WO2020103072A1 - Adhesive composition - Google Patents
Adhesive compositionInfo
- Publication number
- WO2020103072A1 WO2020103072A1 PCT/CN2018/116899 CN2018116899W WO2020103072A1 WO 2020103072 A1 WO2020103072 A1 WO 2020103072A1 CN 2018116899 W CN2018116899 W CN 2018116899W WO 2020103072 A1 WO2020103072 A1 WO 2020103072A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- adhesive
- composition
- compound
- layer
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 135
- 239000000853 adhesive Substances 0.000 title claims abstract description 128
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 128
- 229920005862 polyol Polymers 0.000 claims abstract description 61
- 150000001875 compounds Chemical class 0.000 claims abstract description 56
- -1 phosphate ester polyol compound Chemical class 0.000 claims abstract description 40
- 229920005906 polyester polyol Polymers 0.000 claims abstract description 36
- 150000003077 polyols Chemical class 0.000 claims abstract description 35
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 29
- 239000010452 phosphate Substances 0.000 claims abstract description 29
- 239000004814 polyurethane Substances 0.000 claims abstract description 29
- 229920002635 polyurethane Polymers 0.000 claims abstract description 28
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000010410 layer Substances 0.000 claims description 41
- 239000011888 foil Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 30
- 238000003475 lamination Methods 0.000 claims description 25
- 239000004677 Nylon Substances 0.000 claims description 16
- 229920001778 nylon Polymers 0.000 claims description 16
- 230000032683 aging Effects 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 239000007795 chemical reaction product Substances 0.000 claims description 7
- 229920000137 polyphosphoric acid Polymers 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 150000007513 acids Chemical class 0.000 claims description 5
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 3
- 229910001416 lithium ion Inorganic materials 0.000 claims description 3
- 125000000962 organic group Chemical group 0.000 claims description 3
- 229920000307 polymer substrate Polymers 0.000 claims 2
- 239000005001 laminate film Substances 0.000 claims 1
- 238000009472 formulation Methods 0.000 description 43
- 239000002904 solvent Substances 0.000 description 27
- 238000012360 testing method Methods 0.000 description 27
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- 239000012948 isocyanate Substances 0.000 description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229920001228 polyisocyanate Polymers 0.000 description 8
- 239000005056 polyisocyanate Substances 0.000 description 8
- 239000002994 raw material Substances 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920006284 nylon film Polymers 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- 239000005058 Isophorone diisocyanate Substances 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 159000000032 aromatic acids Chemical class 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 229920006280 packaging film Polymers 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 150000004072 triols Chemical class 0.000 description 3
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 2
- 239000004970 Chain extender Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000005025 cast polypropylene Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N hexane carboxylic acid Natural products CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
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- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 235000011007 phosphoric acid Nutrition 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000003880 polar aprotic solvent Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940035437 1,3-propanediol Drugs 0.000 description 1
- JIABEENURMZTTI-UHFFFAOYSA-N 1-isocyanato-2-[(2-isocyanatophenyl)methyl]benzene Chemical class O=C=NC1=CC=CC=C1CC1=CC=CC=C1N=C=O JIABEENURMZTTI-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GOHPTLYPQCTZSE-UHFFFAOYSA-N 2,2-dimethylsuccinic acid Chemical compound OC(=O)C(C)(C)CC(O)=O GOHPTLYPQCTZSE-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- RNWKAIFTTVGWLK-UHFFFAOYSA-N 3,3-diethylpentanedioic acid Chemical compound OC(=O)CC(CC)(CC)CC(O)=O RNWKAIFTTVGWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
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- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
- JDIBGQFKXXXXPN-UHFFFAOYSA-N bismuth(3+) Chemical compound [Bi+3] JDIBGQFKXXXXPN-UHFFFAOYSA-N 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
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- 238000009833 condensation Methods 0.000 description 1
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- 238000004132 cross linking Methods 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
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- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
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- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
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- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
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- 229920005903 polyol mixture Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
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- 239000011541 reaction mixture Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- 230000003068 static effect Effects 0.000 description 1
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- 238000003756 stirring Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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Definitions
- the present invention relates to an adhesive composition; and more specifically, the present invention relates to a two-component polyurethane adhesive composition.
- 2K polyurethane adhesive compositions are based on the reaction mixture of a polyol component and a polyisocyanate component; and have long been used as adhesives.
- the polyisocyanates and polyols react to form a cured polyurethane adhesive; and the reaction can form a strong adhesive bond to many types of substrates.
- the package for packaging a lithium-ion battery typically has a foil-based lamination structure and the foil-based lamination structure can be, for instance, a nylon, foil and retort cast polypropylene (RCPP) combination (nylon/foil/RCPP) ; and the foil-based lamination structure is usually manufactured by a deep draw molding method of nylon/foil/RCPP lamination film.
- the known lamination adhesive compositions used for such LIB applications cannot pass the deep draw and high temperature bond strength test (e.g., achieving a bonding strength of greater than (>) 2 Newtons per 15 millimeters [N/15 mm] at 120°C between nylon and foil) . Therefore, it is desired to provide a 2K solvent-based lamination adhesive composition which has good bond strength, moldability, and heat resistance; and can be used for manufacturing a foil-based structure lamination article such as a laminated film package for a LIB.
- the present invention is directed to a novel solvent-based lamination adhesive composition.
- the adhesive of the present invention is a two-component solvent-based lamination adhesive composition (i.e., a two-part system) including: (1) the first part being an isocyanate-terminated compound part (NCO-component) , and (2) the second part being a hydroxyl-terminated polyol (OH-component) .
- the novel adhesive composition of the present invention is based on a novel polyol mixture (i.e., the second part of the 2K adhesive composition) of (1) a polyester polyol and (2) a phosphate ester polyol.
- the phosphate ester polyol component is provided as an adhesion promoter in the 2K adhesive composition of the present invention.
- the present invention is directed to a polyurethane lamination adhesive composition, such as a 2K polyurethane adhesive, including (A) at least one isocyanate group-containing component including at least one isocyanate group-containing compound; and (B) at least one polyol component including: (Bi) at least one polyester polyol compound having a high molecular weight (e.g., >8,000 grams per mole [g/mol] ) ; and (Bii) at least one phosphate ester polyol compound.
- component (A) , component (B) or both components (A) and (B) can optionally include at least one solvent compound.
- the present invention includes a process for making the above polyurethane lamination adhesive composition.
- the 2K solvent-based lamination adhesive composition of the present invention advantageously provides an increase in the properties, such as bond strength, heat resistance and moldability, for foil-based lamination structures (e.g., nylon/foil/RCPP) useful for manufacturing various articles.
- foil-based lamination structures e.g., nylon/foil/RCPP
- the 2K adhesive of the present invention can be used in a variety of applications; the present invention adhesive can be particularly useful in LIB applications.
- the adhesive composition of the present invention can be designed for deep draw applications which require the use of a high number molecular weight (M n ) polyester polyol, for example, a polyester polyol having a M n of>8,000 g/mol.
- M n number molecular weight
- the amount of phosphate ester used in the adhesive composition of the present invention is used in a proper predetermined amount such that poor performance of the composition is avoided.
- the adhesive composition of the present invention including, for example: (1) there is no need to apply a metal compound in a final lamination adhesive; (2) there is no need to apply an acrylic polyol in a final adhesive composition; (3) there is no limitation on the content of an aliphatic carboxylic acid and/or an aromatic carboxylic acid used in the polyester polyol; (4) there is no need to use an epoxy-terminated polyester; and (5) there is no limitation on the content of an aliphatic isocyanate and/or an aromatic isocyanate used in the isocyanate-terminated compound.
- FIG. 1 is a schematic illustration showing a typical five-layered structure of a LIB packaging laminated film, generally indicated by numeral 10, which includes, from the outer side thereof, an outer layer side resin film layer (11) , an outer layer side adhesive layer (14) , a metal foil layer (12) , an inner layer side adhesive layer (15) , and an inner surface layer (13) composed of a heat seal layer or the like.
- the present invention includes a two-component (2K) adhesive composition; and more specifically, the present invention includes a 2K PU adhesive, including (A) at least one isocyanate group-containing component; and (B) at least one polyol component (or a hydroxyl group-containing component) .
- 2K PU adhesive including (A) at least one isocyanate group-containing component; and (B) at least one polyol component (or a hydroxyl group-containing component) .
- the ratio of (B) : (A) viz, the OH/NCO dry weight index can be from 1 to 20 in one embodiment; from 2 to 15 in another embodiment; and from 5 to 12 in still another embodiment.
- the isocyanate group-containing component, component (A) can be a mixture or blend of one or more compounds including, for example, at least one isocyanate group-containing compound such as one or more polyisocyanate compounds.
- the isocyanate group-containing component, component (A) can also include, as an optional component, at least one solvent compound such as ethyl acetate as described herein below.
- the isocyanate group-containing compound useful in the adhesive formulation of the present invention can include, for example, aromatic isocyanates, aliphatic isocyanates, or mixtures thereof.
- aromatic isocyanate useful in the present invention include, for example, isomers of methylene diphenyl diisocyanate ( “MDI” ) such as 4, 4-MDI, 2, 4-MDI and 2, 2’-MDI; modified MDI such as carbodiimide modified MDI or allophanate modified MDI; isomers of toluene-diisocyanate ( “TDI” ) such as 2, 4-TDI and 2, 6-TDI; isomers of naphthalene-diisocyanate ( “NDI” ) such as 1, 5-NDI; and combinations thereof.
- MDI methylene diphenyl diisocyanate
- TDI toluene-diisocyanate
- NDI isomers of naphthalene-diisocyanate
- Embodiments of an aliphatic isocyanate group-containing compound useful in the present invention include, for example, isomers of hexamethylene diisocyanate ( “HDI” ) ; isomers of isophorone diisocyanate ( “IPDI” ) ; isomers of xylene diisocyanate ( “XDI” ) ; isomers of hydrogenated methylene diphenyl diisocyanate ( “H12MDI” ) ; and combinations thereof.
- HDI hexamethylene diisocyanate
- IPDI isomers of isophorone diisocyanate
- XDI xylene diisocyanate
- H12MDI hydrogenated methylene diphenyl diisocyanate
- the isocyanate group-containing compound useful in the present invention can be selected, for example, from the group consisting of an isocyanate monomer, a polyisocyanate, an isocyanate prepolymer, and mixtures of two or more thereof.
- Exemplary of the isocyanate monomers useful in the adhesive formulation may include aromatic diisocyanates such as isomers ofMDI, isomers of TDI; or aliphatic isocyanate such as HDI, IPDI and mixtures thereof.
- Exemplary of the polyisocyanate compounds useful in the adhesive formulation can include, for example, a polyisocyanate adduct or trimer.
- the polyisocyanate compound may include, but not limited to, a TDI-trimethylolpropane adduct (TDI-TMP adduct) , and an IPDI-trimer.
- the polyisocyanate compound can have an average NCO functionality (f) of greater than or equal to ( ⁇ ) 2.8 and less than or equal to ( ⁇ ) 5 (i.e., 2.8 ⁇ f ⁇ 5) .
- Exemplary of the isocyanate prepolymer useful in the adhesive formulation can include, for example, at least one prepolymer–polyol–chain extender compound structure such as MDI (methylene diphenyl diisocyanate) end-capped prepolymers based on EO (ethylene oxide) and/or PO (propylene oxide) based diols or triols.
- MDI methylene diphenyl diisocyanate
- EO ethylene oxide
- PO propylene oxide
- the amount of the isocyanate compound in the 2K adhesive formulation can be generally in the range of from 1 weight percent (wt%) to 30 wt%in one embodiment; from 2 wt%to 25 wt%in another embodiment; and from 4 wt%to 15 wt%in still another embodiment, based on the total dry weight of the components in the formulation.
- the solids content of the isocyanate group-containing component, component (A) can be, for example, from 30 wt%to 100 wt%.
- the polyol component, component (B) can be a solution, mixture or blend of one or more compounds including, for example: (Bi) at least one polyester polyol compound (e.g., a polyester polyol having a molecular weight of>8,000 g/mol) ; and (Bii) at least one phosphate ester polyol compound.
- a polyester polyol compound e.g., a polyester polyol having a molecular weight of>8,000 g/mol
- phosphate ester polyol compound e.g., a phosphate ester polyol compound
- the polyester polyol compound, component (Bi) useful in the adhesive formulation of the present invention can include, for example polyester polyols derived from polycarboxylic acids and polyols.
- the polyester polyol compound suitable for use in the polyol component (B) can be selected, for example, from polyester polyols having a number average molecular weight of at least 8,000 g/mol.
- the suitable polyester polyols can have an OH functionality (f) of ⁇ 1.8 to ⁇ 3 (i.e., 1.8 ⁇ f ⁇ 3) and an OH number of less than ( ⁇ ) 15 mg KOH/g.
- the “OH number” is characterized by the milligrams of potassium hydroxide equivalent to the hydroxyl content in one gram of polyol.
- the polyester polyol compound suitable for use in the adhesive formulation can include, for example, polycondensates of diols and also, optionally, polyols (e.g., triols, tetraols) , and mixtures thereof; and of dicarboxylic acids, and mixtures thereof.
- the polyester polyol compound can also be derived from dicarboxylic acids, their corresponding anhydrides, or corresponding esters of lower alcohols.
- Suitable diols useful in the present invention can include, but are not limited to, ethylene glycol; butylene glycol; diethylene glycol; 1, 2-propanediol; 1, 3-propanediol; 1, 3-butanediol; 1, 4-butanediol; 1, 6-hexanediol; 2-methyl-1, 3-propanediol; neopentyl glycol; and mixtures thereof.
- polyols having an OH functionality of3 or>3 can optionally be included in the adhesive composition (e.g., trimethylolpropane, glycerol, erythritol, or pentaerythritol) .
- Suitable dicarboxylic acids useful in the present invention can include, but are not limited to, aliphatic acids, aromatic acids, and combinations thereof.
- suitable aromatic acids include phthalic acid, isophthalic acid, terephthalic acid, and mixtures thereof.
- suitable aliphatic acids include cyclohexane dicarboxylic acid, adipic acid, azelaic acid, sebacic acid, glutaric acid, maleic acid, fumaric acid, itaconic acid, malonic acid, suberic acid, 2-methyl succinic acid, 3, 3-diethyl glutaric acid, 2, 2-dimethyl succinic acid, trimellitic acid, and mixtures thereof.
- Anhydrides of such acids may also be used.
- monocarboxylic acids such as benzoic acid and hexane carboxylic acid
- monocarboxylic acids should be minimized or excluded from the compositions of the present invention.
- saturated aliphatic or saturated aromatic acids such as azelaic acid, sebacic acid, adipic acid, terephthalic acid, isophthalic acid, and mixtures thereof can be used in the present invention.
- the polyester polyol compound, component (Bi) can have a glass transition temperature (Tg) in the range of-25°C to 40°C. All the individual ranges and subranges between-25°C and 40°C are included in the scope of the present invention; for example, the polyester polyol compound can have a Tg in the range of -15°C to 5°C in one embodiment and a Tg in the range of-20°C to 10°C in another embodiment.
- Tg glass transition temperature
- the amount of the polyester polyol compound, component (Bi) , in the two-component adhesive formulation can be generally in the range of from 70 wt%to 95 wt%in one embodiment; from 75 wt%to 90 wt%in another embodiment; and from 80 wt%to 90 wt%in still another embodiment, based on the total dry weight of the components in the formulation.
- the molecular weight (M n ) of the polyester polyol compound can be from>8,000 g/mol in one embodiment, >10,000 g/mol in another embodiment, >12,000 g/mol in still another embodiment, and>20,000 g/mol in yet another embodiment.
- the M n of the polyester polyol compound can be from >8,000 g/mol to 200,000 g/mol in one embodiment, from 10,000 g/mol to 150,000 g/mol in another embodiment; and from 20,000 g/mol to 100,000 g/mol in still another embodiment.
- the polyester polyol compound can be selected based on the hydroxyl value of the polyester polyol compound which can be ⁇ 15 mg KOH/g in one embodiment, ⁇ 10 mg KOH/g in another embodiment; and ⁇ 5 mg KOH/g in still another embodiment.
- the phosphate ester polyol compound, component (Bii) can include for example, the compounds of Structure (I) or Structure (II) as follows:
- R’ can be selected from any organic group.
- the phosphate ester polyol can be obtained by reacting phosphoric-type acids with polyols.
- suitable phosphoric-type acids include, but are not limited to, orthophosphoric acid, any member of the series of compounds that may be made by condensation of orthophosphoric acid by the elimination of water such as pyrophosphoric acid, tripolyphosphoric acid and polyphosphoric acids, and mixture thereof.
- suitable polyols include, but are not limited to, diols, triols, polyether polyol, polyester polyol, and mixture thereof.
- the phosphate ester polyol compound useful in the adhesive formulation can include, for example, the reaction product of polyphosphoric acid and a polyol wherein the polyol is selected from polyether polyol, polyester polyol, and combinations of two or more polyols.
- the phosphate ester polyol compound useful in the present invention can be selected, for example, from the reaction product of polyester polyol and 115 percent (%) polyphosphoric acid.
- the amount of the phosphate ester polyol compound, component (Bii) , in the two-component adhesive formulation can be generally in the range of from 0.1 wt%to 7 wt%in one embodiment; from 0.5 wt%to 5 wt%in another embodiment; and from 1 wt%to 4 wt%in still another embodiment based on the total dry weight of the components in the formulation.
- the polyol component, component (B) may further contains solvent; and in a preferred embodiment, each of the polyol ingredients is soluble in the solvent used in component (B) .
- each of the polyol ingredients can be soluble in the amount, by weight based on the weight of the solvent, of 10 wt%or more in one embodiment, 50 wt%or more in another embodiment, and 100 wt%or more in still another embodiment.
- the solvent can be selected from hydrocarbon solvents, polar aprotic solvents, polar protic solvents, and mixtures thereof.
- the solvent can be a polar aprotic solvent.
- the solvent can be selected from ethyl acetate, acetone, methyl ethyl ketone, and mixtures thereof.
- the amount of solvent, by weight based on the total weight of component B can be 10 wt%or more in one embodiment, 20 wt%or more in another embodiment, and 40 wt%or more in still another embodiment.
- the amount of solvent, by weight based on the total weight of component B can be 90%or less in one embodiment, and 80%or less in another embodiment.
- the adhesive formulation of the present invention may be formulated with a wide variety of optional additives to enable performance of specific functions while maintaining the excellent benefits/properties of the present adhesive product.
- the optional components, component (C) , of the polyurethane adhesive may be added to the first isocyanate group-containing component (A) ; or the optional components of the polyurethane adhesive may be added to the second polyol component (B) .
- an optional solvent compound can be added to component (A) of the adhesive formulation of the present invention; and in another embodiment, an optional solvent compound can be added to component (B) of the adhesive formulation of the present invention.
- the same or different optional solvent compound can be added to both component (A) and component (B) of the adhesive formulation.
- the optional solvent compound when used, can include, for example, ethyl acetate, butanone, acetone, methylbenzene and other urethane grade of organic solvents that can dissolve: component (A) , polyester, epoxy, silane, phosphate ester, and any mixtures thereof.
- component (A) ethyl acetate, butanone, acetone, methylbenzene and other urethane grade of organic solvents that can dissolve: component (A) , polyester, epoxy, silane, phosphate ester, and any mixtures thereof.
- the same solvent as described above may be added to the composition af ter the components (A) and (B) have been mixed together.
- the optional compounds or additives useful in the formulation may include, for example, other solvents; adhesion promoters such as silane, epoxy and phenolic resins; chain extenders such as glycerin, trimethylol propane, diethylene glycol, propanediol, and 2-methyl-1, 3-propanediol; and catalysts such as a latent tin catalyst such as dioctyltinmercaptide; a non-tin based metal-organic catalyst such as bismuth (III) -neodecanaote; or a thermosensitive amine catalyst such as DBU (1, 8-Diazabicyclo- [5.4.0] undec-7-ene) ; fillers such as silicon dioxide; and mixtures thereof.
- adhesion promoters such as silane, epoxy and phenolic resins
- chain extenders such as glycerin, trimethylol propane, diethylene glycol, propanediol, and 2-methyl-1, 3-propanediol
- the amount of an optional additive, component (C) when used in the 2K adhesive formulation, can be generally in the range of from 0 wt%to 20 wt%in one embodiment; from 0.01 wt%to 10 wt%in another embodiment; and from 1 wt%to 5 wt%in still another embodiment, based on the total weight of the components in the formulation.
- the process for making the adhesive formulation of the present invention includes mixing, admixing or blending: (A) at least one isocyanate group-containing component including at least one isocyanate group-containing compound; and any of the above optional compounds desired such as a solvent compound; and (B) at least one polyol component including: (Bi) at least one polyester polyol compound; (Bii) at least one phosphate ester polyol compound; and any of the above optional compounds desired such as a solvent compound.
- One or more additional optional components may be added to the adhesive formulation as desired.
- the components (A) and (B) can be mixed together in the desired concentrations discussed above and at a temperature of from 20°C to 25°C in one embodiment; and from 15°C to 35°C in another embodiment.
- the order of mixing of the components is not critical and two or more components can be mixed together followed by addition of the remaining components.
- the adhesive formulation components may be mixed together by any known mixing process and equipment.
- the two components (A) and (B) can be prepared separately from one another; and the components can each be stored in a separate container.
- the other components and optional additives of the polyurethane adhesive formulation may be present as part of the first component (A) or the second component (B) .
- a suitable container for the storage of each component can be, for example, a drum, ahobbock, a bag, a bucket, a can, a cartridge or a tube.
- the two components (A) and (B) Prior to the application of the adhesive composition, the two components (A) and (B) are stored separately and mixed with one another only during or prior to the application.
- the adhesive formulation of the present invention produced by the process of the present invention has several advantageous properties and benefits compared to conventional adhesive formulations.
- some of the properties exhibited by the adhesive formulation can include increased bond strength, moldability, and heat resistance; properties that are beneficial in a process for manufacturing a foil-based structure lamination article such as a laminated film for producing a package for a LIB.
- the bond strength at 120°C between nylon layer and aluminum foil layer exhibited by the adhesive formulation can be generally 1 N/15 mm or greater since the higher the bond strength, the better is the bonding performance of the adhesive formulation.
- the bond strength of the adhesive can be ⁇ 1 N/15 mm in one embodiment, ⁇ 1.5 N/15 mm in another embodiment, and ⁇ 2.5 N/15 mm in another embodiment.
- Other preferred embodiments of the adhesive bond strength can include the range of from 1 N/15 mm to 8 N/15 mm in one embodiment, from 2.5 N/15 mm to 8 N/15 mm in another embodiment; from 1.5 N/15 mm to 5.5 N/15 mm in still another embodiment; and from 1 N/15 mm to 5 N/15 mm in yet another embodiment.
- the bond strength of the adhesive can be measured by the general procedure described in the Test Methods of the Examples herein below.
- moldability is a beneficial property exhibited by the adhesive of the present invention.
- the moldability of the adhesive can be measured by the depth of the deep draw setting of such a deep draw process.
- the moldability of the adhesive can be generally 1 millimeter (mm) or greater since the higher the depth of deep draw, the better is the moldability performance of the adhesive formulation.
- the moldability of the adhesive can be ⁇ 1 mm in one embodiment, ⁇ 3 mm in another embodiment, and ⁇ 4 mm in another embodiment.
- Other preferred embodiments of the adhesive moldability can include the range of the depth of deep draw setting of from 1 mm to 15 mm, from 3 mm to 8 mm in another embodiment, and from 4 mm to 6 mm in still another embodiment.
- the moldability of the adhesive can be measured by the general procedure described in the Test Methods of the Examples herein below.
- the heat resistance of the adhesive formulation of the present invention is another beneficial property of the formulation.
- the heat resistance of an adhesive can be determined by laminated structure made by the adhesive passing or failing an aging test selected from a conventional aging test known in the art. Typically, a laminated structure is subjected to an aging test that is carried out for a particular number of hours; and then the laminated structure made by the adhesive can be visually observed to pass or fail the test by any sign of delamination, tunneling or any type of structure failure. Generally, the aging test can be carried out, for example, for a desired period of time as can be measured by the procedure described in the Test Methods of the Examples herein below. In general, the adhesive composition should pass an aging time of>60 hours (hr) at 85°C and 85%humidity.
- the bonding of two substrates using the adhesive of the present invention can be carried out in an industrial scale for production of large quantities of lamination products.
- the two components (A) and (B) are filled and stored separately in drums or hobbocks until the components are ready to be used.
- the two components prior to the application of the adhesive composition, the two components are stored separately; and only during or prior to the application of the adhesive are the two components mixed with one another.
- the components are forced out of the storage containers by means of feed pumps, and metered in via lines of a mixing apparatus, such as those commonly used for 2K adhesives in industrial production.
- the mixing of the two components (A) and (B) can be done via static mixers or by means of dynamic mixers.
- the application of the adhesive to the surface of at least one substrate can be carried out by conventional means such as by using a roll coater, a doctor blade, or extrusion equipment and process.
- the adhesive composition can be applied at a level, in grams of dry composition per square meter, of 1 or greater in one embodiment and 2 or greater in another embodiment.
- the adhesive composition can be applied at a level, in grams of dry composition per square meter, of 10 or less in one embodiment and 7 or less in another embodiment.
- Another embodiment of the present invention is directed to a process for bonding at least a first substrate to at least a second substrate including the steps of: (a) mixing the two components (A) and (B) as described above to form the polyurethane adhesive, (b) applying the polyurethane adhesive of step (a) to at least one of the substrate surfaces to be bonded and evaporating the solvent if any, (c) contacting (or joining) together the first and second substrates to be bonded with the polyurethane adhesive, and (d) curing the polyurethane adhesive.
- the adhesive can be heated to fully cure the adhesive; and the heating of the adhesive can be carried out at a temperature of from 25°C to 80°C in one general embodiment.
- the two substrates may consist of the same or different materials.
- Suitable substrates that can be used in the above process can include, for example, woven and nonwoven fabric, metal foil, polymers, and metal-coated polymers.
- Films optionally have a surface on which an image is printed with ink; and the ink may be in contact with the adhesive composition.
- the films are polymer films and metal foil.
- a combination of nylon film and aluminum foil can be used as the two substrates to be bonded together.
- the 2K polyurethane adhesive of the present invention can be used, for example, in the following applications: LIB applications for manufacturing the packaging for the LIB; and various other packaging applications such as food packaging applications like cans or containers, pouches, packaging trays and the like.
- a LIB packaging film material can be manufactured according to the present invention.
- a laminated film structure generally indicated by numeral 10 including three substrate film layers 11, 12, and 13 bonded together by a first outer layer side adhesive 14 and a second inner layer side adhesive 15.
- an outer layer side resin film layer 11 and a metal foil layer 12 may be laminated on each other by using the outer layer side polyurethane adhesive 14 according to the present invention to form a first intermediate laminate.
- an inner surface layer 13 may be laminated on the metal foil layer 12 surface of the intermediate laminate by using an inner layer side adhesive 15.
- the metal foil layer 12 and the inner surface layer 13 may be laminated on each other by using an inner layer side adhesive 15 to form a first intermediate laminate.
- the metal foil layer 12 of the intermediate laminate and an outer layer side resin film layer 11 may be laminated on each other by using a polyurethane adhesive 14 according to the present invention.
- FIG. 1 there is shown a schematic illustration of a five-layered structure of a LIB packaging laminated film, generally indicated by numeral 10.
- the layers of structure 10 includes a nylon substrate layer 11 (25 microns [ ⁇ ] in thickness) ; the first adhesive layer 14 referred to herein as “Adhesive A” ; an aluminum substrate layer 12 (40 ⁇ in thickness) ; the second adhesive layer 15 referred to herein as “Adhesive B” ; and a retort cast polypropylene (RCPP) substrate layer 13 (20 ⁇ in thickness) .
- the substrates shown in FIG. 1 are also described in Table II.
- the phosphate ester polyol used in the Inventive Examples and the Comparative Examples is synthesized according to the formulation listed in Table III.
- the raw material compounds, PA115 and Bester 648 are charged into a 1,000 milliliter (mL) glass reactor and mixed carefully to form a formulation. After all the above raw materials are fed, the heating of the formulation is started. When the formulation reaches around 60°C, increase the rotation speed to 50 revolutions per minute (RPM) ; and control the temperature increasing speed, and monitor the reaction during the whole process. During the temperature increase process, PA115 separates from Bester 648; and PA115 concentrates at the bottom of the formulation. Meanwhile, the color ofPA115 also becomes dark.
- RPM revolutions per minute
- reaction temperature reaches up to around 100-103°C
- the reaction product becomes transparent and homogeneous.
- the reaction product is kept at around 100-103°C for 2 hr.
- the reactor is cooled as soon as possible.
- the reactor is cooled down to 60°C-70°C.
- the final product is charged into a well-sealed steel bottle with a nitrogen atmosphere to protect the formulation from contamination.
- the NCO component and the OH component used in the examples are synthesized according to the formulations described in Table IV.
- the NCO component used in the examples is Catalyst F.
- the OH component used in the examples is a solution of high molecular weight polyester polyol, silane and phosphate ester which are all dissolved in an organic solvent as described in Table IV.
- the moisture content of all raw materials is set to ⁇ 500 parts per million (ppm) .
- ppm parts per million
- the isocyanate components and polyol components are mixed according to the pairings (as sample designation) and mix ratio illustrated in Table V to form the adhesive compositions of the Examples.
- the adhesive compositions of the Examples are then used to form laminates comprising nylon film and pre-laminated aluminum (Al) foil (i.e., an Al foil/RCPP laminate) .
- Adcote 502S/NCO-1 100/6.5 Comp.
- F Adcote 811A/NCO-1 100/10 Comp.
- G OH-12/NCO-1 100/5.5 Comp.
- H OH-13/NCO-1 100/5.5 Comp.
- I OH-14/NCO-1 100/5.5 Comp.
- J OH-15/NCO-1 100/5.5
- the coating and lamination process used in the examples is conducted in a Labo-Combi 400 lamination machine available from Nordmeccanica group.
- the adhesive is applied on nylon film and then the nylon film/adhesive is laminated to the aluminum foil surface of a pre-laminated Al foil/RCPP.
- the temperature of the nip roll of the lamination machine is kept at 70°C, and the coating speed is 100 meters per minute (m/min) during the lamination process.
- the dry coating weight is controlled at 4-4.5 grams per square meter (g/m 2 ) .
- the resulting laminated film is cured (e.g., at a temperature of60°C) in an oven before testing.
- laminated films are cut into 15 mm width test strip samples for T-peel testing in an Instron 5965 U 5974 machine with a crosshead speed of 250 millimeters per minute (mm/min) .
- Three test strips are then tested in a warm oven at 120°C and an average value of the three strips tested is recorded.
- the tail of the strip is pulled slightly by finger to ensure the tail of the strip remains at 90° degrees toward the peeling direction.
- the results of the bonding strength test are measured in units of N/15 mm. To pass this bonding strength test, the bond strength of the laminated films should be >2 N/15 mm.
- Laminates (laminated films) are cut into 4 cm x 4 cm size square test samples; and then the samples are subjected to an aging resistant test.
- the samples are aged in a constant temperature humidity chamber, LHU-213, under 85°C and 85%relative air humidity for 60 hr.
- a constant temperature humidity chamber LHU-213, under 85°C and 85%relative air humidity for 60 hr.
- six pieces of one laminated film are chosen for evaluation. Every piece of the laminate is fully contacted with ambient air.
- the appearance of the final laminated film is evaluated. To pass the aging resistant test, no bubbles in the film should be observed; and no delamination of the laminated film should be detected.
- Cured laminated films are cut into 8 cm x 12 cm size rectangle test samples; and then the samples are positioned at the platform of an auto deep draw equipment, SDCK-004A, for evaluation.
- the equipment is operated with a specific parameter for deep draw application which would adjust the air pressure to 0.5 megapascals (MPa) and would maintain a punch speed of molds at 100 mm/min.
- the depth of deep draw molding is set at 5 mm for all laminates tested.
- the nylon side of the laminates’ surface as the out layer forms a convex surface.
- Different adhesives are used in the laminates.
- the appearance of the laminates after the deep draw molding is visually checked for any bubbles, tunnels, and/or delaminations. Also, the laminates are checked for any sign of broken substrates. Meanwhile, the laminates after punch are also heated to 100°C in a warm oven for 1 hour, and then the appearance of the laminates are checked again visually for defects as described above.
- a laminate packaging film for a LIB that has a failure in terms of a broken foil of the laminate after the deep draw test does not pass the quality test to be adequate for consumer use
- a laminate packaging film for a LIB that has a failure in terms of delamination of a nylon/foil laminated composite film of the laminate after the deep draw test, also does not pass the quality test to be adequate for consumer use.
- exemplary embodiments of the present invention can also include the following:
- a polyurethane adhesive composition including: (A) at least one isocyanate group-containing component including at least one isocyanate group-containing compound; and (B) at least one polyol component; wherein the at least one polyol component (B) includes: (Bi) at least one polyester polyol compound having a molecular weight (Mn) of>8,000 g/mol; and (Bii) at least one phosphate ester polyol compound.
- composition of embodiment (1) above including further a solvent.
- composition of embodiment (1) above, wherein the concentration ratio by dry weight of component (B) to component (A) [B: A] is from 1 to 20.
- composition of embodiment (1) above, wherein the at least one polyester polyol compound is derived from dicarboxylic acid comprising azelaic acid, sebacic acid, adipic acid, terephthalic acid, isophthalic acid, and mixtures thereof.
- composition of embodiment (1) above, wherein at least one phosphate ester polyol compound is the reaction product of polyphosphoric acid and a polyol, wherein the polyol is selected from polyether polyol, polyester polyol, and combinations of two or more polyols.
- R’ can be selected from an organic group.
- composition of embodiment (1) above including further a component (C) ; wherein (C) can be at least one epoxy, at least one silane, or a mixture thereof.
- a process for making a polyurethane adhesive composition including admixing: (A) at least one isocyanate group-containing component including at least one isocyanate group-containing compound; and (B) at least one polyol component including: (Bi) at least one polyester polyol compound; and (Bii) at least one phosphate ester polyol compound.
- a process for adhering at least a first substrate and at least a second substrate including: (I) contacting at least a portion of one surface of the at least first substrate or at least a portion of one surface of the at least second substrate with the adhesive composition of embodiment (1) above; and (II) heating the combined first substrate, second substrate, and the adhesive of step (I) to a temperature sufficient to cure the adhesive composition.
- a packaging article including the multi-layer composite film structure of embodiment (14) above.
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Abstract
Description
Formulation | Bester 648 | PA 115 |
Phosphate ester polyol | 40 | 3 |
Example | Sample Designation | Mix Ratio |
Comp. Ex. A | OH-1/NCO-1 | 100/5.5 |
Comp. Ex. B | OH-2/NCO-1 | 100/5.5 |
Inv. Ex. 1 | OH-3/NCO-1 | 100/5.5 |
Inv. Ex. 2 | OH-4/NCO-1 | 100/5.5 |
Inv. Ex. 3 | OH-5/NCO-1 | 100/5.5 |
Inv. Ex. 4 | OH-6/NCO-1 | 100/5.5 |
Comp. Ex. C | OH-7/NCO-1 | 100/5.5 |
Inv. Ex. 5 | OH-8/NCO-1 | 100/5.5 |
Inv. Ex. 6 | OH-9/NCO-1 | 100/5.5 |
Inv. Ex. 7 | OH-10/NCO-1 | 100/5.5 |
Comp. Ex. D | OH-11/NCO-1 | 100/5.5 |
Comp. Ex. E | Adcote 502S/NCO-1 | 100/6.5 |
Comp. Ex. F | Adcote 811A/NCO-1 | 100/10 |
Comp. Ex. G | OH-12/NCO-1 | 100/5.5 |
Comp. Ex. H | OH-13/NCO-1 | 100/5.5 |
Comp. Ex. I | OH-14/NCO-1 | 100/5.5 |
Comp. Ex. J | OH-15/NCO-1 | 100/5.5 |
Claims (10)
- A polyurethane adhesive composition comprising:(A) at least one isocyanate group-containing component including at least one isocyanate group-containing compound; and(B) at least one polyol component including:(Bi) at least one polyester polyol compound having a molecular weight (Mn) of greater than 8,000 grams per mole; and(Bii) at least one phosphate ester polyol compound.
- The composition of claim 1, wherein the concentration ratio by dry weight of component (B) to component (A) [B: A] is from 1 to 20.
- The composition of claim 1, wherein the polyurethane adhesive composition: (i) has a bond strength of from 1 N/15 mm to 8 N/15 mm, (ii) passes an aging time of greater than 60 hours at 85℃ and 85%humidity, and/or (iii) has sufficient moldability to provide a depth of deep draw setting of from 1 millimeter to 15 millimeters.
- The composition of claim 1, wherein the at least one phosphate ester polyol compound, component (Bii) , is a reaction product of (a) polyether polyol, polyester polyol, or mixture thereof; and (b) a polyphosphoric acid; or a mixture of a polyphosphoric acid and other acids.
- A process for making a polyurethane adhesive composition comprising admixing:(A) at least one isocyanate group-containing component including at least one isocyanate group-containing compound; and(B) at least one polyol component including:(Bi) at least one polyester polyol compound; and(Bii) at least one phosphate ester polyol compound.
- A process for adhering at least a first substrate and at least a second substrate comprising:(I) contacting at least a portion of one surface of the at least first substrate or at least a portion of one surface of the at least second substrate with the adhesive composition of claim 1; and(II) heating the combined first substrate, second substrate, and the adhesive of step (I) to a temperature sufficient to cure the adhesive composition.
- The process of claim 7, wherein the heating step (II) is carried out at a temperature of from 25℃ to 80℃.
- A multi-layer composite laminate film structure made by the process of claim 8.
- A package for packaging a lithium-ion battery comprising a foil-based lamination structure wherein the foil-based lamination structure includes a combination of (a) a nylon layer, (b) a foil layer, (c) a polymer substrate layer; (d) a first upper adhesive layer comprising the composition of claim 1 disposed in between one side of the nylon layer and one side of the foil layer, and (e) a second lower adhesive layer different from the composition of claim 1 disposed in between the other side of the foil layer and one side of the polymer substrate layer.
Priority Applications (9)
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BR112021009932-8A BR112021009932A2 (en) | 2018-11-22 | 2018-11-22 | polyurethane adhesive composition, process, multilayer composite laminated film structure, and package |
MX2021006018A MX2021006018A (en) | 2018-11-22 | 2018-11-22 | Adhesive composition. |
PCT/CN2018/116899 WO2020103072A1 (en) | 2018-11-22 | 2018-11-22 | Adhesive composition |
US17/296,238 US20240240068A1 (en) | 2018-11-22 | 2018-11-22 | Adhesive composition |
EP18941078.0A EP3884009A4 (en) | 2018-11-22 | 2018-11-22 | Adhesive composition |
CN201880100281.4A CN113195670A (en) | 2018-11-22 | 2018-11-22 | Adhesive composition |
JP2021529352A JP7404364B2 (en) | 2018-11-22 | 2018-11-22 | adhesive composition |
TW108140946A TWI855007B (en) | 2018-11-22 | 2019-11-12 | Adhesive composition |
ARP190103380A AR117109A1 (en) | 2018-11-22 | 2019-11-15 | ADHESIVE COMPOSITION |
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PCT/CN2018/116899 WO2020103072A1 (en) | 2018-11-22 | 2018-11-22 | Adhesive composition |
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EP (1) | EP3884009A4 (en) |
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WO2024168616A1 (en) * | 2023-02-15 | 2024-08-22 | Dow Global Technologies Llc | Two component solvent based laminating adhesive for medical cold forming packages |
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2018
- 2018-11-22 WO PCT/CN2018/116899 patent/WO2020103072A1/en unknown
- 2018-11-22 EP EP18941078.0A patent/EP3884009A4/en active Pending
- 2018-11-22 US US17/296,238 patent/US20240240068A1/en active Pending
- 2018-11-22 BR BR112021009932-8A patent/BR112021009932A2/en not_active Application Discontinuation
- 2018-11-22 MX MX2021006018A patent/MX2021006018A/en unknown
- 2018-11-22 JP JP2021529352A patent/JP7404364B2/en active Active
- 2018-11-22 CN CN201880100281.4A patent/CN113195670A/en active Pending
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2019
- 2019-11-15 AR ARP190103380A patent/AR117109A1/en active IP Right Grant
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Also Published As
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JP7404364B2 (en) | 2023-12-25 |
AR117109A1 (en) | 2021-07-14 |
JP2022519151A (en) | 2022-03-22 |
EP3884009A1 (en) | 2021-09-29 |
BR112021009932A2 (en) | 2021-08-17 |
MX2021006018A (en) | 2021-07-21 |
EP3884009A4 (en) | 2022-06-08 |
US20240240068A1 (en) | 2024-07-18 |
TW202020091A (en) | 2020-06-01 |
CN113195670A (en) | 2021-07-30 |
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