WO2019041679A1 - 一种实现阵列波导光栅双线性温度补偿装置及方法 - Google Patents

一种实现阵列波导光栅双线性温度补偿装置及方法 Download PDF

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WO2019041679A1
WO2019041679A1 PCT/CN2017/118168 CN2017118168W WO2019041679A1 WO 2019041679 A1 WO2019041679 A1 WO 2019041679A1 CN 2017118168 W CN2017118168 W CN 2017118168W WO 2019041679 A1 WO2019041679 A1 WO 2019041679A1
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driving rod
temperature
rod
end surface
bilinear
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PCT/CN2017/118168
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English (en)
French (fr)
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凌九红
吴凡
孔祥健
李长安
胡家艳
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武汉光迅科技股份有限公司
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Priority to US16/759,795 priority Critical patent/US10969545B2/en
Publication of WO2019041679A1 publication Critical patent/WO2019041679A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G02B6/12026—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence
    • G02B6/1203—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence using mounting means, e.g. by using a combination of materials having different thermal expansion coefficients
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G02B6/12011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the arrayed waveguides, e.g. comprising a filled groove in the array section
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G02B6/12016—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the input or output waveguides, e.g. tapered waveguide ends, coupled together pairs of output waveguides

Definitions

  • the invention relates to a temperature compensation device and a method, and belongs to the technical field of optical communication, in particular to a device and a method for realizing an arrayed waveguide grating bilinear temperature compensation.
  • AWG chips are usually silicon-based planar optical waveguide components.
  • the center wavelength varies greatly with ambient temperature, which is about 11 pm/°C.
  • AWG devices In order to make the AWG chip work normally in the working environment, AWG devices usually need temperature compensation technology. To maintain the stability of the wavelength.
  • One of the AWG chip temperature compensation technologies is a mechanical moving method.
  • the patent CN101099098A introduces an AWG chip temperature compensation scheme, which divides the AWG chip into two parts 6a and 6b, and the driver drives 6a to move relative to 6b to compensate the AWG.
  • the wavelength of the chip is offset by temperature.
  • the wavelength change value of this scheme is linear with the change value of temperature.
  • the variation of the wavelength ⁇ of the AWG chip with temperature T is not a single linear relationship, but has a nonlinear relationship, as shown in the following formula 1:
  • the temperature/wavelength curve is shown as curve c in Figure 13 and Figure 14, which is a parabola and is a reflection of the residual wavelength/temperature nonlinear effect.
  • curve c of Fig. 14 when the temperature range changes more, the wavelength change rate is larger, and at -40-85 degrees, the wavelength change reaches 60 pm or more.
  • the curve b shown in FIG. 14 is a graph overcompensation at the high temperature region done to compensate for the AWG chip G b of the curve, shown as curve c 14 less compensation curve, in a low temperature region of the AWG chip to make a D undercompensation of the curve, so that the AWG chip having different amounts of compensation in different temperature ranges the flat curve compensation, temperature segment Can be divided into at least two paragraphs or even multiple segments.
  • the invention provides a device for realizing bilinear temperature compensation of an arrayed waveguide grating (AWG), so that the wavelength shift of the AWG chip is controlled within a small range, and the wavelength shift reaches + in the range of -40 ° C to 85 ° C. -15pm.
  • AWG arrayed waveguide grating
  • the invention mainly solves the problem that the wavelength of the AWG chip with temperature shifts in the prior art, and proposes a bilinear temperature compensation device and method for realizing the arrayed waveguide grating.
  • the device and method respectively use two drivers to realize linear compensation and superposition effect nonlinear compensation, so that two parts of the split chip optical path have different relative displacement/effective compensation amount in different temperature ranges, thereby making the AWG chip
  • the central wavelength exhibits two gentle curves with temperature, which can effectively reduce the residual nonlinear temperature effect.
  • the present invention enables wavelength shifts of less than 30 pm over a temperature range of -40 degrees to 80 degrees, which can be applied in outdoor scenes.
  • An arrayed waveguide grating bilinear temperature compensation device includes:
  • the first driver has a first driving rod, and the first driving rod is respectively connected to the first sub-section and the second sub-section of the relatively movable AWG chip;
  • a second driver having a second driving rod having a shape variable different from the first driving rod in a partial temperature interval, the second driving rod being connected at one end to the first sub-section of the AWG chip and at the other end detachably contacting the first driving rod a force receiving end surface, wherein the force receiving end surface and the first driving rod end surface position on the second sub-portion are relatively fixed;
  • the first driving rod is provided with a retractable and/or rotating elastic portion.
  • a ball is disposed between the second driving rod and the force receiving end surface
  • the end surface of the second driving rod that is in contact with the force receiving end surface has a pointed shape or a circular arc shape.
  • the first driving rod has an L shape, one side of which is parallel to the second driving rod, and the other side of which is perpendicular to the force receiving end surface.
  • the end face of the second drive rod is perpendicular to the force receiving end surface.
  • the first driving rod and the second driving rod have the same thermal expansion coefficient and different lengths.
  • a bilinear temperature compensating means length of the first driving lever L 1 a second drive rod length L 2 subject to the following constraint conditions:
  • the expansion and contraction amount k1 of the first actuator per unit temperature thermal expansion and contraction, and the expansion and contraction amount k2,r of the second actuator per unit temperature thermal expansion and contraction are proportional coefficients, which are related to the stiffness and structural shape of the two actuators, Obtained by stress analysis calculation simulation or test;
  • the unit temperature moving distance ⁇ , w is the compensation amount.
  • the second driving portion is plural, and the length between each of the second driving rods is different.
  • the number of the second driving rods is two and has the same expansion coefficient as the first driving rod; wherein the length of one of the second driving rods is greater than the first One drive rod, the other second drive rod has a length that is smaller than the first drive rod.
  • An array waveguide grating bilinear temperature compensation method includes:
  • the second driving rod is detachably contacted with a force end surface, and the end surface of the force receiving end is relatively fixed with an end surface of the first driving rod;
  • the two drive rods are different from the deformation of the first drive rod to change the elastic deformation of the first drive rod.
  • the second driving rod is in contact with the force receiving end surface to deform the first driving rod in a part of the temperature range; In the interval, the second driving rod is separated from the force receiving end surface to recover the deformation of the first driving rod.
  • the above-described arrayed waveguide grating bilinear temperature compensation method is characterized in that, in a normal temperature state, the length of the second driving rod is greater than the length of the first driving rod; and:
  • the expansion amount of the second driving rod is greater than the expansion amount of the first driving rod, and the second driving rod stretches the first driving rod;
  • the contraction amount of the second driving rod is larger than the contraction amount of the first driving rod, and the second driving rod is separated from the force receiving end surface.
  • the above-described arrayed waveguide grating bilinear temperature compensation method is characterized in that, in a normal temperature state, the length of the second driving rod is smaller than the length of the first driving rod; and:
  • the expansion amount of the second driving rod is smaller than the expansion amount of the first driving rod, and the second driving rod is separated from the force receiving end surface;
  • the contraction amount of the second driving rod is smaller than the contraction amount of the first driving rod, and the second driving rod is in contact with the force receiving end surface to deform the first driving rod.
  • the present invention has the following advantages: 1.
  • the present invention achieves different compensation coefficients by having different linear expansion lengths or (and) elastic deformation in two different temperature zones; thereby changing the center wavelength of the AWG chip with temperature. Presenting two gentle curves
  • the present invention enables wavelength shifts of less than 30 pm in the temperature range of -40 to 80 degrees, and can be applied in outdoor scenes.
  • Figure 1 is a structural view of the apparatus of the present invention
  • FIG. 2 is a schematic view showing the first driver of the device of the present invention disposed on an AWG chip
  • Figure 3 is an embodiment of a first actuator of the apparatus of the present invention
  • Figure 4 is another embodiment of the first actuator of the apparatus of the present invention.
  • Figure 5 is a schematic view showing an embodiment of a second driver arrangement of the present invention.
  • Figure 6 is a schematic view showing a specific embodiment of the second driver of the present invention.
  • Figure 7 is a schematic view showing the contact of the second driver with the force end face of the first driver
  • Figure 8 is a schematic view showing another contact end face of the second driver and the first driver
  • Figure 9 is a schematic view of a specific embodiment of the apparatus of the present invention.
  • Figure 10 is a schematic view of a specific embodiment of the apparatus of the present invention at a high temperature
  • Figure 11 is a schematic view showing a specific embodiment of the apparatus of the present invention at a low temperature
  • Figure 12 is a schematic view showing the principle of three actuator embodiments of the apparatus of the present invention at a high temperature
  • Figure 13 is a schematic view showing the principle of three actuator embodiments of the apparatus of the present invention at a low temperature
  • FIG. 14 is a schematic diagram of a compensation curve of the temperature compensation principle of the AWG chip of the device of the present invention.
  • the apparatus of the present invention includes a first driver 1 and a second driver 2.
  • the first driver 1 includes a driving rod 11, and the driving rod 11 is respectively provided with a base 301 and a base 302.
  • the base can be, but is not limited to, a transparent material with a low expansion coefficient.
  • quartz, glass, etc. the connection of the driving rod 11 and the base may be bonded or the like, and the bases 301 and 302 are respectively fixed on the first portion w1 and the second portion w2 after the division of the AWG chip.
  • the driving rod 11 of the first driver 1 is provided with an elastic structure 12, which can be elastically deformed along the longitudinal direction of the driving rod 11.
  • the end surface of the base 302 of the first driver 1 is larger than the driving rod 11.
  • the end surface, the connection common surface of the base 302 of the first driver 1 and the driving rod 11 is set as the force end surface m,
  • the second embodiment of the first drive 1 of the drive rod 11 formed L-shaped end face n is a force end face, with an elastic structure 13;
  • the second driver 2 includes a driving rod 21 and a base 303.
  • One end surface of the driving rod 21 of the second driver 2 is fixed to the base 303, and the base 303 is fixed to the second portion w2 of the AWG chip.
  • the position of the pedestal 303 disposed on the second portion w2 of the AWG chip is such that the other end surface 202 of the second driver 2 is in contact with the stressed end face m or n of the first driver 1;
  • an embodiment of the second driver 2 is such that the driving rod 21 of the second driver 2 is mounted with the ball 203 on the end surface 202 of the first driver 1 to reduce the contact area and achieve the point contact.
  • the connection between the 203 and the second actuator 2 is, but not limited to, press-fitting, welding, and bonding.
  • the end face 202 of the second driver 2 in contact with the force receiving end face m of the first driver 1 can be disposed in a pointed shape or a circular arc shape to achieve point-to-face contact.
  • a preferred solution is that the drive rod 11 of the first drive 1 and the drive rod 21 of the second drive 2 are of different lengths of the same material. Three specific embodiments are given below.
  • the driving rod 11 of the first driver 1 has a resilient structure 12 having a length L 1 , and the two ends of the driving rod 11 are respectively fixed to the two portions w2 and w1 of the AWG chip by the bases 301 and 302, and the second The driving rod 21 of the driver 2 is fixed to the second portion w2 of the AWG chip after being divided by the base 303.
  • the position of the base 303 of the second driver 2 on the AWG chip w2 is such that one end surface 202 of the second driver 2 is The force receiving surface m of the first actuator 1 is in contact.
  • Second driver drive rod 2 is provided a length L 2 smaller than the first drive lever 11 of the actuator 21 L 1, a first drive and the second drive shaft 11 drives the second drive rod 21 using the same material.
  • ⁇ is the relative displacement required for the compensation of the wavelength per unit temperature
  • n s and n c are the effective refractive indices of the input/output planar waveguide and the array waveguide of the AWG chip, respectively
  • n g is the group refractive index
  • d is the adjacent array waveguide
  • m is the diffraction order
  • R is the Roland focal length
  • d ⁇ is the center wavelength change of the AWG chip.
  • Equation 2 The amount of expansion and contraction k of the thermal expansion and contraction per unit temperature of the drive is calculated by Equation 2.
  • L is the length of the drive rod
  • the first driver 1 and the second driver 2 use the same material line.
  • the expansion coefficient is the same, so the expansion amount k 1 of the first actuator 1 per unit temperature is greater than the expansion amount k 2 per unit temperature of the second actuator 2 , and the larger expansion amount of the first actuator 1 causes the force end surface of the first actuator 1 to be m the second separator 202 and the end face of the driver 2, a first driver base 302 by pushing the AWG chip w1 movement, the distance traveled by the chip is the unit of temperature variation of the first drive unit 1, i.e.
  • the length of the driving rod 11 of the first driver 1 can be calculated by the formula 2 ( The coefficient of linear expansion of the drive rod 11 and the drive rod 21)
  • the compensation curve is set to the under-compensation curve, and the unit temperature compensation amount of the AWG chip is the under-compensation amount, for example, set to 0.9 ⁇ , and the compensation curve is the under-compensation curve a D .
  • the contraction amount of the second driver 2 is smaller than that of the first driver 1.
  • the amount of contraction the first driver 1 has an elastic structure 12, the second driver 2 elastically deforms the first driver 1, and the moving distance of the AWG chip w1 with respect to the unit temperature of w2 is shared by the first driver 1 and the second driver 2, Its unit temperature moving distance can be expressed as:
  • r is the proportional coefficient, which is related to the stiffness and structural shape of the two actuators, and can be obtained by stress analysis calculation simulation or experiment.
  • the arrangement of the lengths L 1 , L 2 of the first driver 1 driving rod 11 and the second driver 2 driving rod 21 may be opposite to that of the first embodiment, the length of the first driver 1 driving rod 11 being smaller than the length of the driving rod 21 of the second driver 2;
  • the linear expansion coefficients of the driving rods of the first driver 1 and the second driver 2 are the same, so the second driver 2 amount of contraction per unit temperature per unit amount of contraction k 2 is greater than the temperature of 1 K 1 first driver, the second driver drives a first end surface 202 and the force of the end face 2 m separation 1, the first actuator 1 through the base 302 pulls the AWG chip w1 to move 0.9 ⁇ distance, the compensation curve is as shown in FIG. 14 curve a D , and the length L 1 of the second driver 2 driving rod 21 can be calculated by Equation 2;
  • the first driver 1 When the temperature rises higher than the normal temperature, since the expansion amount of the driving rod 21 of the second driver 2 is larger than the expansion amount of the driving rod 11 of the first driver 1, the first driver 1 has the elastic structure 12, and the second driver 2 causes the first driver 1 to occur.
  • the elastic deformation, the first actuator 1 makes the relative displacement amount of the AWG chip per unit temperature to 1.1 ⁇ through the susceptor 302, the compensation curve is as shown in the curve b G of FIG. 14, and the length L 2 of the driving rod 21 of the second driver 2 is calculated by Equation 3.
  • More than two drivers may be provided.
  • the first driver 1, the second driver 2, and the third driver 3 when the temperature is higher than the normal temperature, when the second driver pushes the first driver to undergo elastic deformation ⁇ k 1
  • the third driver 3 is separated from the first driver 1
  • the compensation amount of the displacement of the second portion of the AWG chip relative to the first portion of the chip is formed by superposition of the first driver 1 and the second driver 2; as shown in FIG.
  • the third driver is in contact with the first driver and causes the first driver to elastically deform ⁇ k 2 to generate a compensation amount different from the displacement of the second driver 2.

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Abstract

本发明涉及一种温度补偿装置及方法，属于光通信技术领域，具体涉及一种实现阵列波导光栅双线性温度补偿装置及方法。本发明由两个驱动器组成，第一驱动器在低于常温25℃至-40℃(低温区)或高于常温25℃至85℃(高温区)进行线性补偿，第二驱动器用于在另一温度区实现AWG芯片波长/温度的叠加效应非线性补偿。这样可以使分割后芯片光路的两个部分在不同的温度范围内出现不同的相对位移/有效补偿量，在高温区范围内出现过补偿，而在低温区出现欠补偿，从而使AWG芯片的中心波长随温度变化呈现两段平缓的曲线，可以有效降低残余的非线性温度效应。

Description

一种实现阵列波导光栅双线性温度补偿装置及方法 技术领域
本发明涉及一种温度补偿装置及方法，属于光通信技术领域，具体涉及一种实现阵列波导光栅双线性温度补偿装置及方法。
背景技术
AWG芯片通常是基于硅基的平面光波导元件，其中心波长随环境温度变化较大，约为11pm/℃，为使AWG芯片在工作环境温度内正常工作，通常AWG器件都需要采用温度补偿技术来保持波长的稳定。
其中一种AWG芯片温度补偿技术是机械移动方式，如专利CN101099098A中介绍了一种AWG芯片温度补偿方案，将AWG芯片分割为2部分6a和6b，驱动器驱动6a使其与6b相对移动从而补偿AWG芯片波长由温度引起的偏移。该方案的波长变化值与温度的变化值是线性的关系。
实际上，AWG芯片的波长λ随温度T的变化值并不是单一的线性关系，而是具有非线性关系，如下公式1所示：
dλ＝a*dT 2+b*dT+c    公式1
该方案不能补偿其二次项，经过单一的线性补偿后，温度/波长变化曲线如图13图14所示曲线c，该曲线为抛物线，是残余的波长/温度非线性效应的体现。由图14曲线c可以看出，当温度范围变化越大时，波长变化率越大，在-40-85度时，波长变化达到60pm以上。
近年来随着AWG器件的应用场景从室内扩展至室外，即工作环境温度要求达到-40℃～85℃，AWG芯片波长随温度的偏移量加大会导致AWG芯片 其它相关指标的急剧劣化，因此对波长控制技术提出了更高的要求。
为实现在-40℃～85℃范围内降低波长偏移量，一种方法是采用温度分段补偿，如图14曲线b所示为过补偿曲线，在高温区对AWG芯片做过补偿b G段曲线，如图14曲线c所示为欠补偿曲线，在低温区对AWG芯片做欠补偿a D段曲线，使AWG芯片在不同温度段具有不同的补偿量而使补偿曲线平缓，温度分段可至少分为两段甚至于多段。本发明提出一种实现阵列波导光栅(AWG)双线性温度补偿的装置，使AWG芯片的波长偏移控制在较小的范围内，在-40℃～85℃范围内，波长偏移达到+-15pm。
发明内容
本发明主要是解决现有技术所存在的AWG芯片波长随温度的偏移问题，提出了一种实现阵列波导光栅双线性温度补偿装置及方法。该装置及方法利用两个驱动器分别实现线性补偿和叠加效应非线性补偿，从而使分割后芯片光路的两个部分在不同的温度范围内出现不同的相对位移/有效补偿量，从而使AWG芯片的中心波长随温度变化呈现两段平缓的曲线，可以有效降低残余的非线性温度效应。本发明使得在-40度至80度的温度范围内波长偏移小于30pm，可在室外场景应用。
本发明的上述技术问题主要是通过下述技术方案得以解决的：
一种阵列波导光栅双线性温度补偿装置，包括：
第一驱动器，具有第一驱动杆，该第一驱动杆两端分别连接可相对移动的AWG芯片的第一子部和第二子部；
第二驱动器，具有在部分温度区间内形变量不同于第一驱动杆的第二驱动杆，该第二驱动杆一端连接于AWG芯片的第一子部上，其另一端可分离式接触于一受力端面，所述受力端面与第二子部上的第一驱动杆端面位 置相对固定；
其中，所述第一驱动杆上设置有可伸缩和/或转动的弹性部。
优选的，上述的一种阵列波导光栅双线性温度补偿装置，所述第二驱动杆与所述受力端面之间设置有滚珠；
和/或，
所述第二驱动杆与所述受力端面相接触的端面为一尖形或圆弧形。
优选的，上述的一种阵列波导光栅双线性温度补偿装置，所述第一驱动杆为一L形，其一边平行于所述第二驱动杆，其另一边作为所述受力端面垂直于第二驱动杆的端面。
优选的，上述的一种阵列波导光栅双线性温度补偿装置，所述第一驱动杆与所述第二驱动杆的热膨胀系数相同，长度不同。
优选的，上述的一种阵列波导光栅双线性温度补偿装置，所述第一驱动杆的长度L 1，第二驱动杆的长度L 2受以下条件约束：
Figure PCTCN2017118168-appb-000001
α＝k 1+r*k 2
式中，第一驱动器每单位温度热胀冷缩的伸缩量k1，第二驱动器每单位温度热胀冷缩的伸缩量k2，r为比例系数，与两个驱动器的刚度及结构形状相关，可通过应力分析计算模拟或试验获得；
Figure PCTCN2017118168-appb-000002
为第一驱动杆线膨胀系数，
Figure PCTCN2017118168-appb-000003
为第二驱动杆线膨胀系数，单位温度移动距离α，w为补偿量。
优选的，上述的一种阵列波导光栅双线性温度补偿装置，所述第二驱动部为多个，并且各第个第二驱动杆之间的长度不同。
优选的，上述的一种阵列波导光栅双线性温度补偿装置，第二驱动杆的数量为两个并且具有与第一驱动杆相同的膨胀系数；其中一个第二驱动杆的长度大于所述第一驱动杆，另一个第二驱动杆的长度小于第一驱动杆。
一种阵列波导光栅双线性温度补偿方法，包括：
利用连接AWG芯片两子部的第一驱动杆在温度变化时驱动两子部间相对移动；
在所述AWG芯片两子部间设置第二驱动杆，该第二驱动杆一端与一受力端面可分离式接触，所述受力端面与第一驱动杆的一个端面位置相对固定；利用第二驱动杆不同于第一驱动杆的形变量来改变第一驱动杆的弹性形变。
优选的，上述的一种阵列波导光栅双线性温度补偿方法，在部分温度区间内，所述第二驱动杆与所述受力端面接触而使所述第一驱动杆产生形变；在部分温度区间内，所述第二驱动杆与所述受力端面分离而使所述第一驱动杆形变恢复。
优选的，上述的一种阵列波导光栅双线性温度补偿方法，其特征在于，常温状态下，第二驱动杆的长度大于第一驱动杆的长度；并且：
在温度高于常温时，第二驱动杆的膨胀量大于第一驱动杆的膨胀量，所述第二驱动杆拉伸所述第一驱动杆；
在温度低于常温时，第二驱动杆的收缩量大于第一驱动杆的收缩量，所述第二驱动杆与受力端面分离。
优选的，上述的一种阵列波导光栅双线性温度补偿方法，其特征在于，常温状态下，第二驱动杆的长度小于第一驱动杆的长度；并且：
在温度高于常温时，第二驱动杆的膨胀量小第一驱动杆的膨胀量，所述第二驱动杆与受力端面分离；
在温度低于常温时，第二驱动杆的收缩量小于第一驱动杆的收缩量，所述第二驱动杆与受力端面接触使第一驱动杆产生形变。
因此，本发明具有如下优点：1、本发明通过两个驱动器在不同温度区 的具有不同的线性膨胀长度或(和)发生弹性形变达到不同的补偿系数；从而使AWG芯片的中心波长随温度变化呈现两段平缓的曲线
2、本发明使得在-40度至80度的温度范围内波长偏移小于30pm，可在室外场景应用。
附图说明
图1是本发明装置的结构图；
图2是本发明装置第一驱动器设置于AWG芯片上的示意图；
图3是本发明装置第一驱动器的一个实施例；
图4是本发明装置第一驱动器的另一个实施例；
图5是本发明第二驱动器设置的一个实施例示意图；
图6是本发明第二驱动器的一个具体实施例示意图；
图7是第二驱动器与第一驱动器的受力端面接触示意图；
图8是第二驱动器与第一驱动器的另一种受力端面接触示意图；
图9是本发明装置的一个具体实施例示意图
图10是本发明装置的一个具体实施例高温时的示意图；
图11是本发明装置的一个具体实施例低温时的示意图；
图12是本发明装置三个驱动器实施例原理高温时的示意图；
图13是本发明装置三个驱动器实施例原理低温时的示意图；
图14是本发明装置AWG芯片温度波长补偿原理补偿曲线示意图；
其中：
c补偿量为α的补偿曲线
a补偿量为0.9α的欠补偿曲线
b补偿量为1.1α的过补偿曲线
a D、欠补偿曲线的低温补偿曲线；
b G、过补偿曲线的高温补偿曲线；
具体实施方式
下面通过实施例，并结合附图，对本发明的技术方案作进一步具体的说明。
实施例：
如图1所示，本发明装置包括第一驱动器1、第二驱动器2。
如图2所示，一个具体实施例为第一驱动器1包括驱动杆11、驱动杆11两端分别设置有基座301和基座302，基座可采用但不限于使用低膨胀系数的透明材料如石英、玻璃等，驱动杆11与基座的连接可采用粘接等方式，基座301、302分别固定于AWG芯片分割后的第一部分w1和第二部分w2上。
如图3所示，第一驱动器1的驱动杆11具备有弹性结构12，沿驱动杆11长度方向可产生弹性形变；一个具体实施例为第一驱动器1的基座302端面大于驱动杆11的端面，第一驱动器1基座302与驱动杆11的连接公共面设置为受力端面m，
如图4所示，第二个实施例为第一驱动器1的驱动杆11形成L形设置一个端面n为受力端面，具有弹性结构13；
如图5所示，第二驱动器2包括驱动杆21和基座303，第二驱动器2的驱动杆21的一个端面固定于基座303上，基座303固定于AWG芯片的第二部分w2上，基座303设置于AWG芯片的第二部分w2上的位置是使第二驱动器2的另一个端面202与第一驱动器1的受力端面m或n接触；
如图6所示，第二驱动器2的一个实施例为第二驱动器2的驱动杆21 与第一驱动器1接触的端面202安装滚珠203，减小接触的面积，达到点面接触的目的，滚珠203与第二驱动器2的连接方式为但不限于压入、焊接、粘接。
如图7图8所示，第二驱动器2与第一驱动器1的受力端面m接触的端面202可设置为尖形或圆弧形等达到点面接触的目的。
一种优选的方案是第一驱动器1的驱动杆11和第二驱动器2的驱动杆21采用相同的材料不同的长度。下面给出三个具体实施例。
实施例一
如图9所示，第一驱动器1的驱动杆11具有弹性结构12长度为L 1，驱动杆11两端通过基座301、302分别固定于AWG芯片分割的两部分w2和w1上，第二驱动器2的驱动杆21通过基座303固定于AWG芯片分割后的第二部分w2上，第二驱动器2的基座303设置于AWG芯片w2上的位置是使第二驱动器2的一个端面202与第一驱动器1的受力面m接触。第二驱动器2驱动杆21的长度L 2设置小于第一驱动器1驱动杆11的长度L 1，第一驱动器1驱动杆11和第二驱动器2驱动杆21采用相同的材料。
如图14所示，AWG芯片温度波长完全补偿时，分割后芯片两部分w1和w2的单位温度的相对位移量为α，被分割的AWG芯片两部分的相对位移dx与温度变化dT之间的关系，由公式1得出，补偿曲线为c，
Figure PCTCN2017118168-appb-000004
α为每单位温度波长补偿所需的相对位移量，n s和n c分别是AWG芯片的输入/输出平面波导和阵列波导的有效折射率，n g是群折射率，d是相邻阵列波导在罗兰圆周上的间距，m是衍射级次，R是罗兰圆焦距，dλ是AWG芯片的中心波长变化值。
驱动器每单位温度热胀冷缩的伸缩量k由公式2计算，
Figure PCTCN2017118168-appb-000005
L为驱动杆的长度，
Figure PCTCN2017118168-appb-000006
为驱动杆线膨胀系数，
如图10所示，温度升高时，由于第一驱动器1驱动杆11的长度L 1大于第二驱动器2驱动杆21的长度L 2，第一驱动器1和第二驱动器2采用相同的材料线膨胀系数相同，所以第一驱动器1每单位温度的膨胀量k 1大于第二驱动器2每单位温度的膨胀量k 2，第一驱动器1较大的膨胀量使第一驱动器1的受力端面m与第二驱动器2的端面202分离，第一驱动器1通过基座302推动AWG芯片w1移动，芯片单位温度移动的距离即为第一驱动器1单位温度有效长度的变化量即膨胀量k 1。如图14所示，当第一驱动器1每单位温度补偿的相对位移量k 1大于α为过补偿曲线c，设定k 1＝1.1α，则补偿曲线高于常温时为过补偿曲线b G，由公式2可计算第一驱动器1驱动杆11的长度
Figure PCTCN2017118168-appb-000007
(
Figure PCTCN2017118168-appb-000008
为驱动杆11和驱动杆21的线膨胀系数)
如图14所示，温度降低时，设定补偿曲线为欠补偿曲线，AWG芯片单位温度补偿量为欠补偿量，例如设置为0.9α，补偿曲线为欠补偿曲线a D，
如图11所示，在温度低于常温时，由于第二驱动器2驱动杆21的长度L 2小于第一驱动器1驱动杆11的长度L 1，第二驱动器2的收缩量小于第一驱动器1的收缩量，第一驱动器1具有弹性结构12，第二驱动器2使第一驱动器1发生弹性形变，AWG芯片w1相对于w2单位温度的移动距离由第一驱动器1和第二驱动器2共同作用，其单位温度移动距离可以表示为：
α＝k 1+r*k 2  公式3
其中，r为比例系数，与两个驱动器的刚度及结构形状相关，可通过应力分析计算模拟或试验获得。
则由公式3：
Figure PCTCN2017118168-appb-000009
于是，第一驱动器1驱动杆11、第二驱动器2驱动杆21的长度分别为
Figure PCTCN2017118168-appb-000010
Figure PCTCN2017118168-appb-000011
实施例二
第一驱动器1驱动杆11和第二驱动器2驱动杆21的长度L 1、L 2的设置可与实施例一相反，第一驱动器1驱动杆11长度小于第二驱动器2驱动杆21的长度；温度降低时，由于第二驱动器2驱动杆21的长度L 2大于第一驱动器1驱动杆11的长度L 1，第一驱动器1和第二驱动器2驱动杆的线膨胀系数相同，所以第二驱动器2每单位温度的收缩量k 2大于第一驱动器1每单位温度的收缩量k 1，使第二驱动器2的端面202与第一驱动器1的受力端面m分离，第一驱动器1通过基座302拉动AWG芯片w1移动0.9α距离，补偿曲线如图14曲线a D，第二驱动器2驱动杆21的长度L 1可由公式2计算；
温度升高高于常温时，由于第二驱动器2驱动杆21的膨胀量大于第一驱动器1驱动杆11的膨胀量，第一驱动器1具有弹性结构12，第二驱动器2使第一驱动器1发生弹性形变，第一驱动器1通过基座302使AWG芯片每单位温度的相对位移量为1.1α，补偿曲线如图14曲线b G，第二驱动器2驱动杆21的长度L 2由公式3计算。
实施例三
可设置多于两个的驱动器，如图12所示，第一驱动器1、第二驱动器2和第三驱动器3，在温度高于常温时，当第二驱动器推动第一驱动器发生弹性形变Δk 1时，第三驱动器3与第一驱动器1分离，AWG芯片第二部分相对于芯片第一部分发生位移的补偿量由第一驱动器1和第二驱动器2叠加 形成；如图13所示，在低温收缩时，第二驱动器2与第一驱动器1分离，第三驱动器与第一驱动器接触并使第一驱动器发生弹性形变Δk 2，产生不同于第二驱动器2的位移的补偿量。
本文中所描述的具体实施例仅仅是对本发明精神作举例说明。本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代，但并不会偏离本发明的精神或者超越所附权利要求书所定义的范围。

Claims (10)

  1. 一种阵列波导光栅双线性温度补偿装置，包括：
    第一驱动器，具有第一驱动杆，该第一驱动杆两端分别连接可相对移动的AWG芯片的第一子部和第二子部；
    其特征在于，还包括：
    第二驱动器，具有在部分温度区间内形变量不同于第一驱动杆的第二驱动杆，该第二驱动杆一端连接于AWG芯片的第一子部上，其另一端可分离式接触于一受力端面，所述受力端面与第二子部上的第一驱动杆端面位置相对固定；
    其中，所述第一驱动杆上设置有可伸缩和/或转动的弹性部。
  2. 根据权利要求1所述的一种阵列波导光栅双线性温度补偿装置，其特征在于，所述第二驱动杆与所述受力端面之间设置有滚珠；
    和/或，
    所述第二驱动杆与所述受力端面相接触的端面为一尖形或圆弧形。
  3. 根据权利要求1所述的一种阵列波导光栅双线性温度补偿装置，其特征在于，所述第一驱动杆为一L形，其一边平行于所述第二驱动杆，其另一边作为所述受力端面垂直于第二驱动杆的端面。
  4. 根据权利要求1所述的一种阵列波导光栅双线性温度补偿装置，其特征在于，所述第一驱动杆与所述第二驱动杆的热膨胀系数相同，长度不同。
  5. 根据权利要求1所述的一种阵列波导光栅双线性温度补偿装置，其特征在于，所述第一驱动杆的长度L 1，第二驱动杆的长度L 2受以下条件约 束：
    Figure PCTCN2017118168-appb-100001
    α＝k 1+r*k 2
    式中，第一驱动器每单位温度热胀冷缩的伸缩量k1，第二驱动器每单位温度热胀冷缩的伸缩量k2，r为比例系数，与两个驱动器的刚度及结构形状相关，可通过应力分析计算模拟或试验获得；
    Figure PCTCN2017118168-appb-100002
    为第一驱动杆线膨胀系数，
    Figure PCTCN2017118168-appb-100003
    为第二驱动杆线膨胀系数，单位温度移动距离α，w为补偿量。
  6. 根据权利要求1所述的一种阵列波导光栅双线性温度补偿装置，其特征在于，第二驱动杆的数量为两个并且具有与第一驱动杆相同的膨胀系数；其中一个第二驱动杆的长度大于所述第一驱动杆，另一个第二驱动杆的长度小于第一驱动杆。
  7. 一种阵列波导光栅双线性温度补偿方法，其特征在于，包括：
    利用连接AWG芯片两子部的第一驱动杆在温度变化时驱动两子部间相对移动；
    在所述AWG芯片两子部间设置第二驱动杆，该第二驱动杆一端与一受力端面可分离式接触，所述受力端面与第一驱动杆的一个端面位置相对固定；利用第二驱动杆不同于第一驱动杆的形变量来改变第一驱动杆的弹性形变。
  8. 根据权利要求7所述的一种阵列波导光栅双线性温度补偿方法，其特征在于，在部分温度区间内，所述第二驱动杆与所述受力端面接触而使所述第一驱动杆产生形变；在部分温度区间内，所述第二驱动杆与所述受力端面分离而使所述第一驱动杆形变恢复。
  9. 根据权利要求7所述的一种阵列波导光栅双线性温度补偿方法，其特征在于，常温状态下，第二驱动杆的长度大于第一驱动杆的长度；并且：
    在温度高于常温时，第二驱动杆的膨胀量大于第一驱动杆的膨胀量，所述第二驱动杆拉伸所述第一驱动杆；
    在温度低于常温时，第二驱动杆的收缩量大于第一驱动杆的收缩量，所述第二驱动杆与受力端面分离。
  10. 根据权利要求7所述的一种阵列波导光栅双线性温度补偿方法，其特征在于，常温状态下，第二驱动杆的长度小于第一驱动杆的长度；并且：
    在温度高于常温时，第二驱动杆的膨胀量小第一驱动杆的膨胀量，所述第二驱动杆与受力端面分离；
    在温度低于常温时，第二驱动杆的收缩量小于第一驱动杆的收缩量，所述第二驱动杆与受力端面接触使第一驱动杆产生形变。
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CN109425929A (zh) * 2017-08-31 2019-03-05 上海永鼎光电子技术有限公司 一种实现宽温度范围内波长稳定的无热阵列波导光栅
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