列基板和显示面板 |
CN112259595A (zh) * | 2020-10-30 | 2021-01-22 | 武汉天马微电子有限公司 | 一种阵列基板以及显示面板 |
CN113066804A (zh) * | 2021-03-23 | 2021-07-02 | 合肥鑫晟光电科技有限公司 | 显示面板和显示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN113066804B (zh) | 2023-04-18 |
CN113066804A (zh) | 2021-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20220376024A1 (en) | Display Substrate and Manufacturing Method Therefor, and Display Apparatus | |
CN108122928B (zh) | 包括多类型薄膜晶体管的有机发光显示装置 | |
US11315977B2 (en) | Photosensitive assembly and method for preparing the same, array substrate, and display device | |
US11721282B2 (en) | Display substrate and display device | |
US12063813B2 (en) | Display substrate, preparation method therefor and display apparatus | |
KR20150080355A (ko) | 유기 발광 디스플레이 장치와 이의 제조 방법 | |
US10916613B1 (en) | Array substrate and OLED display device | |
US20210098549A1 (en) | Thin film transistor array substrate and organic light emitting diode panel | |
US10868103B2 (en) | Wiring structure and manufacture method thereof, OLED array substrate and display device | |
US20190229169A1 (en) | Display panel and manufacturing method therefor, and display apparatus | |
WO2022042041A1 (zh) | 显示基板、显示装置 | |
CN114974120B (zh) | 半导体基板及其驱动方法、半导体显示装置 | |
KR20160053043A (ko) | 유기전계발광표시장치와 이의 제조방법 | |
WO2022199081A1 (zh) | 显示面板和显示装置 | |
KR20210085377A (ko) | 표시 장치 | |
WO2022226994A1 (zh) | 显示面板和显示装置 | |
US11605689B2 (en) | Array substrate and display device | |
US20230180521A1 (en) | Display Substrate, Preparation Method thereof, and Display Apparatus | |
KR102208431B1 (ko) | 유기전계발광표시장치와 이의 제조방법 | |
KR20140028604A (ko) | 유기발광다이오드 표시소자 및 그 제조방법 | |
US10446632B2 (en) | Organic light-emitting diode display panel | |
US10475872B2 (en) | Display device with light blocking layer and manufacturing method thereof | |
US20240172476A1 (en) | Display Substrate and Display Apparatus | |
WO2022061546A1 (zh) | 一种阵列基板及其制作方法、显示面板、显示装置 | |
WO2023241217A1 (zh) | 显示基板、其制作方法及显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 17914516 Country of ref document: US |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21932689 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 19.01.2024) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 21932689 Country of ref document: EP Kind code of ref document: A1 |