WO2020134296A1 - 安检设备及其控制方法 - Google Patents

安检设备及其控制方法 Download PDF

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Publication number
WO2020134296A1
WO2020134296A1 PCT/CN2019/109367 CN2019109367W WO2020134296A1 WO 2020134296 A1 WO2020134296 A1 WO 2020134296A1 CN 2019109367 W CN2019109367 W CN 2019109367W WO 2020134296 A1 WO2020134296 A1 WO 2020134296A1
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WIPO (PCT)
Prior art keywords
tested
security inspection
item
mimo
array
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Ceased
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PCT/CN2019/109367
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English (en)
French (fr)
Inventor
陈志强
游�燕
赵自然
马旭明
武剑
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Nuctech Co Ltd
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Nuctech Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/005—Prospecting or detecting by optical means operating with millimetre waves, e.g. measuring the black losey radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/20—Detecting, e.g. by using light barriers using multiple transmitters or receivers

Definitions

  • the present disclosure relates to the technical field of safety inspection, in particular to a security inspection device and a control method thereof.
  • a security inspection device including: a device body provided with a detection space on the device body, the detection space being configured to accommodate an object to be tested; a 2D MIMO device, that is, two-dimensional multiplex Receiving device, provided in the detection space, and configured to send a detection signal to the item under test and receive an echo signal from the item under test; and a processor, connected to the 2D MIMO device, and configured to Reconstruct the image of the item to be tested according to the received echo signal.
  • a 2D MIMO device that is, two-dimensional multiplex Receiving device, provided in the detection space, and configured to send a detection signal to the item under test and receive an echo signal from the item under test
  • a processor connected to the 2D MIMO device, and configured to Reconstruct the image of the item to be tested according to the received echo signal.
  • the 2D MIMO device includes: a 2D MIMO antenna array, disposed in the detection space, including at least one sub-array, each sub-array includes a plurality of transmit antennas arranged along the first direction and A plurality of receiving antennas arranged in a second direction with a first direction at a preset angle, and a midpoint of a connection line of each of the plurality of transmitting antennas and a corresponding one of the plurality of receiving antennas is taken as An equivalent phase center, the plurality of transmitting antennas and the plurality of receiving antennas are arranged such that the equivalent phase centers are arranged in a two-dimensional array; and a control circuit is configured to control the plurality of transmitting antennas according to a preset The detection signals are sequentially transmitted, and the multiple receiving antennas are controlled to receive the echo signals.
  • the preset angle is 90 degrees
  • each sub-array includes two rows of transmitting antennas arranged along the first direction and two columns of receiving antennas arranged along the second direction.
  • the two columns of receiving antennas form a rectangular pattern.
  • the preset angle is 90 degrees
  • the number of the sub-arrays is 1
  • the sub-array includes a row of transmitting antennas arranged along the first direction and a row of receiving antennas arranged along the second direction, The rows and columns cross to form a cross shape.
  • the security inspection device further includes a translation device installed on the device body and configured to translate the 2D MIMO antenna array in the plane where the 2D MIMO antenna array is located.
  • the security inspection device further includes: a lifting device, installed on the device body, and configured to control the 2D MIMO antenna array to move away from or near the object to be tested.
  • the security inspection device further includes: a backplane, the backplane is disposed in the detection space below the item to be tested, and is configured to pass a detection signal that passes through the item to be tested to the backplane Reflect back to the 2D MIMO device.
  • the backplane includes a metal plate or a plate with a metal coating.
  • the detection space is arranged in a groove structure, having a first side wall and a second side wall parallel to each other and a third side wall perpendicular to the first and second side walls, the 2D
  • the MIMO device is located on the first side wall, and the second side wall is used for placing an object to be tested.
  • the security inspection apparatus further includes: a conveying device configured to pass through the detection space and configured to convey the item to be tested so that the item to be tested enters or leaves the detection space.
  • the security inspection device further includes: a display device connected to the processor and configured to present the reconstructed image of the item to be tested to the user.
  • the security inspection device further includes an alarm device
  • the processor is further configured to determine whether the item to be tested may contain dangerous goods based on preset criteria based on the reconstructed image of the item to be tested, if If yes, control the alarm device to make an alarm.
  • the detection signal is a millimeter wave.
  • a control method of the above security inspection device including: controlling the 2D MIMO device to send a detection signal to an object to be tested, and receiving an echo signal from the object to be tested; and according to the received Echo signals to reconstruct the image of the item to be tested.
  • the reconstructing the image of the object to be tested includes reconstructing the image of the object to be tested based on a holographic reconstruction algorithm or a backward projection algorithm.
  • FIG. 1a shows a schematic structural diagram of a security inspection device according to an embodiment of the present disclosure.
  • FIG. 1b shows a schematic circuit diagram of the security inspection device of FIG. 1a.
  • FIG. 2a shows a schematic structural diagram of a security inspection device according to another embodiment of the present disclosure.
  • Fig. 2b shows a schematic circuit diagram of the security inspection device of Fig. 2a.
  • FIG. 3a shows a schematic structural diagram of a 2D MIMO antenna array according to an embodiment of the present disclosure.
  • FIG. 3b shows a schematic diagram of the equivalent phase center of the 2D MIMO antenna array of FIG. 3a.
  • FIG. 4 shows a schematic structural diagram of a 2D MIMO antenna array according to another embodiment of the present disclosure.
  • FIG. 5 shows a schematic structural diagram of a 2D MIMO antenna array according to another embodiment of the present disclosure.
  • FIG. 6 shows a schematic structural diagram of a 2D MIMO antenna array according to another embodiment of the present disclosure.
  • FIG. 7 shows a schematic structural diagram of a 2D MIMO antenna array according to another embodiment of the present disclosure.
  • FIG. 8a shows a schematic structural diagram of a 2D MIMO antenna array according to another embodiment of the present disclosure.
  • FIG. 8b shows a schematic diagram of the equivalent phase center of the 2D MIMO antenna array of FIG. 8a.
  • FIG. 9a shows a schematic structural diagram of a 2D MIMO antenna array according to another embodiment of the present disclosure.
  • FIG. 9b shows a schematic diagram of the equivalent phase center of the 2D MIMO antenna array of FIG. 9a.
  • FIG. 10 shows a schematic diagram of a scanning route combining mechanical scanning and electronic scanning of a security inspection device according to an embodiment of the present disclosure.
  • FIG. 11 shows a schematic flowchart of a control method of a security inspection device according to an embodiment of the present disclosure.
  • FIG. 12 shows a schematic flowchart of a control method of a security inspection device according to another embodiment of the present disclosure.
  • FIG. 1a shows a schematic structural diagram of a security inspection device according to an embodiment of the present disclosure.
  • Figure 1b shows a schematic circuit diagram of the security device of Figure 1a.
  • the security inspection device 100 includes a device body 10, a two-dimensional multiple-output multiple-input (2D MIMO, 2-Demensional Multiple-Input Multiple-Output) device 20 and a processor 30.
  • 2D MIMO two-dimensional multiple-output multiple-input
  • 2D MIMO 2-Demensional Multiple-Input Multiple-Output
  • a detection space 11 is provided on the device body 10, and the detection space 11 is used for accommodating the object to be tested 12.
  • the detection space 11 may be configured as a groove structure as shown in FIG. 1a, having a first side wall 111 and a second side wall 112 parallel to each other and a third side wall perpendicular to the first side wall 111 and the second side wall 112 113.
  • a 2D MIMO device 20 can be installed on the first side wall 111, and the object to be tested 12 can be placed on the second side wall 112.
  • the security inspection device 100 can be applied to small mail such as letters, registered parcels, etc.
  • the structure and size of the detection space 11 can be set according to the outer shape and size of the small mail, for example, the first side wall 111 and
  • the distance between the second side wall 112 is set in the range of 20cm-100cm, for example, it can be set to about 30cm, which can basically accommodate most of the small mails at present, and at the same time ensure that there is enough between the 2D MIMO device 20 and the object 12 to be tested Imaging distance.
  • the embodiments of the present disclosure are not limited to this, the structure and size of the device body 10 and the detection space 11 can be selected according to needs, for example, the detection space 11 can be configured as a tunnel structure, a combination of a tray and a top plate, or any other suitable structure, The size of the detection space 11 can be adjusted according to the type of the object to be tested.
  • the 2D MIMO device 20 is provided in the detection space 11.
  • the 2D MIMO device 20 can send a detection signal to the object to be tested 12 and receive an echo signal from the object to be tested.
  • the 2D MIMO device 20 includes a 2D MIMO antenna array 21 and a control circuit 22.
  • the 2D MIMO antenna array 21 is provided in the detection space 10, for example, on the first side wall 111 of the detection space 10 in the example of FIG.
  • the object under test 12 sends a detection signal, and the echo signal generated after the detection signal passes through the object under test 12 is received by the 2D MIMO antenna array 21.
  • the control circuit 22 may be located in the device body 10, or may be set in other suitable positions as needed.
  • the control circuit 22 is connected to the 2D MIMO antenna array 21, and controls the 2D MIMO antenna array 21 to transmit a detection signal and receive an echo signal.
  • the detection signal may be an electromagnetic wave, such as a millimeter wave, specifically a millimeter wave terahertz wave.
  • the 2D MIMO device 20 may be implemented by a 76-81 GHz chip, which has the advantages of high array integration and low cost.
  • the processor 30 is connected to the 2D MIMO device 20.
  • the processor 30 reconstructs the image of the item to be measured according to the received echo signal.
  • the detection signal for example, millimeter wave
  • the detection signal transmitted by the transmitting antenna in the 2D MIMO antenna array 21 to the object under test 12 can penetrate the contents of the object under test 12 after reaching the object under test 12, thereby generating an echo signal, an echo signal Received by the receiving antenna in the 2D MIMO antenna array 21.
  • the processor 30 can reconstruct the image of the item to be tested by processing the received echo signal, and the image contains information related to the content of the item to be tested 12. Based on the shape, density, etc.
  • the staff can determine whether it may contain dangerous goods, so as to further unpack the inspection, thereby improving the detection efficiency and detection accuracy.
  • the item 12 to be tested in FIG. 1a is shown as a letter containing prohibited seeds.
  • the reconstructed image is displayed on the display device 50
  • the image shows the information related to the content of the letter, such as outline, density, etc., and the staff can judge whether it is a prohibited seed based on this.
  • the processor 30 may be a digital signal processor (DSP).
  • the security inspection device may further include an analog signal processor and a digital-to-analog converter (D/A converter) to cooperate with the digital signal processor to perform image reconstruction.
  • examples of the processor 30 include, but are not limited to, CPU, GPU, micro control unit (MCU), field programmable gate array FPGA, application specific integrated circuit ASIC.
  • the security device may further include a memory, which may be used to store information related to image reconstruction, such as data and programs related to image reconstruction.
  • the security inspection device 100 may further include a back plate 40 that is disposed in the detection space 11 and is located below the item to be tested 12, including but not limited to a metal plate or a plate with a metal coating
  • the metal includes but is not limited to aluminum.
  • the security inspection device 100 may further include a display device 50.
  • the display device 50 is connected to the processor 30 and is used to present the reconstructed image of the object to be tested to the user.
  • the display device 50 may include various suitable types of displays, so that the inspector can observe the reconstructed image of the test object through the display to determine whether the test object may contain dangerous goods.
  • the processor 30 may also determine whether the item to be tested may contain dangerous goods based on a preset standard according to the reconstructed image of the item to be tested. For example, feature templates of dangerous goods such as prohibited seeds, drugs, and foreign pests can be stored in advance, and the reconstructed image can be compared with the template to determine whether the test object may contain dangerous goods, and further determine the possible content. The type and quantity of dangerous goods and the probability of containing such dangerous goods, etc.
  • the processor 30 After the processor 30 detects that the object to be tested 12 contains dangerous goods, it can control the display device 50 to present prompt information, for example, the prompt information can indicate the type of dangerous goods, the probability of containing the dangerous goods, etc., to help the staff make Further judgment, if necessary, open the package inspection.
  • the prompt information can indicate the type of dangerous goods, the probability of containing the dangerous goods, etc., to help the staff make Further judgment, if necessary, open the package inspection.
  • the security inspection device 100 may further include an alarm device 60 (as shown in FIG. 1b ), and the processor 30 may control the alarm device 60 to alarm after detecting that the object to be tested 12 may contain dangerous goods.
  • the alarm device 60 can be implemented in various forms, including but not limited to devices such as speakers, vibrators, alarms, etc., that issue alarms through audio, vibration, and various other means. You can also set the alarm level. For example, when the probability of containing dangerous goods is low, you can use low-volume sound or weak vibration to alarm. When the probability of containing dangerous goods is high, you can use high-volume sound or Strong vibration to alarm.
  • FIG. 2a shows a schematic structural diagram of a security inspection device according to another embodiment of the present disclosure.
  • Fig. 2b shows a schematic circuit diagram of the security inspection device of Fig. 2a.
  • the security inspection equipment of FIGS. 2a and 2b (hereinafter referred to as FIG. 2) is similar to the security inspection equipment of FIG. 1, except that the security inspection equipment of FIG. 2 further includes a transmission device 70.
  • the differences are mainly described in detail below.
  • the conveying device 70 passes through the detection space 11 and can convey the object to be tested so that the object to be tested enters or leaves the detection space 11.
  • the conveying device 70 may include a conveying belt 71 and a conveying control part 72 (not shown in the figure).
  • the transmission control part 72 may control the conveyor belt 71 to transmit according to a preset manner, or may control the conveyor belt 71 to transmit under the control of the processor 30, so that the time that the object to be tested 12 stays under the 2D MIMO device 20 allows the 2D MIMO device 20 Complete the scan.
  • the transmission method can be selected according to needs, for example, it can be set to transmit at a preset speed, or it can be set to stay for a preset time whenever the item to be tested 12 is transferred below the 2D MIMO device 20, and so on.
  • the security inspection device of FIG. 2 may further include a lifting device 80.
  • the lifting device 80 may be installed on the device body 10.
  • a lifting space 13 may be provided on the device body 10, and the lifting device 60 may control the 2D MIMO device 20 (specifically, the 2D MIMO antenna array 21 in the 2D MIMO device 20) to move away or approach within the lifting space 13 The object 12 to be measured, thereby adjusting the imaging distance.
  • the lifting space 13 of FIG. 2 is only schematic, and can be set according to needs in actual applications, for example, it can be a virtual space defined by the lifting height of the lifting device 60, or it can be a solid The physical space defined by the frame.
  • the lifting device 80 can be controlled to adjust the distance between the 2D MIMO antenna array 21 and the test object 12 according to the characteristics such as the size and shape of the test object 12. For example, when the height of the object under test falls within the first threshold range, it is determined that the object under test belongs to a letter-type object, thereby adjusting the distance between the 2D MIMO antenna array 21 and the object under test 12 so that the imaging distance is 10cm-40cm; When the height of the item to be tested falls within the second threshold range, it is determined that the item to be tested belongs to a small express package, thereby adjusting the distance between the 2D MIMO antenna array 21 and the item to be tested 12 so that the imaging distance is 20-100 cm.
  • the lifting device 80 may be manually controlled by a worker, or may be automatically controlled.
  • the lifting device 80 may include a track, a slider, a connector, etc., and the 2D MIMO antenna array 21 may be installed on the slider through a fixing member, so as to be slidable along the slideway.
  • the lifting device 80 may include a motor, such as a stepper motor.
  • the lifting device 80 may automatically adjust the imaging distance in a preset manner, or may adjust the imaging distance under the control of the processor 30.
  • a sensor may be used to measure the height of the object 12 to be measured, and the processor 30 controls the lifting device 80 to adjust the imaging distance based on the height of the object 12 to be measured.
  • the security inspection device of FIG. 2 may further include a translation device 90.
  • the translation device 90 may be installed on the device body 10.
  • the translation device 90 may translate the 2D MIMO antenna array 21 in the plane where the 2D MIMO antenna array 21 is located.
  • the translation device 90 may translate the 2D MIMO antenna array 21 according to a preset path and speed, so that whenever the 2D MIMO antenna array 21 completes the scanning task (ie, whenever all the transmit antennas in the 2D MIMO antenna array 21 complete detection The signal is transmitted, and the receiving antenna completes the reception of the echo signal), the 2D MIMO antenna array 21 is translated to the next position, so that the 2D MIMO antenna array 21 restarts the next round of scanning, and so on, so that a 2D can be used
  • the MIMO antenna array 21 achieves the scanning effect of multiple 2D MIMO antenna arrays 21, which saves costs and simplifies the system structure.
  • the translation device 90 may include a track, a motor, a connector, a slider, a control circuit, and the like, and the 2D MIMO antenna array 21 may be installed on the slider through the connector to allow the motor to move along the track mobile.
  • the arrangement of the 2D MIMO antenna array 21 will be described below with reference to FIGS. 3 to 9.
  • the 2D MIMO antenna array 21 may include a plurality of transmission antennas and a plurality of reception antennas arranged in an array, and the transmission antennas and the reception antennas may be installed on the substrate and arranged in various forms as required.
  • the 2D MIMO antenna array 21 may include at least one sub-array (represented by a dotted frame in the figure), and each sub-array includes a plurality of transmitting antennas Tx arranged along the first direction and along the first direction.
  • a plurality of receiving antennas Rx arranged in the second direction at a preset angle, the transmitting antenna Tx and/or the receiving antenna Rx between adjacent sub-arrays are common.
  • the size of each sub-array can be determined according to the tolerable error using the equivalent phase center, which is related to the imaging distance (detection distance).
  • the antenna spacing in the sub-array can be one wavelength, and the interval between the generated equivalent phase centers can be half a wavelength. .
  • the size of the 2D MIMO antenna array 21 can be designed to be the same as the imaging area, or slightly smaller or slightly larger than the imaging area, in order to ensure that the image of the object to be measured can be correctly reconstructed, for example, the side length of the 2D MIMO antenna array 21 can be in the range of 15cm-50cm Inside.
  • the imaging distance can be set within the range of 2cm-100cm. According to an embodiment of the present disclosure, the imaging distance may be adjusted according to the height of the object to be measured.
  • FIG. 3a and 3b respectively show a structural schematic diagram and an equivalent phase center schematic diagram of a 2D MIMO antenna array according to an embodiment of the present disclosure.
  • the 2D MIMO antenna array 21 includes a sub-array including two rows of transmitting antennas Tx arranged in the horizontal direction and two columns of receiving antennas Rx arranged in the vertical direction, two rows of transmitting antennas Tx and two columns
  • the receiving antenna Rx forms a rectangular pattern.
  • the size of the 2D MIMO array 21 may be 20 cm ⁇ 20 cm, and the number of the transmit antenna Tx and the receive antenna Rx are 96 and 96, respectively.
  • the equivalent position of the transmitted and received signals can be represented by the phase center of the antenna, which is the physical center of two independent antennas or apertures.
  • one transmitting antenna Tx corresponds to multiple receiving antennas Rx.
  • the receiving antenna Rx and the transmitting antenna Tx are set not to be in the same position, such a system where the transmitting and receiving antennas are spatially separated can Using a virtual system simulation, in the virtual system, a virtual position is added between each group of transmitting antenna Tx and receiving antenna Rx, and this position is called the equivalent phase center.
  • the echo data collected by the transceiver antenna combination can be equivalent to the echo collected by the spontaneous and self-receiving antenna at the position of the equivalent phase center.
  • FIG. 4 shows a schematic structural diagram of a 2D MIMO antenna array 21 according to another embodiment of the present disclosure.
  • the 2D MIMO antenna array 21 includes 2 ⁇ 2 sub-arrays, and the size of each sub-array is set to 10cm ⁇ 10cm.
  • the overall size of the 2D MIMO antenna array 21 is 20cm ⁇ 20cm.
  • the transmit antenna Tx and the receive antenna Rx The numbers are 141 and 141, respectively.
  • FIG. 5 shows a schematic structural diagram of a 2D MIMO antenna array 21 according to another embodiment of the present disclosure.
  • the 2D MIMO antenna array 21 includes 3 ⁇ 3 sub-arrays, and the size of each sub-array is 8cm ⁇ 8cm, the overall size of the 2D MIMO antenna array 21 is 24cm ⁇ 24cm, and the number of the transmit antenna Tx and the receive antenna Rx Respectively 224, 224.
  • FIG. 6 shows a schematic structural diagram of a 2D MIMO antenna array 21 according to another embodiment of the present disclosure.
  • the 2D MIMO antenna array 21 may include 2 ⁇ 3 sub-arrays, and the size of each sub-array is 10 cm ⁇ 10 cm.
  • the overall size of the 2D MIMO antenna array 21 is 20 cm ⁇ 30 cm.
  • the transmit antenna Tx and the receive antenna Rx The numbers are 188 and 213 respectively.
  • FIG. 7 shows a schematic structural diagram of a 2D MIMO antenna array 21 according to another embodiment of the present disclosure.
  • the 2D MIMO antenna array 21 includes 2 ⁇ 4 sub-arrays, and the size of each sub-array is 10cm ⁇ 10cm.
  • the overall size of the 2D MIMO antenna array 21 is 20cm ⁇ 40cm, the number of transmitting antenna Tx and receiving antenna Rx They are 285 and 235 respectively.
  • the 2D MIMO device 21 can also be implemented by MIMO circuits of other frequencies in the range of 10 GHz-300 GHz.
  • the side length of the antenna area array can be selected to be 15cm-50cm, preferably 20cm-40cm.
  • Table 1 shows the number of transmitting antennas Tx and receiving antennas Rx under different frequency bands for two different sub-array sizes when the total size of the 2D MIMO antenna array 21 is 30 cm ⁇ 30 cm, where * represents the center frequency.
  • the number of transmit antennas is 26 and the number of receive antennas is 26
  • the size of the subarray is 15cm ⁇ 15cm, then for the detection signal in the 10GHz-20GHz frequency band, the number of transmitting antennas is 36, the number of receiving antennas is 36, and so on.
  • FIG. 8a shows a schematic structural diagram of a 2D MIMO antenna array 21 according to another embodiment of the present disclosure.
  • FIG. 8b shows a schematic diagram of the equivalent phase center of the 2D MIMO antenna array of FIG. 8a.
  • the 2D MIMO antenna array 21 includes a sub-array including a row of transmitting antennas Tx arranged in the horizontal direction and a row of receiving antennas Rx arranged in the vertical direction, the row of transmitting antennas Tx and the row of receiving antennas Rx Cross to form a cross-shaped pattern.
  • the equivalent phase centers of the 2D MIMO antenna array of FIG. 8a are distributed in the form of an array at the center of the cross-shaped pattern.
  • FIG. 9a shows a schematic structural diagram of a 2D MIMO antenna array 21 according to another embodiment of the present disclosure.
  • 9b shows a schematic diagram of the equivalent phase center of the 2D MIMO antenna array of FIG. 9a.
  • the 2D MIMO antenna array 21 includes a sub-array including a row of transmitting antennas T arranged along the first diagonal direction of the array and a row arranged along the second diagonal direction of the array The receiving antenna R, the row of transmitting antennas T and the row of receiving antennas R intersect, thereby forming a diagonal cross pattern on the panel.
  • the equivalent phase center of FIG. 9b is rotated 45 degrees relative to the equivalent phase center of FIG. 8b (either clockwise or counterclockwise). This is because the 2D MIMO antenna array of FIG. 9a is relative to FIG. 8a.
  • the 2D MIMO antenna array is rotated 45 degrees.
  • the structure of the 2D MIMO antenna array 21 of the present disclosure is not limited to this.
  • the size of the sub-array, the size of the array, the arrangement of the antennas in the sub-array, and the number of antennas can be determined as needed Adjustment.
  • the 2D MIMO antenna array 21 may be controlled by electronic scanning, or the 2D MIMO antenna array 21 may be controlled by combining electronic scanning and mechanical scanning.
  • the control circuit 22 can control the transmitting antenna Tx in a sub-array of the 2D MIMO antenna array 21 to transmit sequentially, the receiving antenna Rx is all received, and then switch the next transmitting antenna Tx, and repeat the operation until the whole is completed
  • the antenna array scans to obtain all scattering data of the object under different viewing angles.
  • Electronic scanning has the advantage of fast detection speed, combined with the three-dimensional holographic algorithm algorithm based on fast Fourier transform (FFT), real-time imaging can be achieved.
  • FFT fast Fourier transform
  • the control circuit 22 can control the 2D MIMO antenna array 21 to complete the above electronic scanning, and then the translation device 90 translates the 2D MIMO antenna array 21 to the next position, and the control circuit 22 controls the 2D MIMO antenna
  • the array 21 repeats the foregoing electronic scanning until the translation device 90 completes the translation of the preset path. For example, by shifting the 2D MIMO antenna array 21 of FIG. 3 according to the shape of a zigzag, the detection effect of the MIMO antenna array 21 of FIG. 42D can be achieved, so that the detection of four sub-arrays is completed with one sub-array, saving costs and simplifying the antenna structure .
  • FIG. 10 shows a schematic diagram of a scanning route combining mechanical scanning and electronic scanning of a security inspection device according to an embodiment of the present disclosure.
  • a 5cm*5cm sub-array is used to mechanically scan a 30cm*30cm area array.
  • the 5cm*5cm sub-array completes the scanning work (that is, the transmitting antennas in the sub-array all complete the detection signal Transmit and receive the antenna to complete the reception of the echo signal)
  • the 5cm*5cm sub-array is translated to the next position according to the route shown by the arrow in the figure, until the 5cm*5cm sub-array is scanned at all positions.
  • a 5cm*5cm sub-array is used to achieve the scanning effect of 30cm*30cm area array.
  • FIG. 11 shows a schematic flowchart of a control method of a security inspection device according to an embodiment of the present disclosure.
  • the 2D MIMO device is controlled to send a detection signal to the object under test, and receive an echo signal from the object under test.
  • the control circuit 22 can be used to control the 2D MIMO antenna array 21 to transmit a detection signal to the object to be tested 12 oppositely and receive an echo signal.
  • the detection signal may be an electromagnetic wave, such as a millimeter wave, specifically a millimeter wave terahertz wave. After the detection signal reaches the object to be tested 12, it will pass through the object to be tested 12, thereby generating an echo signal, and the echo signal carries information related to the contents of the object to be tested 12.
  • the 2D MIMO device can be controlled by electronic scanning or a combination of electronic scanning and mechanical scanning, so as to obtain scattering data of various angles of view of the object to be measured.
  • step S102 the image of the item to be tested is reconstructed according to the received echo signal.
  • a whole system reconstruction algorithm or a backward projection algorithm can be used to reconstruct the image of the item to be measured.
  • the holographic reconstruction algorithm can realize the real-time reconstruction of the image of the object to be tested. After completing data collection based on the received echo signal, correct the scattering coefficient matrix using the following formula to obtain the corrected scattering coefficient matrix:
  • s(n x , n y ) is the reflection coefficient matrix, n x and n y are the indexes of the rows and columns of the equivalent phase center;
  • a reference point representing the center of the imaging area j represents an imaginary number
  • k represents a spatial constant
  • R u (n x , n y ) represents the reflection set calculated when the object to be tested is sampled.
  • the object to be tested contains a Point scatterer.
  • R o (n x , n y ) represents the reflection set calculated in the case of sampling in the equivalent phase of the multi-reception and multi-transmission aperture.
  • I (x, y) represents the scattering coefficient of the object to be tested
  • z 0 represents the distance between the 2D MIMO array panel and the object to be tested
  • j represents the imaginary number
  • k is the propagation constant
  • k x , k y are the spatial propagation Constant
  • FFT 2D means two-dimensional Fourier transform
  • IFFT 2D means two-dimensional inverse Fourier transform.
  • Backprojection algorithm originated from computer tomography technology, is an accurate imaging algorithm based on time-domain signal processing.
  • the basic idea of the backward projection algorithm is to calculate the delay between this point and the receiving and transmitting antennas for each imaging point in the imaging area, and coherently superimpose the contributions of all echoes to it to obtain the corresponding point in the image.
  • the backward projection algorithm is easy to implement parallel operations, such as the use of GPU and FPGA technology, the reconstruction time can be greatly reduced.
  • the reconstruction formula can be expressed as,
  • z a is the imaging distance
  • j is the imaginary unit
  • k is the propagation constant
  • s(x t , y t , x r , y r , k) is a pair of transmitting antenna-receiving antenna combination receiving
  • the echo signal to the item to be tested (x t , y t ) is the coordinates of the transmitting antenna, (x r , y r ) is the coordinates of the receiving antenna,
  • z represents the gap between the 2D MIMO array panel and a certain fault of the item distance.
  • FIG. 12 shows a schematic flowchart of a control method of a security inspection device according to another embodiment of the present disclosure.
  • step S201 the height of the object to be measured is detected.
  • a sensor provided on a security inspection device may be used to automatically detect the height of the object to be measured, and of course, the height of the object to be tested may also be detected through other methods, such as manual methods.
  • step S202 the distance between the 2D MIMO device and the object to be measured is adjusted.
  • the imaging distance between the 2D MIMO antenna array 21 and the object to be tested 12 can be adjusted to 10cm-40cm; when the height of the object to be tested is large, such as small
  • the imaging distance between the 2D MIMO antenna array 21 and the item to be tested 12 can be adjusted from 20 cm to 100 cm.
  • step S203 the 2D MIMO device is controlled to send a detection signal to the object under test and receive an echo signal from the object under test.
  • a scanning method combining electronic scanning and mechanical scanning is adopted.
  • the 2D MIMO device performs electronic scanning at the current position.
  • step S204 it is judged whether the 2D MIMO device has finished scanning. If it is, it means that the scanning of the current position is completed, and the process proceeds to step S205 to pan to the next position, otherwise it returns to step S203 to continue the scanning of the current position.
  • step S205 it is judged whether the translation path is completed. If it is, it means that the 2D MIMO device has finished scanning all the positions on the path. Therefore, the scanning of the current object to be tested is completed, and the process proceeds to step S206 for image reconstruction, otherwise step S207 is executed Pan to the next position to scan.
  • step S206 the obtained echo signal is used to reconstruct the image of the object to be measured.
  • the reconstruction algorithm includes, but is not limited to, the above-mentioned whole-system reconstruction algorithm and backward projection algorithm.
  • step S207 the 2D MIMO device is translated, and the process returns to step S203 to perform scanning detection again at a new position.
  • the translation can be performed according to a preset path, for example, as shown in FIG. 10, each time a translation step is performed until the translation reaches the last position on the path.
  • steps S208 to 209 can also be performed after step S206.
  • step S208 the reconstructed image of the object to be tested is analyzed to determine whether the object to be tested may contain dangerous goods. If so, step S209 is executed, otherwise the safety detection of the current object to be tested is ended.
  • the reconstructed image of the object to be tested can be compared with a pre-stored template. If the degree of matching with the characteristic template of a certain dangerous product is greater than a preset threshold, it is determined that it may contain the dangerous product, otherwise it is determined that it does not contain a dangerous product Goods.
  • the probability of containing dangerous goods may also be determined according to the degree of matching. For example, a higher matching degree indicates a higher probability of containing dangerous goods, and a lower matching degree indicates a lower probability of containing dangerous goods.
  • step S209 the alarm device is controlled to make an alarm.
  • Alarm methods include but are not limited to screen display, audio alarm, vibration alarm and so on. You can also set the alarm level. For example, when the probability of containing dangerous goods is low, you can use low-volume sound or weak vibration to alarm. When the probability of containing dangerous goods is high, you can use high-volume sound or Strong vibration to alarm.
  • the image of the test object reconstructed in step S206 and/or the judgment result in step S208 may also be presented to the user.
  • the reconstructed image may be displayed on the display screen after the image reconstructed in step S206, After step S208, the judgment result of step S208 is also presented on the display screen; after the comparison in step S208 is completed, the image reconstructed in step S206 and the judgment result of step S208 can also be presented on the display screen.
  • the presentation method of the determination result of step S208 (for example, what kind of dangerous goods may be contained and the probability of containing the dangerous goods) can be selected according to need.
  • the judgment result can be played in the form of voice, or the alarm volume of the alarm can be used to indicate the judgment result.
  • a high-volume alarm indicates that the possibility of containing dangerous goods is high, low The volume alarm indicates a low probability of containing dangerous goods.
  • Embodiments of the present disclosure also provide a computer-readable medium that stores instructions stored in the computer-readable medium, which when executed by the processor, causes the processor to perform the control method of the security inspection device described above.
  • the embodiments of the present disclosure can use 2D MIMO devices for scanning detection in security inspection equipment, which can realize automatic security inspection of small mail such as letters and registered parcels, which can be improved compared to traditional manual inspection and X-ray machine inspection. Security inspection efficiency and accuracy.
  • the embodiments of the present disclosure can flexibly select 2D MIMO antenna arrays of various structures according to needs, and have high flexibility in use.
  • millimeter wave as the detection signal, it can penetrate the object to be imaged, thereby replacing the X-ray machine to achieve the purpose of safety detection, while providing higher detection quality and higher safety.
  • the embodiment of the present disclosure can reflect the detection signal passing through the test object back to the 2D MIMO device by providing a back plate under the test object, thereby enhancing the contrast between the echo signal from the test object and other echo signals, thereby Improve detection accuracy.
  • the embodiments of the present disclosure can adjust the imaging distance according to the height of the object to be measured, thereby finding the optimal imaging distance and achieving high-resolution imaging. In some cases, a sufficiently small imaging distance can even achieve a quarter of the resolution.
  • the security inspection device of the embodiment of the present disclosure may be provided with a simplified structure without a transmission device, or may be provided with a quick inspection structure with a transmission device, under which the object to be measured can be placed in the imaging space by hand or in other ways, It can flexibly change angle and orientation imaging.
  • the conveying device automatically conveys the object to be tested, and can also use the lifting device to automatically adjust the imaging distance, thereby realizing real-time, batch, and automatic detection and improving the detection efficiency.
  • the embodiments of the present disclosure support a full electronic scanning method and a scanning method combining electronic scanning and mechanical scanning.
  • the full electronic scanning method has fast scanning speed, and combined with the three-dimensional holographic algorithm algorithm based on fast Fourier transform (FFT), real-time imaging can be realized.
  • FFT fast Fourier transform
  • the scanning method combining the electronic scanning and the mechanical scanning can realize the scanning of a larger imaging area with a smaller antenna array, which saves cost and has a simple structure.
  • the embodiments of the present disclosure can provide automated threat detection by automatically analyzing the reconstructed image of the object to be tested, which greatly improves the detection efficiency and reduces the missed detection rate compared to the traditional method.
  • the security inspection device of the embodiments of the present disclosure is simple in structure, light, strong, small in size, high in sensitivity, easy to carry, can be installed in offices, transceiver rooms and other places, and is safer to the human body than traditional X-ray machines.

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Abstract

一种安检设备（100）及其控制方法，安检设备（100）包括：设备本体（10），设备本体（10）上设置有检测空间（11），检测空间（11）被配置为容纳待测物品（12）；二维(2D)多发多收(MIMO)装置（20），设置在检测空间（11）中，并且被配置为向待测物品（12）发送检测信号，并接收来自待测物品（12）的回波信号；处理器（30），与二维(2D)多发多收(MIMO)装置（20）相连，并且被配置为根据接收到的回波信号来重建待测物品（12）的图像。

Description

安检设备及其控制方法
本申请要求于2018年12月29日提交的、申请号为201811654207.5的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及安全检测技术领域，具体涉及一种安检设备及其控制方法。
背景技术
目前，对诸如信函和挂号小包之类的小型邮件，绝大多数邮检机构仅靠人工进行查验，但人工查验只能凭借面单上简要的信息、包裹的重量、来自国家和地区等要素，根据检验人员的经验抽样开拆包检查，而人工查验因为会受到各种人为因素限制，工作效率和检测准确性都较低。部分邮检机构也会抽取部分小型邮件过X光机检查，但过机成像效果较差。小型邮件数量大，上述传统查验方式导致漏检现象较多，给检验检疫工作带来隐患。
发明内容
根据本公开的一个方面，提供了一种安检设备，包括：设备本体，所述设备本体上设置有检测空间，所述检测空间被配置为容纳待测物品；2D MIMO装置，即二维多发多收装置，设置在所述检测空间中，并且被配置为向待测物品发送检测信号，并接收来自待测物品的回波信号；以及处理器，与所述2D MIMO装置相连，并且被配置为根据接收到的回波信号来重建待测物品的图像。
在一些实施例中，所述2D MIMO装置包括：2D MIMO天线阵列，设置在所述检测空间中，包括至少一个子阵，每个子阵包括沿第一方向排列的多个发射天线和沿着与第一方向成预设角度的第二方向排列的多个接收天线，所述多个发射天线中的每个发射天线和所述多个接收天线中的相应一个接收天线的连线的中点作为一个等效相位中心，所述多个发射天线和所述多个接收天线被布置为使得等效相位中心排列成二维阵列；以及控制电路，被配置为控制所述多个发射天线按照预设顺序发射所述检测信号，以及控制所述多个接收天线接收所述回波信号。
在一些实施例中，所述预设角度为90度，每个子阵包括沿着第一方向排列的两行发射天线和沿着第二方向排列的两列接收天线，所述两行发射天线与两列接收天线形成矩形图案。
在一些实施例中，所述预设角度为90度，所述子阵的数目为1，该子阵包括沿着第一方向排列的一行发射天线和沿着第二方向排列的一列接收天线，所述行和列交叉形成十字形状。
在一些实施例中，所述安检设备还包括：平移装置，安装在所述设备本体上，并且被配置为在所述2D MIMO天线阵列所在的平面内平移所述2D MIMO天线阵列。
在一些实施例中，所述安检设备还包括：升降装置，安装在所述设备本体上，并且被配置为控制所述2D MIMO天线阵列远离或靠近所述待测物品。
在一些实施例中，所述安检设备还包括：背板，所述背板设置在检测空间中，位于待测物品下方，并且被配置为将穿过待测物品到达所述背板的检测信号反射回所述2D MIMO装置。
在一些实施例中，所述背板包括金属板或具有金属涂层的板状物。
在一些实施例中，所述检测空间设置成凹槽结构，具有彼此平行的第一侧壁和第二侧壁以及与第一侧壁和第二侧壁垂直的第三侧壁，所述2D MIMO装置位于所述第一侧壁上，所述第二侧壁用于放置待测物品。
在一些实施例中，所述安检设备还包括：传送装置，设置成穿过所述检测空间，并且被配置为传送待测物品以使待测物品进入或离开所述检测空间。
在一些实施例中，所述安检设备还包括：显示装置，与所述处理器相连，并且被配置为向用户呈现所重建的待测物品的图像。
在一些实施例中，所述安检设备还包括报警装置，所述处理器还并且被配置为根据所重建的待测物品的图像基于预设的标准来判断待测物品是否可能含有危险品，如果是，则控制所述报警装置进行报警。
在一些实施例中，所述检测信号为毫米波。
根据本公开的另一方面，提供了一种上述安检设备的控制方法，包括：控制所述2D MIMO装置向待测物品发送检测信号，并接收来自待测物品的回波信号；以及根据接收到的回波信号来重建待测物品的图像。
在一些实施例中，所述重建待测物品的图像包括基于全息重建算法或后向投影算法来重建待测物品的图像。
附图说明
图1a示出了根据本公开一实施例的安检设备的结构示意图。
图1b示出了图1a的安检设备的示意电路图。
图2a示出了根据本公开另一实施例的安检设备的结构示意图。
图2b示出了图2a的安检设备的示意电路图。
图3a示出了根据本公开一实施例的2D MIMO天线阵列的结构示意图。
图3b示出了图3a的2D MIMO天线阵列的等效相位中心的示意图。
图4示出了根据本公开另一实施例的2D MIMO天线阵列的结构示意图。
图5示出了根据本公开另一实施例的2D MIMO天线阵列的结构示意图。
图6示出了根据本公开另一实施例的2D MIMO天线阵列的结构示意图。
图7示出了根据本公开另一实施例的2D MIMO天线阵列的结构示意图。
图8a示出了根据本公开另一实施例的2D MIMO天线阵列的结构示意图。
图8b示出了图8a的2D MIMO天线阵列的等效相位中心的示意图。
图9a示出了根据本公开另一实施例的2D MIMO天线阵列的结构示意图。
图9b示出了图9a的2D MIMO天线阵列的等效相位中心的示意图。
图10示出了根据本公开实施例的安检设备的机械扫描与电子扫描相结合的扫描路线示意图。
图11示出了根据本公开一实施例的安检设备的控制方法的示意流程图。
图12示出了根据本公开另一实施例的安检设备的控制方法的示意流程图。
具体实施方式
虽然将参照含有本公开的较佳实施例的附图充分描述本公开，但在此描述之前应了解本领域的普通技术人员可修改本文中所描述的公开，同时获得本公开的技术效果。因此，须了解以上的描述对本领域的普通技术人员而言为一广泛的揭示，且其内容不在于限制本公开所描述的示例性实施例。
另外，在下面的详细描述中，为便于解释，阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地，一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下，公知的结构和装置以图示的方式体现以简化附图。
图1a示出了根据本公开一实施例的安检设备的结构示意图。图1b示出了图1a的安 检设备的示意电路图。如图1a和1b(以下简称图1)所示，安检设备100包括设备本体10、二维多发多收(2D MIMO，2-Demensional Multiple-Input Multiple-Output)装置20和处理器30。
设备本体10上设置有检测空间11，所述检测空间11用于容纳待测物品12。检测空间11可以设置成如图1a所示的凹槽结构，具有彼此平行的第一侧壁111和第二侧壁112以及与第一侧壁111和第二侧壁112垂直的第三侧壁113。第一侧壁111上可以安装2D MIMO装置20，第二侧壁112上可以放置待测物品12。在本实施例中，安检设备100可以应用于诸如信函、挂号小包之类的小型邮件，检测空间11的结构和尺寸可以根据小型邮件的外形和尺寸来设置，例如可以将第一侧壁111和第二侧壁112之间的距离设置成在20cm-100cm范围内，例如可以设置成约30cm，这样基本能够容纳目前大部分小型邮件，同时确保2D MIMO装置20与待测物品12之间具有足够的成像距离。然而本公开的实施例不限于此，设备本体10与检测空间11的结构和尺寸可以根据需要来选择，例如检测空间11可以设置成隧道结构、托盘和顶板组合的结构或者任何其他合适的结构，检测空间11的尺寸可以根据待测物品的类型而有所调整。
2D MIMO装置20设置在检测空间11中。2D MIMO装置20可以向待测物品12发送检测信号，并接收来自待测物品的回波信号。2D MIMO装置20包括2D MIMO天线阵列21和控制电路22。2D MIMO天线阵列21设置在检测空间10中，例如在图1a的示例中设置在检测空间10的第一侧壁111上，从而向对面的待测物品12发送检测信号，检测信号经过待测物品12后产生的回波信号被2D MIMO天线阵列21接收。控制电路22可以位于设备本体10中，也可以根据需要设置在其他合适的位置，控制电路22与2D MIMO天线阵列21相连，控制2D MIMO天线阵列21发射检测信号并接收回波信号。检测信号可以是电磁波，例如毫米波，具体地毫米波太赫兹波。在一些实施例中，2D MIMO装置20可以由76-81GHz芯片来实现，具有阵列集成程度高、成本低等优点。
处理器30与2D MIMO装置20相连。处理器30根据接收到的回波信号来重建待测物品的图像。2D MIMO天线阵列21中的发射天线向待测物品12发射的检测信号(例如毫米波)到达待测物品12后可以穿透待测物品12中的内容物，从而产生回波信号，回波信号被2D MIMO天线阵列21中的接收天线接收。处理器30通过对接收到的回波信号进行处理，可以重建待测物品的图像，图像中包含了与待测物品12中的内容物有关的信息。工作人员根据通过基于图像中对象的形状、密度等可以判定是否可能含有危险品，从而进一步拆包检验，从而提高检测效率和检测准确度。例如，图1a中的待测 物品12被示为内含违禁种子的信函，利用2D MIMO装置20对待测物品12进行电磁波扫描并利用处理器30进行图像重建之后，在显示装置50上显示所重建的图像，图像中展示了与信函中的内容物有关的信息，例如轮廓、密度等等，工作人员可以据此来判断其是否为违禁种子。在一些实施例中，处理器30可以为数字信号处理器(DSP)。安检设备还可以包括模拟信号处理器，数模转换器(D/A转换器)以配合数字信号处理器执行图像重建。在一些实施例中，处理器30的示例包括但不限于CPU、GPU、微控制单元(MCU)、现场可编程门阵列FPGA、专用集成电路ASIC。在一些实施例中，该安检设备还可以包括存储器，存储器可以被用来存储与图像重建相关的信息，例如与图像重建相关的数据和程序。
在一些实施例中，安检设备100还可以包括背板40，所述背板40设置在检测空间11中，位于待测物品12下方，包括但不限于金属板或具有金属涂层的板状物，所述金属包括但不限于铝。检测信号到达待测物品12后，一部分会穿过待测物品12，例如在采用毫米波作为检测信号的情况下这种情形尤为明显，通过设置背板40，使得穿过待测物品12到达所述背板30的检测信号能够被再次反射回到2D MIMO装置20，总而使来自待测物品12的回波信号增强，从而提高重建图像的质量。
在一些实施例中，安检设备100还可以包括显示装置50。显示装置50与所述处理器30相连，用于向用户呈现所重建的待测物品的图像。显示装置50可以包括各种合适类型的显示器，从而使检验人员能够通过显示器观察重建的待测物品的图像来判断待测物品内是否可能含有危险品。
在一些实施例中，处理器30还可以在重建图像之后，根据所重建的待测物品的图像基于预设的标准来判断待测物品是否可能含有危险品。例如可以预先存储诸如违禁种子、毒品、外来有害生物之类的危险品的特征模板，通过将重建的图像与模板比对来判断待测物品中是否可能含有危险品，还可以进一步判断可能含有的危险品的类型、数量以及可能含有该类危险品的概率等等。处理器30在检测到待测物品12中含有危险品之后，可以控制显示装置50呈现提示信息，例如提示信息可以指示危险品的种类、含有该危险品的概率等等，以帮助工作人员做出进一步判断，必要时开包检验。
另外，安检设备100还可以包括报警装置60(如图1b所示)，处理器30可以在检测到待测物品12中可能含有危险品之后控制报警装置60进行报警。报警装置60可以采用各种形式来实现，包括但不限于诸如扬声器、振动器、警报器等通过音频、振动以及各种其他方式发出警报的装置。还可以设置报警级别，例如当含有危险品的概率较低 时，可以通过较低音量的声音或者较弱的振动来报警，当含有危险品的概率较高时，可以通过较高音量的声音或者较强的振动来报警。
图2a示出了根据本公开另一实施例的安检设备的结构示意图。图2b示出了图2a的安检设备的示意电路图。图2a和2b(以下简称图2)的安检设备与图1的安检设备类似，区别至少在于图2的安检设备还包括传送装置70。为了简明起见，下面主要对区别部分进行详细描述。
如图2a和2b所示，传送装置70穿过所述检测空间11，可以传送待测物品以使待测物品进入或离开检测空间11。例如，传送装置70可以包括传送带71和传送控制部件72(图中未示出)。传送控制部件72可以按照预设的方式来控制传送带71进行传送，也可以在处理器30的控制下控制传送带71进行传送，使得待测物品12在2D MIMO装置20下方停留的时间允许2D MIMO装置20完成扫描。传送的方式可以根据需要来选择，例如可以设置成按照预设的速度来传送，还可以设置成每当将待测物品12传送到2D MIMO装置20下方时停留预设的时间等等。
图2的安检设备还可以包括升降装置80。升降装置80可以安装在设备本体10上。例如，可以如图2a所示在设备本体10上设置升降空间13，升降装置60可以控制2D MIMO装置20(具体地2D MIMO装置20中的2D MIMO天线阵列21)在升降空间13内远离或靠近待测物品12，从而调节成像距离。本领域技术人员应清楚，图2的升降空间13仅仅是示意性的，实际应用中可以根据需要来设置，例如可以是由升降装置60的升降高度来限定的一个虚拟空间，也可以是由实体框架限定的实体空间。可以根据待测物品12的诸如尺寸、形状等特征来控制升降装置80适应性地调整2D MIMO天线阵列21与待测物品12之间的距离。例如当待测物品的高度落入第一阈值范围内时，判定待测物品属于信函类物品，从而调节2D MIMO天线阵列21与待测物品12之间的距离，使得成像距离为10cm-40cm；当待测物品的高度落入第二阈值范围内时，判定待测物品属于小件快递包裹，从而调节2D MIMO天线阵列21与待测物品12之间的距离，使得成像距离为20-100cm。升降装置80可以是工作人员手动控制的，也可以是自动控制的。例如升降装置80可以包括轨道、滑动件、连接件等，可以将2D MIMO天线阵列21通过固定件安装在滑动件上，从而沿滑道可滑动。在一些实施例中，升降装置80可以包括电机，例如步进电机。例如升降装置80可以按照预设的方式自动调整成像距离，也可以在处理器30的控制下调整成像距离。例如，例如可以利用传感器来测量待测物品12的高度，处理器30基于待测物品12的高度来控制升降装置80基调整成像距离。
图2的安检设备还可以包括平移装置90。平移装置90可以安装在所述设备本体10上。平移装置90可以在所述2D MIMO天线阵列21所在的平面内平移所述2D MIMO天线阵列21。例如，平移装置90可以按照预设的路径和速度来平移2D MIMO天线阵列21，使得每当2D MIMO天线阵列21完成扫描任务时(即，每当2D MIMO天线阵列21内的全部发射天线完成检测信号的发射，并且接收天线完成回波信号的接收)，将2D MIMO天线阵列21平移到下一个位置，使得2D MIMO天线阵列21重新开始下一轮扫描，以此类推，从而使得可以利用一个2D MIMO天线阵列21的达到多个2D MIMO天线阵列21的扫描效果，起到节省成本和简化系统结构的作用。下文将进一步对此进行详细说明。在一些实施例中，平移装置90可以包括轨道、电机、连接件、滑动件、控制电路等等，2D MIMO天线阵列21可以通过连接件安装在滑动件上，以在电机的作用下沿轨道可移动。
下面参考图3至图9来描述根据本公开实施例的2D MIMO天线阵列21的布置。2D MIMO天线阵列21可以包括布置成阵列的多个发射天线和多个接收天线，发射天线和接收天线可以安装在基板上，根据需要以多种形式来布置。根据本公开的实施例，2D MIMO天线阵列21可以包括至少一个子阵(图中由虚线框表示)，每个子阵包括沿第一方向排列的多个发射天线Tx和沿着与第一方向成预设角度的第二方向排列的多个接收天线Rx，相邻子阵之间的发射天线Tx和/或接收天线Rx是公用的。每个子阵大小可以根据采用等效相位中心的能容忍的误差决定，与成像距离(检测距离)有关，子阵中天线间隔可以为一个波长，产生的等效相位中心之间间隔可以为半波长。2D MIMO天线阵列21的尺寸可以设计成与成像区域相同，或者略小于或者略大于成像区域，以便确保能够正确重建待测物品的图像，例如2D MIMO天线阵列21的边长可以在15cm-50cm范围内。针对邮件、信函、小件快递包裹，成像距离可以设置在2cm-100cm范围内。根据本公开的实施例，成像距离可以根据待测物品的高度来调整。
图3a和3b(下文简称图3)分别示出了根据本公开一实施例的2D MIMO天线阵列的结构示意图和等效相位中心示意图。如图3a所示，2D MIMO天线阵列21包括一个子阵，该子阵包括沿水平方向排列的两行发射天线Tx和沿垂直方向排列的两列接收天线Rx，两行发射天线Tx和两列接收天线Rx形成矩形图案。图3a中，2D MIMO阵列21尺寸可以为20cm×20cm，发射天线Tx和接收天线Rx的数目分别为96、96，图中为了简明起见发射天线Tx和接收天线Rx的数目仅仅是作为示意，而非实际数目。如图3b所示，发射和接收信号的等效位置可以由天线的相位中心来表示，该等效位置为两个 独立天线或孔径的物理中心。在MIMO架构下，一个发射天线Tx对应着多个接收天线Rx，本公开的实施例中，接收天线Rx和发射天线Tx被设置为不处于同一位置，这种发射和接收天线空间分离的系统可以使用一个虚拟的系统模拟，在虚拟系统中，在每一组发射天线Tx与接收天线Rx之间添加一个虚拟位置，这个位置被称为等效相位中心。收发天线组合所采集的回波数据，可以等效为其等效相位中心所在位置自发自收天线所采集的回波。
图4示出了根据本公开另一实施例的2D MIMO天线阵列21的结构示意图。如图4所示，2D MIMO天线阵列21包括2×2个子阵，每个子阵的尺寸设置成10cm×10cm，2D MIMO天线阵列21的总体尺寸为20cm×20cm，发射天线Tx和接收天线Rx的数目分别为141、141。
图5示出了根据本公开另一实施例的2D MIMO天线阵列21的结构示意图。如图5所示，2D MIMO天线阵列21包括3×3个子阵，每个子阵的尺寸为8cm×8cm，2D MIMO天线阵列21的总体尺寸为24cm×24cm，发射天线Tx和接收天线Rx的数目分别为224、224。
图6示出了根据本公开另一实施例的2D MIMO天线阵列21的结构示意图。如图6所示，2D MIMO天线阵列21可以包括2×3个子阵，每个子阵的尺寸为10cm×10cm，2D MIMO天线阵列21的总体尺寸为20cm×30cm，发射天线Tx和接收天线Rx的数目分别为188、213。
图7示出了根据本公开另一实施例的2D MIMO天线阵列21的结构示意图。如图7所示，2D MIMO天线阵列21包括2×4个子阵，每个子阵的尺寸为10cm×10cm，2D MIMO天线阵列21的总体尺寸为20cm×40cm时，发射天线Tx和接收天线Rx数目分别为285、235。
除了采用上述的76-81GHz芯片，2D MIMO装置21也可以由10GHz-300GHz范围内的其他频率的MIMO电路来实现。天线面阵边长可选择为15cm-50cm，优选20cm-40cm。表1示出了在2D MIMO天线阵列21的总尺寸为30cm×30cm的情况下对于两种不同的子阵尺寸在不同频段下的发射天线Tx和接收天线Rx的数目，其中*表示中心频率。例如，如表1所示，对于30cm×30cm的2D MIMO天线阵列21，如果子阵尺寸为30cm×30cm，那么对于10GHz-20GHz频段的检测信号，发射天线数目为26个，接收天线数目为26个；如果子阵尺寸为15cm×15cm，那么对于10GHz-20GHz频段的检测信号，发射天线数目为36个，接收天线数目为36个，以此类推。
表1
频率/GHz 子阵尺寸30cm×30cm 子阵尺寸15cm×15cm
10-20 26+26 36+36
24-30 50+50 72+72
24-40 60+60 87+87
40-60 96+96 141+141
70-80 146+146 216+216
76-81 154+154 228+228
89-99 184+184 273+273
75-110 182+182 270+270
120* 236+236 351+351
140 276+276 411+411
170 336+336 501+501
195-205 396+396 591+591
210 416+416 621+621
220 436+436 651+651
250 496+496 741+741
270-300 566+566 846+846
图8a示出了根据本公开另一实施例的2D MIMO天线阵列21的结构示意图。图8b示出了图8a的2D MIMO天线阵列的等效相位中心的示意图。如图8a所示，2D MIMO天线阵列21包括一个子阵，该子阵包括沿水平方向排列的一行发射天线Tx和沿垂直方向排列的一列接收天线Rx，该一行发射天线Tx和一行接收天线Rx交叉形成十字形图案。如图8b所示，图8a的2D MIMO天线阵列的等效相位中心以阵列的形式分布在十字形图案的中心位置。
图9a示出了根据本公开另一实施例的2D MIMO天线阵列21的结构示意图。图9b示出了图9a的2D MIMO天线阵列的等效相位中心的示意图。如图9a所示，2D MIMO天线阵列21包括一个子阵，该子阵包括沿阵列的第一对角线方向排列的一排发射天线T和沿阵列的第二对角线方向排列的一排接收天线R，该一排发射天线T和一排接收天线R交叉，从而在面板上形成对角线形式的十字形图案。如图9b所示，图9b的等效相位 中心相对于图8b的等效相位中心旋转了45度(顺时针或者逆时针都可以)，这是因为图9a的2D MIMO天线阵列相对于是图8a的2D MIMO天线阵列旋转45度。
本领域技术人员应清楚，以上仅仅是示例，本公开的2D MIMO天线阵列21的结构不限于此，子阵的尺寸、阵列的尺寸、子阵中天线的排列方式以及天线的数目可以根据需要来调整。
在进行安全检测时，可以采用电子扫描的方式控制上述2D MIMO天线阵列21，也可以采用电子扫描与机械扫描相结合的方式控制上述2D MIMO天线阵列21。
在电子扫描的情况下，控制电路22可以控制2D MIMO天线阵列21的一个子阵中的发射天线Tx依次发射，接收天线Rx全部接收，然后切换下一个发射天线Tx，重复该操作，直到完成整个天线阵列扫描，获得被检物不同视角的所有散射数据。电子扫描具备检测速度快的优点，结合基于快速傅里叶变换(FFT)的三维全息算法算法，可以实现实时成像。
在机械扫描与电子扫描相结合的情况下，控制电路22可以控制2D MIMO天线阵列21完成上述电子扫描，然后平移装置90将2D MIMO天线阵列21平移到下一位置，控制电路22控制2D MIMO天线阵列21重复上述电子扫描，直到平移装置90完成预设路径的平移。例如采用将图3的2D MIMO天线阵列21按照田字形平移，可以达到图42D MIMO天线阵列21的检测效果，从而利用一个子阵完成了四个子阵的检测工作，节省了成本，简化了天线结构。
图10示出了根据本公开实施例的安检设备的机械扫描与电子扫描相结合的扫描路线示意图。在图10的示例中，利用一个5cm*5cm的子阵机械扫描一个30cm*30cm的面阵，每当5cm*5cm子阵完成扫描工作之后(即，子阵中的发射天线全部完成检测信号的发射并且接收天线完成回波信号的接收)，就按照图中箭头所示的路线将5cm*5cm子阵平移到下一个位置，直到5cm*5cm子阵完成全部位置的扫描。通过这种方式，利用一个5cm*5cm的子阵达到了30cm*30cm面阵的扫描效果。
图11示出了根据本公开实施例的安检设备的控制方法的示意流程图。
在步骤S101，控制2D MIMO装置向待测物品发送检测信号，并接收来自待测物品的回波信号。例如可以利用控制电路22控制2D MIMO天线阵列21向对面的待测物品12发射检测信号并接收回波信号。检测信号可以是电磁波，例如毫米波，具体地毫米波太赫兹波。检测信号到达待测物品12后会穿过待测物品12，从而产生回波信号，回波信号中承载了与待测物品12的内容物有关的信息。可以如以上描述的，以电子扫描的 方式或者电子扫描与机械扫描相结合的方式来控制2D MIMO装置，从而获得待测物品的多种不同视角的散射数据。
在步骤S102，根据接收到的回波信号来重建待测物品的图像。例如可以采用全系重建算法或后向投影算法来重建待测物品的图像。
全息重建算法可以实现对待测物品的图像的实时重建。在基于接收到的回波信号完成数据采集后，利用如下公式校正散射系数矩阵，得到校正后散射系数矩阵：
Figure PCTCN2019109367-appb-000001
其中，
s(n x，n y)为反射系数矩阵，n x和n y是等效相位中心的行和列的索引；
Figure PCTCN2019109367-appb-000002
Figure PCTCN2019109367-appb-000003
其中，
Figure PCTCN2019109367-appb-000004
表示成像区域的中心的参考点，j表示虚数，k表示空间常数。
R u(n x，n y)表示在对待测物品采样的情况下计算的反射集，待测物品包含一个定位在
Figure PCTCN2019109367-appb-000005
处的点散射体。
R o(n x，n y)表示在对多收多发孔径的等效相位中采样的情况下计算的反射集。
然后利用2D FFT算法重建，获得图像：
Figure PCTCN2019109367-appb-000006
其中，I(x，y)表示待测物品的散射系数，z 0表示2D MIMO阵列面板和待测物品之间的距离，j表示虚数，k为传播常数、k x、k y分别是空间传播常数，FFT 2D表示二维傅里叶变换，IFFT 2D表示二维傅里叶逆变换。
后向投影算法起源于计算机断层扫描技术，是一种基于时域信号处理的精确的成像算法。后向投影算法的基本思想是对成像区域内每一成像点，通过计算该点到收、发天线之间的延时，将所有回波对它的贡献相干叠加从而得到该点在图像中对应的像素值，这样对整个成像区域逐点地进行相干叠加处理，即可获得成像区域的图像。后向投影算法易于实现并行运算，如采用GPU和FPGA技术，重建时间可以大大降低。
重建公式可以表示为，
Figure PCTCN2019109367-appb-000007
Figure PCTCN2019109367-appb-000008
Figure PCTCN2019109367-appb-000009
其中，
Figure PCTCN2019109367-appb-000010
是待测物品的散射系数，z a是成像距离，j为虚数单位，k为传播常数，s(x t，y t，x r，y r，k)为一对发射天线-接收天线组合接收到待测物品的回波信号，(x t，y t)为发射天线坐标，(x r，y r)为接收天线的坐标，z表示2D MIMO阵列面板和待测物品某一断层之间的距离。
图12示出了根据本公开另一实施例的安检设备的控制方法的示意流程图。
在步骤S201，检测待测物品的高度。例如可以利用设置在安检设备上的传感器来自动检测待测物品的高度，当然也可以通过其他方式，例如人工方式检测待测物品的高度。
在步骤S202，调整2D MIMO装置与待测物品之间的距离。例如当待测物品高度较低时，例如信函类物品，可以将2D MIMO天线阵列21与待测物品12之间的成像距离调节为10cm-40cm；当待测物品为高度较大时，例如小件快递包裹，可以调节2D MIMO天线阵列21与待测物品12之间的成像距离为20cm-100cm。
在步骤S203，控制2D MIMO装置向待测物品发送检测信号并接收来自待测物品的回波信号。在本实施例中采用的是电子扫描与机械扫描相结合的扫描方式，在本步骤中2D MIMO装置在当前位置进行电子扫描。
在步骤S204，判断2D MIMO装置是否完成扫描，如果是，则表示当前位置的扫描完成，进行到步骤S205平移到下一位置，否则返回步骤S203继续当前位置的扫描。
在步骤S205，判断是否完成平移路径，如果是，则表示2D MIMO装置已完成路径上所有位置的扫描，因此针对当前待测物品的扫描结束，并进行到步骤S206进行图像重建，否则执行步骤S207平移到下一个位置进行扫描。
在步骤S206，利用获得的回波信号来重建待测物品的图像。重建算法包括但不限于上述的全系重建算法和后向投影算法。
在步骤S207，平移2D MIMO装置，并返回步骤S203，以在新的位置再次进行扫描检测。平移可以按照预设的路径进行，例如图10所示，每次平移一个步长，直到平移到路径上最后一个位置。
在一些实施例中，还可以在步骤S206之后执行步骤S208至209。
在步骤S208中，分析重建的待测物品的图像，以判断待测物品中是否可能含有危险品，如果是，则执行步骤S209，否则结束当前待测物品的安全检测。例如可以将重建的待测物品图像与预先存储的模板相比较，如果与某种危险品的特征模板匹配程度大于预设的阈值，则判定为可能含有该种危险品，否则判定为不含有危险品。在一些实施例中，还可以根据匹配程度的高低来确定含有危险品的概率的高低，例如匹配程度较高指示含有危险品的概率较高，匹配程度较低指示含有危险品的概率较低。
在步骤S209，控制报警装置进行报警。报警的方式包括但不限于画面显示、音频报警、振动报警等等。还可以设置报警级别，例如当含有危险品的概率较低时，可以通过较低音量的声音或者较弱的振动来报警，当含有危险品的概率较高时，可以通过较高音量的声音或者较强的振动来报警。
在本实施例中，还可以将步骤S206重建的待测物品的图像和/或步骤S208中的判断结果呈现给用户，例如，可以在步骤S206重建图像之后利用显示屏来显示所重建的图像，并在步骤S208之后将步骤S208的判断结果也呈现在显示屏上；也可以在步骤S208完成比对之后再一并将步骤S206重建的图像和步骤S208的判定结果呈现在显示屏上。步骤S208的判定结果(例如可能含有哪种危险品、含有该危险品的概率)的呈现方式可以根据需要来选择，除了上述在显示屏上以画面的形式呈现之外，还可以利用音频、振动等其他方式来呈现，例如可以判断结果以语音的形式播放，也可以利用报警器的报警音量高低或振动强弱来指示判断结果，比如高音量的报警代表含有危险品的可能性较高，低音量的报警代表含有危险品的可能性较低。
本公开的实施例还提供了一种计算机可读介质，所述计算机可读介质中存储有指令，所述指令在由处理器执行时使处理器执行上述安检设备的控制方法。
本公开的实施例通过在安检设备中利用2D MIMO装置进行扫描检测，可以实现对诸如信函、挂号小包之类的小型邮件的自动安全检查，相比于传统的人工查验和X光机查验能够提高安检效率和准确性。
本公开的实施例可以根据需要灵活选用各种不同结构的2D MIMO天线阵列，具有较高的使用灵活性。通过采用毫米波作为检测信号，能够穿透待测物品成像，从而取代X光机达到安全检测的目的的同时，提供了更高的检测质量和更高的安全性。
本公开的实施例通过在待测物品下方设置背板，可以将穿过待测物品的检测信号反射回2D MIMO装置，增强了来自待测物品的回波信号与其他回波信号的对比度，从而提高检测精度。
本公开的实施例可以根据待测物品的高度调整成像距离，从而找到最佳的成像距离，实现高分辨率成像。在一些情况下，足够小的成像距离甚至可以实现四分之一的分辨率。
本公开的实施例的安检设备可以设置成不具有传送装置的精简结构，也可以设置成具有传送装置的快检结构，在精简结构下可以手持或以其他方式将待测物品放置在成像空间，可以灵活变换角度、方位成像。在快检结构下，传送装置自动传送待测物品，还可以配合使用升降装置自动调节成像距离，从而实现实时、批量、自动化的检测，提高检测效率。
本公开的实施例支持全电子扫描方式以及电子扫描与机械扫描相结合的扫描方式。全电子扫描方式扫描速度快，结合基于快速傅里叶变换(FFT)的三维全息算法算法，可以实现实时成像。电子扫描与机械扫描相结合的扫描方式可以利用较小的天线阵列实现较大成像区域的扫描，节省成本并且结构简单。
本公开的实施例通过自动分析重建的待测物品的图像，能够能提供自动化的威胁检测，相比于传统方式大大提高了检测效率，降低漏检率。
本公开的实施例的安检设备结构简单、轻便、坚固、体积小、灵敏度高，便于携带，可安装在办公室、收发室等场所，并且相比于传统X光机对人体更安全。
本领域的技术人员可以理解，上面所描述的实施例都是示例性的，并且本领域的技术人员可以对其进行改进，各种实施例中所描述的结构在不发生结构或者原理方面的冲突的情况下可以进行自由组合。
在详细说明本公开的较佳实施例之后，熟悉本领域的技术人员可清楚的了解，在不脱离随附权利要求的保护范围与精神下可进行各种变化与改变，且本公开亦不受限于说明书中所举示例性实施例的实施方式。

Claims (15)

  1. 一种安检设备，包括：
    设备本体，所述设备本体上设置有检测空间，所述检测空间被配置为容纳待测物品；
    2D MIMO装置，即二维多发多收装置，设置在所述检测空间中，并且被配置为向待测物品发送检测信号，并接收来自待测物品的回波信号；以及
    处理器，与所述2D MIMO装置相连，并且被配置为根据接收到的回波信号来重建待测物品的图像。
  2. 根据权利要求1所述的安检设备，其中，所述2D MIMO装置包括：
    2D MIMO天线阵列，设置在所述检测空间中，包括至少一个子阵，每个子阵包括沿第一方向排列的多个发射天线和沿着与第一方向成预设角度的第二方向排列的多个接收天线，所述多个发射天线中的每个发射天线和所述多个接收天线中的相应一个接收天线的连线的中点作为一个等效相位中心，所述多个发射天线和所述多个接收天线被布置为使得等效相位中心排列成二维阵列；以及
    控制电路，被配置为控制所述多个发射天线按照预设顺序发射所述检测信号，以及控制所述多个接收天线接收所述回波信号。
  3. 根据权利要求2所述的安检设备，其中，所述预设角度为90度，每个子阵包括沿着第一方向排列的两行发射天线和沿着第二方向排列的两列接收天线，所述两行发射天线与两列接收天线形成矩形图案。
  4. 根据权利要求2所述的安检设备，其中，所述预设角度为90度，所述子阵的数目为1，该子阵包括沿着第一方向排列的一行发射天线和沿着第二方向排列的一列接收天线，所述行和列交叉形成十字形状。
  5. 根据权利要求2所述的安检设备，还包括：平移装置，安装在所述设备本体上，并且被配置为在所述2D MIMO天线阵列所在的平面内平移所述2D MIMO天线阵列。
  6. 根据权利要求2所述的安检设备，还包括：升降装置，安装在所述设备本体上，并且被配置为控制所述2D MIMO天线阵列远离或靠近所述待测物品。
  7. 根据权利要求1所述的安检设备，还包括：背板，所述背板设置在检测空间中，位于待测物品下方，并且被配置为将穿过待测物品到达所述背板的检测信号反射回所述2D MIMO装置。
  8. 根据权利要求7所述的安检设备，其中，所述背板包括金属板或具有金属涂层 的板状物。
  9. 根据权利要求1所述的安检设备，其中，所述检测空间设置成凹槽结构，具有彼此平行的第一侧壁和第二侧壁以及与第一侧壁和第二侧壁垂直的第三侧壁，所述2D MIMO装置位于所述第一侧壁上，所述第二侧壁用于放置待测物品。
  10. 根据权利要求1所述的安检设备，还包括：传送装置，设置成穿过所述检测空间，并且被配置为传送待测物品以使待测物品进入或离开所述检测空间。
  11. 根据权利要求1所述的安检设备，还包括：显示装置，与所述处理器相连，并且被配置为向用户呈现所重建的待测物品的图像。
  12. 根据权利要求1所述的安检设备，还包括报警装置，所述处理器还被配置为根据所重建的待测物品的图像基于预设的标准来判断待测物品是否可能含有危险品，如果是，则控制所述报警装置进行报警。
  13. 根据权利要求1至12中任一项权利要求所述的安检设备，其中，所述检测信号为毫米波。
  14. 一种根据权利要求1至13中任一项权利要求所述的安检设备的控制方法，包括：
    控制所述2D MIMO装置向待测物品发送检测信号，并接收来自待测物品的回波信号；以及
    根据接收到的回波信号来重建待测物品的图像。
  15. 根据权利要求14所述的控制方法，其中，所述重建待测物品的图像包括基于全息重建算法或后向投影算法来重建待测物品的图像。
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