WO2022186478A1 - Backlight unit, display apparatus including same, and manufacturing method of backlight unit - Google Patents

Backlight unit, display apparatus including same, and manufacturing method of backlight unit Download PDF

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Publication number
WO2022186478A1
WO2022186478A1 PCT/KR2022/000865 KR2022000865W WO2022186478A1 WO 2022186478 A1 WO2022186478 A1 WO 2022186478A1 KR 2022000865 W KR2022000865 W KR 2022000865W WO 2022186478 A1 WO2022186478 A1 WO 2022186478A1
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WO
WIPO (PCT)
Prior art keywords
psr
porous
light source
printed circuit
layer
Prior art date
Application number
PCT/KR2022/000865
Other languages
French (fr)
Korean (ko)
Inventor
장내원
이영철
용석우
조병진
최석주
Original Assignee
삼성전자주식회사
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Publication of WO2022186478A1 publication Critical patent/WO2022186478A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices

Definitions

  • the present disclosure relates to a backlight unit, a display device including the same, and a method of manufacturing the backlight unit, and more particularly, to a backlight unit including a photo solder resist (PSR) layer.
  • PSR photo solder resist
  • a display device is a type of output device that visually displays data information such as text or figures and an image, and includes a television, various monitors, and various portable terminals (eg, notebook computers, tablet PCs, and smart phones).
  • the display device is a light emitting type using a display panel that emits light by itself, such as an organic light emitting diode (OLED), and cannot emit light by itself, such as a liquid crystal display (LCD), but needs to be supplied with light from a backlight unit. It can be classified as a light-receiving type using a display panel.
  • OLED organic light emitting diode
  • LCD liquid crystal display
  • the backlight unit may be classified into a direct type in which the light source is disposed at the rear of the display panel and an edge type in which the light source is disposed at a side of the display panel according to the location of the light source.
  • the direct type backlight unit may include a light source plate in which an LED (Light Emitting Diode, LED) is mounted on a flat printed circuit board.
  • the direct type backlight unit may include a reflective sheet attached to the light source plate to reflect the light emitted from the light source plate.
  • One aspect of the present disclosure provides a backlight unit having improved optical efficiency by improving reflectance of a photo solder resist (PSR) layer.
  • PSR photo solder resist
  • Another aspect of the present disclosure provides a display device including the backlight unit.
  • Another aspect of the present disclosure provides a method of manufacturing the backlight unit.
  • the backlight unit includes a light source plate including a printed circuit board and a plurality of light source modules mounted on the printed circuit board, and is disposed in front of the light source plate to diffuse light emitted from the light source plate It includes a diffuser plate.
  • the printed circuit board may include a porous PSR (Photo Solder Resist) layer including a plurality of pores to reflect the light emitted from the rear of the diffusion plate.
  • PSR Photo Solder Resist
  • the porous PSR layer may be formed by mixing PSR ink and hollow particles.
  • the hollow particles may include at least one of silica and acrylic.
  • the porous PSR layer may be formed by mixing PSR ink and heat-shrinkable resin.
  • the pores When heat is applied to the porous PSR layer, the pores may be provided in the porous PSR layer as the size of the resin is reduced by heat shrinkage.
  • the resin may include at least one of a silicone resin and an epoxy resin.
  • a display device including the backlight unit includes a liquid crystal panel, a printed circuit board disposed behind the liquid crystal panel, and a light source mounted on the printed circuit board to provide light to the liquid crystal panel and a light source plate including a module and a diffusion plate disposed in front of the light source plate to diffuse light provided from the light source plate.
  • the printed circuit board may include a porous photo solder resist (PSR) layer including a plurality of pores to reflect the light emitted from the diffusion plate rearward.
  • PSR photo solder resist
  • the porous PSR layer may be formed by mixing PSR ink and hollow particles.
  • the hollow particles may include at least one of silica and acryl.
  • the porous PSR layer may be formed by mixing PSR ink and heat-shrinkable resin.
  • the pores When heat is applied to the porous PSR layer, the pores may be provided in the porous PSR layer as the size of the resin is reduced by heat shrinkage.
  • the resin may include at least one of a silicone-based resin and an epoxy-based resin.
  • a printed circuit board including a porous photo solder resist (PSR) layer is provided, and a light source module emitting light is mounted on the printed circuit board. and disposing an optical member on the printed circuit board on which the light source module is mounted.
  • PSR photo solder resist
  • the porous PSR layer is made of a mixture of PSR ink and hollow particles, and the hollow particles may include at least one of silica and acryl.
  • the porous PSR layer is made of a mixture of PSR ink and heat-shrinkable resin, and the resin may include at least one of a silicone-based resin and an epoxy-based resin.
  • PSR ink and hollow particles are mixed, and the PSR ink mixed with the hollow particles is applied on the upper side of the base to form a porous PSR layer.
  • PSR ink and hollow particles are mixed, and the PSR ink mixed with the hollow particles is applied on the upper side of the base to form a porous PSR layer.
  • a porous PSR layer is formed by mixing PSR ink and heat-shrinkable resin, and applying the PSR ink mixed with the resin on the upper side of the base. forming, and applying heat to the porous PSR layer so that the resin is thermally contracted to form pores in the porous PSR layer.
  • the optical member may include a diffusion plate for evenly diffusing the irregular light emitted from the light source module.
  • the optical member includes a diffuser sheet for offsetting the pattern of the diffuser plate, a prism sheet for improving luminance by concentrating light, and a protection for protecting other optical sheets from external impact or foreign matter inflow
  • the sheet may include at least one of a reflective polarization sheet (DBEF), which transmits one polarized light and reflects the other polarized light to improve luminance.
  • DBEF reflective polarization sheet
  • the backlight unit according to the spirit of the present disclosure may improve the optical efficiency of the display device by improving the reflectance of the photo solder resist (PSR) layer.
  • PSR photo solder resist
  • the PSR (Photo Solder Resist) layer may replace the existing reflective sheet, productivity of the display device may be improved.
  • FIG. 1 is a perspective view of a display device according to an embodiment of the present disclosure
  • FIG. 2 is an exploded perspective view of the display device shown in FIG. 1 ;
  • FIG. 3 is a view showing a cross-section of the display device shown in FIG. 1;
  • FIG. 4 is a view showing a printed circuit board of the display device of FIG. 2 .
  • FIG. 5 is a schematic diagram illustrating a state in which light is reflected from the printed circuit board of FIG. 4 .
  • FIG. 6 is a diagram illustrating a printed circuit board of a display device according to another embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram illustrating a state in which the resin is thermally shrunk in the printed circuit board of FIG. 6 .
  • FIG. 8 is a flowchart illustrating a method of manufacturing a backlight unit of the display device of FIG. 1 or FIG. 6 ;
  • FIG. 9 is an example illustrating a step of preparing a printed circuit board including a porous PSR layer in the method of manufacturing the backlight unit of FIG. 8 .
  • FIG. 10 is another example illustrating a step of preparing a printed circuit board including a porous PSR layer in the method of manufacturing the backlight unit of FIG. 8 .
  • first may be referred to as a second component
  • second component may also be referred to as a first component.
  • the term “and/or” includes a combination of a plurality of related listed items or any of a plurality of related listed items.
  • FIG. 1 is a perspective view of a display device according to an embodiment of the present disclosure
  • FIG. 2 is an exploded perspective view of the display device shown in FIG. 1 .
  • the display device 1 includes a liquid crystal panel 10 for displaying an image, and a backlight unit 5 disposed behind the liquid crystal panel 10 to provide light to the liquid crystal panel 10 . ) and a chassis assembly supporting the backlight unit 5 and the liquid crystal panel 10 .
  • the chassis assembly includes a rear chassis 40 provided to support the backlight unit 5 , a front chassis 20 provided in front of the rear chassis 40 to support the liquid crystal panel 10 , and the front chassis 20 . and a middle mold 30 coupled between the rear chassis 40 and the rear chassis 40 .
  • the liquid crystal panel 10 is injected between a thin film transistor substrate in which thin film transistors are formed in a matrix form, a color filter substrate coupled to the thin film transistor substrate in parallel, and a thin film transistor substrate and a color filter substrate, and is optically It may include a liquid crystal having variable properties.
  • the backlight unit 5 may be disposed behind the liquid crystal panel 10 to illuminate the liquid crystal panel 10 .
  • the backlight unit 5 includes a light source plate 80 including a printed circuit board 90 on which a plurality of light source modules 100 are mounted, and optical members disposed on a movement path of light emitted from the light source plate 80 . (50) may be included.
  • the light source plate 80 may have a flat plate shape.
  • the light source plate 80 may be disposed parallel to the liquid crystal panel 10 .
  • the light source plate 80 may include a printed circuit board 90 and a plurality of light source modules 100 mounted on a surface of the printed circuit board 90 facing the liquid crystal panel 10 .
  • the light source module 100 may include an LED (Light Emitting Diode, LED) chip.
  • the optical members 50 may be disposed on a movement path of the light emitted from the light source module 100 to guide the traveling direction of the light, reflect the light, diffuse the light, or improve optical characteristics.
  • the optical members 50 may include a diffuser plate 60 for evenly diffusing the irregular light emitted from the light source plate 80 , and optical sheets 51 and 52 for improving optical characteristics. .
  • the diffusion plate 60 may evenly diffuse the light emitted from the light source plate 80 and support the optical sheets 51 and 52 .
  • the diffuser plate 60 may evenly diffuse the light incident on the incident surface to emit it to the exit surface.
  • the optical sheets 51 and 52 may be disposed in front of the diffuser plate 60 to improve optical properties of light emitted from the diffuser plate 60 .
  • the optical sheets 51 and 52 are a diffuser sheet for offsetting the pattern of the diffuser plate 60, a prism sheet for improving luminance by concentrating light, and other optics from external impact or foreign matter inflow. It may include a protective sheet for protecting the sheet, a reflective polarization sheet (DBEF, Dual Brightness Enhancement Film) that transmits one polarized light and reflects the other polarized light to improve luminance.
  • DBEF Reflective polarization sheet
  • the rear chassis 40 may be disposed behind the backlight unit 5 .
  • the rear chassis 40 may have a plate shape in which an edge portion is bent forward.
  • the backlight unit 5 may be accommodated between the rear chassis 40 and the front chassis 20 .
  • the rear chassis 40 includes a rear base portion 41 on which the light source plate 80 is installed, and a rear side portion 42 formed at the upper, lower, left, and right edges of the rear chassis 40 so as to be coupled with the middle mold 30 . can do.
  • the rear chassis 40 may function to radiate heat generated from heat generating elements such as the plurality of light source modules 100 to the outside.
  • the rear chassis 40 may be formed of various metal materials such as aluminum and SUS, or plastic materials such as ABS.
  • the front chassis 20 may have a frame shape having an opening 23 so that light from the backlight unit 5 is provided to the liquid crystal panel 10 .
  • the front chassis 20 has a front side part 21 formed at the upper, lower, left and right edges of the front chassis 20 to be coupled with the middle mold 30 , and the front side part 21 to support the liquid crystal panel 10 inwardly. It may include a protruding panel support 22 .
  • the middle mold 30 may support the diffusion plate 60 and reflect light emitted from the light source plate 80 to the diffusion plate 60 .
  • the middle mold 30 may maintain a gap between the diffusion plate 60 and the light source plate 80 .
  • the middle mold 30 may be coupled between the front chassis 20 and the rear chassis 40 .
  • the middle mold 30 may be formed in a frame shape having an opening 31 .
  • the middle mold 30 includes a frame part 32 to which the front chassis 20 and the rear chassis 40 are coupled, and a diffuser plate support part 33 protruding inward from the frame part 32 to support the diffuser plate 60 . ), a reflector 34 extending from the diffuser plate support 33 to reflect light, and a substrate support 35 extending from the reflector 34 to support the printed circuit board 90 . have.
  • the frame part 32 may be formed on upper, lower, left, and right edges of the middle mold 30 .
  • the frame part 32 may be coupled to the front chassis 20 and the rear chassis 40 through various known fitting structures and separate fastening members.
  • the diffuser plate support part 33 may protrude inward from the frame part 32 to support the diffuser plate 60 .
  • the diffuser plate support part 33 may support the edge of the incident surface of the diffuser plate 60 .
  • the diffuser plate support 33 may be formed to be parallel to the base 41 of the rear chassis 40 .
  • the reflector 34 may reflect the light emitted from the light source plate 80 to the incident surface of the diffuser plate 60 .
  • the reflective portion 34 may extend substantially in an inwardly inclined manner from the diffuser plate support 33 .
  • the reflector 34 may extend from the diffuser plate support 33 to the substrate support 35 in an inclined manner.
  • the substrate support part 35 may fix the printed circuit board 90 of the light source plate 80 not to be lifted from the base part 41 of the rear chassis 40 .
  • the substrate support part 35 may be formed at an inner end of the reflective part 34 .
  • An edge of the printed circuit board 90 of the light source plate 80 may be supported between the substrate support part 35 and the base part 41 .
  • the frame part 32 of the middle mold 30 , the diffuser plate support part 33 , the reflective part 34 , and the substrate support part 35 may be integrally formed.
  • a material having high reflectivity may be coated on the surface of the middle mold 30 .
  • the high reflectance material may be coated on the entire surface of the middle mold 30 or only on the surface of the reflective portion 34 .
  • the entire middle mold 30 or the reflective portion 34 of the middle mold 30 may have a white color so that light is well reflected.
  • FIG. 4 is a diagram illustrating a printed circuit board of the display device of FIG. 2
  • FIG. 5 is a schematic diagram illustrating a state in which light is reflected from the printed circuit board of FIG. 4 .
  • the printed circuit board 90 of the light source plate 80 includes a base 91 , a power wiring layer 92 including metal wiring, and a base 91 and a power wiring layer 92 .
  • An insulating layer 93 formed in between and disposed in front of the base 91 and disposed behind the power wiring layer 92, and a power wiring layer 92 to protect the pattern of the power wiring layer 92 and increase light efficiency. It may include a porous photo solder resist (PSR) layer 94 that is formed in front and exposed to the outside.
  • PSR porous photo solder resist
  • the base forms the framework of the light source plate 80 , and any substrate capable of applying a voltage to the light source module 100 through the power wiring layer 92 may be used.
  • it may be formed of FR-4, ceramic, polyimide, PET, glass, or the like.
  • the metal wiring of the power wiring layer 92 may be formed by patterning a conductive material on a base.
  • the insulating layer 93 may be positioned between the base and the power wiring layer 92 to electrically insulate the base and the metal wiring of the power wiring layer 92 .
  • the porous PSR layer 94 may be formed by applying a photo solder resist (PSR) ink mixed with hollow particles on the power wiring layer 92 .
  • PSR photo solder resist
  • the hollow particle 96 is a spherical particle with an empty interior, and an empty space is formed therein. Accordingly, a plurality of pores 97 formed as the empty space of the hollow particle 96 may be formed in the PSR layer 94 . have.
  • the hollow particles 96 may include at least one of silica and acrylic, and may include various particles having a hollow shape in addition.
  • the light when light is emitted from the diffuser plate 60 to the rear, the light is directed toward the porous PSR layer 94 .
  • the light emitted from the diffusion plate 60 is reflected in the plurality of pores 97 formed in the porous PSR layer 94 as shown in FIG. 5 .
  • FIG. 6 is a diagram illustrating a printed circuit board of a display device according to another embodiment of the present disclosure
  • FIG. 7 is a schematic diagram illustrating a state in which the resin is thermally shrunk in the printed circuit board of FIG. 6 .
  • the display device according to the present disclosure is substantially the same as the display device 1 described with reference to FIGS. 1 to 5 except for the printed circuit board 90a, the same reference numerals are used, and overlapping descriptions are omitted.
  • the printed circuit board 90a of the backlight unit of the display device includes a base 91a, a power wiring layer 92a including metal wiring, the base 91a, and a power supply.
  • a porous photo solder resist (PSR) layer 94 formed in front of the wiring layer 92a and exposed to the outside may be included.
  • PSR photo solder resist
  • the porous PSR layer 94a may be formed by mixing the PSR ink 95a and the heat-shrinkable resin 98a.
  • the resin 98a may include at least one of a silicon-based resin and an epoxy-based resin, and may also include various inorganic materials.
  • FIG. 8 is a flowchart illustrating a method of manufacturing the backlight unit of the display device of FIG. 1 or FIG. 6
  • FIG. 9 shows a step of preparing a printed circuit board including a porous PSR layer in the method of manufacturing the backlight unit of FIG. 8
  • FIG. 10 is another example illustrating a step of preparing a printed circuit board including a porous PSR layer in the method of manufacturing the backlight unit of FIG. 8 .
  • a printed circuit board including a porous photo solder resist (PSR) layer is prepared (step S100).
  • PSR ink 95 in liquid form and hollow particles 96 in solid form prepared to mix the PSR ink 95 and the hollow particles 96, and the PSR ink 95 mixed with the hollow particles 96 on the upper side of the base, that is, on the power wiring layer 92, as shown in (b).
  • PSR ink 95 in liquid form and hollow particles 96 in solid form prepared to mix the PSR ink 95 and the hollow particles 96, and the PSR ink 95 mixed with the hollow particles 96 on the upper side of the base, that is, on the power wiring layer 92, as shown in (b).
  • a liquid PSR ink 95a and a solid heat-shrinkable resin 98a are prepared as shown in (a), and the PSR ink 95a and the resin 98a are mixed.
  • the PSR ink 95a mixed with the resin 98a on the upper side of the base 91a, that is, on the power wiring layer 92a as shown in (b) mixed with the resin 98 as shown in (c)
  • the printed circuit board 90a including the porous PSR layer 94a may be prepared by applying heat to the PSR ink 95a so that the resin 98 is thermally contracted.
  • the printed circuit board 90a including the porous PSR layer 94a may be formed by performing normal exposure and development operations.
  • the light source module 100 is mounted (step S200).
  • the backlight unit 5 may be manufactured by disposing the optical members 50 in front of the printed circuit boards 90 and 90a on which the light source module 100 is mounted (step S300 ).
  • the optical members 50 may include a diffuser plate 60 for evenly diffusing the irregular light emitted from the light source plate 80 , and optical sheets 51 and 52 for improving optical characteristics. .
  • the diffusion plate 60 may evenly diffuse the light emitted from the light source plate 80 and support the optical sheets 51 and 52 .
  • the diffuser plate 60 may evenly diffuse the light incident on the incident surface to be emitted to the emission surface.
  • the optical sheets 51 and 52 may be disposed in front of the diffuser plate 60 to improve optical properties of light emitted from the diffuser plate 60 .
  • the optical sheets 51 and 52 are a diffuser sheet for offsetting the pattern of the diffuser plate 60, a prism sheet for improving luminance by concentrating light, and other optics from external impact or foreign matter inflow. It may include a protective sheet for protecting the sheet, a reflective polarization sheet (DBEF, Dual Brightness Enhancement Film) that transmits one polarized light and reflects the other polarized light to improve luminance.
  • DBEF Reflective polarization sheet

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  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Provided are a backlight unit, a display apparatus including same, and a manufacturing method of a backlight unit, the backlight unit comprising: a light source plate including a printed circuit board and a plurality of light source modules mounted on the printed circuit board; and a diffusion plate disposed in front of the light source plate to diffuse light emitted from the light source plate. The printed circuit board includes a porous photo solder resist (PSR) layer that includes a plurality of pores to reflect light emitted rearward from the diffuser plate.

Description

백라이트 유닛, 이를 포함하는 디스플레이 장치, 및 백라이트 유닛의 제조 방법A backlight unit, a display device including the same, and a manufacturing method of the backlight unit
본 개시는 백라이트 유닛, 이를 포함하는 디스플레이 장치, 및 백라이트 유닛의 제조 방법에 관한 것으로서, 특히 PSR(Photo Solder Resist)층을 포함하는 백라이트 유닛에 관한 것이다.The present disclosure relates to a backlight unit, a display device including the same, and a method of manufacturing the backlight unit, and more particularly, to a backlight unit including a photo solder resist (PSR) layer.
디스플레이 장치는 문자나 도형 등의 데이터 정보 및 영상을 시각적으로 표시하는 출력 장치의 일종으로서, 텔레비전, 각종 모니터 및 각종 휴대용 단말기(예를 들어, 노트북, 태블릿 피씨 및 스마트폰) 등을 포함한다.A display device is a type of output device that visually displays data information such as text or figures and an image, and includes a television, various monitors, and various portable terminals (eg, notebook computers, tablet PCs, and smart phones).
디스플레이 장치는 유기 발광 다이오드(OLED, Organic Light Emitting Diode)와 같이 스스로 발광하는 디스플레이 패널을 사용하는 발광형과, 액정 패널(LCD, Liquid Crystal Display)과 같이 스스로 발광하지 못하고 백라이트 유닛으로부터 광을 공급받아야 하는 디스플레이 패널을 사용하는 수광형으로 분류될 수 있다.The display device is a light emitting type using a display panel that emits light by itself, such as an organic light emitting diode (OLED), and cannot emit light by itself, such as a liquid crystal display (LCD), but needs to be supplied with light from a backlight unit. It can be classified as a light-receiving type using a display panel.
백라이트 유닛은 광원의 위치에 따라 광원이 디스플레이 패널의 후방에 배치되는 직하형(Direct type)과, 광원이 디스플레이 패널의 측방에 배치되는 에지형(Edge type)으로 분류될 수 있다. 직하형 백라이트 유닛은 평판 형상의 인쇄회로기판에 엘이디(Light Emitting Diode, LED)가 실장된 광원 플레이트를 포함할 수 있다. The backlight unit may be classified into a direct type in which the light source is disposed at the rear of the display panel and an edge type in which the light source is disposed at a side of the display panel according to the location of the light source. The direct type backlight unit may include a light source plate in which an LED (Light Emitting Diode, LED) is mounted on a flat printed circuit board.
또한, 직하형 백라이트 유닛은 광원 플레이트에서 발산되는 광을 반사시키도록 광원 플레이트 상에 부착되는 반사 시트를 포함할 수 있다. In addition, the direct type backlight unit may include a reflective sheet attached to the light source plate to reflect the light emitted from the light source plate.
본 개시의 일 측면은, PSR(Photo Solder Resist)층의 반사율을 개선하여 광학 효율을 향상시킨 백라이트 유닛을 제공한다.One aspect of the present disclosure provides a backlight unit having improved optical efficiency by improving reflectance of a photo solder resist (PSR) layer.
본 개시의 다른 측면은, 상기 백라이트 유닛을 포함하는 디스플레이 장치를 제공한다.Another aspect of the present disclosure provides a display device including the backlight unit.
본 개시의 또 다른 측면은, 상기 백라이트 유닛의 제조 방법을 제공한다.Another aspect of the present disclosure provides a method of manufacturing the backlight unit.
상기한 본 개시의 사상에 따른 백라이트 유닛은, 인쇄회로기판 및 상기 인쇄회로기판에 실장되는 복수의 광원 모듈을 포함하는 광원 플레이트 및 상기 광원 플레이트의 전방에 배치되어 상기 광원 플레이트에서 발산되는 광을 확산시키는 확산판을 포함한다.The backlight unit according to the spirit of the present disclosure includes a light source plate including a printed circuit board and a plurality of light source modules mounted on the printed circuit board, and is disposed in front of the light source plate to diffuse light emitted from the light source plate It includes a diffuser plate.
상기 인쇄회로기판은, 상기 확산판에서 후방으로 출사되는 광을 반사시키도록 복수의 공극을 포함하는 다공성 PSR(Photo Solder Resist) 층을 포함하는 것을 특징으로 한다.The printed circuit board may include a porous PSR (Photo Solder Resist) layer including a plurality of pores to reflect the light emitted from the rear of the diffusion plate.
상기 다공성 PSR 층은, PSR잉크와 중공 입자가 혼합되어 이루어질 수 있다.The porous PSR layer may be formed by mixing PSR ink and hollow particles.
상기 중공 입자는, 실리카(silica) 및 아크릴(acrylic) 중 적어도 하나를 포함할 수 있다.The hollow particles may include at least one of silica and acrylic.
상기 다공성 PSR 층은, PSR잉크와 열 수축이 가능한 레진이 혼합되어 이루어질 수 있다.The porous PSR layer may be formed by mixing PSR ink and heat-shrinkable resin.
상기 다공성 PSR층에 열을 가하는 경우, 상기 레진이 열 수축에 의해 그 크기가 감소함에 따라 상기 다공성 PSR 층에는 상기 공극이 마련될 수 있다.When heat is applied to the porous PSR layer, the pores may be provided in the porous PSR layer as the size of the resin is reduced by heat shrinkage.
상기 레진은, 실리콘계(silicon) 레진 및 에폭시계(epoxy) 레진 중 적어도 하나를 포함할 수 있다.The resin may include at least one of a silicone resin and an epoxy resin.
상기한 본 개시의 다른 사상에 따른 상기 백라이트 유닛을 포함하는 디스플레이 장치는, 액정 패널, 상기 액정 패널의 후방에 배치되는 인쇄회로기판 및 상기 액정 패널에 광을 제공하도록 상기 인쇄회로기판에 실장되는 광원 모듈을 포함하는 광원 플레이트 및 상기 광원 플레이트의 전방에 배치되어 상기 광원 플레이트에서 제공되는 광을 확산시키는 확산판을 포함한다.A display device including the backlight unit according to another aspect of the present disclosure includes a liquid crystal panel, a printed circuit board disposed behind the liquid crystal panel, and a light source mounted on the printed circuit board to provide light to the liquid crystal panel and a light source plate including a module and a diffusion plate disposed in front of the light source plate to diffuse light provided from the light source plate.
상기 인쇄회로기판은, 상기 확산판에서 후방으로 출사되는 광을 반사시키도록 복수의 공극을 포함하는 다공성 PSR(Photo Solder Resist) 층을 포함할 수 있다.The printed circuit board may include a porous photo solder resist (PSR) layer including a plurality of pores to reflect the light emitted from the diffusion plate rearward.
상기 다공성 PSR 층은, PSR잉크와 중공 입자가 혼합되어 이루어질 수 있다. The porous PSR layer may be formed by mixing PSR ink and hollow particles.
상기 중공 입자는, 실리카 및 아크릴 중 적어도 하나를 포함할 수 있다.The hollow particles may include at least one of silica and acryl.
상기 다공성 PSR 층은, PSR잉크와 열 수축이 가능한 레진이 혼합되어 이루어질 수 있다.The porous PSR layer may be formed by mixing PSR ink and heat-shrinkable resin.
상기 다공성 PSR층에 열을 가하는 경우, 상기 레진이 열 수축에 의해 그 크기가 감소함에 따라 상기 다공성 PSR 층에는 상기 공극이 마련될 수 있다.When heat is applied to the porous PSR layer, the pores may be provided in the porous PSR layer as the size of the resin is reduced by heat shrinkage.
상기 레진은, 실리콘계 레진 및 에폭시계 레진 중 적어도 하나를 포함할 수 있다.The resin may include at least one of a silicone-based resin and an epoxy-based resin.
상기한 본 개시의 또 다른 사상에 따른 상기 백라이트 유닛의 제조 방법에서, 다공성 PSR(Photo Solder Resist) 층을 포함하는 인쇄회로기판을 마련하고, 상기 인쇄회로기판 상에 광을 발산하는 광원 모듈을 실장하고, 상기 광원 모듈이 실장된 상기 인쇄회로기판 상에 광학 부재를 배치하는 것을 포함한다. In the method of manufacturing the backlight unit according to another aspect of the present disclosure, a printed circuit board including a porous photo solder resist (PSR) layer is provided, and a light source module emitting light is mounted on the printed circuit board. and disposing an optical member on the printed circuit board on which the light source module is mounted.
상기 다공성 PSR 층은, PSR잉크와 중공 입자가 혼합되어 이루어지며, 상기 중공 입자는, 실리카 및 아크릴 중 적어도 하나를 포함할 수 있다.The porous PSR layer is made of a mixture of PSR ink and hollow particles, and the hollow particles may include at least one of silica and acryl.
상기 다공성 PSR 층은, PSR잉크와 열 수축이 가능한 레진이 혼합되어 이루어지며, 상기 레진은, 실리콘계 레진 및 에폭시계 레진 중 적어도 하나를 포함할 수 있다. The porous PSR layer is made of a mixture of PSR ink and heat-shrinkable resin, and the resin may include at least one of a silicone-based resin and an epoxy-based resin.
상기 다공성 PSR(Photo Solder Resist) 층을 포함하는 인쇄회로기판을 마련하는 것은, PSR 잉크와 중공 입자를 혼합하고, 베이스의 상측에 상기 중공 입자와 혼합된 PSR 잉크를 도포하여 다공성 PSR층을 형성하는 것을 포함할 수 있다.To prepare a printed circuit board including the porous PSR (Photo Solder Resist) layer, PSR ink and hollow particles are mixed, and the PSR ink mixed with the hollow particles is applied on the upper side of the base to form a porous PSR layer. may include
상기 다공성 PSR(Photo Solder Resist) 층을 포함하는 인쇄회로기판을 마련하는 것은, PSR 잉크와 열 수축이 가능한 레진을 혼합하고, 베이스의 상측에 상기 레진과 혼합된 PSR 잉크를 도포하여 다공성 PSR층을 형성하고, 상기 다공성 PSR층에 열을 인가하여 상기 레진이 열 수축되어 상기 다공성 PSR층에 공극이 형성되도록 하는 것을 포함할 수 있다.In preparing the printed circuit board including the porous PSR (Photo Solder Resist) layer, a porous PSR layer is formed by mixing PSR ink and heat-shrinkable resin, and applying the PSR ink mixed with the resin on the upper side of the base. forming, and applying heat to the porous PSR layer so that the resin is thermally contracted to form pores in the porous PSR layer.
상기 광학 부재는, 상기 광원 모듈에서 발산되는 불규칙적인 광을 고르게 확산시키는 확산판을 포함할 수 있다. The optical member may include a diffusion plate for evenly diffusing the irregular light emitted from the light source module.
상기 광학 부재는, 상기 확산판의 패턴을 상쇄시키기 위한 확산 시트(Diffuser Sheet), 광을 집중시켜서 휘도를 향상 시키는 프리즘 시트(Prism Sheet), 외부의 충격이나 이물 유입으로부터 다른 광학 시트를 보호하는 보호 시트(Protection Sheet), 일 편광은 투과시키고 다른 편광은 반사시켜서 휘도를 향상시키는 반사 편광 시트(DBEF, Dual Brightness Enhancement Film) 중 적어도 하나를 포함할 수 있다.The optical member includes a diffuser sheet for offsetting the pattern of the diffuser plate, a prism sheet for improving luminance by concentrating light, and a protection for protecting other optical sheets from external impact or foreign matter inflow The sheet may include at least one of a reflective polarization sheet (DBEF), which transmits one polarized light and reflects the other polarized light to improve luminance.
상기한 본 개시의 사상에 따른 백라이트 유닛은, PSR(Photo Solder Resist)층의 반사율을 개선하여 디스플레이 장치의 광학 효율을 향상시킬 수 있다.The backlight unit according to the spirit of the present disclosure may improve the optical efficiency of the display device by improving the reflectance of the photo solder resist (PSR) layer.
또한, PSR(Photo Solder Resist)층이 기존의 반사 시트를 대체할 수 있어 디스플레이 장치의 생산성을 향상시킬 수 있다.In addition, since the PSR (Photo Solder Resist) layer may replace the existing reflective sheet, productivity of the display device may be improved.
도 1는 본 개시의 일 실시예에 따른 디스플레이 장치의 사시도.1 is a perspective view of a display device according to an embodiment of the present disclosure;
도 2는 도 1에 도시된 디스플레이 장치의 분해 사시도.FIG. 2 is an exploded perspective view of the display device shown in FIG. 1 ;
도 3은 도 1에 도시된 디스플레이 장치의 단면을 도시한 도면.FIG. 3 is a view showing a cross-section of the display device shown in FIG. 1;
도 4는 도 2의 디스플레이 장치의 인쇄회로기판을 도시한 도면.FIG. 4 is a view showing a printed circuit board of the display device of FIG. 2 .
도 5는 도 4의 인쇄회로기판에서 광이 반사되는 상태를 도시한 모식도.5 is a schematic diagram illustrating a state in which light is reflected from the printed circuit board of FIG. 4 .
도 6은 본 개시의 다른 실시예에 따른 디스플레이 장치의 인쇄회로 기판을 도시한 도면.6 is a diagram illustrating a printed circuit board of a display device according to another embodiment of the present disclosure;
도 7은 도 6의 인쇄회로기판에서 레진이 열 수축된 상태를 도시한 모식도.7 is a schematic diagram illustrating a state in which the resin is thermally shrunk in the printed circuit board of FIG. 6 .
도 8은 도 1 또는 도6의 디스플레이 장치의 백라이트 유닛의 제조 방법을 도시한 흐름도.FIG. 8 is a flowchart illustrating a method of manufacturing a backlight unit of the display device of FIG. 1 or FIG. 6 ;
도 9는 도 8의 백라이트 유닛의 제조 방법에서 다공성 PSR층을 포함하는 인쇄회로기판을 마련하는 단계를 도시한 일 예.9 is an example illustrating a step of preparing a printed circuit board including a porous PSR layer in the method of manufacturing the backlight unit of FIG. 8 .
도 10은 도 8의 백라이트 유닛의 제조 방법에서, 다공성 PSR층을 포함하는 인쇄회로기판을 마련하는 단계를 도시한 다른 예.FIG. 10 is another example illustrating a step of preparing a printed circuit board including a porous PSR layer in the method of manufacturing the backlight unit of FIG. 8 .
본 명세서에 기재된 실시예와 도면에 도시된 구성은 개시된 발명의 바람직한 일 예에 불과할 뿐이며, 본 출원의 출원시점에 있어서 본 명세서의 실시예와 도면을 대체할 수 있는 다양한 변형 예들이 있을 수 있다.The configuration shown in the embodiments and drawings described in this specification is only a preferred example of the disclosed invention, and there may be various modifications that can replace the embodiments and drawings of the present specification at the time of filing of the present application.
또한, 본 명세서의 각 도면에서 제시된 동일한 참조번호 또는 부호는 실질적으로 동일한 기능을 수행하는 부품 또는 구성요소를 나타낸다.In addition, the same reference numbers or reference numerals in each drawing in the present specification indicate parts or components that perform substantially the same functions.
또한, 본 명세서에서 사용한 용어는 실시예를 설명하기 위해 사용된 것으로, 개시된 발명을 제한 및/또는 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 명세서에서, "포함하다" 또는 "가지다" 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는다.In addition, the terms used herein are used to describe the embodiments, and are not intended to limit and/or limit the disclosed invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.
또한, 본 명세서에서 사용한 "제1", "제2" 등과 같이 서수를 포함하는 용어는 다양한 구성요소들을 설명하는데 사용될 수 있지만, 상기 구성요소들은 상기 용어들에 의해 한정되지는 않으며, 상기 용어들은 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로만 사용된다. 예를 들어, 본 개시의 권리 범위를 벗어나지 않으면서 제1 구성요소는 제2 구성요소로 명명될 수 있고, 유사하게 제2 구성요소도 제1 구성요소로 명명될 수 있다. "및/또는" 이라는 용어는 복수의 관련된 기재된 항목들의 조합 또는 복수의 관련된 기재된 항목들 중의 어느 항목을 포함한다.In addition, terms including an ordinal number such as "first", "second", etc. used herein may be used to describe various elements, but the elements are not limited by the terms, and the terms are It is used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present disclosure, a first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. The term “and/or” includes a combination of a plurality of related listed items or any of a plurality of related listed items.
이하에서는 일 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, an embodiment will be described in detail with reference to the accompanying drawings.
도 1은 본 개시의 일 실시예에 따른 디스플레이 장치의 사시도이고, 도 2는 도 1에 도시된 디스플레이 장치의 분해 사시도이다.1 is a perspective view of a display device according to an embodiment of the present disclosure, and FIG. 2 is an exploded perspective view of the display device shown in FIG. 1 .
도 1 및 도 2를 참조하면, 디스플레이 장치(1)는 화상을 표시하는 액정 패널(10)과, 액정 패널(10)의 후방에 배치되어 액정 패널(10)에 광을 제공하는 백라이트 유닛(5)과, 백라이트 유닛(5) 및 액정 패널(10)을 지지하는 섀시 어셈블리를 포함할 수 있다.1 and 2 , the display device 1 includes a liquid crystal panel 10 for displaying an image, and a backlight unit 5 disposed behind the liquid crystal panel 10 to provide light to the liquid crystal panel 10 . ) and a chassis assembly supporting the backlight unit 5 and the liquid crystal panel 10 .
섀시 어셈블리는 백라이트 유닛(5)을 지지하도록 구비되는 후방 섀시(40)와, 액정 패널(10)을 지지하도록 후방 섀시(40)의 전방에 마련되는 전방 섀시(20)와, 전방 섀시(20)와 후방 섀시(40)의 사이에 결합되는 미들 몰드(30)를 포함할 수 있다.The chassis assembly includes a rear chassis 40 provided to support the backlight unit 5 , a front chassis 20 provided in front of the rear chassis 40 to support the liquid crystal panel 10 , and the front chassis 20 . and a middle mold 30 coupled between the rear chassis 40 and the rear chassis 40 .
액정 패널(10)은 박막 트랜지스터가 매트릭스 형태로 형성된 박막 트랜지스터 기판과, 박막 트랜지스터 기판과 나란하게 결합되는 컬러 필터 기판, 박막 트랜지스터 기판과 컬러 필터 기판의 사이에 주입되어 전압이나 온도의 변화에 따라 광학적 성질이 가변하는 액정(Liquid Crystal)을 포함할 수 있다.The liquid crystal panel 10 is injected between a thin film transistor substrate in which thin film transistors are formed in a matrix form, a color filter substrate coupled to the thin film transistor substrate in parallel, and a thin film transistor substrate and a color filter substrate, and is optically It may include a liquid crystal having variable properties.
백라이트 유닛(5)은 액정 패널(10)의 후방에 배치되어 액정 패널(10) 측으로 광을 비춰줄 수 있다. 백라이트 유닛(5)은 복수의 광원 모듈(100)들이 실장된 인쇄회로기판(90)을 포함하는 광원 플레이트(80)와, 광원 플레이트(80)에서 발산되는 광의 이동 경로 상에 배치되는 광학 부재들(50)을 포함할 수 있다.The backlight unit 5 may be disposed behind the liquid crystal panel 10 to illuminate the liquid crystal panel 10 . The backlight unit 5 includes a light source plate 80 including a printed circuit board 90 on which a plurality of light source modules 100 are mounted, and optical members disposed on a movement path of light emitted from the light source plate 80 . (50) may be included.
광원 플레이트(80)는 평판 형상을 가질 수 있다. 광원 플레이트(80)는 액정 패널(10)에 나란하게 배치될 수 있다. The light source plate 80 may have a flat plate shape. The light source plate 80 may be disposed parallel to the liquid crystal panel 10 .
광원 플레이트(80)는 인쇄회로기판(90)과, 인쇄회로기판(90)의 액정 패널(10)을 마주 보는 면에 실장되는 복수의 광원 모듈(100)을 포함할 수 있다. 광원 모듈(100)은 엘이디(Light Emitting Diode, LED) 칩을 포함할 수 있다.The light source plate 80 may include a printed circuit board 90 and a plurality of light source modules 100 mounted on a surface of the printed circuit board 90 facing the liquid crystal panel 10 . The light source module 100 may include an LED (Light Emitting Diode, LED) chip.
광학 부재들(50)은 광원 모듈(100)에서 발산되는 광의 이동 경로 상에 배치되어 광의 진행 방향을 안내하거나 광을 반사시키거나 광을 확산시키거나 광 특성을 향상시킬 수 있다.The optical members 50 may be disposed on a movement path of the light emitted from the light source module 100 to guide the traveling direction of the light, reflect the light, diffuse the light, or improve optical characteristics.
광학 부재들(50)은 광원 플레이트(80)에서 발사되는 불규칙적인 광을 고르게 확산시키는 확산판(Diffuser Plate, 60)과, 광특성을 향상시키는 광학 시트들(51, 52)을 포함할 수 있다.The optical members 50 may include a diffuser plate 60 for evenly diffusing the irregular light emitted from the light source plate 80 , and optical sheets 51 and 52 for improving optical characteristics. .
확산판(60)은 광원 플레이트(80)에서 발산되는 광을 고르게 확산시키고, 광학 시트들(51, 52)을 지지할 수 있다. 확산판(60)은 그 입사면으로 입사된 광을 고르게 확산시켜 그 출사면으로 출사시킬 수 있다.The diffusion plate 60 may evenly diffuse the light emitted from the light source plate 80 and support the optical sheets 51 and 52 . The diffuser plate 60 may evenly diffuse the light incident on the incident surface to emit it to the exit surface.
광학 시트(51, 52)는 확산판(60)에서 출사되는 광의 광 특성을 향상시키도록 확산판(60)의 전방에 배치될 수 있다. 광학 시트(51, 52)는 확산판(60)의 패턴을 상쇄시키기 위한 확산 시트(Diffuser Sheet), 광을 집중시켜서 휘도를 향상시키는 프리즘 시트(Prism Sheet), 외부의 충격이나 이물 유입으로부터 다른 광학 시트를 보호하는 보호 시트(Protection Sheet), 일 편광은 투과시키고 다른 편광은 반사시켜서 휘도를 향상시키는 반사 편광 시트(DBEF, Dual Brightness Enhancement Film) 등을 포함할 수 있다.The optical sheets 51 and 52 may be disposed in front of the diffuser plate 60 to improve optical properties of light emitted from the diffuser plate 60 . The optical sheets 51 and 52 are a diffuser sheet for offsetting the pattern of the diffuser plate 60, a prism sheet for improving luminance by concentrating light, and other optics from external impact or foreign matter inflow. It may include a protective sheet for protecting the sheet, a reflective polarization sheet (DBEF, Dual Brightness Enhancement Film) that transmits one polarized light and reflects the other polarized light to improve luminance.
후방 섀시(40)는 백라이트 유닛(5)의 후방에 배치될 수 있다. 후방 섀시(40)는 대략 테두리부가 전방으로 절곡된 판 형상을 가질 수 있다. 후방 섀시(40)와 전방 섀시(20)의 사이에 백라이트 유닛(5)이 수용될 수 있다.The rear chassis 40 may be disposed behind the backlight unit 5 . The rear chassis 40 may have a plate shape in which an edge portion is bent forward. The backlight unit 5 may be accommodated between the rear chassis 40 and the front chassis 20 .
후방 섀시(40)는 광원 플레이트(80)가 설치되는 후방 베이스부(41)와, 미들 몰드(30)와 결합되도록 후방 섀시(40)의 상하좌우의 테두리에서 형성되는 후방 측면부(42)를 포함할 수 있다.The rear chassis 40 includes a rear base portion 41 on which the light source plate 80 is installed, and a rear side portion 42 formed at the upper, lower, left, and right edges of the rear chassis 40 so as to be coupled with the middle mold 30 . can do.
후방 섀시(40) 복수의 광원 모듈(100) 등의 발열 소자에서 발생하는 열을 외부로 방열시키는 기능을 할 수 있다. 이를 위해 후방 섀시(40)는 알루미늄, SUS 등의 각종 금속 재질, 또는 ABS 등의 플라스틱 재질로 형성될 수 있다.The rear chassis 40 may function to radiate heat generated from heat generating elements such as the plurality of light source modules 100 to the outside. To this end, the rear chassis 40 may be formed of various metal materials such as aluminum and SUS, or plastic materials such as ABS.
전방 섀시(20)는 백라이트 유닛(5)의 광이 액정 패널(10)로 제공되도록 개구(23)를 갖는 틀 형상을 가질 수 있다. 전방 섀시(20)는 미들 몰드(30)와 결합되도록 전방 섀시(20)의 상하좌우의 테두리에서 형성되는 전방 측면부(21)와, 액정 패널(10)을 지지하도록 전방 측면부(21)에서 내측으로 돌출되는 패널 지지부(22)를 포함할 수 있다. The front chassis 20 may have a frame shape having an opening 23 so that light from the backlight unit 5 is provided to the liquid crystal panel 10 . The front chassis 20 has a front side part 21 formed at the upper, lower, left and right edges of the front chassis 20 to be coupled with the middle mold 30 , and the front side part 21 to support the liquid crystal panel 10 inwardly. It may include a protruding panel support 22 .
미들 몰드(30)는 확산판(60)을 지지하고 광원 플레이트(80)에서 발산된 광을 확산판(60)으로 반사시킬 수 있다. 미들 몰드(30)는 확산판(60)과 광원 플레이트(80) 사이의 간격을 유지할 수 있다. 미들 몰드(30)는 전방 섀시(20)와 후방 섀시(40)의 사이에 결합될 수 있다. The middle mold 30 may support the diffusion plate 60 and reflect light emitted from the light source plate 80 to the diffusion plate 60 . The middle mold 30 may maintain a gap between the diffusion plate 60 and the light source plate 80 . The middle mold 30 may be coupled between the front chassis 20 and the rear chassis 40 .
미들 몰드(30)는 개구(31)를 갖는 틀 형상으로 형성될 수 있다. 미들 몰드(30)는 전방 섀시(20)와 후방 섀시(40)가 결합되는 프레임부(32)와, 확산판(60)을 지지하도록 프레임부(32)에서 내측으로 돌출되는 확산판 지지부(33)와, 광을 반사시키도록 확산판 지지부(33)에서 연장되는 반사부(34)와, 인쇄회로기판(90)을 지지하도록 반사부(34)에서 연장되는 기판 지지부(35)를 포함할 수 있다.The middle mold 30 may be formed in a frame shape having an opening 31 . The middle mold 30 includes a frame part 32 to which the front chassis 20 and the rear chassis 40 are coupled, and a diffuser plate support part 33 protruding inward from the frame part 32 to support the diffuser plate 60 . ), a reflector 34 extending from the diffuser plate support 33 to reflect light, and a substrate support 35 extending from the reflector 34 to support the printed circuit board 90 . have.
프레임부(32)는 미들 몰드(30)의 상하좌우 테두리에 형성될 수 있다. 프레임부(32)는 공지된 다양한 끼움 결합 구조 및 별도의 체결 부재를 통해 전방 섀시(20) 및 후방 섀시(40)에 결합될 수 있다.The frame part 32 may be formed on upper, lower, left, and right edges of the middle mold 30 . The frame part 32 may be coupled to the front chassis 20 and the rear chassis 40 through various known fitting structures and separate fastening members.
확산판 지지부(33)는 확산판(60)을 지지하도록 프레임부(32)에서 내측으로 돌출될 수 있다. 확산판 지지부(33)는 확산판(60)의 입사면의 테두리부를 지지할 수 있다. 확산판 지지부(33)는 후방 섀시(40)의 베이스부(41)에 나란하도록 형성될 수 있다.The diffuser plate support part 33 may protrude inward from the frame part 32 to support the diffuser plate 60 . The diffuser plate support part 33 may support the edge of the incident surface of the diffuser plate 60 . The diffuser plate support 33 may be formed to be parallel to the base 41 of the rear chassis 40 .
반사부(34)는 광원 플레이트(80)에서 발산된 광을 확산판(60)의 입사면으로 반사시킬 수 있다. 반사부(34)는 대략 확산판 지지부(33)에서 후방 내측으로 경사지게 연장될 수 있다. 반사부(34)는 확산판 지지부(33)로부터 기판 지지부(35)를 향해 경사지게 연장될 수 있다.The reflector 34 may reflect the light emitted from the light source plate 80 to the incident surface of the diffuser plate 60 . The reflective portion 34 may extend substantially in an inwardly inclined manner from the diffuser plate support 33 . The reflector 34 may extend from the diffuser plate support 33 to the substrate support 35 in an inclined manner.
기판 지지부(35)는 광원 플레이트(80)의 인쇄회로기판(90)이 후방 섀시(40)의 베이스부(41)에서 들뜨지 않도록 고정할 수 있다. 기판 지지부(35)는 반사부(34)의 내측 단부에 형성될 수 있다. 기판 지지부(35)와 베이스부(41)의 사이에 광원 플레이트(80)의 인쇄회로기판(90)의 테두리부가 지지될 수 있다. The substrate support part 35 may fix the printed circuit board 90 of the light source plate 80 not to be lifted from the base part 41 of the rear chassis 40 . The substrate support part 35 may be formed at an inner end of the reflective part 34 . An edge of the printed circuit board 90 of the light source plate 80 may be supported between the substrate support part 35 and the base part 41 .
미들 몰드(30)의 프레임부(32)와, 확산판 지지부(33)와, 반사부(34)와, 기판 지지부(35)는 일체로 형성될 수 있다. 미들 몰드(30)의 표면에는 반사율이 높은 물질이 코팅될 수 있다. 반사율이 높은 물질은 미들 몰드(30)의 전체 표면에 코팅되거나 또는 반사부(34)의 표면에만 코팅될 수도 있다. 미들 몰드(30) 전체 또는 미들 몰드(30)의 반사부(34)는 광의 반사가 잘 이루어지도록 화이트 색상을 가질 수 있다.The frame part 32 of the middle mold 30 , the diffuser plate support part 33 , the reflective part 34 , and the substrate support part 35 may be integrally formed. A material having high reflectivity may be coated on the surface of the middle mold 30 . The high reflectance material may be coated on the entire surface of the middle mold 30 or only on the surface of the reflective portion 34 . The entire middle mold 30 or the reflective portion 34 of the middle mold 30 may have a white color so that light is well reflected.
도 4는 도 2의 디스플레이 장치의 인쇄회로기판을 도시한 도면이고, 도 5는 도 4의 인쇄회로기판에서 광이 반사되는 상태를 도시한 모식도이다.FIG. 4 is a diagram illustrating a printed circuit board of the display device of FIG. 2 , and FIG. 5 is a schematic diagram illustrating a state in which light is reflected from the printed circuit board of FIG. 4 .
도 4 및 도 5를 참조하면, 광원 플레이트(80)의 인쇄회로기판(90)은 베이스(91)와, 금속 배선을 포함하는 전원 배선층(92)과, 베이스(91)와 전원 배선층(92)의 사이에 형성되어 베이스(91)의 전방에 배치되고 전원 배선층(92)의 후방에 배치되는 절연층(93)과, 전원 배선층(92)의 패턴을 보호하고 광효율 증대를 위해 전원 배선층(92) 전방에 형성되어 외부로 노출되는 다공성 PSR(Photo Solder Resist)층(94)을 포함할 수 있다.4 and 5 , the printed circuit board 90 of the light source plate 80 includes a base 91 , a power wiring layer 92 including metal wiring, and a base 91 and a power wiring layer 92 . An insulating layer 93 formed in between and disposed in front of the base 91 and disposed behind the power wiring layer 92, and a power wiring layer 92 to protect the pattern of the power wiring layer 92 and increase light efficiency. It may include a porous photo solder resist (PSR) layer 94 that is formed in front and exposed to the outside.
베이스는 광원 플레이트(80)의 골격을 형성하며, 전원 배선층(92)을 통해 광원 모듈(100)에 전압을 인가할 수 있는 기판이면 어떤 것이든 사용 가능할 수 있다. 예를 들어, FR-4, 세라믹, 폴리이미드(Polyimide), PET, 유리(glass) 등에 의해 형성될 수 있다.The base forms the framework of the light source plate 80 , and any substrate capable of applying a voltage to the light source module 100 through the power wiring layer 92 may be used. For example, it may be formed of FR-4, ceramic, polyimide, PET, glass, or the like.
전원 배선층(92)의 금속 배선은 베이스 상에 도전성 물질이 패터닝되어 형성될 수 있다.The metal wiring of the power wiring layer 92 may be formed by patterning a conductive material on a base.
절연층(93)은 베이스와 전원 배선층(92)의 사이에 위치하여 베이스와 전원 배선층(92)의 금속 배선 사이를 전기적으로 절연시킬 수 있다.The insulating layer 93 may be positioned between the base and the power wiring layer 92 to electrically insulate the base and the metal wiring of the power wiring layer 92 .
다공성 PSR층(94)은 전원 배선층(92) 상에 중공 입자(hollow particle)와 혼합된 PSR(Photo solder resist) 잉크를 도포함으로써 형성될 수 있다. The porous PSR layer 94 may be formed by applying a photo solder resist (PSR) ink mixed with hollow particles on the power wiring layer 92 .
중공 입자(96)는 내부가 빈 구형 입자로서 그 내부에 빈 공간이 형성되며, 이에 따라 PSR층(94)에는 중공 입자(96)의 빈 공간으로 형성되는 복수의 공극(97)이 형성될 수 있다.The hollow particle 96 is a spherical particle with an empty interior, and an empty space is formed therein. Accordingly, a plurality of pores 97 formed as the empty space of the hollow particle 96 may be formed in the PSR layer 94 . have.
이 경우, 중공 입자(96)는 실리카(silica) 및 아크릴(acrylic) 중 적어도 하나를 포함할 수 있으며, 이외에 중공 형상을 갖는 다양한 입자를 포함할 수 있다.In this case, the hollow particles 96 may include at least one of silica and acrylic, and may include various particles having a hollow shape in addition.
앞서 설명한 바와 같이 확산판(60)으로부터 광이 후방으로 출사되는 경우, 광은 다공성 PSR층(94)을 향하게 된다. 이 경우, 확산판(60)으로부터 출사된 광은 도 5에 도시된 바와 같이 다공성 PSR층(94)에 형성되는 복수의 공극(97)에서 반사가 이루어지게 된다. As described above, when light is emitted from the diffuser plate 60 to the rear, the light is directed toward the porous PSR layer 94 . In this case, the light emitted from the diffusion plate 60 is reflected in the plurality of pores 97 formed in the porous PSR layer 94 as shown in FIG. 5 .
다시 말하여, 확산판(60)으로부터 다공성 PSR층(94)에 광이 입사되는 경우, 복수의 공극(97)에서 반사가 이루어짐에 따라 다공성 PSR층(94)에서 반사가 이루어져 광이 다시 확산판(60)을 향할 수 있게 된다. 그리하여 확산판(60)으로부터 출사된 광을 반사시키도록 확산판(60)과 인쇄회로기판(90) 사이에 종래의 디스플레이 장치와 같이 반사 시트를 배치할 필요가 없으며, 이에 따라 디스플레이 장치의 원가 절감은 물론 생산성을 향상시킬 수 있게 된다.In other words, when light is incident on the porous PSR layer 94 from the diffuser plate 60 , as light is reflected in the plurality of pores 97 , the light is reflected in the porous PSR layer 94 so that the light is again transmitted to the diffuser plate. (60) is possible. Therefore, there is no need to dispose a reflective sheet between the diffuser plate 60 and the printed circuit board 90 to reflect the light emitted from the diffuser plate 60 as in a conventional display device, thereby reducing the cost of the display device. Of course, it can improve productivity.
도 6은 본 개시의 다른 실시예에 따른 디스플레이 장치의 인쇄회로 기판을 도시한 도면이고, 도 7은 도 6의 인쇄회로기판에서 레진이 열 수축된 상태를 도시한 모식도이다.6 is a diagram illustrating a printed circuit board of a display device according to another embodiment of the present disclosure, and FIG. 7 is a schematic diagram illustrating a state in which the resin is thermally shrunk in the printed circuit board of FIG. 6 .
본 개시에 의한 디스플레이 장치는 인쇄회로기판(90a)을 제외하고는 도 1 내지 도 5를 참조하여 설명한 디스플레이 장치(1)와 실질적으로 동일하므로 동일한 참조번호를 사용하고 중복되는 설명은 생략한다.Since the display device according to the present disclosure is substantially the same as the display device 1 described with reference to FIGS. 1 to 5 except for the printed circuit board 90a, the same reference numerals are used, and overlapping descriptions are omitted.
도 6 및 도 7을 참조하면, 본 개시에 의한 디스플레이 장치의 백라이트 유닛의 인쇄회로기판(90a)은 베이스(91a)와, 금속 배선을 포함하는 전원 배선층(92a)과, 베이스(91a)와 전원 배선층(92a)의 사이에 형성되어 베이스(91a)의 전방에 배치되고 전원 배선층(92a)의 후방에 배치되는 절연층(93a)과, 전원 배선층(92a)의 패턴을 보호하고 광효율 증대를 위해 전원 배선층(92a) 전방에 형성되어 외부로 노출되는 다공성 PSR(Photo Solder Resist)층(94)을 포함할 수 있다.6 and 7 , the printed circuit board 90a of the backlight unit of the display device according to the present disclosure includes a base 91a, a power wiring layer 92a including metal wiring, the base 91a, and a power supply. An insulating layer 93a formed between the wiring layers 92a, disposed in front of the base 91a and disposed behind the power wiring layer 92a, and a power supply to protect the pattern of the power wiring layer 92a and increase light efficiency A porous photo solder resist (PSR) layer 94 formed in front of the wiring layer 92a and exposed to the outside may be included.
다공성 PSR 층(94a)은 PSR 잉크(95a)와 열 수축이 가능한 레진(98a)이 혼합되어 이루어질 수 있다.The porous PSR layer 94a may be formed by mixing the PSR ink 95a and the heat-shrinkable resin 98a.
이 경우, 레진(98a)은 실리콘계(silicon) 레진 및 에폭시계(epoxy) 레진 중 적어도 하나를 포함할 수 있으며, 이외에 다양한 무기물을 포함하여 이루어질 수도 있다.In this case, the resin 98a may include at least one of a silicon-based resin and an epoxy-based resin, and may also include various inorganic materials.
도 7에 도시한 바와 같이, 다공성 PSR층(94a)에 열을 인가하면 레진(98a)이 열 수축에 의해 그 크기가 감소됨에 따라 다공성 PSR층(94a)에 복수의 공극(99a)이 형성될 수 있다.7, when heat is applied to the porous PSR layer 94a, as the size of the resin 98a is reduced by thermal contraction, a plurality of pores 99a will be formed in the porous PSR layer 94a. can
이 경우, 확산판(60)으로부터 광이 후방으로 출사되어 다공성 PSR층(94a)으로 입사되면, 광은 다공성 PSR층(94a)의 복수의 공극(99a)에서 반사가 이루어지게 된다.In this case, when light is emitted from the diffusion plate 60 backward and is incident on the porous PSR layer 94a, the light is reflected in the plurality of pores 99a of the porous PSR layer 94a.
이하에서는 도면들을 참조하여 본 개시에 따른 디스플레이 장치의 백라이트 유닛(5)의 제조 방법에 대하여 설명한다.Hereinafter, a method of manufacturing the backlight unit 5 of the display device according to the present disclosure will be described with reference to the drawings.
도 8은 도 1 또는 도6의 디스플레이 장치의 백라이트 유닛의 제조 방법을 도시한 흐름도이고, 도 9는 도 8의 백라이트 유닛의 제조 방법에서 다공성 PSR층을 포함하는 인쇄회로기판을 마련하는 단계를 도시한 일 예이고, 도 10은 도 8의 백라이트 유닛의 제조 방법에서, 다공성 PSR층을 포함하는 인쇄회로기판을 마련하는 단계를 도시한 다른 예이다.FIG. 8 is a flowchart illustrating a method of manufacturing the backlight unit of the display device of FIG. 1 or FIG. 6 , and FIG. 9 shows a step of preparing a printed circuit board including a porous PSR layer in the method of manufacturing the backlight unit of FIG. 8 As an example, FIG. 10 is another example illustrating a step of preparing a printed circuit board including a porous PSR layer in the method of manufacturing the backlight unit of FIG. 8 .
도 8을 참조하면, 먼저, 다공성 PSR(Photo Solder Resist) 층을 포함하는 인쇄회로기판을 마련한다(단계 S100).Referring to FIG. 8 , first, a printed circuit board including a porous photo solder resist (PSR) layer is prepared (step S100).
다공성 PSR층(94)을 포함하는 인쇄회로기판(90)을 마련할 때, 일 예로, 도 9를 참조하면, (a)와 같이 액체 형태의 PSR 잉크(95)와 고체 형태의 중공 입자(96)를 준비하여 PSR 잉크(95)와 중공 입자(96)를 혼합하고, (b)와 같이 베이스의 상측, 즉, 전원 배선층(92) 상에 중공 입자(96)와 혼합된 PSR 잉크(95)를 도포함으로써, 다공성 PSR층(94)을 포함하는 인쇄회로기판(90)을 마련할 수 있다.When preparing the printed circuit board 90 including the porous PSR layer 94, for example, referring to FIG. 9 , as shown in (a), PSR ink 95 in liquid form and hollow particles 96 in solid form ) prepared to mix the PSR ink 95 and the hollow particles 96, and the PSR ink 95 mixed with the hollow particles 96 on the upper side of the base, that is, on the power wiring layer 92, as shown in (b). By coating the printed circuit board 90 including the porous PSR layer 94 can be prepared.
다른 예로, 도 10을 참조하면, (a)와 같이 액체 형태의 PSR 잉크(95a)와 고체 형태의 열 수축이 가능한 레진(98a)을 준비하여 PSR 잉크(95a)와 레진(98a)을 혼합하고, (b)와 같이 베이스(91a)의 상측, 즉, 전원 배선층(92a) 상에 레진(98a)과 혼합된 PSR 잉크(95a)를 도포한 후, (c)와 같이 레진(98)과 혼합된 PSR 잉크(95a)에 열을 인가하여 레진(98)이 열 수축되도록 함으로써, 다공성 PSR층(94a)을 포함하는 인쇄회로기판(90a)을 마련할 수 있다.As another example, referring to FIG. 10 , a liquid PSR ink 95a and a solid heat-shrinkable resin 98a are prepared as shown in (a), and the PSR ink 95a and the resin 98a are mixed. , after applying the PSR ink 95a mixed with the resin 98a on the upper side of the base 91a, that is, on the power wiring layer 92a as shown in (b), mixed with the resin 98 as shown in (c) The printed circuit board 90a including the porous PSR layer 94a may be prepared by applying heat to the PSR ink 95a so that the resin 98 is thermally contracted.
도시하지 않았으나, 이와 같이 베이스의 상측에 PSR 잉크(95a)가 도포되면, 통상의 노광 및 현상 작업을 수행함으로써, 다공성 PSR 층(94a)을 포함하는 인쇄회로기판(90a)이 형성될 수 있다.Although not shown, when the PSR ink 95a is applied to the upper side of the base as described above, the printed circuit board 90a including the porous PSR layer 94a may be formed by performing normal exposure and development operations.
이와 같이 다공성 PSR 층(94, 94a)을 포함하는 인쇄회로기판(90, 90a)이 형성되면, 다공성 PSR층(94, 94a)을 포함하는 인쇄회로기판(90, 90a) 상에 광을 발산하는 광원 모듈(100)을 실장한다(단계 S200).When the printed circuit boards 90 and 90a including the porous PSR layers 94 and 94a are formed in this way, light is emitted on the printed circuit boards 90 and 90a including the porous PSR layers 94 and 94a. The light source module 100 is mounted (step S200).
마지막으로, 광원 모듈(100)이 실장된 인쇄회로기판(90, 90a)의 전방에 광학 부재들을(50) 배치함으로써 백라이트 유닛(5)이 제조될 수 있다(단계 S300). Finally, the backlight unit 5 may be manufactured by disposing the optical members 50 in front of the printed circuit boards 90 and 90a on which the light source module 100 is mounted (step S300 ).
광학 부재들(50)은 광원 플레이트(80)에서 발사되는 불규칙적인 광을 고르게 확산시키는 확산판(Diffuser Plate, 60)과, 광특성을 향상시키는 광학 시트들(51, 52)을 포함할 수 있다.The optical members 50 may include a diffuser plate 60 for evenly diffusing the irregular light emitted from the light source plate 80 , and optical sheets 51 and 52 for improving optical characteristics. .
확산판(60)은 광원 플레이트(80)에서 발산되는 광을 고르게 확산시키고, 광학 시트들(51, 52)을 지지할 수 있다. 확산판(60)은 그 입사면으로 입사된 광을 고르게 확산시켜 그 출사면으로 출사시킬 수 있다.The diffusion plate 60 may evenly diffuse the light emitted from the light source plate 80 and support the optical sheets 51 and 52 . The diffuser plate 60 may evenly diffuse the light incident on the incident surface to be emitted to the emission surface.
광학 시트(51, 52)는 확산판(60)에서 출사되는 광의 광 특성을 향상시키도록 확산판(60)의 전방에 배치될 수 있다. 광학 시트(51, 52)는 확산판(60)의 패턴을 상쇄시키기 위한 확산 시트(Diffuser Sheet), 광을 집중시켜서 휘도를 향상시키는 프리즘 시트(Prism Sheet), 외부의 충격이나 이물 유입으로부터 다른 광학 시트를 보호하는 보호 시트(Protection Sheet), 일 편광은 투과시키고 다른 편광은 반사시켜서 휘도를 향상시키는 반사 편광 시트(DBEF, Dual Brightness Enhancement Film) 등을 포함할 수 있다.The optical sheets 51 and 52 may be disposed in front of the diffuser plate 60 to improve optical properties of light emitted from the diffuser plate 60 . The optical sheets 51 and 52 are a diffuser sheet for offsetting the pattern of the diffuser plate 60, a prism sheet for improving luminance by concentrating light, and other optics from external impact or foreign matter inflow. It may include a protective sheet for protecting the sheet, a reflective polarization sheet (DBEF, Dual Brightness Enhancement Film) that transmits one polarized light and reflects the other polarized light to improve luminance.
발명의 권리범위는 상기 설명한 특정 실시예에만 한정되는 것이 아니다. 청구범위에 명시된 본 개시의 기술적 사상으로서의 요지를 일탈하지 아니하는 범위 안에서 당 분야에서 통상의 지식을 가진 자에 의하여 수정 또는 변형 가능한 다양한 다른 실시예들도 본 개시의 권리범위에 속한다 할 것이다.The scope of the invention is not limited to the specific embodiments described above. Various other embodiments that can be modified or modified by those skilled in the art within the scope without departing from the spirit of the present disclosure specified in the claims will also fall within the scope of the present disclosure.

Claims (15)

  1. 인쇄회로기판 및 상기 인쇄회로기판에 실장되는 복수의 광원 모듈을 포함하는 광원 플레이트; 및a light source plate including a printed circuit board and a plurality of light source modules mounted on the printed circuit board; and
    상기 광원 플레이트의 전방에 배치되어 상기 광원 플레이트에서 발산되는 광을 확산시키는 확산판;을 포함하며,a diffusion plate disposed in front of the light source plate to diffuse the light emitted from the light source plate; and
    상기 인쇄회로기판은,The printed circuit board is
    상기 확산판에서 후방으로 출사되는 광을 반사시키도록 복수의 공극을 포함하는 다공성 PSR(Photo Solder Resist) 층을 포함하는 백라이트 유닛.and a porous photo solder resist (PSR) layer including a plurality of pores to reflect light emitted from the diffusion plate rearward.
  2. 제1항에 있어서, According to claim 1,
    상기 다공성 PSR 층은,The porous PSR layer,
    PSR잉크와 중공 입자가 혼합되어 이루어지는 백라이트 유닛.A backlight unit made by mixing PSR ink and hollow particles.
  3. 제2항에 있어서, 3. The method of claim 2,
    상기 중공 입자는,The hollow particles are
    실리카(silica) 및 아크릴(acrylic) 중 적어도 하나를 포함하는 백라이트 유닛.A backlight unit comprising at least one of silica and acrylic.
  4. 제1항에 있어서, According to claim 1,
    상기 다공성 PSR 층은,The porous PSR layer,
    PSR잉크와 열 수축이 가능한 레진이 혼합되어 이루어지는 백라이트 유닛.A backlight unit made of a mixture of PSR ink and heat-shrinkable resin.
  5. 제4항에 있어서, 5. The method of claim 4,
    상기 다공성 PSR층에 열을 가하는 경우, 상기 레진이 열 수축에 의해 그 크기가 감소함에 따라 상기 다공성 PSR 층에는 상기 공극이 마련되는 백라이트 유닛.When heat is applied to the porous PSR layer, the pore is provided in the porous PSR layer as the size of the resin decreases due to heat shrinkage.
  6. 제5항에 있어서, 6. The method of claim 5,
    상기 레진은,The resin is
    실리콘계(silicon) 레진 및 에폭시계(epoxy) 레진 중 적어도 하나를 포함하는 백라이트 유닛.A backlight unit comprising at least one of a silicon-based resin and an epoxy-based resin.
  7. 액정 패널; liquid crystal panel;
    상기 액정 패널의 후방에 배치되는 인쇄회로기판 및 상기 액정 패널에 광을 제공하도록 상기 인쇄회로기판에 실장되는 광원 모듈을 포함하는 광원 플레이트; 및a light source plate including a printed circuit board disposed behind the liquid crystal panel and a light source module mounted on the printed circuit board to provide light to the liquid crystal panel; and
    상기 광원 플레이트의 전방에 배치되어 상기 광원 플레이트에서 제공되는 광을 확산시키는 확산판;을 포함하며,a diffusion plate disposed in front of the light source plate to diffuse the light provided from the light source plate; and
    상기 인쇄회로기판은,The printed circuit board is
    상기 확산판에서 후방으로 출사되는 광을 반사시키도록 복수의 공극을 포함하는 다공성 PSR(Photo Solder Resist) 층을 포함하는 디스플레이 장치.and a porous photo solder resist (PSR) layer including a plurality of pores to reflect the light emitted from the diffusion plate rearward.
  8. 제7항에 있어서, 8. The method of claim 7,
    상기 다공성 PSR 층은,The porous PSR layer,
    PSR잉크와 중공 입자가 혼합되어 이루어지는 백라이트 유닛.A backlight unit composed of a mixture of PSR ink and hollow particles.
  9. 제8항에 있어서, 9. The method of claim 8,
    상기 중공 입자는,The hollow particles are
    실리카 및 아크릴 중 적어도 하나를 포함하는 디스플레이 장치.A display device comprising at least one of silica and acrylic.
  10. 제7항에 있어서, 8. The method of claim 7,
    상기 다공성 PSR 층은,The porous PSR layer,
    PSR잉크와 열 수축이 가능한 레진이 혼합되어 이루어지는 디스플레이 장치.A display device made of a mixture of PSR ink and heat-shrinkable resin.
  11. 제10항에 있어서, 11. The method of claim 10,
    상기 다공성 PSR층에 열을 가하는 경우, 상기 레진이 열 수축에 의해 그 크기가 감소함에 따라 상기 다공성 PSR 층에는 상기 공극이 마련되는 디스플레이 장치.When heat is applied to the porous PSR layer, the pore is provided in the porous PSR layer as the size of the resin is reduced by heat shrinkage.
  12. 제11항에 있어서, 12. The method of claim 11,
    상기 레진은,The resin is
    실리콘계 레진 및 에폭시계 레진 중 적어도 하나를 포함하는 디스플레이 장치.A display device comprising at least one of a silicone-based resin and an epoxy-based resin.
  13. 다공성 PSR(Photo Solder Resist) 층을 포함하는 인쇄회로기판을 마련하고,Prepare a printed circuit board including a porous PSR (Photo Solder Resist) layer,
    상기 인쇄회로기판 상에 광을 발산하는 광원 모듈을 실장하고,Mounting a light source module emitting light on the printed circuit board,
    상기 광원 모듈이 실장된 상기 인쇄회로기판 상에 광학 부재를 배치하는 것을 포함하는 백라이트 유닛의 제조 방법.and disposing an optical member on the printed circuit board on which the light source module is mounted.
  14. 제13항에 있어서, 14. The method of claim 13,
    상기 다공성 PSR 층은, PSR잉크와 중공 입자가 혼합되어 이루어지며, The porous PSR layer is made by mixing PSR ink and hollow particles,
    상기 중공 입자는, 실리카 및 아크릴 중 적어도 하나를 포함하는 백라이트 유닛의 제조 방법.The hollow particle is a method of manufacturing a backlight unit including at least one of silica and acryl.
  15. 제13항에 있어서, 14. The method of claim 13,
    상기 다공성 PSR 층은, PSR잉크와 열 수축이 가능한 레진이 혼합되어 이루어지며, 상기 레진은, 실리콘계 레진 및 에폭시계 레진 중 적어도 하나를 포함하는 백라이트 유닛의 제조 방법.The porous PSR layer is made of a mixture of PSR ink and heat-shrinkable resin, wherein the resin includes at least one of a silicone-based resin and an epoxy-based resin.
PCT/KR2022/000865 2021-03-02 2022-01-18 Backlight unit, display apparatus including same, and manufacturing method of backlight unit WO2022186478A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030046051A (en) * 2001-12-04 2003-06-12 주식회사 코오롱 Composition for solder resist ink having superior adhesion to copper clad laminate
KR20080092239A (en) * 2006-01-26 2008-10-15 소니 가부시끼 가이샤 Light source device and display device
KR20110023798A (en) * 2009-08-28 2011-03-08 다이요 홀딩스 가부시키가이샤 Solder resist layer and printed wiring board
JP5754196B2 (en) * 2011-03-23 2015-07-29 ソニー株式会社 Illumination device and display device
CN109975900A (en) * 2017-12-27 2019-07-05 宁波长阳科技股份有限公司 A kind of reflectance coating and the preparation method and application thereof with heat conducting coating

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030046051A (en) * 2001-12-04 2003-06-12 주식회사 코오롱 Composition for solder resist ink having superior adhesion to copper clad laminate
KR20080092239A (en) * 2006-01-26 2008-10-15 소니 가부시끼 가이샤 Light source device and display device
KR20110023798A (en) * 2009-08-28 2011-03-08 다이요 홀딩스 가부시키가이샤 Solder resist layer and printed wiring board
JP5754196B2 (en) * 2011-03-23 2015-07-29 ソニー株式会社 Illumination device and display device
CN109975900A (en) * 2017-12-27 2019-07-05 宁波长阳科技股份有限公司 A kind of reflectance coating and the preparation method and application thereof with heat conducting coating

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