WO2020147096A1 - Method and system for metal surface detection - Google Patents

Method and system for metal surface detection Download PDF

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WO2020147096A1
WO2020147096A1 PCT/CN2019/072268 CN2019072268W WO2020147096A1 WO 2020147096 A1 WO2020147096 A1 WO 2020147096A1 CN 2019072268 W CN2019072268 W CN 2019072268W WO 2020147096 A1 WO2020147096 A1 WO 2020147096A1
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metal
wave
modulation
space
defect
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PCT/CN2019/072268
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French (fr)
Chinese (zh)
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王星泽
何良雨
祝毅博
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合刃科技(深圳)有限公司
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Priority to PCT/CN2019/072268 priority Critical patent/WO2020147096A1/en
Publication of WO2020147096A1 publication Critical patent/WO2020147096A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical means
    • G01B11/30Measuring arrangements characterised by the use of optical means for measuring roughness or irregularity of surfaces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106General arrangement of respective parts
    • G01N2021/0112Apparatus in one mechanical, optical or electronic block

Abstract

A method and system for metal surface detection. The method comprises: a transmitter (110) transmits an electromagnetic wave of which the frequency is less than the frequency of a metal plasma into a gap between a modulation device (120) and a metal to be tested so as to generate a metal surface plasma wave, where the metal surface plasma wave is coupled with the incident electromagnetic wave and is resonated and excited into a space-radiating electromagnetic wave, the space-radiating electromagnetic wave is transmitted from the other end of the modulation device (120), thus being received by a detector (130); the relative positions of the modulation device (120) and of the metal in the horizontal direction are changed, when the surface plasma wave passes where a defect is present on the metal surface, a change occurs in the transmitted electromagnetic wave, thus detecting the position at where the defect is located on the metal surface. The method or system allows the quick detection of whether any defect is present on the metal surface and is highly efficient.

Description

一种金属表面检测的方法及系统Method and system for detecting metal surface 技术领域Technical field
本发明涉及金属检测领域,特别涉及一种金属表面检测的方法及系统。The invention relates to the field of metal detection, in particular to a method and system for metal surface detection.
背景技术Background technique
抛光的金属在其生产及后期处理过程中,可能会产生划痕、凹坑、凸起等表面缺陷,这些缺陷不仅影响了产品的外观,而且也会对产品的使用性能和寿命造成一定的影响。由于抛光金属具有极强的反光特性,常用的光学二维成像和三维扫描方法都很难对抛光金属表面进行缺陷检测。目前的检测手段大多采用传统的人工目视灯检方式,但是这种检测方式对于缺陷的识别有效性不足,效率偏低,而且检测成本极高。因此,寻找一种不受高反光影响并能有效检测表面缺陷的方法,对抛光金属表面的质量控制有着重要意义。Polished metal may produce scratches, pits, bumps and other surface defects during its production and post-processing. These defects not only affect the appearance of the product, but also have a certain impact on the performance and life of the product. . Because polished metal has strong reflective characteristics, it is difficult to detect defects on polished metal surfaces with commonly used optical two-dimensional imaging and three-dimensional scanning methods. The current detection methods mostly use the traditional manual visual light inspection method, but this detection method is not effective in identifying defects, the efficiency is low, and the detection cost is extremely high. Therefore, finding a method that is not affected by high reflectance and can effectively detect surface defects is of great significance to the quality control of polished metal surfaces.
发明内容Summary of the invention
本发明实施例提供了一种金属表面检测的方法及系统,通过使用本发明提供的方法或系统,能够迅速检测金属表面是否存在缺陷,而且效率高,成本较低。The embodiment of the present invention provides a method and system for detecting a metal surface. By using the method or system provided by the present invention, whether there is a defect on the metal surface can be quickly detected with high efficiency and low cost.
本发明第一方面公开了一种金属表面检测的系统,所述系统包括发射器、探测器以及调制装置;其中,发射器和所述探测器位于所述调制装置的两端;The first aspect of the present invention discloses a metal surface detection system. The system includes a transmitter, a detector, and a modulation device; wherein the transmitter and the detector are located at two ends of the modulation device;
所述发射器,用于将频率小于金属等离子体频率的电磁波入射到所述调制装置与待测金属之间的狭缝,以产生金属表面等离子体波;其中,所述金属表面等离子体波与所述入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;The transmitter is used to inject electromagnetic waves with a frequency lower than the frequency of the metal plasma into the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein the metal surface plasma wave is The incident electromagnetic waves are coupled and excited by resonance into spatial radiation electromagnetic waves, and the spatial radiation electromagnetic waves are emitted from the other end of the modulation device;
所述探测器,用于接收所述空间辐射电磁波,并根据所述空间辐射电磁波确定是否存在缺陷。The detector is used to receive the electromagnetic waves radiated in space, and determine whether there is a defect according to the electromagnetic waves radiated in space.
所述调制装置的长度需小于表面等离子体波在所述待测金属表面的传播 距离。The length of the modulation device needs to be less than the propagation distance of the surface plasma wave on the metal surface to be measured.
另外,需要指出的是,所述调制装置到所述待测金属表面的距离小于所述待测金属表面等离子体波在空气中的衰减距离。In addition, it should be pointed out that the distance from the modulation device to the surface of the metal to be measured is smaller than the attenuation distance of the plasma wave of the metal surface to be measured in the air.
另外,进一步需要指出的是,所述待测金属的厚度大于所述表面等离子体波在所述待测金属中的衰减距离。In addition, it should be further pointed out that the thickness of the metal to be measured is greater than the attenuation distance of the surface plasmon wave in the metal to be measured.
结合第一方面,检测过程中,改变调制装置和金属在水平方向上的相对位置,当表面等离子体波经过所述金属表面存在缺陷的地方,出射的电磁波会发生变化,从而可以检测出所述金属表面的缺陷及所在位置。In combination with the first aspect, in the detection process, the relative position of the modulation device and the metal in the horizontal direction is changed. When the surface plasma wave passes the defect on the metal surface, the emitted electromagnetic wave will change, so that the detection Defects on the metal surface and their location.
可选的,所述系统还包括处理单元;Optionally, the system further includes a processing unit;
所述处理单元,用于对利用机器学习算法对历史检测数据进行学习以获取缺陷检测模型;其中,所述历史检测数据是对存在缺陷的金属进行检测后所述探测器探测到的数据。The processing unit is configured to learn historical detection data using a machine learning algorithm to obtain a defect detection model; wherein the historical detection data is the data detected by the detector after detecting the defective metal.
另外,需要指出的是,通过本系统的使用方法有很多,比如通过平移检测系统进行水平检测,也可以通过垂直移动检测系统进行垂直检测;还可以水平和垂直检测结合,当然如果待检测金属的形状为圆形时,还可以通过旋转检测系统来进行检测。In addition, it should be pointed out that there are many ways to use this system, such as horizontal detection through the translation detection system, vertical detection through the vertical movement detection system; horizontal and vertical detection can also be combined, of course, if the metal to be detected When the shape is circular, it can also be detected by rotating the detection system.
本发明第二方面公开了一种金属表面检测的方法,所述方法包括:The second aspect of the present invention discloses a method for detecting a metal surface, the method comprising:
发射器将频率小于金属等离子体频率的电磁波入射到调制装置与待测金属之间的狭缝,以产生金属表面等离子体波;其中,所述金属表面等离子体波与入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;其中,所述调制装置平行放置在所述待测金属的上方;The transmitter injects electromagnetic waves with a frequency lower than the frequency of the metal plasma into the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein the metal surface plasma wave is coupled with the incident electromagnetic wave and is Resonance excitation is a space radiating electromagnetic wave, which is emitted from the other end of the modulation device; wherein the modulation device is placed in parallel above the metal to be measured;
探测器接收所述空间辐射电磁波,并根据所述空间辐射电磁波确定是否存在缺陷;The detector receives the space radiated electromagnetic wave, and determines whether there is a defect according to the space radiated electromagnetic wave;
其中,所述调制装置的长度需小于所述表面等离子体波在所述待测金属表面的传播距离。Wherein, the length of the modulation device needs to be less than the propagation distance of the surface plasma wave on the metal surface to be measured.
其中,需要指出的是,所述调制装置到所述待测金属表面的距离小于所述待测金属表面等离子体波在空气中的衰减距离。It should be noted that the distance from the modulation device to the surface of the metal to be measured is smaller than the attenuation distance of the plasma wave of the metal surface to be measured in the air.
其中,进一步需要指出的是,所述待测金属的厚度大于所述表面等离子体波在所述待测金属中的衰减距离。It should be further pointed out that the thickness of the metal to be measured is greater than the attenuation distance of the surface plasmon wave in the metal to be measured.
其中,可选的,所述根据所述空间辐射电磁波确定是否存在缺陷,包括:当所述探测器接收到的空间辐射电磁波发生变化时,确定所述金属表面存在缺陷,以及根据所述接收到的空间辐射电磁波的角度确定所述缺陷的位置。Wherein, optionally, the determining whether there is a defect based on the space radiated electromagnetic wave includes: when the space radiated electromagnetic wave received by the detector changes, determining that the metal surface has a defect, and based on the received The angle of the space radiated electromagnetic waves determines the location of the defect.
另外,进一步可选的,所述方法还包括:In addition, further optionally, the method further includes:
处理单元利用机器学习算法对历史检测数据进行学习以获取缺陷检测模型;其中,所述历史检测数据是对存在缺陷的金属进行检测后探测到的数据。The processing unit uses a machine learning algorithm to learn historical detection data to obtain a defect detection model; wherein the historical detection data is data detected after detecting defective metals.
本发明第三方面公开了一种存储介质,所述存储介质中存储有程序代码,当所述程序代码被运行时,所述第二方面的方法会被执行;A third aspect of the present invention discloses a storage medium in which a program code is stored, and when the program code is executed, the method of the second aspect is executed;
本发明第四方面公开了一种计算机程序产品,所述计算机程序产品中包含有程序代码;当所述程序代码被运行时,所述第二方面的方法会被执行。The fourth aspect of the present invention discloses a computer program product, the computer program product contains program code; when the program code is executed, the method of the second aspect is executed.
可以看出,在本发明实施例的方案中,将频率小于金属等离子体频率的电磁波入射到所述调制装置与待测金属之间的狭缝,以产生金属表面等离子体波;其中,所述金属表面等离子体波与所述入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;其中,所述调制装置平行放置在所述待测金属的上方;接收所述空间辐射电磁波,并根据所述空间辐射电磁波确定是否存在缺陷。通过本发明提供的技术方案,通过使用本发明提供的方法或系统,能够迅速检测金属表面是否存在缺陷,而且效率高,成本较低。It can be seen that in the solution of the embodiment of the present invention, electromagnetic waves with a frequency lower than the frequency of the metal plasma are incident on the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein, the The metal surface plasma wave couples with the incident electromagnetic wave and is excited by resonance into a space radiating electromagnetic wave, which is emitted from the other end of the modulation device; wherein the modulation device is placed in parallel on the under-test Above the metal; receiving the space radiated electromagnetic waves, and based on the space radiated electromagnetic waves to determine whether there are defects. Through the technical solution provided by the present invention, by using the method or system provided by the present invention, it can quickly detect whether there are defects on the metal surface, and the efficiency is high and the cost is low.
附图说明BRIEF DESCRIPTION
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to explain the technical solutions in the embodiments of the present invention more clearly, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained from these drawings without creative work.
图1为本发明实施例提供的一种金属表面检测的系统的示意图;FIG. 1 is a schematic diagram of a metal surface detection system provided by an embodiment of the present invention;
图2为本发明实施例提供的一种调制装置的结构示意图;2 is a schematic structural diagram of a modulation device provided by an embodiment of the present invention;
图3为本发明实施例提供的另一种调制装置的结构示意图;3 is a schematic structural diagram of another modulation device provided by an embodiment of the present invention;
图4为本发明实施例提供的另一种调制装置的结构示意图;4 is a schematic structural diagram of another modulation device provided by an embodiment of the present invention;
图5为本发明的实施例提供的一种平移型金属表面检测轨迹示意图;5 is a schematic diagram of a translational metal surface detection track provided by an embodiment of the present invention;
图6为本发明实施例提供的另一种平移型金属表面检测轨迹示意图;6 is a schematic diagram of another translational metal surface detection track provided by an embodiment of the present invention;
图7为本发明实施例提供另一种平移型金属表面检测轨迹示意图;7 is a schematic diagram of another translational metal surface detection track provided by an embodiment of the present invention;
图8为本发明实施例提供另一种平移型金属表面检测轨迹示意图;8 is a schematic diagram of another translational metal surface detection track provided by an embodiment of the present invention;
图9为本发明实施例提供的一种利用神经网络进行学习的示意图;FIG. 9 is a schematic diagram of learning using a neural network according to an embodiment of the present invention;
图10为本发明实施例提供的一种金属表面检测的方法流程示意图;10 is a schematic flowchart of a method for detecting a metal surface according to an embodiment of the present invention;
图11为本发明实施例提供的另一种金属表面检测的方法流程示意图;FIG. 11 is a schematic flowchart of another method for detecting a metal surface according to an embodiment of the present invention;
图12为本发明实施例提供的一种金属表面检测设备的结构示意图。FIG. 12 is a schematic structural diagram of a metal surface detection device provided by an embodiment of the present invention.
具体实施方式detailed description
为了使本技术领域的人员更好地理解本发明方案,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚地描述,显然,所描述的实施例是本发明一部分的实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are the present invention. Part of the embodiment, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
本发明说明书、权利要求书和附图中出现的术语“第一”、“第二”和“第三”等是用于区别不同的对象,而并非用于描述特定的顺序。此外,术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元,而是可选地还包括没有列出的步骤或单元,或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。The terms "first", "second" and "third" appearing in the specification, claims, and drawings of the present invention are used to distinguish different objects, rather than describing a specific sequence. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally also includes Other steps or units inherent to these processes, methods, products or equipment.
请参阅图1,图1是本发明一个实施例提供的一种金属表面检测的系统。所述系统包括发射器110、调制装置120(或称为调制机构)以及探测器130;其中,发射器110和探测器130位于调制装置120的两端;Please refer to FIG. 1. FIG. 1 is a metal surface detection system provided by an embodiment of the present invention. The system includes a transmitter 110, a modulation device 120 (or called a modulation mechanism), and a detector 130; wherein, the transmitter 110 and the detector 130 are located at two ends of the modulation device 120;
发射器110,用于将频率小于金属等离子体频率的电磁波入射到所述调制装置与待测金属之间的狭缝,以产生金属表面等离子体波;其中,所述金属表 面等离子体波与所述入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;The transmitter 110 is used to inject electromagnetic waves with a frequency lower than the frequency of the metal plasma into the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein, the metal surface plasma wave is The incident electromagnetic waves are coupled and excited by resonance into spatial radiation electromagnetic waves, and the spatial radiation electromagnetic waves are emitted from the other end of the modulation device;
探测器130,用于接收所述空间辐射电磁波,并根据所述空间辐射电磁波确定是否存在缺陷。The detector 130 is configured to receive the electromagnetic waves radiated from the space, and determine whether there is a defect according to the electromagnetic waves radiated from the space.
另外,可以理解的是,探测器130,具体用于当接收到的空间辐射电磁波发生变化时,确定所述金属表面存在缺陷;进一步的,还可以根据接收到的空间辐射电磁波确定所述缺陷的位置。In addition, it can be understood that the detector 130 is specifically used to determine that the metal surface has a defect when the received space radiated electromagnetic wave changes; further, it can also determine the defect of the defect based on the received space radiated electromagnetic wave. position.
其中,可以理解的是,空间辐射电磁波的变化包括但不限于空间辐射电磁波幅度的变化和空间辐射电磁波波动频率的变化等。Among them, it can be understood that the changes in the electromagnetic wave radiation in space include, but are not limited to, changes in the amplitude of the electromagnetic wave radiation in the space and changes in the fluctuation frequency of the electromagnetic wave radiation in the space.
其中,可以理解的是,逆着接收到的空间辐射电磁波的射出角度就可以定位缺陷的位置。Among them, it is understandable that the position of the defect can be located against the emission angle of the received spatial radiation electromagnetic wave.
举例来说,如果接收到的空间辐射电磁波的射出角度与入射电磁波的角度不匹配,就可以理解为发生了变化。比如入射是45度,如果不存在缺陷那么射出角度应该也是45度。如果不是45度,说明存在缺陷。For example, if the emission angle of the received electromagnetic wave from space does not match the angle of the incident electromagnetic wave, it can be understood as a change. For example, the incident angle is 45 degrees, if there are no defects, the exit angle should also be 45 degrees. If it is not 45 degrees, there is a defect.
其中,检测过程中,通过改变调制装置和金属在水平方向上的相对位置,当表面等离子体波经过金属表面存在缺陷的地方,出射的空间辐射电磁波会发生相应变化。其中,需要指出的是,常见的缺陷类型包括划痕、裂纹、凸起以及凹坑等。Among them, in the detection process, by changing the relative position of the modulation device and the metal in the horizontal direction, when the surface plasma wave passes through the defect on the metal surface, the emitted spatial radiation electromagnetic wave will change accordingly. Among them, it should be pointed out that common types of defects include scratches, cracks, bumps and pits.
其中,需要指出的是,由于在一般情况(对于连续的金属介质界面)下,表面等离子体波的波矢量是大于光波的,所以不可能直接用光波激发出沿界面传播的表面等离子体波(propagating surface plasmon)。为了激励表面等离子体波,需要引入一些特殊的结构达到波矢匹配,常用的结构有以下几种:Among them, it needs to be pointed out that, because the wave vector of the surface plasmon wave is larger than that of the light wave under general conditions (for a continuous metal medium interface), it is impossible to directly use light waves to excite the surface plasmon waves propagating along the interface ( propagating surface plasmon). In order to excite surface plasmon waves, some special structures need to be introduced to achieve wave vector matching. The commonly used structures are as follows:
其中,需要指出的是,表面等离子体波SPW(Surface Plasmon Wave)是沿金属和介质界面传播的表面电磁波,它只存在于介电常数(横磁波)或磁导率(横电波)符号相反的两种介质的界面上。在一定条件下,SPW可与入射光横磁波极化能量耦合并被共振激发。Among them, it should be pointed out that SPW (Surface Plasmon Wave) is a surface electromagnetic wave that propagates along the interface between metal and medium. It only exists in the opposite sign of permittivity (transverse magnetic wave) or permeability (transverse electric wave) On the interface of the two media. Under certain conditions, SPW can be coupled with the incident light transverse magnetic wave polarization energy and be excited by resonance.
其中,需要指出的是,由于在一般情况(对于连续的金属介质界面)下,表面等离子体波的波矢量是大于光波的,所以不可能直接用光波激发出沿界面传播的表面等离子体波SPW。为了激励表面等离子体波,需要引入一些特殊的结 构达到波矢匹配,即调制装置120。常用调制装置120的结构可以为棱镜耦合的方式、波导结构、衍射光栅结构等。Among them, it needs to be pointed out that, because the wave vector of the surface plasmon wave is larger than that of the light wave under normal circumstances (for a continuous metal medium interface), it is impossible to directly excite the surface plasmon wave SPW propagating along the interface with light waves. . In order to excite the surface plasmon wave, some special structures need to be introduced to achieve wave vector matching, namely the modulation device 120. The structure of the commonly used modulation device 120 may be a prism coupling manner, a waveguide structure, a diffraction grating structure, and the like.
其中,可以理解的是,如图2所示,棱镜耦合的方式包括两种:一种是Kretschmann结构:金属薄膜直接镀在棱镜面上,入射光在金属-棱镜界面处会发生全反射,全反射的消逝波可能实现与表面等离子体波的波矢量匹配,光的能量便能有效的传递给表面等离子体,从而激发出表面等离子体波。另一种是Otto结构:具有高折射率的棱镜和金属之间存在狭缝,狭缝的宽度比较小,大约几十到几百个纳米。Among them, it can be understood that, as shown in Figure 2, there are two ways of prism coupling: one is Kretschmann structure: the metal film is directly plated on the prism surface, and the incident light will be totally reflected at the metal-prism interface. The reflected evanescent wave may match the wave vector of the surface plasmon wave, and the energy of the light can be effectively transferred to the surface plasmon to excite the surface plasmon wave. The other is the Otto structure: there is a slit between the prism with high refractive index and the metal, and the width of the slit is relatively small, about tens to hundreds of nanometers.
其中,如图3所示,波导结构是利用波导边界处的消逝波激发表面等离子体波,使波导中的光场能量耦合到表面等离子体波中。其中,波导两侧光波是消逝波,当在波导的某个位置镀上金属,这样当光波通过这个区域的时候就能够激发出表面等离子体波。在实际的研究中,常采用光纤做波导,剥去光纤某段的包层,再镀上金属,这样就实现了一种最简单的波导激发表面等离子体波的结构。Among them, as shown in Figure 3, the waveguide structure uses the evanescent wave at the boundary of the waveguide to excite the surface plasmon wave, so that the optical field energy in the waveguide is coupled to the surface plasmon wave. Among them, the light waves on both sides of the waveguide are evanescent waves. When metal is plated on a certain position of the waveguide, surface plasmon waves can be excited when the light waves pass through this area. In actual research, optical fibers are often used as waveguides, a certain section of the optical fiber is stripped of the cladding, and then metal is plated, so as to realize the simplest structure of a waveguide to excite surface plasmon waves.
其中,如图4所示,衍射光栅结构是利用光栅引入一个额外的波矢量的增量实现波矢量的匹配。常用的光栅主要是一维光栅,二维光栅以及孔阵列结构和颗粒阵列,由于光栅结构的材料参数与几何参数等都可以自己选定,可供研究的内容很丰富。这种结构一方面能够激发表面等离子体波,另一方面二维光栅结构中能够引入能带,从而使得表面波的特性受到能带的影响,使得器件的参数更加可控。Among them, as shown in Figure 4, the diffraction grating structure uses the grating to introduce an additional wave vector increment to achieve wave vector matching. The commonly used gratings are mainly one-dimensional gratings, two-dimensional gratings, hole array structures and particle arrays. Since the material parameters and geometric parameters of the grating structure can be selected by oneself, the content for research is very rich. On the one hand, this structure can excite surface plasmon waves, and on the other hand, energy bands can be introduced into the two-dimensional grating structure, so that the characteristics of surface waves are affected by the energy bands, and the device parameters are more controllable.
其中,可以理解的是,调制装置120到所述金属表面的距离小于所述金属表面等离子体波在空气中的衰减距离。进一步的,所述待测金属的厚度大于所述表面等离子体波在所述金属中的衰减距离。另外,还需要指出的是,调制装置120的几何设计根据相应的波特性进行调整(比如:长度需小于表面等离子体波在所述金属表面的传播距离)。It can be understood that the distance from the modulation device 120 to the metal surface is smaller than the attenuation distance of the metal surface plasma wave in the air. Further, the thickness of the metal to be measured is greater than the attenuation distance of the surface plasma wave in the metal. In addition, it should be pointed out that the geometric design of the modulation device 120 is adjusted according to the corresponding wave characteristics (for example, the length needs to be smaller than the propagation distance of the surface plasma wave on the metal surface).
其中,需要指出的是,可以根据不同频率波生成的金属表面等离子体波的衰减距离估算金属表面缺陷,如裂纹、凹坑等的深度。例如:不同频率的波对应的调制装置在所述金属表面移动时,若发现移动到某个位置,探测器检测到某一个频率的波对应的信号变化最大,且其他频段的波对应的信号基本没什么 变化,就可以依据该频率波的衰减常数的公式,估算出金属表面裂纹、凹坑等的深度。Among them, it should be pointed out that the depth of metal surface defects, such as cracks, pits, etc., can be estimated based on the attenuation distance of metal surface plasma waves generated by waves of different frequencies. For example: when the modulation device corresponding to waves of different frequencies moves on the metal surface, if it is found to move to a certain position, the detector detects that the wave of a certain frequency corresponds to the largest signal change, and the signal corresponding to waves of other frequency bands is basically Without any change, the depth of cracks and pits on the metal surface can be estimated based on the formula of the attenuation constant of the frequency wave.
其中,需要指出的是,表面等离子体波SPW(Surface Plasmon Wave)是沿金属和介质界面传播的表面电磁波,它只存在于介电常数(横磁波)或磁导率(横电波)符号相反的两种介质的界面上。在一定条件下,SPW可与入射光横磁波极化能量耦合并被共振激发。Among them, it should be pointed out that SPW (Surface Plasmon Wave) is a surface electromagnetic wave that propagates along the interface between metal and medium. It only exists in the opposite sign of permittivity (transverse magnetic wave) or permeability (transverse electric wave) On the interface of the two media. Under certain conditions, SPW can be coupled with the incident light transverse magnetic wave polarization energy and be excited by resonance.
另外,需要指出的是,通过本系统的使用方法有很多,比如通过平移检测系统进行水平检测,也可以通过垂直移动检测系统进行垂直检测;还可以水平和垂直检测结合,当然如果待检测金属的形状为圆形时,还可以通过旋转检测系统来进行检测。In addition, it should be pointed out that there are many ways to use this system, such as horizontal detection through the translation detection system, vertical detection through the vertical movement detection system; horizontal and vertical detection can also be combined, of course, if the metal to be detected When the shape is circular, it can also be detected by rotating the detection system.
具体的,无论使用那种方法,检测开始时,入射波进入调制装置与待测金属之间的狭缝,产生金属表面等离子体波。该表面等离子体波可以与入射波耦合,并被共振激发为空间辐射电磁波,从调制装置的另一端射出,从而被探测器接收。电磁波发射器和探测器分别位于调制装置的两端。检测过程中,改变调制装置和金属在水平方向上的相对位置,当表面等离子体波经过金属表面存在缺陷的地方,出射的电磁波会发生变化,从而可以检测出金属表面的缺陷及所在位置。Specifically, no matter which method is used, when the detection starts, the incident wave enters the slit between the modulation device and the metal to be measured, generating a metal surface plasma wave. The surface plasmon wave can be coupled with the incident wave and resonantly excited into a space radiating electromagnetic wave, which is emitted from the other end of the modulation device and received by the detector. The electromagnetic wave transmitter and the detector are respectively located at the two ends of the modulation device. During the detection process, the relative position of the modulation device and the metal in the horizontal direction is changed. When the surface plasma wave passes through the defect on the metal surface, the emitted electromagnetic wave will change, so that the defect and location of the metal surface can be detected.
接下来详细介绍下常见的几种使用方法。Next, we will introduce several common usage methods in detail.
如图5所示,图5提供了一种平移检测的方法。其中,需要指出的是,在待测物比该系统的检测范围大的情况下,无法一次完成对整个表面的检测,因而需要设计表面检测轨迹,水平改变该装置与金属表面的相对位置,遍历全局。具体的,如图5所示,保持检测装置与所述金属表面的相对高度不变,让他们沿着波传播方向相对平移,然后逐行扫描,覆盖整个所述金属表面。检测过程中,当遇到金属表面缺陷时,出射的波信号会马上产生变化,由此可以定位出缺陷的位置。另外,需要指出的是,平移检测法检测的精度较高。As shown in Figure 5, Figure 5 provides a translation detection method. Among them, it needs to be pointed out that when the object to be tested is larger than the detection range of the system, the entire surface cannot be detected at one time. Therefore, it is necessary to design the surface detection trajectory, horizontally change the relative position of the device and the metal surface, and traverse Global. Specifically, as shown in FIG. 5, keeping the relative height of the detection device and the metal surface unchanged, allowing them to relatively translate along the wave propagation direction, and then scanning line by line to cover the entire metal surface. During the inspection process, when a metal surface defect is encountered, the emitted wave signal will immediately change, so that the location of the defect can be located. In addition, it should be pointed out that the detection accuracy of the translation detection method is higher.
如图6所示,图6提供了一种垂直移动检测方法。所述方法具体包括:保持检测装置与金属表面的相对高度不变,让他们垂直于波传播方向相对平移,然后逐列扫描,覆盖整个所述金属表面。检测过程中,当遇到金属表面缺陷时,出射的波信号会马上产生变化,由此可以定位出缺陷的位置。另外,需要指出 的是,垂直检测方法的检测的速度较快。As shown in Figure 6, Figure 6 provides a vertical movement detection method. The method specifically includes: keeping the relative height of the detection device and the metal surface constant, allowing them to translate relative to the wave propagation direction, and then scanning column by column to cover the entire metal surface. During the inspection process, when a metal surface defect is encountered, the emitted wave signal will immediately change, so that the location of the defect can be located. In addition, it should be pointed out that the detection speed of the vertical detection method is faster.
另外,进一步,需要指出的是,可以将上述两种方法进行结合。具体的,所述方法包括:先让金属与检测装置垂直于波传播方向相对平移,当检测到出射波信号变化时(遇到表面缺陷),改变扫描方式为沿波传播方向平移,从而可以得到该缺陷在两个方向上的准确位置。此后,该装置与金属继续沿垂直于波方向平移,逐列扫描,直至遇到下一个缺陷,重复以上步骤,可以精确定位出整个金属表面的缺陷。In addition, it should be pointed out that the above two methods can be combined. Specifically, the method includes: firstly allowing the metal and the detection device to translate relative to the direction of wave propagation, and when a change in the outgoing wave signal is detected (when surface defects are encountered), changing the scanning mode to translate along the direction of wave propagation, so that the The exact location of the defect in both directions. After that, the device and the metal continue to translate along the direction perpendicular to the wave, scanning column by column until the next defect is encountered. Repeating the above steps can accurately locate the defect on the entire metal surface.
另外,也可以针对待测金属的形状设计检测方法,比如待测金属是圆形的,且尺寸小于该检测装置时,可以采用旋转式扫描,迅速检测表面缺陷。该方法最大的优点就是检测速度快,效率高。具体的,如图7和图8所示,所述方法包括:检测装置位于被测表面上方,保持相对高度不变。检测过程中,该装置与被测表面进行相对旋转运动,当转过360度,整个表面都可以被该装置扫描到。根据出射波的信号变化,可以检测出相应的缺陷。In addition, the detection method can also be designed for the shape of the metal to be tested. For example, when the metal to be tested is round and the size is smaller than the detection device, a rotary scanning can be used to quickly detect surface defects. The biggest advantage of this method is the fast detection speed and high efficiency. Specifically, as shown in FIG. 7 and FIG. 8, the method includes: the detection device is located above the surface to be measured, and the relative height is kept constant. During the detection process, the device and the surface to be tested rotate relative to each other. When rotated through 360 degrees, the entire surface can be scanned by the device. According to the signal change of the emitted wave, the corresponding defect can be detected.
举例来说,如果待测表面为如手机外壳的金属logo,那么就可以采用上述的旋转法进行检测。For example, if the surface to be tested is a metal logo such as a mobile phone shell, the rotation method described above can be used for testing.
进一步的,需要指出的是,由于抛光金属表面的缺陷多种多样(包括划痕,凸起,凹坑等),其对表面等离子体波的影响也各不相同。因此,可以对探测端采集到的出射波信号进行逐类分析,达到表面缺陷检测及识别的目的。由于单次测量只能得到单方向或者单线条的电磁波信号,进行平移或者旋转扫描后,得到整个被测物体的电磁信号平面分布图,再进行人工智能算法分析。Furthermore, it should be pointed out that due to the various defects (including scratches, bumps, pits, etc.) of the polished metal surface, the effects on the surface plasma waves are also different. Therefore, the output wave signals collected by the detection end can be analyzed category by category to achieve the purpose of surface defect detection and identification. Since a single measurement can only obtain electromagnetic wave signals in a single direction or a single line, after performing translation or rotation scanning, the electromagnetic signal plane distribution map of the entire measured object is obtained, and then artificial intelligence algorithm analysis is performed.
可选的,所述金属表面检测系统还包括处理单元;Optionally, the metal surface detection system further includes a processing unit;
所述处理单元,用于对利用机器学习算法对历史检测数据进行学习以获取缺陷检测模型;其中,所述历史检测数据是对存在缺陷的金属进行检测后所述探测器探测到的数据。The processing unit is configured to learn historical detection data using a machine learning algorithm to obtain a defect detection model; wherein the historical detection data is the data detected by the detector after detecting the defective metal.
其中,常见的机器学习算法包括分类学习算法,贝叶斯学习算法、支持向量机学习算法以及神经网络学习算法等等。Among them, common machine learning algorithms include classification learning algorithms, Bayesian learning algorithms, support vector machine learning algorithms, neural network learning algorithms, and so on.
举例来说,如图9所示,图9为利用神经网络进行学习的示意图。具体的,针对出射波信号图,利用深度学习神经网络进行大样本训练和学习。按照不同的缺陷样品分别采集大量数据,对这些能够间接反映金属表面缺陷的信号图进 行分类训练,得到不同缺陷的神经网络模型。其中,该模型中定义了凸起、无缺陷(OK)、划痕、凹坑等输出状态。For example, as shown in FIG. 9, FIG. 9 is a schematic diagram of learning using a neural network. Specifically, for the outgoing wave signal graph, a deep learning neural network is used for large sample training and learning. Collect large amounts of data according to different defect samples, classify and train these signal maps that can indirectly reflect metal surface defects, and obtain neural network models for different defects. Among them, the model defines output states such as bumps, no defects (OK), scratches, and pits.
可以看出,本实施例的方案中,将频率小于金属等离子体频率的电磁波入射到所述调制装置与待测金属之间的狭缝,以产生金属表面等离子体波;其中,所述金属表面等离子体波与所述入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;其中,所述调制装置平行放置在所述待测金属的上方;接收所述空间辐射电磁波,并根据所述空间辐射电磁波确定是否存在缺陷。通过本发明提供的技术方案,通过使用本发明提供的方法或系统,能够迅速检测金属表面是否存在缺陷,而且效率高,成本较低。It can be seen that in the solution of this embodiment, an electromagnetic wave with a frequency lower than the frequency of the metal plasma is incident on the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein, the metal surface The plasma wave is coupled with the incident electromagnetic wave and is excited by resonance into a space radiating electromagnetic wave, which is emitted from the other end of the modulation device; wherein the modulation device is placed in parallel on the metal to be measured Above; receiving the space radiated electromagnetic wave, and determine whether there is a defect according to the space radiated electromagnetic wave. Through the technical solution provided by the present invention, by using the method or system provided by the present invention, it can quickly detect whether there are defects on the metal surface, and the efficiency is high and the cost is low.
请参阅图10,图10是本发明的另一个实施例提供的一种金属表面检测的方法流程示意图。其中,如图10所示,所述方法包括:Please refer to FIG. 10, which is a schematic flowchart of a method for detecting a metal surface according to another embodiment of the present invention. Wherein, as shown in FIG. 10, the method includes:
S201、发射器将频率小于金属等离子体频率的电磁波入射到调制装置与待测金属之间的狭缝,以产生金属表面等离子体波;其中,所述金属表面等离子体波与所述入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;S201. The transmitter injects electromagnetic waves with a frequency lower than the frequency of the metal plasma into the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein, the metal surface plasma wave and the incident electromagnetic wave Coupled and excited by resonance into a space radiation electromagnetic wave, the space radiation electromagnetic wave is emitted from the other end of the modulation device;
其中,所述调制装置的长度需小于表面等离子体波在所述金属表面的传播距离;Wherein, the length of the modulation device needs to be less than the propagation distance of the surface plasma wave on the metal surface;
其中,所述调制装置平行放置在所述待测金属的上方;Wherein, the modulation device is placed in parallel above the metal to be tested;
其中,所述调制装置到所述金属表面的距离小于所述金属表面等离子体波在空气中的衰减距离。Wherein, the distance from the modulation device to the metal surface is smaller than the attenuation distance of the metal surface plasma wave in the air.
其中,所述待测金属的厚度大于所述表面等离子体波在所述金属中的衰减距离。Wherein, the thickness of the metal to be measured is greater than the attenuation distance of the surface plasmon wave in the metal.
S202、探测器接收所述空间辐射电磁波,并根据所述空间辐射电磁波确定是否存在缺陷。S202. The detector receives the space radiation electromagnetic wave, and determines whether there is a defect according to the space radiation electromagnetic wave.
具体的,所述根据所述空间辐射电磁波确定是否存在缺陷,包括:当接收到的空间辐射电磁波发生变化时,确定所述金属表面存在缺陷以及确定所述缺 陷的位置。Specifically, the determining whether there is a defect based on the space radiated electromagnetic wave includes: when the received space radiated electromagnetic wave changes, determining that the metal surface has a defect and determining the position of the defect.
其中,可以理解的是,空间辐射电磁波的变化包括但不限于空间辐射电磁波幅度的变化和空间辐射电磁波波动频率的变化等。Among them, it can be understood that the changes in the electromagnetic wave radiation in space include, but are not limited to, changes in the amplitude of the electromagnetic wave radiation in the space and changes in the fluctuation frequency of the electromagnetic wave radiation in the space.
举例来说,可以根据接收到的空间辐射电磁波确定所述缺陷的位置。可以理解的是,逆着接收到的空间辐射电磁波的射出角度就可以定位缺陷的位置。For example, the location of the defect can be determined based on the received electromagnetic waves of space radiation. It is understandable that the position of the defect can be located against the emission angle of the received electromagnetic wave from space.
举例来说,如果接收到的空间辐射电磁波的射出角度与入射电磁波的角度不匹配,就可以理解为发生了变化。比如入射是45度,如果不存在缺陷那么射出角度应该也是45度。如果不是45度,说明存在缺陷。For example, if the emission angle of the received electromagnetic wave from space does not match the angle of the incident electromagnetic wave, it can be understood as a change. For example, the incident angle is 45 degrees, if there are no defects, the exit angle should also be 45 degrees. If it is not 45 degrees, there is a defect.
其中,检测过程中,通过改变调制装置和金属在水平方向上的相对位置,当表面等离子体波经过金属表面存在缺陷的地方,出射的空间辐射电磁波会发生变化。Among them, in the detection process, by changing the relative position of the modulation device and the metal in the horizontal direction, when the surface plasma wave passes through the defect on the metal surface, the emitted spatial radiation electromagnetic wave will change.
另外,可选的,所述方法还包括:In addition, optionally, the method further includes:
处理单元对利用机器学习算法对历史检测数据进行学习以获取缺陷检测模型;其中,所述历史检测数据是对存在缺陷的金属进行检测后探测到的数据。The processing unit learns historical detection data using a machine learning algorithm to obtain a defect detection model; wherein, the historical detection data is data detected after detecting defective metals.
举例来说,常见的机器学习算法包括分类学习算法,贝叶斯学习算法、支持向量机学习算法以及神经网络学习算法等等。For example, common machine learning algorithms include classification learning algorithms, Bayesian learning algorithms, support vector machine learning algorithms, neural network learning algorithms, and so on.
可以看出,本实施例的方案中,将频率小于金属等离子体频率的电磁波入射到所述调制装置与待测金属之间的狭缝,以产生金属表面等离子体波;其中,所述金属表面等离子体波与所述入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;其中,所述调制装置平行放置在所述待测金属的上方;接收所述空间辐射电磁波,并根据所述空间辐射电磁波确定是否存在缺陷。通过本发明提供的技术方案,通过使用本发明提供的方法或系统,能够迅速检测金属表面是否存在缺陷,而且效率高,成本较低。It can be seen that in the solution of this embodiment, an electromagnetic wave with a frequency lower than the frequency of the metal plasma is incident on the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein, the metal surface The plasma wave is coupled with the incident electromagnetic wave and is excited by resonance into a space radiating electromagnetic wave, which is emitted from the other end of the modulation device; wherein the modulation device is placed in parallel on the metal to be measured Above; receiving the space radiated electromagnetic wave, and determine whether there is a defect according to the space radiated electromagnetic wave. Through the technical solution provided by the present invention, by using the method or system provided by the present invention, it can quickly detect whether there are defects on the metal surface, and the efficiency is high and the cost is low.
如图11所示,本发明的一个实施例提供的一种金属表面检测的方法,其中,所述方法包括:As shown in FIG. 11, an embodiment of the present invention provides a method for detecting a metal surface, wherein the method includes:
S301、发射器将频率小于金属等离子体频率的电磁波入射到所述调制装置与待测金属之间的狭缝,以产生金属表面等离子体波;其中,所述金属表面等 离子体波与所述入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;S301. The transmitter injects electromagnetic waves with a frequency lower than the frequency of the metal plasma into the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein, the metal surface plasma wave is The electromagnetic waves are coupled and excited by resonance into spatial radiation electromagnetic waves, which are emitted from the other end of the modulation device;
其中,所述调制装置平行放置在所述待测金属的上方;Wherein, the modulation device is placed in parallel above the metal to be tested;
其中,所述调制装置到所述金属表面的距离小于所述金属表面等离子体波在空气中的衰减距离。Wherein, the distance from the modulation device to the metal surface is smaller than the attenuation distance of the metal surface plasma wave in the air.
其中,所述待测金属的厚度大于所述表面等离子体波在所述金属中的衰减距离。Wherein, the thickness of the metal to be measured is greater than the attenuation distance of the surface plasmon wave in the metal.
其中,所述调制装置的长度需小于表面等离子体波在所述金属表面的传播距离Wherein, the length of the modulation device needs to be less than the propagation distance of the surface plasma wave on the metal surface
S302、探测器接收所述空间辐射电磁波。S302. The detector receives the electromagnetic wave radiated from the space.
S303、当探测器接收到的空间辐射电磁波发生变化时,确定所述金属表面存在缺陷以及确定所述缺陷的位置;S303: When the space radiated electromagnetic wave received by the detector changes, determine that the metal surface has a defect and determine the location of the defect;
举例来说,可以根据接收到的空间辐射电磁波确定所述缺陷的位置。可以理解的是,逆着接收到的空间辐射电磁波的射出角度就可以定位缺陷的位置。For example, the location of the defect can be determined based on the received electromagnetic waves of space radiation. It is understandable that the position of the defect can be located against the emission angle of the received electromagnetic wave from space.
举例来说,如果接收到的空间辐射电磁波的射出角度与入射电磁波的角度不匹配,就可以理解为发生了变化。比如入射是45度,如果不存在缺陷那么射出角度应该也是45度。如果不是45度,说明存在缺陷。For example, if the emission angle of the received electromagnetic wave from space does not match the angle of the incident electromagnetic wave, it can be understood as a change. For example, the incident angle is 45 degrees, if there are no defects, the exit angle should also be 45 degrees. If it is not 45 degrees, there is a defect.
其中,检测过程中,通过改变调制装置和金属在水平方向上的相对位置,当表面等离子体波经过金属表面存在缺陷的地方,出射的空间辐射电磁波会发生变化。。Among them, in the detection process, by changing the relative position of the modulation device and the metal in the horizontal direction, when the surface plasma wave passes through the defect on the metal surface, the emitted spatial radiation electromagnetic wave will change. .
S304、处理单元利用机器学习算法对历史检测数据进行学习以获取缺陷检测模型;其中,所述历史检测数据是对存在缺陷的金属进行检测后探测到的数据。S304. The processing unit uses a machine learning algorithm to learn historical detection data to obtain a defect detection model; wherein, the historical detection data is data detected after detecting defective metals.
举例来说,常见的机器学习算法包括分类学习算法,贝叶斯学习算法、支持向量机学习算法以及神经网络学习算法等等。For example, common machine learning algorithms include classification learning algorithms, Bayesian learning algorithms, support vector machine learning algorithms, neural network learning algorithms, and so on.
请参阅图12,在本发明的另一个实施例中,提供一种设备400。该设备可以是发射器,也可以是探测器。设备400包括CPU 401、存储器402、总线403、收发器404等硬件。该设备可执行上述的发射器的方法或探测 器的方法。Referring to FIG. 12, in another embodiment of the present invention, a device 400 is provided. The device can be a transmitter or a detector. The device 400 includes hardware such as a CPU 401, a memory 402, a bus 403, and a transceiver 404. The device can perform the aforementioned transmitter method or detector method.
在本发明的另一个实施例中,公开了一种存储介质,所述存储介质中存储有程序代码,当所述程序代码被运行时,前述方法实施例中的方法会被执行。In another embodiment of the present invention, a storage medium is disclosed, the storage medium stores program code, and when the program code is executed, the method in the foregoing method embodiment is executed.
在本发明的另一个实施例中,公开了一种计算机程序产品,所述计算机程序产品中包含有程序代码;当所述程序代码被运行时,前述方法实施例中的方法会被执行。In another embodiment of the present invention, a computer program product is disclosed. The computer program product contains program code; when the program code is executed, the method in the foregoing method embodiment will be executed.
在本申请所提供的几个实施例中,应该理解到,所揭露的装置,可通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如所述单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性或其它的形式。In the several embodiments provided in this application, it should be understood that the disclosed device may be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the unit is only a logical function division. In actual implementation, there may be another division manner, for example, multiple units or components may be combined or may Integration into another system, or some features can be ignored, or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical or other forms.
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
另外,在本发明各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现,也可以采用软件功能单元的形式实现。In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit. The above integrated unit can be implemented in the form of hardware or software function unit.
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时,可以存储在一个计算机可读取存储介质中。基于这样的理解,本发明的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质中,包括若干指令用以使得一台计算机设备(可为个人计算机、服务器或者网络设备等)执行本发明各个实施例所述方法的全部或部分步骤。而前述的存储介质包括:U盘、只读存储器(ROM,Read-Only Memory)、随机存取存储 器(RAM,Random Access Memory)、移动硬盘、磁碟或者光盘等各种可以存储程序代码的介质。If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention essentially or part of the contribution to the existing technology or all or part of the technical solution can be embodied in the form of a software product, the computer software product is stored in a storage medium , Including several instructions to enable a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present invention. The aforementioned storage media include: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program code .
以上所述,以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the embodiments are modified, or some of the technical features thereof are equivalently replaced; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

  1. 一种金属表面检测的系统,其特征在于,所述系统包括发射器、探测器以及调制装置;其中,所述发射器和所述探测器位于所述调制装置的两端;A metal surface detection system, characterized in that the system includes a transmitter, a detector and a modulation device; wherein the transmitter and the detector are located at two ends of the modulation device;
    所述发射器,用于将频率小于金属等离子体频率的电磁波入射到所述调制装置与待测金属之间的狭缝,以产生金属表面等离子体波;其中,所述金属表面等离子体波与所述入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;The transmitter is used to inject electromagnetic waves with a frequency lower than the frequency of the metal plasma into the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein the metal surface plasma wave is The incident electromagnetic waves are coupled and excited by resonance into spatial radiation electromagnetic waves, and the spatial radiation electromagnetic waves are emitted from the other end of the modulation device;
    所述探测器,用于接收所述空间辐射电磁波,并根据所述空间辐射电磁波确定是否存在缺陷;The detector is configured to receive the electromagnetic waves radiated in space, and determine whether there is a defect according to the electromagnetic waves radiated in space;
    其中,所述调制装置的长度需小于表面等离子体波在所述待测金属表面的传播距离。Wherein, the length of the modulation device needs to be less than the propagation distance of the surface plasma wave on the metal surface to be measured.
  2. 根据权利要求1所述的系统,其特征在于,所述调制装置到金属表面的距离小于所述金属表面等离子体波在空气中的衰减距离。The system according to claim 1, wherein the distance from the modulation device to the metal surface is less than the attenuation distance of the plasma wave of the metal surface in the air.
  3. 根据权利要求2所述的系统,其特征在于,所述待测金属的厚度大于所述表面等离子体波在所述金属中的衰减距离。The system according to claim 2, wherein the thickness of the metal to be measured is greater than the attenuation distance of the surface plasmon wave in the metal.
  4. 根据权利要求3所述的系统,其特征在于,所述探测器,具体用于当接收到的空间辐射电磁波发生变化时,确定所述待测金属表面存在的缺陷以及根据所述接收到的空间辐射电磁波的角度确定所述缺陷的位置。The system according to claim 3, wherein the detector is specifically configured to determine the defects existing on the metal surface to be tested when the received space radiated electromagnetic wave changes and according to the received space The angle of the radiated electromagnetic wave determines the location of the defect.
  5. 根据权利要求4所述的系统,其特征在于,所述系统还包括处理单元;The system according to claim 4, wherein the system further comprises a processing unit;
    所述处理单元,用于利用机器学习算法对历史检测数据进行学习以获取缺陷检测模型;其中,所述历史检测数据是对存在缺陷的金属进行检测后所述探测器探测到的数据。The processing unit is configured to use a machine learning algorithm to learn historical detection data to obtain a defect detection model; wherein the historical detection data is the data detected by the detector after detecting the defective metal.
  6. 一种金属表面检测的方法,其特征在于,所述方法包括;A method for detecting a metal surface, characterized in that the method includes;
    发射器将频率小于金属等离子体频率的电磁波入射到调制装置与待测金 属之间的狭缝,以产生金属表面等离子体波;其中,所述待测金属表面等离子体波与所述入射的电磁波耦合,并被共振激发为空间辐射电磁波,所述空间辐射电磁波从所述调制装置的另一端射出;其中,所述调制装置平行放置在所述待测金属的上方;The transmitter injects electromagnetic waves with a frequency lower than the frequency of the metal plasma into the slit between the modulation device and the metal to be measured to generate a metal surface plasma wave; wherein the metal surface plasma wave to be measured and the incident electromagnetic wave Coupled and excited by resonance into a space radiating electromagnetic wave, the space radiating electromagnetic wave is emitted from the other end of the modulation device; wherein the modulation device is placed in parallel above the metal to be measured;
    探测器接收所述空间辐射电磁波,并根据所述空间辐射电磁波的变化确定是否存在缺陷;The detector receives the space radiated electromagnetic wave, and determines whether there is a defect according to the change of the space radiated electromagnetic wave;
    其中,所述调制装置的长度需小于表面等离子体波在所述待测金属表面的传播距离。Wherein, the length of the modulation device needs to be less than the propagation distance of the surface plasma wave on the metal surface to be measured.
  7. 根据权利要求6所述的方法,其特征在于,所述调制装置到所述待测金属表面的距离小于所述待测金属表面等离子体波在空气中的衰减距离。The method according to claim 6, wherein the distance from the modulation device to the surface of the metal to be measured is smaller than the attenuation distance of the plasma wave of the surface of the metal to be measured in the air.
  8. 根据权利要求7所述的方法,其特征在于,所述待测金属的厚度大于所述表面等离子体波在所述待测金属中的衰减距离。8. The method according to claim 7, wherein the thickness of the metal to be measured is greater than the attenuation distance of the surface plasma wave in the metal to be measured.
  9. 根据权利要求3所述的方法,其特征在于,所述根据所述空间辐射电磁波确定是否存在缺陷,包括:当所述探测器接收到的空间辐射电磁波发生变化时,确定所述金属表面存在缺陷,以及根据所述接收到的空间辐射电磁波的角度确定所述缺陷的位置。The method according to claim 3, wherein the determining whether there is a defect based on the space radiated electromagnetic wave comprises: when the space radiated electromagnetic wave received by the detector changes, determining that the metal surface has a defect , And determine the position of the defect according to the angle of the received electromagnetic wave from space.
  10. 根据权利要求9所述的方法,其特征在于,所述方法还包括:The method according to claim 9, wherein the method further comprises:
    处理单元利用机器学习算法对历史检测数据进行学习以获取缺陷检测模型;其中,所述历史检测数据是对存在缺陷的金属进行检测后探测到的数据。The processing unit uses a machine learning algorithm to learn historical detection data to obtain a defect detection model; wherein the historical detection data is data detected after detecting defective metals.
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004109106A (en) * 2002-07-22 2004-04-08 Fujitsu Ltd Method and apparatus for inspecting surface defect
US20060091332A1 (en) * 2000-09-21 2006-05-04 Hitachi High-Technologies Corporation Method and its apparatus for inspecting particles or defects of a semiconductor device
JP2009271001A (en) * 2008-05-09 2009-11-19 Hitachi Plasma Display Ltd Substrate surface defect inspection method and device
CN102096269A (en) * 2011-01-18 2011-06-15 南京邮电大学 Terahertz surface plasma wave optical modulator and modulation method thereof
CN202281747U (en) * 2011-11-07 2012-06-20 上海工程技术大学 Plasma resonance sensing device
CN102636491A (en) * 2012-04-17 2012-08-15 南京邮电大学 Semiconductor defect detection method based on surface plasma wave
CN102739165A (en) * 2012-06-28 2012-10-17 南京邮电大学 Electromagnetic wave modulation method based on surface plasma wave transmission distance
CN102928503A (en) * 2012-10-24 2013-02-13 天津工业大学 Electromagnetic acoustic emission nondestructive inspection device for metal plate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CZ299489B6 (en) * 2005-01-12 2008-08-13 Ústav fotoniky a elektroniky AV CR, v. v. i. Spectroscopy method of surface plasmons for sensors with surface plasmons and sensor element for making the same
CN102736273A (en) * 2012-06-28 2012-10-17 南京邮电大学 Method for modulating temperatures of electromagnetic waves based on surface plasma wave transmission distance
CN102721670B (en) * 2012-06-28 2014-06-04 南京邮电大学 Method for measuring frequency of semiconductor plasma
CN104597564B (en) * 2015-01-16 2018-03-30 哈尔滨工业大学深圳研究生院 The compound narrow slit wave-guide of one species surface plasma and its application

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060091332A1 (en) * 2000-09-21 2006-05-04 Hitachi High-Technologies Corporation Method and its apparatus for inspecting particles or defects of a semiconductor device
JP2004109106A (en) * 2002-07-22 2004-04-08 Fujitsu Ltd Method and apparatus for inspecting surface defect
JP2009271001A (en) * 2008-05-09 2009-11-19 Hitachi Plasma Display Ltd Substrate surface defect inspection method and device
CN102096269A (en) * 2011-01-18 2011-06-15 南京邮电大学 Terahertz surface plasma wave optical modulator and modulation method thereof
CN202281747U (en) * 2011-11-07 2012-06-20 上海工程技术大学 Plasma resonance sensing device
CN102636491A (en) * 2012-04-17 2012-08-15 南京邮电大学 Semiconductor defect detection method based on surface plasma wave
CN102739165A (en) * 2012-06-28 2012-10-17 南京邮电大学 Electromagnetic wave modulation method based on surface plasma wave transmission distance
CN102928503A (en) * 2012-10-24 2013-02-13 天津工业大学 Electromagnetic acoustic emission nondestructive inspection device for metal plate

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