WO2022057058A1 - 一种计算机网络设备用的散热装置 - Google Patents
一种计算机网络设备用的散热装置 Download PDFInfo
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- WO2022057058A1 WO2022057058A1 PCT/CN2020/127291 CN2020127291W WO2022057058A1 WO 2022057058 A1 WO2022057058 A1 WO 2022057058A1 CN 2020127291 W CN2020127291 W CN 2020127291W WO 2022057058 A1 WO2022057058 A1 WO 2022057058A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Definitions
- the invention relates to the field of network equipment, in particular to a heat dissipation device for computer network equipment.
- a switch is a network device used for electrical (optical) signal forwarding. It can provide an exclusive electrical signal path for any two network nodes connected to the switch.
- the most common switch is an Ethernet switch, and other common ones are Telephone voice switches, fiber switches, etc.
- the existing cabinet generally uses a larger distance between the switch and the switch, so that the heat can be better dispersed into the air, but this makes the cabinet accommodate the switch.
- it is necessary to add multiple cabinets to arrange other switches which leads to low space utilization efficiency in the equipment room, and because there is a certain space between switches and switches, it is easy to cause dust accumulation.
- the present invention provides a heat dissipation device for computer network equipment.
- a heat sink for computer network equipment which is installed on the main frame with the switch, and is used to dissipate the heat generated by the switch, and the heat sink for the computer network equipment includes a heat conduction mechanism. and heat-dissipating mechanism;
- the heat-conducting mechanism includes a heat-conducting block and a fixing plate, the fixing plate is installed on the heat-conducting block, the interior of the heat-conducting block is hollowed out, and is open to both sides, the heat-conducting block is fixedly connected with the fixing plate, and the heat-conducting block is installed on the main plate through the fixing plate.
- the frame is attached to the switch and is used to guide the heat generated by the switch to the fixing plate;
- the heat dissipation mechanism is installed at the opening on one side of the heat-conducting block, and is used to guide the heat guided to the fixing plate from the other side of the heat-conducting block. Side opening to disperse out.
- the heat-conducting block includes an upper heat-conducting plate and a lower heat-conducting plate, the upper heat-conducting plate and the lower heat-conducting plate are detachably connected to each other, a plurality of heat sinks are provided on the opposite side of the upper heat-conducting plate and the lower heat-conducting plate, and the fixing plate is provided with two and are respectively fixed on both sides of the upper heat conduction plate and the lower heat conduction plate.
- both the upper heat conducting plate and the lower heat conducting plate are provided with heat dissipation holes.
- the heat expelling mechanism includes a main casing, a fixing assembly and a plurality of heat expelling fans
- the interior of the main casing is provided with a cavity with one side open
- the fixing assembly is installed on the main casing, and is used for connecting a cavity opened to the main casing.
- the side is fixed at the opening of the heat-conducting block
- a plurality of heat-dissipating fans are installed in the main casing respectively
- the blowing direction of the heat-discharging fans is toward the opening of the main casing. an air vent.
- the fixing assembly includes a sub-housing provided in an inner cavity, a fixing rod and an elastic member both installed in the sub-housing, a fixing hole is provided on the fixing plate, and a through hole connected to the interior is provided on one side of the sub-housing
- the fixing rod is slidably installed in the auxiliary casing, the first end of the fixing rod extends out of the through hole and is clamped with the fixing hole, one end of the elastic piece is connected with the inner wall of the auxiliary casing, and the other end is connected with the fixing rod.
- the auxiliary casing is further provided with a guide hole, the second end of the fixing rod is provided with a push-pull member, and the push-pull member extends from the guide hole.
- the heat expelling mechanism further includes a shock absorbing member, the shock absorbing member is arranged on the edge of the opening of the main casing and does not close the opening of the main casing.
- the invention provides a heat dissipation device for computer network equipment, which is installed on the main frame with the switch and used to dissipate heat generated by the switch.
- the heat dissipation device for computer network equipment includes a heat conduction mechanism and a heat dissipation mechanism; the heat conduction mechanism includes The heat-conducting block and the fixing plate.
- the fixing plate is installed on the heat-conducting block.
- the interior of the heat-conducting block is hollowed out and open to both sides.
- the heat-conducting block is fixedly connected to the fixing plate.
- the cooling device for computer network equipment can reduce the dust accumulation on the switch when the switch is dissipating heat.
- FIG. 1 shows a first structural schematic diagram of an embodiment of the present invention
- FIG. 2 shows a second schematic structural diagram of an embodiment of the present invention
- Fig. 3 shows a schematic diagram of the stacking manner of the switch and the heat sink in Fig. 1;
- Fig. 4 shows the exploded schematic diagram 1 of the heat conduction mechanism in Fig. 3;
- Fig. 5 shows the exploded schematic diagram II of the heat conduction mechanism in Fig. 3;
- Fig. 6 shows the structural schematic diagram 1 of the heat expelling mechanism in Fig. 3;
- Fig. 7 shows the second structural schematic diagram of the heat expelling mechanism in Fig. 3;
- Fig. 8 shows the exploded schematic diagram of the heat expelling mechanism in Fig. 7;
- FIG. 9 shows a partial enlarged view of part A in FIG. 8 .
- a heat sink for computer network equipment is installed on the main frame 2 with the switch 1 and used to dissipate the heat generated by the switch 1.
- the heat sink for computer network equipment includes a heat conduction mechanism 3 and a heat-dissipating mechanism 4;
- the heat-conducting mechanism 3 includes a heat-conducting block 31 and a fixing plate 32, the fixing plate 32 is mounted on the heat-conducting block 31, the interior of the heat-conducting block 31 is hollowed out, and is provided with openings on both sides, and the heat-conducting block 31 is fixed with the fixing plate 32 connection,
- the heat conduction block 31 is installed on the main frame 2 through the fixing plate 32, and is attached to the switch 1 to guide the heat generated by the switch 1 to the fixing plate 32;
- the heat expelling mechanism 4 is installed in the opening on one side of the heat conduction block 31 and is used to dissipate the heat guided to the fixing plate 32 from the opening on the other side of the heat-conducting block 31 .
- the main frame 2 is a frame inside the cabinet in which the switch 1 is placed.
- a plurality of switches 1 and a plurality of the cooling devices are sequentially fixed to the main frame 2 in a stacked manner.
- the upper surface and the lower surface of each switch 1 are attached and connected to the heat-conducting block 31 of the heat dissipation device, wherein the material of the heat-conducting block 31 can be selected from copper, aluminum or copper-aluminum matching materials.
- the volume of the switch 1 is relatively large, and the thermal conduction block 31 needs to be in maximum contact with the upper surface and the lower surface of the switch 1 to have a better thermal conduction effect.
- the corresponding volume of the thermal conduction block 31 also needs to be similar to the switch 1.
- the heat sink needs to be assembled on the cabinet by the operation and maintenance personnel, so the weight should not be too large. Therefore, in terms of material cost and density quality, it is more economical and practical to choose aluminum materials than copper materials.
- the heat conducting block 31 in this embodiment is made of pure aluminum material. Most of the heat generated by the switch 1 during operation will be guided out by the two heat-conducting blocks 31 contacting the upper and lower surfaces of the switch 1.
- the shape of the heat-conducting blocks 31 is similar to a hollow square column, which increases the contact surface area with the air.
- the heat dissipation mechanism 4 is installed at the opening on one side of the heat-conducting block 31, and the heat-discharging mechanism 4 can continuously discharge the heat drained by the heat-conducting block 31 from the opening on the other side of the heat-conducting block 31.
- the side of the switch 1 with the network port needs to be installed with multiple network cables, if the network cables are concentrated in the heat exhaust If the network cable is located in the same position, the network cable is prone to damage and dust accumulation, which makes it unusable, affects the normal operation of the network, and also increases the operation and maintenance cost.
- the stacking method of the switch 1 and the cooling device increases. The capacity of the cabinet for the switch 1, where the switch 1 is sandwiched by two heat sinks, which also makes it difficult for dust to fall on the switch 1 and avoids dust accumulation.
- each switch 1 needs to have two heat-conducting blocks 31 attached to the upper and lower surfaces.
- the plurality of heat-dissipating mechanisms 4 are respectively installed at the openings of the corresponding heat-conducting blocks 31 . And under the dissipation of the heat-dissipating mechanism 4 , the heat retained in the heat-conducting block 31 is discharged from the opening of the heat-conducting block 31 .
- the heat-conducting block 31 includes an upper heat-conducting plate 311 and a lower heat-conducting plate 312, the upper heat-conducting plate 311 and the lower heat-conducting plate 312 are detachably connected to each other, and the opposite side of the upper heat-conducting plate 311 and the lower heat-conducting plate 312 is provided with a plurality of heat dissipation plates.
- both sides of the upper heat-conducting plate 311 and the lower heat-conducting plate 312 are provided with fasteners that can be nested and connected to each other, and are formed by bending sheet metal technology.
- the upper heat-conducting plate 311 and the lower heat-conducting plate In order to increase the surface area of the heat sink 313 on the heat conduction plate 312 in contact with the air, the heat sink 313 on the upper heat conduction plate 311 and the heat sink 313 on the lower heat conduction plate 312 are nested and connected to the upper heat conduction plate 311 and the lower heat conduction plate 312. The times are staggered to ensure that the heat drained between the heat sinks 313 will not interfere with each other and affect the heat dissipation efficiency, and the stagger of the heat sinks 313 also facilitates heat replacement when contacting with the air.
- the heat expelling mechanism 4 includes a main casing 41, a fixing assembly 42 and a plurality of heat expelling fans 43.
- the main casing 41 is provided with a cavity with one side open, and the fixing assembly 42 is installed on the main casing 41 and is used for The open side of the main casing 41 is fixed at the opening of the heat conduction block 31 , and a plurality of heat-dissipating fans 43 are respectively installed in the main casing 41 , and the blowing direction of the heat-discharging fans 43 is toward the opening of the main casing 41 .
- the main casing 41 is provided with a plurality of air induction holes 411 corresponding to the positions of the plurality of heat expelling fans 43 .
- the main casing 41 is provided with a plurality of installation slots for installing the heat-dissipating fan 43 , the structure of which is similar to the structure of the cooling fan installed in the server on the market, and will not be repeated here.
- the fixing assembly 42 is fixed at the opening of the heat-conducting block 31, wherein the main casing 41 needs to be fixed to the opening of the heat-conducting block 31 when the main casing 41 is fixed, so as to ensure the heat-dissipating fan.
- the upper heat-conducting plate 311 and the lower heat-conducting plate 312 on the heat dissipation device are provided with a plurality of heat dissipation holes 314, and the heat-dissipating air driven by the heat-dissipating fan 43 will enter the heat-conducting block 31.
- the block 31 exchanges heat with the heat sink 313, it also exits from the heat dissipation hole 314 to contact the upper and lower surfaces of the switch 1, and performs heat exchange, so as to improve the heat dissipation effect of the heat sink for the computer network equipment.
- the fixing assembly 42 includes a sub-housing 421 provided in an inner cavity, a fixing rod 422 and an elastic member 423 both installed in the sub-housing 421 , the fixing plate 32 is provided with a fixing hole 321 , one side of the sub-housing 421 is There is a through hole 421a connected to the inside.
- the fixing rod 422 is slidably installed in the auxiliary casing 421.
- the inner wall of the auxiliary casing 421 is connected, and the other end is connected with the fixing rod 422 .
- the auxiliary casing 421 is also provided with a guide hole 421b, the second end of the fixing rod 422 is provided with a push-pull member 422a, and the push-pull member 422a protrudes from the guide hole 421b.
- the fixing components 42 there are two sets of fixing components 42 , and they are symmetrically installed on both sides of the main casing 41 .
- the heat expelling mechanism 4 is installed on the heat conducting mechanism 3
- the first end of the fixing rod 422 is on the elastic member 423 .
- the user needs to drive the push-pull member 422a to move along the length direction of the guide hole 421b by external force.
- the first end of the fixing rod 422 is retracted from the through hole 421a into the auxiliary casing 421, and when the opening of the main casing 41 and the opening of the heat conduction block 31 are attached, the position of the through hole 421a is the same as that of the fixing hole 321. At this time, the push-pull member 422a can be released, and the first end of the fixing rod 422 will protrude out of the through hole 422a again under the force of the elastic member 423, and align with the fixing hole on the fixing plate 32. 321 is snapped to complete the fixed connection of the heat expelling mechanism 4 and the heat conduction mechanism 3. When the user needs to disassemble the heat expelling mechanism 4 and the heat conduction mechanism 3, the same operation process as above can be used.
- the heat expelling mechanism 4 further includes a shock absorbing member 44 .
- the shock absorbing member 44 is disposed on the edge of the opening of the main casing 41 and does not close the opening of the main casing 41 .
- the heat-dissipating fans 43 will vibrate at a certain frequency during operation, and a large number of heat-dissipating fans 43 operate at the same time, it will cause a larger noise, and the vibration may even bring about the switch 1 .
- the hardware is damaged, so the shock-absorbing member 44 at the opening of the main casing 41 is specifically EVA material, which has anti-static, sound-absorbing and shock-absorbing effects, and can effectively slow down the vibration and noise brought by the heat-dissipating fan 43. .
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Abstract
一种计算机网络设备用的散热装置,与交换机1均安装在主框架2上,并用于驱散交换机1产生的热量,该计算机网络设备用的散热装置包括导热机构3和驱热机构4;导热机构3包括导热块31和固定板32,固定板32安装在导热块31上,导热块31内部镂空,且朝两侧开口设置,导热块31与固定板32固定连接,导热块31通过固定板32安装在主框架2上,并与交换机1贴合,用于引导交换机1产生的热量至固定板32上;驱热机构4安装在导热块31一侧的开口处,并用于将引导到固定板32上的热量从导热块31的另一侧开口驱散出去。该一种计算机网络设备用的散热装置能够实现交换机1散热时,减少交换机积灰的情况。
Description
本发明涉及网络设备领域,具体为一种计算机网络设备用的散热装置。
交换机是一种用于电(光)信号转发的网络设备,它可以为接入交换机的任意两个网络节点提供独享的电信号通路,最常见的交换机为以太网交换机,其他常见的还有电话语音交换机、光纤交换机等,目前大部分企业为了保证数据的安全性,都会采购大量的交换机来组成内网,而交换机都会被分为若干个为一组的放置到机柜内,由于交换机在运作时会产生较大的热量,因此现有的机柜一般采用的是将交换机与交换机之间的放置距离增大,使得热量能够更好地分散到空气中,但是这便使得这种机柜容纳交换机的数量变少,为此还需要增添多个机柜来安排放置其他交换机,这样便导致机房的空间利用效率偏低,而且由于交换机与交换机之间存在一定的空间,这便容易造成积灰现象。
发明内容
(一)解决的技术问题
为解决以上问题,本发明提供了一种计算机网络设备用的散热装置。
(二)技术方案
为实现上述目的,本发明提供如下技术方案:一种计算机网络设备用的散热装置,与交换机均安装在主框架上,并用于驱散交换机产生的热量,该计算机网络设备用的散热装置包括导热机构和驱热机构;导热机构包括导热块和固定板,固定板安装在导热块上,导热块内部镂空,且朝两侧开口设置,导热块与固定板固定连接,导热块通过固定板安装在主框架上,并与交换机贴合,用于引导交换机产生的热量至固定板上;驱热机构安装在导热块一侧的开口处, 并用于将引导到固定板上的热量从导热块的另一侧开口驱散出去。
优选地,导热块包括上导热板和下导热板,上导热板与下导热板相互可拆卸连接,上导热板与下导热板相向的一侧均设有多个散热片,固定板设有两个,并分别固定在上导热板与下导热板的两侧上。
优选地,上导热板和下导热板上均设有散热孔。
优选地,驱热机构包括主壳体、固定组件和多个驱热风扇,主壳体内部设有一侧开口的空腔,固定组件安装在主壳体上,并用于将主壳体开口的一侧固定在导热块的开口处,多个驱热风扇分别安装在主壳体内,且驱热风扇的吹风向朝向主壳体的开口处,主壳体对应多个驱热风扇的位置设有多个引风孔。
优选地,固定组件包括内部空腔设置的副壳体以及均安装在副壳体内的固定杆和弹性件,固定板上设有固定孔,副壳体一侧设有与内部接通的通孔,固定杆可滑动地安装在副壳体内,固定杆的第一端伸出通孔并与固定孔卡接,弹性件一端与副壳体内壁连接,另一端与固定杆连接。
优选地,副壳体上还设有导向孔,固定杆的第二端设有推拉件,推拉件从导向孔处伸出。
优选地,驱热机构还包括缓震件,缓震件设置在主壳体开口处的边缘上,且不封闭主壳体的开口。
(三)有益效果
本发明提供的一种计算机网络设备用的散热装置,与交换机均安装在主框架上,并用于驱散交换机产生的热量,该计算机网络设备用的散热装置包括导热机构和驱热机构;导热机构包括导热块和固定板,固定板安装在导热块上,导热块内部镂空,且朝两侧开口设置,导热块与固定板固定连接,导热块通过固定板安装在主框架上,并与交换机贴合,用于引导交换机产生的热量至固定 板上;驱热机构安装在导热块一侧的开口处,并用于将引导到固定板上的热量从导热块的另一侧开口驱散出去。总的来说,该一种计算机网络设备用的散热装置能够实现交换机散热时,减少交换机积灰的情况。
附图用来提供对本发明的进一步理解,并且构成说明书的一部分,与本发明的实施例一起用于解释本发明,并不构成对本发明的限制,在附图中:
图1示出了本发明的实施例的结构示意图一;
图2示出了本发明的实施例的结构示意图二;
图3示出了图1中交换机与散热装置堆叠方式的示意图;
图4示出了图3中导热机构的爆炸示意图一;
图5示出了图3中导热机构的爆炸示意图二;
图6示出了图3中驱热机构的结构示意图一;
图7示出了图3中驱热机构的结构示意图二;
图8示出了图7中驱热机构的爆炸示意图;
图9示出了图8中A部的局部放大图。
图中:1交换机、2主框架、3导热机构、31导热块、311上导热板、312下导热板、313散热片、314散热孔、32固定板、321固定孔、4驱热机构、41主壳体、411引风孔、42固定组件、421副壳体、421a通孔、421b导向孔、422固定杆、422a推拉件、423弹性件、43驱热风扇、44缓震件。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造 性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
参阅附图1-附图9,一种计算机网络设备用的散热装置,与交换机1均安装在主框架2上,并用于驱散交换机1产生的热量,该计算机网络设备用的散热装置包括导热机构3和驱热机构4;导热机构3包括导热块31和固定板32,固定板32安装在导热块31上,导热块31内部镂空,且朝两侧开口设置,导热块31与固定板32固定连接,导热块31通过固定板32安装在主框架2上,并与交换机1贴合,用于引导交换机1产生的热量至固定板32上;驱热机构4安装在导热块31一侧的开口处,并用于将引导到固定板32上的热量从导热块31的另一侧开口驱散出去。
具体的,主框架2具体为放置交换机1的机柜内部的框架,在主框架2上,多个交换机1和多个该散热装置按照堆叠的方式,依次固定到主框架2上。如附图1所示,使得每个交换机1上表面和下表面都与该散热装置的导热块31贴合连接,其中导热块31的材料可选用铜、铝或者铜铝搭配材料,由于企业级的交换机1的体积较大,导热块31需要与交换机1的上表面和下表面最大化的接触才能有着更佳的导热效果,因此导热块31的所对应的体积也需要与交换机1相近,再加上该散热装置需要运维人员的组装到机柜上,因此重量不能太大,所以从材料的成本以及密度质量上,选择铝材料要比铜材料要经济实用,而采用铜铝搭配的导热块31虽然能够将两种材料的优势相互利用到,但是其在加工工艺的制造难度及设计上需要花费时间成本,因此在本实施例中的导热块31采用的是纯铝材料。交换机1在运作过程中产生的热量大多都会被接触到交换机1上下表面的两个导热块31所引导而出,而导热块31的形状类似于中空的方形柱,使其与空气的接触表面积增大,提高了散热效率,同时驱热机构4安装在导热块31一侧的开口处,驱热机构4能够将导热块31所引流的热量不断从导 热块31的另一侧开口处排出,这里需要将交换机1设有网口的一侧与安装有驱热机构4的导热块31开口处同一侧,由于交换机1设有网口的一侧需要安插多根网线,若是网线都集中在热量排出的位置上的话,网线容易出现受损和积灰的情况,进而导致无法使用,影响到网络的正常运作,而且还增大了运维成本,这种交换机1与散热装置的堆叠方式增大了机柜对交换机1的容纳量,其中交换机1是被两个散热装置夹在中间,这也使得灰尘不易落到交换机1上,避免了积灰的情况。
基于上述方案,具体的实施步骤如下:
将交换机1通过直角连接件和螺丝固定在主框架2上,再将导热块31通过固定板32和螺丝固定在主框架2上,在固定的同时,保证导热块31与交换机1相互贴合,在上述安装的基础上,其余多个交换机1与多个导热块31的安装同理,其中需要注意的是,每台交换机1都需要有两个导热块31贴合于上下两个表面上,交换机1于导热块31安装完成后,再将多个驱热机构4分别安装到对应的导热块31的开口处,交换机1运作时所生产的热量会被上下两个导热块31所引流吸收,并在驱热机构4的驱散下,将滞留在导热块31内的热量从导热块31的开口处排出。
进一步的,导热块31包括上导热板311和下导热板312,上导热板311与下导热板312相互可拆卸连接,上导热板311与下导热板312相向的一侧均设有多个散热片313,固定板32设有两个,并分别固定在上导热板311与下导热板312的两侧上,上导热板311和下导热板312上均设有散热孔314。
参阅附图4和附图5,上导热板311和下导热板312的两侧均设有可相互嵌套连接的扣件,且均采用钣金工艺折弯形成的,上导热板311与下导热板312上的散热片313为了增大与空气接触的表面积,其中上导热板311上的散热片 与下导热板312上的散热片313在上导热板311与下导热板312嵌套连接的时候会相互错开,以保证散热片313之间所引流的热量不会相互干扰而影响散热效率,且散热片313的错开也方便了与空气接触时的热量置换。
进一步的,驱热机构4包括主壳体41、固定组件42和多个驱热风扇43,主壳体41内部设有一侧开口的空腔,固定组件42安装在主壳体41上,并用于将主壳体41开口的一侧固定在导热块31的开口处,多个驱热风扇43分别安装在主壳体41内,且驱热风扇43的吹风向朝向主壳体41的开口处,主壳体41对应多个驱热风扇43的位置设有多个引风孔411。
参阅附图8,主壳体41内设有多个用于安装驱热风扇43的安装卡槽,其结构与市面上服务器安装散热风扇的结构类似,这处不再加以赘述,主壳体41通过固定组件42固定在导热块31的开口处,其中主壳体41在固定时需要保证主壳体41的开口一侧需要与导热块31的开口处相贴合固定,这样才能保证驱热风扇43有效地将风引流到导热块31内,将引导到散热片313上的热量置换到空气中,并从导热块31的另一侧开口处排出,其中在交换机1与导热块31贴合安装时,两者是很难达到完全贴合的状态,都会出现凹凸不起的缝隙,影响交换机1热量的传导,除非采用CPU利用硅脂与散热器紧密贴合的方式,但是这样需要用到大量类似硅脂一般的材料,其成本较高,且后续在对该散热装置进行拆卸清灰时,还需要将硅脂清理掉,在安装回去时也需要重新补充硅脂,耗时耗力而且还耗资金,因此在该散热装置上的上导热板311和下导热板312均设有多个散热孔314,驱热风扇43所驱使的驱热风会进入导热块31内,驱热风除了在经过导热块31与其和散热片313进行热量置换同时,也从散热孔314出去与交换机1的上下表面接触,并进行热量置换,以提升了该计算机网络设备用的散热装置的散热效果。
进一步的,固定组件42包括内部空腔设置的副壳体421以及均安装在副壳体421内的固定杆422和弹性件423,固定板32上设有固定孔321,副壳体421一侧设有与内部接通的通孔421a,固定杆422可滑动地安装在副壳体421内,固定杆422的第一端伸出通孔421a并与固定孔321卡接,弹性件423一端与副壳体421内壁连接,另一端与固定杆422连接。
副壳体421上还设有导向孔421b,固定杆422的第二端设有推拉件422a,推拉件422a从导向孔421b处伸出。
具体的,固定组件42设有两组,且分别对称安装在主壳体41的两侧上,在将驱热机构4安装到导热机构3上时,固定杆422的第一端在弹性件423的作用力下,是处于伸出通孔421a并置于外界,使用者在将驱热机构4固定到导热机构3上时,需要通过外力驱使推拉件422a沿导向孔421b的长度方向上移动,使得固定杆422的第一端从通孔421a缩回到副壳体421内,在将主壳体41的开口处与导热块31的开口处贴合时,通孔421a的位置与固定孔321的位置想齐平,此时,即可松开推拉件422a,固定杆422的第一端便会在弹性件423的作用力下重新伸出通孔422a,并与固定板32上的固定孔321卡接,以完成驱热机构4与导热机构3的固定连接,使用者需要将驱热机构4和导热机构3进行拆卸时,同样采用上述的操作流程即可。
进一步的,驱热机构4还包括缓震件44,缓震件44设置在主壳体41开口处的边缘上,且不封闭主壳体41的开口。
具体的,由于驱热风扇43在运作时,会发生一定频率的震动,而数量多的驱热风扇43同时运作,便会带来较大的噪音,而这中震动甚至可能给交换机1带来硬件上的损坏,因此在主壳体41的开口处手缓震件44,具体为EVA材料,其具有防静电、吸音和缓震效果,能够有效的减缓驱热风扇43所带来的震动以 及噪音。
需要注意的是,这里所使用的术语仅是为了描述具体实施方式,而非意图限制根据本申请的示例性实施方式。如在这里所使用的,除非上下文另外明确指出,否则单数形式也意图包括复数形式,此外,还应当理解的是,当在本说明书中使用术语“包含”和/或“包括”时,其指明存在特征、步骤、操作、器件、机构和/或它们的组合。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (7)
- 一种计算机网络设备用的散热装置,与交换机(1)均安装在主框架(2)上,并用于驱散交换机(1)产生的热量,其特征在于,包括:导热机构(3)和驱热机构(4);所述导热机构(3)包括导热块(31)和固定板(32),所述固定板(32)安装在导热块(31)上,所述导热块(31)内部镂空,且朝两侧开口设置,所述导热块(31)与固定板(32)固定连接,所述导热块(31)通过固定板(32)安装在主框架(2)上,并与交换机(1)贴合,用于引导交换机(1)产生的热量至固定板(32)上;所述驱热机构(4)安装在导热块(31)一侧的开口处,并用于将引导到固定板(32)上的热量从导热块(31)的另一侧开口驱散出去。
- 根据权利要求1所述的一种计算机网络设备用的散热装置,其特征在于,所述导热块(31)包括上导热板(311)和下导热板(312),所述上导热板(311)与下导热板(312)相互可拆卸连接,所述上导热板(311)与下导热板(312)相向的一侧均设有多个散热片(313),所述固定板(32)设有两个,并分别固定在上导热板(311)与下导热板(312)的两侧上。
- 根据权利要求1所述的一种计算机网络设备用的散热装置,其特征在于,所述上导热板(311)和下导热板(312)上均设有散热孔(314)。
- 根据权利要求1所述的一种计算机网络设备用的散热装置,其特征在于,所述驱热机构(4)包括主壳体(41)、固定组件(42)和多个驱热风扇(43),所述主壳体(41)内部设有一侧开口的空腔,所述固定组件(42)安装在主壳体(41)上,并用于将主壳体(41)开口的一侧固定在导热块(31)的开口处,多个所述驱热风扇(43)分别安装在主壳体(41)内,且驱热风扇(43)的吹风向朝向主壳体(41)的开口处,所述主壳体(41)对应多个驱热风扇(43) 的位置设有多个引风孔(411)。
- 根据权利要求4所述的一种计算机网络设备用的散热装置,其特征在于,所述固定组件(42)包括内部空腔设置的副壳体(421)以及均安装在副壳体(421)内的固定杆(422)和弹性件(423),所述固定板(32)上设有固定孔(321),所述副壳体(421)一侧设有与内部接通的通孔(421a),所述固定杆(422)可滑动地安装在副壳体(421)内,所述固定杆(422)的第一端伸出通孔(421a)并与固定孔(321)卡接,所述弹性件(423)一端与副壳体(421)内壁连接,另一端与固定杆(422)连接。
- 根据权利要求5所述的一种计算机网络设备用的散热装置,其特征在于,所述副壳体(421)上还设有导向孔(421b),所述固定杆(422)的第二端设有推拉件(422a),所述推拉件(422a)从导向孔(421b)处伸出。
- 根据权利要求4所述的一种计算机网络设备用的散热装置,其特征在于,所述驱热机构(4)还包括缓震件(44),所述缓震件(44)设置在主壳体(41)开口处的边缘上,且不封闭主壳体(41)的开口。
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| CN114629859A (zh) * | 2022-04-14 | 2022-06-14 | 吉林吉大通信设计院股份有限公司 | 一种计算机网络交换机 |
| CN114629859B (zh) * | 2022-04-14 | 2024-01-26 | 吉林吉大通信设计院股份有限公司 | 一种计算机网络交换机 |
| CN114866498A (zh) * | 2022-06-20 | 2022-08-05 | 安徽中创信达信息科技有限公司 | 一种网络交换机交互的方法及其设备 |
| CN114866498B (zh) * | 2022-06-20 | 2023-10-10 | 安徽中创信达信息科技有限公司 | 一种网络交换机交互的方法及其设备 |
| CN116996459A (zh) * | 2023-09-27 | 2023-11-03 | 深圳市洪瑞光祥电子技术有限公司 | 一种环境自适应调节式工业交换机设备及方法 |
| CN116996459B (zh) * | 2023-09-27 | 2023-12-12 | 深圳市洪瑞光祥电子技术有限公司 | 一种环境自适应调节式工业交换机设备及方法 |
| CN118632479A (zh) * | 2024-05-29 | 2024-09-10 | 重庆科技大学 | 一种计算机网络隔离装置 |
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