WO2022095652A1 - 一种超声激光机械复合加工方法、超声波振动夹具、机床及激光器 - Google Patents

一种超声激光机械复合加工方法、超声波振动夹具、机床及激光器 Download PDF

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WO2022095652A1
WO2022095652A1 PCT/CN2021/122295 CN2021122295W WO2022095652A1 WO 2022095652 A1 WO2022095652 A1 WO 2022095652A1 CN 2021122295 W CN2021122295 W CN 2021122295W WO 2022095652 A1 WO2022095652 A1 WO 2022095652A1
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laser
ultrasonic
workpiece
processed
tool
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English (en)
French (fr)
Inventor
王成勇
李伟秋
颜炳姜
陈守峰
郑李娟
杜策之
胡小月
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Huizhuan Technology Group Co Ltd
Keyizhan Intelligent Equipment Co Ltd Guangzhou Branch
Guangdong University of Technology
Conprofe Technology Group Co Ltd
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Huizhuan Technology Group Co Ltd
Keyizhan Intelligent Equipment Co Ltd Guangzhou Branch
Guangdong University of Technology
Conprofe Technology Group Co Ltd
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Publication of WO2022095652A1 publication Critical patent/WO2022095652A1/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Definitions

  • the invention relates to the technical field of methods for processing hard and brittle materials, in particular to an ultrasonic laser-mechanical composite processing method, an ultrasonic vibration fixture, a machine tool and a laser.
  • Refractory hard and brittle materials represented by ceramics, glass, sapphire, etc., have the characteristics of corrosion resistance, high temperature resistance, wear resistance, high hardness and high brittleness. They are widely used in various industries such as consumer electronics, semiconductors, molds, solar energy and aerospace. .
  • Hard and brittle materials are typical difficult-to-machine materials.
  • the commonly used processing methods for hard and brittle materials include grinding and milling.
  • the grinding efficiency is low and the milling quality is poor.
  • the two processing methods have residual stress on the surface of the workpiece under the action of the tool. High, it is easy to produce microscopic cracks, resulting in serious surface and sub-surface damage.
  • An ultrasonic laser-mechanical composite processing method comprising the following steps:
  • the workpiece to be processed is placed on the ultrasonic vibration fixture, and the ultrasonic vibration generated by the ultrasonic vibration fixture is transmitted to the workpiece to be processed, so that the workpiece to be processed generates ultrasonic vibration;
  • the laser generated by the laser performs rough machining on the workpiece to be processed, and the laser processing produces a damaged layer on the workpiece to be processed, and the ultrasonic vibration is used to increase the expansion of the damaged layer;
  • the workpiece to be machined is finished by the tool.
  • the method before the laser performs rough machining on the workpiece to be processed, the method further includes:
  • the method further includes:
  • the adjustment range of ultrasonic frequency and ultrasonic amplitude is determined, and matching laser power and scanning speed can be used to achieve matching expansion of ultrasonic and laser.
  • the method before finishing the workpiece to be machined by the tool, the method further includes:
  • the appropriate cutting depth, cutting width, feed rate and cutting speed are selected.
  • the method before finishing the workpiece to be machined by the tool, the method further includes:
  • the tool is installed on the ultrasonic tool handle, and the ultrasonic vibration generated by the ultrasonic tool handle is transmitted to the tool, so that the tool generates ultrasonic vibration.
  • the laser wavelength ranges from 335 nm to 1064 nm
  • the power ranges from 10 W to 500 W
  • the pulse width is less than 30 ns.
  • the frequency range of the ultrasonic wave is 16000 Hz-18000 Hz, and the ultrasonic amplitude adjustment range is 2 ⁇ m-3 ⁇ m.
  • the tool is a solid PCD micro-edge milling tool.
  • the cutting depth is within 0.2 mm
  • the cutting width is within 2 mm
  • the feed rate is within 5000 mm/min
  • the cutting speed is 15000 r/min ⁇ 24000 r/min.
  • the material of the workpiece to be processed is any one of glass, ceramics, sapphire, silicon carbide and single crystal silicon.
  • An ultrasonic vibration fixture is used to realize the ultrasonic laser-machine composite processing method as described in any one of the above.
  • a machine tool which is used to realize the ultrasonic laser-mechanical composite machining method described in any one of the above.
  • a laser which is used to realize the ultrasonic laser-mechanical composite processing method described in any one of the above.
  • the laser generated by the laser performs rough machining on the workpiece to be processed, and the laser processing produces a damaged layer with cracks on the workpiece to be processed.
  • the ultrasonic vibration is used to increase the expansion of the damaged layer, and then through the tool Finish machining the workpiece to be machined.
  • Ultrasonic vibration is conducive to the shedding of droplets after laser ablation of the workpiece to be processed, thus increasing the contact between the workpiece to be processed and the laser; laser ablation will cause a damage layer of micro-cracks on the surface of the workpiece to be processed.
  • FIG. 1 is a schematic flowchart of an ultrasonic laser-mechanical composite processing method in one embodiment
  • FIG. 2 is a simplified schematic diagram of an ultrasonic vibration fixture, a laser and a workpiece to be machined in one embodiment
  • FIG. 3 is a schematic flowchart of an ultrasonic laser-mechanical composite processing method in a preferred embodiment
  • FIG. 4 is a surface roughness diagram of a glass workpiece after processing by the processing method in the preferred embodiment
  • Figure 5 is the surface roughness diagram of the glass workpiece after rough machining with a 350# grinding wheel and finishing with a tool in the comparative example;
  • FIG. 6 is a schematic view of the depth SEM of the damaged layer after rough machining the glass workpiece by the processing method in the preferred embodiment
  • FIG. 7 is a schematic view of the depth SEM of the subsurface damage zone after finishing the glass workpiece by using the processing method in the preferred embodiment
  • Figure 8 is a schematic view of the depth SEM of the damaged layer of the glass workpiece rough-machined with a 350# grinding wheel in the comparative example
  • FIG. 9 is a schematic view of the depth SEM of the subsurface damage area after the workpiece is processed by a tool in the comparative example.
  • an ultrasonic laser-mechanical composite processing method in one embodiment includes the following steps:
  • step S110 the workpiece to be processed is placed on the ultrasonic vibration fixture, and the ultrasonic vibration generated by the ultrasonic vibration fixture is transmitted to the workpiece to be processed, so that the workpiece to be processed generates ultrasonic vibration.
  • the workpiece 10 to be processed is placed on the ultrasonic vibration fixture 20 , and the ultrasonic vibration fixture 20 is electrically connected to the ultrasonic generator 30 .
  • Step S120 in the case that the workpiece to be processed generates ultrasonic vibration, the laser generated by the laser performs rough machining on the workpiece to be processed, and the laser processing produces a damaged layer on the workpiece to be processed, and the ultrasonic vibration is used to increase the expansion of the damaged layer. Therefore, while the laser is processing the workpiece to be processed, the ultrasonic vibration generated by the ultrasonic vibration fixture is transmitted to the workpiece to be processed.
  • step S130 the workpiece to be processed is finished by the tool.
  • the tool may be a milling tool.
  • the tool may be a solid PCD micro-edge milling tools.
  • the laser generated by the laser performs rough machining on the workpiece to be processed, and the laser processing produces a damaged layer with cracks on the workpiece to be processed.
  • the ultrasonic vibration is used to increase the expansion of the damaged layer, and then through the tool Finish machining the workpiece to be machined.
  • Ultrasonic vibration is conducive to the shedding of droplets after laser ablation of the workpiece to be processed, thus increasing the contact between the workpiece to be processed and the laser; laser ablation will cause a damage layer of micro-cracks on the surface of the workpiece to be processed.
  • the wavelength, pulse width and power of the laser are selected according to the material properties and processing requirements of the workpiece to be processed.
  • the material of the workpiece to be processed can be hard and brittle materials such as glass, ceramics, sapphire, silicon carbide or single crystal silicon.
  • the wavelength range of the laser is 335nm-1064nm
  • the power range is 10W-500W
  • the pulse width is less than 30ns. If the power range of the laser is too large, it is easy to cause cracking of the workpiece. If the power of the laser is too small, the processing efficiency is too low, so an appropriate range of 10W to 500W is selected.
  • the laser power ranges from 10W to 100W.
  • the material of the workpiece to be processed is glass as an example for illustration.
  • the specific selection process is roughly as follows: the test workpiece is placed on the ultrasonic vibration fixture, and the ultrasonic generator has not been started at this time. That is, the test workpiece does not generate ultrasonic vibration. Then adjust the laser parameters (including laser wavelength, pulse width and power, etc.), so that the processing effect of the test workpiece is better, without cracking, and the surface of the test workpiece has a certain damage layer. From this, parameters such as laser wavelength, pulse width and power of the laser are determined.
  • Step S202 Determine the ultrasonic frequency and the ultrasonic amplitude adjustment range according to the subsurface damage characteristics of the material to be processed in the laser processing, and cooperate with the laser power and scanning speed to achieve matching loss expansion of the ultrasonic wave and the laser.
  • the frequency range of the ultrasonic wave is 16000 Hz to 18000 Hz
  • the ultrasonic amplitude adjustment range is 2 ⁇ m to 3 ⁇ m.
  • the specific determination process is roughly as follows: after adjusting the parameters of the laser (laser wavelength, pulse width and power, etc.), then adjusting the parameters of the ultrasonic wave (including the frequency and amplitude of the ultrasonic wave) can ensure that the damage layer on the test workpiece is further expanded. After the laser parameters and ultrasonic parameters are determined, the workpiece to be processed can be processed. The workpiece to be processed at this time is made of the same material as the above-mentioned test workpiece, for example, no glass. If you need to process workpieces of different materials, you need to reselect the laser parameters and ultrasonic parameters.
  • step S203 the workpiece to be processed is placed on the ultrasonic vibration fixture, and the ultrasonic vibration generated by the ultrasonic vibration fixture is transmitted to the workpiece to be processed, so that the workpiece to be processed generates ultrasonic vibration.
  • the workpiece to be processed is directly placed on the ultrasonic vibration fixture. It should be noted that, in other embodiments, the workpiece to be processed may also be indirectly placed on the ultrasonic vibration fixture, as long as it is ensured that the workpiece to be processed can generate qualified ultrasonic vibration.
  • Step S204 when the workpiece to be processed generates ultrasonic vibration, the laser generated by the laser performs rough machining on the workpiece to be processed, and the laser processing generates a damaged layer on the workpiece to be processed, and the ultrasonic vibration is used to increase the expansion of the damaged layer. That is, in the present embodiment, while the workpiece is processed by the laser, ultrasonic vibration is also generated on the workpiece, so that the laser and ultrasonic vibration are combined to process the workpiece.
  • Laser processing ablates the material of the workpiece to be processed, and ultrasonic vibration is conducive to the fall off of the droplet after laser ablation of the workpiece to be processed, thus increasing the contact between the workpiece to be processed and the laser; secondly, laser ablation will cause the workpiece to be processed.
  • the damage layer with micro-cracks on the surface under the action of ultrasonic vibration, after the formation of micro-cracks, due to the existence of high-frequency vibration, the internal stress of the material is released more completely, and the expansion of micro-cracks is stably increased, thereby stably expanding the expansion of the damaged layer. .
  • the depth of the damage layer produced by laser processing on the glass surface is controlled between 100 ⁇ m and 130 ⁇ m, and the damage layer can be stably expanded by about 15% to 20% (phase). compared to laser-only processing).
  • Step S205 the tool is installed on the ultrasonic tool handle, and the ultrasonic vibration generated by the ultrasonic tool handle is transmitted to the tool, so that the tool generates ultrasonic vibration. Therefore, ultrasonic vibration is also added to the tool, which can further improve the surface quality of the workpiece to be machined.
  • the tool is a solid PCD micro-edge milling tool.
  • the tool can also be a milling tool of other materials.
  • step S205 can also be omitted, and the workpiece can be processed directly by using an integral PCD micro-edge cutting tool.
  • Step S206 selecting an appropriate cutting depth, cutting width, feed amount and cutting speed according to the subsurface damage characteristics of the workpiece material to be machined during the combined laser and ultrasonic vibration machining process.
  • the cutting depth is within 0.2mm
  • the cutting width is within 2mm
  • the feed rate is within 5000mm/min
  • the cutting speed is 15000r/min ⁇ 24000r/min.
  • step S207 the workpiece to be processed is finished by the tool.
  • the workpiece has been subjected to the previous combined laser and ultrasonic vibration processing. Therefore, the surface of the processed workpiece will produce a damaged layer, which will reduce the mechanical properties of the material.
  • the cutting force and tool wear can be reduced, and the processing efficiency can be improved.
  • the overall PCD micro-blade milling tool and ultrasonic tool shank finishing method can make the surface quality of glass processing reach about 5nm ⁇ 10nm.
  • the grinding method reduces the surface roughness of the workpiece by more than 20%.
  • the glass surface roughness Sa was 10 nm.
  • the roughness of the workpiece surface obtained by using a 350# grinding wheel for rough machining and a tool for finishing machining in the traditional process (as a comparative example)
  • the roughness Sa is 12 nm.
  • the workpiece processed by the processing method of this preferred embodiment has smaller surface roughness and higher surface quality.
  • FIG. 6 is a SEM image of the depth of the damaged layer after rough machining of the glass workpiece by using the combined laser and ultrasonic vibration processing methods.
  • the figure shows that the depth of the damaged layer 11 is 115 ⁇ m.
  • FIG. 7 is a SEM schematic diagram of the depth of the subsurface damage zone 12 after the composite processing of laser and ultrasonic vibration, and then the processing method of integral PCD micro-blade milling tool and ultrasonic tool shank is used to finish the glass workpiece.
  • the depth of its subsurface damage zone 12 is shown in 16.3 ⁇ m.
  • FIG. 6 is a SEM image of the depth of the damaged layer after rough machining of the glass workpiece by using the combined laser and ultrasonic vibration processing methods.
  • the figure shows that the depth of the damaged layer 11 is 115 ⁇ m.
  • FIG. 7 is a SEM schematic diagram of the depth of the subsurface damage zone 12 after the composite processing of laser and ultrasonic vibration, and then the processing method of integral PCD micro-blade milling tool
  • FIG. 8 which is a schematic view of the depth SEM of the damaged layer 11 ′ of the glass workpiece by using a 350# grinding wheel for rough machining. As shown in the accompanying drawing, the depth of the damaged layer 11 ′ is 120 ⁇ m.
  • FIG. 9 which is a SEM schematic diagram of the depth of the subsurface damaged area 12' after the workpiece is processed by a tool. As shown in the figure, the depth of the subsurface damaged area 12' is 45.4 ⁇ m. Obviously, the depth of the subsurface damage zone 12 of the glass workpiece processed by this preferred embodiment is smaller, which means that the surface quality of the glass workpiece is higher.
  • the maximum cutting force in the axial direction (Z direction, the direction of the tool close to the workpiece) is reduced by more than 113%, and the maximum cutting force in the Y direction is reduced by more than 100%.
  • the present invention also provides an ultrasonic vibration fixture, which is used to realize the above-mentioned ultrasonic laser-mechanical composite processing method.
  • the present invention also provides a machine tool, which is used for realizing the above-mentioned ultrasonic laser-mechanical composite machining method.
  • the present invention also provides a laser, which is used to realize the above-mentioned ultrasonic laser-mechanical composite processing method.

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Abstract

一种超声激光机械复合加工方法，在待加工工件产生超声波振动的情况下，激光器产生的激光对待加工工件进行粗加工，激光加工使待加工工件上产生具有裂纹的损伤层，超声波振动用于增大损伤层的扩展，然后通过刀具对待加工工件进行精加工。超声波振动有利于激光对待加工工件烧蚀后熔滴的脱落，增加了待加工工件与激光的接触；激光烧蚀作用会导致待加工工件表面产生微裂纹的损伤层，在超声波振动的作用下，在微裂纹形成后由于高频振动的存在使材料内部应力释放更完全，稳定增大微裂纹的扩展，进而稳定扩大了损伤层的扩展，有利于刀具对加工工件精加工时材料的去除，降低切削力和刀具磨损，提升加工效率。还涉及一种超声波振动夹具、一种机床及一种激光器。

Description

一种超声激光机械复合加工方法、超声波振动夹具、机床及激光器 技术领域
本发明涉及对硬脆材料进行加工的方法技术领域，特别是涉及一种超声激光机械复合加工方法、超声波振动夹具、机床及激光器。
背景技术
以陶瓷、玻璃、蓝宝石等为代表的难加工硬脆材料，具有抗腐蚀、耐高温、抗磨损、硬度高、脆性大等特点广泛用于消费电子、半导体、模具、太阳能和航空航天等各个行业。
硬脆材料属于典型难加工材料，硬脆材料常用加工方式有磨削加工和铣削加工，磨削加工效率低，铣削加工加工质量差，而且两种加工方法，工件在刀具的作用下表面残余应力高，极易产生微观裂纹，导致表面和亚表面损伤比较严重。
采用激光对硬脆材料工件进行加工的方式，激光烧蚀作用会使工件产生热损伤，从而降低材料的力学性能，有利于机械加工进一步去除。但是，由于激光大功率加工损伤太大，会导致整个工件开裂，难以实现工件上的裂纹稳定扩展，无法保证损伤层的稳定扩大。
发明内容
基于此，有必要针对上述技术问题，提供一种可以实现工件上裂纹稳定扩展，保证损伤层的稳定扩大的超声激光机械复合加工方法、超声波振动夹具、机床及激光器。
一种超声激光机械复合加工方法，包括以下步骤：
将待加工工件置于超声波振动夹具上，超声波振动夹具产生的超声波振动传递至待加工工件上，使待加工工件产生超声波振动；
在待加工工件产生超声波振动的情况下，激光器产生的激光对待加工工件进行粗加工，激光加工使待加工工件上产生损伤层，超声波振动用于增大损伤层的扩展；
通过刀具对待加工工件进行精加工。
在其中一个实施例中，在激光器对待加工工件进行粗加工之前，还包括：
根据待加工工件的材料特性和加工要求选择激光波长、脉宽及功率。
在其中一个实施例中，在确定好激光波长、脉宽及功率后，还包括：
根据激光加工中待加工材料的亚表面损伤特性确定超声波频率、超声波振幅调节范围，配合激光功率和扫描速度，实现超声和激光的匹配扩损。
在其中一个实施例中，在通过刀具对待加工工件进行精加工之前，还包括：
根据激光和超声波振动复合加工过程中待加工工件材料的亚表面损伤特性选择合适的切削深度、切削宽度、进给量及切削速度。
在其中一个实施例中，在通过刀具对待加工工件进行精加工之前，还包括：
将刀具安装在超声波刀柄上，超声波刀柄产生的超声波振动传递至刀具上，使刀具产生超声波振动。
在其中一个实施例中，所述激光波长范围为335nm～1064nm，功率范围为10W～500W，脉宽小于30ns。
在其中一个实施例中，所述超声波的频率范围为16000Hz～18000Hz，超声波振幅调节范围为2μm～3μm。
在其中一个实施例中，所述刀具为整体PCD微刃铣削刀具。
在其中一个实施例中，切削深度范围为0.2mm以内，切削宽度范围为2mm以内，进给量范围为5000mm/min以内，切削速度为15000r/min～24000r/min。
在其中一个实施例中，所述待加工工件的材料为玻璃、陶瓷、蓝宝石、碳化硅和单晶硅的任一种。
一种超声波振动夹具，所述超声波振动夹具用于实现如上任一项所述的超声激光机械复合加工方法。
一种机床，所述机床用于实现如上任一项所述的超声激光机械复合加工方法。
一种激光器，所述激光器用于实现如上任一项所述的超声激光机械复合加工方法。
上述超声激光机械复合加工方法至少具有以下优点：
在待加工工件产生超声波振动的情况下，激光器产生的激光对待加工工件进行粗加工，激光加工使待加工工件上产生具有裂纹的损伤层，超声波振动用于增大损伤层的扩展，然后通过刀具对待加工工件进行精加工。超声波振动有利于激光对待加工工件烧蚀后熔滴的脱落，因此增加了待加工工件与激光的接触；激光烧蚀作用会导致待加工工件表面产生微裂纹的损伤层，在超声波振动的作用下，在微裂纹形成后由于高频振动的存在使材料内部应力释放更完全，稳定增大微裂纹的扩展，进而稳定扩大了损伤层的扩展，有利于刀具对加工工件精加工时材料的去除，降低切削力和刀具磨损，提升加工效率，提高精加工后加工表面质量，实现硬脆材料的高效精密低损伤去除。
附图说明
图1为一实施方式中超声激光机械复合加工方法的流程示意图；
图2为一实施方式中超声波振动夹具、激光器和待加工工件的简化示意图；
图3为优选实施方式中的超声激光机械复合加工方法的流程示意图；
图4为采用优选实施方式中的加工方法对玻璃工件加工后的表面粗糙度图；
图5为对比例中采用350#砂轮进行粗加工，刀具进行精加工的方式对玻璃工件加工后的表面粗糙度图；
图6为采用优选实施方式中的加工方法对玻璃工件进行粗加工后的损伤层的深度SEM示意图；
图7为采用优选实施方式中的加工方法对玻璃工件进行精加工后的亚表面损伤区的深度SEM示意图；
图8为对比例中采用350#砂轮对玻璃工件进行粗加工的损伤层的深度SEM示意图；
图9为对比例中采用刀具进行对工件进行加工后的亚表面损伤区的深度SEM示意图。
图中，10、待加工工件；20、超声波振动夹具；30、超声波发生器，11，11’、损伤层；12，12’、亚表面损伤区。
具体实施方式
为使本实用新型的上述目的、特征和优点能够更加明显易懂，下面结合附图对本实用新型的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本实用新型。但是本实用新型能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本实用新型内涵的情况下做类似改进，因此本实用新型不受下面公开的具体实施的限制。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一 个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本实用新型的技术领域的技术人员通常理解的含义相同。本文中在本实用新型的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本实用新型。以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
请参阅图1，一实施方式中的超声激光机械复合加工方法，包括以下步骤：
步骤S110，将待加工工件置于超声波振动夹具上，超声波振动夹具产生的超声波振动传递至加工工件上，使待加工工件产生超声波振动。具体地，如图2所示，待加工工件10放置在超声波振动夹具20上，超声波振动夹具20与超声波发生器30电连接。
步骤S120，在待加工工件产生超声波振动的情况下，激光器产生的激光对待加工工件进行粗加工，激光加工使待加工工件上产生损伤层，超声波振动用于增大损伤层的扩展。因此，激光对待加工工件进行加工的同时，超声波振动夹具产生的超声波振动传递至待加工工件上。
步骤S130，通过刀具对待加工工件进行精加工。具体地，刀具可以为铣削刀具。例如，为整体PCD微刃铣削刀具。
上述超声激光机械复合加工方法至少具有以下优点：
在待加工工件产生超声波振动的情况下，激光器产生的激光对待加工工件 进行粗加工，激光加工使待加工工件上产生具有裂纹的损伤层，超声波振动用于增大损伤层的扩展，然后通过刀具对待加工工件进行精加工。超声波振动有利于激光对待加工工件烧蚀后熔滴的脱落，因此增加了待加工工件与激光的接触；激光烧蚀作用会导致待加工工件表面产生微裂纹的损伤层，在超声波振动的作用下，在微裂纹形成后由于高频振动的存在使材料内部应力释放更完全，稳定增大微裂纹的扩展，进而稳定扩大了损伤层的扩展，有利于刀具对加工工件精加工时材料的去除，降低切削力和刀具磨损，提升加工效率，提高精加工后加工表面质量，实现硬脆材料的高效精密低损伤去除。
以下，将以一优选实施方式的超声激光机械复合加工方法为例做详细阐述。
一种优选实施方式中的超声激光机械复合加工方法，包括以下步骤：
步骤S201，根据待加工工件的材料特性和加工要求选择激光波长、脉宽及功率。待加工工件的材质可以为玻璃、陶瓷、蓝宝石、碳化硅或单晶硅等硬脆性材料。例如，激光的波长范围为335nm～1064nm，功率范围为10W～500W，脉宽小于30ns。如果激光的功率范围过大，则容易导致工件开裂，如果激光的功率过小，则加工效率过于低下，故而选择10W～500W的合适范围。优选地，激光功率的范围为10W～100W。例如，本实施方式中，以待加工工件的材质为玻璃作为举例说明。
具体的选择过程大致为：将试验工件置于超声波振动夹具上，此时超声波发生器暂未启动。即，试验工件不会产生超声波振动。然后调节激光参数(包括激光波长、脉宽和功率等)，使得试验工件的加工效果较好，不会开裂，试验工件表面具有一定的损伤层。由此确定激光的激光波长、脉宽和功率等参数。
步骤S202，根据激光加工中待加工材料的亚表面损伤特性确定超声波频率、超声波振幅调节范围，配合激光功率和扫描速度，实现超声和激光的匹配扩损。 例如，超声波的频率范围为16000Hz～18000Hz，超声波振幅调节范围为2μm～3μm。
具体的确定过程大致为：等激光的参数(激光波长、脉宽和功率等)调节好后，再调节超声波的参数(包括超声波的频率和振幅)，能够保证试验工件上的损伤层进一步扩展。待激光参数和超声波参数都确定好之后，就可以开始对待加工工件进行加工。此时的待加工工件与上述试验工件的材料相同，例如都未玻璃。若需要加工不同材料的工件时，需要重新选择激光参数和超声波参数。
步骤S203，将待加工工件置于超声波振动夹具上，超声波振动夹具产生的超声波振动传递至待加工工件上，使待加工工件产生超声波振动。在本实施方式中，待加工工件是直接置于超声波振动夹具上的。需要说明的是，在其他的实施方式中，待加工工件还可以间接地置于超声波振动夹具上，只要保证待加工工件上能够产生符合条件的超声波振动即可。
步骤S204，在待加工工件产生超声波振动的情况下，激光器产生的激光对待加工工件进行粗加工，激光加工使待加工工件上产生损伤层，超声波振动用于增大损伤层的扩展。即，在本实施方式中，采用激光对工件进行加工的同时，工件上还产生超声波振动，形成激光加超声波振动复合对加工工件进行加工的方式。
激光加工对待加工工件的材料进行烧蚀，同时超声波振动有利于激光对待加工工件烧蚀后熔滴的脱落，因此增加了待加工工件与激光的接触；其次，激光烧蚀作用会导致待加工工件表面产生微裂纹的损伤层，在超声波振动的作用下，在微裂纹形成后由于高频振动的存在使材料内部应力释放更完全，稳定增大微裂纹的扩展，进而稳定扩大了损伤层的扩展。经过试验分析得知，采用激光与超声波振动配合做粗加工的方式，玻璃表面激光加工产生的损伤层的深度 大概控制在100μm～130μm之间，损伤层可稳定扩展约15％～20％(相较于仅激光进行加工的方式)。
步骤S205，将刀具安装在超声波刀柄上，超声波刀柄产生的超声波振动传递至刀具上，使刀具产生超声波振动。因此，在刀具上也增加了超声波振动，可以进一步提高对待加工工件加工的表面质量。在本实施方式中，刀具为整体PCD微刃铣削刀具。当然，刀具还可以为其他材质的铣削刀具。在其他的实施方式中，还可以省去步骤S205，而直接采用整体PCD微刃切削刀具对工件进行加工。
步骤S206，根据激光和超声波振动复合加工过程中待加工工件材料的亚表面损伤特性选择合适的切削深度、切削宽度、进给量及切削速度。例如，切削深度范围为0.2mm以内，切削宽度范围为2mm以内，进给量范围为5000mm/min以内，切削速度为15000r/min～24000r/min。通过将切削深度、切削宽度、进给量和切削速度设置成上述参数，可以保证工件表面材料(可以是损伤层或者损伤层+部分非损伤层)的高效去除，同时降低刀具的损耗。
步骤S207，通过刀具对待加工工件进行精加工。在本实施方式中的加工步骤中，工件已经经过前面的激光和超声波振动复合加工，因此，加工工件的表面会产生损伤层，降低材料的力学性能，在后续利用刀具对工件进行机加工时，相比于传统通过刀具直接对工件进行加工的方式，可以降低切削力和刀具磨损，提高加工效率。
经过试验分析得知，经过激光和超声波振动复合粗加工后，再采用整体PCD微刃铣削刀具和超声波刀柄精加工的方式，可以使得玻璃加工表面质量达到5nm～10nm左右，相比于刀具直接磨削加工的方式，工件表面粗糙度降低20％以上。如图4所示，采用上述超声激光机械加工方法对玻璃进行加工后，玻璃表 面粗糙度Sa为10nm。如图5所示，为传统工艺(作为对比例)中采用350#砂轮进行粗加工，刀具进行精加工的方式所得工件表面的粗糙度，其粗糙度Sa为12nm。本优选实施方式加工方法加工出的工件，其表面粗糙度更小，表面质量更高。
请参阅图6，为采用激光和超声波振动复合加工方式对玻璃工件粗加工后的损伤层的深度SEM图，附图中显示其损伤层11的深度为115μm。请参阅图7，为采用激光和超声波振动复合加工后，再采用整体PCD微刃铣削刀具和超声波刀柄的加工方式对玻璃工件进行精加工，其亚表面损伤区12的深度SEM示意图，附图中显示为其亚表面损伤区12的深度16.3μm。请参阅图8，为采用350#砂轮对玻璃工件进行粗加工的损伤层11’的深度SEM示意图，附图中显示，其损伤层11’的深度为120μm。请参阅图9，为采用刀具进行对工件进行加工后的亚表面损伤区12’的深度SEM示意图，附图中显示，其亚表面损伤区12’的深度为45.4μm。显然，采用本优选实施方式加工出的玻璃工件的亚表面损伤区12的深度更小，意味着玻璃工件表面质量更高。
请参阅下表，为采用本优选实施方式的加工方法对工件进行粗加工和精加工和采用350#砂轮进行粗加工，再利用刀具进行精加工时的切削力对比表格。其中，采用本优选实施方式中的加工方法进行加工时，对玻璃工件进行精加工时，其轴向最大切削力Fz Max为15.04N，其y向最大切削力Fy Max为1.481N。采用350#砂轮进行粗加工，再利用刀具进行精加工时，其轴向最大切削力Fz Max为32.41N，其y向最大切削力Fy Max为3.6N。通过对比可知，采用本优选实施方式的加工方法，其轴向(Z向，刀具沿靠近工件的方向)最大切削力降低113％以上，Y向最大切削力降低100％以上。
Figure PCTCN2021122295-appb-000001
切削力越小说明切削过程中崩碎概率比较小，这意味着材料去除更顺利，加工之后表面凹坑破碎较少，因此加工质量较高；同时切削力小，对刀具磨损，冲击小，可以减缓刀具磨损，延长刀具寿命。
本发明还提供一种超声波振动夹具，超声波振动夹具用于实现上述的超声激光机械复合加工方法。
本发明还提供一种机床，机床用于实现上述的超声激光机械复合加工方法。
本发明还提供一种激光器，激光器用于实现上述的超声激光机械复合加工方法。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (13)

  1. 一种超声激光机械复合加工方法，其特征在于，包括以下步骤：
    将待加工工件置于超声波振动夹具上，超声波振动夹具产生的超声波振动传递至待加工工件上，使待加工工件产生超声波振动；
    在待加工工件产生超声波振动的情况下，激光器产生的激光对待加工工件进行粗加工，激光加工使待加工工件上产生损伤层，超声波振动用于增大损伤层的扩展；
    通过刀具对待加工工件进行精加工。
  2. 根据权利要求1所述的超声激光机械复合加工方法，其特征在于，在激光器对待加工工件进行粗加工之前，还包括：
    根据待加工工件的材料特性和加工要求选择激光波长、脉宽及功率。
  3. 根据权利要求2所述的超声激光机械复合加工方法，其特征在于，在确定好激光波长、脉宽及功率后，还包括：
    根据激光加工中待加工材料的亚表面损伤特性确定超声波频率、超声波振幅调节范围，配合激光功率和扫描速度，实现超声和激光的匹配扩损。
  4. 根据权利要求3所述的超声激光机械复合加工方法，其特征在于，在通过刀具对待加工工件进行精加工之前，还包括：
    根据激光和超声波振动复合加工过程中待加工工件材料的亚表面损伤特性选择合适的切削深度、切削宽度、进给量及切削速度。
  5. 根据权利要求3所述的超声激光机械复合加工方法，其特征在于，在通过刀具对待加工工件进行精加工之前，还包括：
    将刀具安装在超声波刀柄上，超声波刀柄产生的超声波振动传递至刀具上，使刀具产生超声波振动。
  6. 根据权利要求3所述的超声激光机械复合加工方法，其特征在于，所述 激光波长范围为335nm～1064nm，功率范围为10W～500W，脉宽小于30ns。
  7. 根据权利要求6所述的超声激光机械复合加工方法，其特征在于，所述超声波的频率范围为16000Hz～18000Hz，超声波振幅调节范围为2μm～3μm。
  8. 根据权利要求1所述的超声激光机械复合加工方法，其特征在于，所述刀具为整体PCD微刃铣削刀具。
  9. 根据权利要求4所述的超声激光机械复合加工方法，其特征在于，切削深度范围为0.2mm以内，切削宽度范围为2mm以内，进给量范围为5000mm/min以内，切削速度为15000r/min～24000r/min。
  10. 根据权利要求1所述的超声激光机械复合加工方法，其特征在于，所述待加工工件的材料为玻璃、陶瓷、蓝宝石、碳化硅和单晶硅的任一种。
  11. 一种超声波振动夹具，其特征在于，所述超声波振动夹具用于实现如权利要求1-10任一项所述的超声激光机械复合加工方法。
  12. 一种机床，其特征在于，所述机床用于实现如权利要求1-10任一项所述的超声激光机械复合加工方法。
  13. 一种激光器，其特征在于，所述激光器用于实现如权利要求1-10任一项所述的超声激光机械复合加工方法。
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CN117359392A (zh) * 2023-09-20 2024-01-09 武汉数字化设计与制造创新中心有限公司 超声辅助加工刀具磨损测量系统及刀具磨损机理研究方法
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CN120516014A (zh) * 2025-07-25 2025-08-22 四川航天职业技术学院(四川航天高级技工学校) 一种金属3d打印件残余应力消除装置

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