WO2021226016A1 - Multiple patterning with organometallic photopatternable layers with intermediate freeze steps - Google Patents
Multiple patterning with organometallic photopatternable layers with intermediate freeze steps Download PDFInfo
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- WO2021226016A1 WO2021226016A1 PCT/US2021/030562 US2021030562W WO2021226016A1 WO 2021226016 A1 WO2021226016 A1 WO 2021226016A1 US 2021030562 W US2021030562 W US 2021030562W WO 2021226016 A1 WO2021226016 A1 WO 2021226016A1
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- pattern
- patterned
- patterning
- organometallic
- hardmask
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Classifications
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
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- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Definitions
- This application is directed to multiple patterning approaches based on organometallic photopattemable materials that allow for exploitation of high etch contrast.
- the invention is further directed to structures achievable using multiple layer patterning with organometallic radiation pattemable resists.
- Organometallic coatings have been shown to be useful as suitable photoresist materials for achieving high-resolution patterning and are very promising for commercial use for patterning using extreme ultraviolet light as well as for electron-beam patterning.
- pragmatic improvements in processing for commercial environments can allow for the exploitation of the full potential for these materials.
- the invention described herein is directed to multiple patterning approaches using organometallic photopattemable materials and structures achievable using these approaches.
- the invention pertains to a method for patterning a substrate, the method comprising irradiating a layer of a photosensitive composition over a patterned understructure to form a latent image, wherein the photosensitive composition comprises an organometallic composition with radiation sensitive ligands bound to the metal, wherein the patterned understmcture comprises sequentially a substrate, an unpattemed hardmask layer over the substrate, and a patterned metal oxide based material having a first pattern over the hardmask layer, with the photosensitive composition located over the hardmask layer with the patterned metal oxide based material, wherein the pattern corresponding to the latent image is distinct from the first pattern, and wherein the hardmask layer has differential etching relative to the irradiated photosensitive composition and the patterned metal oxide based material and developing the latent image to form a second pattern from irradiated photosensitive composition
- the invention pertains to a structure comprising a substrate; an unpattemed hardmask coating on the substrate; a first pattern of a first tin oxide based material over the hardmask coating, wherein gaps in the first pattern do not cover the hardmask; and a second pattern of a second tin oxide based material over the hardmask coating with the first pattern, wherein the second pattern is distinct from the first pattern, with the proviso that if the second pattern does not overlap with the first pattern the line width roughness of the first pattern is less than a quarter of the feature to feature distance of the first pattern.
- the invention pertains to a method of forming a patterned structure using radiation based lithography, the method comprising performing a positive tone development step on a latent image formed in a patterning composition, such as an organometallic patterning composition, deposited over a patterned metal composition supported on a structure, wherein the positive tone development step removes an irradiated portion of the latent image in the organometallic patterning composition and an exposed portion of the patterned metal composition to form a cut pattern in the patterned metal composition.
- a patterning composition such as an organometallic patterning composition
- the invention pertains to a method for forming a patterned structure, the method comprising irradiating a structure according to a first pattern to form a first latent image, the structure comprising a layer of organometallic radiation sensitive material and a substrate; further irradiating the structure with the first latent image according to a second pattern to form a second latent image superimposed on the first latent image, wherein the first latent image and the superimposed second latent image form a composite latent image; and developing the structure with the composite latent image to form the patterned structure.
- Fig. 1A is a representation of a half-pitch line- space pattern which may be formed via the metal oxide-freezing-metal oxide process disclosed herein.
- Fig. IB is a representation of a crossed array (crosshatched) pattern which may be formed via the metal oxide-freezing-metal oxide process disclosed herein.
- Fig. 1C is a representation of a hexagonal array pattern which may be formed via the metal oxide-freezing-metal oxide process disclosed herein.
- Fig. ID is a representation of a mixed pattern of pillars and line-spacing which may be formed via the metal oxide-freezing-metal oxide process disclosed herein.
- Fig. IE is a representation of a line cutting pattern which may be formed via a double patterning process disclosed herein.
- Fig. 2A is a flow chart of the litho-freeze-litho-freeze process.
- Fig. 2B is a flow chart of a lithographic cutting process.
- Fig. 3 is a side plan view of a “thermal freeze” double patterning process flow in which a bake renders the first patterned layer insoluble to a second layer.
- Fig. 4 is a schematic perspective view of a radiation patterned structure with a latent image.
- Fig. 5 is a side plan view of the structure of Fig. 4.
- Fig. 6 is a schematic perspective view of the structure of Fig. 4 after development of the latent image to remove un-irradiated photosensitive organometallic material to form a patterned structure.
- Fig. 7 is a side view of the patterned structure of Fig. 6.
- Fig. 8 is a schematic perspective view of the patterned structure of Fig. 6 onto which a second layer of photosensitive organometallic material has been deposited.
- Fig. 9 is a side view of the structure of Fig. 8.
- Fig. 10 is a schematic perspective view of the radiation patterned structure of Fig. 8 with a latent image in the second photosensitive organometallic layer which is parallel to the first pattern.
- Fig. 11 is a side plan view of the structure of Fig. 10.
- Fig. 12 is a schematic perspective view of the structure of Fig. 10 after development of the latent image to remove un-irradiated photosensitive organometallic material from the second photosensitive organometallic layer to form a double patterned line structure on the hardmask-coated substrate.
- Fig. 13 is a side view of the structure of Fig. 12.
- Fig. 14 is a schematic perspective view of a patterned structure having a hardmask which has been etched into a pattern according to the structure of Fig. 12.
- Fig. 15 is a side view of the structure of Fig. 14.
- Fig. 16 is a schematic perspective view of the radiation patterned structure of Fig. 8 with a latent image in the second photosensitive organometallic layer which is perpendicular to the first pattern.
- Fig. 17 is a side plan view of the structure of Fig. 16.
- Fig. 18 is a schematic perspective view of the structure of Fig. 16 after development of the latent image to remove un-irradiated photosensitive organometallic material from the second photosensitive organometallic layer to form a double patterned crosshatched structure on the hardmask-coated substrate.
- Fig. 19A is a side view of the structure of Fig. 18.
- Fig. 19B is a cross-section view along plane B-B of the structure of Fig. 18.
- Fig. 19C is a cross-section view along plane C-C of the structure of Fig. 18.
- Fig. 20 is a schematic perspective view of a patterned structure having a hardmask which has been etched into a pattern according to the structure of Fig. 18.
- Fig. 21 is a side plan view of the structure of Fig. 20.
- Fig. 22A is a schematic view of a patterned structure having organometallic material that has been exposed to patterned radiation and developed.
- Fig. 22B is a side view of the structure of Fig. 22A.
- Fig. 22C is a schematic view of the structure of Fig. 22 A onto which a layer of photosensitive organometallic material has been deposited and patterned with radiation to form a latent image.
- Fig. 22D is a side view of the structure of Fig. 22C.
- Fig. 22E is a schematic view of the structure of Fig. 22C after development of irradiated organometallic material according to the latent image of Fig. 22C.
- Fig. 22F is a schematic view of a line cut structure of Fig. 22 A, shown after removing unirradiated photosensitive organometallic material from the organometallic layer of Fig.
- Fig. 23A is a schematic view of a radiation patterned structure with a latent image.
- Fig. 23B is a schematic view of a radiation patterned structure with a combined latent image.
- Fig. 23C is a schematic view of the structure of Fig. 23B after development of the combined latent image with a negative tone developer.
- Fig. 23D is a schematic view of a patterned structure having a hardmask which has been etched into a pattern according to the structure of Fig. 23C.
- Fig. 24A is a schematic view of a radiation patterned structure with a latent image.
- Fig. 24B is a schematic view of a radiation patterned structure with a combined latent image.
- Fig. 24C is a schematic view of the structure of Fig. 24B after development of the combined latent image with a positive tone developer.
- Fig. 24D is a schematic view of a patterned structure having a hardmask which has been etched into a pattern according to the structure of Fig. 24C.
- Fig. 25 is a CD-SEM image of the crosshatched tin oxide pattern prepared with the double patterning process described in the Example.
- organometallic radiation sensitive resist compositions are exploited for advantageous multiple patterning processes that provide for the formation of desirable structures involving the multiple patterns.
- a hardmask layer between the resist compositions and the substrate provide for more effective pattern transfer allowing for various substrate compositions.
- organometallic radiation sensitive resists with high etch contrast have been developed that can be cured to form metal oxide based compositions with increasing degree of oxidation based on process conditions.
- the organometallic resists can be used to form high resolution patterns.
- a freeze step can be performed, such as through heating the patterned structure to further dehydrate the resist to form a metal oxide or a more oxidized composition closer in structure to a metal oxide composition.
- a freeze step is not performed after the first patterning step to facilitate cutting the first pattern in a second pattering step.
- the frozen structure is desirably stable for deposition and patterning of another layer of organometallic resist composition.
- the second layer is again patterned through radiation exposure and development.
- a single resist layer is exposed through multiple masks followed by a single development step to develop the latent image formed through the multiple masks.
- Organometallic resists can be effectively used to form high- resolution patterns and can be effective for EUV patterning.
- Suitable resists can be used for both negative tone and positive tone patterning to efficiently allow more multiple patterning options using the same composition for predictably reproducible multiple patterning, although adjustment of resist compositions can be made to optimize subsequent patterning steps. Subsequent or intermittent processing can be used to improve pattern quality.
- Multiple patterning techniques can be used to improve pattern resolution to extend the practical patterning capabilities achievable with a particular patterning system.
- a first pattern various features can be formed, which maybe on a regular pattern, such as a pattern of stripes.
- the second pattern can be overlapping with the first pattern, located within the first pattern or a combination of overlapping and within the first pattern.
- the second pattern can alternatively be used to cut the first pattern.
- the sequential patterning steps provide for the formation of structures that generally are not readily formed with a single patterning step to achieve higher resolution or more intricately placed features. If desired, a third or more additional pattering steps can be performed.
- compatible positive tone patterning can provide for a cut step as a multiple patterning step, and one or more cut steps with positive tone patterning can be performed after one negative tone patterning step or a plurality of multiple sequential negative tone patterning steps, or interspersed as cut steps between one or more initial negative tone patterning steps and one or more subsequent negative tone patterning steps.
- the positive tone patterning as a cut step can be performed using an organometallic patterning composition or an organic photoresist, such as chemically amplified resists, as described further below.
- the high development contrast of organometallic patterning compositions can be used to provide for multiple patterning using two or more exposure steps using different masks followed by a development step of the latent image formed from the multiple exposures. Such multiple exposure followed by development forms of multiple patterning can be combined with additional negative tone patterning steps and positive tone cut steps as described herein.
- the formation of integrated electronic devices and the like generally involves the patterning of the materials to form individual elements or components within the structures. This patterning can involve different compositions covering selected portions of stacked layers that interface with each other vertically and/or horizontally to induce desired functionality.
- the various materials can comprise semiconductors, which can have selected dopants, dielectrics, electrical conductors and/or other types of materials.
- To form ultimate components, such as integrated circuits generally many layers are formed and patterned to form the eventual structures with different materials at locations defined both by position in the stack and by position along the substrate.
- radiation sensitive organic compositions can be used to introduce patterns, and the compositions can be referred to as resists since portions of the composition are processed to be resistant to development/etching such that selective material removal can be used to introduce a selected pattern. Irradiation with the selected pattern or the negative of the pattern can be used to expose the resist and to form a pattern or latent image with developer resistant regions and developer dissolvable regions.
- the radiation sensitive organometallic compositions described herein can be used for the direct formation of desired inorganic material structures within the device and/or as a radiation patternable organometallic resist. In either case, significant processing improvements can be exploited, and the structure of the patterned metal oxide based material can be also improved.
- SADP spacer aligned double patterning
- SAQP spacer aligned quadruple patterning
- Organometallic photoresists such as metal oxide hydroxide compositions with radiation sensitive ligands, in particular, enable methods for performing multiple patterning steps by using a freeze process, such as a thermal freeze process, for appropriate embodiments.
- a freeze process a first photoresist layer is deposited, exposed, and developed to form a first pattern. This first pattern then undergoes a process to “freeze” the pattern, and suitable freeze processes can be exposure to blanket UV light and/or a thermal bake step. After freezing the first pattern, a second layer of photoresist can be deposited to also undergo exposure and development to result in a second pattern.
- Metal oxide hydroxide compositions can exhibit either positive tone patterning or negative tone patterning behavior.
- negative tone patterning exposure to radiation converts the irradiated coating material into a material that is more resistant to removal with a developer composition relative to the non-irradiated coating material.
- positive tone patterning exposure sufficiently changes the polarity of the exposed coating material, e.g., increasing the polarity, such that the exposed coating material can be selectively removed with an aqueous solvent or other highly polar solvent. Selective removal of at least a portion of the coating material leaves a pattern where regions have been removed to expose the underlying substrate.
- Negative tone patterning is particularly desirable for a lower level in a multiple pattering process since the initially patterned and developed layer is not significantly affected by further irradiation in a subsequent patterning step. If the lower pattern is a positive tone resist, this resist can be further altered by a subsequent irradiation step. Thus, if the positive tone pattern on the lower level is not protected by a hardmask or the like during the development of an upper level, the lower pattern can be damaged in a subsequent development step. Therefore, organometallic resists that can be used for negative tone patterning with small feature size are particularly well suited for multiple patterning with fewer process steps. In view of the ability to use a positive tone development process with an organometallic patterning composition for a subsequent pattern step, allows for cutting of previously formed patterns, which provides a further process advantage for organometallic patterning compositions for multiple patterning processes.
- Suitable photoresists can be based on metal oxide chemistry (metal oxo/hydroxo compositions) using radiation sensitive ligands to control stability and processability of the resists. In general, these resist compositions function as negative tone photoresists when developed with organic solvents. Suitable resist compositions can have a peroxo ligand to provide radiation sensitivity. Peroxo-based resist compounds are discussed in U.S. patent 8,415,000B2 to Stowers et ah, entitled "Patterned Inorganic Layers, Radiation Based Patterning Compositions and Corresponding Methods," and in U.S.
- Organometallic photoresists such as organotin oxide hydroxides have been shown to possess excellent properties as photoresists for use in lithographic photopatterning.
- Suitable organometallic photoresists include organotin materials as described in U.S. patent 9,310,684B2 to Meyers et al., entitled “Organometallic Solution Based High Resolution Patterning Compositions,” published U.S.
- Other organometallic patterning compositions based on various metals are described in published U.S. patent application 2002/0076495 to Maloney et al., entitled “Method of Making Electronic Material,” and U.S. patent 9,372,402B2 to Freedman et al., entitled “Molecular Organometallic Resists for EUV,” both of which are incorporated herein by reference.
- Resists with metal oxide nanoparticles encased with organic shell-like coatings are described in published U.S. patent application 2015/0234272A1 to Sarma et al., entitled “Metal Oxide Nanoparticles and Photoresist Compositions,” incorporated herein by reference. Applicant has developed organotin patterning materials that have been progressed to a high degree, and some of these are the exemplified compositions.
- Suitable organotin materials can be based on the chemistry of radiation sensitive patterning compositions represented by the formula R z SnO ( 2- (z/ 2 )-(x/ 2 )) (OH) x where 0 ⁇ z ⁇ 2 and 0 ⁇ (z + x) ⁇ 4, in which R is a hydrocarbyl group with 1-31 carbon atoms or blends thereof with distinct R groups, which can be written as R N , for N distinct compositions.
- the compositions can be integrated into a common oxo/hydroxo network.
- R forms a carbon-tin bond, and R can comprise heteroatoms, which are not carbon or hydrogen.
- branched alkyl ligands can be desirable for some patterning compositions where the compound can be represented generally as R 1 R 2 R 3 CSn 0 (2 (z/2)-(x/2)) (0H) x , where R 1 and R 2 are independently an alkyl group with 1-10 carbon atoms, and R 3 is hydrogen or an alkyl group with 1-10 carbon atoms.
- R 1 R 2 R 3 CSn(X)3 is similarly applicable to the other embodiments generally with R 1 R 2 R 3 CSn(X)3, with X corresponding to hydrolysable ligands, such as alkoxide or amide moieties.
- R 1 and R 2 can form a cyclic alkyl moiety, and R 3 may also join the other groups in a cyclic moiety.
- Suitable branched alkyl ligands can be, for example, isopropyl (R 1 and R 2 are methyl and R 3 is hydrogen), tert-butyl (R 1 , R 2 and R 3 are methyl), tert-amyl (R 1 and R 2 are methyl and R 3 is - CH2CH3), sec-butyl (R 1 is methyl, R 2 is -CH2CH3, and R 3 is hydrogen), neopentyl (R 1 and R 2 are hydrogen, and R 3 is -C(CH3)3), cyclohexyl, cyclopentyl, cyclobutyl, and cyclopropyl.
- Suitable cyclic groups include, for example, 1-adamantyl (-C(CH2)3(CH)3(CH2)3 or tricyclo(3.3.1.13,7) decane bonded to the metal at a tertiary carbon) and 2-adamantyl (- CH(CH)2(CH 2 )4(CH)2(CH 2 ) or tricyclo(3.3.1.13,7) decane bonded to the metal at a secondary carbon).
- hydrocarbyl groups may include aryl or alkenyl groups, for example, benzyl or allyl, or alkynyl groups.
- the hydrocarbyl ligand R may include any group consisting solely of C and H and containing 1-31 carbon atoms.
- alkyl groups bonded to tin include, for example, linear or branched alkyl (i-Pr ((CH ) 2 CH-), t-Bu ((CH ) 3 C-), Me (CH -), n-Bu (CH CH 2 CH 2 CH 2 -)), cyclo-alkyl (cyclo-propyl, cyclo-butyl, cyclo-pentyl), olefinic (alkenyl, aryl, allylic), or alkynyl groups, or combinations thereof.
- linear or branched alkyl i-Pr ((CH ) 2 CH-), t-Bu ((CH ) 3 C-), Me (CH -), n-Bu (CH CH 2 CH 2 CH 2 -)), cyclo-alkyl (cyclo-propyl, cyclo-butyl, cyclo-pentyl), olefinic (alkenyl, aryl, allylic), or alkynyl groups, or
- suitable R groups may include hydrocarbyl groups substituted with hetero-atom functional groups including cyano, thio, silyl, ether, keto, ester, or halogenated groups or combinations thereof.
- Precursor compositions can be employed to form organotin oxo/hydroxyl coating compositions that integrate into a common oxo/hydroxo network.
- the precursor compositions can comprise one or more soluble organotin oxo/hydroxo compounds, or corresponding compounds with hydrolyzable ligands that form oxo and/or hydroxo ligands upon hydrolysis.
- the compounds can have distinct organic ligands with metal-carbon bonds and the same or distinct hyrolyzable ligands.
- Suitable hydrolysable ligands can include, for example, alkynides (R°CoC-), alkoxides (R 0 O-), carboxylates (R°COO-), halides, dialkylamides or combinations thereof, where the R° group can be one of the same moieties described above for R.
- organotin trialkoxide compositions can be represented by the formula RSn(OR°) 3 .
- organotin tridialkylamide compositions can be represented by the formula RSn(NR a R b ) 3 , where the R a and R b groups can be one of the same moieties described above for R.
- organotin photoresists exhibit both high resolution and high etch resistances that enable the formation of small features and patterns.
- In situ hydrolysis during the coating process or after a coating step can be used to hydrolyze any hydrolyzable M-X bonds to form an oxo/hydroxo network in the coating prior to patterning.
- the precursor compounds can also form clusters in solution with appropriate ligand rearrangement, in which at least some of the hydrolyzable ligands may be replaced with oxo bridges or hydroxyl groups, such as with three tin atoms, as described in published U.S.
- compositions described above can be used to deposit and form a layer of coating material via various means known by those skilled in the art, and subsequent processing of the precursor onto a selected structure.
- the structure comprises a substrate with a hard mask coating over its surface.
- the hard mask surface provides for patterning uniformity while undergoing the multiple patterning steps being performed to reduce pattern feature size.
- Hard mask layers can comprise a material with a good etch contrast with the patterned resist.
- the hard mask is designed to be ultimately removed, but in some embodiments patterned portions of the hardmask should be maintained for subsequent processing. Selection of the hardmask can be based on compatibility and possibly etch contrast with the material below the hardmask in the substrate, which may itself be patterned with different materials.
- the multiple pattering with organometallic resists as described herein provides significant flexibility to efficiently provide high resolution patterning based on high development contrast and good radiation absorption.
- Various implementations of multiple patterning can effectively be exploited to form a variety of ultimately desired patterns.
- Use of tin based organometallic patterning compositions, improved developers and post development pattern quality improvement can be exploited to reduce pattern imperfections.
- a substrate generally presents a surface onto which the coating material can be deposited, and the substrate may comprise a plurality of layers.
- the substrate surface can be treated to prepare the surface for adhesion of the coating material.
- the surface can be cleaned and/or smoothed as appropriate.
- Suitable substrate surfaces can comprise any reasonable material.
- Some substrates of particular interest include, for example, silicon wafers, silica substrates, other inorganic materials, polymer substrates, such as organic polymers, composites thereof and combinations thereof across a surface and/or in layers of the substrate. Wafers, such as relatively thin cylindrical structures, can be convenient, although any reasonable shaped structure can be used.
- Polymer substrates or substrates with polymer layers on non-polymer structures can be desirable for certain applications based on their low cost and flexibility, and suitable polymers can be selected based on the relatively low processing temperatures that can be used for the processing of the patternable materials described herein.
- suitable polymers can include, for example, polycarbonates, polyimides, polyesters, polyalkenes, copolymers thereof and mixtures thereof.
- a hardmask layer is formed over the substrate prior to deposition of radiation patternable coatings.
- a hardmask layer can have an average thickness from about 1 nm to about 200 nm, in further embodiments from about 2 nm to about 150 nm, in other embodiments form about 2.5 nm to about 100 nm, and in additional embodiments form about 3 nm to about 75 nm.
- desired hardmask materials can be typically chosen for their etch properties with respect to the other layers.
- the hardmask materials are chosen and layered into a film stack based upon their etch “color”, where the “color” refers to etch susceptibility to some etch chemistry.
- Suitable materials for the hardmask layer can include, for example, titanium nitride (TiN), silicon nitride (S13N4), tantalum nitride (TaN), silicon oxides (S1O2, spin-on-glass, silicon oxynitride), and carbon-rich materials (such as, spin coated carbon (SOC), CVD carbon layers), although a range of other materials may be suitable.
- TiN titanium nitride
- SiN4 silicon nitride
- TaN tantalum nitride
- silicon oxides S1O2
- spin-on-glass silicon oxynitride
- carbon-rich materials such as, spin coated carbon (SOC), CVD carbon layers
- etch stacks e.g. a complex logic pattern having lots of lines, spaces, and rectangular features may be patterned with a different film stack than a memory pattern that consists of arrays of dots or holes. Holes can be roughly circular, rectangular, square, or other reasonable shapes. Based on the teachings herein, selection of suitable hardmask materials, stack configurations, etch chemistries, and relative etch differentials thereof are known by those of ordinary skill in the art and are within the scope of the present disclosure.
- Hardmasks can be deposited with vapor depositions approaches, such as chemical vapor deposition (CVD), physical vapor deposition (PVD), or atomic layer deposition (ALD), or solution based coating approaches such as with spin-on-glass or spin-on-carbon.
- Spin-on- carbon (SoC) generally refers to compositions with a high carbon content that can be deposited as liquids and generally comprise, for example, high carbon content polymers, or molecules such as fullerenes, which are commercially available as spin-on carbon from Irresistible Materials, Ltd, UK.
- Spin-on-glass materials are available commercially, such as from Desert Silicon (AZ, USA).
- Spin-on-glass compositions can comprise polysilazane polymers in a suitable organic solvent, such as an ether or an aromatic solvent, and the polysilazane polymer can be cured in an oxygen atmosphere to form silicon oxide.
- a suitable organic solvent such as an ether or an aromatic solvent
- Spin-on glass formulations with polyorganosiloxanes are described in U.S. patent 5,302,198 to Allman, entitled “Coating Solution for Forming Glassy Layers,” incorporated herein by reference.
- Suitable silica based sol-gel compositions are known in the art and can be used as the spin-on glass compositions.
- sol-gel compositions for the formation of silica glass materials are described in published U.S. patent application 2002/0157418 to Ganguli et al., entitled "Process for Reducing or Eliminating Bubble Defects in Sol-Gel Silica Glass,” incorporated herein by reference.
- the spin-on glass compositions can be cured with heat in an oxygen containing atmosphere to form silica glass.
- Silica glass is commonly deposited in a variety of contexts using chemical vapor deposition (CVD) or other processes known in the art.
- CVD chemical vapor deposition
- suitable substrates can comprise previously formed organometallic photoresist patterns.
- substrates can also comprise pre-pattemed structures as described in U.S. Patent No.: 10,649,328 by Stowers et al., entitled “Pre-Patterned Lithography Templates, Processes Based on Radiation Patterning Using the Templates and Processes To Form the Templates”, and U.S. Patent No.: 9,005,875 by Bristol et al., entitled “Pre-Pattemed Hard Mask for Ultrafast Lithographic Imaging”, both incorporated herein by reference.
- substrates can comprise multiple layers of different or partially different compositions, in which each layer may be itself patterned, for example, with components or portions of components that may be integrated with further components or portions of components based on the further lithography processing to pattern additional layer over the substrate and/or in the substrate.
- suitable deposition methods for organometallic resists include solution processing methods such as spin coating or dip coating, or vapor deposition methods such as atomic layer deposition (ALD), physical vapor deposition (PVD), or chemical vapor deposition (CVD) processes can be used to form organometallic coatings. If solution processing is desired then it is desirable for the organotin compositions to be dissolved in a solvent to aid in the deposition process.
- the desired organotin compositions can be dissolved in an organic solvent, e.g., alcohols, aromatic and aliphatic hydrocarbons, esters or combinations thereof.
- suitable solvents include, for example, aromatic compounds (e.g., xylenes, toluene), ethers (anisole, tetrahydrofuran), esters (propylene glycol monomethyl ether acetate, ethyl acetate, ethyl lactate), alcohols (e.g., 4-methyl-2-propanol, 1 -butanol, methanol, isopropyl alcohol, 1-propanol), ketones (e.g., methyl ethyl ketone), mixtures thereof, and the like.
- aromatic compounds e.g., xylenes, toluene
- ethers anisole, tetrahydrofuran
- esters propylene glycol monomethyl ether acetate, ethyl acetate,
- organic solvent selection can be influenced by solubility parameters, volatility, flammability, toxicity, viscosity and potential chemical interactions with other processing materials.
- the character of the species may change, in some embodiments, as a result of partial in-situ hydrolysis, hydration, and/or condensation.
- the reference is to the components as added to the solution, since complex formulations may undergo solvolysis and ligand metathesis, or produce metal polynuclear species in solution that may not be well characterized.
- the organic solvent it is desirable for the organic solvent to have a flash point of no less than about 10 °C, in further embodiments no less than about 20 °C and in further embodiment no less than about 25 °C and a vapor pressure at 20 °C of no more than about 10 kPa, in some embodiments no more than about 8 kPa and in further embodiments no more than about 6 kPa.
- a flash point of no less than about 10 °C, in further embodiments no less than about 20 °C and in further embodiment no less than about 25 °C and a vapor pressure at 20 °C of no more than about 10 kPa, in some embodiments no more than about 8 kPa and in further embodiments no more than about 6 kPa.
- vapor deposition methods can comprise reacting one or more metal-containing precursors are reacted on or more with small molecule gas-phase reagents such as H2O, H2O2, O3, O2, CO2, CO, or CH3OH, which serve as O and H sources for production of oxides and oxide hydroxides.
- gas-phase reagents such as H2O, H2O2, O3, O2, CO2, CO, or CH3OH, which serve as O and H sources for production of oxides and oxide hydroxides.
- two or more reactant gases are generally mixed in the chamber in the vicinity of the substrate surface. Therefore, sufficient stability can be designed into the reaction conditions to control undesirable vapor-phase reactions and nucleation.
- ALD precursors introduced separately and sequentially to the reaction chamber, typically react with chemisorbed co-precursor or decomposition products saturating the substrate surface.
- Desirable features of R n SnX ( 4- n) precursors include, for example, sufficient volatility for vapor-phase transport in the system, thermal stability to prevent premature decomposition, and/or appropriate reactivity with co-precursors to produce the target product under prescribed process conditions.
- the pressure and temperature in the reaction chamber can be selected to control the reaction process.
- precursors with relatively low vapor pressures may be introduced using flow of vapor, aerosol, and/or direct liquid injection into a vaporization chamber. Flash evaporators can be used to introduce a controlled amount of precursor vapors into the reaction chamber to correspondingly control the reaction process in the chamber.
- the secondary reactant to drive hydrolysis/oxidation can be introduced through a separate inlet into the chamber.
- CVD apparatuses can be adapted for this use or specific equipment can be used.
- the substrate may be heated or may be cooled depending on the precursor properties.
- Inert gases such as N2, Ar or the like may be used in appropriate capacities as carrier gases, purge gases, or pressure modulating gases in both sequential and continuous flow regimes.
- the organotin precursors can be selected for desired properties amenable to the deposition, such as volatility and reactivity, through selection of radiation sensitive ligand (alkyl groups) and the hydrolytically sensitive and/or oxidizable ligands.
- the vapor deposition process can be controlled to provide a desired coating thickness.
- the thickness of the coating generally can be a function of the precursor solution concentration, viscosity, and process parameters, such as the spin speed.
- the thickness can generally also be adjusted through the selection of the deposition and coating parameters such as flow rate, cycle time, number of cycles, etc.
- it can be desirable to use a thin coating to facilitate formation of small and highly resolved features.
- the coating materials can have an average dry thickness prior to development of no more than about 1 micron, in further embodiments no more than about 250 nanometers (nm), in additional embodiments from about 1 nanometers (nm) to about 100 nm, in further embodiments from about 1 nm to about 50 nm, in other embodiments from about 1 nm to about 40 nm and in some embodiments from about 1 nm to about 25 nm.
- the ranges of post development coating thickness for the exposed regions generally fall within the same ranges as presented above with the realization that development may remove a relatively small amount of exposed material.
- each coating layer of radiation patternable compositions can fall within these dry thickness ranges.
- subsequent patternable coatings can have the same average thickness or a different average thickness relative to previous patternable coatings.
- the thickness can be evaluated using non-contact methods of x-ray reflectivity and/or ellipsometry based on the optical properties of the film.
- the average thickness is evaluated relative to the existing patterned surface extending upward from the surface relative to the plane of the structure, acknowledging that the subsequent layer generally may not be flat.
- the positive tone resist can effectively be an organometallic photoresist, such as a same or similar resist as used for an initial negative tone patterning, or an organic positive tone resist can be used, such as a blend of diazonaphthoquinone (DNQ) and novolac resin (a phenol formaldehyde resin), DNQ-Novolac resists.
- DNQ diazonaphthoquinone
- novolac resin a phenol formaldehyde resin
- commercial formulations of these positive tone resists are available, such as Fujifilm Holdings America Corp.
- an edge bead removal (EBR) rinse step generally can be used.
- EBR processing typically occurs prior to any thermal processing or baking following deposition of the photoresist and involves rinsing the peripheral edge of a wafer or substrate with a solvent to remove the photoresist in selected regions.
- An EBR and backside rinse involves applying the edge bead rinse solution to the edge as well as the back of the wafer, as described in Waller et al.
- U.S Patent No. 10,627,719 entitled “Methods of Reducing Metal Residue in Edge Bead Region from Metal- Containing Resists", incorporated herein by reference.
- a soft bake, or a post-apply bake is typically performed prior to radiation exposure to hydrolyze the hydrolysable bonds in the precursor compositions, and/or further drive off solvent, and promote densification of the coating material.
- the PAB can be performed at temperatures from about 25 °C to about 250 °C, in additional embodiments from about 50 °C to about 200 °C and in further embodiments from about 80 °C to about 150 °C.
- the post exposure heating can generally be performed for at least about 0.1 minute, in further embodiments from about 0.5 minutes to about 30 minutes and in additional embodiments from about 0.75 minutes to about 10 minutes.
- the coated material generally comprises a polymeric metal oxo-hydroxo network based on the binding of oxo-hydroxo ligands to the metals in which the metals also have some organic (hydrocarbyl) ligands, or a molecular solid comprised of polynuclear metal oxo-hydroxo species with organic (hydrocarbyl) ligands.
- selected organometallic photoresist coatings can be patterned using radiation.
- Suitable radiation sources include extreme ultraviolet (EUV), ultraviolet (UV), or electron beam (EB) radiation.
- EUV radiation can be desirable due to its higher resolution compared to UV radiation, and its higher throughput compared to electron beam (EB)-based processing.
- Radiation can generally be directed to the substrate material through a mask or a radiation beam can be controllably scanned across the substrate to form a latent image within the resist coating.
- ultraviolet light extends between wavelengths of greater than or equal 100 nm and less than 400 nm.
- a krypton fluoride laser can be used as a source for 248 nm ultraviolet light.
- the ultraviolet range can be subdivided in several ways under accepted Standards, such as extreme ultraviolet (EUV) from greater than or equal 10 nm to less than 121 nm and far ultraviolet (FUV) from greater than or equal to 122 nm to less than 200 nm.
- EUV extreme ultraviolet
- FUV far ultraviolet
- a 193 nm line from an argon fluoride laser can be used as a radiation source in the FUV.
- EUV light has been used for lithography at 13.5 nm, and this light is generated from a Xe or Sn plasma source excited using high energy lasers or discharge pulses.
- Commercial sources of EUV photons include scanners fabricated by ASML Holding N.V. Netherlands.
- Soft x-rays can be defined from greater than or equal 0.1 nm to less than 10 nm. The light is directed through a mask to form a latent image in the radiation sensitive coating with exposed regions and un-exposed regions.
- the amount of electromagnetic radiation can be characterized by a fluence or dose which is obtained by the integrated radiative flux over the exposure time.
- suitable radiation fluences can be from about 1 mJ/cm 2 to about 200 mJ/cm 2 , in further embodiments from about 2 mJ/cm 2 to about 150 mJ/cm 2 and in further embodiments from about 3 mJ/cm 2 to about 100 mJ/cm 2 .
- the EUV radiation can be done at a dose of less than or equal to about 150 mJ/cm 2 or with an electron beam at a dose equivalent to or not exceeding about 2 mC/cm 2 at 30 kV.
- PEB post exposure bake
- the PEB can be performed in ambient environments, and in additional embodiments the PEB can be performed in the presence of a reactive gas such as EhO, CO2, CO, SO2, Eh, or others as described in U.S. Patent Application No.: 17/188,679 to Telecky et al. (hereinafter the '679 application), entitled “Process Environment For Inorganic Resist Patterning,” incorporated herein by reference.
- the PEB can be performed at temperatures from about 45 °C to about 250 °C, in additional embodiments from about 50 °C to about 190 °C and in further embodiments from about 60 °C to about 175 °C.
- the post exposure heating can generally be performed for at least about 0.1 minute, in further embodiments from about 0.5 minutes to about 30 minutes and in additional embodiments from about 0.75 minutes to about 10 minutes.
- additional ranges of PEB temperatures and times within the explicit ranges above are contemplated and are within the present disclosure.
- the PEB can be designed to further densify and/or consolidate the exposed regions without decomposing the un-exposed regions into a metal oxide.
- development of the image involves the contact of the patterned coating material including the latent image to a developer composition to remove either the un-irradiated coating material to form the negative image or the irradiated coating to form the positive image, and other organometallic patterning materials may or may not be suitable for both types of patterning tones.
- organotin resist materials described herein effective negative patterning or positive patterning can be performed with desirable resolution using appropriate developing solutions, generally based on the same coating formed from the same precursor composition, although optimization of the coatings may suggest some adjustment of the compositions.
- the irradiated regions are at least partially condensed to increase the metal oxide character so that the irradiated material is resistant to dissolving by organic solvents while the un-irradiated compositions remain soluble in the organic solvents.
- Reference to a condensed coating material refers to at least partial condensation in the sense of increasing the oxide character of the material relative to an initial material.
- the un-irradiated material is not soluble in weak aqueous bases or acids due to the hydrophobic natural of the material so that aqueous bases can be used to remove the irradiated material while maintaining the non-irradiated material for positive patterning.
- suitable developers generally can be aqueous acids or bases.
- aqueous bases can be used to obtain sharper images.
- quaternary ammonium hydroxide compositions such as tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide or combinations thereof, are desirable positive tone developers.
- the coating materials described herein generally can be developed with the same developer commonly used presently for polymer resists, specifically tetramethyl ammonium hydroxide (TMAH). Commercial TMAH is available at 2.38 weight percent.
- TMAH tetramethyl ammonium hydroxide
- Commercial TMAH is available at 2.38 weight percent.
- mixed quaternary tetraalkyl- ammonium hydroxides can be used.
- the developer can comprise from about 0.5 to about 30 weight percent, in further embodiments from about 1 to about 25 weight percent and in other embodiments from about 1.25 to about 20 weight percent tetra-alkylammonium hydroxide or similar quaternary ammonium hydroxides.
- tetra-alkylammonium hydroxide or similar quaternary ammonium hydroxides.
- the developer can be an organic solvent, such as the solvents used to form the precursor solutions.
- developer selection can be influenced by solubility parameters with respect to the coating material, both irradiated and non-irradiated, as well as developer volatility, flammability, toxicity, viscosity and potential chemical interactions with other process material.
- suitable developers include, for example, aromatic compounds (e.g., benzene, xylenes, toluene), esters (e.g., propylene glycol monomethyl ester acetate (PGMEA), ethyl acetate, ethyl lactate, n-butyl acetate, butyrolactone), alcohols (e.g., 4-methyl-2-pentanol, 1-butanol, isopropanol, 1-propanol, methanol), ketones (e.g., methyl ethyl ketone, acetone, cyclohexanone, 2-heptanone, 2- octanone), ethers (e.g., tetrahydrofuran, dioxane, anisole) and the like.
- aromatic compounds e.g., benzene, xylenes, toluene
- esters e.g., propylene glycol monomethyl ester a
- Improved developer compositions have been described in published U.S. Patent Application No.: 2020/0326627 to Jiang et ah, entitled “Organometallic Photoresist Developer Compositions and Processing Methods,” incorporated herein by reference.
- Improved developer solutions generally comprise a reference organic solvent composition and an additive composition having a higher polarity and/or hydrogen-bonding character than the reference solvent composition.
- an improved developer composition can comprise PGMEA and acetic acid.
- the development can be performed for about 5 seconds to about 30 minutes, in further embodiments from about 8 seconds to about 15 minutes and in addition embodiments from about 10 seconds to about 10 minutes.
- a person of ordinary skill in the art will recognize that additional ranges within the explicit ranges above are contemplated and are within the present disclosure.
- a freeze step such as a hard bake
- a post development bake step can be used as a freeze step in a multiple patterning context, as described further below.
- the hard bake conditions can be similar to the PEB step.
- the hard bake can be performed in ambient environments, and in additional embodiments the PEB can be performed in the presence of a reactive gas such as H2O, CO2, CO, SO2, 3 ⁇ 4, or others as described in the '679 patent application cited above.
- the hard bake can be performed at temperatures of at least about 45 °C, in some embodiments from about 45 °C to about 400 °C, in additional embodiments from about 50 °C to about 300 °C and in further embodiments from about 60 °C to about 250 °C.
- the hard bake can generally be performed for at least about 0.1 minute, in further embodiments from about 0.5 minutes to about 30 minutes and in additional embodiments from about 0.75 minutes to about 10 minutes.
- additional ranges of PEB temperatures and times within the explicit ranges above are contemplated and are within the present disclosure.
- organometallic photoresist After the formation of an initial pattern of organometallic material on a surface, another layer of organometallic photoresist can be deposited on top of the pattern. Due to the process advantages of the organometallic patterning compositions, generally an intervening processing step is not used to separate the subsequent patterning resist from the pre-pattemed underlayers. Owing to the chemical changes that occur during exposure and/or PEB steps, existing patterns of organometallic photoresist are insoluble in the coating compositions. This property of the photoresist enables patterning approaches that would require more complicated processing for conventional polymer resists with methods known by those of ordinary skill in the art.
- a first photoresist pattern is transferred into a hardmask layer, which is generally initially unpattemed, whereupon a second lithography process is performed to form a second photoresist pattern whereupon a second etch is performed to transfer the second pattern into the hardmask.
- a second lithography process is performed to form a second photoresist pattern whereupon a second etch is performed to transfer the second pattern into the hardmask.
- a spacer material having a higher etch resistance than the photoresist material is conformally deposited onto the initial photoresist pattern and then the whole substrate is subjected to a series of etches to first remove a portion of the spacer material such that only the sidewalls remain whereupon the remaining photoresist pattern is stripped, thereby forming a pattern of spacer material having a smaller pitch than the initial resist pattern.
- SADP spacer-aligned double patterning
- the multiple patterning concepts herein generally involve sequential patterning steps with a selected relationship of a subsequent pattern with a first pattern. These relationships are shown schematically in Fig. 1 A-E.
- the second pattern is developed to form features between the features of the first pattern so that feature spacing is effectively reduced. As shown in this figure, the patterns are regularly spaced stripes.
- the second pattern overlaying the first pattern intersects with the first pattern and, in this specific embodiment, is orthogonal to the first pattern.
- Each pattern depicted in Fig. IB is again a series of regularly spaced stripes.
- the second pattern overlaying the first pattern has features at an angle to the first pattern, and the features of both patterns are regularly spaced stripes.
- the stripes can be made with irregular spacing or different shapes can be used relative to stripes within the feature size and spacing constraints of the patterning process.
- the second pattern has a different character from the first pattern with some portions again between the features of the first pattern and some portions overlapping the features of the first pattern.
- Fig. IE depicts a cutting of the first pattern using a second patterning step.
- the cuts of the first pattern are guided by the second pattern.
- the cutting process can be effectively performed using opposite tone patterning for each step.
- the second resist coating layer is fully stripped off after doing the cutting step and prior to performing further processing. While the discussion herein focuses primarily on two patterning steps, a third or more patterning steps can be sequentially performed. These three or more patterning steps can be straightforward generalizations of the multiple patterning formats in Figs. 1 A-E.
- a cutting step of Fig. 1 E can be interspersed between other multiple patterning steps or can be the ultimate steps that cuts through one or more previous patterns to form a cut pattern.
- the desirable processing approaches described herein provide for effective multiple patterning without intervening pattern transfer based on high etch contrast and optimization of pattern development.
- multiple patterning can be performed using fewer steps than may be used for multiple patterning with organic resists.
- the lower pattern or patterns are based on negative tone patterning.
- the irradiated resist is maintained while non-irradiated resist is removed by the developer.
- Subsequent layers or resist can then be deposited without having the solvent for the resist damaging the initial pattern.
- a post-patterning freeze step i.e,.a bake step, can optionally be performed to stabilize the pattern, and such a freeze step can generally be desirable to improve the overall patterning quality following the multiple pattering steps.
- a cut step can be performed using a positive tone pattern step such that the developer removes both the irradiated resist composition as well as exposed portions of the pervious patterns.
- the positive tone patterning for cutting can be performed with an organometallic patterning composition or an organic resist, which can be a chemically amplified resist (CAR). High pattern contrast makes this a reasonable undertaking without pattern transfer.
- a litho-freeze-litho-freeze (LFLF) process (with freeze steps being optional and/or adjustable) enables a simpler processing scheme to achieve more complex, higher density, or improved patterns relative to single patterning approaches, and enables simpler processing schemes relative to other multiple patterning approaches available with conventional resists.
- the current processing takes advantage of a hardmask over the substrate that provides for more applicability without being constrained by the substrate compositions.
- there can be many layers of materials built up and patterned so that the composition of the top surface of the substrate at the start of a patterning step can be varied.
- Fig. 2A shows a flow chart of the LFLF process.
- a substrate is obtained 10, and a hardmask layer is placed 12 over the substrate.
- Two lithography processes are shown as parallel vertical arrays of steps.
- an organometallic photoresist is deposited 14 onto the substrate using methods as described above.
- the resist then receives patterned radiation exposure 16 and development 18 to form an image or pattern from a latent image.
- the structure can be subjected optionally to a freeze 20 to allow a subsequent lithography step with reduced damage to the original developed pattern.
- a freeze can be performed using an after development bake step as described above and/or a further unpatterned UV irradiation step.
- the post-development UV irradiation can be used to fragment remaining carbon-metal bonds to further stabilize the material with respect to further processing.
- a blanket UV irradiation step can be performed in the same tool without a mask.
- a subsequent lithography process can then be performed without removing the developed pattern formed in first lithography process.
- a second lithography process similarly comprises depositing 22 an organometallic photoresist over the frozen developed pattern of the first lithography process, radiation exposure 24 of the organometallic resist to form a second latent image, development 26 of the second latent image, and optionally performing a second hardbake freeze 28 to stabilize the pattern following the second development.
- Still more litho-freeze processes such as shown in the parallel set of steps in Fig. 2A, can be performed until a desired pattern of organometallic photoresist is obtained. Once patterning is completed, further processing 30 into devices can be performed. By simplifying the process for performing two or more lithography steps, device manufacturing can be made more efficient.
- a cut step is similar to the lithography steps of Fig. 2, except that the unexposed resist is removed following the cut step prior to an optional hardbake and further processing, either additional lithography steps or next steps of device formation.
- a cutting process is shown in Fig. 2B.
- organometallic photoresist is deposited 34.
- the resist layer is then exposed 36 with patterned radiation to form a latent image.
- the latent image is developed 38 as a positive tone resist.
- the development 38 can be effective to remove the irradiated resist as well as exposed regions of the underlying patterned resist formed from irradiated resist from earlier lithographic patterning steps.
- the process step 38 involves simultaneous development and cutting.
- unexposed resist is stripped 40.
- an optional post patterning bake can be performed 42 to stabilize the pattern. Additional processing can then be performed 30.
- An initial structure 50 comprises a substrate 52 with a hardmask coating 54.
- Substrate 52 comprises an upper section 56 that can be subject to processing and that may or may not have distinct compositions and or patterning of its own.
- a first pattern 60 is formed over hardmask 54.
- the patterning stage involves several steps as outlined in Fig. 2 in the context of the first vertical column of steps to form a first pattern.
- a second patterning stage is performed 62 to form a second pattern 64 over hardmask 54. While Fig.
- second pattern 64 can be considered to be a final pattern.
- the pattern can be further processed 66 by transferring the overall pattern to hard mask 54 and stripping the remaining resist to form patterned hardmask 68. Then, the hardmask pattern is transferred to upper section 56 of substrate 52. Pattern transfer to upper section 56 can comprise etching 70 to form etched substrate 72 or deposition 74 to form patterned hardmask 68 with accretions 76 followed by hardmask etching 78 to form patterned substrate 80.
- Some examples of useful applications of this invention include combining two distinct patterns that require different illumination conditions, for example combing a pillar pattern with a line-space pattern.
- Other advantages of this invention can provide stitching advantages for desired patterns wherein a portion of a desired pattern can be printed, followed by printing another portion of the pattern to print a full pattern that would otherwise be difficult to achieve in one lithography step.
- Multiple exposure mediums can also be practiced for this invention wherein multiple exposure steps independently chosen from sources, such as EUV, ArF, KrF, and electron beams can be used and their respective patterns combined into a new pattern that would otherwise be difficult or unachievable when using only one exposure source.
- adjacent linear segments of neighboring structures can have an average pitch (half-pitch) of no more than about 60 nm (30 nm half-pitch), in some embodiments no more than about 50 nm (25 nm half-pitch) and in further embodiments no more than about 34 nm (17 nm half-pitch).
- Pitch can be evaluated by design and confirmed with scanning electron microscopy (SEM), such as with a top-down image.
- SEM scanning electron microscopy
- pitch refers to the spatial period, or the center-to-center distances of repeating structural elements, and as generally used in the art a half-pitch is a half of the pitch.
- Feature dimensions of a pattern can also be described with respect to the average width of the feature, which is generally evaluated away from comers or the like.
- features can refer to gaps between material elements and/or to material elements.
- average widths can be no more than about 25 nm, in further embodiments no more than about 20 nm, and in additional embodiments no more than about 15 nm.
- average line-width roughness can be no more than about 5.5 nm, in some embodiments no more than about 5 nm and in further embodiments no more than about 4.5 nm.
- the line width roughness can be evaluated as a function of a critical dimension. Evaluating line-width roughness is performed by analysis of top-down SEM images to derive a 3s deviation from the mean line-width.
- the mean contains both high- frequency and low-frequency roughness, i.e., short correlation lengths and long correlation lengths, respectively.
- the line-width roughness of organic resists is characterized primarily by long correlation lengths, while the present organometallic coating materials exhibit significantly shorter correlation lengths.
- the resulting structure can be further processed as desired to achieve a functional integrated circuit.
- the organometallic patterning resists provide a useful platform for effective multiple patterning with reduced process steps and good capability to exploit EUV processing.
- three multiple patterning scenarios are discussed in more detail with appropriate figures to provide more specific explanation for these representative embodiments of multiple patterning.
- a litho-freeze-litho-freeze process is described in which sequential negative tone patterning is performed, and generally with a freeze step based on thermal processing performed between the two patterning steps. While the freeze steps can be optional, they are generally desirable.
- a litho (negative)-litho (positive/cut)-partial strip-freeze process is described, in which the positive tone development simultaneously cuts a portion of the first pattern.
- a freeze can be optionally performed after the first litho step.
- the partial strip step removes the remaining resist from the positive tone patterning after the cut step is completed to leave the uncut remaining portions of the first pattern that was formed by negative tone processing.
- a pattern-pattern-litho process is performed, in which a radiation sensitive coating is exposed to two distinct mask patterns to form a composite latent image before performing a development step. The development then forms a composite pattern.
- Figs. 4 through 15 are directed to a litho-freeze-litho-freeze process with features from the second lithography step being placed within the pattern of the first lithography step.
- the first photosensitive organometallic material is patterned with irradiated regions and un-irradiated regions.
- a patterned structure 100 is shown comprising a substrate 102, a hardmask layer 103, and patterned organometallic material 104.
- Patterned organometallic material 104 comprises condensed regions 110, 112, 116 of irradiated coating material and uncondensed regions 118, 120 of un irradiated coating material.
- condensed regions 110, 112, 116 and uncondensed regions 118, 120 represent a latent image within the organometallic material, and the development of the latent image is discussed in the following section.
- the materials suitable for each of these layers is described in detail above, and the discussion above can be considered reproduced here verbatim.
- FIGs. 6 and 7 the latent image of the structure shown in Figs. 4 and 5 has been developed through contact with a developer to form patterned structure 130.
- Development compositions for negative tone development are described in detail above, and that discussion can be considered a part of the present discussion.
- hardmask layer 103 is exposed along the top surface through openings 132, 134. Openings 132, 134 are located at the positions of uncondensed regions 118, 120, respectively.
- a patterned structure 160 is shown comprising a substrate 102, a hardmask layer 103, "frozen” organometallic material 162, 164, 166, and a second photosensitive organometallic material 170, which has been deposited using solution deposition and/or vapor deposition approaches described above.
- the pattern formed by "frozen" regions 162, 164, 166 is retained under the second photosensitive organometallic material 170 regardless of the deposition approaches since the frozen regions are not soluble in the solvents used to deposit the photosensitive organometallic material.
- the post-development bake to freeze the pattern is not required, but it does further stabilize the structure with efficient processing to improve the pattern structure.
- a patterned structure 190 is shown comprising a substrate 102, a hardmask layer 103, "frozen" previous pattern of organometallic material 162, 164, 166, and patterned organometallic material 180.
- Patterned organometallic material 180 comprises regions 198, 200 of irradiated coating material and uncondensed regions 192, 194, 196 of un-irradiated coating material.
- the pattern formed by condensed regions 198, 200 is parallel to and offset from the pattern formed by the "frozen" organometallic material 162, 164, 166.
- the pattern formed by condensed regions 198, 200 and unirradiated regions 192, 194, 196 represents a latent image into the second organometallic material. The pattern is referred to as the second latent image.
- the second latent image of the structure shown in Figs. 10 and 11 has been developed through contact with a developer for a negative tone image to form a double patterned line structure 220.
- organometallic material 232, 234 is located at the positions of condensed regions 198, 200, respectively.
- "Frozen" organometallic material 162, 164, 166 is located at the positions of condensed regions 110, 112, 116, respectively.
- Hardmask layer 103 is exposed along the top surface through openings 222, 224, 226, 228.
- the etched hardmask 274 exposes the substrate 102 along the top surface through openings 264, 266, 268, 270.
- the patterned substrate 250 consists of hardmask regions 252, 254, 256, 258, 262.
- the hardmask regions 252, 254, 256, 258, 262 correspond, respectively, to the positions of organometallic material 232, 234 and "frozen" organometallic material 162, 164, 166 shown in Figs. 9 and 10.
- Further processing of patterned substrate 250 may include etching into substrate 102 through openings 264, 266, 268, 270 as depicted in Fig. 3, for example.
- depositions can be delivered to the substrate through openings 264, 266, 268, 270, which can be performed with or without first etching the substrate.
- Figs. 16-21 are directed to a litho-freeze-litho-freeze process with features from the second lithography step laying atop and perpendicular to the pattern of the first lithography step.
- Fig. 16 illustrates the exposure of patterned structure 160 (Figs. 8 and 9) with radiation to pattern the second photosensitive organometallic material with irradiated regions and un irradiated regions.
- Resulting patterned structure 280 is shown comprising a substrate 102, a hardmask layer 103, "frozen" organometallic material 162, 164, 166, and patterned organometallic material 282.
- Patterned organometallic material 282 comprises condensed regions 290, 292, 294 of irradiated coating material and regions 284, 286, 288 of un-irradiated coating material.
- the pattern formed by condensed regions 290, 292, 294 is perpendicular to the pattern formed by the "frozen" organometallic material 162, 164, 166.
- the pattern formed by condensed regions 290, 292, 294 and unirradiated regions 284, 286, 288 represents a latent image into the second organometallic material.
- the pattern is referred to as the second latent image. Referring to Figs. 18 and 19A-19C, the second latent image of the structure shown in Figs.
- organometallic material 312, 314, and 316 is located at the positions of condensed regions 290, 292, 294, respectively. Portions of organometallic material 312, 314, and 316 are adjacent to and overlapping with, but does not cut "frozen” organometallic material 162, 164, 166. "Frozen" organometallic material 162, 164, 166 is located at the positions of condensed regions 110, 112, 116, respectively.
- Hardmask layer 103 is exposed along the top surface through openings 324, 326, 328, 330, 332, 334.
- patterned substrate 340 consists of patterned hardmask 342 with a pattern corresponding to the positions of organometallic material 312, 314, and 316 and "frozen" organometallic material 162, 164, 166 shown in Figs. 18 and 19A-19C.
- Patterned hardmask 342 exposes substrate 102 along the top surface through openings 344, 346, 348, 350, 352, 354.
- patterned substrate 340 may include etching into substrate 102 through openings 344, 346, 348, 350, 352, 354 as depicted in Fig. 3, for example.
- depositions can be delivered to the substrate through openings 344, 346, 348, 350, 352, 354, which can be performed with or without first etching the substrate.
- Figs. 22A-22F are directed to a litho-litho process with features from the second lithography step cutting the features from the first lithography step through the use of a positive tone patterning after a negative tone patterning step.
- Figs. 22A and 22B show a patterned structure comprising organometallic material 360 in a pattern on hardmask layer 362.
- hardmask layer 362 is on a substrate 102.
- Organometallic material 360 is a first photosensitive organometallic material that has been irradiated and is at least partially condensed but may not have been subjected to a hardbake freeze. While a hardbake freeze step can stabilize the structure of Fig. 22A, a hardbake freeze can slow subsequent development to cut the structure.
- Organometallic material 360 has been developed through contact with a negative tone developer to form a pattern.
- a second photosensitive organometallic material 364 has been deposited onto the patterned structure of Figs. 22A and 22B using solution deposition and/or vapor deposition approaches described above and patterned with radiation to form a latent image with irradiated regions 366.
- the first photosensitive organometallic material and the second photosensitive organometallic material can be the same material.
- irradiated regions 366 have been developed with a positive tone developer to form open regions 370.
- the positive tone developer also removes exposed organometallic material 360 in the same development step.
- open regions 370 expose hardmask layer 362.
- unexposed second organometallic material 364 has been stripped to reveal patterned resist 376 on hardmask layer 362. Cuts 374 through patterned resist 376 correspond to open regions 370.
- Further processing of the patterned structure of Fig. 22D generally includes etching through hardmask layer 362 to expose portions of a substrate below hardmask layer 362. The remaining patterned organometallic material can then be stripped.
- Figs. 23A-23D are directed to a litho-litho-etch process with latent features from the second irradiation step adding to the latent features from a first lithography step and then developed in a single step to form a pattern of organometallic material.
- Fig. 23A shows a patterned structure comprising condensed regions 380 of irradiated organometallic material and regions 382 of unirradiated organometallic material.
- the pattern formed by condensed regions 380 and unirradiated regions 382 represents a latent image into the organometallic material.
- the pattern is referred to as the first latent image.
- Fig. 23B shows the patterned structure of Fig.
- condensed regions 384 of irradiated organometallic material after irradiation to form condensed regions 384 of irradiated organometallic material.
- the pattern formed by condensed regions 380, condensed regions 384 and unirradiated regions 385 represents a latent image into the organometallic material.
- the pattern is referred to as the combined latent image.
- the combined latent image of the structure shown in Fig. 23B has been developed through contact with a developer for a negative tone image to remove unirradiated organometallic material from unirradiated regions 385 to form the patterned structure of Fig. 23C.
- the patterned structure of Fig. 23C comprises patterned organometallic material 388 on hardmask layer 386. Referring to Fig.
- etched hardmask 394 exposes substrate 390 along the top surface.
- Etched hardmask 394 corresponds to the positions of patterned organometallic material 388.
- patterned organometallic material 388 is stripped prior to further processing.
- Further processing of the patterned structure of Fig. 23D may include etching into substrate 390, as depicted in Fig. 3, for example.
- depositions can be delivered to substrate 390 through openings formed by etched hardmask 394, which can be performed with or without first etching the substrate.
- Figs. 24A-24D are directed to a litho-litho-etch process that is similar to the previous process but uses a positive tone developer instead of a negative tone developer.
- Fig. 24A shows a patterned structure comprising condensed regions 394 of irradiated organometallic material and regions 396 of unirradiated organometallic material. The pattern formed by irradiated regions 394 and unirradiated regions 396 represents a latent image into the organometallic material. The pattern is referred to as the first latent image.
- Fig. 24B shows the patterned structure of Fig. 24A after irradiation to form irradiated regions 398 of irradiated organometallic material.
- the pattern formed by irradiated regions 394, irradiated regions 398, and unirradiated regions 397 represents a latent image into the organometallic material.
- the pattern is referred to as the combined latent image.
- the combined latent image of the structure shown in Fig. 24B has been developed through contact with a developer for a positive tone image to remove irradiated organometallic material from irradiated regions 394 and irradiated regions 398 to form the patterned structure of Fig. 24C.
- the patterned structure of Fig. 24C comprises patterned organometallic material 400 on hardmask layer 402. Referring to Fig.
- etched hardmask 404 exposes substrate 406 along its top surface. Etched hardmask 404 corresponds to the positions of patterned organometallic material 400. Generally, patterned organometallic material 388 is stripped prior to further processing. Further processing of the patterned structure of Fig. 24D may include etching into substrate 406, as depicted in Fig. 3, for example. Alternatively, or additionally, depositions can be delivered to substrate 406 through openings formed by etched hardmask 404, which can be performed with or without first etching the substrate.
- Figs. 1-24D The various multiple patterning processes depicted in Figs. 1-24D can be combined in various reasonable ways, as described generally above.
- the Example below describes methods for performing LFLF on an organotin resist using EUV lithography.
- rectangular holes can be formed having an average size of no more than about 50 nm, in further embodiments no more than 40 nm, in other embodiments no more than 30 nm, and in additional embodiments from 20 nm to 30 nm.
- Size refers to a diameter or to a diagonal length for a rectangular hole, and a person of ordinary skill in the art can evaluate an appropriate size based on this for other shapes. A person of ordinary skill in the art will recognize that additional ranges of hole size within these explicit ranges are contemplated and are within the present disclosure.
- This example demonstrates methods of double patterning with an organotin photoresist wherein a first layer of photosensitive organotin material is patterned on a substrate, whereupon a subsequent layer of photosensitive organotin material is deposited atop the first patterned layer and patterned perpendicular to the first pattern to result in a crosshatched pattern.
- the substrate in this example consisted of a Si wafer coated with 10 nm of spin-on- glass (SOG) as an underlayer, however the underlayer identity is not particularly important to practice this method.
- SOG spin-on- glass
- Other underlayers can be used insofar as they provide adequate adhesion and enable sufficient lithographic performance.
- the organotin resist used in this example was YATU1011, manufactured by Inpria Corporation and having a composition as described in U.S. Patent Number 10,228,618 by Meyers et al. entitled “Organotin Oxide Hydroxide Patterning Compositions, Precursors, And Patterning”
- a first organotin layer was deposited via spin coating at 1394 rpm to give a film having a thickness of approximately 22 nm, and followed by a post-application bake (PAB) step performed at 100°C for 60 seconds. Following the PAB step, the wafer is exposed to EUV radiation on an ASML NXE3300 scanner to form a first radiation patterned layer. After exposure, a post-exposure bake (PEB) was performed at 170°C for 60 seconds. The first patterned layer is then developed and subjected to a hard bake at 250 °C for 60s to produce a first pattern of parallel 16.0 nm lines on a 32.0 nm pitch on the now patterned substrate. The hard bake is employed to “freeze” the pattern; in other words, to render it completely insoluble in the subsequent lithographic process.
- PAB post-application bake
- a second layer of organotin material can be deposited on top of the patterned substrate and subjected to a PAB using identical processes and conditions employed for formation of the first organotin layer.
- the wafer was rotated 90° and exposed to EUV radiation on an ASML NXE3300 scanner. Due to the 90° rotation of the wafer relative to the first pattern, the second exposure produces a radiation pattern that is perpendicular to the first.
- the wafer is subjected to a PEB at 170°C for 60 seconds, developed, and hard baked at 250°C for 60 seconds to form a double patterned substrate.
- Fig. 25 shows a CD-SEM image of the final product.
- a crosshatched pattern is seen wherein lines in the x direction are produced in the first patterning step, and the lines in the y direction are produced in the second patterning step.
- the crosshatched pattern has 16.0 nm lines of organotin material with a line width roughness of 1.8 nm on a 32.0 nm pitch, forming approximately 16.6 nm square holes. This structure can be a useful method for producing contact holes.
- the developer composition comprised PGME and acetic acid as described in U.S. Patent Application No.: 16/845,511 by Jiang et al. entitled “Organometallic Photoresist Developer Compositions”.
- Other developers can be used, such as 2-heptanone and others described in U.S Patent Number 9,310,684, entitled “Organometallic Solution Based High Resolution Patterning Compositions” and U.S. Patent Number 10,228,618 by Meyers et al. entitled “Organotin Oxide Hydroxide Patterning Compositions, Precursors, And Patterning”
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US11886116B2 (en) | 2024-01-30 |
KR20230005970A (en) | 2023-01-10 |
JP2023524969A (en) | 2023-06-14 |
TW202226343A (en) | 2022-07-01 |
EP4147269A1 (en) | 2023-03-15 |
US20240118614A1 (en) | 2024-04-11 |
EP4147269A4 (en) | 2024-06-05 |
US20210349390A1 (en) | 2021-11-11 |
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