WO2020002074A1 - Light converting device with ceramic protection layer - Google Patents

Light converting device with ceramic protection layer Download PDF

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Publication number
WO2020002074A1
WO2020002074A1 PCT/EP2019/066157 EP2019066157W WO2020002074A1 WO 2020002074 A1 WO2020002074 A1 WO 2020002074A1 EP 2019066157 W EP2019066157 W EP 2019066157W WO 2020002074 A1 WO2020002074 A1 WO 2020002074A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
converting device
laser
substrate
converter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/066157
Other languages
French (fr)
Inventor
Claudia Goldmann
Rainald GIERTH
Ulrich Hechtfischer
Josef Schug
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds Holding BV
Original Assignee
Lumileds Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumileds Holding BV filed Critical Lumileds Holding BV
Publication of WO2020002074A1 publication Critical patent/WO2020002074A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/37—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors characterised by their material, surface treatment or coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/16—Laser light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0087—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials

Definitions

  • the invention relates to a light converting device with a ceramic protection layer, a laser-based light source comprising such a light converting device and a vehicle headlight comprising such a laser-based light source.
  • a light converting device In high luminance light sources often a light converting device is used that is ex cited by e.g. blue light emitted by a laser.
  • a phosphor of the light converting device is cou pled to a heatsink e.g. by means of a layer of glue or solder which is provided between the heatsink and the phosphor.
  • the phos phor may be sandwiched in-between heat dissipating layers with a higher thermal conductiv ity than the phosphor, the heat dissipating layers conducting the heat generated in the phos phor away from the phosphor.
  • the high- intensity especially of blue laser light and the high temperature caused by the light conversion by means of the phosphor may cause reliability issues. Further more, reliable heat dissipation e.g. by means of a substrate in combination with high optical efficiency (low absorption) is an issue.
  • the light con verting device comprises a light converter.
  • the light converter is adapted to convert laser light to converted light.
  • a peak emission wavelength of the converted light is in a longer wave length range than a laser peak emission wavelength of the laser light.
  • the light converter comprises a light entrance surface, a bonding surface opposite to the light entrance surface and at least one side surface.
  • the bonding surface is mechanically and thermally coupled to a substrate functioning as a heatsink for the light converter.
  • the light converting device further comprises a reflective structure attached to or part of the substrate.
  • the reflective structure comprises at least one reflective metal surface arranged to reflect laser light and converted light.
  • the reflective structure is arranged on the side of the substrate facing the light con verter.
  • the light converting device further comprises a translucent ceramic protection layer.
  • the ceramic protection layer is arranged between the reflective structure and the light con verter such that the reliability of the reflective structure is increased.
  • the ceramic protection layer may inhibit mechanical damage of the reflective structure.
  • the ceramic protection layer may further inhibit chemical reactions (e.g. corrosion) of the metallic surface comprised by the reflective structure.
  • the ceramic protection layer may be arranged to scatter the laser light and converted light.
  • the ceramic protection layer may, for example, comprise scattering structures (e.g. particles or pores) with a size between 10 nm and 10 pm (size of scattering structures and layer thickness of the ceramic protection layer are adapted such that the ce ramic protection layer avoids direct exposure of the reflective structure).
  • the reflectivity of the reflective structure is preferably more than 90%, more preferably more than 95% and most preferably more than 98% in the respective wavelength range (wavelength range of laser light and converted light).
  • the reflective structure may be specular reflective especially in case of sufficient scattering of the laser and converted light already been provided by means of the light converter and/or the ceramic protection layer.
  • The, for example, blue laser light and the converted light may alternatively or in addition be diffusely reflected by means of the reflec tive structure or a combination of the reflective structure and corresponding scattering ele ments within, for example, the light converter or the ceramic protection layer.
  • the light converter may, for example, be a thin (e.g. between 25 pm and 200 pm thick) rectangular or circular plate (maximum lateral extension e.g. less than 5 cm in scanning applications).
  • the substrate is arranged to dissipate heat, thus functions as a heatsink.
  • the ceramic protection layer may cover the reflective structure.
  • the ceramic pro tection layer may, for example, be deposited or laminated on the metal surface to avoid degra dation of the metal surface.
  • the ceramic protection layer may, for example, be provided by means of plasma deposition, sol-gel processing or any other suitable deposition or lamination method.
  • the ceramic protection layer may comprise at least one ceramic material selected out of the group of aluminum oxide, magnesium oxide, titanium oxide, and zirconium oxide, preferably AI2O3 or Ti0 2 .
  • the material and/or the thickness of the ceramic material is chosen such that the ceramic protection layer does not substantially absorb relevant parts of the laser light and the converted light.
  • the absorption of laser light and converted light passing the ce- ramic protection layer is preferably less than 3%, more preferably less than 1% and most pref- erably less than 0.5%.
  • the substrate may, for example, comprise or consist of a metal like, for example, aluminum, copper, or steel.
  • a surface of the metal may comprise at least one reflective metal surface forming the metal surface of the reflective structure.
  • the metal surface may, for ex- ample, be a polished surface of the metal.
  • the ceramic protection layer covers in this embodi- ment the polished surface as described above.
  • the reflective structure may alternatively comprise at least one metal layer depos- ited on a surface of the substrate facing the light converter.
  • the metal layer may, for example, be a thin aluminum or silver layer.
  • the ceramic protection layer covers in this embodiment the metal layer attached to the substrate.
  • the thickness of the ceramic protection layer is less than 50 pm and preferably less than 10 pm.
  • the thickness is chosen such that optical performance and thermal conduc- tivity to the substrate including the ceramic layer are sufficient to enable a highly efficient and reliable light converting device.
  • the light converter may be mechanically and thermally coupled to the substrate by, for example, a thin bonding layer (thickness preferably less than 3 pm, more preferably less than 1 pm) arranged between the bonding surface of the light converter and the ceramic protection layer.
  • the bonding layer may, for example, be silicone glue dispensed on at least a part of the surface of the ceramic protection layer.
  • the bonding layer may alternatively be a thin layer of glass melting at low temperatures (e.g. melting temperature being be- tween 200°C and 300°C).
  • the bonding layer is preferably highly transparent in order to avoid optical losses and corresponding heating of the bonding layer and the light converter. The lim ited thickness of the bonding layer may limit heating of the bonding layer.
  • the light converting device may further comprise a reflective side coating cover ing the at least one side surface of the light converter.
  • the reflective side coating is arranged to reflect laser light and converted light such that optical losses via the at least one side sur face of the light converter may be reduced.
  • the reflective side coating may, for example, be a white coating.
  • the reflective side coating may, for example, comprise an optical silicone filled with e.g. titanium oxide particles.
  • the substrate may according to an alternative embodiment comprise a slot.
  • the slot is arranged to host the light converter.
  • the light converter is positioned in the slot such that the bonding surface faces an inner bottom surface of the slot.
  • the reflective structure is in this embodiment arranged at the bottom surface and optionally at the side surface of the slot such that laser light and converted light can be reflected by means of the reflective structure.
  • the reflective structure is covered by the ceramic protection layer.
  • a depth of the slot may be at least 80% or, more preferably, may be the same as a thickness of the light converter perpen dicular to the bonding surface.
  • the slot (or cavity) is slightly larger than the light converter.
  • the light converter may be bonded to the reflective structure by means of a bonding layer.
  • the bonding layer may, for example, comprise glue like silicone glue between the reflective structure and the light converter which is hardened by curing.
  • the configuration of the bond- ing layer may be similar to the one as described above.
  • a laser-based light source comprises a light converting device as described above and at least one la ser which is adapted to emit the laser light.
  • the laser-based light source may comprise two, three, four or more lasers (e.g. in the form of an array) emitting, for example, blue laser light.
  • a vehicle headlight comprises at least one laser-based light source as described above.
  • the vehicle headlight may comprise two, three, four or more laser-based light sources as described above.
  • the light converter may in this case comprise or consist of a yellow phosphor garnet (e.g. Y (3- o. 4) Gdo. 4 Al 5 0i 2 :Ce).
  • a mixture of blue laser light and yellow converted light may be used to generate white light. Around 21% of the blue laser light may be reflected, and the remaining blue laser light may be converted to yellow light. This enables a ratio of 26% blue laser light and 74% yellow converted light in the mixed light emitted by the laser-based light source by taking into account, for example, Stokes losses in the phosphor.
  • Fig. 1 shows a principal sketch of a first embodiment of a laser-based light source with a light converting device.
  • Fig. 2 shows a principal sketch of a second embodiment of a laser-based light source with a light converting device.
  • Fig. 3 shows a principal sketch of a third embodiment of a laser-based light source with a light converting device.
  • Fig. 1 shows a principal sketch of a first embodiment of a laser-based light source 100 comprising a light converting device 130.
  • a light converter 134 like a rectangular phosphor platelet is glued by means of a bonding layer 133 to a substrate 131 which acts as a heatsink.
  • the surface of the substrate 131 (being e.g. an aluminum substrate) the rectangular phosphor platelet is mounted on is highly reflective (obtained e.g. by polishing) and forms a reflective structure 137.
  • a ceramic protection layer 138 consisting of AI2O3 with a layer thick ness of around 20 pm is deposited on top of the reflective structure 137 such that the ceramic protection layer is arranged between the bonding layer 133 and the substrate 131.
  • a reflective side coating 132 covers the side surface or surfaces of the light converter 134.
  • a laser 110 is arranged to emit blue laser light 10 which enters the light converter 134 (yellow phosphor garnet) via a light entrance surface of the light con verter 134 which comprises an anti-reflective coating (not shown) avoiding reflection of light in the wavelength range of the laser light 10 and optionally the converted light 20.
  • a part of the blue laser light 10 is converted to yellow converted light 20.
  • a mixture of reflected blue laser light 11 which e.g. is reflected at the reflective structure 137 and converted light 20 is emitted via the light entrance surface.
  • the laser-based light source 100 is arranged to emit white light which comprises the mixture of reflected laser light 11 and converted light 20.
  • Fig. 2 shows a principal sketch of a second embodiment of a laser-based light source 100 with a light converting device 130.
  • the light converting device 130 comprises a substrate 131 which acts as a heatsink.
  • the substrate 131 further comprises a reflective struc- ture 137.
  • the reflective structure 137 comprises a reflective metal layer (e.g. silver layer) which is deposited on the surface of the substrate 131 on which a light converter 134 is mounted.
  • the reflective metal layer is protected by means of a ceramic protection layer 138 (e.g. 10 pm aluminum oxide or titanium oxide) which is deposited on top of the reflective metal layer.
  • the light converter 134 is clamped by means of a reflective side coating 132 on the ceramic protection layer 138 such that the ceramic protection layer 138 is arranged be- tween the light converter 134 and the reflective structure 137.
  • the light converter 134 may alternatively be bonded to the ceramic protection layer 138 by means of, for example, a thermocompression bonding or ultrasonic bonding without any adhesive or bonding layer or by means of a bonding layer as described above.
  • Fig. 3 shows a principal sketch of a third embodiment of a laser-based light source 100 with a light converting device 130.
  • the substrate 131 consists in this embodiment of a block of metal in which a cavity or slot is provided (e.g. by deep-drawing). Other meth ods to shape the metal are well known to those skilled in the art.
  • the metal may be in this case aluminum.
  • the bottom of the cavity and the sidewalls are polished surfaces forming the re flective structure 137.
  • the bottom of the cavity, the side walls and the top surface of the block surrounding the cavity are covered by a ceramic protection layer 138 (e.g. 10 pm AI2O3 with T1O2 scattering particles).
  • a small droplet of glue is dispensed in the cavity and the light con verter 134 (e.g. platelet of 500 c 500 pm 2 ) which is slightly smaller than the cavity is placed on top of the glue. Thickness of the platelet (e.g. 50-100 pm) and depth of the cavity are prefera bly arranged such that the light entrance surface of the light converter 134 and the surround ing surface of the substrate 131 are on the same level. Small deviations may be acceptable. Both steps may be carried out in a dispense/p&p tool as typically used in the LED industry equipped with an ultra-high precision dispense valve. Afterwards the glue is cured, which typ ically implies an oven batch process.
  • the light con verter 134 e.g. platelet of 500 c 500 pm 2
  • Thickness of the platelet and depth of the cavity are prefera bly arranged such that the light entrance surface of the light converter 134 and the surround ing surface of the substrate 131 are on the same level. Small deviations may be

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Lasers (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Light converting device (130) comprising: - a substrate (131) functioning as a heatsink, - a light converter (134) adapted to convert laser light (10) to converted light (20) having a longer wavelength than the laser light (10), wherein the light converter (134) comprises a light entrance surface, a bonding surface opposite to the light entrance surface and at least one side surface, wherein the bonding surface is mechanically and thermally coupled to the substrate (131), - a reflective structure (137) attached to or part of the substrate (131) and comprising at least one reflective metal surface arranged to reflect laser light (10) and converted light (20), wherein the reflective structure (137) is arranged on the side of the substrate (131) facing the light converter (134), and - a translucent ceramic protection layer (138), arranged between the reflective structure (137) and the light converter (134), and having a thickness of less than 50 m icrometres.

Description

LIGHT CONVERTING DEVICE WITH CERAMIC PROTECTION LAYER
FIELD OF THE INVENTION
The invention relates to a light converting device with a ceramic protection layer, a laser-based light source comprising such a light converting device and a vehicle headlight comprising such a laser-based light source.
BACKGROUND OF THE INVENTION
In high luminance light sources often a light converting device is used that is ex cited by e.g. blue light emitted by a laser. A phosphor of the light converting device is cou pled to a heatsink e.g. by means of a layer of glue or solder which is provided between the heatsink and the phosphor. Alternatively, as e.g. disclosed in US20170137706A1, the phos phor may be sandwiched in-between heat dissipating layers with a higher thermal conductiv ity than the phosphor, the heat dissipating layers conducting the heat generated in the phos phor away from the phosphor.
Still, the high- intensity especially of blue laser light and the high temperature caused by the light conversion by means of the phosphor may cause reliability issues. Further more, reliable heat dissipation e.g. by means of a substrate in combination with high optical efficiency (low absorption) is an issue.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an improved light converting de vice.
According to a first aspect a light converting device is provided. The light con verting device comprises a light converter. The light converter is adapted to convert laser light to converted light. A peak emission wavelength of the converted light is in a longer wave length range than a laser peak emission wavelength of the laser light. The light converter comprises a light entrance surface, a bonding surface opposite to the light entrance surface and at least one side surface. The bonding surface is mechanically and thermally coupled to a substrate functioning as a heatsink for the light converter. The light converting device further comprises a reflective structure attached to or part of the substrate. The reflective structure comprises at least one reflective metal surface arranged to reflect laser light and converted light. The reflective structure is arranged on the side of the substrate facing the light con verter. The light converting device further comprises a translucent ceramic protection layer. The ceramic protection layer is arranged between the reflective structure and the light con verter such that the reliability of the reflective structure is increased. The ceramic protection layer may inhibit mechanical damage of the reflective structure. The ceramic protection layer may further inhibit chemical reactions (e.g. corrosion) of the metallic surface comprised by the reflective structure. The ceramic protection layer may be arranged to scatter the laser light and converted light. The ceramic protection layer may, for example, comprise scattering structures (e.g. particles or pores) with a size between 10 nm and 10 pm (size of scattering structures and layer thickness of the ceramic protection layer are adapted such that the ce ramic protection layer avoids direct exposure of the reflective structure). The reflectivity of the reflective structure is preferably more than 90%, more preferably more than 95% and most preferably more than 98% in the respective wavelength range (wavelength range of laser light and converted light). The reflective structure may be specular reflective especially in case of sufficient scattering of the laser and converted light already been provided by means of the light converter and/or the ceramic protection layer. The, for example, blue laser light and the converted light may alternatively or in addition be diffusely reflected by means of the reflec tive structure or a combination of the reflective structure and corresponding scattering ele ments within, for example, the light converter or the ceramic protection layer.
The light converter may, for example, be a thin (e.g. between 25 pm and 200 pm thick) rectangular or circular plate (maximum lateral extension e.g. less than 5 cm in scanning applications).
The substrate is arranged to dissipate heat, thus functions as a heatsink.
The ceramic protection layer may cover the reflective structure. The ceramic pro tection layer may, for example, be deposited or laminated on the metal surface to avoid degra dation of the metal surface. The ceramic protection layer may, for example, be provided by means of plasma deposition, sol-gel processing or any other suitable deposition or lamination method.
The ceramic protection layer may comprise at least one ceramic material selected out of the group of aluminum oxide, magnesium oxide, titanium oxide, and zirconium oxide, preferably AI2O3 or Ti02. The material and/or the thickness of the ceramic material is chosen such that the ceramic protection layer does not substantially absorb relevant parts of the laser light and the converted light. The absorption of laser light and converted light passing the ce- ramic protection layer is preferably less than 3%, more preferably less than 1% and most pref- erably less than 0.5%.
The substrate may, for example, comprise or consist of a metal like, for example, aluminum, copper, or steel. A surface of the metal may comprise at least one reflective metal surface forming the metal surface of the reflective structure. The metal surface may, for ex- ample, be a polished surface of the metal. The ceramic protection layer covers in this embodi- ment the polished surface as described above.
The reflective structure may alternatively comprise at least one metal layer depos- ited on a surface of the substrate facing the light converter. The metal layer may, for example, be a thin aluminum or silver layer. The ceramic protection layer covers in this embodiment the metal layer attached to the substrate.
The thickness of the ceramic protection layer is less than 50 pm and preferably less than 10 pm. The thickness is chosen such that optical performance and thermal conduc- tivity to the substrate including the ceramic layer are sufficient to enable a highly efficient and reliable light converting device.
The light converter may be mechanically and thermally coupled to the substrate by, for example, a thin bonding layer (thickness preferably less than 3 pm, more preferably less than 1 pm) arranged between the bonding surface of the light converter and the ceramic protection layer. The bonding layer may, for example, be silicone glue dispensed on at least a part of the surface of the ceramic protection layer. The bonding layer may alternatively be a thin layer of glass melting at low temperatures (e.g. melting temperature being be- tween 200°C and 300°C). The bonding layer is preferably highly transparent in order to avoid optical losses and corresponding heating of the bonding layer and the light converter. The lim ited thickness of the bonding layer may limit heating of the bonding layer.
The light converting device may further comprise a reflective side coating cover ing the at least one side surface of the light converter. The reflective side coating is arranged to reflect laser light and converted light such that optical losses via the at least one side sur face of the light converter may be reduced. The reflective side coating may, for example, be a white coating. The reflective side coating may, for example, comprise an optical silicone filled with e.g. titanium oxide particles.
The substrate may according to an alternative embodiment comprise a slot. The slot is arranged to host the light converter. The light converter is positioned in the slot such that the bonding surface faces an inner bottom surface of the slot. The reflective structure is in this embodiment arranged at the bottom surface and optionally at the side surface of the slot such that laser light and converted light can be reflected by means of the reflective structure. The reflective structure is covered by the ceramic protection layer. A depth of the slot may be at least 80% or, more preferably, may be the same as a thickness of the light converter perpen dicular to the bonding surface. The slot (or cavity) is slightly larger than the light converter. The light converter may be bonded to the reflective structure by means of a bonding layer.
The bonding layer may, for example, comprise glue like silicone glue between the reflective structure and the light converter which is hardened by curing. The configuration of the bond- ing layer may be similar to the one as described above.
According to a further aspect, a laser-based light source is provided. The laser based light source comprises a light converting device as described above and at least one la ser which is adapted to emit the laser light.
The laser-based light source may comprise two, three, four or more lasers (e.g. in the form of an array) emitting, for example, blue laser light.
According to a further aspect, a vehicle headlight is provided. The vehicle head light comprises at least one laser-based light source as described above. The vehicle headlight may comprise two, three, four or more laser-based light sources as described above. The light converter may in this case comprise or consist of a yellow phosphor garnet (e.g. Y(3- o.4)Gdo.4Al50i2:Ce). A mixture of blue laser light and yellow converted light may be used to generate white light. Around 21% of the blue laser light may be reflected, and the remaining blue laser light may be converted to yellow light. This enables a ratio of 26% blue laser light and 74% yellow converted light in the mixed light emitted by the laser-based light source by taking into account, for example, Stokes losses in the phosphor.
It shall be understood that a preferred embodiment of the invention can also be any combination of the above described embodiments.
Further advantageous embodiments are defined below.
BRIEF DESCRIPTION OF THE DRAWINGS
These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter.
The invention will now be described, by way of example, based on embodiments with reference to the accompanying drawings. In the drawings:
Fig. 1 shows a principal sketch of a first embodiment of a laser-based light source with a light converting device.
Fig. 2 shows a principal sketch of a second embodiment of a laser-based light source with a light converting device.
Fig. 3 shows a principal sketch of a third embodiment of a laser-based light source with a light converting device.
In the Figures, like numbers refer to like objects throughout. Objects in the Fig ures are not necessarily drawn to scale.
DETAILED DESCRIPTION OF EMBODIMENTS
Various embodiments of the invention will now be described by means of the Fig ures.
Fig. 1 shows a principal sketch of a first embodiment of a laser-based light source 100 comprising a light converting device 130. A light converter 134 like a rectangular phosphor platelet is glued by means of a bonding layer 133 to a substrate 131 which acts as a heatsink. The surface of the substrate 131 (being e.g. an aluminum substrate) the rectangular phosphor platelet is mounted on is highly reflective (obtained e.g. by polishing) and forms a reflective structure 137. A ceramic protection layer 138 consisting of AI2O3 with a layer thick ness of around 20 pm is deposited on top of the reflective structure 137 such that the ceramic protection layer is arranged between the bonding layer 133 and the substrate 131. A reflective side coating 132 (e.g. titanium oxide filled optical silicone) covers the side surface or surfaces of the light converter 134. A laser 110 is arranged to emit blue laser light 10 which enters the light converter 134 (yellow phosphor garnet) via a light entrance surface of the light con verter 134 which comprises an anti-reflective coating (not shown) avoiding reflection of light in the wavelength range of the laser light 10 and optionally the converted light 20. A part of the blue laser light 10 is converted to yellow converted light 20. A mixture of reflected blue laser light 11 which e.g. is reflected at the reflective structure 137 and converted light 20 is emitted via the light entrance surface. The laser-based light source 100 is arranged to emit white light which comprises the mixture of reflected laser light 11 and converted light 20.
Fig. 2 shows a principal sketch of a second embodiment of a laser-based light source 100 with a light converting device 130. The light converting device 130 comprises a substrate 131 which acts as a heatsink. The substrate 131 further comprises a reflective struc- ture 137. The reflective structure 137 comprises a reflective metal layer (e.g. silver layer) which is deposited on the surface of the substrate 131 on which a light converter 134 is mounted. The reflective metal layer is protected by means of a ceramic protection layer 138 (e.g. 10 pm aluminum oxide or titanium oxide) which is deposited on top of the reflective metal layer. The light converter 134 is clamped by means of a reflective side coating 132 on the ceramic protection layer 138 such that the ceramic protection layer 138 is arranged be- tween the light converter 134 and the reflective structure 137.
The light converter 134 may alternatively be bonded to the ceramic protection layer 138 by means of, for example, a thermocompression bonding or ultrasonic bonding without any adhesive or bonding layer or by means of a bonding layer as described above.
Fig. 3 shows a principal sketch of a third embodiment of a laser-based light source 100 with a light converting device 130. The substrate 131 consists in this embodiment of a block of metal in which a cavity or slot is provided (e.g. by deep-drawing). Other meth ods to shape the metal are well known to those skilled in the art. The metal may be in this case aluminum. The bottom of the cavity and the sidewalls are polished surfaces forming the re flective structure 137. The bottom of the cavity, the side walls and the top surface of the block surrounding the cavity are covered by a ceramic protection layer 138 (e.g. 10 pm AI2O3 with T1O2 scattering particles). A small droplet of glue is dispensed in the cavity and the light con verter 134 (e.g. platelet of 500c500 pm2) which is slightly smaller than the cavity is placed on top of the glue. Thickness of the platelet (e.g. 50-100 pm) and depth of the cavity are prefera bly arranged such that the light entrance surface of the light converter 134 and the surround ing surface of the substrate 131 are on the same level. Small deviations may be acceptable. Both steps may be carried out in a dispense/p&p tool as typically used in the LED industry equipped with an ultra-high precision dispense valve. Afterwards the glue is cured, which typ ically implies an oven batch process.
While the invention has been illustrated and described in detail in the drawings and the foregoing description, such illustration and description are to be considered illustra tive or exemplary and not restrictive.
From reading the present disclosure, other modifications will be apparent to per sons skilled in the art. Such modifications may involve other features which are already known in the art and which may be used instead of or in addition to features already described herein. Variations to the disclosed embodiments can be understood and effected by those skilled in the art, from a study of the drawings, the disclosure and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite ar ticle "a” or "an" does not exclude a plurality of elements or steps. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combina tion of these measures cannot be used to advantage.
Any reference signs in the claims should not be construed as limiting the scope thereof.
LIST OF REFERENCE NUMERALS:
10 laser light
11 reflected laser light
20 converted light
100 laser-based light source
110 laser
130 light converting device
131 substrate
132 reflective side coating
133 bonding layer
134 light converter
137 reflective structure
138 ceramic protection layer

Claims

CLAIMS:
1. A light converting device (130) comprising:
a substrate (131) functioning as a heatsink,
a light converter (134), wherein the light converter (134) is adapted to convert laser light (10) to converted light (20), wherein a peak emission wavelength of the converted light (20) is in a longer wavelength range than a laser peak emission wavelength of the laser light (10), wherein the light converter (134) comprises a light entrance surface, a bonding surface opposite to the light entrance surface and at least one side surface, wherein the bonding surface is mechanically and thermally coupled to the substrate (131),
a reflective structure (137) attached to or part of the substrate (131), wherein the reflective structure (137) comprises at least one reflective metal surface arranged to reflect laser light (10) and converted light (20), wherein the reflective
structure (137) is arranged on the side of the substrate (131) facing the light converter (134), and
a translucent ceramic protection layer (138), arranged between the reflective structure (137) and the light converter (134), and having a thickness of less than 50 pm.
2. The light converting device (130) according to claim 1, wherein the thickness of the ceramic protection layer (138) is less than 10 pm.
3. The light converting device (130) according to claim 1 or 2, wherein the ceramic
protection layer (138) covers the reflective structure (137).
4. The light converting device (130) according to claim 1 or 2, wherein the ceramic
protection layer (138) comprises at least one ceramic material selected out of the group of aluminum oxide, magnesium oxide, titanium oxide, and zirconium oxide.
5. The light converting device (130) according to claim 1 or 2, wherein the ceramic
protection layer (138) comprises scattering structures for scattering the laser light (10) and the converted light (20).
6. The light converting device (130) according to claim 1 or 2, wherein the substrate (131) comprises a metal, and wherein a surface of the metal comprises the at least one reflective metal surface.
7. The light converting device (130) according to claim 1 or 2, wherein the reflective structure (137) comprises at least one metal layer deposited on a surface of the substrate (131).
8. The light converting device (130) according to claim 1 or 2, wherein the bonding
surface of the light converter (134) is mechanically and thermally coupled to the substrate (131) by means of a bonding layer (133), wherein the bonding layer (133) is arranged between the light converter (134) and the ceramic protection layer (138).
9. The light converting device (130) according to claim 1 or 2, wherein the light
converting device (130) further comprises a reflective side coating (132) covering the at least one side surface of the light converter (134), wherein the reflective side coating (132) is arranged to reflect laser light (10) and converted light (20).
10. The light converting device (130) according to claim 1 or 2, wherein the substrate (131) comprises a slot, wherein the slot is arranged to host the light converter (134), and wherein the light converter (134) is positioned in the slot such that the bonding surface faces an inner bottom surface of the slot.
11. The light converting device (130) according to claim 10, wherein the reflective
structure (137) and the ceramic protection layer (138) cover at least the inner bottom surface and a side surface of the slot.
12. A laser-based light source (100) comprising:
the light converting device (130) according to any one of claims 1-11, and
at least one laser (110), wherein the at least one laser (110) is adapted to emit the laser light (10).
13. A vehicle headlight comprising at least one laser-based light source (100) according to claim 12.
PCT/EP2019/066157 2018-06-26 2019-06-19 Light converting device with ceramic protection layer Ceased WO2020002074A1 (en)

Applications Claiming Priority (2)

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EP18179728.3 2018-06-26

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DE102019121511A1 (en) * 2019-08-09 2021-02-11 Schott Ag Light conversion and lighting device
JP2024532680A (en) 2021-07-29 2024-09-10 シグニファイ ホールディング ビー ヴィ Laser Illumination Device

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