WO2021226449A1

WO2021226449A1 - Stretchable electronic device and method of making the same

Info

Publication number: WO2021226449A1
Application number: PCT/US2021/031280
Authority: WO
Inventors: Yon Visell; Shantonu BISWAS
Original assignee: The Regents Of The University Of California
Priority date: 2020-05-08
Filing date: 2021-05-07
Publication date: 2021-11-11
Also published as: US20230155090A1

Abstract

A method of manufacturing a stretchable electronic device (215) includes the steps of: a) depositing a release layer (102, 208) on a temporary rigid substrate (100, 200); b) depositing a sacrificial layer (104, 210) on the release layer (102, 208); c) fabricating conductive traces (110, 202) and electrical contacts (112a, 112b, 230a, 230b) on top of the sacrificial layer (104, 210); d) mounting surface mount components (SMCs) (118, 234) to the electrical contacts (112a, 112b, 230a, 230b); e) depositing a first stretchable polymer layer (122, 228) over the conductive traces (110, 202) and SMCs (118, 234) to form a stretchable substrate (120); f) separating the rigid substrate (100, 200) and release layer (102, 208) from the sacrificial layer (104, 210) and the stretchable substrate (120) at an interface between the release layer (102, 208) and the sacrificial layer (104, 210); g) removing the sacrificial layer (104, 210) from the stretchable substrate (120); and h) depositing a second stretchable polymer layer (120) on a surface of the stretchable substrate (120) exposed by removing the sacrificial layer (104, 210).

Description

STRETCHABLE ELECTRONIC DEVICE AND METHOD OF MAKING THE SAME

STATEMENT OF GOVERNMENT RIGHTS [0001] This invention was made with United States Government support under Grant No. 1751348, awarded by the National Science Foundation (NSF). The United States Government has certain rights in this invention.

CROSS-REFERENCE TO RELATED APPLICATION

[0002] This application claims benefit of priority to U.S. Provisional Patent Application No. 63/022,064 filed on May 8, 2020, the entire disclosure of which is hereby incorporated by reference.

BACKGROUND

[0003] The present invention is directed to flexible and stretchable electronic devices and in particular to methods of making flexible and stretchable electronic devices.

[0004] Wearable monitoring devices are utilized in a growing number of applications. The electronics associated with these monitoring devices must be flexible and stretchable to comply with and conform to the body of the wearer. Typical electronic devices fabricated on a printed circuit board are too rigid for this type of application. Many flexible circuits cannot be stretched, preventing them from conforming to the body of the wearer. It would therefore be desirable to fabricate flexible and stretchable electronic devices that can be utilized on wearable devices.

BRIEF DESCRIPTION OF THE FIGURES

[0005] Figs la - lr are a diagram illustrating the microfabrication steps implemented to fabricate a flexible and stretchable electronic device according to some embodiments;

[0006] Figure 2a is a top view of electrical traces fabricated on a rigid substrate according to some embodiments;

[0007] Figure 2b is a side view of the rigid substrate, detachment layer, sacrificial layer, and electrical trace layer according to some embodiments;

[0008] Figure 2c is a top view of the rigid substrate that includes one or more surface mounted components (SMCs); [0009] Figure 2d is a side view of the rigid substrate shown in Figure 2c that includes at least one SMC;

[0010] Figure 2e is a perspective view of a flexible and stretchable electronic device;

[0011] Figure 2f is a side view of the flexible and stretchable electronic device according to some embodiments;

[0012] Figure 2g is a perspective view of a transparent, flexible, and stretchable electronic device according to some embodiments;

[0013] Figure 2h is a perspective view of flexible conductive traces in transparent, flexible, and stretchable electronic device according to some embodiments;

[0014] Figure 3 is a perspective view of a flexible and stretchable electronic device being removed from a rigid substrate according to some embodiments;

[0015] Figure 4a is a perspective view of a flexible and stretchable electronic device being worn on a finger and used in a reflective mode according to some embodiments; and [0016] Figure 4b is a perspective view of a flexible and stretchable electronic device being worn on a finger and used in a transmissive mode according to some embodiments.

DETAILED DESCRIPTION

[0017] According to some aspects, this disclosure is directed to electronic devices that are stretchable and flexible and to methods of making the same. In some embodiments, a microfabrication method is utilized to fabricate the flexible and stretchable electronic device, hereinafter referred to as the device. As used herein, the term “stretchable” means that the device is capable of being elongated along at least one axis, and preferably multiple axes. Further, as used herein, the term “flexible” means that the device is capable of bending along multiple axes, in contrast with typical flexible printed circuit boards (PCBs) which are capable of flexing along only a single axis. The method utilizes a substrate formed of a rigid material (e.g., silicon, glass, etc.) on which the device is temporarily disposed to fabricate conductive traces and contact pads on which surface mounted electrical components are mounted to be included in the device. In some embodiments, a release layer, e.g., polymethyl methacrylate (PMMA), is deposited on the substrate, followed by a sacrificial layer, e.g., polyimide (PI), which is then cured to provide a rigid carrier on which the remaining microfabrication steps can be carried out. Following fabrication of the electronic components on the temporary rigid substrate, the electronic components are coated with a flexible and stretchable polymeric material that serves as a flexible and stretchable substrate for the device. This is followed by detachment of the electronics and flexible and stretchable substrate from the temporary rigid substrate at the interface between the release layer and the sacrificial layer. The sacrificial layer is subsequently removed from the flexible and stretchable substrate by an etching process and another layer of flexible and stretchable polymer material is provided over the bottom of the device. The end product is an electronic device in a flexible and stretchable substrate that is well adapted for use as a wearable device. The method of fabricating the electronic device, in particular the temporary use of the rigid substrate, allows for the use of high-precision microfabrication techniques capable of providing the desired integration density while providing a flexible and stretchable substrate that is well-suited for applications such as health monitoring of a person wearing the device. The device has the ability to conform to curved surfaces and is therefore useful in a number of applications, including as a wearable device capable of conforming to the body of a medical patient or other user.

[0018] Figures la through lr is a diagram illustrating the microfabrication steps of fabricating a stretchable and flexible electronic device. The method begins at the step shown in Figure la with a temporary rigid substrate 100 such as a silicon substrate or glass substrate. In the step shown in Figure lb, a release layer 102 is deposited on the surface of the temporary rigid substrate 100. In some embodiments, the release layer 102 is polymethylmethacrylate (PMMA). In some embodiments, the release layer 102 is deposited onto the surface of the temporary rigid substrate 100 by a spin coat process and then heated at a desired temperature for a length of time (e.g., 180°C for two minutes).

[0019] .In the step shown in Figure lc, a sacrificial layer 104 is deposited on top of the release layer 102. In some embodiments, the sacrificial layer 104 is polyimide (PI). In some embodiments, the sacrificial layer 104 is deposited onto the surface of the release layer 102 by spin coating and then prebaking at 180°C and subsequently fully curing in a convection oven at 300°C under a flow of nitrogen.

[0020] In some embodiments, the adhesion between the release layer 102 and the sacrificial layer 104 is controlled to ensure the bond is sufficient to be maintained during subsequent fabrication steps but can be detached from each other to separate the rigid substrate from the device. Curing the release layer 102 and the sacrificial layer 104 allows the temporary substrate to act as a rigid carrier through the rest of the processing steps. [0021] In the step shown in Figure Id, an initial metal layer 106 is deposited on top of the sacrificial layer 104 through a metallization process. In some embodiments, the initial metal layer 106 is deposited using electron beam evaporation. In some embodiments, the initial metal layer 106 is a gold (Au). In some embodiments, the initial metal layer 106 is utilized as a seed layer for subsequent electrodeposition techniques. In this embodiment, the seed layer may be relatively thin (e.g., approximately 400 nm thick). In some embodiments, plasma activation of the initial metal layer 106 is utilized to increase the surface adhesion of the initial metal layer 106 to the sacrificial layer 104.

[0022] In the step shown in Figure le, photolithography techniques are utilized to pattern the initial metal layer 106. In some embodiments, this includes deposition of a mask layer 108 on the initial metal layer 106.

[0023] In the step shown in Figure If, a thicker metal layer 110 is electrodeposited using the initial metal layer 106 as a seed layer.

[0024] In the step shown in Figure lg, the mask layer 108 is removed from the initial metal layer 106.

[0025] In the step shown in Figure lh, the initial metal layer 106 is removed (e.g., chemically etched) to expose metal contacts 112a, 112b and traces (not visible) in the desired pattern. In some embodiments, rather than a single layer of electrical traces and metal contacts 112a, 112b, the process may be repeated to fabricate a plurality of layers of electrical traces and/or contacts, which conductive layer (including electrical traces and/or contacts) separated by a flexible and stretchable insulative layer. In some embodiments, conductive vias are fabricated in the insulative layer located between the one or more conductive layers to provide a multi-layer flexible and stretchable circuit. In some embodiments the flexible and stretchable insulative layer is the same as the flexible and stretchable substrate described in more detail with respect the steps shown in Figures lm through lq and the deposition process may be essentially the same. In some embodiments, the flexible and stretchable insulative layer may also be patterned according to the desired via interconnects. In other embodiments, other material may be utilized between the layers of electrical traces and/or contacts but the material utilized should be both non-conductive (insulative) as well as flexible and stretchable. In some embodiments, one of the plurality of layers may include a conductive grounding layer. In some embodiments, the conductive grounding layer is fabricated utilizing a conductive polymer to provide the desired conductivity in combination with the desired flexibility and stretchability. At this stage in the process, the substrate is ready for mounting of surface mounted electrical components (SMCs) onto the metal contacts 112a, 112b. Depending on the application, a plurality of different types of SMCs may be utilized, including optical devices, electro-optical devices, electro-mechanical devices, etc. For example, in one application the SMCs include one or more active optical devices (e.g., light emitting diodes, lasers, etc.) and one or more optical sensors for measuring backscattered light.

[0026] In some embodiments, mounting of SMCs utilizes a lithography and dip coating process to deposit the solder at the desired location on the metal contacts 112a, 112b. In some embodiments, as shown in Fig li, lithography techniques are utilized to deposit a mask layer 114. As shown in Figure li, the mask layer 114 exposes a small portion of the metal contacts 112a, 112b.

[0027] In the step shown in Figure lj, the substrate is dip coated in a molten solder bath, which results in solder layers 116 being deposited onto exposed portions of the metal contacts 112a, 112b. [0028] In the step shown in Figure lk, the mask layer 114 is removed by a stripping process, leaving the solder layer 116 positioned on the metal contacts 112a, 112b as desired.

[0029] In the step shown in Figure 11, a surface mounted device (SMC) 118 is placed onto the metal contacts 112a, 112b and the solder is heated causing it to reflow and allow self-assembly of the SMC 118 on the metal contacts 112a, 112b. At this point in the microfabrication process, the device can be electrically and mechanically tested. In some embodiments, these steps may utilize automated microfabrication techniques. For example, pick and place machines may be utilized to place the SMCs 118 on the desired contact pads. In addition, optical registration techniques may be utilized to verify placement of metal contacts 112a, 112b and/or SMCs 118.

[0030] In the steps shown in Figures lm through lq and in Fig. 3, the temporary rigid substrate is removed and replaced with a soft, compliant substrate 120. In some embodiments, the soft, compliant substrate 120 is clear, i.e., transparent, to allow optical signals to be transmitted to and from the SMCs 118. In some embodiments, in the step shown in Figure lm, a polymer resin is applied to the substrate in an over-molding step. In some embodiments the polymer resin is a transparent urethane rubber material, e.g., CLEAR FLEX™ manufactured by Smooth-On Inc. of Macungie, Pennsylvania, that is comprised of two component polymers mixed together in a predetermined ratio (e.g., 1A:2B). As shown in Figure lm, over molding of the polymer resin results in the SMCs 118 as well as the other sacrificial layer 104 being covered by the polymer resin. As described above, in some embodiments the polymer resin is transparent. In some embodiments, the assembled components are treated with ozone for a length of time to increase the bonding strength between the components and the compliant substrate 120. In some embodiments, the compliant substrate 120 is cured. In some embodiments, the polymer resin is flexible and stretchable. At this stage, the temporary rigid substrate - which includes the temporary rigid substrate 100, release layer 102 and sacrificial layer 104 - is still affixed to the electronic components on a bottom side. The compliant substrate 120 is located opposite the temporary rigid substrate 100, affixed to the top side (as discussed in more detail below in the next step, the substrate is flipped wherein the top side becomes the bottom side).

[0031] In the step shown in Figure In, the temporary rigid substrate 100 is separated from the electrical device (e.g., SMCs 118 and conductive traces) at the interface between the release layer 102 and the sacrificial layer 104, wherein the sacrificial layer 104 remains affixed to the compliant substrate 120. The process of separating the compliant substrate 120 from the temporary rigid substrate 100 is dry i.e., no solvent is necessary to make the separation. This separation relies on a differential interfacial adhesion between PMMA and PI materials. A first adhesion force between the PMMA material forming the release layer 102 and the silicon material forming the temporary rigid substrate 100 is stronger than a second adhesion force of the PI material forming the sacrificial layer 104 to the PMMA material forming the release layer 102. When a removal force greater than the second adhesion force is applied to the compliant substrate 120 it detaches from the temporary rigid substrate 100 at the PMMA-PI interface. A single transfer step for the entire device/circuit is also scalable.

[0032] In the step shown in Figure lo, the sacrificial layer 104 is removed from by a plasma etching process. As shown at in Figure lo, the compliant substrate 120 is flipped upside down, wherein the plasma etching process removes the sacrificial layer 104 from the compliant substrate 120. Following the step shown in Figure lo, electrical contacts and traces are exposed on the (now) top side of the compliant substrate 120.

[0033] In the step shown in Figure lp, electrical contacts are established as a required and in the step shown in Figure lq, a polymer layer 122 is deposited on top of the device to fully encapsulate the device. The final device is shown in Figure lr.

[0034] In this way, the method described above utilizes a rigid substrate to pattern and place electrical components in the density required utilizing microfabrication techniques. Following fabrication of the device the temporary rigid substrate is removed and the device is encapsulated in a stretchable silicone substrate.

[0035] Referring now to Figures 2a-2f, the flexible and stretchable electronic device is illustrated at several different stages of manufacture as well as in operation. Figure 2a is a top view of electrical traces fabricated on a temporary rigid substrate according to some embodiments. In this view, a temporary rigid substrate 200 supports a plurality of conductive traces 202 as well as a plurality of electrical contacts 204. As discussed above, utilization of a rigid substrate allows traditional microfabrication techniques to be utilized, allowing for density of conductive traces 202 and density of electrical contacts 204 not possible without microfabrication techniques. In the embodiment shown in Figure 2a, conductive traces 202 have a geometry designed to accommodate stretching and/or bending of the device.

[0036] Figure 2b is a side view of the device shown in Figure 2a, in which a temporary rigid substrate 200 includes a rigid silicon substrate 205, a release layer 208 (e.g., PMMA) and a sacrificial layer 210 (e.g., PI). As described above, the release layer 208 and the sacrificial layer 210 are cured to ensure that temporary rigid substrate 200 is sufficiently rigid to fabricate electrical traces and mount surface mounted components (SMCs) as shown in Figure 2c. In this example, conductive traces 202 and electrical contacts 204 have been deposited and fabricated on top of the temporary rigid substrate 200.

[0037] Figures 2c is a top view that illustrates a plurality of surface mounted components (SMCs) 234 that are mounted to the temporary rigid substrate 200 according to some embodiments. In this view, the temporary rigid substrate 200 provides support during the mounting and soldering of the plurality of SMCs 234 onto the electrical contacts 204 shown in Figure 2a and 2b. In some embodiments, placement of the plurality of SMCs 234 may take advantage of pick- and-place commonly utilized with microfabrication techniques.

[0038] Figure 2d is a side view of the device shown in Figure 2c, in which SMCs 234 are mounted on the electrical contacts 204. At this time, the temporary rigid substrate 200 provides the rigidity necessary to mount the SMCs 234 onto the electrical contacts. In some embodiments, pick and place machines are utilized to mount the plurality of SMCs 234 onto the desired electrical contacts 204. A benefit of utilizing a rigid substrate (i.e., the temporary rigid substrate 200) during this process is that it allows for standard microfabrication techniques - such as pick and place machines - to be utilized to fabricate the electronic device. As described above with respect to Figures la-lr, following placement of the surface mounted components on the electrical contacts 204, the temporary rigid substrate 200 is removed and the remaining components are encased in a flexible and stretchable polymer layer as shown in Figures 2e and 2f.

[0039] With respect to Figure 2e, an embodiment is shown in which the flexible and stretchable electronic device 215 includes a plurality of surface mounted optical devices. In particular, in the embodiment shown in Figure 2e, the device includes an infrared (IR) LED 220, a red-green-blue (RGB) LED 222, an IR phototransistor 224, and a visible light phototransistor 226. Each of these components represents a type of surface mounted device (SMC) mounted onto the electrical contacts 204 shown in Figure 2a. In addition, the embodiment shown in Figure 2e illustrates a clear flexible and stretchable polymer substrate 228 surrounding the conductive traces 202 and SMR devices, including IR LED 220, RGB LED 222, IR phototransistor 224, and visible light phototransistor 226. As illustrated in Fig. 2g, the geometry of the conductive traces 202 (e.g., undulating, meandering, sawtooth, and/or serpentine geometry) allows the conductive traces 202 to handle bending and/or stretching. Likewise, the flexible and stretchable polymer substrate 228 is capable of handling bending and/or stretching. In addition, in applications in which one or more of the SMCs are optical devices requiring to transmit and/or receive transmitted light, it is important that the flexible and stretchable polymer substrate 228 be transparent or nearly transparent to allow the transmission of light to and from the optical devices.

[0040] Figure 2f is a side view of the device shown in Figure 2e. In the embodiment shown in Figure 2f, the entire device is encapsulated in the flexible and stretchable polymer substrate 228. Encased within the flexible and stretchable polymer substrate 228 is a pair of electrical contacts 230a, 230b, a pair of solder joints 232a, 232b, and SMCs 234 (e.g., IR LED 220, RGB LED 222, IR phototransistor 224, or visible light phototransistor 226). The geometry of the conductive traces 202 ensures that the stretchability and flexibility of the device does not prevent electrical conductivity between the electrical contacts 230a, 230b, solder joints 232a, 232b, and the SMCs 234.

[0041] Figure 2g is a perspective view illustrating the transparent and stretchable electrical device fabricated as shown in Figures 2a-2f in operation. In particular, the embodiment shown in Figure 2g illustrates the use of optoelectronic devices, which can be utilized in a plurality of patient and health monitoring applications. [0042] Although the embodiment shown in Figures 2a-2e utilizes a plurality of optoelectronic devices, in other embodiments various other configurations of optoelectronic devices and/or other electrical devices may be microfabricated on the flexible and stretchable substrate. For those applications that do not require transmission of light, the stretchable substrate is not required to be transparent.

[0043] While the invention has been described with reference to an exemplary embodiment(s), it will be understood by those skilled in the art that various changes may be made, and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention is not limited to the disclosed embodiment(s), but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

CLAIMS:

1. A method of manufacturing a stretchable electronic device (215), comprising: depositing a release layer (102, 208) on a temporary rigid substrate (100, 200); depositing a sacrificial layer (104, 210) on the release layer (102, 208); fabricating a plurality of conductive traces (110, 202) and electrical contacts (112a, 112b, 230a, 230b) on top of the sacrificial layer (104, 210); mounting one or more surface mount components (118, 234) to the electrical contacts (112a, 112b, 230a, 230b); depositing a first stretchable polymer layer (122, 228) on top of the conductive traces (110, 202) and surface mount components (118, 234) to form a stretchable substrate (120); separating the temporary rigid substrate (100, 200) and release layer (102, 208) from the sacrificial layer (104, 210) and the stretchable substrate (120) at an interface between the release layer (102, 208) and the sacrificial layer (104, 210); removing the sacrificial layer (104, 210) from the stretchable substrate (120); and depositing a second stretchable polymer layer (120) on a surface of the stretchable substrate (120) exposed by removing the sacrificial layer (104, 210).

2. The method of claim 1, wherein the first and second stretchable polymer layers (122, 228, 120) are flexible.

3. The method of claim 1 or 2, wherein the first and second stretchable polymer layers (122, 228, 120) are formed of a urethane rubber material.

4. The method of any one of the preceding claims, wherein the release layer (102, 208) is formed of poly methyl methacrylate.

5. The method of any one of the preceding claims, wherein the sacrificial layer (104, 210) is formed of polyimide.

6. The method of any one of the preceding claims, wherein the sacrificial layer (104, 210) is removed from the first stretchable polymer layer (122, 228) by a plasma etching process.

7. The method of any one of the preceding claims, wherein the temporary rigid substrate ( 100, 200) is formed of a silicon-based material.

8. The method of any one of the preceding claims, wherein the first stretchable polymer layer (122, 228) is transparent.

9. The method of claim 8, wherein the one or more surface mount components (118, 234) are optoelectronic devices.

10. The method of any one of the preceding claims, wherein the plurality of conductive traces (110, 202) is stretchable and flexible.

11. The method of claim 10, wherein the plurality of conductive traces (110, 202) has an undulating, meandering, sawtooth, or serpentine geometry.

12. A stretchable electronic device (215) comprising: a plurality of conductive traces (110, 202); one or more electrical contacts (112a, 112b, 230a, 230b) in electrical communication with the plurality of conductive traces (110, 202); one or more surface mounted components (118, 234) mounted to the one or more electrical contacts (112a, 112b, 230a, 230b); and a stretchable substrate (120) surrounding the plurality of conductive traces (110, 202) and the one or more surface mounted components (118, 234).

13. The stretchable electronic device (215) of claim 12, wherein the stretchable substrate (120) is flexible.

14. The stretchable electronic device (215) of claim 12 or 13, wherein the plurality of conductive traces (110, 202) is stretchable.

15. The stretchable electronic device (215) of any one of the claims 12 to 14, wherein the plurality of conductive traces (110, 202) is flexible.

16. The stretchable electronic device (215) of claim 15, wherein the plurality of conductive traces (110, 202) has an undulating, meandering, sawtooth, or serpentine geometry.

17. The stretchable electronic device (215) of any one of the claims 12 to 16, wherein the stretchable substrate (120) is transparent.

18. The stretchable electronic device (215) of claim 17, wherein the one or more surface mounted components (118, 234) are optoelectronic devices.

19. The stretchable electronic device (215) of claim 18, wherein the optoelectronic devices include a photo generation device and a photo detector device.

20. A stretchable electronic assembly, comprising: two stretchable electronic devices (215) of any one of the claims 12 to 19, wherein the two stretchable electronic devices (215) are stacked on one another and wherein conductive traces (110, 202) in the two stretchable electronic devices (215) are connected by one or more conductive vias extending between the two stretchable electronic devices (215).