WO2022160645A1 - 机械臂及其组件、测试系统及方法、存储介质及电子设备 - Google Patents

机械臂及其组件、测试系统及方法、存储介质及电子设备 Download PDF

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Publication number
WO2022160645A1
WO2022160645A1 PCT/CN2021/110981 CN2021110981W WO2022160645A1 WO 2022160645 A1 WO2022160645 A1 WO 2022160645A1 CN 2021110981 W CN2021110981 W CN 2021110981W WO 2022160645 A1 WO2022160645 A1 WO 2022160645A1
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WIPO (PCT)
Prior art keywords
operating mechanism
base
robotic arm
adapter
housing part
Prior art date
Application number
PCT/CN2021/110981
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English (en)
French (fr)
Inventor
余玉
Original Assignee
长鑫存储技术有限公司
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Publication date
Application filed by 长鑫存储技术有限公司 filed Critical 长鑫存储技术有限公司
Priority to US17/651,887 priority Critical patent/US12007433B2/en
Publication of WO2022160645A1 publication Critical patent/WO2022160645A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
    • B07C2501/0063—Using robots

Definitions

  • Embodiments of the present application relate to the field of semiconductor technology, and in particular, to a robotic arm and components thereof, a testing system and method, a storage medium, and an electronic device.
  • Semiconductor structures require extensive testing in order to reject defective products. In the process of testing the semiconductor structure, the semiconductor structure needs to be put into the pedestal, and taken out from the pedestal after the test is completed. In the related art, manual participation is often used, which is not only inefficient, but also has a high labor cost.
  • Embodiments of the present application provide a robotic arm and components thereof, a testing system and method, a storage medium and an electronic device to assist in the testing of semiconductor structures.
  • a robotic arm for semiconductor structure testing including a body and an operating arm, and the operating arm includes:
  • connecting piece the connecting piece is connected with the body
  • the first adapter part is connected with the connecting piece, and the first adapter part is used for installing the first operating mechanism for opening and closing the base;
  • the second adapter part is connected with the connector, and the second adapter part is used to install a second operating mechanism for grabbing and releasing the semiconductor device;
  • the second adapter portion can drive the second operating mechanism to put the semiconductor device into the pedestal, or take out the semiconductor device in the pedestal.
  • a robotic arm assembly including the aforementioned robotic arm, a first operating mechanism, and a second operating mechanism.
  • a semiconductor structure testing system including the above-mentioned robotic arm assembly and a base.
  • a method for testing a semiconductor structure includes:
  • a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, implements the above-mentioned method for testing a semiconductor structure.
  • an electronic device including:
  • the processor is configured to execute the above-mentioned method of testing a semiconductor structure by executing the executable instructions.
  • the robotic arm of the embodiment of the present application can install the first operating mechanism and the second operating mechanism respectively through the first adapter portion and the second adapter portion on the connector.
  • the first operating mechanism can open and close the base, and the second operating mechanism can grasp and release the semiconductor device.
  • the base is opened by the first operating mechanism, the second operating mechanism puts the captured semiconductor device into the base, and then the base is closed by the first operating mechanism, and the first operating mechanism is opened after the semiconductor device is tested
  • the base, the second operating mechanism takes out the semiconductor device in the base, so as to complete a test of the semiconductor device. closed to improve test efficiency.
  • FIG. 1 is a schematic structural diagram of a robotic arm according to an exemplary embodiment
  • FIG. 2 is a schematic structural diagram of a state of a robotic arm according to an exemplary embodiment
  • FIG. 3 is a schematic diagram of another state structure of a robotic arm according to an exemplary embodiment
  • FIG. 4 is a schematic structural diagram of a semiconductor structure testing system according to an exemplary embodiment
  • FIG. 5 is a schematic flowchart of a method for testing a semiconductor structure according to an exemplary embodiment
  • FIG. 6 schematically shows a schematic diagram of a computer-readable storage medium in an exemplary embodiment of the present application
  • FIG. 7 schematically shows a schematic diagram of an electronic device in an exemplary embodiment of the present application.
  • Base 2. First operating mechanism; 3. Second operating mechanism; 4. Test platform; 5. Indicator light; 6. Image acquisition unit; 7. Server;
  • Main body 11. Supporting part; 12. Moving part; 13. First housing part; 14. Second housing part; 20. Operating arm; 21. Connecting part; 22. First adapter part; 24, the rotating part; 25, the third housing part; 26, the fourth housing part;
  • 300 program product; 600, electronic equipment; 610, processing unit; 620, storage unit; 6201, random access storage unit (RAM); 6202, cache storage unit; 6203, read only storage unit (ROM); 6204, program/utility; 6205, program module; 630, bus; 640, display unit; 650, input/output (I/O) interface; 660, network adapter; 700, external device.
  • RAM random access storage unit
  • ROM read only storage unit
  • program/utility 6205
  • 6205 program module
  • 630 bus
  • 640 display unit
  • 650 input/output (I/O) interface
  • 660 network adapter
  • 700 external device.
  • the robot arm includes a body 10 and an operation arm 20 .
  • the operation arm 20 includes a connector 21 , and the connector 21 is connected to a
  • the main body 10 is connected; the first adapter part 22, the first adapter part 22 is connected with the connector 21, and the first adapter part 22 is used to install the first operating mechanism 2 for opening and closing the base 1;
  • the connecting part 23, the second connecting part 23 is connected with the connecting piece 21, and the second connecting part 23 is used to install the second operating mechanism 3 for grabbing and releasing the semiconductor device;
  • the second adapter 23 can drive the second operating mechanism 3 to put the semiconductor device in the base 1 or take out the semiconductor device in the base 1 .
  • the robot arm can install the first operating mechanism 2 and the second operating mechanism 3 respectively through the first adapter portion 22 and the second adapter portion 23 on the connector 21 .
  • the first operating mechanism 2 can open and close the base 1, and the second operating mechanism 3 can grasp and release the semiconductor device.
  • the base 1 is opened by the first operating mechanism 2, the second operating mechanism 3 puts the captured semiconductor device into the base 1, and then the base 1 is closed by the first operating mechanism 2, and after the semiconductor device is tested After that, the first operating mechanism 2 opens the base 1, and the second operating mechanism 3 takes out the semiconductor device in the base 1, thereby completing a test of the semiconductor device.
  • the robot arm realizes the automatic grasping of the semiconductor device. and release, as well as the automatic opening and closing of the base 1, so as to improve the test efficiency.
  • the base 1 can be different types of Sockets, that is, the first operating mechanism 2 for opening and closing the base 1 can also be adapted to it.
  • the first operating mechanism 2 can be compatible with multiple sockets at the same time, which is not limited here.
  • the first operating mechanism 2 may be a clamping jaw mechanism, that is, the connection with the base 1 is realized by opening and closing the clamping jaws, thereby opening and closing the base 1 .
  • the first operating mechanism 2 may also be a suction mechanism, that is, the suction base 1 is used to open and close it.
  • the specific structure of the first operating mechanism 2 is not limited here, and can be adjusted adaptively according to actual needs.
  • the second operating mechanism 3 may be a clamping jaw mechanism, that is, grasping and grasping the semiconductor device is realized by opening and closing the clamping jaws.
  • the second operating mechanism 3 may also be a suction mechanism, for example, a suction pen holder.
  • the specific structure of the second operating mechanism 3 is not limited here, and can be adjusted adaptively according to actual needs.
  • the body 10 includes: a support member 11 for suspending the robotic arm in the air; a moving member 12 , the moving member 12 is arranged on the support member 11 and is opposite to the support member 12
  • the connecting member 11 is movably arranged; wherein, the connecting member 21 is connected with the moving member 12, and the connecting member 21 can move with the moving member 12, so that the first operating mechanism 2 or the second operating mechanism 3 can complete the corresponding operation.
  • the moving member 12 is connected with the connecting member 21, so that when the position of the moving member 12 changes, the connecting member 21 will drive the first adapter portion 22 and the second adapter portion 23 to move, so that the first operating mechanism 2 and the second operating mechanism 3 complete corresponding operations.
  • first operating mechanism 2 and the second operating mechanism 3 and the base 1 can be adjusted, so that the first operating mechanism 2 and the second operating mechanism 3 respectively complete corresponding operations.
  • the moving member 12 is vertically movable relative to the supporting member 11 to drive the connecting member 21 to move in a direction close to or away from the base 1 . That is, when the first operating mechanism 2 needs to open the base 1, the moving member 12 needs to be moved downward. At this time, the first operating mechanism 2 is close to the base 1. After the first operating mechanism 2 is connected with the base 1, it moves The member 12 moves upward, and the first operating mechanism 2 moves away from the base 1 at this time, thereby opening the base 1 .
  • the second operating mechanism 3 needs to grab a semiconductor device at a certain station, the moving member 12 needs to move downward. At this time, the second operating mechanism 3 is close to the semiconductor device, and the second operating mechanism 3 grabs the semiconductor device.
  • the moving member 12 is moved upward, and after the second operating mechanism 3 is opposite to the opened base 1, the moving member 12 is moved downward. At this time, the second operating mechanism 3 is close to the base 1, and in the second operation After the mechanism 3 moves in place, the semiconductor device can be put into the base 1. At this time, the first operating mechanism 2 is moved to close the base 1. After the test is completed, the base 1 is repeatedly opened, and the second operating mechanism 3 takes out the semiconductor device, and The cycle is performed for the detection of the next semiconductor device.
  • the moving member 12 is rotatably disposed relative to the supporting member 11 , so that the connecting member 21 can rotate with the moving member 12 .
  • the first operating mechanism 2 or the second operating mechanism 3 can be disposed opposite to the base 1 , so that the first operating mechanism 2 or the second operating mechanism 3 can complete corresponding actions.
  • the first operating mechanism 2 and the second operating mechanism 3 can be moved to another workstation position, that is, disposed opposite to the other base 1, so as to complete the operation at the other position. Semiconductor device inspection.
  • a plurality of operating arms 20 are disposed around the circumferential direction of the body 10 , that is, the plurality of operating arms 20 may correspond to a plurality of bases 1 respectively, and during the rotation of the moving member 12 , the plurality of operating arms 20 may respectively Corresponding to the next base 1 to perform the next test, this operation can ensure that a plurality of operating arms 20 are in the running process at the same time, and there will be no idling at a certain position.
  • the moving member 12 is arranged to be movable in the horizontal direction relative to the supporting member 11 , that is, the moving member 12 can drive the connecting member 21 to move left and right, so as to adjust the position or move to the next base 1 .
  • a plurality of operating arms 20 may be disposed on the body 10 at intervals along a linear direction.
  • a cylinder or an oil cylinder may be provided on the support member 11, and the piston rod is connected to the movable member 12, so that the extension of the piston rod can
  • the up and down movement of the moving part 12 can be realized by going out and retracting.
  • the moving member 12 can also be moved up and down by the motor driving the gear and the rack, or the moving member 12 can be moved up and down by the motor driving the screw assembly, which is not limited here.
  • a motor can be provided on the support member 11, and the motor can drive the movable member 12 to rotate, which is not limited here.
  • the moving member 12 is arranged so as to be movable in the horizontal direction relative to the supporting member 11 , and reference may be made to the driving manner of the moving member 12 moving in the vertical direction relative to the supporting member 11 , which will not be repeated here.
  • the body 10 further includes: a first housing part 13 , the first housing part 13 is connected with the supporting part 11 , and the moving part 12 is movably arranged on the first housing part 13 , so that the moving part 12 is arranged on the supporting part 11 through the first housing part 13 .
  • the first housing part 13 is a protective structure of the main body 10 , and an accommodating space is formed inside thereof, so as to realize the protection of the moving part 12 .
  • the body 10 further includes: a second housing part 14 , the second housing part 14 is connected with the first housing part 13 , and the connecting part 21 is movably arranged in the second housing part 14 , The first adapter part 22 and the second adapter part 23 can move with the connecting piece 21 , that is, the second housing part 14 can protect the connecting piece 21 .
  • the first housing part 13 and the second housing part 14 may be an integral structure, and the first housing part 13 and the second housing part 14 form a complete housing part.
  • the second housing member 14 can protect the connecting member 21 without affecting the rotation of the connecting member 21 .
  • the second housing member 14 may be an annular member.
  • each second housing part 14 corresponds to an independent connecting part 21 .
  • the connecting member 21 is movably disposed relative to the moving member 12 , that is, the connecting member 21 itself can be adjusted in position, so as to adapt to the positional relationship between the connecting member 21 and the base 1 .
  • the connecting member 21 is movable in a horizontal direction relative to the moving member 12 .
  • the first housing member 13 is movably disposed relative to the support member 11, that is, the first housing member 13 can drive the connecting member 21 to move relative to the moving member 12, so that the connecting member 21 moves to different bases where seat 1 is located.
  • the support 11 can drive the robotic arm to move in the air, that is, the support 11 can be similar to a crane, so that the entire robotic arm moves.
  • the support 11 is capable of at least one of rotational and linear motion.
  • the operating arm 20 further includes: a rotating member 24 , the rotating member 24 is connected with the connecting member 21 , and both the first adapter portion 22 and the second adapter portion 23 are provided On the rotating member 24 , the first adapter portion 22 and the second adapter portion 23 are both connected to the connecting member 21 through the rotating member 24 .
  • the arrangement of the rotating member 24 can make it easier to adjust the positions of the first adapter portion 22 and the second adapter portion 23 , so as to adapt to the positional relationship with the base 1 .
  • rotating member 24 can be directly connected to the connecting member 21 .
  • the rotating member 24 can also be indirectly connected to the connecting member 21 .
  • At least part of the rotating member 24 is rotatably disposed relative to the connecting member 21, so that both the first adapter portion 22 and the second adapter portion 23 are rotatably disposed with the rotating member 24;
  • the member 24 is used to make one of the first operating mechanism 2 and the second operating mechanism 3 opposite to the base 1 .
  • the first adapter portion 22 is used for connecting the first operating mechanism 2
  • the second adapter portion 23 is used for connecting the second operating mechanism 3
  • the first adapter portion 23 is used for connecting the second operating mechanism 3 . 22 and the installation plane of the second adapter 23 are on the same horizontal plane, that is, the rotating member 24 can be understood as a ring structure.
  • the rotation of the rotating member 24 makes the first adapter 22 and the second adapter
  • the parts 23 can correspond to the base 1 respectively, the rotation center point of the similar rotating member 24 is located above the base 1, and the first adapter part 22 and the second adapter part 23 are respectively connected in the circumferential direction of the center point, Therefore, when the rotating member 24 is rotated, the first adapter portion 22 and the second adapter portion 23 can be located directly above the base 1 respectively, so as to perform corresponding operations.
  • the rotating part 24 may include a fixed part and a rotating part, the fixed part is connected with the connecting part 21, the rotating part is located on the fixed part, and the first adapter part 22 and the second adapter part 23 are connected to the rotating part so that when the rotating part rotates relative to the fixed part, the position of the first adapting part 22 and the second adapting part 23 is adjusted.
  • the operating arm 20 further includes: a third housing part 25 , the third housing part 25 is connected with the rotating part 24 , and the first adapter part 22 is located in the third housing part 25 . Inside the housing part 25 , the third housing part 25 protects the first adapter part 22 .
  • the operating arm 20 further includes: a fourth housing part 26 , the fourth housing part 26 is connected with the rotating part 24 , and the second adapter part 23 is located in the fourth housing part 26 . Inside the housing part 26 , the fourth housing part 26 protects the second adapter part 23 .
  • An embodiment of the present application further provides a robotic arm assembly. Please refer to FIGS. 1 to 4 .
  • the robotic arm assembly includes the aforementioned robotic arm, a first operating mechanism 2 and a second operating mechanism 3 .
  • the robotic arm assembly of an embodiment of the present application can open and close the base 1 through the first operating mechanism 2, and the second operating mechanism 3 can grasp and release the semiconductor device. Grab and release, and automatic opening and closing of base 1 to improve test efficiency.
  • the first operating mechanism 2 is detachably disposed on the first adapter portion 22 of the robotic arm, that is, the first operating mechanism 2 can be replaced at any time.
  • the first operating mechanism 2 is snap-fitted, bonded or connected with the first adapter portion 22 through fasteners.
  • the first operating mechanism 2 is detachably disposed on the first adapter portion 22 of the robotic arm, for example, the first operating mechanism 2 can be directly welded to the first adapter portion 22 .
  • the second operating mechanism 3 is detachably disposed on the second adapter portion 23 of the robotic arm, that is, the second operating mechanism 3 can be replaced at any time.
  • the second operating mechanism 3 and the second adapter portion 23 are snap-connected, bonded or connected by fasteners.
  • the second operating mechanism 3 is non-detachably disposed on the second adapter portion 23 of the robotic arm, for example, the second operating mechanism 3 is welded with the second adapter portion 23 .
  • An embodiment of the present application further provides a semiconductor structure testing system, please refer to FIG. 4 , which includes the aforementioned robotic arm assembly and the base 1 .
  • the robotic arm assembly due to the setting of the robotic arm assembly, the robotic arm assembly realizes the automatic grasping and releasing of the semiconductor device and the automatic opening and closing of the base 1 during the whole testing process, thus completing the Automate testing to improve testing efficiency.
  • the semiconductor structure testing system further includes: a testing platform 4 , the base 1 is disposed on the testing platform 4 , and the robotic arm assembly is located above the testing platform 4 .
  • the test platform 4 can be used to run the test program, so as to realize the test of the semiconductor device.
  • test platform 4 when used for high and low temperature testing, a small temperature box (such as a heating mantle) is installed on the test platform 4, or all equipment or all test platforms are in the same larger temperature box, and run through the test platform The test program implements the test.
  • the test platform 4 is not limited here, and a test platform commonly used in the related art can be used to test the semiconductor device.
  • the semiconductor structure testing system further includes: an indicator light 5 , the indicator light 5 is arranged on the test platform 4 , and the indicator light 5 indicates different results through different display modes.
  • the indicator light 5 can display different colors to correspond to different test results or record information.
  • a plurality of indicator lights 5 may be provided, and the plurality of indicator lights 5 may be divided into multiple groups, and each group of indicator lights 5 displays different test results or recorded information.
  • the indicator light 5 can indicate:
  • the Socket ie the base
  • the particles semiconductor devices
  • the Socket is open, but the particles are not filled
  • test fails, there can be multiple states, the connection with the server 7 fails; the test system crashes, etc.;
  • a set of indicator lights 5 can be specially provided for the display of the number of tests.
  • the semiconductor structure testing system further includes: an image acquisition part 6 , and the acquisition head of the image acquisition part 6 can be disposed opposite to at least one of the indicator light 5 and the base 1 .
  • the image acquisition part 6 can be used to read the state indicated by the indicator light 5 , and also used to scan the information of the semiconductor device and the corresponding test platform 4 .
  • the image acquisition part 6 may be a camera.
  • the semiconductor structure testing system further includes: a server 7 , the server 7 is signally connected to the test platform 4 , and the server 7 is signally connected to the robotic arm.
  • the server 7 is used to input the test strategy (such as replacing/configuring the test program, setting the number of retests, etc.), obtaining the test information (such as the test log, test case result, error information, etc.) from the test platform 4, and instructing the test platform to switch or switch according to the configuration.
  • Configure all the incubators obtain the test status, semiconductor device and test platform information from the image acquisition unit 6; instruct the robot arm to move, such as opening the socket, replacing the new semiconductor device to be tested, and moving the connector 21 (such as changing the test platform and resetting the test platform). test, so that a semiconductor device that has been tested can be re-tested on another test platform), close the socket, etc.
  • An embodiment of the present application also provides a method for testing a semiconductor structure. Please refer to FIG. 5 .
  • the method for testing a semiconductor structure includes:
  • the semiconductor structure testing method controls the robotic arm to drive the first operating mechanism 2 and the second operating mechanism 3 to move, thereby realizing automatic grasping and releasing of the semiconductor device, and automatic opening and closing of the base 1 . closed, thereby improving the test efficiency of the test platform 4 .
  • the method for testing a semiconductor structure further includes: controlling the rotation of the rotating member 24 connected to the connecting member 21 to rotate the first adapter portion 22 and the second adapter portion 23 connected to the rotating member 24 , one of the first operating mechanism 2 and the second operating mechanism 3 is disposed opposite to the base 1 , that is, the first operating mechanism 2 and the second operating mechanism 3 are respectively operated correspondingly.
  • the method for testing a semiconductor structure further includes: controlling the movement of the body 10 of the robotic arm, so that each connector 21 on the body 10 moves accordingly, so that the semiconductor device that has been tested can be re-tested in another test. retest on the platform.
  • a method of testing a semiconductor structure employs the semiconductor structure testing system described above.
  • Embodiments of the present application further provide a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, implements the above-mentioned method for testing a semiconductor structure.
  • various aspects of the embodiments of the present application may also be implemented in the form of a program product, which includes program code, and when the program product runs on a terminal device, the program code is used to make The terminal device performs the steps according to various exemplary embodiments of the present application described in the above-mentioned part of the test method for semiconductor structures of this specification.
  • a program product 300 for implementing the above method according to an embodiment of the present application is described, which can adopt a portable compact disk read only memory (CD-ROM) and include program codes, and can be used in a terminal device, For example running on a personal computer.
  • CD-ROM portable compact disk read only memory
  • the program product of the embodiments of the present application is not limited thereto, and in this document, the readable storage medium may be any tangible medium that contains or stores a program, and the program may be used by or combined with an instruction execution system, apparatus, or device.
  • the program product may employ any combination of one or more readable media.
  • the readable medium may be a readable signal medium or a readable storage medium.
  • the readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus or device, or a combination of any of the above. More specific examples (non-exhaustive list) of readable storage media include: electrical connections with one or more wires, portable disks, hard disks, random access memory (RAM), read only memory (ROM), erasable programmable read only memory (EPROM or flash memory), optical fiber, portable compact disk read only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.
  • the computer-readable storage medium may include a data signal propagated in baseband or as part of a carrier wave, carrying readable program code therein. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the foregoing.
  • a readable storage medium can also be any readable medium other than a readable storage medium that can transmit, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.
  • Program code embodied on a readable storage medium may be transmitted using any suitable medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.
  • Program code for performing the operations of the embodiments of the present application may be written in any combination of one or more programming languages, including object-oriented programming languages—such as Java, C++, etc., as well as conventional Procedural programming language - such as the "C" language or similar programming language.
  • the program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device, or entirely on the remote computing device or server execute on.
  • the remote computing device may be connected to the user computing device through any kind of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computing device (eg, using an Internet service provider business via an Internet connection).
  • LAN local area network
  • WAN wide area network
  • an external computing device eg, using an Internet service provider business via an Internet connection
  • An embodiment of the present application further provides an electronic device, including: a processor; and a memory for storing executable instructions of the processor; wherein the processor is configured to execute the above-mentioned method for testing a semiconductor structure by executing the executable instructions .
  • the electronic device 600 according to this embodiment of the present application is described below with reference to FIG. 7 .
  • the electronic device 600 shown in FIG. 7 is only an example, and should not impose any limitations on the functions and scope of use of the embodiments of the present application.
  • electronic device 600 takes the form of a general-purpose computing device.
  • Components of the electronic device 600 may include, but are not limited to, at least one processing unit 610, at least one storage unit 620, a bus 630 connecting different system components (including the storage unit 620 and the processing unit 610), a display unit 640, and the like.
  • the storage unit stores program codes, and the program codes can be executed by the processing unit 610, so that the processing unit 610 executes the various exemplary embodiments of the present application described in the above-mentioned part of the semiconductor structure testing method of this specification. Implementation steps.
  • the storage unit 620 may include a readable medium in the form of a volatile storage unit, such as a random access storage unit (RAM) 6201 and/or a cache storage unit 6202 , and may further include a read only storage unit (ROM) 6203 .
  • RAM random access storage unit
  • ROM read only storage unit
  • the storage unit 620 may also include a program/utility 6204 having a set (at least one) of program modules 6205 including, but not limited to, an operating system, one or more application programs, other program modules, and programs Data, each or some combination of these examples may include an implementation of a network environment.
  • the bus 630 may be representative of one or more of several types of bus structures, including a memory cell bus or memory cell controller, a peripheral bus, a graphics acceleration port, a processing unit, or a local area using any of a variety of bus structures. bus.
  • the electronic device 600 may also communicate with one or more external devices 700 (eg, keyboards, pointing devices, Bluetooth devices, etc.), with one or more devices that enable a user to interact with the electronic device 600, and/or with Any device (eg, router, modem, etc.) that enables the electronic device 600 to communicate with one or more other computing devices. Such communication may occur through input/output (I/O) interface 650 . Also, the electronic device 600 may communicate with one or more networks (eg, a local area network (LAN), a wide area network (WAN), and/or a public network such as the Internet) through a network adapter 660 . Network adapter 660 may communicate with other modules of electronic device 600 through bus 630 . It should be understood that, although not shown, other hardware and/or software modules may be used in conjunction with electronic device 600, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives and data backup storage systems.
  • the exemplary embodiments described herein may be implemented by software, or by a combination of software and necessary hardware. Therefore, the technical solutions according to the embodiments of the present application may be embodied in the form of software products, and the software products may be stored in a non-volatile storage medium (which may be CD-ROM, U disk, mobile hard disk, etc.) or on the network , which includes several instructions to cause a computing device (which may be a personal computer, a server, or a network device, etc.) to execute the above-mentioned method for testing a semiconductor structure according to an embodiment of the present application.
  • a computing device which may be a personal computer, a server, or a network device, etc.

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  • Mechanical Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

一种用于半导体结构测试的机械臂，包括本体（10）和操作臂（20），操作臂（20）包括连接件（21）、第一转接部（22）以及第二转接部（23），连接件（21）与本体（10）相连接；第一转接部（22）与连接件（21）相连接，第一转接部（22）用于安装打开和关闭基座（1）的第一操作机构（2）；第二转接部（23）与连接件（21）相连接，第二转接部（23）用于安装抓取和释放半导体器件的第二操作机构（3）；其中，当第一转接部（22）驱动第一操作机构（2）打开基座（1）后，第二转接部（23）能够驱动第二操作机构（3）将半导体器件放入基座（1）中，或将基座（1）中的半导体器件取出。整个测试过程中机械臂实现了对半导体器件的自动抓取与释放，以及基座的自动打开与关闭，以此提高测试效率。还涉及一种机械臂组件、半导体结构测试系统及方法、存储介质及电子设备。

Description

机械臂及其组件、测试系统及方法、存储介质及电子设备
交叉引用
本申请要求于2021年01月26日提交的申请号为202110103853.8、名称为“机械臂及其组件、测试系统及方法、存储介质及电子设备”的中国专利申请的优先权，该中国专利申请的全部内容通过引用全部并入本文。
技术领域
本申请实施例涉及半导体技术领域，尤其涉及一种机械臂及其组件、测试系统及方法、存储介质及电子设备。
背景技术
半导体结构需要进行大量的测试，以便剔除不合格的产品。在对半导体结构进行测试过程中，需要将半导体结构放入基座中，待测试完成后由基座中取出，相关技术中多通过人工参与，不仅效率低下，且劳动成本较高。
发明内容
本申请实施例提供一种机械臂及其组件、测试系统及方法、存储介质及电子设备，以辅助半导体结构的测试。
根据本申请实施例的第一个方面，提供了一种用于半导体结构测试的机械臂，包括本体和操作臂，操作臂包括：
连接件，连接件与本体相连接；
第一转接部，第一转接部与连接件相连接，第一转接部用于安装打开和关闭基座的第一操作机构；
第二转接部，第二转接部与连接件相连接，第二转接部用于安装抓取和释放半导体器件的第二操作机构；
其中，当第一转接部驱动第一操作机构打开基座后，第二转接部能够驱动第二操作机构将半导体器件放入基座中，或将基座中的半导体器件取出。
根据本申请实施例的第二个方面，提供了一种机械臂组件，包括上述的机械臂、第一操作机构以及第二操作机构。
根据本申请实施例的第三个方面，提供了一种半导体结构测试系统，包括上述的机械臂组件和基座。
根据本申请实施例的第四个方面，一种半导体结构的测试方法，包括：
控制机械臂的连接件移动，以使得连接于连接件上的第一转接部移动，连接于第一转接部上的第一操作机构打开基座；
控制连接件移动，以使得连接于连接件上的第二转接部移动，连接于第二转接部上的第二操作机构将半导体器件放入基座中；
控制连接件移动，以使得第一转接部带动第一操作机构移动，第一操作机构关闭基座；
控制测试平台运行。
根据本申请实施例的第五个方面，提供了一种计算机可读存储介质，其上存储有计算机程序，该程序被处理器执行时实现上述的半导体结构的测试方法。
根据本申请实施例的第六个方面，提供了一种电子设备，包括：
处理器；以及
存储器，用于存储处理器的可执行指令；
其中，处理器配置为经由执行可执行指令来执行上述的半导体结构的测试方法。
本申请实施例的机械臂通过连接件上的第一转接部和第二转接部能够分别安装第一操作机构和第二操作机构。第一操作机构能够打开和关闭基座，第二操作机构能够抓取和释放半导体器件。通过第一操作机构打开基座，第二操作机构将其抓取到的半导体器件放入到基座内，然后通过第一操作机构关闭基座，并在半导体器件测试完毕后第一操作机构打开基座，第二操作机构将基座内的半导体器件取出，以此完成半导体器件的一次测试，整个测试过程中机械臂实现了对半导体器件的自动抓取与释放，以及基座的自动打开与关闭，以此提高测试效率。
附图说明
通过结合附图对本申请实施例的详细说明，本申请实施例的各种目标，特征和优点将变得更加显而易见。附图仅为本申请实施例的示范性图解，并非一定是按比例绘制。在附图中，同样的附图标记始终表示相同或类似的部件。其中：
图1是根据一示例性实施方式示出的一种机械臂的结构示意图；
图2是根据一示例性实施方式示出的一种机械臂的一个状态结构示意图；
图3是根据一示例性实施方式示出的一种机械臂的另一个状态结构示意图；
图4是根据一示例性实施方式示出的一种半导体结构测试系统的结构示意图；
图5是根据一示例性实施方式示出的一种半导体结构的测试方法的流程示意图；
图6示意性示出本申请示例性实施例中一种计算机可读存储介质示意图；
图7示意性示出本申请示例性实施例中一种电子设备示意图。
附图标记说明如下：
1、基座；2、第一操作机构；3、第二操作机构；4、测试平台；5、指示灯；6、图像采集部；7、服务器；
10、本体；11、支撑件；12、运动件；13、第一壳体件；14、第二壳体件；20、操作臂；21、连接件；22、第一转接部；23、第二转接部；24、旋转件；25、第三壳体件；26、第四壳体件；
300、程序产品；600、电子设备；610、处理单元；620、存储单元；6201、随机存取存储单元(RAM)；6202、高速缓存存储单元；6203、只读存储单元(ROM)；6204、程序/实用工具；6205、程序模块；630、总线；640、显示单元；650、输入/输出(I/O)接口；660、网络适配器；700、外部设备。
具体实施方式
体现本申请特征与优点的典型实施例将在以下的说明中详细叙述。应理解的是本申请能够在不同的实施例上具有各种的变化，其皆不脱离本申请的范围，且其中的说明及附图在本质上是作说明之用，而非用以限制本申请。
在对本申请的不同示例性实施方式的下面描述中，参照附图进行，附图形成本申请实施例的一部分，并且其中以示例方式显示了可实现本申请的多个方面的不同示例性结构，系统和步骤。应理解的是，可以使用部件，结构，示例性装置，系统和步骤的其他特定方案，并且可在不偏离本申请范围的情况下进行结构和功能性修改。而且，虽然本说明书中可使用术语“之上”，“之间”，“之内”等来描述本申请的不同示例性特征和元件，但是这些术语用于本文中仅出于方便，例如根据附图中的示例的方向。本说明书中的任何内容都不应理解为需要结构的特定三维方向才落入本申请的范围内。
本申请的一个实施例提供了一种用于半导体结构测试的机械臂，请参考图1至图4，机械臂包括本体10和操作臂20，操作臂20包括：连接件21，连接件21与本体10相连接；第一转接部22，第一转接部22与连接件21相连接，第一转接部22用于安装打开和关闭基座1的第一操作机构2；第二转接部23，第二转接部23与连接件21相连接，第二 转接部23用于安装抓取和释放半导体器件的第二操作机构3；其中，当第一转接部22驱动第一操作机构2打开基座1后，第二转接部23能够驱动第二操作机构3将半导体器件放入基座1中，或将基座1中的半导体器件取出。
本申请实施例一个实施例的机械臂通过连接件21上的第一转接部22和第二转接部23能够分别安装第一操作机构2和第二操作机构3。第一操作机构2能够打开和关闭基座1，第二操作机构3能够抓取和释放半导体器件。通过第一操作机构2打开基座1，第二操作机构3将其抓取到的半导体器件放入到基座1内，然后通过第一操作机构2关闭基座1，并在半导体器件测试完毕后第一操作机构2打开基座1，第二操作机构3将基座1内的半导体器件取出，以此完成半导体器件的一次测试，整个测试过程中机械臂实现了对半导体器件的自动抓取与释放，以及基座1的自动打开与关闭，以此提高测试效率。
需要说明的是，基座1(Socket)可以是不同类型的Socket，即用于打开关闭基座1的第一操作机构2也可以与其相适配。在一些实施例中，不排除第一操作机构2可以同时兼容多个Socket，此处不作限定。
第一操作机构2可以是夹爪机构，即通过夹爪的打开与闭合实现与基座1的连接，从而将基座1打开与关闭。或者，第一操作机构2也可以是吸附机构，即通过吸附基座1将其打开与关闭。对于第一操作机构2的具体结构此处不作限定，可以根据实际需求进行适应性的调整。
相应的，第二操作机构3可以是夹爪机构，即通过夹爪的打开与闭合实现与对半导体器件的抓取。或者，第二操作机构3也可以是吸附机构，例如，吸笔夹具。对于第二操作机构3的具体结构此处不作限定，可以根据实际需求进行适应性的调整。
在一个实施例中，如图1所示，本体10包括：支撑件11，支撑件11用于将机械臂悬挂在空中；运动件12，运动件12设置在支撑件11上，且相对于支撑件11可活动地设置；其中，连接件21与运动件12相连接，连接件21能够随运动件12运动，从而使得第一操作机构2或第二操作机构3完成相应的操作。
具体的，运动件12与连接件21相连接，从而在运动件12发生位置变化时，连接件21就会带动第一转接部22和第二转接部23运动，从而使得第一操作机构2和第二操作机构3完成相应的操作。
需要说明的是，第一操作机构2和第二操作机构3与基座1之间的位置关系可以调整，从而使得第一操作机构2和第二操作机构3分别完成相应的操作。
在一个实施例中，运动件12相对于支撑件11沿竖直方向可移动地设置，以驱动连接 件21沿靠近或远离基座1的方向移动。即在第一操作机构2需要打开基座1时，需要使得运动件12向下移动，此时第一操作机构2靠近基座1，在第一操作机构2与基座1完成连接后，运动件12向上移动，此时第一操作机构2远离基座1，从而将基座1打开。在第二操作机构3需要抓取到某个工位的半导体器件时，需要使得运动件12向下移动，此时第二操作机构3靠近半导体器件，在第二操作机构3抓取到半导体器件后，使得运动件12向上移动，并在第二操作机构3与打开后的基座1相对后，使得运动件12向下移动，此时第二操作机构3靠近基座1，在第二操作机构3运动到位后，可以将半导体器件放入到基座1内，此时移动第一操作机构2关闭基座1，测试完成后重复打开基座1，第二操作机构3取出半导体器件，并循环进行下一个半导体器件的检测。
在一个实施例中，运动件12相对于支撑件11可转动地设置，以使连接件21能够随运动件12转动。
具体的，在运动件12转动过程中，可以使得第一操作机构2或者第二操作机构3与基座1相对设置，从而使得第一操作机构2或者第二操作机构3完成相应的动作。
或者，在运动件12转动过程中，可以使得第一操作机构2和第二操作机构3运动到另外一个工位位置处，即与另一个基座1相对设置，以此完成另一个位置处的半导体器件检测。
在一些实施例中，操作臂20为多个，多个操作臂20依次设置在本体10上，即在运动件12转动时，多个操作臂20可以进行相应的位置调整，以此对应到其他的基座1处。
在一些实施例中，多个操作臂20环绕本体10的周向方向设置，即多个操作臂20可以分别对应多个基座1，在运动件12转动过程中，多个操作臂20可以分别对应到下一个基座1，以此进行下一个测试，此操作可以保证多个操作臂20同时处于运行过程中，不会出现某个位置的空运行。
在一个实施例中，运动件12相对于支撑件11可沿水平方向移动地设置，即运动件12可以带动连接件21实现左右运动，以此进行位置调整或者移动至下一个基座1处。
在一些实施例中，多个操作臂20可以沿直线方向间隔地设置在本体10上。
需要说明的是，对于运动件12相对于支撑件11沿竖直方向可移动地设置，可以在支撑件11上设置有气缸或者油缸，活塞杆与运动件12相连接，从而通过活塞杆的伸出与缩回实现运动件12的上下移动。在一些实施例中，也可以通过电机带动齿轮和齿条实现运动件12的上下移动，或者电机带动丝杠组件实现运动件12的上下移动，此处不作限定。
对于运动件12相对于支撑件11可转动地设置，可以在支撑件11上设置有电机，通 过电机带动运动件12转动即可，此处不作限定。
运动件12相对于支撑件11可沿水平方向移动地设置，可以参考运动件12相对于支撑件11沿竖直方向移动的驱动方式，此处不作赘述。
需要注意的是，对于旋转运动以及直线运动驱动方式均可以参考上述方式，此处仅给出了某些可实施的方式。在移动过程中可以结合导轨等结构保证移动的稳定性。
在一个实施例中，如图1所示，本体10还包括：第一壳体件13，第一壳体件13与支撑件11相连接，运动件12可活动地设置在第一壳体件13内，以使运动件12通过第一壳体件13设置在支撑件11上。第一壳体件13为本体10的防护结构，其内部形成容纳空间，以此实现对运动件12的防护。
在一个实施例中，本体10还包括：第二壳体件14，第二壳体件14与第一壳体件13相连接，连接件21可活动地设置在第二壳体件14内，第一转接部22和第二转接部23能够随连接件21运动，即第二壳体件14实现对连接件21的防护。
在一些实施例中，第一壳体件13和第二壳体件14可以为一个整体结构，第一壳体件13和第二壳体件14组成了一个完整的壳体件，当连接件21能够相对于第二壳体件14进行大范围的直线移动或者旋转运动时，第二壳体件14均能够对连接件21形成防护，且不会影响连接件21转动。例如，当多个操作臂20环绕本体10的周向方向设置时，第二壳体件14可以是一个环形件。
在一些实施例中，第二壳体件14可以是多个，即每个第二壳体件14均对应有独立的连接件21。
在一个实施例中，连接件21相对于运动件12可活动地设置，即连接件21本身可以进行位置调整，以此适应其与基座1之间的位置关系。
在一个实施例中，连接件21相对于运动件12可沿水平方向移动。
在一些实施例中，第一壳体件13相对于支撑件11可移动地设置，即第一壳体件13可以带动连接件21相对于运动件12移动，从而使得连接件21移动至不同基座1所在位置处。
在一个实施例中，支撑件11能够驱动机械臂在空中移动，即支撑件11可以类似天车，使得整个机械臂进行运动。
在一个实施例中，支撑件11能够实现转动和直线运动中的至少一种。
在一个实施例中，如图1至图3所示，操作臂20还包括：旋转件24，旋转件24与连接件21相连接，第一转接部22和第二转接部23均设置在旋转件24上，以使第一转接部 22和第二转接部23均通过旋转件24与连接件21相连接。旋转件24的设置能够使得第一转接部22和第二转接部23的位置更容易调整，以此适应与基座1之间的位置关系。
需要说明的是，旋转件24可以直接连接于连接件21上。旋转件24也可以间接连接于连接件21上。
在一个实施例中，旋转件24的至少部分相对于连接件21可转动地设置，以使第一转接部22和第二转接部23均随旋转件24可转动地设置；其中，旋转件24用于使第一操作机构2和第二操作机构3中的一个与基座1相对设置。
具体的，结合图2和图3所示，第一转接部22上用于连接第一操作机构2，第二转接部23上用于连接第二操作机构3，而第一转接部22和第二转接部23的安装平面均处于同一个水平面上，即可以将旋转件24理解为一个环形结构，此时通过旋转件24的转动使得第一转接部22和第二转接部23可以分别与基座1进行对应，类似旋转件24的旋转中心点位于基座1的上方，而第一转接部22和第二转接部23分别连接在中心点周向方向上，从而在旋转件24转动时，第一转接部22和第二转接部23可以分别位于基座1的正上方，从而进行相应的操作。
需要说明的是，旋转件24可以包括固定部分和旋转部分，固定部分与连接件21相连接，旋转部分位于固定部分上，而第一转接部22和第二转接部23连接于旋转部分上，从而在旋转部分相对于固定部分转动时，使得第一转接部22和第二转接部23发生位置调整。
在一个实施例中，如图2和图3所示，操作臂20还包括：第三壳体件25，第三壳体件25与旋转件24相连接，第一转接部22位于第三壳体件25内，第三壳体件25实现对第一转接部22的防护。
在一个实施例中，如图2和图3所示，操作臂20还包括：第四壳体件26，第四壳体件26与旋转件24相连接，第二转接部23位于第四壳体件26内，第四壳体件26实现对第二转接部23的防护。
本申请的一个实施例还提供了一种机械臂组件，请参考图1至图4，机械臂组件包括上述的机械臂、第一操作机构2以及第二操作机构3。
本申请一个实施例的机械臂组件通过第一操作机构2能够打开和关闭基座1，第二操作机构3能够抓取和释放半导体器件，整个测试过程中机械臂组件实现了对半导体器件的自动抓取与释放，以及基座1的自动打开与关闭，以此提高测试效率。
在一个实施例中，第一操作机构2可拆卸地设置在机械臂的第一转接部22上，即第一操作机构2可以随时进行更换。
在一些实施例中，第一操作机构2与第一转接部22卡接、粘结或者通过紧固件相连接。
在一个实施例中，第一操作机构2不可拆卸地设置在机械臂的第一转接部22上，如，第一操作机构2可以直接焊接到第一转接部22上。
在一个实施例中，第二操作机构3可拆卸地设置在机械臂的第二转接部23上，即第二操作机构3可以随时进行更换。
在一些实施例中，第二操作机构3与第二转接部23卡接、粘结或者通过紧固件相连接。
在一个实施例中，第二操作机构3不可拆卸地设置在机械臂的第二转接部23上，如，第二操作机构3与第二转接部23焊接。
本申请的一个实施例还提供了一种半导体结构测试系统，请参考图4，包括上述的机械臂组件和基座1。
本申请一个实施例的半导体结构测试系统，由于机械臂组件的设置，整个测试过程中机械臂组件实现了对半导体器件的自动抓取与释放，以及基座1的自动打开与关闭，以此完成自动化测试，提高测试效率。
在一个实施例中，如图4所示，半导体结构测试系统还包括：测试平台4，基座1设置在测试平台4上，机械臂组件位于测试平台4的上方。测试平台4可以用于运行测试程序，以此实现对半导体器件的测试。
具体的，在用于高低温测试时，在测试平台4上安装小型的温箱(如加热罩)，或者所有的设备或者所有的测试平台处于同一个较大的温箱内，通过测试平台运行测试程序实现测试。对于测试平台4的此处不作限定可以使用相关技术中常用的测试平台，以此实现对半导体器件的测试。
在一个实施例中，如图4所示，半导体结构测试系统还包括：指示灯5，指示灯5设置在测试平台4上，指示灯5通过不同的显示方式实现对不同结果的指示。
具体的，指示灯5可以通过显示不同的颜色来对应不同的测试结果或者记录信息。或者指示灯5可以如图4所示设置有多个，多个指示灯5可以分为多组，每组指示灯5显示不同的测试结果或者记录信息。
在本实施例中，指示灯5可以表示：
1、Socket(即基座)关闭，颗粒(半导体器件)未填入；
2、Socket打开，颗粒未填入；
3、Socket打开，颗粒已填入；
4、Socket关闭，颗粒已填入；
5、开机，机械臂开机、测试平台4、或者服务器7开机等；
6、测试中；
7、测试失败时，可以有多个状态，与服务器7连接失败；测试系统死机等；
8、测试结束，测试失败；
9、测试结束，测试通过；
10、测试平台4第一次测试、第二次测试、…等，对于测试次数的显示可以专门设置有一组指示灯5进行。
在一个实施例中，如图4所示，半导体结构测试系统还包括：图像采集部6，图像采集部6的采集头能够与指示灯5和基座1中的至少之一相对设置。图像采集部6可以用于读取指示灯5指示的状态，同时也用于扫描半导体器件与对应的测试平台4信息。图像采集部6可以是摄像头。
在一个实施例中，如图4所示，半导体结构测试系统还包括：服务器7，服务器7与测试平台4信号连接，服务器7与机械臂信号连接。
服务器7用于输入测试策略(如更换\配置测试程序，设置复测次数等)，从测试平台4获取测试信息(如测试log，test case result，错误信息等)，根据配置指挥测试平台开关或配置所有的温箱，从图像采集部6获取测试状态，半导体器件、测试平台信息；指挥机械臂动作，如打开Socket、换取新的待测半导体器件、移动连接件21(如进行换测试平台复测，这样就可以让一个已经测试完成的半导体器件重新在另外一个测试平台上进行复测)，关闭Socket等。
本申请的一个实施例还提供了一种半导体结构的测试方法，请参考图5，半导体结构的测试方法包括：
S101，控制机械臂的连接件21移动，以使得连接于连接件21上的第一转接部22移动，连接于第一转接部22上的第一操作机构2打开基座1；
S103，控制连接件21移动，以使得连接于连接件21上的第二转接部23移动，连接于第二转接部23上的第二操作机构3将半导体器件放入基座1中；
S105，控制连接件21移动，以使得第一转接部22带动第一操作机构2移动，第一操作机构2关闭基座1；
S107，控制测试平台4运行。
本申请的一个实施例的半导体结构的测试方法通过控制机械臂带动第一操作机构2和第二操作机构3运动，从而实现对半导体器件的自动抓取与释放，以及基座1的自动打开与关闭，从而提高测试平台4的测试效率。
在一个实施例中，半导体结构的测试方法还包括：控制连接于连接件21上的旋转件24转动，以使得连接于旋转件24上的第一转接部22和第二转接部23转动，第一操作机构2和第二操作机构3中的一个与基座1相对设置，即使得第一操作机构2和第二操作机构3分别进行相应的操作。
在一个实施例中，半导体结构的测试方法还包括：控制机械臂的本体10运动，以使得本体10上的各个连接件21随之运动，从而可用使得已经测试完成的半导体器件重新在另外一个测试平台上进行复测。
在一个实施例中，半导体结构的测试方法应用上述的半导体结构测试系统。测试平台上有两组指示灯可用来指示设备的测试状态；测试系统&软件自动执行，并根据测试程序的进度及结果来控制测试平台上的两组指示灯状态；机械臂根据指示灯的状态以及测试策略来自动更换测试的半导体器件；机械臂根据指示灯的状态来获取测试结果，并保存存储结果；测试结果采集&保存服务器，从测试平台以及机械手臂获取测试信息(如log)以及测试结果并保存；
本申请实施例还提供了一种计算机可读存储介质，其上存储有计算机程序，该程序被处理器执行时实现上述的半导体结构的测试方法。
在一些可能的实施方式中，本申请实施例的各个方面还可以实现为一种程序产品的形式，其包括程序代码，当所述程序产品在终端设备上运行时，所述程序代码用于使所述终端设备执行本说明书上述半导体结构的测试方法部分中描述的根据本申请各种示例性实施方式的步骤。
参考图6所示，描述了根据本申请的实施方式的用于实现上述方法的程序产品300，其可以采用便携式紧凑盘只读存储器(CD-ROM)并包括程序代码，并可以在终端设备，例如个人电脑上运行。然而，本申请实施例的程序产品不限于此，在本文件中，可读存储介质可以是任何包含或存储程序的有形介质，该程序可以被指令执行系统、装置或者器件使用或者与其结合使用。
所述程序产品可以采用一个或多个可读介质的任意组合。可读介质可以是可读信号介质或者可读存储介质。可读存储介质例如可以为但不限于电、磁、光、电磁、红外线、或半导体的系统、装置或器件，或者任意以上的组合。可读存储介质的更具体的例子(非穷 举的列表)包括：具有一个或多个导线的电连接、便携式盘、硬盘、随机存取存储器(RAM)、只读存储器(ROM)、可擦式可编程只读存储器(EPROM或闪存)、光纤、便携式紧凑盘只读存储器(CD-ROM)、光存储器件、磁存储器件、或者上述的任意合适的组合。
所述计算机可读存储介质可以包括在基带中或者作为载波一部分传播的数据信号，其中承载了可读程序代码。这种传播的数据信号可以采用多种形式，包括但不限于电磁信号、光信号或上述的任意合适的组合。可读存储介质还可以是可读存储介质以外的任何可读介质，该可读介质可以发送、传播或者传输用于由指令执行系统、装置或者器件使用或者与其结合使用的程序。可读存储介质上包含的程序代码可以用任何适当的介质传输，包括但不限于无线、有线、光缆、RF等等，或者上述的任意合适的组合。
可以以一种或多种程序设计语言的任意组合来编写用于执行本申请实施例操作的程序代码，所述程序设计语言包括面向对象的程序设计语言—诸如Java、C++等，还包括常规的过程式程序设计语言—诸如“C”语言或类似的程序设计语言。程序代码可以完全地在用户计算设备上执行、部分地在用户设备上执行、作为一个独立的软件包执行、部分在用户计算设备上部分在远程计算设备上执行、或者完全在远程计算设备或服务器上执行。在涉及远程计算设备的情形中，远程计算设备可以通过任意种类的网络，包括局域网(LAN)或广域网(WAN)，连接到用户计算设备，或者，可以连接到外部计算设备(例如利用因特网服务提供商来通过因特网连接)。
本申请实施例还提供了一种电子设备，包括：处理器；以及存储器，用于存储处理器的可执行指令；其中，处理器配置为经由执行可执行指令来执行上述的半导体结构的测试方法。
所属技术领域的技术人员能够理解，本申请实施例的各个方面可以实现为系统、方法或程序产品。因此，本申请实施例的各个方面可以具体实现为以下形式，即：完全的硬件实施方式、完全的软件实施方式(包括固件、微代码等)，或硬件和软件方面结合的实施方式，这里可以统称为“电路”、“模块”或“系统”。
下面参照图7来描述根据本申请的这种实施方式的电子设备600。图7显示的电子设备600仅仅是一个示例，不应对本申请实施例的功能和使用范围带来任何限制。
如图7所示，电子设备600以通用计算设备的形式表现。电子设备600的组件可以包括但不限于：至少一个处理单元610、至少一个存储单元620、连接不同系统组件(包括存储单元620和处理单元610)的总线630、显示单元640等。
其中，所述存储单元存储有程序代码，所述程序代码可以被所述处理单元610执行， 使得所述处理单元610执行本说明书上述半导体结构的测试方法部分中描述的根据本申请各种示例性实施方式的步骤。
所述存储单元620可以包括易失性存储单元形式的可读介质，例如随机存取存储单元(RAM)6201和/或高速缓存存储单元6202，还可以进一步包括只读存储单元(ROM)6203。
所述存储单元620还可以包括具有一组(至少一个)程序模块6205的程序/实用工具6204，这样的程序模块6205包括但不限于：操作系统、一个或者多个应用程序、其它程序模块以及程序数据，这些示例中的每一个或某种组合中可能包括网络环境的实现。
总线630可以为表示几类总线结构中的一种或多种，包括存储单元总线或者存储单元控制器、外围总线、图形加速端口、处理单元或者使用多种总线结构中的任意总线结构的局域总线。
电子设备600也可以与一个或多个外部设备700(例如键盘、指向设备、蓝牙设备等)通信，还可与一个或者多个使得用户能与该电子设备600交互的设备通信，和/或与使得该电子设备600能与一个或多个其它计算设备进行通信的任何设备(例如路由器、调制解调器等等)通信。这种通信可以通过输入/输出(I/O)接口650进行。并且，电子设备600还可以通过网络适配器660与一个或者多个网络(例如局域网(LAN)，广域网(WAN)和/或公共网络，例如因特网)通信。网络适配器660可以通过总线630与电子设备600的其它模块通信。应当明白，尽管图中未示出，可以结合电子设备600使用其它硬件和/或软件模块，包括但不限于：微代码、设备驱动器、冗余处理单元、外部磁盘驱动阵列、RAID系统、磁带驱动器以及数据备份存储系统等。
通过以上的实施方式的描述，本领域的技术人员易于理解，这里描述的示例实施方式可以通过软件实现，也可以通过软件结合必要的硬件的方式来实现。因此，根据本申请实施方式的技术方案可以以软件产品的形式体现出来，该软件产品可以存储在一个非易失性存储介质(可以是CD-ROM，U盘，移动硬盘等)中或网络上，包括若干指令以使得一台计算设备(可以是个人计算机、服务器、或者网络设备等)执行根据本申请实施方式的上述半导体结构的测试方法。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本申请的其它实施方案。本申请旨在涵盖本发明的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和示例实施方式仅被视为示例性的，本申请的真正范围和精神由前 面的权利要求指出。
应当理解的是，本申请并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。

Claims (20)

  1. 一种用于半导体结构测试的机械臂，包括本体和操作臂，所述操作臂包括：
    连接件，所述连接件与所述本体相连接；
    第一转接部，所述第一转接部与所述连接件相连接，所述第一转接部用于安装打开和关闭基座的第一操作机构；
    第二转接部，所述第二转接部与所述连接件相连接，所述第二转接部用于安装抓取和释放半导体器件的第二操作机构；
    其中，当所述第一转接部驱动所述第一操作机构打开所述基座后，所述第二转接部能够驱动所述第二操作机构将半导体器件放入所述基座中，或将所述基座中的半导体器件取出。
  2. 根据权利要求1所述的机械臂，其中，所述本体包括：
    支撑件，所述支撑件用于将所述机械臂悬挂在空中；
    运动件，所述运动件设置在所述支撑件上，且相对于所述支撑件可活动地设置；
    其中，所述连接件与所述运动件相连接，所述连接件能够随所述运动件运动。
  3. 根据权利要求2所述的机械臂，其中，所述运动件相对于所述支撑件沿竖直方向可移动地设置，以驱动所述连接件沿靠近或远离所述基座的方向移动。
  4. 根据权利要求3所述的机械臂，其中，所述运动件相对于所述支撑件可转动地设置，以使所述连接件能够随所述运动件转动。
  5. 根据权利要求2所述的机械臂，其中，所述本体还包括：
    第一壳体件，所述第一壳体件与所述支撑件相连接，所述运动件可活动地设置在所述第一壳体件内；
    第二壳体件，所述第二壳体件与所述第一壳体件相连接，所述连接件可活动地设置在所述第二壳体件内，所述第一转接部和所述第二转接部能够随所述连接件运动。
  6. 根据权利要求2所述的机械臂，其中，所述连接件相对于所述运动件可活动地设置。
  7. 根据权利要求2所述的机械臂，其中，所述支撑件能够驱动所述机械臂在空中移动。
  8. 根据权利要求1所述的机械臂，其中，所述操作臂还包括：
    旋转件，所述旋转件与所述连接件相连接，所述第一转接部和所述第二转接部均设置在所述旋转件上，以使所述第一转接部和所述第二转接部均通过所述旋转件与所述连接件相连接。
  9. 根据权利要求8所述的机械臂，其中，所述旋转件的至少部分相对于所述连接件可转动地设置，以使所述第一转接部和所述第二转接部均随所述旋转件可转动地设置；
    其中，所述旋转件用于使所述第一操作机构和所述第二操作机构中的一个与所述基座相对设置。
  10. 根据权利要求8所述的机械臂，其中，所述操作臂还包括：
    第三壳体件，所述第三壳体件与所述旋转件相连接，所述第一转接部位于所述第三壳体件内。
  11. 根据权利要求8所述的机械臂，其中，所述操作臂还包括：
    第四壳体件，所述第四壳体件与所述旋转件相连接，所述第二转接部位于所述第四壳体件内。
  12. 根据权利要求1至11中任一项所述的机械臂，其中，所述操作臂为多个，多个所述操作臂依次设置在所述本体上。
  13. 根据权利要求12所述的机械臂，其中，多个所述操作臂环绕所述本体的周向方向设置。
  14. 根据权利要求12所述的机械臂，其中，多个所述操作臂沿直线方向间隔地设置在所述本体上。
  15. 一种机械臂组件，包括权利要求1至14中任一项所述的机械臂、第一操作机构以及第二操作机构。
  16. 根据权利要求15所述的机械臂组件，其中，所述第一操作机构可拆卸地设置在所述机械臂的第一转接部上；
    和/或，所述第二操作机构可拆卸地设置在所述机械臂的第二转接部上。
  17. 一种半导体结构测试系统，包括权利要求15或16所述的机械臂组件和基座。
  18. 一种半导体结构的测试方法，包括：
    控制机械臂的连接件移动，以使得连接于所述连接件上的第一转接部移动，连接于所述第一转接部上的第一操作机构打开基座；
    控制所述连接件移动，以使得连接于所述连接件上的第二转接部移动，连接于所述第二转接部上的第二操作机构将半导体器件放入所述基座中；
    控制所述连接件移动，以使得所述第一转接部带动所述第一操作机构移动，所述第一操作机构关闭所述基座；
    控制测试平台运行。
  19. 一种计算机可读存储介质，其上存储有计算机程序，该程序被处理器执行时实现权利要求18所述的半导体结构的测试方法。
  20. 一种电子设备，包括：
    处理器；以及
    存储器，用于存储所述处理器的可执行指令；
    其中，所述处理器配置为经由执行所述可执行指令来执行权利要求18所述的半导体结构的测试方法。
PCT/CN2021/110981 2021-01-26 2021-08-05 机械臂及其组件、测试系统及方法、存储介质及电子设备 WO2022160645A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12007433B2 (en) 2021-01-26 2024-06-11 Changxin Memory Technologies, Inc. Mechanical arm and mechanical arm assembly, test system and method, storage medium and electronic device
CN112958467B (zh) * 2021-01-26 2023-11-03 长鑫存储技术有限公司 机械臂及其组件、测试系统及方法、存储介质及电子设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3905659B2 (ja) * 1999-02-09 2007-04-18 大日本スクリーン製造株式会社 動作検査システム
CN209167331U (zh) * 2018-10-08 2019-07-26 长鑫存储技术有限公司 机械手及芯片测试系统
CN110921317A (zh) * 2019-12-25 2020-03-27 佛山信卓派思机械科技有限公司 一种用于产品内部芯片测试的装置
CN210704803U (zh) * 2019-09-30 2020-06-09 安测半导体技术(江苏)有限公司 一种半导体芯片测试用机械手
CN111830401A (zh) * 2020-09-14 2020-10-27 武汉精鸿电子技术有限公司 一种半导体测试设备
CN112958467A (zh) * 2021-01-26 2021-06-15 长鑫存储技术有限公司 机械臂及其组件、测试系统及方法、存储介质及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101992189B (zh) * 2009-08-25 2014-01-15 康准电子科技（昆山）有限公司 工件检测分拣装置
CN203863675U (zh) * 2014-05-23 2014-10-08 吕成 一种自动化双臂外抓旋转机器人机构
DE102017005170A1 (de) * 2017-05-31 2017-11-16 Daimler Ag Automatisierte Oberflächenprüfung von Automobilbauteilen
CN208033076U (zh) * 2017-12-25 2018-11-02 清华大学附属中学永丰学校 一种分拣机器人
CN110508511B (zh) * 2019-08-30 2021-07-20 珠海格力智能装备有限公司 检测设备
CN112077845A (zh) * 2020-08-31 2020-12-15 东风电驱动系统有限公司 一种自动化性能检测方法、控制装置、工业机器人及存储介质

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3905659B2 (ja) * 1999-02-09 2007-04-18 大日本スクリーン製造株式会社 動作検査システム
CN209167331U (zh) * 2018-10-08 2019-07-26 长鑫存储技术有限公司 机械手及芯片测试系统
CN210704803U (zh) * 2019-09-30 2020-06-09 安测半导体技术(江苏)有限公司 一种半导体芯片测试用机械手
CN110921317A (zh) * 2019-12-25 2020-03-27 佛山信卓派思机械科技有限公司 一种用于产品内部芯片测试的装置
CN111830401A (zh) * 2020-09-14 2020-10-27 武汉精鸿电子技术有限公司 一种半导体测试设备
CN112958467A (zh) * 2021-01-26 2021-06-15 长鑫存储技术有限公司 机械臂及其组件、测试系统及方法、存储介质及电子设备

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