WO2022141037A1 - 一种集总参数非互易铁氧体器件 - Google Patents

一种集总参数非互易铁氧体器件 Download PDF

Info

Publication number
WO2022141037A1
WO2022141037A1 PCT/CN2020/140715 CN2020140715W WO2022141037A1 WO 2022141037 A1 WO2022141037 A1 WO 2022141037A1 CN 2020140715 W CN2020140715 W CN 2020140715W WO 2022141037 A1 WO2022141037 A1 WO 2022141037A1
Authority
WO
WIPO (PCT)
Prior art keywords
ferrule
lumped
inductance
cavity
ferrite device
Prior art date
Application number
PCT/CN2020/140715
Other languages
English (en)
French (fr)
Inventor
熊飞
张伟
Original Assignee
深圳市华扬通信技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华扬通信技术有限公司 filed Critical 深圳市华扬通信技术有限公司
Priority to PCT/CN2020/140715 priority Critical patent/WO2022141037A1/zh
Publication of WO2022141037A1 publication Critical patent/WO2022141037A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices

Definitions

  • the invention relates to the technical field of radio frequency microwave ferrite devices, in particular to a lumped parameter non-reciprocal ferrite device.
  • the RF microwave stripline circulator/isolator is a microwave ferrite device with a large market volume at present. It is mainly designed by using the non-reciprocal characteristics of the perpendicularly magnetized ferrite and the microwave signal.
  • a microwave device, its electrical performance is characterized in that radio frequency microwave signals can only be transmitted in one direction between three or more ports.
  • Lumped parameter circulator and lumped parameter isolator are two common lumped parameter non-reciprocal ferrite devices, both of which can be used for isolation between RF microwave amplifier stages, and are indispensable components of radar systems and communication systems. .
  • Lumped parameter circulators and isolators have the advantages of small size and low cost, and occupy a large market in the field of circulators and isolators.
  • Lumped parameter circulators are generally composed of cavities, inductor bars, ferrites, magnets, capacitors It is composed of a cover plate and a load on one port to form a lumped parameter isolator.
  • the existing lumped parameter circulators and isolators have many ground electrodes and dielectric patches, which lead to complex manufacturing processes and high production costs.
  • the connection between the input and output electrodes and the inductance strips is only realized by patch welding, and there is a risk of falling off. Risks, resulting in low structural stability, in addition, the existing lumped parameter circulator and isolator structures are difficult to ensure that the inductance strips are centered and symmetrically assembled in the cavity.
  • the technical problem to be solved by the present invention is to provide a lumped parameter non-reciprocal ferrite device with stable structure.
  • the technical solution adopted in the present invention is: a lumped parameter non-reciprocal ferrite device, comprising a cavity, a cover plate, an inductance strip, a ferrule and a dielectric part, and the ferrule is arranged on the dielectric part , a part of the dielectric element and the inductance strip are respectively arranged in the cavity, the cavity is cylindrical, the cover plate is connected with the cavity by the buckle, the ferrule is cylindrical, and the inductance strip is provided with The ferrule is matched with the sleeve hole, the ferrule and the inductance bar are welded by solder paste at the sleeve hole, and the ferrule is provided with a tin container for accommodating a part of the solder paste. The bottom surface of the inductive strip abuts against the dielectric member.
  • the beneficial effects of the invention are as follows: the lumped parameter non-reciprocal ferrite device has a novel and simple structure, few parts, is convenient for processing and manufacturing, and is beneficial to control the production cost; Improve the stability of the connection between the inductance strip and the ferrule, thereby improving the structural stability of the lumped parameter non-reciprocal ferrite device, and also assist the inductive strip to be symmetrically assembled in the center of the cavity, thereby ensuring the lumped parameter non-reciprocity. Electrical properties of ferrite devices.
  • the overall outline of the lumped parameter non-reciprocal ferrite device cavity is designed to be cylindrical, so that the lumped parameter non-reciprocal ferrite device can have three ports.
  • Rotary debugging can improve debugging efficiency, and the cylindrical cavity occupies a small area of the board; the existence of the tin container not only increases the contact area between the solder paste and the ferrule, but also forms a card position structure, which greatly reduces the solder paste.
  • the risk of being pulled out along the axial direction of the ferrule is beneficial to ensure that the inductance strip area around the sleeve hole is close to the dielectric component, thereby further improving the structural stability of the lumped parameter non-reciprocal ferrite device.
  • FIG. 1 is a schematic structural diagram of an overall structure of a lumped-parameter non-reciprocal ferrite device according to an embodiment of the present invention (when it is a circulator);
  • FIG. 2 is an exploded diagram of a lumped parameter non-reciprocal ferrite device according to an embodiment of the present invention (when it is a circulator);
  • FIG. 3 is a schematic diagram of the coordination of an inductor strip, a ferrite, a ceramic capacitor ring, a dielectric ring and a ferrule in a lumped-parameter non-reciprocal ferrite device according to an embodiment of the present invention (when it is a circulator);
  • FIG. 4 is a schematic structural diagram of an overall structure of a lumped-parameter nonreciprocal ferrite device according to an embodiment of the present invention (when it is an isolator).
  • FIG. 5 is a cross-sectional view of a partial structure of the lumped parameter nonreciprocal ferrite device according to the first embodiment of the present invention
  • FIG. 6 is a cross-sectional view of a partial structure of a lumped-parameter non-reciprocal ferrite device of another structure according to Embodiment 1 of the present invention.
  • FIG. 7 is a cross-sectional view of a partial structure of a lumped-parameter nonreciprocal ferrite device according to Embodiment 2 of the present invention.
  • FIG. 8 is a cross-sectional view of a partial structure of a lumped-parameter nonreciprocal ferrite device according to Embodiment 3 of the present invention.
  • a lumped parameter non-reciprocal ferrite device includes a cavity 1, a cover plate 12, an inductance strip 2, a ferrule 3 and a dielectric member 6, and the ferrule 3 is disposed on the dielectric member 6
  • a part of the dielectric element 6 and the inductance strip 2 are respectively arranged in the cavity 1
  • the cavity 1 is cylindrical
  • the cover plate 12 is snap-connected to the cavity 1
  • the ferrule 3 is cylindrical
  • the inductance bar 2 is provided with a sleeve hole 7 matched with the ferrule 3
  • the ferrule 3 and the inductance bar 2 are welded by solder paste at the sleeve hole 7, and the ferrule
  • a tin container 14 for accommodating part of the tin paste is provided, and the bottom surface of the inductance strip 2 abuts against the dielectric member 6 .
  • the beneficial effects of the present invention are: the lumped parameter non-reciprocal ferrite device has a novel and simple structure, few parts, is convenient for processing and manufacturing, and is beneficial to control the production cost; Soldering on the core 3 can not only improve the stability of the connection between the inductance strip 2 and the ferrule 3, thereby improving the structural stability of the lumped parameter non-reciprocal ferrite device, but also assist the inductance strip 2 in the cavity 1.
  • the inner center is symmetrically assembled, so as to ensure the electrical performance of the lumped parameter non-reciprocal ferrite device.
  • the existence of the tin container 14 not only increases the contact area between the solder paste and the ferrule 3, but also forms a card position structure.
  • the dielectric member 6 has three mounting platforms 9 , two adjacent mounting platforms 9 are arranged at an interval of 120°, and the ferrule 3 is arranged on the mounting platforms 9 .
  • ferrules 3 are respectively provided on the three mounting platforms 9 .
  • the lumped parameter non-reciprocal ferrite device is a circulator at this time.
  • ferrules 3 are respectively provided on two of the mounting platforms 9 , and a load 11 which is connected to the inductance bar 2 is provided on the other mounting platform 9 .
  • the lumped parameter non-reciprocal ferrite device is an isolator at this time.
  • the ferrule 3 is also provided with an exhaust slot 15 that communicates with the tin accommodating slot 14 , and the tin accommodating slot 14 and the exhaust slot 15 are respectively arranged around the ferrule 3 .
  • the air groove 15 is located on the side of the tin container 14 away from the mounting table 9 .
  • the exhaust groove 15 can allow the tin liquid to smoothly force out the gas in the tin container 14, so that the tin liquid can better fill the tin container 14, thereby preventing the solder paste from solidifying. Air bubbles remain in the tin-containing tank 14, which is beneficial to improve the bonding force between the solder paste and the ferrule 3, thereby improving the structural stability of the lumped parameter non-reciprocal ferrite device.
  • the top surface of the mounting table 9 is provided with a communication groove 16 that communicates with the tin container 14
  • the inductance bar 2 is provided with a through hole 17 penetrating the top surface and the bottom surface of the inductance bar 2 .
  • the bottom end of the through hole 17 communicates with the communication groove 16 , and a part of the solder paste fills the communication groove 16 and the through hole 17 .
  • the communication groove 16 can not only play a role in facilitating the discharge of gas in the tin container 14, but also after the communication groove 16 is filled with solder paste, the bonding force between the solder paste and the inductor strip 2 is further improved, thereby further Improve the structural stability of the lumped parameter non-reciprocal ferrite device; and the solder paste in the through hole 17 not only improves the bonding force between the solder paste and the inductor bar 2, but also prevents the inductor bar 2 from occurring.
  • the effect of left and right displacement is beneficial to further improve the structural stability of lumped parameter nonreciprocal ferrite devices.
  • cross section of the tin container 14 is semicircular.
  • the semicircular tin container 14 can allow the tin liquid to more smoothly force out the gas in the tin container 14 , thereby improving the structural stability of the lumped parameter nonreciprocal ferrite device.
  • the cavity 1 is a cylindrical shell having a hollow structure with an opening at the top, and the peripheral wall of the shell has three vertical slots 10 corresponding to the mounting table 9 .
  • the overall outline of the cavity 1 is designed to be cylindrical, so that the lumped parameter non-reciprocal ferrite device can be debugged by three-port rotation to improve the debug efficiency.
  • the cylindrical cavity 1 occupies a small board area, which conforms to the development trend of miniaturization of communication equipment.
  • solder is provided at the connection between the cavity 1 and the cover plate 12 .
  • the lumped parameter non-reciprocal ferrite device can be tinned and fastened after the debugging is completed, so as to improve the reliability of the connection between the cover plate 12 and the cavity 1 .
  • the inductance bar 2 wraps the ferrite 4
  • the ceramic capacitor ring 5 surrounds the ferrite 4 .
  • the inductance bar 2 is welded with the ceramic capacitor ring 5 .
  • the dielectric member 6 is annular, and the ceramic capacitor ring 5 is located in the dielectric member 6 .
  • the first embodiment of the present invention is: please refer to FIG. 1 to FIG. 3 , a lumped parameter non-reciprocal ferrite device, which includes a cavity 1 , a cover plate 12 , and an inductance strip 2 , ferrule 3, ferrite 4, ceramic capacitor ring 5 and dielectric member 6, the cavity 1 is cylindrical, the cover plate 12 is snap-connected with the cavity 1, and the ferrule 3 is arranged on the dielectric member 6, a part of the dielectric element 6, the inductance strip 2 and the ceramic capacitor ring 5 are respectively arranged in the cavity 1, the inductance strip 2 wraps the ferrite 4, and the ceramic capacitor ring 5 surrounds the ferrite 4.
  • the dielectric member 6 is annular, the ceramic capacitor ring 5 is located in the dielectric member 6 , the ferrule 3 is cylindrical, and the inductance bar 2 is provided with a matching ferrule 3 .
  • Sleeve 7, the ferrule 3 and the inductance bar 2 are welded by solder paste at the sleeve hole 7, and the inductance bar 2 and the ceramic capacitor ring 5 are welded.
  • the inductance bar 2 is in A welding hole 8 is provided at the welding place between the inductance bar 2 and the ceramic capacitor ring 5 , so that the reliability of the welding of the inductance bar 2 and the ceramic capacitor ring 5 can be improved.
  • the sleeve hole 7 is an oblong hole, which can reduce the requirement of machining accuracy and facilitate the debugging of the lumped parameter non-reciprocal ferrite device.
  • the cavity 1 and the cover plate 12 are snap-connected so that repairing can be performed during the production process, which is beneficial to reduce waste of production resources and save production costs.
  • the ferrule 3 is provided with a tin container 14 for accommodating part of the solder paste.
  • the tin container The cross section of the groove 14 is rectangular.
  • the ferrule 3 is further provided with an exhaust slot 15 that communicates with the tin accommodating slot 14 , and the tin accommodating slot 14 and the exhaust slot 15 are respectively arranged around the ferrule 3 .
  • the exhaust groove 15 is located on the side of the tin container 14 away from the mounting table 9 .
  • the cross section of the exhaust groove 15 is triangular.
  • the exhaust groove 15 communicates with the tin holding groove 14 to form a ring groove with a right-angled trapezoid cross-section.
  • the dielectric element 6 has three mounting platforms 9, two adjacent mounting platforms 9 are arranged at an interval of 120°, the ferrule 3 is arranged on the mounting platforms 9, and the cavity 1 is
  • the top has a hollow cylindrical casing with an opening, and the peripheral wall of the casing has three vertical slots 10 corresponding to the mounting table 9 .
  • the bottom surface of the inductance bar 2 is in contact with the dielectric member 6 .
  • the bottom surface of the inductance bar 2 is in contact with the top surface of the mounting table 9 .
  • the lumped-parameter non-reciprocal ferrite device when the lumped-parameter non-reciprocal ferrite device is a lumped-parameter circulator, the ferrules 3 are respectively provided on the three mounting platforms 9 . That is to say, at this time, the lumped parameter non-reciprocal ferrite device can be a lumped parameter circulator with size parameters such as 5mm, 7mm, 10mm, 12mm, 14mm, etc.
  • the lumped-parameter non-reciprocal ferrite device when the lumped-parameter non-reciprocal ferrite device is a lumped-parameter isolator, the two mounting platforms 9 are respectively provided with the ferrules 3 , and the other mounting platform is provided with the ferrule 3 . 9 is provided with a load 11 that conducts with the inductance bar 2 . Optionally, the load 11 is welded with the inductance bar 2 . That is to say, the lumped-parameter non-reciprocal ferrite device can be a lumped-parameter isolator with size parameters such as 5mm, 7mm, 10mm, 12mm, 14mm, etc. at this time.
  • solder is provided at the connection between the cavity 1 and the cover plate 12 .
  • the cavity 1 is provided with a clamping block
  • the cover plate 12 is provided with a clamping slot matched with the clamping block.
  • the cavity 1 is further provided with a magnet 13 , and the magnet 13 is located between the ferrite 4 and the cover plate 12 .
  • the first embodiment of the present invention is: please refer to FIGS. 1 to 3, a lumped parameter non-reciprocal ferrite device, which includes a cavity 1, a cover 12, The inductance strip 2, the ferrule 3, the ferrite 4, the ceramic capacitor ring 5 and the dielectric element 6, the cavity 1 is cylindrical, the cover plate 12 is snap-connected with the cavity 1, and the ferrule 3 is provided with
  • the matching sleeve hole 7, the ferrule 3 and the inductance strip 2 are welded by solder paste at the sleeve hole 7,
  • the inductor The bar 2 is provided with a welding hole 8 at the welding place between the inductance bar 2 and the ceramic capacitor ring 5 , so that the reliability of the welding of the inductance bar 2 and the ceramic capacitor ring 5 can be improved.
  • the sleeve hole 7 is an oblong hole, which can reduce the requirement of machining accuracy and facilitate the debugging of the lumped parameter non-reciprocal ferrite device.
  • the cavity 1 and the cover plate 12 are snap-connected so that repairing can be performed during the production process, which is beneficial to reduce waste of production resources and save production costs.
  • the cross section of 14 is semicircular.
  • the tin accommodating tank 14 with a semicircular cross-section has no dead ends, which is more convenient for the tin liquid to force out the air in the tin accommodating tank 14 .
  • the ferrule 3 is further provided with an exhaust slot 15 that communicates with the tin accommodating slot 14 , and the tin accommodating slot 14 and the exhaust slot 15 are respectively arranged around the ferrule 3 .
  • the exhaust groove 15 is located on the side of the tin container 14 away from the mounting table 9 .
  • the dielectric element 6 has three mounting platforms 9, two adjacent mounting platforms 9 are arranged at an interval of 120°, the ferrule 3 is arranged on the mounting platforms 9, and the cavity 1 is
  • the top has a hollow cylindrical casing with an opening, and the peripheral wall of the casing has three vertical slots 10 corresponding to the mounting table 9 .
  • the bottom surface of the inductance bar 2 is in contact with the dielectric member 6 .
  • the bottom surface of the inductance bar 2 is in contact with the top surface of the mounting table 9 .
  • the tin containing tank 14 is tangent to the top surface of the mounting table 9 and the wall surface of the exhaust tank 15 respectively.
  • the tin-containing groove 14 is tangent to the top surface of the mounting table 9 , after the sleeve hole 7 on the inductance bar 2 is placed on the ferrule 3 , the tin-containing groove 14 can also assist the inductance bar 2 to find Positive, so that the bottom surface of the end of the inductance bar 2 where the sleeve hole 7 is arranged is attached to the mounting table 9 .
  • the lumped-parameter non-reciprocal ferrite device is a lumped-parameter circulator
  • the ferrules 3 are respectively provided on the three mounting platforms 9 .
  • the two mounting platforms 9 are respectively provided with the ferrules 3 , and the other mounting platform is provided with the ferrule 3 .
  • 9 is provided with a load 11 that conducts with the inductance bar 2 .
  • the load 11 is welded with the inductance bar 2 .
  • solder is provided at the connection between the cavity 1 and the cover plate 12 .
  • the cavity 1 is provided with a clamping block
  • the cover plate 12 is provided with a clamping slot matched with the clamping block.
  • the cavity 1 is further provided with a magnet 13 , and the magnet 13 is located between the ferrite 4 and the cover plate 12 .
  • the third embodiment of the present invention is: please refer to FIG. 1 to FIG. 3, a lumped parameter non-reciprocal ferrite device, which includes a cavity 1, a cover 12, The inductance strip 2, the ferrule 3, the ferrite 4, the ceramic capacitor ring 5 and the dielectric element 6, the cavity 1 is cylindrical, the cover plate 12 is snap-connected with the cavity 1, and the ferrule 3 is provided with
  • the matching sleeve hole 7, the ferrule 3 and the inductance strip 2 are welded by solder paste at the sle
  • the inductor The bar 2 is provided with a welding hole 8 at the welding place between the inductance bar 2 and the ceramic capacitor ring 5 , so that the reliability of the welding of the inductance bar 2 and the ceramic capacitor ring 5 can be improved.
  • the sleeve hole 7 is an oblong hole, which can reduce the requirement of machining accuracy and facilitate the debugging of the lumped parameter non-reciprocal ferrite device.
  • the cavity 1 and the cover plate 12 are snap-connected so that repairing can be performed during the production process, which is beneficial to reduce waste of production resources and save production costs.
  • the cross section of 14 is semicircular.
  • the tin accommodating tank 14 with a semicircular cross-section has no dead ends, which is more convenient for the tin liquid to force out the air in the tin accommodating tank 14 .
  • the ferrule 3 is further provided with an exhaust slot 15 that communicates with the tin accommodating slot 14 , and the tin accommodating slot 14 and the exhaust slot 15 are respectively arranged around the ferrule 3 .
  • the exhaust groove 15 is located on the side of the tin container 14 away from the mounting table 9 .
  • the dielectric element 6 has three mounting platforms 9, two adjacent mounting platforms 9 are arranged at an interval of 120°, the ferrule 3 is arranged on the mounting platforms 9, and the cavity 1 is
  • the top has a hollow cylindrical casing with an opening, and the peripheral wall of the casing has three vertical slots 10 corresponding to the mounting table 9 .
  • the bottom surface of the inductance bar 2 is in contact with the dielectric member 6 .
  • the bottom surface of the inductance bar 2 is in contact with the top surface of the mounting table 9 .
  • the top surface of the mounting table 9 is provided with a communication groove 16 that communicates with the tin container 14
  • the inductance bar 2 is provided with a through hole 17 penetrating the top surface and the bottom surface of the inductance bar 2 .
  • the bottom end of the through hole 17 communicates with the communication groove 16 , and a part of the solder paste fills the communication groove 16 and the through hole 17 .
  • the communication groove 16 is annular.
  • the communication groove 16 may also be elongated or other shapes.
  • the tin containing grooves 14 are respectively tangent to the bottom surface of the communication groove 16 and the wall surface of the exhaust groove 15 .
  • the part of the solder paste in the through hole 17 is connected to the part of the solder paste located on the top surface of the inductor bar 2. It is easy to understand that at this time, the solidified solder paste has a ring-shaped cross-section.
  • the solidified solder paste includes four parts, the first part is located in the tin holding tank 14 (and the exhaust groove 15, In the sleeve hole 7), the second part is located on the top surface of the inductor bar 2, the third part is located in the communication groove 16, and the fourth part is located in the through hole 17, wherein the first part and the fourth part pass through the first part and the fourth part.
  • the three parts are connected.
  • the lumped-parameter non-reciprocal ferrite device is a lumped-parameter circulator
  • the ferrules 3 are respectively provided on the three mounting platforms 9 .
  • the two mounting platforms 9 are respectively provided with the ferrules 3 , and the other mounting platform is provided with the ferrule 3 .
  • 9 is provided with a load 11 that conducts with the inductance bar 2 .
  • the load 11 is welded with the inductance bar 2 .
  • solder is provided at the connection between the cavity 1 and the cover plate 12 .
  • the cavity 1 is provided with a clamping block
  • the cover plate 12 is provided with a clamping slot matched with the clamping block.
  • the cavity 1 is further provided with a magnet 13 , and the magnet 13 is located between the ferrite 4 and the cover plate 12 .
  • the lumped parameter non-reciprocal ferrite device provided by the present invention has a novel and simple structure, few parts, is convenient for processing and manufacturing, and is beneficial to control the production cost; it has good structural stability and good electrical performance;
  • the existing lumped parameter circulator and isolator, the overall outline of the lumped parameter non-reciprocal ferrite device cavity is designed to be cylindrical, so that the lumped parameter non-reciprocal ferrite device can be debugged by three-port rotation to improve debugging. efficiency, and the cylindrical cavity occupies a small area of the board.

Landscapes

  • Non-Reversible Transmitting Devices (AREA)

Abstract

一种集总参数非互易铁氧体器件，包括腔体（1）、盖板（12）、电感条（2）、插芯（3）及介质件（6），插芯（3）设于介质件（6）上，介质件（6）的一部分及电感条（2）分别设于腔体（1）内，腔体（1）呈圆柱形，盖板（12）与腔体（1）卡扣连接，插芯（3）呈柱状，电感条（2）上设有与插芯（3）相配合的套孔（7），插芯（3）与电感条（2）在套孔（7）处通过锡膏焊接，插芯（3）上设有用于容纳部分锡膏的容锡槽（14）。集总参数非互易铁氧体器件结构新颖简单、零部件少，便于加工制造、利于控制生产成本；结构稳定性好、电学性能佳；腔体（1）整体轮廓设计为圆柱形，使得三端口可旋转调试，调试效率高，占板面积少。

Description

一种集总参数非互易铁氧体器件 技术领域
本发明涉及射频微波铁氧体器件技术领域，尤其涉及一种集总参数非互易铁氧体器件。
 背景技术
射频微波带线环行器/隔离器是目前市场用量很大的一种微波铁氧体器件，它主要是利用垂直磁化的铁氧体与微波信号相作用下所表现出的非互易特性而设计出的一种微波器件，它的电气性能特点是射频微波信号只能在三个或多个端口之间单向传输。
集总参数环行器和集总参数隔离器是两种常见的集总参数非互易铁氧体器件，两者多可用于射频微波放大器级间隔离，是雷达系统和通讯系统不可或缺的组件。集总参数环行器、隔离器具有尺寸小、成本低的优点，在环行器、隔离器领域占有很大的市场，集总参数环行器一般由腔体、电感条、铁氧体、磁铁、电容及盖板组成，在其一端口加负载即可组成集总参数隔离器。
现有的集总参数环行器、隔离器具有较多的地电极及介质贴片，导致制造工艺复杂，生产成本高，且其输入输出电极与电感条的连接仅由贴片焊接实现，存在脱落风险，导致其结构稳定性偏低，另外，现有集总参数环行器、隔离器的结构难以保证电感条在腔体内居中对称装配。
 技术问题
本发明所要解决的技术问题是：提供一种结构稳定的集总参数非互易铁氧体器件。
 技术解决方案
为了解决上述技术问题，本发明采用的技术方案为：一种集总参数非互易铁氧体器件，包括腔体、盖板、电感条、插芯及介质件，插芯设于介质件上，介质件的一部分及电感条分别设于腔体内，所述腔体呈圆柱形，所述盖板与所述腔体卡扣连接，所述插芯呈柱状，所述电感条上设有与所述插芯相配合的套孔，所述插芯与所述电感条在所述套孔处通过锡膏焊接，所述插芯上设有用于容纳部分所述锡膏的容锡槽，所述电感条的底面抵触所述介质件。
 有益效果
本发明的有益效果在于：本集总参数非互易铁氧体器件结构新颖简单、零部件少，便于加工制造、利于控制生产成本；将电感条套孔卡在插芯上进行焊接，不仅可以提高电感条与插芯连接导通的稳固性，从而提高集总参数非互易铁氧体器件的结构稳定性，还可辅助电感条在腔体内居中对称装配，从而保证集总参数非互易铁氧体器件的电学性能。相比均为方形的现有集总参数环行器、隔离器，本集总参数非互易铁氧体器件腔体整体廓设计为圆柱形使得集总参数非互易铁氧体器件可三端口旋转调试以提高调试效率，且呈圆柱状的腔体占板面积小；容锡槽的存在不仅增大了锡膏与插芯的接触面积，而且还形成了一卡位结构，大大降低锡膏沿插芯轴向脱出的风险，利于确保套孔周围的电感条区域紧贴介质件，从而进一步提高集总参数非互易铁氧体器件的结构稳定性。
 附图说明
图1为本发明实施例的集总参数非互易铁氧体器件的整体结构的结构示意图（为环行器时）；
图2为本发明实施例的集总参数非互易铁氧体器件的爆炸图（为环行器时）；
图3为本发明实施例的集总参数非互易铁氧体器件中的电感条、铁氧体、陶瓷电容环、介质环及插芯配合的示意图（为环行器时）；
图4为本发明实施例的集总参数非互易铁氧体器件的整体结构的结构示意图（为隔离器时）。
图5为本发明实施例一的集总参数非互易铁氧体器件的局部结构的剖视图；
图6为本发明实施例一的另一种结构的集总参数非互易铁氧体器件的局部结构的剖视图；
图7为本发明实施例二的集总参数非互易铁氧体器件的局部结构的剖视图；
图8为本发明实施例三的集总参数非互易铁氧体器件的局部结构的剖视图；
标号说明：
1、腔体；2、电感条；3、插芯；4、铁氧体；5、陶瓷电容环；6、介质件；7、套孔；8、焊孔；9、安装台；10、竖直开槽；11、负载；12、盖板；13、磁铁；14、容锡槽；15、排气槽；16、连通槽；17、贯穿孔。
 本发明的实施方式
为详细说明本发明的技术内容、所实现目的及效果，以下结合实施方式并配合附图予以说明。
请参照图1至图8，一种集总参数非互易铁氧体器件，包括腔体1、盖板12、电感条2、插芯3及介质件6，插芯3设于介质件6上，介质件6的一部分及电感条2分别设于腔体1内，所述腔体1呈圆柱形，所述盖板12与所述腔体1卡扣连接，所述插芯3呈柱状，所述电感条2上设有与所述插芯3相配合的套孔7，所述插芯3与所述电感条2在所述套孔7处通过锡膏焊接，所述插芯上设有用于容纳部分所述锡膏的容锡槽14，所述电感条2的底面抵触所述介质件6。
从上述描述可知，本发明的有益效果在于：本集总参数非互易铁氧体器件结构新颖简单、零部件少，便于加工制造、利于控制生产成本；将电感条2套孔7卡在插芯3上进行焊接，不仅可以提高电感条2与插芯3连接导通的稳固性，从而提高集总参数非互易铁氧体器件的结构稳定性，还可辅助电感条2在腔体1内居中对称装配，从而保证集总参数非互易铁氧体器件的电学性能，容锡槽14的存在不仅增大了锡膏与插芯3的接触面积，而且还形成了一卡位结构，大大降低锡膏沿插芯3轴向脱出的风险，利于确保套孔7周围的电感条2区域紧贴介质件6，从而进一步提高集总参数非互易铁氧体器件的结构稳定性。
进一步的，所述介质件6具有三个安装台9，相邻的两个所述安装台9间隔120°设置，所述插芯3设于所述安装台9上。
进一步的，三个所述安装台9上分别设有所述插芯3。
由上述描述可知，此时集总参数非互易铁氧体器件为环行器。
进一步的，两个所述安装台9上分别设有所述插芯3，另一个所述安装台9上设有与所述电感条2导通的负载11。
由上述描述可知，此时集总参数非互易铁氧体器件为隔离器。
进一步的，所述插芯3上还设有连通所述容锡槽14的排气槽15，所述容锡槽14和所述排气槽15分别环绕所述插芯3设置，所述排气槽15位于所述容锡槽14远离所述安装台9的一侧。
由上述描述可知，在焊锡膏时，排气槽15能够让锡液顺利地将容锡槽14内的气体逼出，使得锡液能够更好地装填容锡槽14，从而避免锡膏凝固后容锡槽14内有气泡残存，利于提高锡膏与插芯3的结合力，进而提高集总参数非互易铁氧体器件的结构稳定性。
进一步的，所述安装台9的顶面设有连通所述容锡槽14的连通槽16，所述电感条2上设有贯穿所述电感条2的顶面与底面的贯穿孔17，所述贯穿孔17的底端连通所述连通槽16，所述锡膏的一部分填充所述连通槽16及所述贯穿孔17。
由上述描述可知，连通槽16不仅能够起到方便容锡槽14内气体排出的作用，且连通槽16由锡膏填充后，进一步提高了锡膏与电感条2之间的结合力，从而进一步提高集总参数非互易铁氧体器件的结构稳定性；而贯穿孔17内的锡膏不仅起到提高锡膏与电感条2的结合力的作用，而且还能够起到防止电感条2发生左右位移的作用，利于进一步提高集总参数非互易铁氧体器件的结构稳定性。
进一步的，所述容锡槽14的截面呈半圆状。
由上述描述可知，半圆状的容锡槽14能够让锡液更顺畅地将容锡槽14内的气体逼出，从而提高集总参数非互易铁氧体器件的结构稳定性。
进一步的，所述腔体1为顶部具有开口的中空结构的圆柱状壳体，所述壳体的周壁具有对应于所述安装台9设置的三个竖直开槽10。
由上述描述可知，腔体1整体轮廓设计为圆柱形使得集总参数非互易铁氧体器件可三端口旋转调试以提高调试效率。而且呈圆柱状的腔体1占板面积小，符合通信器材小型化的发展趋势。
进一步的，所述腔体1与所述盖板12的连接处设有焊锡。
由上述描述可知，集总参数非互易铁氧体器件在调试完成后可进行加锡紧固，提高盖板12与腔体1连接的可靠性。
进一步的，还包括铁氧体4和陶瓷电容环5，所述电感条2包裹所述铁氧体4，所述陶瓷电容环5围绕所述铁氧体4。
由上述描述可知，一体化陶瓷电容环5的结构设计简单，利于降低成本。
进一步的，所述电感条2与所述陶瓷电容环5焊接。
由上述描述可知，电感条2与陶瓷电容环5焊接不仅能够实现两者的并联，还能够进一步提高集总参数非互易铁氧体器件的结构稳定性。
进一步的，所述介质件6呈环状，所述陶瓷电容环5位于所述介质件6内。
实施例一
请参照图1至图6，本发明的实施例一为：请结合图1至图3，一种集总参数非互易铁氧体器件，其包括腔体1、盖板12、电感条2、插芯3、铁氧体4、陶瓷电容环5及介质件6，所述腔体1呈圆柱形，所述盖板12与所述腔体1卡扣连接，插芯3设于介质件6上，介质件6的一部分、电感条2及陶瓷电容环5分别设于腔体1内，所述电感条2包裹所述铁氧体4，所述陶瓷电容环5围绕所述铁氧体4，所述介质件6呈环状，所述陶瓷电容环5位于所述介质件6内，所述插芯3呈柱状，所述电感条2上设有与所述插芯3相配合的套孔7，所述插芯3与所述电感条2在所述套孔7处通过锡膏焊接，所述电感条2与所述陶瓷电容环5焊接，优选的，所述电感条2在其与所述陶瓷电容环5的焊接处设有焊孔8，如此可提高所述电感条2与所述陶瓷电容环5焊接的可靠性。可选的，所述套孔7为长圆孔，如此可降低加工精度要求，同时方便集总参数非互易铁氧体器件的调试工作。腔体1与盖板12卡扣连接使得生产过程中可进行返修处理，利于减少生产资源的浪费，节约生产成本。
如图5所示，为提高插芯3与电感条2焊接的稳定性，所述插芯3上设有用于容纳部分所述锡膏的容锡槽14，本实施例中，所述容锡槽14的截面呈矩形。
可选的，所述插芯3上还设有连通所述容锡槽14的排气槽15，所述容锡槽14和所述排气槽15分别环绕所述插芯3设置，所述排气槽15位于所述容锡槽14远离所述安装台9的一侧。本实施例中，所述排气槽15的截面呈三角形。优选的，所述排气槽15与所述容锡槽14连通后形成截面呈直角梯形的环槽。
优选的，所述介质件6具有三个安装台9，相邻的两个所述安装台9间隔120°设置，所述插芯3设于所述安装台9上，所述腔体1为顶部具有开口的中空结构的圆柱状壳体，所述壳体的周壁具有对应于所述安装台9设置的三个竖直开槽10。如此，不仅可以实现集总参数非互易铁氧体器件三端口旋转调试，提高调试效率，还能够减少集总参数非互易铁氧体器件的占板面积。
如图5所示，所述电感条2的底面抵触所述介质件6，具体的，所述电感条2的底面抵触所述安装台9的顶面。当然，如图6所示，所述电感条2的底面同时抵触所述容锡槽14的下壁面与所述安装台9的顶面也是可行的。
请结合图1至图3，当所述集总参数非互易铁氧体器件为集总参数环行器时，三个所述安装台9上分别设有所述插芯3。也就是说，此时集总参数非互易铁氧体器件可为5mm、7mm、10mm、12mm、14mm等尺寸参数的集总参数环行器。
如图4所示，当所述集总参数非互易铁氧体器件为集总参数隔离器时，两个所述安装台9上分别设有所述插芯3，另一个所述安装台9上设有与所述电感条2导通的负载11，可选的，所述负载11与所述电感条2焊接。也就是说，此时集总参数非互易铁氧体器件可为5mm、7mm、10mm、12mm、14mm等尺寸参数的集总参数隔离器。
进一步的，所述腔体1与所述盖板12的连接处设有焊锡。具体的，所述腔体1上设有卡块，所述盖板12上设有与所述卡块相配合的卡槽。
如图1所示，所述腔体1内还设有磁铁13，所述磁铁13位于所述铁氧体4与盖板12之间。
实施例二
请参照图1至图4和图7，本发明的实施例一为：请结合图1至图3，一种集总参数非互易铁氧体器件，其包括腔体1、盖板12、电感条2、插芯3、铁氧体4、陶瓷电容环5及介质件6，所述腔体1呈圆柱形，所述盖板12与所述腔体1卡扣连接，插芯3设于介质件6上，介质件6的一部分、电感条2及陶瓷电容环5分别设于腔体1内，所述电感条2包裹所述铁氧体4，所述陶瓷电容环5围绕所述铁氧体4，所述介质件6呈环状，所述陶瓷电容环5位于所述介质件6内，所述插芯3呈柱状，所述电感条2上设有与所述插芯3相配合的套孔7，所述插芯3与所述电感条2在所述套孔7处通过锡膏焊接，所述电感条2与所述陶瓷电容环5焊接，优选的，所述电感条2在其与所述陶瓷电容环5的焊接处设有焊孔8，如此可提高所述电感条2与所述陶瓷电容环5焊接的可靠性。可选的，所述套孔7为长圆孔，如此可降低加工精度要求，同时方便集总参数非互易铁氧体器件的调试工作。腔体1与盖板12卡扣连接使得生产过程中可进行返修处理，利于减少生产资源的浪费，节约生产成本。
如图7所示，提高插芯3与电感条2焊接的稳定性，所述插芯3上设有用于容纳部分所述锡膏的容锡槽14，本实施例中，所述容锡槽14的截面呈半圆状。截面呈半圆状的所述容锡槽14无死角，更便于锡液将容锡槽14内的空气逼出。
可选的，所述插芯3上还设有连通所述容锡槽14的排气槽15，所述容锡槽14和所述排气槽15分别环绕所述插芯3设置，所述排气槽15位于所述容锡槽14远离所述安装台9的一侧。
优选的，所述介质件6具有三个安装台9，相邻的两个所述安装台9间隔120°设置，所述插芯3设于所述安装台9上，所述腔体1为顶部具有开口的中空结构的圆柱状壳体，所述壳体的周壁具有对应于所述安装台9设置的三个竖直开槽10。如此，不仅可以实现集总参数非互易铁氧体器件三端口旋转调试，提高调试效率，还能够减少集总参数非互易铁氧体器件的占板面积。
如图7所示，所述电感条2的底面抵触所述介质件6，具体的，所述电感条2的底面抵触所述安装台9的顶面。为让容锡槽14内的气体更易排出，优选的，所述容锡槽14分别与所述安装台9的顶面及所述排气槽15的壁面相切。同时，由于所述容锡槽14与所述安装台9的顶面相切，因此，当电感条2上的套孔7套在插芯3上后，容锡槽14还能够协助电感条2找正，以使电感条2设置所述套孔7的端部的底面贴合在安装台9上。
请结合图1至图3，当所述集总参数非互易铁氧体器件为集总参数环行器时，三个所述安装台9上分别设有所述插芯3。
如图4所示，当所述集总参数非互易铁氧体器件为集总参数隔离器时，两个所述安装台9上分别设有所述插芯3，另一个所述安装台9上设有与所述电感条2导通的负载11，可选的，所述负载11与所述电感条2焊接。
进一步的，所述腔体1与所述盖板12的连接处设有焊锡。具体的，所述腔体1上设有卡块，所述盖板12上设有与所述卡块相配合的卡槽。
如图1所示，所述腔体1内还设有磁铁13，所述磁铁13位于所述铁氧体4与盖板12之间。
实施例三
请参照图1至图4和图8，本发明的实施例三为：请结合图1至图3，一种集总参数非互易铁氧体器件，其包括腔体1、盖板12、电感条2、插芯3、铁氧体4、陶瓷电容环5及介质件6，所述腔体1呈圆柱形，所述盖板12与所述腔体1卡扣连接，插芯3设于介质件6上，介质件6的一部分、电感条2及陶瓷电容环5分别设于腔体1内，所述电感条2包裹所述铁氧体4，所述陶瓷电容环5围绕所述铁氧体4，所述介质件6呈环状，所述陶瓷电容环5位于所述介质件6内，所述插芯3呈柱状，所述电感条2上设有与所述插芯3相配合的套孔7，所述插芯3与所述电感条2在所述套孔7处通过锡膏焊接，所述电感条2与所述陶瓷电容环5焊接，优选的，所述电感条2在其与所述陶瓷电容环5的焊接处设有焊孔8，如此可提高所述电感条2与所述陶瓷电容环5焊接的可靠性。可选的，所述套孔7为长圆孔，如此可降低加工精度要求，同时方便集总参数非互易铁氧体器件的调试工作。腔体1与盖板12卡扣连接使得生产过程中可进行返修处理，利于减少生产资源的浪费，节约生产成本。
如图8所示，提高插芯3与电感条2焊接的稳定性，所述插芯3上设有用于容纳部分所述锡膏的容锡槽14，本实施例中，所述容锡槽14的截面呈半圆状。截面呈半圆状的所述容锡槽14无死角，更便于锡液将容锡槽14内的空气逼出。
可选的，所述插芯3上还设有连通所述容锡槽14的排气槽15，所述容锡槽14和所述排气槽15分别环绕所述插芯3设置，所述排气槽15位于所述容锡槽14远离所述安装台9的一侧。
优选的，所述介质件6具有三个安装台9，相邻的两个所述安装台9间隔120°设置，所述插芯3设于所述安装台9上，所述腔体1为顶部具有开口的中空结构的圆柱状壳体，所述壳体的周壁具有对应于所述安装台9设置的三个竖直开槽10。如此，不仅可以实现集总参数非互易铁氧体器件三端口旋转调试，提高调试效率，还能够减少集总参数非互易铁氧体器件的占板面积。
如图8所示，所述电感条2的底面抵触所述介质件6，具体的，所述电感条2的底面抵触所述安装台9的顶面。进一步的，所述安装台9的顶面设有连通所述容锡槽14的连通槽16，所述电感条2上设有贯穿所述电感条2的顶面与底面的贯穿孔17，所述贯穿孔17的底端连通所述连通槽16，所述锡膏的一部分填充所述连通槽16及所述贯穿孔17。本实施例中，所述连通槽16呈圆环状，在其他实施例中，所述连通槽16还可以是呈长条状或其他形状的。优选的，所述容锡槽14分别与所述连通槽16的底面及所述排气槽15的壁面相切。
作为一种优选实施方式，所述贯穿孔17内的所述锡膏部分与位于电感条2的顶面上的锡膏部分相连，容易理解的，此时，凝固后的锡膏为截面呈环状的回转体，其中，电感条2的一部分包裹于所述回转体，具体来说，此时，凝固后的锡膏包括四个部分，第一部分位于容锡槽14（和排气槽15、套孔7）内、第二部分位于电感条2的顶面、第三部分位于连通槽16内、第四部分位于贯穿孔17内，其中所述第一部分与所述第四部分通过所述第三部分相连。这样的构造，能够在极大程度上提高集总参数非互易铁氧体器件的结构稳定性。
请结合图1至图3，当所述集总参数非互易铁氧体器件为集总参数环行器时，三个所述安装台9上分别设有所述插芯3。
如图4所示，当所述集总参数非互易铁氧体器件为集总参数隔离器时，两个所述安装台9上分别设有所述插芯3，另一个所述安装台9上设有与所述电感条2导通的负载11，可选的，所述负载11与所述电感条2焊接。
进一步的，所述腔体1与所述盖板12的连接处设有焊锡。具体的，所述腔体1上设有卡块，所述盖板12上设有与所述卡块相配合的卡槽。
如图1所示，所述腔体1内还设有磁铁13，所述磁铁13位于所述铁氧体4与盖板12之间。
综上所述，本发明提供的集总参数非互易铁氧体器件结构新颖简单、零部件少，便于加工制造、利于控制生产成本；结构稳定性好、电学性能佳；相比均为方形的现有集总参数环行器、隔离器，本集总参数非互易铁氧体器件腔体整体廓设计为圆柱形使得集总参数非互易铁氧体器件可三端口旋转调试以提高调试效率，且呈圆柱状的腔体占板面积小。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等同变换，或直接或间接运用在相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种集总参数非互易铁氧体器件，包括腔体、盖板、电感条、插芯及介质件，插芯设于介质件上，介质件的一部分及电感条分别设于腔体内，其特征在于：所述腔体呈圆柱形，所述盖板与所述腔体卡扣连接，所述插芯呈柱状，所述电感条上设有与所述插芯相配合的套孔，所述插芯与所述电感条在所述套孔处通过锡膏焊接，所述插芯上设有用于容纳部分所述锡膏的容锡槽，所述电感条的底面抵触所述介质件。
  2. 根据权利要求1所述的集总参数非互易铁氧体器件，其特征在于：所述介质件具有三个安装台，相邻的两个所述安装台间隔120°设置，所述插芯设于所述安装台上。
  3. 根据权利要求2所述的集总参数非互易铁氧体器件，其特征在于：三个所述安装台上分别设有所述插芯。
  4. 根据权利要求2所述的集总参数非互易铁氧体器件，其特征在于：两个所述安装台上分别设有所述插芯，另一个所述安装台上设有与所述电感条导通的负载。
  5. 根据权利要求2所述的集总参数非互易铁氧体器件，其特征在于：所述插芯上还设有连通所述容锡槽的排气槽，所述容锡槽和所述排气槽分别环绕所述插芯设置，所述排气槽位于所述容锡槽远离所述安装台的一侧。
  6. 根据权利要求5所述的集总参数非互易铁氧体器件，其特征在于：所述安装台的顶面设有连通所述容锡槽的连通槽，所述电感条上设有贯穿所述电感条的顶面与底面的贯穿孔，所述贯穿孔的底端连通所述连通槽，所述锡膏的一部分填充所述连通槽及所述贯穿孔。
  7. 根据权利要求5所述的集总参数非互易铁氧体器件，其特征在于：所述容锡槽的截面呈半圆状。
  8. 根据权利要求1所述的集总参数非互易铁氧体器件，其特征在于：还包括铁氧体和陶瓷电容环，所述电感条包裹所述铁氧体，所述陶瓷电容环围绕所述铁氧体。
  9. 根据权利要求8所述的集总参数非互易铁氧体器件，其特征在于：所述电感条与所述陶瓷电容环焊接。
  10. 根据权利要求9所述的集总参数非互易铁氧体器件，其特征在于：所述介质件呈环状，所述陶瓷电容环位于所述介质件内。
PCT/CN2020/140715 2020-12-29 2020-12-29 一种集总参数非互易铁氧体器件 WO2022141037A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/140715 WO2022141037A1 (zh) 2020-12-29 2020-12-29 一种集总参数非互易铁氧体器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/140715 WO2022141037A1 (zh) 2020-12-29 2020-12-29 一种集总参数非互易铁氧体器件

Publications (1)

Publication Number Publication Date
WO2022141037A1 true WO2022141037A1 (zh) 2022-07-07

Family

ID=82259936

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/140715 WO2022141037A1 (zh) 2020-12-29 2020-12-29 一种集总参数非互易铁氧体器件

Country Status (1)

Country Link
WO (1) WO2022141037A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6337607B1 (en) * 2000-05-12 2002-01-08 Renaissance Electronics Corporation Surface mountable low IMD ferrite isolator/circulator structure
CN101515663A (zh) * 2008-02-20 2009-08-26 株式会社Ntt都科摩 非可逆电路元件
CN209389191U (zh) * 2019-01-14 2019-09-13 深圳市华扬通信技术有限公司 一种微波环行器/隔离器
CN210224252U (zh) * 2019-08-30 2020-03-31 深圳市华扬通信技术有限公司 一体式插针组件及环行器/隔离器
CN210778914U (zh) * 2019-08-26 2020-06-16 中航富士达科技股份有限公司 一种中心导体及小型化环行器
CN111740196A (zh) * 2020-07-23 2020-10-02 北京航天微电科技有限公司 一种用于环形器的中心导体结构、环形器及其设计方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6337607B1 (en) * 2000-05-12 2002-01-08 Renaissance Electronics Corporation Surface mountable low IMD ferrite isolator/circulator structure
CN101515663A (zh) * 2008-02-20 2009-08-26 株式会社Ntt都科摩 非可逆电路元件
CN209389191U (zh) * 2019-01-14 2019-09-13 深圳市华扬通信技术有限公司 一种微波环行器/隔离器
CN210778914U (zh) * 2019-08-26 2020-06-16 中航富士达科技股份有限公司 一种中心导体及小型化环行器
CN210224252U (zh) * 2019-08-30 2020-03-31 深圳市华扬通信技术有限公司 一体式插针组件及环行器/隔离器
CN111740196A (zh) * 2020-07-23 2020-10-02 北京航天微电科技有限公司 一种用于环形器的中心导体结构、环形器及其设计方法

Similar Documents

Publication Publication Date Title
JP4640455B2 (ja) フェライト・磁石素子、非可逆回路素子及び複合電子部品
KR100856136B1 (ko) 비가역 회로소자
WO2022141037A1 (zh) 一种集总参数非互易铁氧体器件
CN112736388B (zh) 一种集总参数非互易铁氧体器件
KR100379060B1 (ko) 비가역 회로 소자 및 이를 사용한 통신 장치
CN113555655B (zh) 一种集总参数环行器
US6642831B2 (en) Nonreciprocal circuit device and communication device using same
JP2000114818A (ja) 集中定数型非可逆回路素子
JP4345254B2 (ja) 非可逆回路素子及び通信装置
JPH11239009A (ja) 非可逆回路素子の広帯域化構造
CN103022607A (zh) 一种表贴式超小型化隔离器
JP3072290B1 (ja) 非可逆回路素子
JP2001156503A (ja) 非可逆回路素子、非可逆回路および通信装置
US6670862B2 (en) Nonreciprocal circuit device and communication apparatus
KR100397727B1 (ko) 비가역 회로소자 및 이를 이용한 통신 장치
JP3417380B2 (ja) 非可逆回路素子および通信装置
JP3201279B2 (ja) 非可逆回路素子
JP3395748B2 (ja) 非可逆回路素子及び通信機装置
JP2001267810A (ja) 集中定数型非可逆回路素子
KR20010062014A (ko) 비가역 회로장치, 통신장치 및 비가역 회로장치의 제조방법
KR101378740B1 (ko) 집중정수형 소자가 적용된 분포소자형 공진기를 가지는 비가역 회로소자
JP4110688B2 (ja) 非可逆回路素子及び通信機装置
US20020158703A1 (en) Nonreciprocal circuit device and communication apparatus using same
JP3365057B2 (ja) 非可逆回路素子
KR20190101022A (ko) 비가역회로소자

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20967386

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20967386

Country of ref document: EP

Kind code of ref document: A1