WO2019227546A1 - Method for preparing ink-jet printing amoled display panel - Google Patents

Method for preparing ink-jet printing amoled display panel Download PDF

Info

Publication number
WO2019227546A1
WO2019227546A1 PCT/CN2018/092356 CN2018092356W WO2019227546A1 WO 2019227546 A1 WO2019227546 A1 WO 2019227546A1 CN 2018092356 W CN2018092356 W CN 2018092356W WO 2019227546 A1 WO2019227546 A1 WO 2019227546A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
anode
pixel definition
preparing
display panel
Prior art date
Application number
PCT/CN2018/092356
Other languages
French (fr)
Chinese (zh)
Inventor
何昆鹏
张晓星
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US16/114,413 priority Critical patent/US10692945B2/en
Publication of WO2019227546A1 publication Critical patent/WO2019227546A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Definitions

  • the invention relates to the field of display technology, in particular to a method for preparing an inkjet printed AMOLED display panel.
  • the film thickness of the evaporation material in the pixel area is good, and IJP-AMOLED (Inkjet Printing AMOLED) uses Water-based liquid ink is sprayed into a film, and the residue of the hydrophobic PDL (Pixel Define Layer) material in the Bank area (pixel area) directly affects the spread of the ink, resulting in abnormal pixel functions and ultimately affecting the display effect.
  • IJP-AMOLED Inkjet Printing AMOLED
  • 2' is a flat layer
  • 3 ' is a pixel definition layer
  • 4' is an anode.
  • 30 ′ is a patterned pixel definition layer.
  • a notch 31 ′ is formed thereon.
  • the anode 4 ′ is exposed through the notch 31 ′, and the pixel definition layer material 32 ′ remains on the anode 4 ′.
  • the ink layer 5 ' is formed on the anode 4' by inkjet water (the ink material may be a material for light emission), there will be a blank area 41 'around the remaining pixel definition layer material 32'. Covered by the ink layer 5 ', which will affect the display effect of AMOLED.
  • the PDL material is an organic photosensitive material.
  • the Bank region is formed by the yellow light and OVEN process (baking process). After the PDL layer is developed, the PDL material residue in the pixel region directly affects the ink spread.
  • the countermeasures for the residual PDL material of the vapor-deposited AMOLED pixel region are more dry etching after the PDL yellow light process is used.
  • the dry etching process after the PDL yellow light process of IJP-AMOLED will bring the following problems:
  • Dry etching will cause a certain degree of loss in the thickness and line width of the PDL, which will affect the confirmation of the ink drop amount and the pixel aperture ratio.
  • the present invention provides a method for preparing an inkjet printed AMOLED display panel, which can improve the cleanliness of the anode surface in the AMOLED display panel, reduce residues, and make the printed light-emitting layer easier to spread uniformly, so as to avoid AMOLED display panel display
  • the abnormality will not damage the surface structure of the pixel definition layer, nor will it cause loss of the surface thickness and line width of the pixel definition layer.
  • the invention provides a method for preparing an inkjet printed AMOLED display panel, including the following steps:
  • An ink layer is formed on the anode by means of inkjet printing.
  • the thickness of the spacer layer ranges from 300 to 800 Angstroms.
  • the spacer layer is a metal film layer
  • the anode is a transparent electrode or a reflective electrode.
  • the transparent electrode is an ITO film layer
  • the reflective electrode includes two ITO film layers and a silver metal layer sandwiched between the two ITO film layers.
  • the method further includes the following steps:
  • a baking process is performed on the pixel definition layer and the anode.
  • the spacer layer is a molybdenum film layer or an aluminum film layer, and the spacer layer under the notch is etched away by an aluminum etching solution.
  • the pixel definition layer is patterned by a yellow light process.
  • the pixel definition layer is a hydrophobic pixel definition layer.
  • a flat layer is prepared on the TFT backplane, and the pixel definition layer and the anode are both located on the flat layer.
  • an ink layer on the anode by means of inkjet printing, specifically:
  • a hole layer and a light emitting layer are sequentially formed on the anode by inkjet printing; wherein the hole layer includes a hole injection layer and a hole transport layer, and the hole transport layer is located at the hole injection. Between the layer and the light emitting layer.
  • the invention also provides a method for preparing an inkjet printed AMOLED display panel, including the following steps:
  • the thickness of the spacer layer ranges from 300 to 800 ⁇ ;
  • the spacer layer is a metal film layer
  • the anode is a transparent electrode or a reflective electrode.
  • the transparent electrode is an ITO film layer
  • the reflective electrode includes two ITO film layers and a silver metal layer sandwiched between the two ITO film layers.
  • the method further includes the following steps:
  • a baking process is performed on the pixel definition layer and the anode.
  • the spacer layer is a molybdenum film layer or an aluminum film layer, and the spacer layer under the notch is etched away by an aluminum etching solution.
  • the pixel definition layer is patterned by a yellow light process
  • the pixel definition layer is a hydrophobic pixel definition layer.
  • Forming an ink layer on the anode by inkjet printing is specifically:
  • a hole layer and a light emitting layer are sequentially formed on the anode by inkjet printing; wherein the hole layer includes a hole injection layer and a hole transport layer, and the hole transport layer is located at the hole injection. Between the layer and the light emitting layer.
  • the invention also provides a method for preparing an inkjet printed AMOLED display panel, including the following steps:
  • a pixel definition layer is prepared on the TFT backplane, and the pixel definition layer covers the spacer layer; the pixel definition layer is a hydrophobic pixel definition layer;
  • Forming an ink layer on the anode by inkjet printing is specifically:
  • a hole layer and a light emitting layer are sequentially formed on the anode by inkjet printing; wherein the hole layer includes a hole injection layer and a hole transport layer, and the hole transport layer is located at the hole injection. Between the layer and the light emitting layer.
  • the thickness of the spacer layer ranges from 300 to 800 Angstroms
  • the spacer layer is a metal film layer
  • the anode is a transparent electrode or a reflective electrode.
  • the transparent electrode is an ITO film layer
  • the reflective electrode includes two ITO film layers and a silver metal layer sandwiched between the two ITO film layers
  • the spacer layer is a molybdenum film layer or an aluminum film layer, and the spacer layer under the notch is etched away by an aluminum etching solution.
  • the pixel definition layer is patterned by a yellow light process
  • the method for preparing an inkjet printed AMOLED display panel further includes the following steps:
  • a flat layer is prepared on the TFT backplane, and the pixel definition layer and the anode are both located on the flat layer.
  • the implementation of the present invention has the following beneficial effects:
  • the present invention prepares a spacer layer on the anode surface on the TFT backplane, and after the pixel definition layer above the spacer layer is etched away, there are pixels remaining on the surface of the spacer layer. Define the layer material.
  • the spacer layer is etched away by an etching solution, thereby removing the pixel definition layer material remaining on the surface of the spacer layer, thereby improving the cleanliness of the anode surface and reducing the residue, making it easier to print the light-emitting layer to spread uniformly, so as to avoid AMOLED
  • the display panel displays abnormally.
  • the present invention does not increase the dry etching process, will not damage the surface structure of the pixel definition layer, and will not cause loss of the surface thickness and line width of the pixel definition layer.
  • FIG. 1 is a schematic diagram of an anode and a pixel definition layer prepared on a TFT backplane in the prior art
  • FIG. 2 is a schematic structural diagram obtained by the pixel definition layer in FIG. 1;
  • FIG. 3 is a schematic diagram of preparing an ink layer on the anode in FIG. 2;
  • FIG. 4 is a flowchart of a method for manufacturing an inkjet printed AMOLED display panel according to the present invention.
  • FIG. 5 is a schematic diagram of an anode, a spacer layer, and a pixel definition layer prepared on a TFT backplane provided by the present invention
  • FIG. 6 is a schematic structural diagram obtained by graphically defining the pixel definition layer in FIG. 5 provided by the present invention.
  • FIG. 7 is a schematic structural diagram obtained by etching the spacer layer under the notch of the pixel definition layer in FIG. 6 provided by the present invention.
  • FIG. 8 is a cross-sectional view of an ink layer prepared on the anode in FIG. 7 provided by the present invention.
  • FIG. 9 is a top view of an ink layer prepared on the anode in FIG. 7 provided by the present invention.
  • FIG. 10 is a schematic structural diagram of an anode according to an embodiment of the present invention.
  • FIG. 11 is a schematic structural diagram of an ink layer provided by the present invention.
  • the invention provides a method for manufacturing an inkjet printed AMOLED display panel. As shown in FIG. 4, the method includes the following steps:
  • a TFT (Thin Film Transistor) backplane 1 is prepared, and an anode 4 is prepared on the TFT backplane 1.
  • a spacer layer 5 is provided on the anode 4 to isolate the anode 4 from the pixel definition layer.
  • a pixel definition layer 3 is prepared on the TFT backplane 1, and the pixel definition layer 3 covers the spacer layer 5.
  • the pixel definition layer 3 is patterned, and a notch 31 is formed on the pixel definition layer 3 to expose the spacer layer 5.
  • 30 in FIG. 6 is a pixel definition layer after patterning.
  • the spacer layer 5 under the notch 31 is etched away by an etching solution, and the pixel definition layer material 32 remaining on the spacer layer 5 is taken away to expose the anode 4; the surface of the anode 4 is flat and there is no residue
  • the pixels define layer material 32 or other residues. 50 shown in FIG. 7 is that the anode 4 is exposed after the spacer layer 5 under the notch 31 is etched away by an etching solution.
  • an ink layer 6 for emitting light is formed on the anode 4 by means of inkjet printing. It can be seen from FIG. 9 that the ink layer 6 spreads well on the surface of the anode 4, and the ink layer 6 can spread evenly and evenly on the surface of the anode 4, thereby improving the display effect of the AMOLED display panel.
  • the surface structure of the pixel definition layer will not be damaged, and the thickness and line width of the pixel definition layer will not be lost.
  • the thickness of the spacer layer 5 ranges from 300 to 800 Angstroms.
  • the spacer layer 5 is a metal film layer
  • the anode 4 is a transparent electrode or a reflective electrode.
  • the reflective electrode includes two ITO film layers 41 and a silver metal layer 42 sandwiched between the two ITO film layers 41.
  • the transparent electrode is an ITO (Indium Tin Oxide) film layer.
  • the AMOLED display panel in the present invention may be top-emitting or bottom-emitting.
  • the AMOLED display panel When the AMOLED display panel is top-emitting, the light emitted from the AMOLED display panel passes through a cathode opposite to the anode. At this time, the anode is a reflective electrode and the cathode is a transparent electrode .
  • the AMOLED display panel emits light at the bottom, the light emitted from the AMOLED display panel passes through the anode. At this time, the anode is a transparent electrode and the cathode is a reflective electrode.
  • graphic pixel definition layer 3 further includes the following steps:
  • the patterned pixel definition layer 30 and the anode 4 are subjected to a baking process.
  • the pixel definition layer can be cured through the baking process, and the amorphous ITO film layer in the anode 4 can be converted into a crystalline ITO film.
  • Floor The patterned pixel definition layer 30 and the anode 4 are subjected to a baking process.
  • the pixel definition layer can be cured through the baking process, and the amorphous ITO film layer in the anode 4 can be converted into a crystalline ITO film.
  • Floor a crystalline ITO film
  • the spacer layer 5 is a molybdenum film layer or an aluminum film layer, and the spacer layer 5 under the notch 31 of the pixel definition layer is etched away by using an aluminum etching solution.
  • the pixel definition layer 3 shown in FIG. 5 is patterned by a yellow light process.
  • the yellow light process includes coating a photoresist on the pixel definition layer, exposing, developing, and etching the pixel definition layer.
  • the pixel definition layer is a hydrophobic pixel definition layer.
  • the method for preparing an inkjet printed AMOLED display panel further includes the following steps:
  • a flat layer 2 is prepared on the TFT back plate 1, and the pixel definition layer 3 and the anode 4 are both located on the flat layer 2.
  • ink layer 5 on the anode 4 by means of inkjet printing is specifically:
  • the hole layer 62 and the light emitting layer 61 shown in FIG. 11 are sequentially formed on the anode 4 by inkjet printing.
  • the hole layer 62 includes a hole injection layer 622 and a hole transport layer 621.
  • the hole transport layer 621 It is located between the hole injection layer 622 and the light emitting layer 61.
  • the active layer of the thin film transistor on the TFT backplane 1 may be a low temperature polysilicon material or an oxide material such as IGZO (Indium Gallium Zinc Oxide), or other semiconductor materials.
  • IGZO Indium Gallium Zinc Oxide
  • the inkjet printed AMOLED display panel provided by the present invention, after the anode of the TFT backplane is completed, a spacer film formation, yellow light, and etching process is added, and then the yellow light and The baking process, and finally the spacer layer is etched away with an aluminum etching solution.
  • the etching rate of the spacer layer by the aluminum etchant can reach The spacer layer of a certain thickness can be etched clean in a short time, and the anisotropy of the wet etch also ensures that the small amount of pixel definition layer material remaining on the surface of the spacer layer will not cause the spacer layer to be etched uncleanly.
  • the amorphous ITO film layer also forms a crystalline ITO film layer during the baking process of the pixel definition layer.
  • the aluminum etching solution will not react with the crystalline ITO film layer, so the invention can ensure that the interval is etched away. Layer and take away the material of the remaining pixel definition layer without affecting the anode film layer.
  • the invention can improve the cleanliness of the surface of the anode film layer in the AMOLED display panel and reduce the residue, so that the printed light-emitting layer can be more easily spread uniformly, so as to avoid abnormal display of the AMOLED display panel.
  • the film-forming process, the yellow-light process, and the etching process that increase the spacer layer are all ordinary processes, and there is no special requirement for equipment and materials, so the present invention can greatly improve the product yield with a small increase in cost.

Abstract

Provided in the present invention is a method for preparing an ink-jet printing AMOLED display panel, comprising the following steps: preparing a TFT backplate, and preparing an anode on the TFT backplate; preparing an interval layer on the anode; preparing a pixel defining layer on the TFT backplate, wherein the pixel defining layer covers the interval layer; performing patterning on the pixel defining layer for forming a notch in the pixel defining layer so as to expose the interval layer; etching off the interval layer below the notch through an etching liquid so as to expose the anode; and forming an ink layer on the anode through an ink-jet printing method. By means of the present invention, the degree of cleanliness of a surface of an anode in an AMOLED display panel can be improved, and the residue is reduced, so that a printed light-emitting layer is unfolded more easily and uniformly, display abnormalities of the AMOLED display panel are avoided, the surface structure of a pixel defining layer is not damaged, and loss of the surface thickness and line width of the pixel defining layer can be avoided.

Description

一种喷墨打印AMOLED显示面板的制备方法Preparation method of inkjet printing AMOLED display panel
本申请要求于2018年5月29日提交中国专利局、申请号为201810528668.1、发明名称为“一种喷墨打印AMOLED显示面板的制备方法”的中国专利申请的优先权,上述专利的全部内容通过引用结合在本申请中。This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on May 29, 2018, with application number 201810528668.1, and the invention name is "A method for preparing an inkjet printed AMOLED display panel". Citations are incorporated in this application.
技术领域Technical field
本发明涉及显示技术领域,尤其涉及一种喷墨打印AMOLED显示面板的制备方法。The invention relates to the field of display technology, in particular to a method for preparing an inkjet printed AMOLED display panel.
背景技术Background technique
在蒸镀AMOLED(Active-matrix organic light emitting diode,有源矩阵有机发光二极体)技术中,蒸镀材料在像素区的膜厚均匀性好,而IJP-AMOLED(喷墨打印AMOLED)使用亲水性的液态的墨水喷吐成膜,Bank区域(像素区域)的疏水性PDL(Pixel Define Layer,像素定义层)材料的残留直接影响墨水的铺展,从而导致像素功能异常并最终影响显示效果。例如,如图1所示,1’为TFT(Thin Film Transistor,薄膜晶体管)背板,2’为平坦层,3’为像素定义层,4’为阳极。如图2所示,30’为图形化后的像素定义层,上面形成有缺口31’,通过缺口31’露出阳极4’,阳极4’上有残留的像素定义层材料32’。如图3所示,在阳极4’上通过喷墨水(墨水材料可以是用于发光的材料)方式形成墨水层5’时,残留的像素定义层材料32’周围会有空白区域41’没有被墨水层5’覆盖,从而会影响AMOLED的显示效果。In the evaporation-active AMOLED (Active-Matrix Organic Light Emitting Diode) technology, the film thickness of the evaporation material in the pixel area is good, and IJP-AMOLED (Inkjet Printing AMOLED) uses Water-based liquid ink is sprayed into a film, and the residue of the hydrophobic PDL (Pixel Define Layer) material in the Bank area (pixel area) directly affects the spread of the ink, resulting in abnormal pixel functions and ultimately affecting the display effect. For example, as shown in FIG. 1, 1 'is a TFT (Thin Film Transistor) backplane, 2' is a flat layer, 3 'is a pixel definition layer, and 4' is an anode. As shown in FIG. 2, 30 ′ is a patterned pixel definition layer. A notch 31 ′ is formed thereon. The anode 4 ′ is exposed through the notch 31 ′, and the pixel definition layer material 32 ′ remains on the anode 4 ′. As shown in FIG. 3, when the ink layer 5 'is formed on the anode 4' by inkjet water (the ink material may be a material for light emission), there will be a blank area 41 'around the remaining pixel definition layer material 32'. Covered by the ink layer 5 ', which will affect the display effect of AMOLED.
因此,良好的墨水铺展性很大程度上决定IJP-AMOLED的产品品质,所以在打印墨水前Bank区域的洁净无残留尤为重要。PDL材料是有机感光材料,Bank区域通过黄光和OVEN制程(烘烤制程)形成,PDL层显影后像素区的PDL材料残留直接影响墨水铺展。现在针对蒸镀AMOLED像素区域的PDL材料残留的对策较多使用PDL黄光制程之后追加一道干刻蚀。但是在IJP-AMOLED的PDL黄光制程之后使用干刻蚀制程会带来以下问题:Therefore, good ink spreadability largely determines the product quality of IJP-AMOLED, so it is particularly important that the Bank area is clean and free of residues before printing ink. The PDL material is an organic photosensitive material. The Bank region is formed by the yellow light and OVEN process (baking process). After the PDL layer is developed, the PDL material residue in the pixel region directly affects the ink spread. At present, the countermeasures for the residual PDL material of the vapor-deposited AMOLED pixel region are more dry etching after the PDL yellow light process is used. However, the dry etching process after the PDL yellow light process of IJP-AMOLED will bring the following problems:
1、干刻蚀会破坏PDL表面结构,使PDL失去疏水性,所以在IJP制程中滴下的墨水容易粘附在Bank区域表面,而不是流入Bank区域中。1. Dry etching will destroy the surface structure of PDL and make PDL lose its hydrophobicity. Therefore, the ink dripped during the IJP process is likely to adhere to the surface of the Bank area instead of flowing into the Bank area.
2、干刻蚀会造成PDL的厚度和线宽一定程度的损失,影响墨水滴入量的确认和像素的开口率。2. Dry etching will cause a certain degree of loss in the thickness and line width of the PDL, which will affect the confirmation of the ink drop amount and the pixel aperture ratio.
发明内容Summary of the Invention
为解决上述技术问题,本发明提供一种喷墨打印AMOLED显示面板的制备方法,可以提高AMOLED显示面板中阳极表面的洁净程度,减少残留,使得打印发光层更容易铺展均匀,以免AMOLED显示面板显示异常,不会破坏像素定义层表面结构,也不会对像素定义层表面厚度和线宽造成损失。In order to solve the above technical problems, the present invention provides a method for preparing an inkjet printed AMOLED display panel, which can improve the cleanliness of the anode surface in the AMOLED display panel, reduce residues, and make the printed light-emitting layer easier to spread uniformly, so as to avoid AMOLED display panel display The abnormality will not damage the surface structure of the pixel definition layer, nor will it cause loss of the surface thickness and line width of the pixel definition layer.
本发明提供的一种喷墨打印AMOLED显示面板的制备方法,包括下述步骤:The invention provides a method for preparing an inkjet printed AMOLED display panel, including the following steps:
制备TFT背板,在所述TFT背板上制备阳极;Preparing a TFT backplane, and preparing an anode on the TFT backplane;
在所述阳极上制备用于隔绝阳极与像素定义层的间隔层;Preparing a spacer layer on the anode to isolate the anode from the pixel definition layer;
在所述TFT背板上制备像素定义层,且所述像素定义层覆盖所述间隔层;Preparing a pixel definition layer on the TFT backplane, and the pixel definition layer covers the spacer layer;
图形化所述像素定义层,在所述像素定义层上形成缺口以露出所述间隔层;Patterning the pixel definition layer and forming a gap on the pixel definition layer to expose the spacer layer;
通过刻蚀液将所述缺口下方的间隔层刻蚀掉,露出所述阳极;Etching the spacer layer under the notch through an etching solution to expose the anode;
通过喷墨打印的方式在所述阳极上形成墨水层。An ink layer is formed on the anode by means of inkjet printing.
优选地,所述间隔层的厚度范围为300~800埃米。Preferably, the thickness of the spacer layer ranges from 300 to 800 Angstroms.
优选地,所述间隔层为金属膜层,所述阳极为透明电极或者反射电极。Preferably, the spacer layer is a metal film layer, and the anode is a transparent electrode or a reflective electrode.
优选地,所述透明电极为一层ITO膜层,所述反射电极包含两层ITO膜层以及夹持在所述两层ITO膜层之间的银金属层。Preferably, the transparent electrode is an ITO film layer, and the reflective electrode includes two ITO film layers and a silver metal layer sandwiched between the two ITO film layers.
优选地,在图形化所述像素定义层之后还包括下述步骤:Preferably, after patterning the pixel definition layer, the method further includes the following steps:
对所述像素定义层以及所述阳极进行烘烤制程。A baking process is performed on the pixel definition layer and the anode.
优选地,所述间隔层为钼膜层或者铝膜层,通过铝刻蚀液将所述缺口下方的间隔层刻蚀掉。Preferably, the spacer layer is a molybdenum film layer or an aluminum film layer, and the spacer layer under the notch is etched away by an aluminum etching solution.
优选地,通过黄光制程图形化所述像素定义层。Preferably, the pixel definition layer is patterned by a yellow light process.
优选地,所述像素定义层为疏水性的像素定义层。Preferably, the pixel definition layer is a hydrophobic pixel definition layer.
优选地,还包括下述步骤:Preferably, the following steps are further included:
在所述TFT背板上制备平坦层,所述像素定义层以及所述阳极均位于所述平坦层上。A flat layer is prepared on the TFT backplane, and the pixel definition layer and the anode are both located on the flat layer.
优选地,通过喷墨打印的方式在所述阳极上形成墨水层,具体为:Preferably, forming an ink layer on the anode by means of inkjet printing, specifically:
通过喷墨打印的方式在所述阳极上依次形成空穴层和发光层;其中,所述空穴层包括空穴注入层和空穴传输层,所述空穴传输层位于所述空穴注入层和所述发光层之间。A hole layer and a light emitting layer are sequentially formed on the anode by inkjet printing; wherein the hole layer includes a hole injection layer and a hole transport layer, and the hole transport layer is located at the hole injection. Between the layer and the light emitting layer.
本发明还提供一种喷墨打印AMOLED显示面板的制备方法,包括下述步骤:The invention also provides a method for preparing an inkjet printed AMOLED display panel, including the following steps:
制备TFT背板,在所述TFT背板上制备阳极;Preparing a TFT backplane, and preparing an anode on the TFT backplane;
在所述阳极上制备用于隔绝阳极与像素定义层的间隔层;Preparing a spacer layer on the anode to isolate the anode from the pixel definition layer;
在所述TFT背板上制备像素定义层,且所述像素定义层覆盖所述间隔层;Preparing a pixel definition layer on the TFT backplane, and the pixel definition layer covers the spacer layer;
图形化所述像素定义层,在所述像素定义层上形成缺口以露出所述间隔层;Patterning the pixel definition layer and forming a gap on the pixel definition layer to expose the spacer layer;
通过刻蚀液将所述缺口下方的间隔层刻蚀掉,露出所述阳极;Etching the spacer layer under the notch through an etching solution to expose the anode;
通过喷墨打印的方式在所述阳极上形成墨水层;Forming an ink layer on the anode by means of inkjet printing;
所述间隔层的厚度范围为300~800埃米;The thickness of the spacer layer ranges from 300 to 800 Å;
所述间隔层为金属膜层,所述阳极为透明电极或者反射电极。The spacer layer is a metal film layer, and the anode is a transparent electrode or a reflective electrode.
优选地,所述透明电极为一层ITO膜层,所述反射电极包含两层ITO膜层以及夹持在所述两层ITO膜层之间的银金属层。Preferably, the transparent electrode is an ITO film layer, and the reflective electrode includes two ITO film layers and a silver metal layer sandwiched between the two ITO film layers.
优选地,在图形化所述像素定义层之后还包括下述步骤:Preferably, after patterning the pixel definition layer, the method further includes the following steps:
对所述像素定义层以及所述阳极进行烘烤制程。A baking process is performed on the pixel definition layer and the anode.
优选地,所述间隔层为钼膜层或者铝膜层,通过铝刻蚀液将所述缺口下方的间隔层刻蚀掉。Preferably, the spacer layer is a molybdenum film layer or an aluminum film layer, and the spacer layer under the notch is etched away by an aluminum etching solution.
优选地,通过黄光制程图形化所述像素定义层;Preferably, the pixel definition layer is patterned by a yellow light process;
所述像素定义层为疏水性的像素定义层。The pixel definition layer is a hydrophobic pixel definition layer.
优选地,还包括下述步骤:Preferably, the following steps are further included:
在所述TFT背板上制备平坦层,所述像素定义层以及所述阳极均位于所 述平坦层上;Preparing a flat layer on the TFT back plate, and the pixel definition layer and the anode are located on the flat layer;
通过喷墨打印的方式在所述阳极上形成墨水层,具体为:Forming an ink layer on the anode by inkjet printing is specifically:
通过喷墨打印的方式在所述阳极上依次形成空穴层和发光层;其中,所述空穴层包括空穴注入层和空穴传输层,所述空穴传输层位于所述空穴注入层和所述发光层之间。A hole layer and a light emitting layer are sequentially formed on the anode by inkjet printing; wherein the hole layer includes a hole injection layer and a hole transport layer, and the hole transport layer is located at the hole injection. Between the layer and the light emitting layer.
本发明还提供一种喷墨打印AMOLED显示面板的制备方法,包括下述步骤:The invention also provides a method for preparing an inkjet printed AMOLED display panel, including the following steps:
制备TFT背板,在所述TFT背板上制备阳极;Preparing a TFT backplane, and preparing an anode on the TFT backplane;
在所述阳极上制备用于隔绝阳极与像素定义层的间隔层;Preparing a spacer layer on the anode to isolate the anode from the pixel definition layer;
在所述TFT背板上制备像素定义层,且所述像素定义层覆盖所述间隔层;所述像素定义层为疏水性的像素定义层;A pixel definition layer is prepared on the TFT backplane, and the pixel definition layer covers the spacer layer; the pixel definition layer is a hydrophobic pixel definition layer;
图形化所述像素定义层,在所述像素定义层上形成缺口以露出所述间隔层;Patterning the pixel definition layer and forming a gap on the pixel definition layer to expose the spacer layer;
通过刻蚀液将所述缺口下方的间隔层刻蚀掉,露出所述阳极;Etching the spacer layer under the notch through an etching solution to expose the anode;
通过喷墨打印的方式在所述阳极上形成墨水层;Forming an ink layer on the anode by means of inkjet printing;
其中,通过喷墨打印的方式在所述阳极上形成墨水层,具体为:Forming an ink layer on the anode by inkjet printing is specifically:
通过喷墨打印的方式在所述阳极上依次形成空穴层和发光层;其中,所述空穴层包括空穴注入层和空穴传输层,所述空穴传输层位于所述空穴注入层和所述发光层之间。A hole layer and a light emitting layer are sequentially formed on the anode by inkjet printing; wherein the hole layer includes a hole injection layer and a hole transport layer, and the hole transport layer is located at the hole injection. Between the layer and the light emitting layer.
优选地,所述间隔层的厚度范围为300~800埃米;Preferably, the thickness of the spacer layer ranges from 300 to 800 Angstroms;
所述间隔层为金属膜层,所述阳极为透明电极或者反射电极。The spacer layer is a metal film layer, and the anode is a transparent electrode or a reflective electrode.
优选地,所述透明电极为一层ITO膜层,所述反射电极包含两层ITO膜层以及夹持在所述两层ITO膜层之间的银金属层;Preferably, the transparent electrode is an ITO film layer, and the reflective electrode includes two ITO film layers and a silver metal layer sandwiched between the two ITO film layers;
在图形化所述像素定义层之后还包括下述步骤:After graphicizing the pixel definition layer, the following steps are further included:
对所述像素定义层以及所述阳极进行烘烤制程;Performing a baking process on the pixel definition layer and the anode;
所述间隔层为钼膜层或者铝膜层,通过铝刻蚀液将所述缺口下方的间隔层刻蚀掉。The spacer layer is a molybdenum film layer or an aluminum film layer, and the spacer layer under the notch is etched away by an aluminum etching solution.
优选地,通过黄光制程图形化所述像素定义层;Preferably, the pixel definition layer is patterned by a yellow light process;
喷墨打印AMOLED显示面板的制备方法还包括下述步骤:The method for preparing an inkjet printed AMOLED display panel further includes the following steps:
在所述TFT背板上制备平坦层,所述像素定义层以及所述阳极均位于所述平坦层上。A flat layer is prepared on the TFT backplane, and the pixel definition layer and the anode are both located on the flat layer.
实施本发明,具有如下有益效果:本发明通过在位于TFT背板上的阳极表面制备一层间隔层,将间隔层上方的像素定义层刻蚀掉之后,即是间隔层表面还有残留的像素定义层材料,通过刻蚀液将间隔层刻蚀掉,从而去除间隔层表面所残留的像素定义层材料,从而提高阳极表面的洁净程度,减少残留,使得打印发光层更容易铺展均匀,以免AMOLED显示面板显示异常。而且,本发明没有增加干刻蚀制程,不会破坏像素定义层表面结构,也不会对像素定义层表面厚度和线宽造成损失。The implementation of the present invention has the following beneficial effects: The present invention prepares a spacer layer on the anode surface on the TFT backplane, and after the pixel definition layer above the spacer layer is etched away, there are pixels remaining on the surface of the spacer layer. Define the layer material. The spacer layer is etched away by an etching solution, thereby removing the pixel definition layer material remaining on the surface of the spacer layer, thereby improving the cleanliness of the anode surface and reducing the residue, making it easier to print the light-emitting layer to spread uniformly, so as to avoid AMOLED The display panel displays abnormally. Moreover, the present invention does not increase the dry etching process, will not damage the surface structure of the pixel definition layer, and will not cause loss of the surface thickness and line width of the pixel definition layer.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without paying creative labor.
图1是现有技术中TFT背板上制备有阳极和像素定义层的示意图;1 is a schematic diagram of an anode and a pixel definition layer prepared on a TFT backplane in the prior art;
图2是图1中的像素定义层所得到的结构示意图;FIG. 2 is a schematic structural diagram obtained by the pixel definition layer in FIG. 1; FIG.
图3是在图2中的阳极上制备墨水层的示意图;3 is a schematic diagram of preparing an ink layer on the anode in FIG. 2;
图4是本发明提供喷墨打印AMOLED显示面板的制备方法的流程图;4 is a flowchart of a method for manufacturing an inkjet printed AMOLED display panel according to the present invention;
图5是本发明提供的TFT背板上制备有阳极、间隔层和像素定义层的示意图;5 is a schematic diagram of an anode, a spacer layer, and a pixel definition layer prepared on a TFT backplane provided by the present invention;
图6是本发明提供的图形化图5中的像素定义层所得到的结构示意图;FIG. 6 is a schematic structural diagram obtained by graphically defining the pixel definition layer in FIG. 5 provided by the present invention; FIG.
图7是本发明提供的将图6中像素定义层的缺口下方的间隔层刻蚀掉后所得到的结构示意图;FIG. 7 is a schematic structural diagram obtained by etching the spacer layer under the notch of the pixel definition layer in FIG. 6 provided by the present invention; FIG.
图8是本发明提供的在图7中的阳极上制备墨水层的剖面图;8 is a cross-sectional view of an ink layer prepared on the anode in FIG. 7 provided by the present invention;
图9是本发明提供的在图7中的阳极上制备墨水层的俯视图;FIG. 9 is a top view of an ink layer prepared on the anode in FIG. 7 provided by the present invention; FIG.
图10是本发明提供的一实施例中阳极的结构示意图;10 is a schematic structural diagram of an anode according to an embodiment of the present invention;
图11是本发明提供的墨水层的结构示意图。FIG. 11 is a schematic structural diagram of an ink layer provided by the present invention.
具体实施方式Detailed ways
本发明提供一种喷墨打印AMOLED显示面板的制备方法,如图4所示, 该制备方法包括下述步骤:The invention provides a method for manufacturing an inkjet printed AMOLED display panel. As shown in FIG. 4, the method includes the following steps:
参考图5,制备TFT(Thin Film Transistor,薄膜晶体管)背板1,在TFT背板1上制备阳极4。Referring to FIG. 5, a TFT (Thin Film Transistor) backplane 1 is prepared, and an anode 4 is prepared on the TFT backplane 1.
在阳极4上制备用于隔绝阳极4与像素定义层的间隔层5。A spacer layer 5 is provided on the anode 4 to isolate the anode 4 from the pixel definition layer.
在TFT背板1上制备像素定义层3,且像素定义层3覆盖间隔层5。A pixel definition layer 3 is prepared on the TFT backplane 1, and the pixel definition layer 3 covers the spacer layer 5.
如图6所示,图形化像素定义层3,在像素定义层3上形成缺口31以露出间隔层5。图6中的30为图形化后的像素定义层。As shown in FIG. 6, the pixel definition layer 3 is patterned, and a notch 31 is formed on the pixel definition layer 3 to expose the spacer layer 5. 30 in FIG. 6 is a pixel definition layer after patterning.
如图7所示,通过刻蚀液将缺口31下方的间隔层5刻蚀掉,一并带走间隔层5上残留的像素定义层材料32,露出阳极4;阳极4的表面平坦且没有残留的像素定义层材料32或者其他的残留物。图7中所示的50为通过刻蚀液将缺口31下方的间隔层5刻蚀掉之后,露出阳极4。As shown in FIG. 7, the spacer layer 5 under the notch 31 is etched away by an etching solution, and the pixel definition layer material 32 remaining on the spacer layer 5 is taken away to expose the anode 4; the surface of the anode 4 is flat and there is no residue The pixels define layer material 32 or other residues. 50 shown in FIG. 7 is that the anode 4 is exposed after the spacer layer 5 under the notch 31 is etched away by an etching solution.
如图8所示,通过喷墨打印的方式在阳极4上形成用于发光的墨水层6。从图9中可以看出,墨水层6在阳极4的表面铺展良好,墨水层6可以在阳极4表面均匀平坦的铺展,进而可以提升AMOLED显示面板的显示效果。As shown in FIG. 8, an ink layer 6 for emitting light is formed on the anode 4 by means of inkjet printing. It can be seen from FIG. 9 that the ink layer 6 spreads well on the surface of the anode 4, and the ink layer 6 can spread evenly and evenly on the surface of the anode 4, thereby improving the display effect of the AMOLED display panel.
本发明中,在图形化像素定义层之后,不需要增加干刻蚀制程,因此不会破坏像素定义层的表面结构,也不会对像素定义层的厚度和线宽造成损失。In the present invention, after the pixel definition layer is patterned, there is no need to add a dry etching process, so the surface structure of the pixel definition layer will not be damaged, and the thickness and line width of the pixel definition layer will not be lost.
进一步地,间隔层5的厚度范围为300~800埃米。Further, the thickness of the spacer layer 5 ranges from 300 to 800 Angstroms.
进一步地,间隔层5为金属膜层,阳极4为透明电极或者反射电极。Further, the spacer layer 5 is a metal film layer, and the anode 4 is a transparent electrode or a reflective electrode.
在一实施例中,如图10所示,反射电极包含两层ITO膜层41以及夹持在两层ITO膜层41之间的银金属层42。在另一实施例中,透明电极为一层ITO(铟锡氧化物)膜层。In an embodiment, as shown in FIG. 10, the reflective electrode includes two ITO film layers 41 and a silver metal layer 42 sandwiched between the two ITO film layers 41. In another embodiment, the transparent electrode is an ITO (Indium Tin Oxide) film layer.
本发明中的AMOLED显示面板可以是顶发光或者底发光,当AMOLED显示面板为顶发光时,AMOLED显示面板的出射光线从与阳极相对的阴极透出,此时阳极为反射电极,阴极为透明电极。当AMOLED显示面板为底发光时,AMOLED显示面板的出射光线从阳极透出,此时阳极为透明电极,阴极是反射电极。The AMOLED display panel in the present invention may be top-emitting or bottom-emitting. When the AMOLED display panel is top-emitting, the light emitted from the AMOLED display panel passes through a cathode opposite to the anode. At this time, the anode is a reflective electrode and the cathode is a transparent electrode . When the AMOLED display panel emits light at the bottom, the light emitted from the AMOLED display panel passes through the anode. At this time, the anode is a transparent electrode and the cathode is a reflective electrode.
进一步地,在图形化像素定义层3之后还包括下述步骤:Further, the graphic pixel definition layer 3 further includes the following steps:
对图形化后的像素定义层30以及阳极4进行烘烤制程,通过烘烤制程 可以将像素定义层进行固化,还可以将阳极4中的非晶态的ITO膜层转化为结晶态的ITO膜层。The patterned pixel definition layer 30 and the anode 4 are subjected to a baking process. The pixel definition layer can be cured through the baking process, and the amorphous ITO film layer in the anode 4 can be converted into a crystalline ITO film. Floor.
进一步地,间隔层5为钼膜层或者铝膜层,通过铝刻蚀液将像素定义层的缺口31下方的间隔层5刻蚀掉。Further, the spacer layer 5 is a molybdenum film layer or an aluminum film layer, and the spacer layer 5 under the notch 31 of the pixel definition layer is etched away by using an aluminum etching solution.
进一步地,通过黄光制程图形化图5中所示的像素定义层3。一般而言,黄光制程包含在像素定义层上涂布光阻,曝光,显影,刻蚀像素定义层。Further, the pixel definition layer 3 shown in FIG. 5 is patterned by a yellow light process. Generally speaking, the yellow light process includes coating a photoresist on the pixel definition layer, exposing, developing, and etching the pixel definition layer.
进一步地,像素定义层为疏水性的像素定义层。Further, the pixel definition layer is a hydrophobic pixel definition layer.
进一步地,喷墨打印AMOLED显示面板的制备方法还包括下述步骤:Further, the method for preparing an inkjet printed AMOLED display panel further includes the following steps:
在TFT背板1上制备平坦层2,像素定义层3以及阳极4均位于平坦层2上。A flat layer 2 is prepared on the TFT back plate 1, and the pixel definition layer 3 and the anode 4 are both located on the flat layer 2.
进一步地,通过喷墨打印的方式在阳极4上形成墨水层5,具体为:Further, forming the ink layer 5 on the anode 4 by means of inkjet printing is specifically:
通过喷墨打印的方式在阳极4上依次形成图11所示的空穴层62和发光层61;其中,空穴层62包括空穴注入层622和空穴传输层621,空穴传输层621位于空穴注入层622和发光层61之间。The hole layer 62 and the light emitting layer 61 shown in FIG. 11 are sequentially formed on the anode 4 by inkjet printing. The hole layer 62 includes a hole injection layer 622 and a hole transport layer 621. The hole transport layer 621 It is located between the hole injection layer 622 and the light emitting layer 61.
优选地,上述的TFT背板1上薄膜晶体管的有源层可以为低温多晶硅材料或者IGZO(铟镓锌氧化物)等氧化物材料,还可以是其他的半导体材料。Preferably, the active layer of the thin film transistor on the TFT backplane 1 may be a low temperature polysilicon material or an oxide material such as IGZO (Indium Gallium Zinc Oxide), or other semiconductor materials.
综上所述,本发明提供的喷墨打印AMOLED显示面板中,在TFT背板的阳极制作完成后增加一道间隔层的成膜、黄光和刻蚀制程,之后进行像素定义层的黄光和烘烤制程,最后再用铝刻蚀液将间隔层刻蚀掉。In summary, in the inkjet printed AMOLED display panel provided by the present invention, after the anode of the TFT backplane is completed, a spacer film formation, yellow light, and etching process is added, and then the yellow light and The baking process, and finally the spacer layer is etched away with an aluminum etching solution.
由于铝刻蚀液对间隔层的刻蚀速率可达到
Figure PCTCN2018092356-appb-000001
在较短时间内即可将一定厚度的间隔层刻蚀干净,湿刻蚀的各向异性也保证了残留在间隔层表面残留的少量像素定义层材料不会引起间隔层的刻蚀不净。
As the etching rate of the spacer layer by the aluminum etchant can reach
Figure PCTCN2018092356-appb-000001
The spacer layer of a certain thickness can be etched clean in a short time, and the anisotropy of the wet etch also ensures that the small amount of pixel definition layer material remaining on the surface of the spacer layer will not cause the spacer layer to be etched uncleanly.
非晶态的ITO膜层也在像素定义层的烘烤制程中形成结晶态ITO膜层,铝刻蚀液不会与结晶态的ITO膜层发生反应,所以本发明可以保证在刻蚀掉间隔层并带走残留像素定义层材料的同时不对阳极膜层产生影响。The amorphous ITO film layer also forms a crystalline ITO film layer during the baking process of the pixel definition layer. The aluminum etching solution will not react with the crystalline ITO film layer, so the invention can ensure that the interval is etched away. Layer and take away the material of the remaining pixel definition layer without affecting the anode film layer.
本发明可以提高AMOLED显示面板中阳极膜层表面的洁净程度、减少残留,使得打印发光层更容易铺展均匀,以免AMOLED显示面板显示异常。The invention can improve the cleanliness of the surface of the anode film layer in the AMOLED display panel and reduce the residue, so that the printed light-emitting layer can be more easily spread uniformly, so as to avoid abnormal display of the AMOLED display panel.
而且,增加间隔层的成膜制程、黄光制程、刻蚀制程都是普通制程,对设备和物料无特殊需求,所以本发明可以在少量成本增加的情况下大幅提高 产品良率。Moreover, the film-forming process, the yellow-light process, and the etching process that increase the spacer layer are all ordinary processes, and there is no special requirement for equipment and materials, so the present invention can greatly improve the product yield with a small increase in cost.
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明,不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本发明的保护范围。The above content is a further detailed description of the present invention in combination with specific preferred embodiments, and it cannot be considered that the specific implementation of the present invention is limited to these descriptions. For those of ordinary skill in the technical field to which the present invention pertains, without deviating from the concept of the present invention, several simple deductions or replacements can be made, which should all be regarded as belonging to the protection scope of the present invention.

Claims (20)

  1. 一种喷墨打印AMOLED显示面板的制备方法,其中,包括下述步骤:A method for preparing an inkjet printed AMOLED display panel includes the following steps:
    制备TFT背板,在所述TFT背板上制备阳极;Preparing a TFT backplane, and preparing an anode on the TFT backplane;
    在所述阳极上制备用于隔绝阳极与像素定义层的间隔层;Preparing a spacer layer on the anode to isolate the anode from the pixel definition layer;
    在所述TFT背板上制备像素定义层,且所述像素定义层覆盖所述间隔层;Preparing a pixel definition layer on the TFT backplane, and the pixel definition layer covers the spacer layer;
    图形化所述像素定义层,在所述像素定义层上形成缺口以露出所述间隔层;Patterning the pixel definition layer and forming a gap on the pixel definition layer to expose the spacer layer;
    通过刻蚀液将所述缺口下方的间隔层刻蚀掉,露出所述阳极;Etching the spacer layer under the notch through an etching solution to expose the anode;
    通过喷墨打印的方式在所述阳极上形成墨水层。An ink layer is formed on the anode by means of inkjet printing.
  2. 根据权利要求1所述的喷墨打印AMOLED显示面板的制备方法,其中,所述间隔层的厚度范围为300~800埃米。The method for manufacturing an inkjet printed AMOLED display panel according to claim 1, wherein the thickness of the spacer layer ranges from 300 to 800 Angstroms.
  3. 根据权利要求1所述的喷墨打印AMOLED显示面板的制备方法,其中,所述间隔层为金属膜层,所述阳极为透明电极或者反射电极。The method of claim 1, wherein the spacer layer is a metal film layer, and the anode is a transparent electrode or a reflective electrode.
  4. 根据权利要求3所述的喷墨打印AMOLED显示面板的制备方法,其中,所述透明电极为一层ITO膜层,所述反射电极包含两层ITO膜层以及夹持在所述两层ITO膜层之间的银金属层。The method for preparing an inkjet printed AMOLED display panel according to claim 3, wherein the transparent electrode is a layer of ITO film, and the reflective electrode comprises two layers of ITO film and sandwiched between the two layers of ITO film Silver metal layer between layers.
  5. 根据权利要求4所述的喷墨打印AMOLED显示面板的制备方法,其中,在图形化所述像素定义层之后还包括下述步骤:The method for preparing an inkjet printed AMOLED display panel according to claim 4, further comprising the following steps after patterning the pixel definition layer:
    对所述像素定义层以及所述阳极进行烘烤制程。A baking process is performed on the pixel definition layer and the anode.
  6. 根据权利要求5所述的喷墨打印AMOLED显示面板的制备方法,其中,所述间隔层为钼膜层或者铝膜层,通过铝刻蚀液将所述缺口下方的间隔层刻蚀掉。The method for preparing an inkjet printed AMOLED display panel according to claim 5, wherein the spacer layer is a molybdenum film layer or an aluminum film layer, and the spacer layer under the notch is etched away by an aluminum etching solution.
  7. 根据权利要求1所述的喷墨打印AMOLED显示面板的制备方法,其中,通过黄光制程图形化所述像素定义层。The method for manufacturing an inkjet printed AMOLED display panel according to claim 1, wherein the pixel definition layer is patterned by a yellow light process.
  8. 根据权利要求1所述的喷墨打印AMOLED显示面板的制备方法,其中,所述像素定义层为疏水性的像素定义层。The method of claim 1, wherein the pixel definition layer is a hydrophobic pixel definition layer.
  9. 根据权利要求1所述的喷墨打印AMOLED显示面板的制备方法,其 中,还包括下述步骤:The method for manufacturing an inkjet printed AMOLED display panel according to claim 1, further comprising the following steps:
    在所述TFT背板上制备平坦层,所述像素定义层以及所述阳极均位于所述平坦层上。A flat layer is prepared on the TFT backplane, and the pixel definition layer and the anode are both located on the flat layer.
  10. 根据权利要求1所述的喷墨打印AMOLED显示面板的制备方法,其中,通过喷墨打印的方式在所述阳极上形成墨水层,具体为:The method for preparing an inkjet printed AMOLED display panel according to claim 1, wherein the forming an ink layer on the anode by inkjet printing is specifically:
    通过喷墨打印的方式在所述阳极上依次形成空穴层和发光层;其中,所述空穴层包括空穴注入层和空穴传输层,所述空穴传输层位于所述空穴注入层和所述发光层之间。A hole layer and a light emitting layer are sequentially formed on the anode by inkjet printing; wherein the hole layer includes a hole injection layer and a hole transport layer, and the hole transport layer is located at the hole injection. Between the layer and the light emitting layer.
  11. 一种喷墨打印AMOLED显示面板的制备方法,其中,包括下述步骤:A method for preparing an inkjet printed AMOLED display panel includes the following steps:
    制备TFT背板,在所述TFT背板上制备阳极;Preparing a TFT backplane, and preparing an anode on the TFT backplane;
    在所述阳极上制备用于隔绝阳极与像素定义层的间隔层;Preparing a spacer layer on the anode to isolate the anode from the pixel definition layer;
    在所述TFT背板上制备像素定义层,且所述像素定义层覆盖所述间隔层;Preparing a pixel definition layer on the TFT backplane, and the pixel definition layer covers the spacer layer;
    图形化所述像素定义层,在所述像素定义层上形成缺口以露出所述间隔层;Patterning the pixel definition layer and forming a gap on the pixel definition layer to expose the spacer layer;
    通过刻蚀液将所述缺口下方的间隔层刻蚀掉,露出所述阳极;Etching the spacer layer under the notch through an etching solution to expose the anode;
    通过喷墨打印的方式在所述阳极上形成墨水层;Forming an ink layer on the anode by means of inkjet printing;
    所述间隔层的厚度范围为300~800埃米;The thickness of the spacer layer ranges from 300 to 800 Å;
    所述间隔层为金属膜层,所述阳极为透明电极或者反射电极。The spacer layer is a metal film layer, and the anode is a transparent electrode or a reflective electrode.
  12. 根据权利要求11所述的喷墨打印AMOLED显示面板的制备方法,其中,所述透明电极为一层ITO膜层,所述反射电极包含两层ITO膜层以及夹持在所述两层ITO膜层之间的银金属层。The method for preparing an inkjet printed AMOLED display panel according to claim 11, wherein the transparent electrode is a layer of ITO film, and the reflective electrode comprises two layers of ITO film and sandwiched between the two layers of ITO film Silver metal layer between layers.
  13. 根据权利要求12所述的喷墨打印AMOLED显示面板的制备方法,其中,在图形化所述像素定义层之后还包括下述步骤:The method for manufacturing an inkjet printed AMOLED display panel according to claim 12, further comprising the following steps after patterning the pixel definition layer:
    对所述像素定义层以及所述阳极进行烘烤制程。A baking process is performed on the pixel definition layer and the anode.
  14. 根据权利要求13所述的喷墨打印AMOLED显示面板的制备方法,其中,所述间隔层为钼膜层或者铝膜层,通过铝刻蚀液将所述缺口下方的间隔层刻蚀掉。The method for manufacturing an inkjet printed AMOLED display panel according to claim 13, wherein the spacer layer is a molybdenum film layer or an aluminum film layer, and the spacer layer under the notch is etched away by an aluminum etching solution.
  15. 根据权利要求11所述的喷墨打印AMOLED显示面板的制备方法,其中,通过黄光制程图形化所述像素定义层;The method for manufacturing an inkjet printed AMOLED display panel according to claim 11, wherein the pixel definition layer is patterned by a yellow light process;
    所述像素定义层为疏水性的像素定义层。The pixel definition layer is a hydrophobic pixel definition layer.
  16. 根据权利要求11所述的喷墨打印AMOLED显示面板的制备方法,其中,还包括下述步骤:The method for manufacturing an inkjet printed AMOLED display panel according to claim 11, further comprising the following steps:
    在所述TFT背板上制备平坦层,所述像素定义层以及所述阳极均位于所述平坦层上;Preparing a flat layer on the TFT backplane, and the pixel definition layer and the anode are located on the flat layer;
    通过喷墨打印的方式在所述阳极上形成墨水层,具体为:Forming an ink layer on the anode by inkjet printing is specifically:
    通过喷墨打印的方式在所述阳极上依次形成空穴层和发光层;其中,所述空穴层包括空穴注入层和空穴传输层,所述空穴传输层位于所述空穴注入层和所述发光层之间。A hole layer and a light emitting layer are sequentially formed on the anode by inkjet printing; wherein the hole layer includes a hole injection layer and a hole transport layer, and the hole transport layer is located at the hole injection. Between the layer and the light emitting layer.
  17. 一种喷墨打印AMOLED显示面板的制备方法,其中,包括下述步骤:A method for preparing an inkjet printed AMOLED display panel includes the following steps:
    制备TFT背板,在所述TFT背板上制备阳极;Preparing a TFT backplane, and preparing an anode on the TFT backplane;
    在所述阳极上制备用于隔绝阳极与像素定义层的间隔层;Preparing a spacer layer on the anode to isolate the anode from the pixel definition layer;
    在所述TFT背板上制备像素定义层,且所述像素定义层覆盖所述间隔层;所述像素定义层为疏水性的像素定义层;A pixel definition layer is prepared on the TFT backplane, and the pixel definition layer covers the spacer layer; the pixel definition layer is a hydrophobic pixel definition layer;
    图形化所述像素定义层,在所述像素定义层上形成缺口以露出所述间隔层;Patterning the pixel definition layer and forming a gap on the pixel definition layer to expose the spacer layer;
    通过刻蚀液将所述缺口下方的间隔层刻蚀掉,露出所述阳极;Etching the spacer layer under the notch through an etching solution to expose the anode;
    通过喷墨打印的方式在所述阳极上形成墨水层;Forming an ink layer on the anode by means of inkjet printing;
    其中,通过喷墨打印的方式在所述阳极上形成墨水层,具体为:Forming an ink layer on the anode by inkjet printing is specifically:
    通过喷墨打印的方式在所述阳极上依次形成空穴层和发光层;其中,所述空穴层包括空穴注入层和空穴传输层,所述空穴传输层位于所述空穴注入层和所述发光层之间。A hole layer and a light emitting layer are sequentially formed on the anode by inkjet printing; wherein the hole layer includes a hole injection layer and a hole transport layer, and the hole transport layer is located at the hole injection. Between the layer and the light emitting layer.
  18. 根据权利要求17所述的喷墨打印AMOLED显示面板的制备方法,其中,所述间隔层的厚度范围为300~800埃米;The method for manufacturing an inkjet printed AMOLED display panel according to claim 17, wherein the thickness of the spacer layer ranges from 300 to 800 Angstroms;
    所述间隔层为金属膜层,所述阳极为透明电极或者反射电极。The spacer layer is a metal film layer, and the anode is a transparent electrode or a reflective electrode.
  19. 根据权利要求18所述的喷墨打印AMOLED显示面板的制备方法, 其中,所述透明电极为一层ITO膜层,所述反射电极包含两层ITO膜层以及夹持在所述两层ITO膜层之间的银金属层;The method for manufacturing an inkjet printed AMOLED display panel according to claim 18, wherein the transparent electrode is a layer of ITO film, and the reflective electrode comprises two layers of ITO film and sandwiched between the two layers of ITO film Silver metal layer between layers;
    在图形化所述像素定义层之后还包括下述步骤:After graphicizing the pixel definition layer, the following steps are further included:
    对所述像素定义层以及所述阳极进行烘烤制程;Performing a baking process on the pixel definition layer and the anode;
    所述间隔层为钼膜层或者铝膜层,通过铝刻蚀液将所述缺口下方的间隔层刻蚀掉。The spacer layer is a molybdenum film layer or an aluminum film layer, and the spacer layer under the notch is etched away by an aluminum etching solution.
  20. 根据权利要求17所述的喷墨打印AMOLED显示面板的制备方法,其中,通过黄光制程图形化所述像素定义层;The method for manufacturing an inkjet printed AMOLED display panel according to claim 17, wherein the pixel definition layer is patterned by a yellow light process;
    喷墨打印AMOLED显示面板的制备方法还包括下述步骤:The method for preparing an inkjet printed AMOLED display panel further includes the following steps:
    在所述TFT背板上制备平坦层,所述像素定义层以及所述阳极均位于所述平坦层上。A flat layer is prepared on the TFT backplane, and the pixel definition layer and the anode are both located on the flat layer.
PCT/CN2018/092356 2018-05-29 2018-06-22 Method for preparing ink-jet printing amoled display panel WO2019227546A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/114,413 US10692945B2 (en) 2018-05-29 2018-08-28 Manufacturing method for an inkjet printing AMOLED display panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810528668.1 2018-05-29
CN201810528668.1A CN108832009A (en) 2018-05-29 2018-05-29 A kind of preparation method of inkjet printing AMOLED display panel

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/114,413 Continuation US10692945B2 (en) 2018-05-29 2018-08-28 Manufacturing method for an inkjet printing AMOLED display panel

Publications (1)

Publication Number Publication Date
WO2019227546A1 true WO2019227546A1 (en) 2019-12-05

Family

ID=64146041

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/092356 WO2019227546A1 (en) 2018-05-29 2018-06-22 Method for preparing ink-jet printing amoled display panel

Country Status (2)

Country Link
CN (1) CN108832009A (en)
WO (1) WO2019227546A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114300641A (en) * 2021-12-24 2022-04-08 深圳市华星光电半导体显示技术有限公司 Organic light-emitting display device manufacturing method and organic light-emitting display device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109817826B (en) * 2019-01-22 2020-09-01 深圳市华星光电半导体显示技术有限公司 Manufacturing method of OLED display panel
CN110071224B (en) 2019-04-04 2020-07-10 深圳市华星光电半导体显示技术有限公司 Organic light emitting device and method of fabricating the same
CN110112328A (en) * 2019-04-08 2019-08-09 深圳市华星光电半导体显示技术有限公司 Organic light emitting diode display and its manufacturing method
CN110047905B (en) * 2019-05-16 2022-08-09 京东方科技集团股份有限公司 Display substrate, display panel and display device
CN110993646B (en) 2019-11-08 2022-07-12 深圳市华星光电半导体显示技术有限公司 Preparation method of OLED (organic light emitting diode) back plate and OLED back plate
CN111987243B (en) * 2020-08-11 2021-11-02 Tcl华星光电技术有限公司 Display panel manufacturing method and display panel
CN112420946A (en) * 2020-11-12 2021-02-26 深圳市华星光电半导体显示技术有限公司 Display panel, preparation method thereof and display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104638147A (en) * 2015-03-04 2015-05-20 京东方科技集团股份有限公司 Pixel demarcation layer and OLED (organic light emitting diode) device
CN104752490A (en) * 2015-04-16 2015-07-01 京东方科技集团股份有限公司 Organic light emitting diode displaying panel, manufacturing method thereof and display device
CN105529409A (en) * 2015-11-11 2016-04-27 Tcl集团股份有限公司 Printed AM-QDLED device and preparation method thereof
CN107195796A (en) * 2017-06-19 2017-09-22 深圳市华星光电技术有限公司 Dot structure based on inkjet technology and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006030937A1 (en) * 2004-09-15 2006-03-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8310152B2 (en) * 2007-12-10 2012-11-13 Panasonic Corporation Organic EL device and EL display panel having a low driving voltage and high light emitting frequency, and method for manufacturing
CN104064583A (en) * 2014-05-29 2014-09-24 何东阳 AMOLED (Active Matrix/Organic Light Emitting Diode) display device with ultrahigh resolution ratio
CN105068349A (en) * 2015-09-16 2015-11-18 京东方科技集团股份有限公司 Array substrate, display panel, display device and manufacturing method of array substrate
CN105185815A (en) * 2015-10-09 2015-12-23 信利(惠州)智能显示有限公司 OLED display device and electronic device
CN105914223B (en) * 2016-05-04 2019-08-13 上海天马有机发光显示技术有限公司 The manufacturing method and display panel of display panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104638147A (en) * 2015-03-04 2015-05-20 京东方科技集团股份有限公司 Pixel demarcation layer and OLED (organic light emitting diode) device
CN104752490A (en) * 2015-04-16 2015-07-01 京东方科技集团股份有限公司 Organic light emitting diode displaying panel, manufacturing method thereof and display device
CN105529409A (en) * 2015-11-11 2016-04-27 Tcl集团股份有限公司 Printed AM-QDLED device and preparation method thereof
CN107195796A (en) * 2017-06-19 2017-09-22 深圳市华星光电技术有限公司 Dot structure based on inkjet technology and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114300641A (en) * 2021-12-24 2022-04-08 深圳市华星光电半导体显示技术有限公司 Organic light-emitting display device manufacturing method and organic light-emitting display device
CN114300641B (en) * 2021-12-24 2023-07-28 深圳市华星光电半导体显示技术有限公司 Organic light-emitting display device manufacturing method and organic light-emitting display device

Also Published As

Publication number Publication date
CN108832009A (en) 2018-11-16

Similar Documents

Publication Publication Date Title
WO2019227546A1 (en) Method for preparing ink-jet printing amoled display panel
US10868190B2 (en) Top-gate thin film transistor, manufacturing method thereof, array substrate and display panel comprising top-gate thin film transistor
US9065001B2 (en) Light-emitting display backplane, display device and manufacturing method of pixel define layer
US10115775B2 (en) OLED display device and manufacturing method thereof, and display apparatus
TWI674689B (en) Display device and method for fabricating the same
WO2016165233A1 (en) Organic light emitting diode display panel and manufacturing method therefor, and display device
US11189641B2 (en) Method for manufacturing array substrate, array substrate and display apparatus
US20160351643A1 (en) Array substrate, its manufacturing method and display device
US20080218058A1 (en) Organic light emitting diode display device
US20110198596A1 (en) Organic light-emitting display device and method of manufacturing the same
US20190013371A1 (en) Display device and method of manufacturing the same
WO2017202035A1 (en) Pixel unit and method for preparing the same, array substrate and display device
WO2018090482A1 (en) Array substrate and preparation method therefor, and display device
US8441592B2 (en) TFT-LCD array substrate and manufacturing method thereof
WO2019019236A1 (en) Manufacturing method for oled back plate, and manufacturing method for oled panel
US10692945B2 (en) Manufacturing method for an inkjet printing AMOLED display panel
US20220310981A1 (en) Display panel and manufacturing method thereof
WO2018196091A1 (en) Active-matrix organic light emitting diode panel and method for manufacturing same
US20160086981A1 (en) Fabrication methods of transparent conductive electrode and array substrate
US20120099058A1 (en) Array substrate and manufacturing method thereof, liquid crystal display
US20110168985A1 (en) Organic Light Emitting Diode Display Device and Method of Manufacturing the Same
WO2016078248A1 (en) Array substrate and manufacturing method therefor, and display device
US11362155B2 (en) Display substrate, manufacturing method thereof and display device
WO2021088144A1 (en) Oled backplate preparation method and oled backplate
JPWO2006109585A1 (en) Substrate provided with conductive layer, display device, and method for manufacturing substrate provided with conductive layer

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18920556

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18920556

Country of ref document: EP

Kind code of ref document: A1