WO2021200336A1 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
WO2021200336A1
WO2021200336A1 PCT/JP2021/011701 JP2021011701W WO2021200336A1 WO 2021200336 A1 WO2021200336 A1 WO 2021200336A1 JP 2021011701 W JP2021011701 W JP 2021011701W WO 2021200336 A1 WO2021200336 A1 WO 2021200336A1
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WO
WIPO (PCT)
Prior art keywords
main surface
electronic device
substrate
lead
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/011701
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
祐司 石松
憲治 ▲濱▼
原　英夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to DE212021000242.0U priority Critical patent/DE212021000242U1/de
Priority to DE112021000700.9T priority patent/DE112021000700T5/de
Priority to CN202180024866.4A priority patent/CN115335986A/zh
Priority to US17/914,088 priority patent/US12599006B2/en
Priority to JP2022511955A priority patent/JP7607640B2/ja
Publication of WO2021200336A1 publication Critical patent/WO2021200336A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • This disclosure relates to electronic devices.
  • IPM Intelligent Power Module
  • This electronic device includes an electronic element, a control element, and a lead frame (see Patent Document 1).
  • the electronic device is a power semiconductor device that controls electric power.
  • the control element controls the electronic element.
  • the lead frame supports electronic and control devices and provides a conduction path for these devices.
  • one issue of the present disclosure is to provide an electronic device capable of higher integration.
  • the electronic device has a substrate having a substrate main surface and a substrate back surface separated from each other in the thickness direction, an element main surface, and a first main surface electrode on the element main surface. It has an electronic element formed of, a wiring portion formed on the main surface of the substrate and transmitting a control signal for controlling the electronic element, and a main surface and a back surface separated from each other in the thickness direction.
  • the back surface was joined to the wiring portion, the conductive first lead arranged on the main surface of the substrate, and the main surface and the first main surface electrode of the conductive member. It includes a first connecting member.
  • the first lead includes a first pad portion separated from the wiring portion and to which the electronic element is bonded.
  • the wiring portion and the first main surface electrode are electrically connected to each other via the conductive member and the first connecting member.
  • FIG. 3 is a cross-sectional view taken along the line VII-VII of FIG.
  • FIG. 6 is an enlarged cross-sectional view of a main part obtained by enlarging a part of FIG. 7.
  • FIG. 3 is a cross-sectional view taken along the line IX-IX of FIG. It is a top view which shows the electronic device of 2nd Embodiment, and the resin member is shown by the imaginary line. It is sectional drawing which follows the XI-XI line of FIG.
  • the electronic device A1 includes a substrate 1, a wiring unit 2, two electronic elements 3, two control elements 4, a plurality of passive elements 5, a plurality of leads 6, a plurality of first connecting members 71, and a plurality of second connecting members 72. , A plurality of third connecting members 73 and a resin member 8 are provided.
  • the plurality of leads 6 includes a plurality of first leads 61, a plurality of second leads 62, a plurality of third leads 63, and a plurality of fourth leads 64.
  • the electronic device A1 is, for example, an IPM (Intelligent Power Module), but the present disclosure is not limited to this.
  • the electronic device A1 is used for applications such as an air conditioner and a motor control device.
  • FIG. 1 is a perspective view showing the electronic device A1.
  • FIG. 2 is a plan view showing the electronic device A1.
  • FIG. 3 is a plan view corresponding to FIG. 2, and the resin member 8 is shown by an imaginary line (dashed line).
  • FIG. 4 is a bottom view showing the electronic device A1.
  • FIG. 5 is a side view (left side view) showing the electronic device A1.
  • FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG.
  • FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG.
  • FIG. 8 is an enlarged cross-sectional view of a main part obtained by enlarging a part of FIG. 7.
  • FIG. 9 is a cross-sectional view taken along the line IX-IX of FIG. In FIG. 9, the first connecting member 71 and the third connecting member 73 are omitted.
  • the z direction corresponds to the thickness direction of the electronic device A1.
  • the x-direction and the y-direction are included in the plan view of the electronic device A1 (for example, FIG. 3).
  • the x1 direction When distinguishing between the two directions in the x direction, one is called the x1 direction and the other is called the x2 direction.
  • the y1 and y2 directions When distinguishing between the two directions in the x2 direction, one is called the x2 direction.
  • the term "planar view” may be used to describe the case of viewing in the z direction (along).
  • the substrate 1 has a shape in which the dimension (thickness) in the z direction is relatively smaller than the dimension in the x direction or the y direction.
  • the substrate 1 has a rectangular shape that is long in the x direction in a plan view.
  • the thickness of the substrate 1 is, for example, 0.1 mm or more and 1.0 mm or less, but the present disclosure is not limited thereto.
  • Each dimension (length, width, thickness) of the substrate 1 is not particularly limited.
  • the substrate 1 is made of an insulating material. Further, as the material of the substrate 1, for example, a material having a higher thermal conductivity than the resin member 8 is preferable.
  • the substrate 1 is made of ceramic. Examples of ceramics include alumina (Al 2 O 3 ), silicon nitride (SiN), aluminum nitride (AlN), and alumina containing zirconia.
  • the substrate 1 has a substrate main surface 11 and a substrate back surface 12.
  • the substrate main surface 11 and the substrate back surface 12 are separated from each other in the z direction.
  • the substrate main surface 11 faces the z2 direction, and the substrate back surface 12 faces the z1 direction.
  • the main surface of the substrate 11 and the back surface of the substrate 12 are flat surfaces orthogonal to the z direction, respectively, but the present disclosure is not limited thereto.
  • a wiring portion 2 is formed on the main surface 11 of the substrate, and a plurality of first leads 61, a plurality of third leads 63, and a plurality of electronic components are mounted.
  • the plurality of electronic components include two electronic elements 3 and two control elements 4.
  • the back surface 12 of the substrate is exposed from the resin member 8.
  • Each of the substrate main surface 11 and the substrate back surface 12 has a rectangular shape in a plan view, for example.
  • the plan view shape of the substrate 1 is not limited.
  • the wiring portion 2 is formed on the main surface 11 of the substrate.
  • the wiring portion 2 is made of a conductive material.
  • the constituent material of the wiring portion 2 is, for example, silver (Ag) or an Ag alloy (for example, Ag-Pt, AgPd, etc.).
  • the constituent material may be copper (Cu) or Cu alloy, gold (Au), Au alloy, or the like, instead of Ag or Ag alloy.
  • the wiring portion 2 is formed by printing a paste material containing the above-mentioned constituent material and then firing the paste material, but the present disclosure is not limited to this.
  • the wiring unit 2 is a conduction path to each control element 4.
  • Various control signals for controlling each electronic element 3 flow through the wiring unit 2.
  • the control signal includes a drive signal, a detection signal, and the like.
  • the drive signal is a signal for controlling the drive of the electronic element 3.
  • the detection signal is a signal for detecting the operating state (for example, voltage value, current value, etc.) of the electronic element 3.
  • the wiring unit 2 includes a plurality of pad units 21 and a plurality of connection wirings 22.
  • Each of the plurality of pad portions 21 has a rectangular shape in a plan view.
  • the plurality of pad portions 21 are separated from each other.
  • the plurality of pad portions 21 are portions to which other parts are joined.
  • a plurality of conductive members 29, a plurality of control elements 4, a plurality of passive elements 5, a plurality of third leads 63, a plurality of fourth leads 64, and a plurality of third connections are connected to the plurality of pad portions 21.
  • the members 73 are joined.
  • the plurality of connection wirings 22 are connected between the plurality of pad portions 21 so that the conduction path of the electronic device A1 has a desired circuit configuration.
  • Each of the plurality of conductive members 29 is, for example, a rectangular parallelepiped block material, and has a rectangular shape in a plan view.
  • Each conductive member 29 is made of, for example, Cu.
  • Other conductive materials may be used instead of Cu.
  • it may be a metal other than Cu, or it may be a semiconductor material (for example, Si) which is doped with impurities and has an increased electrical conductivity.
  • Each of the plurality of conductive members 29 has a main surface 291 and a back surface 292.
  • the main surface 291 and the back surface 292 are separated from each other in the z direction.
  • the main surface 291 faces the z2 direction
  • the back surface 292 faces the z1 direction.
  • the main surface 291 and the back surface 292 are flat surfaces orthogonal to the z direction, respectively, but the present disclosure is not limited thereto.
  • a first connecting member 71 is joined to the main surface 291. As a result, the conductive member 29 conducts to the first connecting member 71.
  • Each conductive member 29 and the electronic element 3 conducting the conductive member 29 are arranged in an orthogonal direction orthogonal to the z direction.
  • the orthogonal direction corresponds to the direction in which the first connecting member 71 that conducts them is extended in a plan view.
  • the main surface 291 overlaps the electronic element 3 when viewed in the orthogonal direction, for example.
  • the thickness of the conductive member 29 (dimension in the z direction) is larger than the difference between the thickness of the wiring portion 2 and the thickness of the first lead 61.
  • the main surface 291 overlaps the main surface of the electronic device 3 (the above-mentioned element main surface 31).
  • the main surface 291 may be located above each electronic element 3 (z2 direction) in the z direction.
  • Each conductive member 29 is joined to each pad portion 21 (wiring portion 2) by a conductive bonding material (not shown).
  • a conductive bonding material for example, solder, a metal paste (silver paste, copper paste, etc.) or a sintered metal (sintered silver, etc.) is used.
  • the bonding method between each conductive member 29 and each pad portion 21 may be another method such as ultrasonic bonding or laser bonding.
  • each conductive member 29 is larger than the pad portion 21 to which the conductive member 29 is joined in a plan view. Instead, the conductive member 29 may have the same size as the pad portion 21 (including the case where it is substantially the same), or may be smaller than the pad portion 21.
  • Each of the two electronic elements 3 is arranged on each first lead 61 (first pad portion 611).
  • Each electronic element 3 is, for example, a power transistor that controls electric power.
  • Each electronic element 3 is, for example, a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) made of a SiC (silicon carbide) substrate.
  • MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor
  • SiC silicon carbide
  • each electronic element 3 may be a MOSFET made of a Si substrate instead of a SiC substrate, and may include, for example, an IGBT element. Alternatively, it may be a MOSFET containing GaN (gallium nitride).
  • the electronic device A1 includes two electronic devices 3, but the number of the electronic devices 3 is not limited and is appropriately changed according to the requirements of the electronic device A1.
  • Each electronic element 3 has an element main surface 31 and an element back surface 32.
  • the element main surface 31 and the element back surface 32 are separated from each other in the z direction.
  • the element main surface 31 faces the z2 direction, and the element back surface 32 faces the z1 direction.
  • the element main surface 31 and the element back surface 32 are flat, respectively, but the present disclosure is not limited thereto.
  • a first main surface electrode 311 and a second main surface electrode 312 are formed on the element main surface 31.
  • the first main surface electrode 311 and the second main surface electrode 312 are separated from each other.
  • the second main surface electrode 312 is larger than the first main surface electrode 311.
  • One end of each first connecting member 71 is joined to each first main surface electrode 311.
  • each second connecting member 72 is joined to each second main surface electrode 312.
  • a back surface electrode 321 is formed on the back surface 32 of the element.
  • the back surface electrode 321 is formed on the entire surface (or substantially the entire surface) of the back surface 32 of the element.
  • Each back surface electrode 321 is joined to the first lead 61 (first pad portion 611).
  • the first main surface electrode 311 is, for example, a gate electrode
  • the second main surface electrode 312 is, for example, a source electrode
  • the back surface electrode 321 is, for example, a drain electrode. be.
  • a drive signal is input from the control element 4 (control element 4a described later) to the first main surface electrode 311 of the electronic element 3a, and a switching operation is performed according to the input drive signal (that is, a conduction state and a cutoff state). Switch). In the conductive state, a current flows from the back surface electrode 321 (drain electrode) to the second main surface electrode 312 (source electrode), and in the cutoff state, such a current does not flow.
  • the electronic element 3b Similar to the electronic element 3a, the electronic element 3b also receives a drive signal from the control element 4 (control element 4b described later) to the first main surface electrode 311, and changes to a conduction state and a cutoff state according to the input drive signal. Is switched.
  • control element 4 control element 4b described later
  • Each of the two protective elements 39 is for preventing a reverse voltage from being applied to each electronic element 3.
  • Each protection element 39 is, for example, a diode.
  • Each protection element 39 is arranged on each first lead 61 (first pad portion 611).
  • Each protection element 39 is connected to each electronic element 3 in antiparallel.
  • the protective element 39 includes a main surface electrode 391 and a back surface electrode 392.
  • the main surface electrode 391 is formed on the main surface (the surface facing the z2 direction) of the protective element 39, and the back surface electrode 392 is formed on the back surface (the surface facing the z1 direction) of the protective element 39.
  • Each second connecting member 72 is joined to the main surface electrode 391, and the main surface electrode 391 and the second main surface electrode 312 conduct with each other via each of the second connecting members 72.
  • the back surface electrode 392 is joined to each of the first leads 61, and the back surface electrode 392 and the back surface electrode 321 conduct with each other via each of the first leads 61.
  • each protection element 39 is a diode
  • the main surface electrode 391 is an anode electrode
  • the back surface electrode 392 is a cathode electrode.
  • the electronic device A1 does not have to include the protection element 39.
  • Each of the two control elements 4 controls the drive of each electronic element 3.
  • Each control element 4 is arranged on the main surface 11 of the substrate. When distinguishing between the two control elements 4, one is referred to as a control element 4a and the other is referred to as a control element 4b.
  • the control element 4a controls the drive of the electronic element 3a.
  • the control element 4a controls the switching operation of the electronic element 3a by inputting a drive signal (for example, a gate voltage) to the first main surface electrode 311 (gate electrode) of the electronic element 3a.
  • a drive signal for example, a gate voltage
  • Each of the plurality of third connecting members 73 is joined to the control element 4a.
  • the control element 4a conducts to the first main surface electrode 311 of the electronic element 3a via each of the third connection member 73, the wiring portion 2, the conduction member 29, and the first connection member 71. Therefore, the drive signal output from the control element 4a is input to the first main surface electrode 311 of the electronic element 3a via each of the third connection member 73, the wiring unit 2, the conduction member 29, and the first connection member 71.
  • the upper surface of the control element 4a (the surface facing the z2 direction) is located in the z1 direction with respect to the element main surface 31 of each electronic element 3.
  • the upper surface of the control element 4a is at the same position (or substantially the same) as, for example, the upper surface (the surface facing the z2 direction) of the first pad portion 611 described later in the z direction.
  • the control element 4b controls the drive of the electronic element 3b.
  • the control element 4b controls the switching operation of the electronic element 3b by inputting a drive signal (for example, a gate voltage) to the first main surface electrode 311 (gate electrode) of the electronic element 3b.
  • a drive signal for example, a gate voltage
  • the control element 4b constitutes the control device 40 together with the resin package 401 and the plurality of connection terminals 402.
  • the control device 40 is a SOP (Small Outline Package) type package.
  • the package type of the control device 40 is not limited to the SOP type, for example, QFP (Quad Flat Package) type, SOJ (Small Outline J-lead Package) type, QFN (Quad Flatpack No Lead) type, SON (Small-Outline No.) It may be another type of package such as Lead) type.
  • the resin package 401 is made of, for example, an epoxy resin and covers the control element 4b. The plurality of connection terminals 402 protrude from the resin package 401 and conduct with the control element 4b inside the resin package 401.
  • each connection terminal 402 is conductively bonded to each pad portion 21 (wiring portion 2) via a conductive bonding material (for example, solder, metal paste, sintered metal, etc.).
  • the control element 4b conducts to the first main surface electrode 311 of the electronic element 3a via the wiring portion 2, the conduction member 29, and the first connection member 71. Therefore, the drive signal output from the control element 4b is input to the first main surface electrode 311 of the electronic element 3b via the wiring unit 2, the conduction member 29, and the first connection member 71.
  • Each of the plurality of passive elements 5 is arranged on the substrate main surface 11 of the substrate 1 and is joined to each pad portion 21 (wiring portion 2).
  • the plurality of passive elements 5 are, for example, resistors, capacitors, coils, diodes and the like.
  • the plurality of passive elements 5 include a thermistor 5a.
  • the thermistor 5a is conductively joined to the two pad portions 21 of the wiring portion 2. Each of the pad portions 21 conducts to two different third leads 63 via the wiring portion 2. The thermistor 5a outputs a current corresponding to the ambient temperature by applying a voltage between the two third leads 63.
  • Each of the plurality of leads 6 is composed of a material containing metal. Preferably, each lead 6 has a higher thermal conductivity than the substrate 1.
  • Each lead 6 is composed of, for example, copper (Cu), aluminum, iron (Fe), oxygen-free copper, or an alloy thereof (for example, Cu—Sn alloy, Cu—Zr alloy, Cu—Fe alloy, etc.).
  • the surface of each lead 6 may be plated (for example, nickel-plated).
  • the plurality of leads 6 may be formed by, for example, pressing a mold against a metal plate, or by etching the metal plate.
  • the thickness (dimension in the z direction) of each lead 6 is not particularly limited, but is, for example, 0.4 mm or more and 0.8 mm or less.
  • the plurality of leads 6 are separated from each other.
  • Each lead 6 includes a portion covered with the resin member 8 and a portion exposed from the resin member 8.
  • the plurality of first leads 61 are supported by the resin member 8 and the substrate 1, respectively.
  • Each first lead 61 includes a first pad portion 611 and a first terminal portion 612.
  • the first pad portion 611 and the first terminal portion 612 are conductive.
  • Each first pad portion 611 is covered with a resin member 8.
  • Each of the first pad portions 611 is arranged on the substrate main surface 11 of the substrate 1 and overlaps with the substrate 1 in a plan view.
  • Each first pad portion 611 is joined to the substrate main surface 11 by a joining material (not shown).
  • a metal layer may be provided on the substrate main surface 11 to which each first pad portion 611 is bonded. By using the same material as the wiring portion 2 for the metal layer, the metal layer can be formed together with the formation of the wiring portion 2.
  • a pair of electronic elements 3 and a protective element 39 are mounted on each first pad portion 611.
  • the back electrode 321 (drain electrode) of each electronic element 3 and the back electrode 392 (cathode electrode) of each protection element 39 are conductively bonded to each first pad portion 611 by a conductive bonding material (not shown). ..
  • the conductive bonding material is, for example, solder, metal paste, or sintered metal.
  • the back electrode 321 of each electronic element 3 and the back electrode 392 of each protection element 39 are conductive.
  • the element back surface 32 of each electronic element 3 and the back surface of each protection element 39 face each first pad portion 611. As shown in FIG. 8, the thickness (dimension in the z direction) T2 of each first pad portion 611 is larger than the thickness (dimension in the z direction) T1 of the wiring portion 2.
  • Each first terminal portion 612 is exposed from the resin member 8. Each first terminal portion 612 is bent in the z2 direction. Each first terminal portion 612 is an external terminal of the electronic device A1. Since each first pad portion 611 conducts to the back surface electrode 321 of each electronic element 3, the drain current of each electronic element 3 flows through each first terminal portion 612.
  • Each of the plurality of second leads 62 is supported by the resin member 8.
  • Each second lead 62 includes a second pad portion 621 and a second terminal portion 622. In each second lead 62, the second pad portion 621 and the second terminal portion 622 are conductive.
  • Each second pad portion 621 is covered with a resin member 8. Each second pad portion 621 does not overlap the substrate 1 in a plan view.
  • a plurality of second connecting members 72 are joined to each second pad portion 621.
  • Each second connecting member 72 joined to each second pad portion 621 is joined to the second main surface electrode 312 of each electronic element 3. As a result, each second pad portion 621 conducts to the second main surface electrode 312 (source electrode) of each electronic element 3 via each second connecting member 72.
  • Each second terminal portion 622 is exposed from the resin member 8. Each second terminal portion 622 is bent in the z2 direction. Each second terminal portion 622 is an external terminal of the electronic device A1. Since the second pad portion 621 conducts to the second main surface electrode 312 (source electrode) of each electronic element 3, the source current of each electronic element 3 flows through the second terminal portion 622.
  • the plurality of third leads 63 are supported by the resin member 8 and the substrate 1, respectively.
  • Each third lead 63 includes a third pad portion 631 and a third terminal portion 632.
  • the third pad portion 631 and the third terminal portion 632 are conductive.
  • Each third pad portion 631 is covered with a resin member 8. Each third pad portion 631 is arranged on the substrate main surface 11 of the substrate 1 and overlaps with the substrate 1 in a plan view. Each third pad portion 631 is conductively bonded to each pad portion 21 of the wiring portion 2 by a conductive bonding material (not shown). Each pad portion 21 to which each third pad portion 631 is joined conducts to each control element 4 via each connection wiring 22. Therefore, each third pad portion 631 conducts to each control element 4 via the wiring portion 2.
  • Each third terminal portion 632 is exposed from the resin member 8. Each third terminal portion 632 is bent in the z2 direction. Each third terminal portion 632 is an external terminal of the electronic device A1. Since each third pad portion 631 conducts to each control element 4, each third terminal portion 632 is an input terminal for various control signals to each control element 4 or an output terminal for various control signals from each control element 4. Is.
  • the plurality of fourth leads 64 are supported by the resin member 8 and the substrate 1, respectively.
  • Each fourth lead 64 includes a fourth pad portion 641 and a fourth terminal portion 642.
  • the fourth pad portion 641 and the fourth terminal portion 642 are conductive.
  • Each fourth pad portion 641 is covered with a resin member 8.
  • Each of the fourth pad portions 641 is arranged on the substrate main surface 11 of the substrate 1 and overlaps with the substrate 1 in a plan view.
  • Each of the fourth pad portions 641 is conductively bonded to each of the pad portions 21 of the wiring portion 2 by a conductive bonding material (not shown).
  • Each pad portion 21 to which each fourth pad portion 641 is joined conducts to each thermistor 5a via each connection wiring 22. Therefore, each of the fourth pad portions 641 conducts to each thermistor 5a via the wiring portion 2.
  • Each fourth terminal portion 642 is exposed from the resin member 8. Each fourth terminal portion 642 is bent in the z2 direction. Each of the fourth terminal portions 642 overlaps with each of the third terminal portions 632 when viewed in the x direction. Each fourth terminal portion 642 is an external terminal of the electronic device A1. Since each of the fourth pad portions 641 conducts to the thermistor 5a, each of the fourth terminal portions 642 is a temperature detection terminal.
  • one first lead 61 and one second lead 62 are provided for each of the two electronic elements 3. That is, the electronic device A1 includes two first leads 61 and two second leads 62. As the number of electronic elements 3 increases, so does the number of first leads 61 and the number of second leads 62. Similarly, the electronic device A1 includes four fourth leads 64 (two fourth leads 64 are provided for each of the two thermistors 5a).
  • the plurality of first connecting members 71, the plurality of second connecting members 72, the plurality of third connecting members 73, and the fourth connecting member 74 each conduct two members separated from each other.
  • the plurality of first connecting members 71, the plurality of second connecting members 72, the plurality of third connecting members 73, and the fourth connecting member 74 are wires (bonding wires), respectively.
  • Each of the plurality of first connecting members 71 is joined to the first main surface electrode 311 (gate electrode) of each electronic element 3 and the main surface 291 of each conductive member 29, and the first main surface electrode 311 of each electronic element 3 is joined. And the conduction member 29 are made conductive.
  • Each first connecting member 71 is composed of, for example, Au, but may be composed of Cu or Al.
  • the wire diameter of each first connecting member 71 and the number of first connecting members 71 are not limited to the example shown in FIG.
  • Each first connecting member 71 includes a pair of joint portions 711 and 712 and a linear portion 713.
  • the joint portion 711 is a portion to be joined to the first main surface electrode 311.
  • the joint portion 712 is a portion to be joined to the main surface 291 of the conductive member 29.
  • the linear portion 713 is a portion that connects the pair of joint portions 711 and 712. The linear portion 713 extends from each of the pair of joints 711 and 712.
  • each first connecting member 71 for example, the joint portion 711 is formed before the joint portion 712.
  • each first connecting member 71 is formed by a wire bonding device using a capillary.
  • the joint portion 711 is formed by ball bonding
  • the joint portion 712 is formed by stitch bonding.
  • the joint portion 711 is an example of the “preceding bonding portion”
  • the joint portion 712 is an example of the “sequential bonding portion”.
  • the joint portion 712 may be formed before the joint portion 711.
  • the joint portion 712 is formed by ball bonding
  • the joint portion 711 is formed by stitch bonding.
  • each first connecting member 71 may be formed by a wire bonding device using a wedge tool instead of the capillary. In this case, the joint portion 711 and the joint portion 712 are each formed by wedge bonding.
  • the plurality of second connecting members 72 are joined to the second main surface electrode 312 (source electrode) of the electronic element 3 and the second pad portion 621 of the second lead 62, respectively, and the second main surface electrodes 312 and the second Conduct the lead 62.
  • the plurality of second connecting members 72 are joined to the second main surface electrode 312 (source electrode) of the electronic element 3 and the main surface electrode 391 (anode electrode) of the protective element 39, respectively, with the second main surface electrode 312. It is made conductive with the main surface electrode 391.
  • Each second connecting member 72 is made of, for example, Al, Cu, or Au, but the present disclosure is not limited thereto.
  • the wire diameter of each second connecting member 72 and the number of the second connecting members 72 are not limited to the example shown in FIG.
  • each second connecting member 72 includes a pair of joint portions 721 and 722, an intermediate joint portion 723, and two linear portions 724.
  • the joint portion 721 is a portion to be joined to the second main surface electrode 312.
  • the joint portion 722 is a portion to be joined to the second pad portion 621 of the second lead 62.
  • the intermediate joint portion 723 is a portion to be joined to the main surface electrode 391 of the protective element 39.
  • One of the two linear portions 724 is a portion connecting the joint portion 721 and the intermediate joint portion 723, and the other is a portion connecting the joint portion 722 and the intermediate joint portion 723.
  • the second main surface electrode 312 (electronic element 3), the main surface electrode 391 (protective element 39), and the second pad portion 621 (second lead) are provided by one second connecting member 72. 62) are electrically connected to each other, but the present disclosure is not limited to this.
  • a wire for conducting the second main surface electrode 312 and the main surface electrode 391 and a wire for conducting the main surface electrode 391 and the second pad portion 621 are separately provided. You may.
  • a wire for conducting the second main surface electrode 312 and the second pad portion 621 and a wire for conducting the second main surface electrode 312 and the main surface electrode 391 may be provided. good.
  • Each of the plurality of third connecting members 73 is joined to the control element 4a and each pad portion 21 of the wiring portion 2, and the control element 4 and the wiring portion 2 are made conductive.
  • Each third connecting member 73 is made of, for example, Au, Cu, or Al.
  • the wire diameter of each third connecting member 73 and the number of the third connecting member 73 are not limited to the example shown in FIG.
  • the fourth connecting member 74 is joined to the second main surface electrode 312 of the electronic element 3b and the main surface 291 of the conductive member 29, and conducts the second main surface electrode 312 and the conductive member 29. Since the conductive member 29 conducts to the wiring unit 2, a detection signal for detecting a current (for example, a source current) flowing through the second main surface electrode 312 of the electronic element 3b is transmitted to the wiring unit 2.
  • the fourth connecting member 74 is made of, for example, Au, Cu or Al.
  • the wire diameter of the fourth connecting member 74 is not limited to the example shown in FIG. Further, a plurality of fourth connecting members 74 may be used.
  • the fourth connecting member 74 is formed so that the portion joined to the second main surface electrode 312 precedes the portion joined to the main surface 291. The order of formation of these may be reversed.
  • the fourth connecting member 74 may be formed by a wire bonding device using a capillary, or may be formed by a wire bonding device using a wedge tool.
  • the resin member 8 includes a substrate 1 (excluding the back surface 12 of the substrate), a wiring portion 2, two electronic elements 3, two control elements 4 (control device 40), a plurality of passive elements 5, and a part of a plurality of leads 6. , A plurality of first connecting members 71, a plurality of second connecting members 72, a plurality of third connecting members 73, and a fourth connecting member 74.
  • an insulating material such as an epoxy resin or a silicone gel is adopted.
  • the resin member 8 is formed by, for example, molding.
  • the resin member 8 has a resin main surface 81, a resin back surface 82, and a plurality of resin side surfaces 831 to 834.
  • the resin main surface 81 and the resin back surface 82 are separated from each other in the z direction.
  • the resin main surface 81 faces the z2 direction, and the resin back surface 82 faces the z1 direction.
  • the resin main surface 81 and the resin back surface 82 are flat surfaces orthogonal to each other in the z direction, but the present disclosure is not limited thereto.
  • the back surface 12 of the substrate is exposed from the back surface 82 of the resin. In the present embodiment, as shown in FIGS. 6, 7 and 9, the back surface 12 of the substrate and the back surface 82 of the resin are flush with each other, but the present disclosure is not limited thereto.
  • the plurality of resin side surfaces 831 to 834 are connected to the resin main surface 81 and the resin back surface 82, respectively.
  • the two resin side surfaces 831 and 832 are separated from each other in the x direction.
  • the resin side surface 831 faces the x1 direction, and the resin side surface 832 faces the x2 direction.
  • the two resin side surfaces 833 and 834 are separated from each other in the y direction.
  • the resin side surface 833 faces the y1 direction, and the resin side surface 834 faces the y2 direction.
  • each of the resin side surfaces 831 to 834 is bent at the center (or near the center) in the z direction, but the present disclosure is not limited to this.
  • each of the resin side surfaces 831 to 834 may be flat as a whole or may be curved with a predetermined curvature.
  • the plurality of first leads 61 and the plurality of second leads 62 each protrude from the resin side surface 833, and the plurality of third leads 63 and the plurality of fourth leads 64 each protrude from the resin side surface 834. ing. That is, the electric power terminal conducting on each electronic element 3 and the control signal terminal conducting on each control element 4 project from the side surfaces opposite to each other.
  • the electronic device A1 includes a wiring portion 2 formed on the substrate 1 (board main surface 11).
  • the wiring unit 2 constitutes a path for transmitting a control signal (for example, a drive signal) for controlling each electronic element 3.
  • a control signal for example, a drive signal
  • the drive signal for the electronic element 3 is output from the control element 4 and input to the first main surface electrode 311 via the wiring unit 2, the conduction member 29, and the first connection member 71.
  • the wiring portion 2 is formed, for example, by printing a silver paste on a substrate 1 in a predetermined pattern and then firing the silver paste. According to this configuration, unlike the case where the transmission path is configured by a metal lead frame, it is possible to reduce the line thickness and the density of the transmission path. Therefore, the electronic device A1 can be highly integrated.
  • the electronic device A1 includes a conductive member 29 that conducts to the wiring portion 2. Further, the first connecting member 71 is used to conduct the electronic element 3 (the first main surface electrode 311) and the conductive member 29 (the main surface 291). In general, the first connecting member 71 made of a bonding wire has a relatively large inductance component and can cause noise. On the other hand, in the electronic device A1, the first connecting member 71 is not directly joined to the wiring portion 2, but is connected to the conductive member 29 (having an inductance component smaller than that of the first connecting member 71) made of a block material. It is joined. As a result, the length of the first connecting member 71 can be shortened (that is, the inductance component can be reduced), so that the generation of noise can be suppressed.
  • the conductive member 29 is not provided.
  • the first connecting member 71' is directly connected to the first main surface electrode 311 of the electronic element 3 and the wiring portion 2.
  • the first connecting member 71' is likely to come into contact with the first pad portion 611, which may cause an unintended short circuit.
  • the height difference between the upper surface of the first main surface electrode 311 (element main surface 31) and the upper surface of the pad portion 21 is large. ..
  • a conductive member 29 is provided, and the first connecting member 71 is joined to the first main surface electrode 311 of the electronic element 3 and the main surface 291 of the conductive member 29 to form the above-mentioned height. The difference is reduced. As a result, it is possible to suppress the contact between the first connecting member 71 and the first pad portion 611. That is, the electronic device A1 suppresses an unintended short circuit and improves reliability.
  • the main surface 291 of the conductive member 29 overlaps the electronic element 3 in the horizontal direction (orthogonal direction orthogonal to the z direction).
  • the orthogonal direction corresponds to a direction in which each conductive member 29 and each electronic element 3 conducting the conductive member 29 are arranged side by side in a plan view.
  • the entire first connecting member 71 is located above the first pad portion 611 (in the z2 direction), contact between the first connecting member 71 and the first pad portion 611 can be reliably avoided.
  • the linear portion 713 of the first connecting member 71 is lengthened so that the linear portion is sufficiently separated from the first pad portion 611 in the z direction.
  • the total length of the first connecting member 71 is increased, so that the inductance component is increased.
  • the resin member 8 is formed, the resin member 8 is pushed down by the poured mold resin, resulting in continuity such as disconnection or unintended short circuit. It causes a defect.
  • the configuration of the electronic device A1 is advantageous in suppressing an increase in the inductance component and suppressing a conduction failure.
  • the electronic element 3 is bonded to the first pad portion 611, and the back electrode 321 of the electronic element 3 and the first lead 61 are electrically connected to each other. Further, the second main surface electrode 312 of the electronic element 3 conducts to the second lead 62 via the plurality of second connecting members 72. According to this configuration, the path to the electronic element 3 through which a relatively large current flows can be configured by the first lead 61 and the second lead 62. This is advantageous because the allowable current amount can be increased as compared with the case where the current path to the electronic element 3 is configured by the wiring unit 2. That is, the electronic device A1 can be highly integrated while ensuring the allowable current for the electronic element 3.
  • the two first leads 61 have higher thermal conductivity than the substrate 1. As a result, it is possible to suppress a decrease in the amount of heat radiated from each electronic element 3. In particular, since the electronic element 3 is mounted on the first pad portion 611 of the first lead 61, the heat from the electronic element 3 can be transferred to each first lead 61 more efficiently. Further, since each first lead 61 is exposed from the resin member 8, a conduction path from the outside to each electronic element 3 can be formed, and the heat dissipation characteristic from the electronic element 3 can be further improved. Further, since the substrate back surface 12 of the substrate 1 is exposed from the resin member 8 (resin back surface 82), the heat transferred from each electronic element 3 to the substrate 1 can be efficiently released to the outside.
  • the control device 40 includes a resin package 401 that covers the control element 4b. Instead, if the resin package that covers the control element 4b is not used, the high voltage and high current required for the shipping inspection cannot flow through the control element 4b. Therefore, it is necessary to wait for the shipping inspection until the finished product is provided with the resin member 8. In this case, if the control element 4b is determined to be a defective product by the shipping inspection, the entire finished product is discarded even if the parts other than the control element 4b are normal. On the other hand, in the control device 40, since the control element 4b is covered with the resin package 401, the high voltage and high current required for the shipping inspection can be passed. Therefore, it is possible to inspect the control device 40 before the finished product is produced, and if the control element 4b is a defective product, discard only the control device 40.
  • FIG. 10 is a plan view showing the electronic device A2, and the resin member 8 is shown by an imaginary line.
  • FIG. 11 is a cross-sectional view taken along the line XI-XI of FIG.
  • the electronic device A2 unlike the electronic device A1, two electronic elements 3 are electrically connected. As will be described later, in the electronic device A2, the two electronic elements 3 are connected to each other to form a leg.
  • the electronic element 3a constitutes the upper arm circuit of the leg
  • the electronic element 3b constitutes the lower arm circuit of the leg.
  • the plurality of leads 6 include a plurality of third leads 63, a plurality of fourth leads 64, two input leads 65 and 66, an output lead 67, and a detection lead 68.
  • a part of each of the two input leads 65 and 66, the output lead 67 and the detection lead 68 is covered with the resin member 8, and the other part is exposed from the resin member 8.
  • the input lead 65 is supported by the resin member 8 and the substrate 1.
  • the input lead 65 includes a pad portion 651 and a terminal portion 652.
  • the pad portion 651 and the terminal portion 652 are electrically connected to each other.
  • the pad portion 651 is covered with a resin member 8.
  • the pad portion 651 is arranged on the main surface 11 of the substrate and overlaps the substrate 1 in a plan view.
  • the pad portion 651 is joined to the substrate main surface 11 by, for example, a joining material (not shown).
  • a metal layer may be provided between the pad portion 651 and the substrate main surface 11.
  • the metal layer is formed of, for example, the same material as the wiring portion 2. As a result, the wiring portion 2 and the metal layer can be formed collectively.
  • An electronic element 3a is mounted on the pad portion 651.
  • the pad portion 651 and the back surface electrode 321 (drain electrode) of the electronic element 3a are conductively bonded to each other by a conductive bonding material (not shown).
  • the conductive bonding material is, for example, solder, metal paste, or sintered metal.
  • the element back surface 32 of the electronic element 3a faces the pad portion 651.
  • the terminal portion 652 is exposed from the resin member 8.
  • the terminal portion 652 is bent in the z2 direction at a position separated from the resin member 8 by a predetermined distance.
  • the terminal portion 652 is an external terminal of the electronic device A2. Since the pad portion 651 conducts to the back electrode 321 of the electronic element 3a, the drain current of the electronic element 3a flows through the terminal portion 652.
  • the input lead 66 is supported by the resin member 8.
  • the input lead 66 includes a pad portion 661 and a terminal portion 662. In the input lead 66, the pad portion 661 and the terminal portion 662 are electrically connected to each other.
  • the pad portion 661 is covered with the resin member 8.
  • the pad portion 661 does not overlap the substrate 1 in a plan view.
  • a plurality of second connecting members 72 are joined to the pad portion 661, respectively.
  • Each of the second connecting members 72 joined to the pad portion 661 is also joined to the second main surface electrode 312 of the electronic element 3b.
  • the pad portion 661 conducts to the second main surface electrode 312 (source electrode) of the electronic element 3b via each of the second connecting members 72.
  • the terminal portion 662 is exposed from the resin member 8.
  • the terminal portion 662 is bent in the z2 direction at a position separated from the resin member 8 by a predetermined distance.
  • the terminal portion 662 is an external terminal of the electronic device A2. Since the pad portion 661 conducts to the second main surface electrode 312 (source electrode) of the electronic element 3b, the source current of the electronic element 3b flows through the terminal portion 662.
  • the output lead 67 is supported by the resin member 8 and the substrate 1.
  • the output lead 67 includes a pad portion 671 and a terminal portion 672. In the output lead 67, the pad portion 671 and the terminal portion 672 are electrically connected to each other.
  • the pad portion 671 is covered with the resin member 8.
  • the pad portion 671 is arranged on the main surface 11 of the substrate and overlaps the substrate 1 in a plan view.
  • the pad portion 671 is joined to the substrate main surface 11 by a joining material (not shown).
  • a metal layer may be provided between the pad portion 671 and the substrate main surface 11.
  • the metal layer is formed of, for example, the same material as the wiring portion 2. With this, the wiring portion 2 and the metal layer can be formed collectively.
  • An electronic element 3b is mounted on the pad portion 671.
  • the pad portion 671 and the back surface electrode 321 (drain electrode) of the electronic element 3b are conductively bonded to each other by a conductive bonding material (not shown).
  • the conductive bonding material is, for example, solder, metal paste, or sintered metal.
  • the element back surface 32 of the electronic element 3b faces the pad portion 671.
  • a plurality of second connecting members 72 are joined to the pad portion 671 respectively. Each of the second connecting members 72 joined to the pad portion 671 is also joined to the second main surface electrode 312 of the electronic element 3a. As a result, the pad portion 671 conducts to the second main surface electrode 312 (source electrode) of the electronic element 3a via each of the second connecting members 72.
  • the terminal portion 672 is exposed from the resin member 8.
  • the terminal portion 672 is bent in the z2 direction at a position separated from the resin member 8 by a predetermined distance.
  • the terminal portion 672 is an external terminal of the electronic device A2. Since the pad portion 671 conducts to the back surface electrode 321 (drain electrode) of the electronic element 3b, the drain current of the electronic element 3b flows through the terminal portion 672. Further, since the pad portion 671 conducts to the second main surface electrode 312 (source electrode) of the electronic element 3a, the source current of the electronic element 3a flows through the terminal portion 672.
  • a power supply voltage is applied between the two input leads 65 and 66.
  • the input lead 65 is a positive electrode (P terminal), and the input lead 66 is a negative electrode (N terminal).
  • the power supply voltage input between the two input leads 65 and 66 is converted into AC power (voltage) by each switching operation of the two electronic elements 3a and 3b.
  • the AC power is output from the output lead 67.
  • the two input leads 65 and 66 are the input terminals of the power supply voltage
  • the output leads 67 are the output terminals of the AC power voltage-converted by the two electronic elements 3a and 3b.
  • the detection lead 68 is supported by the resin member 8 and the substrate 1.
  • the detection lead 68 includes a pad portion 681 and a terminal portion 682. In the detection lead 68, the pad portion 681 and the terminal portion 682 are electrically connected to each other.
  • the pad portion 681 is covered with the resin member 8.
  • the pad portion 681 is arranged on the main surface 11 of the substrate and overlaps the substrate 1 in a plan view.
  • the pad portion 681 is joined to the substrate main surface 11 by a joining material (not shown).
  • a metal layer may be provided between the pad portion 681 and the substrate main surface 11.
  • the metal layer is formed of, for example, the same material as the wiring portion 2. As a result, the wiring portion 2 and the metal layer can be formed collectively.
  • One of a plurality of passive elements 5 is joined to the pad portion 681.
  • the shunt resistor 5b is joined to the pad portion 681.
  • the shunt resistor 5b is arranged so as to straddle the pad portion 671 (output lead 67) and the pad portion 681 (detection lead 68), and is conductively bonded to the pad portion 671 and the pad portion 681, respectively.
  • the current flowing through the output lead 67 is divided by the shunt resistor 5b and transmitted to the pad portion 681.
  • the terminal portion 682 is exposed from the resin member 8.
  • the terminal portion 682 is bent in the z2 direction at a position separated from the resin member 8 by a predetermined distance.
  • the terminal portion 682 is an external terminal of the electronic device A2. Since the pad portion 681 conducts to the pad portion 671 via the shunt resistor 5b, the current diverted from the output lead 67 flows through the terminal portion 682.
  • the electronic device A2 includes a plurality of fifth connecting members 75.
  • Each fifth connecting member 75 is a bonding wire like the first connecting member 71 to the fourth connecting member 74.
  • Each fifth connecting member 75 is formed of, for example, Au, Cu or Al.
  • the wiring portion 2 conducting to the fourth lead 64 is conducting to the wiring portion 2 conducting to the thermistor 5a via the fifth connecting member 75.
  • the electronic device A2 also includes a wiring portion 2 formed on the main surface 11 of the substrate, similarly to the electronic device A1. Then, similarly to the electronic device A1, the wiring unit 2 transmits a control signal (for example, a drive signal) for controlling the electronic element 3, and constitutes a transmission path of the control signal. Therefore, the electronic device A2 can be made thinner and denser in the transmission path, and can be highly integrated.
  • a control signal for example, a drive signal
  • the electronic device A2 can reduce the inductance component and suppress the generation of noise. Further, since the electronic device A2 is provided with the conductive member 29, the contact between the first connecting member 71 and the first pad portion 611 can be suppressed, and the reliability can be improved.
  • the electronic device according to the present disclosure is not limited to the above-described embodiment.
  • the specific configuration of each part of the electronic device of the present disclosure can be freely redesigned.
  • the disclosure includes embodiments described in the appendix below.
  • Appendix 1. A substrate having a substrate main surface and a substrate back surface separated from each other in the thickness direction, An electronic device having an element main surface and having a first main surface electrode formed on the element main surface, A wiring unit formed on the main surface of the substrate and transmitting a control signal for controlling the electronic element, and a wiring unit.
  • a conductive member having a main surface and a back surface separated from each other in the thickness direction, and the back surface is joined to the wiring portion.
  • the first lead includes a first pad portion separated from the wiring portion and to which the electronic element is bonded.
  • Appendix 2. The electronic device according to Appendix 1, wherein the first pad portion has a dimension in the thickness direction larger than that of the wiring portion.
  • Appendix 3. When viewed in the thickness direction, the conductive member and the electronic element are arranged along an orthogonal direction orthogonal to the thickness direction.
  • the electronic device according to Appendix 2 wherein the main surface of the conductive member overlaps the electronic element when viewed in the orthogonal direction.
  • Appendix 4. The electronic device according to Appendix 3, wherein the main surface of the conductive member overlaps the element main surface when viewed in the orthogonal direction.
  • Appendix 5. The electronic device according to any one of Supplementary note 1 to Supplementary note 4, wherein the first connecting member is a wire.
  • Appendix 7. The electronic element has an element back surface opposite to the element main surface, and has an element back surface.
  • control signal includes a drive signal for controlling the drive of the electronic element.
  • Appendix 12. The electronic device according to Appendix 11, further comprising a third connecting member joined to the control element and the wiring portion.
  • Appendix 13. The electronic device according to Appendix 12, wherein the third connecting member is a wire.
  • Appendix 14. It further comprises a conductive third lead that is separated from the first lead and the second lead.
  • the electronic device according to any one of Appendix 11 to Appendix 13, wherein the third lead is joined to the wiring portion and conducts to the control element via the wiring portion.
  • a resin member that covers at least a part of the substrate, the wiring portion, the conduction member, the electronic element, the control element, and the first connection member is further provided.
  • Appendix 16. The electronic device according to Appendix 15, wherein the back surface of the substrate is exposed from the resin member.
  • Appendix 17. The electronic device according to any one of Supplementary note 1 to Supplementary note 16, wherein the first pad portion overlaps the substrate when viewed in the thickness direction.
  • Appendix 18 The electronic device according to any one of Supplementary note 1 to Supplementary note 17, wherein the conductive member contains Cu.
  • Appendix 19 The electronic device according to any one of Supplementary note 1 to Supplementary note 18, wherein the substrate contains ceramics.
  • Appendix 20. The electronic device according to any one of Supplementary note 1 to Supplementary note 19, wherein the electronic element is a power transistor.

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2021/011701 2020-04-01 2021-03-22 電子装置 Ceased WO2021200336A1 (ja)

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DE212021000242.0U DE212021000242U1 (de) 2020-04-01 2021-03-22 Elektronische Vorrichtung
DE112021000700.9T DE112021000700T5 (de) 2020-04-01 2021-03-22 Elektronische vorrichtung
CN202180024866.4A CN115335986A (zh) 2020-04-01 2021-03-22 电子装置
US17/914,088 US12599006B2 (en) 2020-04-01 2021-03-22 Electronic device
JP2022511955A JP7607640B2 (ja) 2020-04-01 2021-03-22 電子装置

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JP2020065762 2020-04-01

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JP (1) JP7607640B2 (https=)
CN (1) CN115335986A (https=)
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