WO2020189897A1 - Multi-beam processing method and multi-beam processing apparatus - Google Patents

Abstract

The present invention relates to a multi-beam processing method and a multi-beam processing apparatus which can improve the uniformity of multi-beam processing by dividing a laser beam into multiple unit beams, the number of which is less than the number of processing points, to form a multi-beam, irradiating a first irradiation position with the formed multi-beam, and irradiating a second irradiation position partially overlapping the first irradiation position with the formed multi-beam.

Description

Multi-beam processing method and multi-beam processing device

The present invention relates to a multi-beam processing method and a multi-beam processing apparatus, and more particularly, to a multi-beam processing method and a multi-beam processing apparatus for improving the homogeneity of multi-beam processing.

In the processing (or patterning) process, an object to be processed is generally processed using a laser beam, and application of a patterning technology using multi-beams is increasing to increase the processing speed.

In the case of processing an object to be processed using a multi-beam, it is hardly processed by a single shot, and processing is performed by irradiating a multi-beam several times. For example, in the case of manufacturing a fine metal mask (FMM), a processing hole can be formed only when a beam is irradiated several hundred times at the same processing point of a processing object such as a metal plate.

In addition, when using multi-beams, variations in workability may occur between a plurality of processing points. Due to errors caused by diffractive optics and lens aberrations, which form multi-beams by dividing one laser beam. Multi-beams become heterogeneous, and machining deviation may occur between a plurality of machining points.

Therefore, the homogeneity of the multi-beam is very important in multi-beam processing, and especially in the case of fine patterns, the homogeneity of the multi-beam is more required. Therefore, the micro-beam using a multi-beam that can minimize the deviation of workability between a plurality of processing points The need for micro patterning technology is increasing.

(Patent Document 1) Korean Laid-Open Patent Publication No. 10-2015-0111349

The present invention provides a multi-beam processing method and a multi-beam processing apparatus capable of reducing processing deviation between a plurality of processing points during multi-beam processing.

A multi-beam processing method according to an embodiment of the present invention includes: setting a plurality of processing points on an object to be processed; Generating and outputting a laser beam for processing the object to be processed; Dividing the laser beam into a plurality of unit beams less than the number of the plurality of processing points to form a multi-beam; Irradiating the multi-beam to a first irradiation position corresponding to some of the plurality of processing points; Moving the irradiation position of the multi-beam; And irradiating the multi-beam to a second irradiation location partially overlapping with the first irradiation location.

In the process of setting the plurality of processing points, the plurality of processing points arranged at the same interval of the first distance are set, and the process of forming the multi-beam is at the same interval of a second distance proportional to the first distance. It may be performed by dividing the laser beam into the arranged plurality of unit beams.

The plurality of processing points and the plurality of unit beams are arranged side by side in a first direction, and in a process of moving the irradiation position of the multi-beam, the irradiation position of the multi-beam may be moved in the first direction.

It may further include a process of determining the number of times of irradiation of the unit beam according to the energy of the multi-beam.

The process of determining the number of unit beams in the first direction of the multi-beam according to the determined number of irradiation; further comprising, the process of forming the multi-beam, the plurality of unit beams according to the distance of the plurality of processing points The process of determining the interval; Providing a pattern plate on which diffraction patterns are formed according to the determined number and spacing of the plurality of unit beams; And injecting the laser beam onto the pattern plate.

Determining the number of irradiation points of the unit beams overlapping the first irradiation position and the second irradiation position according to the determined number of irradiation and the determined number of unit beams in the first direction; In the process of moving the irradiation position of the beam, the irradiation position of the multi-beam may be moved to the second irradiation position overlapping the first irradiation position by the determined number of irradiation points of the overlapping unit beam.

Detecting the number of times the unit beam is irradiated for each processing point; Determining whether to compensate by determining whether the number of irradiations detected for each processing point reaches the determined number of irradiations; And additionally irradiating the unit beam to the processing point where compensation is determined.

The process of additionally irradiating the unit beam may include blocking a path of a unit beam corresponding to a processing point for which compensation is not determined; And irradiating the unit beam whose path is opened to the processing point where the compensation is determined.

The process of additionally irradiating the unit beam may be performed stepwise until the number of irradiation times of each of the plurality of processing points reaches the determined number of irradiation.

A multi-beam processing apparatus according to another embodiment of the present invention includes a workpiece support for supporting an object to be processed at a plurality of predetermined processing points; A laser beam oscillator for generating and outputting a laser beam for the processing; A multi-beam forming unit configured to form a multi-beam by dividing the output laser beam into a plurality of unit beams less than the number of the plurality of processing points; A multi-beam irradiation unit for irradiating the multi-beam onto the object to be processed a plurality of times; And a support driving unit for moving the workpiece support to change the irradiation position of the multi-beam to a second irradiation position partially overlapping with the first irradiation position to which the multi-beam is irradiated.

An irradiation count setting unit for setting the irradiation count of the unit beam at each processing point; And a unit beam number determining unit that determines the number of the plurality of unit beams according to the set number of irradiation of the unit beams.

The multi-beam forming unit may include a pattern plate on which diffraction patterns are formed according to the number and interval of the plurality of unit beams, and the laser beam is incident thereon; And a pattern plate changing unit that determines a diffraction pattern according to the determined number of the plurality of unit beams and an interval between the plurality of unit beams, and changes the pattern plate to a pattern plate on which the determined diffraction pattern is formed.

The multi-beam irradiation unit may include an angle correction optical system that adjusts the irradiation angle of the plurality of unit beams divided by the pattern plate to a predetermined angle.

Further comprising a beam cutting unit provided on a path between the pattern plate and the object to be processed to block a path of some of the plurality of unit beams, wherein the beam cutting unit has a hollow portion, and the plurality of unit beams A body portion providing a path of; And a blocking plate provided on a side wall of the body portion and having a length adjusted in the inner direction of the hollow portion.

An irradiation count detection unit for detecting the irradiation count of the unit beam for each processing point of the object to be processed; And a compensation determination unit that determines whether or not to compensate by determining whether the number of irradiation detected for each processing point has reached a predetermined number of irradiations; wherein the beam cutting unit includes a unit beam corresponding to a processing point for which compensation is not determined. You can block the path.

A position measuring unit for measuring the position coordinates and the moving distance of the workpiece support; further comprising, the plurality of processing points and the plurality of unit beams are arranged side by side in a first direction, and the support drive unit measures the position measurement unit As a result, by moving the workpiece support in the first direction, the irradiation position of the multi-beam may be changed to the second irradiation position in which a predetermined number of irradiation points of the unit beam overlap with the first irradiation position.

In the multi-beam processing method according to an embodiment of the present invention, after irradiating the multi-beam to the first irradiation position, the multi-beam is irradiated to the second irradiation position partially overlapping with the first irradiation position, and units of different positions at the overlapping irradiation point. By allowing the beams to overlap, unit beams having different positions can be mixed. Accordingly, machining deviation between a plurality of machining points due to a difference in beam intensity for each position of a plurality of unit beams may be reduced.

In addition, by determining the number of irradiation of unit beams to complete processing of each processing point, the number of unit beams in the first direction of the multi-beam is determined, and the first irradiation according to the determined number of irradiation and the determined number of unit beams in the first direction The number of irradiation points of the unit beam overlapping the location and the second irradiation location may be determined. Through this, it is possible to effectively mix unit beams having different beam intensity (or energy) at each of the plurality of processing points, and it is possible to minimize processing deviation between the plurality of processing points.

In addition, by blocking some unit beams of the multi-beams with the beam cutting unit, the overlapping of the unit beams is not achieved only by moving the irradiation position of the multi-beams, or the unit beam is additionally irradiated to a processing point where the number of irradiation of the unit beam is less than the determined number of irradiation. I can. In addition, since the number of irradiation of the unit beam is less than the determined number of irradiation, the number of irradiation of the unit beam may be compensated for a processing point where processing is not completed. Through this, the unit beams may be superimposed on all the plurality of processing points to complete processing.

1 is a flow chart showing a multi-beam processing method according to an embodiment of the present invention.

2 is a conceptual diagram for explaining the overlapping of the irradiation points of the first irradiation location and the second irradiation location according to an embodiment of the present invention.

3 is a conceptual diagram illustrating an effect of overlapping unit beams according to an embodiment of the present invention.

4 is a conceptual diagram illustrating beam cutting according to an embodiment of the present invention.

5 is a conceptual diagram for explaining compensation through beam cutting according to an embodiment of the present eradication.

6 is a schematic view showing a multi-beam processing apparatus according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only the present embodiments make the disclosure of the present invention complete, and the scope of the invention to those of ordinary skill in the art It is provided to inform you. In the description, the same reference numerals are assigned to the same components, and the drawings may be partially exaggerated in size to accurately describe the embodiments of the present invention, and the same numerals refer to the same elements in the drawings.

1 is a flow chart showing a multi-beam processing method according to an embodiment of the present invention.

Referring to FIG. 1, a multi-beam processing method according to an embodiment of the present invention includes a process of setting a plurality of processing points 11 on an object 10 (S100); Generating and outputting a laser beam 12 for processing the object 10 (S200); Dividing the laser beam 12 into a plurality of unit beams 13a less than the number of the plurality of processing points 11 to form a multi-beam 13 (S300); Irradiating the multi-beam 13 to a first irradiation position 30a corresponding to some of the processing points 11 among the plurality of processing points 11 (S400); Moving the irradiation position of the multi-beam 13 (S450); And irradiating the multi-beam 13 to the second irradiation location 30b partially overlapping with the first irradiation location 30a (S500).

First, a plurality of processing points 11 are set on the object 10 (S100). A plurality of processing points 11 may be set at a point on the object 10 to be processed, and a plurality of processing points 11 may be set as a first pattern. Here, the first pattern may be an array (or an array of processing points) of processing points 11 arranged along a first direction (or a row (m) direction), and m×n (m ≥ 1, n> 2 ) May be in the form of a matrix.

Meanwhile, the object to be processed 10 may generally be a mask stick (or metal plate) of a fine metal mask (FMM) used in a vacuum deposition process when manufacturing an organic EL (electroluminescence) or organic semiconductor device. However, any object that can be processed with a laser beam is irrelevant. For example, in the packaging of semiconductor devices, in the case of forming a via hole formed in a printed circuit board (PCB) or a processing pattern in a specific area on the semiconductor substrate, the printed circuit board The (PCB) or semiconductor substrate may be the object 10 to be processed.

Next, a laser beam 12 for processing the object 10 is generated and output (S200). In order to process the object 10, the laser beam 12 may be generated and oscillate toward the object 10. Here, the laser beam 12 may be a pulse laser, a high energy beam may be periodically irradiated for a short time, and heat accumulation may be suppressed or prevented.

Then, the laser beam 12 is divided into a plurality of unit beams 13a less than the number of the plurality of processing points 11 to form a multi-beam 13 (S300). The laser beam 12 can be divided into a plurality of unit beams 13a to form a multi-beam 13, and the number of the plurality of unit beams 13a by irradiating the multi-beam 13 onto the object 10 The same (or two or more) machining points 11 can be machined simultaneously. At this time, the multi-beam 13 may have a second pattern corresponding to (or a subset) of the first pattern, and the number of the plurality of unit beams 13a is the number of the plurality of processing points 11 Can be less. Here, the second pattern may be an array (or unit beam array) of unit beams 13a arranged along a first direction (or row direction), and a matrix of x×y (x ≥ 1, y ≥ 2) It can be a form.

2 is a conceptual diagram for explaining the overlapping of the irradiation points of a first irradiation location and a second irradiation location according to an embodiment of the present invention. FIG. 2A shows the intensity difference between a plurality of unit beams. 2(b) shows the overlapping of the irradiation points of the first and second irradiation locations, and FIG. 2(c) shows the improvement of the uniformity of the accumulated energy by the overlap of the irradiation points.

Referring to FIG. 2, when the laser beam 12 is divided into a plurality of unit beams 13a to form a multi-beam 13, a difference in beam intensity or intensity between the plurality of unit beams 13a Can occur. This may be generated by diffractive optics, lens aberration, or the like in the process of dividing one laser beam 12 to form the multi-beam 13. Due to this difference (or error), the multi-beam 13 may become non-uniform for each position of the unit beam 13a.

3 is a conceptual diagram for explaining the effect of overlapping unit beams according to an embodiment of the present invention, FIG. 3(a) shows non-overlapping of unit beams, and FIG. 3(b) is a multi-beam Fig. 3(c) shows the overlap of unit beams corresponding to 1/2, and Fig. 3(d) shows the overlap of unit beams corresponding to 1/4 of the multi-beam. It represents the overlap of corresponding unit beams.

2 and 3, the multi-beam 13 is irradiated to a first irradiation position 30a corresponding to some of the processing points 11 of the plurality of processing points 11 (S400). Here, the first irradiation position 30a may be a position where the processing of the plurality of processing points 11 starts, may be one end (or corner) of the first pattern, and in the case of m×n matrix form In may be an irradiation location including the processing point 11 corresponding to any one of (1,1), (1,n), (m,1), and (m,n) coordinates.

Then, the irradiation position of the multi-beam 13 is moved (S450). The irradiation position of the multi-beam 13 may be moved, and unit beams 13a at different positions may be superimposed on the processing point 11. In this case, the irradiation position of the multi-beam 13 may be moved from the first irradiation position 30a to a second irradiation position 30b partially overlapping with the first irradiation position 30a.

Then, the multi-beam 13 is irradiated to the second irradiation location 30b partially overlapping the first irradiation location 30a (S500). In the first irradiation position 30a and the second irradiation position 30b, some irradiation points 31 (or some processing points) may overlap, and the overlapping irradiation points 31 have unit beams 13a at different positions. ) Can be mixed. Accordingly, the uniformity of the accumulated energy between the plurality of processing points 11 may be improved, and the processing deviation between the plurality of processing points 11 may be reduced.

In the process of setting the plurality of processing points 11 (S100), the plurality of processing points 11 arranged at equal intervals of a first distance may be set, and the process of forming the multi-beam 13 (S300) ) May be performed by dividing the laser beam 12 into the plurality of unit beams 13a arranged at equal intervals of a second distance proportional to the first distance.

The plurality of processing points 11 may be arranged at equal intervals of the first distance, and the irradiation position of the multi-beam 13 may be moved according to the position of each of the plurality of processing points 11. If the plurality of processing points 11 are not arranged at equal intervals, a plurality of units in the case of moving the irradiation position of the multi-beam 13 so that the first irradiation position 30a and the second irradiation position 30b partially overlap The beam 13a is positioned at each processing point 11 so that irradiation cannot be performed. Accordingly, a plurality of processing points 11 can be arranged at equal intervals, and when the first irradiation position 30a and the second irradiation position 30b partially overlap only by moving the irradiation position of the multi-beam 13, a plurality of The unit beams 13a of may be respectively positioned in correspondence with each processing point 11. Accordingly, each of the plurality of unit beams 13a may be irradiated only to the respective processing points 11.

The laser beam 12 may be divided into a plurality of unit beams 13a arranged at equal intervals of a second distance proportional to the first distance, and the second distance may be determined according to the first distance. Here, the second distance may be proportional to the first distance, and the laser beam 12 is divided into a plurality of unit beams 13a having a size and spacing greater or less than the size and spacing of the plurality of processing points 11. It can be divided and converted to fit the size and spacing of the plurality of machining points 11 through optics at the rear end of the beam path, and the laser beam 12 is converted to the size and spacing of the plurality of machining points 11 It may be directly divided into a plurality of unit beams 13a having the same size and spacing and transmitted to the processing points 11 of the object 10. The plurality of unit beams 13a must also be arranged at the same interval so that the plurality of unit beams 13a can be irradiated according to the positions of each of the plurality of processing points 11 arranged at the same interval. When the first irradiation position 30a and the second irradiation position 30b partially overlap with only the movement of the position, a plurality of unit beams 13a may correspond to each processing point 11 to be positioned respectively.

The plurality of processing points 11 and the plurality of unit beams 13a may be arranged side by side in a first direction, and in the process of moving the irradiation position of the multi-beam 13 (S450), the multi-beam ( The irradiation position of 13) can be moved in the first direction. A plurality of processing points 11 and a plurality of unit beams 13a are arranged side by side in the first direction, and some of the irradiation points 31 are moved while moving the irradiation position of the multi-beam 13 in the first direction. Can be nested. In this case, the number of the first direction unit beams 13a of the multi-beam 13 may be less than the number of the first direction processing points 11 of the plurality of processing points 11. When the number of the first direction unit beams 13a of the multi-beam 13 is more than the number of the first direction processing points 11 of the plurality of processing points 11, the multi-beam 13 is irradiated. The position can no longer be moved in the first direction, or some of the unit beams 13a of the multi-beams 13 are out of the processing point 11 of the object 10, so that an efficient processing process cannot be performed. do.

In the process of moving the irradiation position of the multi-beam 13 (S450), the irradiation position of the multi-beam 13 may be moved in the first direction, and the irradiation position of the multi-beam 13 is moved to the first direction. The direction may be moved by a distance smaller than the first width of the multi-beam 13 (or the width of the second pattern in the first direction). That is, the irradiation position of the multi-beam 13 is determined by a distance corresponding to the number of (the first direction) of the processing points 11 less than the number of unit beams 13a in the first direction of the multi-beam 13 It can be moved in the first direction. When the irradiation position of the multi-beam 13 is moved in the first direction by a distance equal to or greater than the width in the first direction of the multi-beam 13, the irradiation position of the multi-beam 13 becomes the first irradiation position 30a. It does not overlap with the first irradiation position 30a, and it is impossible to mix unit beams 13a having different positions at each processing point 11.

Accordingly, in the multi-beam processing method of the present invention, the irradiation position of the multi-beam 13 is moved in the first direction, and processing points less than the number of unit beams 13a in the first direction of the multi-beam 13 ( You can move as many as 11) (or the number of cells). Through this, the unit beams 13a having different positions may be mixed at each processing point 11.

The multi-beam processing method according to the present invention may further include a process of determining the number of times of irradiation of the unit beam 13a according to the energy of the multi-beam 13 (S50).

The number of times the unit beam 13a is irradiated may be determined according to the energy of the multi-beam 13 (S50). Here, the process of determining the number of irradiation of the unit beam 13a according to the energy of the multi-beam 13 (S50) may be performed before the process of forming the multi-beam 13 (S300), and The number of times the unit beam 13a is irradiated may be determined according to at least one of the material, thickness, and processing depth of (10) and the energy (or intensity) of the multi-beam 13. In this case, the number of times of irradiation of the unit beam 13a may be determined through the energy distribution of the multi-beam 13 (or according to the energy distribution), and the highest portion of the energy distribution of the multi-beam 13 (for example, For example, the number of times of irradiation of the unit beam 13a may be determined based on the central part). In addition, the number of times of irradiation of the same unit beam 13a to a plurality of processing points 11 may be determined, and the unit beam 13a for each processing point 11 according to the energy distribution of the multi-beam 13 You can also determine the number of investigations. Here, according to at least one of the material, thickness, and processing depth of the object 10, the number of irradiation times of the unit beam 13a to be processed (or to which processing can be completed) of each processing point 11 is determined. It can be determined by experimentally confirming the number of irradiation of the unit beam (13a) that can be processed. For example, in the case of forming the processing hole of the fine metal mask (FMM), the number of irradiation of the unit beam 13a in which the processing hole is formed can be experimentally confirmed, and the number of irradiation of the unit beam 13a thus confirmed May be determined as the number of irradiation of the unit beam 13a to complete the processing.

The multi-beam processing method according to the present invention may further include a process of determining the number of the first direction unit beams 13a of the multi-beam 13 (S60) according to the determined number of irradiations.

In addition, the number of unit beams 13a in the first direction of the multi-beam 13 may be determined according to the determined number of irradiations (S60). The number of the first direction unit beams 13a of the multi-beam 13 may be less than the number of the first direction processing points 11 of the plurality of processing points 11. Then, the number of the first direction unit beams 13a of the multi-beam 13 is determined according to the determined number of irradiation, and the plurality of processing points 11 are moved in the first direction with the multi-beam 13 (or the first It is possible to complete the machining of most (or the center) of the machining point 11 when scanned (to the end of the direction).

In this case, the number of the first direction unit beams 13a of the multi-beam 13 may be selected from a product of a factor of the determined number of irradiation or a factor of the determined number of irradiation. Here, the number of columns (n) and/or the number of rows (m) of the matrix of the multi-beam 13 may be determined according to the determined number of irradiations.

The process of forming the multi-beams 13 (S300) may include determining the spacing of the plurality of unit beams 13a according to the spacing of the plurality of processing points 11 (S310); Providing a pattern plate 131 on which a diffraction pattern is formed according to the determined number and interval of the plurality of unit beams 13a (S320); And a process (S330) of incidence of the laser beam 12 onto the pattern plate 131.

The spacing of the plurality of unit beams 13a may be determined according to the spacing of the plurality of processing points 11 (S310). When the number of the first direction unit beams 13a is determined, the spacing of the plurality of unit beams 13a may be determined according to the spacing of the plurality of processing points 11 (ie, the first spacing), and the The first direction spacing of the plurality of unit beams 13a may be determined according to the first direction spacing of the plurality of processing points 11.

In addition, a pattern plate 131 on which diffraction patterns according to the determined number and spacing of the plurality of unit beams 13a are formed may be provided (S320). Here, the number of the plurality of unit beams 13a may be determined according to the determined number of the first direction unit beams 13a. A diffraction pattern may be formed on the pattern plate 131 to divide one laser beam 12 into a plurality of unit beams 13a, and the diffraction pattern may be formed according to the number and spacing of the plurality of unit beams 13a. It can be different. That is, one laser beam 12 may be divided into a plurality of unit beams 13a having a predetermined number and intervals according to the diffraction pattern. According to the determined number and spacing of the plurality of unit beams 13a, the laser beam 12 is converted into a pattern plate 131 in which an appropriate diffraction pattern is formed and a plurality of unit beams 13a having a desired (or determined) number and spacing. ) Can be divided. Here, the pattern plate 131 may include a Diffractive Optical Element (DOE).

Then, the laser beam 12 may be incident on the pattern plate 131 (S330). When the laser beam 12 is incident on the pattern plate 131, the laser beam 12 may be divided into a plurality of unit beams 13a having a predetermined number and interval according to the diffraction pattern.

The multi-beam processing method according to the present invention is an overlapping unit of the first irradiation location (30a) and the second irradiation location (30b) according to the determined number of irradiation and the determined number of the first direction unit beams (13a). The process of determining the number of irradiation points 31 of the beam 13a (S70); may further include, and the overlapping unit beam determined in the process (S450) of moving the irradiation location of the multi-beam 13 As many as the number of irradiation points 31 in (13a), the irradiation points 31 may be moved to the second irradiation position 30b overlapping with the first irradiation position 30a.

And the irradiation point of the unit beam 13a overlapping the first irradiation position 30a and the second irradiation position 30b according to the determined number of irradiation and the determined number of unit beams 13a in the first direction ( 31) can be determined (S70). According to the determined number of irradiation and the determined number of unit beams 13a in the first direction, the irradiation point 31 of the unit beam 13a overlapping the first irradiation position 30a and the second irradiation position 30b You can decide the number. Through this, it is possible to effectively mix the unit beams 13a having different beam intensity (or energy) at each of the plurality of processing points 11, and it is possible to minimize processing deviation between the plurality of processing points 11. When the number of irradiation points 31 of the unit beam 13a overlapping the first irradiation position 30a and the second irradiation position 30b is determined, the irradiation position of the multi-beam 13 in the first direction A moving distance (or number of cells) (or the number of processing points at which the multi-beam should move in the first direction) may be calculated.

For example, when the determined number of irradiations is a composite number, the process of determining the number of irradiation points 31 of the overlapping unit beams 13a (S70) is a process of calculating a factor of the determined irradiation number. (S71); Determine the number of moving cells (or the number of processing points to be moved in the first direction) of the irradiation position from an integer value obtained by dividing the determined number of the first direction unit beams 13a by a factor of the calculated number of irradiation The process (S72); And calculating the number of irradiation points 31 of the overlapping unit beams 13a by a difference between the determined number of the first direction unit beams 13a and the determined number of moving cells of the irradiation position (S73). can do. That is, when the determined number of irradiation is a composite number, the number of moving cells of the irradiation position may be selected from an integer value obtained by dividing the determined number of the first direction unit beams 13a by a factor of the calculated number of irradiation, and the selected The number of irradiation points 31 of the overlapping unit beams 13a may be determined according to the number of moving cells of the irradiation location.

In addition, when the determined number of irradiations is a small number, the process of determining the number of irradiation points 31 of the overlapping unit beams 13a (S70) includes a factor of the number of adjustments obtained by adding 1 to the determined number of irradiations. The process of calculating (S75); Determining the number of moving cells of the irradiation position from an integer value obtained by dividing the determined number of the first direction unit beams 13a by a factor of the calculated number of adjustments (S76); And calculating the number of irradiation points 31 of the overlapping unit beams 13a by a difference between the determined number of the first direction unit beams 13a and the determined number of moving cells of the irradiation position (S73). can do. That is, when the determined number of irradiation is a small number, the number of moving cells of the irradiation position is calculated as the number of the determined number of the first direction unit beams 13a (i.e., a value obtained by adding 1 to the determined number of irradiation) It may be selected from an integer value divided by a factor of, and the number of irradiation points 31 of the overlapping unit beam 13a may be determined according to the number of moving cells of the selected irradiation location.

On the other hand, if the determined number of irradiation is a small number, the number of the first direction unit beams 13a of the multi-beam 13 at the first irradiation location 30a and the second irradiation location 30b is different (or differently). ) You may. For example, when the number of the first direction of the plurality of processing points 11 is 7 (decimal), the number of the first direction unit beams 13a is 3 at the first irradiation position 30a. (13) can be irradiated, and in the second irradiation position (30b), the multi-beam 13 having the number of the first direction unit beams 13a of four can be irradiated. And in the process of moving the irradiation position of the multi-beam 13 (S450), one space in the first direction (i.e., one unit beam can be moved from the irradiation point to an adjacent processing point in the first direction). The irradiation position of the multi-beam 13 may be moved by distance).

In the process of moving the irradiation position of the multi-beam 13 (S450), a value obtained by dividing the determined number of the first direction unit beams 13a by the determined number of irradiation and the calculated number of moving cells of the irradiation position It may be performed after repeating the process (S400) of irradiating the first irradiation location 30a as many times as multiplied.

In the process (S450) of moving the irradiation position of the multi-beam 13 (S450), the irradiation point 31 is the first irradiation position (of) as many as the number of irradiation points 31 of the overlapping unit beams 13a ( The irradiation position of the multi-beam 13 may be moved to the second irradiation position 30b overlapping with 30a). That is, the irradiation position of the multi-beam 13 can be moved to the second irradiation position 30b overlapping the first irradiation position 30a by the determined number of irradiation points of the overlapping unit beam 13a, The irradiation position of the multi-beam 13 may be moved in the first direction by the determined number of moving cells of the irradiation position.

4 is a conceptual diagram illustrating beam cutting according to an embodiment of the present invention, FIG. 5 is a conceptual diagram illustrating compensation through beam cutting according to an embodiment of the present invention, and FIG. 5A is The mixed area and the unmixed area of the unit beam are shown, and FIG. 5B shows the unit beam compensation of the non-mixed area.

4 and 5, the multi-beam processing method according to the present invention includes a process of detecting the number of irradiation times of the unit beam 13a for each processing point 11 (S550); Determining whether to compensate by determining whether the number of irradiations detected for each processing point 11 has reached the determined number of irradiations (S560); And a process (S600) of additionally irradiating the unit beam 13a to the processing point 11 where compensation is determined (S600).

In addition, the number of irradiation times of the unit beam 13a for each processing point 11 may be detected (S550). The number of irradiation of the unit beam 13a for each processing point 11 can be detected, and it is possible to check (or grasp) whether processing is completed for each processing point 11. It is possible to complete (or stop) the unit beam overlapping process in which the first irradiation position 30a and the second irradiation position 30b partially overlap by determining whether processing is completed for each processing point 11. In this case, the unit beam overlapping process may be completed after scanning the entire plurality of processing points 11 while partially overlapping the first and second irradiation positions 30a and 30b. Through this, after scanning the entire plurality of processing points 11 by the unit beam overlapping process, most of the processing points except for the processing points 11 located at the edges (or edge regions) of the plurality of processing points 11 ( 11) can be completed to process.

Then, it is possible to determine whether to compensate by determining whether the number of irradiations detected for each processing point 11 has reached the determined number of irradiations (S560). It is possible to determine whether or not to compensate by determining whether the number of investigations detected for each processing point 11 has reached the determined number of investigations, and to determine compensation for the processing point 11 whose number of detected investigations is less than the determined number of investigations. have. That is, it is possible to grasp (or detect) a processing point 11 (or a compensation area) to compensate for the unit beam 13a by comparing the detected number of irradiation with the determined number of irradiation.

In addition, the unit beam 13a may be additionally irradiated to the processing point 11 at which compensation is determined (S600). The processing point 11 at which the compensation is determined is less than the determined number of irradiations, and thus processing has not been completed. Therefore, the unit beam 13a is additionally irradiated to determine the compensation of the processing point 11 at which the compensation is determined. Processing can be completed. In this way, the unit beam 13a is compensated for the processing point 11 in which the detected number of irradiation is less than the determined number of irradiation, so that the processing of all the plurality of processing points 11 can be completed.

The process of additionally irradiating the unit beam 13a (S600) may include blocking a path of the unit beam 13a corresponding to the processing point 11 for which compensation is not determined (S610); And a process (S620) of irradiating the unit beam 13a with an open path to the processing point 11 for which the compensation is determined.

The path of the unit beam 13a corresponding to the processing point 11 for which compensation is not determined may be blocked (S610). The path of the unit beam 13a corresponding to the processing point 11 for which compensation is not determined is blocked, so that the unit beam 13a may be additionally irradiated only to the processing point 11 for which the compensation is determined.

In addition, the unit beam 13a in which the path is opened may be irradiated to the processing point 11 at which the compensation is determined (S620). The unit beam 13a with an open path may be irradiated to the processing point 11 for which the compensation is determined, and the unit beam 13a may be compensated for the processing point 11 for which the compensation is determined (only). Through this, the unit beam 13a of the same number of times of irradiation is irradiated to all the plurality of processing points 11, thereby further reducing processing deviation between the plurality of processing points 11.

The process of additionally irradiating the unit beam 13a (S600) may be performed in stages until the number of irradiation times of each of the plurality of processing points 11 all reach the determined number of irradiation. The process of additionally irradiating the unit beam 13a (S600) may be performed until the irradiation times of each of the plurality of processing points 11 all reach the determined irradiation number, and the blocked unit beam 13a It can be done step by step while changing the path of. Accordingly, the processing of all the plurality of processing points 11 can be completed, and all the plurality of processing points 11 are irradiated with a unit beam 13a of the same number of times of irradiation, thereby processing deviation between the plurality of processing points 11 May be further reduced.

Here, in the process of additionally irradiating the unit beam 13a (S600), the unit beam 13a to be irradiated (or to be irradiated) among the multi-beams 13 according to the position of the processing point 11 for which the compensation is determined ( Alternatively, it may be performed by determining the position of the unit beam. In this case, the position of the irradiated unit beam 13a may be different according to the position of the processing point 11 at which the compensation is determined. The energy of the unit beam 13a to be irradiated may be determined according to the accumulated energy of the position of the processing point 11 for which the compensation is determined (or the total amount of energy of the irradiated unit beam), and the energy of the determined unit beam 13a Unit beams 13a at different (or appropriate) positions may be selected.

For example, a unit beam 13a of a high energy portion (for example, a central portion) of the multi-beam 13 may be additionally irradiated to the processing point 11 where the accumulated energy is low (or small) and the compensation is determined. have. In general, the processing points 11 located at the edge (or edge area) among the plurality of processing points 11 that need to be compensated by additionally irradiating the unit beam 13a because the processing is not completed have low cumulative energy and Since there is a large difference from the accumulated energy of the positioned processing points 11, the unit beam 13a of the high energy portion of the multi-beam 13 can be additionally irradiated. Accordingly, the energy of the processing point 11 for which the compensation is determined may be compensated, and a variation in accumulated energy between a plurality of processing points 11 and/or a processing variation between a plurality of processing points 11 may be minimized. At this time, since the accumulated energy gradually decreases as the distance from the central portion of the plurality of processing points 11 among the processing points 11 for which the compensation is determined, corresponding (or opposite) to the central portion of the plurality of processing points 11 The energy of the irradiated unit beam 13a may increase gradually as the processing point 11 at which the distant compensation is determined increases.

Meanwhile, in the process of moving the irradiation position of the multi-beam 13 (S450), after the scan in the first direction is completed, the irradiation position of the multi-beam 13 is moved in a second direction crossing the first direction. A process of moving (S455) may be included (more).

After the scan in the first direction is completed, the irradiation position of the multi-beam 13 may be moved in a second direction crossing the first direction. While moving the irradiation position of the multi-beam 13 in the second direction, scanning in the first direction is performed for each position (or line) moved in the second direction, You can make the processing complete.

6 is a schematic diagram showing a multi-beam processing apparatus according to another embodiment of the present invention.

A multi-beam processing apparatus according to another embodiment of the present invention will be described in more detail with reference to FIG. 6, and details overlapping with those previously described in relation to the multi-beam processing method according to an embodiment of the present invention will be omitted. .

A multi-beam processing apparatus 100 according to another embodiment of the present invention includes a workpiece support 110 for supporting an object 10 to be processed at a plurality of predetermined processing points 11; A laser beam oscillator 120 for generating and outputting a laser beam 12 for the processing; A multi-beam forming unit 130 configured to form a multi-beam 13 by dividing the output laser beam 12 into a plurality of unit beams 13a less than the number of the plurality of processing points 11; A multi-beam irradiation unit 160 for irradiating the multi-beam 13 onto the object 10 a plurality of times; And moving the workpiece support 110 so that the irradiation position of the multi-beam 13 is changed to a second irradiation position 30b partially overlapping the irradiated first irradiation position 30a. It may include; support base driving unit 140.

The workpiece support 110 may support the object to be processed 10 to be processed at a plurality of predetermined processing points 11. Here, the object to be processed 10 may generally be a mask stick (or metal plate) of a fine metal mask (FMM) used in a vacuum deposition process when manufacturing an organic EL (electroluminescence) or an organic semiconductor device. have.

The laser beam oscillation unit 120 may generate and output a laser beam 12 for the processing, and generate a laser beam 12 to process the object 10 to oscillate toward the object 10 to be processed. I can. In this case, the laser beam oscillation unit 120 may output the laser beam 12 in the form of a pulse laser, and a high energy beam may be periodically irradiated for a short time. In this case, heat accumulation at the irradiation point 31 can be suppressed or prevented. Here, the laser beam oscillation unit 120 may be a known configuration that generates a laser beam, and excimer lasers such as KrF excimer lasers and ArF excimer lasers, diode pumped solids (Diode) according to the wavelength of the laser beam to be used. Various types of lasers such as Pumping Solid-State (DPSS) lasers may be employed.

The multi-beam forming unit 130 may form a multi-beam 13 by dividing the output laser beam 12 into a plurality of unit beams 13a less than the number of a plurality of processing points 11. By irradiating (13) to the object 10 to be processed, the same (or two or more) processing points 11 equal to the number of the plurality of unit beams 13a can be simultaneously processed.

The multi-beam irradiation unit 160 may irradiate the multi-beam 13 onto the object 10 a plurality of times, and block (or close) the multi-beam 13 by opening and closing the path of the multi-beam 13 The multi-beam 13 may be irradiated multiple times to the object 10 by repeating and passing (or opening), or according to the multi-beam 13 periodically provided to the laser beam 12 in the form of a pulsed laser. The beam 13 may be irradiated multiple times on the object 10 to be processed.

The support drive unit 140 moves the workpiece support 110 to change the irradiation position of the multi-beam 13 to a second irradiation position 30b partially overlapping the first irradiation position 30a where the multi-beam 13 is irradiated. Can be moved. The irradiation position of the multi-beam 13 may be moved through the support driving part 140, and unit beams 13a at different positions may be overlapped on the processing point 11. In this case, the irradiation position of the multi-beam 13 may be moved from the first irradiation position 30a to a second irradiation position 30b partially overlapping with the first irradiation position 30a.

Here, the support drive unit 140 includes a power source 141 that provides a driving force for moving the workpiece support 110; And it may include a connection portion 142 connecting the workpiece support 110 and the power source 141.

The power source 141 may provide a driving force for the movement of the workpiece support 110 and may be configured with a servo-motor or the like.

The connection part 142 may connect the workpiece support 110 and the power source 141, and its length may change, or another configuration may move along (or ride) the connection part 142 to move the workpiece support 110. have.

The multi-beam processing apparatus 100 according to the present invention includes: an irradiation frequency setting unit (not shown) for setting the irradiation frequency of the unit beam 13a of each processing point 11; And a unit beam number determination unit (not shown) that determines the number of the plurality of unit beams 13a according to the set number of irradiation of the unit beams 13a.

The irradiation frequency setting unit (not shown) may set (or determine) the number of irradiation of the unit beam 13a of each processing point 11, and the number of irradiation of the unit beam 13a of each processing point 11 It may be determined and set, or the number of irradiation of the unit beam 13a of each processing point 11 may be set as the number of input irradiation. For example, the number of irradiation setting unit (not shown) is the unit of each processing point 11 by the number of irradiation of the unit beam 13a to be processed (or can be processed) of each processing point 11 The number of irradiation of the beam 13a can be set, and the number of irradiation of the unit beam 13a of each processing point 11 can be set by experimentally checking the number of irradiation of the unit beam 13a at which processing can be completed. .

The number of unit beams determining unit (not shown) may determine the number of the plurality of unit beams 13a according to the set number of irradiation of the unit beams 13a. Here, the number of unit beams determining unit (not shown) is the first direction unit beam 13a of the multi-beam 13 which is less than the number of the first direction processing points 11 of the plurality of processing points 11 You can determine the number of. Then, the number of the first direction unit beams 13a of the multi-beams 13 are determined according to the set number of irradiation of the unit beams 13a, and the plurality of processing points 11 are designated as the multi-beams 13 When scanning in the first direction (or to the end of the first direction), most (or the central portion) of the processing point 11 may be processed to be completed.

Meanwhile, the number of second direction unit beams 13a crossing the first direction in the multi-beam 13 may be determined to be less than or equal to the number of the second direction processing points 11 of the plurality of processing points 11. In addition, since there may be difficulty in overlapping and/or compensating in the second direction, a line pattern (or shape) in which the unit beams 13a are arranged in a row may facilitate overlapping and compensation of the unit beams 13a. have. Through this, the number of unit beams determining unit (not shown) may determine the number of the plurality of unit beams 13a.

In addition, the multi-beam forming unit 130 includes a pattern plate 131 on which diffraction patterns are formed according to the number and interval of the plurality of unit beams 13a, and the laser beam 12 is incident thereon; And a pattern plate changing unit (not shown) that determines a diffraction pattern according to the determined number of the plurality of unit beams 13a and the spacing of the plurality of unit beams 13a, and changes to the pattern plate 131 on which the determined diffraction pattern is formed. Poem).

The pattern plate 131 may have a diffraction pattern according to the number and interval of the plurality of unit beams 13a, and the laser beam 12 may be incident. When the laser beam 12 is incident on the pattern plate 131, the laser beam 12 may be divided into the number and interval of a plurality of unit beams 13a determined according to a diffraction pattern formed on the pattern plate 131. Here, the pattern plate 131 may include a Diffractive Optical Element (DOE).

The pattern plate changing unit (not shown) may determine a diffraction pattern according to the determined number of the plurality of unit beams 13a and the interval between the plurality of unit beams 13a, and the pattern plate 131 having the determined diffraction pattern formed thereon. Can be changed to A plurality of unit beams having a desired (or determined) number and intervals by determining an appropriate diffraction pattern according to the determined number and interval of the plurality of unit beams 13a and changing to the pattern plate 131 on which the determined diffraction pattern is formed ( The laser beam 12 can be split into 13a). The multi-beam processing apparatus 100 of the present invention determines a diffraction pattern according to the number of the plurality of unit beams 13a determined by the pattern plate changing unit (not shown) and the spacing of the plurality of unit beams 13a, By changing to the pattern plate 131 on which the determined diffraction pattern is formed, multi-beams having a desired number and spacing can be formed.

Meanwhile, the multi-beam forming unit 130 may further include a focusing lens 132 that adjusts the focus of the multi-beam 13. The focusing lens 132 is provided on a path between the pattern plate 131 and the multi-beam irradiation unit 160, and is irradiated onto the focal point and/or the object to be processed 10 incident on the multi-beam irradiation unit 160 You can adjust the focus. In addition, the size of the multi-beam 13 may be adjusted through the focusing lens 132.

The multi-beam irradiation unit 160 may include an angle correction optical system 161 that adjusts the irradiation angle of the plurality of unit beams 13a divided by the pattern plate 131 to a predetermined angle.

The angle correction optical system 161 may adjust the irradiation angle of the plurality of unit beams 13a divided by the pattern plate 131 to a predetermined angle, and may convert the plurality of unit beams 13a into a parallel light form. Here, the angle correction optical system 161 may include a telecentric optical system (or lens).

Meanwhile, the multi-beam processing apparatus 100 of the present invention may further include a mirror unit 165 for reflecting a plurality of unit beams 13a. The mirror unit 165 can change the path (or direction) of the plurality of unit beams 13a by reflecting the plurality of unit beams 13a, and the plurality of unit beams 13a through the number of mirror units 165 The length of the path can be adjusted. Here, the mirror unit 165 is not particularly limited as long as it can reflect the plurality of unit beams 13a, and may be configured in various ways.

The multi-beam processing apparatus 100 according to the present invention is provided on a path between the pattern plate 131 and the object to be processed 10, and blocks some paths of the plurality of unit beams 13a. The unit 150; may further include.

The beam cutting unit 150 may be provided on a path between the pattern plate 131 and the object 10 to be processed to block some paths of the plurality of unit beams 13a. By blocking the path of some of the plurality of unit beams 13a through the beam cutting unit 150, the unit beam 13a can be irradiated only at the processing point 11 where (additional) irradiation of the unit beam 13a is required. have. For example, the path of the unit beam 13a corresponding to the processing point 11 for which compensation is not determined may be blocked, and the unit beam 13a may be additionally irradiated only to the processing point 11 for which the compensation is determined. Meanwhile, the beam cutting unit 150 may block some paths of the plurality of unit beams 13a to adjust the number of the plurality of unit beams 13a and/or the energy distribution of the multi-beams 13.

Further, the beam cutting part 150 has a hollow part, and a body part 151 providing a path of the plurality of unit beams 13a; And a blocking plate 152 provided on a side wall of the body portion 151 and having a length adjusted in the inner direction of the hollow portion.

The body portion 151 may have a hollow portion, and may provide a path for a plurality of unit beams 13a through the hollow portion. The material and/or shape of the body part 151 is particularly limited if there is no path change and/or energy loss (or strength decrease) due to the material and/or shape while a plurality of unit beams 13a pass through the hollow part. It doesn't work.

The blocking plate 152 may be provided on the sidewall of the body part 151 and its length may be adjusted in the inner direction of the hollow part. That is, some paths of the plurality of unit beams 13a may be blocked by adjusting the open area (or diameter) of the hollow part.

For example, a plurality of blocking plates 152 may be provided on both side walls of the body part 151, and the gaps are narrowed toward each other at both side walls of the body part 151 to reduce the open area of the hollow part. It can be reduced, and apart from each other, the open area of the hollow portion can be widened.

The multi-beam processing apparatus 100 according to the present invention includes: an irradiation count detection unit (not shown) for detecting the irradiation count of the unit beam 13a for each processing point 11 of the object 10; And a compensation determination unit (not shown) that determines whether or not to compensate by determining whether the number of irradiations detected for each processing point 11 has reached a predetermined number of irradiations.

The number of irradiation detection unit (not shown) can detect the number of irradiation of the unit beam 13a for each processing point 11 of the object 10, and checks whether processing is completed for each processing point 11 (or Grasp) can. It is possible to complete (or stop) the unit beam overlapping process in which the first irradiation position 30a and the second irradiation position 30b partially overlap by determining whether processing is completed for each processing point 11. In this case, the unit beam overlapping process may be completed after scanning the entire plurality of processing points 11 while partially overlapping the first and second irradiation positions 30a and 30b. Through this, after scanning the entire plurality of processing points 11 by the unit beam overlapping process, most of the processing points except for the processing points 11 located at the edges (or edge regions) of the plurality of processing points 11 ( 11) can be completed to process.

The compensation determination unit (not shown) may determine whether or not to compensate by determining whether the number of investigations detected for each processing point 11 has reached a predetermined number of investigations, and the number of detected investigations is less than the determined number of investigations. (11) can determine the compensation. That is, it is possible to grasp (or detect) a processing point 11 (or a compensation area) to compensate for the unit beam 13a by comparing the detected number of irradiation with the determined number of irradiation.

In addition, the beam cutting unit 150 may block a path of the unit beam 13a corresponding to the processing point 11 for which compensation is not determined. The unit beam 13a may be additionally irradiated only to the processing point 11 where compensation is determined, and the unit beam 13a with an open path may be irradiated to the processing point 11 at which the compensation is determined. At this time, through the beam cutting unit 150, the path of the unit beam 13a corresponding to the processing point 11 for which the compensation is not determined can be blocked, and the unit beam 13a whose path is open can be processed. It can only be investigated at point (11). Through this, it is possible to compensate the unit beam 13a to the processing point 11 for which the compensation is determined (only), and the unit beam 13a of the same number of irradiation to all the plurality of processing points 11 The machining deviation between the machining points 11 can be further reduced.

The multi-beam processing apparatus 100 according to the present invention may further include a position measuring unit (not shown) for measuring the position coordinates and the moving distance of the workpiece support 110.

The position measuring unit (not shown) may measure the position coordinates and the moving distance of the workpiece support 110. By measuring the position coordinates and moving distance of the workpiece support 110 through a position measuring unit (not shown), the workpiece support 110 can be moved to an accurate position, and the multi-beam 13 corresponds to the processing point 11, respectively. To be investigated. Here, the position measuring unit (not shown) may include an encoder.

In addition, a plurality of processing points 11 and a plurality of unit beams 13a may be arranged side by side in a first direction, and the support base driving unit 110 is in the first direction according to the measurement of the position measuring unit (not shown). By moving the workpiece support 110, the multi-beams (31) of the predetermined number of unit beams (13a) to the second irradiation location (30b) overlapping with the first irradiation location (30a) 13) can be changed.

A plurality of processing points 11 and a plurality of unit beams 13a may be arranged side by side along the first direction, and some irradiation points 31 may be overlapped while moving the workpiece support 110 in the first direction. .

At this time, the support driving unit 110 may move the workpiece support 110 in the first direction according to the measurement of the position measuring unit (not shown), and a plurality of unit beams 13a may be provided at each processing point 11 ), so that it can be accurately positioned. In this way, the support driving unit 110 moves from the first irradiation position 30a to the second irradiation position 30b where the irradiation points 31 of a predetermined number of unit beams 13a overlap the first irradiation position 30a. The irradiation position of the multi-beam 13 may be changed.

As described above, in the present invention, after the multi-beam is irradiated to the first irradiation position, the multi-beam is irradiated to the second irradiation position partially overlapping the first irradiation position, so that the unit beams at different positions are overlapped at the overlapping irradiation point. Can mix different unit beams. Accordingly, machining deviation between a plurality of processing points due to a difference in beam intensity for each position of the plurality of unit beams may be reduced. In addition, by determining the number of irradiation of unit beams to complete processing of each processing point, the number of unit beams in the first direction of the multi-beam is determined, and the first irradiation according to the determined number of irradiation and the determined number of unit beams in the first direction The number of irradiation points of the unit beam overlapping the location and the second irradiation location may be determined. Through this, it is possible to effectively mix unit beams having different beam intensity (or energy) at each of the plurality of processing points, and it is possible to minimize processing deviation between the plurality of processing points. In addition, by blocking some unit beams of the multi-beams with the beam cutting unit, the overlapping of the unit beams is not achieved only by moving the irradiation position of the multi-beams, or the unit beam is additionally irradiated to a processing point where the number of irradiation of the unit beam is less than the determined number of irradiation. I can. For example, since the number of irradiation of the unit beam is less than the determined number of irradiation, the number of irradiation of the unit beam may be compensated for a processing point where processing has not been completed. Through this, the unit beams may be superimposed on all the plurality of processing points to complete processing.

Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments, and common knowledge in the field to which the present invention belongs without departing from the gist of the present invention claimed in the claims. Those who have a will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the technical protection scope of the present invention should be determined by the following claims.

Claims (16)

1. Setting a plurality of processing points on the object to be processed;

   Generating and outputting a laser beam for processing the object to be processed;

   Dividing the laser beam into a plurality of unit beams less than the number of the plurality of processing points to form a multi-beam;

   Irradiating the multi-beam to a first irradiation position corresponding to some of the plurality of processing points;

   Moving the irradiation position of the multi-beam; And

   A process of irradiating the multi-beam to a second irradiation location partially overlapping with the first irradiation location.
2. The method according to claim 1,

   In the process of setting the plurality of processing points, the plurality of processing points arranged at equal intervals of the first distance are set,

   The process of forming the multi-beam is performed by dividing the laser beam into the plurality of unit beams arranged at equal intervals of a second distance proportional to the first distance.
3. The method according to claim 1,

   The plurality of processing points and the plurality of unit beams are arranged side by side along a first direction,

   In the process of moving the irradiation position of the multi-beams, the multi-beam processing method of moving the irradiation position of the multi-beams in the first direction.
4. The method according to claim 1,

   The process of determining the number of times of irradiation of the unit beam according to the energy of the multi-beams.
5. The method of claim 4,

   The process of determining the number of unit beams in the first direction of the multi-beam according to the determined number of irradiation; further comprising,

   The process of forming the multi-beam,

   Determining the spacing of the plurality of unit beams according to the spacing of the plurality of processing points;

   Providing a pattern plate on which diffraction patterns are formed according to the determined number and spacing of the plurality of unit beams; And

   A multi-beam processing method comprising the step of injecting the laser beam onto the pattern plate.
6. The method of claim 5,

   Determining the number of irradiation points of the unit beams overlapping the first irradiation location and the second irradiation location according to the determined number of irradiation and the determined number of unit beams in the first direction; and

   In the process of moving the irradiation position of the multi-beam, a multi-beam in which the irradiation point is moved to the second irradiation position overlapping the first irradiation position by the determined number of irradiation points of the overlapping unit beam. Beam processing method.
7. The method of claim 4,

   Detecting the number of times the unit beam is irradiated for each processing point;

   Determining whether to compensate by determining whether the number of irradiations detected for each processing point reaches the determined number of irradiations; And

   The process of additionally irradiating the unit beam to the processing point for which compensation is determined; the multi-beam processing method further comprising.
8. The method of claim 7,

   The process of additionally irradiating the unit beam,

   Blocking a path of a unit beam corresponding to a processing point for which compensation is not determined; And

   A multi-beam processing method comprising the step of irradiating a unit beam with an open path to a processing point at which the compensation is determined.
9. The method of claim 7,

   The process of additionally irradiating the unit beam is performed in stages until the number of irradiation times of each of the plurality of processing points reaches the determined number of irradiation.
10. A workpiece support for supporting an object to be processed at a plurality of preset processing points;

    A laser beam oscillator for generating and outputting a laser beam for the processing;

    A multi-beam forming unit configured to form a multi-beam by dividing the output laser beam into a plurality of unit beams less than the number of the plurality of processing points;

    A multi-beam irradiation unit for irradiating the multi-beam onto the object to be processed a plurality of times; And

    And a support driving unit for moving the workpiece support to change the irradiation position of the multi-beam to a second irradiation position partially overlapping with the first irradiation position to which the multi-beam is irradiated.
11. The method of claim 10,

    An irradiation count setting unit for setting the irradiation count of the unit beam at each processing point; And

    The multi-beam processing apparatus further comprising a; unit beam number determining unit determining the number of the plurality of unit beams according to the set number of irradiation of the unit beam.
12. The method of claim 11,

    The multi-beam forming unit,

    A pattern plate on which diffraction patterns according to the number and interval of the plurality of unit beams are formed, and on which the laser beam is incident; And

    A multi-beam processing apparatus comprising a pattern plate changing unit that determines a diffraction pattern according to the determined number of the plurality of unit beams and an interval between the plurality of unit beams, and converts the determined diffraction pattern into a pattern plate.
13. The method of claim 12,

    The multi-beam processing apparatus including an angle correction optical system for adjusting the irradiation angle of the plurality of unit beams divided by the pattern plate to a predetermined angle.
14. The method of claim 12,

    A beam cutting unit provided on a path between the pattern plate and the object to be processed to block a path of some of the plurality of unit beams; further comprising,

    The beam cutting part,

    A body portion having a hollow portion and providing a path of the plurality of unit beams; And

    A multi-beam processing apparatus including a blocking plate provided on a side wall of the body portion and having a length adjusted in the inner direction of the hollow portion.
15. The method of claim 14,

    An irradiation count detection unit for detecting the irradiation count of the unit beam for each processing point of the object to be processed; And

    Compensation determination unit determining whether to compensate by determining whether the number of irradiation detected for each processing point reaches a predetermined number of irradiation; further comprises,

    The beam cutting unit is a multi-beam processing apparatus for blocking a path of a unit beam corresponding to a processing point for which compensation is not determined.
16. The method of claim 10,

    Further comprising; a position measuring unit for measuring the position coordinates and the moving distance of the workpiece support,

    The plurality of processing points and the plurality of unit beams are arranged side by side along a first direction,

    The support drive unit moves the workpiece support in the first direction according to the measurement of the position measuring unit, so that the multi-beams to the second irradiation position where a predetermined number of irradiation points of the unit beam overlap with the first irradiation position. Multi-beam processing device that changes the irradiation position

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