WO2020114454A1 - 双面压接背板及其生产方法 - Google Patents

双面压接背板及其生产方法 Download PDF

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Publication number
WO2020114454A1
WO2020114454A1 PCT/CN2019/123294 CN2019123294W WO2020114454A1 WO 2020114454 A1 WO2020114454 A1 WO 2020114454A1 CN 2019123294 W CN2019123294 W CN 2019123294W WO 2020114454 A1 WO2020114454 A1 WO 2020114454A1
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Prior art keywords
double
sided
board
backplane
hole area
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PCT/CN2019/123294
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English (en)
French (fr)
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吴玉祥
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中兴通讯股份有限公司
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Publication of WO2020114454A1 publication Critical patent/WO2020114454A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present disclosure relates to the technical field of circuit board design, in particular to a double-sided crimping backplane and a production method thereof.
  • the backplane provides physical and electrical interconnection between modules in the same equipment.
  • the data link rate between line cards and switching cards is getting higher and higher.
  • the backplane needs to use high-density connectors to connect line cards and switching cards, Challenge the limit of the backplane transmission rate.
  • the integration requirements of the backplane printed circuit board are getting higher and higher, which results in more and more assembly of on-board devices and the increasing density of wiring layout, making the design of the backplane printed circuit board more and more difficult. Therefore, the backplane printed circuit board is required to have higher design flexibility, especially to be able to adapt to various high-density devices during processing and assembly.
  • hole 1 is a blind hole
  • hole 2 is a through hole, and back drilling is performed after processing to the finished product
  • hole 3 is a through hole
  • the relevant labels are as follows (the following are all in accordance with the IPC2 standard).
  • Risk 2 The copper in the back hole at the lower end of the hole 2 is damaged during crimping, which may cause poor electrical performance.
  • the new double-sided blind hole backplane uses a connector with a built-in metal shielding gasket, which may contact the outer disk of hole 3, resulting in a short circuit of the connector.
  • Risk 4 Accuracy of hole position, the inner hole of the same connector of the new double-sided blind hole backplane is currently +/-3.5mm, and crimping needles may appear.
  • the present disclosure provides a double-sided crimping backplane and a production method thereof, which aims to solve the problem that there is a certain height difference on the surface of the inner hole of the same connector after backdrilling in some cases.
  • the present disclosure provides a method for producing a double-sided crimped backplane.
  • the method for producing a double-sided crimped backplane includes: pressing the back surface of the first daughter board with the front surface of the second daughter board To obtain a first double-sided board with a blind hole area; after processing the protective films on both the front and back sides of the first double-sided board, through-hole drilling and thickening are performed to obtain a blind hole area and a through-hole area The second double-sided board; back drilling the first through-hole adjacent to the blind hole region in the through-hole region to obtain a third double-sided board, wherein the depth of the back-drilled hole is equal to the thickness of the thickening process Correspondingly; the protective film is removed from the third double-sided board to obtain a double-sided crimped back board.
  • An embodiment of the present disclosure also provides a double-sided crimped backplane prepared by the above-mentioned production method of the double-sided crimped backplane;
  • the double-sided crimped backplane includes a first daughter board 2.
  • a second daughter board, both the first daughter board and the second daughter board are provided with blind hole areas; the back surface of the first daughter board is pressed against the front surface of the second daughter board and a through hole is formed by drilling Area; the first through hole adjacent to the through hole area and the blind hole area is back drilled, and a protective film and a thickening layer are sequentially stacked around the first through hole; the thickness of the thickening layer Corresponds to the depth of the back drill.
  • Figure 1 is a schematic diagram of the structure of some cases
  • FIG. 2 is a schematic flowchart of a first embodiment of a method for producing a double-sided crimping backplane according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural view of the daughter board in the first embodiment
  • FIG. 4 is a schematic structural diagram of a first double-sided panel obtained in step S10 in the first embodiment
  • FIG. 5 is a schematic structural diagram of a second double-sided board obtained in step S20 in the first embodiment
  • FIG. 6 is a schematic structural diagram of a third double-sided panel obtained in step S30 in the first embodiment
  • step S40 is a schematic structural view of the double-sided crimped backplane obtained in step S40 in the first embodiment
  • FIG. 8 is a schematic flowchart of a second embodiment of a method for producing a double-sided crimping backplane according to an embodiment of the present disclosure
  • FIG. 9 is a schematic view of the structure of a connector for a double-sided crimping backplane of the present disclosure.
  • Label name Label name 100 First daughter board 101 Second daughter board 102 Second through hole 103 Blind hole 104 Resin layer 105 Sheet adhesive material 106 Copper foil 107 First through hole 108 Third through hole 109 Plating 110 Connector A A
  • the embodiments of the present disclosure provide a method for producing a double-sided crimping backplane.
  • FIG. 2 is a schematic flow chart of the first embodiment of the production method of the double-sided crimping backplane of the present disclosure
  • FIG. 3 is a schematic structural diagram of a daughter board
  • FIG. 4 is a first embodiment obtained in step S10 in the first embodiment Schematic diagram of a double panel.
  • the production method of the double-sided crimping backplane of the present disclosure includes:
  • step S10 the back surface of the first daughter board and the front surface of the second daughter board are pressed together to obtain a first double-sided board with a blind hole area.
  • the back surface of the first daughter board is pressed against the front surface of the second daughter board to obtain a first double-sided board with a blind hole area.
  • PCBs with blind holes when processing, they are usually divided into two sub-boards, where the blind holes are drilled through holes in the sub-boards, and then the two sub-boards are pressed together, and one end of the through holes passes The pressed material is blocked to obtain blind holes.
  • the structure of the first daughter board and the second daughter board are the same.
  • the back of the first daughter board and the front of the second daughter board are pressed together.
  • the first double-sided board is obtained to form a blind hole area.
  • the structures of the first daughter board 100 and the second daughter board 101 refer to FIG. 3.
  • the structures of the first daughter board 100 and the second daughter board 101 are the same. Both of them have a plurality of second through holes 102 and part of the second through holes 102 back drill.
  • the back surface of the first daughter board 100 is pressed against the front surface of the second daughter board 101 to obtain a first double-sided board with a blind hole area. Since the first daughter board 100 and the second daughter board 101 are pressed together by the sheet-like adhesive material 105, the second through holes 102 on the first daughter board 100 and the second daughter board 101 are all stuck by the sheet-like Material 105 gets blind hole 103. In addition, at the time of pressing, a resin layer with poor adhesiveness, that is, a PP layer is added to the surface of the first daughter board 100 and the surface of the second daughter board 101 to obtain a resin layer 104.
  • a resin layer with poor adhesiveness that is, a PP layer is added to the surface of the first daughter board 100 and the surface of the second daughter board 101 to obtain a resin layer 104.
  • step S20 through-hole drilling is performed on the front and back protective films of the first double-sided board, and thickening processing is performed to obtain a second double-sided board with a blind hole area and a through hole area.
  • a first double-sided board is obtained, a protective film is attached to both sides of the first double-sided board, and then through-hole drilling is performed, and then additional Thick processing to obtain a second double-sided board with a blind hole area and a through hole area.
  • the protective film in this case is preferably copper foil, and copper foil is pasted on the front and back sides of the first double-sided board, and through-hole drilling is performed where necessary, so as to obtain a second double-sided board with through holes, and through The hole is I-shaped and then thickened.
  • the thickening in this case is preferably electroplating. Copper plating can be used to perform electroplating according to the thickness of the PCB plate. The thickness of the electroplated copper layer is about 20-30um.
  • the protective film is copper foil 106. Both front and back sides of the first double-sided board are covered with copper foil 106. Through-hole drilling is performed to obtain a plurality of third through-holes 108. Some third through-holes are close to the blind
  • the definition of the hole area is the first through hole 107, which is used for back drilling; please refer to FIG. 6, which is thickened, and the thickened processing is electroplating to obtain an electroplated layer 109, and the thickness of the electroplated copper layer is about 20-30um .
  • Step S30 back drilling the first through hole adjacent to the blind hole area in the through hole area to obtain a third double-sided board, wherein the depth of the back drill corresponds to the thickness of the thickening process.
  • the first through hole adjacent to the blind hole area in the through hole area is back drilled to obtain a third double-sided board, wherein the depth of the back drill corresponds to the thickness of the thickening process .
  • this case will back drill the first through hole adjacent to the blind hole area in the through hole area, and the depth of the back drill corresponds to the thickness of the thickening process, so that when the connector is plugged, Can be highly consistent.
  • the first through hole 107 is back drilled after electroplating, and the depth of the back drill corresponds to the thickness of the thickening process.
  • Step S40 the protective film is removed from the third double-sided board to obtain a double-sided crimped back board.
  • the protective film is removed to obtain a double-sided crimped back board.
  • the protective film in this case is preferably copper foil 106.
  • the present disclosure provides a double-sided crimped backplane and a production method thereof.
  • the first sub-board and the second sub-board are pressed together to obtain a blind hole area, and the first double-sided board is processed with a protective film
  • through-hole drilling is performed to obtain the second double-sided board with through-holes
  • the thickening process is performed so that the second double-sided board with blind hole regions and through-hole regions is obtained.
  • the front and back sides are protected by a protective film, and the through hole is thickened after drilling, so that the blind hole has been protected by the protective film, and only the thickening of the through hole area is realized.
  • the thickness of the outer layer of the hole area is greater than the thickness of the outer layer of the blind hole area.
  • the thickness of the outer layer of the through hole area is the sum of the thickness of the protective film and the thickened thickness. Therefore, the through hole area is adjacent to the blind hole area.
  • the first through hole is back drilled, and the back drill depth corresponds to the thickness of the thickening process, so that the depth of the first through hole after back drilling is the same as the blind hole depth of the adjacent blind hole area, inserted in the connector
  • the surface of the inner hole of the connector is made to have the same depth of back drilling and thickening thickness, so that the surface of the inner hole is on the same horizontal plane, thereby effectively avoiding the problem of difference in height of the surface of the inner hole of the connector.
  • Step S20 includes: Step S201, in the first The front and back sides of the double-sided board are pressed with copper foil, and then through-hole drilling is performed to obtain a second double-sided board with a through-hole area; step S202, the front and back sides of the second double-sided board are electroplated to obtain the The second double panel.
  • copper foil is pasted on the front and back sides of the first double-sided board, and through-hole drilling is performed where necessary, so as to obtain a second double-sided board with through-holes, and the through-holes are type I,
  • the thickening process is performed again, and the thickening process in this case is preferably a plating process.
  • Copper plating can be used to perform electroplating according to the thickness of the PCB plate.
  • the thickness of the electroplated copper layer is about 20-30um.
  • the depth of the back drill is the sum of the thickness of the plating layer and the thickness of the copper foil.
  • the depth of the back drilling corresponds to the sum of the thickness of the plating layer and the thickness of the copper foil.
  • the depth of the back drilling can be relatively deep, which is insufficient In order to make the problem of height difference in the inner hole.
  • the back surface of the first daughter board 100 is pressed against the front surface of the second daughter board 101 to obtain a first double-sided board with a blind hole area. Since the first daughter board 100 and the second daughter board 101 are pressed together by the sheet-like adhesive material 105, the second through holes 102 on the first daughter board 100 and the second daughter board 101 are all stuck by the sheet-like Material 105 gets blind holes. In addition, at the time of lamination, a resin layer with poor adhesiveness is added to the surface of the first daughter board 100 and the surface of the second daughter board 101 so as to obtain the resin layer 104 by lamination.
  • the step S40 is: removing the copper foil on the third double-sided board to obtain a double-sided crimped backplane.
  • the production method of the double-sided crimping backplane further includes: through-hole drilling two daughter boards respectively to obtain a first daughter board and a second daughter board, wherein, the first daughter board
  • the structure is the same as that of the second daughter board, and each of them is provided with a plurality of second through holes.
  • the production method of the double-sided crimping back board further includes: after back drilling some of the through holes in the plurality of second through holes, step S10 is performed . Referring to Fig. 3, drill back before pressing the two daughter boards to ensure signal integrity.
  • a resin layer is added on the front and back surfaces of the first daughter board and the front and back surfaces of the second daughter board.
  • the resin layer is a PP layer with poor flowability, see FIG. 4.
  • step S10 is: pressing the back surface of the first daughter board and the front surface of the second daughter board with sheet adhesive materials on the front and back surfaces of the first daughter board and the front and back surfaces of the second daughter board , And one end of the first through hole is blocked by a sheet-shaped adhesive material to obtain a blind hole area.
  • the sheet-shaped adhesive material is shown in FIG. 4, which is a sheet-shaped adhesive material synthesized by resin and carrier, so that the back surface of the first daughter board and the front surface of the second daughter board can be effectively pressed together, and used to form the blind hole 103.
  • both the through hole area and the blind hole area are provided with ground holes and signal holes.
  • Ground holes and signal holes are beneficial to the signal integrity of the circuit board.
  • the embodiments of the present disclosure also provide a double-sided crimping backplane, which is prepared by the production method of the double-sided crimping backplane;
  • the double-sided crimping backplane includes a first daughterboard 100 and a second daughterboard 101, both of which are provided with blind hole areas; the back of the first daughterboard 100 and the second daughterboard 101 The front of the is pressed and a through hole area is formed by drilling;
  • the first through hole 107 adjacent to the through hole area and the blind hole area is back drilled, and a protective film 106 and a thickened layer 109 are sequentially stacked around the first through hole 107;
  • the protective film 106 is a copper foil 106 and a thickened layer 109 is an electroplating layer 109, and the electroplating layer 109 is a copper layer;
  • the thickness of the thickened layer 109 corresponds to the depth of the back drill.
  • the protective film 106 is a copper foil
  • the thickening layer 109 is a copper layer.
  • the front and back surfaces of the first daughter board 100 and the front and back surfaces of the second daughter board 101 are provided with a resin layer 104.
  • the back surface of the first daughter board 100 and the front surface of the second daughter board 101 are pressed together by a sheet-shaped adhesive material 105.
  • both the through hole area and the blind hole area are provided with ground holes and signal holes.
  • FIG. 9 is a schematic view of the structure of the connector for the double-sided crimping backplane.
  • a plurality of connectors 110 are inserted into the double-sided crimping backplane, wherein the holes with serial numbers AG (all round are holes) are blind holes 103, and the holes with serial number HN (all round The holes are all through holes 107. All squares except the connector 110 are electroplated layers 109, that is, copper layers.
  • row H because row H is a back-drilled through-hole 107, and the connector 110 comes with a bottom support seat (not shown), and the hole between the bottom support seat and the connector 110 has a 0.3 mm avoidance
  • the distance if using the double-panel shown in Figure 1 in some cases, will obviously cause a height difference, the deviation is as high as 0.34mm.
  • the through hole 107 in row H that is, the first through hole 107 adjacent to the through hole area and the blind hole area, see FIG. 7, after removing the copper foil 106, the first through hole 107 is blind Since the copper foil 106 is removed in the hole area, the plating layer 109 is also removed. Therefore, the height of the blind hole area is only increased by the resin layer 104; and the increase in the through hole area is the copper foil 106 and the plating layer 109.
  • the through hole 107 is back drilled so that the depth of the back drill is the sum of the thickness of the copper foil 106 and the plating layer 109, so that the height of the first through hole after back drilling is consistent with the height of the adjacent blind hole area is:
  • the copper dots in the area are in the inner layer, and the copper dots in the via area are in the outer layer.
  • the copper in the outer layer is about 30um thicker than the inner layer, which results in the entire connector being at the same height. Therefore, the connector 110 is at the same height and there is no difference in height, thereby effectively avoiding the problems caused by the difference in height of the connector 110 and effectively avoiding the above four risks.
  • the depth of the first through hole after back drilling is the same as the depth of the blind hole in the adjacent blind hole area.
  • the surface of the inner hole of the connector passes through the back drilling depth and the thickness of the thickness is uniform, The surface of the inner hole is on the same horizontal plane, thereby effectively avoiding the problem of height difference on the surface of the inner hole of the connector.
  • the present disclosure provides a double-sided crimped backplane and a production method thereof.
  • the first sub-board and the second sub-board are pressed together to obtain a blind hole area, and the first double-sided board is processed with a protective film Then, through-hole drilling is performed to obtain the second double-sided board with through-holes, and the thickening process is performed so that the second double-sided board with blind hole regions and through-hole regions is obtained.
  • the front and back sides are protected by a protective film, and the through hole is thickened after drilling, so that the blind hole has been protected by the protective film, and only the thickening of the through hole area is realized. Therefore, after removing the protective film, pass The thickness of the outer layer of the hole area is greater than the thickness of the outer layer of the blind hole area.
  • the thickness of the outer layer of the through hole area is the sum of the thickness of the protective film and the thickened thickness. Therefore, the through hole area is adjacent to the blind hole area
  • the first through hole is back drilled, and the back drill depth corresponds to the thickness of the thickening process, so that the depth of the first through hole after back drilling is the same as the blind hole depth of the adjacent blind hole area, inserted in the connector
  • the surface of the inner hole of the connector passes through the same depth of back drilling and thickening thickness, and the surface of the inner hole is on the same horizontal plane, thereby effectively avoiding the problem of difference in height of the surface of the inner hole of the connector.

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Abstract

双面压接背板及其生产方法，该生产方法包括：将第一子板（100）的背面与第二子板（101）的正面进行压合，得到带有盲孔区域的第一双面板；在对第一双面板的正反两面保护膜加工后进行通孔钻孔，并进行增厚加工，得到带有盲孔区域和通孔区域的第二双面板；对通孔区域中与盲孔区域相邻的第一通孔（107）进行背钻得到第三双面板；对第三双面板进行去除保护膜加工，得到双面压接背板。

Description

双面压接背板及其生产方法
本公开要求享有2018年12月05日提交的名称为“双面压接背板及其生产方法”的中国专利申请CN201811483445.4的优先权，其全部内容通过引用并入本文中。
技术领域
本公开涉及电路板设计技术领域，尤其涉及一种双面压接背板及其生产方法。
背景技术
随着5G的发展，运营商需要面对5G业务的大流量、低延时、大带宽的挑战，在通讯设备中，背板为同一设备中各个模块之间提供物理和电气互连。随着技术的发展以及用户对带宽需求的激增，线卡与交换卡之间数据链路速率也越来越高，由于背板中有相当一部分需要使用高密连接器连接线卡和交换卡，不断挑战背板传输速率的极限。背板印制电路板的集成度要求越来越高，使得板上器件的组装越来越多，布线布局密度越来越大，使得背板印制电路板的设计难度也越来越大。因此，需要要求背板印制电路板具有更高的设计灵活性，尤其是在加工和装配过程中能够适应各种高密器件。
基于现有的背板印制电路板技术已经不能满足产品的高集成度和高可靠性要求，通常采用双面盲通孔压接方案，但是，在双面盲通孔压接背板的方案中，先进的盲通孔会导致背板连接器有一定的高度差，PCB同一连接器内高度有差异，由于通孔、盲孔加工流程不同步，且同时需要对H孔进行背钻，使得同一连接器内孔表面存在一定的高度差。
如图1所示，孔1为盲孔；孔2为通孔，加工至成品后进行背钻；孔3为通孔，相关标注如下表(以下均按IPC2标准)。
Figure PCTCN2019123294-appb-000001
从上可以看出，同一连接器内最大高度差在2孔与3孔之间，理论最大高度偏差为d+b＝0.25+0.09＝0.34mm；
这个问题严重影响背板的可靠性，对未来的生产工艺造成不可估量的损失。
如图1所示，如果不采取措施，将有以下4种风险：
风险1：孔2在压接时无法压接针充分接触，可能导致压接不牢固。
风险2：孔2在压接时背钻低端孔铜被破坏，可能导致电性能不良。
风险3：新双面盲孔背板使用连接器内置有金属屏蔽垫片，可能与孔3外层盘接触，导致连接器短路。
风险4：孔位精度问题，新双面盲孔背板目前同一连接器内孔为精度为+/-3.5mm，可能出现压接跪针。
发明内容
本公开提供一种双面压接背板及其生产方法，旨在解决一些情况中背钻后同一连接器内孔表面存在一定高度差的问题。
为实现上述目的，本公开提供一种双面压接背板的生产方法，所述双面压接背板的生产方法包括：将第一子板的背面与第二子板的正面进行压合，得到带有盲孔区域的第一双面板；对所述第一双面板的正反两面保护膜加工后进行通孔钻孔，并进行增厚加工，得到带有盲孔区域和通孔区域的第二双面板；对所述通孔区域中与盲孔区域相邻的第一通孔进行背钻得到第三双面板，其中，所述背钻的深度与所述增厚加工的厚度相对应；对所述第三双面板进行去除保护膜加工，得到双面压接背板。
本公开实施例还提供一种双面压接背板，所述双面压接背板由上述的双面压接背板的生产方法制备；所述双面压接背板包括第一子板、第二子板，所述第一子板及第二子板均设有盲孔区域；所述第一子板的背面与所述第二子板的正面压合且通过钻孔形成通孔区域；所述通孔区域与所述盲孔区域相邻的第一通孔通过背钻，且所述第一通孔的四周依次层叠有保护膜及增厚层；所述增厚层的厚度与所述背钻的深度相对应。
附图说明
图1是一些情况的结构示意图；
图2是本公开实施例方案涉及的双面压接背板生产方法的第一实施例的流程示意图；
图3是第一实施例中子板的结构示意图；
图4是第一实施例中步骤S10得到的第一双面板的结构示意图；
图5是第一实施例中步骤S20得到的第二双面板的结构示意图；
图6是第一实施例中步骤S30得到的第三双面板的结构示意图；
图7是第一实施例中步骤S40得到的双面压接背板的结构示意图；
图8是本公开实施例方案涉及的双面压接背板生产方法的第二实施例的流程示意图；
图9是本公开的双面压接背板使用连接器的结构示意图。
附图标号说明：
标号 名称 标号 名称
100 第一子板 101 第二子板
102 第二通孔 103 盲孔
104 树脂层 105 片状粘结材料
106 铜箔 107 第一通孔
108 第三通孔 109 电镀层
110 连接器    
本公开目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的实施例仅仅用以解释本公开，并不用于限定本公开。
本公开实施例提供一种双面压接背板的生产方法。
参照图2-4，图2是本公开双面压接背板的生产方法第一实施例的流程示意图，图3是子板的结构示意图；图4是第一实施例中步骤S10得到的第一双面板的结构示意图。
如图2所示，本公开双面压接背板的生产方法包括：
步骤S10，将第一子板的背面与第二子板的正面进行压合，得到带有盲孔区域的第一双面板。
本实施例中，将第一子板的背面与第二子板的正面进行压合，得到带有盲孔区域的第一双面板。针对有盲孔的PCB，加工时，通常会分为两个子板，其中，盲孔在子板中进行通孔钻孔，再将两块子板压合到一起，并且，通孔的一端通过压合的材料封堵，从而得到盲孔。本案的第一子板和第二子板结构一致，对二者加工时，针对有需要的位置进行通孔钻孔后，将第一子板的背面和第二子板的正面进行压合，得到第一双面板，形成盲孔区域。
第一子板100和第二子板101的结构均参阅图3，第一子板100与第二子板101的结构一致，均开设有多个第二通孔102，且部分第二通孔102背钻。
如图4所示，第一子板100的背面与第二子板101的正面进行压合，得到带有盲孔区域的第一双面板。由于第一子板100与第二子板101之间通过片状粘结材料105压合，因此，第一子板100和第二子板101上的第二通孔102均通过片状粘结材料105得到盲孔103。并且，压合时，在第一子板100的表面及第二子板101的表面增加流胶性差的树脂层，即PP层，得到树脂层104。
步骤S20，对所述第一双面板的正反两面保护膜加工后进行通孔钻孔，并进行增厚加 工，得到带有盲孔区域和通孔区域的第二双面板。
本实施例中，在将第一子板与第二子板压合后，得到第一双面板，对第一双面板的正反两面贴上保护膜，然后进行通孔钻孔，再进行增厚加工处理，从而得到带有盲孔区域和通孔区域的第二双面板。本案中的保护膜优选为铜箔，在第一双面板的正反双面贴上铜箔，在有需要的地方进行通孔钻孔，从而得到带有通孔的第二双面板，且通孔为I型，再进行增厚加工，本案的增厚加工优选为电镀处理。可以采用镀铜的方式，根据PCB板材的厚度，进行电镀，电镀的铜层厚度约为20-30um。
请参阅图5，保护膜为铜箔106，第一双面板的正反两面均贴上铜箔106，在进行通孔钻孔，得到多个第三通孔108，部分第三通孔靠近盲孔区域的定义为第一通孔107，用于背钻；请参阅图6，图6进行了增厚加工，增厚加工为电镀，得到电镀层109，电镀的铜层厚度约为20-30um。
步骤S30，对所述通孔区域中与盲孔区域相邻的第一通孔进行背钻得到第三双面板，其中，所述背钻的深度与所述增厚加工的厚度相对应。
本实施例中，对所述通孔区域中与盲孔区域相邻的第一通孔进行背钻得到第三双面板，其中，所述背钻的深度与所述增厚加工的厚度相对应。由于在插接连接器时，若连接器插接在盲孔区域或者是通孔区域时，由于盲孔区域的高度及通孔区域的高度均一致，因此，不管是在盲孔区域还是通孔区域插接，均不会有连接器内孔出现高度差的问题；但是，若连接器插接的孔既有盲孔，又有通孔，则会引起高度差的问题。
针对高度差的问题，本案将与通孔区域中与盲孔区域相邻的第一通孔进行背钻，且背钻的深度与增厚加工的厚度相对应，使得连接器在插接时，能保持高度一致。
参阅图6，在电镀后对第一通孔107进行背钻，且背钻的深度与增厚加工的厚度相对应。
步骤S40，对所述第三双面板进行去除保护膜加工，得到双面压接背板。
本实施例中，在背钻得到第三双面板之后，将保护膜去除掉，得到双面压接背板。本案的保护膜优选为铜箔106。
参阅图7，去除铜箔后，得到本案的双面压接背板。
相比一些情况，本公开提供了一种双面压接背板及其生产方法，通过第一子板和第二子板压合，得到盲孔区域，通过对第一双面板进行保护膜加工后进行通孔钻孔，得到带通孔的第二双面板，并且，进行增厚加工，使得得到带有盲孔区域和通孔区域的第二双面板，此时，由于对第一双面板的正反两面先进行保护膜保护，在通孔钻孔后进行增厚加工，使得盲孔已经被保护膜保护，仅仅实现对通孔区域的增厚加工，从而，在去除保护膜后，通孔区域的外层的增厚厚度大于盲孔区域的外层厚度，通孔区域的外层增厚厚度为保护膜厚度与增厚厚度之和，因此，通孔区域中与盲孔区域相邻的第一通孔进行背钻，且背钻深度 与增厚加工的厚度相对应，使得第一通孔在背钻后的深度与相邻的盲孔区域的盲孔深度一致，在连接器插入时，连接器的内孔表面通过高度一致的背钻深度、增厚厚度，使得内孔表面处于同一水平面上，从而有效避免连接器内孔表面存在高度差的问题。
基于第一实施例，提出本公开双面压接背板的生产方法的第二实施例，如图8所示，所述保护膜为铜箔；步骤S20包括：步骤S201，在所述第一双面板的正反两面均压合铜箔后进行通孔钻孔，得到带有通孔区域的第二双面板；步骤S202，对所述第二双面板的正反两面进行电镀，得到所述第二双面板。
本实施例中，在第一双面板的正反双面贴上铜箔，在有需要的地方进行通孔钻孔，从而得到带有通孔的第二双面板，且通孔为I型，再进行增厚加工，本案的增厚加工优选为电镀处理。可以采用镀铜的方式，根据PCB板材的厚度，进行电镀，电镀的铜层厚度约为20-30um。
在一个实施例中，所述背钻的深度为所述电镀层的厚度与所述铜箔的厚度之和。
为了避免一些情况中连接器插接后内孔出现高度差的问题，背钻时的深度与电镀层的厚度及铜箔的厚度之和相对应，当然，背钻的深度可以相对深一些，不足以使得内孔出现高度差的问题均可。
参阅图4，第一子板100的背面与第二子板101的正面进行压合，得到带有盲孔区域的第一双面板。由于第一子板100与第二子板101之间通过片状粘结材料105压合，因此，第一子板100和第二子板101上的第二通孔102均通过片状粘结材料105得到盲孔。并且，压合时，在第一子板100的表面及第二子板101的表面增加流胶性差的的树脂层，以便压合，得到树脂层104。
在一个实施例中，参阅图7，所述步骤S40为：去除所述第三双面板上的铜箔，得到双面压接背板。
在步骤S10之前，所述双面压接背板的生产方法还包括：对两块子板分别进行通孔钻孔，得到第一子板和第二子板，其中，所述第一子板和第二子板的结构一致，且均开设有多个第二通孔。
在对两块子板分别进行通孔钻孔之后，所述双面压接背板的生产方法还包括：对多个所述第二通孔中的部分通孔进行背钻后，执行步骤S10。参阅图3，在压合两块子板前背钻，保证信号的完整性。
在一个实施例中，在对多个所述第二通孔中的部分通孔进行背钻后，在所述第一子板的正面和背面、第二子板的正面和背面增加树脂层。树脂层为流胶性差的的PP层，参阅图4。
在一个实施例中，步骤S10为：在第一子板的正面和背面、第二子板的正面和背面采用片状粘结材料将第一子板的背面与第二子板的正面压合，且第一通孔的一端通过片状粘结材料封堵，得到盲孔区域。片状粘结材料如图4，是树脂与载体合成的一种片状粘结材料，使得第一子板的背面与第二子板的正面能够有效压合，且用于形成盲孔103。
在一个实施例中，通孔区域和盲孔区域上均设有地孔和信号孔。地孔和信号孔有利于电路板的信号完整性。
此外，本公开实施例还提供一种双面压接背板，双面压接背板由双面压接背板的生产方法制备；
双面压接背板包括第一子板100、第二子板101，第一子板100及第二子板101均设有盲孔区域；第一子板100的背面与第二子板101的正面压合且通过钻孔形成通孔区域；
通孔区域与盲孔区域相邻的第一通孔107通过背钻，且第一通孔107的四周依次层叠有保护膜106及增厚层109；保护膜106为铜箔106，增厚层109为电镀层109，且电镀层109为铜层；
增厚层109的厚度与背钻的深度相对应。
在一个实施例中，保护膜106为铜箔，且增厚层109为铜层。
在一个实施例中，第一子板100的正面和背面、第二子板101的正面和背面均设有树脂层104。
在一个实施例中，第一子板100的背面与第二子板101的正面通过片状粘结材料105压合。
在一个实施例中，通孔区域和盲孔区域上均设有地孔和信号孔。
请参阅图9，图9为双面压接背板使用连接器的结构示意图。
如图9所示，双面压接背板上插接有多个连接器110，其中，序号A-G的孔(所有圆形的均为孔)均为盲孔103，序号H-N的孔(所有圆形的均为孔)均为通孔107，所有方形除连接器110外均为电镀层109，即铜层，在序号A-G的区域中，由于都是盲孔103，高度一致，因此，在插接连接器110时，不会存在使连接器110内孔高度不一致的问题；同理，在序号J-N的区域中，由于都是通孔108，高度一致，因此，在插接连接器110时，同样不会存在使连接器110内孔高度不一致的问题。然而，在H行时，由于H行是背钻后的通孔107，而连接器110自带底部支撑座(图未示)，并且，底部支撑座与连接器110的孔有0.3mm的避让距离，若采用一些情况的如图1所示的双面板，很明显会造成高度差，偏差高达0.34mm。
通过本案的双面板的设计，H行的通孔107，即通孔区域与盲孔区域中相邻的第一通孔107，参阅图7，第一通孔107在去除铜箔106后，盲孔区域由于去除了铜箔106，同样会去除电镀层109，因此，盲孔区域的高度仅仅增加了树脂层104；而通孔区域增加的是 铜箔106、电镀层109，再者，第一通孔107通过背钻，使得背钻深度为铜箔106、电镀层109的厚度之和，从而使得背钻后的第一通孔高度与相邻的盲孔区域高度一致，为：在盲孔区域的铜点在内层，通孔区域的铜点在外层，外层的铜比内层的厚约30um，这样导致整个连接器在同一高度。因此，使得连接器110处于同一高度，不存在高度差的现象，从而有效避免因连接器110有高度差而产生的问题，有效避免上述四种风险。
本公开使得第一通孔在背钻后的深度与相邻的盲孔区域的盲孔深度一致，在连接器插入时，连接器的内孔表面通过高度一致的背钻深度、增厚厚度，其内孔表面处于同一水平面上，从而有效避免连接器内孔表面存在高度差的问题。相比一些情况，本公开提供了一种双面压接背板及其生产方法，通过第一子板和第二子板压合，得到盲孔区域，通过对第一双面板进行保护膜加工后进行通孔钻孔，得到带通孔的第二双面板，并且，进行增厚加工，使得得到带有盲孔区域和通孔区域的第二双面板，此时，由于对第一双面板的正反两面先进行保护膜保护，在通孔钻孔后进行增厚加工，使得盲孔已经被保护膜保护，仅仅实现对通孔区域的增厚加工，从而，在去除保护膜后，通孔区域的外层的增厚厚度大于盲孔区域的外层厚度，通孔区域的外层增厚厚度为保护膜厚度与增厚厚度之和，因此，通孔区域中与盲孔区域相邻的第一通孔进行背钻，且背钻深度与增厚加工的厚度相对应，使得第一通孔在背钻后的深度与相邻的盲孔区域的盲孔深度一致，在连接器插入时，连接器的内孔表面通过高度一致的背钻深度、增厚厚度，其内孔表面处于同一水平面上，从而有效避免连接器内孔表面存在高度差的问题。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者系统不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者系统所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者系统中还存在另外的相同要素。
以上所述仅为本公开的优选实施例，并非因此限制本公开的专利范围，凡是利用本公开说明书及附图内容所作的等效结构或流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本公开的专利保护范围内。

Claims (14)

  1. 一种双面压接背板的生产方法，其中，所述双面压接背板的生产方法包括：
    将第一子板的背面与第二子板的正面进行压合，得到带有盲孔区域的第一双面板；
    对所述第一双面板的正反两面保护膜加工后进行通孔钻孔，并进行增厚加工，得到带有盲孔区域和通孔区域的第二双面板；
    对所述通孔区域中与盲孔区域相邻的第一通孔进行背钻得到第三双面板，其中，所述背钻的深度与所述增厚加工的厚度相对应；
    对所述第三双面板进行去除保护膜加工，得到双面压接背板。
  2. 根据权利要求1所述的双面压接背板的生产方法，其中，所述保护膜为铜箔；所述对所述第一双面板的正反两面保护膜加工后进行通孔钻孔，并进行增厚加工，得到带有盲孔区域和通孔区域的第二双面板的步骤包括：
    在所述第一双面板的正反两面均压合铜箔后进行通孔钻孔，得到带有通孔区域的第二双面板；
    对所述第二双面板的正反两面进行电镀，得到所述第二双面板。
  3. 根据权利要求2所述的双面压接背板的生产方法，其中，所述背钻的深度为所述电镀层的厚度与所述铜箔的厚度之和。
  4. 根据权利要求2所述的双面压接背板的生产方法，其中，所述对所述第三双面板进行去除保护膜加工，得到双面压接背板的步骤包括：
    去除所述第三双面板上的铜箔，得到双面压接背板。
  5. 根据权利要求1所述的双面压接背板的生产方法，其中，所述将第一子板的背面与第二子板的正面进行压合，得到带有盲孔区域的第一双面板的步骤之前，所述双面压接背板的生产方法还包括：
    对两块子板分别进行通孔钻孔，得到第一子板和第二子板，其中，所述第一子板和第二子板的结构一致，且均开设有多个第二通孔。
  6. 根据权利要求5所述的双面压接背板的生产方法，其中，所述对两块子板分别进行通孔钻孔的步骤之后，所述双面压接背板的生产方法还包括：
    对多个所述第二通孔中的部分通孔进行背钻后，执行所述将第一子板的背面与第二子 板的正面进行压合的步骤。
  7. 根据权利要求6所述的双面压接背板的生产方法，其中，所述对多个所述第二通孔中的部分通孔进行背钻的步骤之后，所述双面压接背板的生产方法还包括：
    在所述第一子板的正面和背面、第二子板的正面和背面增加树脂层。
  8. 根据权利要求7所述的双面压接背板的生产方法，其中，所述将第一子板的背面与第二子板的正面进行压合，得到带有盲孔区域的第一双面板的步骤还包括：
    在所述第一子板的正面和背面、第二子板的正面和背面采用片状粘结材料将第一子板的背面与第二子板的正面压合，且所述第二通孔的一端通过片状粘结材料封堵，得到盲孔区域。
  9. 根据权利要求1至8中任一项所述的双面压接背板的生产方法，其中，所述通孔区域和盲孔区域上均设有地孔和信号孔。
  10. 一种双面压接背板，其中，所述双面压接背板由权利要求1-9中任一项所述的双面压接背板的生产方法制备；
    所述双面压接背板包括第一子板、第二子板，所述第一子板及第二子板均设有盲孔区域；所述第一子板的背面与所述第二子板的正面压合且通过钻孔形成通孔区域；
    所述通孔区域与所述盲孔区域相邻的第一通孔通过背钻，且所述第一通孔的四周依次层叠有保护膜及增厚层；
    所述增厚层的厚度与所述背钻的深度相对应。
  11. 如权利要求10所述的双面压接背板，其中，所述保护膜为铜箔，且所述增厚层为铜层。
  12. 如权利要求10所述的双面压接背板，其中，所述第一子板的正面和背面、第二子板的正面和背面均设有树脂层。
  13. 如权利要求10所述的双面压接背板，其中，所述第一子板的背面与第二子板的正面通过片状粘结材料压合。
  14. 如权利要求10至13中任一项所述的双面压接背板，其中，所述通孔区域和盲孔 区域上均设有地孔和信号孔。
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