WO2021200790A1 - 積層フィルム、その製造方法および利用 - Google Patents
積層フィルム、その製造方法および利用 Download PDFInfo
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- WO2021200790A1 WO2021200790A1 PCT/JP2021/013199 JP2021013199W WO2021200790A1 WO 2021200790 A1 WO2021200790 A1 WO 2021200790A1 JP 2021013199 W JP2021013199 W JP 2021013199W WO 2021200790 A1 WO2021200790 A1 WO 2021200790A1
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- piezoelectric film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F1/00—Preventing the formation of electrostatic charges
- H05F1/02—Preventing the formation of electrostatic charges by surface treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
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- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
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- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
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Definitions
- the present invention relates to a laminated film, and more particularly to a laminated film including a piezoelectric film, a method for producing the same, and its use.
- Piezoelectric film is a film that charges when it receives pressure, but the charged film may cause severe electrostatic discharge, so care must be taken when handling it.
- As a method of removing static electricity from a charged film there is a method of using a device such as an ionizer, but it is costly to introduce the equipment.
- the piezoelectric film is charged by its characteristics only when it comes into contact with an object (particularly during transportation) or is unwound from the roll.
- piezoelectric films that are less likely to be charged are required.
- Cited Document 1 discloses a resin film having an adhesive layer on the first surface and a surface roughness Ra of the second surface on the opposite side having a surface roughness Ra of 1.5 nm or more.
- the resin film of Cited Document 1 has a peeling charge amount of 30 kV or less when the second surface is brought into contact with the transparent conductive layer and then peeled off.
- Cited Document 2 a release layer is provided on one surface of a polyester film having an average centerline roughness of less than 0.5 ⁇ m, and an antistatic layer made of a resin containing conductive carbon black is provided on the other surface.
- a release film provided with a layer is disclosed.
- the release film of Cited Document 2 has a surface specific resistance value of the antistatic layer of 5 ⁇ 10 4 to 5 ⁇ 10 9 ⁇ / ⁇ and a peeling charge amount of ⁇ 5 to + 5 kV.
- the present invention has been made in view of the above problems, and an object of the present invention is to provide a piezoelectric film which is less likely to be charged and can be handled safely.
- the present invention is a laminated film in which a piezoelectric film containing polyvinylidene fluoride and a protective film containing an antistatic layer are laminated.
- the laminated film according to the present invention it is possible to provide a piezoelectric film that is less likely to be charged and can be handled safely.
- Laminated film A form of the laminated film according to the present invention will be described below. In the laminated film according to this embodiment, a piezoelectric film and a protective film are bonded together.
- the piezoelectric film in the present embodiment contains polyvinylidene fluoride as a main component.
- "as a main component” means that the content is 50 mol% or more.
- the components other than polyvinylidene fluoride that can be contained in the piezoelectric film will be described later.
- the piezoelectric film in the present embodiment preferably has a piezoelectric constant d 33 of 5 pC / N or more, more preferably 8 pC / N or more, and even more preferably 10 pC / N or more.
- the piezoelectric constant d 33 of the piezoelectric film is preferably 40 pC / N or less, more preferably 35 pC / N or less, and even more preferably 30 pC / N or less.
- a film having a piezoelectric constant d 33 within this range has a piezoelectric property suitable for obtaining a transparent conductive film having sufficient functions and a touch panel.
- the piezoelectric constant d 33 can be an index of the degree of charge with respect to a constant pressure.
- the larger the piezoelectric constant d 33 the higher the charge density generated when a constant pressure is applied, so that the degree of charge of the piezoelectric film can also be increased.
- the piezoelectric constant d 33 in the present specification is a value calculated by applying stress to the film in the thickness direction of the film at a constant speed using a pneumatic press and measuring the generated charge with a charge amplifier. be.
- the piezoelectric film in the present embodiment preferably has a thickness of 5 ⁇ m or more, more preferably 10 ⁇ m or more, and even more preferably 20 ⁇ m or more.
- the thickness of the piezoelectric film is preferably 200 ⁇ m or less, more preferably 120 ⁇ m or less, and even more preferably 80 ⁇ m or less.
- the transparent conductive film is required to have high transparency.
- the transparency of the transparent conductive film is affected by the thickness of the piezoelectric film as a raw material. However, if the thickness is within the above range, the transparent conductive film is composed of a thin layer. Therefore, a transparent conductive film having sufficient transparency can be obtained. Therefore, the piezoelectric film having a thickness within the above range can be suitably used for the transparent conductive film and the touch panel.
- the piezoelectric film is bonded to the protective film in the process of manufacturing the transparent conductive film and the touch panel. Therefore, it is preferable that the piezoelectric film is smooth with few irregularities on the surface to the extent that it can be sufficiently bonded to the protective film.
- the polyvinylidene fluoride contained in the piezoelectric film of the present embodiment may contain a monomer copolymerizable with vinylidene fluoride as a constituent unit within the range in which the effect of the present embodiment can be obtained.
- a monomer copolymerizable with vinylidene fluoride include fluorine-containing monomers such as ethylene trifluoride, ethylene tetrafluoride, propylene hexafluoride, ethylene trifluoride and vinyl fluoride.
- two or more kinds of such monomers may be contained.
- the piezoelectric film can contain various additives in order to improve the extrusion processability at the time of forming the film within the range where the effect of the present embodiment can be obtained.
- the additive include a plasticizer, a stabilizer, an antioxidant, a surfactant, a pigment, and the like, which can be appropriately combined and used depending on the intended use. Both organic and inorganic compounds can be used as additives.
- the organic compound may be a polymer.
- the protective film in the present embodiment is a film that adheres to the piezoelectric film to protect the piezoelectric film from scratches and dirt, and at the same time, eliminates static electricity from the piezoelectric film, and includes an antistatic layer.
- the antistatic layer is composed of a conductive polymer, a material to which an antistatic agent is added, or a surface coating with an antistatic agent, or these. It may be composed of combinations.
- Examples of the conductive polymer include polyacetylene, polyparaphenylene, polythiophene, polypyrrole, polyaniline, and polyacene.
- the antistatic agent examples include (a) various cationic antistatic agents having a cationic group such as a quaternary ammonium salt, a pyridinium salt, and a primary to tertiary amino group, and (b) a sulfonic acid base and a sulfuric acid.
- Anionic antistatic agents having anionic groups such as ester bases, phosphate ester bases and phosphonic acid bases, (c) amphoteric antistatic agents such as amino acid-based and aminosulfate ester-based, and (d) aminoalcohol-based and glycerin. Examples thereof include nonionic antistatic agents such as ester and polyethylene glycol.
- More specific examples are not particularly limited, but 1-octylpyridinium hexafluorophosphate, 1-nonylpyridinium hexafluorophosphate, 2-methyl-1-dodecylpyridinium hexafluorophosphate.
- Examples thereof include acid salt, 1-octylpyridinium dodecylbenzenesulfonate, 1-dodecylpyridinium thiocyanate, 1-dodecylpyridinium dodecylbenzenesulfonate, 4-methyl-1-octylpyridinium hexafluorophosphate and the like. ..
- the antistatic layer has electrical conductivity. Therefore, when the surface of a charged object is coated with an antistatic layer, the surface of the object is electrically conductive and the electric charge leaks, so that the static electricity is dissipated and the static electricity is eliminated.
- the surface specific resistance value can be mentioned.
- the surface specific resistance value can be measured according to JIS K 7194 using, for example, a known resistivity meter.
- the antistatic layer preferably has a surface specific resistance value of 10 14 ⁇ / sq or less, more preferably 10 12 ⁇ / sq or less, and further preferably 10 10 ⁇ / sq or less.
- the surface specific resistance value is 10 14 ⁇ / sq or less, it is possible to prevent the laminated film from being charged.
- the antistatic layer has a surface resistivity, is preferably 10 4 ⁇ / sq or more, more preferably 10 6 ⁇ / sq or more, more preferably 10 8 ⁇ / sq or more ..
- the surface specific resistance value is within this range, the laminated film can be static-free without causing a violent electrostatic discharge when a charged object comes into contact with another object.
- the thickness of the antistatic layer is not particularly limited as long as the effect can be sufficiently exerted, and may be appropriately selected according to the antistatic agent to be used. For example, it can be 0.020 ⁇ m to 2.0 ⁇ m, but it may be 0.020 ⁇ m to 0.15 ⁇ m or 0.10 ⁇ m to 2.0 ⁇ m.
- the protective film in the present embodiment may further include an adhesive layer, a base material layer, and the like in addition to the antistatic layer.
- the protective film in the present embodiment is assumed to include an adhesive layer and a base material layer.
- the adhesive layer is a layer having an adhesive force for attaching the protective film to the piezoelectric film.
- the pressure-sensitive adhesive is preferably a material that can not only attach the protective film to the piezoelectric film but also peel off the protective film without leaving glue on the piezoelectric film.
- the adhesives include, for example, acrylic adhesives, rubber adhesives, silicone adhesives, polyester adhesives, polyurethane adhesives, polyamide adhesives, epoxy adhesives, vinyls.
- examples thereof include alkyl ether-based pressure-sensitive adhesives and fluorine-based pressure-sensitive adhesives. These adhesives can be used alone or in combination of two or more. Among them, an acrylic pressure-sensitive adhesive is preferably used from the viewpoint of adhesiveness and peelability.
- the thickness of the adhesive layer is not particularly limited as long as the protective film can be attached to the piezoelectric film, but it is preferably 3 ⁇ m or more and 10 ⁇ m or less, for example.
- the base material layer is a resin layer for supporting the antistatic layer and the adhesive layer.
- resins that make up the substrate layer include polyesters such as polyethylene terephthalate (PET) and polybutylene terephthalate; polyolefins such as polyethylene (PE) and polypropylene (PP); polyvinyl chloride, vinyl chlorinated resins, and polyfluoride.
- Halogen-containing polymers such as vinylidene (PVDF); acrylic polymers such as polymethylmethacrylate; and styrene-based polymers such as polystyrene and styrene-methylmethacrylate copolymers can be mentioned.
- PVDF vinylidene
- acrylic polymers such as polymethylmethacrylate
- styrene-based polymers such as polystyrene and styrene-methylmethacrylate copolymers can be mentioned.
- PET, PE and PP are preferable, and PET is the most preferable.
- the thickness of the base material layer is not particularly limited as long as it can support the antistatic layer and the adhesive layer, but is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, and further preferably 30 ⁇ m or more.
- the thickness of the base material layer is preferably 150 ⁇ m or less, more preferably 100 ⁇ m or less, and further preferably 60 ⁇ m or less. ..
- the antistatic layer, the adhesive layer and the base material layer may be laminated in any order as long as the function and effect can be exhibited.
- the adhesive layer, the base material layer and the antistatic layer may be laminated in this order, or the adhesive layer, the antistatic layer and the base material layer may be laminated in this order.
- the adhesive layer, the base material layer and the antistatic layer are laminated in this order in the protective film.
- the protective film in the present embodiment preferably has a thickness of 10 ⁇ m or more, more preferably 20 ⁇ m or more, and further preferably 30 ⁇ m or more. If the thickness of the protective film is within this range, the piezoelectric film can be sufficiently protected from scratches and dirt.
- the thickness of the protective film is preferably 150 ⁇ m or less, more preferably 100 ⁇ m or less, and further preferably 60 ⁇ m or less. When the thickness of the protective film is within this range, the manufacturing cost and the transportation cost of the conductive film and the touch panel can be suppressed.
- the protective film in the present embodiment is a layer for protecting the surface of the protective film from dirt and the like until it is bonded to the piezoelectric film, and may further include a release layer that is removed at the time of bonding.
- the material of the release layer is not particularly limited as long as it can protect the protective film and can be easily removed.
- the release layer is composed of PET.
- the release layer may be formed on only one surface of the surface of the protective film, or may be formed on both surfaces.
- the surface potential in the rolled state is preferably ⁇ 5 kV or more and 5 kV or less, more preferably -4 kV or more and 4 kV or less, and further preferably -3 kV or more and 3 kV or less. ..
- the surface potential of the film can be measured using, for example, a known electrostatic potential measuring device.
- the surface potential of the film in the rolled state is within this range, charging is unlikely to occur when the piezoelectric film is transported or the film is unwound in the manufacturing process, so that severe electrostatic discharge can be prevented. Therefore, the operator can safely handle the laminated film.
- the laminated film according to the present embodiment preferably has a film surface potential of -3 kV or more and 3 kV or less when the laminated film is pulled out from the rolled state at 50 cm / s. More preferably, the surface potential is -2 kV or more and 2 kV or less, and more preferably -1 kV or more and 1 kV or less.
- the film is unlikely to be charged when the laminated film in the rolled state is pulled out. Therefore, even if electrostatic discharge occurs, the electric shock to the hand does not cause pain. .. Therefore, the operator can safely handle the laminated film.
- the piezoelectric film and the protective film are bonded to each other via the adhesive layer of the protective film.
- the piezoelectric film, the adhesive layer, the base material layer and the antistatic layer may be laminated in this order, or the piezoelectric film, the adhesive layer, the antistatic layer and the base material layer may be laminated in this order.
- the former is more preferable.
- the antistatic layer discharges electric charges from its surface to eliminate static electricity from the piezoelectric film. Therefore, when the antistatic layer is provided on the outside of the laminated film, the piezoelectric film is statically eliminated more efficiently. Can be done. That is, the electrification of the laminated film can be suppressed.
- the method for manufacturing a laminated film according to the present embodiment includes a polarization step for obtaining a piezoelectric film, a laminating step for laminating a piezoelectric film and a protective film to obtain a laminated film, and winding up the laminated film. Including the process.
- the polarization step is a step of polarizing an extruded film containing polyvinylidene fluoride before winding to obtain a piezoelectric film.
- the extruded film containing polyvinylidene fluoride can be obtained by a known method, and the method is not limited. For example, a method of melt-extruding and stretching a polyvinylidene fluoride resin containing polyvinylidene fluoride can be mentioned.
- polyvinylidene fluoride and additives constituting the polyvinylidene fluoride resin are supplied to the extruder using a known drying and mixing device.
- the stretching method is also not particularly limited, and the flat film or tubular film can be stretched by uniaxial or biaxial stretching by a known stretching method such as a tenter method, a drum method, or an inflation method.
- the extruded film before winding is polarized.
- Polarization can be performed, for example, by passing a direct current through the extruded film and applying a voltage.
- the voltage may be appropriately adjusted depending on the thickness of the extruded film, but may be, for example, about 1 kV to 50 kV.
- the piezoelectric film can be obtained by polarization the extruded film.
- the extruded film may be obtained and then the film may be cooled before polarization.
- the laminating step is a step of laminating a piezoelectric film before winding and a protective film containing an antistatic layer to obtain a laminated film. At this time, the piezoelectric film and the protective film are bonded to each other via the adhesive layer of the protective film.
- the protective film contains an adhesive layer, but when the protective film does not include the adhesive layer, the protective film is coated with an adhesive and then the piezoelectric film. And the protective film may be bonded together.
- the piezoelectric film may be heated before the piezoelectric film and the protective film are bonded together. As a result, the piezoelectric film is heat-fixed while the strain is alleviated. When the heat-fixed piezoelectric film is used, it is possible to reduce the heat shrinkage of the laminated film that may occur in the step after bonding.
- the piezoelectric film may be heated at 90 to 140 ° C. for about 15 to 120 seconds, for example.
- the winding step is a step of winding the laminated film.
- the laminated film is wound around, for example, a roller core.
- the tension and speed at the time of winding may be appropriately adjusted according to the thickness of the laminated film and the like so as not to cause winding tightening.
- the protective film When winding the laminated film, the protective film may be on the inside or the piezoelectric film may be on the inside. Further, the laminated film once wound may be rewound in a subsequent step, and at this time, the front and back of the film may be reversed.
- the piezoelectric film can be statically eliminated by the step of laminating the piezoelectric film and the protective film. Further, the laminated film produced by the production method in the present embodiment can be safely handled because the piezoelectric film is bonded to the protective film and the piezoelectric film is less likely to be charged.
- the laminated film according to the embodiment of the present invention is a resin film made of a piezoelectric film and can be applied to a transparent conductive film.
- the transparent conductive film can be produced by adhering a metal oxide such as Sn-doped indium oxide or fluorine-doped tin oxide to the surface of the laminated film produced by the above method and peeling off the protective film.
- a metal oxide such as Sn-doped indium oxide or fluorine-doped tin oxide
- a sputtering method or a thin film deposition method can be used for the adhesion of the metal oxide to the surface of the laminated film. Either the metal oxide adhesion or the protective film peeling may be performed first.
- a desired transparent conductive film can be obtained by appropriately performing a corona treatment, a wet coating treatment, an annealing treatment and the like, if necessary.
- the transparent conductive film obtained by the above method can be applied to a touch panel provided in a smartphone, a tablet terminal, a car navigation system, or the like. That is, it is possible to realize a 3D touch sensor in which a third sensor for detecting a pressing force is added to a conventional touch panel that detects a position in a two-dimensional direction.
- the laminated film according to the present invention is a laminated film in which a piezoelectric film containing polyvinylidene fluoride and a protective film containing an antistatic layer are bonded together.
- the piezoelectric film preferably has a piezoelectric constant d 33 of 5 pC / N or more and 40 pC / N or less.
- the piezoelectric film preferably has a thickness of 5 ⁇ m or more and 200 ⁇ m or less.
- the antistatic layer preferably has a surface specific resistance value of 10 14 ⁇ / sq or less.
- the protective film further includes a base material layer, and the piezoelectric film, the base material layer, and the antistatic layer are laminated in this order.
- the surface potential of the film when the laminated film is pulled out from the rolled state at 50 cm / s is -3 kV or more and 3 kV or less.
- the method for producing a laminated film according to the present invention includes a polarization step of polarization an extruded film before winding to obtain a piezoelectric film containing vinylidene fluoride, a protective film containing the piezoelectric film before winding and an antistatic layer.
- This is a method for producing a laminated film, which includes a laminating step of laminating the laminated films to obtain a laminated film and a winding step of winding the laminated film.
- the method for producing a transparent conductive film according to the present invention includes attaching a metal oxide to the surface of a laminated film produced by using the above-described method for producing a laminated film and peeling off a protective film. This is a method for manufacturing a conductive film.
- Example 1 A resin film (thickness, 120 ⁇ m) formed from PVDF (polyvinylidene fluoride: manufactured by Kureha Corporation) having an intrinsic viscosity of 1.3 dl / g was passed through a preheating roll heated to a surface temperature of 110 ° C. Subsequently, the film passed through the preheating roll was passed through a stretching roll heated to a surface temperature of 120 ° C. and stretched so as to have a stretching ratio of 4.2 times to obtain a PVDF film.
- PVDF polyvinylidene fluoride: manufactured by Kureha Corporation
- the PVDF film was passed through a polarization roll to perform polarization treatment to obtain a piezoelectric film.
- the needle electrodes were arranged at positions separated from the surface of the polarization roll by about 10 mm, and a DC voltage was applied between the needle electrodes. At that time, the DC voltage was increased from 0 kV to 11 kV.
- the film after the polarization treatment was further heat-treated at 130 ° C. for 1 minute to obtain a final piezoelectric film.
- the piezoelectric constant d 33 of the piezoelectric film was obtained. Specifically, stress was applied at a constant speed in the thickness direction of the piezoelectric film using a pneumatic press, and the generated charge was measured with a charge amplifier.
- a film having a thickness of 38 ⁇ m (base material: polyethylene terephthalate) was prepared.
- the surface intrinsic resistance value of the antistatic layer was measured using a resistivity meter (Mitsubishi Chemical Analytech Co., Ltd. LorestaGP MCP-HT800) in accordance with JIS K6911. The surface specific resistance value was measured three times, and the average value of the three times was shown in Table 1 as a representative value.
- the protective film and the piezoelectric film were bonded together using a multi-coater, and then wound into a roll.
- the multi-coater was set to a line speed of 5 m / min and a laminating roll contact pressure of about 0.3 N.
- Example 2 In the polarization treatment, the same operation as in Example 1 was performed except that the DC voltage was increased from 0 kV to 9 kV instead of being increased from 0 kV to 11 kV.
- Example 3 The same operation as in Example 1 was performed except that a protective film (manufactured by Fujimori Kogyo Co., Ltd., “KB-003”) having a different surface specific resistance value of the antistatic layer was used.
- a protective film manufactured by Fujimori Kogyo Co., Ltd., “KB-003”
- Example 4 The same operation as in Example 2 was carried out to obtain a piezoelectric film.
- a film having a thickness of 32 ⁇ m (base material: PVDF) was prepared as a protective film containing an antistatic layer.
- the protective film was produced as follows. A resin film (thickness, 120 ⁇ m) formed from PVDF (polyvinylidene fluoride: manufactured by Kureha Corporation) was stretched so that the stretching ratio was 4.2 times. Next, using a multi-coater set to a line speed of 2 m / min, an antistatic agent (manufactured by Arakawa Chemical Industry Co., Ltd.) adjusted to a solid content concentration of 3.5% on the surface of the stretched resin film. Alacoat AS601D ”) was applied at a coating rate of 3 g / m 2.
- the resin film was dried at 100 ° C. for 1 minute and then wound into a roll.
- an adhesive manufactured by Soken Kagaku Co., Ltd.
- the solid content concentration of the resin film was adjusted to 15% using ethyl acetate on the surface opposite to the surface coated with the antistatic agent, that is, the back surface.
- SK Dyne 1499M was applied at a coating rate of 22 g / m 2.
- the resin film was dried at 100 ° C. for 1 minute to obtain a protective film having an antistatic layer on the front surface and an adhesive layer on the back surface.
- the surface intrinsic resistance value of the antistatic layer was measured using a resistivity meter (Nittoseiko Analytech Co., Ltd. Hiresta MCP-HT800) in accordance with JIS K6911. The surface specific resistance value was measured three times, and the average value of the three times was shown in Table 1 as a representative value.
- the protective film and the piezoelectric film were bonded together using a multi-coater, and then wound into a roll.
- the multi-coater was set to a line speed of 5 m / min and a laminating roll contact pressure of about 0.3 N. In this way, a laminated film in which the piezoelectric film, the base material layer (PDVF), and the antistatic layer are laminated in this order was obtained.
- the same operation as in Example 4 was carried out except that the antistatic agent (“BONDEIP-PA100” manufactured by Konishi Co., Ltd.) was applied with a wet coating amount of 3 g / m 2.
- Example 2 The same operation as in Example 1 was performed except that only the piezoelectric film was wound into a roll.
- the surface potential of the film when the film was pulled out from the roll at 50 cm / s was measured. The measurement was performed at a position 10 cm from the film surface on the outside of the roll. When pulling out the film from the roll, the electrostatic potential measuring instrument was fixed so that it could be measured at a certain distance.
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- Spectroscopy & Molecular Physics (AREA)
- Laminated Bodies (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/907,483 US20230119647A1 (en) | 2020-04-02 | 2021-03-29 | Multilayered film, method for producing same, and use thereof |
| CN202180019036.2A CN115362059A (zh) | 2020-04-02 | 2021-03-29 | 层叠膜、其制造方法和利用 |
| EP21780232.1A EP4129669A4 (en) | 2020-04-02 | 2021-03-29 | MULTILAYER FILM, PRODUCTION PROCESS AND USE THEREOF |
| KR1020227032412A KR20220140840A (ko) | 2020-04-02 | 2021-03-29 | 적층 필름, 그의 제조 방법 및 이용 |
| JP2022512189A JPWO2021200790A1 (https=) | 2020-04-02 | 2021-03-29 |
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| JP2020-066712 | 2020-04-02 | ||
| JP2020066712 | 2020-04-02 |
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| WO2021200790A1 true WO2021200790A1 (ja) | 2021-10-07 |
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| PCT/JP2021/013199 Ceased WO2021200790A1 (ja) | 2020-04-02 | 2021-03-29 | 積層フィルム、その製造方法および利用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230119647A1 (https=) |
| EP (1) | EP4129669A4 (https=) |
| JP (1) | JPWO2021200790A1 (https=) |
| KR (1) | KR20220140840A (https=) |
| CN (1) | CN115362059A (https=) |
| TW (1) | TW202138191A (https=) |
| WO (1) | WO2021200790A1 (https=) |
Cited By (6)
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|---|---|---|---|---|
| EP4245519A1 (en) * | 2022-03-15 | 2023-09-20 | Taghleef Industries Inc. | Triboelectric mitigator coating |
| JPWO2023224056A1 (https=) * | 2022-05-18 | 2023-11-23 | ||
| JPWO2023224057A1 (https=) * | 2022-05-18 | 2023-11-23 | ||
| WO2025135141A1 (ja) * | 2023-12-21 | 2025-06-26 | 株式会社クレハ | 積層圧電体及びその製造方法 |
| WO2025182752A1 (ja) * | 2024-02-28 | 2025-09-04 | 株式会社クレハ | フッ素系樹脂圧電フィルムおよびその製造方法 |
| WO2026029139A1 (ja) * | 2024-07-31 | 2026-02-05 | 株式会社クレハ | フッ素系樹脂圧電フィルムおよびその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024203685A1 (https=) * | 2023-03-24 | 2024-10-03 |
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| EP4245519A1 (en) * | 2022-03-15 | 2023-09-20 | Taghleef Industries Inc. | Triboelectric mitigator coating |
| JPWO2023224056A1 (https=) * | 2022-05-18 | 2023-11-23 | ||
| WO2023224056A1 (ja) * | 2022-05-18 | 2023-11-23 | 株式会社クレハ | 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法 |
| JPWO2023224057A1 (https=) * | 2022-05-18 | 2023-11-23 | ||
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| WO2025182752A1 (ja) * | 2024-02-28 | 2025-09-04 | 株式会社クレハ | フッ素系樹脂圧電フィルムおよびその製造方法 |
| WO2026029139A1 (ja) * | 2024-07-31 | 2026-02-05 | 株式会社クレハ | フッ素系樹脂圧電フィルムおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202138191A (zh) | 2021-10-16 |
| EP4129669A1 (en) | 2023-02-08 |
| EP4129669A4 (en) | 2024-04-03 |
| US20230119647A1 (en) | 2023-04-20 |
| CN115362059A (zh) | 2022-11-18 |
| JPWO2021200790A1 (https=) | 2021-10-07 |
| KR20220140840A (ko) | 2022-10-18 |
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