WO2020038444A1 - 一种基于半导体致冷片的随身携带型空调 - Google Patents

一种基于半导体致冷片的随身携带型空调 Download PDF

Info

Publication number
WO2020038444A1
WO2020038444A1 PCT/CN2019/102042 CN2019102042W WO2020038444A1 WO 2020038444 A1 WO2020038444 A1 WO 2020038444A1 CN 2019102042 W CN2019102042 W CN 2019102042W WO 2020038444 A1 WO2020038444 A1 WO 2020038444A1
Authority
WO
WIPO (PCT)
Prior art keywords
air
heat
semiconductor cooling
air conditioner
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/102042
Other languages
English (en)
French (fr)
Inventor
郑敏发
张展翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2020038444A1 publication Critical patent/WO2020038444A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/02—Self-contained room units for air-conditioning, i.e. with all apparatus for treatment installed in a common casing
    • F24F1/04—Arrangements for portability
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/30—Arrangement or mounting of heat-exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect

Definitions

  • the invention relates to an air-conditioning apparatus, in particular to a portable air conditioner based on a semiconductor cooling sheet.
  • Existing air-conditioning equipment includes central air-conditioning systems and domestic air-conditioning.
  • Compressors and Freon or other refrigerants are generally used for refrigeration. Its complex structure and large power consumption can only be fixed-point installation. Installation and disassembly are extremely inconvenient. Damage to environmental pollution is great and is not conducive to environmental protection.
  • Both the central air-conditioning system and the domestic air-conditioning system cool or heat the entire room or building, which consumes high energy, while localized cooling / heating systems (LCHS) can reduce the energy requirements for cooling / heating, and
  • the cooling / heating system only adjusts the ambient temperature around the user's body, not the overall ambient temperature of the building. Therefore, under the premise of not losing the comfort of the user's physical temperature, many people are affected in areas that are not particularly cold or hot Love and advocate.
  • the principle of the water cooling fan is to use a pumping motor or water absorbing material to allow water to be distributed on the filter material to form a water curtain through the internal structure design.
  • a pumping motor or water absorbing material to allow water to be distributed on the filter material to form a water curtain through the internal structure design.
  • the air When the air is sucked into the water cooling fan, it will first exchange heat through the water curtain, which will reduce the air temperature and increase the humidity, and then the processed air will be blown out by the fan.
  • the treated air is blown to the skin surface, part of the heat on the skin surface will be taken away by the high-humidity cool wind, making people feel that the temperature is lowered.
  • the principle of the portable spray fan is similar, except that the spray evaporation cooling technology is used instead. Through evaporation at the small water points, heat is exchanged to absorb heat and blow out the treated air.
  • thermoelectric refrigeration devices that can both heat and cool.
  • the principle is that when N-type semiconductor materials and P-type semiconductor materials are connected into a galvanic pair, the direct current can generate energy transfer, and the current flows from the N type. Flow to the P-type joint will absorb heat to become the cold end, if the P-type flow to the N-type joint to release heat, it will become the hot end. If the direction of the current is reversed, the hot and cold ends are switched to each other. The amount of absorbed and released heat is determined by the amount of current.
  • This characteristic of thermoelectric refrigeration devices coupled with a highly efficient heat exchange system, can be applied to portable air-conditioning equipment.
  • Patent CN103423814A discloses a portable air-conditioning device, which includes a semiconductor cooling sheet, and the two wires of the semiconductor cooling sheet are respectively connected to the positive electrode and the negative electrode of a power source; and two sides of the semiconductor cooling sheet are respectively provided with a heat sink and a heat sink.
  • a mask is provided on the semiconductor cooling sheet, and a tie is provided on the mask.
  • Thermally conductive silicone grease is filled between the semiconductor cooling sheet and the heat absorbing sheet, and between the semiconductor cooling sheet and the heat radiating sheet, and a ventilation hole is provided on the mask.
  • Patent CN203810612U discloses a small semiconductor air conditioner.
  • the air conditioner includes an electric control box, an air inlet, a fan, a semiconductor chip, and heat exchangers and air outlets located on both sides of the air conditioner in order from bottom to top.
  • the air conditioner is a desktop-type cabinet-type small semiconductor air conditioner, which uses semiconductor chips for cooling to provide cold air, and uses a heat storage agent to suck the hot air away.
  • Patent CN2198546Y discloses a cooling and heating device using a Peltier element. It is equipped with a Peltier element in a heat shield, and the cooling and heating surfaces are respectively placed on the two sides of the heat shield. A heat sink is installed on the hot surface, an energy storage diffuser is installed on the cooling surface, and an isolation cover is installed.
  • One end of the isolation cover is an air inlet, and the other end is provided with a ventilator and an air outlet.
  • the Peltier element is connected with a reversing switch and DC power is on.
  • the technical solutions of the above three patents due to the shortcomings of the cold-end ventilation and heat exchanger design or the poor design of the heat dissipation system, operate with semiconductor refrigeration chips of the same power, which can only cool the air about 3-4 degrees Celsius with low efficiency. High-power semiconductor refrigeration chips will cause a large increase in power consumption, which is not convenient to carry out and use, so it has not met the actual use requirements, and so far no product of similar use has appeared in the market.
  • the purpose of the present invention is to overcome the shortcomings of the prior art, and to provide a structure that has a reasonable structural design, can be easily and easily used anytime, anywhere, and can be carried around, light in weight, low in noise, simple in manufacture, low in cost, and capable of effectively adjusting air temperature.
  • the present invention provides a portable air conditioner based on a semiconductor cooling sheet, the technical solution of which is:
  • a portable air conditioner based on a semiconductor cooling sheet including an airtight housing, an airtight cover, a battery pack, a single chip, a semiconductor cooling sheet and an air conditioning component, a battery pack, a single chip, a semiconductor cooling sheet and an air conditioning component It is arranged in the air-tight shell, the air-tight shell cover is set on the top of the air-tight shell, the microcontroller is electrically connected to the battery pack and the semiconductor cooling sheet; the air-conditioning component includes an air-conditioning end and a temperature diffusion end, and the air-conditioning end and the temperature diffusion end The two sides of the semiconductor cooling fins are connected to each other.
  • the air-conditioning end includes a miniature high-pressure fan, a heat exchanger, a heat-insulating ventilation duct, and an air recirculator.
  • the heat exchanger is disposed in the heat-insulating ventilation duct.
  • the high-pressure fan is used to provide circulation power for the air, and the air recirculator is capable of directing a part of the processed air back to the heat exchanger to adjust the air temperature again.
  • the temperature diffusion end includes a heat storage sheet, a heat transfer tube, a small high-flow fan, and a heat sink.
  • the heat storage sheet is connected to one side of the semiconductor cooling sheet, and the other side of the semiconductor cooling sheet is connected to a heat exchanger.
  • One end is connected to the heat storage fin, and the other end of the heat pipe is connected to the heat radiating fin.
  • a small high-flow fan is arranged at the bottom of the heat radiating fin.
  • the heat conducting tube is welded into a whole with the heat storage sheet and the heat sink, and a conducting liquid is arranged in the heat conducting tube.
  • a temperature sensor is provided at the inlet of the untreated air, and the temperature sensor transmits the temperature measured in real time to the single-chip microcomputer; the single-chip microcomputer is arranged on the top of the airtight shell cover.
  • a dew drainage hole is provided on the insulated ventilation duct, and the dew drainage hole is connected to the dew collector.
  • the dew drainage holes are provided on the rear side wall of the heat insulation ventilation duct.
  • a thermally conductive paste is filled between the semiconductor cooling sheet and the air-conditioning end.
  • the wires of the miniature high-pressure fan, the semiconductor cooling fin, and the small high-flow fan are respectively connected to corresponding power output ports of the single-chip microcomputer.
  • a thermally conductive paste is filled between the semiconductor cooling sheet and the temperature diffusion end.
  • the heat insulation ventilation duct has a structure with air inlets and outlets and is capable of accommodating a heat exchanger
  • the air recirculator is a miniature air circulation fan installed at the bottom of the heat insulation ventilation duct, or a duct connecting the air inlet end and the air outlet end .
  • the portable air conditioner based on the semiconductor cooling sheet of the invention blows the processed air directly to the human body, so that the heat transfer is not affected by the size of the space, and the rapid improvement of the body temperature and temperature comfort is achieved.
  • the power consumption of the device is reduced to achieve the purpose of energy saving and environmental protection.
  • the complete system device of the present invention adopts a combination of two types of power sources: commercial power (power frequency AC power) and lithium battery charging. It is not limited by power during work, and can be used with charging. It is convenient to carry, requires no maintenance, and is placed in any non-extreme climate and non- The confined space can work normally, strong shock and shock resistance, light weight, low noise, simple manufacturing, low cost, safety and reliability.
  • the portable semiconductor air conditioner of the present invention has been tested and can reduce the temperature by 10 degrees Celsius in the cooling mode. And it is small in size, about the size of an adult's palm, and weighs only about 800 grams. It can be easily hung on the waist to blow the wind into the clothes.
  • the air conditioning end of the present invention is composed of a specially designed and arranged micro high pressure fan, heat exchanger, heat insulation ventilation duct and air recirculator. It realizes that the air is drawn into the air conditioning end by a high speed fan at high temperature.
  • the heat exchanger can effectively reduce the air temperature and humidity under refrigeration. Some processed air is led to the front of the ventilation pipe by the air recirculator and mixed with untreated air, and the remaining processed air is blown to the human body through the air outlet, making the The cooling and heating effects of the air conditioner are more significant; at low temperatures, circuit conversion is performed by a single-chip microcomputer so that the power of the semiconductor cooling fins is exchanged between positive and negative, and heating can be achieved.
  • the temperature diffusion end is composed of a designed and arranged heat storage sheet, a heat pipe, a small high-flow fan and a heat sink. During the operation of the semiconductor cooling sheet, the hot end is effectively cooled to ensure its cold end cooling performance.
  • the invention has the characteristics of remarkable air conditioning efficiency, reasonable structure design, convenient use and easy to carry, and is suitable for use in non-extreme climate regions around the world, and is particularly suitable for people who need to be outdoors for a long time. It has a significant improvement effect on the air temperature and humidity in the user's clothes.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a portable air conditioner based on a semiconductor cooling sheet according to an embodiment of the present invention.
  • FIG. 2 is a schematic perspective view of the other side of a portable air conditioner based on a semiconductor cooling sheet according to an embodiment of the present invention.
  • FIG. 3 is a three-dimensional structure diagram of the portable air conditioner after the cover is opened.
  • FIG. 4 is a schematic diagram of the internal structure of a portable air conditioner based on a semiconductor cooling sheet according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural side view of the portable air conditioner after the airtight enclosure is opened.
  • FIG. 6 is a schematic diagram of an explosion structure of a part of a portable air conditioner.
  • FIG. 7 is a schematic diagram of an explosion structure of an air-conditioning component.
  • FIG. 8 is a schematic diagram of an explosion structure of a portable air conditioner.
  • FIG. 9 is a plan view of air flow and air circulation at the air-conditioning end.
  • Fig. 10 is a schematic structural view taken along the A-A plane of Fig. 9.
  • FIG. 11 is a schematic flow chart of air flow at the air-conditioning end.
  • Air-tight enclosure 1. Air-tight shell cover; 3. Battery pack; 4. Single-chip microcomputer; 5. Semiconductor refrigeration sheet; 51. Cold end; 52. Hot end; 6. Insulation layer; 7. Air conditioning end; 71, micro high pressure fan; 72, heat exchanger; 73, heat insulation ventilation duct; 74, micro air circulation fan; 75, untreated air inlet; 76, treated air outlet; 77, air mixing point; 8, temperature diffusion end; 81, heat storage sheet; 82, heat pipe; 83, small high-flow fan; 84, heat sink; 9, dew collector; 10, dew drainage hole.
  • FIG. 1 to FIG. 8 the purpose of this embodiment is to improve the user ’s temperature comfort in cold and hot climate conditions. Under the limitation of limited volume and weight, a reasonable structural design can be provided at any time.
  • An air conditioning device that is simple and easy to use anywhere and can be carried with you. This device can reduce high air temperature and humidity at high temperatures, blow out cool air, and prevent heat stroke. At low temperatures, it can raise lower air temperatures. Keep warm and cold.
  • FIG. 1 and FIG. 2 are schematic diagrams of the three-dimensional structure of the portable air conditioner based on the semiconductor cooling sheet of this embodiment
  • FIG. 3 is a schematic diagram of the three-dimensional structure of the portable air conditioner with the case cover opened
  • FIG. 5 is a side structural diagram of the portable air conditioner with the airtight casing opened
  • FIGS. 6 to 7 are schematic diagrams of the explosion structure of the portable air conditioner.
  • a portable air conditioner based on a semiconductor cooling sheet 5 provided in this embodiment includes an airtight casing 1, an airtight casing cover 2, a battery pack 3, a single-chip microcomputer 4, a semiconductor cooling sheet 5 and an air-conditioning component, and a battery pack. 3.
  • the single-chip microcomputer 4, the semiconductor cooling sheet 5 and the air-conditioning component are arranged in the air-tight casing 1, the air-tight shell cover 2 is set on the top of the air-tight casing 1, the single-chip microcomputer 4 and the battery pack 3 and the semiconductor cooling sheet 5 are respectively Connection;
  • the air-conditioning component includes an air-conditioning terminal 7 and a temperature diffusion terminal 8, the air-conditioning terminal 7 and the temperature diffusion terminal 8 are respectively disposed on both sides of the semiconductor cooling fin 5, and
  • the air-conditioning terminal 7 includes a miniature high-pressure fan 71 and a heat exchanger 72 Insulated ventilation duct 73 and air recirculator. Heat exchanger 72 is disposed in the insulated ventilation duct 73.
  • the air recirculator can direct a part of the processed air back to the heat exchanger to adjust the air temperature again.
  • the micro high-pressure fan 71 is provided at the untreated air inlet 75 to provide circulation power for the air.
  • the micro high-pressure fan 71 is preferably installed at the untreated air inlet 75. Type, the installation can also achieve the object of the present invention in other positions.
  • the two wires of the semiconductor cooling fin 5 in this embodiment are connected to the positive and negative electrodes of the single chip microcomputer 4.
  • the two sides of the semiconductor cooling fin 5 are a cold end 51 and a hot end 52, respectively, and are connected to the air conditioning end 7 and
  • the temperature diffusion end 8 is filled with a thermally conductive paste between the semiconductor cooling sheet 5 and the air-conditioning end 7, and the semiconductor cooling sheet 5 and the temperature diffusion end 8 are filled with a thermally conductive paste to improve close contact and reduce the thermal resistance coefficient.
  • the structure of the heat-insulating ventilation duct 73 and the heat exchanger 72 increases the time for air to exchange heat, greatly improves the air-conditioning performance compared with the prior art, and realizes an effective air-conditioning function.
  • the air recirculator may be a miniature air circulation fan installed at the bottom of an insulated ventilation duct.
  • the heat-insulating ventilation duct 73 of the air-conditioning end 7 has a structure with air inlets and outlets and can accommodate a heat exchanger.
  • the bottom of the heat-insulation ventilation duct 73 has a bottom groove for installing a micro air circulation fan 74.
  • the micro air circulation fan 74 can Part of the processed air is blown back to the air inlet end through the bottom tank to repeat the heat exchange, and the heat exchanger 72 is separated by an intermediate partition to form an air circulation channel.
  • a person skilled in the art may know that the above-mentioned air recirculator is only an embodiment.
  • the heat insulation ventilation duct 73 may also be a duct with air inlet and outlet.
  • the heat exchanger 72 is disposed in the duct.
  • the duct may be “U-shaped”, “S type”, or other structures, can increase the contact time between air and heat exchanger 72 and increase the heat exchange effect by increasing the length of the duct.
  • Interconnected ducts are set at the air inlet and air outlets as air recirculators ( (Not shown).
  • the micro high-pressure fan 71 blows the untreated air from the untreated air inlet 75 into the insulated ventilation duct 73
  • the heat exchanger 72 performs heat exchange, and a miniature air circulation fan 74 provided at the treated air outlet 76 blows part of the processed air back to the untreated air inlet 75 to mix with the hot air (see FIG. 10).
  • the process air inlet 75 has an air mixing point 77.
  • the portable air conditioner of this embodiment blows the processed air directly to the human body, so that the heat transfer is not affected by the size of the space, and the body temperature and temperature comfort are quickly improved.
  • the wires of the miniature high-pressure fan 71, the miniature air circulation fan 74, the semiconductor cooling fin 5 and the small high-flow fan 83 are respectively connected to the corresponding power output ports of the single chip computer 4.
  • the full set of system devices in this embodiment uses a combination of two types of power sources: commercial power (power frequency AC) and lithium battery charging. It is not subject to power restrictions during work, and can be used with charging, convenient to carry, no maintenance, and placed in any non-extreme climate and Non-enclosed space can work normally, strong shock and shock resistance, light weight, low noise, simple manufacturing, low cost, safety and reliability.
  • the temperature diffusion end 8 includes a heat storage sheet 81, a heat transfer tube 82, a small high-flow fan 83, and a heat sink 84.
  • the heat storage sheet 81 is connected to one side of the semiconductor cooling sheet 5, and the semiconductor cooling
  • the other side of the fin 5 is connected to the heat exchanger 72, one end of the heat transfer pipe 82 is connected to the heat storage fin 81, the other end of the heat transfer pipe 82 is connected to the heat radiating fin 84, and a small high-flow fan 83 is disposed at the bottom of the heat radiating fin 84.
  • the air-conditioning end 7 of this embodiment is composed of a specially designed and arranged micro high-pressure fan 71, a heat exchanger 72, a heat-insulating ventilation duct 73, and a micro-air circulation fan 74, so that high-speed fans can draw air into the air at high temperatures.
  • the heat exchanger 72 in the ventilation duct can effectively reduce the temperature and humidity of the air under cooling. Part of the processed air is led by the air circulation fan to the front of the ventilation pipe and mixed with the untreated air. The air outlet is blown to the human body, so that the cooling and heating effects of the air conditioner of the present invention are more remarkable.
  • the temperature diffusion end 8 is composed of a designed and arranged heat storage sheet 81, a heat transfer tube 82, a small high-flow fan 83, and a heat sink 84.
  • the hot end 52 is effectively cooled to ensure its cold end 51 refrigeration efficiency.
  • circuit conversion is performed by the single-chip microcomputer 4 so that the power of the semiconductor cooling fins 5 is exchanged between positive and negative, so that heating can be achieved.
  • the working mechanism is the same as the working mechanism described above, which is effective. Blow towards the human body after raising the air temperature.
  • the heat conducting tube 82 is welded into a whole with the heat sink 84 and the heat storage sheet 81, and a conductive liquid is disposed in the heat conducting tube 82.
  • the miniature air circulation fan 74 is provided at the bottom of the heat-insulating ventilation duct 73.
  • the single-chip microcomputer 4 is disposed on the top of the airtight cover 2.
  • the insulated ventilation duct 73 is provided with a dew drainage hole 10.
  • the dew drainage hole 10 is connected to the dew collector 9.
  • the dew drainage hole 10 is preferably provided on a rear side wall of the insulated ventilation duct 73.
  • the battery pack 3 is placed on both sides of the airtight casing 1, and the dew collector 9 is located between the heat-insulating ventilation duct 73 and the heat sink 84.
  • the heat exchanger 72 is preferably a copper-aluminum mixed heat conductive metal sheet
  • the heat storage sheet 81 is preferably a heat storage copper sheet
  • the heat sink 84 is preferably an aluminum heat sink.
  • the heat storage fins 81 and radiating fins 84 have the functions of transferring heat and cold. When the portable air conditioner is cooling, the heat storage fins 81 and radiating fins 84 are used to transfer heat; when the portable air conditioner is heating, the heat storage fins 81 and radiating fins 84 is used to pass cold.
  • the airtight casing 1 and the airtight casing cover 2 are provided with openings to help the heat pipe 82 and the heat sink 84 to dissipate heat.
  • the portable semiconductor air conditioner of the present invention has been tested.
  • the test scenario is a temperature of 30 degrees Celsius and a relative humidity of 80%.
  • the test environment data is measured in real time in the field. It is powered by four 18650 lithium batteries and the cooling test is started 30 seconds after being turned on:
  • the air cooled at 30 degrees Celsius from the air inlet through the air conditioning terminal 7 to the air outlet is cooled down to 20 degrees Celsius.
  • the air treated in the cooling mode of the present invention and the untreated air The temperature difference reaches 10 degrees Celsius.
  • the cooling efficiency only decreased by about 20%, and the air temperature difference between the air inlet and outlet was about 8 degrees Celsius. This is because the circuit design failed to fully cooperate with multiple lithium battery packs to output stable power. And it is small in size, about the size of an adult's palm, and weighs only about 800 grams. It can be easily hung on the waist to blow the wind into the clothes.
  • the working principle of the portable semiconductor air conditioner of the present invention is:
  • the battery pack 3 is connected to the power input port of the single-chip microcomputer 4 in the air-tight enclosure 1, and the single-chip microcomputer 4 controls the power switch, electrode conversion and adjusts the output power of each power supply according to the driver program.
  • the wires of the high-pressure fan, the air circulation fan, the semiconductor cooling fin 5 and the high-flow fan are respectively connected to the corresponding power output ports of the single-chip microcomputer 4.
  • the single-chip microcomputer 4 When the control switch is turned on, the single-chip microcomputer 4 outputs electric power of corresponding power to each power output port according to the instructions of the circuit design and the built-in driver program, so that the parts that require electric power drive operate at the most appropriate power.
  • the power of the semiconductor cooling fin 5 used in the present invention is a low-power model of 36W.
  • the semiconductor cooling fin 5 is also called temperature difference electric cooling, that is, the Peltier effect is used to make a temperature difference electric cooling component. It is a solid-state heat pump, which does not require Maintenance, no noise, can work in any position, strong shock resistance and shock resistance, with two functions of cooling and heating.
  • the DC polarity is changed, that is, the heating and cooling switch in the single-chip microcomputer 4, the same type of cooling sheet will be realized.
  • the phenomenon of heat absorption or heat release the whole machine has no compressor suction action, and the system cooling and heating are all powered by the semiconductor cooling fins 5.
  • the cold end 51 and the hot end 52 are formed on both sides of the system, and the two are separated by the heat insulation layer 6.
  • 73 and heat exchanger 72 increase the heat transfer area several times, so that the air medium quickly exchanges heat and directly blows to the human body to achieve the effect of cooling and heating. Since the treated air directly contacts the human body, the power of the whole machine is small.
  • hot end 52 connected to the heat storage plate 81, heat transfer tubes 82, and the high temperature heat sink flow fan consisting of a diffusion terminal 8 for cooling the cold end 51 to ensure a stable cooling performance.
  • the semiconductor cooling fins 5 and the heat exchanger 72 and the semiconductor cooling fins 5 and the heat storage fins 81 are filled with a thermally conductive paste to reduce thermal resistance, thereby improving the overall work efficiency.
  • the purpose of the present invention is to actually improve the user's physical and thermal comfort.
  • the following natural laws found in thermodynamics, aerodynamics, and meteorology are used as the basis for design:
  • the present invention calculates the thermal conductivity of various materials, the thermal conductivity, the application of wind speed and air volume graphs, the calculation of equal pressure method, and the calculation of the ventilation system and the air outlet diffusion radius.
  • the structure of the air-conditioning terminal 7 is provided.
  • the function objective of the air-conditioning terminal 7 is to regulate the temperature and humidity of the air flowing through it in a limited volume, for a long time, quickly and efficiently.
  • the target function, functional benefit, functional structure and operating mechanism of the air conditioning terminal 7 are designed based on the above natural laws.
  • the calculation results of the physical temperature and the heat index are added to the driver of the single chip computer 4.
  • the single-chip microcomputer 4 controls the power output according to the driver program to the miniature high-pressure fan 71 to pressurize the air, allowing the air to flow into the heat-insulating ventilation pipe 73, which is more efficient.
  • the heat exchanger 72 in the insulated ventilation duct 73 reaches the air outlet.
  • the overall design of the insulated ventilation duct 73 will increase the contact time and surface area of the air and the heat exchanger 72, so that the air temperature and humidity can be adjusted efficiently.
  • the air needs to pass through a high-density copper-aluminum mixed high heat conduction heat exchanger 72 to increase the surface area in contact with the air to make the heat exchange effect more significant; the miniature air circulation fan 74 circulates part of the air back to the air inlet of the insulated ventilation duct 73.
  • the mixed air also increases the contact time between the air and the heat exchanger 72. Li air outlet diffusing through the body blow evenly distributed, so that the user instantly comfortable feeling temperature rises, more air conditioning design of the end 7 of the present invention so that the air conditioning performance than similar products have more than 2-fold increase.
  • the present invention may also be provided with an air temperature management system.
  • the temperature sensor of the single-chip microcomputer 4 measures the air temperature of the air inlet in real time.
  • the current output connected to 71 and miniature air circulation fan 74 can quickly and effectively adjust the working temperature and air circulation time of air conditioning terminal 7. According to the cold / hot air mode at that time, after the air at the air inlet is high / lower than the target temperature, The single-chip microcomputer 4 will adjust the power output back to the normal output according to the driver program to achieve an effective constant temperature while reducing power consumption.
  • the dew condensed on the heat exchanger 72 When used for a long time, the dew condensed on the heat exchanger 72 will also be concentrated and drained to the dew due to the gravity and the pressure difference between the design of the insulated ventilation duct 73 and the dew drainage hole 10 + the dew water collector 9.
  • the drainage hole 10 flows into the dew collector 9 for storage, and can also help the temperature diffusion end 8 to cool down.
  • the circuit design of the single chip microcomputer 4 will cause the positive and negative electrodes of the power supply connected to the semiconductor cooling fins 5 to alternately switch between the heating and cooling modes. Conversion, after the cold and hot end conversion, the above operation mechanism is repeated to adjust the output air temperature.
  • the temperature diffusing end 8 acts on the semiconductor cooling fins 5 during operation so that the hot end 52 can effectively dissipate heat to ensure the efficient operation of the cold end.
  • the overall volume is smaller and the design is more user-friendly without affecting the heat dissipation performance.
  • the temperature diffusion end 8 includes a heat storage sheet 81, a heat transfer tube 82, a high-flow fan, and a heat sink 84, and the heat storage sheet 81, the heat transfer tube 82, and the heat sink 84 are welded into one body.
  • the capillary tube effect and heat conduction liquid inside the heat transfer tube 82 Under the action of thermal convection, the heat generated by the hot end 52 is transmitted to the heat sink through the heat storage sheet 81, and the single chip microcomputer 4 controls the power output according to the driver program to a small high-flow fan 83 to blow the air to the heat sink 84, so that the air and heat are dissipated.
  • the heat exchange effect is generated by the sheet 84 to cool the heat sink 84, and then the heat exchange tube 82 transmits the heat exchange effect efficiency to the heat storage sheet 81 and the hot end 52 in the same mode to achieve effective temperature reduction.
  • the single-chip microcomputer 4 is a control system of the present invention.
  • the computer program can be divided into one or more modules / units, and one or more modules / units are stored in the memory. And executed by the processor to complete the present invention.
  • One or more modules / units may be a series of computer program instruction segments capable of performing specific functions, and the instruction segments are used to describe the execution process of the computer program in the terminal device.
  • the computer program can be divided into the above modules and realize its functions.
  • the terminal device may further include an input / output device, a network access device, a bus, and the like. Those skilled in the art can achieve the objectives of the present invention by reading the description of the present invention.
  • the invention has the characteristics of remarkable air conditioning efficiency, reasonable structure design, convenient use, and easy to carry. It is suitable for use in non-extreme climate regions around the world, and is particularly suitable for people who need to be outdoors for a long time. Improve results.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)

Abstract

本发明涉及一种基于半导体致冷片的随身携带型空调，包括气密外壳、气密壳盖、电池组、单片机、半导体致冷片和空气调节组件，单片机与电池组和半导体致冷片电连接；空气调节组件包括空气调节端和温度扩散端，空气调节端和温度扩散端分别连接在半导体致冷片的两面，空气调节端包括微型高压风扇、热交换器、隔热通风管道和空气再循环器。其有益效果是：本发明的随身携带型空调具有空气调节效能显著，结构设计合理、使用方便、易于携带的特点，适合全球非极端气候地区使用，特别适合需要长时间处于户外的人士。可有效调节空气冷热温度，而且体积细小，大小约为成年人手掌大小，重量只有约800克，可轻易挂在腰部将风吹入衣服内。

Description

一种基于半导体致冷片的随身携带型空调 技术领域
本发明涉及一种空气调节设备，特别涉及一种基于半导体致冷片的随身携带型空调。
 背景技术
现有空调设备中包括中央空调系统和家用空调，一般采用压缩机和氟利昂或其他冷媒来制冷，其结构复杂、耗电量大，只能定点安装，安装及拆卸极为不便，且氟利昂的使用对环境污染破坏大，不利于环保。中央空调系统和家用空调都是将整个房间或整个建筑物冷却或加热，耗能高，而局部冷却/加热系统( localized cooling/heating systems；LCHS)能够减少制冷/制热的能源需求，并且局部冷却/加热系统只调整使用者身体周围的环境温度，而非建筑物整体的环境温度，因此在使用者体感温度的舒适度不损失的前提下，在不是特别寒冷或炎热的地区，受到很多人的喜爱和提倡。
此外，在炎热的夏季，会导致中暑；寒冷的冬季，会引发低温症，需要长时间在户外环境的人士绝对有调节体感温度舒适度的需求，采用现有的空调器势必会造成极大的浪费，而且现有的空调需要固定地点安装、高耗电
Figure f97e
、体积过大、重量过重，并不适用于户外环境使用，至于采用风扇降温，其仅有吹风使空气流动，降温效果非常有限，当温度很高时，风扇的降温效果更是微乎其微；当温度很低时，更是毫无用处。而现时坊间出现的便携式水冷扇和手提式喷雾扇，声称能将温度降低至6至8度。水冷扇原理是利用抽水马达或吸水物料，透过内部结构设计令水分布于滤材上形成水帘。当空气被吸进水冷扇时，会先经过水帘进行热交换，令空气温度下降同时湿度提升，再由风扇将已处理空气吹出。当已处理空气吹到皮肤表面后，皮肤表面部分热量会被高湿度凉风带走，让人感到温度降低。手提式喷雾扇原理亦类似，只是改为利用喷雾蒸发降温技术，透过蒸发在空气的小水点，进行热交换吸走热量并将已处理的空气吹出。但经实际测试该类产品，需在温度低于28°C及相对湿度低于60%的环境下，才能吹出比室温低约2至5度的凉风。在高温高湿度环境下，这类产品更是没有任何效用。针对户外环境或一些未有安装空调的室内空间，极需要一种随身携带型空调装置。
目前出现了一种既可制热又可制冷的半导体制冷晶片，原理是当N型半导体材料和P型半导体材料连接成电偶对时，通直流电流就能产生能量的转移，电流从N型流向P型的接头会吸收热量成为冷端，若由P型流向N型的接头释放热量，成为热端。如果将电流方向相反过来，则冷热端相互转换。而吸收热量和释放热量的大小由电流大小决定，热电制冷器件的这种特性，加上高效率的热交换系统，可应用于随身携带型空调设备中。专利CN103423814A公开一种便携式空气调节装置，它包括半导体致冷片，半导体致冷片的两导线分别与电源的正极、负极相连接；半导体致冷片的两侧分别设置有吸热片和散热片，半导体致冷片的上面设置有面罩，面罩上设置有系带。半导体致冷片和吸热片之间及半导体致冷片和散热片之间填充有导热硅脂，面罩上设置有换气孔。专利CN203810612U公开一种小型半导体空调器，空调器由下至上依次包括电控箱、进风口、风扇、半导体芯片以及位于其两侧的换热器、出风口。该空调器是一种桌面型柜机式样小型半导体空调，利用半导体芯片制冷提供冷风，采用蓄热剂将热风吸走。专利CN2198546Y公开一种应用珀耳帖元件的致冷、致热装置，它是在一个隔热屏中装有珀耳帖元件，其致冷和致热面分别置于隔热屏的两面，致热面上装有散热器，致冷面上装有储能扩散器，并外装隔离罩，隔离罩的一端为空气进口，另一端装有通风机和空气出口，珀耳帖元件接有换向开关和直流电源接通。但是以上三个专利的技术方案因为冷端通风及热交换器设计的缺陷或散热系统设计不良，以相同功率的半导体制冷片运作，只能低效率将空气降温约3-4摄氏度，如更换更大功率半导体制冷片，会令耗电量大幅增加，不便于携带外出使用，因而未能达到实际使用需求，至今未有任何类似用途的产品出现于市场中。
因此，提供一种结构设计合理、能随时随地简单容易的使用、且能够随身携带、重量轻、低噪音、制造简单、成本低、能够有效调节空气温度的基于半导体致冷片的随身携带型空调，是本发明的创研动机。
 技术问题
本发明的目的在于克服现有技术的不足，提供一种结构设计合理、能随时随地简单容易的使用、且能够随身携带、重量轻、低噪音、制造简单、成本低、能够有效调节空气温度的基于半导体致冷片的随身携带型空调。
 技术解决方案
本发明提供的一种基于半导体致冷片的随身携带型空调，其技术方案为：
一种基于半导体致冷片的随身携带型空调，包括气密外壳、气密壳盖、电池组、单片机、半导体致冷片和空气调节组件，电池组、单片机、半导体致冷片和空气调节组件设置在气密外壳内，气密壳盖设置在气密外壳的顶部，单片机与电池组和半导体致冷片电连接；空气调节组件包括空气调节端和温度扩散端，空气调节端和温度扩散端分别连接在半导体致冷片的两面，空气调节端包括微型高压风扇、热交换器、隔热通风管道和空气再循环器，所述热交换器设置在所述隔热通风管道内，所述微型高压风扇用于为空气提供流通动力，所述空气再循环器能够将一部分已处理的空气导回热交换器进行再次调节空气温度。
优选地，温度扩散端包括储热片、导热管、小型高流量风扇和散热片，储热片与半导体致冷片的一面连接，半导体致冷片的另一面与热交换器连接，导热管的一端与储热片连接，导热管的另一端与散热片连接，小型高流量风扇设置在散热片的底部。
优选地，导热管与储热片和散热片焊接成一体，导热管内设置有传导液。
优选地，在未处理空气入口处设置有温度传感器，所述温度传感器将实时测量的温度传送到单片机；单片机设置在气密壳盖的顶部。
优选地，隔热通风管道上设置有露水引流孔，露水引流孔连接到露水收集器。
优选地，露水引流孔设置在隔热通风管道的后侧壁上。
优选地，半导体致冷片与空气调节端之间填充有导热膏。
优选地，微型高压风扇、半导体致冷片和小型高流量风扇的导线分别连接单片机相对应的电源输出口。
优选地，半导体致冷片与温度扩散端之间填充有导热膏。
优选地，隔热通风管道为具有空气出入口并能够容纳热交换器的结构，空气再循环器是安装在隔热通风管道底部的微型空气循环风扇，或者将空气入口端与空气出口端连接的管道。
 有益效果
本发明的实施包括以下技术效果：
本发明的基于半导体致冷片的随身携带型空调将已处理的空气直接吹向人体，使传热不受空间大小的影响，实现快速使其体感温度舒适度提升，相比较与现有的空调装置耗电量减少，实现节能环保的目的。本发明的全套系统装置采用市电（工频交流电）和锂电池充电两种电源相结合，工作时不受电源限制，随充随用，携带方便、无需维护、放在任何非极端气候及非密闭空间都能正常工作，抗冲击和抗震能力强，重量轻，低噪音、制造简单、成本低、安全可靠。
本发明的随身携带型半导体空调经过测试，在制冷模式下，能够将温度降低10摄氏度。而且体积细小，大小约为成年人手掌大小，重量只有约800克，可轻易挂在腰部将风吹入衣服内。
本发明的空气调节端由特殊设计和布局的微型高压风扇、热交换器、隔热通风管道和空气再循环器所组成，实现在高温下由高速风扇将空气吸入空气调节端，通风管道内的热交换器在制冷情况下能有效降低空气温度及湿度，部分己处理空气由空气再循环器将其引到通风管前端与未处理空气混合，其余已处理空气经出风口吹向人体，使得本发明的空调制冷和制热效果更显著；在低温下经单片机进行电路转换令半导体致冷片的电源正负交换，就能够实现制热，当半导体致冷片冷热转换后以上述相同机制，在有效提高空气温度后吹向人体。温度扩散端由经过设计和布局储热片、导热管、小型高流量风扇和散热片所组成，在半导体致冷片运作期间，令热端有效散热以确保其冷端制冷效能。
本发明具有空气调节效能显著，结构设计合理、使用方便、易于携带的特点，适合全球非极端气候地区使用，特别适合需要长时间处于户外的人
Figure 2f20
、对使用者衣服内的空气温度及湿度有明显改善效果。
 附图说明
图1为本发明实施例的基于半导体致冷片的随身携带型空调立体结构示意图。
图2为本发明实施例的基于半导体致冷片的随身携带型空调另一面立体结构示意图。
图3为打开壳盖后的随身携带型空调立体结构示意图。
图4为本发明实施例的基于半导体致冷片的随身携带型空调的内部结构示意图。
图5为打开气密外壳后的随身携带型空调侧面结构示意图。
图6为随身携带型空调的一部分部件爆炸结构示意图。
图7为空气调节组件爆炸结构示意图。
图8为随身携带型空调爆炸结构示意图。
图9为空气调节端空气流动及空气循环平面图。
图10为图9的A-A切面结构示意图。
图11为空气调节端空气流动的流程示意图。
图中：1、气密外壳；2、气密壳盖；3、电池组；4、单片机；5、半导体致冷片； 51、冷端；52、热端；6、隔热层；7、空气调节端；71、微型高压风扇；72、热交换器；73、隔热通风管道；74、微型空气循环风扇；75、未处理空气入口；76、已处理空气出口；77、空气混合点；8、温度扩散端；81、储热片；82、导热管；83、小型高流量风扇；84、散热片；9、露水收集器；10、露水引流孔。
 本发明的实施方式
下面将结合实施例以及附图对本发明加以详细说明，需要指出的是，所描述的实施例仅旨在便于对本发明的理解，而对其不起任何限定作用。
需要说明的是，在本发明的描述中可能出现的术语“正面/背面”、“上/下”、“左/右”、“竖直/水平”、“内/外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或组件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。为叙述方便，下文中所称的“左”“右”“上”“下”与附图本身的左、右、上、下方向一致，但并不对本发明的结构起限定作用。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个组件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
参见图1至图8所示，本实施例的目的在于在寒冷和炎热气候条件下，令使用者体感温度的舒适度提升，在有限体积及重量限制下，提供一种结构设计合理、能随时随地简单容易的使用，且能够随身携带的空调装置，该装置在高温下能将较高的空气温度、湿度降低，吹出凉爽空气，防止中暑；在低温下能将较低的空气温度升高，保暖驱寒。具体地，图1和图2为本实施例的基于半导体致冷片的随身携带型空调立体结构示意图，图3为打开壳盖后的随身携带型空调立体结构示意图，图4为本实施例的基于半导体致冷片的随身携带型空调的内部结构示意图，图5为打开气密外壳后的随身携带型空调侧面结构示意图，图6至图7为随身携带型空调爆炸结构示意图。本实施例提供的一种基于半导体致冷片5的随身携带型空调，包括气密外壳1、气密壳盖2、电池组3、单片机4、半导体致冷片5和空气调节组件，电池组3、单片机4、半导体致冷片5和空气调节组件设置在气密外壳1内，气密壳盖2设置在气密外壳1的顶部，单片机4与分别电池组3和半导体致冷片5电连接；空气调节组件包括空气调节端7和温度扩散端8，空气调节端7和温度扩散端8分别设置在半导体致冷片5的两面，空气调节端7包括微型高压风扇71、热交换器72、隔热通风管道73和空气再循环器，热交换器72设置在隔热通风管道73内，空气再循环器能够将一部分已处理的空气导回热交换器进行再次调节空气温度，优选地，微型高压风扇71设置在未处理空气入口75处，为空气提供流通动力，本领域技术人员可知，微型高压风扇71设置在未处理空气入口75处为一优选的设置方式，安装在其它位置亦能实现本发明的目的。本实施例中的半导体致冷片5的两导线与单片机4的正极、负极相连接；半导体致冷片5的两侧分别为冷端51及热端52，并隔离后连接空气调节端7及温度扩散端8，半导体致冷片5与空气调节端7之间填充有导热膏，半导体致冷片5与温度扩散端8之间填充有导热膏，提高紧密性接触，降低热阻系数。隔热通风管道73及热交换器72结构，增加空气进行热交换的时间，令空气调节性能与现有技术相比大幅提升，实现有效的空气调节功能。
参见图7所示，空气再循环器可以是安装在隔热通风管道底部的微型空气循环风扇。空气调节端7的隔热通风管道73为具有空气出入口并能够容纳热交换器的结构，隔热通风管道73的底部具有用于安装微型空气循环风扇74的底槽，微型空气循环风扇74能够将已处理的一部分空气通过底槽吹回空气入口端重复换热，热交换器72通过中间隔板分隔形成空气流通通道。本领域技术人员可知，上述的空气再循环器仅仅是一种实施例，隔热通风管道73还可以是具有空气进出口的管道，热交换器72设置在管道内，管道可以“U型”、“S型”，或者其它结构，通过增加管道的长度可以增加空气与热交换器72的接触时间，增加换热效果，在空气入口端与空气出口端设置相互连接的管道作为空气再循环器（图中未示出）。
具体地，参见图9空气调节端空气流动及空气循环流程平面图和图11空气调节端空气流动的流程示意图，微型高压风扇71将未处理空气从未处理空气入口75吹入隔热通风管道73中的热交换器72进行换热，在已处理空气出口76处设置的微型空气循环风扇74将已处理的一部分空气吹回未处理空气入口75与热空气进行混合（参见图10所示），未处理空气入口75处具有空气混合点77。本实施例的随身携带型空调，将已处理的空气直接吹向人体，使传热不受空间大小的影响，实现快速使其体感温度舒适度提升，相比较与现有的空调装置耗电量减少，实现节能环保的目的。微型高压风扇71、微型空气循环风扇74、半导体致冷片5和小型高流量风扇83的导线分别连接单片机4相对应的电源输出口。本实施例的全套系统装置采用市电（工频交流电）和锂电池充电两种电源相结合，工作时不受电源限制，随充随用，携带方便、无需维护、放在任何非极端气候及非密闭空间都能正常工作，抗冲击和抗震能力强，重量轻，低噪音、制造简单、成本低、安全可靠。在高温下能长时间高效降低接触人体皮肤的空气温度和湿度，防止中暑；低温下能长时间高效加热接触人体皮肤的空气温度，保暖驱寒，结构简单可靠；采用电池供电，安全、方便、用电量低、环保。
参见图7和图8所示，温度扩散端8包括储热片81、导热管82、小型高流量风扇83和散热片84，储热片81与半导体致冷片5的一面连接，半导体致冷片5的另一面与热交换器72连接，导热管82的一端与储热片81连接，导热管82的另一端与散热片84连接，小型高流量风扇83设置在散热片84的底部。本实施例的空气调节端7由特殊设计和布局的微型高压风扇71、热交换器72、隔热通风管道73和微型空气循环风扇74所组成，实现在高温下由高速风扇将空气吸入空气调节端7，在通风管道内的热交换器72在制冷情况下能有效降低空气温度及湿度，部分己处理空气由空气循环风扇将其引到通风管前端与未处理空气混合，其余已处理空气经出风口吹向人体，使得本发明的空调制冷和制热效果更显著。温度扩散端8由经过设计和布局储热片81、导热管82、小型高流量风扇83和散热片84所组成，在半导体致冷片5运作期间，令热端52有效散热以确保其冷端51制冷效能。在低温下经单片机4进行电路转换令半导体致冷片5的电源正负交换，就能够实现制热，当半导体致冷片5冷热转换后的工作机制与上述介绍的工作机制相同，在有效提高空气温度后吹向人体。
优选地，导热管82与散热片84和储热片81焊接成一体，导热管82内设置有传导液。微型空气循环风扇74设置在隔热通风管道73的底部。单片机4设置在气密壳盖2的顶部。隔热通风管道73上设置有露水引流孔10，露水引流孔10连接到露水收集器9，露水引流孔10优选设置在隔热通风管道73的后侧壁上。具体地，电池组3放置在气密外壳1的两侧，露水收集器9位于隔热通风管道73和散热片84之间。本实施例中，热交换器72优选铜铝混合热传导金属片，储热片81优选储热铜片，散热片84优选铝散热片。储热片81和散热片84具有传递热和传递冷的功能，携带型空调制冷时，储热片81和散热片84用于传递热；携带型空调制热时，储热片81和散热片84用于传递冷。气密外壳1和气密壳盖2上设置有开口，有助于导热管82和散热片84散热。
本发明的随身携带型半导体空调经过测试，测试场景为气温30摄氏度、相对湿度80%，测试环境数据为实地实时测量；以4颗18650锂电池供电，在开机后30秒开始进行降温测试：
当空气通过本空调降温后，30摄氏度空气由入风口通过空气调节端7到出风口输出时空气降温至20摄氏度，结果得出在上述环境下经本发明制冷模式处理的空气与未处理前的温差达到10摄氏度。而经运作90分钟后，降温效能仅仅下降约20%，出入风口空气温度差约8摄氏度，这是因为电路设计未能完全配合多颗锂电池组3合输出稳定功率电力导致的。而且体积细小，约为成年人手掌大小，重量只有约800克，可轻易挂在腰部将风吹入衣服内。
本发明的随身携带型半导体空调的工作原理为：
以空调制冷模式进行说明，首先在气密外壳1内由电池组3连接单片机4的电源输入口，并由单片机4依驱动程序下控制电源开关，电极转换及调节各电源输出的输出功率。高压风扇、空气循环风扇、半导体致冷片5及高流量风扇的导线分别连接单片机4相对应的电源输出口。当控制开关打开时单片机4依电路设计及驱动程序内建的指令，向各电源输出口输出相对应的功率的电力，令需要电力驱动的零件以最合适功率运作。
本发明采用的半导体致冷片5的功率选择36W的低功率型号，半导体致冷片5也叫温差电致冷，即珀尔贴效应制作温差电致冷组件，它是一种固态热泵，无需维护、无噪音、能在任何位置工作，抗冲击和抗震能力强，具有致冷和致热两种功能，当改变直流电极性时，即单片机4中的冷暖开关，同一种致冷片将实现吸热或放热现象，整机无压缩机抽吸动作，系统制冷制暖全部由半导体致冷片5通电后其两侧分别形成冷端51及热端52，并由隔热层6隔离两端以减弱温度互相影响并将冷端51连接热交换器72、微型高压风扇71、隔热通风管道73及微型空气循环风扇74所组成的空气调节端7进行冷暖调节循环，由于隔热通风管道73及热交换器72数倍地增加传热面积，使空气介质快速热交换传导后直接吹至人体实现冷暖空调功效，由于经处理的空气直接接触人体，整机功率小，故能量损耗极少，节能效果显著；热端52则连接储热片81、导热管82、高流量风扇及散热片所组成的温度扩散端8进行散热确保冷端51制冷效能稳定。而半导体致冷片5和热交换器72之间及半导体致冷片5和储热片81之间则填充导热膏减低热阻，令整体工作效能提升。
本发明的目的是实际令用户的体感温度舒适度提升，为达到目标功能、功能结构及运作机制都引用以下热力学、空气力学及气象学所发现的自然定律作为基础而设计：
i)热传导定律中描述一个区域内的热会从高温处向低温处传播；
ii)根据导热率计算出各种材料间的热传导性能；
iii)空气湿线图应用及露点温度计算；
iv)体感温度及酷热指数计算；
v)风速与风量曲线图的应用；
vi)应用等压法计算进行通风系统设计；
vii)出风口扩散半径计算。
本发明跟据热传导方程式所描述温度如何随时间变化的公式、计算出各种材料导热率的热传导性能、风速与风量曲线图应用、等压法计算进行通风系统设计及出风口扩散半径计算，得出本发明的核心设计空气调节端7的结构，空气调节端7的功能目标是在体积限制、长时间、快速及高效调节流过的空气温度及湿度。
空气调节端7的目标功能，功能效益、功能结构及运作机制都引用以上自然定律作为基础而设计，为实际令用户体感温度舒适度上升，将体感温度及酷热指数计算结果加入单片机4的驱动程序，当单片机4的温度传感器测量到冷端51达到目标工作温度后，单片机4依驱动程序下控制电源输出至微型高压风扇71将空气增压，令空氣流入隔热通风管道73時，能更高效通过隔热通风管道73内的热交换器72到达出风口，同时隔热通风管道73的整体设计会增加空气与热交换器72的接触时间及接触表面积，从而能高效调节空气温度及湿度，期间空气需要通过高密集分布的铜铝混合高热传导热交换器72，以增加与空气接触的表面积令热交换效果更显著；微型空气循环风扇74将部分空气循环回隔热通风管道73的入风口，混合空气同时增加空气与热交换器72的接触时间，大部分已处理空气则通过出风口扩散性平均分布吹向人体，即时令用户体感温度舒适度上升，以上空气调节端7的设计令本发明的空气调节效能比类似产品有2倍以上提升。另外本发明还可以设有空气温度管理系统，单片机4的温度传感器实时测量入风口空气温度，当入风口空气达到目标温度后，单片机4依驱动程序下调整与半导体致冷片5、微型高压风扇71及微型空气循环风扇74所连接的电流输出，能快速有效调节空气调节端7的工作温度及空气流通时间；而跟据当时冷/热风模式，入风口空气在高/低于目标温度后，单片机4将依驱动程序下调整电源输出回正常输出，达到有效恒温同时减少耗电。长时间使用时热交换器72上凝结的露水，亦会因地心引力及隔热通风管道73的设计与露水引流孔10+露水水收集器9之间的气压差，令露水集中引流到露水引流孔10并流入露水收集器9储存，还可以协助温度扩散端8降温。
当控制本发明进行冷暖模式转换时，单片机4电路设计会令连接半导体致冷片5的电源输出正负极交替进行冷暖模式转换，由于半导体致冷片5正负极交替时会产生冷热端转换，经冷热端转换后重复上述运作机制达到调节输出空气温度。
温度扩散端8作用于半导体致冷片5运作期间令热端52能有效散热以确保冷端高效运作，在不影响散热效能下令整体体积更小及外型设计更方便用户使用。温度扩散端8包括储热片81、导热管82、高流量风扇及散热片84所组成，而储热片81、导热管82及散热片84焊接成一体，导热管82内因毛细管效应及热传导液体热对流作用下，将热端52产生的热力经储热片81传导到散热片，而单片机4依驱动程序下控制电源输出至小型高流量风扇83将空气吹向散热片84，令空气与散热片84产生热交换作用使散热片84降温，再由导热管82依相同模式将热交换作用效能传导到储热片81及热端52实现有效降温。
单片机4作为本发明的控制系统，本领域技术人员可知，需要通过计算机程序来实现，计算机程序可以被分割成一个或多个模块/单元，一个或者多个模块/单元被存储在所述存储器中，并由所述处理器执行，以完成本发明。一个或多个模块/单元可以是能够完成特定功能的一系列计算机程序指令段，该指令段用于描述计算机程序在终端设备中的执行过程。计算机程序可以被分割成上文的多个模块，并实现其功能。本领域技术人员可以理解，还可包括为实现本发明所需的一些部件，例如终端设备还可以包括输入输出设备、网络接入设备、总线等。本领域技术人员通过阅读本发明的说明书，就能够实现本发明的目的。
本发明具有空气调节效能显著，结构设计合理、使用方便、易于携带的特点，适合全球非极端气候地区使用，特别适合需要长时间处于户外的人、对使用者衣服内的空气温度及湿度有明显改善效果。
以上所揭露的仅为本发明的优选实施例而已，当然不能以此来限定本发明之权利范围，因此依本发明申请专利范围所作的等同变化，仍属本发明所涵盖的范围。应当理解，以上的描述意图在于说明而非限制。例如，上述实施例(和/或其方面)可以彼此组合使用。此外，根据本发明的启示可以做出很多改型以适于具体的情形或材料而没有偏离本发明的范围。通过阅读上述描述，权利要求的范围和精神内的很多其它的实施例和改型对本领域技术人员是显而易见的。

Claims (10)

  1. 一种基于半导体致冷片的随身携带型空调，包括气密外壳、气密壳盖、电池组、单片机、半导体致冷片和空气调节组件，所述电池组、所述单片机、所述半导体致冷片和所述空气调节组件设置在所述气密外壳内，所述气密壳盖设置在所述气密外壳的顶部，其特征在于：所述单片机分别与所述电池组和所述半导体致冷片电连接；所述空气调节组件包括空气调节端和温度扩散端，所述空气调节端和所述温度扩散端分别连接在所述半导体致冷片的两面，所述空气调节端包括微型高压风扇、热交换器、隔热通风管道和空气再循环器，所述热交换器设置在所述隔热通风管道内，所述微型高压风扇用于为空气提供流通动力，所述空气再循环器能够将一部分已处理的空气导回热交换器再次调节空气温度。
  2. 根据权利要求1所述的一种基于半导体致冷片的随身携带型空调，其特征在于：所述温度扩散端包括储热片、导热管、小型高流量风扇和散热片，所述储热片与所述半导体致冷片的一面连接，所述半导体致冷片的另一面与所述热交换器连接，所述导热管的一端与所述储热片连接，所述导热管的另一端与散热片连接，所述小型高流量风扇设置在所述散热片的底部。
  3. 根据权利要求2所述的一种基于半导体致冷片的随身携带型空调，其特征在于：所述导热管与所述储热片和所述散热片焊接成一体，所述导热管内设置有传导液。
  4. 根据权利要求1所述的一种基于半导体致冷片的随身携带型空调，其特征在于：在未处理空气入口处设置有温度传感器，所述温度传感器将实时测量的温度传送到单片机。
  5. 根据权利要求1所述的一种基于半导体致冷片的随身携带型空调，其特征在于：所述隔热通风管道上设置有露水引流孔，所述露水引流孔连接到露水收集器。
  6. 根据权利要求5所述的一种基于半导体致冷片的随身携带型空调，其特征在于：所述露水引流孔设置在所述隔热通风管道的后侧壁上。
  7. 根据权利要求1所述的一种基于半导体致冷片的随身携带型空调，其特征在于：所述半导体致冷片与所述空气调节端之间填充有导热膏。
  8. 根据权利要求2所述的一种基于半导体致冷片的随身携带型空调，其特征在于：所述微型高压风扇、所述半导体致冷片和所述小型高流量风扇的导线分别连接单片机相对应的电源输出口。
  9. 根据权利要求1所述的一种基于半导体致冷片的随身携带型空调，其特征在于：所述半导体致冷片与所述温度扩散端之间填充有导热膏。
  10. 根据权利要求1-9任一所述的一种基于半导体致冷片的随身携带型空调，其特征在于：所述隔热通风管道为具有空气出入口并能够容纳热交换器的结构；所述空气再循环器是安装在隔热通风管道内的微型空气循环风扇，或者是将空气入口端与空气出口端连接的管道。
PCT/CN2019/102042 2018-08-24 2019-08-22 一种基于半导体致冷片的随身携带型空调 Ceased WO2020038444A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810973108.7A CN110857800A (zh) 2018-08-24 2018-08-24 一种基于半导体致冷片的随身携带型空调
CN201810973108.7 2018-08-24

Publications (1)

Publication Number Publication Date
WO2020038444A1 true WO2020038444A1 (zh) 2020-02-27

Family

ID=69591979

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/102042 Ceased WO2020038444A1 (zh) 2018-08-24 2019-08-22 一种基于半导体致冷片的随身携带型空调

Country Status (2)

Country Link
CN (1) CN110857800A (zh)
WO (1) WO2020038444A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116541910A (zh) * 2023-06-07 2023-08-04 黄理鑫 一种用于生物冻存的传热模块及其设计、制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113758047A (zh) * 2021-09-10 2021-12-07 中电海康无锡科技有限公司 半导体制冷凉霸的控制方法、控制装置、电控系统及凉霸

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100212334A1 (en) * 2005-11-16 2010-08-26 Technologies Holdings Corp. Enhanced Performance Dehumidification Apparatus, System and Method
CN203432016U (zh) * 2013-08-20 2014-02-12 上海理工大学 台式便携半导体制冷空调
CN203810612U (zh) * 2014-03-20 2014-09-03 海尔集团公司 小型半导体空调器
CN107062502A (zh) * 2017-02-28 2017-08-18 深圳沃海森科技有限公司 壁挂式加热制冷一体式新风机
CN207471731U (zh) * 2017-09-20 2018-06-08 南通诺亚居环保科技有限公司 外循环双重除湿新风系统
CN208687868U (zh) * 2018-08-24 2019-04-02 郑敏发 一种基于半导体致冷片的随身携带型空调

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101918261B1 (ko) * 2011-11-28 2018-11-14 삼성전자주식회사 모바일 장치용 반도체 패키지
CN203147957U (zh) * 2013-03-07 2013-08-21 王方军 一种无噪音冷暖空调
CN104266278B (zh) * 2014-02-28 2017-06-30 海尔集团公司 桌面空调
CN204006454U (zh) * 2014-07-15 2014-12-10 青岛海尔智能技术研发有限公司 便携式空调
CN105352075A (zh) * 2015-09-09 2016-02-24 南京中格科技发展有限公司 电子空调机
CN205939496U (zh) * 2016-08-12 2017-02-08 广东美的制冷设备有限公司 除湿机

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100212334A1 (en) * 2005-11-16 2010-08-26 Technologies Holdings Corp. Enhanced Performance Dehumidification Apparatus, System and Method
CN203432016U (zh) * 2013-08-20 2014-02-12 上海理工大学 台式便携半导体制冷空调
CN203810612U (zh) * 2014-03-20 2014-09-03 海尔集团公司 小型半导体空调器
CN107062502A (zh) * 2017-02-28 2017-08-18 深圳沃海森科技有限公司 壁挂式加热制冷一体式新风机
CN207471731U (zh) * 2017-09-20 2018-06-08 南通诺亚居环保科技有限公司 外循环双重除湿新风系统
CN208687868U (zh) * 2018-08-24 2019-04-02 郑敏发 一种基于半导体致冷片的随身携带型空调

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116541910A (zh) * 2023-06-07 2023-08-04 黄理鑫 一种用于生物冻存的传热模块及其设计、制造方法
CN116541910B (zh) * 2023-06-07 2024-02-13 黄理鑫 一种用于生物冻存的传热模块及其设计、制造方法

Also Published As

Publication number Publication date
CN110857800A (zh) 2020-03-03

Similar Documents

Publication Publication Date Title
CN102818324B (zh) 半导体风扇
CN203432016U (zh) 台式便携半导体制冷空调
CN103453604A (zh) 一种太阳能空调系统
CN108375149A (zh) 一种太阳能光伏空调墙
CN201844486U (zh) 一种半导体制冷空调装置
WO2025086536A1 (zh) 一种风冷式降温服
WO2020038444A1 (zh) 一种基于半导体致冷片的随身携带型空调
CN206413788U (zh) 一种可穿戴人体降温系统
CN218976549U (zh) 储能电源
CN208687868U (zh) 一种基于半导体致冷片的随身携带型空调
CN116158578A (zh) 一种新型半导体降温服
CN102997353B (zh) 太阳能电子空调及其制作方法
CN212787498U (zh) 一种控温设备及控温服
CN207778721U (zh) 空调器及其电器盒
CN212345361U (zh) 一种便携式制冷服
CN212157720U (zh) 一种制冰机
CN220453840U (zh) 液冷空调机组
CN217851449U (zh) 一种半导体调温空调服
CN209571444U (zh) 一种锂电池组空气冷却加温系统
CN215531878U (zh) 一种基于医用防护服的便携式单人制冷装置
CN110811031B (zh) 一种空调衣
CN208042405U (zh) 一种太阳能光伏空调墙
CN216718990U (zh) 可制冷制热的模块化温度调节装置
CN213983848U (zh) 便携式空调模块
CN202521767U (zh) 蒸发与电子双重制冷冷风扇

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19852038

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19852038

Country of ref document: EP

Kind code of ref document: A1