WO2022007233A1 - 扬声器及其制备方法 - Google Patents

扬声器及其制备方法 Download PDF

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Publication number
WO2022007233A1
WO2022007233A1 PCT/CN2020/122194 CN2020122194W WO2022007233A1 WO 2022007233 A1 WO2022007233 A1 WO 2022007233A1 CN 2020122194 W CN2020122194 W CN 2020122194W WO 2022007233 A1 WO2022007233 A1 WO 2022007233A1
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WO
WIPO (PCT)
Prior art keywords
layer
piston
driver
side wall
vibration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/122194
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English (en)
French (fr)
Inventor
程诗阳
朱国
吴健兴
但强
李杨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
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Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Technologies Holdings Nanjing Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Publication of WO2022007233A1 publication Critical patent/WO2022007233A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups

Definitions

  • the invention relates to the field of electro-acoustic conversion, in particular to a loudspeaker and a preparation method thereof.
  • a loudspeaker that converts vibration signals into electrical signals.
  • a piston-type loudspeaker includes a substrate with a cavity, a driver formed on the substrate, and a piston linkage mechanism accommodated in the cavity; the driver is used to receive an electrical signal to drive the vibration layer Vibration is generated, the substrate includes a vibration layer and a side wall that forms a cavity with the vibration layer, and the piston connecting rod mechanism includes a connecting rod fixed on the side of the vibration layer close to the cavity, and a connecting rod connected with the vibration layer.
  • the connecting rod is away from the fixed piston at one end of the vibration layer, and the piston is spaced from the side wall to form a gap.
  • the driver receives the electrical signal to generate vibration and transmits it to the piston through the vibration layer and the connecting rod in turn, and the piston moves along the connecting rod. The axial movement of the rod produces sound and realizes electro-acoustic conversion.
  • the piston is only connected with the connecting rod.
  • the piston moves along the axis direction of the connecting rod, the piston is not constrained by directions other than the axis direction, which can easily cause unstable Vibration modes, which affect sound, while the piston's unstable confinement structure makes it more prone to failure in the event of a drop.
  • the purpose of the present invention is to provide a loudspeaker with better acoustic performance.
  • the present invention provides a loudspeaker comprising:
  • the substrate includes a side wall enclosing a cavity and a vibration layer supported at one end of the side wall;
  • the driver is attached to the side of the vibration layer away from the cavity, and is used for receiving an electrical signal to drive the vibration layer to vibrate;
  • the piston connecting rod mechanism is accommodated in the cavity, and comprises a piston arranged spaced apart from the vibration layer and used for vibrating and producing sound, and a connecting rod connecting the piston and the vibration layer, the piston is spaced from the sidewall to form a gap;
  • a guide spring the guide spring is sandwiched and fixed between the connecting rod and the piston, and the peripheral edge of the guide spring is connected to the side wall.
  • the side wall includes a first side wall and a second side wall that are stacked along the vibration direction of the vibration layer and are bonded and fixed by bonding metal, and the vibration layer is disposed far from the first side wall.
  • the guide spring is located between the first side wall and the second side wall, and the guide spring is formed by patterning the bonding metal.
  • the guide spring is at least partially spaced from the piston.
  • the guide spring includes a first part that is fixedly connected with the connecting rod, a second part that is spaced around the first part and connected to the side wall, and a second part that is connected to the first part and the side wall.
  • the first connecting arm of the second part includes at least two first connecting arms and is spaced apart from each other.
  • the first connecting arms include three and are arranged at equal distances from each other.
  • the first connecting arm has a zigzag structure, a serpentine structure, an arc structure or an I-shaped structure.
  • the speaker further includes an auxiliary driver formed on a side of the piston close to the guide spring, and the auxiliary driver is located between two adjacent first connecting arms.
  • the vibration layer includes a first through hole therethrough, and the first through hole communicates with the cavity.
  • the driver includes a second through hole extending therethrough and corresponding to the first through hole, and the second through hole communicates with the cavity through the first through hole.
  • the orthographic projection of the driver to the vibration layer along the vibration direction of the vibration layer completely falls within the range of the vibration layer.
  • the gap is less than or equal to 0.1 mm.
  • the first through holes include at least two
  • the drivers include at least two
  • each of the drivers is disposed between two adjacent first through holes.
  • the present invention also provides a method for preparing a loudspeaker, the method comprising the following steps:
  • Step S1 forming the driver: prepare a first silicon wafer, the first silicon wafer includes a first layer, a second layer, a third layer, a fourth layer and a first layer stacked in sequence from bottom to top. Five layers, the first layer, the third layer and the fifth layer are made of silicon dioxide material, the second layer and the fourth layer are made of silicon material, in the fifth layer depositing driver material on a side of the layer remote from the fourth layer to form the driver;
  • Step S2 forming the first through hole and the second through hole: etching the driver, the fifth layer and the fourth layer to form the first through hole and the second through hole;
  • Step S3 forming the connecting rod and the cavity: depositing bonding metal on the side of the first layer away from the second layer to form a bonding metal layer, etching the bonding metal layer, the first layer layer and the second layer forming the connecting rod and the cavity, and partially exposing the third layer to the cavity;
  • Step S4 prepare a second silicon wafer: prepare a second silicon wafer, the second silicon wafer includes a sixth layer and a seventh layer formed on the sixth layer, the sixth layer The layer is made of silicon material, the seventh layer is made of silicon dioxide material, and bonding metal is deposited on the side of the seventh layer away from the sixth layer to form the guide spring;
  • Step S5 the first silicon wafer is combined with the second silicon wafer: the bonding metal layer and the guide spring are fixed by a bonding process, so that the first silicon wafer is the wafer is combined with the second silicon wafer;
  • Step S6 forming the piston and the gap: etching the piston and the gap on the side of the sixth layer away from the seventh layer, and partially exposing the seventh layer to the gap ;
  • Step S7 releasing the restraint between the guide reed and the piston: the seventh layer exposed to the gap is removed through a release process so that the guide reed can take effect normally.
  • the guide reed is sandwiched and fixed between the connecting rod and the piston, and the peripheral edge of the guide reed is connected to the side wall;
  • the restriction of the piston on its plane restricts the movement of the piston other than along the axis of the connecting rod, avoids the unstable vibration mode when the speaker works, and improves the acoustic performance; at the same time, the restriction of the piston plane increases the The reliability and drop resistance of the speaker are improved.
  • Fig. 1 is the stereo structure schematic diagram of the loudspeaker of the present invention
  • Fig. 2 is the partial three-dimensional structure exploded view of the speaker of the present invention
  • Fig. 3 is a sectional view along line A-A in Fig. 1;
  • Fig. 4 is another sectional view in Fig. 1;
  • Fig. 5 is the structural representation of the speaker guide spring of the present invention.
  • FIG. 6 is a schematic structural diagram of another loudspeaker of the present invention.
  • FIG. 7 is a schematic structural diagram of yet another loudspeaker of the present invention.
  • Fig. 8 is the preparation process of loudspeaker of the present invention.
  • FIG. 9 is a schematic structural diagram of the manufacturing process of the speaker of the present invention.
  • the present invention provides a speaker 100 , which includes a substrate 1 , a driver 2 , a piston linkage mechanism 3 and a guide spring 4 .
  • the substrate 1 includes a side wall 12 surrounding a cavity 10 and a vibration layer 11 supported at one end of the side wall 12 ;
  • the first side wall 1a and the second side wall 1b fixed by bonding metal bonding, as shown in FIG. 2 are of course not limited thereto.
  • the cross-section of the cavity 10 can be in any shape such as a circle, a triangle and a polygon.
  • the piston 32 below is set corresponding to the shape of the cavity 10. In this embodiment, the cross-section of the cavity 10 and the cross-section of the piston 32 are the same. It is circular; as shown in FIG. 6 , the cavity 10e is rectangular.
  • the driver 2 is attached to the side of the vibration layer 11 away from the cavity 10 for receiving electrical signals to drive the vibration layer 11 to vibrate.
  • the vibration layer 11 is disposed on the first side
  • the wall 1a is remote from one end of the second side wall 1b.
  • the driver 2 is a piezoelectric driver with a sandwich structure, that is, it includes at least one layer of electrode material and at least one layer of piezoelectric material.
  • the driver 2 can also be an electrostatic driver or an electromagnetic driver.
  • the orthographic projection of the driver 2 to the vibration layer 11 along the vibration direction of the vibration layer 11 completely falls within the range of the vibration layer 11 .
  • the vibration layer 11 includes a first through hole 11w extending therethrough, and the first through hole 11w communicates with the cavity 10 ; the driver 2 includes a first through hole 11w corresponding to the first through hole 11w. The second through hole 2w is communicated with the cavity 10 through the first through hole 11w.
  • both the driver 2 and the vibration layer 11 have a hollow structure to allow the cavity 10 to communicate with the outside world for pressure relief, which does not cover the central area of the cavity 10 to form a cantilever, which improves the flexibility of the driving structure composed of the vibration layer 11 and the driver, which is beneficial to Increasing the displacement amplitude of the entire loudspeaker is beneficial to the loudspeaker 100 to generate high sound pressure, thereby improving the acoustic performance of the loudspeaker 100 .
  • the driver 2 includes a fifth part 21 , a sixth part 22 wound around the fifth part 21 and spaced from the fifth part 21 , and a sixth part 22 connected to the fifth part 21 and the fifth part 21 .
  • the third connecting arms 23 of the sixth part 22 include a plurality of third connecting arms 23 and are spaced apart from each other to form the second through holes 2w.
  • the vibration layer 11 includes a third portion 111 that forms a fixed connection with the connecting rod 31 , a fourth portion 112 that is wound around the third portion 111 and is spaced from the third portion 111 , and is connected On the second connecting arms 113 of the third part 111 and the fourth part 112 , the second connecting arms 113 are spaced apart to form first through holes 11 w , and the fourth part 112 is supported and fixed to the side wall 12 .
  • the number of the second connecting arms 113 and the third connecting arms 23 match and are arranged correspondingly, the fifth part 21 is stacked and fixed on the third part 111 , and the sixth part 22 is stacked and fixed on the The fourth section 112 is described.
  • the second connecting arm 113 and the third connecting arm 23 are arranged at equal intervals.
  • the piston linkage mechanism 3 is accommodated in the cavity 10 , and includes a piston 32 spaced from the vibration layer 11 and used for vibrating and sounding, and a connecting rod connecting the piston 32 to the vibration layer 11 . 31.
  • the piston 32 and the connecting rod 31 are both arranged at the center of the cavity 10.
  • the number of the connecting rods 31 may also include multiple ones.
  • the center of the cavity 10 is symmetrically arranged; the piston 32 is spaced from the side wall 12 to form a gap 30 .
  • the gap 30 is less than or equal to 0.1 mm.
  • the piston 32 can move along the axis direction of the connecting rod 31 under the driving of the driver 2, and at the same time, the whole space is smaller, and the loudspeaker is further reduced. 100 volume.
  • the guide reed 4 is sandwiched and fixed between the connecting rod 31 and the piston 32 , the periphery of the guide reed 4 is connected to the side wall 12 , and the piston 32 passes through the guide reed 4 fixed to the connecting rod 31 .
  • the arrangement of the guide reed 4 increases the constraint of the piston 32 on its plane, restricts the movement of the piston 32 except along the axis of the connecting rod 31, and avoids the unstable vibration mode when the speaker 100 works, and the acoustic performance At the same time, the restriction of the plane of the piston 32 increases the reliability and anti-drop performance of the speaker.
  • the guide reed 4 is located between the first side wall 1a and the second side wall 1b and the guide reed 4 is a layer, and the guide reed 4 is formed by the key above.
  • the bonding metal is formed by patterning, that is, in the process flow, when the first side wall 1a and the second side wall 1b are formed and fixed by the bonding metal bonding process, the bonding metal is simultaneously patterned to form the guide spring. 4. It does not require any additional process, does not increase the overall process difficulty, does not affect the controllability of the process, and achieves the effect of optimizing performance while saving costs.
  • the guide spring 4 is at least partially spaced from the piston 32 , that is, the movement of the piston 32 along the axis of the connecting rod 31 is not restricted while the plane of the piston 32 is restrained.
  • the guide spring 4 includes a first portion 41 that is fixedly connected to the connecting rod 31 , a second portion 42 that is spaced around the first portion and connected to the side wall 12 and connected to the side wall 12 , and a connecting portion 42 .
  • the first connecting arms 43 of the first part 41 and the second part 42 include at least two and are spaced apart from each other.
  • the first connecting arms 43 are related to the first part 41 and the The connecting rods 31 are arranged symmetrically.
  • the first connecting arms 43 include four and are arranged at equal distances from each other. Of course, it is not limited to this. As shown in FIG. As shown in FIG.
  • the guide spring 4b includes eight first connecting arms 43b which are arranged at equal distances from each other.
  • the first connecting arm 43c has a Z-shaped structure; of course, its shape is not limited to this.
  • the first connecting arm 43a has a long strip shape; It can be in the shape of a serpentine structure, an arc structure, an I-shaped structure, etc., or a superimposed combination of different shapes, so as to meet the rigidity matching of the entire guide spring 4 .
  • this embodiment also provides a method for preparing a speaker 100 , and the method includes the following steps:
  • Step S1 forming the driver 2: as shown in FIG. 9a, prepare a first silicon wafer 400, the first silicon wafer 400 includes a first layer 4001 and a second layer stacked in sequence from bottom to top 4002, the third layer 4003, the fourth layer 4004 and the fifth layer 4005, the first layer 4001, the third layer 4003 and the fifth layer 4005 are made of silicon dioxide material, the second layer 4002 and the fourth layer 4004 are made of silicon material, and driver material is deposited on the side of the fifth layer 4005 remote from the fourth layer 4004 to form the driver 2 .
  • Step S2 forming the first through hole 11w and the second through hole 2w: as shown in FIG. 9b, etching the driver 2, the fifth layer 4005 and the fourth layer 4004 to form the first A through hole 11w and the second through hole 2w;
  • Step S3 forming the connecting rod 31 and the cavity 10: as shown in FIG. 9c, depositing bonding metal on the side of the first layer 4001 away from the second layer 4002 to form a bonding metal layer 4d , etching the bonding metal layer 4d, the first layer 4001 and the second layer 4002 to form the connecting rod 31 and the cavity 10, and partially expose the third layer 4003 to the cavity 10;
  • Step S4 prepare a second silicon wafer 500: as shown in FIG. 9d, prepare a second silicon wafer 500, the second silicon wafer 500 includes a sixth layer 5001 and a second silicon wafer 500 formed on the sixth layer 5001 Above the seventh layer 5002, the sixth layer 5001 is made of silicon material, the seventh layer 5002 is made of silicon dioxide material, and the seventh layer 5002 is far from the sixth layer 5001. Bonding metal is deposited on the sides to form the guide springs 4 .
  • Step S5 the first silicon wafer 400 is combined with the second silicon wafer 500: as shown in FIG. 9e, the bonding metal layer 4d and the guide spring 4 are performed by a bonding process. Fixing, so that the first silicon wafer 400 and the second silicon wafer 500 are combined together.
  • Step S6 forming the piston 32 and the gap 30: as shown in FIG. 9f, the piston 32 and the gap 30 are etched on the side of the sixth layer 5001 away from the seventh layer 5002, and The seventh layer 5002 is partially exposed to the void 30 .
  • Step S7 release the restraint between the guide reed 4 and the piston 32: as shown in FIG. 9g, remove the seventh layer 5002 exposed to the gap 30 through a release process so that the guide reed 4 can be Take effect normally.
  • This embodiment provides a loudspeaker 200, as shown in FIG. 6, which is substantially the same as the loudspeaker 100 in Embodiment 1, except that the guide spring 4d includes two layers; when the first side wall 11a and the second side wall 11a and the second When the side wall 11b is bonded by bonding metal, the bonding metal includes two layers, and the naturally obtained guide spring 4d also includes two layers; that is, when the structural rigidity required by the speaker 200 is high, the bonding metal may include multiple layers , the formed guide spring 4d may also include multiple layers. That is, the present invention does not limit the number of layers of the bonding metal and the guide spring 4, which is determined by the entire process flow and the overall structural rigidity.
  • This embodiment provides a loudspeaker 300, as shown in FIG. 7, which is substantially the same as the loudspeaker 100 in Embodiment 1, except that the driver 4e includes two, and each driver 4e is disposed at between two adjacent first through holes 111w. That is to say, the drivers 4e are respectively arranged on the fourth part 112e at intervals.
  • the number of the drivers 4e is not limited to this; that is, the drivers 4e at this time may not be arranged in a hollow structure, and the driving structure composed of the vibration layer and the vibration layer are integrally formed. A hollowed-out structure is sufficient, so that the cavity 10e communicates with the outside to relieve pressure.
  • the speaker 300 further includes a sub-driver 5e formed on the side of the piston 32e close to the guide reed 4e, that is, a compound speaker; the sub-driver 5e is located between two adjacent first connecting arms 43e.
  • the number of the driver 4e and the sub-driver 5e is not limited to this, and the number can be adjusted according to the actual situation; the setting of the sub-driver 5e can realize more than 300 kinds of speakers to vibrate and sound.
  • the guide reed is sandwiched and fixed between the connecting rod and the piston, and the peripheral edge of the guide reed is connected to the side wall;
  • the restriction of the piston on its plane restricts the movement of the piston other than along the axis of the connecting rod, avoids the unstable vibration mode when the speaker works, and improves the acoustic performance; at the same time, the restriction of the piston plane increases the The reliability and drop resistance of the speaker are improved.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

本发明提供了一种扬声器及其制备方法，扬声器包括具有空腔的衬底、贴设于振动层远离空腔的一侧的驱动器、收容于空腔内的活塞连杆机构以及导向簧片，驱动器用于接收电信号驱动振动层振动，活塞连杆机构包括与振动层间隔设置的活塞以及将活塞与振动层连接的连杆，活塞与侧壁间隔形成间隙，导向簧片夹设固定于连杆与活塞之间，导向簧片的周缘连接于侧壁。与相关技术相比，本发明的扬声器声学性能更好。

Description

扬声器及其制备方法 技术领域
本发明涉及电声转换领域，尤其涉及一种扬声器及其制备方法。
 背景技术
扬声器，用于将振动信号转化为电信号。
相关技术中，活塞式的扬声器包括具有空腔的衬底、形成于衬底之上的驱动器以及收容于所述空腔内的活塞连杆机构；所述驱动器用于接收电信号以驱动振动层产生振动，所述衬底包括振动层以及与所述振动层围成空腔的侧壁，所述活塞连杆机构包括固定于所述振动层靠近所述空腔一侧的连杆以及与所述连杆远离所述振动层一端固定的活塞，所述活塞与所述侧壁间隔形成间隙，所述驱动器接收电信号产生振动并依次通过振动层、连杆传递至活塞，所述活塞沿连杆的轴线方向运动产生声音，实现电声转换。
 技术问题
然而，相关技术的扬声器中，所述活塞仅与所述连杆连接，当所述活塞沿连杆的轴线方向运动时，活塞不受除轴线方向以外的方向的约束，极易引发不稳定的振动模态，从而影响音效，与此同时，活塞不稳定的约束结构也会导致在发生跌落时更容易失效。
因此，实有必要提供一种新的扬声器解决上述技术问题。
 技术解决方案
本发明的目的在于提供一种声学性能更好的扬声器。
为了达到上述目的，本发明提供了一种扬声器，所述扬声器包括：
衬底，所述衬底包括围成空腔的侧壁以及支撑于所述侧壁一端的振动层；
驱动器，所述驱动器贴设于所述振动层远离所述空腔的一侧，用于接收电信号驱动所述振动层振动；
活塞连杆机构，所述活塞连杆机构收容于所述空腔内，其包括与所述振动层间隔设置且用于振动发声的活塞以及将所述活塞与所述振动层连接的连杆，所述活塞与所述侧壁间隔形成间隙；以及，
导向簧片，所述导向簧片夹设固定于所述连杆与所述活塞之间，所述导向簧片的周缘连接于所述侧壁。
优选的，所述侧壁包括沿所述振动层的振动方向叠设并通过键合金属键合固定的第一侧壁和第二侧壁，所述振动层设置于所述第一侧壁远离所述第二侧壁的一端，所述导向簧片位于所述第一侧壁和第二侧壁之间，所述导向簧片由所述键合金属图形化形成。
优选的，所述导向簧片与所述活塞至少部分间隔设置。
优选的，所述导向簧片包括与所述连杆形成固定连接的第一部分、间隔绕设于所述第一部分并与所述侧壁连接的第二部分以及连接于所述第一部分和所述第二部分的第一连接臂，所述第一连接臂包括至少两个且相互间隔设置。
优选的，所述第一连接臂包括三个且互相等间距设置。
优选的，所述第一连接臂呈Z字型结构或蛇形结构或弧形结构或工字形结构。
优选的，所述扬声器还包括形成于所述活塞靠近所述导向簧片一侧的副驱动器，所述副驱动器位于相邻两个所述第一连接臂之间。
优选的，所述振动层包括贯穿其上的第一通孔，所述第一通孔与所述空腔连通。
优选的，所述驱动器包括贯穿其上且与所述第一通孔对应设置的第二通孔，所述第二通孔通过所述第一通孔与所述空腔连通。
优选的，所述驱动器沿所述振动层的振动方向向所述振动层的正投影完全落入所述振动层范围内。
优选的，所述间隙小于或等于0.1mm。
优选的，所述第一通孔包括至少两个，所述驱动器包括至少两个，每一所述驱动器设置于相邻两个所述第一通孔之间。
本发明还提供一种扬声器的制备方法，该方法包括以下步骤：
步骤S1，形成所述驱动器：准备第一块硅晶圆，所述第一块硅晶圆包括从下往上依次叠设的第一层、第二层、第三层、第四层以及第五层，所述第一层、所述第三层及所述第五层由二氧化硅材料制成，所述第二层和所述第四层由硅材料制成，在所述第五层远离所述第四层的一侧沉积驱动器材料以形成所述驱动器；
步骤S2，形成所述第一通孔和所述第二通孔：蚀刻所述驱动器、所述第五层和所述第四层以形成所述第一通孔和所述第二通孔；
步骤S3，形成所述连杆以及所述空腔：在所述第一层远离所述第二层的一侧沉积键合金属以形成键合金属层，蚀刻键合金属层、所述第一层以及所述第二层形成所述连杆以及所述空腔，并使所述第三层部分暴露于所述空腔；
步骤S4，准备第二块硅晶圆：准备第二块硅晶圆，所述第二块硅晶圆包括第六层和形成于所述第六层之上的第七层，所述第六层由硅材料制成，所述第七层由二氧化硅材料制成，在所述第七层远离所述第六层的一侧沉积键合金属以形成所述导向簧片；
步骤S5，所述第一块硅晶圆与所述第二块硅晶圆结合一起：所述键合金属层和所述导向簧片通过键合工艺进行固定，以使所述第一块硅晶圆与所述第二块硅晶圆结合一起；
步骤S6，形成所述活塞以及所述空隙：在所述第六层远离所述第七层的一侧蚀刻出所述活塞以及所述空隙，并使所述第七层部分暴露于所述空隙；
步骤S7，解除所述导向簧片与所述活塞的约束：通过释放工艺去除暴露于所述空隙的所述第七层以使所述导向簧片可正常生效。
 有益效果
与相关技术相比，本发明的扬声器中，所述导向簧片夹设固定于所述连杆与所述活塞之间，所述导向簧片的周缘连接于所述侧壁；即增加了所述活塞在其平面上的约束，限制了活塞除沿连杆轴线方向以外的运动，避免了扬声器工作时产生不稳定的振动模态，声学性能提高；同时，其所述活塞平面的约束，增加了扬声器的可靠性以及抗跌落性能。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本发明扬声器的立体结构示意图；
图2为本发明扬声器的部分立体结构分解图；
图3为沿图1中A-A线的剖示图；
图4为图1中另一剖示图；
图5为本发明扬声器导向簧片的结构示意图；
图6为本发明另一种扬声器的结构示意图；
图7为本发明再一种扬声器的结构示意图；
图8为本发明扬声器的制备流程；
图9为本发明扬声器的制备流程中的结构示意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
实施例一
请同时参阅图1-5，本发明提供了一种扬声器100，其包括衬底1、驱动器2、活塞连杆机构3以及导向簧片4。
所述衬底1包括围成空腔10的侧壁12以及支撑于所述侧壁12一端的振动层11；具体的，所述侧壁12包括沿所述振动层11的振动方向叠设并通过键合金属键合固定的第一侧壁1a和第二侧壁1b，如图2所示，当然不限于此。所述空腔10的截面可以呈圆形、三角形及多边形等任意形状，下文的活塞32与所述空腔10的形状对应设置，本实施例中，空腔10的截面和活塞32的截面均呈圆形；如图6中，空腔10e呈矩形。
所述驱动器2贴设于所述振动层11远离所述空腔10的一侧，用于接收电信号驱动所述振动层11振动，具体的，所述振动层11设置于所述第一侧壁1a远离所述第二侧壁1b的一端。本实施例中，所述驱动器2为压电驱动器，呈三明治结构，即包括至少一层电极材料和至少一层压电材料，当然所述驱动器2也可采用静电驱动器或电磁式驱动器。
具体的，所述驱动器2沿所述振动层11的振动方向向所述振动层11的正投影完全落入所述振动层11范围内。
所述振动层11包括贯穿其上的第一通孔11w，所述第一通孔11w与所述空腔10连通；所述驱动器2包括贯穿其上且与所述第一通孔11w对应设置的第二通孔2w，所述第二通孔2w通过所述第一通孔11w与所述空腔10连通。即驱动器2和振动层11均呈镂空结构以使空腔10与外界连通泄压，其不覆盖空腔10的中心区域，形成悬臂，提升了振动层11和驱动器组成的驱动结构的柔性，利于提升整个扬声器的位移振幅，有利于扬声器100产生高声压，提高扬声器100的声学性能。
本实施例中，所述驱动器2包括第五部分21、绕设于所述第五部分21并与所述第五部分21间隔设置的第六部分22以及连接于所述第五部分21和所述第六部分22的第三连接臂23，所述第三连接臂23包括多个且相互间隔设置以形成第二通孔2w。对应的，所述振动层11包括与所述连杆31形成固定连接的第三部分111、绕设于所述第三部分111并与所述第三部分111间隔设置的第四部分112以及连接于所述第三部分111和所述第四部分112的第二连接臂113，第二连接臂113间隔设置以形成第一通孔11w，所述第四部分112支撑固定于所述侧壁12。所述第二连接臂113与所述第三连接臂23的数量匹配且对应设置，所述第五部分21叠设固定于所述第三部分111，所述第六部分22叠设固定于所述第四部分112。
优选的，所述第二连接臂113与所述第三连接臂23均等间距设置。
所述活塞连杆机构3收容于所述空腔10内，其包括与所述振动层11间隔设置且用于振动发声的活塞32以及将所述活塞32与所述振动层11连接的连杆31，优选的，所述活塞32和所述连杆31均设置在空腔10的中心处，当然所述连杆31的个数也可包括多个，其多个连杆31关于所述空腔10的中心对称布置；所述活塞32与所述侧壁12间隔形成间隙30。优选的，所述间隙30小于或等于0.1mm，此时所述活塞32在驱动器2的驱动下能沿其连杆31的轴线方向运动，同时，又使得整个空间较小，进一步的减小扬声器100的体积。
所述导向簧片4夹设固定于所述连杆31与所述活塞32之间，所述导向簧片4的周缘连接于所述侧壁12，所述活塞32通过所述导向簧片4固定于所述连杆31。导向簧片4的设置增加了所述活塞32在其平面上的约束，限制了活塞32除沿连杆31轴线方向以外的运动，避免了扬声器100工作时产生不稳定的振动模态，声学性能提高；同时，其所述活塞32平面的约束，增加了扬声器的可靠性以及抗跌落性能。
更优的，所述导向簧片4位于所述第一侧壁1a和第二侧壁1b之间且所述导向簧片4为一层，所述导向簧片4由上文的所述键合金属图形化形成，即在工艺流程中，当所述第一侧壁1a和第二侧壁1b通过键合金属键合工艺形成固定时，同步对其键合金属图形化以形成导向簧片4，不需任何额外工艺，不增加整体工艺难度，不影响工艺可控性，在节省成本的同时达到优化性能的效果。
具体的，所述导向簧片4与所述活塞32至少部分间隔设置，即在保证活塞32平面的约束同时，不限制活塞32沿连杆31轴线方向的运动。
本实施中，所述导向簧片4包括与所述连杆31形成固定连接的第一部分41、间隔绕设于所述第一部分并41并与所述侧壁12连接的第二部分42以及连接于所述第一部分41和所述第二部分42的第一连接臂43，所述第一连接臂43包括至少两个且相互间隔设置，优选的，其第一连接臂43关于第一部分41及连杆31对称设置。具体的，所述第一连接臂43包括四个且互相等间距设置，当然不限于此，如图4a所示，所述导向簧片4a包括三个第一连接臂43a且互相等间距设置，如图4b所示，所述导向簧片4b包括八个第一连接臂43b且互相等间距设置。如图4c所示，所述导向簧片4c中，所述第一连接臂43c呈Z字型结构；当然其形状不限于此，如图4a中，第一连接臂43a呈长条状；也可呈蛇形结构、弧形结构、工字形结构等形状，或不同形状的叠加组合，以满足整个导向簧片4的刚度匹配。
请结合图8和图9所示，本实施例还提供了一种扬声器100的制备方法，该方法包括以下步骤：
步骤S1，形成所述驱动器2：如图9a所示，准备第一块硅晶圆400，所述第一块硅晶圆400包括从下往上依次叠设的第一层4001、第二层4002、第三层4003、第四层4004以及第五层4005，所述第一层4001、所述第三层4003及所述第五层4005由二氧化硅材料制成，所述第二层4002和所述第四层4004由硅材料制成，在所述第五层4005远离所述第四层4004的一侧沉积驱动器材料以形成所述驱动器2。
步骤S2，形成所述第一通孔11w和所述第二通孔2w：如图9b所示，蚀刻所述驱动器2、所述第五层4005和所述第四层4004以形成所述第一通孔11w和所述第二通孔2w；
步骤S3，形成所述连杆31以及所述空腔10：如图9c所示，在所述第一层4001远离所述第二层4002的一侧沉积键合金属以形成键合金属层4d，蚀刻键合金属层4d、所述第一层4001以及所述第二层4002形成所述连杆以31及所述空腔10，并使所述第三层4003部分暴露于所述空腔10；
步骤S4，准备第二块硅晶圆500：如图9d所示，准备第二块硅晶圆500，所述第二块硅晶圆500包括第六层5001和形成于所述第六层5001之上的第七层5002，所述第六层5001由硅材料制成，所述第七层5002由二氧化硅材料制成，在所述第七层5002远离所述第六层5001的一侧沉积键合金属以形成所述导向簧片4。
步骤S5，所述第一块硅晶圆400与所述第二块硅晶圆500结合一起：如图9e所示，所述键合金属层4d和所述导向簧片4通过键合工艺进行固定，以使所述第一块硅晶圆400与所述第二块硅晶圆500结合一起。
步骤S6，形成所述活塞32以及所述空隙30：如图9f所示，在所述第六层5001远离所述第七层5002的一侧蚀刻出所述活塞32以及所述空隙30，并使所述第七层5002部分暴露于所述空隙30。
步骤S7，解除所述导向簧片4与所述活塞32的约束：如图9g所示，通过释放工艺去除暴露于所述空隙30的所述第七层5002以使所述导向簧片4可正常生效。
实施例二
本实施例提供一种扬声器200，参图6所示，其与实施例一中的扬声器100大致相同，其不同之处在于，导向簧片4d包括两层；当第一侧壁11a和第二侧壁11b通过键合金属键合时，其键合金属包括两层，自然得到的导向簧片4d也包括两层；即当扬声器200需求的结构刚度较高，其键合金属可包括多层，形成的导向簧片4d也可包括多层。即本发明对键合金属和导向簧片4的层数不做限制，由整个工艺流程及整体结构刚度确定。
实施例三
本实施例提供一种扬声器300，参图7所述示，其与实施例一中的扬声器100大致相同，其不同之处在于，所述驱动器4e包括两个，每一所述驱动器4e设置于相邻两个所述第一通孔111w之间。即所述驱动器4e分别间隔设置于第四部分112e上，当然所述驱动器4e的个数不限于此；即此时的驱动器4e可以不设置为镂空结构，其与振动层组成的驱动结构整体呈镂空结构即可，以使所述空腔10e与外界连通泄压。所述扬声器300还包括形成于所述活塞32e靠近所述导向簧片4e一侧的副驱动器5e，即形成复合型扬声器；所述副驱动器5e位于相邻两个所述第一连接臂43e之间，当然所述驱动器4e和所述副驱动器5e的个数不限于此，可根据实际情况调整其个数；副驱动器5e的设置可实现扬声器300多种的振动发声。
与相关技术相比，本发明的扬声器中，所述导向簧片夹设固定于所述连杆与所述活塞之间，所述导向簧片的周缘连接于所述侧壁；即增加了所述活塞在其平面上的约束，限制了活塞除沿连杆轴线方向以外的运动，避免了扬声器工作时产生不稳定的振动模态，声学性能提高；同时，其所述活塞平面的约束，增加了扬声器的可靠性以及抗跌落性能。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (13)

  1. 一种扬声器，其特征在于，所述扬声器包括：
    衬底，所述衬底包括围成空腔的侧壁以及支撑于所述侧壁一端的振动层；
    驱动器，所述驱动器贴设于所述振动层远离所述空腔的一侧，用于接收电信号驱动所述振动层振动；
    活塞连杆机构，所述活塞连杆机构收容于所述空腔内，其包括与所述振动层间隔设置且用于振动发声的活塞以及将所述活塞与所述振动层连接的连杆，所述活塞与所述侧壁间隔形成间隙；以及，
    导向簧片，所述导向簧片夹设固定于所述连杆与所述活塞之间，所述导向簧片的周缘连接于所述侧壁。
  2. 根据权利要求1所述的扬声器，其特征在于，所述侧壁包括沿所述振动层的振动方向叠设并通过键合金属键合固定的第一侧壁和第二侧壁，所述振动层设置于所述第一侧壁远离所述第二侧壁的一端，所述导向簧片位于所述第一侧壁和第二侧壁之间，所述导向簧片由所述键合金属图形化形成。
  3. 根据权利要求1所述的扬声器，其特征在于，所述导向簧片与所述活塞至少部分间隔设置。。
  4. 根据权利要求1所述的扬声器，其特征在于，所述导向簧片包括与所述连杆形成固定连接的第一部分、间隔绕设于所述第一部分并与所述侧壁连接的第二部分以及连接于所述第一部分和所述第二部分的第一连接臂，所述第一连接臂包括至少两个且相互间隔设置。
  5. 根据权利要求4所述的扬声器，其特征在于，所述第一连接臂包括三个且互相等间距设置。
  6. 根据权利要求4所述的扬声器，其特征在于，所述第一连接臂呈Z字型结构或蛇形结构或弧形结构或工字形结构。
  7. 根据权利要求4所述的扬声器，其特征在于，所述扬声器还包括形成于所述活塞靠近所述导向簧片一侧的副驱动器，所述副驱动器位于相邻两个所述第一连接臂之间。
  8. 根据权利要求1所述的扬声器，其特征在于，所述振动层包括贯穿其上的第一通孔，所述第一通孔与所述空腔连通。
  9. 根据权利要求8所述的扬声器，其特征在于，所述驱动器包括贯穿其上且与所述第一通孔对应设置的第二通孔，所述第二通孔通过所述第一通孔与所述空腔连通。
  10. 根据权利要求1所述的扬声器，其特征在于，所述驱动器沿所述振动层的振动方向向所述振动层的正投影完全落入所述振动层范围内。
  11. 根据权利要求1所述的扬声器，其特征在于，所述间隙小于或等于0.1mm。
  12. 根据权利要求8所述的扬声器，其特征在于，所述第一通孔包括至少两个，所述驱动器包括至少两个，每一所述驱动器设置于相邻两个所述第一通孔之间。
  13. 一种如权利要求1-12任意一项所述的扬声器的制备方法，其特征在于，该方法包括以下步骤：
    步骤S1，形成所述驱动器：准备第一块硅晶圆，所述第一块硅晶圆包括从下往上依次叠设的第一层、第二层、第三层、第四层以及第五层，所述第一层、所述第三层及所述第五层由二氧化硅材料制成，所述第二层和所述第四层由硅材料制成，在所述第五层远离所述第四层的一侧沉积驱动器材料以形成所述驱动器；
    步骤S2，形成所述第一通孔和所述第二通孔：蚀刻所述驱动器、所述第五层和所述第四层以形成所述第一通孔和所述第二通孔；
    步骤S3，形成所述连杆以及所述空腔：在所述第一层远离所述第二层的一侧沉积键合金属以形成键合金属层，蚀刻键合金属层、所述第一层以及所述第二层形成所述连杆以及所述空腔，并使所述第三层部分暴露于所述空腔；
    步骤S4，准备第二块硅晶圆：准备第二块硅晶圆，所述第二块硅晶圆包括第六层和形成于所述第六层之上的第七层，所述第六层由硅材料制成，所述第七层由二氧化硅材料制成，在所述第七层远离所述第六层的一侧沉积键合金属并图形化以形成所述导向簧片；
    步骤S5，所述第一块硅晶圆与所述第二块硅晶圆结合一起：所述键合金属层和所述导向簧片通过键合工艺进行固定，以使所述第一块硅晶圆与所述第二块硅晶圆结合一起；
    步骤S6，形成所述活塞以及所述空隙：在所述第六层远离所述第七层的一侧蚀刻出所述活塞以及所述空隙，并使所述第七层部分暴露于所述空隙；
    步骤S7，解除所述导向簧片与所述活塞的约束：通过释放工艺去除暴露于所述空隙的所述第七层以使所述导向簧片可正常生效。
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