WO2022173168A1 - Digitizer and image display device comprising same - Google Patents

Abstract

Embodiments of the present invention provide a digitizer and an image display device comprising same. The digitizer comprises: a substrate layer including an active area and adjacent areas; a first conductive coil, which is arranged on the substrate layer and extends in a row direction; a second conductive coil, which is arranged on the substrate layer and extends in a column direction; and a compensation pattern connected to the first conductive coil or the second conductive coil. A current passage of a conductive coil extends through the compensation pattern so that electromagnetic induction efficiency can be improved.

Description

Digitizer and image display device including same

The present invention relates to a digitizer and an image display device including the same. More particularly, it relates to a digitizer including a multilayer conductive structure and an image display device including the same.

Recently, various sensing functions and communication functions are combined in an image display device, and are implemented in the form of, for example, a smartphone. For example, electronic devices in which a touch panel or a touch sensor is attached to a display panel of the image display device to select a menu displayed on a window surface to implement an information input function are being developed.

In addition, as disclosed in Korean Patent No. 10-1750564, a digitizer that converts analog coordinate information into a digital signal by an electromagnetic method is disposed on the back side of the image display device.

A digitizer needs a circuit design with low resistance to improve electromagnetic induction efficiency. However, when the wiring density is increased in order to increase the sensitivity of the digitizer, the wiring line width may decrease and thus the resistance may increase.

Recently, a flexible display having flexibility that can be folded or bent is being developed, and accordingly, a sensor structure such as the digitizer needs to be developed to have appropriate physical properties, design, and structure so that it can also be applied to the flexible display.

For example, in the case of a digitizer applied to a thin display device, a wiring crack may easily occur in a bending portion. In this case, resistance may be increased by damaged wiring. Therefore, there is a need to develop a digitizer capable of maintaining reliability even after repeated bending.

One object of the present invention is to provide a digitizer having improved mechanical and electrical reliability.

An object of the present invention is to provide an image display device including a digitizer having improved mechanical and electrical reliability.

1. A substrate layer including an active region and a peripheral region, a first conductive coil disposed on the substrate layer and extending in a row direction, and a second conductive coil disposed on the substrate layer and extending in a column direction; and a compensation pattern connected to the first conductive coil or the second conductive coil.

2. The digitizer of 1 above, wherein the compensation pattern includes a first compensation pattern connected to the first conductive coil and a second compensation pattern connected to the second conductive coil.

3. The digitizer of 2 above, wherein the first conductive coil includes a plurality of row direction conductive loops, and the second conductive coil includes a plurality of column direction conductive loops.

4. The digitizer of 3 above, wherein the first compensation pattern is connected to each of the row direction conductive loops, and the second compensation pattern is connected to each of the column direction conductive loops.

5. The method of 2 above, wherein the first conductive coil includes first upper conductive lines extending in the row direction, second lower conductive lines extending in the column direction, and the first upper conductive lines and the first conductive coils. first contacts electrically connecting two lower conductive lines, wherein the second conductive coil includes first lower conductive lines extending in the column direction, second upper conductive lines extending in the row direction, and the A digitizer comprising: second contacts electrically connecting the first lower conductive lines and the second upper conductive lines.

6. The method of 5 above, further comprising an interlayer insulating layer formed on the base layer, wherein the first lower conductive lines and the second lower conductive lines are disposed on the upper surface of the base layer, and the interlayer insulating layer is formed on the upper surface of the base layer to cover the first lower conductive lines and the second lower conductive lines, and the first upper conductive lines and the second upper conductive lines are formed on the upper surface of the interlayer insulating layer Placed on the digitizer.

7. The method of 6 above, wherein the first compensation pattern and the second compensation pattern are disposed on the active region of the base layer, and the first compensation pattern is the first upper conductive pattern included in the first conductive coil. connected to the lines, and the second compensation pattern is in contact with the first lower conductive lines included in the second conductive coil.

8. The method of 7 above, wherein the first compensation pattern is disposed on the same layer as the first lower conductive lines and the second lower conductive lines, and the second compensation pattern passes through the interlayer insulating layer and passes through the interlayer insulating layer. 1 Digitizer, in contact with the upper surface of the lower conductive line.

9. The digitizer according to 8 above, wherein the interlayer insulating layer includes a first via hole filled by the first upper conductive line and a second via hole in which the second compensation pattern is formed.

10. The method of 6 above, wherein the first compensation pattern and the second compensation pattern are disposed on the peripheral region of the base layer, and the first compensation pattern is the second lower conductive pattern included in the first conductive coil. The second upper conductive line is in contact with a second lower conductive line disposed at an outer portion of the lines, and the second compensation pattern includes a second upper conductive line disposed at an outer portion of the second upper conductive lines included in the second conductive coil; Contact, digitizer.

11. The method of 10 above, wherein the first compensation pattern penetrates the interlayer insulating layer and is in contact with an upper surface of the second lower conductive line, and the second compensation pattern includes the first lower conductive lines and the second lower conductive line. A digitizer, disposed on the same layer as the conductive lines and connected to the second upper conductive line.

12. The digitizer of the above 11, wherein the interlayer insulating layer includes a third via hole in which the first compensation pattern is formed, and a fourth via hole filled by the second connection line.

13. The digitizer according to the above 6, wherein a thickness of the first lower conductive lines is greater than a thickness of the first upper conductive lines.

14. The digitizer according to the above 13, wherein the base layer includes a bending region in the central portion.

15. The digitizer according to 14 above, wherein a bending axis of the bending region intersects the first upper conductive lines and is parallel to the first lower conductive lines.

16. The digitizer according to 1 above, wherein a plurality of the first conductive coils are arranged along the column direction, and a plurality of the second conductive coils are arranged along the row direction.

17. The digitizer according to 16 above, wherein the compensation pattern is disposed in a region of the active region except for an intersection region where the first conductive coils and the second conductive coils overlap.

18. The digitizer of 16 above, wherein a plurality of the compensation patterns are arranged along a periphery of the base layer.

19. An image display apparatus comprising: a display panel; and the above-described digitizer disposed below the display panel.

20. The method of 19 above, further comprising a touch sensor disposed on a rear cover, a window substrate, and the display panel, wherein the touch sensor is disposed between the window substrate and the display panel, and the digitizer comprises the display panel and the display panel. An image display device disposed between the rear covers.

According to embodiments of the present invention, the compensation pattern may be connected to the conductive coil of the active region of the digitizer. A current path in the active region may be expanded through the compensation pattern to improve or amplify the strength of a magnetic field generated through the conductive coil. Accordingly, the sensing sensitivity in the active region may be improved.

In example embodiments, the digitizer may include a multilayer structure of a lower conductive layer and an upper conductive layer. The upper conductive layer may include an upper conductive line intersecting a bending axis, and the lower conductive layer may include a lower conductive line parallel to the bending axis. By forming it small, it is possible to suppress electrode cracks and improve bending properties.

The digitizer may include a plurality of first conductive coils and second conductive coils, and the first conductive coil and the second conductive coil may include a plurality of conductive loops. Accordingly, a digitizer that promotes the electromagnetic induction phenomenon and has high resolution and improved flexible characteristics can be provided.

1 and 2 are schematic plan and cross-sectional views, respectively, of a digitizer according to exemplary embodiments.

3 and 4 are schematic plan and cross-sectional views, respectively, of a digitizer according to exemplary embodiments.

5 and 6 are schematic plan and cross-sectional views, respectively, of a digitizer according to exemplary embodiments.

7 and 8 are schematic plan and cross-sectional views, respectively, of a digitizer according to exemplary embodiments.

9 is a schematic plan view illustrating a digitizer according to exemplary embodiments.

10 is a schematic partially enlarged plan view illustrating an active area of a digitizer according to example embodiments.

11 is a schematic plan view illustrating a digitizer according to exemplary embodiments.

12 is a schematic cross-sectional view illustrating an image display apparatus according to example embodiments.

SUMMARY Embodiments of the present invention provide a digitizer including conductive patterns having a multilayer structure and having improved bending reliability. Also provided is an image display device including a digitizer.

Hereinafter, with reference to the drawings, embodiments of the present invention will be described in more detail. However, the following drawings attached to the present specification illustrate preferred embodiments of the present invention, and serve to further understand the technical spirit of the present invention together with the above-described content of the present invention, so the present invention is described in such drawings It should not be construed as being limited only to the matters.

In the drawings below, two directions parallel to and intersecting with the upper surface of the digitizer 100 or the base layer 105 are defined as a first direction and a second direction. For example, the first direction and the second direction may cross each other perpendicularly.

The first direction may correspond to a width direction, a row direction, or an X-direction of the digitizer 100 . The second direction may correspond to a longitudinal direction, a column direction, or a Y-direction of the digitizer 100 .

The terms "row direction", "column direction", etc. used in the present application do not refer to absolute directions, and should be understood as relative meanings designating different directions.

1 and 2 are schematic plan and cross-sectional views, respectively, of a digitizer according to exemplary embodiments. For example, FIG. 1 is a schematic plan view illustrating a first conductive coil included in a digitizer. FIG. 2 is a cross-sectional view taken along the line I-I' shown in FIG. 1 in the thickness direction.

1 and 2 , a digitizer according to example embodiments may include a lower conductive layer 110 and an upper conductive layer 130 formed on a base layer 105 . The lower conductive layer 110 and the upper conductive layer 130 may be separated in different layers with the interlayer insulating layer 120 interposed therebetween.

The lower conductive layer 110 may include a first lower conductive line 112 (refer to FIG. 3 ) and a second lower conductive line 114 . The upper conductive layer 130 may include a first upper conductive line 132 and a second upper conductive line 134 (refer to FIG. 3 ).

The first lower conductive line 112 and the second lower conductive line 114 may extend in the second direction. The first upper conductive line 132 and the second upper conductive line 134 may extend in a first direction.

In some embodiments, the second lower conductive line 114 and the second upper conductive line 134 may have a smaller width than the first lower conductive line 112 and the first upper conductive line 132 .

In example embodiments, the digitizer may include compensation patterns 110a and 130a connected to a first conductive coil 50 or a second conductive coil 70 to be described later.

The substrate layer 105 is used to encompass a support layer or a film-type substrate for forming the conductive layers 110 and 130 and the interlayer insulating layer 120 . For example, the base layer 105 may include a polymer applicable to a flexible display. Examples of the polymer include cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), poly Allylate (polyallylate), polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), poly Methyl methacrylate (PMMA), etc. are mentioned.

Preferably, the base layer 105 may include polyimide to secure stable bending properties.

The lower conductive layer 110 and the upper conductive layer 130 may each include a low-resistance metal. For example, the lower conductive layer 110 and the upper conductive layer 130 are silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium ( Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc ( Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least two of them.

Preferably, the lower conductive layer 110 and the upper conductive layer 130 may include copper or a copper alloy to realize low resistance.

The interlayer insulating layer 120 may be formed on the upper surface of the base layer 105 to cover the lower conductive layer 110 . The interlayer insulating layer 120 may include an organic insulating material such as an epoxy-based resin, an acrylic resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic insulating material such as silicon oxide or silicon nitride. Preferably, the interlayer insulating layer 120 may be formed using an organic insulating material to improve flexible properties.

The upper conductive layer 130 may be formed on the interlayer insulating layer 120 . In some embodiments, the passivation layer 140 may be formed on the interlayer insulating layer 120 to cover the upper conductive layer 130 . The passivation layer 140 may include an organic insulating material such as an epoxy-based resin, an acrylic resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic insulating material such as silicon oxide or silicon nitride.

Preferably, the passivation layer 140 may be formed using an organic insulating material to improve flexible properties. In an embodiment, each of the interlayer insulating layer 120 and the passivation layer 140 may have a thickness in a range of about 1.5 to 20 μm to improve bending properties, and may include the organic insulating material.

In an embodiment, each of the interlayer insulating layer 120 and the passivation layer 140 may include the inorganic insulating material and may have a thickness of about 100 nm to 500 nm.

The digitizer may include a first conductive coil 50 . The first conductive coil 50 may be provided as the first direction (or row direction) conductive coil. In the first conductive coil 50 , the second lower conductive line 114 of the lower conductive layer 110 and the first upper conductive line 132 of the upper conductive layer 130 are combined by first contacts 135 . can be defined as

The first upper conductive line 132 and the second lower conductive line 114 may together form a first conductive coil 50 to serve as a sensing line for an input pen through electromagnetic induction.

For example, the first upper conductive line 132 and the second lower conductive line 114 may be electrically connected to each other through the first contact 135 . A plurality of first upper conductive lines 132 and a plurality of second lower conductive lines 114 are electrically connected to each other through a plurality of first contacts 135 to form a single first conductive coil 50 . A plurality of conductive loops may be included. For example, four row direction conductive loops may be included in one first conductive coil 50 .

In one embodiment, the first row-direction conductive loop 50a, the second row-direction conductive loop 50b, the third row-direction conductive loop 50c and The fourth row direction conductive loops 50d may be sequentially disposed.

In some embodiments, the row direction conductive loops may have different sizes or areas in a planar direction. For example, the size of the first row-direction conductive loop 50a, the second row-direction conductive loop 50b, the third row-direction conductive loop 50c, and the fourth row-direction conductive loop 50d sequentially increases in the order. can do.

The first contact 135 may penetrate the interlayer insulating layer 120 through the first contact hole 121 to be formed substantially integrally with the first upper conductive line 132 .

A first input line 113 and a first output line 115 may be connected to any one of the row direction conductive loops. The current input from the first input line 113 may alternately cycle through the lower conductive layer 110 and the upper conductive layer 130 through the row direction conductive loops, and may be discharged through the first output line 115 . have. For example, the first input line 113 may be connected to the first row direction conductive loop 50a, and the first output line 115 may be connected to the fourth row direction conductive loop 50d.

In some embodiments, a third compensation pattern 150a in contact with the first input line 113 and/or the first output line 115 may be further formed. Accordingly, the current path of the signal input/output line may be expanded to improve the sensing sensitivity of the digitizer.

In some embodiments, the first input line 113 and the first output line 115 may be included in the lower conductive layer 110 . In some embodiments, the lower conductive layer 110 may further include a first internal connection line 114a. For example, adjacent row direction conductive loops may be connected by the first internal connection line 114a.

In example embodiments, the base layer 105 may include an active region and a peripheral region to be described later.

The active region may correspond to, for example, a sensing region in which a physical signal is substantially converted into a digital signal. The peripheral region may include, for example, outer portions of the first conductive coil 50 and the second conductive coil 70 to be described later and surround the active region.

According to some embodiments, the first compensation pattern 110a and the second compensation pattern 130a may be disposed on the active region of the base layer 105 . Hereinafter, embodiments in which the first compensation pattern 110a and the second compensation pattern 130a are disposed on the active region will be described with reference to FIGS. 1 to 4 .

According to some embodiments, the first compensation pattern 110a may be connected to the first conductive coil 50 disposed on the active region. In some embodiments, the first compensation pattern 110a may be in contact with or electrically connected to the first upper conductive line 132 included in each row direction conductive loop.

The first compensation pattern 110a may be in contact with or electrically connected to the first upper conductive line 132 through the first via hole 123 formed in the interlayer insulating layer 120 . The first compensation pattern 110a may be physically separated from the second lower conductive line 114 .

For example, the first compensation pattern 110a is disposed on the same layer or on the same level as the first lower conductive line 112 and the second lower conductive line 114 , and the first upper conductive line 132 is the first The via hole 123 may be filled. Accordingly, the first upper conductive line 132 and the first compensation pattern 110a may contact or be electrically connected to each other through the first via hole 123 .

1 , a plurality of first compensation patterns 110a may contact one first upper conductive line 132 . The first compensation patterns 110a may be arranged under one first upper conductive line 132 in the first direction. For example, each of the first compensation patterns 110a may have a shape of a straight bar extending in the first direction, a curved shape, or a bent pattern shape.

3 and 4 are schematic plan and cross-sectional views, respectively, of a digitizer according to exemplary embodiments. For example, FIG. 3 is a schematic plan view illustrating a second conductive coil included in a digitizer. 4 is a cross-sectional view taken along the line II-II' shown in FIG. 3 in the thickness direction.

3 and 4 , the digitizer may include a second conductive coil 70 . The second conductive coil 70 may be provided as the second direction (or column direction) conductive coil. In the second conductive coil 70 , the first lower conductive line 112 of the lower conductive layer 110 and the second upper conductive line 134 of the upper conductive layer 130 are combined by second contacts 137 . can be defined as

The first lower conductive line 112 and the second upper conductive line 134 may be provided together as a sensing line for an input pen through electromagnetic induction by forming a second conductive coil 70 together.

For example, the first lower conductive line 112 and the second upper conductive line 134 may be electrically connected to each other through the second contact 137 . A plurality of first lower conductive lines 112 and a plurality of second upper conductive lines 134 are electrically connected to each other through a plurality of second contacts 137 to form a single second conductive coil 70 . A plurality of conductive loops may be included. For example, four column direction conductive loops may be included in one second conductive coil 70 .

In one embodiment, the first column-direction conductive loop 70a, the second column-direction conductive loop 70b, the third column-direction conductive loop 70c and The fourth column-direction conductive loops 70d may be sequentially disposed.

In some embodiments, the column-direction conductive loops may have different sizes or areas in a planar direction. For example, the size of the first column-direction conductive loop 70a, the second column-direction conductive loop 70b, the third column-direction conductive loop 70c, and the fourth column-direction conductive loop 70d sequentially increases in order. can do.

The second contact 137 may penetrate the interlayer insulating layer 120 through the second contact hole 122 to be formed substantially integrally with the first lower conductive line 112 .

A second input line 117 and a second output line 119 may be connected to any one of the column-direction conductive loops. The current input from the second input line 117 may alternately circulate through the lower conductive layer 110 and the upper conductive layer 130 through the column direction conductive loops, and may be discharged through the second output line 119 . have. For example, the second input line 117 may be connected to the first column-direction conductive loop 70a, and the second output line 119 may be connected to the fourth column-direction conductive loop 70d.

In some embodiments, the second conductive coil may further include a fourth compensation pattern 170a in contact with the second input line 117 and/or the second output line 119 . Accordingly, the current path of the signal input/output line may be expanded to improve the sensing sensitivity of the digitizer.

In some embodiments, the second input line 117 and the second output line 119 may be included in the lower conductive layer 110 .

In some embodiments, the upper conductive layer 130 may further include an external connection line 134a. For example, the second input line 117 and the second output line 119 may be connected to the column-direction conductive loops through the second contact 137 by the external connection line 134a.

In an embodiment, the external connection line 134a may be connected to two different second conductive coils 70 . For example, the output line 119 connected to one of the second conductive coils 70 may be connected to the input line 117 of the other second conductive coil 70 through an external connection line 134a.

In some embodiments, the upper conductive layer 130 may further include a second internal connection line 134b. For example, adjacent column-direction conductive loops in the second conductive coil 70 may be connected to each other by the second internal connection line 134b.

In example embodiments, the second compensation pattern 130a may be connected to the second conductive coil 70 disposed on the active region of the base layer 105 . In some embodiments, the second compensation pattern 130a may be in contact with or electrically connected to the first lower conductive line 112 included in each column-direction conductive loop.

The second compensation pattern 130a may penetrate the interlayer insulating layer 120 through the second via hole 124 formed in the interlayer insulating layer 120 and may be in contact with the first lower conductive line 112 . The second compensation pattern 130a may be physically separated from the second upper conductive line 134 .

As shown in FIG. 3 , a plurality of second compensation patterns 130a may contact one first lower conductive line 112 . The second compensation patterns 130a may be arranged on one first lower conductive line 112 along the second direction.

For example, each of the second compensation patterns 130a may have a shape of a straight bar extending in the second direction, a curved shape, or a bent pattern shape.

According to some embodiments described above, the compensation patterns 110a and 130a may be connected to the conductive loops. Accordingly, it is possible to promote current flow and electromagnetic induction in the conductive coils 50 and 70, and generate a magnetic field of sufficient strength.

In addition, since the conductive loop is formed by connecting the lower conductive layer 110 and the upper conductive layer 130 through the contacts 135 and 137 , the number of loops of the conductive coil in a limited space is efficiently increased and electromagnetic induction efficiency is achieved. can improve

According to some embodiments, the first compensation pattern 110a and the second compensation pattern 130a may be disposed on the peripheral region of the base layer 105 . Hereinafter, embodiments in which the first compensation pattern 110a and the second compensation pattern 130a are disposed on the peripheral area will be described with reference to FIGS. 5 to 8 .

According to some embodiments, the outer portion of the first conductive coil 50 may be disposed on the peripheral region of the base layer 105 , and the first compensation pattern 110a may be connected thereto. In some embodiments, the first compensation pattern 110a may be in contact with the second lower conductive line 114 included in the row-direction conductive loop disposed at the outer portion of the first conductive coil 50 .

According to an embodiment, the first compensation pattern 110a may contact the second lower conductive line 114 included in the outermost conductive loop of the first conductive coil 50 . For example, the first compensation pattern 110a may contact the second lower conductive line 114 included in the fourth row direction conductive loop 50d. In an embodiment, the first compensation pattern 110a may also contact the second lower conductive line 114 included in the third row direction conductive loop 50c.

The first compensation pattern 110a may penetrate the interlayer insulating layer 120 through the third via hole 125 formed in the interlayer insulating layer 120 and may be in contact with the second lower conductive line 114 . The first compensation pattern 110a may be physically separated from the first upper conductive line 132 .

5 and 6 , a plurality of first compensation patterns 110a may contact one second lower conductive line 114 . The first compensation patterns 110a may be arranged on one second lower conductive line 114 in the second direction.

For example, each of the first compensation patterns 110a may have a straight bar, curved, or bent pattern shape extending in the second direction.

7 and 8 are schematic plan and cross-sectional views, respectively, of a digitizer according to exemplary embodiments. For example, FIG. 7 is a schematic plan view illustrating a second conductive coil included in a digitizer. 8 is a cross-sectional view taken along the line II-II' shown in FIG. 7 in the thickness direction.

According to some embodiments, the second compensation pattern 130a may be connected to the outer portion of the second conductive coil 70 . In some embodiments, the second compensation pattern 130a may be in contact with the second upper conductive line 134 included in the column-direction conductive loop disposed at the outer portion of the second conductive coil 70 .

According to an embodiment, the second compensation pattern 130a may contact the second upper conductive line 134 included in the outermost conductive loop of the second conductive coil 70 . For example, the second compensation pattern 130a may contact the second upper conductive line 134 included in the fourth column-direction conductive loop 70d. In an embodiment, the second compensation pattern 130a may also contact the second upper conductive line 134 included in the third column-direction conductive loop 70c.

The second compensation pattern 130a may be in contact with or electrically connected to the second upper conductive line 134 through the fourth via hole 126 formed in the interlayer insulating layer 120 . The second compensation pattern 130a may be physically separated from the first lower conductive line 112 .

For example, the second compensation pattern 130a may be disposed on the same layer or on the same level as the first lower conductive line 112 , and the second upper conductive line 134 may fill the fourth via hole 126 . . Accordingly, the second upper conductive line 134 and the second compensation pattern 130a may contact or be electrically connected to each other through the fourth via hole 126 .

7 , a plurality of second compensation patterns 130a may contact one second upper conductive line 134 . The second compensation patterns 130a may be arranged under one second upper conductive line 134 in the first direction. For example, each of the second compensation patterns 130a may have a shape of a straight bar extending in the first direction, a curved shape, or a bent pattern shape.

According to some embodiments described above, the compensation patterns 110a and 130a may be connected to the conductive loops of the outer portion. Accordingly, a current path in the conductive loops of the outer portion having a relatively long loop length may be expanded. In addition, as the compensation patterns 110a and 130a are connected to the second lower conductive line 114 and the second upper conductive line 134 having relatively narrow line widths, the second lower conductive line 114 and the second upper conductive line 134 are connected to each other. An increase in resistance at line 134 can be prevented.

Although it is illustrated that four conductive loops are included in one conductive coil in FIGS. 1 to 8 , the number of conductive loops in the conductive coil may be adjusted in consideration of the size and resolution of the image display device.

In example embodiments, both the lower conductive layer 110 and the upper conductive layer 130 may be disposed on the upper surface of the base layer 105 . Accordingly, when bending or folding through the base layer 105 , the stress direction for the lower conductive layer 110 and the upper conductive layer 130 may be adjusted in the same manner.

For example, when tensile stress is applied to the bottom surface of the base layer 105 , compressive stress may be applied to the lower conductive layer 110 and the upper conductive layer 130 . Accordingly, a neutral plane in which stress is canceled may be easily generated to be adjacent to the conductive layers 110 and 130 . Accordingly, stress applied to the conductive layers 110 and 130 may be relieved, thereby reducing or preventing electrode cracking due to bending.

According to some embodiments, the thickness of the lower conductive layer 110 may be greater than the thickness of the upper conductive layer 130 . For example, the thickness of the first lower conductive line 112 may be greater than the thickness of the first upper conductive line 132 .

As will be described later with reference to FIGS. 9 to 11 , the first upper conductive line 132 may extend in a first direction (eg, a row direction or a width direction) and intersect a bending axis. For example, the first upper conductive line 132 may be perpendicular to the bending axis. The first lower conductive line 112 may extend in a second direction (a column direction or a length direction) and may be substantially parallel to the bending axis.

According to example embodiments, by reducing the thickness of the first upper conductive line 132 to which bending stress is easily transmitted as it intersects the bending axis, prevention of cracks in the conductive line may be reduced or suppressed. Since the first lower conductive line 112, which is parallel to the bending axis and is relatively free from bending stress, is formed to have a large thickness, a sufficient electromagnetic induction effect may be realized by expanding a current path through the conductive coil.

In an embodiment, the second lower conductive line 114 may also have a greater thickness than the second upper conductive line 134 .

In some embodiments, the thickness of the lower conductive layer 110 (the first lower conductive line or the second lower conductive line) may be about 5 to 20 μm, preferably 10 to 20 μm. The thickness of the upper conductive layer 130 (the first upper conductive line or the second upper conductive line) may be 6 μm or less, preferably about 1 to 6 μm.

According to exemplary embodiments, by combining the relatively thick first compensation pattern 110a with the relatively small upper conductive layer 130 , the current path is expanded to increase the current in the upper conductive layer 130 . flow can be reinforced.

9 is a schematic plan view illustrating a digitizer according to exemplary embodiments. Specifically, FIG. 9 schematically illustrates embodiments in which the first compensation pattern 110a and the second compensation pattern 130a described above with reference to FIGS. 1 to 4 are disposed on the active area AA of the base layer 105 . can For convenience of description, the detailed structure/configuration of the conductive coil including the above-described first compensation pattern 110a and second compensation pattern 130a is omitted from FIG. 9 .

Referring to FIG. 9 , a plurality of first conductive coils 50 and second conductive coils 70 may be arranged on the upper surface of the base layer 105 .

The digitizer 100 or the base layer 105 may include an active area AA and a peripheral area PA. The peripheral area PA may include an outer portion of the base layer 105 , and the active area AA may be surrounded by the peripheral area PA.

The active area AA may substantially correspond to a sensing area in which a physical signal transmitted to the input pen is converted into a digital signal. For example, outer portions of each of the first conductive coil 50 and the second conductive coil 70 may not be disposed on the active area AA.

The peripheral area PA is provided as a margin area of the base layer 105 , and for example, distal ends of the input lines 113 and 117 and the output lines 115 and 119 are disposed on the peripheral area PA. It may be connected to an integrated circuit chip.

In some embodiments, ends of the conductive coils 50 and 70 may be disposed on the peripheral area PA. For example, the outer portions of the conductive coils 50 and 70 may be disposed on the peripheral area PA.

For example, both ends of the first conductive coil 50 in the row direction (or the first direction) and both ends of the second conductive coil 70 in the column direction (or the second direction) are in the peripheral area PA may be placed on the

The first conductive coil 50 may extend in the first direction or the row direction. The plurality of first conductive coils 50 may be arranged along the second direction or the column direction.

For example, n first conductive coils 50 - 1 to 50 - n may be sequentially arranged along the second direction (n is a natural number).

The second conductive coil 70 may extend in the second direction or the column direction. The plurality of second conductive coils 70 may be arranged along the first direction or the row direction.

For example, m second conductive coils 70 - 1 to 70 - m may be sequentially arranged in the first direction.

A bending area BA may be included in the central portion of the base layer 105 . A bending axis 80 extending in the second direction may be positioned in the bending area BA. The digitizer 100 according to example embodiments may be bent or folded around the bending axis 80 .

As described above, the thickness of the first upper conductive line 132 or the second upper conductive line 134 crossing the bending axis 80 may be relatively small. Accordingly, it is possible to prevent cracking of the upper conductive layer 130 to which bending stress is directly applied and to increase flexibility.

The thickness of the first lower conductive line 112 and the second lower conductive line 114 parallel to the bending axis 80 and having relatively small bending stress is increased to reduce resistance and improve the efficiency of generating a magnetic field through the conductive coil. can do it

As described above, in some embodiments, the compensation patterns 110a and 130a are disposed in the active area AA of the digitizer 100 to the conductive lines 112 and 132 of the conductive coils 50 and 70 . can be connected with Accordingly, current flow in the active area AA may be promoted by the compensation patterns 110a and 130a to promote electromagnetic induction and magnetic field generation through the conductive coils 50 and 70 .

10 is a schematic partially enlarged plan view illustrating an active area of a digitizer according to example embodiments.

As described with reference to FIG. 9 , the conductive coils 50 and 70 may be arranged to cross each other in a planar direction. Accordingly, the first upper conductive lines 132 included in the first conductive coil 50 and the first lower conductive lines 112 included in the second conductive coil 70 cross each other in a planar direction. A region C may be formed.

In example embodiments, the above-described compensation patterns 110a and 130a may be connected to portions other than intersections included in the intersection region C of the conductive lines 112 and 132 .

In an embodiment, the first compensation patterns 110a may be in contact with or connected to portions of the first upper conductive lines 132 excluding the crossing portions (indicated by E1 in FIG. 10 ).

In an embodiment, the second compensation patterns 130a may be connected to portions of the first lower conductive lines 112 excluding the crossing portions (indicated by E2 in FIG. 10 ).

As described above, the compensation patterns 110a and 130a may not be formed in the intersection region C. As illustrated in FIG. Accordingly, it is possible to reduce resistance and promote electromagnetic induction by utilizing an extra space without changing the arrangement structure or arrangement density of the conductive coils 50 and 70 .

11 is a schematic plan view illustrating a digitizer according to exemplary embodiments. Specifically, FIG. 11 may show embodiments in which the first compensation pattern 110a and the second compensation pattern 130a are disposed on the peripheral area PA of the base layer 105 . For convenience of description, the detailed structure/configuration of the conductive coil is omitted in FIG. 11 .

As described above, in some embodiments, the first compensation patterns 110a are disposed on the outer portion of the first conductive coil 50 , and the second compensation pattern is disposed on the outer portion of the second conductive coil 70 . Fields 130a may be disposed.

According to example embodiments, the first compensation patterns 110a are disposed at the end of the first conductive coil 50 in the row direction, and the second compensation patterns 130a include the second conductive coil 70 . ) in the column direction. Accordingly, while the compensation patterns 110a and 130a are disposed on the periphery of the digitizer or the base layer 105 , it is possible to promote current flow and promote electromagnetic induction and magnetic field generation through the conductive coils 50 and 70 . have

12 is a schematic cross-sectional view illustrating an image display apparatus according to example embodiments.

Referring to FIG. 12 , the image display apparatus may include a display panel 360 , a touch sensor 200 , and the digitizer 100 according to the above-described exemplary embodiments.

The digitizer 100 may be disposed under the display panel 360 . For example, the digitizer 100 may be disposed between the display panel 360 and the rear cover 380 .

The digitizer 100 includes relatively thick conductive lines for efficiency in generating a magnetic field using electromagnetic induction, and may include a plurality of conductive coils. Accordingly, the digitizer 100 may be disposed under the display panel 360 so as not to be recognized by a user of the image display apparatus.

As described above, by using the structure of the digitizer 100 according to the exemplary embodiments to sufficiently increase the magnetic field strength, for example, energy transfer to the input pen in contact with the window substrate 230 of the image display device is efficiently transmitted. can be promoted to

The display panel 360 may include a pixel electrode 310 , a pixel defining layer 320 , a display layer 330 , a counter electrode 340 , and an encapsulation layer 350 disposed on the panel substrate 300 . can

A pixel circuit including a thin film transistor (TFT) may be formed on the panel substrate 300 , and an insulating layer covering the pixel circuit may be formed. The pixel electrode 310 may be electrically connected to, for example, a drain electrode of a TFT on the insulating layer.

The pixel defining layer 320 may be formed on the insulating layer to expose the pixel electrode 310 to define a pixel area. A display layer 330 is formed on the pixel electrode 310 , and the display layer 330 may include, for example, a liquid crystal layer or an organic light emitting layer.

A counter electrode 340 may be disposed on the pixel defining layer 320 and the display layer 330 . The opposing electrode 340 may be provided as a common electrode or a cathode of the image display device, for example. An encapsulation layer 350 for protecting the display panel 360 may be stacked on the opposite electrode 340 .

The touch sensor 200 may be stacked on the display panel 360 and disposed toward the window substrate 230 . The touch sensor 200 may generate capacitance by a user's touch input through the surface of the window substrate 230 . Accordingly, the touch sensor 200 may include a sensing electrode or sensing channels having a thickness smaller than that of the conductive layer included in the digitizer 100 so as not to be recognized by the user. For example, the thickness of the sensing electrode or the sensing channel may be less than 1 μm or less than 0.5 μm.

Each of the sensing electrodes or the sensing channels may be independently disposed in one single layer to interact with an adjacent sensing electrode or sensing channel to generate capacitance.

The touch sensor 200 may be coupled to the display panel 360 through the adhesive layer 260 .

The window substrate 230 includes, for example, a hard coating film and thin glass, and in an embodiment, a light blocking pattern 235 may be formed on a periphery of one surface of the window substrate 230 . The light blocking pattern 235 may include, for example, a color printing pattern. A bezel part or a non-display area of the image display device may be defined by the light blocking pattern 235 .

A polarization layer 210 may be disposed between the window substrate 230 and the touch sensor 200 . The polarizing layer 210 may include a coated polarizer or a polarizing plate.

The polarization layer 210 may be directly bonded to the one surface of the window substrate 230 or may be attached through the first adhesive layer 220 . The touch sensor 200 may be coupled to the polarization layer 210 through the second adhesive layer 225 .

As shown in FIG. 12 , the window substrate 230 , the polarization layer 210 , and the touch sensor 200 may be disposed in the order from the user's viewing side. In this case, since the sensing electrodes of the touch sensor 200 are disposed under the polarization layer 210 , it is possible to more effectively prevent the sensing electrode from being viewed.

In an embodiment, the touch sensor 200 may be directly transferred onto the window substrate 230 or the polarization layer 210 . In an embodiment, the window substrate 230 , the touch sensor 200 , and the polarization layer 210 may be disposed in the order from the user's viewing side.

Claims (20)

1. a substrate layer comprising an active region and a peripheral region;

   a first conductive coil disposed on the base layer and extending in a row direction;

   a second conductive coil disposed on the base layer and extending in a column direction; and

   and a compensation pattern connected to the first conductive coil or the second conductive coil.
2. The digitizer of claim 1 , wherein the compensation pattern includes a first compensation pattern connected to the first conductive coil and a second compensation pattern connected to the second conductive coil.
3. The method according to claim 2, wherein the first conductive coil comprises a plurality of row direction conductive loops,

   and the second conductive coil includes a plurality of column directional conductive loops.
4. 4. The digitizer of claim 3, wherein the first compensation pattern is coupled to each of the row directional conductive loops, and the second compensation pattern is coupled to each of the column directional conductive loops.
5. The method according to claim 2, wherein the first conductive coil includes first upper conductive lines extending in the row direction, second lower conductive lines extending in the column direction, and the first upper conductive lines and the second lower portion. first contacts electrically connecting the conductive lines;

   The second conductive coil electrically connects the first lower conductive lines extending in the column direction, the second upper conductive lines extending in the row direction, and the first lower conductive lines and the second upper conductive lines. A digitizer comprising second contacts for coupling.
6. The method according to claim 5, further comprising an interlayer insulating layer formed on the base layer,

   The first lower conductive lines and the second lower conductive lines are disposed on the upper surface of the base layer,

   The interlayer insulating layer is formed on the upper surface of the base layer to cover the first lower conductive lines and the second lower conductive lines,

   and the first upper conductive lines and the second upper conductive lines are disposed on a top surface of the interlayer insulating layer.
7. The method according to claim 6, wherein the first compensation pattern and the second compensation pattern is disposed on the active region of the base layer,

   the first compensation pattern is connected to the first upper conductive lines included in the first conductive coil;

   The second compensation pattern is in contact with the first lower conductive lines included in the second conductive coil.
8. The method according to claim 7, wherein the first compensation pattern is disposed on the same layer as the first lower conductive lines and the second lower conductive lines,

   and the second compensation pattern passes through the interlayer insulating layer and is in contact with an upper surface of the first lower conductive line.
9. The digitizer of claim 8 , wherein the insulating interlayer includes a first via hole filled by the first upper conductive line and a second via hole in which the second compensation pattern is formed.
10. The method according to claim 6, wherein the first compensation pattern and the second compensation pattern is disposed on the peripheral region of the base layer,

    the first compensation pattern is in contact with a second lower conductive line disposed at an outer portion of the second lower conductive lines included in the first conductive coil;

    The second compensation pattern is in contact with a second upper conductive line disposed at an outer portion of the second upper conductive lines included in the second conductive coil.
11. The method according to claim 10, wherein the first compensation pattern penetrates the interlayer insulating layer and contacts an upper surface of the second lower conductive line,

    The second compensation pattern is disposed on the same layer as the first lower conductive lines and the second lower conductive lines and is connected to the second upper conductive line.
12. The digitizer of claim 11 , wherein the interlayer insulating layer includes a third via hole in which the first compensation pattern is formed, and a fourth via hole filled by the second upper conductive line.
13. The digitizer of claim 6 , wherein a thickness of the first lower conductive lines is greater than a thickness of the first upper conductive lines.
14. The digitizer of claim 13 , wherein the base layer includes a bending region in the central portion.
15. The digitizer of claim 14 , wherein a bending axis of the bending region intersects the first upper conductive lines and is parallel to the first lower conductive lines.
16. The digitizer according to claim 1, wherein a plurality of the first conductive coils are arranged along the column direction, and a plurality of the second conductive coils are arranged along the row direction.
17. The digitizer of claim 16 , wherein the compensation pattern is disposed in a region of the active region except for an intersection region where the first conductive coils and the second conductive coils overlap.
18. The digitizer of claim 16 , wherein a plurality of the compensation patterns are arranged along a periphery of the base layer.
19. display panel; and

    An image display device comprising the digitizer according to claim 1 disposed below the display panel.
20. The method according to claim 19, further comprising a touch sensor disposed on the rear cover, the window substrate, and the display panel,

    The touch sensor is disposed between the window substrate and the display panel, and the digitizer is disposed between the display panel and the rear cover.

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