WO2022137780A1 - 樹脂組成物および電力ケーブル - Google Patents

樹脂組成物および電力ケーブル Download PDF

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Publication number
WO2022137780A1
WO2022137780A1 PCT/JP2021/039406 JP2021039406W WO2022137780A1 WO 2022137780 A1 WO2022137780 A1 WO 2022137780A1 JP 2021039406 W JP2021039406 W JP 2021039406W WO 2022137780 A1 WO2022137780 A1 WO 2022137780A1
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Prior art keywords
resin
resistance
imparting agent
propylene
resin composition
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PCT/JP2021/039406
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English (en)
French (fr)
Japanese (ja)
Inventor
智 山▲崎▼
文俊 伊與田
孝則 山崎
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Priority to US18/035,744 priority Critical patent/US20230399500A1/en
Priority to DE112021006581.5T priority patent/DE112021006581T5/de
Priority to JP2022571911A priority patent/JP7666525B2/ja
Priority to CN202180070537.3A priority patent/CN116323781A/zh
Publication of WO2022137780A1 publication Critical patent/WO2022137780A1/ja
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Ethylene-propylene or ethylene-propylene-diene copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Definitions

  • This disclosure relates to resin compositions and power cables.
  • Cross-linked polyethylene has been widely used as a resin component constituting an insulating layer in power cables and the like because of its excellent insulating properties (for example, Patent Document 1).
  • the resistance-imparting agent is a monoma having a phenol skeleton and having hydrogen or an alkyl group having 1 to 3 carbon atoms bonded to at least one of the ortho positions of a hydroxyl group in the phenol skeleton, having a melting point of 145 ° C. or lower and a molecular weight. Is 200 or more and 500 or less, The content of the resistance-imparting agent is 0.4 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the resin component.
  • a resin composition is provided.
  • the insulating layer is formed of a resin composition and is formed from a resin composition.
  • the resin composition is Contains a resin component containing a propylene unit and a resistance-imparting agent,
  • the resistance-imparting agent is a monoma having a phenol skeleton and having hydrogen or an alkyl group having 1 to 3 carbon atoms bonded to at least one of the ortho positions of a hydroxyl group in the phenol skeleton, having a melting point of 145 ° C. or lower and a molecular weight. Is 200 or more and 500 or less,
  • the content of the resistance-imparting agent is 0.4 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the resin component. Power cables are provided.
  • FIG. 1 is a schematic cross-sectional view orthogonal to the axial direction of the power cable according to the embodiment of the present disclosure.
  • propylene-based resin a resin containing propylene
  • the propylene resin Even if the propylene resin is non-crosslinked, it can achieve high insulation. That is, both insulation and recyclability can be achieved at the same time. Further, by using a propylene-based resin, handleability, processability, and manufacturability can be improved.
  • the insulating property originally possessed by the propylene-based resin may not be obtained. Further, according to the study by the present inventors, it has been found that in the insulating layer containing a propylene resin, for example, when the power cable is bent and stress due to the bending is applied to the insulating layer, the insulating property is remarkably lowered. It was issued.
  • An object of the present disclosure is to provide a technique for improving the insulating property of an insulating layer containing a propylene resin and suppressing a decrease in the insulating property due to external stress.
  • propylene-based resin has a large amount of crystals and easily forms coarse crystals. Therefore, when the insulating layer is formed only of the propylene resin, the insulating layer tends to be hard. Therefore, when a propylene-based resin is used as the resin component constituting the insulating layer, it is necessary to mix a low-crystalline resin or the like to control the crystallinity of the propylene-based resin.
  • the insulating layer containing the propylene resin high insulating property may not be obtained due to fine voids, or the insulating property may be significantly deteriorated due to the generation of voids due to bending.
  • This additive is used as an antioxidant, has a phenolic skeleton, and is composed of hydrogen or an alkyl group having 1 to 3 carbon atoms bonded to at least one of the ortho positions of the hydroxyl group in the phenolic skeleton. It is a monoma having a molecular weight of 200 or more and 500 or less and a melting point lower than that of a propylene-based resin.
  • the monoma has been generally used as an antioxidant until now, but according to the study by the present inventors, it has a predetermined chemical structure, molecular weight and melting point, so that it has a fine void or a fine void in the insulating layer.
  • the voids formed by bending can be filled. Then, by filling the voids, it acts to alleviate a sudden change in resistance between the insulating layer and the voids, and as a result, it is possible to suppress a decrease in the insulating property due to the voids. That is, the monoma acts not only as an antioxidant but also as a resistance-imparting agent that imparts resistance to the deterioration of the insulating property due to voids to the insulating layer.
  • a resistance-imparting agent is embedded in fine voids existing in the insulating layer and voids formed by applying external stress to provide insulating properties. It was found that the deterioration of the insulating property due to bending can be suppressed while improving the above.
  • the resin composition according to one aspect of the present disclosure is Contains a resin component containing a propylene unit and a resistance-imparting agent
  • the resistance-imparting agent is a monoma having a phenol skeleton and having hydrogen or an alkyl group having 1 to 3 carbon atoms bonded to at least one of the ortho positions of a hydroxyl group in the phenol skeleton, having a melting point of 145 ° C. or lower and a molecular weight. Is 200 or more and 500 or less,
  • the content of the resistance-imparting agent is 0.4 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the resin component. According to this configuration, it is possible to improve the insulating property of the resin composition containing the propylene-based resin and suppress the deterioration of the insulating property due to bending.
  • the power cable according to another aspect of the present disclosure is With the conductor An insulating layer coated on the outer circumference of the conductor and Equipped with The insulating layer is formed of a resin composition and is formed from a resin composition.
  • the resin composition is Contains a resin component containing a propylene unit and a resistance-imparting agent,
  • the resistance-imparting agent is a monoma having a phenol skeleton and having hydrogen or an alkyl group having 1 to 3 carbon atoms bonded to at least one of the ortho positions of a hydroxyl group in the phenol skeleton, having a melting point of 145 ° C. or lower and a molecular weight.
  • the content of the resistance-imparting agent is 0.4 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the resin component. According to this configuration, it is possible to improve the insulating property of the insulating layer containing the propylene-based resin and suppress the deterioration of the insulating property due to bending.
  • the resin component contains at least one of ethylene units and styrene units. According to this configuration, excessive crystal growth of the propylene-based resin can be suppressed, and the formation of voids in the insulating layer can be suppressed.
  • the resistance-imparting agent has a linear carbon chain structure having 5 or more and 10 or less carbon atoms. According to this configuration, electrical stability can be imparted to the insulating layer.
  • the resistance-imparting agent contains a sulfur atom. According to this configuration, electrical stability can be imparted to the insulating layer.
  • the resistance-imparting agent has a melting point such that it becomes a liquid state at 27 ° C. According to this configuration, it is easy to fasten the resistance-imparting agent to a portion of the insulating layer that becomes a starting point of cracks and voids, and it is possible to more reliably fill the newly formed voids and the like with the resistance-imparting agent.
  • the resistance-imparting agent is a phenolic antioxidant. According to this configuration, the effect of the antioxidant can be imparted to the insulating layer.
  • the resin composition contains, as a propylene-based resin, a propylene homopolymer having a melting point of 160 ° C. or higher and 175 ° C. or lower and a heat of fusion of 100 J / g or higher and 120 J / g or lower.
  • the melting point of the resin composition is 158 ° C. or higher and 168 ° C. or lower, and the heat of fusion is 55 J / g or higher and 110 J / g or lower. According to this configuration, excessive crystal growth of the propylene-based resin can be suppressed in the insulating layer, and higher insulating properties can be obtained in the insulating layer.
  • the resin composition contains, as a propylene-based resin, a propylene random copolymer having a melting point of 140 ° C. or higher and 155 ° C. or lower and a melting heat amount of 90 J / g or higher and 105 J / g or lower.
  • the melting point of the resin composition is 140 ° C. or higher and 150 ° C. or lower, and the heat of fusion is 55 J / g or higher and 100 J / g or lower. According to this configuration, excessive crystal growth of the propylene-based resin can be suppressed in the insulating layer, and higher insulating properties can be obtained in the insulating layer.
  • the resin composition of the present embodiment is a material constituting the insulating layer 130 in the power cable 10 described later, and is, for example, a resin component containing a propylene unit, a resistance-imparting agent, and if necessary. , With other additives.
  • the resin composition of the present embodiment contains at least a propylene-based resin as a resin component, and when the resin composition is analyzed by a nuclear magnetic resonance (NMR) apparatus, at least propylene units are detected.
  • NMR nuclear magnetic resonance
  • the propylene-based resin is random polypropylene
  • propylene units and ethylene units are detected
  • propylene units are detected.
  • the resin component preferably contains at least one of a low crystalline resin and a styrene resin as a soft component that lowers the crystallinity of the propylene resin and enhances the flexibility of the insulating layer.
  • the resin component contains a low crystalline resin or a styrene resin
  • the monoma unit derived from these resins is detected by analyzing the resin composition by NMR.
  • ethylene propylene rubber (EPR) which will be described later
  • EPR ethylene propylene rubber
  • styrene-based resin the styrene unit derived from the styrene-based resin is detected.
  • the propylene-based resin is the base polymer of the resin composition and is the component having the highest content in the resin component.
  • a propylene homopolymer hereinafter, also referred to as homoPP
  • a propylene random copolymer hereinafter, also referred to as random PP
  • the random PP tends to have a low crystal content because it contains ethylene units, but it can suppress the formation of cracks and voids due to coarse crystallization in the insulating layer.
  • the random PP higher insulating properties than the homo PP can be obtained. Further, when an external stress such as bending is applied to the insulating layer, the formation of voids can be suppressed and the fluctuation of the insulating property before and after bending can be further reduced.
  • the steric regularity of the propylene-based resin is not particularly limited, but it is preferably isotactic. According to the isotactic propylene resin, when mixed with a low crystalline resin, it can be crystallized lower than that of syndiotactic or atactic, so that the brittleness of the insulating layer at low temperature is improved and the insulating property is improved. Can be improved.
  • the melting point and heat of fusion of the propylene resin are not particularly limited.
  • the melting point is preferably 160 ° C. or higher and 175 ° C. or lower, and the heat of fusion is preferably 100 J / g or higher and 120 J / g or lower.
  • the melting point is preferably 140 ° C. or higher and 155 ° C. or lower, and the heat of fusion is preferably 90 J / g or higher and 105 J / g or lower.
  • the low crystallinity resin is a component that controls the crystal growth (crystallinity) of the propylene-based resin to impart flexibility to the insulating layer.
  • the low crystallinity resin refers to a component having low crystallinity or amorphous, having no melting point, and having a melting point of 100 ° C. or less even if it has a melting point.
  • the heat of fusion of the low crystalline resin is, for example, 50 J / g or less, preferably 30 J / g or less.
  • the low crystalline resin may be a copolymer obtained by copolymerizing at least two of ethylene, propylene, butene, hexene and octene from the viewpoint of improving the controllability of crystal growth and the flexibility of the insulating layer.
  • the carbon-carbon double bond in the monoma unit constituting the low crystalline resin is preferably at the ⁇ -position, for example.
  • the low crystalline resin examples include ethylene propylene rubber (EPR: Ethylene Propyrene Rubber) and ultra-low density polyethylene (VLDPE: Very Low Density Poly Ethylene).
  • the ultra-low density polyethylene is, for example, polyethylene having a density of 0.91 g / cm 3 or less, preferably 0.855 g / cm 3 to 0.890 g / cm 3 .
  • a copolymer containing propylene is preferable from the viewpoint of compatibility with a propylene-based resin.
  • EPR is mentioned as a copolymer containing propylene.
  • the ethylene content of the EPR is, for example, preferably 20% by mass or more, preferably 40% by mass or more, and more preferably 55% by mass or more.
  • the ethylene content is less than 20% by mass, the compatibility of EPR with the propylene-based resin becomes excessively high. Therefore, the insulating layer can be made flexible even if the content of EPR in the insulating layer is reduced. However, the crystallization of the propylene-based resin cannot be sufficiently controlled, and the insulating property may be deteriorated.
  • by setting the ethylene content to 20% by mass or more, it is possible to prevent the EPR from becoming excessively compatible with the propylene-based resin.
  • the ethylene content indicates the mass ratio of ethylene units to the ethylene units constituting the EPR and the propylene units.
  • the low crystalline resin may be, for example, a copolymer containing no propylene.
  • the propylene-free copolymer for example, VLDPE is preferable from the viewpoint of easy availability.
  • VLDPE include PE composed of ethylene and 1-butene, PE composed of ethylene and 1-octene, and the like.
  • the copolymer containing no propylene as the low crystallinity resin complete compatibility can be suppressed while mixing a predetermined amount of the low crystallinity resin with the propylene resin. Therefore, by setting the content of such a copolymer to a predetermined amount or more, the crystallization of the propylene-based resin can be stably controlled.
  • the styrene-based resin is a styrene-based thermoplastic elastomer containing styrene as a hard segment and at least one such as ethylene, propylene, butylene, and isoprene as a soft segment. Similar to the low crystallinity resin, the styrene-based resin can be dispersed in the resin composition to control the crystal growth of the propylene-based resin. In particular, when the styrene resin is mixed with the propylene resin together with the low crystal resin, it is considered that the styrene resin is finely dispersed in the propylene resin starting from the low crystal resin to form a unique phase structure.
  • the styrene resin does not have a melting point and a calorific value for melting.
  • styrene resin examples include styrene butadiene styrene block copolymer (SBS), hydride styrene butadiene styrene block copolymer, styrene isoprene styrene copolymer (SIS), hydride styrene isoprene styrene copolymer, and hydrogenation.
  • SBS styrene butadiene styrene block copolymer
  • SIS styrene isoprene styrene copolymer
  • hydrogenation examples include styrene butadiene rubber, hydride styrene isoprene rubber, and styrene ethylene butylene olefin crystal block copolymer. Two or more of these may be used in combination.
  • hydrolysis here means that hydrogen is added to the double bond.
  • hydrogenated styrene-butadiene styrene block copolymer means a polymer obtained by adding hydrogen to the double bond of the styrene butadiene styrene block copolymer. No hydrogen was added to the double bond of the aromatic ring of styrene.
  • the "hydrogenated styrene butadiene styrene block copolymer” can be paraphrased as a styrene ethylene butylene styrene block copolymer (SEBS).
  • the styrene resin a resin having no double bond in the chemical structure excluding the benzene ring is preferable.
  • the resin component may be thermally deteriorated at the time of molding the resin composition, and the characteristics of the obtained molded product may be deteriorated.
  • the resistance to heat deterioration is high, so that the characteristics of the molded product can be maintained higher.
  • the styrene content of the styrene-based resin is not particularly limited, but is preferably 5% by mass or more and 35% by mass or less from the viewpoint of controlling the crystal growth of the propylene-based resin and softening the molded body.
  • the styrene content indicates the mass ratio of the styrene unit to the component units constituting the styrene resin.
  • the resistance-imparting agent is a component that embeds the voids existing in the insulating layer and suppresses the deterioration of the insulating property due to the voids.
  • the resistance-imparting agent also functions as an antioxidant, and can suppress deterioration of the resin composition during heating and mixing.
  • the resistance-imparting agent has a phenol skeleton, is composed of hydrogen or an alkyl group having 1 to 3 carbon atoms bonded to at least one of the ortho positions of the hydroxyl group in the phenol skeleton, and has a melting point higher than that of the resin component. It is also low and has a molecular weight of 200 or more and 500 or less.
  • the resistance-imparting agent is a phenolic antioxidant having the above chemical structure, melting point and molecular weight.
  • the resistance-imparting agent Since the resistance-imparting agent has a melting point of 145 ° C. or lower and tends to have a melting point lower than that of the resin component, it melts and becomes a liquid state when it is heated and mixed with the resin component. When the resin composition obtained by heating and mixing is formed into an insulating layer and cooled, the resin component first begins to solidify. At this time, the crystal growth of the propylene-based resin may proceed and fine voids may be generated. Since the resistance-imparting agent has a melting point lower than that of the resin component and exists in a liquid state at the stage when the resin component begins to solidify, it can move to the void and fill the void.
  • the molecular weight of the resistance-imparting agent is 200 or more, the volatilization of the resistance-imparting agent can be suppressed when the resin composition is heated and mixed, and the resistance-imparting agent can be stably embedded in the void. Further, since the molecular weight is 500 or less, the resistance-imparting agent can be suitably moved in the resin component, and aggregation of the resistance-imparting agent can be suppressed. As a result, the resistance-imparting agent can be uniformly dispersed in the resin composition, and the resistance-imparting agent can be stably embedded in the void.
  • the resistance-imparting agent since the resistance-imparting agent has an aromatic ring derived from the phenol skeleton, it is possible to embed voids and impart electrical stability to the insulating layer. Further, since the resistance-imparting agent has a polarity due to the phenol skeleton, when it is filled in the void, it can alleviate a sudden change in resistance with the insulating layer and maintain the insulating property. Moreover, the resistance-imparting agent has hydrogen or an alkyl group having 1 to 3 carbon atoms at at least one of the ortho positions of the hydroxyl groups constituting the phenol skeleton, and is a bulky substituent on at least one side of the ortho positions of the hydroxyl groups. Is not placed.
  • the resistance-imparting agent has less steric hindrance around the hydroxyl group.
  • a monoma in which a bulky substituent (t-butyl group, etc.) is arranged at the ortho position on both sides of the hydroxyl group, for example, a hindered phenolic antioxidant has a large steric hindrance around the hydroxyl group.
  • a hindered phenolic antioxidant has a large steric hindrance around the hydroxyl group.
  • the reactivity of the hydroxyl group may be inhibited due to steric hindrance, and the originally obtained characteristics may not be exhibited.
  • the resistance-imparting agent of the present embodiment since the steric hindrance is small and the reactivity of the hydroxyl group is high, the property of maintaining the insulating property can be stably exhibited.
  • the resistance-imparting agent can embed voids in the insulating layer and impart electrical stability to the insulating layer. Therefore, even in the case where fine voids are present in the insulating layer or voids are formed due to bending of the insulating layer, the deterioration of the insulating property due to the voids can be alleviated and maintained high.
  • the molecular weight of the resistance-imparting agent is 200 or more and 500 or less. From the viewpoint of suppressing the volatilization of the resistance-imparting agent and suppressing the aggregation of the resistance-imparting agent and dispersing it in the resin composition, the molecular weight of the resistance-imparting agent is preferably 300 or more and 450 or less.
  • the melting point of the resistance-imparting agent may be 145 ° C or lower, but preferably 130 ° C or lower. When the melting point is 130 ° C. or lower, the resistance-imparting agent can be more reliably filled in the voids generated in the insulating layer. Further, the melting point is preferably a temperature at which the resistance-imparting agent is in a liquid state at room temperature (27 ° C.), and more preferably 27 ° C. or lower. A resistance-imparting agent that is in a liquid state at 27 ° C. tends to accumulate in an insulating layer where the molecular chains that are the starting points of cracks and voids are sparse. Therefore, an external stress is applied to the insulating layer, and the resistance-imparting agent can be more reliably filled in the newly formed voids.
  • the lower limit is not particularly limited, but is preferably ⁇ 30 ° C. or higher.
  • the number of phenol skeletons is not particularly limited as long as the molecular weight of the resistance-imparting agent is in the range of 200 or more and 500 or less, but may be, for example, 1 or 2.
  • the resistance-imparting agent preferably has a linear carbon chain structure having 5 or more and 10 or less carbon atoms in the phenol skeleton from the viewpoint of enhancing compatibility with the resin component.
  • the number of linear carbon chain structures is not particularly limited as long as the molecular weight of the resistance-imparting agent is within the above range, but may be, for example, one or two. From the viewpoint of improving compatibility while satisfying the molecular weight range, the number of linear carbon chain structures is preferably two.
  • the linear carbon chain structure may be located at the other end of the ortho position of the hydroxyl group. This is because if at least one of the ortho-positions of the hydroxyl group has hydrogen or an alkyl group having 1 to 3 carbon atoms, the decrease in reactivity due to steric hindrance can be suppressed. Further, the linear carbon chain structure may be directly bonded to the aromatic ring, or may be bonded via another atom such as a sulfur atom or a nitrogen atom.
  • the resistance-imparting agent is a monoma containing a carbon atom, a hydrogen atom and an oxygen atom, and may contain a sulfur atom or a nitrogen atom in addition to this atom. It preferably contains a sulfur atom.
  • the resistance-imparting agent is not particularly limited as long as it satisfies the above-mentioned chemical structure, molecular weight and melting point.
  • 2,2'-Dihydroxy-4,4'-dimethoxybenzophenone 2,4-bis (octylthiomethyl) -6-methylphenol, nonylphenol, dinonylphenol and the like can be used.
  • the content of the resistance-imparting agent is 0.4 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the resin component. It is preferably 0.5 parts by mass or more and 8 parts by mass or less.
  • the content is 0.4 parts by mass or more, the resistance-imparting agent can be easily embedded in the void, so that the deterioration of the insulating property due to the void can be alleviated.
  • the amount of the resistance-imparting agent added is excessively large, it becomes difficult to mold the resin composition into the insulating layer, but by setting the amount to 10 parts by mass or less, the moldability of the resin composition can be ensured.
  • the resin composition may contain other additives, if necessary.
  • Other additives may include antioxidants, copper damage inhibitors, lubricants and colorants other than the above-mentioned resistance-imparting agents.
  • the resin composition preferably has a small content of an additive functioning as a nucleating agent for producing propylene crystals, and more preferably does not substantially contain such an additive.
  • the content of the additive functioning as a nucleating agent is preferably less than 1 part by mass, and is 0 part by mass, for example, when the total content of the resin components is 100 parts by mass. Is more preferable. As a result, it is possible to suppress the occurrence of unexpected abnormal crystallization caused by the nucleating agent and easily control the amount of crystallization.
  • the resin composition is preferably non-crosslinked without cross-linking, but may contain a cross-linking agent for cross-linking.
  • a cross-linking agent for cross-linking it is preferable to carry out the cross-linking so that the gel fraction (degree of cross-linking) is low.
  • the residue is, for example, cumyl alcohol, ⁇ -methylstyrene, or the like.
  • the melting point and the calorific value of melting of the resin composition vary depending on the contents of the propylene-based resin and the low crystallinity resin used as the resin component, and are indicators of the resin composition.
  • the melting point and heat of fusion of the resin composition are not particularly limited, but when random PP is contained as the propylene resin, the melting point is preferably 140 ° C. or higher and 150 ° C. or lower, and the heat of melting is preferably 55 J / g or higher and 100 J / g or lower. More preferably, the melting point is 140 ° C. or higher and 148 ° C.
  • the melting point is preferably 158 ° C. or higher and 168 ° C. or lower, and the heat of fusion is preferably 55 J / g or higher and 110 J / g or lower. More preferably, the melting point is 158 ° C. or higher and 165 ° C. or lower, and the heat of fusion is 55 J / g or higher and 100 J / g or lower.
  • the propylene-based resin and at least one of the low-crystalline resin and the styrene-based resin so as to have such a melting point and the amount of heat of melting By blending the propylene-based resin and at least one of the low-crystalline resin and the styrene-based resin so as to have such a melting point and the amount of heat of melting, excessive crystal growth of the propylene-based resin is suppressed, and each resin is used. The characteristics can be obtained.
  • the "melting point” and "heat of melting” referred to here are measured by differential scanning calorimetry (DSC).
  • DSC differential scanning calorimetry
  • the “differential scanning calorimetry” is performed, for example, in accordance with JIS-K-7121 (1987). Specifically, in the DSC apparatus, the temperature of the measurement sample is raised from room temperature (normal temperature, for example, 27 ° C.) to 220 ° C. at 10 ° C./min. Thereby, the DSC curve can be obtained by plotting the amount of heat absorption (heat flow) per unit time with respect to the temperature.
  • the temperature at which the amount of heat absorbed per unit time in the sample becomes the maximum (highest peak) is defined as the "melting point (melting peak temperature)".
  • the value (J) obtained by dividing the endothermic amount (J) of the sample from room temperature to 220 ° C. by the mass (g) of the entire resin component in the sample. / G) is defined as "heat of fusion”.
  • the crystallinity (%) of the sample can be obtained based on the theoretical value of the heat of fusion of the sample and the heat of fusion of the perfect crystal.
  • the content of each component contained in the resin composition is appropriately changed so that the melting point and the amount of heat of melting of the resin composition are within the above-mentioned ranges.
  • the resin composition contains 55 parts by mass or more and 95 parts by mass of the propylene-based resin when the total of the propylene-based resin and the soft component containing at least one of the low crystalline resin and the styrene-based resin is 100 parts by mass.
  • the soft component is contained in an amount of 5 parts by mass or more and 45 parts by mass or less.
  • the crystal amount in the resin composition can be adjusted within an appropriate range. As a result, when the insulating layer is formed of the resin composition, the formation of voids in the insulating layer can be suppressed.
  • the addition ratio of the low crystallinity resin and the styrene resin is not particularly limited, and the total addition amount may satisfy the above range.
  • FIG. 1 is a cross-sectional view orthogonal to the axial direction of the power cable according to the present embodiment.
  • the power cable 10 of this embodiment is configured as a so-called solid-state insulated power cable. Further, the power cable 10 of the present embodiment is configured to be laid, for example, on land (inside a pipeline), underwater, or at the bottom of the water. The power cable 10 is used for alternating current, for example.
  • the power cable 10 has, for example, a conductor 110, an inner semi-conductive layer 120, an insulating layer 130, an outer semi-conductive layer 140, a shielding layer 150, and a sheath 160.
  • the conductor 110 is configured by twisting a plurality of conductor core wires (conductive core wires) including, for example, pure copper, a copper alloy, aluminum, an aluminum alloy, or the like.
  • the internal semi-conductive layer 120 is provided so as to cover the outer periphery of the conductor 110. Further, the internal semi-conductive layer 120 has semi-conductivity and is configured to suppress electric field concentration on the surface side of the conductor 110.
  • the internal semi-conductive layer 120 is, for example, an ethylene-based copolymer such as an ethylene-ethyl acrylate copolymer, an ethylene-methyl acrylate copolymer, an ethylene-butyl acrylate copolymer, and an ethylene-vinyl acetate copolymer, or an olefin. It contains at least one of the above-mentioned low crystalline resins and the like, and conductive carbon black.
  • the insulating layer 130 is provided so as to cover the outer periphery of the internal semi-conductive layer 120, and is configured as the resin composition molded body described above.
  • the insulating layer 130 is extruded with a resin composition, for example, as described above.
  • the external semi-conductive layer 140 is provided so as to cover the outer periphery of the insulating layer 130. Further, the external semi-conductive layer 140 has semi-conductivity and is configured to suppress electric field concentration between the insulating layer 130 and the shielding layer 150.
  • the outer semi-conductive layer 140 is made of, for example, the same material as the inner semi-conductive layer 120.
  • the shielding layer 150 is provided so as to cover the outer periphery of the outer semi-conductive layer 140.
  • the shielding layer 150 is configured by, for example, winding a copper tape, or is configured as a wire shield in which a plurality of annealed copper wires or the like are wound.
  • a tape made of a rubberized cloth or the like may be wound around the inside or the outside of the shielding layer 150.
  • the sheath 160 is provided so as to cover the outer periphery of the shielding layer 150.
  • the sheath 160 is made of, for example, polyvinyl chloride or polyethylene.
  • the power cable 10 of the present embodiment is an underwater cable or a submersible cable, it may have a metal impermeable layer such as a so-called aluminum cover or iron wire armor on the outside of the shielding layer 150. good.
  • the power cable 10 of the present embodiment does not have to have the impermeable layer outside the shielding layer 150. That is, the power cable 10 of the present embodiment may be configured by a non-complete impermeable structure.
  • the specific dimensions of the power cable 10 are not particularly limited, but for example, the diameter of the conductor 110 is 5 mm or more and 60 mm or less, and the thickness of the internal semi-conductive layer 120 is 0.5 mm or more and 3 mm or less.
  • the thickness of the insulating layer 130 is 3 mm or more and 35 mm or less, the thickness of the external semi-conductive layer 140 is 0.5 mm or more and 3 mm or less, and the thickness of the shielding layer 150 is 0.1 mm or more and 5 mm or less.
  • the thickness of the sheath 160 is 1 mm or more.
  • the AC voltage applied to the power cable 10 of the present embodiment is, for example, 20 kV or more.
  • the following insulating properties can be obtained by configuring the insulating layer 130 (resin composition molded product) so as to contain the above-mentioned resistance-imparting agent.
  • the insulating layer 130 of the present embodiment can maintain high insulating properties even when an external stress is applied due to bending.
  • a sheet having a thickness of 0.4 mm formed from the above-mentioned resin composition is subjected to a 180 ° bending test described later, and the sheet to which an external stress is applied is subjected to a commercial frequency (for example, 60 Hz) at room temperature.
  • a commercial frequency for example, 60 Hz
  • the AC breakdown electric field strength is 45 kV / mm or more even if voids are confirmed. If no void is confirmed, the frequency will be 70 kV / mm or more.
  • the insulating layer 130 can maintain a high AC breaking electric field strength even when voids are formed due to external stress such as bending. That is, the AC fracture electric field strength of the insulating layer 130 has a small difference between the state before the external stress such as bending is applied and the state after the external stress such as bending is applied. Specifically, the volatility of the AC breakdown electric field strength due to bending is 30% or less.
  • the fluctuation rate of the AC breaking electric field strength is a ratio indicating the difference between the AC breaking electric field strength before and after bending with respect to the AC breaking electric field strength in the normal state before bending.
  • a propylene-based resin a soft component containing at least one of a low-crystalline resin and a styrene-based resin, a resistance-imparting agent, and, if necessary, other additives are mixed.
  • the mixer include an open roll, a Banbury mixer, a pressurized kneader, a single-screw mixer, a multi-screw mixer and the like.
  • the amount of each resin added is propylene-based, for example, when the total content of the propylene-based resin and the soft component containing at least one of the low crystalline resin and the styrene-based resin is 100 parts by mass.
  • the resin may be 55 parts by mass or more and 95 parts by mass or less, and the soft component may be 5 parts by mass or more and 45 parts by mass or less.
  • the content of the resistance-imparting agent shall be 0.4 parts by mass or more and 10 parts by mass or less when the total content of the propylene resin and the low crystalline resin is 100 parts by mass.
  • granulate the mixed material with an extruder After forming the mixed material, granulate the mixed material with an extruder. As a result, a pellet-shaped resin composition that constitutes the insulating layer 130 is formed.
  • a twin-screw extruder having a high kneading action may be used to collectively perform the steps from mixing to granulation.
  • the insulating layer 130 is formed by using the above-mentioned resin composition so as to cover the outer periphery of the conductor 110 with a thickness of 3 mm or more.
  • the internal semi-conductive layer 120, the insulating layer 130, and the outer semi-conductive layer 140 are simultaneously formed by using a three-layer simultaneous extruder.
  • the composition for the internal semi-conductive layer is put into the extruder A that forms the internal semi-conductive layer 120.
  • the pellet-shaped resin composition described above is put into the extruder B that forms the insulating layer 130.
  • the set temperature of the extruder B is set to a temperature higher than the desired melting point by a temperature of 10 ° C. or higher and 50 ° C. or lower. It is preferable to adjust the set temperature appropriately based on the linear velocity and the extrusion pressure.
  • composition for the external semi-conductive layer containing the same material as the resin composition for the internal semi-conductive layer charged into the extruder A is charged into the extruder C for forming the external semi-conductive layer 140.
  • each extruded product from the extruders A to C is guided to the common head, and the internal semi-conductive layer 120, the insulating layer 130, and the outer semi-conductive layer 140 are simultaneously formed on the outer periphery of the conductor 110 from the inside to the outside. Extrude. As a result, an extruded material to be a cable core is formed.
  • the extruded material is cooled with, for example, water.
  • the resin component containing the propylene-based resin begins to solidify.
  • the resistance-imparting agent having a melting point lower than that of the resin component exists in a molten liquid state, it moves to a fine void formed during solidification and is embedded.
  • a cable core composed of a conductor 110, an inner semi-conductive layer 120, an insulating layer 130, and an outer semi-conductive layer 140 is formed.
  • the shielding layer 150 is formed on the outside of the outer semi-conductive layer 140, for example, by winding a copper tape.
  • the power cable 10 as a solid-state insulated power cable is manufactured.
  • the insulating layer of the present embodiment contains a resin component containing a propylene-based resin, at least one of a low crystalline resin and a styrene-based resin, and a resistance-imparting agent having a predetermined molecular weight, melting point, and chemical structure. It is formed from a resin composition containing 0.4 parts by mass to 10 parts by mass with respect to 100 parts by mass of the resin component. According to the low crystallinity resin and the styrene resin, excessive crystal growth of the propylene resin can be suppressed.
  • the resistance-imparting agent it is possible to suppress a sudden change in resistance between the resin component and the void by entering the void existing in the resin composition, for example, a fine void that cannot be observed. Therefore, high insulation can be obtained in the insulating layer.
  • the insulating layer may be bent to form a void, the resistance-imparting agent embeds the void, so that the deterioration of the insulating property due to the void formation can be suppressed.
  • the insulating property before the external stress is applied can be improved, and the difference in the AC fracture electric field strength before and after the external stress due to bending is kept small. It is possible to suppress fluctuations in insulation before and after bending.
  • the melting point of the resistance-imparting agent is preferably 130 ° C. or lower, and more preferably the melting point of the resistance-imparting agent so that it becomes a liquid state at 27 ° C. According to the resistance-imparting agent having such a melting point, it can be reliably embedded by the void formed of the propylene-based resin, and the fluctuation of the insulating property before and after bending in the insulating layer can be further suppressed.
  • the resistance-imparting agent preferably has a linear carbon chain structure having 5 or more and 10 or less carbon atoms. Further, the resistance-imparting agent preferably contains a sulfur atom. According to such a resistance-imparting agent, since it is excellent in compatibility with the resin component, it is possible to stably embed the void in the insulating layer and to impart electrical stability to the insulating layer. As a result, it is possible to improve the insulating property in the initial state of the insulating layer and further suppress the fluctuation of the insulating property before and after bending.
  • random PP since random PP has a smaller amount of crystals than homo PP, cracks and voids are less likely to occur in the insulating layer, and new voids are less likely to be formed when the insulating layer is bent.
  • the original insulating property of random PP cannot be obtained due to the presence of fine voids that cannot be observed.
  • fine voids can be filled and the deterioration of the insulating property due to the voids can be suppressed.
  • the resin composition preferably contains random PP and a styrene resin, or a random PP, a low crystallinity resin and a styrene resin.
  • the resin composition comprises random PP as a propylene-based resin and a soft component such as a low-crystalline resin or a styrene-based resin, and the melting point of the resin composition is 140 ° C. or higher and 150 ° C. or lower, and the heat of fusion is 55 J / g. It is preferable to include it in a ratio of 100 J / g or less.
  • the resin composition comprises homo-PP as a propylene-based resin and a soft component such as a low-crystalline resin or a styrene-based resin, and the melting point of the resin composition is 158 ° C. or higher and 168 ° C. or lower, and the heat of fusion is 55 J / g or higher.
  • each component in a ratio of 110 J / g or less.
  • a ratio of 110 J / g or less By containing each component in a ratio such that the heat of fusion and the melting point of the resin composition are within the above ranges, excessive crystal growth of the propylene-based resin is suppressed in the insulating layer, and higher insulating properties are obtained in the insulating layer. Can be done.
  • the resin composition preferably contains a propylene-based resin, a low crystallinity resin, and a styrene-based resin as resin components. This makes it possible to further control the crystal growth of the propylene-based resin as compared with the case where only the low crystalline resin or the styrene-based resin is added, and the number of voids can be reduced or the size of the voids can be reduced. can do. In addition, the formation of voids due to bending of the insulating layer can be further suppressed. Moreover, by adding the resistance-imparting agent to the resin composition, the resistance-imparting agent can be embedded in fine voids to improve the insulating property.
  • the decrease in insulating property due to the formation of voids can be alleviated, so that the amount of the styrene-based resin that suppresses the formation of voids can be reduced.
  • the power cable 10 may have a simple impermeable layer.
  • the simple impermeable layer is made of, for example, a metal laminated tape.
  • the metal laminated tape has, for example, a metal layer made of aluminum, copper, or the like, and an adhesive layer provided on one side or both sides of the metal layer.
  • the metal laminated tape is, for example, wound by vertical attachment so as to surround the outer circumference of the cable core (outer circumference than the outer semiconducting layer).
  • the water-impervious layer may be provided outside the shielding layer, or may also serve as a shielding layer. With such a configuration, the cost of the power cable 10 can be reduced.
  • the power cable 10 may be configured as a so-called overhead electric wire (overhead insulated electric wire).
  • three layers are simultaneously extruded in the cable core forming step S300, but one layer may be extruded one by one.
  • propylene-based resin (A).
  • Isotactic propylene homopolymer (homo PP): melt flow rate: 0.5 g / 10 min, density: 0.9 g / ml, melting point: 165 ° C., heat of fusion: 115 J / g -Random polypropylene (random PP): melt flow rate: 1.3 g / 10 min, density: 0.9 g / ml, melting point: 145 ° C., heat of fusion: 100 J / g
  • Ethylene propylene rubber ethylene content: 52% by mass, Mooney viscosity ML (1 + 4) 100 ° C: 40, melting point: none, heat of fusion: none
  • styrene resin C
  • SEBS thermoplastic elastoma
  • the number of phenols indicates the number of phenol skeletons in the compound, and the case of 0 is indicated by "-".
  • the area around the hydroxyl group indicates the presence or absence of steric hindrance at the hydroxyl group, "-" when the steric hindrance is small, “single hindered” when the bulky substituent is on one side of the ortho position of the hydroxyl group, and both sides of the ortho position.
  • the case is referred to as "hindered”.
  • the resistance-imparting agent (d6) and the resistance-imparting agent (d'9) are liquid at room temperature (27 ° C.), the boiling points (bp) are indicated.
  • Samples 1 to 6 In Sample 1, as shown in Table 2, 75 parts by mass of the isotactic propylene homopolymer (homo PP) as the polypropylene resin (A) and 25 parts of ethylene propylene rubber (EPR) as the low crystalline resin (B). A resin composition was prepared by mixing 6 parts by mass and 6 parts by mass of the component (d1) shown in Table 1 as the resistance-imparting agent (D) and heating and mixing at 220 ° C. using a kneader. Further, in Sample 2, a resin composition was prepared in the same manner as in Sample 1 except that the resistance-imparting agent (D) was not added. In Samples 3 to 6, a resin composition was prepared in the same manner as in Sample 1, except that the amount of the component (d1) added was changed to 0.3 parts by mass, 0.5 parts by mass, 9 parts by mass, and 12 parts by mass, respectively. did.
  • the amount of the component (d1) added was changed to 0.3 parts by mass, 0.5 parts by mass, 9 parts by mass
  • Samples 15 to 17 In Samples 15 and 16, as shown in Table 5, the type of the propylene-based resin (A) was changed from homo-PP to random polypropylene (random PP), and the amount of each component added was changed. A resin composition was prepared in the same manner. In Sample 17, a resin composition was prepared in the same manner as in Samples 15 and 16, except that the resistance-imparting agent (D) was not added.
  • Samples 18 to 20 In Samples 18 and 19, as shown in Table 5, a resin composition was prepared in the same manner as in Sample 15, except that the styrene resin (C) was further added as a resin component and the amount of each component added was appropriately changed. did. In Sample 20, a resin composition was prepared in the same manner as in Samples 18 and 19, except that the resistance-imparting agent (D) was not added.
  • Examples 21 to 30 In the samples 21 to 30, as shown in Tables 6 and 7, the components (d'1) to (d'10) are used as the comparative component (D') instead of the resistance-imparting agent (D), and the components thereof are used.
  • a resin composition was prepared in the same manner as in Sample 1 except that the addition amount was appropriately changed.
  • the melting point of each evaluation sample was determined by DSC measurement. DSC measurement was performed according to JIS-K-7121 (1987). Specifically, as the DSC device, a DSC8500 (input compensation type) manufactured by PerkinElmer Co., Ltd. was used. The reference sample was, for example, ⁇ -alumina. The mass of the evaluation sample was 8 to 10 g. In the DSC apparatus, the temperature was raised from room temperature (27 ° C.) to 220 ° C. at 10 ° C./min. As a result, a DSC curve was obtained by plotting the amount of heat absorbed (heat flow) per unit time with respect to temperature.
  • the temperature at which the amount of heat absorbed per unit time in each evaluation sample became the maximum (highest peak) was defined as the "melting point”.
  • the "heat of melting” was obtained by obtaining the area of the region surrounded by the melting peak and the baseline in the DSC curve.
  • AC breakdown electric field strength Regarding the insulation of the prepared evaluation sample, the AC breakdown electric field strength was measured.
  • the AC breakdown electric field strength was determined by the AC breakdown test. Specifically, at room temperature (27 ° C.), an AC voltage of a commercial frequency (for example, 60 Hz) is applied to the evaluation sample at 10 kV for 10 minutes, then boosted every 1 kV and applied for 10 minutes repeatedly. Applied below. The electric field strength when the evaluation sample had dielectric breakdown was measured. In this example, the AC breaking electric field strengths of the evaluation samples before and after the bending test, which will be described later, were measured.
  • a commercial frequency for example, 60 Hz
  • the samples 1, 4 and 5 in which the amount of the resistance-imparting agent (D) added was 0.4 parts by mass to 10 parts by mass are the samples 2 and the addition of the resistance-imparting agent (D) not added. It was confirmed that the AC breakdown electric field strength before the bending test was higher and the insulating property was excellent as compared with the sample 3 having an amount of 0.3 parts by mass. Moreover, when a bending test was performed on each sample, it was confirmed that voids having a size exceeding 10 ⁇ m were formed in each sample. Further, in Samples 2 and 3, the AC breaking electric field strength before the bending test was low, and the AC breaking electric field strength was significantly lowered before and after the bending test.
  • the types of the resistance-imparting agent (D) were changed as appropriate, but all of them had high insulation in the initial state and voids were formed by bending. It was confirmed that the deterioration of the insulating property due to the void can be alleviated and the insulating property can be maintained high. Further, according to the sample 10, it was confirmed that the AC breaking electric field strength in the initial state was higher and the fluctuation of the AC breaking electric field strength due to bending was smaller than that of the other samples. From this, it was confirmed that the resistance-imparting agent (D) preferably has a sulfur atom or a linear carbon chain structure having 5 or more and 10 or less carbon atoms in the chemical structure.
  • the comparative component (D) having a molecular weight outside the range of 200 to 500, having no phenol skeleton, causing steric hindrance around the hydroxyl group, or having a melting point higher than that of the resin component (D). Since ⁇ ) was used, it was confirmed that the insulating property before the bending test was low and the insulating property was significantly lowered before and after the bending test. This is because the comparative component (D') could not be sufficiently embedded in the void, or even if the comparative component (D') was embedded in the void, the comparative component (D') could not sufficiently mitigate the sudden resistance change with the insulating layer. it is conceivable that.
  • the reason why the comparative component (D') was not sufficiently embedded in the void was that the comparative component (D') volatilized during heating and mixing due to its excessively small molecular weight, and was heated due to its excessively large molecular weight. It is presumed that they could not be dispersed in the resin composition during mixing, or could not be sufficiently melted during heating and mixing because the melting point was higher than that of the resin component. Further, as a factor that the comparative component (D') cannot alleviate a sudden resistance change with the insulating layer, the comparative component (D') does not have a phenol skeleton that contributes to electrical stability, or has steric hindrance. It is presumed that the reactivity of the hydroxyl group is low by having.
  • the insulating property in the initial state of the insulating layer can be improved and the insulating property in the initial state can be improved. It was confirmed that the deterioration of the insulating property before and after bending can be suppressed.
  • (Appendix 1) Contains a resin component containing a propylene unit and a resistance-imparting agent
  • the resistance-imparting agent is a monoma having a phenol skeleton and having hydrogen or an alkyl group having 1 to 3 carbon atoms bonded to at least one of the ortho positions of a hydroxyl group in the phenol skeleton, having a melting point of 145 ° C. or lower and a molecular weight. Is 200 or more and 500 or less, The content of the resistance-imparting agent is 0.4 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the resin component. Resin composition.
  • the insulating layer is formed of a resin composition and is formed from a resin composition.
  • the resin composition is Contains a resin component containing a propylene unit and a resistance-imparting agent,
  • the resistance-imparting agent is a monoma having a phenol skeleton and having hydrogen or an alkyl group having 1 to 3 carbon atoms bonded to at least one of the ortho positions of a hydroxyl group in the phenol skeleton, having a melting point of 145 ° C. or lower and a molecular weight. Is 200 or more and 500 or less,
  • the content of the resistance-imparting agent is 0.4 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the resin component. Power cable.
  • Appendix 3 The power cable according to Appendix 2, wherein the resin component further contains at least one of an ethylene unit and a styrene unit.
  • the resistance-imparting agent has a melting point such that it becomes liquid at 27 ° C.
  • the resistance-imparting agent has a linear carbon chain structure having 5 or more and 10 or less carbon atoms.
  • the power cable according to any one of Supplementary note 2 to Supplementary note 4.
  • the resistance-imparting agent contains a sulfur atom.
  • the power cable according to any one of Supplementary note 2 to Supplementary note 5.
  • the resistance-imparting agent is a phenolic antioxidant.
  • the power cable according to any one of Supplementary note 2 to Supplementary note 6.
  • the resin composition contains, as a propylene-based resin, a propylene homopolymer having a melting point of 160 ° C. or higher and 175 ° C. or lower and a heat of fusion of 100 J / g or higher and 120 J / g or lower.
  • the melting point of the resin composition is 158 ° C. or higher and 168 ° C. or lower, and the heat of fusion is 55 J / g or higher and 110 J / g or lower.
  • the power cable according to any one of Supplementary note 2 to Supplementary note 7.
  • the resin composition contains, as a propylene-based resin, a propylene random copolymer having a melting point of 140 ° C. or higher and 155 ° C. or lower and a melting heat amount of 90 J / g or higher and 105 J / g or lower.
  • the melting point of the resin composition is 140 ° C. or higher and 150 ° C. or lower, and the heat of fusion is 55 J / g or higher and 100 J / g or lower.
  • the power cable according to any one of Supplementary note 2 to Supplementary note 7.
  • a step of coating an insulating layer around a conductor using the resin composition is provided.
  • the resistance-imparting agent is a monoma having a phenol skeleton and having hydrogen or an alkyl group having 1 to 3 carbon atoms bonded to at least one of the ortho positions of a hydroxyl group in the phenol skeleton, having a melting point of 145 ° C. or lower and a molecular weight.
  • the resistance-imparting agent is added in an amount of 0.4 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the resin component containing the propylene-based resin and the soft component. How to make a power cable.
  • the propylene-based resin is a propylene homopolymer having a melting point of 160 ° C. or higher and 175 ° C. or lower and a heat of fusion of 100 J / g or higher and 120 J / g or lower.
  • the propylene-based resin and the flexible component are mixed so that the melting point of the resin composition is 158 ° C. or higher and 168 ° C. or lower and the heat of fusion is 55 J / g or higher and 110 J / g or lower.
  • the method for manufacturing a power cable according to Appendix 10 or Appendix 11.
  • the propylene-based resin is a propylene random copolymer having a melting point of 140 ° C. or higher and 155 ° C. or lower and a heat of fusion of 90 J / g or higher and 105 J / g or lower.
  • the propylene-based resin and the flexible component are mixed so that the melting point of the resin composition is 140 ° C. or higher and 150 ° C. or lower and the heat of melting is 55 J / g or higher and 100 J / g or lower.

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