WO2020107283A1 - 换能器组件及其制备方法 - Google Patents

换能器组件及其制备方法 Download PDF

Info

Publication number
WO2020107283A1
WO2020107283A1 PCT/CN2018/118004 CN2018118004W WO2020107283A1 WO 2020107283 A1 WO2020107283 A1 WO 2020107283A1 CN 2018118004 W CN2018118004 W CN 2018118004W WO 2020107283 A1 WO2020107283 A1 WO 2020107283A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
transducer
sub
transducer assembly
axial direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/118004
Other languages
English (en)
French (fr)
Inventor
冯伟
黄林冰
张艳辉
张晨宁
尹铎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Institute of Advanced Technology of CAS
Original Assignee
Shenzhen Institute of Advanced Technology of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Institute of Advanced Technology of CAS filed Critical Shenzhen Institute of Advanced Technology of CAS
Priority to PCT/CN2018/118004 priority Critical patent/WO2020107283A1/zh
Publication of WO2020107283A1 publication Critical patent/WO2020107283A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction

Definitions

  • the present application relates to the technical field of detection, in particular to a transducer assembly and a preparation method thereof.
  • ultrasonic phased array inspection technology is an ultrasonic non-destructive inspection technology developed in recent years. This technology can improve the inspection speed and the signal-to-noise ratio of the inspection signal. It has the characteristics of fast, reliable and accurate.
  • the design of commonly used ultrasonic phased array probes is based on the Huygens principle. There are array elements arranged one-dimensionally in the azimuth direction of the transducer, and each array element is independent of each other. According to a certain electronic delay, each array element Excited to form a new ultrasonic front. By applying different electronic delays, the ultrasonic beam will be deflected in the azimuth direction to meet various detection needs.
  • the phased array has certain advantages compared to the conventional single array probe, but the resolution at the near surface is still relatively poor.
  • the resolution of the near surface of the related art ultrasound probe is poor.
  • the application provides a transducer assembly and a preparation method thereof, which can improve the resolution of the near surface of the ultrasonic probe.
  • the first technical solution adopted by the present application is to provide a transducer assembly including a backing layer, a transducer layer and a matching layer sequentially stacked in the axial direction Layer, the transducer assembly is provided with a first separation gap, the first separation gap penetrates the matching layer and the transducer layer along the axial direction and extends into the backing layer, In order to divide the transducer assembly into n rows of sub-body at least along the elevation angle direction, wherein the axial direction is perpendicular to the elevation angle direction, and n is an integer not less than 2.
  • the second technical solution adopted by the present application is: to provide a method for manufacturing a transducer assembly, which includes: preparing a transducer layer; and preparing a matching layer on both sides of the transducer layer Layer and backing layer, wherein the backing layer, the transducer layer and the matching layer are stacked in the axial direction; the matching layer, the transducer layer and the back are cut in the axial direction A liner layer to form a first separation gap, wherein the first separation gap penetrates the matching layer and the transducer layer and extends to the backing layer to hold the transducer assembly at least in the elevation direction Divided into n columns of sub-body, wherein the axial direction is perpendicular to the elevation direction, n is an integer not less than 2.
  • the present application provides a transducer assembly, the transducer assembly includes a backing layer, a transducer layer and a matching layer sequentially stacked in the axial direction.
  • the transducer assembly is provided with a first separation gap, which penetrates the matching layer and the transducer layer in the axial direction and extends into the backing layer to divide the transducer assembly into n rows of sub-body at least in the elevation direction , Where the axial direction is perpendicular to the elevation direction, and n is an integer not less than 2.
  • the transducer assembly of the present application is divided into n rows of sub-body along the elevation direction.
  • the transducer assembly has one-dimensionally arranged multi-row sub-body in the elevation direction, and the multi-row sub-body is independent of each other.
  • Huygens principle excites each column of sub-body to form a new ultrasonic array, thereby reducing the slice thickness of the ultrasonic beam and improving the resolution of the near surface of the ultrasonic probe.
  • FIG. 1 is a schematic diagram of the overall structure of an embodiment of a transducer assembly of the present application
  • FIG. 2 is a schematic cross-sectional structural view of the transducer assembly of FIG. 1 perpendicular to the azimuth direction;
  • FIG. 3 is a schematic cross-sectional view of the transducer assembly of FIG. 1 perpendicular to the elevation angle direction;
  • FIG. 4 is a partial enlarged view of area A in FIG. 3;
  • FIG. 5 is a schematic flowchart of an embodiment of a method for manufacturing a transducer assembly of the present application
  • FIG. 6 is a schematic structural diagram of the corresponding transducer assembly in step 501 and step 502 in FIG. 5;
  • FIG. 7 is a schematic structural diagram of the corresponding transducer assembly in step 503 in FIG. 5;
  • FIG. 8 is a schematic flowchart of another embodiment of a method for manufacturing a transducer assembly of the present application.
  • FIG. 9 is a schematic structural diagram of the corresponding transducer assembly in steps 801 to 803 in FIG. 8.
  • FIG. 1 is a schematic diagram of the overall structure of an embodiment of a transducer assembly of the present application.
  • the transducer assembly 10 includes a backing layer 11, a transducer layer 12, and a matching layer 13 sequentially stacked in the axial direction F1.
  • the transducer assembly 10 is provided with a first separation gap 14 that penetrates the matching layer 13 and the transducer layer 12 in the axial direction F1 and extends into the backing layer 11 to connect the transducer assembly 10 It is divided into n rows of sub-body at least along the elevation angle direction F2, wherein the axial direction F1 is perpendicular to the elevation angle direction F2, and n is an integer not less than 2.
  • the transducer assembly 10 is divided into n rows of sub-body along the elevation direction F2.
  • the transducer assembly 10 has a plurality of rows of sub-body arranged in one dimension in the elevation direction F2, and the rows of sub-body are independent of each other. According to the Huygens principle, each column of sub-body is excited according to a certain electronic delay, thereby forming a new ultrasonic array, thereby reducing the slice thickness of the ultrasonic beam, and improving the resolution of the near surface of the ultrasonic probe.
  • the transducer layer 12 includes at least one transducer element (not shown) configured to emit ultrasonic energy at a central operating frequency
  • the transducer element is a composite piezoelectric of potassium sodium niobate/sodium bismuth titanate piezoelectric Any one of a thin film, a barium sodium titanate/lithium niobate composite piezoelectric film, a piezoelectric micromechanical film, or a capacitor micromechanical film.
  • the center operating frequency is 100 MHz or above.
  • the transducer element When the transducer element is a composite piezoelectric film of potassium sodium niobate/sodium bismuth titanate or a composite piezoelectric film of sodium barium titanate/lithium niobate, it can be made by a sol-gel method.
  • the transducer layer 12 Preferably, the transducer layer 12 generates ultrasonic waves with a frequency of 100-500 MHz when vibrating. In other embodiments, the transducer layer 12 generates ultrasonic waves with other frequencies when vibrating, which is not limited in this application.
  • One or more transducer elements can be used for electro-acoustic transduction.
  • the efficiency of electro-acoustic transduction can be improved by providing multiple layers of transducer elements; in addition, the use of thin-film transducer elements can greatly reduce the transduction
  • the thickness of the transducer layer 12 enables the transducer layer 12 to generate higher frequency ultrasonic waves when vibrating, which improves the resolution of the near surface of the ultrasonic probe.
  • the material of the transducer element in the transducer layer 12 can be selected according to specific circumstances, which is not limited in this application.
  • the matching layer 13 includes a first sub-matching layer 131 and a second sub-matching layer 132 distributed along the axial direction F1, and the acoustic impedance of the transducer layer 12 is greater than the first sub-matching layer 131 and the second sub-matching
  • the acoustic impedance of any one of the layers 132, the acoustic impedance of the first sub-matching layer 131 is greater than the acoustic impedance of the second sub-matching layer 132.
  • the number of sub-matching layers is set according to specific circumstances, and can be 2, 3 or more, as long as the acoustic impedance of multiple sub-matching layers is away from the transducer layer 12 It gradually decreases, and the acoustic impedance of any of the plurality of sub-matching layers may be smaller than the acoustic impedance of the transducer layer 12.
  • the acoustic impedance matching between the working medium and the transducer layer 12 can be fully achieved, effectively reducing the reflection of sound waves on the surface of the working medium, and increasing the effectiveness of the sound waves The amount of transmission.
  • the acoustic impedance of multiple sub-matching layers can be accurately calculated by an iterative algorithm to obtain an optimal value, which is not limited in this application.
  • the first sub-matching layer 131 may be directly coated on the surface of the transducer layer 12 through a vacuum coating process, and then the second sub-matching layer 132 may be coated on the surface of the first sub-matching layer 131.
  • other processes may also be used for coating, which is not limited in this application.
  • the separately prepared matching layer 13 is adhered to the surface of the transducer layer 12 by using epoxy resin.
  • the matching layer 13 and the transducer layer 12 can be prepared at the same time, which can improve the production efficiency.
  • other types of curable adhesives may also be used to adhere the matching layer 13 to the surface of the transducer layer 12, which is not limited in this application.
  • the backing layer 11 is a composite material containing multiple materials, and at least two of the filler materials have different acoustic impedances.
  • the at least two materials in the backing layer 11 have different acoustic impedances, which can play a role in sound absorption and shock absorption.
  • the composite material includes microspheres suspended in an epoxy resin or other flowable, curable liquid substance; the microspheres may include glass or plastic microspheres surrounding or encapsulating a gas (such as air or hydrocarbon gas) or solid microspheres;
  • the microsphere can also be a solid sphere, the material of which includes but is not limited to rubber, silica, zirconia, alumina, metal, etc.; the microsphere or microsphere can be mixed with epoxy resin or polymer in different proportions To obtain composite materials with different consistency and density. For example, composite materials are mixed with microspheres and epoxy resins or polymers.
  • the backing layer 11 may be a single material, and the single material includes, but is not limited to, solid materials such as metal, epoxy resin, zirconia, and alumina.
  • the backing layer 11 may also be a gas, may contain only one kind of gas, or may be a mixed gas.
  • the backing layer 11 is a gas, its acoustic impedance is small, and the acoustic energy is reflected to a large extent at the interface between the transducer layer 12 and the backing layer 11, because the transducer layer 12 emits energy in two directions As the acoustic energy returns along the opposite path, the energy will be superimposed, increasing the transmission power.
  • the backing layer 11 has a uniform or gradual acoustic impedance along the axial direction F1.
  • the backing layer 11 has a gradual acoustic impedance, which can improve the bandwidth and sensitivity effects of the transducer assembly 10.
  • the flowable and curable backing layer 11 is combined with the transducer layer 12 by pouring.
  • the backing layer 11 may be prepared in advance, and then the backing layer 11 may be adhered to the surface of the transducer layer 12 by an adhesive.
  • the backing layer 11 and the transducer layer 12 can be prepared at the same time, which can improve the preparation efficiency.
  • n is an odd number not less than 3.
  • the n-row sub-bodies in the elevation direction F2 are symmetrically distributed about the central axis of the sub-body located in the middle of the n-row sub-bodies, and the sum of the widths of the two rows of sub-body symmetrical to each other in the elevation direction F2 and the width of the sub-body located in the n-row Two columns of equal and symmetrical sub-body are electrically connected to receive external excitation at the same time. Because each group of symmetrical sub-bodies in the elevation direction F2 are electrically connected together, that is to say, they are simultaneously excited during excitation.
  • the beam in the elevation direction F2 is focused on the symmetrical surface of the transducer assembly 10 in the elevation direction F2, and the focal length can be adjusted by changing the delay.
  • the focus in the elevation direction F2 can be reduced by one more focus before the later lens is further focused. Small slice thickness.
  • FIG. 2 is a schematic cross-sectional view of the transducer assembly of FIG. 1 perpendicular to the azimuth direction F3.
  • the first separation gap 14 penetrates the matching layer 13 and the transducer layer 12 in the axial direction F1 and extends into the backing layer 11 to divide the transducer assembly 10 into five rows of sub-body along the elevation direction F2, respectively
  • the first row of sub-body 101, the second row of sub-body 102, the third row of sub-body 103, the fourth row of sub-body 104, and the fifth row of sub-body 105 are arranged along the elevation direction F2, wherein the third row of sub-body 103 is the middle child of the five rows of sub-body body.
  • the third row of sub-body 103 is self-symmetrical about the central axis L
  • the first row of sub-body 101 and the fifth row of sub-body 105 are symmetrical about the central axis L of the third row of sub-body 103
  • the second row of sub-body 102 and the fourth row of sub-body 104 are about third column
  • the central axis L of the body 103 is symmetrical.
  • the sum of the widths of the first row sub-body 101 and the fifth row sub-body 105, the sum of the widths of the second row sub-body 102 and the fourth row sub-body 104, and the width of the third row sub-body 103 are equal.
  • the first row of sub-body 101 and the fifth row of sub-body 105 are electrically connected, and the second row of sub-body 102 and the fourth row of sub-body 104 are electrically connected to receive excitation at the same time.
  • the transducer layer 12 receives the excitation, the symmetrical two rows of sub-bodies and the middle sub-bodies emit the same area of ultrasonic waves, which ensures that the symmetrical two rows of sub-bodies and the intermediate sub-bodies emit the same ultrasonic energy, and it is also easy for the transducer The later-stage electrical impedance matching design of layer 12.
  • the width of the first separation gap 14 between two adjacent rows of sub-body in the elevation direction F2 is equal, and the width is 10-100 ⁇ m. Setting the same gap can ensure product quality and improve product accuracy. In other embodiments, the tolerance between the widths of the first separation gaps 14 is kept within a preset range, which can reduce the process difficulty and improve the production efficiency when the basic product is satisfied.
  • the first partition gap 14 is further filled with a filling material.
  • the portion of the first separation gap 14 located in the matching layer 13 and the transducer layer 12 is more densely packed than the portion of the first separation gap 14 located in the backing layer 11. Since the backing layer 11 is mainly sound-absorbing and shock-absorbing, the filling density of the gap is reduced, and the process difficulty and the production cost can be reduced while satisfying its sound-absorbing and shock-absorbing properties.
  • the filling material has a uniform or gradual acoustic impedance along the axial direction F1.
  • the filling material may be a single material or a composite material.
  • the composite material includes microspheres suspended in an epoxy resin or other flowable, curable liquid substance; the microspheres may include glass or plastic microspheres surrounding or encapsulating a gas (such as air or hydrocarbon gas) or solid microspheres;
  • the microsphere can also be a solid sphere, the material of which includes but is not limited to rubber, silica, zirconia, alumina, metal, etc.; the microsphere or microsphere can be mixed with epoxy resin or polymer in different proportions To obtain composite materials with different consistency and density.
  • composite materials are mixed with microspheres and epoxy resins or polymers.
  • the filler material may be a single material.
  • the single material includes but is not limited to metal, epoxy resin, zirconia, alumina and other solid substances.
  • the filling material may also be a gas, which may contain only one kind of gas or a mixed gas. When the filling material is gas, it can better reduce crosstalk between adjacent sub-body.
  • FIG. 3 is a schematic cross-sectional view of the transducer assembly of FIG. 1 perpendicular to the elevation angle direction;
  • FIG. 4 is a partially enlarged view of area A in FIG. 3.
  • the transducer assembly 10 is further provided with a second separation gap 15 that penetrates the matching layer 13 and the transducer layer 12 in the axial direction F1 and extends into the backing layer 11 to Transducer assembly 10 is divided into m rows of sub-body at least along azimuth direction F3, wherein azimuth direction F3, axial direction F1 and elevation angle direction F2 are perpendicular to each other, and m is an integer not less than 2.
  • the transducer assembly 10 is divided into n rows of sub-body along the azimuth direction F3.
  • the transducer assembly 10 has one-dimensionally arranged multi-row sub-body in the azimuth direction F3, and the multi-row sub-body is independent of each other, according to Huygens principle
  • the excitation of each column of sub-body according to a certain electronic delay will form a new ultrasonic array, which will cause the ultrasonic beam to deflect and focus in the azimuth direction F3, and improve the resolution of the near surface of the ultrasonic probe.
  • m is an even number greater than n, and the m columns of sub-bodies in the azimuth direction F3 have the same width in the azimuth direction F3.
  • m can take any one of 64, 128, and 256.
  • the m columns of progeny along the azimuth direction F3 are symmetrically distributed.
  • the width of the second separation gap 15 between two adjacent rows of sub-bodies in m rows of sub-bodies in the azimuth direction F3 is the same in the azimuth direction F3 and has a width of 10-100 m.
  • the width of the second partition gap 15 and the width of the first partition gap 14 are equal. In other embodiments, the widths of the second separation gap 15 and the first separation gap 14 may also be different, which is not limited in this application.
  • the second partition gap 15 is further filled with a filling material, and the filling material in the first partition gap 14 is the same as the material in the first partition gap 14, which will not be repeated here.
  • the filling material in the first separation gap 14 may also be different, which is not limited in this application.
  • the first separation gap 14 and the second separation gap 15 may be formed using a mechanical cutting process of blade cutting, or may be formed by a related etching process such as photolithography, chemical etching, plasma etching, etc. Not limited.
  • the transducer assembly 10 is divided into n rows of sub-body along the elevation direction F2, and is divided into m rows of sub-body along the azimuth direction F3.
  • the transducer assembly 10 has Multiple child bodies arranged in two dimensions, and the multiple child bodies are independent of each other. According to the Huygens principle, each sub-body is excited according to a certain electronic delay, while different excitation delays are applied to the child in the azimuth direction F3, and different excitation delays are also applied to the child in the elevation direction F2 , Thereby forming a new ultrasonic array, the beam in the elevation direction F2 is focused on the symmetrical surface of the transducer assembly in the elevation direction F2, and the focal length of the focus can be adjusted by changing the delay.
  • Focusing in the elevation direction can reduce the slice thickness, and can also be deflected in the azimuth direction F3, which further reduces the slice thickness of the ultrasonic beam; on the other hand, by using the thin-film transducer layer 12, the energy conversion The vibrator layer 12 can generate high frequency ultrasonic waves when vibrating. Combining the improvement of the two, the resolution of the transducer assembly 10 in the axial direction F1 can be within 5 ⁇ m, which can detect more subtle workpiece defects and improve the near-surface resolution.
  • the present application provides a transducer assembly including a backing layer, a transducer layer and a matching layer sequentially stacked in the axial direction, the transducer assembly is provided with a first The separation gap, the first separation gap penetrates the matching layer and the transducer layer in the axial direction, and extends into the backing layer to divide the transducer assembly into n rows of sub-body at least in the elevation direction, wherein the axial direction is The elevation direction is vertical, n is an integer not less than 2.
  • the transducer assembly of the present application is divided into n rows of sub-body along the elevation direction.
  • the transducer assembly has one-dimensionally arranged multi-row sub-body in the elevation direction, and the multi-row sub-body is independent of each other.
  • a certain electronic delay excites each column of sub-body to form a new ultrasonic array, thereby reducing the slice thickness of the ultrasonic beam and improving the resolution of the near surface of the ultrasonic probe.
  • FIG. 5 is a schematic flowchart of an embodiment of a method for manufacturing a transducer assembly of the present application.
  • the manufacturing method of the transducer assembly includes:
  • Step 501 Prepare the transducer layer.
  • FIG. 6 is a schematic structural diagram of the corresponding transducer assembly in step 501 and step 502 in FIG. 5.
  • the transducer layer 22 is the same as the transducer layer 11 in FIG. 1. Please refer to FIG. 1 and related descriptions in the specification, and no more details are provided here.
  • Step 502 Prepare a matching layer and a backing layer on both sides of the transducer layer, wherein the backing layer, the transducer layer, and the matching layer are stacked in the axial direction.
  • the matching layer 23 and the backing layer 21 are the same as the matching layer 13 and the backing layer 11 in FIG. 1. Please refer to FIG. 1 and related descriptions in the specification, and relevant parts will not be repeated here.
  • the matching layer 23 includes a first sub-matching layer 231 and a second matching layer 232.
  • the first sub-matching layer 231 is directly coated on the surface of the transducer layer 22 through a vacuum coating process, and then the second matching layer 232 is plated on the surface of the first sub-matching layer 231.
  • the flowable and curable backing layer 21 is combined with the transducer layer 22 by pouring. It should be noted that the order in which the backing layer 21 and the matching layer 23 are made on the transducer layer 22 can be interchanged, which is not limited in this application. In other embodiments, other processes may also be used to prepare the matching layer 23 and the backing layer 21, which is not limited in this application.
  • the matching layer 23 and the backing layer 21 are prepared, and the matching layer 23 and the backing layer 21 are pasted on both side surfaces of the transducer layer 22 by an adhesive.
  • the separately prepared matching layer 23 is adhered to the surface of the transducer layer 22 by using epoxy resin.
  • the matching layer 23 and the transducer layer 22 can be prepared at the same time, which can improve the preparation efficiency.
  • Step 503 Cutting the matching layer, the transducer layer and the backing layer in the axial direction to form a first separation gap, wherein the first separation gap penetrates the matching layer and the transducer layer and extends to the backing layer,
  • the transducer assembly is divided into n rows of sub-body at least along the elevation angle direction, wherein the axial direction is perpendicular to the elevation angle direction, and n is an integer not less than 2.
  • FIG. 7 is a schematic structural diagram of the corresponding transducer assembly in step 503 in FIG. 5.
  • the matching layer 23, the transducer layer 22 and the backing layer 21 are cut in the axial direction to form a first separation gap 24, wherein the first separation gap 24 penetrates the matching layer 23 and the transducer layer 22 and extends to the back
  • the lining layer 21 divides the transducer assembly 20 into at least n rows of sub-body along the elevation direction, wherein the axial direction F1 is perpendicular to the elevation direction F2, and n is an integer not less than 2.
  • the first separation gap 24 may be formed by a mechanical cutting process of blade cutting, or may be formed by a related etching process such as photolithography, chemical etching, plasma etching, etc., which is not limited in this application.
  • the first separation gap 24 is the same as the first separation gap 14 in FIG. 1 and will not be repeated here.
  • first separation gap 24 is filled with a filling material.
  • the filling material is the same as the material of the first separation gap in FIG. 1 and will not be repeated here.
  • this application divides the transducer assembly into n rows of sub-body along the elevation direction.
  • the transducer assembly has one-dimensionally arranged multi-row sub-body in the elevation direction, and the multi-row sub-body is independent of each other, according to According to Huygens principle, each column of sub-body is excited according to a certain electronic delay to form a new ultrasonic array, thereby reducing the slice thickness of the ultrasonic beam and improving the resolution of the near surface of the ultrasonic probe.
  • FIG. 8 is a schematic flowchart of another embodiment of a method for manufacturing a transducer assembly of the present application.
  • the manufacturing method of the transducer assembly includes:
  • Step 801 Prepare the transducer layer.
  • FIG. 9 is a schematic structural diagram of the corresponding transducer assembly in steps 801 to 803 in FIG. 8. Prepare the transducer layer 32. Step 801 is the same as step 501 and will not be repeated here.
  • Step 802 Prepare a matching layer and a backing layer on both sides of the transducer layer, wherein the backing layer, the transducer layer, and the matching layer are stacked in the axial direction.
  • the matching layer 33 and the backing layer 31 are prepared on both sides of the transducer layer 32, wherein the backing layer 31, the transducer layer 32, and the matching layer 33 are stacked in the axial direction.
  • Step 802 is the same as step 502 and will not be repeated here.
  • Step 803 Cutting the matching layer, the transducer layer and the backing layer in the axial direction to form a first separation gap and a second separation gap, wherein the first separation gap penetrates the matching layer and the transducer layer and extends to Backing layer to divide the transducer assembly into n rows of sub-body at least along the elevation direction, where the axial direction is perpendicular to the elevation direction, n is an integer not less than 2; the second separation gap penetrates the matching layer and the transducer layer And extend to the backing layer to divide the transducer assembly into m rows of sub-body at least along the azimuth direction, wherein the azimuth direction, axial direction and elevation direction are perpendicular to each other, and m is an integer not less than 2.
  • the first separation gap 34 may be formed by a mechanical cutting process of blade cutting, or may be formed by a related etching process such as photolithography, chemical etching, plasma etching, etc., which is not limited in this application.
  • the first separation gap 34 is the same as the first separation gap 14 in FIG. 1 and will not be repeated here.
  • a second separation gap 35 is also formed, wherein the second separation gap 35 penetrates the matching layer 33 and the transducer layer 32, and It extends to the backing layer 31 to divide the transducer assembly 30 into m rows of sub-body at least along the azimuth direction F3, wherein the azimuth direction F3, the axial direction F1 and the elevation direction F2 are perpendicular to each other, and m is an integer not less than 2.
  • the second separation gap 35 is the same as the separation gap in FIG. 1 and will not be repeated here.
  • first partition gap 34 and the second partition gap 35 may be interchanged, or formed at the same time.
  • the first separation gap 34 and the second separation gap 35 are filled with a filling material.
  • the filling material is the same as the material of the first separation gap in FIG. 1 and will not be repeated here.
  • this application divides the transducer assembly into n rows of sub-body along the elevation direction.
  • the transducer assembly has one-dimensionally arranged multi-row sub-body in the elevation direction, and the multi-row sub-body is independent of each other, according to According to Huygens principle, each column of sub-body is excited according to a certain electronic delay to form a new ultrasonic array, thereby reducing the slice thickness of the ultrasonic beam and improving the resolution of the near surface of the ultrasonic probe.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

一种换能器组件及其制备方法，该换能器组件包括沿轴向方向依次叠置的背衬层、换能器层以及匹配层，换能器组件设置有第一分隔间隙，第一分隔间隙沿轴向方向贯穿匹配层和换能器层，并延伸至背衬层中，以将换能器组件至少沿仰角方向分割成n列子体，其中，轴向方向与仰角方向垂直，n为不小于2的整数。该换能器组件沿仰角方向被分割成了n列子体，在仰角方向上具有呈一维排列的多列子体，且多列子体间相互独立。根据惠更斯原理，按照一定的电子延时对每列子体进行激励，从而形成一个新的超声波阵面，进而减小了超声波束的切片厚度，提高了超声探头的近表面的分辨率。

Description

换能器组件及其制备方法 【技术领域】
本申请涉及检测技术领域，尤其涉及一种换能器组件及其制备方法。
【背景技术】
在超声无损检测技术方面，常用的检测超声探头频率较低，很多在10MHz以内，其中单探头占多数，部分探头为相控阵探头。超声相控阵检测技术是近年发展起来的一种超声无损检测技术，这种技术能够提高检测速度和检测信号的信噪比，具有快速、可靠、准确等特点。常用超声相控阵探头的设计基于惠更斯原理，换能器存在着在方位方向上呈一维排列的阵元，每个阵元间相互独立，按照一定的电子延时对每个阵元进行激励，从而形成一个新的超声波阵面。通过施加不同的电子延时，会使得超声波束在方位方向上发生偏转，以满足各种检测需要。相控阵相比于常规的单阵元探头来说具有一定的优势，但是在近表面的分辨力仍然比较差。
也就是说，现有技术的超声探头的近表面的分辨率较差。
【发明内容】
本申请提供一种换能器组件及其制备方法，能够提高超声探头的近表面的分辨率。
为解决上述技术问题，本申请采用的第一个技术方案是：提供一种换能器组件，所述换能器组件包括沿轴向方向依次叠置的背衬层、换能器层以及匹配层，所述换能器组件设置有第一分隔间隙，所述第一分隔间隙沿所述轴向方向贯穿所述匹配层和所述换能器层，并延伸至所述背衬层中，以将所述换能器组件至少沿仰角方向分割成n列子体，其中，所述轴向方向与所述仰角方向垂直，n为不小于2的整数。
为解决上述技术问题，本申请采用的第二个技术方案是：提供一种 换能器组件的制备方法，包括：准备换能器层；在所述换能器层的两侧表面分别制备匹配层和背衬层，其中，所述背衬层、所述换能器层以及所述匹配层沿轴向方向叠置；沿所述轴向方向切割所述匹配层、换能器层以及背衬层，以形成第一分隔间隙，其中，所述第一分隔间隙贯穿所述匹配层和所述换能器层，并延伸至背衬层，以将所述换能器组件至少沿仰角方向分割成n列子体，其中，所述轴向方向与所述仰角方向垂直，n为不小于2的整数。
本申请的有益效果是：区别于现有技术，本申请提供一种换能器组件，该换能器组件包括沿轴向方向依次叠置的背衬层、换能器层以及匹配层，换能器组件设置有第一分隔间隙，第一分隔间隙沿轴向方向贯穿匹配层和换能器层，并延伸至背衬层中，以将换能器组件至少沿仰角方向分割成n列子体，其中，轴向方向与仰角方向垂直，n为不小于2的整数。本申请换能器组件沿仰角方向被分割成了n列子体，换能器组件在仰角方向上具有呈一维排列的多列子体，且多列子体间相互独立，根据惠更斯原理，按照一定的电子延时对每列子体进行激励，从而形成一个新的超声波阵面，进而减小了超声波束的切片厚度，提高了超声探头的近表面的分辨率。
【附图说明】
图1是本申请换能器组件一实施方式的整体结构示意图；
图2是图1换能器组件的垂直于方位方向的剖面结构示意图；
图3是图1换能器组件的垂直于仰角方向的剖面结构示意图；
图4是图3中A区域的局部放大图；
图5是本申请换能器组件的制备方法一实施方式的流程示意图；
图6是图5中步骤501和步骤502中对应的换能器组件的结构示意图；
图7是图5中步骤503中对应的换能器组件的结构示意图；
图8是本申请换能器组件的制备方法另一实施方式的流程示意图；
图9是图8中步骤801-步骤803中对应的换能器组件的结构示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，均属于本申请保护的范围。
应当理解的是，下列细节的其中一些被提供用来以一种足以使相关领域技术人员能够制造和使用公开的实施例的方式描述下列实施例。然而，下面描述的细节的其中一些对于实施本技术的某些实施例可能是不必要的。此外，本申请可以包括权利要求书范围内但未参考附图详细描述的其他实施例。
在下列说明书和附图中描述了一些细节，以提供对本申请的各实施例的透彻理解。附图中示出的许多细节、尺寸、角度和其他特征仅仅是对本公开的特定实施例的说明。因此，在不脱离本公开的精神或范围的情况下，其他实施例可以具有其他的细节、尺寸、角度和特征。此外，本领域普通技术人员可以理解，可以在没有以下描述的细节的其中一些的情况下实施本申请的其他实施例。
请参见图1，图1是本申请换能器组件一实施方式的整体结构示意图。
如图1所示，本实施方式中，换能器组件10包括沿轴向方向F1依次叠置的背衬层11、换能器层12以及匹配层13。换能器组件10设置有第一分隔间隙14，第一分隔间隙14沿轴向方向F1贯穿匹配层13和换能器层12，并延伸至背衬层11中，以将换能器组件10至少沿仰角方向F2分割成n列子体，其中，轴向方向F1与仰角方向F2垂直，n为不小于2的整数。本实施方式中，换能器组件10沿仰角方向F2被分割成了n列子体，换能器组件10在仰角方向F2上具有呈一维排列的多列子体，且多列子体间相互独立，根据惠更斯原理，按照一定的电子延时对每列子体进行激励，从而形成一个新的超声波阵面，进而减小了超声波 束的切片厚度，提高了超声探头的近表面的分辨率。
本实施方式中，换能器层12包括至少一个配置为以中心操作频率发射超声波能量的换能器元件(图未示)，换能器元件为铌酸钾钠/钛酸铋钠复合压电薄膜、钛酸钡钠/铌酸锂复合压电薄膜、压电微机械薄膜或者电容微机械薄膜中的任一种。其中，中心操作频率为百兆赫兹或以上。换能器元件为铌酸钾钠/钛酸铋钠复合压电薄膜或钛酸钡钠/铌酸锂复合压电薄膜时，可以通过溶胶-凝胶法制成。优选地，换能器层12在振动时产生100-500MHZ的频率的超声波，在其他实施方式中，换能器层12在振动时产生其他频率的超声波，本申请对此不作限定。一个或多个换能器元件可以用来进行电声换能，通过设置多层换能器元件可以提高电声换能的效率；另外，采用薄膜式的换能器元件可以大大减小换能器层12的厚度，从而使得换能器层12在振动时能产生频率较高的超声波，提高了超声探头的近表面的分辨率。在其他实施方式中，换能器层12中换能器元件的材料可以根据具体情况选用，本申请对此不作限定。
本实施方式中，匹配层13包括沿轴向方向F1分布的第一子匹配层131和第二子匹配层132，换能器层12的声阻抗大于第一子匹配层131和第二子匹配层132中任一个的声阻抗，第一子匹配层131的声阻抗大于第二子匹配层132的声阻抗。在其他实施方式中，子匹配层的个数根据具体情况设定，可以为2个、3个或者更多个，只需保证多个子匹配层的声阻抗在远离换能器层12的方向上逐渐减小，且多个子匹配层任一个的声阻抗均小于换能器层12的声阻抗即可。通过设置多个子匹配层，且多个子匹配层的声阻抗渐变，能够完全实现工作介质与换能器层12之间的声阻抗匹配，有效减少声波在工作介质表面的反射，增大声波的有效透射量。在其他实施方式中，多个子匹配层的声阻抗可以通过迭代算法进行精确计算，以取得最优值，本申请对此不作限定。
本实施方式中，可以通过真空镀膜的工艺直接在换能器层12表面镀上第一子匹配层131，然后在第一子匹配层131表面镀上第二子匹配层132。在其他实施方式中，也可以采用其他工艺进行镀膜，本申请对此不作限定。
本实施方式中，通过使用环氧树脂将单独制作好的匹配层13粘到换能器层12表面。匹配层13和换能器层12可以同时制备，可以提高制备效率。在其他实施方式中，也可以采用其他类型的可固化的粘合剂将匹配层13粘到换能器层12表面，本申请对此不作限定。
本实施方式中，背衬层11为包含多种材料的复合型材料，填充材料中至少有两种材料的声阻抗不同。背衬层11中至少两种材料的声阻抗不同，可以较好的起到吸声减震的作用。复合材料包括悬浮在环氧树脂或者其他可流动、可固化液态物质中的微球；该微球可以包括围绕或封装气体(例如空气或烃气体)的玻璃或塑料微球体或者是固体微球体；该微球体也可以是实心球体，其材质包括但不限于橡胶、二氧化硅、氧化锆、氧化铝、金属等物质；该微球或微球体可以以不同的比例与环氧树脂或聚合物混合，以获得具有不同稠度和密度的复合材料。例如，复合材料与微球和环氧树脂或聚合物混合。在其他实施方式中，背衬层11可以为单一材料，该单一材料包括但不限于金属、环氧树脂、氧化锆、氧化铝等固体物质。背衬层11还可以为气体，可以只含有一种气体，也可以是混合型气体。背衬层11为气体时，其声阻抗较小，声能量在换能器层12和背衬层11的交界处发生较大程度的反射，因为换能器层12是朝两个方向发射能量的，声能量沿相反路径返回，能量会有叠加，提高了发射功率。
本实施方式中，背衬层11沿轴向方向F1具有均匀或渐变的声阻抗。背衬层11具有渐变的声阻抗，能够改善换能器组件10的带宽和灵敏度效果。
本实施方式中，通过灌注的方式让可流动、可固化背衬层11与换能器层12结合。在其他实施方式中，可以预先制作好背衬层11，再通过粘合剂将背衬层11粘合到换能器层12表面。背衬层11和换能器层12可以同时制备，可以提高制备效率。
在一个具体的实施方式中，n为不小于3的奇数。沿仰角方向F2的n列子体关于位于n列子体中间的子体的中轴线对称分布，且彼此对称的两列子体在沿仰角方向F2的宽度之和与位于n列子体中间的子体的 宽度相等，彼此对称的两列子体电连接，以同时接收外部激励。因为仰角方向F2每一组对称的子体是被一起电连接的，也就是说激励时是被同时激励的。仰角方向F2上的波束聚焦于换能器组件10在仰角方向F2的对称面上，通过改变延时可以调整聚焦的焦距，在后期透镜进一步聚焦之前多一次在仰角方向F2上的聚焦，能够减小切片厚度。
为了描述方便，本实施方式以n为5进行具体说明。具体的，可以参阅图2，图2是图1换能器组件的垂直于方位方向F3的剖面结构示意图。第一分隔间隙14沿轴向方向F1贯穿匹配层13和换能器层12，并延伸至背衬层11中，以将换能器组件10沿仰角方向F2分割成5列子体，分别为依次沿仰角方向F2排列第一列子体101、第二列子体102、第三列子体103、第四列子体104以及第五列子体105，其中，第三列子体103为5列子体的中间的子体。第三列子体103关于其中轴线L自对称，第一列子体101与第五列子体105关于第三列子体103的中轴线L对称，第二列子体102与第四列子体104关于第三列子体103的中轴线L对称。第一列子体101与第五列子体105的宽度之和、第二列子体102与第四列子体104的宽度之和、以及第三列子体103的宽度之和相等。第一列子体101与第五列子体105之间电连接，第二列子体102与第四列子体104之间电连接，以同时接受激励。当换能器层12接收激励时，彼此对称的两列子体与中间子体发出超声波的面积相同，保证了彼此对称的两列子体与中间子体发出的超声波能量相同，同时也易于换能器层12的后期电阻抗匹配的设计。
本实施方式中，沿仰角方向F2的n列子体中，相邻两列子体之间的第一分隔间隙14沿仰角方向F2的宽度相等，且宽度为10-100μm。设置相同的间隙，可以保证产品质量，提高产品精度。在其他实施方式中，第一分隔间隙14的宽度之间的公差保持在预设范围内，在满足产品基本的情况下，可以降低工艺难度，提高生产效率。
本实施方式中，第一分隔间隙14内进一步由填充材料进行填充。在一个具体的实施方式中，第一分隔间隙14位于匹配层13和换能器层12的部分的填充密实度大于第一分隔间隙14位于背衬层11的部分。由 于背衬层11主要是吸声减震，降低其间隙的填充密实度，在满足其吸声减震的同时可以减小工艺难度，降低制作成本。
进一步的，填充材料沿轴向方向F1具有均匀或者渐变的声阻抗。填充材料可以为单一材料或复合材料。复合材料包括悬浮在环氧树脂或者其他可流动、可固化液态物质中的微球；该微球可以包括围绕或封装气体(例如空气或烃气体)的玻璃或塑料微球体或者是固体微球体；该微球体也可以是实心球体，其材质包括但不限于橡胶、二氧化硅、氧化锆、氧化铝、金属等物质；该微球或微球体可以以不同的比例与环氧树脂或聚合物混合，以获得具有不同稠度和密度的复合材料。例如，复合材料与微球和环氧树脂或聚合物混合。在其他实施方式中，填充材料可以为单一材料。该单一材料包括但不限于金属、环氧树脂、氧化锆、氧化铝等固体物质。填充材料还可以为气体，可以只含有一种气体，也可以是混合型气体。填充材料为气体时可以较好的起到进一步减弱相邻子体间的串扰的作用。
进一步参阅图3和图4，图3是图1换能器组件的垂直于仰角方向的剖面结构示意图；图4是图3中A区域的局部放大图。
本实施方式中，换能器组件10还设置有第二分隔间隙15，第二分隔间隙15沿轴向方向F1贯穿匹配层13和换能器层12，并延伸至背衬层11中，以将换能器组件10至少沿方位方向F3分割成m列子体，其中，方位方向F3、轴向方向F1以及仰角方向F2相互垂直，m为不小于2的整数。换能器组件10沿方位方向F3被分割成了n列子体，换能器组件10在方位方向F3上具有呈一维排列的多列子体，且多列子体间相互独立，根据惠更斯原理，按照一定的电子延时对每列子体进行激励，从而形成一个新的超声波阵面，会使得超声波束在方位方向F3上发生偏转、聚焦，提高了超声探头的近表面的分辨率。
在一个具体的实施方式中，m为大于n的偶数，沿方位方向F3的m列子体在沿方位方向F3上的宽度相同。优选地，m可取64、128以及256中的任一种。进一步的，沿方位方向F3的m列子体对称分布。
本实施方式中，沿方位方向F3的m列子体相邻两列子体之间的第 二分隔间隙15的宽度沿方位方向F3相同，且宽度为10-100μm。优选的，第二分隔间隙15宽度和第一分隔间隙14的宽度相等。在其他实施方式中，第二分隔间隙15和第一分隔间隙14的宽度也可以不同，本申请对此不作限定。
本实施方式中，第二分隔间隙15中进一步由填充材料进行填充，第一分隔间隙14中的填充材料与第一分隔间隙14中的材料相同，在此不再赘述。在其他实施方式中，第一分隔间隙14中的填充材料也可以不同，本申请对此不作限定。
本实施方式中，第一分隔间隙14和第二分隔间隙15可以使用刀片切割的机械切割工艺形成，也可以通过光刻、化学刻蚀、等离子刻蚀等相关刻蚀工艺形成，本申请对此不作限定。
本实施方式中，换能器组件10沿仰角方向F2被分割成了n列子体，沿方位方向F3被分割成了m列子体，换能器组件10在仰角方向F2和方位方向F3上具有呈二维排列的多个子体，且多个子体间相互独立。根据惠更斯原理，按照一定的电子延时对每个子体进行激励，在方位方向F3上给子体施加不同激励延时的同时，也在仰角方向F2上给子体施加不同的激励延时，从而形成一个新的超声波阵面，仰角方向F2上的波束聚焦于换能器组件在仰角方向F2的对称面上，通过改变延时可以调整聚焦的焦距，在后期透镜进一步聚焦之前多一次在仰角方向上的聚焦，能够减小切片厚度，也能在方位方向F3上发生偏转，进而进一步减小了超声波束的切片厚度；另一方面，通过使用薄膜式换能器层12，使得换能器层12在振动时能产生频率较高的超声波。结合此二者的提升，换能器组件10沿轴向方向F1的分辨力可在5μm以内，能够检测更加细微的工件缺陷，提高了近表面分辨力。
区别于现有技术，本申请提供一种换能器组件，该换能器组件包括沿轴向方向依次叠置的背衬层、换能器层以及匹配层，换能器组件设置有第一分隔间隙，第一分隔间隙沿轴向方向贯穿匹配层和换能器层，并延伸至背衬层中，以将换能器组件至少沿仰角方向分割成n列子体，其中，轴向方向与仰角方向垂直，n为不小于2的整数。本申请换能器组 件沿仰角方向被分割成了n列子体，换能器组件在仰角方向上具有呈一维排列的多列子体，且多列子体间相互独立，根据惠更斯原理，按照一定的电子延时对每列子体进行激励，从而形成一个新的超声波阵面，进而减小了超声波束的切片厚度，提高了超声探头的近表面的分辨率。
参阅图5，图5是本申请换能器组件的制备方法一实施方式的流程示意图。
如图5所示，本实施方式中，换能器组件的制备方法包括：
步骤501：准备换能器层。
参阅图6，图6是图5中步骤501和步骤502中对应的换能器组件的结构示意图。准备换能器层22。本实施方式中，换能器层22与图1中的换能器层11相同，请参阅图1和说明书相关描述，在此不再赘述。
步骤502：在换能器层的两侧表面分别制备匹配层和背衬层，其中，背衬层、换能器层以及匹配层沿轴向方向叠置。
继续参阅图6，本实施方式中，匹配层23和背衬层21与图1中的匹配层13和背衬层11相同，请参阅图1和说明书相关描述，相关部分在此不再赘述。
在一个具体的实施方式中，匹配层23包括第一子匹配层231和第二匹配层232。通过真空镀膜的工艺直接在换能器层22表面镀上第一子匹配层231，然后在第一子匹配层231表面镀上第二匹配层232。通过灌注的方式让可流动、可固化背衬层21与换能器层22结合。需要说明的是，在换能器层22上制作背衬层21和匹配层23的先后顺序可以互换，本申请对此不作限定。在其他实施方式中，也可以采用其他工艺制备匹配层23和背衬层21，本申请对此不作限定。
在另一个具体的实施方式中，准备匹配层23和背衬层21，将匹配层23和背衬层21通过粘合剂粘贴在换能器层22的两侧表面上。通过使用环氧树脂将单独制作好的匹配层23粘到换能器层22表面。匹配层23和换能器层22可以同时制备，可以提高制备效率。
步骤503：沿轴向方向切割匹配层、换能器层以及背衬层，以形成第一分隔间隙，其中，第一分隔间隙贯穿匹配层和换能器层，并延伸至 背衬层，以将换能器组件至少沿仰角方向分割成n列子体，其中，轴向方向与仰角方向垂直，n为不小于2的整数。
参阅图7，图7是图5中步骤503中对应的换能器组件的结构示意图。沿轴向方向切割匹配层23、换能器层22以及背衬层21，以形成第一分隔间隙24，其中，第一分隔间隙24贯穿匹配层23和换能器层22，并延伸至背衬层21，以将换能器组件20至少沿仰角方向分割成n列子体，其中，轴向方向F1与仰角方向F2垂直，n为不小于2的整数。本实施方式中，第一分隔间隙24可以使用刀片切割的机械切割工艺形成，也可以通过光刻、化学刻蚀、等离子刻蚀等相关刻蚀工艺形成，本申请对此不作限定。第一分隔间隙24与图1中的第一分隔间隙14相同，在此不再赘述。
进一步的，利用填充材料对第一分隔间隙24进行填充。填充材料与图1中第一分隔间隙的材料相同，在此不再赘述。
区别于现有技术，本申请将换能器组件沿仰角方向分割成了n列子体，换能器组件在仰角方向上具有呈一维排列的多列子体，且多列子体间相互独立，根据惠更斯原理，按照一定的电子延时对每列子体进行激励，从而形成一个新的超声波阵面，进而减小了超声波束的切片厚度，提高了超声探头的近表面的分辨率。
参阅图8，图8是本申请换能器组件的制备方法另一实施方式的流程示意图。
本实施方式中，换能器组件的制备方法包括：
步骤801：准备换能器层。
参阅图9，图9是图8中步骤801-步骤803中对应的换能器组件的结构示意图。准备换能器层32。步骤801与步骤501相同，在此不再赘述。
步骤802：在换能器层的两侧表面分别制备匹配层和背衬层，其中，背衬层、换能器层以及匹配层沿轴向方向叠置。
本实施方式中，在换能器层32的两侧表面分别制备匹配层33和背衬层31，其中，背衬层31、换能器层32以及匹配层33沿轴向方向叠 置。步骤802与步骤502相同，在此不再赘述。
步骤803：沿轴向方向切割匹配层、换能器层以及背衬层，以形成第一分隔间隙和第二分隔间隙，其中，第一分隔间隙贯穿匹配层和换能器层，并延伸至背衬层，以将换能器组件至少沿仰角方向分割成n列子体，其中，轴向方向与仰角方向垂直，n为不小于2的整数；第二分隔间隙贯穿匹配层和换能器层，并延伸至背衬层，以将换能器组件至少沿方位方向分割成m列子体，其中，方位方向、轴向方向以及仰角方向相互垂直，m为不小于2的整数。
本实施方式中，第一分隔间隙34可以使用刀片切割的机械切割工艺形成，也可以通过光刻、化学刻蚀、等离子刻蚀等相关刻蚀工艺形成，本申请对此不作限定。第一分隔间隙34与图1中的第一分隔间隙14相同，在此不再赘述。
在沿轴向方向F1切割匹配层33、换能器层32以及背衬层31之后，还形成第二分隔间隙35，其中，第二分隔间隙35贯穿匹配层33和换能器层32，并延伸至背衬层31，以将换能器组件30至少沿方位方向F3分割成m列子体，其中，方位方向F3、轴向方向F1以及仰角方向F2相互垂直，m为不小于2的整数。第二分隔间隙35与图1中分隔间隙相同，在此不再赘述。
需要说明的是，第一分隔间隙34和第二分隔间隙35的形成顺序可以互换，或者同时形成。
进一步的，在形成第二分隔间隙35之后，利用填充材料对第一分隔间隙34和第二分隔间隙35进行填充。填充材料与图1中第一分隔间隙的材料相同，在此不再赘述。
区别于现有技术，本申请将换能器组件沿仰角方向分割成了n列子体，换能器组件在仰角方向上具有呈一维排列的多列子体，且多列子体间相互独立，根据惠更斯原理，按照一定的电子延时对每列子体进行激励，从而形成一个新的超声波阵面，进而减小了超声波束的切片厚度，提高了超声探头的近表面的分辨率。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡 是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (17)

  1. 一种换能器组件，其特征在于，所述换能器组件包括沿轴向方向依次叠置的背衬层、换能器层以及匹配层，所述换能器组件设置有第一分隔间隙，所述第一分隔间隙沿所述轴向方向贯穿所述匹配层和所述换能器层，并延伸至所述背衬层中，以将所述换能器组件至少沿仰角方向分割成n列子体，其中，所述轴向方向与所述仰角方向垂直，n为不小于2的整数。
  2. 根据权利要求1所述的换能器组件，其特征在于，n为不小于3的奇数。
  3. 根据权利要求2所述的换能器组件，其特征在于，沿所述仰角方向的n列子体关于位于n列子体中间的子体的中轴线对称分布，且彼此对称的两列子体在沿所述仰角方向的宽度之和与位于n列子体中间的子体的宽度相等，彼此对称的两列子体电连接，以同时接收外部激励。
  4. 根据权利要求1所述的换能器组件，其特征在于，所述匹配层包括沿所述轴向方向分布的多个子匹配层，所述换能器层的声阻抗大于所述多个子匹配层中任一个的声阻抗，所述多个子匹配层的声阻抗在远离所述换能器层的方向上逐渐减小。
  5. 根据权利要求1所述的换能器组件，其特征在于，沿所述仰角方向的n列子体中，相邻两列子体之间的所述第一分隔间隙沿所述仰角方向的宽度相等，且宽度为10-100μm。
  6. 根据权利要求1所述的换能器组件，其特征在于，所述第一分隔间隙内进一步由填充材料进行填充。
  7. 根据权利要求6所述的换能器组件，其特征在于，所述填充材料沿所述轴向方向具有均匀或者渐变的声阻抗。
  8. 根据权利要求7所述的换能器组件，其特征在于，所述填充材料为包含多种材料的复合型材料，所述填充材料中至少有两种材料的声阻抗不同。
  9. 根据权利要求1所述的换能器组件，其特征在于，所述背衬层沿所述轴向方向具有均匀或渐变的声阻抗。
  10. 根据权利要求1所述的换能器组件，其特征在于，所述换能器层包括至少一个配置为以中心操作频率发射超声波能量的换能器元件，所述换能器元件为铌酸钾钠/钛酸铋钠复合压电薄膜、钛酸钡钠/铌酸锂复合压电薄膜、压电微机械薄膜或者电容微机械薄膜中的任一种。
  11. 根据权利要求1-10任一项所述的换能器组件，其特征在于，所述换能器组件还设置有第二分隔间隙，所述第二分隔间隙沿所述轴向方向贯穿所述匹配层和所述换能器层，并延伸至背衬层中，以将所述换能器组件至少沿方位方向分割成m列子体，其中，所述方位方向、所述轴向方向以及所述仰角方向相互垂直，m为不小于2的整数。
  12. 根据权利要求11所述的换能器组件，其特征在于，m为大于n的偶数，沿所述方位方向的m列子体在沿所述方位方向上的宽度相同。
  13. 根据权利要求11所述的换能器组件，其特征在于，所述第二分隔间隙中进一步由填充材料进行填充。
  14. 一种换能器组件的制备方法，其特征在于，包括：
    准备换能器层；
    在所述换能器层的两侧表面分别制备匹配层和背衬层，其中，所述背衬层、所述换能器层以及所述匹配层沿轴向方向叠置；
    沿所述轴向方向切割所述匹配层、换能器层以及背衬层，以形成第一分隔间隙，其中，所述第一分隔间隙贯穿所述匹配层和所述换能器层，并延伸至背衬层，以将所述换能器组件至少沿仰角方向分割成n列子体，其中，所述轴向方向与所述仰角方向垂直，n为不小于2的整数。
  15. 根据权利要求14所述的制备方法，其特征在于，所述在所述换能器层的两侧表面分别制备匹配层和背衬层的步骤包括：
    准备所述匹配层和所述背衬层，将所述匹配层和所述背衬层通过粘合剂粘贴在所述换能器层的两侧表面上。
  16. 根据权利要求14所述的制备方法，其特征在于，所述沿所述轴向方向切割所述匹配层、换能器层以及背衬层的步骤进一步包括：
    形成第二分隔间隙，其中，所述第二分隔间隙贯穿所述匹配层和所所述换能器层，并延伸至背衬层，以将所述换能器组件至少沿方位方向分割成m列子体，其中，所述方位方向、所述轴向方向以及所述仰角方向相互垂直，m为不小于2的整数。
  17. 根据权利要求16所述的制备方法，其特征在于，所述方法进一步包括：
    利用填充材料对所述第一分隔间隙和所述第二分隔间隙进行填充。
PCT/CN2018/118004 2018-11-28 2018-11-28 换能器组件及其制备方法 Ceased WO2020107283A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/118004 WO2020107283A1 (zh) 2018-11-28 2018-11-28 换能器组件及其制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/118004 WO2020107283A1 (zh) 2018-11-28 2018-11-28 换能器组件及其制备方法

Publications (1)

Publication Number Publication Date
WO2020107283A1 true WO2020107283A1 (zh) 2020-06-04

Family

ID=70854242

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/118004 Ceased WO2020107283A1 (zh) 2018-11-28 2018-11-28 换能器组件及其制备方法

Country Status (1)

Country Link
WO (1) WO2020107283A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103315775A (zh) * 2013-06-28 2013-09-25 深圳市理邦精密仪器股份有限公司 一种超声阵列换能器及其制备方法
CN105170435A (zh) * 2015-09-23 2015-12-23 深圳先进技术研究院 高频超声换能器及其制备方法
CN106984516A (zh) * 2017-05-31 2017-07-28 陈江龙 一种用于检测的接触式超声换能器及其制备方法
CN107920797A (zh) * 2015-09-03 2018-04-17 富士胶片索诺声公司 超声波换能器组件
CN107981887A (zh) * 2017-12-19 2018-05-04 深圳先进技术研究院 超声换能器、聚焦换能器及聚焦换能器制作方法
CN109530196A (zh) * 2018-11-28 2019-03-29 深圳先进技术研究院 换能器组件及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103315775A (zh) * 2013-06-28 2013-09-25 深圳市理邦精密仪器股份有限公司 一种超声阵列换能器及其制备方法
CN107920797A (zh) * 2015-09-03 2018-04-17 富士胶片索诺声公司 超声波换能器组件
CN105170435A (zh) * 2015-09-23 2015-12-23 深圳先进技术研究院 高频超声换能器及其制备方法
CN106984516A (zh) * 2017-05-31 2017-07-28 陈江龙 一种用于检测的接触式超声换能器及其制备方法
CN107981887A (zh) * 2017-12-19 2018-05-04 深圳先进技术研究院 超声换能器、聚焦换能器及聚焦换能器制作方法
CN109530196A (zh) * 2018-11-28 2019-03-29 深圳先进技术研究院 换能器组件及其制备方法

Similar Documents

Publication Publication Date Title
US10486197B2 (en) Multilayer backing absorber for ultrasonic transducer
CN101524682B (zh) 压电单晶复合材料高频超声换能器及其制作方法与应用
JP5807206B2 (ja) 超音波プローブ、及び、超音波診断装置
Wong et al. Development of a 20-MHz wide-bandwidth PMN-PT single crystal phased-array ultrasound transducer
US20070035204A1 (en) Dual frequency band ultrasound transducer arrays
US20110208059A1 (en) Ultrasound probe
CN109530196B (zh) 换能器组件及其制备方法
CN201516405U (zh) 压电单晶复合材料高频超声换能器
CN107534815A (zh) 包括具有复合结构的匹配层的超声换能器及其制造方法
WO2016138622A1 (zh) 超声波换能器及其制造方法
CN209406784U (zh) 换能器组件
WO2012023619A1 (ja) 超音波探触子およびそれを用いた超音波診断装置
CN102205311A (zh) 具有宽束超声波换能器的短距离超声波装置
CN111957544B (zh) 压电微机械超声换能器背衬结构
Brown et al. Fabrication and performance of high-frequency composite transducers with triangular-pillar geometry
WO2020107283A1 (zh) 换能器组件及其制备方法
CN109622345B (zh) 超声换能器
CN219978201U (zh) 一种基于主动背衬结构的阵列式超声探头
CN110095532A (zh) 超声换能器以及超声换能器的制备方法
CN209502195U (zh) 超声换能器
Wong et al. An ultrawide bandwidth high frequency phased-array ultrasound transducer fabricated using the PMN-0.3 PT single crystal
JPS59178378A (ja) 超音波探触子
La Mura Fem Modelling and Characterization of Ultrasonic Flextensional Transducers
Gebhardt et al. Air coupled ultrasonic transducers: Design and applications
WO2020113535A1 (zh) 超声换能器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18941801

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205N DATED 20/07/2021

122 Ep: pct application non-entry in european phase

Ref document number: 18941801

Country of ref document: EP

Kind code of ref document: A1