WO2021184816A1

WO2021184816A1 - Oriented high-thermal-conductivity interface material and preparation method therefor

Info

Publication number: WO2021184816A1
Application number: PCT/CN2020/131363
Authority: WO
Inventors: 唐正华
Original assignee: 平湖阿莱德实业有限公司
Priority date: 2020-03-16
Filing date: 2020-11-25
Publication date: 2021-09-23
Also published as: CN111363358A

Abstract

An oriented high-thermal-conductivity interface material and a preparation method therefor. The material is composed of 10-90 parts of a binder resin and 10-90 parts of a long-fiber thermal-conducting material. The preparation method therefor comprises: arranging the long fiber material in a regular manner inside a housing with a preset shape, carrying out curing and forming on the fiber material by means of the binder resin, to obtain a block body, and then according to requirements, cutting the block body to a required thickness to obtain a sheet-shaped oriented high-thermal-conductivity interface material. The high-thermal-conductivity interface material prepared by fiber bundle glue injection has an ultra-high thermal conductivity, and the thermal conductivity coefficient can reach 80 W/(m.k) or even higher; and the high-thermal-conductivity interface material is ultra soft, and can be applied to a 5G communication device which is sensitive to compressive stress and requires heat dissipation.

Description

Orientation type high thermal conductivity interface material and preparation method thereof

Technical field

The invention belongs to the technical field of thermally conductive materials, and specifically relates to an orientation type high thermally conductive interface material and a preparation method thereof.

Background technique

With the rapid development of electronic technology, electronic communication is entering the 5G era. The introduction of high frequencies, the upgrade of hardware components and the number of Internet equipment and antennas have doubled. At the same time, 5G will use massive computing and Massive MIMO technology, which will significantly increase The power consumption and heat generation of 5G base stations also rise rapidly. The thermal conductivity of the traditional all-directionally uniformly conductive silicone sheet (thermal pad) is 1-10W/m·K, which can no longer meet the current and future development needs of electronic communications. The rapid and effective conduction of heat to the outside of the device is becoming a development bottleneck, which directly affects the product's lifespan, operating speed, performance and user experience.

Summary of the invention

In view of the problems in the prior art, the design objective of the present invention is to provide an oriented high thermal conductivity interface material and a preparation method thereof.

The present invention is realized through the following technical solutions:

The oriented high thermal conductivity interface material is characterized in that the interface material is composed of 10 to 90 parts of binder resin and 10 to 90 parts of long fiber thermal conductive material.

The oriented high thermal conductivity interface material is characterized in that the binder resin is a curable resin or a thermoplastic resin, and the curable resin is any one of liquid silicone rubber, epoxy resin and polyurethane, and The thermoplastic resin is any one of polyethylene, polypropylene, and thermoplastic elastomer.

The oriented high thermal conductivity interface material is characterized in that the binder resin is liquid silicone rubber.

The oriented high thermal conductivity interface material is characterized in that the long-fiber thermal conductive material is carbon fiber filaments, the length of the carbon fiber filaments is 10-1000 mm, and the thermal conductivity is 300-1100 W/(m.k).

The oriented high thermal conductivity interface material is characterized in that the carbon fiber filaments are pitch-based carbon fiber filaments.

The preparation method of the oriented high thermal conductivity interface material is characterized by including the following steps: firstly arrange the long fiber thermal conductive material in a square shell container, and add the binder resin under the condition of the vacuum degree ≥ 0.098Mpa After the vertical addition of the adhesive is completed, press down on the upper cover plate on the square shell container to shape the long-fiber thermally conductive material and the adhesive, remove the vacuum, and solidify to obtain a block, which is then cut into pieces as required The required thickness is a sheet-like orientation type high thermal conductivity interface material.

The preparation method of the oriented high thermal conductivity interface material is characterized in that the square shell container is a container body with an upper opening, the container body is provided with an upper cover plate, and the outer wall of the upper cover plate and the container body The inner walls are consistent.

The method for preparing the oriented high thermal conductivity interface material is characterized in that the total mass of the binder resin and the long fibers is 100 parts.

The high thermal conductivity interface material prepared by the fiber bundle glue injection of the present invention has super high thermal conductivity, and the thermal conductivity can reach 80W/(mk) or even higher. The interface material prepared by the formula and preparation method of the present invention has super high thermal conductivity. In addition to high thermal conductivity, it also has super softness, which can be applied to 5G communication devices that are sensitive to compressive stress and require heat dissipation.

Description of the drawings

Fig. 1 is a schematic cross-sectional structure diagram of a square shell container;

In the figure, 1-long fiber thermal conductive material, 2-square-shaped shell container, 3-adhesive resin, 4-upper cover.

Detailed ways

In the following, the present invention will be further described in detail with reference to the drawings and embodiments of the specification, and specific implementations will be given.

The oriented high thermal conductivity interface material of the present invention is composed of 10 to 90 parts of binder resin and 10 to 90 parts of long fiber thermal conductive material. Among them, the binder resin is a curable resin or a thermoplastic resin, the curable resin is any one of liquid silicone rubber, epoxy resin and polyurethane, preferably liquid silicone rubber, and the thermoplastic resin is polyethylene, polypropylene and thermoplastic elastomer. The long-fiber thermal conductive material is carbon fiber filaments, preferably pitch-based carbon fiber filaments, the length of the carbon fiber filaments is 10-1000 mm, and the thermal conductivity is 300-1100 W/(mk).

The preparation method of the oriented high thermal conductivity interface material includes the following steps: first arrange the long fiber thermal conductive material neatly in a square shell container, add a binder resin under the condition of a vacuum degree ≥ 0.098Mpa, and the binder is vertical After the straight addition is completed, press down the upper cover plate on the square shell container to shape the long-fiber thermal conductive material and the adhesive, remove the vacuum and solidify to obtain a block, and then cut it to the required thickness as needed, that is Obtained sheet-like orientation type high thermal conductivity interface material. Among them, the structure of the container with a square shell is shown in FIG.

Example 1

Discharge 50 parts of carbon fiber bundles with a thermal conductivity of 900W/(mk) and a length of 50mm in the square shell neatly, add 50 parts of 500cps liquid silica gel under vacuum ≥0.098Mpa, press the upper cover plate down to shape the fibers and adhesive After removing the vacuum, cure at 120°C for 1 hour to obtain a block-shaped elastomer, and then cut out a 2mm thick sheet.

Example 2

Discharge 40 parts of carbon fiber bundles with a thermal conductivity of 900W/(mk) and a length of 50mm in a square shell neatly, add 60 parts of 500cps liquid silica gel under vacuum ≥0.098Mpa, and press the upper cover plate to shape the fibers and adhesives. After removing the vacuum, curing was carried out at 120°C for 1 hour to obtain a block-shaped elastomer, and then cut out a 2mm thick sheet.

Example 3

Discharge 60 parts of carbon fiber bundles with a thermal conductivity of 900W/(mk) and a length of 50mm in a square shell neatly, add 40 parts of 500cps liquid silica gel under vacuum ≥0.098Mpa, and press the upper cover plate to shape the fibers and adhesives. After removing the vacuum, curing was carried out at 120°C for 1 hour to obtain a block-shaped elastomer, and then cut out a 2mm thick sheet.

Example 4

Discharge 50 parts of carbon fiber bundles with a thermal conductivity of 600W/(mk) and a length of 50mm in a square shell neatly, add 50 parts of 500cps liquid silica gel under vacuum ≥0.098Mpa, press the upper cover plate down to shape the fibers and adhesives, After removing the vacuum, curing was carried out at 120°C for 1 hour to obtain a block-shaped elastomer, and then cut out a 2mm thick sheet.

Comparative example 1

After 94 parts of spherical alumina and 6 parts of liquid 500cps liquid silica gel planetary machine were uniformly mixed in vacuum, they were calendered to a thickness of 2mm and cured at 120°C to obtain a sheet of alumina as a thermally conductive filler.

Comparative example 2

After mixing 55 parts of spherical alumina, 25 parts of carbon fiber powder with a thermal conductivity of 900W/(m.k) length of 200um, and 20 parts of liquid 500cps liquid silica gel planetary machine in vacuum, they are oriented and arranged by a specific device and then solidified and cut into 2mm thick slices.

Test method: Test the thermal conductivity of the gasket according to ASTM D 5470-2012. The higher the thermal conductivity, the better the thermal conductivity of the gasket; the hardness of the gasket is measured according to ASTM 2240-2005. The lower the hardness, the softer the gasket. The test results are shown in Table 1.

Table 1

项目project	实施例1Example 1	实施例2Example 2	实施例3Example 3	实施例4Example 4	对比例1Comparative example 1	对比例2Comparative example 2
导热系数，W/m.kThermal conductivity, W/m.k	6565	4646	7979	4848	6.16.1	3030
硬度，shore00Hardness, shore00	4545	3131	6363	4343	6565	5757

The above are only the preferred embodiments of the present invention. Any structure, modification, equivalent change of principle, equivalent replacement and improvement, etc. made within the scope of the present invention are all included in the protection scope of the present invention. Inside.

Claims

The oriented high thermal conductivity interface material is characterized in that the interface material is composed of 10 to 90 parts of binder resin and 10 to 90 parts of long fiber thermal conductive material.
The oriented high thermal conductivity interface material of claim 1, wherein the binder resin is a curable resin or a thermoplastic resin, and the curable resin is any one of liquid silicone rubber, epoxy resin, and polyurethane The thermoplastic resin is any one of polyethylene, polypropylene, and thermoplastic elastomer.
3. The oriented high thermal conductivity interface material of claim 2, wherein the binder resin is liquid silicone rubber.
The oriented high thermal conductivity interface material of claim 1, wherein the long-fiber thermal conductive material is carbon fiber filaments, the length of the carbon fiber filaments is 10-1000 mm, and the thermal conductivity is 300-1100 W/(m.k).
The oriented high thermal conductivity interface material of claim 1, wherein the carbon fiber filaments are pitch-based carbon fiber filaments.
The preparation method of oriented high thermal conductivity interface material according to claim 1, characterized in that it comprises the following steps: firstly arrange the long fiber thermal conductivity material (1) neatly in the square shell container (2), and the vacuum degree is ≥0.098Mpa Add the binder resin (3) under the conditions of, and after the vertical addition of the binder is completed, press down the upper cover (4) on the square shell container (2) to shape the long-fiber thermal conductive material and the binder , After removing the vacuum, curing is performed to obtain a block, which is then cut to the required thickness as required to obtain a sheet-like orientation type high thermal conductivity interface material.
The method for preparing an oriented high thermal conductivity interface material according to claim 6, wherein the square shell container is a container body with an upper opening, and an upper cover plate is provided on the container body, and the upper cover plate is The outer wall coincides with the inner wall of the container body.
7. The method for preparing an oriented high thermal conductivity interface material according to claim 6, wherein the total mass of the binder resin and the long fibers is 100 parts.