WO2020051763A1 - Isolated heat-dissipation structure applicable to charging pile module and heat dissipation method thereof - Google Patents

Isolated heat-dissipation structure applicable to charging pile module and heat dissipation method thereof Download PDF

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Publication number
WO2020051763A1
WO2020051763A1 PCT/CN2018/104990 CN2018104990W WO2020051763A1 WO 2020051763 A1 WO2020051763 A1 WO 2020051763A1 CN 2018104990 W CN2018104990 W CN 2018104990W WO 2020051763 A1 WO2020051763 A1 WO 2020051763A1
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module
water
air
cooled
pcb board
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Chinese (zh)
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程明
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Shenzhen Poweringev Technology Co Ltd
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Shenzhen Poweringev Technology Co Ltd
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Priority to PCT/CN2018/104990 priority Critical patent/WO2020051763A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to a heat dissipation structure of a charging pile module and a heat dissipation method thereof, and particularly to an isolated heat dissipation structure suitable for a charging pile module and a heat dissipation method thereof.
  • the charging pile module mainly uses direct air cooling to dissipate heat.
  • the fan directly blows ambient air to the PCB board and heating elements and heat sinks, and directly dissipates heat through heat exchange with the air.
  • This heat dissipation structure and method has the following shortcomings: 1. Direct ambient air Contact with the inside of the product will cause dust accumulation. Long-term use will change the air duct, the product's cooling effect will be worse, and it will affect the product's work. 2.
  • the ambient air will contain many highly corrosive substances, similar to sulfide and high salt mist air. Acidic materials will corrode the copper foil and components on the PCB. Even if the three-proof paint is added and used for a long time, the three-proof paint will fail, causing the product to work abnormally. 3. Conductive substances in ambient air will accumulate on the PCB, resulting in Accidental short circuit damages the product.
  • the purpose of the invention is to solve the problem that the current heat dissipation structure and method of the charging pile module easily damage the internal structure of the charging pile module, and provide an isolated heat dissipation structure and a heat dissipation method suitable for the charging pile module.
  • An isolated heat dissipation structure suitable for a charging pile module which includes a housing, a PCB board module, a heat sink module with a water channel, a water-cooled and air-cooled heat dissipation module, and a cooling liquid pipe.
  • a PCB board module is provided on one side of the case, and a water-cooled and air-cooled heat dissipation module is provided on the other side of the case.
  • a heat sink fin module with a water channel is attached to one side of the PCB board module.
  • the heat sink fin module of the water channel is connected to the water-cooled and air-cooled heat dissipation module through a cooling liquid pipe, and an air channel is formed between the casing and at least one side of the PCB board module or an air hole is formed on the side of the casing.
  • the housing includes a PCB board module housing, a water-cooled and air-cooled heat dissipation module housing, and the PCB board module housing includes a PCB board module and a heat sink module with a water channel, and the water-cooled and The air-cooled heat dissipation module case encloses the water-cooled and air-cooled heat dissipation module and exposes a heat dissipation window.
  • the PCB board module case is connected with the water-cooled and air-cooled heat dissipation module case.
  • the isolated heat dissipation structure suitable for the charging pile module further includes a left U-shaped board with an outward groove and / or a
  • the right U-shaped board of the outer tank, the left side of the PCB board module is provided with a left U-shaped board with an outward tank, and the left U-shaped board with the outer tank and the shell
  • a first air duct is formed between the left U-shaped plate with an outward groove and a rear end of the housing, a first air duct opening is provided, and an outward groove is provided on the right side of the PCB module.
  • a second air duct is formed between the right U-shaped plate with the outward groove and the casing, and the right U-shaped plate with the outward groove and the casing
  • a second air duct opening is provided at the connection of the rear end
  • an air duct is formed between the upper and lower sides of the PCB board module and the casing, and an air duct opening is provided at the connection between the upper and lower sides of the PCB board module and the rear end of the casing.
  • the PCB board and all electronic components are isolated from the external high-speed flowing airflow, and the PCB board and all electrical components are isolated and protected.
  • a third air duct is formed between the PCB board module and the water-cooled and air-cooled heat dissipation module, and the first air duct and the second air duct are communicated with the third air duct.
  • the PCB board module includes a first PCB board and a second PCB board, the first PCB board is located at an upper part of the PCB board module, the second PCB board is located at a lower part of the PCB board module, and the first PCB board and The second PCB is disposed face to face.
  • the heat sink module with a water channel includes a first heat sink and a second heat sink
  • the first heat sink is located on an upper portion of the heat sink module with a water channel and is in contact with the first PCB
  • the second heat sink The fin is located at the lower part of the fin module with a water channel and is in contact with the second PCB.
  • the first fin is connected to the second fin.
  • the cooling liquid pipe includes a cold water channel, a hot water channel, the water cooling and air cooling.
  • the module is unidirectionally connected to the first heat sink through a cold water channel
  • the second heat sink is unidirectionally connected to the water-cooled and air-cooled heat sink through a hot water channel.
  • the water-cooled and air-cooled heat dissipation module includes a water pump, a water tank, a water drain, a honeycomb radiator, and a fan.
  • the water pump is located on one side of the water-cooled and air-cooled heat dissipation module, and the water tank is located on the other of the water-cooled and air-cooled heat dissipation module.
  • a water drain is connected between the water pump and the water tank, a honeycomb heat sink is provided on the outside of the water drain, and a plurality of fans are provided on the inner side of the water drain.
  • the water pump is unidirectionally connected to the first heat sink through a cold water channel
  • the second heat sink is unidirectionally connected to the water pump through a hot water channel.
  • a heat dissipation method of an isolated heat dissipation structure suitable for a charging pile module :
  • the water pump sends the coolant in the water tank to the first heat sink through the cold water channel.
  • the coolant absorbs the heat emitted from the first PCB board.
  • the coolant flows through the water channel on the heat sink module to the second heat sink, and the second heat sink Absorbs the heat emitted from the second PCB, and the hot cooling liquid in the second heat sink is sent to the water drain through the hot water channel, and after cooling, it is sent to the water tank to form a cycle;
  • the first air duct and the second air duct provide air passages to send air to the third air duct.
  • the air duct forms a cooling effect on the PCB board module.
  • the fan works to convect the air in the water row and the air in the water row.
  • the hot cooling liquid cools, completes the heat exchange into the air, and is discharged to the outside of the water-cooled and air-cooled heat dissipation module housing through the honeycomb heat sink;
  • the air flow in the first air duct, the second air duct, and the third air duct dissipates heat to the internal PCB module cabinet, and reduces the temperature inside the cabinet.
  • the beneficial effects of the present invention are: all the heat dissipation components are assembled into one body, which is easy to use and install; the air duct design is used to increase the contact area between the heat dissipation air flow and the casing in the air duct, to achieve heat exchange with the internal environment, and to reduce the internal cabinet environmental temperature
  • the purpose of water cooling is the excellent thermal conductivity and the balance of heat dissipation, which is conducive to the thermal balance of the components, and give full play to the performance of the power components;
  • the water-cooled heat dissipation leads the power components to the PCB board module, and performs heat exchange with the air through fans and cold exhaust No direct heat exchange between power components and air to isolate harmful air; Isolated air duct design prevents air from flowing through the PCB board and power components, effectively protects the PCB board and the components above, avoids being damaged by harmful substances in the air, and improves the product reliability.
  • FIG. 1 is a schematic structural diagram of an isolated heat dissipation structure suitable for a charging pile module according to the present invention
  • FIG. 2 is a schematic structural diagram of an isolated heat dissipation structure suitable for a charging pile module according to the present invention
  • FIG. 3 is a schematic structural diagram of an isolated heat dissipation structure suitable for a charging pile module according to the present invention
  • an isolated heat dissipation structure suitable for a charging pile module includes a housing 1, a PCB board module 2, a heat sink module with a water channel 3, and a water-cooled and air-cooled heat dissipation module. 4.
  • Coolant pipe 5 a PCB board module 2 is provided on one side of the housing 1, a water cooling and air cooling module 4 is provided on the other side of the housing 1, and one side of the PCB board module 2 is attached Combined with a water channel fin module 3, the water channel fin module 3 is connected to a water-cooled and air-cooled heat dissipation module 4 through a coolant pipe 5 between the housing 1 and at least one side of the PCB board module 2
  • the air duct 8 is formed or a side hole of the casing 1 is formed to form the air duct 8.
  • the housing 1 includes a PCB board module housing 11 and a water-cooled and air-cooled heat dissipation module housing 12.
  • the PCB board module housing 11 encloses the PCB board module 2 and a water-radiating fin module 3 in a water channel.
  • the water-cooled and air-cooled heat dissipation module case 12 wraps the water-cooled and air-cooled heat dissipation module 4 inside and exposes a heat dissipation window, and the PCB board module case 11 is connected to the water-cooled and air-cooled heat dissipation module case 12.
  • the isolated heat dissipation structure suitable for a charging pile module further includes a left U-shaped board 6 with an outward slot and / or A right U-shaped plate 7 with an outward slot, a left U-shaped plate 6 with an outward slot on the left side of the PCB board module 2 and a left U with an outward slot
  • a first air duct 81 is formed between the profile plate 6 and the housing 1.
  • the left U-shaped plate 6 with an outward groove body is provided with a first air passage opening at the connection between the rear end of the housing 1 and the PCB.
  • the right side of the plate module 2 is provided with a right U-shaped plate 7 with an outward groove, and a second air duct 82 is formed between the right U-shaped plate 7 with the outward groove and the housing 1.
  • a second air duct opening is provided at the connection between the right U-shaped plate 7 with the outward groove and the rear end of the housing 1;
  • an air duct 8 is formed between the upper and lower sides of the PCB board module 2 and the housing 1, and the upper and lower sides of the PCB board module 2 and the rear end of the housing 1
  • the connection is provided with air duct openings, the PCB board and all electronic components are isolated from the external high-speed flowing airflow, and the PCB board and all electrical components are isolated and protected.
  • a third air duct 83 is formed between the PCB board module 2 and the water-cooled and air-cooled heat dissipation module 4, and the first air duct 81 and the second air duct 82 are communicated with the third air duct 83.
  • the PCB board module 2 includes a first PCB board 21 and a second PCB board 22, the first PCB board 21 is located at an upper part of the PCB board module 2, and the second PCB board 22 is located at a lower part of the PCB board module 2,
  • the first PCB board 21 and the second PCB board 22 are disposed face to face.
  • the heat sink module 3 with water channels includes a first heat sink 31 and a second heat sink 32, and the first heat sink 31 is located at an upper portion of the heat sink module 3 with water channels and is in contact with the first PCB board 21.
  • the second heat sink 32 is located at the lower part of the heat sink module 3 with a water channel and is in contact with the second PCB board 22.
  • the first heat sink 31 is connected to the second heat sink 32.
  • the coolant pipe 5 includes cold water. Channel 51 and hot water channel 52, the water-cooled and air-cooled heat dissipation module 4 is unidirectionally connected to the first heat sink 31 through the cold water channel 51, and the second heat sink 32 is unidirectionally connected to the water-cooled and air-cooled through the hot water channel 52 On the thermal module 4.
  • the water-cooled and air-cooled heat dissipation module 4 includes a water pump 41, a water tank 42, a water row 43, a honeycomb heat sink 44, and a fan 45.
  • the water pump 41 is located on one side of the water-cooled and air-cooled heat dissipation module 4, and the water tank 42 is located on the other side of the water-cooled and air-cooled heat dissipation module 4.
  • a water drain 43 is connected between the water pump 41 and the water tank 42.
  • a honeycomb heat sink 44 is provided on the outside of the water drain 43 and a water radiator 43 is provided on the inside.
  • a plurality of fans 45 is a blowing surface to the side of the water row 43, the water pump 41 is unidirectionally connected to the first heat sink 31 through a cold water channel 51, and the second heat sink 32 is unidirectional through a hot water channel 52 Connected to the water pump 41.
  • a heat dissipation method of an isolated heat dissipation structure suitable for a charging pile module :
  • the water pump sends the coolant in the water tank to the first heat sink through the cold water channel.
  • the coolant absorbs the heat emitted from the first PCB board.
  • the coolant flows through the water channel on the heat sink module to the second heat sink, and the second heat sink Absorbs the heat emitted from the second PCB, and the hot cooling liquid in the second heat sink is sent to the water drain through the hot water channel, and after cooling, it is sent to the water tank to form a cycle;
  • the first air duct and the second air duct provide air passages to send air to the third air duct.
  • the air duct forms a cooling effect on the PCB board module.
  • the fan works to convect the air in the water row and the air in the water row.
  • the hot cooling liquid cools, completes the heat exchange into the air, and is discharged to the outside of the water-cooled and air-cooled heat dissipation module housing through the honeycomb heat sink;
  • the air flow in the first air duct, the second air duct, and the third air duct dissipates heat to the internal PCB module cabinet, and reduces the temperature inside the cabinet.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An isolated heat-dissipation structure applicable to a charging pile module, comprising a housing (1), a PCB module (2), a cooling fin module (3) having a water channel, a water cooling and air cooling module (4), and a cooling liquid pipe (5). An inner side of the housing (1) is provided with the PCB module (2), and the other inner side of the housing (1) is provided with the water cooling and air cooling module (4). The cooling fin module (3) having a water channel is attached to one side of the PCB module (2), and is connected to the water cooling and air cooling module (4) by means of the cooling liquid pipe (5). An air channel (8) is formed between the housing (1) and at least one side of the PCB module (2) or a side surface of the housing (1) is provided with a hole to form the air channel (8). All heat-dissipation components are integrally assembled so as facilitate use and installation. The air channel design increases the contact area between heat-dissipation air flow in the air channel and the housing. The isolated air channel design prevents the air from flowing through the PCB and power components, thereby effectively protecting the PCB and the components thereon from damage by harmful substances in the air, and improving product reliability.

Description

一种适用于充电桩模块的隔离式散热结构及其散热方法Isolated heat radiation structure suitable for charging pile module and heat radiation method thereof 【技术领域】[Technical Field]

本发明涉及一种充电桩模块散热结构及其散热方法，尤其涉及一种适用于充电桩模块的隔离式散热结构及其散热方法。The invention relates to a heat dissipation structure of a charging pile module and a heat dissipation method thereof, and particularly to an isolated heat dissipation structure suitable for a charging pile module and a heat dissipation method thereof.

【背景技术】【Background technique】

目前充电桩模块主要使用直接风冷散热,风扇将环境空气直接吹到PCB板和发热元件以及散热片,通过同空气的热交换直接散热，此散热结构与方法存在以下不足：1、环境空气直接接触到产品内部,会造成灰尘累计,长久使用会改变风道,产品散热效果变差,影响到产品的工作；2、环境空气会包含很多高腐蚀性物质,类似硫化物、高盐雾空气，酸性物质等，会腐蚀PCB上的铜箔和元件，即使增加三防漆，长久使用，三防漆也会失效，导致产品工作异常；3、环境空气中的导电物质会堆积在PCB上面，产生意外的短路而损坏产品。At present, the charging pile module mainly uses direct air cooling to dissipate heat. The fan directly blows ambient air to the PCB board and heating elements and heat sinks, and directly dissipates heat through heat exchange with the air. This heat dissipation structure and method has the following shortcomings: 1. Direct ambient air Contact with the inside of the product will cause dust accumulation. Long-term use will change the air duct, the product's cooling effect will be worse, and it will affect the product's work. 2. The ambient air will contain many highly corrosive substances, similar to sulfide and high salt mist air. Acidic materials will corrode the copper foil and components on the PCB. Even if the three-proof paint is added and used for a long time, the three-proof paint will fail, causing the product to work abnormally. 3. Conductive substances in ambient air will accumulate on the PCB, resulting in Accidental short circuit damages the product.

【发明内容】[Summary of the Invention]

本发明目的在于解决目前充电桩模块散热结构与方法容易损坏充电桩模块内部结构的问题，而提供一种适用于充电桩模块的隔离式散热结构及其散热方法。The purpose of the invention is to solve the problem that the current heat dissipation structure and method of the charging pile module easily damage the internal structure of the charging pile module, and provide an isolated heat dissipation structure and a heat dissipation method suitable for the charging pile module.

本发明是通过以下技术方案来实现的：一种适用于充电桩模块的隔离式散热结构，包括壳体、PCB板模块、带有水道的散热片模块、水冷及风冷散热模块、冷却液管道，所述壳体内一侧设有PCB板模块，所述壳体内另一侧设有水冷及风冷散热模块，所述PCB板模块一侧贴合带有水道的散热片模块，所述带有水道的散热片模块通过冷却液管道与水冷及风冷散热模块连接，所述壳体与PCB板模块至少一侧之间形成风道或壳体侧面开孔形成风道。The present invention is achieved by the following technical solutions: An isolated heat dissipation structure suitable for a charging pile module, which includes a housing, a PCB board module, a heat sink module with a water channel, a water-cooled and air-cooled heat dissipation module, and a cooling liquid pipe. A PCB board module is provided on one side of the case, and a water-cooled and air-cooled heat dissipation module is provided on the other side of the case. A heat sink fin module with a water channel is attached to one side of the PCB board module. The heat sink fin module of the water channel is connected to the water-cooled and air-cooled heat dissipation module through a cooling liquid pipe, and an air channel is formed between the casing and at least one side of the PCB board module or an air hole is formed on the side of the casing.

进一步地，所述壳体包括PCB板模块壳体、水冷及风冷散热模块壳体，所述PCB板模块壳体将PCB板模块、带有水道的散热片模块包裹在内，所述水冷及风冷散热模块壳体将水冷及风冷散热模块包裹在内并露出散热窗口，所述PCB板模块壳体与水冷及风冷散热模块壳体相衔接。Further, the housing includes a PCB board module housing, a water-cooled and air-cooled heat dissipation module housing, and the PCB board module housing includes a PCB board module and a heat sink module with a water channel, and the water-cooled and The air-cooled heat dissipation module case encloses the water-cooled and air-cooled heat dissipation module and exposes a heat dissipation window. The PCB board module case is connected with the water-cooled and air-cooled heat dissipation module case.

进一步地，所述风道位于PCB板模块左右两侧时，所述一种适用于充电桩模块的隔离式散热结构还包括带有向外槽体的左侧U型板及/或带有向外槽体的右侧U型板，所述PCB板模块左侧设有带有向外槽体的左侧U型板，所述带有向外槽体的左侧U型板与壳体之间形成第一风道，所述带有向外槽体的左侧U型板与壳体后端的连接处设有第一风道开口，所述PCB板模块右侧设有带有向外槽体的右侧U型板，所述带有向外槽体的右侧U型板与壳体之间形成第二风 道，所述带有向外槽体的右侧U型板与壳体后端的连接处设有第二风道开口；Further, when the air duct is located on the left and right sides of the PCB board module, the isolated heat dissipation structure suitable for the charging pile module further includes a left U-shaped board with an outward groove and / or a The right U-shaped board of the outer tank, the left side of the PCB board module is provided with a left U-shaped board with an outward tank, and the left U-shaped board with the outer tank and the shell A first air duct is formed between the left U-shaped plate with an outward groove and a rear end of the housing, a first air duct opening is provided, and an outward groove is provided on the right side of the PCB module. The right U-shaped plate of the body, a second air duct is formed between the right U-shaped plate with the outward groove and the casing, and the right U-shaped plate with the outward groove and the casing A second air duct opening is provided at the connection of the rear end;

所述风道位于PCB板模块上下两侧时，所述PCB板模块上下两侧与壳体之间形成风道，所述PCB板模块上下两侧与壳体后端的连接处设有风道开口，PCB板和所有电子元件同外部高速流动气流隔离，隔离保护PCB板和所有电气元件。When the air duct is located on the upper and lower sides of the PCB board module, an air duct is formed between the upper and lower sides of the PCB board module and the casing, and an air duct opening is provided at the connection between the upper and lower sides of the PCB board module and the rear end of the casing. The PCB board and all electronic components are isolated from the external high-speed flowing airflow, and the PCB board and all electrical components are isolated and protected.

进一步地，所述PCB板模块和水冷及风冷散热模块之间形成第三风道，所述第一风道、第二风道均与第三风道连通。Further, a third air duct is formed between the PCB board module and the water-cooled and air-cooled heat dissipation module, and the first air duct and the second air duct are communicated with the third air duct.

进一步地，所述PCB板模块包括第一PCB板、第二PCB板，所述第一PCB板位于PCB板模块上部，所述第二PCB板位于PCB板模块下部，所述第一PCB板与第二PCB板面对面设置。Further, the PCB board module includes a first PCB board and a second PCB board, the first PCB board is located at an upper part of the PCB board module, the second PCB board is located at a lower part of the PCB board module, and the first PCB board and The second PCB is disposed face to face.

进一步地，所述带有水道的散热片模块包括第一散热片、第二散热片，所述第一散热片位于带有水道的散热片模块上部与第一PCB板接触，所述第二散热片位于带有水道的散热片模块下部与第二PCB板接触，所述第一散热片与第二散热片相连接，所述冷却液管道包括冷水道、热水道，所述水冷及风冷散热模块通过冷水道单向连接在第一散热片上，所述第二散热片通过热水道单向连接在水冷及风冷散热模块上。Further, the heat sink module with a water channel includes a first heat sink and a second heat sink, the first heat sink is located on an upper portion of the heat sink module with a water channel and is in contact with the first PCB, and the second heat sink The fin is located at the lower part of the fin module with a water channel and is in contact with the second PCB. The first fin is connected to the second fin. The cooling liquid pipe includes a cold water channel, a hot water channel, the water cooling and air cooling. The module is unidirectionally connected to the first heat sink through a cold water channel, and the second heat sink is unidirectionally connected to the water-cooled and air-cooled heat sink through a hot water channel.

进一步地，所述水冷及风冷散热模块包括水泵、水箱、水排、蜂窝状散热体、风扇，所述水泵位于水冷及风冷散热模块一侧，所述水箱位于水冷及风冷散热模块另一侧，所述水泵与水箱之间连接有水排，所述水排外侧设有蜂窝状散热体，所述水排内侧设有若干个风扇，所述风扇向水排侧面为吹风面，所述水泵通过冷水道单向连接在第一散热片上，所述第二散热片通过热水道单向连接在水泵上。Further, the water-cooled and air-cooled heat dissipation module includes a water pump, a water tank, a water drain, a honeycomb radiator, and a fan. The water pump is located on one side of the water-cooled and air-cooled heat dissipation module, and the water tank is located on the other of the water-cooled and air-cooled heat dissipation module. On one side, a water drain is connected between the water pump and the water tank, a honeycomb heat sink is provided on the outside of the water drain, and a plurality of fans are provided on the inner side of the water drain. The water pump is unidirectionally connected to the first heat sink through a cold water channel, and the second heat sink is unidirectionally connected to the water pump through a hot water channel.

一种适用于充电桩模块的隔离式散热结构的散热方法：A heat dissipation method of an isolated heat dissipation structure suitable for a charging pile module:

一、水泵将水箱中的冷却液通过冷水道送到第一散热片，冷却液吸收第一PCB板散发的热量，冷却液经过散热片模块上的水道流到第二散热片，第二散热片吸收第二PCB板散发的热量，第二散热片中的热冷却液通过热水道送到水排，经过水排冷却后送入水箱，形成循环；First, the water pump sends the coolant in the water tank to the first heat sink through the cold water channel. The coolant absorbs the heat emitted from the first PCB board. The coolant flows through the water channel on the heat sink module to the second heat sink, and the second heat sink Absorbs the heat emitted from the second PCB, and the hot cooling liquid in the second heat sink is sent to the water drain through the hot water channel, and after cooling, it is sent to the water tank to form a cycle;

二、第一风道和第二风道提供空气通道，将空气送入到第三风道，风道对PCB板模块形成冷却作用，风扇工作将空气在水排中对流，将水排中的热冷却液冷却，完成热交换到空气中并通过蜂窝状散热体排出到水冷及风冷散热模块壳体外；2. The first air duct and the second air duct provide air passages to send air to the third air duct. The air duct forms a cooling effect on the PCB board module. The fan works to convect the air in the water row and the air in the water row. The hot cooling liquid cools, completes the heat exchange into the air, and is discharged to the outside of the water-cooled and air-cooled heat dissipation module housing through the honeycomb heat sink;

三、第一风道和第二风道以及第三风道流通的空气流对内部PCB模块箱体散热，降低箱体内部的温度。3. The air flow in the first air duct, the second air duct, and the third air duct dissipates heat to the internal PCB module cabinet, and reduces the temperature inside the cabinet.

本发明的有益效果在于：所有的散热组件组装一体，便于使用安装；利用风道设计，增加风道中散热风流同机壳的接触面积，达到同内部环境进行热交换，达到降低内部箱体环境温度的目的；水冷优秀的导热性能和散热的均衡性有利于元件的热均衡，充分的发挥功率元件的性能；水冷散热将功率元件的热导出PCB板模块，通过风扇和冷排同空气做热交换，不用功率元件与空气直接热交换，隔离有害空气；隔离式的风道设计，避免空气流经PCB板和功率元件，有效保护PCB板和上面的元件，避免被空气中有害物质损坏，提高产品可靠性。The beneficial effects of the present invention are: all the heat dissipation components are assembled into one body, which is easy to use and install; the air duct design is used to increase the contact area between the heat dissipation air flow and the casing in the air duct, to achieve heat exchange with the internal environment, and to reduce the internal cabinet environmental temperature The purpose of water cooling is the excellent thermal conductivity and the balance of heat dissipation, which is conducive to the thermal balance of the components, and give full play to the performance of the power components; the water-cooled heat dissipation leads the power components to the PCB board module, and performs heat exchange with the air through fans and cold exhaust No direct heat exchange between power components and air to isolate harmful air; Isolated air duct design prevents air from flowing through the PCB board and power components, effectively protects the PCB board and the components above, avoids being damaged by harmful substances in the air, and improves the product reliability.

【附图说明】[Brief Description of the Drawings]

图1为本发明一种适用于充电桩模块的隔离式散热结构的结构示意图；1 is a schematic structural diagram of an isolated heat dissipation structure suitable for a charging pile module according to the present invention;

图2为本发明一种适用于充电桩模块的隔离式散热结构的结构示意图；2 is a schematic structural diagram of an isolated heat dissipation structure suitable for a charging pile module according to the present invention;

图3为本发明一种适用于充电桩模块的隔离式散热结构的结构示意图；3 is a schematic structural diagram of an isolated heat dissipation structure suitable for a charging pile module according to the present invention;

附图标记：1、壳体；11、PCB板模块壳体；12、水冷及风冷散热模块壳体；2、PCB板模块；21、第一PCB板；22、第二PCB板；3、带有水道的散热片模块；31、第一散热片；32、第二散热片；4、水冷及风冷散热模块；41、水泵；42、水箱；43、水排；44、蜂窝状散热体；45、风扇；5、冷却液管道；51、冷水道；52、热水道；6、带有向外槽体的左侧U型板；7、带有向外槽体的右侧U型板；8、风道；81、第一风道；82、第二风道；83、第三风道。Reference numerals: 1, housing; 11, PCB board module housing; 12, water-cooled and air-cooled heat dissipation module housing; 2, PCB board module; 21, first PCB board; 22, second PCB board; 3, Heat sink module with water channel; 31. First heat sink; 32. Second heat sink; 4. Water-cooled and air-cooled heat sink module; 41; Water pump; 42, Water tank; 43, Water row; 44, Honeycomb heat sink 45, fan; 5, cooling liquid pipe; 51, cold water channel; 52, hot water channel; 6, left U-shaped plate with outward slot body; 7, right U-shaped plate with outward slot body 8, air duct; 81, first air duct; 82, second air duct; 83, third air duct.

【具体实施方式】【detailed description】

下面结合附图及具体实施方式对本发明做进一步描述：The invention is further described below with reference to the drawings and specific embodiments:

如图1、图2、图3所示，一种适用于充电桩模块的隔离式散热结构，包括壳体1、PCB板模块2、带有水道的散热片模块3、水冷及风冷散热模块4、冷却液管道5，所述壳体1内一侧设有PCB板模块2，所述壳体1内另一侧设有水冷及风冷散热模块4，所述PCB板模块2一侧贴合带有水道的散热片模块3，所述带有水道的散热片模块3通过冷却液管道5与水冷及风冷散热模块4连接，所述壳体1与PCB板模块2至少一侧之间形成风道8或壳体1侧面开孔形成风道8。As shown in Figures 1, 2, and 3, an isolated heat dissipation structure suitable for a charging pile module includes a housing 1, a PCB board module 2, a heat sink module with a water channel 3, and a water-cooled and air-cooled heat dissipation module. 4. Coolant pipe 5, a PCB board module 2 is provided on one side of the housing 1, a water cooling and air cooling module 4 is provided on the other side of the housing 1, and one side of the PCB board module 2 is attached Combined with a water channel fin module 3, the water channel fin module 3 is connected to a water-cooled and air-cooled heat dissipation module 4 through a coolant pipe 5 between the housing 1 and at least one side of the PCB board module 2 The air duct 8 is formed or a side hole of the casing 1 is formed to form the air duct 8.

优选地，所述壳体1包括PCB板模块壳体11、水冷及风冷散热模块壳体12，所述PCB板模块壳体11将PCB板模块2、带有水道的散热片模块3包裹在内，所述水冷及风冷散热模块壳体12将水冷及风冷散热模块4包裹在内并露出散热窗口，所述PCB板模块壳体11与水冷及风冷散热模块壳体12相衔接。Preferably, the housing 1 includes a PCB board module housing 11 and a water-cooled and air-cooled heat dissipation module housing 12. The PCB board module housing 11 encloses the PCB board module 2 and a water-radiating fin module 3 in a water channel. Inside, the water-cooled and air-cooled heat dissipation module case 12 wraps the water-cooled and air-cooled heat dissipation module 4 inside and exposes a heat dissipation window, and the PCB board module case 11 is connected to the water-cooled and air-cooled heat dissipation module case 12.

优选地，所述风道8位于PCB板模块2左右两侧时，所述一种适用于充电 桩模块的隔离式散热结构还包括带有向外槽体的左侧U型板6及/或带有向外槽体的右侧U型板7，所述PCB板模块2左侧设有带有向外槽体的左侧U型板6，所述带有向外槽体的左侧U型板6与壳体1之间形成第一风道81，所述带有向外槽体的左侧U型板6与壳体1后端的连接处设有第一风道开口，所述PCB板模块2右侧设有带有向外槽体的右侧U型板7，所述带有向外槽体的右侧U型板7与壳体1之间形成第二风道82，所述带有向外槽体的右侧U型板7与壳体1后端的连接处设有第二风道开口；Preferably, when the air duct 8 is located on the left and right sides of the PCB board module 2, the isolated heat dissipation structure suitable for a charging pile module further includes a left U-shaped board 6 with an outward slot and / or A right U-shaped plate 7 with an outward slot, a left U-shaped plate 6 with an outward slot on the left side of the PCB board module 2 and a left U with an outward slot A first air duct 81 is formed between the profile plate 6 and the housing 1. The left U-shaped plate 6 with an outward groove body is provided with a first air passage opening at the connection between the rear end of the housing 1 and the PCB. The right side of the plate module 2 is provided with a right U-shaped plate 7 with an outward groove, and a second air duct 82 is formed between the right U-shaped plate 7 with the outward groove and the housing 1. A second air duct opening is provided at the connection between the right U-shaped plate 7 with the outward groove and the rear end of the housing 1;

所述风道8位于PCB板模块2上下两侧时，所述PCB板模块2上下两侧与壳体1之间形成风道8，所述PCB板模块2上下两侧与壳体1后端的连接处设有风道开口，PCB板和所有电子元件同外部高速流动气流隔离，隔离保护PCB板和所有电气元件。When the air duct 8 is located on the upper and lower sides of the PCB board module 2, an air duct 8 is formed between the upper and lower sides of the PCB board module 2 and the housing 1, and the upper and lower sides of the PCB board module 2 and the rear end of the housing 1 The connection is provided with air duct openings, the PCB board and all electronic components are isolated from the external high-speed flowing airflow, and the PCB board and all electrical components are isolated and protected.

优选地，所述PCB板模块2和水冷及风冷散热模块4之间形成第三风道83，所述第一风道81、第二风道82均与第三风道83连通。Preferably, a third air duct 83 is formed between the PCB board module 2 and the water-cooled and air-cooled heat dissipation module 4, and the first air duct 81 and the second air duct 82 are communicated with the third air duct 83.

优选地，所述PCB板模块2包括第一PCB板21、第二PCB板22，所述第一PCB板21位于PCB板模块2上部，所述第二PCB板22位于PCB板模块2下部，所述第一PCB板21与第二PCB板22面对面设置。Preferably, the PCB board module 2 includes a first PCB board 21 and a second PCB board 22, the first PCB board 21 is located at an upper part of the PCB board module 2, and the second PCB board 22 is located at a lower part of the PCB board module 2, The first PCB board 21 and the second PCB board 22 are disposed face to face.

优选地，所述带有水道的散热片模块3包括第一散热片31、第二散热片32，所述第一散热片31位于带有水道的散热片模块3上部与第一PCB板21接触，所述第二散热片32位于带有水道的散热片模块3下部与第二PCB板22接触，所述第一散热片31与第二散热片32相连接，所述冷却液管道5包括冷水道51、热水道52，所述水冷及风冷散热模块4通过冷水道51单向连接在第一散热片31上，所述第二散热片32通过热水道52单向连接在水冷及风冷散热模块4上。Preferably, the heat sink module 3 with water channels includes a first heat sink 31 and a second heat sink 32, and the first heat sink 31 is located at an upper portion of the heat sink module 3 with water channels and is in contact with the first PCB board 21. The second heat sink 32 is located at the lower part of the heat sink module 3 with a water channel and is in contact with the second PCB board 22. The first heat sink 31 is connected to the second heat sink 32. The coolant pipe 5 includes cold water. Channel 51 and hot water channel 52, the water-cooled and air-cooled heat dissipation module 4 is unidirectionally connected to the first heat sink 31 through the cold water channel 51, and the second heat sink 32 is unidirectionally connected to the water-cooled and air-cooled through the hot water channel 52 On the thermal module 4.

优选地，所述水冷及风冷散热模块4包括水泵41、水箱42、水排43、蜂窝状散热体44、风扇45，所述水泵41位于水冷及风冷散热模块4一侧，所述水箱42位于水冷及风冷散热模块4另一侧，所述水泵41与水箱42之间连接有水排43，所述水排43外侧设有蜂窝状散热体44，所述水排43内侧设有若干个风扇45，所述风扇45向水排43侧面为吹风面，所述水泵41通过冷水道51单向连接在第一散热片31上，所述第二散热片32通过热水道52单向连接在水泵41上。Preferably, the water-cooled and air-cooled heat dissipation module 4 includes a water pump 41, a water tank 42, a water row 43, a honeycomb heat sink 44, and a fan 45. The water pump 41 is located on one side of the water-cooled and air-cooled heat dissipation module 4, and the water tank 42 is located on the other side of the water-cooled and air-cooled heat dissipation module 4. A water drain 43 is connected between the water pump 41 and the water tank 42. A honeycomb heat sink 44 is provided on the outside of the water drain 43 and a water radiator 43 is provided on the inside. A plurality of fans 45, the fan 45 is a blowing surface to the side of the water row 43, the water pump 41 is unidirectionally connected to the first heat sink 31 through a cold water channel 51, and the second heat sink 32 is unidirectional through a hot water channel 52 Connected to the water pump 41.

一种适用于充电桩模块的隔离式散热结构的散热方法：A heat dissipation method of an isolated heat dissipation structure suitable for a charging pile module:

一、水泵将水箱中的冷却液通过冷水道送到第一散热片，冷却液吸收第一PCB板散发的热量，冷却液经过散热片模块上的水道流到第二散热片，第二散热 片吸收第二PCB板散发的热量，第二散热片中的热冷却液通过热水道送到水排，经过水排冷却后送入水箱，形成循环；First, the water pump sends the coolant in the water tank to the first heat sink through the cold water channel. The coolant absorbs the heat emitted from the first PCB board. The coolant flows through the water channel on the heat sink module to the second heat sink, and the second heat sink Absorbs the heat emitted from the second PCB, and the hot cooling liquid in the second heat sink is sent to the water drain through the hot water channel, and after cooling, it is sent to the water tank to form a cycle;

二、第一风道和第二风道提供空气通道，将空气送入到第三风道，风道对PCB板模块形成冷却作用，风扇工作将空气在水排中对流，将水排中的热冷却液冷却，完成热交换到空气中并通过蜂窝状散热体排出到水冷及风冷散热模块壳体外；2. The first air duct and the second air duct provide air passages to send air to the third air duct. The air duct forms a cooling effect on the PCB board module. The fan works to convect the air in the water row and the air in the water row. The hot cooling liquid cools, completes the heat exchange into the air, and is discharged to the outside of the water-cooled and air-cooled heat dissipation module housing through the honeycomb heat sink;

三、第一风道和第二风道以及第三风道流通的空气流对内部PCB模块箱体散热，降低箱体内部的温度。3. The air flow in the first air duct, the second air duct, and the third air duct dissipates heat to the internal PCB module cabinet, and reduces the temperature inside the cabinet.

根据上述说明书的揭示和教导，本发明所属领域的技术人员还可以对上述实施方式进行适当的变更和修改。因此，本发明并不局限于上面揭示和描述的具体实施方式，对本发明的一些修改和变更也应当落入本发明的权利要求的保护范围内。此外，尽管本说明书中使用了一些特定的术语，但这些术语只是为了方便说明，并不对本发明构成任何限制。Based on the disclosure and teachings of the foregoing specification, those skilled in the art to which the present invention pertains may also make appropriate changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the protection scope of the claims of the present invention. In addition, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation to the present invention.

Claims (8)

一种适用于充电桩模块的隔离式散热结构，其特征在于：包括壳体、PCB板模块、带有水道的散热片模块、水冷及风冷散热模块、冷却液管道，所述壳体内一侧设有PCB板模块，所述壳体内另一侧设有水冷及风冷散热模块，所述PCB板模块一侧贴合带有水道的散热片模块，所述带有水道的散热片模块通过冷却液管道与水冷及风冷散热模块连接，所述壳体与PCB板模块至少一侧之间形成风道或壳体侧面开孔形成风道。An isolated heat dissipation structure suitable for a charging pile module is characterized in that it includes a housing, a PCB board module, a heat sink module with a water channel, a water-cooled and air-cooled heat dissipation module, and a coolant pipe. A PCB board module is provided, and the other side of the housing is provided with a water-cooled and air-cooled heat dissipation module. One side of the PCB board module is bonded with a heat sink module with a water channel, and the heat sink module with a water channel is cooled by The liquid pipe is connected to the water-cooled and air-cooled heat dissipation module, and an air duct is formed between the casing and at least one side of the PCB board module or an opening is formed on the side of the casing to form an air duct. 根据权利要求1所述的一种适用于充电桩模块的隔离式散热结构，其特征在于：所述壳体包括PCB板模块壳体、水冷及风冷散热模块壳体，所述PCB板模块壳体将PCB板模块、带有水道的散热片模块包裹在内，所述水冷及风冷散热模块壳体将水冷及风冷散热模块包裹在内并露出散热窗口，所述PCB板模块壳体与水冷及风冷散热模块壳体相衔接。The isolated heat dissipation structure suitable for a charging pile module according to claim 1, wherein the shell comprises a PCB board module shell, a water-cooled and air-cooled heat sink module shell, and the PCB board module shell The PCB board module and the heat sink module with water channels are wrapped in the body, and the water-cooled and air-cooled heat sink module case is wrapped in the water-cooled and air-cooled heat sink module and the heat radiation window is exposed. The water-cooled and air-cooled heat dissipation module housings are connected. 根据权利要求1所述的一种适用于充电桩模块的隔离式散热结构，其特征在于：所述风道位于PCB板模块左右两侧时，所述一种适用于充电桩模块的隔离式散热结构还包括带有向外槽体的左侧U型板及/或带有向外槽体的右侧U型板，所述PCB板模块左侧设有带有向外槽体的左侧U型板，所述带有向外槽体的左侧U型板与壳体之间形成第一风道，所述带有向外槽体的左侧U型板与壳体后端的连接处设有第一风道开口，所述PCB板模块右侧设有带有向外槽体的右侧U型板，所述带有向外槽体的右侧U型板与壳体之间形成第二风道，所述带有向外槽体的右侧U型板与壳体后端的连接处设有第二风道开口；The isolated heat dissipation structure suitable for a charging pile module according to claim 1, wherein when the air duct is located on the left and right sides of the PCB board module, the isolated heat dissipation structure suitable for a charging pile module The structure also includes a left U-shaped board with an outward slot and / or a right U-shaped board with an outward slot. The left side of the PCB module is provided with a left U with an outward slot. A profile plate, a first air duct is formed between the left U-shaped plate with the outward groove and the housing, and a connection between the left U-shaped plate with the outward groove and the rear end of the housing is provided There is a first air duct opening, a right U-shaped board with an outward groove is provided on the right side of the PCB board module, and a first U-shaped board with the outward groove is formed between the housing and the housing. A second air duct, a second air duct opening is provided at the connection between the right U-shaped plate with the outward groove and the rear end of the casing; 所述风道位于PCB板模块上下两侧时，所述PCB板模块上下两侧与壳体之间形成风道，所述PCB板模块上下两侧与壳体后端的连接处设有风道开口，PCB板和所有电子元件同外部高速流动气流隔离，隔离保护PCB板和所有电气元件。When the air duct is located on the upper and lower sides of the PCB board module, an air duct is formed between the upper and lower sides of the PCB board module and the casing, and an air duct opening is provided at the connection between the upper and lower sides of the PCB board module and the rear end of the casing. The PCB board and all electronic components are isolated from the external high-speed flowing airflow, and the PCB board and all electrical components are isolated and protected. 根据权利要求1所述的一种适用于充电桩模块的隔离式散热结构，其特征在于：所述PCB板模块和水冷及风冷散热模块之间形成第三风道，所述第一风道、第二风道均与第三风道连通。The isolated heat dissipation structure suitable for a charging pile module according to claim 1, wherein a third air duct is formed between the PCB board module and the water-cooled and air-cooled heat dissipation module, and the first air duct Both the second air duct and the third air duct are connected. 根据权利要求1所述的一种适用于充电桩模块的隔离式散热结构，其特征在于：所述PCB板模块包括第一PCB板、第二PCB板，所述第一PCB板位于PCB板模块上部，所述第二PCB板位于PCB板模块下部，所述第一PCB板与第二PCB板面对面设置。The isolated heat dissipation structure suitable for a charging pile module according to claim 1, wherein the PCB board module comprises a first PCB board and a second PCB board, and the first PCB board is located in the PCB board module In the upper part, the second PCB board is located in the lower part of the PCB board module, and the first PCB board and the second PCB board are arranged face to face. 根据权利要求1所述的一种适用于充电桩模块的隔离式散热结构，其特征在于：所述带有水道的散热片模块包括第一散热片、第二散热片，所述第一 散热片位于带有水道的散热片模块上部与第一PCB板接触，所述第二散热片位于带有水道的散热片模块下部与第二PCB板接触，所述第一散热片与第二散热片相连接，所述冷却液管道包括冷水道、热水道，所述水冷及风冷散热模块通过冷水道单向连接在第一散热片上，所述第二散热片通过热水道单向连接在水冷及风冷散热模块上。The isolated heat dissipation structure suitable for a charging pile module according to claim 1, wherein the heat sink module with a water channel comprises a first heat sink, a second heat sink, and the first heat sink The upper part of the heat sink module with a water channel is in contact with the first PCB, the second heat sink is located in the lower part of the heat sink module with a water channel and is in contact with the second PCB, the first heat sink is in contact with the second heat sink The cooling liquid pipe includes a cold water channel and a hot water channel. The water-cooled and air-cooled heat dissipation module is unidirectionally connected to the first heat sink through the cold water channel, and the second heat sink is unidirectionally connected to the water-cooled and wind through the hot water channel. Cooling module. 根据权利要求1所述的一种适用于充电桩模块的隔离式散热结构，其特征在于：所述水冷及风冷散热模块包括水泵、水箱、水排、蜂窝状散热体、风扇，所述水泵位于水冷及风冷散热模块一侧，所述水箱位于水冷及风冷散热模块另一侧，所述水泵与水箱之间连接有水排，所述水排外侧设有蜂窝状散热体，所述水排内侧设有若干个风扇，所述风扇向水排侧面为吹风面，所述水泵通过冷水道单向连接在第一散热片上，所述第二散热片通过热水道单向连接在水泵上。The isolated heat dissipation structure suitable for a charging pile module according to claim 1, wherein the water-cooled and air-cooled heat dissipation module comprises a water pump, a water tank, a water drain, a honeycomb heat sink, a fan, and the water pump The water tank is located on one side of the water-cooled and air-cooled heat dissipation module. The water tank is located on the other side of the water-cooled and air-cooled heat dissipation module. A water drain is connected between the water pump and the water tank. There are several fans inside the water drain. The fan is a blowing surface to the side of the water drain. The water pump is unidirectionally connected to the first heat sink through a cold water channel, and the second heat sink is unidirectionally connected to the water pump through a hot water channel. . 一种适用于充电桩模块的隔离式散热结构的散热方法：A heat dissipation method of an isolated heat dissipation structure suitable for a charging pile module: (1)、水泵将水箱中的冷却液通过冷水道送到第一散热片，冷却液吸收第一PCB板散发的热量，冷却液经过散热片模块上的水道流到第二散热片，第二散热片吸收第二PCB板散发的热量，第二散热片中的热冷却液通过热水道送到水排，经过水排冷却后送入水箱，形成循环；(1) The water pump sends the coolant in the water tank to the first heat sink through the cold water channel. The coolant absorbs the heat emitted from the first PCB board. The coolant flows through the water channel on the heat sink module to the second heat sink. The heat sink absorbs the heat radiated from the second PCB, and the hot cooling liquid in the second heat sink is sent to the water drain through the hot water channel, and then cooled into the water tank to form a cycle; (2)、第一风道和第二风道提供空气通道，将空气送入到第三风道，风道对PCB板模块形成冷却作用，风扇工作将空气在水排中对流，将水排中的热冷却液冷却，完成热交换到空气中并通过蜂窝状散热体排出到水冷及风冷散热模块壳体外；(2) The first air duct and the second air duct provide air passages to send air to the third air duct. The air duct forms a cooling effect on the PCB board module. The fan works to convect the air in the water row and drain the water. The hot cooling liquid in the cooling system completes the heat exchange into the air and is discharged to the outside of the water-cooled and air-cooled heat sink module through the honeycomb heat sink; (3)、第一风道和第二风道以及第三风道流通的空气流对内部PCB模块箱体散热，降低箱体内部的温度。(3) The air flow flowing through the first air duct, the second air duct, and the third air duct dissipates heat to the internal PCB module box, and reduces the temperature inside the box.
PCT/CN2018/104990 2018-09-11 2018-09-11 Isolated heat-dissipation structure applicable to charging pile module and heat dissipation method thereof Ceased WO2020051763A1 (en)

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