WO2020140705A1 - 一种扩展卡组件 - Google Patents

一种扩展卡组件 Download PDF

Info

Publication number
WO2020140705A1
WO2020140705A1 PCT/CN2019/124573 CN2019124573W WO2020140705A1 WO 2020140705 A1 WO2020140705 A1 WO 2020140705A1 CN 2019124573 W CN2019124573 W CN 2019124573W WO 2020140705 A1 WO2020140705 A1 WO 2020140705A1
Authority
WO
WIPO (PCT)
Prior art keywords
type
bracket
expansion card
circuit board
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/124573
Other languages
English (en)
French (fr)
Inventor
张宏海
杨东升
严杰
陈川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Hikvision Digital Technology Co Ltd
Original Assignee
Hangzhou Hikvision Digital Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Hikvision Digital Technology Co Ltd filed Critical Hangzhou Hikvision Digital Technology Co Ltd
Publication of WO2020140705A1 publication Critical patent/WO2020140705A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure

Definitions

  • This application relates to the technical field of hardware devices, in particular to an expansion card component.
  • PCIE PCI-Express: peripheral component, interconnect express, a high-speed serial computer expansion bus standard
  • CPU Central Processing Unit/Processor, central processing unit
  • the purpose of the embodiments of the present application is to provide an expansion card component to meet expansion requirements.
  • an embodiment of the present application provides an expansion card assembly, including an expansion card and a bracket; wherein,
  • the expansion card is pluggable in the hard disk slot of the electronic device through the bracket;
  • the expansion card includes a circuit board, a processing chip, a communication interface, and a bracket connector.
  • the communication interface, the processing chip, and the bracket connector are provided on the circuit board; the communication interface is used for The interface in the hard disk slot communicates, the communication interface is connected to the processing chip, and the bracket connector is used to connect the expansion card to the bracket.
  • the bracket connector includes: a first type stud that fixes the bracket and the expansion card, and a first type that cooperates with the first type stud is provided on the bracket Screw hole
  • the bracket connecting piece includes a second type screw hole that fixes the bracket and the expansion card, and a second type stud that cooperates with the second type screw hole is provided on the bracket.
  • the bracket connector includes: a first type of buckle that fixes the bracket and the expansion card, and a first type that cooperates with the first type of buckle is provided on the bracket Concave bag
  • the bracket connecting piece includes a second type concave package for fixing the bracket and the expansion card, and a second type buckle matched with the second type concave package is provided on the bracket.
  • the expansion card assembly further includes a heat sink component and a heat dissipation connector, the heat dissipation connector is provided on the circuit board, and the heat dissipation connector is used to connect the heat sink component to the circuit board .
  • the heat dissipation connector includes: a third type of stud fixing the heat sink and the circuit board, and a third type of screw that cooperates with the third type of stud is provided on the heat sink hole;
  • the heat dissipation connector includes a fourth type screw hole that fixes the heat sink device and the circuit board, and a fourth type stud that cooperates with the fourth type screw hole is provided on the heat sink device.
  • the heat sink includes a heat sink
  • the heat sink is provided above the circuit board through the third type stud and the third type screw hole; and/or, the heat sink is passed through the fourth type stud and the fourth type
  • the screw hole is arranged above the circuit board.
  • the heat sink device includes a fan
  • the fan is fixedly connected to the circuit board through the third type stud and the third type screw hole; and/or, the fan passes the fourth type stud and the fourth type screw hole Fixedly connected with the circuit board.
  • the expansion card assembly further includes a heat sink, the heat sink is provided above the circuit board, and the bracket connector is provided on the heat sink;
  • the bracket connector includes: a third type of buckle that fixes the bracket and the heat sink, and a third type of recessed bag that cooperates with the third type of buckle is provided on the bracket;
  • the bracket connecting piece includes a fourth type concave package that fixes the bracket and the heat sink, and a fourth type snap that cooperates with the fourth type concave package is provided on the bracket.
  • the length of the first side of the circuit board ranges from 95 mm to 150 mm
  • the length of the second side of the circuit board ranges from 65 mm to 105 mm
  • the thickness of the circuit board is 2 mm, 0.8 Mm, 1 mm or 1.6 mm;
  • the first side and the second side are two adjacent sides.
  • the length of the first side is 146.0-147.0 mm, and the length of the second side is 100.1 mm-101.1 mm;
  • the length of the first side ranges from 99.7 mm to 100.7 mm, and the length of the second side ranges from 69.1 mm to 70.1 mm.
  • the communication interface is provided on the second side of the circuit board, and the distance between the communication interface and the first side of the circuit board ranges from 13.2 mm to 14.2 mm.
  • the first-type studs and the first-type screw holes enable the bracket connector to connect the expansion card to the bracket in a side-fixed manner
  • the screw holes of the second type and the studs of the second type enable the bracket connecting piece to connect the expansion card and the bracket in a side fixed manner.
  • the first type of buckle and the first type of concave wrap enable the bracket connecting piece to connect the expansion card and the bracket in a side fixed manner
  • the second type of concave pocket and the second type of buckle enable the bracket connecting piece to connect the expansion card and the bracket in a side fixed manner.
  • the first type of studs include four studs with central symmetry; the second type of stud holes include four studs with central symmetry.
  • the first type of buckle includes 4 symmetrically centered buckles; and the second type of buckle includes 4 centrally symmetric pockets.
  • the expansion card component includes any one or more of the following: a GPU component, a CPU component, a processor component, a network card component, a wireless communication component, an input/output component, and the processor component is the GPU component And components with data processing functions other than CPU components.
  • the expansion card assembly provided by the embodiment of the present application includes an expansion card and a bracket; the expansion card is pluggably set in the hard disk slot through the bracket; the expansion card includes a circuit board, and a communication interface, a processing chip and a bracket are provided on the circuit board Rack connector; the communication interface is used to communicate with the interface in the hard disk slot, the communication interface is connected to the processing chip, and the bracket connector is used to connect the expansion card to the bracket.
  • FIG. 1 is a first schematic structural diagram of an expansion card component provided by an embodiment of the present application
  • FIG. 2 is a schematic diagram of a first structure of a circuit board provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a buckle and recessed bag cooperation in an embodiment of the present application.
  • Figure 4a is a schematic diagram of the SFF8639 interface structure
  • Figure 4b is a schematic diagram of a part of the interface structure in the improved SFF8639;
  • Figure 4c is a schematic diagram of another part of the interface structure in the improved SFF8639;
  • FIG. 5 is a second schematic structural diagram of an expansion card assembly provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of the circuit board and the heat sink after assembly according to an embodiment of the present application.
  • FIG. 7 is a second schematic structural diagram of a circuit board provided by an embodiment of this application.
  • FIG. 8 is a third schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • the expansion card assembly includes an expansion card 100 and a bracket 200; wherein, the expansion card 100 is removably installed in the bracket 200 through In the hard disk slot of the electronic device.
  • the hard disk slot of the electronic device is a slot for installing a hard disk; correspondingly, the structure of the bracket matches the slot structure of the hard disk slot, so that the expansion card can be plugged and inserted through the bracket 200 In the hard drive slot.
  • the layout clear and the plan clear the following will give a detailed introduction to the related content such as the location and specific types of hard disk slots.
  • the expansion card 100 includes a circuit board 110, a communication interface 111, a processing chip 112, and a bracket connector 113.
  • the communication interface 111, the processing chip 112, and the bracket connector 113 are provided on the circuit board 110;
  • the communication interface 111 is connected to the processing chip 112, and the bracket connector 113 is used to connect the expansion card 100 to the bracket 200.
  • the interface that communicates with the communication interface 111 in the hard disk slot is an interface that can communicate with the expansion card.
  • the expansion card component may include any one or more of the following: a GPU component, a CPU component, a processor component, a network card component, a wireless communication component, and an input and output component, where the processor component is a GPU component And components with data processing functions other than CPU components.
  • the GPU component may include a single chip microcomputer, an ARM processor, an X86 processor, etc., which is not specifically limited.
  • the processor component may include an APU (Accelerated Processing Unit) or TPU (Tensor Processing Unit, tensor processing unit), which is not specifically limited.
  • the network card component may include a 10M network card, a 100M network card, a 1000M network card, a 10G network card, a 25G network card, a 40G network card or a 100G network card, etc., which is not specifically limited.
  • the wireless communication component may include a Bluetooth component, a zigbee component, a wifi component (wireless fidelity, wireless fidelity), or an IoT (Internet of Things) wireless component, such as an IoT-NODE433 component, etc. , No specific restrictions.
  • the input and output components can include various input and output interface boards, such as alarm IO (Input, Output, input and output), RS232 interface board, RS485 interface board, USB (Universal Serial Bus) interface board, etc., specific No limitation.
  • the expansion card component is a GPU component
  • the analysis capabilities of the device can be expanded through the embodiments of the present application.
  • the expansion card component is a CPU component or a processor component
  • the computing capability of the device can be expanded through the embodiments of the present application.
  • the expansion card component is a network card component or a wireless communication component
  • the communication capabilities of the device can be expanded through the embodiments of the present application. It can be seen that in this solution, the use of hard disk slots can expand the analysis capabilities, computing capabilities, and communication capabilities of the device to meet various expansion needs.
  • the processing chip in FIG. 2 may be a GPU chip; if the expansion card component is a processor component, the processing chip in FIG. 2 may be a processor chip, such as an APU chip, a TPU chip, etc. No longer list them one by one. The number of processing chips is not limited.
  • the circuit board 110 may further include other components, for example, a control interface, a power supply interface, a control circuit, a power supply circuit, etc., which is not limited in this embodiment.
  • connection methods of the expansion card 100 and the bracket 200 for example, screw hole stud connection, socket connection, snap connection, slide rail connection, slide rail connection, etc., which is not specifically limited.
  • the bracket connecting member in FIG. 2 may be a screw hole or a stud, a buckle or a concave package, a slide rail or a slide rail, etc., which will not be listed one by one.
  • the bracket connector 113 includes: a first type of studs fixing the bracket 200 and the expansion card 100, and correspondingly, the bracket 200 is provided with a first type that cooperates with the first type of studs Screw holes.
  • the bracket connecting member includes a stud, and the bracket 200 is provided with a screw hole.
  • a first type of stud and a first type of screw hole it is referred to as a first type of stud and a first type of screw hole.
  • the first type of studs and the first type of screw holes cooperate to fix the bracket 200 and the expansion card 100 together.
  • the bracket connector 113 includes: a second type screw hole that fixes the bracket 200 and the expansion card 100, and a second type screw that cooperates with the second type screw hole is provided on the bracket 200 column.
  • the bracket connector 113 includes a screw hole, and the bracket 200 is provided with a stud.
  • a second type screw hole and a second type stud it is referred to as a second type screw hole and a second type stud.
  • the second type of studs and the second type of screw holes cooperate to fix the bracket 200 and the expansion card 100 together.
  • the bracket connector 113 includes: a first type of buckle that fixes the bracket 200 and the expansion card 100, and a first type of recessed bag that cooperates with the first type of buckle is provided on the bracket 200 .
  • the bracket connector 113 includes a buckle, and the bracket 200 is provided with a concave wrap.
  • the bracket 200 is provided with a concave wrap.
  • it is referred to as a first type of buckle and a first type of concave wrap.
  • the first type of buckle cooperates with the first type of concave package, so that the bracket 200 and the expansion card 100 are fixed together.
  • the cooperating way of the buckle and the concave package can be shown in Figure 3.
  • the bracket connector 113 includes: a second type concave package that fixes the bracket 200 and the expansion card 100, and a second type card that cooperates with the second type concave package is provided on the bracket 200 buckle.
  • the bracket connecting member 113 includes a concave package, and a buckle is provided on the bracket 200.
  • a buckle is provided on the bracket 200.
  • it is referred to as a second type concave package and a second type buckle.
  • the second type of buckle cooperates with the second type of concave package, so that the bracket 200 and the expansion card 100 are fixed together.
  • the cooperating way of the buckle and the concave package can be shown in Figure 3.
  • connection method of the bracket and the expansion card described in the above content can be arbitrarily combined, and the specific is not limited.
  • the hard disk slot can be set outside the backplane, the motherboard, or the chassis, and the specific position of the hard disk slot is not limited.
  • the number of hard disk slots and the number of expansion card components are not limited, and can be flexibly configured according to the actual situation.
  • the expansion card is removably installed in the hard disk slot through the bracket, and the hard disk slot includes an interface capable of communicating with the expansion card, and the interface is an interface that communicates with the communication interface 111.
  • the hard disk slot may include a first type interface and a second type interface.
  • the first type interface is used to communicate with the hard disk
  • the second type interface is used to communicate with the expansion card.
  • the first type interface and the second type interface may be completely different interfaces, that is, some interfaces in the hard disk slot can only communicate with the hard disk, and some interfaces can only communicate with the expansion card.
  • the first type interface and the second type interface may be partially the same. For example, there are some interfaces in the hard disk slot that can communicate with the hard disk and the expansion card.
  • the hard disk slot may include the SFF8639 interface, for example, the U.2 interface in SFF8639 or the U.3 interface in SFF8639, which is not specifically limited.
  • the hard disk slot includes the first type interface and the second type interface. Then, for the SFF8639 interface, part of the interface can be used as the first type interface, and the other interface can be used as the second Class interface.
  • the second type of interface may be a PCIE interface
  • the first type of interface may be a SAS (Serial Attached SCSI), Serial SCSI; SCSI: Small Computer System Interface (Small Computer System Interface) interface or SATA (Serial Advanced Technology Attachment) , Serial Advanced Technology Attachment) interface.
  • the PCIE interface can transmit Ethernet RGMII (Reduced Gigabit Media Independent Interface) signals or GMII (Gigabit Medium Independent, Gigabit Media Independent Interface) signals.
  • PCIE stands for PCI-Express (peripheral component interconnect), which is a high-speed serial computer expansion bus standard.
  • Figure 4a is the U.2 interface in SFF8639, where the SAS (SAS-1 and SAS-2) interface/SATA interface is used as the first type interface to communicate with the hard disk, and the PCIE interface (PCIE Channel 0-3) as the second type of interface to communicate with the expansion card.
  • SAS SAS-1 and SAS-2
  • PCIE PCIE Channel 0-3
  • the SFF8639 interface in FIG. 4a also includes a PCIE sideband interface, which is used to modulate the signal transmitted by the PCIE interface.
  • the PCIE sideband interface is the naming of the pins E1-E6 shown in Figure 4a from a functional perspective. Still taking the hard disk slot including the SFF8639 interface as an example, referring to FIG. 4b, FIG. 4b is a part of the interfaces in FIG. 4a, and S26 and S27 in the SFF8639 interface can be redefined as the out-of-band control interface of the expansion card component, namely S26 , S27 these redefined interfaces belong to the second type of interface 120.
  • the out-of-band control interface is a control management interface.
  • the control management interface is used to control the GPU (Graphics Processing Unit, graphics processor) core circuit warm reset, (power off and power on) cold restart and other behaviors.
  • S26 and S27 are respectively connected to low-speed buses such as I2C_SCL (I2C clock synchronization line) and I2C_SDA (I2C data line), and transmit signaling to the expansion card through these low-speed buses.
  • I2C_SCL I2C clock synchronization line
  • I2C_SDA I2C data line
  • S17, S18, S20, and S21 in the SFF8639 interface can be redefined as the communication interface with the expansion card component, that is, S17, S18, S20, S21
  • These redefined interfaces belong to the second type interface 120, and the communication interface 111 of the expansion card can communicate with the redefined interfaces S17, S18, S20, and S21.
  • C represents a capacitor
  • MDI Medium Dependent Interface
  • a and B the MDI (Medium Dependent Interface) signal is divided into two groups of differential signals, A and B, where MDIAP represents the positive electrode of the MDI signal in group A, and MDIAN represents the positive electrode of the MDI signal in group A
  • MDIBP represents the positive pole of the MDI signal of group B
  • MDIBN represents the negative pole of the MDI signal of group B.
  • FIG. 4c is a part of the interface in FIG. 4a.
  • R represents resistance.
  • the IP/MAC addresses of the processing chips in each expansion card component can be independently addressed, reducing address conflicts.
  • the value range of the 10 GPIO states can be 0x000 ⁇ 0x3ff in hexadecimal.
  • the expansion card component is a GPU component
  • the GPU component includes multiple GPU chips, and connecting the multiple GPU chips to these GPIOs respectively can independently address the IP/MAC addresses of each GPU to reduce address conflicts.
  • the expansion card component may further include a power supply component.
  • the power supply component may be disposed outside the backplane, the main board, or the chassis. The specific location of the power supply component is not limited.
  • the power supply component may supply power to the circuit board in the expansion card component or the processing chip in the circuit board.
  • the power supply interface of the original hard disk slot can be reused, and the power supply interface of the slot is connected to the power supply component in the expansion card, so that there is no need to redefine the slot power supply interface, saving Manpower.
  • the expansion card assembly further includes a heat sink component 300 and a heat dissipation connector.
  • the heat dissipation connector is provided on the circuit board 110, and the heat dissipation connector is used to connect the heat sink component 300 It is connected to the circuit board 110.
  • FIG. 5 is a schematic structural diagram of an expansion card assembly.
  • the length of the expansion card assembly is a
  • the width is b
  • the thickness is c.
  • the specific values of a, b, and c are not limited. In one case, the specific values of a, b, and c can be the same as the original 3.5-inch hard disk, or 2.5-inch hard disk, or other sizes of hard disks.
  • the heat sink device 300 includes two devices, a fan and a heat sink: the heat sink is disposed above the circuit board 110; the fan may be a turbo fan, or may be another form of fan. In one case, you can reuse the heat dissipation system that comes with the device to ventilate and expand the expansion card components, which can save costs.
  • connection methods of the heat sink device 300 and the circuit board 110 for example, screw hole stud connection, dimple connection, snap connection, etc., which is not specifically limited.
  • the heat dissipation connectors on the circuit board may be screw holes or studs, buckles or concave packages, etc., which will not be listed one by one.
  • the heat dissipation connector includes a third type stud fixing the heat sink 300 and the circuit board 110.
  • the heat dissipation device is provided with a third type stud hole matching the third type stud .
  • the heat dissipation connector includes a stud, and the heat sink 300 is provided with a screw hole.
  • a third type of stud and a third type of screw hole it is referred to as a third type of stud and a third type of screw hole.
  • the third type of studs and the third type of screw holes cooperate to fix the heat sink device 300 and the circuit board 110 together.
  • the heat dissipation connector includes a screw hole.
  • the heat sink device 300 is provided with a stud.
  • a fourth type screw hole and a fourth type stud it is referred to as a fourth type screw hole and a fourth type stud.
  • the fourth type of screw holes and the fourth type of studs cooperate to fix the heat sink device 300 and the circuit board 110 together.
  • the heat dissipation connector includes a third type of buckle that fixes the heat sink 300 and the circuit board 110.
  • a third type of recessed package that cooperates with the third type of buckle is provided on the heat sink .
  • the heat dissipation connector includes a buckle, and the heat sink member 300 is provided with a concave package.
  • a third type of buckle and a third type of concave package it is referred to as a third type of buckle and a third type of concave package.
  • the third type of buckle and the third type of concave package cooperate to fix the heat sink device 300 and the circuit board 110 together.
  • the cooperating way of the buckle and the concave package can be shown in Figure 3.
  • the heat dissipation connector includes a concave package.
  • the heat sink device 300 is provided with a buckle.
  • a fourth-type concave package and a fourth-type buckle For convenience of description, it is referred to as a fourth-type concave package and a fourth-type buckle.
  • the cooperation between the snap and the recess can be shown in Figure 3.
  • connection method of the heat sink device and the circuit board described in the foregoing can be arbitrarily combined, and the specific is not limited.
  • the heat sink device 300 may include a heat sink.
  • the heat sink is provided above the circuit board through the third type stud and the third type screw hole; and/or The heat sink is provided above the circuit board through the fourth type stud and the fourth type screw hole.
  • the heat sink and the circuit board 110 are connected by studs and screw holes.
  • the heat dissipation connector when the heat dissipation connector includes the third type stud, the third type screw hole is provided on the heat sink; when the heat dissipation connector includes the fourth type stud hole, the fourth type stud is provided on the heat sink; and the heat dissipation connector
  • the third type of studs and the fourth type of stud holes are included, the third type of screw holes and the fourth type of studs are provided on the heat sink.
  • the heat sink device 300 may include a fan.
  • the fan is fixedly connected to the circuit board through the third type stud and the third type screw hole; and/or, the fan passes The fourth type of stud and the fourth type of screw hole are fixedly connected to the circuit board. That is to say, when the heat dissipation connector includes the third type stud, the fan has a third type screw hole; when the heat dissipation connector includes the fourth type stud hole, the fan has a fourth type stud; and the heat dissipation connector When the third type studs and the fourth type stud holes are included, the fan is provided with the third type stud holes and the fourth type stud holes. For example, in FIG. 5, the fan and the circuit board 110 are connected by studs and screw holes.
  • a heat sink is provided above the circuit board 110, and the bracket connector 113 is provided on the heat sink.
  • the bracket connector 113 may include: a third type of buckle that fixes the bracket and the heat sink, and the bracket is provided with a third type of buckle that cooperates with the third type of buckle Three types of concave wraps; and/or, the bracket connecting piece includes: a fourth type concave wrap fixing the bracket and the heat sink, the bracket is provided with a phase corresponding to the fourth type concave wrap The fourth type of buckle.
  • the bracket 200 and the expansion card 100 can be fixed together by a buckle and a concave package. If a heat sink is provided above the circuit board 110 of the expansion card 100, the buckle and/or Or the concave package is arranged on the heat sink.
  • FIG. 6 is a schematic structural diagram of the assembled circuit board and heat sink.
  • the heat sink is provided above the circuit board 110.
  • the heat sink is provided with screw holes and buckles (bracket connector 113 ).
  • the bracket 200 is provided with a stud that cooperates with the screw hole and a concave package that cooperates with the buckle (not shown in FIG. 6).
  • FIG. 6 also shows a screw hole for fixing the heat sink, that is, the above-mentioned fourth type screw hole.
  • the fourth type screw hole may include four diagonally arranged screw holes, and the hole diameter may be 4 mm.
  • FIG. 6 also shows a fan and a stud for fixing the fan.
  • the stud is also the third type of stud described above.
  • the stud may be three welded nut studs.
  • the thickness of the heat sink may be 20 mm
  • the thickness of the circuit board may be 2 mm.
  • Various installation dimensions of the circuit board and the heat sink are shown in FIG. 6.
  • the length of the first side of the circuit board 110 ranges from 95 mm to 150 mm
  • the length of the second side of the circuit board 110 ranges from 65 mm to 105 mm
  • the thickness of the circuit board 110 is 2 mm or 0.8 mm Or 1 mm or 1.6 mm.
  • the first side and the second side are two adjacent sides.
  • the size of the hard disk slot can be 3.5 inches or 2.5 inches.
  • 3.5 inches refers to the diameter of the hard disk that can be accommodated in the hard disk slot is 3.5 inches.
  • 2.5 inches refers to the hard disk that can be accommodated in the hard disk slot.
  • the disk diameter is 2.5 inches.
  • the expansion card component that is pluggable in a 3.5-inch hard disk slot is called a large card component, and the expansion card in this case is called a large card, which is pluggable at 2.5 inches
  • the expansion card component in the hard disk slot is called a small card component, and the expansion card in this case is called a small card.
  • the length of the first side may range from 146.0 to 147.0 mm, and the length of the second side may range from 100.1 mm to 101.1 mm.
  • the length of the first side may range from 99.7 mm to 100.7 mm, and the length of the second side may range from 69.1 mm to 70.1 mm.
  • FIG. 6 is a structural diagram of a circuit board and a heat sink after assembly, and FIG. 7 is only a schematic structural diagram of a portion of the circuit board;
  • FIGS. 6 and 7 are cases where the expansion card is a large card, and FIGS. In Figure 7, the length of the first side of the expansion card is 146.5 mm, and the length of the second side is 100.6 mm.
  • FIG. 7 shows the communication interface 111 and the processing chip 112 in the circuit board 110.
  • FIG. 7 also shows the screw holes for fixing the heat sink, that is, the above-mentioned fourth screw holes.
  • the fourth screw holes may include 4
  • the screw holes arranged diagonally may have a hole diameter of 4 mm, and the bracket connector 113 (recessed package) is also shown in FIG. 7.
  • FIG. 8 shows the case where the expansion card is a small card.
  • the length of the first side of the expansion card is 100.2 mm and the length of the second side is 69.6 mm.
  • FIG. 8 shows the communication interface 111 and the processing chip 112 in the circuit board 110.
  • FIG. 8 also shows the screw holes for fixing the heat sink, that is, the above-mentioned fourth type screw holes.
  • the fourth type screw holes may include 4 A diagonally set screw hole, the hole diameter can be 3 mm, the bracket connector 113 (the second type screw hole) is also shown in FIG. 8, and the specific location dimensions of the screw hole and the communication interface are also shown in FIG. 8 .
  • the communication interface 111 in the circuit board 110 is disposed on the second side of the circuit board.
  • the distance between the communication interface and the first side of the circuit board is 13.2 mm-14.2 mm.
  • the distance between the communication interface 111 in the circuit board 110 and the first side of the circuit board is 13.7 mm.
  • the "distance between the communication interface 111 and the first side of the circuit board" referred to here is the distance between the first gold finger of the communication interface 111 and the first side.
  • the first type of studs and the first type of screw holes enable the bracket connector to connect the expansion card to the bracket in a side-fixed manner; and/or
  • the second type of screw holes and the second type of studs enable the bracket connector to connect the expansion card to the bracket in a side-fixed manner.
  • the above-mentioned first-type studs include four studs that are symmetrical in the center, and the first-type studs and the first-type screw holes make the bracket connecting member fix in a lateral manner
  • the expansion card is connected to the bracket;
  • the second type of screw holes include four symmetrically centered screw holes, and the second type of screw holes and the second type of studs make the bracket connecting piece lateral
  • the expansion card is connected to the bracket in a fixed manner.
  • the first type of buckle and the first type of recessed package make the bracket connecting piece connect the expansion card and the bracket in a side fixed manner; and/or
  • the second type of concave wrap and the second type of buckle enable the bracket connecting piece to connect the expansion card and the bracket in a side fixed manner.
  • the first type of buckle can include 4 buckles with symmetrical center.
  • the second type concave package and the second type buckle make the bracket connecting piece connect the expansion card and the bracket in a side fixed manner
  • the second type concave package It can include 4 concave pockets with symmetrical center.
  • bracket connector 113 can also connect the expansion card to the bracket 200 in a fixed manner on the bottom surface, and the specific connection method is not limited, for example, screw hole stud connection, dimple connection, snap Connection, slide rail connection, slide rail connection, etc.
  • the expansion card assembly further includes a light guide post
  • the electronic device further includes an indicator light
  • the light guide post can export the light of the indicator light
  • the indicator light provided by the multiplexing device is used to indicate the operating state of the expansion card component, which saves cost compared to setting the indicator light again.
  • the expansion card assembly may further include a dustproof net to prevent dust from being sucked in along with the air inlet and adhering to the expansion card assembly, thereby affecting the stable operation of the expansion card assembly.
  • the provision of the dustproof net 280 can improve the operation stability and service life of the expansion card assembly.
  • the expansion card component may also include EMC (Electro Magnetic Compatibility, electromagnetic compatibility) metal shrapnel, which can reduce external radiation.
  • EMC Electro Magnetic Compatibility, electromagnetic compatibility
  • the expansion card assembly may further include a clasp, and the expansion card assembly can be more easily installed and removed through the clasp.
  • the expansion card assembly may further include air inlet holes, fixing screw holes, and the like.
  • the fixing screw holes can reuse the fixing screw holes on the side and bottom of the hard disk.
  • the shape of the expansion card assembly is the same as the original 3.5-inch hard disk or 2.5-inch hard disk or other sizes of hard disks, and the screw holes on the side and bottom of these hard disks can be reused.
  • the bracket connector 113 in FIG. 5 may include a concave package, and the communication interface 111 is also shown in FIG. 5.
  • the expansion card assembly provided by the embodiment of the present application includes an expansion card and a bracket; the expansion card is pluggably set in a hard disk slot of an electronic device through the bracket; the expansion card includes a circuit board, and a communication interface and processing are provided on the circuit board Chip and bracket connector; the communication interface is used to communicate with the interface in the hard disk slot, the communication interface is connected to the processing chip, and the bracket connector is used to connect the expansion card to the bracket.
  • the expansion card component is set in the hard disk slot through the bracket, that is, the expansion card component is expanded by using the hard disk slot to meet the expansion requirements.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种扩展卡组件，包括扩展卡（100）和托架（200）；扩展卡（100）通过托架（200）可插拔地设置于电子设备的硬盘槽位中；扩展卡（100）包括电路板、处理芯片、通讯接口和托架连接件，所述通讯接口、处理芯片和托架连接件设置于所述电路板上；通讯接口用于与硬盘槽位中的接口进行通讯，通讯接口与处理芯片相连接，托架连接件用于将扩展卡（100）与托架（200）相连接。可见，扩展卡组件通过托架（200）设置于硬盘槽位中，也就是利用硬盘槽位扩展了扩展卡组件，满足了扩展需求。

Description

一种扩展卡组件
本申请要求于2019年01月03日提交中国专利局、申请号为201920006888.8发明名称为“一种扩展卡组件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及硬件设备技术领域，特别是涉及一种扩展卡组件。
背景技术
在服务器、终端等设备中，通过使用PCIE(PCI-Express：peripheral component interconnect express，是一种高速串行计算机扩展总线标准)插槽扩展一些扩展卡组件，比如GPU(Graphics Processing Unit，图形处理器)组件、CPU(Central Processing Unit/Processor，中央处理器)组件等等。但是这些设备中的PCIE插槽数量少，不能满足扩展需求。
发明内容
本申请实施例的目的在于提供一种扩展卡组件，以满足扩展需求。
为达到上述目的，本申请实施例提供了一种扩展卡组件，包括扩展卡和托架；其中，
所述扩展卡通过所述托架可插拔地设置于电子设备的硬盘槽位中；
所述扩展卡包括电路板、处理芯片、通讯接口和托架连接件，所述通讯接口、所述处理芯片和所述托架连接件设置于所述电路板上；所述通讯接口用于与所述硬盘槽位中的接口进行通讯，所述通讯接口与所述处理芯片相连接，所述托架连接件用于将所述扩展卡与所述托架相连接。
可选的，所述托架连接件包括：固定所述托架和所述扩展卡的第一类螺柱，所述托架上设置有与所述第一类螺柱相配合的第一类螺孔；
和/或，
所述托架连接件包括：固定所述托架和所述扩展卡的第二类螺孔，所述托架上设置有与所述第二类螺孔相配合的第二类螺柱。
可选的，所述托架连接件包括：固定所述托架和所述扩展卡的第一类卡扣，所述托架上设置有与所述第一类卡扣相配合的第一类凹包；
和/或，
所述托架连接件包括：固定所述托架和所述扩展卡的第二类凹包，所述托架上设置有与所述第二类凹包相配合的第二类卡扣。
可选的，所述扩展卡组件还包括散热器件和散热连接件，所述散热连接件设置在所述电路板上，所述散热连接件用于将所述散热器件与所述电路板相连接。
可选的，所述散热连接件包括：固定所述散热器件和所述电路板的第三类螺柱，所述散热器件上设置有与所述第三类螺柱相配合的第三类螺孔；
和/或，
所述散热连接件包括：固定所述散热器件和所述电路板的第四类螺孔，所述散热器件上设置有与所述第四类螺孔相配合的第四类螺柱。
可选的，所述散热器件包括散热片；
所述散热片通过所述第三类螺柱和所述第三类螺孔设置于所述电路板上方；和/或，所述散热片通过所述第四类螺柱和所述第四类螺孔设置于所述电路板上方。
可选的，所述散热器件包括风扇；
所述风扇通过所述第三类螺柱和所述第三类螺孔与所述电路板固定连接；和/或，所述风扇通过所述第四类螺柱和所述第四类螺孔与所述电路板固定连接。
可选的，所述扩展卡组件还包括散热片，所述散热片设置于所述电路板上方，所述托架连接件设置于所述散热片上；
所述托架连接件包括：固定所述托架和所述散热片的第三类卡扣，所述托架上设置有与所述第三类卡扣相配合的第三类凹包；
和/或，
所述托架连接件包括：固定所述托架和所述散热片的第四类凹包，所述托架上设置有与所述第四类凹包相配合的第四类卡扣。
可选的，所述电路板的第一边长度范围为95毫米-150毫米，所述电路板的第二边的长度范围为65毫米-105毫米，所述电路板的厚度为2毫米、0.8毫米、1毫米或1.6毫米；
所述第一边和所述第二边为相邻的两边。
可选的，所述第一边的长度范围为146.0-147.0毫米，所述第二边的长度范围为100.1毫米-101.1毫米；
或者，所述第一边的长度范围为99.7毫米-100.7毫米，所述第二边的长度范围为69.1毫米-70.1毫米。
可选的，所述通讯接口设置于所述电路板的第二边，所述通讯接口与所述电路板的第一边的距离范围为13.2毫米-14.2毫米。
可选的，所述第一类螺柱与所述第一类螺孔使得所述托架连接件以侧面固定的方式将所述扩展卡与所述托架相连接；
所述第二类螺孔与所述第二类螺柱使得所述托架连接件以侧面固定的方式将所述扩展卡与所述托架相连接。
可选的，所述第一类卡扣与所述第一类凹包使得所述托架连接件以侧面固定的方式将所述扩展卡与所述托架相连接；
所述第二类凹包与所述第二类卡扣使得所述托架连接件以侧面固定的方式将所述扩展卡与所述托架相连接。
可选的，所述第一类螺柱包括中心对称的4个螺柱；所述第二类螺孔包括中心对称的4个螺孔。
可选的，所述第一类卡扣包括中心对称的4个卡扣；所述第二类凹包包括中心对称的4个凹包。可选的，所述扩展卡组件包括以下任意一种或多种：GPU组件、CPU组件、处理器组件、网卡组件、无线通信组件、输入输出组件，所述处理器组件为除所述GPU组件和CPU组件以外的具有数据处理功 能的组件。
本申请实施例提供的扩展卡组件包括扩展卡和托架；扩展卡通过托架可插拔地设置于硬盘槽位中；扩展卡包括电路板，电路板上设置有通讯接口、处理芯片和托架连接件；通讯接口用于与硬盘槽位中的接口进行通讯，通讯接口与处理芯片相连接，托架连接件用于将扩展卡与托架相连接。可见，本方案中，扩展卡组件通过托架设置于硬盘槽位中，也就是利用硬盘槽位扩展了扩展卡组件，满足了扩展需求。
附图说明
为了更清楚地说明本发明实施例和现有技术的技术方案，下面对实施例和现有技术中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的扩展卡组件的第一种结构示意图；
图2为本申请实施例提供的电路板的第一种结构示意图；
图3为本申请实施例中的一种卡扣与凹包配合示意图；
图4a为SFF8639接口结构示意图；
图4b为改进后的SFF8639中一部分接口结构示意图；
图4c为改进后的SFF8639中另一部分接口结构示意图；
图5为本申请实施例提供的扩展卡组件的第二种结构示意图；
图6为本申请实施例提供的电路板与散热片组装后的一种结构示意图；
图7为本申请实施例提供的电路板的第二种结构示意图；
图8为本申请实施例提供的电路板的第三种结构示意图。
具体实施方式
为使本发明的目的、技术方案、及优点更加清楚明白，以下参照附图并 举实施例，对本发明进一步详细说明。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
为了解决上述技术问题，本申请实施例提供了一种扩展卡组件，参考图1，该扩展卡组件包括扩展卡100和托架200；其中，扩展卡100通过托架200可插拔地设置于电子设备的硬盘槽位中。其中，电子设备的硬盘槽位为用于安装硬盘的槽位；相应的，托架的结构为与硬盘槽位的槽位结构相匹配，以使得扩展卡可以通过托架200可插拔地设置于硬盘槽位中。为了布局清楚及方案清晰，下文对硬盘槽位的设置位置、具体类型等相关内容进行详细介绍。
参考图2，扩展卡100包括电路板110、通讯接口111、处理芯片112和托架连接件113，通讯接口111、处理芯片112和托架连接件113设置在电路板110上；通讯接口111用于与所述硬盘槽位中的接口进行通讯，通讯接口111与处理芯片112相连接，托架连接件113用于将扩展卡100与托架200相连接。可以理解的是，硬盘槽位中的与通讯接口111进行通讯的接口，为能够与扩展卡进行通讯的接口。
作为一种实施方式，扩展卡组件可以包括以下任意一种或多种：GPU组件、CPU组件、处理器组件、网卡组件、无线通信组件、输入输出组件，其中，该处理器组件为除GPU组件和CPU组件以外的具有数据处理功能的组件。举例来说，GPU组件可以包括单片机、ARM处理器、X86处理器等等，具体不做限定。该处理器组件可以包括APU(Accelerated Processing Unit，加速处理器)或者TPU(Tensor Processing Unit，张量处理单元)，具体不做限定。该网卡组件可以包括10M网卡、100M网卡、1000M网卡、10G网卡、25G网卡、40G网卡或100G网卡等等，具体不做限定。该无线通信组件可以包括蓝牙组件，zigbee(紫蜂)组件，wifi组件(wireless fidelity，无线保真)，或者，IoT(Internet of things，物联网)无线组件，比如，IoT-NODE433组件，等等，具体不做限定。输入输出组件可以包括各种输入输出接口板，比如，报警IO(Input、Output，输入输出)、RS232接口板、RS485接口板、USB(Universal Serial Bus，通用串行总线)接口板等等，具体不做限定。如果扩展卡组件为GPU组件， 则通过本申请实施例可以扩展设备的分析能力。如果扩展卡组件为CPU组件或者处理器组件，则通过本申请实施例可以扩展设备的运算能力。如果扩展卡组件为网卡组件或者无线通信组件，则通过本申请实施例可以扩展设备的通讯能力。可见，本方案中，利用硬盘槽位可以扩展设备的分析能力、运算能力、通讯能力等，满足了各种扩展需求。如果扩展卡组件为GPU组件，则图2中的处理芯片可以为GPU芯片；如果扩展卡组件为处理器组件，则图2中的处理芯片可以为处理器芯片，如APU芯片、TPU芯片等，不再一一列举。处理芯片的数量不做限定。
电路板110还可以包括其他组成部分，比如，控制接口、供电接口、控制电路、供电电路等等，本实施例对此不进行限定。
在具体应用中，扩展卡100与托架200的连接方式有多种，比如，螺孔螺柱连接、卯柱连接、卡扣连接、滑轨连接、滑道连接等等，具体不做限定。相应的，图2中的托架连接件可以为螺孔或螺柱、卡扣或凹包、滑轨或滑道等等，不再一一列举。
一种实施方式中，托架连接件113包括：固定托架200和扩展卡100的第一类螺柱，相应的，托架200上设置有与所述第一类螺柱相配合的第一类螺孔。
这种实施方式中，托架连接件包括螺柱，托架200上设置有螺孔，为了方便描述，将其称为第一类螺柱和第一类螺孔。第一类螺柱和第一类螺孔相配合，使得托架200和扩展卡100固定在一起。
另一种实施方式中，托架连接件113包括：固定托架200和扩展卡100的第二类螺孔，托架200上设置有与所述第二类螺孔相配合的第二类螺柱。
这种实施方式中，托架连接件113包括螺孔，托架200上设置有螺柱，为了方便描述，将其称为第二类螺孔和第二类螺柱。第二类螺柱和第二类螺孔相配合，使得托架200和扩展卡100固定在一起。
一种实施方式中，托架连接件113包括：固定托架200和扩展卡100的第一类卡扣，托架200上设置有与所述第一类卡扣相配合的第一类凹包。
这种实施方式中，托架连接件113包括卡扣，托架200上设置有凹包，为 了方便描述，将其称为第一类卡扣和第一类凹包。第一类卡扣和第一类凹包相配合，使得托架200和扩展卡100固定在一起。卡扣和凹包的配合方式可以如图3所示。
另一种实施方式中，托架连接件113包括：固定托架200和扩展卡100的第二类凹包，托架200上设置有与所述第二类凹包相配合的第二类卡扣。
这种实施方式中，托架连接件113包括凹包，托架200上设置有卡扣，为了方便描述，将其称为第二类凹包和第二类卡扣。第二类卡扣和第二类凹包相配合，使得托架200和扩展卡100固定在一起。卡扣和凹包的配合方式可以如图3所示。
上述内容中介绍的托架与扩展卡的连接方式可以任意组合，具体不做限定。
另外，为了布局清楚及方案清晰，对硬盘槽位的设置位置、具体类型等相关内容进行详细介绍。
其中，硬盘槽位可以设置于背板、主板或者机箱外侧，硬盘槽位的具体位置不做限定。硬盘槽位的数量及扩展卡组件的数量不做限定，可以实际情况，灵活配置。
并且，本申请实施例中，扩展卡通过托架可插拔地设置于硬盘槽位中，硬盘槽位中包括能够与扩展卡进行通讯的接口，该接口为与通讯接口111相通信的接口。举例来说，硬盘槽位可以包括第一类接口和第二类接口，第一类接口用于与硬盘进行通讯，第二类接口用于与扩展卡进行通讯。一种情况下，第一类接口与第二类接口可以为完全不同的接口，也就是说，硬盘槽位中有一部分接口只能与硬盘进行通讯，有一部分接口只能与扩展卡进行通讯。或者，另一种情况下，第一类接口与第二类接口可以部分相同，比如，硬盘槽位中有一些接口既可以与硬盘进行通讯，又可以与扩展卡进行通讯。
举例来说，硬盘槽位可以包括SFF8639接口，比如，可以为SFF8639中的U.2接口，也可以是SFF8639中的U.3接口，具体不做限定。延续上述例子，硬盘槽位包括第一类接口和第二类接口，那么，针对SFF8639接口而言，该接口中的部分接口可以被作为第一类接口，而另一部接口可以被作为第二类接口。 一种情况下，第二类接口可以为PCIE接口，第一类接口可以为SAS(Serial Attached SCSI，序列式SCSI；SCSI：Small Computer System Interface，小型计算机系统接口)接口或者SATA(Serial Advanced Technology Attachment，串行高级技术附件)接口。PCIE接口可以传输以太网RGMII(Reduced Gigabit Media Independent Interface，吉比特介质独立接口)信号或者GMII(Gigabit Medium Independent，千兆媒体独立接口)信号。其中，PCIE即PCI-Express(peripheral component interconnect express)，是一种高速串行计算机扩展总线标准。
比如，可以参考图4a，图4a为SFF8639中的U.2接口，其中的SAS(SAS-1和SAS-2)接口/SATA接口作为第一类接口与硬盘进行通讯，其中的PCIE接口(PCIE通道0-3)作为第二类接口与扩展卡进行通讯。可见，本方案中，可以复用原有硬盘槽位的SATA接口和SAS接口，不需要重新定义第一类接口，节省了人力。
图4a的SFF8639接口中还包括PCIE边带接口，用于对PCIE接口传输的信号进行调制。其中，PCIE边带接口为对图4a中所示的引脚E1-E6从功能角度上的命名。仍以硬盘槽位包括SFF8639接口为例来说，参考图4b，图4b为图4a中的部分接口，可以将SFF8639接口中的S26、S27重新定义为扩展卡组件的带外控制接口，即S26、S27这些重新定义的接口属于第二类接口120。通过S26、S27这些重新定义的接口，可以对扩展卡进行软复位、硬复位等操作。其中，该带外控制接口即为控制管理接口，该控制管理接口用于控制GPU(Graphics Processing Unit，图形处理器)核心电路的热复位、(断电再上电)冷重启等行为。
具体来说，图4b中，S26、S27分别与I2C_SCL(I2C的时钟同步线)、I2C_SDA(I2C的数据线)这些低速总线相连接，通过这些低速总线传递信令至扩展卡。其中，S26、S27是I2C接口I2C_SCL、I2C_SDA两个引脚。
仍以硬盘槽位包括SFF8639接口为例来说，参考图4b，可以将SFF8639接口中的S17、S18、S20、S21重新定义为与扩展卡组件进行通讯的接口，即S17、S18、S20、S21这些重新定义的接口属于第二类接口120，扩展卡的通讯接口 111可以与S17、S18、S20、S21这些重新定义的接口进行通讯。
具体来说，图4b中，C表示电容器，将MDI(Medium Dependent Interface，介质相关接口)信号分为A、B两组差分信号，其中，MDIAP表示A组MDI信号的正极，MDIAN表示A组MDI信号的负极、MDIBP表示B组MDI信号的正极，MDIBN表示B组MDI信号的负极。
另外，当一个局域网内包括多个扩展卡组件时，由于每个扩展卡组件的IP/MAC地址不能冲突，因此，可以通过为多个GPIO(General Purpose Input Output，通用输入/输出)配置不同的值，来设置扩展卡组件的IP/MAC低位，该低位的位数与该多个GPIO的数量相同。例如：参考图4c，图4c为图4a中的部分接口，可以通过为E7～E16配置不同的值，来设置扩展卡组件的IP/MAC低位10bit位，也就是为扩展卡组件配置使能GPIO口。图4c中，R表示电阻。通过将这E7～E16这10个GPIO上拉下拉为不同的状态，可以使得各个扩展卡组件中的处理芯片的IP/MAC地址独立编址，减少地址冲突。比如这10个GPIO的状态的取值范围可以为16进制的0x000～0x3ff。
如果扩展卡组件为GPU组件，假设GPU组件中包括多个GPU芯片，将该多个GPU芯片分别与这些GPIO相连接，可以使得各GPU的IP/MAC地址独立编址，减少地址冲突。
作为一种实施方式，扩展卡组件中还可以包括供电组件，供电组件可以设置于背板、主板或者机箱外侧，供电组件的具体位置不做限定。供电组件可以为扩展卡组件中的电路板或者电路板中的处理芯片供电。比如，参考图4a，本方案中，可以复用原有硬盘槽位的供电接口，该槽位供电接口与扩展卡中的供电组件相连接，这样，不需要重新定义槽位供电接口，节省了人力。
作为一种实施方式，如图5所示，扩展卡组件还包括散热器件300和散热连接件，相对应的，所述散热连接件设置在电路板110上，散热连接件用于将散热器件300与电路板110相连接。
参考图5，图5为扩展卡组件的一种结构示意图，图5中，扩展卡组件的长度为a、宽度为b、厚度为c，a、b、c的具体数值不做限定。一种情况下，a、b、c的具体数值可以与原3.5寸硬盘、或者2.5寸硬盘，或者其他尺寸的硬盘相同。图5中，散热器件300包括风扇和散热片两种器件：散热片设置于电路板110上方；风扇可以为涡轮风扇，或者也可以为其他形式的风扇。一种情况下，可以复用设备自带的散热系统对扩展卡组件进行通风散热，这样可以节省成本。
在具体应用中，散热器件300与电路板110的连接方式有多种，比如，螺孔螺柱连接、卯柱连接、卡扣连接等等，具体不做限定。相应的，电路板上的散热连接件可以为螺孔或螺柱、卡扣或凹包等等，不再一一列举。
一种实施方式中，散热连接件包括：固定散热器件300和电路板110的第三类螺柱，相应的，所述散热器件上设置有与第三类螺柱相配合的第三类螺孔。
这种实施方式中，散热连接件包括螺柱，散热器件300上设置有螺孔，为了方便描述，将其称为第三类螺柱和第三类螺孔。第三类螺柱和第三类螺孔相配合，使得散热器件300和电路板110固定在一起。
另一种实施方式中，散热连接件包括螺孔，相应的，散热器件300上设置有螺柱，为了方便描述，将其称为第四类螺孔和第四类螺柱。第四类螺孔和第四类螺柱相配合，使得散热器件300和电路板110固定在一起。
一种实施方式中，散热连接件包括：固定散热器件300和电路板110的第三类卡扣，相应的，所述散热器件上设置有与第三类卡扣相配合的第三类凹包。
这种实施方式中，散热连接件包括卡扣，散热器件300上设置有凹包，为了方便描述，将其称为第三类卡扣和第三类凹包。第三类卡扣和第三类凹包相配合，使得散热器件300和电路板110固定在一起。卡扣和凹包的配合方式可以如图3所示。
另一种实施方式中，散热连接件包括凹包，相应的，散热器件300上设置有卡扣，为了方便描述，将其称为第四类凹包和第四类卡扣。第四类凹包和第四类卡扣相配合，使得散热器件300和电路板110固定在一起。卡扣和凹包 的配合方式可以如图3所示。
上述内容中介绍的散热器件与电路板的连接方式可以任意组合，具体不做限定。
如上所述，散热器件300可以包括散热片，一种实施方式中，散热片通过所述第三类螺柱和所述第三类螺孔设置于所述电路板上方；和/或，所述散热片通过所述第四类螺柱和所述第四类螺孔设置于所述电路板上方。比如图5中，散热片与电路板110通过螺柱和螺孔相连接。也就是说，散热连接件包括第三类螺柱时，散热片上设置有第三类螺孔；散热连接件包括第四类螺孔时，散热片上设置有第四类螺柱；而散热连接件包括第三类螺柱和第四类螺孔时，散热片上设置有第三类螺孔和第四类螺柱。
如上所述，散热器件300可以包括风扇，一种实施方式中，风扇通过所述第三类螺柱和所述第三类螺孔与所述电路板固定连接；和/或，所述风扇通过所述第四类螺柱和所述第四类螺孔与所述电路板固定连接。也就是说，散热连接件包括第三类螺柱时，风扇上设置有第三类螺孔；散热连接件包括第四类螺孔时，风扇上设置有第四类螺柱；而散热连接件包括第三类螺柱和第四类螺孔时，风扇上设置有第三类螺孔和第四类螺柱。比如图5中，风扇与电路板110通过螺柱和螺孔相连接。
一种实施方式中，电路板110上方设置有散热片，托架连接件113设置于散热片上。
这种实施方式中，托架连接件113可以包括：固定所述托架和所述散热片的第三类卡扣，所述托架上设置有与所述第三类卡扣相配合的第三类凹包；和/或，所述托架连接件包括：固定所述托架和所述散热片的第四类凹包，所述托架上设置有与所述第四类凹包相配合的第四类卡扣。
如上所述，一种情况下，托架200和扩展卡100之间可以通过卡扣和凹包固定在一起，如果扩展卡100的电路板110上方设置了散热片，则可以将卡扣 和/或凹包设置于散热片上。
参考图6，图6为电路板与散热片组装后的一种结构示意图，散热片设置于电路板110的上方，散热片上设置有螺孔和卡扣(托架连接件113)，相对应的，托架200上设置有与螺孔配合的螺柱、与卡扣配合的凹包(图6中未示出)。
图6中还示出了固定散热片的螺孔，也就是上述第四类螺孔，第四类螺孔可以包括4个对角设置的螺孔，孔径可以为4毫米。图6中还示出了风扇、以及固定风扇的螺柱，该螺柱也就是上述第三类螺柱，该螺柱可以为3个焊接的螺母柱。图6中，散热片的厚度可以为20毫米，电路板的厚度可以为2毫米，电路板与散热片的各种安装尺寸均在图6中示出。
作为一种实施方式，电路板110的第一边长度范围为95毫米-150毫米，电路板110的第二边的长度范围为65毫米-105毫米，电路板110的厚度为2毫米或0.8毫米或1毫米或1.6毫米。其中，该第一边和第二边为相邻的两边。
举例来说，硬盘槽位的尺寸可以为3.5英寸或者2.5英寸，3.5英寸是指硬盘槽位中可容纳的硬盘盘面直径为3.5英寸，类似的，2.5英寸是指硬盘槽位中可容纳的硬盘盘面直径为2.5英寸。为了方便描述，将可插拔地设置于3.5英寸的硬盘槽位中的扩展卡组件称为大卡组件，将这种情况下的扩展卡称为大卡，将可插拔地设置于2.5英寸的硬盘槽位中的扩展卡组件称为小卡组件，将这种情况下的扩展卡称为小卡。
扩展卡为大卡的情况下，第一边的长度范围可以为146.0-147.0毫米，第二边的长度范围可以为100.1毫米-101.1毫米。扩展卡为小卡的情况下，第一边的长度范围可以为99.7毫米-100.7毫米，第二边的长度范围可以为69.1毫米-70.1毫米。
参考图6和图7，图6为电路板与散热片组装后的结构图，图7仅为电路板部分的结构示意图；图6和图7均为扩展卡为大卡的情况，图6和图7中，扩展卡的第一边长度为146.5毫米，第二边长度为100.6毫米。图7中示出了电路板110中的通讯接口111和处理芯片112，图7中还示出了固定散热片的螺孔，也就是上述第四类螺孔，第四类螺孔可以包括4个对角设置的螺孔，孔径可以为4毫米，图7中还示出了托架连接件113(凹包)。
图8为扩展卡为小卡的情况，图8中，扩展卡的第一边长度为100.2毫米，第二边长度为69.6毫米。图8中示出了电路板110中的通讯接口111和处理芯片112，图8中还示出了固定散热片的螺孔，也就是上述第四类螺孔，第四类螺孔可以包括4个对角设置的螺孔，孔径可以为3毫米，图8中还示出了托架连接件113(第二类螺孔)，图8中还示出了螺孔、通讯接口的具体位置尺寸。
作为一种实施方式，电路板110中的通讯接口111设置于所述电路板的第二边，所述通讯接口与所述电路板的第一边的距离范围为13.2毫米-14.2毫米，当然并不局限于此。参考图7和图8，电路板110中的通讯接口111与电路板的第一边的距离13.7毫米。这里所说的“通讯接口111与电路板的第一边的距离”，也就是通讯接口111的第一个金手指与第一边的距离。
作为一种实施方式，所述第一类螺柱与所述第一类螺孔使得所述托架连接件以侧面固定的方式将扩展卡与所述托架相连接；和/或，所述第二类螺孔与所述第二类螺柱使得所述托架连接件以侧面固定的方式将扩展卡与所述托架相连接。参考图7和图8，上述第一类螺柱包括中心对称的4个螺柱，所述第一类螺柱与所述第一类螺孔使得所述托架连接件以侧面固定的方式将扩展卡与所述托架相连接；所述第二类螺孔包括中心对称的4个螺孔，所述第二类螺孔与所述第二类螺柱使得所述托架连接件以侧面固定的方式将扩展卡与所述托架相连接。
作为一种实施方式中，所述第一类卡扣与所述第一类凹包使得所述托架连接件以侧面固定的方式将扩展卡与所述托架相连接；和/或，所述第二类凹包与所述第二类卡扣使得所述托架连接件以侧面固定的方式将扩展卡与所述托架相连接。示例性的，所述第一类卡扣与所述第一类凹包使得所述托架连接件以侧面固定的方式将扩展卡与所述托架相连接时，所述第一类卡扣可以包括中心对称的4个卡扣。示例性的，所述第二类凹包与所述第二类卡扣使得所述托架连接件以侧面固定的方式将扩展卡与所述托架相连接时，所述第二类凹包可以包括中心对称的4个凹包。
另外，需要说明的是，托架连接件113也可以以底面固定的方式将扩展卡与托架200相连接，具体连接方式不做限定，比如，螺孔螺柱连接、卯柱连接、 卡扣连接、滑轨连接、滑道连接等等。
作为一种实施方式，参考图5，扩展卡组件还包括导光柱，电子设备中还包括指示灯，该导光柱可以导出指示灯的灯光。
本实施方式中，复用设备自带的指示灯，通过该指示灯指示扩展卡组件的运行状态，这样相比于再设置指示灯，节省了成本。
参考图5，扩展卡组件还可以包括防尘网，以避免粉尘随进风孔吸入，附着在扩展卡组件上，从而影响扩展卡组件的稳定运行。也就是说，设置了防尘网280可以提高扩展卡组件的运行稳定性及使用寿命。
参考图5，扩展卡组件还可以包括EMC(Electro Magnetic Compatibility，电磁兼容性)金属弹片，EMC金属弹片可以降低对外辐射。
参考图5，扩展卡组件还可以包括扣手，通过扣手可以更方便地安装、拆卸扩展卡组件。
参考图5，扩展卡组件还可以包括进风孔、固定螺孔等。固定螺孔可以复用硬盘的侧面、底面固定螺孔。扩展卡组件的形状与原3.5寸硬盘或者2.5寸硬盘或者其他尺寸的硬盘相同，可以复用这些硬盘的侧面、底面固定螺孔。
图5中的托架连接件113可以包括凹包，图5中还示出了通讯接口111。
本申请实施例提供的扩展卡组件包括扩展卡和托架；扩展卡通过托架可插拔地设置于电子设备的硬盘槽位中；扩展卡包括电路板，电路板上设置有通讯接口、处理芯片和托架连接件；通讯接口用于与硬盘槽位中的接口进行通讯，通讯接口与处理芯片相连接，托架连接件用于将扩展卡与托架相连接。可见，本方案中，扩展卡组件通过托架设置于硬盘槽位中，也就是利用硬盘槽位扩展了扩展卡组件，满足了扩展需求。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明保护的范围之内。

Claims (16)

  1. 一种扩展卡组件，其特征在于，包括扩展卡和托架；其中，
    所述扩展卡通过所述托架可插拔地设置于电子设备的硬盘槽位中；
    所述扩展卡包括电路板、处理芯片、通讯接口和托架连接件，所述通讯接口、所述处理芯片和所述托架连接件设置于所述电路板上；所述通讯接口用于与所述硬盘槽位中的接口进行通讯，所述通讯接口与所述处理芯片相连接，所述托架连接件用于将所述扩展卡与所述托架相连接。
  2. 根据权利要求1所述的扩展卡组件，其特征在于，所述托架连接件包括：固定所述托架和所述扩展卡的第一类螺柱，所述托架上设置有与所述第一类螺柱相配合的第一类螺孔；
    和/或，
    所述托架连接件包括：固定所述托架和所述扩展卡的第二类螺孔，所述托架上设置有与所述第二类螺孔相配合的第二类螺柱。
  3. 根据权利要求1所述的扩展卡组件，其特征在于，所述托架连接件包括：固定所述托架和所述扩展卡的第一类卡扣，所述托架上设置有与所述第一类卡扣相配合的第一类凹包；
    和/或，
    所述托架连接件包括：固定所述托架和所述扩展卡的第二类凹包，所述托架上设置有与所述第二类凹包相配合的第二类卡扣。
  4. 根据权利要求1所述的扩展卡组件，其特征在于，所述扩展卡组件还包括散热器件和散热连接件，所述散热连接件设置在所述电路板上，所述散热连接件用于将所述散热器件与所述电路板相连接。
  5. 根据权利要求4所述的扩展卡组件，其特征在于，所述散热连接件包括：固定所述散热器件和所述电路板的第三类螺柱，所述散热器件上设置有与所述第三类螺柱相配合的第三类螺孔；
    和/或，
    所述散热连接件包括：固定所述散热器件和所述电路板的第四类螺孔，所述散热器件上设置有与所述第四类螺孔相配合的第四类螺柱。
  6. 根据权利要求5所述的扩展卡组件，其特征在于，所述散热器件包括散热片；
    所述散热片通过所述第三类螺柱和所述第三类螺孔设置于所述电路板上方；和/或，所述散热片通过所述第四类螺柱和所述第四类螺孔设置于所述电路板上方。
  7. 根据权利要求5所述的扩展卡组件，其特征在于，所述散热器件包括风扇；
    所述风扇通过所述第三类螺柱和所述第三类螺孔与所述电路板固定连接；和/或，所述风扇通过所述第四类螺柱和所述第四类螺孔与所述电路板固定连接。
  8. 根据权利要求1所述的扩展卡组件，其特征在于，所述扩展卡组件还包括散热片，所述散热片设置于所述电路板上方，所述托架连接件设置于所述散热片上；
    所述托架连接件包括：固定所述托架和所述散热片的第三类卡扣，所述托架上设置有与所述第三类卡扣相配合的第三类凹包；
    和/或，
    所述托架连接件包括：固定所述托架和所述散热片的第四类凹包，所述托架上设置有与所述第四类凹包相配合的第四类卡扣。
  9. 根据权利要求1所述的扩展卡组件，其特征在于，所述电路板的第一边长度范围为95毫米-150毫米，所述电路板的第二边的长度范围为65毫米-105毫米，所述电路板的厚度为2毫米、0.8毫米、1毫米或1.6毫米；
    所述第一边和所述第二边为相邻的两边。
  10. 根据权利要求9所述的扩展卡组件，其特征在于，所述第一边的长度范围为146.0-147.0毫米，所述第二边的长度范围为100.1毫米-101.1毫米；
    或者，所述第一边的长度范围为99.7毫米-100.7毫米，所述第二边的长度范围为69.1毫米-70.1毫米。
  11. 根据权利要求10所述的扩展卡组件，其特征在于，所述通讯接口设置于所述电路板的第二边，所述通讯接口与所述电路板的第一边的距离范围 为13.2毫米-14.2毫米。
  12. 根据权利要求2所述的扩展卡组件，其特征在于，所述第一类螺柱与所述第一类螺孔使得所述托架连接件以侧面固定的方式将所述扩展卡与所述托架相连接；
    所述第二类螺孔与所述第二类螺柱使得所述托架连接件以侧面固定的方式将所述扩展卡与所述托架相连接。
  13. 根据权利要求3所述的扩展卡组件，其特征在于，所述第一类卡扣与所述第一类凹包使得所述托架连接件以侧面固定的方式将所述扩展卡与所述托架相连接；
    所述第二类凹包与所述第二类卡扣使得所述托架连接件以侧面固定的方式将所述扩展卡与所述托架相连接。
  14. 根据权利要求12所述的扩展卡组件，其特征在于，所述第一类螺柱包括中心对称的4个螺柱；所述第二类螺孔包括中心对称的4个螺孔。
  15. 根据权利要求13所述的扩展卡组件，其特征在于，所述第一类卡扣包括中心对称的4个卡扣；所述第二类凹包包括中心对称的4个凹包。
  16. 根据权利要求1所述的扩展卡组件，其特征在于，所述扩展卡组件包括以下任意一种或多种：GPU组件、CPU组件、处理器组件、网卡组件、无线通信组件、输入输出组件，所述处理器组件为除所述GPU组件和CPU组件以外的具有数据处理功能的组件。
PCT/CN2019/124573 2019-01-03 2019-12-11 一种扩展卡组件 Ceased WO2020140705A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201920006888.8 2019-01-03
CN201920006888.8U CN209132753U (zh) 2019-01-03 2019-01-03 一种扩展卡组件

Publications (1)

Publication Number Publication Date
WO2020140705A1 true WO2020140705A1 (zh) 2020-07-09

Family

ID=67249669

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/124573 Ceased WO2020140705A1 (zh) 2019-01-03 2019-12-11 一种扩展卡组件

Country Status (2)

Country Link
CN (1) CN209132753U (zh)
WO (1) WO2020140705A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209132753U (zh) * 2019-01-03 2019-07-19 杭州海康威视数字技术股份有限公司 一种扩展卡组件
CN110851389A (zh) * 2019-12-24 2020-02-28 加弘科技咨询(上海)有限公司 接口扩展方法、扩展网卡及其应用的服务器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5611057A (en) * 1994-10-06 1997-03-11 Dell Usa, L.P. Computer system modular add-in daughter card for an adapter card which also functions as an independent add-in card
CN101004623A (zh) * 2006-01-16 2007-07-25 环隆电气股份有限公司 具有多用途扩充插槽的主机板
CN102902302A (zh) * 2011-07-28 2013-01-30 鸿富锦精密工业（深圳）有限公司 主板组件及其cpu扩展卡
CN204065979U (zh) * 2014-09-09 2014-12-31 浪潮电子信息产业股份有限公司 一种免工具拆装pcie转接卡
CN209132753U (zh) * 2019-01-03 2019-07-19 杭州海康威视数字技术股份有限公司 一种扩展卡组件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5611057A (en) * 1994-10-06 1997-03-11 Dell Usa, L.P. Computer system modular add-in daughter card for an adapter card which also functions as an independent add-in card
CN101004623A (zh) * 2006-01-16 2007-07-25 环隆电气股份有限公司 具有多用途扩充插槽的主机板
CN102902302A (zh) * 2011-07-28 2013-01-30 鸿富锦精密工业（深圳）有限公司 主板组件及其cpu扩展卡
CN204065979U (zh) * 2014-09-09 2014-12-31 浪潮电子信息产业股份有限公司 一种免工具拆装pcie转接卡
CN209132753U (zh) * 2019-01-03 2019-07-19 杭州海康威视数字技术股份有限公司 一种扩展卡组件

Also Published As

Publication number Publication date
CN209132753U (zh) 2019-07-19

Similar Documents

Publication Publication Date Title
CN209015216U (zh) 一种电子设备
TWI553443B (zh) 擴充卡
TWI856259B (zh) 儲存裝置、操作儲存元件的方法及儲存系統
US10956353B1 (en) Connector configurations for printed circuit boards
CN107818062A (zh) 一种兼容sas、sata和nvme硬盘的硬盘背板及其设计方法
US9858227B2 (en) Hybrid networking application switch
US20090300253A1 (en) Changeable CPU module apparatus for a computer
CN111538689B (zh) 两端异构的多通道pcie转接卡
WO2020140705A1 (zh) 一种扩展卡组件
CN104820474A (zh) 一种云服务器主板、云服务器及其实现方法
US9287669B2 (en) SATA express connector
US7188205B2 (en) Mapping of hot-swap states to plug-in unit states
US20230032371A1 (en) Paddle card for crosstalk cancellation in high-speed signaling
CN100476794C (zh) 一种四路服务器主板
US6976113B2 (en) Supporting non-hotswap 64-bit CPCI cards in a HA system
TW201437820A (zh) 耦合至驅動機載架之網路介面卡
CN211124265U (zh) 一种可插拔、自定义物理接口的智能pos核心主板
US20150039797A1 (en) Removable expansion interface device
CN112363977A (zh) Vpx单板计算机主板
US20100002400A1 (en) Daughter board with solid-state storage device for use in computer system
CN201489526U (zh) 适配卡、电脑装置及单板电脑机板
CN202102335U (zh) 一种基于龙芯3a cpu的刀片服务器
CN216286659U (zh) 一种基于国产化vpx架构高速数据处理设备
CN205620854U (zh) 主机板组件与服务器
CN211375594U (zh) 一种基于sw421处理器的接口扩展机构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19907411

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19907411

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 19907411

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 07/02/2022)

122 Ep: pct application non-entry in european phase

Ref document number: 19907411

Country of ref document: EP

Kind code of ref document: A1