WO2022045157A1 - 接着剤組成物 - Google Patents

接着剤組成物 Download PDF

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Publication number
WO2022045157A1
WO2022045157A1 PCT/JP2021/031051 JP2021031051W WO2022045157A1 WO 2022045157 A1 WO2022045157 A1 WO 2022045157A1 JP 2021031051 W JP2021031051 W JP 2021031051W WO 2022045157 A1 WO2022045157 A1 WO 2022045157A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive composition
styrene
adhesive
resin
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/031051
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
栞 門間
航 片桐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP2022545649A priority Critical patent/JP7716415B2/ja
Publication of WO2022045157A1 publication Critical patent/WO2022045157A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the styrene-based elastomer containing an amino group is a copolymer of a conjugated diene compound and an aromatic vinyl compound mainly having a block and a random structure, and an amine-modified product thereof.
  • Specific examples of the types of aromatic vinyl compounds and conjugated diene compounds and styrene-based elastomers are as described in the above section ⁇ Styrene-based elastomer >>.
  • Storage modulus (Pa) For the storage elastic modulus of the adhesive layer, for example, for a sample composed of the adhesive layer, an adhesive film having a thickness of 100 ⁇ m was prepared, and a viscoelasticity measuring device (RSA-G2 manufactured by TA Instruments) was used, and the measurement frequency was increased to 1 Hz. Obtained by measurement according to JIS K7244 under the condition of a temperature rate of 5 ° C./min.
  • Table 3 shows the results of each measurement.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
PCT/JP2021/031051 2020-08-27 2021-08-24 接着剤組成物 Ceased WO2022045157A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022545649A JP7716415B2 (ja) 2020-08-27 2021-08-24 接着剤組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020143253 2020-08-27
JP2020-143253 2020-08-27

Publications (1)

Publication Number Publication Date
WO2022045157A1 true WO2022045157A1 (ja) 2022-03-03

Family

ID=80353964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/031051 Ceased WO2022045157A1 (ja) 2020-08-27 2021-08-24 接着剤組成物

Country Status (3)

Country Link
JP (1) JP7716415B2 (https=)
TW (1) TWI858283B (https=)
WO (1) WO2022045157A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022068044A (ja) * 2020-10-21 2022-05-09 Ｐｓジャパン株式会社 樹脂組成物、マスターバッチ及びシート
JPWO2022113963A1 (https=) * 2020-11-24 2022-06-02
JP2023157050A (ja) * 2022-04-14 2023-10-26 アイカ工業株式会社 低誘電率樹脂組成物
JP2023160867A (ja) * 2021-07-26 2023-11-02 東洋インキＳｃホールディングス株式会社 接着性樹脂シート、プリント配線板および、電子機器。
WO2025009565A1 (ja) * 2023-07-06 2025-01-09 株式会社レゾナック 硬化性樹脂組成物、硬化性フィルム、及び積層フィルム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340593A (ja) * 1998-05-29 1999-12-10 Shin Etsu Polymer Co Ltd プリント配線基板用積層板およびこの製造方法
JP2015040296A (ja) * 2013-08-23 2015-03-02 独立行政法人産業技術総合研究所 誘電体用樹脂組成物および高周波誘電体デバイス
JP2017132858A (ja) * 2016-01-26 2017-08-03 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及び多層プリント配線板
WO2017154995A1 (ja) * 2016-03-08 2017-09-14 東洋インキＳｃホールディングス株式会社 積層体およびその製造方法、並びに接着層付樹脂フィルム
JP2019199612A (ja) * 2017-02-20 2019-11-21 株式会社有沢製作所 樹脂組成物、接着フィルム、カバーレイフィルム、積層板、樹脂付き銅箔及び樹脂付き銅張り積層板
WO2020071154A1 (ja) * 2018-10-02 2020-04-09 ナミックス株式会社 樹脂組成物、フィルム、積層板および半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP6332458B2 (ja) * 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP2018170492A (ja) * 2017-11-21 2018-11-01 東洋インキＳｃホールディングス株式会社 電子部品保護シート
WO2019216352A1 (ja) * 2018-05-11 2019-11-14 日立化成株式会社 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム
JP7283208B2 (ja) * 2019-04-26 2023-05-30 Ａｇｃ株式会社 パウダー分散液、積層体の製造方法、積層体及びプリント基板の製造方法
JP7736567B2 (ja) * 2019-12-23 2025-09-09 信越ポリマー株式会社 接着剤組成物
JP6909342B1 (ja) * 2020-07-31 2021-07-28 アイカ工業株式会社 樹脂組成物及びそれを用いた接着シート
JPWO2022255137A1 (https=) * 2021-06-02 2022-12-08

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340593A (ja) * 1998-05-29 1999-12-10 Shin Etsu Polymer Co Ltd プリント配線基板用積層板およびこの製造方法
JP2015040296A (ja) * 2013-08-23 2015-03-02 独立行政法人産業技術総合研究所 誘電体用樹脂組成物および高周波誘電体デバイス
JP2017132858A (ja) * 2016-01-26 2017-08-03 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及び多層プリント配線板
WO2017154995A1 (ja) * 2016-03-08 2017-09-14 東洋インキＳｃホールディングス株式会社 積層体およびその製造方法、並びに接着層付樹脂フィルム
JP2019199612A (ja) * 2017-02-20 2019-11-21 株式会社有沢製作所 樹脂組成物、接着フィルム、カバーレイフィルム、積層板、樹脂付き銅箔及び樹脂付き銅張り積層板
WO2020071154A1 (ja) * 2018-10-02 2020-04-09 ナミックス株式会社 樹脂組成物、フィルム、積層板および半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022068044A (ja) * 2020-10-21 2022-05-09 Ｐｓジャパン株式会社 樹脂組成物、マスターバッチ及びシート
JP7638661B2 (ja) 2020-10-21 2025-03-04 Ｐｓジャパン株式会社 樹脂組成物、マスターバッチ及びシート
JPWO2022113963A1 (https=) * 2020-11-24 2022-06-02
JP7776440B2 (ja) 2020-11-24 2025-11-26 富士フイルム株式会社 ポリマーフィルム、及び、積層体
JP2023160867A (ja) * 2021-07-26 2023-11-02 東洋インキＳｃホールディングス株式会社 接着性樹脂シート、プリント配線板および、電子機器。
JP2023157050A (ja) * 2022-04-14 2023-10-26 アイカ工業株式会社 低誘電率樹脂組成物
WO2025009565A1 (ja) * 2023-07-06 2025-01-09 株式会社レゾナック 硬化性樹脂組成物、硬化性フィルム、及び積層フィルム

Also Published As

Publication number Publication date
TWI858283B (zh) 2024-10-11
JPWO2022045157A1 (https=) 2022-03-03
JP7716415B2 (ja) 2025-07-31
TW202214808A (zh) 2022-04-16

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