WO2020010706A1 - 曲面光伏组件及其制备方法 - Google Patents

曲面光伏组件及其制备方法 Download PDF

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Publication number
WO2020010706A1
WO2020010706A1 PCT/CN2018/107013 CN2018107013W WO2020010706A1 WO 2020010706 A1 WO2020010706 A1 WO 2020010706A1 CN 2018107013 W CN2018107013 W CN 2018107013W WO 2020010706 A1 WO2020010706 A1 WO 2020010706A1
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Prior art keywords
photovoltaic module
curved
manufacturing
layer
module according
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Ceased
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PCT/CN2018/107013
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English (en)
French (fr)
Inventor
霍艳寅
代凤玉
王运方
曹志峰
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Beijing Apollo Ding Rong Solar Technology Co Ltd
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Beijing Apollo Ding Rong Solar Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/804—Materials of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B29C48/0019—Combinations of extrusion moulding with other shaping operations combined with shaping by flattening, folding or bending
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
    • B29C48/154—Coating solid articles, i.e. non-hollow articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B29C48/21—Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
    • B29C53/02—Bending or folding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
    • B29C53/80—Component parts, details or accessories; Auxiliary operations
    • B29C53/84—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a non-planar shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/156—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is calendered and immediately laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
    • H10F77/147—Shapes of bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H10F77/1698—Thin semiconductor films on metallic or insulating substrates the metallic or insulating substrates being flexible
    • H10P95/90—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a photovoltaic module, in particular to a curved photovoltaic module and a preparation method thereof.
  • Green buildings have their rich connotations.
  • the rational and efficient use of clean energy, especially solar energy, is an important part of green buildings.
  • the emergence of solar thin film power generation buildings is a new design consciousness that transcends energy consciousness in the field of building design and plays an important role in human ecological environment.
  • the development of photovoltaic grid-connected and building integration marks the transition of solar thin-film power generation from remote areas to cities, from supplementary energy to alternative energy, and from human society to a sustainable energy system.
  • the solar thin film power generation curved glass tile application technology is a new feasible option in architecture.
  • the solar thin film power generation curved glass tile application technology uses solar energy, a huge renewable energy source, to generate electricity.
  • the solar thin film power generation curved glass tile can be installed on a building, and can also be used as a multifunctional building material to form an actual building. component.
  • Solar thin-film power generation curved glass tile products and installation systems pass through buildings, mainly by integrating the roof with solar thin-film power generation, so that the building itself uses green and environmentally-friendly solar resources to generate electricity.
  • the prior art discloses a modular curved photovoltaic tile.
  • the front plate and the back plate are made of glass and have a heavy mass.
  • the formation of a curved surface has a greater risk of cracking and a high cost.
  • the prior art discloses a method for preparing a curved flexible base roof solar thin film photovoltaic photovoltaic tile, which requires that each layer such as a solar chip and a back plate be curved, and then laminated. The process is complicated and the deformation process There is a risk of glass breakage and low yield.
  • a main object of the present invention is to provide a method for preparing a curved photovoltaic module, which includes: providing a back sheet layer, a flexible photovoltaic chip, and a light-transmitting layer, the material of the light-transmitting layer being a thermoplastic material; A photovoltaic chip and a light-transmitting layer form a planar photovoltaic component; and the planar photovoltaic component is formed into a curved body by hot pressing to obtain the curved photovoltaic component.
  • the planar photovoltaic module is extruded into the curved body during the hot pressing process by providing an extrusion die on the light-transmitting layer and / or the back sheet layer.
  • the extrusion die is configured to extrude the planar photovoltaic module to form an arched or wavy curved surface.
  • a plurality of mutually parallel extrusion dies are provided on the light-transmitting layer and the back plate layer, the extrusion dies on the light-transmitting layer and the extrusion dies on the back plate layer
  • the photovoltaic modules are alternately arranged along the side-length direction of the photovoltaic module.
  • the extrusion die is extruded to form a wavy curved surface composed of a plurality of arc-shaped bodies, and the centers of two adjacent arc-shaped bodies are respectively located on two sides of the curved body.
  • the arc of the arc body has a degree of 60 to 120 °.
  • the plurality of circular arc bodies includes a first circular arc body, a second circular arc body, and a third circular arc body connected in sequence;
  • the center of the arc is located on one side of the backplane layer, and the center of the arc of the second circular body is on one side of the light-transmitting layer; or, the center of the first circular body and the third circular body are The center of the circular arc is located on the side of the light-transmitting layer, and the center of the circular arc of the second arc body is on the side of the backing layer.
  • the hot pressing process is performed under a pressure with a vacuum degree of less than 100 Pa.
  • the hot pressing process is performed in a flexible sealed bag.
  • the hot pressing includes a preheating process, and a heating temperature of the preheating process is 110 to 130 ° C.
  • the preheating process includes maintaining the planar photovoltaic module at a temperature of 110 to 130 ° C. for 5 to 15 minutes.
  • the hot pressing includes a continuous heating process, an extrusion molding process, and a cooling process performed after the preheating process.
  • the temperature of the continuous heating process is 140 to 160 ° C. and the time is 30 to 50 minutes.
  • the temperature of the extrusion molding process is 140-160 ° C.
  • the temperature of the cooling process is 60 to 80 ° C. and the time is 5 to 10 minutes.
  • the thermoplastic material is selected from one or more of PC, PET, and PEN.
  • An embodiment of the present invention further provides a curved photovoltaic module, which is manufactured by any one of the methods described above.
  • a method for preparing a curved photovoltaic module according to an embodiment of the present invention can directly shape each layer of the photovoltaic module into a desired curved shape, avoiding the tedious steps of separately shaping and then combining the sheets, simplifying the process and reducing Cost and time.
  • FIG. 1 is a schematic structural diagram of a planar photovoltaic module according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a curved photovoltaic module according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a curved photovoltaic module according to another embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a manufacturing process of a curved photovoltaic module according to an embodiment of the present invention.
  • An embodiment of the present invention provides a method for manufacturing a curved photovoltaic module, which can directly shape each layer of the photovoltaic module into a desired curved shape, avoiding the complicated steps of separately shaping and then combining the sheets, which simplifies Process, reducing costs and saving time.
  • a manufacturing method includes: stacking a back sheet layer 11, a flexible photovoltaic chip 13, and a light-transmitting layer 15 in order from bottom to top to form a planar photovoltaic module 10; and passing the planar photovoltaic module 10 through A curved body is formed by hot pressing to obtain a curved photovoltaic module.
  • the back sheet layer 11 is attached to the first surface of the photovoltaic chip 13 through the first adhesive film layer 12, and the light-transmitting layer 15 is attached to the photovoltaic chip 13 opposite to the first surface through the second adhesive film layer 14. Second surface.
  • the material of the light-transmitting layer 15 is a transparent, wear-resistant thermoplastic material, such as a thermoplastic.
  • a thermoplastic include PC (polycarbonate), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), and the like. Because thermoplastics are lighter than glass, they are easier to mold, reducing the risk of cracking the surface layer during hot pressing, and improving the yield of photovoltaic modules. At the same time, because thermoplastics have excellent high light transmission, weather resistance, and flame resistance It makes the photovoltaic module products light in weight, good weather resistance, not easy to break, and long life.
  • the curved photovoltaic module is an arched curved body.
  • the curved photovoltaic module may be a wavy curved body, and the wavy curved body may be formed by staggering a plurality of circular arcs with opposite directions, and each circular arc includes, for example, In the laminated structure of the back sheet layer 11, the first adhesive film layer 12, the photovoltaic chip 13, the second adhesive film layer 14, and the surface layer 15, the centers of the two adjacent circular arc bodies are located on the upper and lower sides of the curved body, respectively.
  • the degree of the arc corresponding to the arc body is 60-120 °, such as 70 °, 80 °, 90 °, 100 °, and the like.
  • the wave-shaped photovoltaic module includes a circular arc body 31, a circular arc body 32, and a circular arc body 33 connected in sequence, and the circular arc body 31 and the circular arc center of the circular arc body 33. It is located below the back layer 11 (in the direction shown), and the center of the arc of the arc body 32 is located above the surface layer 15.
  • the arc-shaped body 32 is connected to the arc-shaped body 31 and the arc-shaped body 33 through two end surfaces (extending surfaces of the two ends of the arc), respectively.
  • the planar photovoltaic module is extruded into a curved body during the hot pressing process by providing an extrusion die on the surface layer 15 and / or the back sheet layer 11.
  • the planar photovoltaic module 10 can be formed with the surface layer 15 as an inner surface (upper surface) under the extrusion of the extrusion mold. ).
  • the back plate layer 11 is arched on the outer surface (lower surface).
  • the planar photovoltaic module 10 can be formed with the back sheet layer 11 as an inner surface (lower surface) and the surface layer 15 as an outer surface. (Top surface) arch.
  • the arcuate curved body may be a circular arc body, and a part or all of the curved surface of the arc body may be an arc surface.
  • the center of the arc of the arc body may be located on the side of the surface layer 15 or the back plate. Layer 11 side (as shown in Figure 2).
  • a plurality of parallel extrusion dies are provided on the surface layer 15 and the back plate layer 11.
  • the extrusion mold on the surface layer 15 and the extrusion mold on the back layer 11 are along the side of the photovoltaic module. The directions are arranged alternately.
  • the extrusion die may be a cylinder.
  • the cylinder is directly placed on the surface layer 15 or the silicone bag is placed on the surface layer 15.
  • the circular arc surface of the cylinder and the The surface layer 15 or the silicone bag keeps tangent; with the progress of the hot pressing process, each layer of the planar photovoltaic module softens, and the surface layer 15 changes from being tangent to the arc surface to gradually covering part of the arc surface, so that the planar photovoltaic module is squeezed. Press into a circular arc body.
  • the cylinder 20 may be a solid cylinder or a hollow cylinder, and is preferably made of stainless steel.
  • it may be a stainless steel cylinder or a cylindrical stainless steel mold.
  • one or more parallel extrusion dies can be provided on the light-transmitting layer 15 and the back plate layer 11 respectively, so that the planar photovoltaic module 10 is extruded into a wave shape during the hot pressing process.
  • a cylinder 20 may be provided on the surface layer 15, two cylinders may be provided on the back sheet layer 11, and the three cylinders may be arranged in parallel and arranged along the side length of the photovoltaic module.
  • the two cylinders on the layer 11 are respectively located on both sides of the cylinder 20 on the surface layer 15, that is, the projection of the cylinder 20 on the surface layer 15 is located between the projections of the two cylinders on the backplane layer 11.
  • a plurality of cylinders 20 arranged alternately adjacently up and down along the side length of the photovoltaic module may be provided on the surface layer 15 and the backing layer 11.
  • the hot-pressing process is performed under a negative pressure state, for example, under a pressure of less than 100 Pa.
  • the hot pressing process may be performed in a silicone bag 40, such as a silicone sealed bag.
  • a silicone bag 40 such as a silicone sealed bag.
  • the upper and lower layers of the silica gel bag 40 have a groove sealing structure, and an extraction valve is provided at the side, which can be connected to an external pipeline to exhaust the silica bag 40.
  • the planar photovoltaic module 10 is preheated and degassed before being heated and extruded.
  • the surface layer material such as the PC sheet itself, absorbs moisture, preheating and degassing can effectively remove the moisture inside the sheet. If the moisture is removed during the heating and extrusion process, bubbles and mist-like micropore groups will appear in the product after molding. Affects the appearance of photovoltaic modules.
  • the heating temperature in the pre-heating degassing stage is 110 to 130 ° C.
  • the time is 5 to 15 minutes, such as 10 minutes.
  • the hot-pressing process includes a preheating (steam removal) stage, a continuous heating stage, an extrusion molding stage, and a cooling stage.
  • the heating temperature for continuous heating is 140 to 160 ° C. and the time is 30 to 50 minutes.
  • the temperature in the extrusion molding stage is 140-160 ° C.
  • the temperature in the cooling stage is 60 to 80 ° C. and the time is 5 to 10 minutes.
  • the thickness of the surface layer 15 may be 1-10 mm, such as 2 mm, 5 mm, and 8 mm.
  • the back sheet layer 11 may be a PET sheet with an aluminum film.
  • the first adhesive film layer 12 and the second adhesive film layer 14 may be UV-resistant POE adhesive films, and the thickness may be 0.2-0.5 mm.
  • the photovoltaic chip 13 includes, but is not limited to, an amorphous silicon thin film chip.
  • the photovoltaic chip 13 may be a CIGS chip, a cadmium telluride chip, a gallium arsenide chip, or the like.
  • a PET board with an aluminum film is used as the back sheet layer 11.
  • the back sheet layer 11 is pasted on the lower surface of the flexible copper indium gallium selenium chip through a POE film, and a 2 mm thick PC board with an anti-UV coating is used as the light transmitting layer.
  • the surface layer 15 is pasted on the upper surface of the flexible copper indium gallium selenium chip through a 0.2mm-thick UV-resistant POE adhesive film to form a layer including “back plate layer 11 / first adhesive film layer 12 / photovoltaic chip 13 / second adhesive Membrane layer 14 / surface layer 15 "planar photovoltaic module.
  • the PET board, the flexible copper indium gallium selenium chip, and the PC board are all flat plates, so that the planar photovoltaic module 10 formed is substantially cubic.
  • the cube-shaped planar photovoltaic module 10 is placed in a silicone bag 40 which can be sealed by two layers of silica gel plates according to the positioning.
  • the upper and lower layers of the silica gel bag 40 have a groove sealing structure around the sides, and an exhaust valve is provided at the side. It can be connected to an external pipeline to evacuate the silicone bag 40.
  • the silicone bag 40 through the suction valve, so that the inside of the silicone bag 40 is in a negative pressure state. After the vacuum in the silicone bag 40 is less than 100 Pa, disconnect the suction valve and push the silicone bag 40 into the hot press. , And connected to the exhaust pipe inside the hot press. During the subsequent hot-pressing stage, the silica gel bag 40 is continuously subjected to air extraction treatment.
  • the hot press realizes the heating treatment of the planar photovoltaic module in the silicone bag 40 by controlling the electric heating and air blowing.
  • a smooth stainless steel cylinder is placed on the planar surface layer 15 of the planar photovoltaic module 10, and two smooth stainless steel cylinders are arranged under the planar backing layer 11 And for precise positioning, the above stainless steel cylinders are all arranged outside the silicone bag 40.
  • the planar photovoltaic module 10 is squeezed under the driving of hydraulic pressure or a motor drive, and the photovoltaic module is shaped according to a preset waveform.
  • two rows of upper and lower stainless steel molds can be set in the hot press. After precise positioning, the planar photovoltaic module is squeezed under the driving of hydraulic or motor drive, and the photovoltaic module is shaped according to a preset waveform.
  • planar photovoltaic module 10 is shaped according to a preset waveform.
  • a wave-shaped photovoltaic module composed of an arc body, in which the degree of each arc body is 60 °.
  • the specific preparation process of this embodiment is the same as that of embodiment 1, except that the temperature of the preheating and degassing stage is 120-130 ° C; the extrusion die used is a cylinder to obtain an arched photovoltaic module, and the arched shape is The arc shape is 120 °.
  • the specific preparation process of this embodiment is the same as that of Embodiment 1, except that the temperature in the preheating and steam removal stage is 90-100 ° C.
  • the specific preparation process of this embodiment is the same as that of Embodiment 1, except that the temperature in the continuous heating stage and the wave forming stage is 150-160 ° C.
  • the specific preparation process of this embodiment is the same as that of Embodiment 1, except that the temperature in the continuous heating stage and the wave forming stage is 180-190 ° C.
  • the specific preparation process of this embodiment is the same as that of Embodiment 1, except that the temperature during the cooling out stage is 70-80 ° C.
  • the specific preparation process of this embodiment is the same as that of Embodiment 1, except that cooling is not performed, and the molded component is directly discharged from the warehouse.
  • the curved photovoltaic modules prepared in Examples 1 to 9 were tested for photoelectric conversion efficiency under the conditions of STC, namely AM1.5, 1000W / m 2 , and 25 ° C. For specific results, see Table 1.
  • the temperature in the preheating and degassing stage of Example 3 is relatively low, and effective degassing cannot be performed, so that the obtained photovoltaic module has micropores visible to the naked eye, which affects the light transmittance of the photovoltaic module and further affects the photoelectric conversion efficiency of the photovoltaic module. .
  • Example 4 does not perform preheating and steam removal, and has more micropores than the photovoltaic module of Example 3, and the corresponding photoelectric conversion efficiency is lower.
  • Embodiment 6 The temperature in the continuous heating stage and the waveform forming stage of Embodiment 6 is too high, the light-transmitting layer and the adhesive film layer are easily deformed, and the adhesive film is easily peeled from other layers, which makes the reliability of the entire photovoltaic module worse; at the same time, the deformation will also be Affects the light transmittance of photovoltaic modules, which in turn affects the photoelectric conversion efficiency.
  • the photovoltaic module of Example 8 is not cooled, and the module after the molding is directly discharged from the warehouse, which will inject gas outside the warehouse, causing bubbles to easily form at the edges of the module, and on the one hand, the edges of the layers can be easily peeled off, which makes the overall reliability of the photovoltaic module. Worsening; on the other hand, it will affect the light transmittance of the module, and then affect the photoelectric conversion efficiency.
  • Embodiment 9 makes the photovoltaic module cool down faster, which easily causes deformation of the adhesive film, and then affects the photoelectric conversion efficiency of the photovoltaic module.
  • the method for preparing a curved photovoltaic module provided by the present invention can directly shape each layer of the photovoltaic module into a curved shape integrally, avoiding the tedious steps of separately shaping and then combining the sheets, simplifying the process, reducing costs, and saving time. And effectively improve the photovoltaic conversion efficiency of the photovoltaic module produced.

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Abstract

本发明提供了一种曲面光伏组件及其制备方法，该制备方法包括：层叠设置背板层、柔性光伏芯片和透光层，形成平面光伏组件；以及将所述平面光伏组件通过热压形成曲面体，制得所述曲面光伏组件。本发明一实施方式的曲面光伏组件的制备方法，可直接将光伏组件的各层一体定型，制成所需的曲面状，避免了分别定型、再进行合片的繁琐步骤，简化了工艺，降低了成本，节约了时间。

Description

曲面光伏组件及其制备方法 技术领域
本发明涉及光伏组件，具体为一种曲面光伏组件及其制备方法。
背景技术
目前在建筑中注入绿色元素(诸如太阳能)已成为建筑发展的趋势。绿色建筑有其丰富的内涵，洁净能源，尤其是太阳能的合理、高效利用是绿色建筑的重要内容。太阳能薄膜发电建筑的产生是建筑物设计领域超越能源意识的新型设计意识，对人类生态环境起着重要作用。光伏并网和建筑一体化的发展，标志着太阳能薄膜发电由边远地区向城市过渡，由补充能源向替代能源过渡，人类社会向可持续发展的能源体系过渡。
太阳能薄膜发电曲面玻璃瓦应用技术作为一种新型的技术，在建筑学上是一种新的可行的选择。太阳能薄膜发电曲面玻璃瓦应用技术是利用太阳光这种巨大的可再生能源来产生电力，其太阳能薄膜发电曲面玻璃瓦既可以安装在建筑物上，又可以作为多功能建筑材料构成实际的建筑物部件。
太阳能薄膜发电曲面玻璃瓦产品及安装系统即通过建筑物，主要是利用屋顶与太阳能薄膜发电集成起来，使建筑物自身利用绿色、环保的太阳能资源产生电力。
有现有技术公开了模块化曲面光伏瓦，前板和背板均为玻璃材质，质量重，形成曲面有较大的破裂风险，成本高。还有现有技术公开了一种曲面柔性基屋顶太阳能薄膜发电光伏瓦的制备方法，需将太阳能芯片、背板等各层分别制成曲面状，再进行合片，工艺较为复杂，变形过程中存在玻璃破裂风险，成品率低。
发明内容
本发明的一个主要目的在于提供一种曲面光伏组件的制备方法，包括：提供背板层、柔性光伏芯片和透光层，所述透光层的材料是热塑性材料；层叠敷设背板层、柔性光伏芯片和透光层，形成平面光伏组件；以及将所述平面光伏组件通过热压形成曲面体，制得所述曲面光伏组件。
根据本发明一实施方式，通过在所述透光层和/或所述背板层设置挤压模具，使得所述平面光伏组件在热压过程中被挤压成所述曲面体。
根据本发明一实施方式，所述挤压模具设置为使所述平面光伏组件被挤压形成拱形或 波浪状曲面。
根据本发明一实施方式，在所述透光层和所述背板层设置多个相互平行的挤压模具，所述透光层上的挤压模具与所述背板层上的挤压模具沿所述光伏组件边长方向交替排布。
根据本发明一实施方式，所述挤压模具挤压形成由多个圆弧体组成的波浪状曲面，两相邻所述圆弧体的圆心分别位于所述曲面体的两侧。
根据本发明一实施方式，所述圆弧体的圆弧的度数为60～120°。
根据本发明一实施方式，所述多个圆弧体包括依次相连的第一圆弧体、第二圆弧体和第三圆弧体；所述第一圆弧体和第三圆弧体的圆弧的圆心位于所述背板层一侧，所述第二圆弧体的圆弧的圆心位于所述透光层一侧；或者，所述第一圆弧体和第三圆弧体的圆弧的圆心位于所述透光层一侧，所述第二圆弧体的圆弧的圆心位于所述背板层一侧。
根据本发明一实施方式，所述热压工艺在真空度小于100帕的压强下进行。
根据本发明一实施方式，所述热压处理在柔性密封袋中进行。
根据本发明一实施方式，所述热压包括预热工艺，所述预热工艺的加热温度为110～130℃。
根据本发明一实施方式，所述预热工艺包括将所述平面光伏组件在110～130℃的温度下保持5～15分钟。
根据本发明一实施方式，所述热压包括在所述预热工艺之后进行的持续加热工艺、挤压成型工艺和冷却工艺。
根据本发明一实施方式，所述持续加热工艺的温度为140～160℃，时间为30～50分钟。
根据本发明一实施方式，所述挤压成型工艺的温度为140～160℃。
根据本发明一实施方式，所述冷却工艺的温度为60～80℃，时间为5～10分钟。
根据本发明一实施方式，所述热塑性材料选自PC、PET和PEN中的一种或几种。
本发明一实施方式进一步提供了一种曲面光伏组件，由上述任一方法制得。
本发明一实施方式的曲面光伏组件的制备方法，可直接将光伏组件的各层一体定型，制成所需的曲面状，避免了分别定型、再进行合片的繁琐步骤，简化了工艺，降低了成本，节约了时间。
附图说明
通过结合附图考虑以下对本发明的优选实施例的详细说明，本发明的各种目标、特征和优点将变得更加显而易见。附图仅为本发明的示范性图解，并非一定是按比例绘制。在 附图中，同样的附图标记始终表示相同或类似的部件。其中：
图1为本发明一实施方式的平面光伏组件的结构示意图；
图2为本发明一实施方式的曲面光伏组件的结构示意图；
图3为本发明另一实施方式的曲面光伏组件的结构示意图；
图4为本发明一实施方式的曲面光伏组件的制备流程示意图。
具体实施方式
体现本发明特征与优点的典型实施方式将在以下的说明中详细叙述。应理解的是本发明能够在不同的实施方式上具有各种的变化，其皆不脱离本发明的范围，且其中的说明及图示在本质上是当作说明之用，而非用以限制本发明。
本发明一实施方式提供了一种曲面光伏组件的制备方法，可直接将光伏组件的各层一体定型，制成所需的曲面状，避免了分别定型、再进行合片的繁琐步骤，简化了工艺，降低了成本，节约了时间。
参照图1至4，本发明一实施方式的制备方法包括，由下至上依次叠置背板层11、柔性光伏芯片13和透光层15，形成平面光伏组件10；以及将平面光伏组件10通过热压形成曲面体，制得曲面光伏组件。
于一实施方式中，背板层11通过第一胶膜层12粘贴于光伏芯片13的第一表面，透光层15通过第二胶膜层14粘贴于光伏芯片13的与第一表面相对设置的第二表面。
于一实施方式中，透光层15的材质为透明、耐磨的热塑性材料，例如热塑性塑料。热塑性塑料具体可以为PC(聚碳酸酯)、PET(聚对苯二甲酸类塑料)、PEN(聚萘二甲酸乙二醇酯)等。由于热塑性塑料较玻璃质量轻，更易于成型，降低了热压过程中面层破裂的风险，提高了光伏组件生产的良率；同时，由于热塑性塑料具有优异的高透光性、耐候性、耐燃性，使得生产出的光伏组件产品质量轻、耐候性好、不易破损、寿命长。
于一实施方式中，如图2所示，曲面光伏组件为拱形曲面体。
于一实施方式中，如图3所示，曲面光伏组件可为波浪状的曲面体，波浪状的曲面体可由方向相反的多个圆弧体交错排布形成，每一圆弧体均包括例如背板层11、第一胶膜层12、光伏芯片13、第二胶膜层14、面层15的层叠结构，两相邻圆弧体的圆心分别位于曲面体的上、下两侧。
于一实施方式中，圆弧体所对应的圆弧的度数为60～120°，例如70°、80°、90°、100°等。
于一实施方式中，如图3所示，波浪状的光伏组件包括依次相连的圆弧体31、圆弧体 32和圆弧体33，圆弧体31和圆弧体33的圆弧的圆心位于背板层11的下方(按照图示方向)，圆弧体32的圆弧的圆心位于面层15的上方。圆弧体32分别通过两个端面(圆弧两端点的延伸面)与圆弧体31、圆弧体33相连。
于一实施方式中，通过在面层15和/或背板层11设置挤压模具，使得平面光伏组件在热压过程中被挤压成曲面体。
于一实施方式中，通过在例如面层15上设置挤压模具，并进行挤压处理，可使平面光伏组件10在挤压模具的挤压作用下形成以面层15为内表面(上表面)、背板层11为外表面(下表面)的拱形。
于一实施方式中，通过在背板层11上设置挤压模具，并进行挤压处理，可使平面光伏组件10形成以背板层11为内表面(下表面)、面层15为外表面(上表面)的拱形。
于一实施方式中，拱形曲面体可以是圆弧体，圆弧体的部分曲面或全部曲面为圆弧面，圆弧体圆弧的圆心可位于面层15一侧，也可位于背板层11一侧(如图2所示)。
于一实施方式中，在面层15上和背板层11下设置多个相互平行的挤压模具，面层15上的挤压模具与背板层11上的挤压模具沿光伏组件边长方向交替排布。
于一实施方式中，挤压模具可以为圆柱体，例如热压处理开始前，将圆柱体直接置于面层15上，或者通过硅胶袋置于面层15上，圆柱体的圆弧面与面层15或者硅胶袋保持相切；随着热压工艺的进行，平面光伏组件各层软化，面层15由与圆弧面相切变为逐渐包覆部分圆弧面，使得平面光伏组件被挤压为圆弧体。
于一实施方式中，圆柱体20，可以是实心的圆柱，也可以是空心的圆筒，优选为不锈钢材质，例如可以是不锈钢圆柱，或者圆柱状的不锈钢模具。
于一实施方式中，可在透光层15和背板层11上分别设置一个或多个相互平行的挤压模具，使得平面光伏组件10在热压过程中被挤压成波浪状。例如，参见图4，可在面层15上设置一个圆柱体20，在背板层11上设置两个圆柱体，三个圆柱体平行设置，并沿光伏组件的边长方向排布，背板层11上的两个圆柱体分别位于面层15上圆柱体20的两侧，即，面层15上圆柱体20的投影位于背板层11上两圆柱体投影之间。使得挤压处理后，所得到的圆弧体31、圆弧体32、圆弧体33整体呈波浪状分布。
于一实施方式中，可根据所要制备的光伏组件的形状，在面层15上、背板层11上设置多个沿光伏组件边长方向上下交替相邻排布的圆柱体20。
于一实施方式中，热压工艺在负压状态，例如真空度小于100帕的压强下进行。
于一实施方式中，热压过程可在硅胶袋40，例如硅胶密封袋中进行。硅胶袋40的上 下两层硅胶板具有凹槽密封结构，边部设有抽气阀门，可与外部管路连接，对硅胶袋40进行抽气。
于一实施方式中，在对平面光伏组件10加热挤压前进行预热除汽。由于面层材料，例如PC板材本身会吸收水汽，预热除汽可以有效去除板材内部水汽，如果加热挤压过程中再除去水分，成型后制品就会出现气泡和雾状的微孔群，从而影响光伏组件的外观。
于一实施方式中，预热除汽阶段的加热温度为110～130℃，时间为5～15分钟，例如10分钟。
于一实施方式中，热压工艺包括预热(除汽)阶段、持续加热阶段、挤压成型阶段和冷却阶段。
于一实施方式中，持续加热的加热温度为140～160℃、时间为30～50分钟。
于一实施方式中，挤压成型阶段的温度为140～160℃。
于一实施方式中，冷却阶段的温度为60～80℃、时间为5～10分钟。
于一实施方式中，面层15的厚度可以为1～10mm，例如2mm、5mm、8mm。
于一实施方式中，背板层11可以是带有铝膜的PET板。
于一实施方式中，第一胶膜层12、第二胶膜层14可以为耐紫外POE胶膜，厚度可以为0.2～0.5mm。
于一实施方式中，光伏芯片13包括但不限于非晶硅薄膜芯片，例如可以为CIGS芯片、碲化镉芯片、砷化镓芯片等。
以下，通过具体实施例对本发明一实施方式的曲面光伏组件的制备方法进行进一步说明。
实施例1
平面光伏组件制备
以带铝膜的PET板作为背板层11，通过POE胶膜将背板层11粘贴于柔性铜铟镓硒芯片的下表面，以带抗紫外涂层的2mm厚的PC板作为透光层15，通过厚度0.2mm的耐紫外POE胶膜将面层15粘贴于柔性铜铟镓硒芯片的上表面，形成包含“背板层11/第一胶膜层12/光伏芯片13/第二胶膜层14/面层15”的平面光伏组件。
其中，PET板、柔性铜铟镓硒芯片和PC板均为平板，使得所形成的平面光伏组件10大致呈立方体状。
准备阶段
将立方体状的平面光伏组件10按照定位放置在一个由可以上下两层硅胶板密封的硅胶袋40内，硅胶袋40的上下两层硅胶板四周具有凹槽密封结构，边部设有抽气阀门，可与外部管路连接，对硅胶袋40进行抽气。
通过抽气阀门对硅胶袋40进行抽气，使硅胶袋40内处于负压状态，待硅胶袋40内真空度小于100帕后，断开抽气阀门，将硅胶袋40推入热压机内部，并与热压机内部的抽气管路连接。在之后的整个热压阶段，持续对硅胶袋40进行抽气处理。
其中，热压机通过控制电加热和鼓风的方式，实现对硅胶袋40内平面光伏组件的加热处理。
热压阶段
1)预热除汽阶段
将热压机内部温度保持在110～120℃范围内，持续时间为10分钟。
2)持续加热阶段
将热压机内部温度上升至140～150℃范围内，保持30～50分钟。期间，第一胶膜层12、第二胶膜层14发生热熔，面层15软化，使得平面光伏组件10各层得到有效粘接。
3)波形成型阶段
保持温度于140～150℃范围内，在平面光伏组件10的平面状的面层15上放置一根表面光滑的不锈钢圆柱，在平面状的背板层11之下设置两根表面光滑的不锈钢圆柱并进行精准定位，上述不锈钢圆柱均设置于硅胶袋40的外部。在液压或电机传动带动下对平面光伏组件10进行挤压处理，光伏组件按照预设波形成型。
或者，也可以在热压机内设置上下两排不锈钢模具，精确定位后，在液压或电机传动带动下对平面光伏组件进行挤压处理，光伏组件按照预设波形成型。
还可以使用上述两种方式进行组合，平面光伏组件10按照预设波形成型。
4)冷却出仓阶段
将热压机内部温度降至60～70℃范围，保持5～10分钟。温度低于60℃后，断开硅胶袋40的抽气阀门，将硅胶袋40从热压机内推出，冷却到室温后，打开硅胶袋40，波形光伏组件热压处理完成，得到由三段圆弧体组成的波浪状的光伏组件，其中每段圆弧体的度数均为60°。
安装接线盒、功率测试
将热压完成的波形光伏组件经过外观检测后安装接线盒，功率测试，绝缘测试后包装 存储。
实施例2
本实施例的具体制备过程同实施例1，区别在于：预热除汽阶段的温度为120～130℃；所使用的挤压模具为一个圆柱体，得到拱形的光伏组件，其中拱形呈圆弧状，圆弧的度数均为120°。
实施例3
本实施例的具体制备过程同实施例1，区别在于：预热除汽阶段的温度为90～100℃。
实施例4
本实施例的具体制备过程同实施例1，区别在于：没有进行预热除汽，直接进入持续加热阶段。
实施例5
本实施例的具体制备过程同实施例1，区别在于：持续加热阶段、波形成型阶段的温度为150～160℃。
实施例6
本实施例的具体制备过程同实施例1，区别在于：持续加热阶段、波形成型阶段的温度为180～190℃。
实施例7
本实施例的具体制备过程同实施例1，区别在于：冷却出仓阶段的温度为70～80℃。
实施例8
本实施例的具体制备过程同实施例1，区别在于：没有进行冷却，成型后的组件直接出仓。
实施例9
本实施例的具体制备过程同实施例1，区别在于：冷却出仓阶段的温度为40～50℃。
将实施例1至9所制得的曲面光伏组件在STC，即AM1.5，1000W/m 2，25℃条件下进行光电转换效率的测试，具体结果参见表1。
表1
Figure PCTCN2018107013-appb-000001
从表1的结果可以看出，实施例1、2、5、7的光电转换效率优于实施例3、4、6、8、9。这是由于：
实施例3的预热除汽阶段的温度较低，不能进行有效除汽，使得所制得的光伏组件具有肉眼可见的微孔，影响光伏组件的透光率，进而影响光伏组件的光电转化效率。
实施例4没有进行预热除汽，较实施例3的光伏组件具有更多的微孔，相应的光电转化效率更低。
实施例6的持续加热阶段、波形成型阶段的温度过高，透光层、胶膜层易发生形变，胶膜易于与其他层剥离，使得整个光伏组件的可靠性变差；同时，形变也会影响光伏组件的透光率，进而影响光电转化效率。
实施例8的光伏组件没有进行冷却，成型后的组件直接出仓，会使仓外气体倒灌，导致组件边缘易形成气泡，一方面会使各层的边缘易于剥离，使得光伏组件整体的可靠性变差；另一方面也会影响组件的透光率，进而影响光电转化效率。
实施例9的冷却出仓阶段的温度较低，使得光伏组件降温较快，易引起胶膜变形，进而影响光伏组件的光电转化效率。
本发明提供的曲面光伏组件的制备方法，可直接将光伏组件的各层一体定型成曲面状，避免了分别定型、再进行合片的繁琐步骤，简化了工艺，降低了成本，节约了时间，并有效提高了所制得的光伏组件的光电转化效率。
除非特别限定，本发明所用术语均为本领域技术人员通常理解的含义。
本发明所描述的实施方式仅出于示例性目的，并非用以限制本发明的保护范围，本领域技术人员可在本发明的范围内作出各种其他替换、改变和改进，因而，本发明不限于上述实施方式，而仅由权利要求限定。

Claims (17)

  1. 一种曲面光伏组件的制备方法，包括：
    提供背板层、柔性光伏芯片和透光层，所述透光层的材料是热塑性材料；
    层叠敷设背板层、柔性光伏芯片和透光层，形成平面光伏组件；以及
    将所述平面光伏组件通过热压形成曲面体，制得所述曲面光伏组件。
  2. 根据权利要求1所述的曲面光伏组件的制备方法，其中，在热压形成所述曲面体的步骤之前，在所述透光层和/或所述背板层设置挤压模具，以使所述平面光伏组件在热压过程中被挤压成所述曲面体。
  3. 根据权利要求2所述的曲面光伏组件的制备方法，其中，所述挤压模具设置为使所述平面光伏组件被挤压形成拱形或波浪状曲面。
  4. 根据权利要求3所述的曲面光伏组件的制备方法，其中，在所述透光层和所述背板层设置多个相互平行的挤压模具，所述透光层上的挤压模具与所述背板层上的挤压模具沿所述光伏组件边长方向交替排布。
  5. 根据权利要求4所述的曲面光伏组件的制备方法，其中，所述平面光伏组件在所述挤压模具的挤压作用下形成由多个圆弧体组成的波浪状曲面体，两相邻所述圆弧体的圆心分别位于所述曲面体的两侧。
  6. 根据权利要求5所述的曲面光伏组件的制备方法，其中所述圆弧体的圆弧的度数为60～120°。
  7. 根据权利要求6所述的曲面光伏组件的制备方法，其中所述多个圆弧体包括依次相连的第一圆弧体、第二圆弧体和第三圆弧体；所述第一圆弧体和第三圆弧体的圆弧的圆心位于所述背板层一侧，所述第二圆弧体的圆弧的圆心位于所述透光层一侧；或者
    所述第一圆弧体和第三圆弧体的圆弧的圆心位于所述透光层一侧，所述第二圆弧体的圆弧的圆心位于所述背板层一侧。
  8. 根据权利要求1所述的曲面光伏组件的制备方法，其中所述热压工艺在真空度小于100帕的压强下进行。
  9. 根据权利要求8所述的曲面光伏组件的制备方法，其中所述热压处理在柔性密封袋中进行。
  10. 根据权利要求1所述的曲面光伏组件的制备方法，其中所述热压包括预热工艺，所述预热工艺的加热温度为110～130℃。
  11. 根据权利要求10所述的曲面光伏组件的制备方法，其中所述预热工艺包括将所 述平面光伏组件在110～130℃的温度下保持5～15分钟。
  12. 根据权利要求10所述的曲面光伏组件的制备方法，其中所述热压包括在所述预热工艺之后进行的持续加热工艺、挤压成型工艺和冷却工艺。
  13. 根据权利要求12所述的曲面光伏组件的制备方法，其中所述持续加热工艺的温度为140～160℃，时间为30～50分钟。
  14. 根据权利要求12所述的曲面光伏组件的制备方法，其中所述挤压成型工艺的温度为140～160℃。
  15. 根据权利要求12所述的曲面光伏组件的制备方法，其中所述冷却工艺的温度为60～80℃，时间为5～10分钟。
  16. 根据权利要求1所述的曲面光伏组件的制备方法，其中所述热塑性材料选自PC、PET和PEN中的一种或几种。
  17. 一种曲面光伏组件，由权利要求1至16所述任一项方法制得。
PCT/CN2018/107013 2018-07-12 2018-09-21 曲面光伏组件及其制备方法 Ceased WO2020010706A1 (zh)

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