WO2020107592A1 - 电卡制冷装置及制冷方法 - Google Patents

电卡制冷装置及制冷方法 Download PDF

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Publication number
WO2020107592A1
WO2020107592A1 PCT/CN2018/123209 CN2018123209W WO2020107592A1 WO 2020107592 A1 WO2020107592 A1 WO 2020107592A1 CN 2018123209 W CN2018123209 W CN 2018123209W WO 2020107592 A1 WO2020107592 A1 WO 2020107592A1
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Prior art keywords
heat
electric card
material layer
cooling
card material
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English (en)
French (fr)
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于淑会
阮盼盼
于均益
孙蓉
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Shenzhen Institute of Advanced Technology of CAS
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Shenzhen Institute of Advanced Technology of CAS
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Definitions

  • the invention relates to the technical field of electromechanical engineering, in particular to an electric card refrigeration device and a refrigeration method.
  • Refrigeration technology plays a vital role in people's daily lives. It is widely used, from the use of air conditioners, the preservation of food, to the protection of various electronic devices.
  • the traditional vapor compression refrigeration will emit organic gases, causing damage to the environment, and has reached the limit; the new type of thermoelectric refrigeration is too low to be suitable for large-scale and large cooling capacity; the magnetic field generation in the magnetic card refrigeration requires magnets, which hinders
  • the miniaturization of refrigeration devices is very inflexible in design. Therefore, it is necessary to develop a refrigeration equipment with low cost, high energy conversion efficiency and environmental protection.
  • Electric card refrigeration equipment is based on the electric card effect, that is, by applying an electric field, the temperature of the material changes.
  • the temperature of the material increases when an electric field is applied, and when the electric field is removed, the temperature of the electric card material decreases to achieve cooling or heating purposes; and for materials with a negative electric card effect, The situation is just the opposite.
  • the present invention provides an electric card cooling device and a cooling method that can be commercialized.
  • the electric card cooling device has a simple structure, is easy to implement, and has a good cooling effect.
  • An electric card refrigerating device includes a disc-shaped electric card material layer, two electrodes respectively connected to the upper and lower surfaces of the electric card material layer, arranged on the periphery of the electric card material layer and opposite to the electric card material layer
  • a rotating heat conduction ring which is formed by connecting the heat conduction part and the heat insulation part end to end in the circumferential direction, and the electric card material layer can be controlled to be periodically powered on and off through the two electrodes;
  • At least one of the heat-insulating portions blocks the cooling inlet to isolate heat
  • at least one of the heat-conductive portions blocks the cooling inlet to transfer heat.
  • the heat conducting ring is disposed in contact with the electric card material layer.
  • the thermally conductive portion is at least one of copper, aluminum, graphene, BN (boron nitride), graphite, carbon fiber, and C/C (carbon/carbon) composite material.
  • the heat-conducting ring includes at least two heat-conducting parts and at least two heat-insulating parts, and the number of the cooling inlets is consistent with the number of the heat-conducting parts and the number of the heat-insulating parts .
  • each of the electric card material layers and one of the heat conduction rings form a cooling unit
  • the electric card cooling device includes a plurality of layers of the cooling units stacked one above the other.
  • the heat conduction portion of the cooling unit of at least one layer coincides with the orthographic projection of the heat conduction portion of the cooling unit of the adjacent layer.
  • the heat conduction portion of the refrigeration unit of at least one layer coincides with the orthographic projection of the heat insulation portion of the refrigeration unit of the adjacent layer.
  • the electric card refrigeration device further includes a heat insulation sheet for heat insulation, and a layer of the heat insulation sheet is interposed between the two heat conduction rings whose orthographic projections of the heat conduction portions of adjacent layers overlap .
  • the thickness of the heat-insulating portion is greater than the sum of the thickness of the electric card material layer and the two electrodes, and the thickness of the heat-conducting portion is not greater than the thickness of the heat-insulating portion and not less than the electrical The sum of the thickness of the card material layer and the two electrodes.
  • Another object of the present invention is to provide a cooling method using any one of the above electric card cooling devices, including:
  • the electric card refrigeration device of the present invention has a simple structure and is easy to implement. By controlling the rotation of the heat conducting ring relative to the internal electric card material layer, and periodically changing the on and off states of the electric card material layer accordingly, the device can continue to cool down , So that the device can maximize the maximum efficiency of the cooling effect.
  • FIG. 1 is a schematic structural diagram of an electric card refrigeration device according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic diagram of a first use state of an electric card refrigeration device according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic diagram of a second use state of an electric card refrigeration device according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 3 of the present invention.
  • FIG. 7 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 4 of the present invention.
  • FIG. 8 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 5 of the present invention.
  • FIG. 9 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 6 of the present invention.
  • an electric card cooling device includes a disc-shaped electric card material layer 11, two electrodes 12 respectively connected to the upper and lower surfaces of the electric card material layer 11, and disposed on the periphery of the electric card material layer 11 And a heat conducting ring 20 that rotates relative to the electric card material layer 11.
  • the heat conducting ring 20 is formed by connecting the heat conducting portion 21 and the heat insulating portion 22 end to end in the circumferential direction.
  • the electric card material layer 11 can be controlled to be periodically energized and Power off.
  • the electric card material layer 11 and the two electrodes 12 on the lower surface of the electrode form an electric card unit 10.
  • the cooling space as a cooling object has at least one cooling inlet.
  • At least one insulating portion 22 blocks cooling The inlet is to isolate heat.
  • at least one heat-conducting portion 21 blocks the cooling inlet to transfer heat.
  • Both the heat-conducting portion 21 and the heat-insulating portion 22 are arc blocks, preferably fan-shaped arc blocks.
  • the electric card material layer 11 is in contact with the thermally conductive ring 20, at least in contact with the thermally conductive portion 21 of the thermally conductive ring 20, to better transfer heat.
  • a heat insulating material for heat insulation may also be provided between the heat conducting portion 21 and the heat insulating portion 22 to prevent heat from being transferred from the heat conducting portion 21 to the heat insulating portion 22.
  • the heat-conducting portion 21 and the heat-insulating portion 22 are alternately arranged in the ring direction, the heat-conducting ring 20 is concentrically arranged with the electric card material layer 11, and the cooling inlet is arranged to communicate with at least one part of the heat-conducting ring.
  • the heat-conducting portion 21 and the heat-insulating portion 22 of the heat-conducting ring 20 alternately pass through the cooling inlet, and heat can be radiated to the cooling inlet through the heat-conducting portion 21, thereby cooling the refrigeration space
  • the temperature of the electric card material layer 11 increases, and during the electric card material layer 11 is powered off, the temperature of the electric card material layer 11 decreases. Therefore, when the electric card material layer 11 is energized, the insulating portion 22 blocks the cooling inlet to isolate the heat, and the heat of the electric card material layer 11 cannot be radiated into the cooling space.
  • the heat conduction portion 21 Rotating to block the cooling inlet to transfer heat, the heat of the electric card material layer 11 can be dissipated into the cooling space to achieve continuous cooling of the cooling space.
  • each cooling inlet is directly opposed to one heat-conducting portion 21 or heat-insulating portion 22.
  • the heat conducting ring 20 of this embodiment is described by taking four parts as an example.
  • the heat conducting ring 20 is composed of two heat conducting parts 21 and two heat insulating parts 22.
  • the heat conducting parts 21 and The heat-insulating portions 22 are connected end to end and are alternately arranged in the circumferential direction of the heat-conducting ring 20, and the cooling space has two cooling inlets corresponding to the number of heat-conducting portions 21.
  • the two electrodes 12 of the electric card material layer 11 are not energized, and the two heat-insulating portions 22 respectively correspond to the two cooling inlets.
  • the electric card material layer 11 is energized through the two electrodes 12, the temperature of the electric card material rises, but because the heat insulating portion 22 is blocked at the refrigeration inlet, the heat conduction portion 21 is staggered from the refrigeration inlet and is directly opposite to the external environment, Therefore, the heat of the electric card material layer 11 cannot enter the cooling space through the cooling inlet, and can only be dissipated into the external environment through the heat conducting portion 21 located outside the cooling inlet; the heat conducting ring 20 rotates relative to the electric card material layer 11 when the heat insulating portion 22 When it rotates to be staggered from the refrigeration inlet, and the heat-conducting portion 21 rotates to correspond to the refrigeration inlet, the insulating portion 22 blocks the external environment, the electric card material layer 11 is de-energized and the temperature decreases, and the heat of the electric card material layer 11 enters
  • the thermally conductive portion 21 is a material with good thermal conductivity, such as gold, silver, copper, aluminum, zinc, titanium, tin, lead, nickel, steel, silicon, iron, silicon dioxide, SiC, GaAs, At least one of GaP, Kavor, graphene, BN, graphite, carbon fiber and C/C composite materials, thermally conductive rubber, and the like.
  • the heat insulation part 22 is glass fiber, asbestos, rock wool, slag wool, silicate, diatomaceous earth, expanded vermiculite, expanded perlite, foamed clay, lightweight concrete, microporous calcium silicate, foam glass, ceramic fiber , Heat-absorbing glass, heat reflective glass, insulating glass, at least one of aerogel felt, vacuum board, foam plastic, etc., preferably foam plastic, glass fiber, asbestos, rock wool, silicate aerogel felt , Vacuum board, etc.
  • the electric card material layer 11 is at least one of single crystal, ferroelectric ceramic, ferroelectric thin film, ferroelectric polymer, ferroelectric polymer composite material and the like.
  • the electrode 12 is at least one of a metal alloy electrode, a coated electrode, a porous gas diffusion electrode, and the like.
  • the diameter of the electric card material layer 11 is preferably 1 ⁇ m to 1 m, and the thickness is 1 nm to 1 m.
  • the diameter of the electrode 12 is preferably 1 ⁇ m to 1 m, and the thickness is 1 nm to 10 cm.
  • the diameter of the heat-conducting portion 21 and the heat-insulating portion 22 is preferably 1 ⁇ m to 1 m, and the thickness is 1 nm to 1 m.
  • the electrode 12 is preferably at least one of a metal alloy electrode, a coated electrode, a porous gas diffusion electrode, and the like.
  • this embodiment does not limit the number of the heat conduction portion 21 and the heat insulation portion 22 in the heat conduction ring 20, and the number of the heat conduction portion 21 and the heat insulation portion 22 may be one or more.
  • the method of using the above electric card cooling device to achieve cooling includes:
  • the voltage is periodically applied to and removed from the electric card material layer 11 through the two electrodes 12, and the heat conduction ring 20 is controlled to rotate relative to the electric card material layer 11;
  • At least one insulating portion 22 blocks the cooling inlet to isolate heat
  • At least one heat-conducting portion 21 rotates to block the cooling inlet to transfer heat.
  • the cooling space can be To achieve continuous cooling.
  • the electric card cooling device of this embodiment is based on the electric card material layer 11 and the heat conducting ring 20 in Embodiment 1.
  • Each electric card material layer 11 and a heat conducting ring 20 form a cooling unit
  • the card refrigeration device includes a plurality of layers of cooling units stacked up and down, and the heat conduction rings 20 of the cooling units of each layer are stacked together with no gap between the two.
  • the number of cooling inlets is the same as the number of heat conducting parts 21 and the number of heat insulating parts 22.
  • the orthographic projections of the heat conduction portion 21 of the cooling unit of at least one layer and the heat conduction portion 21 of the cooling unit of the adjacent layer coincide. That is, the heat conduction portion 21 and the heat insulation portion 22 of at least one layer of the heat conduction ring 20 are directly opposite to the heat conduction portion 21 and the heat insulation portion 22 of the lower layer, and the two heat conduction portions 21 overlap each other.
  • the electricity card material layers 11 of all refrigeration units are regularly turned on and off, so that all The cooling inlets are cooled at the same time, and at the same time, the rotation speed of the heat conduction ring 20 is controlled so that the heat can be collected through the cooling inlets of each layer at the same time.
  • the heat conduction part 21 and the heat insulation part 22 are directly opposite the electric card material layer 11 of the two-layer refrigeration unit
  • the on-off state and the rotation speed of the heat-conducting ring 20 can be the same, which can greatly improve the cooling efficiency.
  • a heat insulating sheet for preventing heat from being emitted in the longitudinal direction may be interposed between the heat conduction ring 20 of the upper layer and the heat conduction ring 20 of the lower layer.
  • the electric card cooling device of this embodiment is also based on the electric card material layer 11 and the heat conduction ring 20 in Embodiment 1, and the heat conduction portion 21 of at least one cooling unit and the cooling unit of the adjacent layer
  • the orthographic projections of the heat-insulating portion 22 coincide, that is, the heat-conducting portion 21 and the heat-insulating portion 22 of at least one layer of the heat-conducting ring 20 are directly opposite to the heat-insulating portion 22 and the heat-conducting portion 21 of the lower layer, and the heat-conducting portions 21 of the two are in a staggered state.
  • the electric card cooling device of this embodiment further includes a heat insulation sheet 30 for heat insulation, and a layer is sandwiched between the two heat conduction rings 20 whose heat projections of the heat insulation portion 21 of the adjacent layer coincide with the orthographic projection of the heat conduction portion 21 of the adjacent layer
  • the heat insulation sheet 30 can prevent heat loss caused by heat transfer between the heat conduction ring 20 and the heat insulation sheet 30 opposed in the longitudinal direction.
  • the heat-insulating portion 22 and the heat-conducting portion 21 of the other-layer refrigeration device can be kept coincident with each other.
  • the heat insulating sheet 30 at least completely covers the heat conducting ring 20, for example, it may be consistent with the shape and size of the heat conducting portion 21 or larger than the area of the heat conducting ring 20.
  • the on and off states of the electric card material layer 11 of the two layers of the cooling unit with the heat conduction part 21 staggered from each other are opposite, and the rotation speed of the heat conduction ring 20 is the same, so that the heating/cooling processes of the two layers are the same To improve the cooling efficiency.
  • the thickness of the heat-insulating portion 22 of this embodiment is greater than the sum of the thicknesses of the electric card material layer 11 and the two electrodes 12, and the thickness of the heat-conducting portion 21 is not greater than the thickness of the heat-insulating portion 22, It is greater than or equal to the sum of the thickness of the electric card material layer 11 and the two electrodes 12.
  • the size of the cooling inlet is the same as the size of the heat-insulating portion 22.
  • the heat can also pass through The gap between the heat conduction portion 21 and the cooling inlet enters, and a part of the bottom surface of the heat conduction portion 21 can also serve as a heat dissipation surface, increasing the heat dissipation area.
  • each electrical card material layer 11 and a thermally conductive ring 20 in Embodiment 4 are regarded as a refrigeration unit, and the electrical card refrigeration device includes a plurality of layers stacked up and down In the provided cooling unit, the heat conduction rings 20 of the cooling units of each layer are stacked together, and a gap is formed between the electric card material layers 11 of the cooling units of each layer.
  • the number of cooling inlets is the same as the number of heat conducting parts 21 and the number of heat insulating parts 22.
  • the orthographic projections of the heat conduction portion 21 of the cooling unit of at least one layer and the heat conduction portion 21 of the cooling unit of the adjacent layer coincide. That is, the heat conduction portion 21 and the heat insulation portion 22 of at least one layer of the heat conduction ring 20 are directly opposite to the heat conduction portion 21 and the heat insulation portion 22 of the lower layer, and the two heat conduction portions 21 overlap each other.
  • the heat insulation portions 22 of the two-layer refrigeration units whose orthographic projections coincide are attached to each other, and the heat conduction portions 21 form a gap through which heat can pass.
  • the electricity card material layers 11 of all refrigeration units are regularly turned on and off, so that all The cooling inlets are cooled at the same time, and at the same time, the rotation speed of the heat conduction ring 20 is controlled so that the heat can be collected through the cooling inlets of each layer at the same time.
  • the heat conduction part 21 and the heat insulation part 22 are directly opposite the electric card material layer 11 of the two-layer refrigeration unit
  • the on-off state and the rotation speed of the heat-conducting ring 20 can be the same, which can greatly improve the cooling efficiency.
  • a heat insulating sheet for preventing heat from being emitted in the longitudinal direction may be interposed between the heat conduction ring 20 of the upper layer and the heat conduction ring 20 of the lower layer.
  • the electric card cooling device of this embodiment is also based on the electric card material layer 11 and the heat conduction ring 20 in the embodiment 4, at least one layer of the heat conduction portion 21 of the cooling unit and the adjacent layer of the cooling unit
  • the orthographic projections of the heat-insulating portion 22 coincide, that is, the heat-conducting portion 21 and the heat-insulating portion 22 of at least one layer of the heat-conducting ring 20 are directly opposite to the heat-insulating portion 22 and the heat-conducting portion 21 of the lower layer, and the heat-conducting portions 21 of the two are in a staggered state.
  • the on and off states of the electric card material layer 11 of the two layers of the cooling unit with the heat conduction portion 21 staggered from each other are opposite, and the rotation speed of the heat conduction ring 20 is the same, so that the heating/cooling process of the two layers is the same, and it can also start To improve the cooling efficiency.
  • a gap between the heat conduction rings 20 of the two-layer refrigeration unit is formed for heat to pass through, and a layer of heat insulation sheet 30 is interposed between the two heat conduction rings 20 of the two-layer refrigeration unit, which can prevent the longitudinally opposed heat conduction rings Heat is transferred between 20 and the heat insulating sheet 30 to cause heat loss.
  • the heat-insulating portion 22 and the heat-conducting portion 21 of the other-layer refrigeration device can be kept coincident with each other.
  • the electric card refrigeration device of the present invention has a simple structure and is easy to implement.
  • the on and off states of the electric card material layer are periodically changed accordingly.
  • the device can continue to cool down, so that the device can maximize the cooling efficiency of the maximum efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
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  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

一种电卡制冷装置，包括圆片形的电卡材料层（11）、分别连接电卡材料层（11）上电极下表面的两个电极（12）、设于电卡材料层（11）外围并相对于电卡材料层（11）转动的导热环（20），导热环（20）由导热部分（21）和绝热部分（22）在周向上首尾衔接而成，通过两个电极（12）可控制电卡材料层（11）周期性地通电和断电；在电卡材料层（11）升温过程中，至少一个绝热部分（22）阻挡制冷入口以隔绝热量，在电卡材料层（11）降温过程中，至少一个导热部分（21）阻挡制冷入口以传递热量。还公开了一种制冷方法。该电卡制冷装置结构简单、易于实现，通过控制导热环（20）相对于内部的电卡材料层（11）转动，并相应地周期性地改变电卡材料层（11）的通、断电状态即可使得装置持续降温，使得装置能够最大限度、最大效率地提高制冷效果。

Description

电卡制冷装置及制冷方法 技术领域
本发明涉及机电工程技术领域，尤其涉及一种电卡制冷装置及制冷方法。
背景技术
制冷技术在人们日常生活中发挥着至关重要的作用，其应用广泛，从空调的使用、食品的保鲜，到各种电子器件的保护。传统的蒸汽压缩式制冷会排放有机气体，对环境造成破坏，且已发展到了极限；新型热电制冷效率太低，不适宜于大规模和大制冷量使用；磁卡制冷中磁场的产生需要磁铁，阻碍了制冷器件的小型化，在设计上很不灵活。因此开发一种成本低、能量转换效率高、环保的制冷设备很有必要。
电卡制冷设备是基于电卡效应，即通过施加电场，材料温度发生改变。对具有正电卡效应的材料，施加电场时，材料温度升高，而在移去电场时，电卡材料温度降低，以此来达到制冷或制热目的；而对于具有负电卡效应的材料，情况恰好相反。
电卡效应研究始于上世纪30年代，但所得温度变化值不大。直到2006年，Mischenko等人(《Science》，2006，311(5765)：1270-1271)研究发现，PbZr0.95Ti0.0503薄膜在48MV/m电场作用下能产生12℃的温度变化，使得电卡材料用于制冷的目的再次得到广泛关注。近年来，科学家们也研究了各种无铅电卡材料以及聚合物和聚合物复合电卡材料，均得到了较大温度变化。其中，一些弛豫型铁电材料有较大的工作温度区间，还可以通过改变某些元素的含量，调整其工作温度。这些为电卡材料应用于各种工作环境提供了极大可能性。现于今，在大多数需要制冷的环境中，还是通过蒸汽压缩式制冷，而根据研究表明，基于电卡效应的电卡制冷能量转换效率更高，且不排放有机气体，对环境不会造成破坏，还具有质量轻、成本低、无噪音，在设计上灵活多样等众多优点。
研究者在电卡制冷材料的开发和性能方面已做了大量工作，但对于制冷器件的设计仍然鲜有报道，导致电卡制冷设备仅仅停留在理论设计阶段，无法很 好地实现商用化。
发明内容
鉴于现有技术存在的不足，本发明提供了一种可以实现商用化的电卡制冷装置及制冷方法，电卡制冷装置的结构简单、易于实现，制冷效果好。
为了实现上述的目的，本发明采用了如下的技术方案：
一种电卡制冷装置，包括圆片形的电卡材料层、分别连接所述电卡材料层上下表面的两个电极、设于所述电卡材料层外围并相对于所述电卡材料层转动的导热环，所述导热环由导热部分和绝热部分在周向上首尾衔接而成，通过两个所述电极可控制所述电卡材料层周期性地通电和断电；在所述电卡材料层升温过程中，至少一个所述绝热部分阻挡制冷入口以隔绝热量，在所述电卡材料层降温过程中，至少一个所述导热部分阻挡制冷入口以传递热量。
作为其中一种实施方式，所述导热环与所述电卡材料层接触设置。
作为其中一种实施方式，所述导热部分为铜、铝、石墨烯、BN(氮化硼)、石墨、碳纤维和C/C(炭/炭)复合材料中的至少一种。
作为其中一种实施方式，所述导热环包括至少两个所述导热部分与至少两个所述绝热部分，所述制冷入口的数量与所述导热部分的数量、所述绝热部分的数量均一致。
作为其中一种实施方式，每个所述电卡材料层与一个所述导热环组成一个制冷单元，电卡制冷装置包括复数层上下层叠设置的所述制冷单元。
作为其中一种实施方式，至少一层制冷单元的所述导热部分与相邻层的制冷单元的所述导热部分的正投影重合。
作为其中一种实施方式，至少一层制冷单元的所述导热部分与相邻层的制冷单元的所述绝热部分的正投影重合。
作为其中一种实施方式，电卡制冷装置还包括用于隔热的绝热片，所述绝热部分与相邻层的导热部分正投影重合的两个导热环之间夹设有一层所述绝热片。
作为其中一种实施方式，所述绝热部分的厚度大于所述电卡材料层与两个所述电极的厚度之和，所述导热部分的厚度不大于所述绝热部分，且不小于所 述电卡材料层与两个所述电极的厚度之和。
本发明的另一目的在于提供一种采用任意一种上述的电卡制冷装置的制冷方法，包括：
通过两个电极对电卡材料层周期性地施加电压和撤去电压，并控制所述导热环相对于所述电卡材料层转动；
对于具有正电卡效应的材料：在电卡材料层通电过程中温度升高，至少一个绝热部分阻挡制冷入口以隔绝热量；在电卡材料层断电过程中温度降低，至少一个导热部分转动至阻挡制冷入口以传递热量，而对于具有负电卡效应的材料，情况恰好相反。
本发明的电卡制冷装置结构简单、易于实现，通过控制导热环相对于内部的电卡材料层转动，并相应地周期性地改变电卡材料层的通、断电状态即可使得装置持续降温，使得装置能够最大限度、最大效率地提高制冷效果。
附图说明
图1为本发明实施例1的一种电卡制冷装置的结构示意图；
图2为本发明实施例1的一种电卡制冷装置的剖面结构示意图；
图3为本发明实施例1的一种电卡制冷装置的第一使用状态示意图；
图4为本发明实施例1的一种电卡制冷装置的第二使用状态示意图；
图5为本发明实施例2的一种电卡制冷装置的剖面结构示意图；
图6为本发明实施例3的一种电卡制冷装置的剖面结构示意图；
图7为本发明实施例4的一种电卡制冷装置的剖面结构示意图；
图8为本发明实施例5的一种电卡制冷装置的剖面结构示意图；
图9为本发明实施例6的一种电卡制冷装置的剖面结构示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，以具有正电卡效应的电卡材料为例，对本发明进一步详细说明。应当理解，本发明的电卡材料也可以是具有负电卡效应的材料，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
实施例1
参阅图1和图2，本发明实施例的电卡制冷装置包括圆片形的电卡材料层11、分别连接电卡材料层11上下表面的两个电极12、设于电卡材料层11外围并相对于电卡材料层11转动的导热环20，导热环20由导热部分21和绝热部分22在周向上首尾衔接而成，通过两个电极12可控制电卡材料层11周期性地通电和断电。电卡材料层11和电极下表面的两个电极12组成一个电卡单元10，作为制冷对象的制冷空间具有至少一个制冷入口，在电卡材料层11通电过程中，至少一个绝热部分22阻挡制冷入口以隔绝热量，在电卡材料层11断电过程中，至少一个导热部分21阻挡制冷入口以传递热量。
导热部分21和绝热部分22均为弧块，最好是扇环形弧块。电卡材料层11与导热环20接触，至少与导热环20的导热部分21接触，以更好地传递热量。
在有的实施方式中，导热部分21和绝热部分22之间也可以设置有用于隔热的绝热材料，以防止热量从导热部分21传到绝热部分22。
导热环20中，导热部分21和绝热部分22在环向上交替设置，导热环20与电卡材料层11同心设置，制冷入口设置为与导热环的至少一个部位连通。在导热环20相对于电卡材料层11转动的过程中，导热环20的导热部分21和绝热部分22交替地经过制冷入口，热量可以经过导热部分21散发至制冷入口，从而对制冷空间进行制冷，在电卡材料层11通电过程中，电卡材料层11温度升高，在电卡材料层11断电过程中，电卡材料层11温度降低。因此，当电卡材料层11通电过程中，绝热部分22阻挡制冷入口以隔绝热量，电卡材料层11的热量无法散发到制冷空间中，当电卡材料层11断电过程中，导热部分21转动至阻挡制冷入口以传递热量，电卡材料层11的热量可以散发到制冷空间中，实现制冷空间的持续降温。
导热环20中，导热部分21和绝热部分22的高度一致。绝热部分22的厚度等于电卡材料层11与两个电极12的厚度之和，初始状态下，每个制冷入口与一个导热部分21或绝热部分22正对。
为方便理解，本实施例的导热环20以四个部分为例进行说明，如图3和图4所示，导热环20由两个导热部分21和两个绝热部分22组成，导热部分21和绝热部分22首尾连接、交替地设置在导热环20的环向上，制冷空间具有两个制冷入口，与导热部分21的数量一致。
初始状态下，电卡材料层11的两个电极12并不通电，两个绝热部分22分别与两个制冷入口对应。当通过两个电极12对电卡材料层11通电的过程中，电卡材料的温度升高，但由于绝热部分22阻挡在制冷入口处，导热部分21与制冷入口错开而与外部环境正对，因此，电卡材料层11的热量无法通过制冷入口进入制冷空间，只能通过位于制冷入口外的导热部分21散发到外部环境中；导热环20相对于电卡材料层11转动，当绝热部分22转动至与制冷入口错开，而导热部分21转动至与制冷入口对应时，绝热部分22阻挡在外部环境处，电卡材料层11断电而温度降低，电卡材料层11的热量通过制冷入口进入制冷空间而使制冷空间温度降低……如此循环，当电卡材料层11通电而温度升高时热量被散发至环境空间中，当电卡材料层11断电而温度降低时热量始终被散发至制冷空间，制冷空间的温度始终只会降低而不会增高，因此，可以很好地保证制冷效率。
作为其中一种实施方式，导热部分21为导热性良好的材料，例如金、银、铜、铝、锌、钛、锡、铅、镍、钢、硅、铁、二氧化硅、SiC、GaAs、GaP、Kavor、石墨烯、BN、石墨、碳纤维和C/C复合材料、导热橡胶等中的至少一种。
绝热部分22为玻璃纤维、石棉、岩棉、矿渣棉、硅酸盐、硅藻土、膨胀蛭石、膨胀珍珠岩、发泡粘土、轻质混凝土、微孔硅酸钙、泡沫玻璃、陶瓷纤维、吸热玻璃、热反射玻璃、中空玻璃，气凝胶毡、真空板、泡沫塑料等中的至少一种，最好是泡沫塑料、玻璃纤维、石棉、岩棉、硅酸盐气凝胶毡、真空板等中的至少一种。
电卡材料层11为单晶、铁电陶瓷、铁电薄膜、铁电聚合物、铁电聚合物复合材料等中的至少一种。例如钛酸钡、钛铌酸钡、钛铬酸钡、钛酸锶钡、锆钛酸钡、锆钛酸铅、(Pb，La)(Zr，Sn，Ti)O 3、(Pb，La)(Zr，Ti)O 3、xPbMg 1/3Nb 2/3O 3-(1-x)PbTiO 3、Pb(Zr，Ti)O 3-CoFe 2O 4、[(K 0.5Na 0.5)NbO 3] (1-x)-[LiSbO 3] x、(Ba，Ce)(Ti，Mn)O 3、(Ba，Ca)(Ti，Zr)O 3、[(Na，Bi)TiO 3] (1-x)-[(K，Bi)TiO 3] (1-x)、Pb(Zr，Ti)O 3、Hf 0.5Zr 0.5O 2、(Ba，Ca)(Te，Ti)O 3、P(VDF-TrFE)、P(VDF-TrFE-CFE)、钛酸钡/P(VDF-TrFE)、钛铌酸钡/P(VDF-TrFE)、钛铬酸钡/P(VDF-TrFE)、钛酸锶钡/P(VDF-TrFE)、锆钛酸钡/P(VDF-TrFE)、锆钛酸铅/P(VDF-TrFE)、(Pb，La)(Zr，Sn，Ti)O 3/P(VDF-TrFE)、(Pb，La)(Zr，Ti)O 3/P(VDF-TrFE)、xPbMg 1/3Nb 2/3O 3-(1-x)PbTiO 3/P(VDF-TrFE)、Pb(Zr，Ti)O 3-CoFe 2O 4/P(VDF-TrFE)、(Pb，La)(Zr，Ti)O 3/P(VDF-TrFE)、[(K 0.5Na 0.5)NbO 3] (1-x)-[LiSbO 3] x/P(VDF-TrFE)、(Ba，Ce)(Ti，Mn)O 3/P(VDF-TrFE)、 (Ba，Ca)(Ti，Zr)O 3/P(VDF-TrFE)、[(Na，Bi)TiO 3] (1-x)-[(K，Bi)TiO 3] (1-x)/P(VDF-TrFE)、Pb(Zr，Ti)O 3/P(VDF-TrFE)、Hf 0.5Zr 0.5O 2/P(VDF-TrFE)、(Ba，Ca)(Te，Ti)O 3/P(VDF-TrFE)、钛酸钡/P(VDF-TrFE-CFE)、钛铌酸钡/P(VDF-TrFE-CFE)、钛铬酸钡/P(VDF-TrFE-CFE)、钛酸锶钡/P(VDF-TrFE-CFE)、锆钛酸钡/P(VDF-TrFE-CFE)、锆钛酸铅/P(VDF-TrFE-CFE)、(Pb，La)(Zr，Sn，Ti)O 3/P(VDF-TrFE-CFE)、(Pb，La)(Zr，Ti)O 3/P(VDF-TrFE-CFE)、xPbMg 1/3Nb 2/3O 3-(1-x)PbTiO 3/P(VDF-TrFE-CFE)、Pb(Zr，Ti)O 3-CoFe 2O 4/P(VDF-TrFE-CFE)、(Pb，La)(Zr，Ti)O 3/P(VDF-TrFE-CFE)、[(K 0.5Na 0.5)NbO 3] (1-x)-[LiSbO 3] x/P(VDF-TrFE-CFE)、(Ba，Ce)(Ti，Mn)O 3/P(VDF-TrFE-CFE)、(Ba，Ca)(Ti，Zr)O 3/P(VDF-TrFE-CFE)、[(Na，Bi)TiO 3] (1-x)-[(K，Bi)TiO 3] (1-x)/P(VDF-TrFE-CFE)、Pb(Zr，Ti)O 3/P(VDF-TrFE-CFE)、Hf 0.5Zr 0.5O 2，(Ba，Ca)(Te，Ti)O 3/P(VDF-TrFE-CFE)等。
电极12为金属合金电极、涂层电极、多孔气体扩散电极等中的至少一种。
进一步地，电卡材料层11的直径最好是1μm-1m，厚度为1nm-1m。电极12的直径最好是1μm-1m，厚度为1nm-10cm。导热部分21、绝热部分22的直径最好是1μm-1m，厚度为1nm-1m。电极12最好是金属合金电极、涂层电极、多孔气体扩散电极等中的至少一种。
需要说明的是，本实施例并不限定导热环20中导热部分21和绝热部分22的数量，导热部分21和绝热部分22的数量可以为一个，也可以更多。
相应地，采用上述的电卡制冷装置实现制冷的方法包括：
通过两个电极12对电卡材料层11周期性地施加电压和撤去电压，并控制导热环20相对于电卡材料层11转动；
在电卡材料层11通电过程中，至少一个绝热部分22阻挡制冷入口以隔绝热量；
在电卡材料层11断电过程中，至少一个导热部分21转动至阻挡制冷入口以传递热量。
由于电卡材料层11产生的高温始终被散发至环境空间中，电卡材料层11产生的低温始终被散发到制冷空间中，因此，在导热环20转动的过程中，制冷空间内可以很好地实现持续降温。
实施例2
如图5所示，本实施例的电卡制冷装置以实施例1中的电卡材料层11与导热环20为基础，每个电卡材料层11与一个导热环20组成一个制冷单元，电卡制冷装置包括复数层上下层叠设置的制冷单元，各层制冷单元的导热环20层叠在一起，二者之间无缝隙。
制冷入口的数量与导热部分21的数量、绝热部分22的数量均一致。至少一层制冷单元的导热部分21与相邻层的制冷单元的导热部分21(在堆叠方向上，如图5所示的纵向)的正投影重合。即至少一层导热环20的导热部分21、绝热部分22分别与下层的导热部分21、绝热部分22正对，两层导热部分21相互重叠。
当电卡制冷装置中具有纵向上重叠的导热部分21与导热部分21、绝热部分22与绝热部分22时，同时对所有的制冷单元的电卡材料层11有规律的通断电，使得所有的制冷入口都同时降温，同时，控制导热环20的转速，使得通过每一层的制冷入口都可以同时搜集热量，导热部分21、绝热部分22均正对的两层制冷单元的电卡材料层11的通断电状态、导热环20的转速均可以一致，可以大幅提升制冷效率。另外，上层的导热环20与下层的导热环20之间也可以夹设有用于防止热量在纵向上散发的绝热片。
实施例3
如图6所示，本实施例的电卡制冷装置也以实施例1中的电卡材料层11与导热环20为基础，至少一层制冷单元的导热部分21与相邻层的制冷单元的绝热部分22的正投影重合，即至少一层导热环20的导热部分21、绝热部分22分别与下层的绝热部分22、导热部分21正对，二者的导热部分21呈错开状态。
在此基础上，本实施例的电卡制冷装置还包括用于隔热的绝热片30，绝热部分22与相邻层的导热部分21正投影重合的两个导热环20之间夹设有一层绝热片30，可以防止纵向上相对的导热环20与绝热片30之间传递热量造成热损失。而其他层制冷装置的绝热部分22、导热部分21可以互相保持重合。绝热片30至少完全覆盖导热环20，例如可以与导热部分21的形状和大小一致或比导热环20的面积大。
电卡制冷装置中，导热部分21相互错开的两层制冷单元的电卡材料层11的通断电状态相反，导热环20的转速一致，使得这两层的升温/降温过程一致， 也可以起到提升制冷效率的作用。
实施例4
如图7所示，与实施例1不同的是，本实施例的绝热部分22的厚度大于电卡材料层11与两个电极12的厚度之和，导热部分21的厚度不大于绝热部分22，且大于或等于电卡材料层11与两个电极12的厚度之和。制冷入口的大小与绝热部分22的大小一致，当导热部分21转动至与制冷入口正对时，导热部分21无法完全遮挡制冷入口，热量除了可以从导热部分21传递至制冷入口外，还可以通过导热部分21与制冷入口之间的缝隙进入，导热部分21的一部分底面也可以作为散热面，增大了散热面积。
实施例5
如图8所示，本实施例在实施例4的基础上，将实施例4中的每个电卡材料层11与一个导热环20视为一个制冷单元，电卡制冷装置包括复数层上下层叠设置的制冷单元，各层制冷单元的导热环20层叠在一起，各层制冷单元的电卡材料层11之间形成间隙。
制冷入口的数量与导热部分21的数量、绝热部分22的数量均一致。至少一层制冷单元的导热部分21与相邻层的制冷单元的导热部分21(在堆叠方向上，如图8所示的纵向)的正投影重合。即至少一层导热环20的导热部分21、绝热部分22分别与下层的导热部分21、绝热部分22正对，两层导热部分21相互重叠。其中，导热部分21正投影重合的两层制冷单元的绝热部分22相互贴合，而导热部分21之间形成可供热量通过的缝隙。
当电卡制冷装置中具有纵向上重叠的导热部分21与导热部分21、绝热部分22与绝热部分22时，同时对所有的制冷单元的电卡材料层11有规律的通断电，使得所有的制冷入口都同时降温，同时，控制导热环20的转速，使得通过每一层的制冷入口都可以同时搜集热量，导热部分21、绝热部分22均正对的两层制冷单元的电卡材料层11的通断电状态、导热环20的转速均可以一致，可以大幅提升制冷效率。另外，上层的导热环20与下层的导热环20之间也可以夹设有用于防止热量在纵向上散发的绝热片。
由于本实施例的电卡制冷装置的每两层相邻的制冷单元的电卡材料层11之间、导热环20之间均形成有可供热量通过的缝隙，因此，进一步地在一定程度上提高了热量散发效率。
实施例6
如图9所示，本实施例的电卡制冷装置也以实施例4中的电卡材料层11与导热环20为基础，至少一层制冷单元的导热部分21与相邻层的制冷单元的绝热部分22的正投影重合，即至少一层导热环20的导热部分21、绝热部分22分别与下层的绝热部分22、导热部分21正对，二者的导热部分21呈错开状态。
电卡制冷装置中，导热部分21相互错开的两层制冷单元的电卡材料层11的通断电状态相反，导热环20的转速一致，使得这两层的升温/降温过程一致，也可以起到提升制冷效率的作用。这两层制冷单元的导热环20之间形成可供热量通过的缝隙，且这两层制冷单元的两个导热环20之间夹设有一层绝热片30，可以防止纵向上相对的导热环20与绝热片30之间传递热量造成热损失。而其他层制冷装置的绝热部分22、导热部分21可以互相保持重合。
综上所述，本发明的电卡制冷装置结构简单、易于实现，通过控制导热环相对于内部的电卡材料层转动，并相应地周期性地改变电卡材料层的通、断电状态即可使得装置持续降温，使得装置能够最大限度、最大效率地提高制冷效果。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种电卡制冷装置，其中，包括圆片形的电卡材料层、分别连接所述电卡材料层上下表面的两个电极、设于所述电卡材料层外围并相对于所述电卡材料层转动的导热环，所述导热环由导热部分和绝热部分在周向上首尾衔接而成，所述导热部分和所述绝热部分之间设置有用于隔热的绝热材料，通过两个所述电极可控制所述电卡材料层周期性地通电和断电；在所述电卡材料层升温过程中，至少一个所述绝热部分阻挡制冷入口以隔绝热量，在所述电卡材料层降温过程中，至少一个所述导热部分阻挡制冷入口以传递热量。
  2. 根据权利要求1所述的电卡制冷装置，其中，所述导热环包括至少两个所述导热部分与至少两个所述绝热部分，所述制冷入口的数量与所述导热部分的数量、所述绝热部分的数量均一致。
  3. 根据权利要求2所述的电卡制冷装置，其中，每个所述电卡材料层与一个所述导热环组成一个制冷单元，电卡制冷装置包括复数层上下层叠设置的所述制冷单元。
  4. 根据权利要求3所述的电卡制冷装置，其中，至少一层制冷单元的所述导热部分与相邻层的制冷单元的所述导热部分的正投影重合。
  5. 根据权利要求3所述的电卡制冷装置，其中，至少一层制冷单元的所述导热部分与相邻层的制冷单元的所述绝热部分的正投影重合。
  6. 根据权利要求3所述的电卡制冷装置，其中，还包括用于隔热的绝热片，所述绝热部分与相邻层的导热部分正投影重合的两个导热环之间夹设有一层所述绝热片。
  7. 根据权利要求3所述的电卡制冷装置，其中，所述绝热部分的厚度大于所述电卡材料层与两个所述电极的厚度之和，所述导热部分的厚度不大于所述绝热部分，且不小于所述电卡材料层与两个所述电极的厚度之和。
  8. 根据权利要求2所述的电卡制冷装置，其中，所述导热环与所述电卡材料层接触设置，所述导热部分为铜、铝、石墨烯、BN、石墨、碳纤维和C/C复合材料中的至少一种。
  9. 一种电卡制冷装置，其中，包括圆片形的电卡材料层、分别连接所述电卡材料层上下表面的两个电极、设于所述电卡材料层外围并相对于所述电卡材 料层转动的导热环，所述导热环由导热部分和绝热部分在周向上首尾衔接而成，通过两个所述电极可控制所述电卡材料层周期性地通电和断电；在所述电卡材料层升温过程中，至少一个所述绝热部分阻挡制冷入口以隔绝热量，在所述电卡材料层降温过程中，至少一个所述导热部分阻挡制冷入口以传递热量。
  10. 根据权利要求9所述的电卡制冷装置，其中，所述导热环与所述电卡材料层接触设置。
  11. 根据权利要求9所述的电卡制冷装置，其中，所述导热环包括至少两个所述导热部分与至少两个所述绝热部分，所述制冷入口的数量与所述导热部分的数量、所述绝热部分的数量均一致。
  12. 根据权利要求11所述的电卡制冷装置，其中，每个所述电卡材料层与一个所述导热环组成一个制冷单元，电卡制冷装置包括复数层上下层叠设置的所述制冷单元。
  13. 根据权利要求12所述的电卡制冷装置，其中，至少一层制冷单元的所述导热部分与相邻层的制冷单元的所述导热部分的正投影重合。
  14. 根据权利要求12所述的电卡制冷装置，其中，还包括用于隔热的绝热片，至少一层制冷单元的所述导热部分与相邻层的制冷单元的所述绝热部分的正投影重合；所述绝热部分与相邻层的导热部分正投影重合的两个导热环之间夹设有一层所述绝热片。
  15. 根据权利要求12所述的电卡制冷装置，其中，所述绝热部分的厚度大于所述电卡材料层与两个所述电极的厚度之和，所述导热部分的厚度不大于所述绝热部分，且不小于所述电卡材料层与两个所述电极的厚度之和。
  16. 一种采用电卡制冷装置的制冷方法，其中，电卡制冷装置包括圆片形的电卡材料层、分别连接所述电卡材料层上下表面的两个电极、设于所述电卡材料层外围并相对于所述电卡材料层转动的导热环，所述导热环由导热部分和绝热部分在周向上首尾衔接而成，通过两个所述电极可控制所述电卡材料层周期性地通电和断电；在所述电卡材料层升温过程中，至少一个所述绝热部分阻挡制冷入口以隔绝热量，在所述电卡材料层降温过程中，至少一个所述导热部分阻挡制冷入口以传递热量；
    所述制冷方法包括：
    通过两个电极对电卡材料层周期性地施加电压和撤去电压，并控制所述导 热环相对于所述电卡材料层转动；
    在电卡材料层升温过程中，至少一个绝热部分阻挡制冷入口以隔绝热量；
    在电卡材料层降温过程中，至少一个导热部分转动至阻挡制冷入口以传递热量。
  17. 根据权利要求16所述的制冷方法，其中，所述导热环与所述电卡材料层接触设置；所述导热环包括至少两个所述导热部分与至少两个所述绝热部分，所述制冷入口的数量与所述导热部分的数量、所述绝热部分的数量均一致。
  18. 根据权利要求17所述的制冷方法，其中，每个所述电卡材料层与一个所述导热环组成一个制冷单元，电卡制冷装置包括复数层上下层叠设置的所述制冷单元；至少一层制冷单元的所述导热部分与相邻层的制冷单元的所述导热部分的正投影重合。
  19. 根据权利要求18所述的制冷方法，其中，所述电卡制冷装置还包括用于隔热的绝热片，至少一层制冷单元的所述导热部分与相邻层的制冷单元的所述绝热部分的正投影重合；所述绝热部分与相邻层的导热部分正投影重合的两个导热环之间夹设有一层所述绝热片。
  20. 根据权利要求18所述的制冷方法，其中，所述绝热部分的厚度大于所述电卡材料层与两个所述电极的厚度之和，所述导热部分的厚度不大于所述绝热部分，且不小于所述电卡材料层与两个所述电极的厚度之和。
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