WO2022131359A2 - 導電性粒子、ソケット、導電材料及び接続構造体 - Google Patents

導電性粒子、ソケット、導電材料及び接続構造体 Download PDF

Info

Publication number
WO2022131359A2
WO2022131359A2 PCT/JP2021/046708 JP2021046708W WO2022131359A2 WO 2022131359 A2 WO2022131359 A2 WO 2022131359A2 JP 2021046708 W JP2021046708 W JP 2021046708W WO 2022131359 A2 WO2022131359 A2 WO 2022131359A2
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
conductive particles
particles
particle
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/046708
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
理 杉本
悠人 土橋
良 栗浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2021577501A priority Critical patent/JP7733583B2/ja
Publication of WO2022131359A2 publication Critical patent/WO2022131359A2/ja
Anticipated expiration legal-status Critical
Priority to JP2025138973A priority patent/JP2025161917A/ja
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Definitions

  • the conductive particles according to the present invention have the above-mentioned structure, high connection reliability can be maintained even if they are compressed for a long period of time.
  • the particle size of the conductive particles is preferably 100 ⁇ m or more, more preferably 150 ⁇ m or more, still more preferably 300 ⁇ m or more, preferably 1000 ⁇ m or less, more preferably 800 ⁇ m or less, still more preferably 700 ⁇ m or less.
  • the particle size of the conductive particles is not less than the above lower limit and not more than the above upper limit, the effect of the present invention can be exhibited even more effectively.
  • conductive particles can be suitably used to obtain sockets or connectors.
  • the material of the base particle may be an organic material or an inorganic material.
  • Examples of the base particles formed only of the organic material include resin particles and the like.
  • Examples of the base particle formed only of the above-mentioned inorganic material include inorganic particles excluding metal.
  • Examples of the base particle formed by both the organic material and the inorganic material include organic-inorganic hybrid particles and the like. From the viewpoint of improving both the flexibility and the compression characteristics of the base particles, the base particles are preferably resin particles or organic-inorganic hybrid particles, and more preferably resin particles.
  • Formaldehyde resin benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polyethylene terephthalate, polysulfone, polyphenylene oxide, polyacetal, polyimide, polyamideimide, Examples thereof include a polyether ether ketone, a polyether sulfone, and a divinylbenzene polymer.
  • the vinylbenzene polymer may be a divinylbenzene copolymer.
  • the divinylbenzene copolymer examples include a divinylbenzene-styrene copolymer and a divinylbenzene- (meth) acrylic acid ester copolymer. Since the compression characteristics of the base material particles can be easily controlled within a suitable range, the material of the base material particles is a polymer obtained by polymerizing one or more kinds of polymerizable monomers having an ethylenically unsaturated group. Is preferable.
  • non-crosslinkable monomer examples include styrene monomers such as styrene, ⁇ -methylstyrene, and chlorstyrene; vinyl ether compounds such as methylvinyl ether, ethylvinyl ether, and propylvinyl ether; vinyl acetate, vinyl butyrate, and the like. Acid vinyl ester compounds such as vinyl laurate and vinyl stearate; halogen-containing monomers such as vinyl chloride and vinyl fluoride; as (meth) acrylic compounds, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth).
  • Examples of the socket include a CPU socket, an IC socket, a DIP socket, a PGA socket, a SiP socket, an LGA socket, a CSP socket, a QFN, a QFP socket, a SOP socket, and a BGA socket.
  • the DIP socket, PGA socket, SiP socket, LGA socket, CSP socket, QFN, QFP socket, SOP socket, and BGA socket may each be a part of the IC socket.
  • Examples of the connector include an FPC connector, a board-to-board connector, a narrow pitch connector, a DIN connector, a compression connector, a one-piece connector, a card edge connector and the like.
  • the conductive particles are dispersed in a binder and used as a conductive material.
  • the conductive material includes the conductive particles and a binder.
  • the conductive particles are preferably dispersed in a binder and used, and preferably dispersed in a binder and used as a conductive material.
  • the conductive material is preferably used for electrical connection between electrodes. Since the above-mentioned conductive particles are used in the above-mentioned conductive material, the connection resistance between the electrodes can be lowered more effectively, and the occurrence of aggregation between the conductive particles can be further effectively suppressed. be able to. Since the above-mentioned conductive particles are used in the above-mentioned conductive material, the occurrence of connection failure can be suppressed more effectively.
  • the viscosity ( ⁇ 25) can be measured at 25 ° C. and 5 rpm using, for example, an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.).
  • the electrodes provided on the first and second connection target members include metal electrodes such as gold electrodes, nickel electrodes, tin electrodes, aluminum electrodes, copper electrodes, molybdenum electrodes, silver electrodes, SUS electrodes, and tungsten electrodes. Can be mentioned.
  • the electrode When the electrode is an aluminum electrode, it may be an electrode formed only of aluminum, or an electrode in which an aluminum layer is laminated on the surface of a metal oxide layer. Examples of the material of the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al and Ga.
  • connection structure (a connection structure having the structure shown in FIG. 4) was produced as follows.

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2021/046708 2020-12-17 2021-12-17 導電性粒子、ソケット、導電材料及び接続構造体 Ceased WO2022131359A2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021577501A JP7733583B2 (ja) 2020-12-17 2021-12-17 導電性粒子、ソケット、導電材料及び接続構造体
JP2025138973A JP2025161917A (ja) 2020-12-17 2025-08-22 導電性粒子、ソケット、導電材料及び接続構造体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020209444 2020-12-17
JP2020-209444 2020-12-17

Publications (1)

Publication Number Publication Date
WO2022131359A2 true WO2022131359A2 (ja) 2022-06-23

Family

ID=82060133

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/046708 Ceased WO2022131359A2 (ja) 2020-12-17 2021-12-17 導電性粒子、ソケット、導電材料及び接続構造体

Country Status (3)

Country Link
JP (2) JP7733583B2 (https=)
TW (1) TW202236310A (https=)
WO (1) WO2022131359A2 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000309715A (ja) * 1999-04-26 2000-11-07 Sekisui Chem Co Ltd 重合体微粒子及び導電性微粒子
JP2001216840A (ja) * 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2001216841A (ja) * 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP4527495B2 (ja) * 2004-10-22 2010-08-18 株式会社日本触媒 重合体微粒子およびその製造方法、導電性微粒子
TWI356425B (en) * 2005-03-24 2012-01-11 Nippon Catalytic Chem Ind Coated fine particle and their manufacturing metho
JP4867418B2 (ja) * 2006-03-22 2012-02-01 Ｔｄｋ株式会社 転写用導電性フィルム及びそれを用いた透明導電層が付与された物体
JP2011040189A (ja) * 2009-08-07 2011-02-24 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2011060502A (ja) * 2009-09-08 2011-03-24 Sekisui Chem Co Ltd 絶縁粒子付き導電性粒子、異方性導電材料及び接続構造体
JP7606348B2 (ja) * 2019-05-14 2024-12-25 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
JP2025161917A (ja) 2025-10-24
JP7733583B2 (ja) 2025-09-03
JPWO2022131359A1 (https=) 2022-06-23
TW202236310A (zh) 2022-09-16

Similar Documents

Publication Publication Date Title
JP7000372B2 (ja) 基材粒子、導電性粒子、導電材料及び接続構造体
CN104584141B (zh) 带有绝缘性粒子的导电性粒子、导电材料及连接结构体
JP7463069B2 (ja) 導電性粒子、導電材料、接続構造体及び接続構造体の製造方法
JP7767300B2 (ja) 導電性粒子、導電材料及び接続構造体
JP7671142B2 (ja) 導電性粒子、導電材料及び接続構造体
JP5996806B2 (ja) 導電性粒子、導電材料及び接続構造体
JP7733583B2 (ja) 導電性粒子、ソケット、導電材料及び接続構造体
JP7288487B2 (ja) 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP7612583B2 (ja) 導電性粒子及び接続構造体
JPWO2019221278A1 (ja) 基材粒子、導電性粒子、導電材料及び接続構造体
JP7328856B2 (ja) 導電性粒子、導電材料及び接続構造体
JP7688617B2 (ja) 導電性粒子、導電材料及び接続構造体
JP2021057189A (ja) 導電性粒子、導電材料及び接続構造体
JP2024035972A (ja) 被覆粒子、樹脂組成物及び接続構造体
WO2024034386A1 (ja) 導電性粒子、導電材料及び接続構造体
WO2022260159A1 (ja) 被覆粒子、被覆粒子の製造方法、樹脂組成物及び接続構造体
JP2020200458A (ja) 粒子、導電性粒子、導電材料及び接続構造体
JPWO2019107572A1 (ja) 導電性組成物及びその硬化物、導通検査装置用部材並びに導通検査装置
JP2021057103A (ja) 導電性粒子、導電材料及び接続構造体
KR20210029143A (ko) 절연성 입자 구비 도전성 입자, 도전 재료 및 접속 구조체

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2021577501

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21906717

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21906717

Country of ref document: EP

Kind code of ref document: A2