WO2020151297A1 - 微带辐射单元和阵列天线 - Google Patents

微带辐射单元和阵列天线 Download PDF

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Publication number
WO2020151297A1
WO2020151297A1 PCT/CN2019/115523 CN2019115523W WO2020151297A1 WO 2020151297 A1 WO2020151297 A1 WO 2020151297A1 CN 2019115523 W CN2019115523 W CN 2019115523W WO 2020151297 A1 WO2020151297 A1 WO 2020151297A1
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WIPO (PCT)
Prior art keywords
radiation unit
microstrip
circuit
radiation
dielectric substrate
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Application number
PCT/CN2019/115523
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English (en)
French (fr)
Inventor
骆胜军
潘波
程季
Original Assignee
武汉虹信通信技术有限责任公司
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Application filed by 武汉虹信通信技术有限责任公司 filed Critical 武汉虹信通信技术有限责任公司
Priority to EP19912014.8A priority Critical patent/EP3916906A4/en
Publication of WO2020151297A1 publication Critical patent/WO2020151297A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H01Q21/26—Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/062—Two dimensional planar arrays using dipole aerials

Definitions

  • the embodiments of the present disclosure relate to the field of communication technologies, and in particular, to a microstrip radiating unit and an array antenna.
  • the 5th-Generation (5G) mobile communication technology applies large-scale antenna technology, deploying dozens or even hundreds of antenna-scale antenna arrays at the base station to increase network capacity.
  • the large-scale antenna technology in the 5G era has turned the antenna into an integrated active antenna (Active Antenna Unit, AAU).
  • AAU integrates the antenna and the radio remote unit (RRU), resulting in a straight line in the weight of the AAU.
  • RRU radio remote unit
  • the existing radiation unit mainly includes the following three solutions.
  • the first solution is to use an aluminum alloy integral die-casting structure. Due to the use of a high-density metal base material, the weight of the vibrator is heavier, which does not meet the demand for lightweight large-scale antennas. Moreover, the radiating part and the feeding part are separated, and the assembly is relatively complicated, which is not suitable for large-scale automated production.
  • the second solution uses a PCB structure. The radiating part and the feeding part are etched on different flat substrate PCBs, and then the various components are welded together to produce electrical contact. Although this implementation method greatly reduces the weight of the radiating unit, Due to the large number of parts, complex assembly and low reliability, it is very unfavorable for large-scale automated production.
  • the third scheme is improved on the basis of the first scheme.
  • the radiator part is made of engineering plastic injection molding, and then the whole is electroplated. Although the weight of the radiating unit is reduced, the radiating part and the feeding part still belong to Separate structure, assembly is
  • the embodiments of the present disclosure provide a microstrip radiating unit and an array antenna to solve the problems of heavy weight and complicated assembly of the existing radiating unit.
  • embodiments of the present disclosure provide a microstrip radiation unit, including a dielectric substrate, a radiation circuit, and a feed circuit;
  • the media base material is integrally injection molded, and the media base material includes a top part, a support part and a welding part, and the support part is connected to the top part and the welding part respectively;
  • the radiation circuit is arranged on the upper surface of the top, and the feed circuit is arranged on the lower surface of the top and extends along the support part to the welding part.
  • embodiments of the present disclosure provide an array antenna, including a plurality of microstrip radiating units as provided in the first aspect, and a feeding network for installing each of the microstrip radiating units.
  • the embodiment of the present disclosure provides a microstrip radiating unit and an array antenna.
  • the weight of the radiating unit is reduced by an integrally injection-molded dielectric substrate, and the radiating circuit and the feeding circuit are both arranged on the dielectric substrate to realize the radiating unit.
  • the integration simple structure, no assembly required, improved reliability and consistency of the radiation unit, and more suitable for large-scale manufacturing.
  • the single-layer radiation circuit is used to realize the microstrip radiation unit, which has good low profile characteristics, effectively reduces the height of the radiation unit, further reduces the weight of the radiation unit, and realizes the lightweight of the radiation unit.
  • FIG. 1 is a schematic structural diagram of a microstrip radiation unit provided by an embodiment of the disclosure
  • FIG. 2 is a schematic structural diagram of a microstrip radiation unit provided by another embodiment of the disclosure.
  • FIG. 3 is a top view of a microstrip radiation unit provided by an embodiment of the disclosure.
  • FIG. 4 is a top view of a microstrip radiation unit provided by another embodiment of the disclosure.
  • Figure 5 is a top view of a microstrip radiation unit provided by an embodiment of the disclosure.
  • FIG. 6 is a schematic structural diagram of an array antenna provided by an embodiment of the disclosure.
  • FIG. 7 is a schematic structural diagram of a feed network provided by an embodiment of the disclosure.
  • FIG. 8 is a schematic diagram of differential feeding of an integrated microstrip radiating unit provided by an embodiment of the disclosure.
  • FIG. 1 is a schematic structural diagram of a microstrip radiation unit provided by an embodiment of the disclosure.
  • the microstrip radiation unit includes a dielectric substrate 11, a radiation circuit 12, and a feed circuit 13; wherein the dielectric substrate 11 is integrated
  • the dielectric substrate 11 includes a top portion 111, a support portion 112, and a welding portion 113.
  • the support portion 112 is connected to the top portion 111 and the welding portion 113, respectively; the radiation circuit 12 is arranged on the upper surface of the roof 111, and the feed circuit 13 is arranged on the top 111 The lower surface extends along the supporting portion 112 to the welding portion 113.
  • the dielectric substrate 11 is a single part that includes a top part 111, a support part 112 and a welding part 113 from top to bottom.
  • the support part 112 is a connecting part between the top part 111 and the welding part 113.
  • the support part 112 may be a single columnar structure shown in FIG. 1, or may be composed of a plurality of supporting components.
  • the side of the top 111 in contact with the supporting portion 112 is confirmed as the lower surface of the top 111, and accordingly the side of the top 111 not in contact with the supporting portion 112 is confirmed as the upper surface of the top 111.
  • the radiating circuit 12 is arranged on the upper surface of the top 111.
  • the radiating circuit 12 can completely cover the upper surface of the top 111, or it can be arranged on the upper surface of the top 111 in a shape consistent with the upper surface of the top 111, or it can be arranged on the top 111 based on a preset shape.
  • the preset position of the upper surface is not limited in the embodiment of the present disclosure.
  • the feeder circuit 13 is arranged on the back of the arrangement surface of the radiation circuit 12, that is, the lower surface of the top 111, and the supporting portion 112 contacting the lower surface of the top 111, and finally extends to the soldering portion 113 to facilitate the operation in the microstrip radiation unit During installation, when the welding part 113 is connected to the feeding network, the electric connection between the feeding circuit 13 and the feeding network is realized through the welding part 113.
  • the radiating circuit 12 is arranged on the upper surface of the top 111
  • the feeding circuit 13 is arranged on the lower surface of the top 111
  • the specific arrangement position of the radiating circuit 12 on the upper surface of the top 111 and the specific arrangement of the feeding circuit 13 on the lower surface of the top 111 The arrangement positions are corresponding, so that the radiation circuit 12 arranged on the upper surface of the top 111 and the feed circuit 13 arranged on the lower surface of the top 111 form a radiating unit for coupling and feeding.
  • the arrangement of the radiating circuit 12 and the feeding circuit 13 on the dielectric substrate 11 can be implemented by 3D-MID (3D Molded Interconnect Device) technology.
  • the microstrip radiation unit provided by the embodiment of the present disclosure reduces the weight of the radiation unit through the integrated injection-molded dielectric substrate 11, and both the radiation circuit 12 and the feed circuit 13 are arranged on the dielectric substrate 11 to realize the Integration, simple structure, no assembly required, improved reliability and consistency of the radiation unit, and more suitable for large-scale manufacturing.
  • the single-layer radiation circuit is used to realize the microstrip radiation unit, which has good low profile characteristics, effectively reduces the height of the radiation unit, further reduces the weight of the radiation unit, and realizes the lightweight of the radiation unit.
  • FIG. 2 is a schematic structural diagram of a microstrip radiation unit provided by another embodiment of the present disclosure.
  • an extension hole 114 is opened in the center of the top 111, and the extension hole 114 is The support part extends in the direction of the welding part; the radiation circuit is extended to the wall of the extension hole 114.
  • an extension hole 114 is opened in the center of the top 111, and the extension hole 114 extends in the direction of the welding part.
  • the extension hole 114 may be a through hole, that is, the support part and the welding part of the dielectric substrate are of hollow design, and the extension hole 114 It may also be a blind hole, that is, the extension hole 114 extends in the support portion but is not opened, which is not specifically limited in the embodiment of the present disclosure.
  • the radiation circuit arranged on the upper surface of the top 111 is extended to the wall of the extension hole 114.
  • the radiation circuit is divided into two parts, one part is the radiation circuit arranged on the upper surface of the top 111.
  • the other part of the top radiation circuit 121 is the radiation circuit extending to the wall of the extension hole 114, that is, the extension radiation circuit 122.
  • the support part can be regarded as a hollow design
  • the hole wall of the extension hole 114 is regarded as the inner wall of the support part
  • the surface of the support part on which the feed circuit is arranged is regarded as the support part
  • a non-conductive area is also arranged on the radiation circuit.
  • FIG. 3 is a top view of the microstrip radiation unit provided by an embodiment of the disclosure.
  • the top 111 of the dielectric substrate is circular, the top 111 is provided with a radiation circuit 12, and the center of the top 111 is provided with an extension hole 114, The center of 111 is the center, and four groups of non-conductive areas 14 are evenly distributed on the upper surface, and each non-conductive area 14 is in a line shape.
  • 4 is a top view of a microstrip radiation unit provided by another embodiment of the present disclosure. As shown in FIG.
  • the top 111 of the dielectric substrate is octagonal, the top 111 is provided with a radiation circuit 12, and the center of the top 111 is provided with an extension hole 114 , With the center of the top 111 as the center, four groups of demetallized non-conductive regions 14 are evenly distributed on the upper surface, and each non-conductive region 14 is a figure eight.
  • a reinforcing rib is also arranged on the top.
  • stiffeners on the top of the media base material by adding stiffeners on the top of the media base material, the structural strength of the integrated media base material and the flatness of the top planar structure can be improved, and the “mouth”-shaped skirt ribs can be provided at the periphery of the top.
  • a cross-shaped stiffener may be provided on the top surface based on the top center, which is not specifically limited in the embodiment of the present disclosure.
  • the radiation circuit and the feed circuit are arranged symmetrically based on the central axis of the dielectric substrate. Therefore, when the microstrip radiation unit is used as a single component for the whole machine assembly, the radiation unit and the feed circuit The electrical connection assembly of the network does not require additional identification, which is very suitable for automated production in large-scale array antenna applications.
  • FIG. 5 is a top view of the microstrip radiating unit provided by the embodiment of the disclosure.
  • the microstrip radiating unit includes four groups of feeder circuits 13, and the four groups of feeder circuits 13 are dielectric
  • the center axis of the substrate 11 is uniformly distributed on the axis.
  • each group of feeder circuits 13 has the same structure, and is distributed in 90° rotation along the central axis in sequence.
  • the microstrip radiation unit including four groups of feeder circuits 13 is a dual-polarized radiation unit.
  • Each polarization of the dual-polarized radiation unit is differentiated by two groups of feeder circuits 13 arranged oppositely and symmetrically (with a 180° phase difference). ) Feeding to suppress high-order modes, further reduce the coupling between the two ports, and improve the pattern consistency and isolation of the dual-polarized oscillator +45° polarization and -45° polarization.
  • the welding portion 113 includes four pins 1131 evenly distributed around the center axis of the dielectric substrate 11, and each feed circuit 13 wraps a pin 1131 .
  • each feeder circuit 13 includes a top feeder circuit 131, an intermediate connection portion 132, and a bottom soldering portion 133.
  • the top feeder circuit 131 is the set of feeder circuits 13 arranged on the top 111 of the dielectric substrate.
  • the middle connecting portion 132 is the part of the group of feeding circuits 13 that is laid on the dielectric substrate support 112 to connect the top feeding circuit 131 and the bottom welding portion 133
  • the bottom welding portion 133 is the group of feeding circuits 13 It is arranged on the welding part 113 of the dielectric base material 11 and is wrapped around a part of a pin 1131 corresponding to the welding part 113.
  • the bottom welding part 133 of the wrapping pin 1131 is used to electrically connect with the feed network port to realize signal excitation.
  • a slot 1132 is provided between any two adjacent pins 1131 of the welding portion 113.
  • the slot 1132 may be a slot of various shapes such as a U-shaped groove and a V-shaped groove.
  • the microstrip radiation unit is a three-dimensional molded interconnection device, and the entire microstrip radiation unit is a single component, which simplifies the supply chain, has a simple structure, improves the reliability and consistency of the radiation unit, and is suitable for large-scale manufacture.
  • FIG. 6 is a schematic structural diagram of an array antenna provided by an embodiment of the present disclosure.
  • the array antenna includes a plurality of microstrip radiating units 1, and is used to install each microstrip radiating unit 1.
  • each microstrip radiating unit 1 is welded to the feeder network 2 through the welding part of the dielectric substrate to realize the electrical connection between the feeder circuit and the feeder network 2.
  • the welding part can be a pin type welding structure, or It may be a soldering type welding structure, and the embodiment of the present disclosure does not specifically limit the installation method between the microstrip radiation unit 1 and the feed network 2.
  • FIG. 7 is a schematic structural diagram of a feed network provided by an embodiment of the disclosure.
  • a number of feed ports 21 are provided on the feed network 2 for electrical connection with the welding part of the microstrip radiation unit.
  • four feed ports 21 are provided for the microstrip radiation unit with four pins in the welding part, and each pin corresponds to a feed port 21.
  • the four pins have rotational center symmetry. In this case, during assembly, only the four pins need to be directly connected to the four feed ports 21, without additional identification, blind mating assembly can be realized, which can significantly shorten the assembly time in antenna production and improve assembly efficiency , Very suitable for realizing automated production in large-scale array antenna applications.
  • FIG. 8 is a schematic diagram of differential feeding of an integrated microstrip radiating unit provided by an embodiment of the disclosure, including an integrated microstrip radiating unit 1 and a differential feeding network 2 thereof.
  • the four solder pins of the integrated radiating unit are blindly inserted into the four feed ports of the differential feed network 2 without additional identification.
  • the two feed ports 21a and 21b (or 22a and 22b) of the same set of polarizations are arranged oppositely and have a phase difference of 180°.
  • the microstrip radiation unit 1 includes a dielectric substrate 11, a radiation circuit 12 and a feeding circuit 13.
  • the dielectric substrate 11 is an integrated structure and is integrally injection molded from high temperature resistant engineering plastics.
  • the dielectric substrate 11 includes a top 111, a supporting portion 112, a welding portion 113 and a reinforcing rib 15.
  • An extension hole 114 is provided at the center of the top 111, and The supporting portion 112 forms a smooth transition structure, which is unobstructed from the top view.
  • the radiation circuit 12 includes a top radiation circuit 121 provided on the upper surface of the top 111 of the dielectric substrate and an extension radiation circuit 122 provided on the surface of the extension hole 114.
  • the top radiation circuit 121 is provided with a demetallization gap, that is, non-conductive.
  • Area 14 The feeding circuit 13 includes a top feeding circuit 131 arranged on the lower surface of the top 111 of the dielectric substrate, an intermediate connecting portion 132 arranged on the outer wall surface of the dielectric substrate supporting portion 112, and a welding portion 113 arranged on the dielectric substrate and covering the entire dielectric substrate.
  • the bottom welding portion 133 of the four welding legs of the material welding portion 113 is provided with a demetallization gap, that is, non-conductive.
  • the planar structure of the top 111 of the dielectric substrate is a square, and can also be a round or other polygonal structure.
  • the extended hole 114 provided in the center of the top 111 can reduce materials and reduce the weight of the integrated dielectric substrate 11.
  • the top radiation circuit 121 provided on the top 111 of the dielectric substrate has a circuit shape consistent with the planar shape of the top 111 of the dielectric substrate 11.
  • On the top radiating circuit 121 with the central axis of the dielectric substrate 11 as the axis, four groups of non-conductive regions 14 with the same structure are arranged, and the shape is "one" or " ⁇ " or other deformed shapes to improve the pole ⁇ Isolation.
  • the extension radiating circuit 122 extending downwardly from the extension hole 114 of the top portion 111 of the dielectric substrate and the connecting portion of the dielectric substrate support portion 112 toward the inner surface of the dielectric substrate support portion 112, that is, the wall of the extension hole 114, can greatly Improve the cross-polarization ratio index of the microstrip radiation unit 1.
  • Reinforcing ribs 15 are respectively arranged on the peripheral edges of the top 111 of the media substrate, forming a “mouth” skirt, and the center of the bottom surface of the top 111 is a “cross” to improve the structural strength of the integrated media substrate 11 and the plane of the top 111 The flatness of the structure.
  • the supporting portion 112 forms a hollow closed structure to enhance the structural strength of the integrated media substrate 11.
  • the supporting portion 112 may be a barrel shape or other closed shapes.
  • the welding part 113 includes four socket pins 1131 that rotate around 90°, and the socket pins 1131 are provided with “U”-shaped slots 1132 in two adjacent areas to further reduce the weight of the integrated dielectric substrate 11.
  • the microstrip radiating unit 1 includes a total of four groups of feeding circuits 13, each of which has the same structure and is distributed along the central axis 90° in turn.
  • the top feeder circuit 131 arranged on the bottom surface of the top 111 of the feeder circuit 13 and the radiation circuit 12 form a radiating unit coupling feed, and the middle connecting portion 132 connects the top feeder circuit 131 and the bottom welding portion 133 , In order to realize the continuous electrical connection of the entire feeder circuit 13.
  • the bottom welding part 133 of the wrapping pin 1131 is used for electrical connection with the feeding port of the feeding network 2 to realize signal excitation.
  • the bottom welding portion 133 may be configured as a pin-type plug-welding type structure, or may be configured as a disc-shaped soldering type structure, which is not specifically limited in the embodiment of the present disclosure.
  • the four groups of feed circuits 13 based on the above structure jointly realize the feed excitation of the dual-polarized microstrip radiation unit 1 to suppress high-order modes, further reduce the coupling between the two ports, and increase the dual-polarized oscillator +45° Polarization and -45° polarization pattern consistency and isolation. It should be noted that in the embodiments of the present disclosure, the coupling feed mode can effectively increase the matching bandwidth of the oscillator.
  • the microstrip radiation unit 1 provided by the embodiment of the present disclosure adopts a single-layer radiation circuit 12 structure.
  • the overall height of the microstrip radiation unit 1 is less than 0.15 ⁇ (where ⁇ represents the wavelength), and has good low profile characteristics; secondly, the microstrip The radiation unit 1 is specially equipped with an extended radiation circuit 122, which greatly improves the cross-polarization index of the microstrip radiation unit 1.
  • the microstrip radiation unit 1 is a 3D-MID molded interconnection device with very light weight and is suitable for Large-scale array antenna application, and the entire microstrip radiating unit 1 is a single component, which simplifies the supply chain, has a simple structure, improves the reliability and consistency of the radiating unit, and is suitable for large-scale manufacturing; in addition, the radiation of the microstrip radiating unit 1
  • the part and the feed part are all based on the center symmetry of the single component of the radiating unit.
  • the four solder pins can be blindly inserted into the four feed ports of the feed network 2 without additional identification, which significantly shortens the assembly time in antenna production and improves assembly efficiency , Very suitable for realizing automated production in large-scale array antenna applications.

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Abstract

本公开实施例提供一种微带辐射单元和阵列天线，其中微带辐射单元包括介质基材、辐射电路和馈电电路；其中，介质基材为一体注塑成型，介质基材包括顶部、支撑部和焊接部，支撑部分别与顶部和焊接部相连；辐射电路布设在顶部上表面，馈电电路布设在顶部下表面，并沿支撑部延伸至焊接部。本公开实施例提供的微带辐射单元和阵列天线，实现了辐射单元的一体化，结构简单，无需装配，提高了辐射单元的可靠性和一致性，更适合大规模制造。此外，微带辐射单元，具有良好的低剖面特征，有效降低了辐射单元的高度，进一步降低了辐射单元重量，实现了辐射单元的轻量化。

Description

微带辐射单元和阵列天线
相关申请的交叉引用
本申请要求于2019年1月22日提交的申请号为2019100580175，发明名称为“微带辐射单元和阵列天线”的中国专利申请的优先权，其通过引用方式全部并入本公开。
技术领域
本公开实施例涉及通信技术领域，尤其涉及一种微带辐射单元和阵列天线。
背景技术
随着移动通信技术迅猛发展，第5代移动通信技术(5th-Generation，5G)应用大规模天线技术，在基站端布置几十甚至上百个天线规模的天线阵列来提升网络容量。5G时代的大规模天线技术将天线变成了一体化有源天线(Active Antenna Unit，AAU)，AAU集成了天线与射频拉远单元(Radio Remote Unit，RRU)，造成了AAU整机重量的直线上升，给铁塔承重和施工带来极大的困扰，因此天线轻量化成为最直观最需要解决的难题。
现有的辐射单元主要包括如下三种方案，第一种方案是采用铝合金一体压铸成型结构，由于采用密度较高的金属基材，振子重量较重，不满足大规模天线轻量化的诉求，且辐射部分和馈电部分分离，装配较为复杂，不适合大规模自动化生产。第二种方案采用PCB结构，辐射部分和馈电部分蚀刻在不同的平面基板PCB上，然后再将各个部件焊接在一起以产生电气接触，这种实现方式虽然大大降低了辐射单元的重量，但是由于零件多，装配复杂，可靠性低，非常不利于大规模自动化生产。第三种方案在第一种方案的基础上进行了改良，其辐射体部分采用工程塑料注塑成型，然后整体电镀的方式，虽然降低了辐射单元的重量，但是其辐射部分和馈电部分仍然属于分离结构，装配上仍然复杂。
因此，如果在实现辐射单元轻量化的同时，满足装配的简易化要求， 以便于大规模自动化生产，仍然是本领域技术人员亟待解决的问题。
发明内容
本公开实施例提供一种微带辐射单元和阵列天线，用以解决现有的辐射单元重量大、装配复杂的问题。
第一方面，本公开实施例提供一种微带辐射单元，包括介质基材、辐射电路和馈电电路；
其中，所述介质基材为一体注塑成型，所述介质基材包括顶部、支撑部和焊接部，所述支撑部分别与所述顶部和所述焊接部相连；
所述辐射电路布设在所述顶部上表面，所述馈电电路布设在所述顶部下表面，并沿所述支撑部延伸至所述焊接部。
第二方面，本公开实施例提供一种阵列天线，包括若干个如第一方面所提供的微带辐射单元，以及用于装设每一所述微带辐射单元的馈电网络。
本公开实施例提供的一种微带辐射单元和阵列天线，通过一体注塑成型的介质基材减轻了辐射单元的重量，将辐射电路和馈电电路均布设在介质基材上，实现了辐射单元的一体化，结构简单，无需装配，提高了辐射单元的可靠性和一致性，更适合大规模制造。此外，采用单层辐射电路实现微带辐射单元，具有良好的低剖面特征，有效降低了辐射单元的高度，进一步降低了辐射单元重量，实现了辐射单元的轻量化。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其余的附图。
图1为本公开实施例提供的微带辐射单元的结构示意图；
图2为本公开另一实施例提供的微带辐射单元的结构示意图；
图3为本公开实施例提供的微带辐射单元的俯视图；
图4为本公开另一实施例提供的微带辐射单元的俯视图；
图5为本公开实施例提供的微带辐射单元的顶视图；
图6为本公开实施例提供的阵列天线的结构示意图；
图7为本公开实施例提供的馈电网络的结构示意图；
图8为本公开实施例提供的一体化微带辐射单元差分馈电示意图。
附图标记说明：
1-微带辐射单元；     11-介质基材；       12-辐射电路；
13-馈电电路；        14-非导电区域；     15-加强筋；
111-顶部；           112-支撑部；        113-焊接部；
114-延伸孔；         1131-插接脚；       1132-开槽；
121-顶部辐射电路；   122-延伸辐射电路；  131-顶部馈电电路；
132-中间连接部；     133-底部焊接部；    2-馈电网络；
21-馈电端口。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其余实施例，都属于本公开保护的范围。
为了解决现有的辐射单元普遍存在的重量较重，不满足大规模天线轻量化的诉求，且装配较为复杂，不适合大规模自动化生产的问题，本公开实施例提供了一种微带辐射单元，在实现辐射单元轻量化的同时，满足装配的简易化要求。图1为本公开实施例提供的微带辐射单元的结构示意图，如图1所示，微带辐射单元包括介质基材11、辐射电路12和馈电电路13；其中，介质基材11为一体注塑成型，介质基材11包括顶部111、支撑部112和焊接部113，支撑部112分别与顶部111和焊接部113相连；辐射电路12布设在顶部111上表面，馈电电路13布设在顶部111下表面，并沿支撑部112延伸至焊接部113。
具体地，介质基材11是自上而下包括顶部111、支撑部112和焊接部113的一体注塑成型的单个部件，其中支撑部112为顶部111与焊接部113之间的连接部件，支撑部112可以是图1中示出的单个柱状结构，还可以是由多个支撑组件构成的。此处，将顶部111与支撑部112接触的一面确认为顶部111的下表面，相应地顶部111未与支撑部112接触的一面确认 为顶部111的上表面。辐射电路12布设在顶部111的上表面，辐射电路12可以完全覆盖顶部111上表面，也可以以与顶部111上表面一致的形状布设在顶部111上表面，还可以基于预设形状布设在顶部111上表面的预设位置，本公开实施例对此不作限定。对应地，馈电电路13布设在辐射电路12布设面的背面，即顶部111下表面，以及与顶部111下表面接触的支撑部112，最终延伸至焊接部113，以便于在微带辐射单元进行安装时，焊接部113与馈电网络连接状态下，通过焊接部113实现馈电电路13和馈电网络之间的电气连接。需要说明的是，辐射电路12布设在顶部111上表面，馈电电路13布设在顶部111下表面，辐射电路12在顶部111上表面的具体布设位置与馈电电路13在顶部111下表面的具体布设位置对应，以便于布设在顶部111上表面的辐射电路12与布设在顶部111下表面的馈电电路13形成辐射单元耦合馈电。
此外，辐射电路12与馈电电路13在介质基材11上的布设，可以通过3D-MID(3D Molded Interconnect Device，三维模塑互连器件)技术实现。
本公开实施例提供的微带辐射单元，通过一体注塑成型的介质基材11减轻了辐射单元的重量，将辐射电路12和馈电电路13均布设在介质基材11上，实现了辐射单元的一体化，结构简单，无需装配，提高了辐射单元的可靠性和一致性，更适合大规模制造。此外，采用单层辐射电路实现微带辐射单元，具有良好的低剖面特征，有效降低了辐射单元的高度，进一步降低了辐射单元重量，实现了辐射单元的轻量化。
基于上述实施例，图2为本公开另一实施例提供的微带辐射单元的结构示意图，如图2所示，微带辐射单元中，顶部111的中心开设有延伸孔114，延伸孔114在支撑部中向焊接部方向延伸；辐射电路延伸布设至延伸孔114的孔壁上。
具体地，顶部111的中心开设有延伸孔114，延伸孔114向焊接部方向延伸，此处延伸孔114可以是通孔，即介质基材的支撑部和焊接部均为中空设计，延伸孔114还可以是盲孔，即延伸孔114在支撑部中延伸但未打通，本公开实施例对此不作具体限定。通过在介质基材中开设延伸孔114，能够进一步减少用料，减轻微带辐射单元的重量。
在此基础上，将布设在顶部111上表面的辐射电路延伸布设至延伸孔114的孔壁上，图2中，将辐射电路分为两部分，一部分为布设在顶部111上表面的辐射电路即顶部辐射电路121，另一部分为延伸至延伸孔114孔壁上的辐射电路即延伸辐射电路122。由于延伸孔114是开设在支撑部中心的孔，可将支撑部视为中空设计，将延伸孔114的孔壁视为支撑部的内壁，将布设有馈电电路的支撑部表面视为支撑部的外壁，通过在支撑部内壁延伸布设辐射电路，能够极大程度上改善微带辐射单元的交叉极化指标。
基于上述任一实施例，微带辐射单元中，辐射电路上还布设有非导电区域。
具体地，为了提升极化隔离度，顶部上表面还设置有非导电区域，本公开实施例不对非导电区域的形状、数量和具体设置位置作限定。图3为本公开实施例提供的微带辐射单元的俯视图，如图3所示，介质基材顶部111为圆形，顶部111布设有辐射电路12，顶部111中心开设有延伸孔114，以顶部111中心为中心，上表面均匀布设有四组去金属化的非导电区域14，每一非导电区域14均为一字形。图4为本公开另一实施例提供的微带辐射单元的俯视图，如图4所示，介质基材顶部111为八边形，顶部111布设有辐射电路12，顶部111中心开设有延伸孔114，以顶部111中心为中心，上表面均匀布设有四组去金属化的非导电区域14，每一非导电区域14均为八字形。
基于上述任一实施例，微带辐射单元中，顶部还布设有加强筋。
具体地，通过在介质基材的顶部加设加强筋，能够提升一体化介质基材的结构强度和顶部平面结构的平整度，可以在顶部四周边缘处设置“口”字形裙边加强筋，还可以基于顶部中心在顶部表面设置“十”字形加强筋，本公开实施例不对此作具体限定。
基于上述任一实施例，微带辐射单元中，辐射电路与馈电电路均基于介质基材的中心轴对称布设，因而将微带辐射单元作为单个部件进行整机装配时，辐射单元与馈电网络的电连接装配无需额外识别，非常适合在大规模阵列天线应用上实现自动化生产。
基于上述任一实施例，图5为本公开实施例提供的微带辐射单元的顶视图，如图5所示，微带辐射单元包括四组馈电电路13，四组馈电电路 13以介质基材11的中心轴为轴心均匀分布。
具体地，每组馈电电路13的结构相同，并依次沿中心轴呈90°旋转分布。此处，包含四组馈电电路13的微带辐射单元即双极化辐射单元，双极化辐射单元的每个极化由相对且对称设置的两组馈电电路13进行差分(180°相差)馈电，以抑制高次模式，进一步降低两个端口之间的耦合，提升了双极化振子+45°极化和-45°极化的方向图一致性和隔离度。
基于上述任一实施例，微带辐射单元中，焊接部113包括四个以介质基材11的中心轴为轴心均匀分布的插接脚1131，每一馈电电路13包裹一个插接脚1131。
具体地，参考图5，每一馈电电路13包括顶部馈电电路131、中间连接部132和底部焊接部133，其中顶部馈电电路131是该组馈电电路13布设在介质基材顶部111的部分，中间连接部132是该组馈电电路13布设在介质基材支撑部112上用于连接顶部馈电电路131和底部焊接部133的部分，底部焊接部133是该组馈电电路13布设在介质基材11的焊接部113上，包裹在焊接部113对应的一个插接脚1131的部分。此处，包裹插接脚1131的底部焊接部133用于与馈电网络端口进行电连接，以实现信号激励。
基于上述任一实施例，参考图5，微带辐射单元中，焊接部113的任意两个相邻的插接脚1131之间设置有开槽1132。通过开槽1132的设置，进一步降低了一体化介质基材11的重量。此处，开槽1132可以是U型槽、V型槽等各种形状的开槽。
基于上述任一实施例，微带辐射单元为三维模塑互连器件，整个微带辐射单元为单一部件，简化了供应链，结构简单，提高了辐射单元的可靠性和一致性，适合大规模制造。
基于上述任一实施例，图6为本公开实施例提供的阵列天线的结构示意图，如图6所示，阵列天线包括若干个微带辐射单元1，以及用于装设每一微带辐射单元1的馈电网络2。
具体地，每一微带辐射单元1通过介质基材的焊接部与馈电网络2进行焊接，实现馈电电路与馈电网络2之间的电气连接，焊接部可以是插脚型焊接结构，还可以是贴焊型焊接结构，本公开实施例不对微带辐射单元 1和馈电网络2之间的装设方式作具体限定。
图7为本公开实施例提供的馈电网络的结构示意图，参考图7，馈电网络2上设置有若干个馈电端口21，用于与微带辐射单元的焊接部进行电气连接。图7中针对焊接部包括四个插接脚的微带辐射单元设置有四个馈电端口21，每一插接脚对应一个馈电端口21，在四个插接脚具备旋转中心对称性的情况下，装配时，仅需将四个插接脚直接与四个馈电端口21对接即可，无需额外识别，可以实现盲插组装，能够显著缩短了天线生产中的组装时间，提高组装效率，非常适合在大规模阵列天线应用上实现自动化生产。
图8为本公开实施例提供的一体化微带辐射单元差分馈电示意图，包括一体化微带辐射单元1及其差分馈电网络2。参考图7和图8，一体化辐射单元的四个插焊脚无需额外识别的盲插在差分馈电网络2的四个馈电端口。差分馈电网络2同一组极化的2个馈电端口21a和21b(或22a和22b)相对设置且成180°相差。
参考图5，微带辐射单元1包括介质基材11、辐射电路12和馈电电路13。其中介质基材11为一体化结构，由耐高温工程塑料一体注塑成型，介质基材11包括顶部111、支撑部112、焊接部113和加强筋15，顶部111中心位置设置有延伸孔114，与支撑部112形成顺滑过渡结构，俯视无遮挡。辐射电路12包括设置在介质基材顶部111上表面的顶部辐射电路121和设置在延伸孔114孔壁表面的延伸辐射电路122，此外，顶部辐射电路121上设置有去金属化间隙，即非导电区域14。馈电电路13包括设置在介质基材顶部111下表面的顶部馈电电路131、设置在介质基材支撑部112外壁表面的中间连接部132以及设置在介质基材焊接部113并包裹整个介质基材焊接部113的四个焊接脚的底部焊接部133。
此处，介质基材顶部111平面结构为正方形，还可以为圆型或其余多边形结构，顶部111中心设置的延伸孔114，能够降低用料，减轻一体化介质基材11的重量。设置在介质基材顶部111的顶部辐射电路121，其电路形状与介质基材11的顶部111平面形状一致。顶部辐射电路121上，以介质基材11的中心轴为轴心，设置的四组结构相同的非导电区域14，形状为“一”字型或“Λ”形或其它变形形状，以提升极化隔离度。沿着 介质基材顶部111的延伸孔114和介质基材支撑部112的连接部位向介质基材支撑部112内表面，即延伸孔114的孔壁向下延伸设置的延伸辐射电路122，能够大大提升微带辐射单元1的交叉极化比指标。
加强筋15分别设置在介质基材顶部111的四周边缘，呈“口”字裙边，以及顶部111下表面中心呈“十”字，以提升一体化介质基材11的结构强度和顶部111平面结构的平整度。此外，支撑部112形成中空型闭合结构，以加强一体化介质基材11的结构强度，支撑部112可以是圆桶形，也可以为其它闭合形状。焊接部113包括四个90°旋转环绕的插接脚1131，插接脚1131两两相邻的区域内设置“U”型开槽1132，以进一步降低一体化介质基材11的重量。
微带辐射单元1共包含四组馈电电路13，每组结构相同，依次沿中心轴90°旋转分布。针对单一馈电电路13，馈电电路13中设置在顶部111下表面的顶部馈电电路131与辐射电路12形成辐射单元耦合馈电，中间连接部132连接顶部馈电电路131和底部焊接部133，以实现整个馈电电路13的连续电连接。包裹插接脚1131的底部焊接部133用于与馈电网络2的馈电端口进行电连接，以实现信号激励。此处，底部焊接部133可以设置为插脚型插焊型结构，还可以设置为圆盘形贴焊型结构，本公开实施例对此不作具体限定。基于上述结构的四组馈电电路13，共同实现双极化微带辐射单元1的馈电激励，以抑制高次模式，进一步降低两个端口之间的耦合，提升双极化振子+45°极化和-45°极化的方向图一致性和隔离度。需要说明的是，本公开实施例中，采用耦合馈电方式能够有效提升振子匹配带宽。
本公开实施例提供的微带辐射单元1，采用了单层辐射电路12结构，微带辐射单元1整体高度＜0.15λ(此处λ表示波长)，具有良好的低剖面特征；其次，微带辐射单元1特别设置了延伸辐射电路122，极大改善了微带辐射单元1的交叉极化指标；再者，微带辐射单元1为3D-MID模塑互连器件，重量非常轻，适合在大规模阵列天线应用，且整个微带辐射单元1为单一部件，简化了供应链，结构简单，提高了辐射单元的可靠性和一致性，适合大规模制造；此外，微带辐射单元1的辐射部分和馈电部分全部基于辐射单元单个部件中心对称，四个插焊脚无需额外识别可盲插 在馈电网络2的四个馈电端口，显著缩短了天线生产中的组装时间，提高组装效率，非常适合在大规模阵列天线应用上实现自动化生产。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (10)

  1. 一种微带辐射单元，其特征在于，包括介质基材、辐射电路和馈电电路；
    其中，所述介质基材为一体注塑成型，所述介质基材包括顶部、支撑部和焊接部，所述支撑部分别与所述顶部和所述焊接部相连；
    所述辐射电路布设在所述顶部上表面，所述馈电电路布设在所述顶部下表面，并沿所述支撑部延伸至所述焊接部。
  2. 根据权利要求1所述的微带辐射单元，其特征在于，所述顶部的中心开设有延伸孔，所述延伸孔在所述支撑部中向所述焊接部方向延伸；
    所述辐射电路延伸布设至所述延伸孔的孔壁上。
  3. 根据权利要求1所述的微带辐射单元，其特征在于，所述辐射电路上还布设有非导电区域。
  4. 根据权利要求1所述的微带辐射单元，其特征在于，所述顶部还布设有加强筋。
  5. 根据权利要求1所述的微带辐射单元，其特征在于，所述辐射电路与所述馈电电路均基于所述介质基材的中心轴对称布设。
  6. 根据权利要求1所述的微带辐射单元，其特征在于，所述微带辐射单元包括四组所述馈电电路，所述四组馈电电路以所述介质基材的中心轴为轴心均匀分布。
  7. 根据权利要求6所述的微带辐射单元，其特征在于，所述焊接部包括四个以所述介质基材的中心轴为轴心均匀分布的插接脚，每一所述馈电电路包裹一个所述插接脚。
  8. 根据权利要求7所述的微带辐射单元，其特征在于，所述焊接部的任意两个相邻的所述插接脚之间设置有开槽。
  9. 根据权利要求1至8中任一项所述的微带辐射单元，其特征在于，所述微带辐射单元为三维模塑互连器件。
  10. 一种阵列天线，其特征在于，包括若干个如权利要求1至9中任一项所述的微带辐射单元，以及用于装设每一所述微带辐射单元的馈电网络。
PCT/CN2019/115523 2019-01-22 2019-11-05 微带辐射单元和阵列天线 WO2020151297A1 (zh)

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