WO2019056633A1 - 一种工艺槽机械臂速度的控制方法 - Google Patents

一种工艺槽机械臂速度的控制方法 Download PDF

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Publication number
WO2019056633A1
WO2019056633A1 PCT/CN2017/118028 CN2017118028W WO2019056633A1 WO 2019056633 A1 WO2019056633 A1 WO 2019056633A1 CN 2017118028 W CN2017118028 W CN 2017118028W WO 2019056633 A1 WO2019056633 A1 WO 2019056633A1
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Prior art keywords
speed
cassette
process tank
controlling
mechanical arm
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PCT/CN2017/118028
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English (en)
French (fr)
Inventor
左国军
夏傲雪
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常州捷佳创精密机械有限公司
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Publication of WO2019056633A1 publication Critical patent/WO2019056633A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to cleaning equipment and wet processing equipment for the solar photovoltaic industry, and more particularly to a method for controlling the mechanical arm speed of key process tanks of such equipment.
  • the object of the present invention is to provide a method for controlling the speed of a manipulator of a process tank, which is placed in a process tank at a distance from the liquid level at the lower edge of the cassette, in view of the above-mentioned drawbacks of the prior art.
  • the robot arm is uniformly lowered at a speed of 200 mm or less per second, so that the cassette is slowly entered into the liquid surface;
  • the mechanical arm When the mechanical arm is taken out of the process tank, the mechanical arm is raised at a constant speed of 200 mm or less until the slide cassette is completely out of the liquid level.
  • the mechanical arm descends at a high speed of 500 mm or more.
  • the average speed of the mechanical arm decreases by 100-200 mm per second.
  • the mechanical arm moves at a high speed of 500 mm or more until it is sent to the next station.
  • the certain height is less than or equal to 200 mm.
  • the slow drop and pull-up control method adopted by the present invention can greatly ensure the liquid level stability of the key slot without fluctuation, and at the same time, after the liquid discharge surface of the cassette, the slide
  • the liquid hanging condition at the lower edge of the box can also be improved. This ensures a good process response of the silicon wafer in the critical slot, which is far superior to the existing control mode.
  • Figure 1 shows a flow chart of the basket of the present invention.
  • Figure 2 shows a flow chart of the basket of the present invention.
  • the present invention provides a control method for the mechanical arm speed of the process tank in order to maintain the liquid level stability, and is divided into two parts: a basket and a basket.
  • the robot arm When the basket is released, the robot arm needs to put the cassette into the process tank, and the arm is first lowered at a high speed to improve the processing efficiency during the production process of the wafer. Then, when the lower edge of the cassette is at a certain height from the liquid level, the robot arm A uniform speed drop of 200 mm per second or less allows the cassette to slowly enter the liquid level until the cassette is placed in the processing position.
  • the silicon wafer may first drop at a speed of more than 500 mm per second, and then slowly enter the liquid surface at a speed of 100-200 mm per second at a distance of 200 mm or less than 200 mm. It is only a preferred embodiment of the present invention, and those skilled in the art can also appropriately adjust the speed of the robot arm as needed.
  • the arm When taking the basket, the arm needs to take the cassette out of the process tank, and the arm is raised at a constant speed of 200 mm or less until the cassette is completely out of the liquid level. Once the cassette is completely out of the liquid level, the arm will move at a high speed of 500 mm per second or more until it is sent to the next station.
  • the invention can effectively reduce the fluctuation of the liquid medicine and maintain the stability of the liquid medicine by controlling the multi-stage speed.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种工艺槽机械臂速度的控制方法，所述机械臂在将载片盒放至工艺槽内，在载片盒下边缘距离液面一定高度时，所述机械臂以200毫米每秒以下的速度匀速下降，使所述载片盒缓慢进入液面；所述机械臂在将载片盒从工艺槽中取出时，所述机械臂以200毫米每秒以下的速度匀速上升，直至所述载片盒完全脱离液面。

Description

一种工艺槽机械臂速度的控制方法 技术领域
本发明涉及太阳能光伏行业的清洗设备和湿法处理设备，尤其涉及这些设备的关键工艺槽的机械臂速度的控制方法。
背景技术
在太阳能硅片的清洗设备和湿法处理设备中，尤其是在新式工艺黑硅处理设备中，在关键工艺槽的环节，通常都会需要利用机械臂来取放硅片篮，在取放盛装硅片的载片盒时，很容易对液槽的液体造成一定的影响，使药液不稳定，液面产生波动，从而对工艺造成一定的影响。
发明内容
本发明的目的是针对上述现有技术存在的缺陷，提供一种工艺槽机械臂速度的控制方法，所述机械臂在将载片盒放至工艺槽内，在载片盒下边缘距离液面一定高度时，所述机械臂以200毫米每秒以下的速度匀速下降，使所述载片盒缓慢进入液面；
所述机械臂在将载片盒从工艺槽中取出时，所述机械臂以200毫米以下的速度匀速上升，直至所述载片盒完全脱离液面。
具体的，所述载片盒的下边缘在距离液面一定高度之上时，所述机械臂以500毫米每秒以上的速度高速下降。
优选的，所述载片盒下边缘距离液面一定高度时，所述机械臂均速下降速度为100-200毫米每秒。
具体的，所述载片盒完全脱离液面后，所述机械臂以500毫米每秒以上的速度高速运动，直至送至下一个工位。所述一定高度为小于或等于200毫米。
与现有技术相比，本发明所采用的这种缓慢下降和拉升的控制方法能极大的保证关键槽的液面稳定，不产生波动、同时在载片盒出液面后，载片盒下边沿挂液情况也能得到良好的改善。从而保证了硅片在关键槽的良好工艺反应情况，远远优于现有的控制模式。
附图说明
图1示出了本发明取篮流程图。
图2示出了本发明放篮流程图。
具体实施方式
下面结合附图和实施例对发明进行详细的说明，且所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。
如图1、图2所示，本发明为了保持液面稳定提出工艺槽机械臂速度的控制方法，分为放篮和取篮两部分。
放篮时，机械臂需要将载片盒放至工艺槽内，机械臂先是高速下降，提升硅片生产过程中的加工效率，然后在载片盒下边缘距离液面一定高度时，机械臂以200毫米每秒以下的速度匀速下降，使所述载片盒缓慢进入液面，直至载片盒放至处理位置。在本实施例中，硅片可以先以大于500毫米每秒的速度下降，然后在距离液面200毫米或者是小于200毫米的时候以100-200毫米每秒的速度缓慢进入液面，这些数据仅是本发明的一个较优实施例，本领域普通技术人员也可以根据需要适当调整机械臂的速度。
取篮时，机械臂需要将载片盒从工艺槽中取出，机械臂先以200毫米以下的速度匀速上升，直至载片盒完全脱离液面。一旦载片盒完全脱离液面后，机械臂将以500毫米每秒以上的速度高速运动，直至送至下一个工位。这些数据也仅是本发明的一个较优实施例，本领域内的普通技术人员同样也可以根据需要调整相应的速度。
本发明通过采用多段速进行控制，能够有效减少药液波动，维持药液稳定。
上述实施例仅用于说明本发明的具体实施方式。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和变化，这些变形和变化都应属于本发明的保护范围。

Claims (5)

  1. 一种工艺槽机械臂速度的控制方法，其特征在于，所述机械臂在将载片盒放至工艺槽内，在载片盒下边缘距离液面一定高度时，所述机械臂以200毫米每秒以下的速度匀速下降，使所述载片盒缓慢进入液面；
    所述机械臂在将载片盒从工艺槽中取出时，所述机械臂以200毫米以下的速度匀速上升，直至所述载片盒完全脱离液面。
  2. 如权利要求1所述的工艺槽机械臂速度的控制方法，其特征在于，所述载片盒的下边缘在距离液面一定高度之上时，所述机械臂以500毫米每秒以上的速度高速下降。
  3. 如权利要求1所述的工艺槽机械臂速度的控制方法，其特征在于，所述载片盒下边缘距离液面一定高度时，所述机械臂的均速下降速度为100-200毫米每秒。
  4. 如权利要求1所述的工艺槽机械臂速度的控制方法，其特征在于，所述载片盒完全脱离液面后，所述机械臂以500毫米每秒以上的速度高速运动，直至送至下一个工位。
  5. 如权利要求1所述的工艺槽机械臂速度的控制方法，其特征在于，所述一定高度为小于或等于200毫米。
PCT/CN2017/118028 2017-09-25 2017-12-22 一种工艺槽机械臂速度的控制方法 WO2019056633A1 (zh)

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CN108493298A (zh) * 2018-04-10 2018-09-04 常州亿晶光电科技有限公司 黑硅沉银槽入水和出水机械臂运行方法
CN110053969B (zh) * 2019-04-23 2020-04-07 浙江金麦特自动化系统有限公司 一种机器人自动搬运清洗系统及方法

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JPS60234975A (ja) * 1984-05-04 1985-11-21 Dainippon Screen Mfg Co Ltd 板状物の浸漬処理方法
JPH08107137A (ja) * 1994-08-08 1996-04-23 Tokyo Electron Ltd 搬送装置、搬送方法、洗浄装置及び洗浄方法
JP2000344342A (ja) * 1999-03-26 2000-12-12 Dainippon Screen Mfg Co Ltd 基板処理装置
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