WO2020133733A1 - 一种无铆钉微铆接装置 - Google Patents

一种无铆钉微铆接装置 Download PDF

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Publication number
WO2020133733A1
WO2020133733A1 PCT/CN2019/078543 CN2019078543W WO2020133733A1 WO 2020133733 A1 WO2020133733 A1 WO 2020133733A1 CN 2019078543 W CN2019078543 W CN 2019078543W WO 2020133733 A1 WO2020133733 A1 WO 2020133733A1
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Prior art keywords
laser
riveting
micro
workpiece
rivetless
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English (en)
French (fr)
Inventor
郭钟宁
黄兴
邓宇
张会寅
谭蓉
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Foshan Gewei Technology Co Ltd
Guangdong University of Technology
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Foshan Gewei Technology Co Ltd
Guangdong University of Technology
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
    • B21D39/03—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal otherwise than by folding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/16—Heating or cooling

Definitions

  • the invention relates to the technical field of miniaturized connection, and more particularly, to a rivetless micro riveting device.
  • connection methods of the micro-foil materials in the prior art include: traditional fusion welding, resistance welding, traditional mechanical fastening technology, adhesive bonding, and laser heating micro riveting welding.
  • the process of adhesive technology is more complicated, and it is prone to lack of glue and excessive glue.
  • the process needs to solve the problem of cleaning and requires post-processing, such as drying to remove more than the glue.
  • Laser-heated rivetless riveting uses materials to absorb laser light and melt to form, but it has great limitations for materials with high reflection, high melting point, and strong thermal conductivity.
  • the object of the present invention is to provide a rivet-free micro riveting device, which can realize an efficient and reliable micro connection of the same kind or different kinds of foil plate materials.
  • a rivetless micro riveting device includes a laser emitting system for emitting laser, a laser conducting device for conducting laser to a riveting point of a workpiece, and a mounting table for placing a workpiece, the mounting table is provided with a place for placing Deionized water, so that the deionized water fills the water tank of the riveting point of the workpiece, so that when the laser is irradiated to the riveting point, the deionized water induces cavitation bubbles.
  • it further includes a detection device for detecting the position of the laser irradiation, the detection device is signal-connected to a control system, and the control system is used to move the position of the mounting table according to the detection information of the detection device, so that the laser Irradiated at the riveting point of the workpiece.
  • the mounting platform is provided on a three-dimensional mobile platform for adjusting the position of the mounting platform, and the three-dimensional mobile platform is signal-connected to the control system.
  • the detection device is a CCD online video detection system.
  • control system the laser emission system, and the three-dimensional mobile platform are all set on a machine tool workbench.
  • the mounting table is further provided with a focusing lens for focusing the laser on the riveting point.
  • the laser transmission device is a mirror.
  • the reflector is provided on the mounting platform, and the reflector and the mounting platform are kept relatively fixed.
  • the mounting table includes an upper mold and a lower mold for clamping a workpiece, and a clamp for clamping the upper mold and the lower mold, and the water tank is a concave provided at an upper end of the upper mold Hole, the lower end of the upper die is provided with a small hole communicating with the recessed hole for the shock wave of the cavitation bubble to expand and collapse, the upper end of the lower die is at the A groove is provided at the riveting point to facilitate plastic deformation of the workpiece.
  • a transparent glass cover plate for preventing splash of deionized water is also provided at the upper end opening of the upper mold.
  • the rivetless micro riveting device includes a laser emitting system for emitting laser light, a laser conducting device for conducting laser light to a riveting point of a workpiece, and a mounting table for placing the workpiece.
  • a laser emitting system for emitting laser light
  • a laser conducting device for conducting laser light to a riveting point of a workpiece
  • a mounting table for placing the workpiece.
  • the rivetless micro riveting device uses deionized water as a medium, and uses the shock wave loading of the cavitation bubble generated by the laser induced deionized water during expansion and collapse instead of the traditional physical punch to apply force.
  • two foil plates are riveted together to realize the connection of micro foil plates of the same or different materials.
  • rivetless riveting technology is based on plastic deformation of the material, combined with laser-induced technology, and cold extrusion deformation according to the material of the plate itself to form deformation points without external heat source. It can complete the micro-connection of the same kind or different kinds of metal foil plate materials, which has the advantages of simple structure, fast response speed, high reliability, clean process, wide application range and low cost.
  • FIG. 1 is a schematic diagram of an internal structure of a specific embodiment of a rivetless micro riveting device provided by the present invention.
  • 1-machine table 2-control system, 3-laser emission system, 4-reflector, 5-concave hole, 6-small hole, 7-groove, 8-focus lens, 9-detection device, 10 -Transparent glass cover, 11-upper mold, 12-workpiece, 13-lower mold, 14-three-dimensional moving platform, 15-fixture.
  • the core of the present invention is to provide a rivetless micro riveting device, which can realize the efficient and reliable micro connection of the same kind or different kind of foil plate materials.
  • FIG. 1 is a schematic diagram of an internal structure of a specific embodiment of a rivetless micro riveting device provided by the present invention.
  • a rivetless micro riveting device provided by the present invention includes a laser emitting system 3 for emitting laser light, a laser conducting device for conducting laser light to the riveting point of the work piece 12, and a mounting table for placing the work piece 12, installation
  • the table is provided with a water tank for placing deionized water so that the deionized water fills the riveting point of the work piece 12 to induce cavitation bubbles in the deionized water when the laser is irradiated to the riveting point.
  • the laser emission system 3 generally includes a laser emitter, a cooling system, and optical components.
  • the laser transmitting device is used to transmit the laser light emitted by the laser emitting system 3 to the riveting point of the workpiece 12, the mounting table is used to install the workpiece 12, and the riveting point of the workpiece 12 is filled with deionized water, so the mounting table needs to be installed In the water tank for storing deionized water, the upper end of the water tank should be able to allow the laser to enter, so that the laser can irradiate the riveting place of the workpiece 12, so that the laser induces cavitation bubbles in the deionized water at the riveting place of the workpiece 12, deionized water To remove excess impurity ion water, so that the laser will not be disturbed when passing through the deionized water.
  • the deionized water When the laser beam generated by the laser emitting system 3 is irradiated to the riveting point of the workpiece 12 filled with deionized water, the deionized water is induced to generate cavitation bubbles, and the plasma shock wave generated at the initial stage of cavitation bubble growth and the collapse of the cavitation bubble are generated.
  • the shock wave and jet flow are guided to the workpiece, causing the plastic deformation of the workpiece to form a riveting inlay point, and completing the riveting.
  • the rivetless micro riveting device uses deionized water as a medium, and uses the shock wave loading of the cavitation bubble generated by the laser induced deionized water in the process of expansion and collapse instead of applying the force of the traditional physical punch.
  • two foil plates are riveted together to realize the connection of micro foil plates of the same or different materials.
  • rivetless riveting technology is based on plastic deformation of the material, combined with laser-induced technology, and cold extrusion deformation according to the material of the plate itself to form deformation points without external heat source. It can complete the connection of the same kind or different kind of metal foil plate materials, which has the advantages of simple structure, fast response speed, high reliability, clean process, wide application range and low cost.
  • the detection device 9 for detecting the position of the laser irradiation
  • the detection device 9 is signally connected to the control system 2, and the control system 2 is used to move the position of the mounting table according to the detection information of the detection device 9, In order to irradiate the laser at the riveting point of the workpiece 12.
  • the laser beam generated by the laser emitting system 3 may not be accurately irradiated at the riveting point of the workpiece 12 due to the change of the position of the workpiece 12 during the irradiation, it is necessary to move the laser emitting system 3 or the mounting table at this time. Position to adjust the laser irradiation position.
  • a detection device 9 for detecting the position of the laser irradiation can also be provided.
  • the detection device 9 can be signal-connected to the control system 2 and the control system 2 can be based on the detection device 9
  • the detected laser irradiation position adjusts the position of the mounting table, so that the laser can be accurately irradiated on the riveting point of the workpiece 12, so as to automatically adjust the relative position of the laser irradiation and the riveting point of the workpiece 12.
  • the mounting table is set on the three-dimensional mobile platform 14 for adjusting the position of the mounting table, and the three-dimensional mobile platform 14 is signal-connected to the control system 2.
  • the control system 2 can control the connection to the three-dimensional mobile platform 14 and then set the mounting table on the three-dimensional mobile platform 14 so that the control system 2 can control the three-dimensional mobile platform 14 To adjust the position of the mounting table.
  • the three-dimensional mobile platform 14 is a precise mobile platform that can drive the mounting table to fine-tune the position to achieve laser alignment.
  • the detection device 9 is a CCD online video detection system, which has non-contact, fast speed and flexibility Good and other advantages.
  • control system 2, the laser emission system 3, and the three-dimensional mobile platform 14 can be installed on the machine tool workbench 1.
  • the machine tool workbench 1 has moisture resistance, corrosion resistance, colorfastness, and temperature coefficient. Low advantages.
  • a focusing lens 8 for focusing the laser on the riveting point may also be provided on the mounting table.
  • the focusing lens 8 should be arranged at a distance from the riveting point A focal length position so that the focusing lens 8 can focus the laser at the riveting point to improve the riveting effect.
  • the laser transmission device may be a mirror 4, and a plurality of mirrors 4 for changing the laser irradiation path may be provided along the laser irradiation path, so that The laser can finally illuminate the riveting point of the mounting table.
  • the mirror 4 here should be a plane mirror.
  • the mirror 4 can be installed on the mounting table, so that the position of the mirror 4 and the mounting table can be kept relatively fixed, so that the light beam generated by the laser emitting system 3 illuminates the mirror at a certain angle When it is on, it can be accurately irradiated on the riveting point on the installation table.
  • the mounting table includes an upper mold 11 and a lower mold 13 for clamping the workpiece 12, and a clamp 15 for clamping the upper mold 11 and the lower mold 13, and the water tank is provided on the upper mold 11
  • the concave hole 5 at the upper end, the lower end of the upper die 11 is provided with a small hole 6 communicating with the concave hole 5 for the shock wave of the cavitation bubble to expand and collapse, and the upper end of the lower die 13 is riveted
  • a groove 7 is provided to facilitate plastic deformation of the workpiece 12.
  • the mounting table is mainly used to place the work piece 12 to be riveted, and to fill deionized water at the riveting point of the work piece 12,
  • the structural setting of the mounting table can have various options, for example, the mounting table may include The upper mold 11 and the lower mold 13, and the jig 15 for holding the upper mold 11 and the lower mold 13, during use, the workpiece 12 can be placed between the upper mold 11 and the lower mold 13, and then the clamp 15 Clamp the upper mold 11 and the lower mold 13 so that the upper mold 11 and the lower mold 13 fix the workpiece 12, and the water tank for storing deionized water may be a concave hole 5 provided at the upper end of the upper mold 11 and the lower end of the upper mold 11
  • a small hole 6 communicating with the recessed hole 5 can be provided, and the laser can be irradiated at the riveting point through the upper mold 11, thereby inducing deionized water to produce cavitation bubbles, and the shock wave of the cavitation bubbles during expansion and collapse can pass through The small hole
  • a transparent glass cover plate 10 for preventing splash of deionized water is also provided at the upper end opening of the upper mold 11.
  • the upper end of the upper mold 11 can be provided to cover the concave hole 5 to prevent the removal
  • the cover plate of the ion water splash is preferably a transparent glass cover plate 10.
  • the concave hole 5 can be filled with deionized water, which is conducive to the stability of the laser light path in the water, and can also make the laser focusing position more accurate.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种无铆钉微铆接装置，包括用于发射激光的激光发射系统（3）、用于将激光传导至工件铆接点的激光传导装置、以及用于放置工件（12）的安装台，安装台上设有用于放置去离子水、以使去离子水填充于工件铆接点的水槽，以使激光照射至铆接点时诱导去离子水产生空化泡。将空化泡生长初期产生的等离子体冲击波和空泡溃灭时产生的冲击波及射流导引至工件上，使工件发生塑性变形形成铆接镶嵌点，完成铆接。该无铆钉微铆接装置，以去离子水作为媒介，利用激光诱导去离子水产生的空化泡在膨胀、溃灭过程中的冲击波加载代替传统实体冲头施加作用力，在微尺度下将两块箔板铆接在一起，实现同种或异种材料微型箔板零件的连接。

Description

一种无铆钉微铆接装置 技术领域
本发明涉及微型化连接技术领域，更具体地说，涉及一种无铆钉微铆接装置。
背景技术
如今，产品的精密化和微型化已成为工业制造发展的一个重要热点，精密、微型化的产品在医疗、航空航天、精密电子等领域有着重要的应用，同时受到学术界和工业界的广泛关注，而微型产品制造中对于零件的衔接是不可忽视的一部分，微制造行业中迫切需要可以连接同种或异种箔板材料的高效微连接技术，实现高效、可靠的微型零件连接是对微制造技术提出的全新挑战。
现有技术中微型箔板材料的连接方法有：传统熔焊、电阻焊、传统机械紧固技术、胶粘、以及激光加热微铆焊等。
其中，传统的熔焊和电阻焊对于熔点较低，热传导性较好的材料不适用，这两种技术基于热效应，无法连接异种金属箔板，尤其是在微尺度下的时候，材料无法形成有效的熔池。
胶粘技术其过程较复杂，容易出现缺胶，涂胶过量的问题，工艺过程需解决清洁问题，并且需要后处理，比如烘干，去除多于的胶水。
激光加热无铆钉铆接利用材料吸收激光后熔融成形，但对于高反光，高熔点，热传导强的材料有很大的局限。
因此，如何解决微型零件连接的方法中效果差、适用范围小的问题，是目前本领域技术人员亟待解决的问题。
发明内容
有鉴于此，本发明的目的是提供一种无铆钉微铆接装置，该装置 可以实现同种或异种箔板材料的高效、可靠的微连接。
为了实现上述目的，本发明提供如下技术方案：
一种无铆钉微铆接装置，包括用于发射激光的激光发射系统、用于将激光传导至工件铆接点的激光传导装置、以及用于放置工件的安装台，所述安装台上设有用于放置去离子水、以使去离子水填充于工件铆接点的水槽，以使激光照射至铆接点时诱导去离子水产生空化泡。
优选的，还包括用于检测激光照射位置的检测装置，所述检测装置信号连接于控制系统，所述控制系统用于根据所述检测装置的检测信息移动所述安装台的位置，以使激光照射在工件的铆接点处。
优选的，所述安装台设置于用于调整所述安装台位置的三维移动平台上，所述三维移动平台信号连接于所述控制系统。
优选的，所述检测装置为CCD在线视频检测系统。
优选的，所述控制系统、所述激光发射系统、以及所述三维移动平台均设于机床工作台上。
优选的，所述安装台上还设有用于将激光聚焦于所述铆接点的聚焦镜片。
优选的，所述激光传导装置为反光镜。
优选的，所述反光镜设于所述安装台上，所述反光镜与所述安装台保持相对固定。
优选的，所述安装台包括用于夹持工件的上模与下模，以及用于夹持所述上模与所述下模的夹具，所述水槽为设于所述上模上端的凹孔，所述上模的下端设有与所述凹孔连通的、用于使所述空化泡在膨胀、溃灭过程中的冲击波穿过的小孔，所述下模的上端在所述铆接点处设有便于所述工件发生塑性变形的凹槽。
优选的，所述上模的上端开口处还设有防止去离子水飞溅的透明玻璃盖板。
本发明所提供的无铆钉微铆接装置，包括用于发射激光的激光发射系统、用于将激光传导至工件的铆接点的激光传导装置、以及用于放置工件的安装台，安装台上设有用于放置去离子水、以使去离子水 填充于工件铆接点的水槽，以使激光照射至铆接点时诱导去离子水产生空化泡，将空化泡生长初期产生的等离子体冲击波和空泡溃灭时产生的冲击波及射流导引至工件上，使工件发生塑性变形形成铆接镶嵌点，完成铆接。本发明所提供的无铆钉微铆接装置，以去离子水作为媒介，利用激光诱导去离子水产生的空化泡在膨胀、溃灭过程中的冲击波加载代替传统实体冲头施加作用力，在微尺度下将两块箔板铆接在一起，实现同种或异种材料微型箔板零件的连接。针对高反光、高熔点、热传导性较强的箔板连接难题，无铆钉铆接技术基于材料塑性变形，结合激光诱导技术，依据板件本身的材料冷挤压变形，形成变形点，无需外部热源，即可完成将同种或异种金属箔板材料微连接，具有结构简单，响应速度快，可靠性高，工艺过程清洁，适用范围广且成本低的优点。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1为本发明所提供无铆钉微铆接装置具体实施例的内部结构示意图。
其中，1-机床工作台、2-控制系统、3-激光发射系统、4-反光镜、5-凹孔、6-小孔、7-凹槽、8-聚焦镜片、9-检测装置、10-透明玻璃盖板、11-上模、12-工件、13-下模、14-三维移动平台、15-夹具。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普 通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的核心是提供一种无铆钉微铆接装置，该装置可以实现同种或异种箔板材料的高效、可靠的微连接。
请参考图1，图1为本发明所提供无铆钉微铆接装置具体实施例的内部结构示意图。
本发明所提供的一种无铆钉微铆接装置，包括用于发射激光的激光发射系统3、用于将激光传导至工件12铆接点的激光传导装置、以及用于放置工件12的安装台，安装台上设有用于放置去离子水、以使去离子水填充于工件12铆接点的水槽，以使激光照射至铆接点时诱导去离子水产生空化泡。
其中，激光发射系统3主要的作用在于发射能够诱导去离子水产生空化泡的激光，激光发射系统3一般包括激光发射器、冷却系统以及光学元器件。激光传导装置用于将激光发射系统3发射的激光传导至工件12的铆接点处，安装台用于安装工件12，以及在工件12的铆接点处填充去离子水，因此安装台上需要设置用于存放去离子水的水槽，水槽的上端应当能够使激光射入，以使激光能够照射在工件12的铆接处，使激光在工件12的铆接处诱导去离子水产生空化泡，去离子水为去掉多余杂质离子的水，以便激光在穿过去离子水时不会受到干扰。
激光发射系统3产生的激光光束照射于填满去离子水的工件12铆接点时，诱导去离子水产生空化泡，将空化泡生长初期产生的等离子体冲击波和空泡溃灭时产生的冲击波及射流导引至工件上，使工件发生塑性变形形成铆接镶嵌点，完成铆接。
本发明所提供的无铆钉微铆接装置，以去离子水作为媒介，利用激光诱导去离子水产生的空化泡在膨胀、溃灭过程中的冲击波加载代替传统实体冲头施加作用力，在微尺度下将两块箔板铆接在一起，实现同种或异种材料微型箔板零件的连接。针对高反光、高熔点、热传导性较强的箔板连接难题，无铆钉铆接技术基于材料塑性变形，结合 激光诱导技术，依据板件本身的材料冷挤压变形，形成变形点，无需外部热源，即可完成将同种或异种金属箔板材料连接，具有结构简单，响应速度快，可靠性高，工艺过程清洁，适用范围广且成本低的优点。
在上述实施例的基础之上，还包括用于检测激光照射位置的检测装置9，检测装置9信号连接于控制系统2，控制系统2用于根据检测装置9的检测信息移动安装台的位置，以使激光照射在工件12的铆接点处。
考虑到激光发射系统3产生的激光光束在照射的时候可能会由于工件12位置的改变而未能准确的照射在工件12的铆接点处，此时便需要通过移动激光发射系统3或者安装台的位置，来调整激光的照射位置。
为提高本发明所提供的无铆钉微铆接装置操作的智能化，还可设置用于检测激光照射位置的检测装置9，检测装置9可信号连接于控制系统2，控制系统2可根据检测装置9所检测的激光照射的位置来调整安装台的位置，以使激光能够准确的照射在工件12的铆接点处，从而达到自动调整激光照射与工件12铆接点相对位置的目的。
在上述实施例的基础之上，安装台设置于用于调整安装台位置的三维移动平台14上，三维移动平台14信号连接于控制系统2。
考虑到控制系统2移动安装台的方式，优选的，控制系统2可控制连接于三维移动平台14，然后将安装台设置于三维移动平台14上，从而控制系统2便可通过控制三维移动平台14来实现对安装台位置的调整。三维移动平台14为精密的移动平台，可带动安装台进行位置微调，以实现激光的对准。
在上述实施例的基础之上，考虑到用于检测激光照射位置的检测装置9的选择，优选的，检测装置9为CCD在线视频检测系统，CCD在线视频检测系统具有非接触、速度快以及柔性好等优点。
在上述实施例的基础之上，可将控制系统2、激光发射系统3、以及三维移动平台14均安装于机床工作台1上，机床工作台1具有有耐潮、耐腐蚀、不褪色、温度系数低等优点。
在上述实施例的基础之上，为进一步提高照射在铆接点的激光的强度，还可在安装台上设置用于将激光聚焦于铆接点的聚焦镜片8，聚焦镜片8应当设置在距离铆接点一个焦距的位置，以便聚焦镜片8能够将激光刚好聚焦于铆接点处，以提高铆接的效果。
考虑到激光传导装置的选择，在上述实施例的基础之上，优选的，激光传导装置可为反光镜4，可沿激光照射路径设置多个用于改变激光照射路径的反光镜4，以使激光最终能够照射在安装台的铆接点处，需要指出的是，此处的反光镜4应当为平面镜。
在上述实施例的基础之上，反光镜4可设置于安装台上，以使反光镜4与安装台的位置能够保持相对固定，以便激光发射系统3产生的光束沿某一角度照射在反光镜4上时，便可准确的照射在安装台上的铆接点处。
在上述任意实施例的基础之上，安装台包括用于夹持工件12的上模11与下模13，以及用于夹持上模11与下模13的夹具15，水槽为设于上模11上端的凹孔5，上模11的下端设有与凹孔5连通的、用于使空化泡在膨胀、溃灭过程中的冲击波穿过的小孔6，下模13的上端在铆接点处设有便于工件12发生塑性变形的凹槽7。
安装台的主要用于放置待铆接的工件12，以及在工件12的铆接点处填充去离子水，安装台的结构设置可以有多种选择，例如，安装台可包括用于夹持工件12的上模11与下模13，以及用于夹持上模11与下模13的夹具15，在使用的过程中，可将工件12放置于上模11与下模13之间，然后使夹具15夹紧上模11与下模13，以使上模11与下模13将工件12固定，用于存放去离子水的水槽可为设置在上模11上端的凹孔5，上模11的下端可设置与凹孔5连通的小孔6，激光可穿过上模11照射在铆接点处，从而诱导去离子水产生空化泡，空化泡在膨胀、溃灭过程中的冲击波能够穿过小孔6作用于工件12上，以实现工件12铆接的工艺。
在上述实施例的基础之上，上模11的上端开口处还设有防止去离子水飞溅的透明玻璃盖板10。
考虑到空化泡在膨胀、溃灭过程中的冲击波会向四周辐射，为避免去离子水从凹孔5中飞溅出来，可在上模11的上端设置用于盖住凹孔5、防止去离子水飞溅的盖板，优选的，盖板可为透明玻璃盖板10。
在使用的过程中，可在凹孔5填满去离子水，有利于激光光路在水中保持稳定，还可以使激光对焦位置更加准确。
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。
以上对本发明所提供的无铆钉微铆接装置进行了详细介绍。本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想。应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以对本发明进行若干改进和修饰，这些改进和修饰也落入本发明权利要求的保护范围内。

Claims (10)

  1. 一种无铆钉微铆接装置，其特征在于，包括用于发射激光的激光发射系统(3)、用于将激光传导至工件(12)铆接点的激光传导装置、以及用于放置工件(12)的安装台，所述安装台上设有用于放置去离子水、以使去离子水填充于工件(12)铆接点的水槽，以使激光照射至铆接点时诱导去离子水产生空化泡。
  2. 根据权利要求1所述的无铆钉微铆接装置，其特征在于，还包括用于检测激光照射位置的检测装置(9)，所述检测装置(9)信号连接于控制系统(2)，所述控制系统(2)用于根据所述检测装置(9)的检测信息移动所述安装台的位置，以使激光照射在工件(12)的铆接点处。
  3. 根据权利要求2所述的无铆钉微铆接装置，其特征在于，所述安装台设置于用于调整所述安装台位置的三维移动平台(14)上，所述三维移动平台(14)信号连接于所述控制系统(2)。
  4. 根据权利要求3所述的无铆钉微铆接装置，其特征在于，所述检测装置(9)为CCD在线视频检测系统。
  5. 根据权利要求4所述的无铆钉微铆接装置，其特征在于，所述控制系统(2)、所述激光发射系统(3)、以及所述三维移动平台(14)均设于机床工作台(1)上。
  6. 根据权利要求1所述的无铆钉微铆接装置，其特征在于，所述安装台上还设有用于将激光聚焦于所述铆接点的聚焦镜片(8)。
  7. 根据权利要求6所述的无铆钉微铆接装置，其特征在于，所述激光传导装置为反光镜(4)。
  8. 根据权利要求7所述的无铆钉微铆接装置，其特征在于，所述反光镜(4)设于所述安装台上，所述反光镜(4)与所述安装台保持相对固定。
  9. 根据权利要求1至8任一项所述的无铆钉微铆接装置，其特征在于，所述安装台包括用于夹持工件(12)的上模(11)与下模(13)，以及用于夹持所述上模(11)与所述下模(13)的夹具(15)，所述 水槽为设于所述上模(11)上端的凹孔(5)，所述上模(11)的下端设有与所述凹孔(5)连通的、用于使所述空化泡在膨胀、溃灭过程中的冲击波穿过的小孔(6)，所述下模(13)的上端在所述铆接点处设有便于所述工件(12)发生塑性变形的凹槽(8)。
  10. 根据权利要求9所述的无铆钉微铆接装置，其特征在于，所述上模(11)的上端开口处还设有防止去离子水飞溅的透明玻璃盖板(10)。
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