WO2022102598A1 - ガラス基板 - Google Patents

ガラス基板 Download PDF

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Publication number
WO2022102598A1
WO2022102598A1 PCT/JP2021/041107 JP2021041107W WO2022102598A1 WO 2022102598 A1 WO2022102598 A1 WO 2022102598A1 JP 2021041107 W JP2021041107 W JP 2021041107W WO 2022102598 A1 WO2022102598 A1 WO 2022102598A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
less
glass
hole
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/041107
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
雅貴 牧田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to CN202180071873.XA priority Critical patent/CN116490476A/zh
Priority to KR1020237018190A priority patent/KR20230098828A/ko
Priority to US18/033,475 priority patent/US20230399253A1/en
Priority to JP2022561926A priority patent/JP7787500B2/ja
Publication of WO2022102598A1 publication Critical patent/WO2022102598A1/ja
Anticipated expiration legal-status Critical
Priority to JP2025231809A priority patent/JP2026026351A/ja
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/11—Glass compositions containing silica with 40% to 90% silica, by weight containing halogen or nitrogen
    • C03C3/112—Glass compositions containing silica with 40% to 90% silica, by weight containing halogen or nitrogen containing fluorine
    • C03C3/115—Glass compositions containing silica with 40% to 90% silica, by weight containing halogen or nitrogen containing fluorine containing boron
    • C03C3/118—Glass compositions containing silica with 40% to 90% silica, by weight containing halogen or nitrogen containing fluorine containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Definitions

  • the wiring density increases at the same time, and it is important to reduce the taper angle of the through hole.
  • the taper angle of the through hole is determined by the ratio of the expansion speed of the hole in the plate thickness direction at the time of etching and the expansion speed of the hole diameter. Then, by slowing down the expansion speed of the hole diameter, the taper angle can be reduced.
  • the expansion speed of the pore diameter is synonymous with the HF etching rate of the mother glass. Therefore, it is important to reduce the HF etching rate in order to produce a through hole having a small taper angle. Then, in order to lower the HF etching rate, the content of SiO 2 in the glass composition may be increased.
  • the amount of residue generated during etching is reduced, the residue is less likely to be clogged in the etching apparatus, the load when processing the residue is reduced, and it is necessary for the treatment of the residue. Cost is reduced.
  • the content of SiO 2 is 69.7% or more, the above-mentioned effect is increased, the HF etching rate is lowered, and the taper angle of the through hole can be reduced.
  • the content of SiO 2 is too high, the high-temperature viscosity becomes high, the amount of heat required for melting increases, the melting cost rises, and the raw material introduced into SiO 2 remains undissolved, resulting in a decrease in yield.
  • the upper limit of B 2 O 3 is 15.0%, more preferably 10.0%, more preferably 7.5%, more preferably 7.4%, more preferably 7.3%, and more. It is preferably 7.0%, more preferably 6.5%, more preferably 6.0%, more preferably 5.5%, and particularly preferably 5.0%.
  • Fe 2 O 3 is a component that is inevitably mixed from the glass raw material and is a component that colors the glass. If the content of Fe 2 O 3 is too small, the raw material cost tends to rise. On the other hand, if the content of Fe 2 O 3 is too large, the glass substrate is colored and it becomes difficult to use it for display applications.
  • the content of Fe 2 O 3 is preferably 0 to 300 mass ppm, more preferably 80 to 250 mass ppm, and particularly preferably 100 to 200 mass ppm.
  • the glass substrate of the present invention preferably has the following characteristics.
  • the Young's modulus is preferably 65 GPa or more, more preferably 70 GPa or more, more preferably 75 GPa or more, more preferably 77 GPa or more, and particularly preferably 78 GPa or more. If Young's modulus is too low, problems due to bending of the glass substrate are likely to occur.
  • the liquid phase temperature is preferably 1350 ° C. or lower, more preferably less than 1350 ° C., more preferably 1300 ° C. or lower, and particularly preferably 1000 to 1280 ° C. By doing so, it becomes easy to prevent a situation in which devitrified crystals are generated during molding and productivity is lowered. Further, since it is easy to mold by the overflow down draw method, it is easy to improve the surface quality of the glass substrate and it is possible to reduce the manufacturing cost of the glass substrate.
  • the liquidus temperature is an index of devitrification resistance, and the lower the liquidus temperature, the better the devitrification resistance.
  • phase separation was evaluated as " ⁇ " when no white turbidity was visually confirmed on the glass substrate and " ⁇ " when white turbidity was confirmed.
  • the temperature at the high temperature viscosity of 10 4.0 dPa ⁇ s, 10 3.0 dPa ⁇ s, and 10 2.5 dPa ⁇ s is a value measured by the platinum ball pulling method.
  • sample No. for 1, 4 to 5, 8 to 10, 24 to 43 fine holes were prepared by the following method, and the taper angle of the holes was confirmed.
  • a mixed acid of 2.5 mL / L HF and 1.0 mol / L HCl solution was used as the etching solution, and the temperature of the etching solution was set to 30 ° C. Further, in order to prevent the temperature from rising during the application of ultrasonic waves, the water in the ultrasonic device was circulated using a chiller to keep the water temperature at 30 ° C. An ultrasonic cleaner (VS-100III: manufactured by AS ONE) was used to apply the ultrasonic vibration. As a result, 28 kHz ultrasonic waves were applied to the etching solution.
  • VS-100III manufactured by AS ONE

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Glass Compositions (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/JP2021/041107 2020-11-16 2021-11-09 ガラス基板 Ceased WO2022102598A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202180071873.XA CN116490476A (zh) 2020-11-16 2021-11-09 玻璃基板
KR1020237018190A KR20230098828A (ko) 2020-11-16 2021-11-09 유리 기판
US18/033,475 US20230399253A1 (en) 2020-11-16 2021-11-09 Glass substrate
JP2022561926A JP7787500B2 (ja) 2020-11-16 2021-11-09 ガラス基板
JP2025231809A JP2026026351A (ja) 2020-11-16 2025-12-04 ガラス基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-190229 2020-11-16
JP2020190229 2020-11-16

Publications (1)

Publication Number Publication Date
WO2022102598A1 true WO2022102598A1 (ja) 2022-05-19

Family

ID=81601315

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/041107 Ceased WO2022102598A1 (ja) 2020-11-16 2021-11-09 ガラス基板

Country Status (5)

Country Link
US (1) US20230399253A1 (https=)
JP (2) JP7787500B2 (https=)
KR (1) KR20230098828A (https=)
CN (1) CN116490476A (https=)
WO (1) WO2022102598A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024142807A1 (ja) * 2022-12-26 2024-07-04 日本電気硝子株式会社 ガラス基板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044278A (ja) * 1998-05-20 2000-02-15 Nippon Electric Glass Co Ltd ディスプレイ用ガラス基板
WO2017038075A1 (ja) * 2015-08-31 2017-03-09 日本板硝子株式会社 微細構造付きガラスの製造方法
JP2017533171A (ja) * 2014-10-31 2017-11-09 コーニング インコーポレイテッド 寸法安定性の、迅速にエッチングされるガラス
WO2018025883A1 (ja) * 2016-08-05 2018-02-08 旭硝子株式会社 ガラス基板、半導体装置および表示装置
JP2019066613A (ja) * 2017-09-29 2019-04-25 大日本印刷株式会社 表示パネルおよびタイリング表示装置
WO2019084077A1 (en) * 2017-10-27 2019-05-02 Corning Incorporated PASSING GLASS BY MANUFACTURING USING PROTECTIVE MATERIAL
WO2020149040A1 (ja) * 2019-01-17 2020-07-23 日本板硝子株式会社 微細構造付ガラス基板及び微細構造付ガラス基板の製造方法
WO2020184175A1 (ja) * 2019-03-08 2020-09-17 日本電気硝子株式会社 ガラス板

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CN1764610A (zh) * 2003-03-31 2006-04-26 旭硝子株式会社 无碱玻璃
JP5088670B2 (ja) * 2006-04-11 2012-12-05 日本電気硝子株式会社 ディスプレイ用ガラス基板
US8947627B2 (en) * 2011-10-14 2015-02-03 Apple Inc. Electronic devices having displays with openings
JP6333282B2 (ja) * 2012-11-29 2018-05-30 コーニング インコーポレイテッド レーザー損傷及びエッチングによってガラス物品を製造する方法
JP2017030976A (ja) * 2013-12-04 2017-02-09 旭硝子株式会社 ガラス基板の仕上げ研磨方法、および、該方法で仕上げ研磨された無アルカリガラス基板
JP6575223B2 (ja) * 2014-08-27 2019-09-18 Ａｇｃ株式会社 無アルカリガラス
US10717670B2 (en) * 2015-02-10 2020-07-21 Nippon Sheet Glass Company, Limited Glass for laser processing and method for producing perforated glass using same
JP6643263B2 (ja) * 2015-02-13 2020-02-12 日本板硝子株式会社 レーザ加工用ガラス及びそれを用いた孔付きガラスの製造方法
JP7292006B2 (ja) * 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
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US11078112B2 (en) * 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
JP2018205525A (ja) 2017-06-05 2018-12-27 ソニー株式会社 表示装置および電子機器
WO2019026858A1 (ja) * 2017-07-31 2019-02-07 大日本印刷株式会社 表示パネルおよび表示装置
JP7064706B2 (ja) * 2017-08-28 2022-05-11 日本電気硝子株式会社 レーザーアシストエッチング用ガラス基板、及びそれを用いた有孔ガラス基板の製造方法
US20190119150A1 (en) * 2017-10-20 2019-04-25 Corning Incorporated Methods for laser processing transparent workpieces using pulsed laser beam focal lines and chemical etching solutions
US11554984B2 (en) * 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11952310B2 (en) * 2019-05-10 2024-04-09 Corning Incorporated Silicate glass compositions useful for the efficient production of through glass vias
US20200354262A1 (en) * 2019-05-10 2020-11-12 Corning Incorporated High silicate glass articles possessing through glass vias and methods of making and using thereof
WO2022026348A1 (en) * 2020-07-30 2022-02-03 Corning Incorporated High boron oxide low alumina and alkali-free glasses for through glass via applications

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044278A (ja) * 1998-05-20 2000-02-15 Nippon Electric Glass Co Ltd ディスプレイ用ガラス基板
JP2017533171A (ja) * 2014-10-31 2017-11-09 コーニング インコーポレイテッド 寸法安定性の、迅速にエッチングされるガラス
WO2017038075A1 (ja) * 2015-08-31 2017-03-09 日本板硝子株式会社 微細構造付きガラスの製造方法
WO2018025883A1 (ja) * 2016-08-05 2018-02-08 旭硝子株式会社 ガラス基板、半導体装置および表示装置
JP2019066613A (ja) * 2017-09-29 2019-04-25 大日本印刷株式会社 表示パネルおよびタイリング表示装置
WO2019084077A1 (en) * 2017-10-27 2019-05-02 Corning Incorporated PASSING GLASS BY MANUFACTURING USING PROTECTIVE MATERIAL
WO2020149040A1 (ja) * 2019-01-17 2020-07-23 日本板硝子株式会社 微細構造付ガラス基板及び微細構造付ガラス基板の製造方法
WO2020184175A1 (ja) * 2019-03-08 2020-09-17 日本電気硝子株式会社 ガラス板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024142807A1 (ja) * 2022-12-26 2024-07-04 日本電気硝子株式会社 ガラス基板

Also Published As

Publication number Publication date
CN116490476A (zh) 2023-07-25
JP2026026351A (ja) 2026-02-16
JP7787500B2 (ja) 2025-12-17
US20230399253A1 (en) 2023-12-14
JPWO2022102598A1 (https=) 2022-05-19
TW202229192A (zh) 2022-08-01
KR20230098828A (ko) 2023-07-04

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