WO2019039447A1 - Dual rf tag - Google Patents

Dual rf tag Download PDF

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Publication number
WO2019039447A1
WO2019039447A1 PCT/JP2018/030749 JP2018030749W WO2019039447A1 WO 2019039447 A1 WO2019039447 A1 WO 2019039447A1 JP 2018030749 W JP2018030749 W JP 2018030749W WO 2019039447 A1 WO2019039447 A1 WO 2019039447A1
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WO
WIPO (PCT)
Prior art keywords
surface
rf tag
formed
element portion
dual rf
Prior art date
Application number
PCT/JP2018/030749
Other languages
French (fr)
Japanese (ja)
Inventor
詩朗 杉村
Original Assignee
株式会社フェニックスソリューション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2017-162673 priority Critical
Priority to JP2017162673 priority
Application filed by 株式会社フェニックスソリューション filed Critical 株式会社フェニックスソリューション
Publication of WO2019039447A1 publication Critical patent/WO2019039447A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30Arrangements for providing operation on different wavebands
    • H01Q5/307Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H01Q5/357Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
    • H01Q5/364Creating multiple current paths
    • H01Q5/371Branching current paths

Abstract

[Problem] The objective of the present invention is to provide a dual RF tag which does not require a switch. [Solution] A dual RF tag 100 comprises a low band radiating element portion 210 formed in a top surface 270, a high band radiating element portion 220 having a different peripheral length to the low band radiating element portion 210, and a rear surface 280 opposing the top surface 270, and includes a ground element portion 400 formed in the rear surface 280, an inductor pattern portion 250 formed in the top surface 270, a balance coil portion 260 formed in the top surface 270, an IC chip 500 placed on the inductor pattern portion 250, and an insulating substrate 300 formed between the top surface 270 and the rear surface 280, wherein the ground element portion 400 and the balance coil portion 260 are electrically connected to one another.

Description

Dual RF tag

The present invention relates to dual RF tags.

For example, according to Patent Document 1 (Japanese Unexamined Patent Publication No. 2017-501619), the antenna configuration is a switch having an open state and a closed state, and the first frequency band in the first frequency band according to the switch being in an open state. And a second antenna operating as a second active drive element in a first frequency band in response to the switch being in an open state. The closed state is operable by operatively coupling a first impedance between the first antenna and the radio frequency ground and a second impedance between the second antenna and the radio frequency ground. By combining, the first antenna and the second antenna are configured to operate in a second frequency band different from the first frequency band. A method is disclosed wherein the first antenna acts as a parasitic element in a second frequency band and the second antenna acts as an active drive element in the second frequency band.

The device described in Patent Document 1 has a first active drive antenna element in a first frequency band in response to at least one switch having an open state and a closed state, and at least one switch being in an open state. A first antenna configured to operate and a first antenna configured to operate as a second active drive antenna element in a first frequency band in response to the at least one switch being in an open state; A device comprising: two antennas, wherein the closed state is by operably coupling a first impedance between the first antenna and the radio frequency ground, and the second antenna and the radio frequency ground And a second antenna different from the first frequency band by operably coupling a second impedance between the first antenna and the second antenna. It is to configured to operate in a wave number band.

JP-T 2017-501619 gazette

As described above, the dual RF tag is configured to require at least one switch having an open state and a closed state, as described in Patent Document 1.
The main object of the present invention is to provide a dual RF tag which does not require a switch.
Another object of the present invention is to provide a dual RF tag which requires no switch, dramatically improves communication sensitivity, and can receive nondirectional radio waves.

(1)
According to one aspect, a dual RF tag includes a first radiation element portion formed on a first surface, a second radiation element portion having a circumferential length different from that of the first radiation element portion, and a second surface facing the first surface. A ground element portion formed on the second surface, an inductor pattern formed on the first surface, a balance coil formed on the first surface, an IC chip mounted on the inductor pattern, The insulating base formed between the surface and the second surface, and a shorting portion shorting the inductor pattern and the balance coil, wherein the shorting portion and the ground element portion are electrically conducted.

In this case, an antenna according to one frequency can be formed by the first radiation element unit, and an antenna according to another frequency can be formed by the second radiation element unit.
As a result, a dual RF tag that does not require a switch can be obtained. In particular, by setting one frequency as the European frequency and the other frequency as the US or Japanese frequency, it is possible to obtain a dual RF tag that can be used worldwide.
Note that a dual RF tag means an RF tag that can handle multiple frequencies. The balance coil is also referred to as a balanced coil. Hereinafter, in the present specification, the balance coil will be described as the same as the balanced coil.

(2)
A dual RF tag according to another aspect includes a first radiating element portion formed on a first surface, a second radiating element portion having a circumferential length different from that of the first radiating element portion, and a second surface facing the first surface A ground element portion formed on the second surface, an inductor pattern formed on the first surface, a balance coil formed on the first surface, an IC chip mounted on the inductor pattern, And an insulating base formed between the first surface and the second surface, wherein the ground element portion and the balance coil portion are electrically conducted.

In this case, an antenna according to one frequency can be formed by the first radiation element unit, and an antenna according to another frequency can be formed by the second radiation element unit.
As a result, a dual RF tag that does not require a switch can be obtained. In particular, by setting one frequency as the European frequency and the other frequency as the US or Japanese frequency, it is possible to obtain a dual RF tag that can be used worldwide.

(3)
A dual RF tag according to a third aspect of the invention is the dual RF tag according to one aspect or the other aspect, wherein the first radiation element portion is formed to extend in the longitudinal direction, and the second radiation element portion is a first radiation It may be formed in parallel with the element part.

In this case, since the phase difference is 90 degrees and -90 degrees from the relationship between the resistance (reactance) of the capacitor and the reactance of the impedance between the first radiation element unit and the second radiation element unit, they should be arranged in parallel. Is preferred.

(4)
The dual RF tag according to the fourth aspect of the present invention may further include, in the dual RF tag according to any one of the first aspect to the third aspect, an adhesive layer for adhering to a metal member on the back surface of the ground element portion.

In this case, the metal member can be used as an antenna by sticking the dual RF tag to the metal member. As a result, communication sensitivity can be dramatically improved, and nondirectional radio waves can be received.

(5)
The dual RF tag according to the fifth invention is the dual RF tag according to any one of the first to fourth inventions, wherein the first radiation element portion has a wavelength λ on the low frequency side (around 860 MHz) of the UHF band RFID frequency. The second radiation element portion is designed to correspond to any one of λ / 4, λ / 2, 3λ / 4, 5λ / 8, and the second radiation element portion is a high frequency side of the UHF band RFID frequency (950 MHz to 960 MHz). It may be designed to correspond to any one of λ / 4, λ / 2, 3 λ / 4, 5 λ / 8 with respect to the wavelength λ of (near).

In this case, the radiation element length corresponding to the frequency can be set. As a result, communication sensitivity can be dramatically improved, and nondirectional radio waves can be received.
In addition, it is preferable that the first radiation element portion and the second radiation element portion have their respective perimeters measured for the wavelength λ / 2 of the target frequency.

(6)
The dual RF tag according to the sixth aspect of the invention is the dual RF tag according to any one of the first aspect through the fifth aspect, wherein the insulating substrate may be made of a foam member.

In this case, since the insulating base is formed of a foam member, the durability can be enhanced and the capacitor can be formed reliably. Also, the opening can be reliably held. In particular, the foamed member is preferably made of expanded polystyrene or the like.

(7)
The dual RF tag according to the seventh invention is the dual RF tag according to any one of the one aspect to the fifth invention, wherein the insulating substrate may be made of a ceramic member, a resin or paper.

In this case, when the insulating base material is made of a ceramic member, resin or paper dielectric, miniaturization of the dual RF tag can be realized. For example, it can also be used as a device.

(8)
A dual RF tag according to an eighth aspect of the invention is the dual RF tag according to any one of the one aspect through the sixth aspect, wherein the insulating substrate is formed on the entire surface of the opposing surface of the first surface and the second surface. Good.

In this case, since the insulating base is formed on the entire surface of the opposing portion of the first surface and the second surface, the first and second radiating element portions formed on the first surface, and the second surface While being able to form easily the capacitor with the ground element section which is formed, it is possible to keep the capacity of the capacitor constant.

It is a typical perspective view showing an example which looked at a dual RF tag concerning this embodiment from the surface. It is a typical perspective view showing an example which looked at a dual RF tag concerning this embodiment from the back. It is a schematic plan view which shows an example of the surface side of a dual RF tag. It is a schematic diagram which shows an example of the equivalent circuit of a dual RF tag. It is a figure which shows an example of the reading distance with respect to the frequency of a dual RF tag. It is a schematic plan view which shows an example of the surface side of another dual RF tag. It is a schematic diagram which shows an example of the equivalent circuit of the dual RF tag shown in FIG. It is the figure which adhere | attached the dual RF tag on the electroconductive member. It is an equivalent circuit at the time of adhering a dual RF tag on a conductive member.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same components are denoted by the same reference numerals. Moreover, in the case of the same sign, their names and functions are also the same. Therefore, detailed description about them shall not be repeated.

This Embodiment
FIG. 1 is a schematic perspective view showing an example of viewing the surface of dual RF tag 100 according to the present embodiment, and FIG. 2 is a schematic view showing an example of viewing back of dual RF tag 100 according to the present embodiment. Perspective view.
FIG. 3 is a schematic plan view showing an example of the surface side of the dual RF tag 100. As shown in FIG.

(Dual RF tag 100)
As shown in FIGS. 1, 2 and 3, the dual RF tag 100 includes a low band radiating element unit 210, a high band radiating element unit 220, a conducting unit 230, an inductor pattern unit 250, a balance coil unit 260, and an insulating base 300. , And the ground element portion 400. Further, the IC chip 500 is disposed in the inductor pattern portion 250 of the dual RF tag 100.

As shown in FIGS. 1, 2 and 3, the dual RF tag 100 has a rectangular parallelepiped shape.

(Low-band radiation element unit 210 and high-band radiation element unit 220)
A low band radiating element unit 210 and a high band radiating element unit 220 are formed on the surface 270 of the dual RF tag 100. The low band radiating element unit 210 and the high band radiating element unit 220 are formed in parallel to the surface 270.

(Inductor pattern 250 and balance coil 260)
Further, on the surface 270, an inductor pattern portion 250 and a balance coil portion 260 are formed. The inductor pattern portion 250 and the balance coil portion 260 are disposed on one end side of the surface 270 of the dual RF tag 100, and the low band radiating element portion 210 and the high band radiating element portion 220 connected to the balance coil portion 260 It is provided extending.
The balance coil unit 260 is also referred to as a balanced coil. Hereinafter, in the present specification, the balance coil unit 260 will be described as the same as the balanced coil unit 260.

(Grand element section 400)
Furthermore, as shown in FIG. 2, a ground element portion 400 is formed on the back surface 280 of the dual RF tag 100. In addition, an adhesive layer 450 (see FIG. 8) may be further included for adhering to the metal member on the back surface of the ground element portion.

In the present embodiment, the low band radiating element unit 210, the high band radiating element unit 220, the conducting unit 230, the inductor pattern unit 250, the balance coil unit 260, and the ground element unit 400 are made of a metal thin film of aluminum. Generally, the thin film in the present embodiment means a thickness in the range of 5 μm to 35 μm.

The low band radiating element unit 210, the high band radiating element unit 220, the conducting unit 230, the inductor pattern unit 250, the balance coil unit 260, and the ground element unit 400 are formed by a method such as etching or pattern printing.

As shown in FIG. 1 and FIG. 3, the low band radiation element part 210 and the high band radiation element part 220 mainly consist of rectangular shapes of flat plates. The area of the high band radiating element portion 220 in the present embodiment is smaller than the area of the low band radiating element portion 210.

The sum of the lengths of the peripheries 210a to 210d (including the uneven portion in the figure) forming the low-band radiation element portion 210 is called a value S1. The value S1 of the low band radiating element portion 210 is any of λ / 4, λ / 2, 3/2, 4/4, 5λ / 8 when the wavelength λ (lambda) on the low frequency side (near 860 MHz) of the UHF band RFID frequency is used. It is designed to fall under one.

The value S1 is more preferably half the wavelength λ of the frequency to be used.

Further, the sum of the lengths of the sides 220a to 220d (including the concavo-convex part in the figure) forming the high band radiating element part 220 is referred to as a value S2. The value S2 of the high band radiating element portion 220 is λ / 4, λ / 2, 3/2, 3/4, 5λ / when the wavelength λ (lambda) on the high frequency side (about 950 MHz to 960 MHz) of the UHF band RFID frequency is used. It is designed to fall under any one of eight.

More preferably, the length is half the wavelength λ of the frequency to be used.

(Insulating substrate 300)
In the present embodiment, the insulating base 300 shown in FIGS. 1 and 2 is made of expanded polystyrene. Insulating base 300 is formed on the entire surface of the facing portion of front surface 270 and back surface 280. The lower surface of the low band radiating element portion 210, the high band radiating element portion 220, the conducting portion 230, the inductor pattern portion 250, and the back surface of the balance coil portion 260 are bonded to one surface of the insulating base 300 with an adhesive.

Insulating base material 300 may be formed on a part of the facing portion of front surface 270 and back surface 280.
Moreover, as for the thickness of the insulation base material 300, it is desirable that it is the range of 0.5 mm or more and 3 mm or less.

In the present embodiment, the foam is made of expanded polystyrene, but the invention is not limited to this. Any insulator may be used, and polyethylene, polyimide, thin foam (borerer), etc. may be used. A foam or material may be used.

As described above, since the dual RF tag 100 according to the present embodiment uses expanded polystyrene as the insulating base 300 of the dual RF tag 100, an opening area of a certain size can be secured, which will be described later. The sensitivity of the dual RF tag 100 including the conductive member 900 can be improved.

The insulating base 300 may be formed of ceramic, paper, resin or the like made of a dielectric. In this case, the size of the dual RF tag 100 can be reduced to several millimeters.

(Conduction unit 230)
As shown in FIGS. 1 and 2, the conducting portion 230 is made of a metal thin film of aluminum. The conduction portion 230 is formed between the low band radiation element portion 210 and the high band radiation element portion 220.

Moreover, in the present embodiment, the conductive portion 230 is formed by a method such as etching or pattern printing simultaneously with the formation of the low band radiating element portion 210 and the high band radiating element portion 220.

In the present embodiment, although the conductive portion 230 is formed by etching or pattern printing, the present invention is not limited to this. The conductive portion 230 is separately formed, and the low band radiating element portion 210 and the high band radiating element are formed. It may be electrically connected to the portion 220. For example, a conductive pin or the like may be used. In addition, the width of the conductive portion 230 may be wider.

(IC chip 500)
The IC chip 500 is mounted on the inductor pattern portion 250 as shown in FIG. The IC chip 500 is disposed on the upper surface side of the insulating base 300 (in the same plane as the low band radiating element portion 210).

The IC chip 500 operates based on radio waves received by the low band radiating element unit 210 or the high band radiating element unit 220 of the dual RF tag 100.

Specifically, the IC chip 500 according to the present embodiment first rectifies part of the carrier wave transmitted from the reader, and the IC chip 500 itself generates a power supply voltage necessary for operation. Then, the IC chip 500 operates the non-volatile memory in which the control logic circuit in the IC chip 500, the unique information of the product, and the like are stored by the generated power supply voltage.

In addition, the IC chip 500 operates a communication circuit and the like for transmitting and receiving data to and from the reader.

(Equivalent circuit of dual RF tag 100)
FIG. 4 is a schematic view showing an example of an equivalent circuit of the dual RF tag 100 shown in FIG.

As shown in FIG. 4, in the inductor pattern portion 250, the inductor L and the internal equivalent capacitance C (hereinafter referred to as a capacitor C) of the IC chip 500 are connected in parallel with each other. The inductor L and the capacitor C constitute a resonant circuit that resonates in the frequency band of the radio wave transmitted from the reader.

Also, the low band radiating element unit 210 and the high band radiating element unit 220 are connected to the inductor-pattern unit 250, and the inductor pattern unit 250 is connected to the ground element unit 400 via the conducting unit 380.

As a result, by providing the low band radiating element unit 210 and the high band radiating element unit 220, it is possible to form the dual RF tag 100 capable of receiving radio waves in two frequency bands.

Further, the balance coil unit 260 can be inductively coupled to the inductor pattern unit 250, and the impedance can be matched with the inductor pattern unit 250 by appropriately adjusting the impedance of the balance coil unit 260.

The impedance Z of the inductor pattern portion 250 is given by equation (1).
Z = jωL + 1 / (jωC), ω = 2πf (1)
However, Z: impedance of the inductor-pattern portion 250 (ohm)
j: Imaginary unit ω: angular frequency of radio wave transmitted from reader (radian / second)
L: Inductor-inductance of pattern portion 250 (Henry)
C: Internal equivalent capacity of IC chip 500 (farad)
π: pi f: frequency of radio wave transmitted from reader (hertz)

The peripheral length and the like of the balance coil portion 260 are adjusted to be equal to the impedance Z of the inductor-pattern portion 250.

For example, in the case of L = 12.5 nH (nanohenry), C = 1.4 pF (picofarad), f = 920 MHz (megahertz), the impedance Z of the inductor pattern portion 250 is 50 Ω (ohm). In this case, if the impedance of the balance coil unit 260 is 50Ω, the impedances of the inductor pattern portion 250 and the balance coil unit 260 can be matched.

In this case, one of the low band radiating element unit 210 and the high band radiating element unit 220 needs to satisfy ωL <1 / (ωC), and either the other of the low band radiating element unit 210 or the high band radiating element unit 220 It is necessary to satisfy ωL> 1 / (ωC).

As a result, one of the low band radiating element unit 210 and the high band radiating element unit 220 is disposed at a phase difference Φ = 90 degrees with reference to the location where the IC chip 500 of the inductor pattern unit 250 is disposed. Further, based on the location where the IC chip 500 of the inductor pattern portion 250 is disposed, either the low band radiating element portion 210 or the high band radiating element portion 220 is disposed at the position of phase difference Φ = −90 degrees.

In the present embodiment, the low band radiating element unit 210 is disposed at the position of the phase difference Φ = 90 degrees, and the high band radiating element unit 220 is disposed at the position of the phase difference Φ = −90 degrees.

As described above, by considering the equivalent capacitance C inside the IC chip 500, the resonant frequency f of the resonant circuit can be accurately set in the frequency band of the radio wave. As a result, the read performance of the dual RF tag 100 can be further improved. Further, the power supply voltage generated by the IC chip 500 can be further increased.

(Reading distance of dual RF tag 100)
FIG. 5 is a view showing an example of the reading distance with respect to the frequency of the dual RF tag 100 shown in FIG. 1 and FIG.

In FIG. 5, a curve 630 is a plot of reading distance when the reader is placed on the front surface 270 side for each frequency, and a curve 640 is a frequency when the reader is placed on the back surface 280 side It is what was plotted for every.
The unit of reading distance is meter (m), and the unit of frequency is megahertz (MHz).

As shown in FIG. 5, in the curves 620 and 640, the reading distance is increased near 860 MHz and near 920 MHz. As a result, it can be seen that the dual RF tag 100 can realize reading in a plurality of frequency bands, even though the conventional switch is not provided.

Further, although the reading distance is slightly reduced as compared with the case where the reading device is placed on the front surface 270 side, it is understood that the reading distance is sufficiently long even when the reading device is placed on the back surface 280 side.

Specifically, in the vicinity of the frequency 860 MHz, the curve 620 is 10.0 m and the curve 640 is 8.0 m. Also, around the frequency 920 MHz, the curve 620 is 12 m and the curve 640 is 5.5 m. As described above, even when the reader is placed on the back surface 280, reading can be performed at least about 5 m.

As a result, the dual RF tag 100 can dramatically improve the communication sensitivity and receive nondirectional radio waves, even though the conventional switch is not provided.

(Another example of dual RF tag)
FIG. 6 is a schematic plan view showing another example of the RF tag antenna 100 according to the present embodiment, and FIG. 7 is a schematic view showing an example of an equivalent circuit of the dual RF tag 100 shown in FIG. It is. In the following, differences from the RF tag antenna 100 according to the present embodiment will be described.

The dual RF tag 100 shown in FIGS. 6 and 7 is obtained by connecting the balance coil section 260 in the dual RF tag 100 to the ground.

In this case, electrical operation is performed by the dielectric effect of the balance coil unit 260 and the inductor pattern unit 250.

As described above, the dual RF tag 100 of FIGS. 6 and 7 realizes the dual RF tag even though the conventional switch is not provided as in the dual RF tag 100 of FIGS. 1 to 4. can do.

(Example of using dual RF tag 100)
By placing the dual RF tag 100 on the conductive member 900 as described above, the conductive member 900 can be made a plate antenna having good sensitivity. FIG. 8 is a view in which the dual RF tag 100 is adhered on the conductive member 900. As shown in FIG. FIG. 9 shows an equivalent circuit in the case where the dual RF tag 100 is adhered on the conductive member 900.

An adhesive layer 450 is provided on the ground element portion 400 on the back surface 280 side of the dual RF tag 100, and the dual RF tag 100 is attached to the conductive member 900 through the adhesive layer 450.
Thus, as shown in FIG. 9, since the conductive member 900 and the ground element portion 400 are capacitively coupled to each other through the adhesive layer 450, the conductive member 900 can function as a plate antenna. Therefore, the dual RF tag 100 can be made omnidirectional and have a long communication distance.

Examples of the adhesive layer 450 include adhesive adhesives and hot melts, and adhesive adhesives are more preferable from the viewpoint of durability and capacity coupling.

In the present embodiment, dual RF tag 100 is capacitively coupled to conductive member 900 through adhesive layer 450, but ground element portion 400 and conductive member 900 are electrically connected. It is also good.

In this case, since there is no capacitive coupling via the adhesive layer 450, the conductive member 900 acts as an antenna together with the ground element portion 400, and the dual RF tag 100 can be made nondirectional and longer in communication distance. In addition, it is possible to eliminate the variation in electrostatic capacity accompanying the installation.

Although the case where dual RF tag 100 was installed in conductive member 900 was illustrated in this embodiment, it does not restrict in particular if conductive member 900 is not limited to this, as long as it is a plate made of metal.

Examples include construction materials, containers, license plates, drums, steel plates, electrical and electronic equipment, vehicles, ships and aircraft. When these main bodies have conductive plates, the dual RF tag 100 may be directly installed, or the conductive plates may be separately installed on the main body.

For example, when the dual RF tag 100 is used in a vehicle, the dual RF tag 100 may be installed on the roof or bonnet of the vehicle. Vehicles are not limited to automobiles, but may be installed on construction vehicles, special vehicles such as agricultural vehicles, two-wheeled vehicles, railways, etc. Furthermore, removable instruments (for example, buckets of hydraulic shovels) used integrally with vehicles The dual RF tag 100 may be installed in part.

In the case where the dual RF tag 100 is used in a vehicle and the conductive member 900 is not used, the dual RF tag may be installed in the window portion of the vehicle.

As described above, in the dual RF tag 100, the low band radiating element unit 210 can form an antenna corresponding to one frequency, and the high band radiating element unit 220 forms an antenna corresponding to the other frequency. Can.
As a result, a dual RF tag 100 that does not require a switch can be obtained. In particular, by setting one frequency as the European frequency and the other frequency as the US or Japan frequency, the dual RF tag 100 that can be used worldwide can be obtained.

In addition, the low-band radiation element unit 210 and the second radiation element unit may be arranged in parallel because the phase difference is 90 degrees and -90 degrees from the relationship between the resistance (reactance) of the capacitor and the reactance of the impedance. preferable.

Further, by adhering the dual RF tag 100 to the conductive member 900, the conductive member 900 can be used as an antenna. As a result, communication sensitivity can be dramatically improved, and nondirectional radio waves can be received.

Moreover, the radiation element length corresponding to the wave number can be set. As a result, communication sensitivity can be dramatically improved, and nondirectional radio waves can be received.
In addition, it is preferable to measure the circumference of each of the low-band radiation element unit 210 and the high-band radiation element unit 220 for a plurality of target wavelengths λ / 2.

In addition, since the insulating base 300 is formed of a foam member, the durability can be enhanced, and a capacitor can be reliably formed. Also, the opening can be reliably held.

Since the insulating base 300 is formed on the entire surface of the opposing portions of the front surface 270 and the back surface 280, the low band radiating element portion 210 and the high band radiating element portion 220 formed on the front surface 270 and the ground formed on the back surface 280 A capacitor with the element portion 400 can be easily formed, and the capacitor capacity can be held constant.

In the present invention, the dual RF tag 100 corresponds to a "dual RF tag", the surface 270 corresponds to a "first surface", and the low band radiating element portion 210 corresponds to a "first radiating element portion". , The high band radiating element portion 220 corresponds to the "second radiating element portion", the back surface 280 corresponds to the "second surface", the ground element portion 400 corresponds to the "ground element portion", and the inductor pattern The part 250 corresponds to an "inductor pattern", the balance coil part 260 corresponds to a "balance coil", the IC chip 500 corresponds to an "IC chip", and the conductive member 900 is a "metal member". Correspondingly, the adhesive layer 450 corresponds to the “adhesive layer”, the insulating base 300 corresponds to the “insulating base”, the short circuit part 240 corresponds to the “short circuit part”, and the conductive part 30 corresponds to the "a short circuit portion and the ground element portion is electrically conductive."

Although a preferred embodiment of the present invention is as described above, the present invention is not limited thereto. It will be understood that various other embodiments may be made without departing from the spirit and scope of the present invention. Furthermore, in the present embodiment, actions and effects according to the configuration of the present invention are described, but these actions and effects are only examples and do not limit the present invention.

DESCRIPTION OF SYMBOLS 100 dual RF tag 210 low band radiation | emission element part 220 high band radiation | emission element part 230 conduction part 240 short circuit part 250 inductor pattern part 260 balance coil part 300 insulation base 400 ground element part 450 adhesive layer 500 IC chip

Claims (8)

  1. A first radiating element portion formed on the first surface;
    A second radiation element portion having a circumferential length different from that of the first radiation element portion;
    A ground element portion having a second surface facing the first surface, and formed on the second surface;
    An inductor pattern formed on the first surface;
    A balance coil formed on the first surface;
    An IC chip mounted on the inductor pattern,
    An insulating base formed between the first surface and the second surface;
    A short circuit shorting the inductor pattern and the balance coil;
    The dual RF tag in which the short circuit portion and the ground element portion are electrically conducted.
  2. A first radiating element portion formed on the first surface;
    A second radiation element portion having a circumferential length different from that of the first radiation element portion;
    A ground element portion having a second surface facing the first surface, and formed on the second surface;
    An inductor pattern formed on the first surface;
    A balance coil formed on the first surface;
    An IC chip mounted on the inductor pattern,
    An insulating substrate formed between the first surface and the second surface,
    The dual RF tag in which the ground element portion and the balance coil portion are electrically conducted.
  3. The first radiation element portion is formed to extend in the longitudinal direction,
    The dual RF tag according to claim 1, wherein the second radiation element unit is formed in parallel with the first radiation element unit.
  4. The dual RF tag according to any one of claims 1 to 3, further comprising an adhesive layer for adhering to a metal member on the back surface of the ground element portion.
  5. The first radiation element portion corresponds to any one of λ / 4, λ / 2, 3/2, 4/5, and 5/8 with respect to the wavelength λ on the low frequency side (near 860 MHz) of the UHF band RFID frequency. So designed
    The second radiation element portion is one of λ / 4, λ / 2, 3/2, 4/5, and 5/8 with respect to the wavelength λ on the high frequency side (about 950 MHz to 960 MHz) of the UHF band RFID frequency. 5. A dual RF tag according to any one of the preceding claims, designed to be relevant.
  6. The dual RF tag according to any one of claims 1 to 5, wherein the insulating substrate comprises a foam member.
  7. The dual RF tag according to any one of claims 1 to 5, wherein the insulating substrate is made of a ceramic member, a resin or paper.
  8. The dual RF tag according to any one of claims 1 to 7, wherein the insulating base is formed on the entire surface of the opposing portion of the first surface and the second surface.
PCT/JP2018/030749 2017-08-25 2018-08-21 Dual rf tag WO2019039447A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009014213A1 (en) * 2007-07-25 2009-01-29 Fujitsu Limited Wireless tag and method for manufacturing the same
JP2012253700A (en) * 2011-06-07 2012-12-20 Murata Mfg Co Ltd Wireless communication device, its manufacturing method, and metal article with wireless communication device
WO2016129542A1 (en) * 2015-02-10 2016-08-18 株式会社 フェニックスソリューション Rf tag antenna and method for manufacturing same, and rf tag

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009014213A1 (en) * 2007-07-25 2009-01-29 Fujitsu Limited Wireless tag and method for manufacturing the same
JP2012253700A (en) * 2011-06-07 2012-12-20 Murata Mfg Co Ltd Wireless communication device, its manufacturing method, and metal article with wireless communication device
WO2016129542A1 (en) * 2015-02-10 2016-08-18 株式会社 フェニックスソリューション Rf tag antenna and method for manufacturing same, and rf tag

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