Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
  • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
  • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
  • C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
  • C08G63/605—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds the hydroxy and carboxylic groups being bound to aromatic rings
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
  • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/18—Manufacture of films or sheets
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
  • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
  • C08L77/12—Polyester-amides
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
  • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2203/00—Applications
  • C08L2203/16—Applications used for films
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2205/00—Polymer mixtures characterised by other features
  • C08L2205/12—Polymer mixtures characterised by other features containing additives being liquid crystalline or anisotropic in the melt
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0137—Materials
  • H05K2201/0141—Liquid crystal polymer [LCP]

Definitions

• the present disclosure relates to liquid crystal polymer films, polymer films, and laminates.
• Patent Document 1 contains a solvent, a soluble liquid crystal polymer dissolved in the solvent, and at least one organic polymer or an inorganic filler, and is an addition dispersed or dissolved in the solvent.
• a liquid crystal polymer composition comprising the same is described.
• Patent Document 2 describes an optical film containing a cellulose ester in which the amount of additives on the surface is controlled by forming the film into multiple layers.
• An object to be solved by one embodiment of the present invention is to provide a liquid crystal polymer film or a polymer film having a low coefficient of linear expansion and excellent adhesion to a substrate. Further, an object to be solved by another embodiment of the present invention is to provide the liquid crystal polymer film or a laminate using the polymer film.
• the means for solving the above problems include the following aspects.
• ⁇ 1> A liquid crystal polymer having a layer A and a layer B on at least one surface of the layer A, the layer A containing a liquid crystal polymer, and a linear expansion coefficient of ⁇ 20 ppm / K to 50 ppm / K. the film.
• ⁇ 2> The liquid crystal polymer film according to ⁇ 1>, wherein the linear expansion coefficient of the layer A is ⁇ 20 ppm / K to 50 ppm / K.
• ⁇ 3> The liquid crystal polymer film according to ⁇ 1> or ⁇ 2>, wherein the liquid crystal polymer has a structural unit represented by any of the formulas (1) to (3).
• Ar 1 represents a phenylene group, a naphthylene group or a biphenylylene group
• Ar 2 and Ar 3 independently represent a phenylene group, a naphthylene group, a biphenylylene group or the following formula (4).
• Ar 4 and Ar 5 independently represent a phenylene group or a naphthylene group, and Z represents an oxygen atom, a sulfur atom, a carbonyl group, a sulfonyl group or an alkylene group.
• Z represents an oxygen atom, a sulfur atom, a carbonyl group, a sulfonyl group or an alkylene group.
• ⁇ 6> The liquid crystal polymer film according to any one of ⁇ 1> to ⁇ 5>, wherein the liquid crystal polymer film contains a filler in at least one layer of the layer A or the layer B.
• ⁇ 7> The liquid crystal polymer film according to any one of ⁇ 1> to ⁇ 6>, wherein the layer A contains a filler.
• ⁇ 8> The liquid crystal polymer film according to ⁇ 6> or ⁇ 7>, wherein the number density of the filler is larger inside than on the surface of the liquid crystal polymer film.
• ⁇ 9> The liquid crystal polymer film according to any one of ⁇ 1> to ⁇ 8>, wherein the dielectric loss tangent of the layer B is 0.02 or less.
• ⁇ 10> The liquid crystal polymer film according to any one of ⁇ 1> to ⁇ 9>, wherein the layer B contains a liquid crystal polymer.
• ⁇ 11> The liquid crystal polymer film according to any one of ⁇ 1> to ⁇ 10>, which further has a layer C, and has the layer B, the layer A, and the layer C in this order.
• ⁇ 12> The liquid crystal polymer film according to ⁇ 11>, wherein the dielectric loss tangent of the layer C is 0.02 or less.
• ⁇ 13> The liquid crystal polymer film according to ⁇ 11> or ⁇ 12>, wherein the layer C contains a liquid crystal polymer.
• ⁇ 14> The polymer film according to any one of ⁇ 11> to ⁇ 13>, wherein the layer C contains a filler.
• ⁇ 15> The liquid crystal polymer according to ⁇ 10> or ⁇ 13>, wherein the liquid crystal polymer contained in the layer B or the layer C has a structural unit represented by any of the formulas (1) to (3). the film.
• Ar 1 represents a phenylene group, a naphthylene group or a biphenylylene group
• Ar 2 and Ar 3 independently represent a phenylene group, a naphthylene group, a biphenylylene group or the following formula (4).
• Ar 4 and Ar 5 independently represent a phenylene group or a naphthylene group, and Z represents an oxygen atom, a sulfur atom, a carbonyl group, a sulfonyl group or an alkylene group.
• Z represents an oxygen atom, a sulfur atom, a carbonyl group, a sulfonyl group or an alkylene group.
• the layer A has a layer A and a layer B on at least one surface of the layer A, and the layer A has a fluoropolymer, a cyclic aliphatic hydrocarbon group, and a group having an ethylenically unsaturated bond.
• ⁇ 18> The liquid crystal polymer film according to any one of ⁇ 1> to ⁇ 15>, or the polymer film according to ⁇ 16> or ⁇ 17>, and the liquid crystal polymer film or the layer B in the polymer film.
• ⁇ 20> The liquid crystal polymer film according to any one of ⁇ 11> to ⁇ 14>, the metal layer arranged on the surface of the liquid crystal polymer film on the layer B side, and the layer C of the liquid crystal polymer film.
• the metal layer arranged on the surface of the layer C is a copper layer arranged on the surface of the layer C, and the separation between the layer C and the copper layer arranged on the surface of the layer C is separated.
• the laminate according to ⁇ 20> which has a strength of 0.5 kN / m or more.
• liquid crystal polymer film or a polymer film having a low coefficient of linear expansion and excellent adhesion it is possible to provide a liquid crystal polymer film or a polymer film having a low coefficient of linear expansion and excellent adhesion to a substrate. Further, according to another embodiment of the present invention, the liquid crystal polymer film or a laminate using the polymer film can be provided.
• the notation that does not describe substitution or non-substitution includes those having no substituent as well as those having a substituent.
• the "alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
• (meth) acrylic is a term used in a concept that includes both acrylic and methacrylic
• (meth) acryloyl is a term that is used as a concept that includes both acryloyl and methacrylic. Is.
• the term "process” in the present specification is not limited to an independent process, and even if it cannot be clearly distinguished from other processes, the term “process” will be used as long as the intended purpose of the process is achieved. included.
• “% by mass” and “% by weight” are synonymous, and “parts by mass” and “parts by weight” are synonymous.
• a combination of two or more preferred embodiments is a more preferred embodiment.
• the first embodiment of the polymer film according to the present disclosure comprises a layer A and a layer B on at least one surface of the layer A, wherein the layer A comprises a polymer having a dielectric loss tangent of 0.01 or less.
• a second embodiment of the polymer film according to the present disclosure has a layer A and a layer B on at least one surface of the layer A, wherein the layer A is a fluoropolymer and a cyclic aliphatic hydrocarbon group.
• a third embodiment of the polymer film according to the present disclosure has a layer A and a layer B on at least one surface of the layer A, wherein the layer A contains a liquid crystal polymer and has a coefficient of linear expansion. , -20 ppm / K to 50 ppm / K, a liquid crystal polymer film.
• the polymer film in which the layer A contains a liquid crystal polymer is also referred to as a liquid crystal polymer film.
• polymer film according to the present disclosure refers to all of the above-mentioned first embodiment, the above-mentioned second embodiment and the above-mentioned third embodiment. do. Further, in the present specification, unless otherwise specified, the term “liquid crystal polymer film according to the present disclosure” shall be used to describe the third embodiment.
• the polymer film contains a polymer having a dielectric tangent of 0.01 or less, or a fluoropolymer, a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether and an aromatic poly. It has at least two layers of a layer A containing at least one polymer selected from the group consisting of ether ketones or containing a liquid crystal polymer, and a layer B on at least one surface of the layer A, and linearly expanding. It is estimated that when the coefficient is -20 ppm / K to 50 ppm / K, the linear expansion coefficient can be lowered and the mechanical strength near the surface is improved, so that the adhesion to the substrate is excellent.
• the polymer film according to the present disclosure preferably further has a layer C in addition to the above layer A and the above layer B, and the above layer B and the above layer. It is more preferable to have A and the layer C in this order. Further, when the metal layer is present separately from each of the above layers, the layer C is preferably the outermost layer on the side in contact with the metal layer.
• the metal layer is preferably a copper layer.
• As the copper layer a rolled copper foil formed by a rolling method or an electrolytic copper foil formed by an electrolytic method is preferable.
• the metal layer is a known surface-treated layer (for example, a chemical-treated layer) for ensuring an adhesive force with a resin on the surface on the side in contact with the polymer film. It is preferable to have.
• the metal layer in the laminate according to the present disclosure may be a metal layer having a circuit pattern. It is also preferable that the metal layer in the laminate according to the present disclosure is processed into a desired circuit pattern by etching, for example, to form a flexible printed circuit board.
• the etching method is not particularly limited, and a known etching method can be used. Further, as a method for detecting or determining the layer structure of the polymer film and the thickness of each layer, the following methods can be mentioned.
• a cross-sectional sample of a polymer film is cut out by a microtome, and the layer composition and the thickness of each layer are determined by an optical microscope.
• the determination may be made by morphological observation with a scanning electron microscope (SEM) or component analysis with a flight time type secondary ion mass spectrometry (TOF-SIMS) or the like.
• the coefficient of linear expansion of the polymer film according to the present disclosure is ⁇ 20 ppm / K to 50 ppm / K, preferably ⁇ 10 ppm / K to 40 ppm / K, and more preferably 0 ppm / K to 35 ppm / K. It is more preferably 10 ppm / K to 30 ppm / K, and particularly preferably 15 ppm / K to 25 ppm / K.
• the coefficient of linear expansion of layer A in the polymer film according to the present disclosure is preferably ⁇ 20 ppm / K to 50 ppm / K, preferably ⁇ 10 ppm, from the viewpoint of the coefficient of linear expansion of the polymer film and the adhesion to the metal layer. It is more preferably / K to 40 ppm / K, further preferably 0 ppm / K to 35 ppm / K, particularly preferably 10 ppm / K to 30 ppm / K, and 15 ppm / K to 25 ppm / K. Is most preferable.
• the method for measuring the coefficient of linear expansion in the present disclosure shall be as follows. Using a thermomechanical analyzer (TMA), apply a tensile load of 1 g to both ends of a polymer film with a width of 5 mm and a length of 20 mm or a measurement sample of each layer, and raise the temperature from 25 ° C to 200 ° C at a rate of 5 ° C / min. did. Then, the coefficient of linear expansion is calculated from the slope of the TMA curve between 30 ° C. and 150 ° C. when the temperature is cooled to 30 ° C. at a rate of 20 ° C./min and the temperature is raised again at a rate of 5 ° C./min.
• TMA thermomechanical analyzer
• the layer to be measured may be scraped off with a razor or the like to prepare a measurement sample.
• a heating stage system (HS82, manufactured by Polymer Toledo), and subsequently from 25 ° C to 200 ° C at a rate of 5 ° C / min. After raising the temperature, the polymer film or the thickness of each layer (ts30) at 30 ° C. and 150 ° C. when the temperature was cooled to 30 ° C.
• the thickness (ts150) of the polymer film or each layer was evaluated, the value obtained by dividing the dimensional change by the temperature change ((ts150-ts30) / (150-30)) was calculated, and the linear expansion coefficient of the polymer film or each layer was calculated. calculate.
• the dielectric loss tangent of the polymer film according to the present disclosure is preferably 0.01 or less, more preferably 0.005 or less, and 0. It is more preferably 004 or less, and particularly preferably more than 0 and 0.003 or less.
• the dielectric loss tangent of the layer A in the polymer film according to the present disclosure is preferably 0.02 or less, preferably 0.01 or less, from the viewpoint of the linear expansion coefficient of the polymer film and the adhesion to the metal layer. Is more preferable, 0.005 or less is further preferable, and more than 0 and 0.003 or less is particularly preferable.
• the dielectric tangents of the layers B and C are independently, preferably 0.02 or less, preferably 0.01 or less, from the viewpoint of the linear expansion coefficient and the adhesion to the metal layer. It is more preferably 0.005 or less, particularly preferably 0.001 or less, and most preferably more than 0 and 0.001 or less.
• the method for measuring the dielectric loss tangent in the present disclosure shall be the following method.
• the permittivity measurement is carried out by the resonance perturbation method at a frequency of 10 GHz.
• a 10 GHz hollow resonator (CP531 manufactured by Kanto Denshi Applied Development Co., Ltd.) is connected to a network analyzer (“E8633B” manufactured by Agent Technology), and a polymer film or a sample of each layer (width: 2 mm ⁇ length: length:) is connected to the cavity resonator. 80 mm) is inserted, and the dielectric constant and dielectric tangent of the polymer film or each layer are measured from the change in resonance frequency before and after the insertion for 96 hours under a temperature of 25 ° C. and a humidity of 60% RH.
• the layer to be measured with a razor or the like may be scraped off and the obtained powdery sample may be used.
• the measurement of the dielectric loss tangent of the polymer in the present disclosure shall be carried out according to the above-mentioned method for measuring the dielectric loss tangent using a sample obtained by identifying or isolating the chemical structure of the polymer constituting each layer and measuring the polymer as a powder. do. The polymer will be described later.
• the polymer film according to the present disclosure has a layer A and a layer B on at least one surface of the layer A, and the layer A contains a polymer having a dielectric positive contact of 0.01 or less, or is a fluoropolymer. It contains at least one polymer selected from the group consisting of a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether and an aromatic polyether ketone, or a liquid crystal polymer. including.
• the polymer contained in the layer A having a dielectric loss tangent of 0.01 or less is a liquid crystal polymer having a dielectric loss tangent of 0.01 or less from the viewpoint of film forming property and mechanical strength. Is preferable.
• a fluoropolymer contained in layer A a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether and an aromatic.
• At least one polymer selected from the group consisting of group polyether ketones is preferably a fluoropolymer from the viewpoint of dielectric positive contact.
• the type of the liquid crystal polymer is not particularly limited, and a known liquid crystal polymer can be used.
• the liquid crystal polymer may be a thermotropic liquid crystal polymer that exhibits liquid crystal properties in a molten state, or may be a riotropic liquid crystal polymer that exhibits liquid crystal properties in a solution state.
• the liquid crystal polymer is a thermotropic liquid crystal polymer, it is preferably a liquid crystal polymer that melts at a temperature of 450 ° C. or lower.
• liquid crystal polymer examples include liquid crystal polyester, liquid crystal polyester amide having an amide bond introduced into the liquid crystal polyester, liquid crystal polyester ether having an ether bond introduced into the liquid crystal polyester, and liquid crystal polyester carbonate having a carbonate bond introduced into the liquid crystal polyester.
• the liquid crystal polymer is preferably a polymer having an aromatic ring, and more preferably an aromatic polyester or an aromatic polyester amide, from the viewpoint of liquid crystal property and linear expansion coefficient.
• the liquid crystal polymer may be a polymer in which an isocyanate-derived bond such as an imide bond, a carbodiimide bond, or an isocyanurate bond is further introduced into an aromatic polyester or an aromatic polyester amide.
• the liquid crystal polymer is preferably a total aromatic liquid crystal polymer using only an aromatic compound as a raw material monomer.
• liquid crystal polymer examples include the following liquid crystal polymers. 1) (i) an aromatic hydroxycarboxylic acid, (ii) an aromatic dicarboxylic acid, and (iii) at least one compound selected from the group consisting of aromatic diols, aromatic hydroxyamines and aromatic diamines. It is made by polycondensing. 2) Polycondensation of multiple types of aromatic hydroxycarboxylic acids. 3) A compound obtained by polycondensing (i) an aromatic dicarboxylic acid and (ii) at least one compound selected from the group consisting of aromatic diols, aromatic hydroxyamines and aromatic diamines.
• Polyester such as polyethylene terephthalate
• aromatic hydroxycarboxylic acid are polycondensed.
• the aromatic hydroxycarboxylic acid, the aromatic dicarboxylic acid, the aromatic diol, the aromatic hydroxyamine and the aromatic diamine may be independently replaced with a polycondensable derivative.
• the aromatic hydroxycarboxylic acid and the aromatic dicarboxylic acid can be replaced with the aromatic hydroxycarboxylic acid ester and the aromatic dicarboxylic acid ester by converting the carboxy group into an alkoxycarbonyl group or an aryloxycarbonyl group.
• the aromatic hydroxycarboxylic acid and the aromatic dicarboxylic acid can be replaced with the aromatic hydroxycarboxylic acid halide and the aromatic dicarboxylic acid halide.
• the aromatic hydroxycarboxylic acid and the aromatic dicarboxylic acid can be replaced with the aromatic hydroxycarboxylic acid anhydride and the aromatic dicarboxylic acid anhydride.
• polymerizable derivatives of compounds having a hydroxy group such as aromatic hydroxycarboxylic acids, aromatic diols and aromatic hydroxyamines, are those obtained by acylating a hydroxy group and converting it into an acyloxy group (acylated product). Can be mentioned.
• the aromatic hydroxycarboxylic acid, the aromatic diol, and the aromatic hydroxyamine can each be replaced with an acylated product.
• polymerizable derivatives of compounds having an amino group such as aromatic hydroxyamines and aromatic diamines, include those obtained by acylating an amino group and converting it into an acylamino group (acylated product).
• aromatic hydroxyamines and aromatic diamines can each be replaced with acylated products by acylating the amino group to convert it to an acylamino group.
• the liquid crystal polymer is a structural unit represented by any of the following formulas (1) to (3) (hereinafter, formula (1)) from the viewpoint of liquid crystal property, coefficient of linear expansion, and adhesion to the metal layer.
• the structural unit or the like represented may be referred to as a structural unit (1) or the like), more preferably a structural unit represented by the following formula (1), and the following formula (1). It is particularly preferable to have a structural unit represented by the following formula (2), and a structural unit represented by the following formula (3).
• Ar 1 represents a phenylene group, a naphthylene group or a biphenylylene group
• Ar 2 and Ar 3 independently represent a phenylene group, a naphthylene group, a biphenylylene group or the following formula (4).
• Ar 4 and Ar 5 independently represent a phenylene group or a naphthylene group, and Z represents an oxygen atom, a sulfur atom, a carbonyl group, a sulfonyl group or an alkylene group.
• halogen atom examples include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
• alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, s-butyl group, t-butyl group, n-hexyl group and 2-ethylhexyl group. Examples thereof include an n-octyl group and an n-decyl group.
• the alkyl group preferably has 1 to 10 carbon atoms.
• aryl group examples include a phenyl group, an o-tolyl group, an m-tolyl group, a p-tolyl group, a 1-naphthyl group and a 2-naphthyl group.
• the aryl group preferably has 6 to 20 carbon atoms.
• the number of substitutions is independently, preferably 2 or less, and more preferably 1 in Ar 1 , Ar 2 or Ar 3 , respectively.
• alkylene group examples include a methylene group, a 1,1-ethanediyl group, a 1-methyl-1,1-ethanediyl group, a 1,1-butandyl group and a 2-ethyl-1,1-hexanediyl group.
• the alkylene group preferably has 1 to 10 carbon atoms.
• the structural unit (1) is a structural unit derived from an aromatic hydroxycarboxylic acid.
• Ar 1 is a p-phenylene group (a structural unit derived from p-hydroxyacousic acid) and an embodiment in which Ar 1 is a 2,6-naphthylene group (6-hydroxy-).
• a structural unit derived from 2-naphthoic acid) or an embodiment having a 4,4'-biphenylylene group (constituent unit derived from 4'-hydroxy-4-biphenylcarboxylic acid) is preferable.
• the structural unit (2) is a structural unit derived from an aromatic dicarboxylic acid.
• Ar 2 is a p-phenylene group (constituent unit derived from terephthalic acid)
• Ar 2 is an m-phenylene group (constituent unit derived from isophthalic acid)
• Ar 2 Is a 2,6-naphthylene group (a structural unit derived from 2,6-naphthalenedicarboxylic acid)
• Ar 2 is a diphenyl ether-4,4'-diyl group (diphenyl ether-4,4'-.
• a structural unit derived from a dicarboxylic acid) is preferable.
• the structural unit (3) is a structural unit derived from an aromatic diol, an aromatic hydroxylamine or an aromatic diamine.
• Ar 3 is a p-phenylene group (a structural unit derived from hydroquinone, p-aminophenol or p-phenylenediamine) and an embodiment in which Ar 3 is an m-phenylene group (isophthalic acid).
• the structural unit to be used) is preferable.
• the content of the structural unit (1) is determined by dividing the total amount of all the structural units (the mass of each structural unit (also referred to as “monomer unit”) constituting the liquid crystal polymer by the formula amount of each structural unit.
• the amount equivalent to the amount of the substance (mol) of the constituent unit is determined, and the total value thereof) is preferably 30 mol% or more, more preferably 30 mol% to 80 mol%, still more preferably 30 mol% to 60 mol. %, Especially preferably 30 mol% to 40 mol%.
• the content of the structural unit (2) is preferably 35 mol% or less, more preferably 10 mol% to 35 mol%, still more preferably 20 mol% to 35 mol%, particularly, with respect to the total amount of all the structural units.
• the content of the structural unit (3) is preferably 35 mol% or less, more preferably 10 mol% to 35 mol%, still more preferably 20 mol% to 35 mol%, particularly, with respect to the total amount of all the structural units. It is preferably 30 mol% to 35 mol%.
• the larger the content of the structural unit (1) the easier it is to improve the heat resistance, strength and rigidity, but if it is too large, the solubility in a solvent tends to be low.
• the ratio between the content of the constituent unit (2) and the content of the constituent unit (3) is expressed by [content of the constituent unit (2)] / [content of the constituent unit (3)] (mol / mol). It is preferably 0.9 / 1 to 1 / 0.9, more preferably 0.95 / 1 to 1 / 0.95, and further preferably 0.98 / 1 to 1 / 0.98.
• the liquid crystal polymer may have two or more types of constituent units (1) to (3) independently. Further, the liquid crystal polymer may have a structural unit other than the structural units (1) to (3), but the content thereof is preferably 10 mol% or less with respect to the total amount of all the structural units. It is preferably 5 mol% or less.
• the liquid crystal polymer has a structural unit (3) in which at least one of X and Y is an imino group as a structural unit (3), that is, an aromatic as a structural unit (3). It is preferable to have at least one of the structural unit derived from hydroxylamine and the structural unit derived from aromatic diamine, and it is more preferable to have only the structural unit (3) in which at least one of X and Y is an imino group.
• the liquid crystal polymer is preferably produced by melt-polymerizing a raw material monomer corresponding to a constituent unit constituting the liquid crystal polymer.
• the melt polymerization may be carried out in the presence of a catalyst.
• catalysts include metal compounds such as magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate and antimony trioxide, 4- (dimethylamino) pyridine and 1-methylimidazole.
• examples thereof include nitrogen heterocyclic compounds, and nitrogen-containing heterocyclic compounds are preferably mentioned.
• the melt polymerization may be further solid-phase polymerized, if necessary.
• the lower limit of the flow start temperature of the liquid crystal polymer is preferably 180 ° C. or higher, more preferably 200 ° C. or higher, still more preferably 250 ° C. or higher, and the upper limit of the flow start temperature is preferably 350 ° C. or higher, 330 ° C. or higher. Is more preferable, and 300 ° C. is even more preferable.
• the solubility, heat resistance, strength and rigidity are excellent, and the viscosity of the solution is appropriate.
• the flow start temperature also called the flow temperature or the flow temperature, melts the liquid crystal polymer using a capillary leometer while raising the temperature at a rate of 4 ° C./min under a load of 9.8 MPa (100 kg / cm 2 ). It is a temperature that shows a viscosity of 4,800 Pa ⁇ s (48,000 poise) when extruded from a nozzle with an inner diameter of 1 mm and a length of 10 mm, and is a guideline for the molecular weight of the liquid crystal polymer (edited by Naoyuki Koide). , "Liquid Polymer-Synthesis / Molding / Application-", CMC Co., Ltd., June 5, 1987, p.95).
• the weight average molecular weight of the liquid crystal polymer is preferably 1,000,000 or less, more preferably 3,000 to 300,000, still more preferably 5,000 to 100,000. It is particularly preferably 5,000 to 30,000.
• the film after heat treatment is excellent in thermal conductivity, heat resistance, strength and rigidity in the thickness direction.
• the liquid crystal polymer is preferably a liquid crystal polymer that is soluble in a specific organic solvent (hereinafter, also referred to as "soluble liquid crystal polymer").
• the soluble liquid crystal polymer in the present disclosure is N-methylpyrrolidone, N-ethylpyrrolidone, dichloromethane, dichloroethane, chloroform, N, N-dimethylacetamide, ⁇ -butyrolactone, dimethylformamide, ethylene glycol mono at 25 ° C.
• a liquid crystal polymer that dissolves 0.1 g or more in 100 g of at least one solvent selected from the group consisting of butyl ether and ethylene glycol monoethyl ether is preferable.
• the layer A preferably contains a fluorinated polymer from the viewpoint of heat resistance and mechanical strength.
• the type of the fluoropolymer is not particularly limited, and a known fluoropolymer can be used.
• the fluorinated polymer is a fluorinated ⁇ -olefin monomer, that is, an ⁇ -olefin monomer containing at least one fluorine atom, and, if necessary, a non-fluorinated ethylene that is reactive with the fluorinated ⁇ -olefin monomer.
• fluorinated ⁇ -olefin monomer that is, an ⁇ -olefin monomer containing at least one fluorine atom, and, if necessary, a non-fluorinated ethylene that is reactive with the fluorinated ⁇ -olefin monomer.
• Examples include homopolymers and copolymers containing building blocks derived from sex unsaturated monomers.
• Examples thereof include perfluoro (alkyl having 2 to 8 carbon atoms) vinyl ether (for example, perfluoromethyl vinyl ether, perfluoropropyl vinyl ether, perfluorooctyl vinyl ether) and the like.
• tetrafluoroethylene CF 2
• (perfluorobutyl) ethylene vinylidene fluoride
• CH 2 CF 2
• hexafluoropropylene CF 2 ).
• At least one monomer selected from the group consisting of CFCF 3 ) is preferred.
• the non-fluorinated monoethylenically unsaturated monomer include ethylene, propylene, butene, and an ethylenically unsaturated aromatic monomer (for example, styrene and ⁇ -methylstyrene).
• the fluorinated ⁇ -olefin monomer may be used alone or in combination of two or more.
• the non-fluorinated ethylenically unsaturated monomer may be used alone or in combination of two or more.
• fluoropolymer examples include polychlorotrifluoroethylene (PCTFE), poly (chlorotrifluoroethylene-propylene), poly (ethylene-tetrafluoroethylene) (ETFE), poly (ethylene-chlorotrifluoroethylene) (ECTFE), and the like.
• the fluoropolymer may be used alone or in combination of two
• the fluoropolymer is preferably at least one of FEP, PFA, ETFE, or PTFE.
• FEP is available under the trade name of Teflon (registered trademark) FEP (TEFLON (registered trademark) FEP) from DuPont, or the trade name of NEOFLON FEP from Daikin Industries, Ltd .
• PFA is the trade name of NEOFLON PFA from Daikin Industries, Ltd., the trade name of Teflon (registered trademark) PFA (TEFLON® PFA) from DuPont, or Solvay. It is available from Solexis) under the trade name of HYFLON PFA.
• the fluoropolymer preferably contains PTFE.
• PTFE can include PTFE homopolymers, partially modified PTFE homopolymers, or combinations comprising one or both of these.
• Partially modified PTFE homopolymers preferably contain less than 1% by weight of building blocks derived from commonomers other than tetrafluoroethylene, based on the total weight of the polymer.
• the fluoropolymer may be a crosslinkable fluoropolymer having a crosslinkable group.
• the crosslinkable fluoropolymer can be crosslinked by a conventionally known crosslinking method.
• One of the typical crosslinkable fluoropolymers is a fluoropolymer having a (meth) acryloxy group.
• R is a fluorine-based oligomer chain having two or more structural units derived from an ⁇ -olefin monomer or a non-fluorinated monoethylenically unsaturated monomer, R'is H or -CH 3 , and n is 1 to 4.
• R may be a fluorine-based oligomer chain containing a structural unit derived from tetrafluoroethylene.
• Forming a crosslinked fluoropolymer network structure by exposing a fluoropolymer having a (meth) acryloxy group to a free radical source in order to initiate a radical crosslinking reaction via the (meth) acryloxy group on a fluoropolymer.
• the free radical source is not particularly limited, but a photoradical polymerization initiator or an organic peroxide is preferable. Suitable photoradical polymerization initiators and organic peroxides are well known in the art.
• Crosslinkable fluoropolymers are commercially available and include, for example, DuPont Byton B.
• Layer A preferably contains a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond.
• polymers of compounds having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond include a structural unit formed of a monomer composed of a cyclic olefin such as norbornene or a polycyclic norbornene-based monomer. Examples thereof include thermoplastic resins having the above.
• the polymer of the compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond is the hydrogenation of the ring-opening polymer of the above cyclic olefin or the ring-opening copolymer using two or more kinds of cyclic olefins. It may be a product, or it may be an addition polymer of a cyclic olefin and an aromatic compound having an ethylenically unsaturated bond such as a chain olefin or a vinyl group.
• a polar group may be introduced into the polymer of the compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond.
• the polymer of the compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond may be used alone or in combination of two or more.
• the ring structure of the cyclic aliphatic hydrocarbon group may be a monocyclic ring, a condensed ring in which two or more rings are condensed, or a bridged ring.
• Examples of the ring structure of the cyclic aliphatic hydrocarbon group include a cyclopentane ring, a cyclohexane ring, a cyclooctane ring, an isovoron ring, a norbornane ring, and a dicyclopentane ring.
• the compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond may be a monofunctional ethylenically unsaturated compound or a polyfunctional ethylenically unsaturated compound.
• the number of cyclic aliphatic hydrocarbon groups in the compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond may be 1 or more, and may be 2 or more.
• a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond polymerizes a compound having at least one cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond.
• the polymer may be a polymer of a compound having two or more kinds of cyclic aliphatic hydrocarbon groups and a group having an ethylenically unsaturated bond, or may not have a cyclic aliphatic hydrocarbon group. It may be a copolymer with another ethylenically unsaturated compound.
• the polymer of the compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond is preferably a cycloolefin polymer.
• the -Polyphenylene ether- Layer A preferably contains polyphenylene ether.
• the weight average molecular weight (Mw) of the polyphenylene ether is preferably 500 to 5,000, preferably 500 to 3,000, from the viewpoint of heat resistance and film forming property when thermosetting after film formation. It is preferable to have. When it is not heat-cured, it is not particularly limited, but is preferably 3,000 to 100,000, and preferably 5,000 to 50,000.
• the average number of phenolic hydroxyl groups at the molecular terminal per molecule is preferably 1 to 5 from the viewpoint of dielectric loss tangent and heat resistance, and is preferably 1.5. More preferably, the number is 3 to 3.
• the number of hydroxyl groups or phenolic hydroxyl groups of polyphenylene ether can be found, for example, from the standard values of polyphenylene ether products.
• Examples of the number of terminal hydroxyl groups or the number of terminal phenolic hydroxyl groups include numerical values representing the average value of hydroxyl groups or phenolic hydroxyl groups per molecule of all polyphenylene ethers present in 1 mol of polyphenylene ether.
• the polyphenylene ether may be used alone or in combination of two or more.
• polyphenylene ether examples include polyphenylene ether composed of 2,6-dimethylphenol and at least one of bifunctional phenol and trifunctional phenol, poly (2,6-dimethyl-1,4-phenylene oxide) and the like.
• examples thereof include those containing the polyphenylene ether of the above as a main component. More specifically, for example, a compound having a structure represented by the formula (PPE) is preferable.
• X represents an alkylene group or a single bond having 1 to 3 carbon atoms
• m represents an integer of 0 to 20
• n represents an integer of 0 to 20
• m and n The sum represents an integer from 1 to 30.
• alkylene group in the X include a dimethylmethylene group and the like.
• -Aromatic polyetherketone- Layer A preferably contains an aromatic polyetherketone.
• the aromatic polyetherketone is not particularly limited, and known aromatic polyetherketones can be used.
• the aromatic polyetherketone is preferably a polyetheretherketone.
• Polyetheretherketone is a kind of aromatic polyetherketone, and is a polymer in which bonds are arranged in the order of ether bond, ether bond, and carbonyl bond (ketone). It is preferable that each bond is linked by a divalent aromatic group.
• the aromatic polyetherketone may be used alone or in combination of two or more.
• aromatic polyether ketone examples include a polyether ether ketone having a chemical structure represented by the following formula (P1) (PEEK) and a polyether ketone having a chemical structure represented by the following formula (P2) (PEK).
• P1 polyether ether ketone having a chemical structure represented by the following formula (P1)
• P2 polyether ketone having a chemical structure represented by the following formula (P2)
• P3 Polyether ether ketone ketone
• PEEKK polyether ether ketone ketone
• P5 examples thereof include polyether ketones and ether ketone ketones (PEKEKK) having the represented chemical structure.
• n of the formulas (P1) to (P5) is preferably 10 or more, more preferably 20 or more, from the viewpoint of mechanical properties.
• n is preferably 5,000 or less, more preferably 1,000 or less, in that an aromatic polyetherketone can be easily produced. That is, n is preferably 10 to 5,000, more preferably 20 to 1,000.
• the layer A in the first embodiment of the polymer film according to the present disclosure contains a polymer having a dielectric loss tangent of 0.01 or less.
• the polymer having a dielectric loss tangent of 0.01 or less is not particularly limited, and among known polymers, those having a dielectric loss tangent of 0.01 or less can be used.
• the dielectric loss tangent of the polymer having a dielectric loss tangent of 0.01 or less is preferably 0.008 or less, more preferably 0.0075 or less, and 0. It is more preferably 006 or less, further preferably 0.005 or less, particularly preferably 0.004 or less, and most preferably more than 0 and 0.003 or less.
• Examples of the polymer having a dielectric tangent of 0.01 or less include a liquid crystal polymer, a fluoropolymer, a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, and an aromatic.
• Thermoplastic resins such as polyether ketones, polyolefins, polyamides, polyesters, polyphenylene sulfides, polyether ketones, polycarbonates, polyether sulfones, polyetherimides; elastomers such as copolymers of glycidyl methacrylate and polyethylene; phenol resins, epoxy resins , Polyethylene, Cyanate Resin and other thermocurable resins.
• the layer A is a liquid crystal polymer, a fluoropolymer, a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, and a polyether. It is preferable to contain at least one selected from the group consisting of ether ketones, more preferably to contain at least one selected from the group consisting of liquid crystal polymers and fluoropolymers, and from the viewpoint of film forming property and mechanical strength. Is particularly preferably containing a liquid crystal polymer, and is particularly preferably containing a fluoropolymer from the viewpoint of dielectric positive contact.
• Layer A is at least one polymer selected from the group consisting of a fluoropolymer, a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, and an aromatic polyether ketone.
• the polymer having a dielectric positive contact of 0.01 or less, or the liquid crystal polymer may be contained in only one kind, or may contain two or more kinds.
• the content of the polymer having a dielectric positive contact of 0.01 or less or the liquid crystal polymer is 20% by volume to 100% by volume with respect to the total volume of the layer A from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer. It is preferably 20% by volume to 90% by volume, more preferably 30% by volume to 80% by volume, and particularly preferably 40% by volume to 70% by volume.
• the content of the liquid crystal polymer is preferably 15% by mass to 85% by mass, more preferably 20% by mass to 70% by mass, based on the total mass of the layer A.
• the polymer film preferably contains a filler in at least one of the layers, and more preferably the layer A contains a filler.
• the filler may be in the form of particles or fibers, and may be an inorganic filler or an organic filler.
• the number density of the filler is larger inside than the surface of the polymer film from the viewpoint of the linear expansion coefficient and the adhesion to the metal layer.
• the surface of the polymer film refers to the outer surface of the polymer film (the surface in contact with air or the substrate), in the range of 3 ⁇ m in the depth direction from the most surface, or with respect to the thickness of the entire polymer film from the most surface. Of the range of 10% or less, the smaller one is defined as the "surface”.
• the inside of the polymer film refers to a part other than the surface of the polymer film, that is, the inner surface of the polymer film (the surface not in contact with air or the substrate), and is not limited, but ⁇ from the center in the thickness direction of the polymer film. Of the range of 1.5 ⁇ m or the range of ⁇ 5% of the total thickness from the center in the thickness direction of the polymer film, the smaller numerical value is defined as “inside”.
• the inorganic filler a known inorganic filler can be used.
• the material of the inorganic filler include BN, Al 2 O 3 , Al N, TiO 2 , SiO 2 , barium titanate, strontium titanate, aluminum hydroxide, calcium carbonate, and a material containing two or more of these. Be done.
• metal oxide particles or fibers are preferable, silica particles, titania particles, or glass fibers are more preferable, and silica particles are preferable from the viewpoint of linear expansion coefficient and adhesion to a metal layer. , Or glass fiber is particularly preferred.
• the average particle size of the inorganic filler is preferably about 20% to about 40% of the thickness of the layer A, and for example, those having an average particle size of 25%, 30% or 35% of the thickness of the layer A may be selected. .. If the particle or fiber is flat, it indicates the length in the short side direction.
• the average particle size of the inorganic filler is preferably 5 nm to 20 ⁇ m, more preferably 10 nm to 10 ⁇ m, and more preferably 20 nm to 1 ⁇ m from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer. It is more preferably 25 nm to 500 nm, and particularly preferably 25 nm to 500 nm.
• the organic filler a known organic filler can be used.
• the material of the organic filler include polyethylene, polystyrene, urea-formalin filler, polyester, cellulose, acrylic resin, fluororesin, cured epoxy resin, crosslinked benzoguanamine resin, crosslinked acrylic resin, liquid crystal polymer, and two or more of these. Examples include materials.
• the organic filler may be in the form of fibers such as nanofibers, or may be hollow resin particles. Among them, the organic filler is a fluororesin particle, a polyester resin particle, a polyethylene particle, a liquid crystal polymer particle, or a cellulosic resin nanofiber from the viewpoint of the linear expansion coefficient and the adhesion to the metal layer.
• liquid crystal polymer particles are not limited, but refer to those obtained by polymerizing a liquid crystal polymer and pulverizing it with a pulverizer or the like to obtain powdery liquid crystal.
• the liquid crystal polymer particles are preferably smaller than the thickness of each layer.
• the average particle size of the organic filler is preferably 5 nm to 20 ⁇ m, more preferably 10 nm to 1 ⁇ m, and more preferably 20 nm to 500 nm from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer. It is more preferably 25 nm to 90 nm, and particularly preferably 25 nm to 90 nm.
• the layer A may contain only one type of filler or may contain two or more types of filler.
• the content of the filler in the layer A is preferably 5% by volume to 80% by volume, preferably 10% by volume or more, based on the total volume of the layer A, from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer. It is more preferably 70% by volume, further preferably 20% by volume to 70% by volume, and particularly preferably 30% by volume to 60% by volume.
• the layer A may contain other additives other than the above-mentioned polymers such as liquid crystal polymers and fillers.
• additives known additives can be used. Specific examples thereof include leveling agents, antifoaming agents, antioxidants, ultraviolet absorbers, flame retardants, colorants and the like.
• the layer A may contain a resin other than the liquid crystal polymer as another additive.
• resins other than liquid crystal polymers include polypropylene, polyamide, polyester other than liquid crystal polyester, polyphenylene sulfide, polyether ketone, polycarbonate, polyether sulfone, polyphenylene ether and its modified products, and heat other than liquid crystal polyester such as polyetherimide.
• Plastic resin; elastomer such as a copolymer of glycidyl methacrylate and polyethylene; thermosetting resin such as phenol resin, epoxy resin, polyimide resin, cyanate resin and the like can be mentioned.
• the total content of the other additives in the layer A is preferably 25 parts by mass or less, more preferably 10 parts by mass or less, still more preferably 5 parts by mass or less, based on 100 parts by mass of the polymer content. Is.
• the average thickness of the layer A is not particularly limited, but is preferably 5 ⁇ m to 90 ⁇ m, more preferably 10 ⁇ m to 70 ⁇ m, and more preferably 15 ⁇ m to 15 ⁇ m from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer. It is particularly preferably 50 ⁇ m.
• the method for measuring the average thickness of each layer in the polymer film according to the present disclosure is as follows.
• the polymer film is cut with a microtome and the cross section is observed with an optical microscope to evaluate the thickness of each layer.
• the cross-section sample is cut out at three or more places, the thickness is measured at three or more points in each cross-section, and the average value thereof is taken as the average thickness.
• the polymer film according to the present disclosure has a layer A and a layer B on at least one surface of the layer A.
• a polymer film having excellent adhesion to the metal layer can be obtained.
• the layer A has a filler
• the layer A embrittled by the addition of the filler has the layer B, so that the surface of the polymer film is improved and the effect of improving the adhesion and the like can be obtained.
• the layer B is preferably a surface layer (outermost layer).
• the polymer film when used, for example, as a laminated body (laminated board with a metal layer) having a layer structure of a metal layer / layer A / layer B, another metal layer or a laminated board with a metal layer is further provided on the layer B side. May be placed. In this case, interface fracture between the layer B and another metal layer in the laminated body is suppressed, and the adhesion to the metal layer is improved.
• the layer B is a fluoropolymer, a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, from the viewpoint of the linear expansion coefficient and the adhesion to the metal layer.
• the preferred embodiment of the polymer used for the layer B is the same as the preferred embodiment of the liquid crystal polymer used for the layer A, except as described later.
• the polymer contained in the layer B may be the same as or different from the polymer contained in the layer A, but is contained in the layer A from the viewpoint of adhesion between the layer A and the layer B. It is preferable to contain the same polymer as the above polymer.
• the polymer contained in the layer B preferably contains a polymer having a higher breaking strength (toughness) than the polymer contained in the layer A.
• the breaking strength shall be measured by the following method. A sample consisting of the polymer to be measured was prepared, and the stress on elongation was measured at a tensile speed of 10% / min in a universal tensile tester "STM T50BP" manufactured by Toyo Baldwin Co., Ltd. at 25 ° C. and 60% RH atmosphere. Find the breaking strength.
• a fluoropolymer in layer B a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, an aromatic polyether ketone, a polymer having a dielectric tangential of 0.01 or less, and a polymer.
• the content of at least one polymer selected from the group consisting of liquid crystal polymers has an ethylenically unsaturated bond with the fluoropolymer in layer A, the cyclic aliphatic hydrocarbon group, from the viewpoint of adhesion to the metal layer.
• the content is higher than the content of at least one polymer selected from the group consisting of a polymer of a compound having a group, a polyphenylene ether, an aromatic polyether ketone, a polymer having a dielectric tangential of 0.01 or less, and a liquid crystal polymer. Is preferable.
• the polymer in layer B preferably a fluoropolymer, a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, an aromatic polyether ketone, and a dielectric tangent of 0.
• the content of at least one polymer selected from the group consisting of a polymer of 01 or less and a liquid crystal polymer is 50% by volume to 100% by volume with respect to the total volume of the layer B from the viewpoint of adhesion to the metal layer. It is preferably 80% by volume to 100% by volume, more preferably 90% by volume to 100% by volume, and particularly preferably 95% by volume to 100% by volume.
• the layer B may contain a filler.
• the preferred embodiment of the filler used for the layer B is the same as the preferred embodiment of the filler used for the layer A, except as described later.
• the content of the filler in the layer B is the content of the filler in the layer A from the viewpoint of adjusting the brittleness of the polymer film by addition, and in the case of an inorganic filler (for example, silica particles), from the viewpoint of adhesion to the metal layer. It is preferably less than the amount.
• an organic filler for example, polyethylene particles
• the addition amount can be set to an arbitrary level.
• the content of the filler in the layer B may not contain the filler from the viewpoint of adhesion to the metal layer, or may be more than 0% by volume and 20% by volume or less with respect to the total volume of the layer B.
• the filler is not contained or is more than 0% by volume and 10% by volume or less with respect to the total volume of the layer B, and the filler is not contained or the total volume of the layer B is relative to the total volume. It is more preferably more than 0% by volume and 5% by volume or less, and it is particularly preferable that the filler is not contained.
• the content of the filler in the layer B is preferably 0% by mass to 15% by mass, more preferably 0% by mass to 5% by mass, based on the total mass of the layer B.
• the filler such as polyethylene and olefin elastomer is preferably, for example, 50% by volume to 90% by volume, more preferably 75% by volume to 85% by volume. In this case, the content of the filler in the layer B is preferably 55% by mass to 90% by mass, more preferably 80% by mass to 85% by mass, based on the total mass of the layer B.
• the layer B may contain other additives other than the above polymer such as a liquid crystal polymer and the filler.
• Preferred embodiments of the other additives used in the layer B are the same as in the preferred embodiments of the other additives used in the layer A, except as described later.
• the average thickness of the layer B is preferably thinner than the average thickness of the layer A from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer.
• the value of TA / TB which is the ratio of the average thickness TA of the layer A to the average thickness TB of the layer B , may be larger than 1 from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer. It is preferably 2 to 100, more preferably 2.5 to 20, and particularly preferably 3 to 10.
• the average thickness of the layer B is preferably 0.1 ⁇ m to 20 ⁇ m, more preferably 0.5 ⁇ m to 15 ⁇ m, and more preferably 1 ⁇ m to 1 ⁇ m from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer. It is more preferably 10 ⁇ m, and particularly preferably 3 ⁇ m to 8 ⁇ m.
• the polymer film according to the present disclosure preferably further has a layer C, and more preferably has the layer B, the layer A, and the layer C in this order from the viewpoint of adhesion to the metal layer. ..
• the layer C is preferably a surface layer (outermost layer), and more preferably a surface layer on the side to which the metal is attached.
• the layer C is preferably arranged between the metal layer and the layer A.
• Layer C is a fluoropolymer, a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, from the viewpoint of linear expansion coefficient and adhesion to a metal layer. It is preferable to contain at least one polymer selected from the group consisting of aromatic polyether ketones, polymers having a dielectric tangent of 0.01 or less, and liquid crystal polymers, and more preferably to contain liquid crystal polymers.
• the preferred embodiment of the polymer used for the layer C is the same as the preferred embodiment of the polymer used for the layer A, except as described later.
• the polymer contained in the layer C may be the same as or different from the polymer contained in the layer A or the layer B, but from the viewpoint of the adhesion between the layer A and the layer C, the layer It is preferable to contain the same polymer as that contained in A.
• a fluoropolymer in layer C a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, an aromatic polyether ketone, a polymer having a dielectric positive contact of 0.01 or less, and a polymer.
• the content of at least one polymer selected from the group consisting of liquid crystal polymers has an ethylenically unsaturated bond with the fluoropolymer in layer A, the cyclic aliphatic hydrocarbon group, from the viewpoint of adhesion to the metal layer.
• the content is higher than the content of at least one polymer selected from the group consisting of a polymer of a compound having a group, a polyphenylene ether, an aromatic polyether ketone, a polymer having a dielectric tangential of 0.01 or less, and a liquid crystal polymer.
• the polymer in layer C preferably a fluoropolymer, a polymer of a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, an aromatic polyether ketone, and a dielectric tangent of 0.
• the content of at least one polymer selected from the group consisting of a polymer of 01 or less and a liquid crystal polymer is 50% by volume to 100% by volume with respect to the total volume of the layer C from the viewpoint of adhesion to the metal layer. It is preferably 80% by volume to 100% by volume, more preferably 90% by volume to 100% by volume, and particularly preferably 95% by volume to 100% by volume.
• the layer C may contain a filler.
• the preferred embodiment of the filler used for the layer C is the same as the preferred embodiment of the filler used for the layer A, except as described later.
• the content of the filler in the layer C is preferably smaller than the content of the filler in the layer A from the viewpoint of adhesion to the metal layer. Further, the content of the filler in the layer C may not contain the filler from the viewpoint of adhesion to the metal layer, or may be more than 0% by volume and 20% by volume or less with respect to the total volume of the layer C. It is more preferable that the filler is not contained or is more than 0% by volume and 10% by volume or less with respect to the total volume of the layer C, and the filler is not contained or the total volume of the layer C is relative to the total volume. It is more preferably more than 0% by volume and 5% by volume or less, and it is particularly preferable that the filler is not contained.
• the content of the filler in the layer C is preferably 0% by mass to 15% by mass, more preferably 0% by mass to 5% by mass, based on the total mass of the layer C.
• the filler such as polyethylene and olefin elastomer is preferably, for example, 50% by volume to 90% by volume, more preferably 75% by volume to 85% by volume.
• the content of the filler in the layer C is preferably 55% by mass to 90% by mass, more preferably 80% by mass to 85% by mass, based on the total mass of the layer C.
• the layer C may contain other additives other than the above polymer such as a liquid crystal polymer and the filler.
• Preferred embodiments of the other additives used in the layer C are the same as in the preferred embodiments of the other additives used in the layer A, except as described later.
• Layer C preferably contains a compound having a functional group as another additive.
• the functional group is at least one selected from the group consisting of a covalent group, an ionic bondable group, a hydrogen bondable group, a bipolar element interactable group, and a curing reaction capable group. It is preferably a group.
• the compound having a functional group may be a low molecular weight compound or a high molecular weight compound.
• the compound having a functional group is preferably a low molecular weight compound from the viewpoint of compatibility between the polymer and the compound having a functional group and the dielectric rectification of the polymer film, and the heat resistance and dynamics of the polymer film. From the viewpoint of target strength, a polymer compound is preferable.
• the number of functional groups in the compound having a functional group may be 1 or more, may be 2 or more, but is preferably 2 or more, and the amount of functional groups is set to an appropriate amount in the polymer film. From the viewpoint of reducing the dielectric loss tangent, 10 or less is preferable. Further, the compound having a functional group may have only one kind of functional group or may have two or more kinds of functional groups.
• the low molecular weight compound used as the compound having a functional group preferably has a molecular weight of 50 or more and less than 2,000, and more preferably 100 or more and less than 1,000, from the viewpoint of adhesion to the metal layer. It is particularly preferable that the molecular weight is 200 or more and less than 1,000.
• the content of the compound having a functional group is 10% by mass with respect to the total mass of the layer B. It is preferable to include the above.
• the polymer compound used as the compound having a functional group is preferably a polymer having a weight average molecular weight of 1,000 or more, and a weight average molecular weight of 2,000 or more, from the viewpoint of adhesion to the metal layer. It is more preferable that the polymer has a weight average molecular weight of 3,000 or more and 1,000,000 or less, and a polymer having a weight average molecular weight of 5,000 or more and 200,000 or less. Especially preferable.
• the polymer having a dielectric loss tangent of 0.01 or less and the compound having a functional group are compatible with each other.
• the difference between the SP value of the polymer by the Hoy method and the SP value of the compound having a functional group by the Hoy method is the compatibility between the polymer having a dielectric loss tangent of 0.01 or less and the compound having a functional group, and the dielectric of the polymer film. From the viewpoint of direct contact and adhesion to the metal layer, it is preferably 5 MPa 0.5 or less. The lower limit is 0 MPa 0.5 .
• the SP value (solubility parameter value) by the Hoy method is calculated from the molecular structure of the resin by the method described in Polymer Handbook future edition.
• the SP value is calculated as the SP value of each constituent unit.
• the functional group in the compound having a functional group was selected from the group consisting of a covalent group, an ionic bondable group, a hydrogen bondable group, a bipolar element interactable group, and a curing reaction capable group. It is preferably at least one group. From the viewpoint of the adhesion between the layer C and the metal layer, the functional group is preferably a covalent group or a group capable of a curing reaction, and more preferably a covalent group. Further, from the viewpoint of storage stability and handleability, the functional group is preferably an ion-bondable group, a hydrogen-bondable group, or a dipole-interactable group.
• the group that can be covalently bonded is not particularly limited as long as it is a group that can form a covalent bond. , Iimide ester group, alkyl halide group, thiol group, hydroxy group, carboxy group, amino group, amide group, isocyanate group, aldehyde group, sulfonic acid group and the like.
• it is selected from the group consisting of an epoxy group, an oxetanyl group, an N-hydroxy ester group, an isocyanate group, an imide ester group, an alkyl halide group, and a thiol group. It is preferably at least one functional group, and an epoxy group is particularly preferable.
• the surface of the metal to be bonded to the layer C has a group paired with the functional group of the compound having a functional group.
• a covalent group and a group paired with the covalent group are, for example, an epoxy.
• the other group includes a hydroxy group, an amino group and the like.
• the other may be an amino group or the like.
• the group capable of ionic bonding include a cationic group and an anionic group.
• the cationic group is preferably an onium group.
• the onium group include an ammonium group, a pyridinium group, a phosphonium group, an oxonium group, a sulfonium group, a selenonium group, an iodonium group and the like.
• an ammonium group, a pyridinium group, a phosphonium group, or a sulfonium group is preferable, an ammonium group or a phosphonium group is more preferable, and an ammonium group is particularly preferable.
• the anionic group is not particularly limited, and is, for example, a phenolic hydroxyl group, a carboxy group, -SO 3 H, -OSO 3 H, -PO 3 H, -OPO 3 H 2 , -CONHSO 2- , -SO 2 NHSO. 2 -etc.
• a phosphoric acid group, a phosphonic acid group, a phosphinic acid group, a sulfate group, a sulfonic acid group, a sulfinic acid group or a carboxy group is preferable, and a phosphoric acid group or a carboxy group is more preferable. It is more preferably a carboxy group.
• an ionic bondable group and a group paired with the ionic bondable group (combination of a functional group of a compound having a functional group and a group having a group on the surface of a metal), for example, one of them is acidic. If it has a group, the other is a basic group. Examples of the acidic group include a carboxy group, a sulfo group, a phosphoric acid group and the like, and a carboxy group is preferable.
• examples of the group that can be ionically bonded to the carboxy group include a tertiary amino group, a pyridyl group, and a piperidyl group.
• the group capable of hydrogen bonding include a group having a hydrogen bond donating site and a group having a hydrogen bond accepting site.
• the hydrogen bond donating site may have a structure having an active hydrogen atom capable of hydrogen bonding, but is preferably a structure represented by XH.
• X represents a heteroatom, and is preferably a nitrogen atom or an oxygen atom.
• the hydrogen bond donating site includes a hydroxy group, a carboxy group, a primary amide group, a secondary amide group, a primary amino group, and a secondary amino from the viewpoint of adhesion between the layer C and the metal layer.
• It is preferably at least one structure selected from the group consisting of a group, a primary sulfonamide group, a secondary sulfonamide group, an imide group, a urea bond, and a urethane bond, and preferably has a hydroxy group, a carboxy group, and a first structure. It may be at least one structure selected from the group consisting of a primary amide group, a secondary amide group, a primary sulfonamide group, a secondary sulfonamide group, a maleimide group, a urea bond, and a urethane bond.
• At least one structure selected from the group consisting of a hydroxy group, a carboxy group, a primary amide group, a secondary amide group, a primary sulfonamide group, a secondary sulfonamide group, and a maleimide group is more preferable, and it is particularly preferable that the structure is at least one selected from the group consisting of a hydroxy group and a secondary amide group.
• the hydrogen bond accepting site preferably has a structure containing an atom having an unshared electron pair, preferably a structure containing an oxygen atom having an unshared electron pair, and has a carbonyl group (carboxy group, amide group, imide group).
• a carbonyl structure such as a urea bond and a urethane bond
• a sulfonyl group including a sulfonyl structure such as a sulfonamide group
• a carbonyl group is particularly preferable.
• the group capable of hydrogen bonding is preferably a group having both the hydrogen bond donating site and the hydrogen bond accepting site, and is preferably a carboxy group, an amide group, an imide group, a urea bond, a urethane bond, or a sulfonamide. It preferably has a group, and more preferably has a carboxy group, an amide group, an imide group, or a sulfonamide group.
• a combination of a group capable of hydrogen bonding and a group paired with the group capable of hydrogen bonding provides a hydrogen bond.
• the other includes a group having a hydrogen binding accepting site.
• one of the above combinations is a carboxy group, an amide group, a carboxy group and the like can be mentioned.
• one of the above combinations is, for example, a phenolic hydroxyl group, the other may be phenolic hydroxide or the like.
• the dipole interactable group had a polarized structure other than the structure represented by XH (X represents a hetero atom, a nitrogen atom, or an oxygen atom) in the hydrogen-bondable group. Any group may be used, and a group to which atoms having different electronegativity are bonded is preferable. As a combination of atoms having different electric negative degrees, a combination of at least one atom selected from the group consisting of an oxygen atom, a nitrogen atom, a sulfur atom, and a halogen atom and a carbon atom is preferable, and an oxygen atom, a nitrogen atom, and the like.
• a combination of at least one atom selected from the group consisting of sulfur atoms and a carbon atom is more preferable.
• a combination of a nitrogen atom and a carbon atom and a combination of a carbon atom and a nitrogen atom, an oxygen atom and a sulfur atom are preferable, and specifically, cyano A group, a cyanul group, and a sulfonic acid amide group are more preferable.
• the combination of the dipole-interactable group and the group paired with the dipole-interactable group (combination of the functional group of the compound having a functional group and the group having on the surface of the metal) is the same.
• a combination of dipole-interactable groups is preferred.
• one of the above combinations is, for example, a cyano group
• the other is a cyano group.
• one of the above combinations is, for example, a sulfonic acid amide group
• the other may be a sulfonic acid amide group.
• the group capable of a curing reaction examples include an ethylenically unsaturated group, a cyclic ether group, a cyanato group, a reactive silyl group, an oxazine ring group, a urethane group and the like.
• the compound having a group capable of a curing reaction the following curable compound may be used.
• the curable compound is a compound that is cured by irradiation with heat or light (for example, visible light, ultraviolet rays, near infrared rays, far infrared rays, electron beams, etc.), and may require a curing aid described later. ..
• curable compounds include epoxy compounds, cyanate ester compounds, vinyl compounds, silicone compounds, oxazine compounds, maleimide compounds, allyl compounds, acrylic compounds, methacrylic compounds, and urethane compounds. These may be used alone or in combination of two or more.
• the compound is at least one selected from the group consisting of an epoxy compound, a cyanate ester compound, a vinyl compound, an allyl compound, and a silicone compound.
• the content of the curable compound in the layer B is preferably 10% by mass or more and 90% by mass or less, and more preferably 20% by mass or more and 80% by mass or less with respect to the total mass of the layer C.
• Hardening aid examples include a polymerization initiator such as a photoreaction initiator (photoradical generator, photoacid generator, photobase generator).
• Specific examples of the curing aid include onium salt compounds, sulfone compounds, sulfonic acid ester compounds, sulfonimide compounds, disulfonyldiazomethane compounds, disulfonylmethane compounds, oxime sulfonate compounds, hydrazine sulfonate compounds, triazine compounds, and nitrobenzyl compounds. Examples thereof include benzyl imidazole compounds, organic halides, octylate metal salts, disulfones and the like.
• these curing aids may be used alone or in combination of two or more.
• the content of the curing aid in the layer B is preferably 5% by mass or more and 20% by mass or less, and more preferably 5% by mass or more and 10% by mass or less with respect to the total mass of the layer B.
• the functional group in the compound having a functional group include an epoxy group, an oxetanyl group, an isocyanate group, an acid anhydride group, a carbodiimide group, an N-hydroxyester group, a glyoxal group, an imide ester group and an alkyl halide group.
• an epoxy group, an oxetanyl group, an isocyanate group, an acid anhydride group, a carbodiimide group, an N-hydroxyester group, a glyoxal group, an imide ester group, an alkyl halide group or a thiol group is more preferable.
• bonds or interactions of the two functional groups are shown below, but the above-mentioned bonds or interactions in the present disclosure are not limited thereto.
• the compound having a functional group is preferably a polyfunctional epoxy compound or a polymer of a polyfunctional epoxy compound from the viewpoint of the dielectric tangent of the polymer film and the adhesion to the metal layer, and the bifunctional epoxy compound, Alternatively, it is more preferably a polymer of a bifunctional epoxy compound, and particularly preferably a bifunctional epoxy compound.
• the layer C may contain only one kind of compound having a functional group, or may contain two or more kinds of compounds.
• the content of the compound having a functional group in the layer C is 1% by mass to 80% by mass with respect to the total mass of the polymer film from the viewpoint of the dielectric positive contact of the polymer film and the adhesion to the metal layer. It is preferably 5% by mass to 70% by mass, more preferably 10% by mass to 60% by mass, and particularly preferably 20% by mass to 60% by mass.
• the average thickness of the layer C is preferably thinner than the average thickness of the layer A from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer.
• the value of TA / TC which is the ratio of the average thickness TA of the layer A to the average thickness TC of the layer C , may be larger than 1 from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer. It is preferably 2 to 100, more preferably 2.5 to 20, and particularly preferably 3 to 14.
• the value of TC / TB which is the ratio of the average thickness TC of the layer C to the average thickness TB of the layer B , is 0.05 from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer.
• the average thickness of the layer C is preferably 0.1 ⁇ m to 20 ⁇ m, more preferably 0.5 ⁇ m to 15 ⁇ m, and more preferably 1 ⁇ m to 1 ⁇ m from the viewpoint of the coefficient of linear expansion and the adhesion to the metal layer. It is more preferably 10 ⁇ m, and particularly preferably 3 ⁇ m to 8 ⁇ m.
• the average thickness of the polymer film according to the present disclosure is preferably 6 ⁇ m to 500 ⁇ m, preferably 6 ⁇ m, from the viewpoint of strength and electrical characteristics (characteristic impedance) when a laminate having a metal layer (particularly a copper layer) is formed. It is more preferably to 100 ⁇ m, and particularly preferably 12 ⁇ m to 100 ⁇ m.
• the average thickness of the polymer film is measured at any five points using an adhesive film thickness meter, for example, an electronic micrometer (product name "KG3001A", manufactured by Anritsu Co., Ltd.), and is used as the average value thereof.
• an adhesive film thickness meter for example, an electronic micrometer (product name "KG3001A", manufactured by Anritsu Co., Ltd.), and is used as the average value thereof.
• the method for producing the polymer film according to the present disclosure is not particularly limited, and known methods can be referred to.
• a method for producing a polymer film according to the present disclosure for example, a co-flow spreading method, a multi-layer coating method, a co-extrusion method and the like are preferably mentioned.
• the coextrusion method is particularly preferable for relatively thin film formation, and the coextrusion method is particularly preferable for thick film formation.
• a layer A forming composition, a layer B forming composition, and a layer C forming composition in which the components of each layer such as the above polymer such as a liquid crystal polymer are dissolved or dispersed in a solvent, respectively.
• the composition or the like it is preferable to carry out a co-flow spreading method or a multi-layer coating method.
• the solvent examples include halogenated hydrocarbons such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,2,2-tetrachloroethane, 1-chlorobutane, chlorobenzene and o-dichlorobenzene; Halogenized phenols such as p-chlorophenol, pentachlorophenol and pentafluorophenol; ethers such as diethyl ether, tetrahydrofuran and 1,4-dioxane; ketones such as acetone and cyclohexanone; esters such as ethyl acetate and ⁇ -butyrolactone; ethylene Phenols such as carbonates and propylene carbonates; amines such as triethylamine; nitrogen-containing heterocyclic aromatic compounds such as pyridines; nitriles such as acetonitrile and succinonitriles; N, N-d
• the solvent preferably contains an aprotic compound (particularly preferably an aprotic compound having no halogen atom) because it is less corrosive and easy to handle.
• the proportion of the aprotic compound in the whole solvent is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass.
• an amide such as N, N-dimethylformamide, N, N-dimethylacetamide, tetramethylurea, N-methylpyrrolidone or ⁇ -butyrolactone may be used. It preferably contains an ester, more preferably N, N-dimethylformamide, N, N-dimethylacetamide, or N-methylpyrrolidone.
• the solvent preferably contains a compound having a dipole moment of 3 to 5 because the polymer such as a liquid crystal polymer can be easily dissolved.
• the proportion of the compound having a dipole moment of 3 to 5 in the entire solvent is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass. be.
• the aprotic compound it is preferable to use a compound having a dipole moment of 3 to 5.
• the solvent preferably contains a compound having a boiling point of 220 ° C. or lower at 1 atm because it is easy to remove.
• the proportion of the compound having a boiling point of 220 ° C. or lower at 1 atm in the whole solvent is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass.
• the aprotic compound it is preferable to use a compound having a boiling point of 220 ° C. or lower at 1 atm.
• a support may be used when the polymer film is produced by the above-mentioned co-flow spreading method, multi-layer coating method, co-extrusion method or the like. Further, when a metal layer (metal foil) or the like used for the laminate described later is used as a support, it may be used as it is without peeling. Examples of the support include a metal drum, a metal band, a glass plate, a resin film or a metal foil. Of these, metal drums, metal bands, and resin films are preferable.
• the resin film examples include a polyimide (PI) film, and examples of commercially available products include U-Pylex S and U-Pylex R manufactured by Ube Kosan Co., Ltd., Kapton manufactured by Toray DuPont Co., Ltd., and Examples thereof include IF30, IF70 and LV300 manufactured by SKC Koron PI.
• the support may have a surface treatment layer formed on the surface thereof so that the support can be easily peeled off.
• the surface treatment layer hard chrome plating, fluororesin or the like can be used.
• the average thickness of the support is not particularly limited, but is preferably 25 ⁇ m or more and 75 ⁇ m or less, and more preferably 50 ⁇ m or more and 75 ⁇ m or less.
• the method for removing at least a part of the solvent from the cast or coated film-like composition is not particularly limited, and a known drying method can be used. ..
• the polymer film according to the present disclosure can be appropriately combined with stretching from the viewpoint of controlling the molecular orientation and adjusting the coefficient of linear expansion and the mechanical properties.
• the stretching method is not particularly limited, and a known method can be referred to, and the stretching method may be carried out in a solvent-containing state or in a dry film state. Stretching in a solvent-containing state may be carried out by gripping the film and stretching it, or by utilizing the self-shrinking force of the web due to drying without stretching, or a combination thereof. Stretching is particularly effective for the purpose of improving the elongation at break and the strength at break when the brittleness of the film is reduced by the addition of an inorganic filler or the like.
• the method for producing a polymer film according to the present disclosure preferably includes a step of heat-treating (annealing) the polymer film.
• the heat treatment temperature in the heat treatment step is preferably 260 ° C. to 370 ° C., more preferably 280 ° C. to 360 ° C., and 300 ° C. to 350 ° C. from the viewpoint of dielectric loss tangent and peel strength. Is more preferable.
• the heat treatment time is preferably 15 minutes to 10 hours, more preferably 30 minutes to 5 hours.
• the method for producing a polymer film according to the present disclosure may include other known steps, if necessary.
• the polymer film according to the present disclosure can be used for various purposes, and above all, it can be suitably used for a film for electronic parts such as a printed wiring board, and can be preferably used for a flexible printed circuit board. Further, the polymer film according to the present disclosure can be suitably used as a polymer film for metal adhesion.
• the laminate according to the present disclosure may be a laminate of the polymer films according to the present disclosure, but the polymer film according to the present disclosure and the metal layer arranged on the surface on the layer B side of the polymer film are used. It is preferable to have the metal layer, and it is more preferable that the metal layer is a copper layer.
• the metal layer arranged on the surface on the layer B side is preferably a metal layer arranged on the surface of the layer B.
• the laminate according to the present disclosure includes a polymer film according to the present disclosure having a layer B, a layer A, and a layer C in this order, and a metal layer arranged on the surface of the polymer film on the layer B side.
• the metal layer arranged on the surface on the layer C side is preferably a metal layer arranged on the surface of the layer C, and the metal layer arranged on the surface on the layer B side is the surface of the layer B. It is more preferable that the metal layer arranged on the surface of the layer C and the metal layer arranged on the surface of the layer C is a metal layer arranged on the surface of the layer C. Further, the metal layer arranged on the surface on the layer B side and the metal layer arranged on the surface on the layer C side are different materials and thicknesses even if they are metal layers having the same material, thickness and shape.
• the metal layer arranged on the surface on the layer B side and the metal layer arranged on the surface on the layer C side may be metal layers of different materials and thicknesses.
• a metal layer may be laminated on only one side of the layer B or the layer C.
• a metal layer is laminated on one side of the layer B or C, and another polymer film (preferably another liquid crystal polymer film) is laminated on the other side. Preferred.
• the peel strength between the layer B and the copper layer is 0.5 kN / m or more. It is preferably 0.7 kN / m or more, more preferably 0.7 kN / m to 2.0 kN / m, further preferably 0.9 kN / m to 1.5 kN / m. Especially preferable.
• the peel strength between the layer C and the copper layer is 0.5 kN / m or more.
• It is preferably 0.7 kN / m or more, more preferably 0.7 kN / m to 2.0 kN / m, further preferably 0.9 kN / m to 1.5 kN / m. Is particularly preferred.
• the surface roughness Rz of the metal layer on the side in contact with the polymer film is preferably 1 ⁇ m to 10 ⁇ m, more preferably 1 ⁇ m to 5 ⁇ m, and particularly preferably 1.5 ⁇ m to 3 ⁇ m when the layer C is not provided.
• the surface roughness Rz of the metal layer on the side in contact with the polymer film is preferably less than 2.0 ⁇ m, particularly preferably 1.8 ⁇ m or less, from the viewpoint of reducing the transmission loss of the high frequency signal. .. Since the smaller the surface roughness Rz of the metal layer is, the more preferable it is, the lower limit value is not particularly set, but for example, 0 or more can be mentioned.
• surface roughness Rz is a value expressed in micrometers, which is the total value of the maximum value of the height of the peak and the maximum value of the depth of the valley observed in the roughness curve at the reference length. means.
• the surface roughness Rz of the metal layer shall be measured by the following method. Using the non-contact surface / layer cross-sectional shape measurement system VertScan (manufactured by Ryoka System Co., Ltd.), measure 465.48 ⁇ m in length and 620.64 ⁇ m in width, and measure the roughness curve on the surface of the object to be measured (metal layer) and the above. Create an average line of the roughness curve.
• the peel strength between the layer B or C of the polymer film and the metal layer shall be measured by the following method.
• a 10 mm wide peeling test piece was prepared from the laminate of the polymer film and the metal layer, the polymer film was fixed to a flat plate with double-sided adhesive tape, and the temperature was 25 ° C. by the 180 ° method according to JIS C 5016 (1994).
• the strength (kN / m) when the metal layer is peeled from the liquid crystal polymer film at a rate of 50 mm / min is measured.
• the metal layer is preferably a copper layer.
• a rolled copper foil formed by a rolling method or an electrolytic copper foil formed by an electrolytic method is preferable.
• the average thickness of the metal layer (preferably the copper layer) is not particularly limited, but is preferably 2 ⁇ m to 20 ⁇ m, more preferably 3 ⁇ m to 18 ⁇ m, and even more preferably 5 ⁇ m to 12 ⁇ m.
• the metal layer may be a metal layer with a carrier formed on a support (carrier) so as to be peelable.
• a carrier a known carrier can be used.
• the average thickness of the carrier is not particularly limited, but is preferably 10 ⁇ m to 100 ⁇ m, and more preferably 18 ⁇ m to 50 ⁇ m.
• the metal layer in the laminate according to the present disclosure may be a metal layer having a circuit pattern. It is also preferable that the metal layer in the laminate according to the present disclosure is processed into a desired circuit pattern by etching, for example, to form a flexible printed circuit board.
• the etching method is not particularly limited, and a known etching method can be used.
• thermomechanical analyzer a tensile load of 1 g is applied to both ends of a polymer film having a width of 5 mm and a length of 20 mm, the temperature is raised to 25 ° C to 200 ° C at a rate of 5 ° C / min, and then 20 ° C.
• the coefficient of linear expansion was calculated from the slope of the TMA curve between 30 ° C. and 150 ° C. when the temperature was cooled to 30 ° C. at a rate of / min and the temperature was raised again at a rate of 5 ° C./min.
• the polymer film was a laminate with a copper foil, the copper foil was etched with iron chloride, and the measurement was performed using the film taken out.
• the permittivity measurement was carried out by the resonance perturbation method at a frequency of 10 GHz.
• a 10 GHz hollow resonator (CP531 manufactured by Kanto Electronics Applied Development Co., Ltd.) is connected to a network analyzer (“E8633B” manufactured by Agent Technology), and a sample (width: 2 mm ⁇ length: 80 mm) is inserted into the cavity resonator.
• the dielectric constant and the dielectric tangent of the sample were measured from the change in the resonance frequency before and after the insertion for 96 hours under the environment of temperature 25 ° C. and humidity 60% RH.
• LC-A Liquid crystal polymer produced according to the following manufacturing method
• the liquid crystal polyester (B1) obtained above is heated in a nitrogen atmosphere from room temperature to 160 ° C. over 2 hours and 20 minutes, then from 160 ° C. to 180 ° C. over 3 hours and 20 minutes, and at 180 ° C. By holding for 5 hours, it was subjected to solid phase polymerization, cooled, and then pulverized with a pulverizer to obtain a powdery liquid crystal polyester (B2).
• the flow start temperature of this liquid crystal polyester (B2) was 220 ° C.
• the liquid crystal polyester (B2) obtained above is heated in a nitrogen atmosphere from room temperature (23 ° C.) to 180 ° C. over 1 hour and 25 minutes, and then from 180 ° C. to 255 ° C. over 6 hours and 40 minutes. After solid-phase polymerization by holding at 255 ° C. for 5 hours, the mixture was cooled to obtain a powdery liquid crystal polyester (LC-A).
• the flow start temperature of LC-A was 302 ° C.
• the melting point of this LC-A was measured using a differential scanning calorimetry device and found to be 311 ° C.
• LC-B Liquid crystal polymer produced according to the following manufacturing method
• the liquid crystal polyester (B1) obtained above is heated in a nitrogen atmosphere from room temperature to 160 ° C. over 2 hours and 20 minutes, then from 160 ° C. to 180 ° C. over 3 hours and 20 minutes, and at 180 ° C. By holding for 5 hours, it was subjected to solid phase polymerization, cooled, and then pulverized with a pulverizer to obtain a powdery liquid crystal polyester (B2).
• the flow start temperature of this liquid crystal polyester (B2) was 220 ° C.
• the liquid crystal polyester (B2) obtained above was heated in a nitrogen atmosphere from room temperature (23 ° C.) to 180 ° C. over 1 hour and 20 minutes, and then from 180 ° C. to 240 ° C. over 5 hours to 240.
• the liquid crystal polyester (B) (LC-B) in the form of powder was obtained by solid-phase polymerization by holding at ° C. for 5 hours and then cooling.
• the flow start temperature of the liquid crystal polyester (B) was 285 ° C.
• LC-C Liquid crystal polymer produced according to the following manufacturing method
• the liquid crystal polyester (C1) obtained above was subjected to solid phase polymerization by holding it at 250 ° C. for 3 hours in a nitrogen atmosphere, cooled, and then pulverized by a pulverizer to obtain a powdery liquid crystal polyester (C1). LC-C) was obtained.
• LC-D Liquid crystal polymer particles produced according to the following manufacturing method
• Liquid crystal polyester (D1) was pulverized using a jet mill (“KJ-200” manufactured by Kurimoto Iron Works Co., Ltd.) to obtain liquid crystal polyester particles (LC-D).
• the average particle size of the liquid crystal polyester particles was 9 ⁇ m.
• M-1 A commercially available aminophenol type epoxy resin (jER630LSD, manufactured by Mitsubishi Chemical Corporation) was used so that the solid content was the amount shown in Table 1.
• M-2 A commercially available thermosetting resin (SLK mainly containing a polymer-type curable compound, manufactured by Shin-Etsu Chemical Co., Ltd.) was used so that the solid content was the amount shown in Table 1.
• a commercially available hydrophobic silica sol having an average particle size of 45 nm (MEK-ST-L, solid content 30% by mass, methyl ethyl ketone (MEK) solvent, manufactured by Nissan Chemical Co., Ltd.) is shown in Table 1 as a solid content component. It was used so as to be the amount of.
• a solvent of commercially available polytetrafluoroethylene (PTFE) particles (polyflon PTFE D-210C, average particle size 0.25 ⁇ m, manufactured by Daikin Industries, Ltd.) is replaced with an N-methylpyrrolidone solvent in a polymer film. It was used so that the solid content was the amount shown in Table 1.
• PTFE polytetrafluoroethylene
• A-4 Copolymer (PFA) particles of ethylene tetrafluoride and perfluoroalkoxy ethylene (melting point 280 ° C., average particle diameter 0.2 ⁇ m to 0.5 ⁇ m, dielectric loss tangent 0.001)
• A-5 Commercially available hollow powder with an average particle size of 16 ⁇ m (Glass Bubbles iM30K, manufactured by 3M Japan Ltd.)
• A-6 Boron nitride particles (melting point> 500 ° C., HP40MF100 (manufactured by Mizushima Alloy Iron Co., Ltd.), dielectric loss tangent 0.0007)
• B-1 Commercially available ultra-high molecular weight polyethylene particles having an average particle size of 10 ⁇ m (Miperon PM200, manufactured by Mitsui Chemicals, Inc.) were used so that the solid content was the amount shown in Table 1.
• the obtained pellets were supplied into a cylinder from the same supply port of a twin-screw extruder having a screw diameter of 50 mm, and heated and kneaded at 340 ° C to 350 ° C to obtain a kneaded product. Subsequently, the kneaded material for layer A and the kneaded material for layer B were sent to a T-die having a multi-manifold structure, respectively, and the film-like kneaded material in a molten state was discharged and solidified on a chill roll. The obtained film was stripped from the chill roll and stretched by tenter to adjust the modulus of anisotropy (MD / TD) to 2 or less to obtain a polymer film.
• MD / TD modulus of anisotropy
• a copper layer was laminated by the following procedure for a polymer film produced by the above co-current B or the above coextrusion and not formed on a copper foil.
• the layer B side was placed on the obtained polymer film so as to be in contact with the roughened surface side of the copper foil (3EC-M1S-HTE, 12 ⁇ m manufactured by Mitsui Metal Mining Co., Ltd.), and the laminator (Vacuum manufactured by Nikko Materials Co., Ltd.) was placed.
• a laminator V-130 " a laminating treatment was performed for 1 minute under the conditions of 140 ° C. and a laminating pressure of 0.4 MPa.
• thermocompression bonding machine manufactured by Toyo Seiki Seisakusho Co., Ltd.
• the polymer films of Examples 1 to 22, which are the polymer films according to the present disclosure have a lower coefficient of linear expansion than the polymer films of Comparative Example 1 or 2, and have a metal layer for a substrate. Has excellent adhesion. Since the polymer film according to the present disclosure having a low coefficient of linear expansion approaches the coefficient of linear expansion of the copper layer, the curl of the laminated body was suppressed well. Further, the polymer films of Examples 1 to 22, which are the polymer films according to the present disclosure in which a resin film is laminated instead of the copper layer, are superior in adhesion to the resin film as compared with the polymer films of Comparative Example 1 or 2. It was a result.

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Laminated Bodies (AREA)

Priority Applications (3)

Applications Claiming Priority (4)

Related Child Applications (1)

Publications (1)

Family

ID=81754616

Family Applications (1)

Country Status (3)

Cited By (4)

Citations (6)

Family Cites Families (8)

• 2021
  • 2021-11-24 JP JP2022565344A patent/JPWO2022113961A1/ja active Pending
  • 2021-11-24 WO PCT/JP2021/042876 patent/WO2022113961A1/ja not_active Ceased
• 2023
  • 2023-05-16 US US18/318,705 patent/US12532414B2/en active Active

Patent Citations (6)

Also Published As

Similar Documents

Legal Events