WO2021132151A1 - Appareil à soupape et dispositif de microsystème électromécanique (mems) - Google Patents

Appareil à soupape et dispositif de microsystème électromécanique (mems) Download PDF

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Publication number
WO2021132151A1
WO2021132151A1 PCT/JP2020/047661 JP2020047661W WO2021132151A1 WO 2021132151 A1 WO2021132151 A1 WO 2021132151A1 JP 2020047661 W JP2020047661 W JP 2020047661W WO 2021132151 A1 WO2021132151 A1 WO 2021132151A1
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WIPO (PCT)
Prior art keywords
passage
fluid
housing
flow path
region
Prior art date
Application number
PCT/JP2020/047661
Other languages
English (en)
Japanese (ja)
Inventor
和久 中川
太助 福田
和明 馬渡
啓 島倉
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2019235647A external-priority patent/JP2021104546A/ja
Priority claimed from JP2019235646A external-priority patent/JP2021105404A/ja
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Priority to CN202080089697.8A priority Critical patent/CN114867682A/zh
Publication of WO2021132151A1 publication Critical patent/WO2021132151A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00—Heating, cooling or ventilating [HVAC] devices
    • B60H1/32—Cooling devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
    • F16K11/02—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/31—Expansion valves
    • F25B41/33—Expansion valves with the valve member being actuated by the fluid pressure, e.g. by the pressure of the refrigerant

Definitions

  • This disclosure relates to a valve device and a MEMS device.
  • Patent Document 1 has proposed a valve device including a microvalve that inputs two fluids, mixes the two fluids, and outputs a mixed fluid of a desired pressure.
  • Micro valves are manufactured using MEMS (Micro Electro Mechanical Systems) technology.
  • the valve device includes the main body, micro valve, pin, cap, and electrical connector.
  • the main body has a pillar shape along the height direction.
  • the main body has three flow paths connecting the end face and the side surface of one end. Two fluids are input to the three flow paths and one fluid is output.
  • the other end of the main body has a recess in which a part of the end face of the other end is recessed toward one end.
  • the micro valve is fixed to the end face of one end of the main body.
  • the micro valve inputs two fluids through the main body and outputs a mixed fluid.
  • the pin penetrates the main body along the height direction. One end side of the pin is exposed from the end surface of one end of the main body. One end of the pin is electrically connected to the microvalve via an electrical connection. The other end of the pin is exposed from the bottom surface of the recess at the other end of the main body.
  • the cap is fixed to one end of the main body.
  • the cap houses the microvalve and insulates the wire from other components.
  • the cap has a through hole. The cap discharges the mixed fluid output from the micro valve to the outside through the through hole.
  • the electric connector is fixed so as to close the recess at the other end of the main body.
  • the electrical connector has a terminal for connecting the microvalve and the electrical device.
  • the terminal is electrically connected to the pin via a wire.
  • an electric connector is fixed to the other end of the main body in order to establish an electrical connection with an electric device. Parts are required to insulate the terminal of the electrical connector from the main body. Therefore, the valve device becomes large in the height direction.
  • the pin is fixed to the main body by a glass hermetic seal. Glass is required to insulate the main body from the pins.
  • the main body needs a through hole for arranging pins and glass. Therefore, the valve device becomes large in the width direction perpendicular to the height direction.
  • the object of the present disclosure is to provide a valve device capable of miniaturizing the physique.
  • Another object of the present invention is to provide a MEMS device capable of preventing corrosion of an electrical connection portion.
  • the valve device includes a housing, a MEMS device, and a terminal.
  • the housing circulates a first flow path that circulates the first fluid of the first pressure, a second flow path that circulates the second fluid of the second pressure, and a mixed fluid of the first fluid and the second fluid. It has a third flow path.
  • the housing is made of resin.
  • the MEMS device is installed in the housing.
  • the MEMS device has a first passage connected to the first flow path, a second passage connected to the second flow path, a third passage connected to the third flow path, and an electrode portion.
  • the MEMS device produces a mixed fluid of a third pressure by changing the passage cross-sectional area of at least one of the first passage and the second passage based on the electric power supplied to the electrode portion.
  • the terminal is insert-molded into the housing so that the first end and the second end opposite to the first end are exposed.
  • the first end is electrically connected to the electrode, and power is input from the second end to supply power to the MEMS device.
  • the terminal since the terminal is insert-molded in the housing, an electrode portion for connecting to the electric device becomes unnecessary. Therefore, the size of the valve device in the length direction of the terminal can be reduced. In addition, a configuration and parts for insulating the housing and the terminal are not required. Therefore, the size of the valve device in the direction perpendicular to the length direction of the terminal can be reduced. Therefore, the physique of the entire valve device can be reduced.
  • the MEMS device is a MEMS device arranged in a first fluid of a first pressure, and includes an element portion, an electrode portion, an electrical connection portion, and a mold resin portion. ..
  • the element portion has a front surface on which a wiring pattern is formed and a back surface opposite to the front surface.
  • the element unit is a mixture of a side surface connecting the front surface and the back surface, a first passage through which the first fluid is circulated, a second passage through which the second fluid of the second pressure is circulated, and the first fluid and the second fluid. It has a third passage through which the fluid flows.
  • the element unit generates a mixed fluid of a third pressure by changing the cross-sectional area of at least one of the first passage and the second passage based on the electric power supplied to the wiring pattern.
  • the electrical connection portion connects the wiring pattern of the element portion and the electrode portion, and supplies electric power to the wiring pattern from the electrode portion.
  • the first inlet portion of the first passage, the second inlet portion of the second passage, and the outlet portion of the third passage of the element portion are connected to the outside, and the tip portion of the electrode portion is exposed.
  • a part of the element part, an electrical connection part, and a part of the electrode part are sealed.
  • the wiring pattern has a connection end that is connected to the electrical connection.
  • the connection end is routed to the side of the second region in the first region constituting the surface of the element portion and the second region connected to the first region, and is connected to the electrical connection portion on the side of the second region. ..
  • the back surface of the element unit has a third region corresponding to the first region of the front surface and a fourth region corresponding to the second region.
  • the mold resin portion seals the portion corresponding to the second region on the front surface, the fourth region on the back surface, and the second region on the side surface of the element portion.
  • connection portion between the electrode portion and the electrical connection portion, the electrical connection portion, and the connection portion between the electrical connection portion and the connection end portion of the wiring pattern are covered with the mold resin portion. Therefore, even if the first fluid contains water, it is possible to prevent corrosion of the electrical connection portion.
  • FIG. 3 is a cross-sectional view taken along the line III-III of FIG.
  • FIG. 3 is a cross-sectional view taken along the line III-III of FIG.
  • FIG. 3 is a cross-sectional view taken along the line III-III of FIG.
  • FIG. 3 is a cross-sectional view taken along the line III-III of FIG.
  • It is a top view which showed the upper layer of the element part.
  • It is a top view which looked at the intermediate layer of the element part on the side of the lower layer.
  • FIG. 27 It is a figure which showed the time change of the temperature of each measurement point at the time of raising temperature of the element part, and when the element part is not cooled by a 1st fluid. It is a figure which showed the time change of the temperature difference between the point D and the point F of FIG. 19 at the time of temperature drop after the supply of electric power to an element part was stopped. It is a top view which showed the modification of the protective film. It is a top view of the support plate which concerns on 4th Embodiment. It is sectional drawing of the MEMS apparatus which concerns on 4th Embodiment. It is a perspective view of the valve device which concerns on 5th Embodiment. It is a top view of the valve device shown in FIG. 27. FIG.
  • FIG. 28 is a cross-sectional view taken along the line XXIV-XXIV of FIG. It is a perspective view of the valve device which showed the state which the MEMS device was removed. It is sectional drawing of the expansion valve to which a valve device was applied. It is sectional drawing of the expansion valve to which a valve device was applied.
  • the valve device 1100 includes a housing 1101, a terminal 1102, and a MEMS device 1103.
  • the housing 1101 has one end 1104, the other end 1105, and a body 1106.
  • the other end 1105 is a portion opposite to the one end 1104.
  • the body portion 1106 is a portion between one end portion 1104 and the other end portion 1105.
  • the direction through which one end 1104, the body 1106, and the other end 1105 of the housing 1101 pass is defined as the height direction.
  • the height direction is the direction in which one end 1104, the body 1106, and the other end 1105 are lined up.
  • the housing 1101 has a pillar shape along the height direction. In the present embodiment, the housing 1101 has a cylindrical shape.
  • the housing is a resin part formed of a thermoplastic resin such as PPS.
  • the housing 1101 has a recess 1107.
  • the recess 1107 is a portion in which a part of one end 1104 of the housing 1101 is recessed toward the other end 1105. Further, the recess 1107 has an input port 1109 in which a part of the bottom surface 1108 of the recess 1107 is recessed toward the other end 1105 of the housing 1101.
  • the housing 1101 has a first flow path 1110, a second flow path 1111, and a third flow path 1112.
  • the first flow path 1110 circulates the first fluid of the first pressure (High).
  • the second flow path 1111 circulates a second fluid of a second pressure (Plow).
  • the third flow path 1112 circulates a mixed fluid of the first fluid and the second fluid.
  • the first fluid, the second fluid, and the mixed fluid are pressure media.
  • the pressure medium may be either a gas or a liquid.
  • the pressure medium may be a mixture of a gas phase state and a liquid phase state.
  • the first flow path 1110 is a recess 1107 of the housing 1101. Since the input port 1109 constitutes a part of the recess 1107, the input port 1109 is a part of the first flow path 1110. The first fluid flows into the recess 1107 and the input port 1109.
  • the second flow path 1111 penetrates the housing 1101 from one of the side surfaces 1113 of the body portion 1106 to the bottom surface 1108 of the recess 1107.
  • the second flow path 1111 has a first through hole 1114 and a second through hole 1115.
  • the first through hole 1114 penetrates the housing 1101 along the width direction perpendicular to the height direction from one place on the side surface 1113 of the body portion 1106 to another place. Therefore, there are two openings 1116 of the second flow path 1111 on the side surface 1113 of the housing 1101.
  • the second through hole 1115 branches from the middle of the first through hole 1114 and penetrates the housing 1101 along the height direction to the bottom surface 1108 of the recess 1107.
  • the width direction is a direction along a plane perpendicular to the height direction.
  • the width direction is not limited to one of the plane directions of the plane perpendicular to the height direction.
  • the third flow path 1112 penetrates the housing 1101 from one location on the one end 1104 side of the side surface 1113 of the body portion 1106 to the bottom surface 1108 of the recess 1107 with respect to the opening 1116 of the second flow path 1111.
  • the third flow path 1112 has a third through hole 1117 and a fourth through hole 1118.
  • the third through hole 1117 penetrates the housing 1101 along the width direction from one of the side surfaces 1113 of the body portion 1106 to the other. Therefore, there are two openings 1119 in the third flow path 1112 on the side surface 1113 of the housing 1101.
  • the fourth through hole 1118 branches from the middle of the third through hole 1117 and penetrates the housing 1101 along the height direction to the bottom surface 1108 of the recess 1107.
  • the second through hole 1115 of the second flow path 1111 and the fourth through hole 1118 of the third flow path 1112 are connected to the bottom surface 1108 of the recess 1107.
  • the valve device 1100 is housed in the housing unit 1200.
  • the accommodating portion 1200 is a bottomed tubular metal part.
  • the accommodating portion 1200 has a hollow portion 1201 along the height direction.
  • the accommodating portion 1200 is omitted.
  • the valve device 1100 is arranged in the hollow portion 1201 so that the side of the one end portion 1104 of the housing 1101 is located on the side of the bottom portion 1202 of the housing portion 1200. Therefore, the valve device 1100 has a first groove portion 1120, a first seal portion 1121, a second groove portion 1122, a second seal portion 1123, a third groove portion 1124, and a third seal portion 1125.
  • the direction centered on the axis along the height direction is defined as the circumferential direction.
  • first groove portion 1120 a part of the side surface 1113 of the housing 1101 is formed along the circumferential direction.
  • the first groove portion 1120 is a portion recessed inside the housing 1101.
  • the first groove portion 1120 is provided on the one end portion 1104 side of the side surface 1113 of the housing 1101 with respect to the opening portion 1119 of the third flow path 1112.
  • the first seal portion 1121 is arranged in the first groove portion 1120.
  • the first seal portion 1121 comes into contact with the inner wall surface 1203 constituting the hollow portion 1201 of the accommodating portion 1200.
  • the first seal portion 1121 has a first space portion 1204 on the side of one end portion 1104 of the hollow portion 1201 of the accommodating portion 1200 and a second space portion 1205 on the side of the opening 1119 of the third flow path 1112. And, separate.
  • the second groove portion 1122 a part of the side surface 1113 of the housing 1101 is formed along the circumferential direction.
  • the second groove portion 1122 is a portion recessed inside the housing 1101.
  • the second groove portion 1122 is provided between the opening portion 1119 of the third flow path 1112 and the opening portion 1116 of the second flow path 1111 in the side surface 1113 of the housing 1101 in the height direction.
  • the second seal portion 1123 is arranged in the second groove portion 1122.
  • the second seal portion 1123 comes into contact with the inner wall surface 1203 of the accommodating portion 1200.
  • the second seal portion 1123 separates the second space portion 1205 of the hollow portion 1201 of the accommodating portion 1200 and the third space portion 1206 on the side of the opening 1116 of the second flow path 1111.
  • the third groove portion 1124 is a portion in which the outer edge portion of the other end surface 1126 of the other end portion 1105 is recessed toward the one end portion 1104. That is, the third groove portion 1124 is a portion in which the corner portion composed of the other end surface 1126 and the side surface 1113 of the housing 1101 is recessed in a stepped shape. It can be said that the height direction is perpendicular to the other end surface 1126 of the other end 1105.
  • the opening 1116 of the second flow path 1111 is formed in a part of the step portion 1127 on the side of the second groove portion 1122 of the third groove portion 1124. That is, the third groove portion 1124 has a chipped portion 1128 in which a part of the stepped portion 1127 is chipped. Since the openings 1116 of the second flow path 1111 are provided at two locations, the chipped portions 1128 are also provided at two locations.
  • the third seal portion 1125 is arranged in the third groove portion 1124.
  • the third seal portion 1125 comes into contact with the inner wall surface 1203 of the accommodating portion 1200.
  • the third seal portion 1125 separates the third space portion 1206 and the other end surface 1126 side of the hollow portion 1201 of the accommodating portion 1200.
  • the opening 1119 of the third flow path 1112 is formed in a part of the step portion 1129 on the side of the first groove portion 1120 constituting the second groove portion 1122. That is, the second groove portion 1122 has a chipped portion 1130 in which a part of the stepped portion 1129 is chipped. Since the openings 1119 of the third flow path 1112 are provided at two locations, the chipped portions 1130 are also provided at two locations.
  • the first range is from the other end surface 1126 of the housing 1101 to the end of the stepped portion 1127 of the third groove portion 1124.
  • the second range is from the end of the step portion 1127 of the third groove portion 1124 to the end of the step portion 1129 of the second groove portion 1122.
  • the third range is from the end of the step portion 1129 of the second groove portion 1122 to the tip of the one end portion 1104.
  • the size of the housing 1101 in the width direction is gradually reduced in the order of the first range, the second range, and the third range. That is, the housing 1101 has a conical shape.
  • the first seal portion 1121, the second seal portion 1123, and the third seal portion 1125 are, for example, O-rings.
  • the size of the O-ring varies depending on the size of the housing 1101 in the width direction.
  • the hollow portion 1201 of the accommodating portion 1200 is formed so as to fit the size of the housing 1101 in the width direction. Further, the accommodating unit 1200 has a first introduction unit 1207, a second introduction unit 1208, and a discharge unit 1209.
  • the first introduction unit 1207 inputs the first fluid to the first space unit 1204 of the accommodating unit 1200.
  • the second introduction unit 1208 inputs the second fluid to the third space unit 1206.
  • the discharge unit 1209 outputs the mixed fluid from the second space unit 1205.
  • the first introduction section 1207, the second introduction section 1208, and the discharge section 1209 are passages provided in the accommodating section 1200.
  • Terminal 1102 is a wiring component having a first end portion 1131 and a second end portion 1132.
  • the terminal 1102 is insert-molded into the housing 1101 so that the first end portion 1131 and the second end portion 1132 are exposed.
  • the first end 1131 of the terminal 1102 is exposed from the bottom surface 1108 of the recess 1107.
  • the recess 1107 of the housing 1101 has a recess 1133.
  • the recessed portion 1133 is a portion in which a part of the bottom surface 1108 is recessed toward the other end portion 1105. As shown in FIG. 4, the first end 1131 of the terminal 1102 is exposed from the recess 1133.
  • the second end portion 1132 of the terminal 1102 is exposed from the other end surface 1126 of the other end portion 1105 of the housing 1101.
  • the terminal 1102 inputs electric power from the second end 1132 and supplies the electric power to the MEMS device 1103.
  • the housing 1101 has an annular lid portion 1135 on which the window portion 1134 is formed.
  • the lid portion 1135 is arranged on the other end surface 1126 of the housing 1101.
  • the lid portion 1135 sandwiches the third seal portion 1125 together with the third groove portion 1124 in the height direction. Then, it is accommodated in the hollow portion 1201 of the accommodating portion 1200 together with the housing 1101.
  • the accommodating portion 1200 has an annular lid portion 1211 on which the window portion 1210 is formed.
  • the lid portion 1211 is fixed to the open end 1212 of the accommodating portion 1200 by caulking, screwing, welding or the like.
  • the second end 1132 of the terminal 1102 projects from the lid 1211 by being passed through the window 1134 of the lid 1135 and the window 1210 of the lid 1211.
  • the MEMS device 1103 is arranged on the bottom surface 1108 of the recess 1107 of the housing 1101. As shown in FIGS. 2 and 5, the MEMS device 1103 has an element portion 1136, a support plate 1137, an electrode portion 1138, and a mold resin portion 1139.
  • the element unit 1136 circulates a mixed fluid of the first fluid and the second fluid.
  • the element unit 1136 has a front surface 1140 and a back surface 1141 opposite to the front surface 1140.
  • the element unit 1136 is a semiconductor chip formed by a semiconductor process.
  • the mixed fluid includes a case where only the first fluid is used and a case where only the second fluid is used.
  • the element unit 1136 is a laminated body in which three layers of the upper layer 1142 shown in FIG. 2, the lower layer 1143 shown in FIG. 5, and the intermediate layer 1144 shown in FIG. 7 are laminated.
  • the upper layer 1142, the lower layer 1143, and the intermediate layer 1144 are, for example, Si substrates.
  • a bonding layer such as SiO 2 is arranged between the layers.
  • the upper surface of the upper layer 1142 corresponds to the surface 1140 of the element portion 1136.
  • the lower surface of the lower layer 1143 corresponds to the back surface 1141 of the element portion 1136.
  • a wiring pattern 1145 is formed on the surface 1140 of the element unit 1136.
  • the wiring pattern 1145 is routed to the outer edge portion 1146 of the surface 1140 of the element portion 1136.
  • the wiring pattern 1145 is a metal thin film such as Al, Cu, and Au.
  • the intermediate layer 1144 has a first electrode 1147, a second electrode 1148, a drive portion 1149, a push rod 1150, a leaf spring 1151, and a beam portion 1152.
  • the first electrode 1147 and the second electrode 1148 are connected to the wiring pattern 1145 of the upper layer 1142.
  • a plurality of drive units 1149 are linearly formed.
  • the drive unit 1149 connects either one of the first electrode 1147 and the second electrode 1148 to one end side of the push rod 1150.
  • the drive unit 1149 is inclined with respect to the linear push rod 1150.
  • the drive unit 1149 is thermally deformed according to the electric power supplied to the electrodes 1147 and 1148.
  • the push rod 1150 is displaced in the linear direction due to thermal deformation of the drive unit 1149.
  • the leaf spring 1151 is connected to the fulcrum portion 1153.
  • the push rod 1150 and the leaf spring 1151 are connected to the beam portion 1152.
  • the beam portion 1152 has a movable portion 1154.
  • the push rod 1150 when the drive unit 1149 is thermally deformed according to the electric power supplied to the electrodes 1147 and 1148, the push rod 1150 is displaced in the linear direction.
  • the beam portion 1152 amplifies the displacement of the push rod 1150 by the action of a lever having the fulcrum portion 1153 as a fulcrum, and transmits the displacement to the beam portion 1152.
  • the movable portion 1154 is displaced.
  • the movable portion 1154 is a valve body that changes the passage cross-sectional area of at least one of the first passage 1155 and the second passage 1156 formed in the lower layer 1143.
  • the first passage 1155 is connected to the input port 1109 and the recess 1107 that form the first passage 1110 of the housing 1101.
  • the second passage 1156 is connected to the second through hole 1115 constituting the second passage 1111 of the housing 1101. Therefore, the amounts of the first fluid and the second fluid flowing into the intermediate layer 1144 are adjusted according to the displacement of the movable portion 1154.
  • the first fluid and the second fluid flowing into the intermediate layer 1144 are mixed to generate a mixed fluid. Since the first fluid of the first pressure and the second fluid of the second pressure are mixed, the mixed fluid becomes the third pressure (Pout).
  • the mixed fluid flows through the intermediate layer 1144 and is output to the third passage 1157 formed in the lower layer 1143.
  • the third passage 1157 is connected to the fourth through hole 1118 constituting the third flow path 1112.
  • the support plate 1137 is a plate-shaped metal part.
  • the support plate 1137 is provided on the lower layer 1143 of the element portion 1136.
  • the support plate 1137 has through holes corresponding to the three passages 1155 to 1157.
  • the support plate 1137 is fixed to the bottom surface 1108 of the recess 1107 with an adhesive, solder, or the like.
  • the electrode portion 1138 is electrically connected to the wiring pattern 1145 by wire bonding on the side of the outer edge portion 1146 of the surface 1140 of the element portion 1136 such as the Al wire.
  • the electrode unit 1138 inputs the electric power supplied via the terminal 1102 to the electrodes 1147 and 1148 of the element unit 1136.
  • the element unit 1136 operates based on the electric power supplied to the electrodes 1147 and 1148.
  • the electrode portion 1138 may be electrically connected to the wiring pattern 1145 by a metal clip such as Cu.
  • the mold resin portion 1139 includes a part of the element portion 1136 and a connection portion between a part of the wiring pattern 1145 and the wire so that the tip portion 1158 and the support plate 1137 of the electrode portion 1138 are exposed, and the wire, the wire and the electrode.
  • the connection portion with the portion 1138 is sealed. As a result, the connection portion of the wire and the wire itself are protected from the first fluid.
  • the portion of the wiring pattern 1145 exposed from the mold resin portion 1139 is covered with, for example, a potting material.
  • the portion of the wiring pattern 1145 excluding the connection portion with the wire is covered with the protective film.
  • the protective film is formed on the surface 1140 of the element portion 1136.
  • the wiring pattern 1145 may be formed as an Au line. As a result, corrosion of the wiring pattern 1145 can be suppressed.
  • the wiring pattern 1145 may be composed of a plurality of metal layers. In this case, the uppermost layer of the wiring pattern 1145 is an Au thin film.
  • the mold resin portion 1139 is an element in a state where the region of the front surface 1136 of the element portion 1136 opposite to the side of the outer edge portion 1146 and the region of the back surface 1141 corresponding to the region are exposed. Part 1136 is sealed.
  • the MEMS device 1103 is arranged on the bottom surface 1108 with the back surface 1141 side of the element unit 1136 facing the bottom surface 1108 of the recess 1107.
  • the support plate 1137 is fixed to the bottom surface 1108 of the recess 1107 by a joining material such as an adhesive or solder.
  • the second passage 1156 is connected to the second through hole 1115 of the second flow path 1111, and the third passage 1157 is connected to the fourth through hole 1118 of the third flow path 1112.
  • the first passage 1155 of the MEMS device 1103 is connected to the input port 1109 of the recess 1107.
  • the tip 1158 of the electrode portion 1138 of the MEMS device 1103 is electrically connected to the first end 1131 of the terminal 1102 at the recess 1133 of the bottom 1202 of the recess 1107.
  • the tip portion 1158 of the electrode portion 1138 and the first end portion 1131 of the terminal 1102 are resistance welded.
  • the housing 1101 has a potting material 1159.
  • the potting material 1159 is arranged in the recess 1133.
  • the potting material 1159 covers the connection portion between the first end portion 1131 and the electrode portion 1138 of the terminal 1102. As a result, the potting material 1159 protects the connection portion between the first end portion 1131 and the electrode portion 1138 of the terminal 1102 from the first fluid.
  • the terminal 1102 is fixed to an electric device such as a circuit board in a state of being housed in the housing unit 1200.
  • the first fluid flows into the first space portion 1204 via the first introduction portion 1207 of the accommodating portion 1200.
  • the second fluid flows into the third space portion 1206 via the second introduction portion 1208 of the accommodating portion 1200.
  • the first fluid flows into the intermediate layer 1144 of the element portion 1136 via the input port 1109 of the recess 1107 and the first passage 1155 of the element portion 1136.
  • the second fluid flows into the intermediate layer 1144 of the element portion 1136 via the second passage 1111 of the housing 1101 and the second passage 1156 of the element portion 1136.
  • the element unit 1136 displaces the movable unit 1154 based on the electric power input to the electrodes 1147 and 1148. As a result, the passage cross-sectional area of the first passage 1155 and the second passage 1156 changes. For example, the second passage 1156 of the second fluid is always open, and only the passage cross-sectional area of the first passage 1155 of the first fluid changes.
  • the first passage 1155 of the first fluid is always open, and only the passage cross-sectional area of the second passage 1156 of the second fluid may be changed. Alternatively, the passage cross-sectional area of both the first passage 1155 and the second passage 1156 may be changed according to the displacement of the movable portion 1154.
  • the element unit 1136 mixes the first fluid and the second fluid that have flowed into the intermediate layer 1144 to generate a mixed fluid.
  • the third pressure of the mixed fluid is the pressure in the range of the first pressure> the third pressure> the second pressure. Therefore, the element unit 1136 adjusts the third pressure by displacing the movable unit 1154.
  • the mixed fluid of the third pressure flows out to the second space portion 1205 via the third passage 1157 of the element portion 1136 and the third passage 1112 of the housing 1101.
  • the mixed fluid is discharged to the discharge unit 1209.
  • the drive unit 1149 of the element unit 1136 is thermally deformed by being supplied with electric power. Therefore, the temperature of the drive unit 1149 and the push rod 1150 rises. Therefore, as shown in FIG. 8, the temperatures at three points, point A of the push rod 1150, point B of the drive unit 1149, and point C on the extension line of the push rod 1150 in the intermediate layer 1144, were simulated.
  • the maximum temperature of the drive unit 1149 during thermal deformation was 240 ° C. It is assumed that the element portion 1136 is made of Si. The maximum temperature of the first fluid was 80 ° C. Further, the element unit 1136 was arranged in the first fluid. After this, power was supplied to the MEMS device 1103.
  • the housing 1101 is resin-molded and the terminal 1102 is insert-molded into the housing 1101. Therefore, an electrode component for connecting the terminal and the electric device becomes unnecessary. Therefore, the size of the valve device 1100 in the length direction, that is, the height direction of the terminal 1102 can be reduced.
  • the housing 1101 is made of resin, the configuration and parts for insulating the housing 1101 and the terminal 1102 are not required. Therefore, the size of the valve device 1100 in the direction perpendicular to the length direction of the terminal 1102, that is, in the width direction can be reduced. Therefore, the overall body shape of the valve device 1100 can be reduced.
  • the MEMS device 1103 is arranged in the recess 1107. Therefore, the size in the height direction can be reduced as compared with the case where the MEMS device 1103 is arranged on one end surface of the one end portion 1104 of the housing 1101.
  • the second pressure of the second fluid inside the first through hole 1114 becomes pressure-free in the width direction. Therefore, the second pressure is only applied in the height direction.
  • the third pressure of the mixed fluid inside the third through hole 1117 becomes pressure-free in the width direction, the third pressure is only applied in the height direction. Therefore, the load on the housing 1101 is smaller than the shape in which the second flow path 1111 and the third flow path 1112 do not branch inside the housing 1101.
  • third pressure> second pressure pressure is applied to the third seal portion 1125 on the other end portion 1105 side of the housing 1101. Therefore, even if the chipped portion 1128 is formed in the stepped portion 1127 of the third groove portion 1124, the portion of the third seal portion 1125 corresponding to the chipped portion 1128 is less likely to be deformed along the shape of the chipped portion 1128. That is, the opening 1116 of the second flow path 1111 does not have to be located closer to the second groove portion 1122 than the step portion 1127. In other words, in order to provide the opening 1116 of the second flow path 1111 in the housing 1101, it is not necessary to consider the size of the housing 1101 in the height direction.
  • the relationship between the opening 1119 of the third flow path 1112 and the stepped portion 1129 of the second groove 1122 is the same. Therefore, the size of the housing 1101 can be reduced by the height of the step portion 1127 of the third groove portion 1124 and the height of the step portion 1129 of the second groove portion 1122 in the height direction.
  • the MEMS device 1103 is located in the first space portion 1204 of the accommodating portion 1200. Therefore, since a part of the element unit 1136 comes into contact with the first fluid, the element unit 1136 can be cooled by the first fluid. On the surface 1140 of the element unit 1136, when the wiring pattern 1145 is Al, heat can be dissipated through the protective film that protects the wiring pattern 1145. On the back surface 1141 of the element unit 1136, heat can be directly dissipated from the lower layer 1143 to the first fluid.
  • the MEMS device 1103 has a configuration in which the wire connecting the wiring pattern 1145 and the electrode portion 1138 is covered with the mold resin portion 1139. Therefore, the wire can be protected from corrosion by the first fluid.
  • the housing 1101 may have a pillar shape other than a cylinder shape.
  • the housing 1101 may be an elliptical column or a polygonal column.
  • the size of the housing 1101 in the width direction from one end 1104 to the other end 1105 may be constant.
  • the first passage 1155 of the element unit 1136 may be provided in the upper layer 1142.
  • the input port 1109 may not be formed in the recess 1107 of the housing 1101.
  • the second flow path 1111 and the third flow path 1112 may be formed as a single road. That is, the second flow path 1111 and the third flow path 1112 do not have to have a branch path.
  • each seal portion 1121, 1123, 1125 may be other than an O-ring.
  • an adhesive may be used as each of the sealing portions 1121, 1123, and 1125.
  • the element portion 1136 may not be sealed by the mold resin portion 1139.
  • the element portion 1136 is fixed to the bottom surface 1108 of the recess 1107 of the housing 1101.
  • the element portion 1136 and the first end portion 1131 of the terminal 1102 are connected by a wire.
  • the wire is covered with a potting material 1159.
  • the first flow path 1110 is not limited to the recess 1107 and the input port 1109.
  • the first flow path 1110 may be a through hole formed in the housing 1101, similarly to the second flow path 1111 and the third flow path 1112.
  • the lid 1135 does not have to be annular.
  • the lid portion 1135 may have two window portions 1134 through which the second end portion 1132 of the terminal 1102 passes.
  • the lid portion 1211 does not have to be annular.
  • the lid portion 1135 may have two window portions 1210 through which the second end portion 1132 of the terminal 1102 is passed.
  • 12 and 13 show an expansion valve 1213 to which the valve device 1100 is applied.
  • the expansion valve 1213 is applied to a refrigeration cycle device mounted on a vehicle.
  • the above-mentioned first fluid and second fluid are refrigerants that circulate in the refrigeration cycle.
  • the first pressure > the second pressure.
  • the refrigerant is, for example, HFC-134a, HFO-1234yf, or the like.
  • the refrigerant repeats four states of compression, condensation, expansion, and evaporation.
  • the expansion valve 1213 is applied to the post-condensation expansion of the refrigeration cycle.
  • the valve device 1100 operates as a pilot valve for the expansion valve 1213.
  • the expansion valve 1213 has a valve device 1100, an accommodating portion 1200, a main valve 1214, and a coil spring 1215.
  • the accommodating portion 1200 has a hollow portion 1216 in which the main valve 1214 and the coil spring 1215 are accommodated, a high-pressure flow path 1217 connected to the hollow portion 1216, a low-pressure flow path 1218, and an output flow path 1219.
  • a part of the high-pressure flow path 1217 is connected to the first introduction unit 1207 of the accommodating unit 1200.
  • the high-pressure flow path 1217 is connected to the first space portion 1204 of the hollow portion 1201.
  • the refrigerant as the first fluid flowing through the high-pressure flow path 1217 flows into the MEMS device 1103 of the valve device 1100. Therefore, the MEMS device 1103 is located in the high pressure first fluid and is cooled by the first fluid.
  • a part of the low pressure flow path 1218 is connected to the second introduction section 1208 of the accommodating section 1200.
  • the low pressure flow path 1218 is connected to the third space portion 1206 of the hollow portion 1201.
  • the refrigerant as the second fluid flowing through the low-pressure flow path 1218 flows into the MEMS device 1103 of the valve device 1100.
  • the output flow path 1219 outputs a mixed fluid of the first fluid and the second fluid to the hollow portion 1220.
  • the third pressure of the mixed fluid is a pressure in the range from the first pressure to the second pressure.
  • the main valve 1214 adjusts the opening degree of the refrigerant passage 1221 based on the third pressure of the mixed fluid.
  • the main valve 1214 is arranged in the height direction according to the magnitude relationship between the force of the coil spring 1215 pushing the main valve 1214 toward the valve device 1100 and the force of the mixed fluid pushing the main valve 1214 toward the coil spring 1215. Displace.
  • the displacement amount of the main valve 1214 is adjusted by controlling the displacement amount of the movable portion 1154 of the valve device 1100 by the control device that controls the refrigeration cycle. As a result, the passage cross-sectional area of the refrigerant passage 1221 changes. Therefore, the refrigerant is depressurized when passing through the refrigerant passage 1221 from the high pressure flow path 1217 and discharged to the low pressure flow path 1218.
  • the main valve 1214 when the third pressure of the mixed fluid is weaker than the force of the coil spring 1215, the main valve 1214 is displaced to a position where the passage cross-sectional area of the refrigerant passage 1221 is reduced.
  • the main valve 1214 when the third pressure of the mixed fluid is stronger than the force of the coil spring 1215, the main valve 1214 is displaced to a position where the passage cross-sectional area of the refrigerant passage 1221 increases.
  • valve device 1100 can be used as a pilot valve for the in-vehicle expansion valve 1213.
  • valve device 1100 can be used not only for in-vehicle use but also as a valve for a hydraulic system.
  • the MEMS device 1103 includes an element portion 1136, a support plate 1137, an electrode portion 1138, an electrical connection portion 104, and a mold resin portion 1139.
  • the element unit 1136 is a semiconductor chip formed by a semiconductor process.
  • the element unit 1136 has a front surface 1140, a back surface 1141 opposite to the front surface 1140, and a side surface 108 connecting the front surface 1140 and the back surface 1141.
  • the element unit 1136 has a first passage 1155, a second passage 1156, and a third passage 1157.
  • the first passage 1155 circulates the first fluid 200 of the first pressure.
  • the second passage 1156 circulates the second fluid 201 of the second pressure.
  • the third passage 1157 circulates the mixed fluid 202 of the first fluid 200 and the second fluid 201.
  • the element unit 1136 generates the mixed fluid 202 of the third pressure by changing the passage cross-sectional area of at least one of the first passage 1155 and the second passage 1156.
  • the mixed fluid 202 includes a case where only the first fluid 200 is used and a case where only the second fluid 201 is used.
  • the first fluid 200, the second fluid 201, and the mixed fluid 202 are pressure media.
  • the pressure medium may be either a gas or a liquid.
  • the pressure medium may be a mixture of a gas phase state and a liquid phase state.
  • the element unit 1136 is a laminated body in which three layers of an upper layer 1142, a lower layer 1143, and an intermediate layer 1144 are laminated.
  • the upper layer 1142, the lower layer 1143, and the intermediate layer 1144 are, for example, Si substrates.
  • Each layer 1142 to 1144 is joined by a joining layer 115 such as SiO 2.
  • the bonding layer 115 is arranged between the upper layer 1142 and the intermediate layer 1144, and between the intermediate layer 1144 and the lower layer 1143.
  • the upper surface of the upper layer 1142 corresponds to the surface 1140 of the element portion 1136.
  • the lower surface of the lower layer 1143 corresponds to the back surface 1141 of the element portion 1136.
  • the surface 1140 of the element unit 1136 has a first region 116 and a second region 117 connected to the first region 116.
  • a wiring pattern 1145 is formed on the surface 1140 of the element portion 1136.
  • the wiring pattern 1145 is two wirings, a positive electrode and a negative electrode.
  • the wiring pattern 1145 is a metal thin film such as Al, Cu, and Au.
  • the wiring pattern 1145 may be composed of a plurality of metal layers. For example, by forming an Au thin film as the uppermost layer of the wiring pattern 1145, corrosion of the wiring pattern 1145 can be suppressed.
  • the wiring pattern 1145 has a connection end portion 119 connected to the electrical connection portion 104.
  • the connection end portion 119 of the wiring pattern 1145 corresponding to the negative electrode is routed to the side of the second region 117 on the surface 1140 of the element portion 1136 and connected to the electrical connection portion 104 on the side of the second region 117. Will be done. That is, the wiring pattern 1145 is routed to the outer edge portion of the surface 1140 of the element portion 1136. It is also possible that the connection end 119 of the wiring patterns 1145 for both the positive electrode and the negative electrode is routed from the first region 116 to the second region 117.
  • the back surface 1141 of the element unit 1136 has a third region 120 corresponding to the first region 116 of the front surface 1140 and a fourth region 121 corresponding to the second region 117.
  • the stacking direction of the layers 1142 to 1144 of the element unit 1136 is defined as the height direction.
  • the height direction is the direction perpendicular to the surface 1140 of the element unit 1136.
  • the third region 120 is at the same position as the first region 116 in the height direction. In the present embodiment, the area of the third region 120 is smaller than the area of the first region 116. The area of the third region 120 may be the same as or larger than the area of the first region 116. Similarly, in the relationship between the fourth region 121 and the second region, the fourth region 121 is at the same position as the second region 117 in the height direction. In the present embodiment, the area of the fourth region 121 is larger than the area of the second region 117. The area of the fourth region 121 may be the same as or smaller than the area of the second region 117.
  • each area 116, 117, 120, 121 is a quadrangular shape.
  • the regions 116, 117, 120, and 121 are not limited to the quadrangle, and may have other shapes.
  • the upper layer 1142 has a first connecting portion 122 and a second connecting portion 123 penetrating the upper layer 1142.
  • the connecting portions 122 and 123 are through electrodes that penetrate the upper layer 1142.
  • the connecting portions 122 and 123 are connected to the corresponding wiring pattern 1145.
  • the element unit 1136 has a protective film 124 arranged on the surface 1140.
  • the protective film 124 covers the wiring pattern 1145 and the connection portions 122 and 123 so that the connection end portion 119 is exposed.
  • the protective film 124 is, for example, an epoxy resin, a silicone resin, or an imide resin.
  • the lower layer 1143 has a first entrance portion 125 of the first passage 1155, a second entrance portion 126 of the second passage 1156, and an outlet portion 127 of the third passage 1157 of the element portions 1136.
  • the first inlet portion 125, the second inlet portion 126, and the outlet portion 127 are arranged in the fourth region 121 of the back surface 1141 of the element portion 1136.
  • the first fluid 200 flows into the first inlet portion 125.
  • the second fluid 201 flows into the second inlet portion 126.
  • the mixed fluid 202 is discharged from the outlet portion 127.
  • the intermediate layer 1144 has a first electrode 1147, a second electrode 1148, a drive unit 1149, a push rod 1150, a leaf spring 1151, and a beam portion 1152.
  • the first electrode 1147 and the second electrode 1148 are connected to the connection portions 122 and 123, respectively.
  • the connection portions 122 and 123 are connected to the wiring pattern 1145 of the upper layer 1142.
  • a plurality of drive units 1149 are linearly formed.
  • the drive unit 1149 connects any one of the electrodes 1147 and 1148 to one end side of the push rod 1150.
  • the drive unit 1149 is inclined with respect to the linear push rod 1150.
  • the drive unit 1149 is thermally deformed according to the electric power supplied to the electrodes 1147 and 1148.
  • the drive unit 1149 is formed at a position corresponding to the first region 116 of the surface 1140 of the intermediate layer 1144.
  • the push rod 1150 is displaced in the linear direction due to thermal deformation of the drive unit 1149.
  • the leaf spring 1151 is connected to the fulcrum portion 1153.
  • the push rod 1150 and the leaf spring 1151 are connected to the beam portion 1152.
  • the beam portion 1152 has a movable portion 1154.
  • the push rod 1150 when the drive unit 1149 is thermally deformed according to the electric power supplied to the electrodes 1147 and 1148, the push rod 1150 is displaced in the linear direction.
  • the beam portion 1152 amplifies the displacement of the push rod 1150 by the action of a lever having the fulcrum portion 1153 as a fulcrum, and transmits the displacement to the beam portion 1152.
  • the movable portion 1154 is displaced.
  • the movable portion 1154 is a valve body that changes the passage cross-sectional area of at least one of the first passage 1155 and the second passage 1156 formed in the lower layer 1143 according to the operation of the drive unit 1149. Therefore, the amounts of the first fluid 200 and the second fluid 201 flowing into the intermediate layer 1144 are adjusted according to the displacement of the movable portion 1154.
  • the first fluid 200 and the second fluid 201 flowing into the intermediate layer 1144 are mixed to generate a mixed fluid 202. Since the first fluid 200 of the first pressure and the second fluid 201 of the second pressure are mixed, the mixed fluid 202 becomes the third pressure (Pout). The mixed fluid 202 flows through the intermediate layer 1144 and is output to the third passage 1157 formed in the lower layer 1143.
  • the support plate 1137 is a plate-shaped metal part.
  • the support plate 1137 is fixed to the lower layer 1143 of the element portion 1136 by the first joint portion 136. Specifically, the support plate 1137 is fixed to the fourth region 121 of the back surface 1141 of the element portion 1136.
  • the support plate 1137 has a first through-passage 137, a second through-passage 138, and a third through-passage 139.
  • the first gangway 137 is connected to the first entrance portion 125.
  • the second gangway 138 is connected to the second entrance portion 126.
  • the third gangway 139 is connected to the exit portion 127.
  • the electrode portion 1138 is, for example, a metal component such as Al or Cu.
  • the electrical connection unit 104 connects the wiring pattern 1145 of the element unit 1136 and the electrode unit 1138.
  • the electrical connection unit 104 supplies electric power from the electrode unit 1138 to the wiring pattern 1145.
  • the electrical connection portion 104 is, for example, an Al wire or the like.
  • the electric connection unit 104 inputs the electric power supplied via the electrode unit 1138 to the electrodes 1147 and 1148 of the element unit 1136 via the wiring pattern 1145.
  • the element unit 1136 operates based on the electric power supplied to the electrodes 1147 and 1148.
  • the electrical connection portion 104 may be a metal clip such as Cu.
  • the mold resin portion 1139 is a part of the element portion 1136, a connection portion between the connection end portion 119 of the wiring pattern 1145 and the electrical connection portion 104, an electrical connection portion 104, and a connection portion between the electrical connection portion 104 and the electrode portion 1138. To seal.
  • the mold resin portion 1139 covers the portions of each layer 1142 to 1144 and the portion of the bonding layer 115 corresponding to the second region 117 of the side surface 108 of the element portion 1136. Further, the mold resin portion 1139 exposes the tip portion 1158 and the support plate 1137 of the electrode portion 1138. The mold resin portion 1139 supports the element portion 1136 so that the first inlet portion 125 of the first passage 1155, the second inlet portion 126 of the second passage 1156, and the outlet portion 127 of the third passage 1157 are connected to the outside. Covers part of the plate 1137.
  • the mold resin portion 1139 seals a portion of the element portion 1136 corresponding to the second region 117 of the front surface 1140, the fourth region 121 of the back surface 1141, and the second region 117 of the side surface 108. To do. That is, the portion of the element portion 1136 corresponding to the first region 116 of the front surface 1140, the third region 120 of the back surface 1141 and the first region 116 of the side surface 108 is exposed from the mold resin portion 1139.
  • the mold resin portion 1139 has a first interface 141 and a second interface 142.
  • the first interface 141 is a portion of the surface 1140 of the element unit 1136 that is in contact with the first boundary 143 between the first region 116 and the second region 117.
  • the first interface 141 is inclined so that the angle ⁇ 1 formed with the first region 116 of the surface 1140 is an obtuse angle. In other words, the first interface 141 is inclined at an acute angle with respect to the height direction.
  • the second interface 142 is a portion of the back surface 1141 of the element unit 1136 that is in contact with the second boundary 144 between the third region 120 and the fourth region 121.
  • the second interface 142 is inclined so that the angle ⁇ 2 formed with the third region 120 of the back surface 1141 is an obtuse angle. In other words, the second interface 142 is inclined at an acute angle with respect to the height direction.
  • the structure in which a part of the mold resin portion 1139 is exposed is manufactured by the film mode.
  • a mold is prepared in which the upper mold and the lower mold form a space.
  • the film is attached to at least the portion of the mold corresponding to the exposed portion of the element portion 1136.
  • the element portion 1136 provided with the electrode portion 1138 and the support plate 1137 is arranged in the mold.
  • the film attached to the mold is brought into contact with the exposed portion of the element portion 1136.
  • the mold resin portion is poured into the space portion of the mold and cured.
  • the tip portion 1158 of the electrode portion 1138 is not sealed in the mold resin portion 1139. This makes it possible to manufacture a structure in which a part of the element portion 1136 and the tip portion 1158 of the electrode portion 1138 are exposed.
  • the interfaces 141 and 142 are set to obtuse angles. As a result, the mold resin portion 1139 can be easily manufactured by the film mode.
  • the angle ⁇ 1 and the angle ⁇ 2 are the same angle. As a result, the balance between the stress applied to the side of the second region 117 of the element unit 1136 and the stress applied to the side of the fourth region 121 is improved.
  • the angle ⁇ 1 and the angle ⁇ 2 may be different from each other.
  • the connecting direction is also the direction in which the third region 120 and the fourth region 121 are arranged side by side.
  • the position of the first boundary 143 is located closer to the electrode portion 1138 than the position of the second boundary 144 in the connecting direction. That is, as shown in FIG. 15, in the connecting direction, the position of the first boundary 143 and the position of the second boundary 144 are separated by a distance L. As a result, the mold resin portion 1139 on the back surface 1141 side of the element portion 1136 is less likely to be peeled off from the back surface 1141.
  • the position of the first boundary 143 and the position of the second boundary 144 may be the same. Further, the position of the second boundary 144 may be located closer to the electrode portion 1138 than the position of the first boundary 143.
  • the mold resin portion 1139 is, for example, an epoxy resin or the like.
  • the coefficient of linear expansion of the mold resin portion 1139 is, for example, 16.
  • the coefficient of linear expansion of the support plate 1137 is, for example, 17. As a result, the warp of the mold resin portion 1139 is suppressed.
  • the MEMS device 1103 is fixed to a housing (not shown) in which the flow path of the second fluid 201 and the flow path of the mixed fluid 202 are formed. Further, as shown in FIG. 19, the MEMS device 1103 is arranged in the first fluid 200 of the first pressure.
  • the first fluid 200 flows into the first passage 1155 through the groove provided in the housing and the first through-passage 137 of the support plate 1137.
  • the first fluid 200 flows into the intermediate layer 1144 of the element unit 1136 via the first passage 1155.
  • the second fluid 201 flows into the second passage 1156 through the second through-passage 138 of the housing and the support plate 1137.
  • the second fluid 201 flows into the intermediate layer 1144 of the element portion 1136 via the second passage 1156.
  • the element unit 1136 displaces the movable unit 1154 based on the electric power input to the electrodes 1147 and 1148.
  • the passage cross-sectional area of the first passage 1155 and the second passage 1156 changes.
  • the passage cross-sectional area of both the first passage 1155 and the second passage 1156 changes with the displacement of the movable portion 1154.
  • the second passage 1156 of the second fluid 201 may be always open, and only the passage cross-sectional area of the first passage 1155 of the first fluid 200 may be changed.
  • the first passage 1155 of the first fluid 200 may be always open, and only the passage cross-sectional area of the second passage 1156 of the second fluid 201 may be changed.
  • the element unit 1136 mixes the first fluid 200 and the second fluid 201 that have flowed into the intermediate layer 1144 to generate the mixed fluid 202.
  • the third pressure of the mixed fluid 202 is a pressure in the range of the first pressure> the third pressure> the second pressure. Therefore, the element unit 1136 adjusts the third pressure by displacing the movable unit 1154.
  • the mixed fluid 202 of the third pressure is discharged to the housing through the third passage 1157 of the element unit 1136 and the third through-passage 139 of the support plate 1137.
  • the drive unit 1149 of the element unit 1136 is thermally deformed by being supplied with electric power. Therefore, the temperature of the drive unit 1149 and the push rod 1150 rises. Therefore, as shown in FIG. 19, the temperatures at three points, the D point of the push rod 1150, the E point of the drive unit 1149, and the F point on the extension line of the push rod 1150 in the intermediate layer 1144, were simulated.
  • the maximum temperature of the drive unit 1149 during thermal deformation was 240 ° C. It is assumed that the element portion 1136 is made of Si. The maximum temperature of the first fluid 200 was 80 ° C. Further, the element unit 1136 was arranged in the first fluid 200. After this, power was supplied to the MEMS device 1103.
  • the heat generated in the drive unit 1149 is dissipated through the first path 145, the second path 146, and the third path 147.
  • the first path 145 is a path that reaches the first fluid 200 from the drive unit 1149 via the first region 116 of the element unit 1136.
  • heat can be dissipated through the protective film 124 that protects the wiring pattern 1145.
  • the second path 146 is a path from the drive unit 1149 to the first fluid 200 via the second region 117 of the element unit 1136 and the mold resin unit 1139.
  • the third path 147 is a path that reaches the first fluid 200 from the drive unit 1149 via the third region 120 of the element unit 1136. On the back surface 1141 of the element unit 1136, heat can be directly dissipated from the lower layer 1143 to the first fluid 200.
  • the electrical connection portion 104 can cool the element portion 1136 in a state of being protected from the first fluid 200.
  • connection portion between the electrode portion 1138 and the electrical connection portion 104, the electrical connection portion 104, and the connection end portion 119 between the electrical connection portion 104 and the wiring pattern 1145.
  • the connection portion is covered with the mold resin portion 1139. Therefore, even if the first fluid 200 contains water, it is possible to prevent the electrical connection portion 104 from corroding.
  • the portion of the bonding layer 115 of the element portion 1136 which is a laminated body is covered with the mold resin portion 1139. Therefore, the portion of the bonding layer 115 covered with the mold resin portion 1139 can be protected from erosion by the first fluid 200.
  • the portion of the surface 1140 of the element portion 1136 corresponding to the drive portion 1149 is exposed from the mold resin portion 1139. Therefore, the heat of the drive unit 1149 can be dissipated from the first region 116 of the element unit 1136 to the first fluid 200.
  • the portion of the wiring pattern 1145 that is not covered by the mold resin portion 1139 is covered with the protective film 124. Therefore, the wiring pattern 1145 can be protected from the first fluid 200.
  • the protective film 124 also functions as a protective material for the wiring pattern 1145 when the element portion 1136 is assembled.
  • the first passage 1155 of the element unit 1136 may be provided in the upper layer 1142.
  • the mold resin portion 1139 may be formed so that the first inlet portion 125 of the first passage 1155 is connected to the outside.
  • the angle ⁇ 1 of the first interface 141 and the angle ⁇ 2 of the second interface 142 may be 90 degrees with respect to the surface 1140 of the element unit 1136. Even in this case, the mold resin portion 1139 can be formed by the film mode.
  • the protective film 124 may be formed in a shape that does not cover the portion of the first region 116 of the element portion 1136 that corresponds to the drive portion 1149.
  • the portion of the wiring pattern 1145 exposed from the mold resin portion 1139 may be covered with, for example, a potting material instead of the protective film 124.
  • the protective film 124 and the potting material may not be formed on the surface 1140 of the element portion 1136.
  • the first through-passage 137, the second through-passage 138, and the third through-passage 139 of the support plate 1137 are formed so as to widen the pitch in the surface direction of the back surface 1141 of the element portion 1136. Has been done.
  • the first gangway 137 is formed so that the pitch a1 of the first entrance portion 125 and the second entrance portion 126 is widened to the pitch a2.
  • the second gangway 138 is formed so that the pitch b1 of the first inlet portion 125 and the outlet portion 127 is widened to the pitch b2.
  • the third gangway 139 is formed so that the pitch c1 of the second inlet portion 126 and the outlet portion 127 is widened to the pitch c2.
  • the support plate 1137 is fixed to the mounting portion 300 by the second joint portion 148.
  • the pitch b1 between the first inlet portion 125 and the outlet portion 127 is expanded to the pitch b2 by the support plate 1137.
  • the second joint portion 148 is, for example, an adhesive, solder, or the like.
  • the linear expansion coefficient ⁇ 1 of the support plate 1137 is set between the linear expansion coefficient ⁇ 2 of the element portion 1136 and the linear expansion coefficient ⁇ 3 of the mounting portion 300. That is, ⁇ 2 ⁇ 1 ⁇ 3. As a result, the stress applied to the support plate 1137 is suppressed, so that the reliability of the first joint portion 136 and the second joint portion 148 can be ensured.
  • each joint 136, 148 may be printed so as to extend the pitch.
  • the support plate 1137, the first joint portion 136, or the second joint portion 148 described in this embodiment corresponds to the enlarged portion.
  • the MEMS device 1103 is applied to a valve device which is a pilot valve of an expansion valve.
  • the expansion valve adjusts the opening degree of the refrigerant passage based on the third pressure of the mixed fluid 202.
  • the first fluid 200 and the second fluid 201 are refrigerants that circulate in the refrigeration cycle device mounted on the vehicle.
  • the refrigerant is, for example, HFC-134a, HFO-1234yf, or the like.
  • the refrigerant repeats four states of compression, condensation, expansion, and evaporation.
  • the expansion valve is applied to the post-condensation expansion of the refrigeration cycle.
  • the valve device 1100 includes a housing 1101, a terminal 1102, and a MEMS device 1103.
  • the housing 1101 has one end 1104, the other end 1105, and a body 1106.
  • the other end 1105 is a portion opposite to the one end 1104.
  • the body portion 1106 is a portion between one end portion 1104 and the other end portion 1105.
  • the direction of passing through one end 1104, the body 1106, and the other end 1105 of the housing 1101 corresponds to the height direction.
  • the height direction is the direction in which one end 1104, the body 1106, and the other end 1105 are lined up.
  • the housing 1101 has a pillar shape along the height direction. In the present embodiment, the housing 1101 has a cylindrical shape.
  • the housing is a resin part formed of a thermoplastic resin such as PPS.
  • the housing 1101 has a recess 1107.
  • the recess 1107 is a portion in which a part of one end 1104 of the housing 1101 is recessed toward the other end 1105. Further, the recess 1107 has an input port 1109 in which a part of the bottom surface 1108 of the recess 1107 is recessed toward the other end 1105 of the housing 1101.
  • the housing 1101 has a first flow path 1110, a second flow path 1111, and a third flow path 1112.
  • the first flow path 1110 circulates the first fluid 200 of the first pressure (High).
  • the second flow path 1111 circulates the second fluid 201 of the second pressure (Plow).
  • the third flow path 1112 circulates the mixed fluid 202 of the first fluid 200 and the second fluid 201.
  • the first flow path 1110 is a recess 1107 of the housing 1101. Since the input port 1109 constitutes a part of the recess 1107, the input port 1109 is a part of the first flow path 1110. The first fluid 200 flows into the recess 1107 and the input port 1109.
  • the second flow path 1111 penetrates the housing 1101 from one of the side surfaces 1113 of the body portion 1106 to the bottom surface 1108 of the recess 1107.
  • the second flow path 1111 has a first through hole 1114 and a second through hole 1115.
  • the first through hole 1114 penetrates the housing 1101 along the width direction perpendicular to the height direction from one place on the side surface 1113 of the body portion 1106 to another place. Therefore, there are two openings 1116 of the second flow path 1111 on the side surface 1113 of the housing 1101.
  • the second through hole 1115 branches from the middle of the first through hole 1114 and penetrates the housing 1101 along the height direction to the bottom surface 1108 of the recess 1107.
  • the width direction is a direction along a plane perpendicular to the height direction.
  • the width direction is not limited to one of the plane directions of the plane perpendicular to the height direction.
  • the third flow path 1112 penetrates the housing 1101 from one location on the one end 1104 side of the side surface 1113 of the body portion 1106 to the bottom surface 1108 of the recess 1107 with respect to the opening 1116 of the second flow path 1111.
  • the third flow path 1112 has a third through hole 1117 and a fourth through hole 1118.
  • the third through hole 1117 penetrates the housing 1101 along the width direction from one of the side surfaces 1113 of the body portion 1106 to the other. Therefore, there are two openings 1119 in the third flow path 1112 on the side surface 1113 of the housing 1101.
  • the fourth through hole 1118 branches from the middle of the third through hole 1117 and penetrates the housing 1101 along the height direction to the bottom surface 1108 of the recess 1107.
  • the second through hole 1115 of the second flow path 1111 and the fourth through hole 1118 of the third flow path 1112 are connected to the bottom surface 1108 of the recess 1107.
  • the valve device 1100 is housed in the housing unit 1200.
  • the accommodating portion 1200 is a bottomed tubular metal part.
  • the accommodating portion 1200 has a hollow portion 1201 along the height direction.
  • the accommodating portion 1200 is omitted.
  • the valve device 1100 is arranged in the hollow portion 1201 so that the side of the one end portion 1104 of the housing 1101 is located on the side of the bottom portion 1202 of the housing portion 1200. Therefore, the valve device 1100 has a first groove portion 1120, a first seal portion 1121, a second groove portion 1122, a second seal portion 1123, a third groove portion 1124, and a third seal portion 1125.
  • the direction centered on the axis along the height direction is defined as the circumferential direction.
  • first groove portion 1120 a part of the side surface 1113 of the housing 1101 is formed along the circumferential direction.
  • the first groove portion 1120 is a portion recessed inside the housing 1101.
  • the first groove portion 1120 is provided on the one end portion 1104 side of the side surface 1113 of the housing 1101 with respect to the opening portion 1119 of the third flow path 1112.
  • the first seal portion 1121 is arranged in the first groove portion 1120.
  • the first seal portion 1121 comes into contact with the inner wall surface 1203 constituting the hollow portion 1201 of the accommodating portion 1200.
  • the first seal portion 1121 has a first space portion 1204 on the side of one end portion 1104 of the hollow portion 1201 of the accommodating portion 1200 and a second space portion 1205 on the side of the opening 1119 of the third flow path 1112. And, separate.
  • the second groove portion 1122 a part of the side surface 1113 of the housing 1101 is formed along the circumferential direction.
  • the second groove portion 1122 is a portion recessed inside the housing 1101.
  • the second groove portion 1122 is provided between the opening portion 1119 of the third flow path 1112 and the opening portion 1116 of the second flow path 1111 in the side surface 1113 of the housing 1101 in the height direction.
  • the second seal portion 1123 is arranged in the second groove portion 1122.
  • the second seal portion 1123 comes into contact with the inner wall surface 1203 of the accommodating portion 1200.
  • the second seal portion 1123 separates the second space portion 1205 of the hollow portion 1201 of the accommodating portion 1200 and the third space portion 1206 on the side of the opening 1116 of the second flow path 1111.
  • the third groove portion 1124 is a portion in which the outer edge portion of the other end surface 1126 of the other end portion 1105 is recessed toward the one end portion 1104. That is, the third groove portion 1124 is a portion in which the corner portion composed of the other end surface 1126 and the side surface 1113 of the housing 1101 is recessed in a stepped shape. It can be said that the height direction is perpendicular to the other end surface 1126 of the other end 1105.
  • the third seal portion 1125 is arranged in the third groove portion 1124.
  • the third seal portion 1125 comes into contact with the inner wall surface 1203 of the accommodating portion 1200.
  • the third seal portion 1125 separates the third space portion 1206 and the other end surface 1126 side of the hollow portion 1201 of the accommodating portion 1200.
  • the opening 1119 of the third flow path 1112 is formed in a part of the step portion 1129 on the side of the first groove portion 1120 constituting the second groove portion 1122. That is, the second groove portion 1122 has a chipped portion 1130 in which a part of the stepped portion 1129 is chipped. Since the openings 1119 of the third flow path 1112 are provided at two locations, the chipped portions 1130 are also provided at two locations.
  • the first range is from the other end surface 1126 of the housing 1101 to the end of the stepped portion 1127 of the third groove portion 1124.
  • the second range is from the end of the step portion 1127 of the third groove portion 1124 to the end of the step portion 1129 of the second groove portion 1122.
  • the third range is from the end of the step portion 1129 of the second groove portion 1122 to the tip of the one end portion 1104.
  • the size of the housing 1101 in the width direction is gradually reduced in the order of the first range, the second range, and the third range. That is, the housing 1101 has a conical shape.
  • the first seal portion 1121, the second seal portion 1123, and the third seal portion 1125 are, for example, O-rings.
  • the size of the O-ring varies depending on the size of the housing 1101 in the width direction.
  • the hollow portion 1201 of the accommodating portion 1200 is formed so as to fit the size of the housing 1101 in the width direction. Further, the accommodating unit 1200 has a first introduction unit 1207, a second introduction unit 1208, and a discharge unit 1209.
  • the first introduction unit 1207 inputs the first fluid 200 to the first space unit 1204 of the accommodating unit 1200.
  • the second introduction unit 1208 inputs the second fluid 201 to the third space unit 1206.
  • the discharge unit 1209 outputs the mixed fluid 202 from the second space unit 1205.
  • the first introduction section 1207, the second introduction section 1208, and the discharge section 1209 are passages provided in the accommodating section 1200.
  • Terminal 1102 is a wiring component having a first end portion 1131 and a second end portion 1132.
  • the terminal 1102 is insert-molded into the housing 1101 so that the first end portion 1131 and the second end portion 1132 are exposed.
  • the first end 1131 of the terminal 1102 is exposed from the bottom surface 1108 of the recess 1107.
  • the recess 1107 of the housing 1101 has a recess 1133.
  • the recessed portion 1133 is a portion in which a part of the bottom surface 1108 is recessed toward the other end portion 1105. As shown in FIG. 30, the first end 1131 of the terminal 1102 is exposed from the recess 1133.
  • the second end portion 1132 of the terminal 1102 is exposed from the other end surface 1126 of the other end portion 1105 of the housing 1101.
  • the terminal 1102 inputs electric power from the second end 1132 and supplies the electric power to the MEMS device 1103.
  • the housing 1101 has an annular lid 434 on which the window 1134 is formed.
  • the lid portion 434 is arranged on the other end surface 1126 of the housing 1101.
  • the lid portion 434 sandwiches the third seal portion 1125 together with the third groove portion 1124 in the height direction. Then, it is accommodated in the hollow portion 1201 of the accommodating portion 1200 together with the housing 1101.
  • the accommodating portion 1200 has an annular lid portion 1211 on which the window portion 1210 is formed.
  • the lid portion 1211 is fixed to the open end 1212 of the accommodating portion 1200 by caulking, screwing, welding or the like.
  • the second end 1132 of the terminal 1102 projects from the lid 1211 by being passed through the window 1134 of the lid 434 and the window 1210 of the lid 1211.
  • the MEMS device 1103 is arranged on the bottom surface 1108 of the recess 1107 of the housing 1101.
  • the support plate 1137 is fixed to the bottom surface 1108 of the recess 1107 at the second joint portion 148.
  • the first passage 1155 of the element unit 1136 is connected to the input port 1109 and the recess 1107 that form the first passage 1110 of the housing 1101.
  • the second passage 1156 of the element unit 1136 is connected to the second through hole 1115 constituting the second passage 1111 of the housing 1101.
  • the first fluid 200 and the second fluid 201 flowing into the intermediate layer 1144 are mixed to generate a mixed fluid 202.
  • the mixed fluid 202 becomes a third pressure (Pout).
  • the mixed fluid 202 is output to the third passage 1157 formed in the lower layer 1143.
  • the third passage 1157 is connected to the fourth through hole 1118 constituting the third flow path 1112.
  • the MEMS device 1103 is arranged on the bottom surface 1108 with the back surface 1141 side of the element unit 1136 facing the bottom surface 1108 of the recess 1107.
  • the support plate 1137 is fixed to the bottom surface 1108 of the recess 1107 by the second joint 148.
  • the second passage 1156 is connected to the second through hole 1115 of the second flow path 1111
  • the third passage 1157 is connected to the fourth through hole 1118 of the third flow path 1112.
  • the first passage 1155 of the MEMS device 1103 is connected to the input port 1109 of the recess 1107.
  • the tip 1158 of the electrode portion 1138 of the MEMS device 1103 is electrically connected to the first end 1131 of the terminal 1102 at the recess 1133 of the bottom 1202 of the recess 1107.
  • the tip portion 1158 of the electrode portion 1138 and the first end portion 1131 of the terminal 1102 are resistance welded.
  • the housing 1101 has a potting material 1159.
  • the potting material 1159 is arranged in the recess 1133.
  • the potting material 1159 covers the connection portion between the first end portion 1131 and the electrode portion 1138 of the terminal 1102. As a result, the potting material 1159 protects the connection portion between the first end portion 1131 and the electrode portion 1138 of the terminal 1102 from the first fluid 200.
  • the terminal 1102 is fixed to an electric device such as a circuit board in a state of being housed in the housing unit 1200.
  • the first fluid 200 flows into the first space portion 1204 via the first introduction portion 1207 of the accommodating portion 1200.
  • the second fluid 201 flows into the third space portion 1206 via the second introduction portion 1208 of the accommodating portion 1200.
  • the first fluid 200 flows into the intermediate layer 1144 of the element portion 1136 via the input port 1109 of the recess 1107 and the first passage 1155 of the element portion 1136.
  • the second fluid 201 flows into the intermediate layer 1144 of the element portion 1136 via the second passage 1111 of the housing 1101 and the second passage 1156 of the element portion 1136.
  • the element unit 1136 displaces the movable unit 1154 based on the electric power input to the electrodes 1147 and 1148. As a result, the passage cross-sectional area of the first passage 1155 and the second passage 1156 changes.
  • the second passage 1156 of the second fluid 201 is always open, and only the passage cross-sectional area of the first passage 1155 of the first fluid 200 changes.
  • the first passage 1155 of the first fluid 200 may be always open, and only the passage cross-sectional area of the second passage 1156 of the second fluid 201 may be changed. Alternatively, the passage cross-sectional area of both the first passage 1155 and the second passage 1156 may be changed according to the displacement of the movable portion 1154.
  • the element unit 1136 mixes the first fluid 200 and the second fluid 201 that have flowed into the intermediate layer 1144 to generate the mixed fluid 202.
  • the third pressure of the mixed fluid 202 is a pressure in the range of the first pressure> the third pressure> the second pressure. Therefore, the element unit 1136 adjusts the third pressure by displacing the movable unit 1154.
  • the mixed fluid 202 of the third pressure flows out to the second space portion 1205 via the third passage 1157 of the element portion 1136 and the third passage 1112 of the housing 1101.
  • the mixed fluid 202 is discharged to the discharge unit 1209.
  • the housing 1101 is resin-molded and the terminal 1102 is insert-molded into the housing 1101. Therefore, an electrode component for connecting the terminal and the electric device becomes unnecessary. Therefore, the size of the valve device 1100 in the length direction, that is, the height direction of the terminal 1102 can be reduced.
  • the housing 1101 is made of resin, the configuration and parts for insulating the housing 1101 and the terminal 1102 are not required. Therefore, the size of the valve device 1100 in the direction perpendicular to the length direction of the terminal 1102, that is, in the width direction can be reduced. Therefore, the overall body shape of the valve device 1100 can be reduced.
  • the MEMS device 1103 is arranged in the recess 1107. Therefore, the size in the height direction can be reduced as compared with the case where the MEMS device 1103 is arranged on one end surface of the one end portion 1104 of the housing 1101.
  • the second pressure of the second fluid 201 inside the first through hole 1114 becomes pressure-free in the width direction. Therefore, the second pressure is only applied in the height direction.
  • the third pressure of the mixed fluid 202 inside the third through hole 1117 becomes pressure-free in the width direction, the third pressure is only applied in the height direction. Therefore, the load on the housing 1101 is smaller than the shape in which the second flow path 1111 and the third flow path 1112 do not branch inside the housing 1101.
  • third pressure> second pressure pressure is applied to the third seal portion 1125 on the other end portion 1105 side of the housing 1101. Therefore, even if the chipped portion 1128 is formed in the stepped portion 1127 of the third groove portion 1124, the portion of the third seal portion 1125 corresponding to the chipped portion 1128 is less likely to be deformed along the shape of the chipped portion 1128. That is, the opening 1116 of the second flow path 1111 does not have to be located closer to the second groove portion 1122 than the step portion 1127. In other words, in order to provide the opening 1116 of the second flow path 1111 in the housing 1101, it is not necessary to consider the size of the housing 1101 in the height direction.
  • the relationship between the opening 1119 of the third flow path 1112 and the stepped portion 1129 of the second groove 1122 is the same. Therefore, the size of the housing 1101 can be reduced by the height of the step portion 1127 of the third groove portion 1124 and the height of the step portion 1129 of the second groove portion 1122 in the height direction.
  • the MEMS device 1103 is located in the first space portion 1204 of the accommodating portion 1200. Therefore, since a part of the element unit 1136 comes into contact with the first fluid 200, the element unit 1136 can be cooled by the first fluid 200.
  • the expansion valve 1213 has a valve device 1100, an accommodating portion 1200, a main valve 1214, and a coil spring 1215.
  • the accommodating portion 1200 has a hollow portion 1216 in which the main valve 1214 and the coil spring 1215 are accommodated, a high-pressure flow path 1217 connected to the hollow portion 1216, a low-pressure flow path 1218, and an output flow path 1219.
  • a part of the high-pressure flow path 1217 is connected to the first introduction unit 1207 of the accommodating unit 1200.
  • the high-pressure flow path 1217 is connected to the first space portion 1204 of the hollow portion 1201.
  • the refrigerant as the first fluid 200 flowing through the high-pressure flow path 1217 flows into the MEMS device 1103 of the valve device 1100. Therefore, the MEMS device 1103 is located in the high pressure first fluid 200 and is cooled by the first fluid 200.
  • a part of the low pressure flow path 1218 is connected to the second introduction section 1208 of the accommodating section 1200.
  • the low pressure flow path 1218 is connected to the third space portion 1206 of the hollow portion 1201.
  • the refrigerant as the second fluid 201 flowing through the low-pressure flow path 1218 flows into the MEMS device 1103 of the valve device 1100.
  • the output flow path 1219 outputs the mixed fluid 202 of the first fluid 200 and the second fluid 201 to the hollow portion 1220.
  • the third pressure of the mixed fluid 202 is a pressure in the range from the first pressure to the second pressure.
  • the main valve 1214 adjusts the opening degree of the refrigerant passage 1221 based on the third pressure of the mixed fluid 202.
  • the main valve 1214 has a height direction according to the magnitude relationship between the force of the coil spring 1215 pushing the main valve 1214 toward the valve device 1100 and the force of the mixed fluid 202 pushing the main valve 1214 toward the coil spring 1215. Displace to.
  • the displacement amount of the main valve 1214 is adjusted by controlling the displacement amount of the movable portion 1154 of the valve device 1100 by the control device that controls the refrigeration cycle. As a result, the passage cross-sectional area of the refrigerant passage 1221 changes. Therefore, the refrigerant is depressurized when passing through the refrigerant passage 1221 from the high pressure flow path 1217 and discharged to the low pressure flow path 1218.
  • the main valve 1214 when the third pressure of the mixed fluid 202 is weaker than the force of the coil spring 1215, the main valve 1214 is displaced to a position where the passage cross-sectional area of the refrigerant passage 1221 is reduced. Conversely, as shown in FIG. 32, when the third pressure of the mixed fluid 202 is stronger than the force of the coil spring 1215, the main valve 1214 is displaced to a position where the passage cross-sectional area of the refrigerant passage 1221 increases.
  • valve device 1100 can be used as a pilot valve for the in-vehicle expansion valve 1213.
  • the housing 1101 may have a pillar shape other than a cylinder shape.
  • the housing 1101 may be an elliptical column or a polygonal column.
  • the size of the housing 1101 in the width direction from one end 1104 to the other end 1105 may be constant.
  • the first passage 1155 of the element unit 1136 may be provided in the upper layer 1142.
  • the input port 1109 may not be formed in the recess 1107 of the housing 1101.
  • the second flow path 1111 and the third flow path 1112 may be formed as a single road. That is, the second flow path 1111 and the third flow path 1112 do not have to have a branch path.
  • each seal portion 1121, 1123, 1125 may be other than an O-ring.
  • an adhesive may be used as each of the sealing portions 1121, 1123, and 1125.
  • the first flow path 1110 is not limited to the recess 1107 and the input port 1109.
  • the first flow path 1110 may be a through hole formed in the housing 1101, similarly to the second flow path 1111 and the third flow path 1112.
  • the lid 434 does not have to be annular.
  • the lid 434 may have two windows 1134 through which the second end 1132 of the terminal 1102 passes.
  • the lid portion 1211 does not have to be annular.
  • the lid 434 may have two windows 1210 through which the second end 1132 of the terminal 1102 passes.
  • the valve device 1100 can be used not only for in-vehicle use but also as a valve for a hydraulic system. That is, the first fluid 200, the second fluid 201, and the mixed fluid 202 are oils.
  • the relationship between the first pressure, the second pressure, and the third pressure is not limited to the above.
  • the second flow path 1111 may be used for output and the third flow path 1112 may be used for input.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Micromachines (AREA)
  • Valve Housings (AREA)

Abstract

L'invention concerne un appareil à soupape (1100) comprenant un boîtier en résine (1101), un dispositif MEMS (1103) et une borne (1102). Le boîtier comprend: un premier canal d'écoulement (1110) pour la circulation d'un premier fluide à l'intérieur; un deuxième canal d'écoulement (1111) pour la circulation d'un second fluide à l'intérieur; et un troisième canal d'écoulement (1112) pour la circulation d'un mélange fluide des premier et second fluides. Le dispositif MEMS est fixé au boîtier. Le dispositif MEMS comporte une partie électrode (1138). La borne est moulée par insertion dans le boîtier de sorte qu'une première extrémité (1131) de la borne et une seconde extrémité (1132) de celle-ci disposée sur un côté opposé à la première extrémité sont toutes deux exposées hors du boîtier. Dans la borne, la première extrémité est électriquement connectée à la partie d'électrode, tandis que de l'énergie électrique est introduite à partir de la seconde extrémité et fournie au dispositif MEMS.
PCT/JP2020/047661 2019-12-26 2020-12-21 Appareil à soupape et dispositif de microsystème électromécanique (mems) WO2021132151A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202080089697.8A CN114867682A (zh) 2019-12-26 2020-12-21 阀装置以及mems装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-235646 2019-12-26
JP2019235647A JP2021104546A (ja) 2019-12-26 2019-12-26 Ｍｅｍｓ装置
JP2019235646A JP2021105404A (ja) 2019-12-26 2019-12-26 バルブ装置
JP2019-235647 2019-12-26

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WO2021132151A1 true WO2021132151A1 (fr) 2021-07-01

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6540203B1 (en) * 1999-03-22 2003-04-01 Kelsey-Hayes Company Pilot operated microvalve device
JP2004501330A (ja) * 2000-06-20 2004-01-15 ケルシー　ヘイズ　カンパニー 電子制御式トランスミッションのためのマイクロバルブ
JP2007512489A (ja) * 2003-11-24 2007-05-17 アルーマナ、マイクロウ、エルエルシー 可変容量形コンプレッサの制御に適したマイクロバルブ・デバイス
US20150153081A1 (en) * 2013-12-04 2015-06-04 Zhejiang Dunan Hetian Metal Co., Ltd. Control element and check valve assembly
US20160123498A1 (en) * 2014-10-30 2016-05-05 Dunan Microstaq, Inc. Micro-electric mechanical system control valve and method for controlling a sensitive fluid

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6540203B1 (en) * 1999-03-22 2003-04-01 Kelsey-Hayes Company Pilot operated microvalve device
JP2004501330A (ja) * 2000-06-20 2004-01-15 ケルシー　ヘイズ　カンパニー 電子制御式トランスミッションのためのマイクロバルブ
JP2007512489A (ja) * 2003-11-24 2007-05-17 アルーマナ、マイクロウ、エルエルシー 可変容量形コンプレッサの制御に適したマイクロバルブ・デバイス
US20150153081A1 (en) * 2013-12-04 2015-06-04 Zhejiang Dunan Hetian Metal Co., Ltd. Control element and check valve assembly
US20160123498A1 (en) * 2014-10-30 2016-05-05 Dunan Microstaq, Inc. Micro-electric mechanical system control valve and method for controlling a sensitive fluid

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