WO2020032074A1 - 積層体の製造方法 - Google Patents
積層体の製造方法 Download PDFInfo
- Publication number
- WO2020032074A1 WO2020032074A1 PCT/JP2019/031006 JP2019031006W WO2020032074A1 WO 2020032074 A1 WO2020032074 A1 WO 2020032074A1 JP 2019031006 W JP2019031006 W JP 2019031006W WO 2020032074 A1 WO2020032074 A1 WO 2020032074A1
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- WO
- WIPO (PCT)
- Prior art keywords
- film
- laminate
- pretreatment
- metal film
- powder
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
- C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/087—Coating with metal alloys or metal elements only
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
Definitions
- the present invention relates to a method for producing a laminate in which a metal film is laminated on a substrate.
- a thermal spraying method or a cold spraying method can be used as a method for producing a laminate in which a metal film is formed on a substrate.
- the thermal spraying method is a method of forming a coating by spraying a material (sprayed material) heated to a state of melting or close to the molten state onto a base material.
- a powder of a material is sprayed from a Laval nozzle together with an inert gas having a melting point or a softening point or lower, and collides with the substrate in a solid state to form a film on the surface of the substrate.
- the metal film has a function of radiating the heat of the base material to the outside. It is generally known that heat can be efficiently dissipated by making the surface for dissipating heat uneven (for example, see Patent Document 2).
- the present invention has been made in view of the above, and an object of the present invention is to provide a method of manufacturing a laminate having high adhesion strength and capable of efficiently dissipating heat.
- a method for manufacturing a laminate according to the present invention is directed to a method for manufacturing a laminate in which a film formed using a material powder is laminated on a surface of an insulating base material.
- the material powder further includes an additive for binding the material powders, and the additive is brazing material or magnesium.
- the film forming step is characterized in that the pretreatment film is heated at 300 ° C. or more and 650 ° C. or less.
- FIG. 1 is a cross-sectional view showing a structure of a laminate according to one embodiment of the present invention.
- FIG. 2 is an enlarged sectional view of a part of the laminate shown in FIG.
- FIG. 3 is a schematic diagram showing an outline of a cold spray device used for forming a metal film of a laminate according to one embodiment of the present invention.
- FIG. 4 is an SEM image showing an example of the laminate according to one embodiment of the present invention, and is a diagram showing an SEM image showing a cross section of the laminate.
- FIG. 5 is an SEM image showing an example of the laminate according to one embodiment of the present invention, and is a diagram showing an SEM image showing a cross section of the laminate.
- FIG. 6 is an SEM image showing an example of the laminate according to one embodiment of the present invention, and is a diagram showing an SEM image showing a cross section of the laminate.
- FIG. 7 is an SEM image showing an example of the laminate according to one embodiment of the present invention, and is a diagram showing an SEM image showing a cross section of the laminate.
- FIG. 8 is an SEM image showing an example of the laminate according to one embodiment of the present invention, and is a diagram showing an SEM image showing a cross section of the laminate.
- FIG. 1 is a cross-sectional view showing a structure of a laminate according to one embodiment of the present invention.
- FIG. 2 is an enlarged sectional view of a part of the laminate shown in FIG.
- the laminate 1 shown in FIG. 1 includes a substrate 10 and a metal film 20 formed on one surface of the substrate 10.
- the base material 10 is a substantially plate-shaped member.
- the material of the base material 10 include nitride ceramics such as aluminum, aluminum nitride, and silicon nitride, and oxide ceramics such as alumina, magnesia, zirconia, steatite, forsterite, mullite, titania, silica, and sialon.
- a resin layer containing an inorganic filler For example, a chip configured by a semiconductor element such as a diode, a transistor, or an IGBT (insulated gate bipolar transistor) may be mounted on the base 10.
- the metal film 20 is mainly composed of a metal or an alloy having good thermal conductivity, such as aluminum or an aluminum alloy.
- the metal film 20 is formed by a cold spray method described later.
- the metal film 20 causes heat to enter the base material 10 or release heat stored in the base material 10 to the outside.
- the metal film 20 is formed at a low temperature by the cold spray method, the influence of thermal stress is reduced. Therefore, it is possible to obtain a metal film having no phase transformation and suppressed oxidation.
- the material powder collides with the base material 10
- plastic deformation occurs between the material powder and the material of the base material 10, thereby obtaining an anchor effect. Therefore, a laminate having high adhesion strength can be obtained.
- the surface of the metal film 20 opposite to the side in contact with the base material 10 has an uneven shape.
- This surface has irregular irregularities that are repeated irregularly, and has a larger surface area as compared with a case where the surface is flat.
- the surface of the metal film 20 is formed by randomly stacking particles (here, the material constituting the metal film 20).
- FIG. 3 is a schematic diagram showing an outline of a cold spray device used for forming a metal film of a laminate according to one embodiment of the present invention.
- the above-described base material 10 is prepared.
- the above-described chip may be mounted on the base material 10.
- the side opposite to the mounting surface is the film forming surface.
- a powder of a material for forming the metal film 20 is accelerated together with the gas on the substrate 10 by a cold spray device 30 shown in FIG. 3 and sprayed and deposited on the surface of the substrate 10 in a solid state.
- a pretreatment film 200 is formed (pretreatment step).
- the cold spray device 30 includes a gas heater 31 that heats the compressed gas, a powder supply device 32 that contains powder of a material for forming the metal film 20 and supplies the powder to a spray gun 33, It is provided with a gas nozzle 34 for injecting the supplied material powder onto the base material, and valves 35 and 36 for adjusting the amount of compressed gas supplied to the gas heater 31 and the powder supply device 32, respectively.
- the material for forming the metal film 20 is a powder material comprising aluminum or an aluminum alloy, which is a main component of the metal film 20, and an additive for bonding aluminum or aluminum alloy.
- the mixing ratio of the main component and the additive is 1 to 1.5 when the main component is 1.
- the “main component of the metal film 20” means a component having the highest content in the components (elements or alloys remaining after the film is formed) constituting the metal film 20.
- the additive examples include a material having a reducing effect on an aluminum oxide film and a brazing material.
- the material having a high reducing action examples include magnesium and zinc, and magnesium is preferable from the viewpoint of a high reducing action on aluminum.
- the brazing material is aluminum brazing material containing aluminum as a main component, magnesium, copper, etc., silver as a main component, silver containing at least one of copper and tin, and containing titanium which is an active metal. Brazing material can be used.
- Helium, nitrogen, air, etc. are used as the compressed gas.
- the compressed gas supplied to the gas heater 31 is heated to, for example, 50 ° C. or higher and lower than the melting point of the powder of the material for forming the metal film 20, and then supplied to the spray gun 33. Is done.
- the heating temperature of the compressed gas is preferably 300 ° C. or more and 650 ° C. or less.
- the compressed gas supplied to the powder supply device 32 supplies the powder in the powder supply device 32 to the spray gun 33 so as to have a predetermined discharge amount.
- the heated compressed gas is made into a supersonic flow (about 340 m / s or more) by the gas nozzle 34 having a divergent shape.
- the gas pressure of the compressed gas is preferably about 1 to 5 MPa.
- the pressure is more preferably about 2 to 4 MPa, particularly preferably about 1.5 to 2.5 MPa.
- the powder of the material supplied to the spray gun 33 is accelerated by the introduction of the compressed gas into the supersonic flow, collides with the base material 10 at a high speed in a solid state, and is deposited.
- the apparatus is not limited to the cold spray apparatus 30 shown in FIG. 3 as long as the apparatus can form a film by colliding the material powder toward the substrate 10 in a solid state.
- the pretreatment film 200 formed by the cold spray device 30 includes a main component (aluminum or an aluminum alloy) and an additive, and has a gap or a minute space.
- the pre-treatment film 200 is subjected to a heat treatment to form the metal film 20 by combining the main components, the additives, and the main component and the additive (film forming step).
- the temperature of this heat treatment is 300 ° C. or more and 650 ° C. or less, preferably 500 ° C. or more and 600 ° C. or less. By doing so, the bonding strength of the metal film 20 can be increased.
- the additive in the metal film 20 is partially evaporated, melted, or partially left as it is in the pretreatment film 200.
- magnesium as an additive is preferable because it reduces the oxide film of the aluminum powder and promotes bonding between the aluminum powders.
- FIGS. 4 and 5 are SEM images showing an example of the laminate according to one embodiment of the present invention, and are diagrams showing SEM images showing a cross section of the laminate. 4 and 5 show examples in which aluminum is the main component and a brazing filler metal is used as an additive.
- FIG. 4 shows a cross section after film formation (pretreatment film 200) by the cold spray device 30.
- FIG. 5 shows a cross section of a metal film (metal film 20) formed by performing heat treatment after film formation. After the film formation, there are many gaps and the like, and there are many portions where the powders are not bonded (see FIG. 4). However, after the heat treatment (see FIG. 5), many gaps are filled and the film is formed. The bonding strength is improved as compared with the later.
- FIGS. 6 to 8 are SEM images showing an example of the laminated body according to one embodiment of the present invention, and are diagrams showing SEM images showing a cross section of the laminated body. 6 to 8 show examples using aluminum as a main component and magnesium as an additive.
- FIG. 6 shows a cross section after film formation by the cold spray device 30 (pretreatment film 200).
- FIG. 7 shows a cross section of a metal film (metal film 20) formed by performing heat treatment after film formation.
- FIG. 8 shows the surface of the metal film in a state where a heat treatment has been performed after the film formation.
- the powder of the material for forming the metal film 20 and the powder of the material including the main component made of aluminum or the aluminum alloy and the additive that binds the powder are combined with the gas. It is accelerated and sprayed and deposited on the surface of the substrate 10 in a solid state to form a pretreatment film 200 having an uneven surface, and heat treatment is performed on the pretreatment film 200 to improve the bonding strength. I did it. According to the above-described embodiment, heat radiation can be efficiently performed with high adhesion strength.
- the metal film 20 is formed using a powder of a material including a main component made of aluminum or an aluminum alloy and an additive that binds the powder to each other has been described.
- the metal film 20 may be formed using a single material powder.
- the present invention can include various embodiments and the like which are not described herein, and can perform various design changes and the like without departing from the technical idea specified by the claims. Is possible.
- the method for manufacturing a laminate according to the present invention has high adhesion strength and is suitable for efficiently dissipating heat.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
10 基材
20 金属皮膜
30 コールドスプレー装置
31 ガス加熱器
32 粉末供給装置
33 スプレーガン
34 ガスノズル
35、36 バルブ
200 前処理皮膜
Claims (3)
- 絶縁性を有する基材表面に材料粉末を用いて形成される皮膜を積層した積層体の製造方法であって、
アルミニウム又はアルミニウム合金を主成分とする前記材料粉末をガスとともに加速し、前記基材表面に固相状態のままで吹き付け、前記基材表面に前処理皮膜を形成する前処理工程と、
前記基材表面に前記前処理皮膜を形成した前処理積層体を加熱して、表面が不規則な凹凸形状をなす熱処理皮膜を形成する皮膜形成工程と、
を含むことを特徴とする積層体の製造方法。 - 前記材料粉末は、当該材料粉末同士を結合させる添加剤をさらに含み、
前記添加剤は、ろう材またはマグネシウムであることを特徴とする請求項1に記載の積層体の製造方法。 - 前記皮膜形成工程は、300℃以上650℃以下で前記前処理皮膜を加熱することを特徴とする請求項1または2に記載の積層体の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201980051612.4A CN112513329A (zh) | 2018-08-10 | 2019-08-06 | 层叠体的制造方法 |
KR1020217002450A KR102559148B1 (ko) | 2018-08-10 | 2019-08-06 | 적층체의 제조 방법 |
JP2020535818A JPWO2020032074A1 (ja) | 2018-08-10 | 2019-08-06 | 積層体の製造方法 |
US17/263,573 US11512395B2 (en) | 2018-08-10 | 2019-08-06 | Method of manufacturing laminate |
EP19848727.4A EP3835454A4 (en) | 2018-08-10 | 2019-08-06 | PROCESS FOR MAKING A MULTI-LAYER BODY |
Applications Claiming Priority (2)
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JP2018-151941 | 2018-08-10 | ||
JP2018151941 | 2018-08-10 |
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WO2020032074A1 true WO2020032074A1 (ja) | 2020-02-13 |
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PCT/JP2019/031006 WO2020032074A1 (ja) | 2018-08-10 | 2019-08-06 | 積層体の製造方法 |
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US (1) | US11512395B2 (ja) |
EP (1) | EP3835454A4 (ja) |
JP (1) | JPWO2020032074A1 (ja) |
KR (1) | KR102559148B1 (ja) |
CN (1) | CN112513329A (ja) |
TW (1) | TWI710465B (ja) |
WO (1) | WO2020032074A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5548167B2 (ja) | 1973-11-13 | 1980-12-04 | ||
JP2008538385A (ja) * | 2005-04-15 | 2008-10-23 | エスエヌティー・カンパニー・リミテッド | 金属マトリックス複合体形成方法およびこれを用いて製造されたコーティング層およびバルク |
JP2011208166A (ja) * | 2010-03-27 | 2011-10-20 | Iwate Industrial Research Center | 皮膜形成方法及び皮膜形成部材 |
JP2016183390A (ja) | 2015-03-26 | 2016-10-20 | 日立化成株式会社 | 金属多孔質体 |
WO2018135490A1 (ja) * | 2017-01-17 | 2018-07-26 | デンカ株式会社 | セラミックス回路基板の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5548167U (ja) | 1978-09-27 | 1980-03-29 | ||
US6468669B1 (en) * | 1999-05-03 | 2002-10-22 | General Electric Company | Article having turbulation and method of providing turbulation on an article |
KR20050081252A (ko) * | 2004-02-13 | 2005-08-18 | 고경현 | 다공성 금속 코팅 부재 및 저온 분사법을 이용한 그의제조 방법 |
JP5548167B2 (ja) | 2011-07-11 | 2014-07-16 | 日本発條株式会社 | 積層体及び積層体の製造方法 |
JP5941818B2 (ja) | 2012-10-10 | 2016-06-29 | 日本発條株式会社 | 成膜方法及び成膜装置 |
JP6109281B1 (ja) | 2015-11-26 | 2017-04-05 | 日本発條株式会社 | 積層体の製造方法 |
CN107236949A (zh) * | 2016-12-26 | 2017-10-10 | 北京理工大学 | 一种Al基含能活性金属药型罩的近净成型制备方法 |
CN110168140B (zh) * | 2017-01-17 | 2021-07-30 | 国立大学法人信州大学 | 陶瓷电路基板的制造方法 |
-
2019
- 2019-08-06 US US17/263,573 patent/US11512395B2/en active Active
- 2019-08-06 KR KR1020217002450A patent/KR102559148B1/ko active IP Right Grant
- 2019-08-06 WO PCT/JP2019/031006 patent/WO2020032074A1/ja unknown
- 2019-08-06 CN CN201980051612.4A patent/CN112513329A/zh active Pending
- 2019-08-06 JP JP2020535818A patent/JPWO2020032074A1/ja active Pending
- 2019-08-06 EP EP19848727.4A patent/EP3835454A4/en active Pending
- 2019-08-12 TW TW108128444A patent/TWI710465B/zh active
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JPS5548167B2 (ja) | 1973-11-13 | 1980-12-04 | ||
JP2008538385A (ja) * | 2005-04-15 | 2008-10-23 | エスエヌティー・カンパニー・リミテッド | 金属マトリックス複合体形成方法およびこれを用いて製造されたコーティング層およびバルク |
JP2011208166A (ja) * | 2010-03-27 | 2011-10-20 | Iwate Industrial Research Center | 皮膜形成方法及び皮膜形成部材 |
JP2016183390A (ja) | 2015-03-26 | 2016-10-20 | 日立化成株式会社 | 金属多孔質体 |
WO2018135490A1 (ja) * | 2017-01-17 | 2018-07-26 | デンカ株式会社 | セラミックス回路基板の製造方法 |
Non-Patent Citations (1)
Title |
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See also references of EP3835454A4 |
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Publication number | Publication date |
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US20210301404A1 (en) | 2021-09-30 |
KR20210024103A (ko) | 2021-03-04 |
EP3835454A4 (en) | 2022-04-27 |
JPWO2020032074A1 (ja) | 2021-08-26 |
KR102559148B1 (ko) | 2023-07-24 |
CN112513329A (zh) | 2021-03-16 |
TW202014308A (zh) | 2020-04-16 |
US11512395B2 (en) | 2022-11-29 |
EP3835454A1 (en) | 2021-06-16 |
TWI710465B (zh) | 2020-11-21 |
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