WO2020238261A1 - Composition de résine d'encapsulation pour un dispositif discret smt d'écran d'affichage à del et application associée - Google Patents

Composition de résine d'encapsulation pour un dispositif discret smt d'écran d'affichage à del et application associée Download PDF

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WO2020238261A1
WO2020238261A1 PCT/CN2020/072357 CN2020072357W WO2020238261A1 WO 2020238261 A1 WO2020238261 A1 WO 2020238261A1 CN 2020072357 W CN2020072357 W CN 2020072357W WO 2020238261 A1 WO2020238261 A1 WO 2020238261A1
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epoxy resin
anhydride
inorganic oxide
polymer particles
organic polymer
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PCT/CN2020/072357
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English (en)
Chinese (zh)
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谭晓华
于会云
单秋菊
孙绪筠
冯亚凯
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天津德高化成新材料股份有限公司
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Priority to JP2020535013A priority Critical patent/JP7017636B2/ja
Publication of WO2020238261A1 publication Critical patent/WO2020238261A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Definitions

  • the invention relates to an encapsulating resin composition for an LED display screen patch type discrete device and its use.
  • LED devices have gradually tended to be miniaturized, and chip size and lamp bead spacing have been simultaneously reduced.
  • Traditional LED packaging materials show many defects in materials and technology, mainly in the following aspects.
  • the EMC lamp beads emitting light from five sides are smaller in size, and the spacing is closer, and the risk of exposed leads or pins after cutting is greater.
  • the packaging layer becomes thinner the protective effect of the chip gradually weakens. Therefore, it is necessary to strengthen the airtight protection of the chip, which requires the packaging material to have high reliability, especially moisture resistance.
  • traditional packaging materials have poor moisture resistance, resulting in reduced chip reliability.
  • the encapsulating resin is required to have better light decay resistance.
  • the light decay resistance of silicone resin is better than that of epoxy resin, but the hardness of silicone resin is lower, the adhesion to the substrate is smaller, and the air tightness is poor. Therefore, it is difficult to meet the high reliability requirements.
  • ordinary epoxy resins have poor resistance to light decay and are difficult to meet optical requirements.
  • the packaging materials currently used cause uneven light output from each angle of the R, G, and B three-color chips, and the large-angle color has a serious deviation with the viewing angle.
  • the ink color of the screen Inconsistent.
  • the encapsulating resin is required to have good light transmittance.
  • traditional encapsulating materials have high transparency materials and serious warpage; while materials with small warpage have the problem of poor transparency. At present, there is no report to resolve the contradiction between light transmittance and warpage.
  • Chinese Patent CN 105229808 A proposes to add inorganic fillers to solve the warpage problem, which is applied to the reflector material formed by surrounding the metal lead frame and the optical semiconductor element on the optical semiconductor device, rather than the packaging material used to package and protect the chip.
  • the problem solved by the patent is the warpage caused by the bracket itself, rather than the warpage caused by the injection molding of the packaging material.
  • the epoxy resin composition disclosed in this patent needs to have a strong reflective effect, and therefore does not have light transmittance.
  • Patent CN 105518882 A uses light-scattering organic fillers to improve light output efficiency.
  • the used organic filler has an average particle size of 5-15 ⁇ m. If the average particle size is too large, it will be very different from the wavelength of the light wave, which will facilitate the passage of light but reduce the scattering effect.
  • Patent CN 109243313 A mixes melanin with a total weight of 1 ⁇ to 6 ⁇ of epoxy resin to improve the contrast of the display screen. Too much melanin will affect the heat dissipation and light transmittance of LED components. When the amount of melanin added exceeds 0.1%, the brightness of the light-emitting chip drops below 1%, which limits its application in the field of display screens.
  • the purpose of the present invention is to overcome the deficiencies of the prior art, and provide a resin composition for LED display patch type discrete devices with low light decay, warpage resistance, moisture resistance, uniform light output from all angles and high contrast.
  • the second object of the present invention is to provide a use of the encapsulating resin composition for the chip discrete device of the LED display screen.
  • An encapsulating resin composition for LED display screen patch type discrete devices which is characterized by comprising a first type epoxy resin, a second type epoxy resin, acid anhydride, inorganic oxide beads, organic polymer particles and melanin.
  • the mass of the first type epoxy resin is 10 to 61 parts
  • the mass of the second type epoxy resin is 0-60 parts
  • the amount of acid anhydride is the same as the epoxy groups of the first type epoxy resin and the second type epoxy resin.
  • the mass is equal molar ratio
  • the mass of inorganic oxide beads is 5-60 parts
  • the mass of organic polymer particles is the total mass of the first type epoxy resin, second type epoxy resin, acid anhydride and inorganic oxide beads 0.1%-1%
  • the mass of melanin is 0.01%-0.1% of the total mass of the first type epoxy resin, the second type epoxy resin, acid anhydride and inorganic oxide microbeads.
  • the first type epoxy resin is at least one of cycloaliphatic epoxy resin and glycidyl isocyanurate;
  • the cycloaliphatic epoxy resin is poly[(2-oxiranyl)-1,2-cyclohexanediol] 2-ethyl-2-(hydroxymethyl)-1,3-propanediol ether, 3,4-epoxycyclohexyl methyl 3,4-epoxycyclohexyl formate or CELLOXIDE 8000.
  • the glycidyl isocyanurate is triglycidyl isocyanurate, diglycidyl isocyanurate or monoglycidyl isocyanurate.
  • the second type of epoxy resin is bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol F epoxy resin or epoxy silica gel composite epoxy resin.
  • the acid anhydride is tetrahydrophthalic anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, hydrogenated pyromellitic dianhydride, maleic anhydride, methyltetrahydrophthalic anhydride , Hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, nadic anhydride, dodecenyl succinic anhydride, methyl nadic anhydride, hydrogenated methyl nadic anhydride, glutaric anhydride, methyl cyclohexane At least one of enetetracarboxylic dianhydrides.
  • M1 B, Al
  • M2 Mg, Ca, Sr , Zn.
  • the central particle size of the inorganic oxide beads is 5-30 ⁇ m.
  • composition according to claim 1 or 2 wherein the organic polymer particles are at least one of silicone polymer particles, phenol resin particles, polystyrene particles, and polymethyl methacrylate particles,
  • the average particle size of the organic polymer particles is less than 5 ⁇ m.
  • the melanin is at least one of nano carbon black, nano copper oxide and nano manganese oxide.
  • the encapsulating resin composition of the present invention can be applied to a patch type discrete RGB device for display screens.
  • the device includes a five-sided independent light source containing a set of R, G, and B chips, and a module containing 4 sets of RGB chips.
  • the packaging composition of the present invention is applied to the above device packaging, which can improve the moisture resistance, light emission uniformity and contrast of the device, while reducing the warpage generated during the packaging process.
  • the encapsulating resin composition also has the characteristics of low light attenuation for the blue light source in the RGB device, and prolongs the service life of the RGB device.
  • FIG. 1 is a schematic diagram of an LED display screen patch type discrete RGB device encapsulated by the encapsulating resin composition of the present invention.
  • Fig. 2 is a schematic diagram of a front view of a discrete device (4in1) of the LED display screen patch type 4 groups of RGB chip modular light sources encapsulated by the encapsulating resin composition.
  • the components used in the present invention are as follows.
  • the first type of epoxy resin is the first type of epoxy resin.
  • CELLOXIDE 2021P epoxy equivalent 125, Daicel Chemical Industry Co., Ltd., referred to as CELLOXIDE 2021P;
  • Daicel CELLOXIDE 8000 epoxy equivalent is 100, Daicel Chemical Industry Co., Ltd., referred to as CELLOXIDE8000.
  • Triglycidyl isocyanurate, TGIC-D epoxy equivalent of 100, Changzhou Niutang Chemical Factory Co., Ltd., TGIC-D for short.
  • DGIC Diglycidyl isocyanurate, epoxy equivalent 120, referred to as DGIC.
  • MGIC Monoglycidyl isocyanurate, epoxy equivalent 185
  • the second type of epoxy resin is the second type of epoxy resin.
  • JER1002 Bisphenol A epoxy resin, JER1002, epoxy equivalent of 600-700, Mitsubishi Chemical Corporation, referred to as JER1002.
  • Bisphenol A epoxy resin, JER1004, epoxy equivalent is 875 ⁇ 975, Mitsubishi Chemical Corporation, referred to as JER1004.
  • Bisphenol A epoxy resin, JER1007, epoxy equivalent is 1750-2200, Mitsubishi Chemical Corporation, referred to as JER1007.
  • JER1009 Bisphenol A epoxy resin, JER1009, epoxy equivalent of 2400-3300, Mitsubishi Chemical Corporation, referred to as JER1009.
  • Bisphenol A epoxy resin, JER1010, epoxy equivalent is 3000 ⁇ 5000, Mitsubishi Chemical Corporation, JER1010 for short.
  • JER1003F Bisphenol A epoxy resin, JER1003F, epoxy equivalent of 700-800, Mitsubishi Chemical Corporation, referred to as JER1003F.
  • NPES-302 Bisphenol A epoxy resin, NPES-302, epoxy equivalent 600 ⁇ 700, Nanya Plastic Industry Co., Ltd., NPES-302 for short.
  • NPES-303 Bisphenol A epoxy resin, NPES-303, epoxy equivalent 800 ⁇ 900, Nan Ya Plastic Industry Co., Ltd., NPES-303 for short.
  • NPES-304 Bisphenol A epoxy resin, NPES-304, epoxy equivalent 900 ⁇ 1000, Nanya Plastic Industry Co., Ltd., NPES-304 for short.
  • NPES-901 Bisphenol A epoxy resin, NPES-901, epoxy equivalent 450 ⁇ 500, Nanya Plastic Industry Co., Ltd., NPES-901 for short.
  • NPES-902 Bisphenol A epoxy resin, NPES-902, epoxy equivalent 600 ⁇ 650, Nan Ya Plastic Industry Co., Ltd., NPES-902 for short.
  • NPES-904 Bisphenol A epoxy resin, NPES-904, epoxy equivalent 780 ⁇ 850, Nan Ya Plastic Industry Co., Ltd., NPES-904 for short.
  • NPES-905 Bisphenol A epoxy resin, NPES-905, epoxy equivalent of 930 ⁇ 960, Nan Ya Plastic Industry Co., Ltd., referred to as NPES-905.
  • Epoxy silica gel composite epoxy resin epoxy resin:
  • Epoxy silica gel composite epoxy resin ERS-Si1700, epoxy equivalent 200, Mitsubishi Chemical Corporation, abbreviated
  • THPA Tetrahydrophthalic anhydride
  • Phthalic anhydride, acid anhydride equivalent is 148, Nan Ya Plastic Industry Co., Ltd.
  • Trimellitic anhydride has an acid anhydride equivalent of 92.
  • Pyromellitic dianhydride, acid anhydride equivalent is 218, Leheng Chemical Co., Ltd.
  • Hexahydrophthalic anhydride the acid anhydride equivalent is 154, Puyang Huicheng Electronic Materials Co., Ltd.
  • Methyl Nadic acid anhydride the acid anhydride equivalent is 178, Puyang Huicheng Electronic Materials Co., Ltd.
  • Glutaric anhydride, acid anhydride equivalent is 114, Liaoyang Hengye Chemical Co., Ltd.
  • Methylcyclohexene tetracarboxylic dianhydride, anhydride equivalent is 132.
  • Inorganic oxide beads :
  • the preparation method of inorganic oxide microbeads Weigh the raw materials of powder precursors (including oxides, carbonates, hydroxides) of each element according to the target ratio, and after ball milling, mixing, pressure filtering, drying, and then High-temperature sintering, coarse crushing, secondary ball milling, and spray drying to obtain fixed-component inorganic oxide microspheres.
  • Inorganic oxide beads, alumina, center particle size D50 5 ⁇ m, Jiangsu Lianrui New Material Co., Ltd., alumina for short.
  • Inorganic oxide beads, magnesium oxide, center particle size D50 15 ⁇ m, referred to as magnesium oxide.
  • Organic polymer particles KMP-597, silicone polymer particles, with an average particle size of 2 ⁇ m, Shin-Etsu Chemical Co., Ltd., KMP-597 for short.
  • Organic polymer particles KMP-600, silicone polymer particles, average particle size 5 ⁇ m, Shin-Etsu Chemical Co., Ltd., KMP-600 for short.
  • Organic polymer particles KMP-605, silicone polymer particles, with an average particle size of 2 ⁇ m, Shin-Etsu Chemical Co., Ltd., KMP-605 for short.
  • Organic polymer particles X-52-7030, silicone polymer particles, average particle size 0.8 ⁇ m, Shin-Etsu Chemical Co., Ltd., X-52-7030 for short.
  • phenolic resin-1 Organic polymer particles, phenolic resin, with a number average molecular weight of 20,000 to 50,000 and an average particle size of 1um, referred to as phenolic resin-1.
  • phenol resin-2 Organic polymer particles, phenol resin, with a number average molecular weight of 30,000 to 80,000 and an average particle size of 3um, referred to as phenol resin-2.
  • phenolic resin-3 Organic polymer particles, phenolic resin, with a number average molecular weight of 50,000 to 100,000 and an average particle size of 5um, referred to as phenolic resin-3.
  • Polystyrene particles-1 Organic polymer particles, polystyrene particles, with an average particle size of 0.5um, referred to as polystyrene particles-1.
  • Polystyrene particles-2 Organic polymer particles, polystyrene particles, average particle size 2um, referred to as polystyrene particles-2.
  • KM-5030 Organic polymer particles, KM-5030, polystyrene particles, with an average particle size of 3 ⁇ m, Dongguan Kemai New Material Co., Ltd., referred to as KM-5030.
  • Organic polymer particles LD-015, polymethyl methacrylate particles, average particle size 1.5 ⁇ m, Dongguan Xuancheng Chemical Technology Co., Ltd.
  • KMR-3EA Organic polymer particles, KMR-3EA, polymethyl methacrylate particles, with an average particle size of 3 ⁇ m, Japan Soken Chemical Co., Ltd., referred to as KER-3EA.
  • Organic polymer particles KMR-3TA, polymethyl methacrylate particles, with an average particle size of 3 ⁇ m, Japan Soken Chemical Co., Ltd., KMR-3TA for short.
  • the encapsulating resin compositions prepared according to the examples and comparative examples of the present invention will be tested for various properties according to the following methods.
  • Blue light decay Place the hexagonal substrate with blue chip and wire soldered on the mold of the molding equipment, and then preheat and extrude the prepared encapsulating resin composition into the mold cavity through the molding equipment to embed the chip, and expose the hexagonal substrate Wire.
  • the sample needs to be cured at 150°C for 4 hours. Then use the integrating sphere to test the initial luminous flux of the embedded chip when it is lit under a specific current.
  • a series of encapsulating resin compositions to be tested are prepared into samples to be tested according to this method, and then connected in series, lighted continuously with 200mA current (accelerated test) at room temperature for 200 hours, and the remaining luminous flux under a specific current is tested again.
  • Initial luminous flux-remaining luminous flux (Initial luminous flux-remaining luminous flux)/Initial luminous flux, that is, the blue light attenuation of the single sample is obtained.
  • the number of test samples for each encapsulation resin composition at a time is not less than 3, and the average value is taken.
  • the integrating sphere equipment used in this test is the aluminum base metering integrating sphere R98 manufactured by Hangzhou Yuzhou Optoelectronics Information Co., Ltd.
  • Molding shrinkage rate Weigh 20g of the prepared encapsulating resin composition powder or pellets or block, and inject it into a specific mold at 150°C for curing.
  • the mold cavity is a circle with a diameter of 60mm and a thickness of about 3mm.
  • the number of test samples for each encapsulation resin composition at a time is not less than 3, and the average value is taken.
  • the mold and injection conditions are the same as the mold shrinkage rate, and the sample with a diameter of 60mm and a thickness of about 3mm is obtained.
  • Continue curing for 4 hours at 150°C. Take out the sample, place it at room temperature, and weigh the sample, which is the initial weight. Then put it into boiling water and continue to boil for 1 hour, take out the sample, wipe off the water, and weigh the quality of the sample. The difference between the two masses divided by the initial mass is the water absorption rate of the sample.
  • the number of test samples for each encapsulation resin composition at a time is not less than 3, and the average value is taken.
  • Light extraction rate extrude the obtained encapsulating resin composition into a mold with a side length of 30mm and a depth of 0.40mm, cure at 150°C for 2 minutes, and then transfer to an oven at 150°C to continue curing for 4 hours to obtain a side
  • a spectrophotometer to test the light transmittance at 450nm, which is the light output rate.
  • the prepared encapsulating resin composition is encapsulated on a red LED chip by injection molding, and then the radiation intensity distribution data of the chip is tested, that is, the radiation intensity at different angles to determine the light effect.
  • Chip surface temperature Place the hexagonal substrate welded with blue light chips and wires on the mold of the molding equipment, and then preheat and extrude the prepared packaging resin composition into the mold cavity through the molding equipment to embed the chip.
  • the embedding thickness is 1mm, and the wires of the hexagonal substrate are exposed.
  • the sample needs to be cured at 150°C for 4 hours.
  • a series of encapsulating resin compositions to be tested were prepared into samples to be tested according to this method, and then connected in series, with 200mA current (accelerated test) at room temperature for continuous lighting for 1 hour, and an infrared thermal imager was used to test the samples under this condition Chip surface temperature.
  • the blue light attenuation of the single sample is obtained. There are no less than 3 samples for each encapsulation resin composition in a single test, and the average value is taken.
  • An encapsulating resin composition for LED display chip-type discrete devices prepared in the embodiment of the present invention (encapsulating resin composition for short): and the method of preparing the encapsulating resin composition in the comparative example is as follows:
  • the materials were mixed according to the ratio shown in Table 3, mixed uniformly at a temperature of 100° C. using a twin-screw extruder, and then cooled and pulverized to obtain a powdered encapsulating resin composition.
  • the obtained encapsulating resin composition has a significant effect of resisting blue light and light decay.
  • Replacing EHPE-3150 in Example 1 with the first type epoxy resin CELLOXIDE 2021P, CELLOXIDE 8000, DGIC or MGIC can obtain similar blue light resistance performance.
  • Comparative Example 1 since all the second type epoxy resin (JER1002) was used as the main agent, the obtained encapsulating resin composition of the Comparative Example had poor performance against blue light attenuation.
  • the second type epoxy resin including bisphenol A epoxy resin NPES-301, NPES-303, NPES-304, NPES-901, NPES-902, NPES-903, NPES-904, NPES-905, JER1004, JER1007, JER1009, JER1010 and JER1003F; hydrogenated bisphenol A epoxy resin YX-8000, YX-8040, YX-8034 and YL-6753; bisphenol F epoxy resin NPEF-170, NPEF-175, NPEF-176 , NPEF-185, NPEF-187 and NPEF-500; epoxy silica gel composite epoxy resin (ERS-Si1200, ERS-Si1700 and XP833) when JER1002 is replaced, similar blue light resistance performance can be obtained.
  • inorganic oxide beads-7, inorganic oxide beads-8, inorganic oxide beads-9, inorganic oxide beads-10, inorganic oxide beads-11 or inorganic oxide beads-12 instead of implementation
  • inorganic oxide beads-1 in Example 1 a similar effect can be obtained.
  • Comparative Example 3 due to the use of ordinary inorganic oxide microbead silica, although the molding shrinkage rate and water absorption rate of the obtained encapsulating resin composition are also significantly reduced, the light extraction rate is very low, which is lost for light-emitting elements. In addition to the added meaning, it is not suitable for RGB display applications.
  • Comparative Example 1 and Comparative Example 7 it can be found that the encapsulating resin composition still has a certain uniform light emitting effect without using organic polymer particles. Therefore, the inorganic oxide microbeads used in the present invention also have a certain balance of light emission from various angles.
  • the light emission curve shape of the encapsulating resin composition is a smooth arc shape, indicating that the light is uniform at all angles, and the organic polymer particles KMP-590 start To balance the role of light from all angles.
  • the encapsulation resin composition obtained by adding organic polymer microparticle phenol resin-1, KM-503 and KMR-3EA has a smooth arc shape. It shows that the organic polymer microparticle phenolic resin-1, KM-503 and KMR-3EA also have the effect of balancing light emission from various angles.
  • Comparative Example 7 It can be seen from Comparative Example 7 that the encapsulating resin composition without adding organic polymer particles has a large difference in light intensity measured at various angles, the curve shape is zigzag, and the light cannot be emitted uniformly at each angle.
  • polystyrene particles-2, KM-5030, LD-015 and KMR-3TA replace the organic polymer particles KMP-590 in Example 1, the light emission curve of the obtained encapsulating resin composition can achieve a similar effect.
  • Example 2 it can be known from Example 2, Example 7 and Example 8 that when there are more organic polymer particles KMP-590, the water absorption rate of the encapsulating resin composition is significantly increased, and the risk of reliability failure is increased. Therefore, organic polymer particles cannot be used alone, and composite inorganic oxide beads are required to eliminate the risk of increased water absorption.
  • melanin nanometer carbon black 2300# average particle size 15nm
  • melanin nanometer copper oxide average particle size 40nm
  • Example 1 melanin nano-carbon black 2300# average particle size 15nm
  • trimellitic anhydride pyromellitic dianhydride, hydrogenated pyromellitic dianhydride, methyltetrahydrophthalic anhydride, nadic anhydride, dodecenyl succinic anhydride, methyl nadic anhydride, hydrogenated methane
  • kinadic anhydride, glutaric anhydride, and methylcyclohexenetetracarboxylic dianhydride are substituted for maleic anhydride in Example 1, similar effects can be obtained.
  • the encapsulating resin composition for LED display chip discrete devices of the present invention has the characteristics of blue light decay resistance, low water absorption, and increases the airtight protection and reliability of miniaturized and thin devices.
  • the molding shrinkage rate of the epoxy resin composition is reduced, and the warpage after the small-pitch high-density chip packaging is effectively suppressed, and the operability problem of the packaging factory is improved.
  • the encapsulating resin composition of the present invention balances the light intensity of the R, G, and B chips at various angles, so that after the packaged chip set screen is white and balanced on the front side, the color deviation caused by the large angle with the viewing angle disappears.
  • the refined addition of appropriate melanin can improve the contrast without causing the chip temperature to rise.
  • Type I Smooth arc, uniform light intensity at all angles.
  • Class II Zigzag, with huge difference in light intensity from various angles.
  • Type III arc shape with a slight depression in the center angle, and the light intensity at the center angle is slightly lower.
  • the present invention screens out the first and second types of epoxy resin systems, adds acid anhydride, and further introduces inorganic oxide microspheres.
  • the present invention uses selected inorganic oxide microbeads, which have a higher transmittance.
  • the content of the inorganic oxide microbeads accounts for 5-60 parts of the first type epoxy resin, the second type epoxy resin and the inorganic oxide microbeads. Since the thermal conductivity of inorganic oxide microbeads is generally greater than that of epoxy resin, the heat dissipation effect of the composition is also improved to a certain extent.
  • the present invention proposes to add organic polymer particles while adding inorganic oxide beads.
  • the organic polymer particles can mix R, G, and B.
  • the light emitted by the chip can balance the light emitted from various angles at a large angle. For the assembled large-size display, there is no red light when viewed from the side at a large angle after the front white balance is adjusted.
  • the present invention proposes to add melanin to achieve the purpose of improving contrast.
  • the amount of melanin is strictly limited to 0.1% by weight or less .
  • an encapsulating resin composition with low light attenuation, warpage resistance, and moisture resistance is obtained, which can also balance light output, improve contrast and heat dissipation, and enhance end user experience.
  • the thickness of the packaging layer of the LED device packaged in the present invention is generally 0.2-0.6 mm.

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

La présente invention concerne une composition de résine d'encapsulation pour un dispositif discret SMT d'écran d'affichage à DEL et une application associée, la composition comprenant une résine époxy d'un premier type, une résine époxy d'un second type, un anhydride, des microperles d'oxyde inorganique, des particules d'un polymère organique et de la mélanine. La composition de résine d'encapsulation de la présente invention peut être appliquée à un dispositif RVB discret SMT d'écran d'affichage, le dispositif comprenant une source de lumière indépendante électroluminescente à cinq faces contenant un ensemble de puces R, V et B, et comprenant aussi une source de lumière modulaire (4-en-1) contenant quatre ensembles de puces RVB. La composition d'encapsulation de la présente invention est appliquée à l'encapsulation du dispositif ci-dessus, il est possible d'améliorer la résistance à l'humidité, l'uniformité de l'émission de lumière et le contraste du dispositif, à l'aide d'une réduction du gauchissement généré pendant le processus d'encapsulation. La composition de résine d'encapsulation présente aussi une faible caractéristique d'atténuation de la lumière pour la source de lumière bleue du dispositif RVB, ce qui prolonge la durée de vie utile du dispositif RVB.
PCT/CN2020/072357 2019-05-30 2020-01-16 Composition de résine d'encapsulation pour un dispositif discret smt d'écran d'affichage à del et application associée WO2020238261A1 (fr)

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JP2020535013A JP7017636B2 (ja) 2019-05-30 2020-01-16 Ｌｅｄディスプレイの表面実装式ディスクリートデバイス用の封止樹脂組成物及びその用途

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CN201910463559.0A CN110283561B (zh) 2019-05-30 2019-05-30 一种led显示屏贴片式分立器件用封装树脂组合物及其用途
CN201910463559.0 2019-05-30

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