WO2021081988A1 - 显示模组和显示装置 - Google Patents

显示模组和显示装置 Download PDF

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Publication number
WO2021081988A1
WO2021081988A1 PCT/CN2019/115063 CN2019115063W WO2021081988A1 WO 2021081988 A1 WO2021081988 A1 WO 2021081988A1 CN 2019115063 W CN2019115063 W CN 2019115063W WO 2021081988 A1 WO2021081988 A1 WO 2021081988A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
bonding
area
display substrate
Prior art date
Application number
PCT/CN2019/115063
Other languages
English (en)
French (fr)
Inventor
黄小霞
纪冰
张爽
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/977,642 priority Critical patent/US11943989B2/en
Priority to PCT/CN2019/115063 priority patent/WO2021081988A1/zh
Priority to CN201980002257.1A priority patent/CN113068408A/zh
Priority to JP2021568844A priority patent/JP7428729B2/ja
Priority to EP19949544.1A priority patent/EP4053624A4/en
Publication of WO2021081988A1 publication Critical patent/WO2021081988A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/868—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the embodiment of the present disclosure relates to a display module and a display device.
  • Organic Light Emitting Diode (OLED) display devices have the characteristics of wide viewing angle, high contrast, and fast response speed. In addition, compared with inorganic light-emitting display devices, organic light-emitting diode display devices have advantages such as higher light-emitting brightness and lower driving voltage. Due to the above-mentioned characteristics and advantages, organic light-emitting diode (OLED) display devices have gradually received widespread attention and can be applied to devices with display functions such as mobile phones, displays, notebook computers, digital cameras, and instrumentation.
  • At least one embodiment of the present disclosure provides a display module including: a first flexible circuit board, a display substrate, and a touch sensor provided on the display side of the display substrate.
  • the display substrate has a flat area and curved areas on both sides of the flat area in a first direction; the touch sensor has a first side on a first side in a second direction that crosses the first direction.
  • the second bonding connection part and the second bonding area are bonded and electrically connected to each other.
  • the first bonding connection portion and the second bonding connection portion of the first flexible circuit board are bent, and the main body portion of the first flexible circuit board is located The side of the display substrate away from the touch sensor.
  • the display module further includes: a driving chip located on a side of the display substrate away from the touch sensor.
  • the driving chip is configured to drive the display substrate; and the orthographic projection of the driving chip on the flat area of the display substrate is located at the first bonding connection part and the second bonding connection of the first flexible circuit board.
  • the connecting portion and the main body are in the area enclosed by the orthographic projection on the flat area of the display substrate, and are in contact with the first bonding connection portion, the second bonding connection portion and the main body of the first flexible circuit board.
  • the orthographic projections on the flat area of the display substrate are arranged at intervals.
  • the display substrate further includes: a substrate main body part and a folding part protruding from the substrate main body part on the first side; the substrate main body part includes all The flat area and the curved area; and the folded portion is bent to a side of the main body portion of the substrate away from the touch sensor.
  • the driving chip is located on a side of the folding part away from the touch sensor, and the driving chip is bonded on the folding part.
  • the display module further includes a second flexible circuit board, the second flexible circuit board is located on a side of the folding portion away from the main body portion of the substrate and Bonded with the folding part, the driving chip is located on a side of the second flexible circuit board away from the folding part.
  • the display module further includes a third flexible circuit board.
  • the third flexible circuit board is located on a side of the display substrate away from the touch sensor; the first flexible circuit board and the third flexible circuit board are electrically connected to each other through bonding; and the second The third flexible circuit board and the second flexible circuit board are electrically connected to each other through bonding, or the third flexible circuit board and the driving chip are electrically connected to each other through bonding.
  • the display module further includes a fourth flexible circuit board.
  • the fourth flexible circuit board includes a third bonding connection part; the display substrate also includes a third bonding area located in the flat area; the third bonding area is connected to the first bonding area and the The second bonding area partially overlaps the orthographic projection of the flat area of the display substrate or the third bonding area is located in the orthographic projection of the first bonding area on the flat area of the display substrate and the first The second bonding area is between the orthographic projections of the flat area of the display substrate; and the fourth flexible circuit board is bonded to the display substrate via the third bonding connection portion and the third bonding area And electrical connection.
  • the fourth flexible circuit board further includes a main body connected to the third bonding connection part; and a third bonding of the fourth flexible circuit board The connecting portion is bent, and the main body of the fourth flexible circuit board is located on a side of the display substrate away from the touch sensor.
  • the fourth flexible circuit board further includes the driver chip, and the driver chip is located on the main body of the fourth flexible circuit board away from the touch sensor. On the side.
  • the display module further includes a third flexible circuit board.
  • the third flexible circuit board is located on a side of the display substrate away from the touch sensor; the first flexible circuit board and the third flexible circuit board are electrically connected to each other through bonding; and the second The third flexible circuit board and the fourth flexible circuit board are electrically connected to each other through bonding.
  • the main body of the first flexible circuit board is located on a side of the third flexible circuit board away from the display substrate; the first flexible circuit board is also It includes an electrical connection area protruding from the main body portion, and the electrical connection area of the first flexible circuit board is located on the main body portion of the first flexible circuit board away from the first bonding connection portion and the second Bonding one side of the connecting portion; the electrical connection area of the first flexible circuit board and the third flexible circuit board at least partially overlap in a direction perpendicular to the display substrate; and the first flexible circuit board passes through The electrical connection area and the third flexible circuit board are bonded to be electrically connected to each other.
  • the display module further includes a bonding support structure and a cover plate.
  • the bonding support structure overlaps the first bonding connection portion and the second bonding connection portion in a direction perpendicular to the flat area of the display substrate, and is located on the first flexible circuit board
  • the part of the first bonding connection part that is in contact with the touch sensor is on the side away from the touch sensor;
  • the cover plate is located on the display side of the display substrate, and is located far away from the touch sensor One side of the display substrate; and the bonding support structure is sandwiched between the first flexible circuit board and the cover plate.
  • the bonding support structure is a foam layer or a polyethylene terephthalate layer.
  • the display module further includes a polarizer.
  • the polarizer is located between the touch sensor and the cover plate; the sum of thicknesses of the bonding support structure and the first bonding connection portion in a direction perpendicular to the flat area of the display substrate It is substantially equal to the thickness of the distance between the touch sensor and the cover plate in a direction perpendicular to the flat area of the display substrate.
  • the display module further includes an adhesive layer.
  • the adhesive layer is located between the cover plate and the polarizer; the sum of thicknesses of the bonding support structure and the first bonding connection portion in a direction perpendicular to the flat area of the display substrate It is substantially equal to the sum of the thickness of the polarizer and the adhesive layer in a direction perpendicular to the flat area of the display substrate.
  • At least one embodiment of the present disclosure further provides a display device, which includes any display module provided in at least one embodiment of the present disclosure.
  • Figure 1 is a front view of a display module
  • FIG. 2A is a front view of the touch sensor and the first flexible circuit board of the display module shown in FIG. 1;
  • FIG. 2B is a front view of the display substrate and the fourth flexible circuit board of the display module shown in FIG. 1;
  • FIG. 2C is a schematic cross-sectional view of the display module shown in FIG. 1;
  • FIG. 2D is another schematic cross-sectional view of the display module shown in FIG. 1;
  • FIG. 3A is a back view of the display module shown in FIG. 1;
  • Figure 3B is a back view of another display module
  • Figure 4A is a front view of yet another display module
  • FIG. 4B is a top view of the display module shown in FIG. 4A;
  • FIG. 4C is a back view of the display module shown in FIG. 4A;
  • FIG. 5 is a front view of a display module provided by at least one embodiment of the present disclosure.
  • FIG. 6A is a front view of the display substrate and the fourth flexible circuit board of the display module shown in FIG. 5;
  • FIG. 6B is an example of the display substrate shown in FIG. 6A;
  • FIG. 7A is a front view of the touch sensor and the first flexible circuit board of the display module shown in FIG. 5;
  • FIG. 7B is an example of the touch sensor shown in FIG. 7A;
  • FIG. 8 is a schematic cross-sectional view of the display module shown in FIG. 5;
  • FIG. 9 is another schematic cross-sectional view of the display module shown in FIG. 5;
  • FIG. 10 is a back view of the display module shown in FIG. 5;
  • FIG. 11 is a front view of a touch sensor and a first flexible circuit board of another display module provided by at least one embodiment of the present disclosure
  • FIG. 12 is a back view of the display module shown in FIG. 11;
  • FIG. 13 is a front view of still another display module provided by at least one embodiment of the present disclosure.
  • FIG. 14A is a front view of the display substrate and driving chip of the display module shown in FIG. 13;
  • FIG. 14B is an example of the display substrate and driving chip shown in FIG. 14A;
  • 14C is a front view of the touch sensor and the first flexible circuit board of the display module shown in FIG. 13;
  • FIG. 15 is a schematic cross-sectional view of the display module shown in FIG. 13;
  • FIG. 16 is another schematic cross-sectional view of the display module shown in FIG. 13;
  • FIG. 17 is a back view of the display module shown in FIG. 13;
  • 18A is a front view of a display substrate and a second flexible circuit board of still another display module provided by at least one embodiment of the present disclosure
  • FIG. 18B is an example of the display substrate and the second flexible circuit board shown in FIG. 18A;
  • Figure 19 is a back view of the display module shown in Figure 18A.
  • FIG. 20 is an exemplary block diagram of a display device provided by at least one embodiment of the present disclosure.
  • FIG. 1 is a front view of a display module (that is, a schematic plan view obtained from the front view of the display module).
  • the display module may be an active matrix organic light emitting diode display screen, and the display screen is a non-curved screen.
  • the display module includes a display substrate 501 (for example, an organic light emitting diode display panel) and a touch sensor 502 provided on the display side of the display substrate 501.
  • the display module further includes a first flexible circuit board 504 (that is, a touch sensor circuit board) and a fourth flexible circuit board 505 (for example, a chip on film). It should be noted that the first flexible circuit board 504 and the fourth flexible circuit board 505 of the display module shown in FIG. 1 are not in a bent state.
  • FIG. 2A is a front view of the touch sensor 502 and the first flexible circuit board 504 of the display module shown in FIG. 1. It should be noted that the first flexible circuit board 504 shown in FIG. 2A is not in a bent state. As shown in FIG. 2A, the second direction D2 has a first side 591 and a second side 592, the touch sensor 502 includes a first bonding area 503 on the first side 591, and the first flexible circuit board 504 only passes through the first The fixed area 503 is electrically connected to the touch sensor 502.
  • FIG. 2B is a front view of the display substrate 501 and the fourth flexible circuit board 505 of the display module shown in FIG. 1. It should be noted that the fourth flexible circuit board 505 shown in FIG. 2B is not in a bent state. As shown in FIG. 2B, the display substrate 501 includes a second bonding area 593 on the first side 591, and the fourth flexible circuit board 505 is electrically connected to the display substrate 501 via the second bonding area 593. As shown in FIG. 2B, the fourth flexible circuit board 505 further includes a driving chip 506.
  • FIG. 2C is a schematic cross-sectional view of the display module shown in FIG. 1, and the schematic cross-sectional view shown in FIG. 2C is cut along the line AA' of FIG. 1.
  • the first flexible circuit board 504 and the fourth flexible circuit board 505 of the display module shown in FIG. 1 are not in a bent state.
  • the touch sensor 502 and the display substrate 501 are superimposed on the third direction D3, and the touch sensor 502 is located on the display side of the display substrate 501 (that is, the light-emitting side or the image output side) in the third direction D3. side).
  • FIG. 2D is another schematic cross-sectional view of the display module shown in FIG. 1, compared with the schematic cross-sectional view shown in FIG. 2C, in the schematic cross-sectional view shown in FIG. 2D, the first flexible circuit board 504 and the fourth flexible circuit board 505 are in a bent state. As shown in Figure 2D, part of the fourth flexible circuit board 505 (the main body of the fourth flexible circuit board 505) and part of the first flexible circuit board 504 are both bent to the back of the display substrate 501 (that is, the display substrate 501 The side away from the touch sensor 502).
  • the display module further includes a third flexible circuit board 507, and the third flexible circuit board 507 and the fourth flexible circuit board 505 are bonded and electrically connected to each other, so that the third flexible circuit board 507 can pass through the
  • the four flexible circuit board 505 controls the driving chip 506, and controls the display substrate 501 via the driving chip 506 to realize the display function;
  • the third flexible circuit board 507 is also electrically connected to the first flexible circuit board 504 via the electrical connection area 508 through bonding, by The third flexible circuit board 507 can control the touch sensor 502 via the first flexible circuit board 504 to realize a touch function.
  • the driving chip 506 is located on the side of the main body of the fourth flexible circuit board 505 away from the display substrate 501.
  • the first flexible circuit board 504 is located only on one side of the driving chip 506 in the first direction D1, that is, the first flexible circuit board 504 is connected to the touch sensor 502 in a single-sided wiring manner.
  • the first direction D1, the second direction D2, and the third direction D3 cross each other (for example, perpendicular to each other).
  • Figure 3A is a back view of another display module.
  • the shape, connection and arrangement of the first flexible circuit board 504, the fourth flexible circuit board 505, and the third flexible circuit board 507 can also adopt the example shown in FIG. 3B.
  • the inventors of the present disclosure have noticed in their research that the first flexible circuit board 504 shown in FIG. 1 is connected to the touch sensor 502 via a single-sided wiring method, which is not suitable for display modules with curved areas ( For example, curved screen), the following is an exemplary description with reference to Figs. 4A-4C.
  • FIG. 4A is a front view of another display module 600.
  • the display module 600 has a flat area 601 and a curved area 602 located on both sides of the flat area 601 in the first direction D1.
  • FIG. 4B is a top view of the display module 600 shown in FIG. 4A. As shown in FIG. 4B, the curved area 602 of the display module 600 is bent from the front of the display module 600 toward the back of the display module 600.
  • FIG. 4C is a back view of the display module 600 shown in FIG. 4A.
  • the display module 600 includes a display substrate (not shown in the figure), a touch sensor (not shown in the figure), a first flexible circuit board (that is, a touch sensor circuit board, in the figure) Not shown), the fourth flexible circuit board 606 and the third flexible circuit board 607.
  • the touch sensor is arranged on the display side of the display substrate; the first flexible circuit board (that is, the touch sensor circuit board) is bonded to the touch sensor to be electrically connected to the touch sensor, and the third flexible circuit board 607 is connected to the touch sensor.
  • the first flexible circuit board is bonded and thus electrically connected to the first flexible circuit board, so that the third flexible circuit board 607 can control the touch sensor via the first flexible circuit board to realize the touch function; the fourth flexible circuit board 606 and The display substrate of the display module 600 is bonded and electrically connected to the display substrate, so that the driving chip 605 included in the fourth flexible circuit board 606 can control the display substrate to realize the display function via the fourth flexible circuit board 606; the third flexible circuit board 607 is bonded to the fourth flexible circuit board 606 to thereby be electrically connected, so that the third flexible circuit board 607 can be electrically connected to the driving chip 605 via the fourth flexible circuit board 606.
  • the third flexible circuit board 607 includes a main body portion 6071 and a connecting portion 6072 protruding from the main body portion 6071.
  • the portion of the fourth flexible circuit board 606 that is bent to the back of the display substrate (the main body portion of the fourth flexible circuit board 606), the driver chip 605, and the main body portion 6071 of the third flexible circuit board 607 are all provided In the flat area 601, this is because the material of the main body of the fourth flexible circuit board 606, the driving chip 605, and the main body 6071 of the third flexible circuit board 607 are relatively hard.
  • the main body portion 6071 of the third flexible circuit board 607 are arranged in the flat area 601 to avoid defects caused by bending the main body portion of the fourth flexible circuit board 606, the driving chip 605, and the main body portion 6071 of the third flexible circuit board 607.
  • the inventors of the present disclosure have noticed in their research that for the display module 600 with the curved area 602 (for example, a curved screen), the display module 600 with the curved area 602 is reserved for the first flexible circuit board ( That is, the layout space (the wiring space of the first flexible circuit board) of the touch sensor circuit board is small.
  • the driving chip 605 is the core electronic component of the display module 600, in order to avoid defects caused by the hard material covering the driving chip 605, it is necessary to prevent the first flexible circuit board from covering the driving chip 605.
  • the multiple traces of the driving chip 605 bonded to the display substrate via the fourth flexible circuit board 606 respectively extend along the second direction D2 and are arranged side by side along the first direction D1; in order to avoid large differences in the length of the multiple traces Potential electrical unevenness and uneven brightness of the display substrate along the first direction D1, the center of the driving chip 605 in the first direction D1 overlaps or is close to the center of the display substrate in the first direction D1.
  • the display module 600 since the display module 600 includes the curved area 602, the size of the flat area 601 in the first direction D1 is relatively small.
  • the driving chip 605 in the first direction D1 overlaps or is close to the center of the display substrate in the first direction D1, and the first flexible circuit board does not cover the driving chip 605, the driving chip 605 is in the first direction.
  • the size of the distance between any end of D1 and the corresponding virtual dividing line (that is, the wiring area PWL that can be used for the first flexible circuit board) is relatively small.
  • the wiring area PWL of the board in the first direction D1 cannot meet the wiring requirements of the first flexible circuit board (for example, the first flexible circuit board can only be bonded to part of the wiring of the touch sensor).
  • the display module includes a first flexible circuit board, a display substrate, and a touch sensor arranged on the display side of the display substrate.
  • the display substrate has a flat area in the first direction and a curved area located on both sides of the flat area;
  • the touch sensor has a first bonding area and a second bonding area on a first side in a second direction that crosses the first direction Area;
  • the first bonding area and the second bonding area are located on the surface of the touch sensor on the side away from the display substrate, overlapping the flat area and spaced apart from each other;
  • the first flexible circuit board passes through the first bonding area and the second
  • the second bonding area is electrically connected to the touch sensor;
  • the first flexible circuit board includes a main body, and a first bonding connection part and a second bonding connection part protruding from the main body and spaced apart from each other; and a first bonding connection part
  • the first bonding area is bonded and electrically connected to each other, and the second bonding
  • FIG. 5 is a front view of a display module 100 provided by at least one embodiment of the present disclosure.
  • the display module 100 may be an active matrix organic light emitting diode display screen.
  • the display module 100 includes a display substrate 110 (for example, an organic light emitting diode display panel) and a touch sensor 120 provided on the display side of the display substrate 110.
  • the display module 100 further includes a first flexible circuit board 130 (that is, a touch sensor circuit board) and a fourth flexible circuit board 150 (for example, a chip on film).
  • the first flexible circuit board 130 and the fourth flexible circuit board 150 of the display module 100 shown in FIG. 5 are not in a bent state.
  • the top view of the display module 100 shown in FIG. 5 may be similar to the top view of the display module shown in FIG. 4B, and will not be repeated.
  • the second direction D2 intersecting the first direction D1 has a first side 191 and a second side 192.
  • the first side 191 and the second side 192 in the second direction D2 are used to illustrate the display module 100 and the components of the display module 100 on both sides of the second direction D2.
  • the first side 191 and the second side 192 of the second direction D2 may be used to represent the first side and the second side of the display module 100 in the second direction D2, respectively.
  • the first side 191 and the second side 192 of the second direction D2 may be used to represent the first side and the second side of the display substrate 110 in the second direction D2, respectively.
  • the first side 191 and the second side 192 of the second direction D2 may be used to represent the first side and the second side of the touch sensor 120 in the second direction D2, respectively.
  • FIG. 6A is a front view of the display substrate 110 and the fourth flexible circuit board 150 of the display module 100 shown in FIG. 5.
  • the display substrate 110 has a flat area 111 and a curved area 112 on both sides of the flat area 111 in the first direction D1.
  • the flat area 111, the curved area 112, and the bending start line 113 of the display substrate 110 correspond to the flat area, the curved area, and the bending start line of the display module 100, respectively.
  • FIG. 6B is an example of the display substrate 110 shown in FIG. 6A.
  • the display substrate 110 includes a plurality of display pixel units 115 arranged in an array, and the plurality of display pixel units 115 are not only arranged in the flat area 111, but also in two curved areas 112 on both sides of the flat area 111.
  • the plurality of display pixel units 115 may also be arranged only in the flat area 111 and not in the curved area 112.
  • each of the plurality of display pixel units 115 includes a pixel driving circuit 116 and a light emitting element 117 connected to the pixel driving circuit 116.
  • the light emitting element 117 is an organic light emitting element; for example, the organic light emitting element is an organic light emitting diode.
  • the pixel driving circuit 116 may be implemented as a 2T1C pixel driving circuit, that is, including two thin film transistors (ie, a driving transistor and a switching transistor) and a storage capacitor, but the embodiments of the present disclosure are not limited thereto.
  • the pixel driving circuit 116 may be implemented as a pixel driving circuit (for example, a 3T1C circuit) including other suitable numbers of transistors and capacitors.
  • the display substrate 110 further includes a plurality of gate lines GL and a plurality of data lines DL, and the plurality of gate lines GL and the plurality of data lines DL cross each other and define a plurality of display pixel units 115.
  • the data line DL is used to connect the source or drain of the switching transistor to provide a data signal for display to the switching transistor;
  • the gate line GL is used to connect to the gate of the switching transistor to provide a gate scan signal to the switching transistor.
  • the display substrate 110 further includes a third bonding area 114 located in the flat area 111 (for example, the third bonding area 114 is located on the first side 191 of the display module 100); the fourth flexible circuit board 150 includes The third bonding connection portion 151 and the fourth flexible circuit board 150 are bonded to the display substrate 110 via the third bonding connection portion 151 and the third bonding area 114 to be electrically connected to the display substrate 110.
  • the plurality of data lines DL of the display substrate 110 extend into the third bonding area 114 (one end of the plurality of data lines DL is located in the third bonding area 114) to be connected to the fourth flexible circuit
  • the third bonding connection part 151 of the board 150 is bonded.
  • the fourth flexible circuit board 150 further includes a main body portion 152 connected to the third bonding connection portion 151 and a driving chip 153 disposed on the main body portion 152 of the third bonding connection portion 151; the driving chip 153
  • the fourth flexible circuit board 150 is bonded to the display substrate 110 to thereby be electrically connected to the display substrate 110, so that the driving chip 153 included in the fourth flexible circuit board 150 can drive the display substrate 110 via the fourth flexible circuit board 150.
  • the driving chip 153 includes a data driver, a timing controller T-Con, etc., and the data driver of the driving chip 153 can provide data signals for display to a plurality of data lines DL via the fourth flexible circuit board 150.
  • the display module further includes a gate drive integration (GOA) on the array substrate, and multiple output terminals of the GOA are respectively connected to multiple gate lines GL to provide gate scan signals to the multiple gate lines GL.
  • GOA gate drive integration
  • the fourth flexible circuit board 150 (for example, the third bonding connection portion 151 of the fourth flexible circuit board 150) shown in FIG. 6A is not in a bent state;
  • the fourth flexible circuit board 150 (for example, the third bonding connection portion 151 of the fourth flexible circuit board 150) is in a bent state, and the main body portion 152 of the fourth flexible circuit board 150 is located far away from the display substrate 110.
  • the side of the control sensor 120 that is, it is bent to the back of the display substrate 110); the driving chip 153 is located on the side of the display substrate 110 away from the touch sensor 120 (for example, the driving chip 153 is located on the side of the fourth flexible circuit board 150).
  • the side of the main body 152 away from the touch sensor 120 these contents will be described in detail in the example shown in FIG. 9 and will not be repeated here.
  • FIG. 7A is a front view of the touch sensor 120 and the first flexible circuit board 130 of the display module 100 shown in FIG. 5. It should be noted that, for convenience of description, FIG. 7A also shows the bending start line 113 of the display substrate 110; it can be understood that the area of the touch sensor 120 located on both sides of the bending start line 113 is in the display module 100. The final product is in a bent state, that is, the area on both sides of the bending start line 113 of the touch sensor 120 is used as the curved area of the touch sensor 120 in the final product of the display module 100. As shown in FIGS.
  • the touch sensor 120 has a first bonding area 121 and a second bonding area 122 on a first side in a second direction that crosses the first direction; the first bonding area 121 And the second bonding area 122 are located on the surface of the touch sensor 120 far away from the display substrate 110, overlapping with the flat area 111 and spaced apart from each other, for example, the first bonding area 121 and the second bonding area 122 are both It does not overlap with the curved area 112.
  • the orthographic projection of the first bonding area 121 and the second bonding area 122 on the display substrate 110 is located in the flat area 111.
  • the third bonding area 114 overlaps the orthographic projection of the first bonding area 121 and the second bonding area 122 on the flat area 111 of the display substrate.
  • the third bonding area 114 is located between the orthographic projection of the first bonding area 121 on the flat area 111 of the display substrate and the orthographic projection of the second bonding area 122 on the flat area 111 of the display substrate.
  • first side of the touch sensor 120 in the second direction that crosses the first direction refers to the first side of the touch sensor 120 in the second direction; the touch sensor 120 is in the second direction
  • the first side of corresponds to the first side of the display module.
  • the touch sensor 120 has the first bonding area 121 and the second bonding area 122 on the first side 191 in the second direction D2 that crosses the first direction D1, the first bonding area 121 and the second The second bonding area 122 and the flat area 111 are overlapped and spaced apart from each other, and the first flexible circuit board 130 is electrically connected to the touch sensor 120 through the first bonding area 121 and the second bonding area 122, which can effectively utilize the display module.
  • the space on the back of the group 100 increases the size of the routing area available for the first flexible circuit board 130 (the overall width of the routing area available for the first flexible circuit board 130 in the first direction D1), so that the display can be displayed
  • the module 100 has a curved area and realizes the bonding connection between the first flexible circuit board 130 and the touch sensor 120 without changing the position of the driving chip 153 in the first direction D1, thereby avoiding changing the driving chip 153
  • the position in the first direction D1 causes potential electrical unevenness and brightness unevenness of the display substrate 110 along the first direction D1.
  • FIG. 7B is an example of the touch sensor 120 shown in FIG. 7A.
  • the touch sensor 120 is an add-on mode touch panel (Add-on Mode Touch Panel), which is produced separately from the display substrate, and then attached to the display side of the display substrate.
  • Add-on Mode Touch Panel add-on Mode Touch Panel
  • the touch sensor 120 includes a plurality of self-capacitance electrodes 123 arranged in an array and a plurality of wires 124 electrically connected to the plurality of self-capacitance electrodes 123, that is, the touch sensor 120 is a self-capacitance electrode 123.
  • Capacitive touch sensor As shown in FIG. 7B, a plurality of self-capacitance electrodes 123 are not only arranged in the flat area of the display module 100, but also arranged in the curved area of the display module 100, that is, the plurality of self-capacitance electrodes 123 are arranged on the display substrate.
  • the orthographic projection on 110 is not only in the flat area 111 but also in the two curved areas 112 on both sides of the flat area 111. It should be noted that in other examples, the plurality of self-capacitance electrodes 123 may also only overlap with the flat area 111 and not with the curved area 112, that is, the plurality of self-capacitance electrodes 123 are on the display substrate 110.
  • the orthographic projection is only located in the flat area 111 and not in the two curved areas 112 located on both sides of the flat area 111. For example, as shown in FIG. 7B, a part of the plurality of wires 124 extends to the first bonding area 121 of the touch sensor 120, and another portion of the plurality of wires 124 extends to the second bonding area 122 of the touch sensor 120.
  • the first flexible circuit board 130 includes a main body portion 131 and a first bonding connection portion 132 and a second bonding connection portion protruding from the main body portion 131 of the first flexible circuit board 130 and spaced apart from each other.
  • 133; the first bonding connection portion 132 and the first bonding area 121 (for example, with the wire 124 in the first bonding area 121) are bonded and electrically connected to each other, and the second bonding connection portion 133 is electrically connected to each other
  • the areas 122 (for example, with the wires 124 in the second bonding area 122) are bonded to be electrically connected to each other.
  • the first flexible circuit board 130 further includes a touch detection chip (not shown in the figure); for example, the touch detection chip is disposed on the main body 131 of the first flexible circuit board 130.
  • the touch detection chip is configured to apply driving signals to the plurality of self-capacitance electrodes 123 via the first flexible circuit board 130 and the plurality of wires 124
  • the touch detection chip is also configured to apply driving signals to the plurality of self-capacitance electrodes 123 via the first flexible circuit board 130 and
  • the plurality of wires 124 receive feedback signals provided by the plurality of self-capacitance electrodes 123, and based on the feedback signals, determine whether the self-capacitance electrodes 123 are touched and the positions (ie, touch positions) of the touched self-capacitance electrodes 123.
  • the first flexible circuit board 130 shown in FIG. 7 is not in a bent state.
  • the first flexible circuit board 130 is in a bent state, and the main body portion 131 of the first flexible circuit board 130 is located on the side of the display substrate 110 away from the touch sensor 120 (also That is, it is bent to the back of the display substrate 110), and the touch detection chip is located on the side of the main body 131 of the first flexible circuit board 130 away from the touch sensor 120.
  • the touch sensor 120 is not limited to being implemented as a self-capacitive touch screen, and may also not be limited to being implemented as a mutual-capacitive touch screen.
  • the touch sensor 120 may include two layers of strip electrodes that are different from each other and intersecting (each layer includes a plurality of strip electrodes arranged side by side), and the two layers of strip electrodes serve as the touch sensor 120 respectively.
  • Touch drive electrodes and touch sensing electrodes may be made of transparent conductive oxide.
  • the transparent conductive oxide may be indium tin oxide (Indium Tin Oxides, ITO).
  • a plurality of mutual capacitances arranged in an array are generated by coupling between touch driving electrodes and touch sensing electrodes that are on different sides and intersecting.
  • the capacitance value of the mutual capacitance located in the corresponding area of the finger will change.
  • the touch detection chip on the first flexible circuit board 130 can provide touch drive signals to the touch drive electrodes via the first flexible circuit board 130, and receive the touch provided by the touch sensing electrodes via the first flexible circuit board 130. Control induction signal.
  • the touch detection chip can determine the position of the finger touch point based on the change of the current corresponding to the multiple mutual capacitance values before and after the finger touch.
  • FIG. 8 is a schematic cross-sectional view of the display module 100 shown in FIG. 5, and the schematic cross-sectional view shown in FIG. 8 is cut along the line BB' of FIG.
  • the first flexible circuit board 130 and the fourth flexible circuit board 150 of the display module 100 shown in FIG. 8 are not in a bent state.
  • the touch sensor 120 and the display substrate 110 are overlapped in the third direction D3, and the touch sensor 120 is located on the display side of the display substrate 110 in the third direction D3 (that is, the light emitting side or the image output side).
  • the first direction D1, the second direction D2, and the third direction D3 cross each other (for example, perpendicular to each other).
  • FIG. 9 is another schematic cross-sectional view of the display module 100 shown in FIG. 5.
  • the first flexible circuit board 130 and the fourth flexible circuit The plates 150 are all in a bent state.
  • the portion of the first bonding connection portion 132 of the first flexible circuit board 130 and the portion of the second bonding connection portion 133 of the first flexible circuit board 130 are both bent to the back of the display substrate 110 (that is, the display substrate 110 is far away from the touch control panel).
  • One side of sensor 120 One side of sensor 120).
  • FIG. 10 is a back view of the display module 100 shown in FIG. 5 (that is, a schematic plan view obtained from the back of the display module 100).
  • the display module 100 further includes a third flexible circuit board (that is, the main circuit board of the display module 100); for ease of description, the back view of the display module 100 shown in FIG. 10 also shows a third flexible circuit board.
  • Three flexible circuit boards 160 are shown in FIG. 5 (that is, a schematic plan view obtained from the back of the display module 100).
  • the third flexible circuit board 160 is located on the side of the display substrate 110 away from the touch sensor 120; the third flexible circuit board 160 and the fourth flexible circuit board 150 (for example, the fourth flexible circuit board 150
  • the third flexible circuit board 160 can control the driving chip 153 via the fourth flexible circuit board 150 (for example, the main body portion 152 of the fourth flexible circuit board 150), and drive The chip 153 controls the display substrate 110 to realize the display function.
  • the first flexible circuit board 130 and the third flexible circuit board 160 are electrically connected to each other through bonding; for example, the third flexible circuit board 160 can control the touch detection chip via the first flexible circuit board 130 , And through the touch detection chip to control the touch sensor 120 to achieve the touch function.
  • the first flexible circuit board 130 and the third flexible circuit board 160 at least partially overlap in a direction perpendicular to the flat area 111 of the display substrate 110.
  • the first flexible circuit board 130 further includes an electrical connection area 134 protruding from the main body portion 131, and the electrical connection area 134 of the first flexible circuit board 130 is located on the main body portion 131 away from the first bonding connection.
  • the electrical connection area 134 of the first flexible circuit board 130 and the third flexible circuit board 160 are in a direction perpendicular to the flat area 111 of the display substrate 110 (that is, the third The direction) is at least partially overlapped, so that the first flexible circuit board 130 can be electrically connected to each other via the electrical connection area 134 and the third flexible circuit board 160.
  • the third flexible circuit board 160 includes a main body portion 161, a connection portion 162 protruding from the main body portion 161 of the third flexible circuit board 160, and a connection portion 162 connected to the connection portion 162 of the third flexible circuit board 160.
  • Connect terminal 163 the electrical connection area 134 of the first flexible circuit board 130 and the main body portion 161 of the third flexible circuit board 160 at least partially overlap in a direction perpendicular to the flat area 111 of the display substrate 110.
  • the connection terminal 163 of the third flexible circuit board 160 is configured to be connected to a main board (not shown in the figure) of the display device to receive image signals and the like provided by the main board.
  • the main body portion 131 of the first flexible circuit board 130, the main body portion 152 of the fourth flexible circuit board 150, the driving chip 153, and the main body portion 161 of the third flexible circuit board 160 are all arranged in the display module. 100 flat area, this is because the material of the main body portion 131 of the first flexible circuit board 130, the main body portion 152 of the fourth flexible circuit board 150, the driving chip 153, and the main body portion 161 of the third flexible circuit board 160 are relatively hard.
  • the main body portion 131 of the first flexible circuit board 130, the main body portion 152 of the fourth flexible circuit board 150, the driving chip 153, and the main body portion 161 of the third flexible circuit board 160 are arranged in a flat area to avoid bending of the first flexible circuit board 130
  • the main body portion 131 of the fourth flexible circuit board 150, the main body portion 152 of the fourth flexible circuit board 150, the driving chip 153, and the main body portion 161 of the third flexible circuit board 160 are caused by defects.
  • the orthographic projection of the driving chip 153 on the display substrate 110 is located on the first bonding connection portion 132, the second bonding connection portion 133 and the main body portion 131 of the first flexible circuit board 130 on the display substrate 110.
  • the area enclosed by the orthographic projection of the upper flat area 111 and the flat area on the display substrate 110 with the first bonding connection portion 132, the second bonding connection portion 133 and the main body portion 131 of the first flexible circuit board 130 The orthographic projection of 111 is arranged at intervals, thereby avoiding defects caused by the first flexible circuit board 130 covering the driving chip 153.
  • the first bonding connection portion 132 and the second bonding connection portion 133 are located on both sides of the driving chip 153 in the first direction D1.
  • the first bonding connection portion 132, the second bonding connection portion 133, and the main body portion 131 of the first flexible circuit board 130 constitute an opening, and the opening exposes the driving chip 153, thereby avoiding the first
  • the flexible circuit board 130 covers the defects caused by the driving chip 153.
  • the main body portion 131 of the first flexible circuit board 130 is located on a side of the third flexible circuit board 160 (for example, the main body portion 161 of the third flexible circuit board 160) away from the display substrate 110.
  • the main body portion 161 of the third flexible circuit board 160, the main body portion 152 of the fourth flexible circuit board 150, and the main body portion of the first flexible circuit board 130 are sequentially arranged on the display substrate 110 away from the touch control panel.
  • the main body 161 of the third flexible circuit board 160 is closer to the display substrate 110 than the main body of the first flexible circuit board 130.
  • the positions of the main body portion 161 of the third flexible circuit board 160, the main body portion 152 of the fourth flexible circuit board 150, and the main body portion of the first flexible circuit board 130 in the direction perpendicular to the flat area 111 of the display substrate 110 The relationship is not limited to the example shown in FIG. 10.
  • the main body portion 152 of the fourth flexible circuit board 150, the main body portion 131 of the first flexible circuit board 130, and the main body portion 161 of the third flexible circuit board 160 are sequentially disposed on the display substrate 110 away from the touch sensor 120.
  • the main body 152 of the fourth flexible circuit board 150 is closer to the display substrate 110.
  • the main body portion 152 of the fourth flexible circuit board 150, the main body portion 161 of the third flexible circuit board 160, and the main body portion 131 of the first flexible circuit board 130 are sequentially disposed on the display substrate 110 away from the touch sensor. On one side of 120, and compared to the main body 131 of the first flexible circuit board 130, the main body 152 of the fourth flexible circuit board 150 is closer to the display substrate 110.
  • FIG. 11 is a front view of the touch sensor 120 and the first flexible circuit board 130 of another display module 100 provided by at least one embodiment of the present disclosure
  • FIG. 12 is a back view of the display module 100 shown in FIG. 11.
  • the shape, connection, and arrangement of the first flexible circuit board 130, the fourth flexible circuit board 150 (the main body portion 152 and the driving chip 153 of the fourth flexible circuit board 150), and the third flexible circuit board 160 can also adopt FIG. 11 And the example shown in Figure 12.
  • the display module 100 further includes a bonding support structure 141; the bonding support structure 141 and the first bonding connection portion 132 and the second bonding connection portion 133 are perpendicular to the display substrate.
  • the flat area 111 of the 110 overlaps in the direction of the flat area 111 and is located on the side of the first bonding connection portion 132 of the first flexible circuit board 130 that is in contact with the touch sensor 120 away from the touch sensor 120.
  • the bonding support structure 141 it is possible to prevent the end of the first bonding connection portion 132 (that is, the end of the first bonding connection portion 132 in contact with the touch sensor 120 when the first flexible circuit board 130 is bent).
  • the bonding failure caused by the tilting of the end of the fixed connection portion 133 can improve the robustness and reliability of the bonding connection between the touch sensor 120 and the first flexible circuit board 130.
  • the material of the bonding support structure 141 can be set according to actual application requirements, which is not specifically limited in the embodiment of the present disclosure.
  • the bonding support structure 141 may be a foam layer or a polyethylene terephthalate layer.
  • the bonding support structure 141 can not only improve the bonding between the touch sensor 120 and the first flexible circuit board 130 The robustness and reliability of the connection can also prevent the end of the first bonding connection portion 132 and the end of the second bonding connection portion 133 from reflecting light, thereby avoiding the deterioration of the display effect of the display module 100.
  • the bonding support structure 141 may include a first bonding support structure and a second bonding support structure spaced apart in the first direction, and the first bonding support structure and the second bonding support structure are respectively the same as the first bonding support structure.
  • the end of the connecting portion 132 and the end of the second bonding connecting portion 133 overlap.
  • the bonding support structure 141 may not only overlap the end of the first bonding connection 132 and the end of the second bonding connection 133, but also overlap the end of the first bonding connection 132 and the second bonding connection 132.
  • the gaps between the ends of the bonding connection portion 133 overlap.
  • the display module 100 further includes a cover plate 142.
  • the cover plate 142 is located on the display side of the display substrate 110 and is located on the side of the touch sensor 120 away from the display substrate 110.
  • the cover plate 142 can be used to protect the related film of the display module 100 from being scratched.
  • the cover plate 142 may be a transparent substrate.
  • the transparent substrate may be a glass substrate, a quartz substrate, a plastic substrate (such as a polyethylene terephthalate (PET) substrate), or a substrate made of other suitable materials.
  • the portion of the cover plate 142 located in the curved area of the display module 100 has a certain bending curvature, so that the portion of the display substrate 110 and the touch sensor 120 located in the curved area of the display module 100 can be along the surface of the cover plate 142.
  • the bending curvature performs bending.
  • the bonding support structure 141 is sandwiched between the first flexible circuit board 130 and the cover plate 142; in this case, the cover plate 142 not only has the function of protecting the display module 100
  • the function of the film layer not being scratched can also apply downward force to the end of the first bonding connection portion 132 and the end of the second bonding connection portion 133 via the bonding support structure 141, thereby further improving
  • the robustness and reliability of the bonding connection between the touch sensor 120 and the first flexible circuit board 130 are established.
  • the bonding support structure 141 is in direct contact with both the first flexible circuit board 130 and the cover plate 142.
  • the display module 100 further includes a polarizer 143.
  • the polarizer 143 is a circular polarizer.
  • the polarizer 143 is located between the touch sensor 120 and the cover plate 142.
  • the polarizer 143 (for example, a circular polarizer) can alleviate the problems of poor contrast and reduced display quality caused by reflected light (due to the reflection of the display substrate to ambient light).
  • the display module 100 further includes an adhesive layer 144 disposed between the polarizer 143 and the cover plate 142 and between the touch sensor 120 and the display substrate 110.
  • the adhesive layer 144 may be, for example, an optical glue.
  • the optical glue 144 may be an OCA (Optically Clear Adhesive) optical glue.
  • the sum of the thickness of the bonding support structure 141 and the first bonding connection portion 132 in the direction perpendicular to the flat area 111 of the display substrate 110 is substantially equal to the distance between the touch sensor 120 and the cover plate 142.
  • the structure 141 applies a downward force to the end of the first bonding connection portion 132 and the end of the second bonding connection portion 133 to further improve the robustness of the bonding connection between the touch sensor 120 and the first flexible circuit board 130 Sex and reliability.
  • the sum of the thickness of the bonding support structure 141 and the first bonding connection portion 132 in the direction perpendicular to the flat area 111 of the display substrate 110 is substantially equal to the polarizer 143 and the adhesive layer 144 (located on the cover plate 142 and the polarizer).
  • the thickness of the adhesive layer 144 between the sheets 143 in the direction perpendicular to the flat area 111 of the display substrate 110 is the sum of the thicknesses.
  • FIG. 13 is a front view of still another display module 200 provided by at least one embodiment of the present disclosure.
  • the display module 200 may be an active matrix organic light emitting diode display screen.
  • the display module 200 includes a display substrate 210 (for example, an organic light emitting diode display panel) and a touch sensor 220 provided on the display side of the display substrate 210.
  • the display module 200 further includes a first flexible circuit board 230 (that is, a touch sensor 220 circuit board). It should be noted that the first flexible circuit board 230 of the display module 200 shown in FIG. 13 is not in a bent state, and the folding portion of the display substrate 210 is not in a folded state.
  • FIG. 14A is a front view of the display substrate 210 and the driving chip 250 of the display module 200 shown in FIG. 13.
  • the second direction D2 has a first side 291 and a second side 292.
  • the first side 291 and the second side 292 in the second direction D2 are used to illustrate the display module 200 and the components of the display module 200 on both sides of the second direction D2.
  • the first side 291 and the second side 292 of the second direction D2 may be used to represent the first side and the second side of the touch sensor 220 in the second direction D2, respectively.
  • the first side 291 and the second side 292 of the second direction D2 may be used to represent the first side and the second side of the substrate main body portion 211 in the second direction D2, respectively.
  • the display substrate 210 includes a substrate main body portion 211 and a folded portion 212 protruding from the substrate main body portion 211 on a first side 291 (the first side of the substrate main body portion 211).
  • the folding portion 212 of the display substrate 210 near the display substrate 210 further includes a bending portion (not shown in the figure) provided between the substrate main body portion 211 of the display substrate 210 and the folding portion 212 of the display substrate 210, and the opposite side of the bending portion They are respectively connected to the substrate main body part 211 and the folding part 212 of the display substrate 210.
  • the bent portion of the display substrate 210 is bent, and the folded portion 212 of the display substrate 210 is bent to the side of the substrate main body 211 away from the touch sensor 220. That is, in the final product of the display module 200, the display substrate 210 is in a folded state.
  • the bent portion of the display substrate 210 is configured such that the substrate main body portion 211 and the folded portion 212 are parallel to and overlap each other in a direction perpendicular to the substrate main body portion 211.
  • the folded portion 212 and the bent portion of the display substrate 210 are both located in the peripheral area of the display substrate 210, and the display area of the display substrate 210 is located in the substrate main body portion 211 of the display substrate 210.
  • the area of the peripheral area in the plane where the main body portion 211 of the substrate is located can be reduced, which is beneficial to the narrow frame design of the display module 200.
  • the substrate main body 211 includes a flat area 213 and a curved area 214, and there is a virtual boundary between the flat area 213 and the curved area 214 (also referred to as a bending start line 215).
  • the flat area 213, the curved area 214, and the bending start line 215 of the display substrate 210 correspond to the flat area, the curved area, and the bending start line of the display module 200, respectively.
  • the display module 200 further includes a driving chip 250 located on the side of the display substrate 210 away from the touch sensor 220.
  • the driving chip 250 includes a data driver, a gate driver, a timing controller T-Con, and so on.
  • the driving chip 250 is located on the side of the folding part 212 away from the touch sensor 220 (the side away from the main body part 211 of the substrate), and the driving chip 250 is directly bonded (for example, directly formed) on the folding part 212 , And thus is electrically connected to the display substrate 210.
  • the driving chip 250 directly bonded (for example, directly formed, directly integrated) on the folding part 212, the driving chip 250 and the display substrate 210 can be electrically connected without using a flexible circuit board, thereby The structure of the display module 200 is simplified.
  • FIG. 14B is an example of the display substrate 210 and the driving chip 250 shown in FIG. 14A.
  • the display substrate 210 includes a plurality of gate lines GL and a plurality of data lines DL, and the plurality of gate lines GL and the plurality of data lines DL cross each other and define a plurality of display pixel units 216 arranged in an array;
  • Each of the plurality of display pixel units 216 includes a pixel driving circuit 217 and a light emitting element 218 connected to the pixel driving circuit 217.
  • FIG. 6B the display substrate 210 includes a plurality of gate lines GL and a plurality of data lines DL, and the plurality of gate lines GL and the plurality of data lines DL cross each other and define a plurality of display pixel units 216 arranged in an array;
  • Each of the plurality of display pixel units 216 includes a pixel driving circuit 217 and a light emitting element 218 connected to the pixel driving circuit 217.
  • a plurality of data lines DL of the display substrate 210 are directly bonded to the driving chip 250 to be electrically connected to each other, and the data driver of the driving chip 250 can provide display for the pixel driving circuit 217 via the data line DL.
  • the gate driver of the driving chip 250 can provide the pixel driving circuit 217 with a gate scan signal for display via the gate line GL, so that the driving chip 250 can drive the display substrate 210 to achieve a display function.
  • the driving chip 250 is directly formed on the folding part 212, and the driving chip 250 is electrically connected to a plurality of data lines DL extending into the folding part 212.
  • the driving chip 250 may also be electrically connected to a plurality of gate lines GL.
  • FIG. 6B other descriptions of the display pixel unit 216, the gate line GL, the data line DL, and the driving chip 250 shown in FIG. 14B can refer to the example shown in FIG. 6B, which will not be repeated here.
  • FIG. 14C is a front view of the touch sensor 220 and the first flexible circuit board 230 of the display module 200 shown in FIG. 13. It should be noted that, for the convenience of description, FIG. 14C also shows the bending start line 215 of the display substrate 210; it can be understood that the touch sensors 220 located on both sides of the bending start line 215 are finally set in the display module 200. The product is in a bent state. It should be noted that the first flexible circuit board 230 shown in FIG. 14C is not in a bent state.
  • the touch sensor 220 has a first bonding area 221 and a second bonding area 222 on the first side 291 in the second direction D2; the first bonding area 221 and the second bonding area 222 overlaps the flat area 213 and is spaced apart from each other in the first direction D1. That is, the orthographic projection of the first bonding area 221 and the second bonding area 222 on the display substrate 210 is only located in the flat area 213. For example, neither the first bonding area 221 nor the second bonding area 222 overlaps the curved area 214.
  • the touch sensor 220 by making the touch sensor 220 have the first bonding area 221 and the second bonding area 222 on the first side 291 in the second direction D2 that crosses the first direction D1, the first bonding area 221 and the second bonding area 222
  • the second bonding area 222 is located on the surface of the touch sensor 220 on the side away from the display substrate 210, and is overlapped with the flat area 213 and is spaced apart from each other, and the first flexible circuit board 230 passes through the first bonding area 221 and the second bonding area.
  • the fixed area 222 is electrically connected to the touch sensor 220, which can effectively use the space on the back of the display module 200 and increase the size of the wiring area that can be used for the first flexible circuit board 230 (which can be used for the wiring area of the first flexible circuit board 230).
  • the overall width in the first direction D1) so that the display module 200 has a curved area and does not change the position of the driving chip 250 in the first direction D1 to realize the first flexible circuit board 230 and the contact
  • the potential electrical unevenness and uneven brightness of the display substrate 210 along the first direction D1 caused by changing the position of the driving chip 250 in the first direction D1 can be avoided.
  • the first flexible circuit board 230 includes a main body portion 231, and a first bonding connection portion 232 and a second bonding connection portion protruding from the main body portion 231 of the first flexible circuit board 230 and spaced apart from each other.
  • the first bonding connection portion 232 and the first bonding area 221 are bonded and electrically connected to each other
  • the second bonding connection portion 233 and the second bonding area 222 are bonded and electrically connected to each other.
  • the specific implementation of the touch sensor 220 and the first flexible circuit board 230 shown in FIG. 14C can be referred to the examples shown in FIG. 7A and FIG. 7B, which will not be repeated here.
  • FIG. 15 is a schematic cross-sectional view of the display module 200 shown in FIG. 13, and the schematic cross-sectional view shown in FIG. 15 is cut along the line CC' of FIG. 13.
  • the first flexible circuit board 230 of the display module 200 shown in FIG. 6 and the bent portion of the display substrate 210 are not in a bent state.
  • the touch sensor 220 and the display substrate 210 are superimposed on the third direction D3, and the touch sensor 220 is located on the display side of the display substrate 210 in the third direction D3 (that is, the light emitting side or the image output side).
  • the first direction D1, the second direction D2, and the third direction D3 cross each other (for example, perpendicular to each other).
  • FIG. 16 is another schematic cross-sectional view of the display module 200 shown in FIG. 13, compared with the schematic cross-sectional view shown in FIG. 15, in the schematic cross-sectional view shown in FIG. 16, the first flexible circuit board 230 and the display substrate 210
  • the bent parts are all in a bent state.
  • the folding part 212 of the display substrate 210 and part of the first flexible circuit board 230 (the main body part 231 of the first flexible circuit board 230, part of the first bonding connection part 232 and part of the second bonding connection part 233 ) Are bent to the back of the display substrate 210 (that is, the side of the display substrate 210 away from the touch sensor 220).
  • the display module 200 further includes a bonding support structure 241, a cover plate 242, a polarizer 243 and an adhesive layer 244.
  • the specific implementation of the bonding support structure 241, the cover plate 242, the polarizer 243 and the optical glue 244 can refer to the bonding support structure 141, the cover plate 142, the polarizer 143 and the adhesive layer shown in FIGS. 8 and 9 144, I won't repeat it here.
  • FIG. 17 is a back view of the display module 200 shown in FIG. 13.
  • the display module 200 further includes a third flexible circuit board 260 (that is, the main circuit board of the display module 200); for ease of description, FIG. 17 is a back view of the third flexible circuit. ⁇ 260.
  • the third flexible circuit board 260 is located on the side of the substrate body portion 211 of the display substrate 210 away from the touch sensor 220; the first flexible circuit board 230 and the third flexible circuit board 260 are electrically connected to each other through bonding .
  • the first flexible circuit board 230 and the third flexible circuit board 260 at least partially overlap in a direction perpendicular to the flat area 213 of the display substrate 210.
  • the first flexible circuit board 230 further includes an electrical connection area 234 protruding from the main body portion 231 of the first flexible circuit board 230, and the electrical connection area 234 of the first flexible circuit board 230 is located on the main body portion 231.
  • the side away from the first bonding connection portion 232 and the second bonding connection portion 233; the electrical connection area 234 of the first flexible circuit board 230 and the third flexible circuit board 260 are perpendicular to the flat area 213 of the display substrate 210 The directions are at least partially overlapped, so that the first flexible circuit board 230 can be electrically connected to each other by bonding the electrical connection area 234 and the third flexible circuit board 260.
  • the first flexible circuit board 230 further includes a touch detection chip, and the third flexible circuit board 260 can control the touch detection chip via the first flexible circuit board 230 and control the touch sensor 220 via the touch detection chip. Touch function.
  • the third flexible circuit board 260 is also bonded to the driving chip 250 to be electrically connected to each other, so that the third flexible circuit board 260 can control the display substrate 210 via the driving chip 250 to realize a display function.
  • the third flexible circuit board 260 includes a main body portion 261, a connection portion 262 protruding from the main body portion 261 of the third flexible circuit board 260, and a connection portion 262 connected to the connection portion 262 of the third flexible circuit board 260.
  • the connection terminal 263 of the third flexible circuit board 260 is configured to be connected to the main board to receive image signals and the like provided by the main board.
  • the main body portion 231 of the first flexible circuit board 230, the substrate main body portion 211, the driving chip 250, and the main body portion 261 of the third flexible circuit board 260 are all disposed in the flat area of the display module 200.
  • the orthographic projection of the driving chip 250 on the flat area 213 of the display substrate 210 is located on the first bonding connection portion 232, the second bonding connection portion 233, and the main body portion 231 of the first flexible circuit board 230.
  • the orthographic projections on the flat area 213 are arranged at intervals, thereby avoiding defects caused by the first flexible circuit board 230 covering the driving chip 250.
  • the first bonding connection portion 232, the second bonding connection portion 233, and the main body portion 231 of the first flexible circuit board 230 constitute an opening, and the opening exposes the driving chip 250, thereby avoiding the first
  • the flexible circuit board 230 covers the defects caused by the driving chip 250.
  • the main body portion 261 of the third flexible circuit board 260, the folded portion 212 of the display substrate 210, and the main body portion 231 of the first flexible circuit board 230 are sequentially disposed on the substrate main body portion 211 of the display substrate 210.
  • a side away from the touch sensor 220 and the main body 261 of the third flexible circuit board 260 is closer to the main body 211 of the display substrate 210 than the main body 231 of the first flexible circuit board 230.
  • the positional relationship between the main body portion 261 of the third flexible circuit board 260, the folded portion 212 of the display substrate 210, and the main body portion 231 of the first flexible circuit board 230 in the direction perpendicular to the flat area 231 of the display substrate 210 is not It is limited to the example shown in FIG. 17.
  • the folding portion 212 of the display substrate 210, the main body portion 231 of the first flexible circuit board 230, and the main body portion 261 of the third flexible circuit board 260 are sequentially disposed on the main body portion 211 of the display substrate 210 away from the touch control panel.
  • the folded portion 212 of the display substrate 210 is closer to the substrate main body 211 of the display substrate 210 than the main body 261 of the third flexible circuit board 260.
  • the folding portion 212 of the display substrate 210, the main body portion 261 of the third flexible circuit board 260, and the main body portion 231 of the first flexible circuit board 230 are arranged in sequence on the remote contact of the main body portion 211 of the display substrate 210.
  • the folded portion 212 of the display substrate 210 is closer to the main body portion 211 of the display substrate 210 than the main body portion 231 of the first flexible circuit board 230.
  • the driving chip 250 of the display module 200 shown in FIG. 17 is not limited to being directly bonded to the main body portion 211 of the substrate. In some examples, the driving chip 250 may also be bonded to the main body portion of the substrate via a flexible circuit board. 211 on. An exemplary description will be given below in conjunction with FIG. 18A, FIG. 18B, and FIG. 19.
  • FIG. 18A is a front view of the display substrate 210 and the second flexible circuit board 270 of still another display module 200 provided by at least one embodiment of the present disclosure.
  • the display module 200 shown in FIG. 18A is similar to the display module 200 shown in FIG. 13, so only the differences between the two will be described here, and the similarities will not be repeated.
  • the display module 200 further includes a second flexible circuit board 270, the second flexible circuit board 270 includes a driving chip 250; the second flexible circuit board 270 and the display substrate 210 are bonded and electrically connected to each other, thereby The bonding connection between the driving chip 250 and the display substrate 210 is realized.
  • FIG. 18B is an example of the display substrate 210 and the second flexible circuit board 270 shown in FIG. 18A. As shown in FIG. 18B, the second flexible circuit board 270 is bonded to the data line DL of the display substrate 210, so the driving chip 250 is electrically connected to the data line DL of the display substrate 210 via the second flexible circuit board 270.
  • FIG. 19 is a back view of the display module 200 shown in FIG. 18A.
  • the second flexible circuit board 270 is located on the side of the folding portion 212 away from the main body portion 211 and bonded to the folding portion 212
  • the driving chip 250 is located on the side of the second flexible circuit board 270 away from the folding portion 212.
  • the display module 200 further includes a third flexible circuit board 260 located on the side of the substrate main body portion 211 of the display substrate 210 away from the touch sensor 220.
  • the third flexible circuit board 260 includes a main body portion 261, and the third flexible circuit board 260 includes a main body portion 261.
  • the main body portion 261 of the flexible circuit board 260 and the second flexible circuit board 270 are bonded and electrically connected to each other. Therefore, the third flexible circuit board 260 can drive the display substrate 210 via the driving chip 250.
  • the orthographic projection of the driving chip 250 on the flat area 213 of the display substrate 210 is located on the first bonding connection portion 232, the second bonding connection portion 233, and the main body portion 231 of the first flexible circuit board 230.
  • the orthographic projections on the flat area 213 are arranged at intervals, thereby avoiding defects caused by the first flexible circuit board 230 covering the driving chip 250.
  • the main body portion 261 of the third flexible circuit board 260, the folded portion 212 of the display substrate 210, the second flexible circuit board 270, and the main body portion 231 of the first flexible circuit board 230 are sequentially arranged on the display substrate.
  • the main body portion 211 of the substrate 210 is on the side away from the touch sensor 220, and compared to the main body portion 231 of the first flexible circuit board 230, the main body portion 261 of the third flexible circuit board 260 is closer to the main body portion of the display substrate 210 211.
  • the main body portion 261 of the third flexible circuit board 260, the folded portion 212 of the display substrate 210, the second flexible circuit board 270, and the main body portion 231 of the first flexible circuit board 230 are in a flat area perpendicular to the display substrate 210.
  • the positional relationship in the direction of 231 is not limited to the example shown in FIG. 19.
  • the folding portion 212 of the display substrate 210, the second flexible circuit board 270, the main body portion 231 of the first flexible circuit board 230, and the main body portion 261 of the third flexible circuit board 260 are sequentially arranged on the substrate of the display substrate 210.
  • a side of the main body 211 away from the touch sensor 220, and the folded portion 212 of the display substrate 210 is closer to the main body 211 of the display substrate 210 than the main body 261 of the third flexible circuit board 260.
  • the folding portion 212 of the display substrate 210, the second flexible circuit board 270, the main body portion 261 of the third flexible circuit board 260, and the main body portion 231 of the first flexible circuit board 230 are sequentially disposed on the display substrate 210.
  • a side of the substrate main body portion 211 away from the touch sensor 220, and the folded portion 212 of the display substrate 210 is closer to the substrate main body portion 211 of the display substrate 210 than the main body portion 231 of the first flexible circuit board 230.
  • FIG. 20 is an exemplary block diagram of a display device provided by at least one embodiment of the present disclosure. As shown in FIG. 20, the display device includes any display module provided by at least one embodiment of the present disclosure.

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Abstract

一种显示模组(100；200)和显示装置。显示模组(100；200)包括第一柔性电路板(130；230)、显示基板(110；210)以及设置在显示基板(110；210)的显示侧上的触控传感器(120；220)。显示基板(110；210)在第一方向(D1)上具有平坦区(111；211)以及位于平坦区(111；213)两侧的曲面区(112；214)；触控传感器(120；220)在位于与第一方向(D1)上交叉的第二方向(D2)的第一侧具有第一邦定区(121；221)和第二邦定区(122；222)，第一邦定区(121；221)和第二邦定区(122；222)位于触控传感器(120；220)的远离显示基板(110；210)一侧的表面上，与平坦区(111；213)叠置且彼此间隔设置；第一柔性电路板(130；230)经由第一邦定区(121；221)和第二邦定区(122；222)与触控传感器(120；220)电连接；第一柔性电路板(130；230)包括主体部(131；231)以及从主体部(131；231)突出且彼此间隔设置的第一邦定连接部(132；232)和第二邦定连接部(133；233)；以及第一邦定连接部(132；232)与第一邦定区(121；221)邦定而彼此电连接，第二邦定连接部(133；233)与第二邦定区(122；222)邦定而彼此电连接。显示模组(100；200)可以更有效的利用显示模组(100；200)背面的空间，并实现触控传感器(120；220)和第一柔性电路板(130；230)的邦定。

Description

显示模组和显示装置 技术领域
本公开的实施例涉及一种显示模组和显示装置。
背景技术
有机发光二极管(Organic Light Emitting Diode，OLED)显示器件具有视角宽、对比度高、响应速度快等特点。并且，相比于无机发光显示器件，有机发光二极管显示器件具有更高的发光亮度、更低的驱动电压等优势。由于具有上述特点和优势，有机发光二极管(OLED)显示器件逐渐受到人们的广泛关注并且可以适用于手机、显示器、笔记本电脑、数码相机、仪器仪表等具有显示功能的装置。
发明内容
本公开的至少一个实施例提供了一种显示模组，其包括：第一柔性电路板、显示基板以及设置在所述显示基板的显示侧上的触控传感器。所述显示基板在第一方向上具有平坦区以及位于所述平坦区两侧的曲面区；所述触控传感器在位于与所述第一方向上交叉的第二方向的第一侧具有第一邦定区和第二邦定区；所述第一邦定区和所述第二邦定区位于所述触控传感器的远离所述显示基板一侧的表面上，与所述平坦区叠置且彼此间隔设置；所述第一柔性电路板经由所述第一邦定区和所述第二邦定区与所述触控传感器电连接；所述第一柔性电路板包括主体部以及从所述主体部突出且彼此间隔设置的第一邦定连接部和第二邦定连接部；以及所述第一邦定连接部与所述第一邦定区邦定而彼此电连接，所述第二邦定连接部与所述第二邦定区邦定而彼此电连接。
例如，在所述显示模组的至少一个示例中，所述第一柔性电路板的第一邦定连接部和第二邦定连接部被弯折，所述第一柔性电路板的主体部位于所述显示基板的远离所述触控传感器的一侧。
例如，在所述显示模组的至少一个示例中，显示模组还包括：位于所述显示基板的远离所述触控传感器一侧的驱动芯片。所述驱动芯片被配置为驱 动所述显示基板；以及所述驱动芯片在所述显示基板的平坦区上的正投影位于所述第一柔性电路板的第一邦定连接部、第二邦定连接部和主体部在所述显示基板的平坦区上的正投影围成的区域中，且与所述第一柔性电路板的第一邦定连接部、第二邦定连接部和主体部在所述显示基板的平坦区上的正投影间隔设置。
例如，在所述显示模组的至少一个示例中，所述显示基板还包括：基板主体部以及在所述第一侧从所述基板主体部凸出的折叠部；所述基板主体部包括所述平坦区以及所述曲面区；以及所述折叠部被弯折到所述基板主体部的远离所述触控传感器的一侧。
例如，在所述显示模组的至少一个示例中，所述驱动芯片位于所述折叠部的远离所述触控传感器一侧，且所述驱动芯片邦定在所述折叠部上。
例如，在所述显示模组的至少一个示例中，所述显示模组还包括第二柔性电路板，所述第二柔性电路板位于所述折叠部的远离所述基板主体部的一侧且与所述折叠部邦定，所述驱动芯片位于所述第二柔性电路板的远离所述折叠部一侧。
例如，在所述显示模组的至少一个示例中，所述显示模组还包括第三柔性电路板。所述第三柔性电路板位于所述显示基板的远离所述触控传感器的一侧；所述第一柔性电路板和所述第三柔性电路板通过邦定而彼此电连接；以及所述第三柔性电路板和所述第二柔性电路板通过邦定而彼此电连接，或者所述第三柔性电路板和所述驱动芯片通过邦定而彼此电连接。
例如，在所述显示模组的至少一个示例中，显示模组还包括第四柔性电路板。所述第四柔性电路板包括第三邦定连接部；所述显示基板还包括位于所述平坦区的第三邦定区；所述第三邦定区与所述第一邦定区和所述第二邦定区在所述显示基板的平坦区的正投影部分重叠或者所述第三邦定区位于所述第一邦定区在所述显示基板的平坦区的正投影和所述第二邦定区在所述显示基板的平坦区的正投影之间；以及所述第四柔性电路板经由所述第三邦定连接部和所述第三邦定区与所述显示基板邦定而电连接。
例如，在所述显示模组的至少一个示例中，所述第四柔性电路板还包括与所述第三邦定连接部连接的主体部；以及所述第四柔性电路板的第三邦定连接部被弯折，所述第四柔性电路板的主体部位于所述显示基板的远离所述触控传感器的一侧。
例如，在所述显示模组的至少一个示例中，所述第四柔性电路板还包括所述驱动芯片，所述驱动芯片位于所述第四柔性电路板的主体部的远离所述触控传感器的一侧。
例如，在所述显示模组的至少一个示例中，所述显示模组还包括第三柔性电路板。所述第三柔性电路板位于所述显示基板的远离所述触控传感器的一侧；所述第一柔性电路板和所述第三柔性电路板通过邦定而彼此电连接；以及所述第三柔性电路板与所述第四柔性电路板通过邦定而彼此电连接。
例如，在所述显示模组的至少一个示例中，所述第一柔性电路板的主体部位于所述第三柔性电路板的远离所述显示基板的一侧；所述第一柔性电路板还包括从所述主体部凸出的电连接区，所述第一柔性电路板的电连接区位于所述第一柔性电路板的主体部的远离所述第一邦定连接部和所述第二邦定连接部的一侧；所述第一柔性电路板的电连接区和所述第三柔性电路板在垂直于所述显示基板的方向上至少部分重叠；以及所述第一柔性电路板经由所述电连接区与所述第三柔性电路板邦定而彼此电连接。
例如，在所述显示模组的至少一个示例中，所述显示模组还包括邦定支撑结构和盖板。所述邦定支撑结构分别与所述第一邦定连接部和所述第二邦定连接部在垂直于所述显示基板的平坦区的方向上叠置，且位于所述第一柔性电路板的第一邦定连接部与所述触控传感器接触的部分的远离所述触控传感器的一侧；所述盖板位于所述显示基板的显示侧，且位于所述触控传感器的远离所述显示基板的一侧；以及所述邦定支撑结构夹置在所述第一柔性电路板和所述盖板之间。
例如，在所述显示模组的至少一个示例中，所述邦定支撑结构为泡棉层或聚对苯二甲酸乙二醇酯层。
例如，在所述显示模组的至少一个示例中，所述显示模组还包括偏光片。所述偏光片位于所述触控传感器与所述盖板之间；所述邦定支撑结构和所述第一邦定连接部在垂直于所述显示基板的平坦区的方向上的厚度之和实质上等于所述触控传感器与所述盖板之间的间距在垂直于所述显示基板的平坦区的方向上的厚度。
例如，在所述显示模组的至少一个示例中，所述显示模组还包括粘合层。所述粘合层位于所述盖板和所述偏光片之间；所述邦定支撑结构和所述第一邦定连接部在垂直于所述显示基板的平坦区的方向上的厚度之和实质上等于 所述偏光片和所述粘合层在垂直于所述显示基板的平坦区的方向上的厚度之和。
本公开的至少一个实施例还提供了一种显示装置，其包括本公开的至少一个实施例提供的任一显示模组。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1是一种显示模组的正视图；
图2A是图1所示的显示模组的触控传感器和第一柔性电路板的正视图；
图2B是图1所示的显示模组的显示基板和第四柔性电路板的正视图；
图2C是图1所示的显示模组的一个截面示意图；
图2D是图1所示的显示模组的另一个截面示意图；
图3A是图1所示的显示模组的背视图；
图3B是另一种显示模组的背视图；
图4A是再一种显示模组的正视图；
图4B是图4A所示的显示模组的俯视图；
图4C是图4A所示的显示模组的背视图；
图5是本公开至少一个实施例提供的一种显示模组的正视图；
图6A是图5所示的显示模组的显示基板和第四柔性电路板的正视图；
图6B是图6A所示的显示基板的一个示例；
图7A是图5所示的显示模组的触控传感器和第一柔性电路板的正视图；
图7B为图7A所示的触控传感器的一个示例；
图8是图5所示的显示模组的一个截面示意图；
图9是图5所示的显示模组的另一个截面示意图；
图10是图5所示的显示模组的背视图；
图11是本公开至少一个实施例提供的另一种显示模组的触控传感器和第一柔性电路板的正视图；
图12是图11所示的显示模组的背视图；
图13是本公开至少一个实施例提供的再一种显示模组的正视图；
图14A是图13所示的显示模组的显示基板和驱动芯片的正视图；
图14B是图14A所示的显示基板和驱动芯片的一个示例；
图14C是图13所示的显示模组的触控传感器和第一柔性电路板的正视图；
图15是图13所示的显示模组的一个截面示意图；
图16是图13所示的显示模组的另一个截面示意图；
图17是图13所示的显示模组的背视图；
图18A是本公开至少一个实施例提供的又再一种显示模组的显示基板和第二柔性电路板的正视图；
图18B是图18A所示的显示基板和第二柔性电路板的一个示例；
图19是图18A所示的显示模组的背视图；以及
图20是本公开至少一个实施例提供的显示装置的示例性框图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
图1是一种显示模组的正视图(也即，从显示模组正面观察获得的平面示意图)。例如，该显示模组可以是有源矩阵式有机发光二极管显示屏，该 显示屏为非曲面屏。如图1所示，该显示模组包括显示基板501(例如，有机发光二极管显示面板)以及设置在显示基板501的显示侧上的触控传感器502。如图1所示，该显示模组还包括第一柔性电路板504(也即，触控传感器电路板)和第四柔性电路板505(例如，覆晶薄膜)。需要说明的是，图1所示的显示模组的第一柔性电路板504和第四柔性电路板505均未处于弯折状态。
图2A是图1所示的显示模组的触控传感器502和第一柔性电路板504的正视图。需要说明的是，图2A所示的第一柔性电路板504未处于弯折状态。如图2A所示，第二方向D2上具有第一侧591和第二侧592，触控传感器502在第一侧591包括第一邦定区503，第一柔性电路板504仅经由第一邦定区503与触控传感器502电连接。
图2B是图1所示的显示模组的显示基板501和第四柔性电路板505的正视图。需要说明的是，图2B所示的第四柔性电路板505未处于弯折状态。如图2B所示，显示基板501在第一侧591上包括第二邦定区593，第四柔性电路板505经由第二邦定区593与显示基板501电连接。如图2B所示，第四柔性电路板505还包括驱动芯片506。
图2C是图1所示的显示模组的一个截面示意图，且图2C所示的截面示意图沿图1的AA’线剖切得到。需要说明的是，图1所示的显示模组的第一柔性电路板504和第四柔性电路板505均未处于弯折状态。如图2C所示，触控传感器502和显示基板501在第三方向D3上叠置，且触控传感器502在第三方向D3上位于显示基板501的显示侧(也即，发光侧或图像输出侧)。
图2D是图1所示的显示模组的另一个截面示意图，相比于图2C所示的截面示意图，在图2D所示的截面示意图中，第一柔性电路板504和第四柔性电路板505均处于弯折状态。如图2D所示，部分第四柔性电路板505(第四柔性电路板505的主体部)和部分第一柔性电路板504均被弯折到显示基板501的背面(也即，显示基板501的远离触控传感器502的一侧)。
图3A是图1所示的显示模组的背视图(也即，从显示模组背面观察获得的平面示意图)。如图3A所示，该显示模组还包括第三柔性电路板507，第三柔性电路板507与第四柔性电路板505邦定而彼此电连接，由此第三柔性电路板507可以经由第四柔性电路板505控制驱动芯片506，并经由驱动芯片506控制显示基板501实现显示功能；第三柔性电路板507还经由电连 接区508与第一柔性电路板504通过邦定彼此电连接，由此第三柔性电路板507可以经由第一柔性电路板504控制触控传感器502实现触控功能。如图3A所示，驱动芯片506位于第四柔性电路板505的主体部远离显示基板501的一侧。如图3A所示，第一柔性电路板504在第一方向D1仅位于驱动芯片506的一侧，也即，第一柔性电路板504采用单侧走线的方式与触控传感器502邦定连接。例如，第一方向D1、第二方向D2和第三方向D3彼此交叉(例如，彼此垂直)。
需要说明的是，图1和图3A所示的第一柔性电路板504、第四柔性电路板505、第三柔性电路板507的形状、连接和排布仅为示例，本公开的实施例不限于此。图3A是另一种显示模组的背视图。例如，第一柔性电路板504、第四柔性电路板505、第三柔性电路板507的形状、连接和排布还可以采用图3B所示的示例。
本公开的发明人在研究中注意到，图1所示的第一柔性电路板504经由单侧走线的方式与触控传感器502邦定连接的方式不适用于具有曲面区的显示模组(例如，曲面屏)，下面结合图4A-图4C进行示例性说明。
图4A是再一种显示模组600的正视图。如图4A所示，显示模组600在第一方向D1上具有平坦区601以及位于平坦区601两侧的曲面区602，平坦区601和曲面区602之间具有虚拟的分界线(也可以被称为弯折起始线603)。图4B是图4A所示的显示模组600的俯视图。如图4B所示，显示模组600的曲面区602从显示模组600的正面朝向显示模组600的背面弯折。
图4C是图4A所示的显示模组600的背视图。如图4C所示，该显示模组600包括显示基板(图中未示出)、触控传感器(图中未示出)、第一柔性电路板(也即，触控传感器电路板，图中未示出)、第四柔性电路板606和第三柔性电路板607。触控传感器设置在显示基板的显示侧上；第一柔性电路板(也即，触控传感器电路板)与触控传感器邦定而由此与触控传感器电连接，第三柔性电路板607与第一柔性电路板邦定而由此与第一柔性电路板电连接，从而，第三柔性电路板607可以经由第一柔性电路板控制触控传感器实现触控功能；第四柔性电路板606与显示模组600的显示基板邦定而由此与显示基板电连接，从而第四柔性电路板606包括的驱动芯片605可以经由第四柔性电路板606控制显示基板实现显示功能；第三柔性电路板607与第四柔性电路板606邦定而由此电连接，从而第三柔性电路板607可以经 由第四柔性电路板606与驱动芯片605电连接。
如图4C所示，第三柔性电路板607包括主体部6071以及从主体部6071凸出的连接部6072。如图4C所示，第四柔性电路板606的被弯折到显示基板背面的部分(第四柔性电路板606的主体部)、驱动芯片605以及第三柔性电路板607的主体部6071均设置在平坦区601，这是因为第四柔性电路板606的主体部、驱动芯片605以及第三柔性电路板607的主体部6071的材质较硬，将第四柔性电路板606的主体部、驱动芯片605以及第三柔性电路板607的主体部6071设置在平坦区601可以避免弯折第四柔性电路板606的主体部、驱动芯片605以及第三柔性电路板607的主体部6071导致的不良。
本公开的发明人在研究中注意到，对于具有曲面区602的显示模组600(例如，曲面屏)，由于以下原因，具有曲面区602的显示模组600预留给第一柔性电路板(也即，触控传感器电路板)的布置空间(第一柔性电路板的走线空间)较小。首先，由于驱动芯片605为显示模组600的核心电子元件，为避免硬质材料覆盖驱动芯片605导致的不良，需要避免第一柔性电路板覆盖驱动芯片605。其次，驱动芯片605经由第四柔性电路板606邦定到显示基板的多根走线分别沿第二方向D2延伸，且沿第一方向D1并列布置；为了避免多根走线长度差异较大导致的显示基板沿第一方向D1的潜在电学不均匀和亮度不均匀问题，驱动芯片605在第一方向D1的中心与显示基板在第一方向D1上的中心重叠或者接近。再次，由于显示模组600包括曲面区602，平坦区601的尺寸在第一方向D1上的尺寸相对较小。因此，在驱动芯片605在第一方向D1的中心与显示基板在第一方向D1上的中心重叠或者接近，且第一柔性电路板未覆盖驱动芯片605的情况下，驱动芯片605在第一方向D1上任一端与对应的虚拟的分界线之间的间距(也即，可用于第一柔性电路板的走线区域PWL)的尺寸较小。例如，在曲面区602在第一方向D1上的宽度较大的情况下，如果第一柔性电路板经由单侧走线的方式与触控传感器邦定连接，则可能导致可用于第一柔性电路板的走线区域PWL的在第一方向D1上的尺寸无法满足第一柔性电路板的走线需求(例如，第一柔性电路板仅能与触控传感器的部分走线邦定)。
本公开的至少一个实施例提供了一种显示模组和显示装置。该显示模组包括第一柔性电路板、显示基板以及设置在显示基板的显示侧上的触控传感器。显示基板在第一方向上具有平坦区以及位于平坦区两侧的曲面区；触控 传感器在位于与第一方向上交叉的第二方向的第一侧具有第一邦定区和第二邦定区；第一邦定区和第二邦定区位于触控传感器的远离显示基板一侧的表面上，与平坦区叠置且彼此间隔设置；第一柔性电路板经由第一邦定区和第二邦定区与触控传感器电连接；第一柔性电路板包括主体部以及从主体部突出且彼此间隔设置的第一邦定连接部和第二邦定连接部；以及第一邦定连接部与第一邦定区邦定而彼此电连接，第二邦定连接部与第二邦定区邦定而彼此电连接。例如，该显示模组可以更有效的利用显示模组背面的空间，并实现触控传感器和第一柔性电路板的邦定。
下面通过几个示例或实施例对根据本公开实施例提供的显示模组进行非限制性的说明，如下面所描述的，在不相互抵触的情况下这些具体示例或实施例中不同特征可以相互组合，从而得到新的示例或实施例，这些新的示例或实施例也都属于本公开保护的范围。
图5是本公开至少一个实施例提供的一种显示模组100的正视图。例如，该显示模组100可以是有源矩阵式有机发光二极管显示屏。如图5所示，该显示模组100包括显示基板110(例如，有机发光二极管显示面板)以及设置在显示基板110的显示侧上的触控传感器120。如图5所示，该显示模组100还包括第一柔性电路板130(也即，触控传感器电路板)和第四柔性电路板150(例如，覆晶薄膜)。需要说明的是，图5所示的显示模组100的第一柔性电路板130和第四柔性电路板150均未处于弯折状态。例如，图5所示显示模组100的俯视图可以类似于图4B示出的显示模组的俯视图，不再赘述。
例如，如图5所示，与第一方向D1交叉的第二方向D2具有第一侧191和第二侧192。例如，第二方向D2的第一侧191和第二侧192用于说明显示模组100以及显示模组100的部件在第二方向D2的两侧。例如，第二方向D2的第一侧191和第二侧192可分别用于表示显示模组100在第二方向D2上的第一侧和第二侧。又例如，第二方向D2的第一侧191和第二侧192可分别用于表示显示基板110在第二方向D2上的第一侧和第二侧。再例如，第二方向D2的第一侧191和第二侧192可分别用于表示触控传感器120在第二方向D2上的第一侧和第二侧。
图6A是图5所示的显示模组100的显示基板110和第四柔性电路板150的正视图。如图6A所示，显示基板110在第一方向D1上具有平坦区111以及位于平坦区111两侧的曲面区112，平坦区111和曲面区112之间具有 虚拟的分界线113(也可以被称为弯折起始线113)。需要说明的是，显示基板110的平坦区111、曲面区112和弯折起始线113分别对应于显示模组100的平坦区、曲面区和弯折起始线。
图6B是图6A所示的显示基板110的一个示例。例如，如图6B所示，显示基板110包括阵列排布的多个显示像素单元115，多个显示像素单元115不仅设置在平坦区111，还设置在平坦区111两侧的两个曲面区112。需要说明的是，在其它示例中，多个显示像素单元115还可以仅设置在平坦区111中，而不设置在曲面区112。
例如，如图6B所示，多个显示像素单元115的每个包括像素驱动电路116和与像素驱动电路116的发光元件117。例如，发光元件117为有机发光元件；例如，有机发光元件为有机发光二极管。例如，像素驱动电路116可以实现为2T1C像素驱动电路，即包括两个薄膜晶体管(即驱动晶体管和开关晶体管)以及存储电容，但本公开的实施例不限于此。又例如，像素驱动电路116可以实现为包括其它适用数目的晶体管和电容的像素驱动电路(例如，3T1C电路)。例如，显示基板110还包括多根栅线GL和多根数据线DL，多根栅线GL和多根数据线DL彼此交叉并限定多个显示像素单元115。例如，数据线DL用于连接开关晶体管的源极或漏极，以向开关晶体管提供显示用的数据信号；栅线GL用于连接开关晶体管的栅极，以向开关晶体管提供栅扫描信号。
如图6A所示，显示基板110还包括位于平坦区111的第三邦定区114(例如，第三邦定区114位于显示模组100的第一侧191)；第四柔性电路板150包括第三邦定连接部151，第四柔性电路板150经由第三邦定连接部151和第三邦定区114与显示基板110邦定而与显示基板110电连接。例如，如图6B所示，显示基板110的多根数据线DL延伸到第三邦定区114中(多根数据线DL的一端位于第三邦定区114中)，以与第四柔性电路板150的第三邦定连接部151邦定。
如图6A所示，第四柔性电路板150还包括与第三邦定连接部151连接的主体部152以及设置在第三邦定连接部151的主体部152上的驱动芯片153；驱动芯片153经由第四柔性电路板150与显示基板110邦定而由此与显示基板110电连接，从而第四柔性电路板150包括的驱动芯片153可以经由第四柔性电路板150驱动显示基板110。例如，驱动芯片153包括数据驱动 器、时序控制器T-Con等，驱动芯片153的数据驱动器可经由第四柔性电路板150向多根数据线DL提供显示用的数据信号。例如，显示模组还包括阵列基板上的栅驱动集成(GOA)，GOA的多个输出端分别与多根栅线GL相连，以向多根栅线GL提供栅扫描信号。
需要说明的是，图6A所示的第四柔性电路板150(例如，第四柔性电路板150的第三邦定连接部151)未处于弯折状态；然而，在包括显示模组100的最终产品中，第四柔性电路板150(例如，第四柔性电路板150的第三邦定连接部151)处于弯折状态，且第四柔性电路板150的主体部152位于显示基板110的远离触控传感器120的一侧(也即，被弯折到显示基板110的背面)；驱动芯片153位于显示基板110的远离触控传感器120一侧(例如，驱动芯片153位于第四柔性电路板150的主体部152的远离触控传感器120的一侧)；这些内容将在图9所示的示例中进行详细描述，在此不再赘述。
图7A是图5所示的显示模组100的触控传感器120和第一柔性电路板130的正视图。需要说明的是，为方便描述，图7A还示出了显示基板110的弯折起始线113；可以理解，触控传感器120的位于弯折起始线113两侧的区域在显示模组100最终的产品中处于弯折状态，也即，触控传感器120位于弯折起始线113两侧的区域在显示模组100最终的产品中作为触控传感器120的曲面区。如图5和图7A所示，触控传感器120在位于与第一方向上交叉的第二方向的第一侧具有第一邦定区121和第二邦定区122；第一邦定区121和第二邦定区122位于触控传感器120的远离显示基板110一侧的表面上，与平坦区111叠置且彼此间隔设置，例如，第一邦定区121和第二邦定区122均不与曲面区112叠置。例如，第一邦定区121和第二邦定区122在显示基板110上的正投影(例如，显示基板110的平坦区111所在层上的正投影)位于平坦区111内。
例如，如图5所示，第三邦定区114与第一邦定区121和第二邦定区122在显示基板的平坦区111的正投影部分重叠。又例如，第三邦定114区位于第一邦定区121在显示基板的平坦区111的正投影和第二邦定区122在显示基板的平坦区111的正投影之间。
需要说明的是，触控传感器120在位于与第一方向上交叉的第二方向的第一侧是指触控传感器120在第二方向上的第一侧；触控传感器120在第二方向上的第一侧对应于显示模组的第一侧。
例如，通过使得触控传感器120在位于与第一方向D1上交叉的第二方向D2的第一侧191具有第一邦定区121和第二邦定区122，第一邦定区121和第二邦定区122与平坦区111叠置且彼此间隔设置，以及第一柔性电路板130经由第一邦定区121和第二邦定区122与触控传感器120电连接，可以有效利用显示模组100背面的空间，提升可用于第一柔性电路板130的走线区域的尺寸(可用于第一柔性电路板130的走线区域在第一方向D1上的总体宽度)，由此可以在显示模组100具有曲面区，且不改变驱动芯片153在第一方向D1上的位置的情况下实现第一柔性电路板130与触控传感器120的邦定连接，由此可以避免因改变驱动芯片153在第一方向D1上的位置导致的显示基板110沿第一方向D1的潜在电学不均匀和亮度不均匀问题。
图7B为图7A所示的触控传感器120的一个示例。例如，如图7B所示，该触控传感器120为外挂式触摸屏(Add-on Mode Touch Panel)，外挂式触摸屏与显示基板分开生产，然后贴合到显示基板的显示侧。
例如，如图7B所示，该触控传感器120包括阵列排布的多个自电容电极123以及与多个自电容电极123电连接的多根导线124，也即，该触控传感器120为自电容式触控传感器。例如，如图7B所示，多个自电容电极123不仅设置在显示模组100的平坦区内，还设置在显示模组100的曲面区内，也即，多个自电容电极123在显示基板110上的正投影不仅位于平坦区111，还位于在平坦区111两侧的两个曲面区112。需要说明的是，在其它示例中，多个自电容电极123还可以仅与平坦区111叠置，而不与曲面区112叠置，也即，多个自电容电极123在显示基板110上的正投影仅位于平坦区111，而不位于位于在平坦区111两侧的两个曲面区112。例如，如图7B所示，多根导线124的一部分延伸到触控传感器120的第一邦定区121，多根导线124的另一部分延伸到触控传感器120的第二邦定区122。
例如，如图7A所示，第一柔性电路板130包括主体部131以及从第一柔性电路板130的主体部131突出且彼此间隔设置的第一邦定连接部132和第二邦定连接部133；第一邦定连接部132与第一邦定区121(例如，与第一邦定区121中的导线124)邦定而彼此电连接，第二邦定连接部133与第二邦定区122(例如，与第二邦定区122中的导线124)邦定而彼此电连接。例如，第一柔性电路板130还包括触控侦测芯片(图中未示出)；例如，触控侦测芯片设置在第一柔性电路板130的主体部131上。例如，触控侦测芯片被配置 为经由第一柔性电路板130和多根导线124向多个自电容电极123施加驱动信号，触控侦测芯片还被配置为经由第一柔性电路板130和多根导线124接收多个自电容电极123提供的反馈信号，并基于反馈信号确认是否有自电容电极123被触摸以及被触摸的自电容电极123所处的位置(也即，触控位置)。
需要说明的是，为方便描述，图7所示的第一柔性电路板130未处于弯折状态。然而，在包括显示模组100的最终产品中，第一柔性电路板130处于弯折状态，且第一柔性电路板130的主体部131位于显示基板110的远离触控传感器120的一侧(也即，被弯折到显示基板110的背面)，触控侦测芯片位于第一柔性电路板130的主体部131的远离触控传感器120的一侧，这些内容将在图9所示的示例中进行详细描述，在此不再赘述。
需要说明的是，触控传感器120不限于实现为自电容式触摸屏，还可以不限于实现为互电容式触摸屏。此种情况下，例如，触控传感器120可以包括两层相互异面且相交的条状电极(每层包括多个并列布置的条状电极)，这两层条状电极分别作为触控传感器120的触控驱动电极和触控感应电极。例如，触控驱动电极和触控感应电极可以由透明导电氧化物制成。例如，透明导电氧化物可以为铟锡金属氧化物(Indium Tin Oxides，ITO)。例如，异面且相交的触控驱动电极和触控感应电极之间耦合产生阵列排布的多个互电容。当手指触碰屏幕时，位于手指对应区域的互电容的电容值会发生改变。例如，第一柔性电路板130上的触控侦测芯片可以经由第一柔性电路板130向触控驱动电极提供触控驱动信号，并经由第一柔性电路板130接收触控感应电极提供的触控感应信号。例如，触控侦测芯片可以基于手指触摸前后多个互电容值对应的电流的变化情况确定手指触摸点的位置。
图8是图5所示的显示模组100的一个截面示意图，且图8所示的截面示意图沿图5的BB’线剖切得到。需要说明的是，为方便描述，图8所示的显示模组100的第一柔性电路板130和第四柔性电路板150均未处于弯折状态。如图8所示，触控传感器120和显示基板110在第三方向D3上叠置，且触控传感器120在第三方向D3上位于显示基板110的显示侧(也即，发光侧或图像输出侧)。例如，第一方向D1、第二方向D2和第三方向D3彼此交叉(例如，彼此垂直)。
图9是图5所示的显示模组100的另一个截面示意图，相比于图8所示的截面示意图，在图9所示的截面示意图中，第一柔性电路板130和第四柔 性电路板150均处于弯折状态。如图9所示，部分第四柔性电路板150(第四柔性电路板150的主体部152)和部分第一柔性电路板130(第一柔性电路板130的主体部131、第一柔性电路板130的第一邦定连接部132的部分以及第一柔性电路板130的第二邦定连接部133的部分)均被弯折到显示基板110的背面(也即，显示基板110的远离触控传感器120的一侧)。
图10是图5所示的显示模组100的背视图(也即，从显示模组100背面观察获得的平面示意图)。例如，该显示模组100还包括第三柔性电路板(也即，显示模组100的主电路板)；为方便描述，图10所示的显示模组100的背视图中还示出了第三柔性电路板160。
例如，如图10所示，第三柔性电路板160位于显示基板110的远离触控传感器120的一侧；第三柔性电路板160与第四柔性电路板150(例如，第四柔性电路板150的主体部152)邦定而彼此电连接；例如，第三柔性电路板160可以经由第四柔性电路板150(例如，第四柔性电路板150的主体部152)控制驱动芯片153，并经由驱动芯片153控制显示基板110实现显示功能。
例如，如图10所示，第一柔性电路板130和第三柔性电路板160通过邦定彼此电连接；例如，第三柔性电路板160可以经由第一柔性电路板130控制触控侦测芯片，并经由触控侦测芯片控制触控传感器120实现触控功能。
例如，如图10所示，第一柔性电路板130和第三柔性电路板160在垂直于显示基板110的平坦区111的方向上至少部分重叠。例如，如图10所示，第一柔性电路板130还包括从主体部131凸出的电连接区134，第一柔性电路板130的电连接区134位于主体部131的远离第一邦定连接部132和第二邦定连接部133的一侧；第一柔性电路板130的电连接区134与第三柔性电路板160在垂直于显示基板110的平坦区111的方向(也即，第三方向)上至少部分重叠，由此第一柔性电路板130可经由电连接区134与第三柔性电路板160邦定而彼此电连接。
例如，如图10所示，第三柔性电路板160包括主体部161，从第三柔性电路板160的主体部161凸出的连接部162以及与第三柔性电路板160的连接部162连接的连接端子163。例如，第一柔性电路板130的电连接区134与第三柔性电路板160的主体部161在垂直于显示基板110的平坦区111的方向上至少部分重叠。例如，第三柔性电路板160的连接端子163被配置为与显示装置的主板(图中未示出)相连，以接收主板提供的图像信号等。
例如，如图10所示，第一柔性电路板130的主体部131、第四柔性电路板150的主体部152、驱动芯片153以及第三柔性电路板160的主体部161均设置在显示模组100的平坦区，这是因为第一柔性电路板130的主体部131、第四柔性电路板150的主体部152、驱动芯片153以及第三柔性电路板160的主体部161的材质较硬，将第一柔性电路板130的主体部131、第四柔性电路板150的主体部152、驱动芯片153以及第三柔性电路板160的主体部161设置在平坦区可以避免弯折第一柔性电路板130的主体部131、第四柔性电路板150的主体部152、驱动芯片153以及第三柔性电路板160的主体部161导致的不良。
例如，如图10所示，驱动芯片153在显示基板110上的正投影位于第一柔性电路板130的第一邦定连接部132、第二邦定连接部133和主体部131在显示基板110上的平坦区111的正投影围成的区域中，且与第一柔性电路板130的第一邦定连接部132、第二邦定连接部133和主体部131在显示基板110上的平坦区111的正投影间隔设置，由此可以避免第一柔性电路板130覆盖驱动芯片153导致的不良。
例如，如图10所示，第一邦定连接部132和第二邦定连接部133在第一方向D1上位于驱动芯片153的两侧。例如，如图10所示，第一柔性电路板130的第一邦定连接部132、第二邦定连接部133和主体部131构成开口，且开口暴露驱动芯片153，由此可以避免第一柔性电路板130覆盖驱动芯片153导致的不良。
例如，如图10所示，第一柔性电路板130的主体部131位于第三柔性电路板160(例如，第三柔性电路板160的主体部161)的远离显示基板110的一侧。例如，如图10所示，第三柔性电路板160的主体部161、第四柔性电路板150的主体部152和第一柔性电路板130的主体部顺次设置在显示基板110的远离触控传感器120的一侧，且相比于第一柔性电路板130的主体部，第三柔性电路板160的主体部161更靠近显示基板110。
需要说明的是，第三柔性电路板160的主体部161、第四柔性电路板150的主体部152和第一柔性电路板130的主体部在垂直于显示基板110的平坦区111的方向的位置关系不限于图10所示的示例。在一个示例中，第四柔性电路板150的主体部152、第一柔性电路板130的主体部131和第三柔性电路板160的主体部161顺次设置在显示基板110的远离触控传感器120的一侧， 且相比于第三柔性电路板160的主体部161，第四柔性电路板150的主体部152更靠近显示基板110。在另一个示例中，第四柔性电路板150的主体部152、第三柔性电路板160的主体部161和第一柔性电路板130的主体部131顺次设置在显示基板110的远离触控传感器120的一侧，且相比于第一柔性电路板130的主体部131，第四柔性电路板150的主体部152更靠近显示基板110。
需要说明的是，图5和图10所示的第一柔性电路板130、第四柔性电路板150、第三柔性电路板160的形状、连接和排布仅为示例，本公开的实施例不限于此。图11是本公开至少一个实施例提供的另一种显示模组100的触控传感器120和第一柔性电路板130的正视图，图12是图11所示的显示模组100的背视图。例如，第一柔性电路板130、第四柔性电路板150(第四柔性电路板150的主体部152和驱动芯片153)、第三柔性电路板160的形状、连接和排布还可以采用图11和图12所示的示例。
现在重新参考图8和图9，例如，显示模组100还包括邦定支撑结构141；邦定支撑结构141分别与第一邦定连接部132和第二邦定连接部133在垂直于显示基板110的平坦区111的方向上叠置，且位于第一柔性电路板130的第一邦定连接部132与触控传感器120接触的部分的远离触控传感器120的一侧。例如，通过设置邦定支撑结构141，可以避免第一柔性电路板130被弯折时第一邦定连接部132的端部(也即，第一邦定连接部132与触控传感器120接触的部分)和第二邦定连接部133端部(也即，第二邦定连接部133与触控传感器120接触的部分)翘起，以及第一邦定连接部132的端部和第二邦定连接部133端部翘起导致的邦定失效，由此可以提升触控传感器120与第一柔性电路板130邦定连接的鲁棒性和信赖性。
例如，邦定支撑结构141的材料可以根据实际应用需求进行设定，本公开的实施例对此不作具体限定。例如，邦定支撑结构141可以为泡棉层或聚对苯二甲酸乙二醇酯层，此种情况下，邦定支撑结构141不仅可以提升触控传感器120与第一柔性电路板130邦定连接的鲁棒性和信赖性，还可以避免第一邦定连接部132的端部和第二邦定连接部133端部反光，由此可以避免显示模组100的显示效果的劣化。
例如，邦定支撑结构141可以包括在第一方向间隔设置的第一邦定支撑结构和第二邦定支撑结构，且第一邦定支撑结构和第二邦定支撑结构分别与第一邦定连接部132的端部和第二邦定连接部133的端部叠置。又例如，邦 定支撑结构141可以不仅与第一邦定连接部132的端部和第二邦定连接部133的端部叠置，还与第一邦定连接部132的端部和第二邦定连接部133的端部之间的间隙叠置。
例如，如图8和图9所示，显示模组100还包括盖板142。盖板142位于设置在显示基板110的显示侧，且位于触控传感器120的远离显示基板110的一侧。例如，盖板142可用于防护该显示模组100的相关膜层不被划伤。例如，盖板142可以为透明基板。例如，透明基板可以是玻璃基板、石英基板、塑料基板(例如聚对苯二甲酸乙二醇酯(PET)基板)或者由其它适用的材料制成的基板。例如，盖板142的位于显示模组100的曲面区的部分具有一定的弯折曲率，由此显示基板110和触控传感器120位于显示模组100的曲面区的部分可以沿着盖板142的弯折曲率进行弯折。
例如，如图8和图9所示，邦定支撑结构141夹置在第一柔性电路板130和盖板142之间；此种情况下，盖板142不仅具有防护该显示模组100的相关膜层不被划伤的功能，还可以经由邦定支撑结构141向第一邦定连接部132的端部和第二邦定连接部133端部施加向下的作用力，由此可以进一步提升触控传感器120与第一柔性电路板130邦定连接的鲁棒性和信赖性。例如，如图8和图9所示，邦定支撑结构141与第一柔性电路板130和盖板142均直接接触。
例如，显示模组100还包括偏光片143。例如，该偏光片143为圆偏光片。例如，偏光片143位于触控传感器120与盖板142之间。例如，偏光片143(例如，圆偏光片)可以缓解反射光(源于显示基板对环境光线的反射)引起的对比度变差、显示质量降低的问题。
例如，显示模组100还包括设置在偏光片143和盖板142之间以及触控传感器120和显示基板110之间的粘合层144，粘合层144例如可以为光学胶。例如，光学胶144可以为OCA(Optically Clear Adhesive)光学胶。
例如，邦定支撑结构141和第一邦定连接部132在垂直于显示基板110的平坦区111的方向上的厚度之和实质上等于触控传感器120与盖板142之间的间距在垂直于显示基板110的平坦区111的方向上的厚度；此种情况下，邦定支撑结构141可以与第一柔性电路板130和盖板142均直接接触，由此盖板142还可以经由邦定支撑结构141向第一邦定连接部132的端部和第二邦定连接部133端部施加向下的作用力，以进一步提升触控传感器120与第 一柔性电路板130邦定连接的鲁棒性和信赖性。
例如，邦定支撑结构141和第一邦定连接部132在垂直于显示基板110的平坦区111的方向上的厚度之和实质上等于偏光片143和粘合层144(位于盖板142和偏光片143之间的粘合层144)在垂直于显示基板110的平坦区111的方向上的厚度之和。
图13是本公开至少一个实施例提供的再一种显示模组200的正视图。例如，该显示模组200可以是有源矩阵式有机发光二极管显示屏。如图13所示，该显示模组200包括显示基板210(例如，有机发光二极管显示面板)以及设置在显示基板210的显示侧上的触控传感器220。如图13所示，该显示模组200还包括第一柔性电路板230(也即，触控传感器220电路板)。需要说明的是，图13所示的显示模组200的第一柔性电路板230均未处于弯折状态且显示基板210的折叠部未处于折叠状态。
图14A是图13所示的显示模组200的显示基板210和驱动芯片250的正视图。如图14A所示，第二方向D2具有第一侧291和第二侧292。例如，第二方向D2的第一侧291和第二侧292用于说明显示模组200以及显示模组200的部件在第二方向D2的两侧。例如，第二方向D2的第一侧291和第二侧292可分别用于表示触控传感器220在第二方向D2上的第一侧和第二侧。又例如，第二方向D2的第一侧291和第二侧292可分别用于表示基板主体部211在第二方向D2上的第一侧和第二侧。
如图14A所示，显示基板210包括基板主体部211以及在第一侧291(基板主体部211的第一侧)从基板主体部211凸出的折叠部212。例如，显示基板210的折叠部212靠近还包括设置在显示基板210的基板主体部211和显示基板210的折叠部212之间的弯折部(图中未标示)，弯折部的对置侧分别与显示基板210的基板主体部211和折叠部212相连。例如，在显示模组200的最终产品中，显示基板210的弯折部被弯折，且显示基板210的折叠部212被弯折到基板主体部211的远离触控传感器220的一侧，也即，在显示模组200的最终产品中，显示基板210处于折叠状态。
例如，显示基板210的弯折部配置为可以使得基板主体部211和折叠部212在垂直于基板主体部211的方向上彼此平行且叠置。例如，显示基板210的折叠部212和弯折部均位于显示基板210的周边区域，显示基板210的显示区域位于显示基板210的基板主体部211中。例如，通过设置弯折部和折 叠部212，可以减小基板主体部211所在平面中周边区域的面积，有利于显示模组200的窄边框设计。
如图14A所示，基板主体部211包括平坦区213以及曲面区214，平坦区213和曲面区214之间具有虚拟的分界线(也可以被称为弯折起始线215)。需要说明的是，显示基板210的平坦区213、曲面区214和弯折起始线215分别对应于显示模组200的平坦区、曲面区和弯折起始线。
例如，如图14A和图17所示，显示模组200还包括位于显示基板210的远离触控传感器220一侧的驱动芯片250。例如，驱动芯片250包括数据驱动器、栅极驱动器、时序控制器T-Con等。如图14A所示，驱动芯片250位于折叠部212的远离触控传感器220一侧(远离基板主体部211的一侧)，且驱动芯片250直接邦定(例如，直接形成)在折叠部212上，而由此与显示基板210电连接。例如，通过使得驱动芯片250直接邦定(例如，直接形成，直接集成)在折叠部212上，可以在不使用柔性电路板的情况下实现驱动芯片250和显示基板210的电连接，由此可以简化显示模组200的结构。
图14B是图14A所示的显示基板210和驱动芯片250的一个示例。例如，如图6B所示，显示基板210包括多根栅线GL和多根数据线DL，多根栅线GL和多根数据线DL彼此交叉并限定阵列排布的多个显示像素单元216；多个显示像素单元216的每个包括像素驱动电路217和与像素驱动电路217的发光元件218。例如，如图6B所示，显示基板210的多根数据线DL直接与驱动芯片250直接邦定而彼此电连接，驱动芯片250的数据驱动器可经由数据线DL向像素驱动电路217提供显示用的数据信号，驱动芯片250的栅极驱动器可经由栅线GL向像素驱动电路217提供显示用的栅扫描信号，由此驱动芯片250可以驱动显示基板210实现显示功能。例如，驱动芯片250直接形成在折叠部212上，且驱动芯片250与延伸到折叠部212中的多根数据线DL电连接。例如，驱动芯片250还可以与多根栅线GL电连接。例如，图14B所示的显示像素单元216、栅线GL、数据线DL和驱动芯片250的其它描述可以参见图6B所示的示例，在此不再赘述。
图14C是图13所示的显示模组200的触控传感器220和第一柔性电路板230的正视图。需要说明的是，为方便描述，图14C还示出了显示基板210的弯折起始线215；可以理解，位于弯折起始线215两侧的触控传感器220在显示模组200最终的产品中处于弯折状态。需要说明的是，图14C所示的 第一柔性电路板230未处于弯折状态。
如图13和图14C所示，触控传感器220在第二方向D2的第一侧291具有第一邦定区221和第二邦定区222；第一邦定区221和第二邦定区222与平坦区213叠置且在第一方向D1上彼此间隔设置，也即，第一邦定区221和第二邦定区222在显示基板210上的正投影仅位于平坦区213内。例如，第一邦定区221和第二邦定区222均不与曲面区214叠置。
例如，通过使得触控传感器220在位于与第一方向D1上交叉的第二方向D2的第一侧291具有第一邦定区221和第二邦定区222，第一邦定区221和第二邦定区222位于触控传感器220的远离显示基板210一侧的表面上，与平坦区213叠置且彼此间隔设置，以及第一柔性电路板230经由第一邦定区221和第二邦定区222与触控传感器220电连接，可以有效利用显示模组200背面的空间，提升可用于第一柔性电路板230的走线区域的尺寸(可用于第一柔性电路板230的走线区域的在第一方向D1上的总体宽度)，由此可以在显示模组200具有曲面区，且不改变驱动芯片250在第一方向D1上的位置的情况下实现第一柔性电路板230与触控传感器220的邦定连接，由此可以避免因改变驱动芯片250在第一方向D1上的位置导致的显示基板210沿第一方向D1的潜在电学不均匀和亮度不均匀问题。
例如，如图14C所示，第一柔性电路板230包括主体部231以及从第一柔性电路板230的主体部231突出且彼此间隔设置的第一邦定连接部232和第二邦定连接部233；第一邦定连接部232与第一邦定区221(例如，与第一邦定区221中的导线)邦定而彼此电连接，第二邦定连接部233与第二邦定区222(例如，与第二邦定区222中的导线)邦定而彼此电连接。例如，图14C所示的触控传感器220和第一柔性电路板230的具体实现方式可以参见图7A和图7B所示的示例，在此不再赘述。
图15是图13所示的显示模组200的一个截面示意图，且图15所示的截面示意图沿图13的CC’线剖切得到。图6所示的显示模组200的第一柔性电路板230和显示基板210的弯折部均未处于弯折状态。如图8所示，触控传感器220和显示基板210在第三方向D3上叠置，且触控传感器220在第三方向D3上位于显示基板210的显示侧(也即，发光侧或图像输出侧)。例如，第一方向D1、第二方向D2和第三方向D3彼此交叉(例如，彼此垂直)。
图16是图13所示的显示模组200的另一个截面示意图，相比于图15所示的截面示意图，在图16所示的截面示意图中，第一柔性电路板230和显示基板210的弯折部均处于弯折状态。如图16所示，显示基板210的折叠部212和部分第一柔性电路板230(第一柔性电路板230的主体部231、部分第一邦定连接部232以及部分第二邦定连接部233)均被弯折到显示基板210的背面(也即，显示基板210的远离触控传感器220的一侧)。
如图15和图16所示，显示模组200还包括邦定支撑结构241、盖板242、偏光片243和粘合层244。例如，邦定支撑结构241、盖板242、偏光片243和光学胶244的具体实现方式可以参见图8和图9所示的邦定支撑结构141、盖板142、偏光片143和粘合层144，在此不再赘述。
图17是图13所示的显示模组200的背视图。例如，该显示模组200还包括第三柔性电路板260(也即，显示模组200的主电路板)；为方便描述，图17是所示的背视图中还示出了第三柔性电路板260。
如图17所示，第三柔性电路板260位于显示基板210的基板主体部211的远离触控传感器220的一侧；第一柔性电路板230和第三柔性电路板260通过邦定彼此电连接。例如，如图17所示，第一柔性电路板230和第三柔性电路板260在垂直于显示基板210的平坦区213的方向上至少部分重叠。例如，如图17所示，第一柔性电路板230还包括从第一柔性电路板230的主体部231凸出的电连接区234，第一柔性电路板230的电连接区234位于主体部231的远离第一邦定连接部232和第二邦定连接部233的一侧；第一柔性电路板230的电连接区234与第三柔性电路板260在垂直于显示基板210的平坦区213的方向上至少部分重叠，由此第一柔性电路板230可经由电连接区234与第三柔性电路板260邦定而彼此电连接。例如，第一柔性电路板230还包括触控侦测芯片，第三柔性电路板260可以经由第一柔性电路板230控制触控侦测芯片，并经由触控侦测芯片控制触控传感器220实现触控功能。
例如，第三柔性电路板260还与驱动芯片250邦定而彼此电连接，由此第三柔性电路板260可以经由驱动芯片250控制显示基板210实现显示功能。
例如，如图17所示，第三柔性电路板260包括主体部261，从第三柔性电路板260的主体部261凸出的连接部262以及与第三柔性电路板260的连接部262连接的连接端子263。例如，第三柔性电路板260的连接端子263被配置为与主板相连，以接收主板提供的图像信号等。例如，如图7所示， 第一柔性电路板230的主体部231、基板主体部211、驱动芯片250以及第三柔性电路板260的主体部261均设置在显示模组200的平坦区。
例如，如图17所示，驱动芯片250在显示基板210的平坦区213上的正投影位于第一柔性电路板230的第一邦定连接部232、第二邦定连接部233和主体部231在显示基板210的平坦区213上的正投影围成的区域中，且与第一柔性电路板230的第一邦定连接部232、第二邦定连接部233和主体部231在显示基板210的平坦区213上的正投影间隔设置，由此可以避免第一柔性电路板230覆盖驱动芯片250导致的不良。
例如，如图17所示，第一柔性电路板230的第一邦定连接部232、第二邦定连接部233和主体部231构成开口，且开口暴露驱动芯片250，由此可以避免第一柔性电路板230覆盖驱动芯片250导致的不良。
例如，如图17所示，第三柔性电路板260的主体部261、显示基板210的折叠部212和第一柔性电路板230的主体部231顺次设置在显示基板210的基板主体部211的远离触控传感器220的一侧，且相比于第一柔性电路板230的主体部231，第三柔性电路板260的主体部261更靠近显示基板210的基板主体部211。
需要说明的是，第三柔性电路板260的主体部261、显示基板210的折叠部212和第一柔性电路板230的主体部231在垂直于显示基板210的平坦区231的方向的位置关系不限于图17所示的示例。在一个示例中，显示基板210的折叠部212、第一柔性电路板230的主体部231和第三柔性电路板260的主体部261顺次设置在显示基板210的基板主体部211的远离触控传感器220的一侧，且相比于第三柔性电路板260的主体部261，显示基板210的折叠部212更靠近显示基板210的基板主体部211。在另一个示例中，显示基板210的折叠部212、第三柔性电路板260的主体部261和第一柔性电路板230的主体部231和顺次设置在显示基板210的基板主体部211的远离触控传感器220的一侧，且相比于第一柔性电路板230的主体部231，显示基板210的折叠部212更靠近显示基板210的基板主体部211。
需要说明的是，图17所示的显示模组200的驱动芯片250不限于直接邦定在基板主体部211上，在一些示例中，驱动芯片250还可以经由柔性电路板邦定在基板主体部211上。下面结合图18A、图18B和图19进行示例性说明。
图18A是本公开至少一个实施例提供的又再一种显示模组200的显示基板210和第二柔性电路板270的正视图。图18A所示的显示模组200与图13所示的显示模组200类似，因此此处将仅阐述两者的不同之处，相同之处不再赘述。
如图18A所示，该显示模组200还包括第二柔性电路板270，第二柔性电路板270包括驱动芯片250；第二柔性电路板270与显示基板210邦定而彼此电连接，由此实现了驱动芯片250与显示基板210的邦定连接。图18B是图18A所示的显示基板210和第二柔性电路板270的一个示例。如图18B所示，第二柔性电路板270与显示基板210的数据线DL邦定连接，由此驱动芯片250经由第二柔性电路板270与显示基板210的数据线DL电连接。
图19是图18A所示的显示模组200的背视图。如图19所示，第二柔性电路板270位于折叠部212的远离基板主体部211的一侧且与折叠部212邦定，驱动芯片250位于第二柔性电路板270远离折叠部212一侧。如图19所示，显示模组200还包括位于显示基板210的基板主体部211的远离触控传感器220的一侧第三柔性电路板260，第三柔性电路板260包括主体部261，第三柔性电路板260的主体部261与第二柔性电路板270邦定而彼此电连接，因此，第三柔性电路板260可经由驱动芯片250驱动显示基板210。
例如，如图19所示，驱动芯片250在显示基板210的平坦区213上的正投影位于第一柔性电路板230的第一邦定连接部232、第二邦定连接部233和主体部231在显示基板210的平坦区213上的正投影围成的区域中，且与第一柔性电路板230的第一邦定连接部232、第二邦定连接部233和主体部231在显示基板210的平坦区213上的正投影间隔设置，由此可以避免第一柔性电路板230覆盖驱动芯片250导致的不良。
例如，如图19所示，第三柔性电路板260的主体部261、显示基板210的折叠部212、第二柔性电路板270和第一柔性电路板230的主体部231顺次设置在显示基板210的基板主体部211的远离触控传感器220的一侧，且相比于第一柔性电路板230的主体部231，第三柔性电路板260的主体部261更靠近显示基板210的基板主体部211。
需要说明的是，第三柔性电路板260的主体部261、显示基板210的折叠部212、第二柔性电路板270和第一柔性电路板230的主体部231在垂直于显示基板210的平坦区231的方向的位置关系不限于图19所示的示例。在一个 示例中，显示基板210的折叠部212、第二柔性电路板270、第一柔性电路板230的主体部231和第三柔性电路板260的主体部261顺次设置在显示基板210的基板主体部211的远离触控传感器220的一侧，且相比于第三柔性电路板260的主体部261，显示基板210的折叠部212更靠近显示基板210的基板主体部211。在另一个示例中，显示基板210的折叠部212、第二柔性电路板270、第三柔性电路板260的主体部261和第一柔性电路板230的主体部231顺次设置在显示基板210的基板主体部211的远离触控传感器220的一侧，且相比于第一柔性电路板230的主体部231，显示基板210的折叠部212更靠近显示基板210的基板主体部211。
本公开的至少一个实施例还提供了一种显示装置。图20是本公开至少一个实施例提供的显示装置的示例性框图。如图20所示，该显示装置包括本公开的至少一个实施例提供的任一显示模组。
需要说明的是，对于该显示模组和显示装置的其它组成部分(例如，图像数据编码/解码装置、时钟电路等)可以采用适用的部件，这些均是本领域的普通技术人员所应该理解的，在此不做赘述，也不应作为对本公开的限制。
虽然上文中已经用一般性说明及具体实施方式，对本公开作了详尽的描述，但在本公开实施例基础上，可以对之作一些修改或改进，这对本领域技术人员而言是显而易见的。因此，在不偏离本公开精神的基础上所做的这些修改或改进，均属于本公开要求保护的范围。
以上所述仅是本公开的示范性实施方式，而非用于限制本公开的保护范围，本公开的保护范围由所附的权利要求确定。

Claims (17)

  1. 一种显示模组，包括：第一柔性电路板、显示基板以及设置在所述显示基板的显示侧上的触控传感器；
    其中，所述显示基板在第一方向上具有平坦区以及位于所述平坦区两侧的曲面区；
    所述触控传感器在位于与所述第一方向上交叉的第二方向的第一侧具有第一邦定区和第二邦定区；
    所述第一邦定区和所述第二邦定区位于所述触控传感器的远离所述显示基板一侧的表面上，与所述平坦区叠置且彼此间隔设置；
    所述第一柔性电路板经由所述第一邦定区和所述第二邦定区与所述触控传感器电连接；
    所述第一柔性电路板包括主体部以及从所述主体部突出且彼此间隔设置的第一邦定连接部和第二邦定连接部；以及
    所述第一邦定连接部与所述第一邦定区邦定而彼此电连接，所述第二邦定连接部与所述第二邦定区邦定而彼此电连接。
  2. 根据权利要求1所述的显示模组，其中，所述第一柔性电路板的第一邦定连接部和第二邦定连接部被弯折，所述第一柔性电路板的主体部位于所述显示基板的远离所述触控传感器的一侧。
  3. 根据权利要求2所述的显示模组，还包括：位于所述显示基板的远离所述触控传感器一侧的驱动芯片，
    其中，所述驱动芯片被配置为驱动所述显示基板；以及
    所述驱动芯片在所述显示基板的平坦区上的正投影位于所述第一柔性电路板的第一邦定连接部、第二邦定连接部和主体部在所述显示基板的平坦区上的正投影围成的区域中，且与所述第一柔性电路板的第一邦定连接部、第二邦定连接部和主体部在所述显示基板的平坦区上的正投影间隔设置。
  4. 根据权利要求3所述的显示模组，其中，所述显示基板还包括：基板主体部以及在所述第一侧从所述基板主体部凸出的折叠部；
    所述基板主体部包括所述平坦区以及所述曲面区；以及
    所述折叠部被弯折到所述基板主体部的远离所述触控传感器的一侧。
  5. 根据权利要求4所述的显示模组，其中，所述驱动芯片位于所述折叠 部的远离所述触控传感器一侧，且所述驱动芯片邦定在所述折叠部上。
  6. 根据权利要求4所述的显示模组，其中，所述显示模组还包括第二柔性电路板，所述第二柔性电路板位于所述折叠部的远离所述基板主体部的一侧且与所述折叠部邦定，所述驱动芯片位于所述第二柔性电路板的远离所述折叠部一侧。
  7. 根据权利要求4-6任一所述的显示模组，还包括第三柔性电路板，
    其中，所述第三柔性电路板位于所述显示基板的远离所述触控传感器的一侧；
    所述第一柔性电路板和所述第三柔性电路板通过邦定而彼此电连接；以及
    所述第三柔性电路板和所述第二柔性电路板通过邦定而彼此电连接，或者所述第三柔性电路板和所述驱动芯片通过邦定而彼此电连接。
  8. 根据权利要求3所述的显示模组，还包括第四柔性电路板，
    其中，所述第四柔性电路板包括第三邦定连接部；
    所述显示基板还包括位于所述平坦区的第三邦定区；
    所述第三邦定区与所述第一邦定区和所述第二邦定区在所述显示基板的平坦区的正投影部分重叠或者所述第三邦定区位于所述第一邦定区在所述显示基板的平坦区的正投影和所述第二邦定区在所述显示基板的平坦区的正投影之间；以及
    所述第四柔性电路板经由所述第三邦定连接部和所述第三邦定区与所述显示基板邦定而电连接。
  9. 根据权利要求8所述的显示模组，其中，所述第四柔性电路板还包括与所述第三邦定连接部连接的主体部；以及
    所述第四柔性电路板的第三邦定连接部被弯折，所述第四柔性电路板的主体部位于所述显示基板的远离所述触控传感器的一侧。
  10. 根据权利要求9所述的显示模组，其中，所述第四柔性电路板还包括所述驱动芯片，所述驱动芯片位于所述第四柔性电路板的主体部的远离所述触控传感器的一侧。
  11. 根据权利要求8-10任一所述的显示模组，还包括第三柔性电路板，
    其中，所述第三柔性电路板位于所述显示基板的远离所述触控传感器的一侧；
    所述第一柔性电路板和所述第三柔性电路板通过邦定而彼此电连接；以及
    所述第三柔性电路板与所述第四柔性电路板通过邦定而彼此电连接。
  12. 根据权利要求11所述的显示模组，其中，所述第一柔性电路板的主体部位于所述第三柔性电路板的远离所述显示基板的一侧；
    所述第一柔性电路板还包括从所述主体部凸出的电连接区，所述第一柔性电路板的电连接区位于所述第一柔性电路板的主体部的远离所述第一邦定连接部和所述第二邦定连接部的一侧；
    所述第一柔性电路板的电连接区和所述第三柔性电路板在垂直于所述显示基板的方向上至少部分重叠；以及
    所述第一柔性电路板经由所述电连接区与所述第三柔性电路板邦定而彼此电连接。
  13. 根据权利要求1-12任一所述的显示模组，还包括邦定支撑结构和盖板，
    其中，所述邦定支撑结构分别与所述第一邦定连接部和所述第二邦定连接部在垂直于所述显示基板的平坦区的方向上叠置，且位于所述第一柔性电路板的第一邦定连接部与所述触控传感器接触的部分的远离所述触控传感器的一侧；
    所述盖板位于所述显示基板的显示侧，且位于所述触控传感器的远离所述显示基板的一侧；以及
    所述邦定支撑结构夹置在所述第一柔性电路板和所述盖板之间。
  14. 根据权利要求13所述的显示模组，其中，所述邦定支撑结构为泡棉层或聚对苯二甲酸乙二醇酯层。
  15. 根据权利要求13或14所述的显示模组，还包括偏光片，其中，所述偏光片位于所述触控传感器与所述盖板之间；
    所述邦定支撑结构和所述第一邦定连接部在垂直于所述显示基板的平坦区的方向上的厚度之和实质上等于所述触控传感器与所述盖板之间的间距在垂直于所述显示基板的平坦区的方向上的厚度。
  16. 根据权利要求15所述的显示模组，还包括粘合层，
    其中，所述粘合层位于所述盖板和所述偏光片之间；以及
    所述邦定支撑结构和所述第一邦定连接部在垂直于所述显示基板的平坦 区的方向上的厚度之和实质上等于所述偏光片和所述粘合层在垂直于所述显示基板的平坦区的方向上的厚度之和。
  17. 一种显示装置，包括如权利要求1-16任一所述的显示模组。
PCT/CN2019/115063 2019-11-01 2019-11-01 显示模组和显示装置 WO2021081988A1 (zh)

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