WO2020122261A3 - 基板収納容器 - Google Patents

基板収納容器 Download PDF

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Publication number
WO2020122261A3
WO2020122261A3 PCT/JP2020/014929 JP2020014929W WO2020122261A3 WO 2020122261 A3 WO2020122261 A3 WO 2020122261A3 JP 2020014929 W JP2020014929 W JP 2020014929W WO 2020122261 A3 WO2020122261 A3 WO 2020122261A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
container body
walls
accommodating
container
Prior art date
Application number
PCT/JP2020/014929
Other languages
English (en)
French (fr)
Other versions
WO2020122261A2 (ja
Inventor
千明 松鳥
Original Assignee
ミライアル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミライアル株式会社 filed Critical ミライアル株式会社
Priority to KR1020217001763A priority Critical patent/KR102418353B1/ko
Priority to PCT/JP2020/014929 priority patent/WO2020122261A2/ja
Priority to CN202080099201.5A priority patent/CN115428138A/zh
Priority to JP2020552055A priority patent/JP6805400B2/ja
Priority to US17/915,904 priority patent/US20230141959A1/en
Publication of WO2020122261A2 publication Critical patent/WO2020122261A2/ja
Publication of WO2020122261A3 publication Critical patent/WO2020122261A3/ja
Priority to TW110111104A priority patent/TWI796660B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K39/00—Medicinal preparations containing antigens or antibodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Animal Behavior & Ethology (AREA)
  • Chemical & Material Sciences (AREA)
  • Microbiology (AREA)
  • Mycology (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Epidemiology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

一端部に容器本体開口部が形成された開口周縁部を有し、他端部が閉塞された筒状の壁部を備え、壁部の内面によって、基板を収納可能であり容器本体開口部に連通する基板収納空間が形成された容器本体２と、蓋体３と、シール部材４と、を備え、　容器本体２の壁部２０には、基板収納空間に収納された基板を処理装置に搬送するためのロードポートに設けられた位置合わせ部に係止されて固定される中央被固定部材６が容器本体２の壁部２０に対して着脱可能に設けられている基板収納容器１である。
PCT/JP2020/014929 2020-03-31 2020-03-31 基板収納容器 WO2020122261A2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020217001763A KR102418353B1 (ko) 2020-03-31 2020-03-31 기판수납용기
PCT/JP2020/014929 WO2020122261A2 (ja) 2020-03-31 2020-03-31 基板収納容器
CN202080099201.5A CN115428138A (zh) 2020-03-31 2020-03-31 基板收纳容器
JP2020552055A JP6805400B2 (ja) 2020-03-31 2020-03-31 基板収納容器
US17/915,904 US20230141959A1 (en) 2020-03-31 2020-03-31 Substrate-accommodating container
TW110111104A TWI796660B (zh) 2020-03-31 2021-03-26 基板收納容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/014929 WO2020122261A2 (ja) 2020-03-31 2020-03-31 基板収納容器

Publications (2)

Publication Number Publication Date
WO2020122261A2 WO2020122261A2 (ja) 2020-06-18
WO2020122261A3 true WO2020122261A3 (ja) 2020-08-13

Family

ID=71076861

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/014929 WO2020122261A2 (ja) 2020-03-31 2020-03-31 基板収納容器

Country Status (6)

Country Link
US (1) US20230141959A1 (ja)
JP (1) JP6805400B2 (ja)
KR (1) KR102418353B1 (ja)
CN (1) CN115428138A (ja)
TW (1) TWI796660B (ja)
WO (1) WO2020122261A2 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214269A (ja) * 2002-12-27 2004-07-29 Miraial Kk 薄板支持容器
JP2008010574A (ja) * 2006-06-28 2008-01-17 Vantec Co Ltd ウエハ容器の位置決め構造
WO2014196011A1 (ja) * 2013-06-03 2014-12-11 ミライアル株式会社 基板収納容器
JP2017092172A (ja) * 2015-11-06 2017-05-25 信越ポリマー株式会社 基板収納容器
WO2019031142A1 (ja) * 2017-08-10 2019-02-14 信越ポリマー株式会社 基板収納容器及びその製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6216874B1 (en) * 1998-07-10 2001-04-17 Fluoroware, Inc. Wafer carrier having a low tolerance build-up
JP3916342B2 (ja) * 1999-04-20 2007-05-16 信越ポリマー株式会社 基板収納容器
US20030188990A1 (en) * 2001-11-14 2003-10-09 Bhatt Sanjiv M. Composite kinematic coupling
US6851170B2 (en) * 2001-12-14 2005-02-08 Applied Materials, Inc. Method and apparatus for alignment of carriers, carrier handlers and semiconductor handling equipment
US7523829B2 (en) * 2003-03-04 2009-04-28 Shin-Etsu Polymer Co., Ltd. Precision substrate storage container
WO2005112107A1 (ja) * 2004-05-17 2005-11-24 Shin-Etsu Polymer Co., Ltd. 基板収納容器及びその位置決め方法
JP4373316B2 (ja) * 2004-10-14 2009-11-25 ミライアル株式会社 薄板支持容器用クランプ装置
EP1883105B8 (en) * 2005-05-06 2013-03-27 Shin-Etsu Polymer Co., Ltd. Substrate storage container and method of producing the same
KR20070034654A (ko) 2005-09-26 2007-03-29 (주)에프알텍 양방향 단일 광섬유 전송을 위한 필터 조대(粗大) 파장분할 다중화용 광송수신모듈 및 광신호 전송 방법
US7422107B2 (en) * 2006-01-25 2008-09-09 Entegris, Inc. Kinematic coupling with textured contact surfaces
KR20070088064A (ko) 2006-02-24 2007-08-29 (주) 에이치에스정보기술 웹 기반의 기업 정보관리 방법
US8827695B2 (en) 2008-06-23 2014-09-09 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer's ambiance control
JP5318800B2 (ja) * 2010-03-04 2013-10-16 信越ポリマー株式会社 基板収納容器
JP6067123B2 (ja) * 2013-08-22 2017-01-25 ミライアル株式会社 基板収納容器
US11309200B2 (en) * 2017-02-27 2022-04-19 Miraial Co., Ltd. Substrate storage container
KR102477834B1 (ko) * 2017-11-15 2022-12-16 신에츠 폴리머 가부시키가이샤 기판 수납 용기
KR20230036071A (ko) * 2020-07-10 2023-03-14 미라이얼 가부시키가이샤 기판수납용기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214269A (ja) * 2002-12-27 2004-07-29 Miraial Kk 薄板支持容器
JP2008010574A (ja) * 2006-06-28 2008-01-17 Vantec Co Ltd ウエハ容器の位置決め構造
WO2014196011A1 (ja) * 2013-06-03 2014-12-11 ミライアル株式会社 基板収納容器
JP2017092172A (ja) * 2015-11-06 2017-05-25 信越ポリマー株式会社 基板収納容器
WO2019031142A1 (ja) * 2017-08-10 2019-02-14 信越ポリマー株式会社 基板収納容器及びその製造方法

Also Published As

Publication number Publication date
CN115428138A (zh) 2022-12-02
US20230141959A1 (en) 2023-05-11
JPWO2020122261A1 (ja) 2021-02-15
KR20210122767A (ko) 2021-10-12
JP6805400B2 (ja) 2020-12-23
TWI796660B (zh) 2023-03-21
WO2020122261A2 (ja) 2020-06-18
TW202140359A (zh) 2021-11-01
KR102418353B1 (ko) 2022-07-06

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