WO2019029121A1 - 光伏组件 - Google Patents
光伏组件 Download PDFInfo
- Publication number
- WO2019029121A1 WO2019029121A1 PCT/CN2018/070076 CN2018070076W WO2019029121A1 WO 2019029121 A1 WO2019029121 A1 WO 2019029121A1 CN 2018070076 W CN2018070076 W CN 2018070076W WO 2019029121 A1 WO2019029121 A1 WO 2019029121A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- photovoltaic module
- honeycomb core
- substrate layer
- substrate
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims abstract description 152
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 239000012792 core layer Substances 0.000 claims abstract description 47
- 238000005538 encapsulation Methods 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 239000002131 composite material Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 9
- 229920006124 polyolefin elastomer Polymers 0.000 claims description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 7
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 7
- -1 polyethylene terephthalate Polymers 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 6
- 239000012815 thermoplastic material Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000002966 varnish Substances 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 230000001413 cellular effect Effects 0.000 abstract 4
- 229910052782 aluminium Inorganic materials 0.000 description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- 239000011521 glass Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000013022 venting Methods 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 229920006280 packaging film Polymers 0.000 description 2
- 239000012785 packaging film Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920001780 ECTFE Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000037368 penetrate the skin Effects 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
Definitions
- the present disclosure pertains to the field of solar cells, for example, to a photovoltaic module.
- Photovoltaic modules also called solar panels, generate electricity through the “photovoltaic effect” and are a core part of solar power systems.
- the mainstream photovoltaic components in the related art are crystalline silicon solar components, including polycrystalline silicon solar modules and monocrystalline silicon solar components, accounting for more than 95% of the photovoltaic components.
- the conventional packaging structure of the crystalline silicon solar components includes glass, packaging film, battery, and packaging adhesive.
- the film and the back sheet, and the metal aluminum frame is used as a frame for supporting and fixing, and the weight is about 12kg/m 2 ;
- the other packaging scheme is to use glass, encapsulation film, battery, packaging film and glass for packaging, but The metal aluminum frame is not used and the weight is also about 12 kg/m 2 .
- the method of using a composite material instead of glass in the related art requires component verification.
- the method of increasing the thickness of the glass to remove the aluminum frame makes the improved photovoltaic module less inferior, and the problem that the sodium ion migration in the glass affects the performance of the battery occurs.
- Related Art For the problem of sodium ion migration, a solution of using methyl methacrylate as a substrate and benzoyl peroxide as an initiator to plastically seal a battery after being connected by chemical crosslinking has been proposed.
- the poor water blocking performance of the transparent front plate of the photovoltaic module may lead to problems such as an increase in corrosion rate of the metal gate lines and interconnecting strips of the battery, and attenuation of the output power of the photovoltaic modules.
- the photovoltaic module provided by the present disclosure is light in weight, easy to recycle, easy to install, and has a wide range of applications.
- a photovoltaic module comprising a transparent front plate, a first encapsulation layer, a solar cell sheet, a second encapsulation layer and a back sheet which are sequentially stacked, the back sheet comprising a first substrate layer, a honeycomb core layer and a first layer which are sequentially stacked a second substrate layer, the first substrate layer and the honeycomb core layer, the second substrate layer and the honeycomb core layer are respectively bonded by an adhesive, and the first substrate layer is located at the second encapsulation layer and the honeycomb core layer
- the first substrate layer is a resin insulating layer or a metal layer.
- the photovoltaic component when the first substrate layer is a metal layer, the photovoltaic component further includes a first insulating layer disposed between the second encapsulation layer and the first substrate layer.
- the adhesive is selected from a heat-resistant adhesive, and the temperature resistance is above 120 ° C, and the temperature resistance may be above 160 ° C.
- the honeycomb core layer is internally provided with an exhaust hole extending along at least one of a width direction and/or a length direction of the honeycomb core layer.
- a side of the photovoltaic module is provided with a skin that penetrates the honeycomb core layer and the skin.
- the venting holes penetrate the skin on both sides and the two sides of the honeycomb core layer. The opening of the venting opening can prevent the backing sheet from bubbling or degumming during the lamination process.
- the plurality of vent holes are uniformly distributed, and the plurality of vent holes are evenly distributed along at least one of a width direction and/or a length direction of the honeycomb core layer.
- the honeycomb core layer is made of metal or resin.
- the metal used to form the honeycomb core layer comprises a metal such as aluminum or aluminum alloy.
- the resin used for fabricating the honeycomb core layer comprises a resin such as epoxy resin, which has high temperature resistance above 120 ° C, low shrinkage, excellent mechanical properties, insulation properties, chemical stability, and size. Stability and durability.
- the material of the second substrate layer is metal or resin.
- the first substrate layer is made of a metal such as aluminum or aluminum alloy.
- the metal used to form the second substrate layer comprises a metal such as aluminum or aluminum alloy.
- the resin used for the first substrate layer and the second substrate layer comprises a resin such as an epoxy resin
- the epoxy resin has a high temperature resistance above 120 ° C, has a low shrinkage rate, and has excellent mechanical properties and insulation properties. Chemical stability, dimensional stability and durability.
- the first insulating layer is an insulating coating or an insulating film layer.
- the first insulating layer is an insulating film layer
- an adhesive bonding is performed between the insulating film layer and the first substrate layer.
- the first insulating layer has a thickness of 20-300 microns.
- the photovoltaic module further includes a second insulating layer disposed on the second substrate layer, the second substrate layer being located between the honeycomb core layer and the second insulating layer.
- the second insulating layer has a thickness of 1-300 microns.
- the first insulating layer and the second insulating layer have properties such as insulation, ultraviolet resistance, and aging resistance.
- the first insulating layer and the second insulating layer may have the same structure or different structures.
- the first insulating layer and the second insulating layer may both be made of an insulating coating or both of the insulating film layers;
- the first insulating layer is an insulating coating
- the second insulating layer is an insulating film layer, or the first insulating layer is an insulating film layer, and the second insulating layer is an insulating coating.
- a mounting hole for mounting the photovoltaic component is disposed on the back plate, and the mounting hole sequentially penetrates the first substrate layer, the honeycomb core layer, and the second substrate layer.
- the mounting holes are formed on opposite sides of the backboard, and a plurality of the mounting holes are respectively formed on two sides of the backboard, and the distance between two adjacent mounting holes may be 900- 1000mm (60 pcs battery) or 1200-1400mm (72pcs).
- the mounting hole may also extend through the transparent front plate, or the mounting hole may be opened only on the back plate.
- the transparent front plate area is smaller than the back plate. The area of the transparent front plate does not completely cover the surface of the back plate, and the mounting hole only needs to be opened on the back plate.
- the photovoltaic component is directly mounted by a clamp, an adhesive, or the mounting hole.
- a lead hole for the bus bar to pass through is formed on the back plate, and the lead hole sequentially penetrates the first substrate layer, the honeycomb core layer and the second substrate layer.
- the lead hole is opened on a short side of the backboard.
- the lead holes may be one, two or three. When the lead holes are two or three, the lead holes are opened at the same short side end of the back plate, and two adjacent ones are The center distance of the lead holes may be 310-324 mm.
- the bus bar lead-out wire is covered with an insulating varnish or an insulating film.
- one side of the insulating film has an adhesive layer, and the glass transition temperature (Tg) of the adhesive is higher than 20 ° C and higher than 85 ° C.
- Tg glass transition temperature
- the insulating film has good weather resistance and high temperature resistance.
- the honeycomb core layer has a thickness of 5 to 15 mm, and may be 5 to 10 mm.
- the back plate has a thickness of 5.5 to 18 mm, and may be 8 to 12 mm.
- the first substrate layer and the second substrate layer have thicknesses of 10 to 400 ⁇ m, respectively.
- a composite sheet prepared by compositeing the first substrate layer, the honeycomb core layer, and the second substrate layer may be a commercially available conventional honeycomb aluminum substrate or a honeycomb epoxy substrate.
- the transparent front plate is one of the following: a transparent fluororesin film, a composite film of a transparent fluororesin film and a hard packaging material, and the transparent fluororesin film is bonded to the transparent hard substrate by an adhesive or by an encapsulating material.
- the composite film formed thereon can improve impact resistance or improve water blocking performance.
- the transparent rigid substrate is, for example, polyethylene terephthalate (PET), polybutylene terephthalate (PBT) or polycarbonate (Polycarbonate, PC).
- PET polyethylene terephthalate
- PBT polybutylene terephthalate
- PC polycarbonate
- the encapsulating material is a thermoplastic material including a polyolefin elastomer, polyvinyl alcohol, and an ethylene-vinyl acetate copolymer.
- the transparent fluororesin film is composed of ethylene-tetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, ethylene-chlorotrifluoroethylene copolymer, and ethylene-tetrafluoroethylene copolymer.
- the transparent front plate adopts a composite film
- the front plate still has high light transmittance characteristics, and the front plate has an average light transmittance of more than 85% in a wavelength range of 380-1100 nm.
- the composite film improves the hardness and rigidity of the film, improves the convenience of the packaging process of the solar module, and resists the impact performance of the hail.
- the transparent front plate has a thickness of 20 to 300 ⁇ m and has high water blocking property, and the front plate has a water vapor transmission rate of not more than 2 g/m 2 .
- the first encapsulation layer is a thermoplastic material, including a polyolefin elastomer, a polyvinyl alcohol, an ethylene-vinyl acetate copolymer, and the like.
- the first encapsulating layer may also be a cross-linking type material, including a crosslinked polyolefin elastomer, a crosslinked ethylene-vinyl acetate copolymer, and a liquid silicone gel.
- the first encapsulating layer may have a thickness of 0.1 to 1.0 mm and may be 0.4 to 0.8 mm.
- the second encapsulating layer is a thermoplastic material, including a polyolefin elastomer, a polyvinyl alcohol, and an ethylene-vinyl acetate copolymer.
- the second encapsulating layer may also be a cross-linking type material, including a crosslinked polyolefin elastomer, a crosslinked ethylene-vinyl acetate copolymer, and a liquid silicone gel.
- the second encapsulation layer may have a thickness of 0.1 to 1.0 mm and may be 0.4 to 0.8 mm.
- the present disclosure avoids the precipitation of metal ions such as Na from the glass, thereby greatly improving the Potential Induced Degradation (PID) performance of the module; and using the composite plate having the porous honeycomb structure as the back plate, reducing the back plate.
- the weight which in turn reduces the weight of the entire assembly, while the backing of the structure ensures sufficient strength and load-resistance of the assembly (eg 5400 Pa), avoiding the use of metal-aluminum frames, significantly reducing the weight of the components, and weighing approximately 50% of the components; at the same time, the thickness of the components is reduced from 35-40mm in the related art to about 10mm, which improves the transportation efficiency of the components by about 3 times and greatly reduces the logistics cost.
- the components of the present disclosure can be widely applied to a variety of distributed projects, such as in distributed power plant projects.
- FIG. 1 is a schematic structural view of a photovoltaic module according to an embodiment.
- FIG. 2 is an enlarged top plan view of a photovoltaic module provided by an embodiment.
- FIG. 3 is a schematic side view showing the structure of a back sheet of a photovoltaic module according to an embodiment.
- FIG. 4 is a schematic top plan view of a portion of a backplane of a photovoltaic module according to an embodiment.
- FIG. 5 is a schematic structural view of a photovoltaic module according to an embodiment.
- FIG. 6 is a schematic structural diagram of a photovoltaic module according to an embodiment.
- the photovoltaic module of the present embodiment uses a transparent front plate instead of the conventional glass, and uses a composite board having a porous honeycomb structure as a back sheet, such as a reinforced epoxy resin or a honeycomb aluminum-based composite board as a back sheet, ensuring sufficient strength of the assembly.
- load resistance for example: 5400Pa
- the thickness of the assembly is reduced from 35 to 40 mm to about 10 mm, which improves the transportation efficiency of the assembly by about 3 times and greatly reduces the logistics cost.
- thermoplastic material such as a polyolefin elastomer and a thermoplastic material such as an ethylene-vinyl acetate copolymer can be used for encapsulation, thereby making the assembly recyclable and meeting increasingly high environmental requirements.
- the transparent front plate is used instead of the conventional glass for packaging, and metal ions such as Na are prevented from being precipitated from the glass, thereby greatly improving the anti-PID performance of the component.
- This embodiment uses a composite board having a porous honeycomb structure as a back sheet, such as a reinforced epoxy resin or a honeycomb aluminum-based composite board as a back sheet, because the back sheet has sufficient strength and load resistance, and thus can be used in the back sheet.
- the corresponding mounting holes are reserved, and the embodiment is more advantageous in the application of the distributed power station project in combination with the characteristics of the backplane.
- a mounting hole is formed in the back plate, so that the photovoltaic module of the embodiment can be directly installed and suspended, without setting an aluminum frame.
- the photovoltaic module provided in this embodiment includes: a transparent front plate 1 , a first encapsulation layer 2 , a solar cell sheet 3 , a second encapsulation layer 4 , and a back plate 5 , which are sequentially stacked.
- 5 includes a first substrate layer 50, a honeycomb core layer 51, and a second substrate layer 52 which are sequentially stacked, and between the first substrate layer 50 and the honeycomb core layer 51, and between the second substrate layer 52 and the honeycomb core layer 51, respectively. Adhesive bonding, the first substrate layer 50 is located between the second encapsulation layer 4 and the honeycomb core layer 51.
- the first substrate layer 50 is a metal layer
- the photovoltaic module further includes a first insulating layer 54 disposed between the first substrate layer 50 and the second encapsulation layer 4.
- the thickness of the first insulating layer 54 may be 30 micrometers.
- the photovoltaic module further includes a second insulating layer 55 disposed on the second substrate layer 52, and the second substrate layer 52 is located between the honeycomb core layer 51 and the second insulating layer 55.
- the second insulating layer 55 may have a thickness of 10 ⁇ m.
- the first insulating layer 54 and the second insulating layer 55 are both insulating coatings.
- the composite substrate in which the first substrate layer 50, the honeycomb core layer 51, and the second substrate layer 52 are composited is a commercially available conventional honeycomb aluminum substrate.
- a vent hole 53 extending in at least one of the width direction and/or the length direction of the honeycomb core layer 51 is opened inside the honeycomb core layer 51.
- a side portion of the photovoltaic module is provided with a skin 56 that extends through the honeycomb core layer 51 and the skin 56.
- the plurality of vent holes 53 are plural, and the plurality of vent holes 53 are evenly distributed along at least one of the width direction and/or the length direction of the honeycomb core layer 51.
- a lead hole 7 through which the bus bar passes is provided on the back plate 5, and the lead hole 7 sequentially penetrates through the first insulating layer 54, the first substrate layer 50, the honeycomb core layer 51, the second substrate layer 52, and the second insulating layer 55. .
- three lead holes 7 for the bus bar to pass through are formed at the same end of the back plate 5.
- the center distance H of the adjacent two lead holes 7 may be 310 to 324 mm.
- the solar cell sheet 3 is protected from damage during the lamination process.
- the bus bar lead-out line 8 passing through the lead hole 7 is covered with an insulating varnish or an insulating film.
- the insulating film is coated, one side of the insulating film has an adhesive layer, and the Tg of the adhesive is higher than 20 ° C and higher than 85 ° C.
- the adhesive is bonded to the bus bar lead-out line 8.
- a mounting hole 6 for mounting the photovoltaic module is further disposed on the back plate 5, and the mounting hole 6 sequentially penetrates the first insulating layer 54, the first substrate layer 50, the honeycomb core layer 51, the second substrate layer 52, and the second insulating layer 55.
- the opposite sides of the backboard 5 are provided with mounting holes 6, and the mounting holes 6 of the two sides of the backboard are respectively a plurality of, and the center distance D of the adjacent two mounting holes 6 may be 970-1000 mm (60 pcs battery) or 1200-1400 mm. (72pcs battery).
- the mounting holes 6 on each side of the backing plate 5 are two.
- the transparent front plate 1 is a polyvinylidene fluoride film.
- the first encapsulating layer 2 and the second encapsulating layer 4 are respectively a polyolefin elastomer encapsulating film.
- the photovoltaic module provided in this embodiment is different from the first embodiment in that the transparent front plate 1 is a composite film of polyvinyl fluoride and PET.
- the photovoltaic module provided in this embodiment is different from the first embodiment in that the materials of the first substrate layer 50, the honeycomb core layer 51 and the second substrate layer 52 of the back plate 5 are made of reinforced epoxy resin. Acrylic honeycomb panels purchased.
- the photovoltaic module provided in this embodiment is different from the first embodiment in that a lead hole 7 through which the bus bar passes is opened on the back plate 5.
- the photovoltaic module provided in this embodiment is different from the first embodiment in that the first substrate layer 50 and the second substrate layer 52 bonded to the metal honeycomb core layer 51 are polymer insulating films.
- the photovoltaic module provided in this comparative example has the same structure as that of Embodiment 1, except that the back plate 5 is made of a metal aluminum plate, and the periphery of the assembly is fixed by an aluminum frame.
- Example 1 Example 2 Example 3 Comparative example 1 Transparent front plate (mm) 0.05 0.28 0.1 3.2 First encapsulation layer (mm) 0.5 0.5 0.5 0.5 0.5 Second encapsulation layer (mm) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Back plate (mm) 10 10 10 0.3 Honeycomb core layer (mm) 9.9 9.9 9.9 -
- the photovoltaic module of Example 1 was subjected to mechanical load testing according to the requirements of the international standard IEC6121510.16 (International Electrotechnical Commission, IEC) for the design and identification of crystalline silicon photovoltaic modules for the ground, as shown in Table 2.
- IEC6121510.16 International Electrotechnical Commission, IEC
- FF fill factor
- the photovoltaic module of the present disclosure reduces the weight of the photovoltaic component and can better meet the requirements of high load, and expands the application range of the component.
Abstract
一种光伏组件,包括:依次层叠设置的透明前板(1)、第一封装层(2)、太阳能电池片(3)、第二封装层(4)及背板(5),所述背板(5)包括依次层叠设置的第一基板层(50)、蜂窝芯层(51)和第二基板层(52),所述第一基板层(50)和蜂窝芯层(51)之间、第二基板层(52)和蜂窝芯层(51)之间分别通过胶粘剂粘接,所述第一基板层(50)位于所述第二封装层(4)和蜂窝芯层(51)之间,所述第一基板层(50)为树脂绝缘层或金属层。
Description
本公开属于太阳能电池领域,例如涉及一种光伏组件。
光伏组件,也叫太阳能电池板,通过“光伏打效应”而发电,是太阳能发电系统中的核心部分。相关技术中主流光伏组件为晶体硅太阳能组件,包括多晶硅太阳能组件和单晶硅太阳能组件,占光伏组件95%以上,该晶体硅太阳能组件常规封装结构依次包括玻璃、封装胶膜、电池、封装胶膜以及背板,并使用金属铝框为框架并起支撑作用和固定,重量约12kg/m
2;另一种封装方案为采用玻璃、封装胶膜、电池、封装胶膜以及玻璃进行封装,但不使用金属铝框,重量也约为12kg/m
2。随着分布式发电逐渐兴起,常规组件因其承重原因而在部分分布式项目中无法使用,如部分彩钢瓦屋顶项目等。为减轻组件重量,常采用减轻玻璃重量,减少金属铝框的重量,或使用透明材料代替太阳能组件的前板,但同时为提高组件的强度,仍使用金属铝框或对背面的基板采用加强筋方式来提高组件的整体强度。
相关技术中的利用复合材料代替玻璃的方法,虽然降低了光伏组件的整体质量,但是组件强度需要验证。而增加玻璃厚度去除铝框的方法,使得改进后的光伏组件强度较差,且出现了玻璃中钠离子迁移影响电池性能的问题。相关技术针对钠离子迁移问题提出了采用甲基丙烯酸甲酯为基材,过氧化苯甲酰为引发剂,通过化学交联方式把串联后的电池进行塑封的解决方案。但是依旧存在光伏组件加工工艺复杂和组件强度差的问题,尤其是光伏组件的透明前板阻水性能差可能导致电池金属栅线和互联条的腐蚀速度加快、光伏组件的输出功率衰减等问题。
发明内容
本公开提供的光伏组件重量轻、易回收、易安装并且应用范围广。
一种光伏组件,包括依次层叠设置的透明前板、第一封装层、太阳能电池片、第二封装层及背板,所述背板包括依次层叠设置的第一基板层、蜂窝芯层和第二基板层,所述第一基板层和蜂窝芯层之间、第二基板层和蜂窝芯层之间 分别通过胶粘剂粘接,所述第一基板层位于所述第二封装层和蜂窝芯层之间,所述第一基板层为树脂绝缘层或金属层。
可选地,当所述第一基板层为金属层时,所述光伏组件还包括设置在所述第二封装层和第一基板层之间的第一绝缘层。
可选地,所述胶粘剂选择耐热性好的胶粘剂,耐温在120℃以上,可以为耐温在160℃以上。
可选地,所述蜂窝芯层内部开设有沿所述蜂窝芯层的宽度方向和/或长度方向至少之一延伸的排气孔。
可选地,所述光伏组件的侧部设置有蒙皮,所述排气孔贯穿所述蜂窝芯层及所述蒙皮。可选地,所述排气孔贯穿所述蜂窝芯层的二侧部及二侧所述蒙皮。所述排气孔的开设能够防止背板在层压过程中鼓泡或脱胶。
可选地,所述排气孔为多个,多个所述排气孔沿所述蜂窝芯层的宽度方向和/或长度方向至少之一均匀分布。
可选地,所述蜂窝芯层的材质为金属或树脂。
可选地,用于制作所述蜂窝芯层的金属包括铝、铝合金等金属。
可选地,用于制作所述蜂窝芯层的树脂包括环氧树脂等树脂,该环氧树脂耐高温在120℃以上,具有低收缩率,优良的力学性能、绝缘性能、化学稳定性、尺寸稳定性和耐久性。
可选地,所述第二基板层的材质分别为金属或树脂。
可选地,用于制作所述第一基板层包括铝、铝合金等金属。
可选地,用于制作第二基板层的金属包括铝、铝合金等金属。
可选地,用于制作所述第一基板层、第二基板层的树脂包括环氧树脂等树脂,该环氧树脂耐高温在120℃以上,具有低收缩率,优良的力学性能、绝缘性能、化学稳定性、尺寸稳定性和耐久性。
可选地,所述第一绝缘层为绝缘涂层或绝缘薄膜层。
可选地,当所述第一绝缘层为绝缘薄膜层时,所述绝缘薄膜层与所述第一基板层之间采用胶粘剂粘接。
可选地,所述第一绝缘层的厚度为20-300微米。
可选地,所述光伏组件还包括设置在所述第二基板层上的第二绝缘层,所述第二基板层位于所述蜂窝芯层和第二绝缘层之间。
可选地,所述第二绝缘层的厚度为1-300微米。
所述第一绝缘层、第二绝缘层具有绝缘、耐紫外以及耐老化等性能。
所述第一绝缘层、第二绝缘层可以是相同的结构,也可以是不同的结构,如第一绝缘层、第二绝缘层可以都采用绝缘涂层或都采用绝缘薄膜层;也可以是第一绝缘层是绝缘涂层,第二绝缘层是绝缘薄膜层,或者,第一绝缘层是绝缘薄膜层,第二绝缘层是绝缘涂层。
可选地,所述背板上开设有用于安装所述光伏组件的安装孔,所述安装孔依次贯穿所述第一基板层、蜂窝芯层和第二基板层。
可选地,所述安装孔开设在所述背板的相对二侧,背板的两侧分别开设有多个所述安装孔,相邻二个所述安装孔之间的距离可以为900-1000mm(60块pcs电池)或1200-1400mm(72pcs)。
可选地,所述安装孔也可贯穿所述透明前板,也可只在所述背板上开设所述安装孔,如光伏组件具体制作时,所述透明前板面积小于所述背板的面积,所述透明前板没有全部覆盖所述背板的表面,则只需在所述背板上开设所述安装孔。
可选地,所述光伏组件通过夹具、粘结胶或所述安装孔直接进行安装。
可选地,所述背板上开设有用于供汇流条穿过的引线孔,所述引线孔依次贯穿所述第一基板层、蜂窝芯层和第二基板层。
可选地,所述引线孔开设在所述背板的短边。所述引线孔为可以为1个、2个或3个,当所述引线孔为2个或3个,所述引线孔开设在所述背板的同一短边端,相邻两个所述引线孔的中心距离可以为310-324mm。
可选地,汇流条引出线上包覆有绝缘漆或绝缘膜。
可选地,所述绝缘膜的一面具有粘结胶层,所述粘结胶的玻璃态转化温度(Glass Transition Temperature,Tg)高于20℃、耐85℃以上的高温。所述绝缘膜具有良好的耐候性和耐高温性能。
可选地,所述蜂窝芯层的厚度为5~15mm,可以为为5~10mm。
可选地,所述背板的厚度为5.5~18mm,可以为为8~12mm。
可选地,所述第一基板层、第二基板层的厚度分别为10-400μm。
在本公开中,由所述第一基板层、蜂窝芯层以及第二基板层复合制备的复合板可采用商购获得的常规蜂窝铝基板或蜂窝环氧树脂基板。
可选地,所述透明前板为下述之一:透明氟树脂薄膜,透明氟树脂薄膜与硬质封装材料的复合膜,透明氟树脂薄膜通过胶粘剂或通过封装材料粘结在透 明硬性基材上制成的复合膜,所述透明硬性基材可以提高抗冲击性或提高阻水性能。
可选地,所述透明硬性基材为如聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate,PET)、聚对苯二甲酸丁二醇酯(Polybutylene Terephthalate,PBT)或聚碳酸酯(Polycarbonate,PC)。
可选地,所述封装材料为热塑性材料,包括聚烯烃弹性体、聚乙烯醇以及乙烯-醋酸乙烯共聚物。
可选地,所述透明氟树脂薄膜由乙烯-四氟乙烯、聚三氟氯乙烯、聚氟乙烯、聚偏氟乙烯、乙烯-三氟氯乙烯共聚物以及乙烯-四氟乙烯共聚物中的一种制成的氟膜。
当所述透明前板采用复合膜时,该前板仍具有高透光率特性,在380-1100nm波长范围内,该前板平均透光率大于85%。复合膜提高了薄膜的硬度和刚性,提高了太阳能组件封装工艺的便捷性,以及抵抗冰雹的冲击性能。
可选地,所述透明前板的厚度为20~300μm,具有高阻水特性,该前板水汽透过率不高于2g/m
2。
可选地,所述第一封装层为热塑性材料,包括聚烯烃弹性体、聚乙烯醇以及乙烯-醋酸乙烯共聚物等。所述第一封装层也可为交联型材料,包括交联型聚烯烃弹性体、交联型乙烯-醋酸乙烯共聚物以及液体硅胶等。所述第一封装层的厚度可以为0.1~1.0mm,可以为0.4~0.8mm。
可选地,所述第二封装层为热塑性材料,包括聚烯烃弹性体、聚乙烯醇以及乙烯-醋酸乙烯共聚物等。所述第二封装层也可为交联型材料,包括交联型聚烯烃弹性体、交联型乙烯-醋酸乙烯共聚物以及液体硅胶等。所述第二封装层的厚度可以为0.1~1.0mm,可以为0.4~0.8mm。
本公开避免了Na等金属离子从玻璃中析出,从而大大提高了组件的抗电位诱发衰减(Potential Induced Degradation,PID)性能;并使用具有多孔蜂窝结构的复合板作为背板,降低了背板的重量,进而降低整个组件的重量,同时该结构的背板能够确保组件有足够的强度和抗负载能力(例如5400Pa),可以避免使用金属铝框,大幅度降低了组件的重量,重量约为常规组件的50%;同时使组件的厚度由相关技术中的35~40mm降低到10mm左右,使组件的运输效率提高约3倍,大幅度降低物流成本。
本公开的组件能够广泛应用于多类分布式项目中,如在分布式电站项目上 更具有优势。
图1为一实施例提供的光伏组件的结构示意图。
图2为一实施例提供的光伏组件的放大俯视示意图。
图3为一实施例提供的光伏组件的背板的侧视结构示意图。
图4为一实施例提供的光伏组件的部分背板的俯视结构示意图。
图5为一实施例提供的光伏组件结构示意图。
图6为一实施例提供的光伏组件结构示意图。
图中:1、透明前板;2、第一封装层;3、太阳能电池片;4、第二封装层;5、背板;50、第一基板层;51、蜂窝芯层;52、第二基板层;53、排气孔;54、第一绝缘层;55、第二绝缘层;56、蒙皮;6、安装孔;7、引线孔;8、汇流条引出线。
本实施例的光伏组件使用透明前板代替常规玻璃,并使用具有多孔蜂窝结构的复合板作为背板,如使用强化的环氧树脂或蜂窝铝基复合板作为背板,确保组件有足够的强度和抗负载能力(例如:5400Pa),同时去除了金属铝框,大幅度降低了组件的重量,重量约为常规组件的50%。同时使组件的厚度由35~40mm降低到10mm左右,使组件的运输效率提高约3倍,大幅度降低物流成本。
本实施例可使用热塑性材料,如聚烯烃弹性体以及乙烯-醋酸乙烯共聚物等热塑性材料进行封装的方案,从而使组件具有可回收性,满足日益提高的环保要求。
同时本实施例,利用透明前板代替常规玻璃进行封装,避免了Na等金属离子从玻璃中析出,从而大大提高了组件的抗PID性能。
本实施例使用具有多孔蜂窝结构的复合板作为背板,如使用强化的环氧树脂或蜂窝铝基复合板作为背板,因该背板有足够的强度和抗负载能力,因此可以在背板上根据安装需要,保留相应的安装孔,结合该背板特性,本实施例应用在分布式电站项目上更具有优势。在背板上开设安装孔,使得本实施例光伏 组件可直接安装和悬空安装,而不需设置铝框。
实施例1
如图1~6所示,本实施例提供的光伏组件,包括:依次层叠设置的透明前板1、第一封装层2、太阳能电池片3、第二封装层4和背板5,背板5包括依次层叠设置的第一基板层50、蜂窝芯层51和第二基板层52,第一基板层50和蜂窝芯层51之间、第二基板层52和蜂窝芯层51之间分别通过胶粘剂粘接,第一基板层50位于第二封装层4和蜂窝芯层51之间。
本实施例中,第一基板层50为金属层,该光伏组件还包括设置在第一基板层50和第二封装层4之间的第一绝缘层54。第一绝缘层54的厚度可以为30微米。
本实施例中,光伏组件还包括设置在第二基板层52上的第二绝缘层55,第二基板层52位于蜂窝芯层51和第二绝缘层55之间。第二绝缘层55的厚度可以为10微米。
第一绝缘层54和第二绝缘层55均为绝缘涂层。
本实施例中,第一基板层50、蜂窝芯层51以及第二基板层52复合成的复合板采用商购常规的蜂窝铝基板。
为了防止背板5在层压过程中鼓泡、脱胶,在蜂窝芯层51内部开设有沿蜂窝芯层51的宽度方向和/或长度方向至少之一延伸的排气孔53。光伏组件的侧部设置有蒙皮56,排气孔53贯穿蜂窝芯层51及蒙皮56。排气孔53为多个,多个排气孔53沿蜂窝芯层51的宽度方向和/或长度方向至少之一均匀分布。
背板5上开设有用于供汇流条穿过的引线孔7,引线孔7依次贯穿第一绝缘层54、第一基板层50、蜂窝芯层51、第二基板层52和第二绝缘层55。本实施例中,在背板5的同一端开设了3个用于汇流条穿过的引线孔7。相邻二个引线孔7的中心距离H可以为310~324mm。当将透明前板1、第一封装层2、太阳能电池片3、第二封装层4和背板5压制成光伏组件时,引线孔7的位置靠近组件的边缘且与太阳能电池片不重叠,保护太阳能电池片3在层压过程不被损坏。安装过程中,穿过该引线孔7的汇流条引出线8上包覆有绝缘漆或绝缘膜。当包覆绝缘膜时,绝缘膜的一面具有粘结胶层,粘结胶的Tg高于20℃、耐85℃以上的高温。粘结胶与汇流条引出线8相粘结。
背板5上还开设有用于安装光伏组件的安装孔6,安装孔6依次贯穿第一绝缘层54、第一基板层50、蜂窝芯层51、第二基板层52和第二绝缘层55。背板 5的相对二侧开设有安装孔6,背板的两侧安装孔6分别为多个,相邻二个安装孔6的中心距离D可以为970-1000mm(60pcs电池)或1200-1400mm(72pcs电池)。本实施例中,背板5的每一侧的安装孔6为2个。
本实施例中,透明前板1为聚偏氟乙烯薄膜。第一封装层2、第二封装层4分别为聚烯烃弹性体封装胶膜。
实施例2
本实施例提供的光伏组件,与实施例1的不同之处在于:透明前板1为聚氟乙烯和PET的复合薄膜。
实施例3
本实施例提供的光伏组件,与实施例1的不同之处在于:背板5的第一基板层50、蜂窝芯层51以及第二基板层52的材质均采用强化的环氧树脂,如商购的环氧树脂蜂窝板。
实施例4
本实施例提供的光伏组件,与实施例1的不同之处在于,在背板5上开设了1个用于汇流条穿过的引线孔7。
实施例5
本实施例提供的光伏组件,与实施例1的不同之处在于,与金属蜂窝芯层51粘结的第一基板层50和第二基板层52为高分子绝缘膜。
对比实施例1
本对比例提供的光伏组件,结构同实施例1,不同之处在于:背板5采用金属铝板,组件的周围采用铝框固定。
性能测试
1、重量检测
检测实施例1~3和对比上述例1的光伏组件的重量,结果如表1所示。
表1
实施例1 | 实施例2 | 实施例3 | 对比例1 | |
透明前板(mm) | 0.05 | 0.28 | 0.1 | 3.2 |
第一封装层(mm) | 0.5 | 0.5 | 0.5 | 0.5 |
第二封装层(mm) | 0.5 | 0.5 | 0.5 | 0.5 |
背板(mm) | 10 | 10 | 10 | 0.3 |
蜂窝芯层(mm) | 9.9 | 9.9 | 9.9 | - |
第一基板层(μm) | 25 | 25 | 25 | - |
第二基板层(μm) | 25 | 25 | 25 | - |
重量(kg/m 2) | 8.1 | 8.3 | 6.8 | 12.2 |
2、机械负载测试
对实施例1的光伏组件按地面用晶体硅光伏组件设计鉴定与定型国际标准IEC6121510.16(International Electrotechnical Commission,IEC)要求进行机械负载测试,如表2所示。
表2
Cycle | Press Side | Press[Pa] | Isc[A] | Voc[V] | Rs[Ω] | FF | Pmax[W] | ΔPmax |
0 | Front | 0 | 8.93 | 38.19 | 0.478 | 0.77 | 262.7 | 0 |
1 | Front | 2400 | 8.94 | 38.05 | 0.475 | 0.764 | 260 | -1.03% |
2 | Back | 2400 | 8.95 | 38.05 | 0.474 | 0.76 | 259.97 | -1.04% |
3 | Front | 2400 | 8.89 | 38.2 | 0.477 | 0.764 | 259.94 | -1.05% |
4 | Back | 2400 | 8.91 | 38.02 | 0.5 | 0.761 | 258.12 | -1.74% |
5 | Front | 5400 | 8.93 | 37.95 | 0.5 | 0.76 | 257.85 | -1.85% |
表2中,FF指:填充因子。
结果表明即使负载达5400Pa时,组件功率仅衰减1.85%,满足IEC61215规定要求<5%,此设计具有优异的抗负载性能。该光伏组件进行机械负载测试后,光伏组件没有受损。
本公开的光伏组件,降低了光伏组件的重量,并且能够更好的满足高载荷的要求,扩展了组件的应用范围。
Claims (14)
- 一种光伏组件,包括:依次层叠设置的透明前板、第一封装层、太阳能电池片、第二封装层及背板,其中,所述背板包括依次层叠设置的第一基板层、蜂窝芯层和第二基板层,所述第一基板层和蜂窝芯层之间、第二基板层和蜂窝芯层之间分别通过胶粘剂粘接,所述第一基板层位于所述第二封装层和蜂窝芯层之间,所述第一基板层为树脂绝缘层或金属层。
- 根据权利要求1所述的光伏组件,其中,当所述第一基板层为金属层时,所述光伏组件还包括设置在所述第二封装层和第一基板层之间的第一绝缘层。
- 根据权利要求2所述的光伏组件,其中,所述蜂窝芯层内部开设有沿所述蜂窝芯层的宽度方向和长度方向至少之一延伸的排气孔。
- 根据权利要求3所述的光伏组件,其中,所述光伏组件的侧部设置有蒙皮,所述排气孔贯穿所述蜂窝芯层及所述蒙皮。
- 根据权利要求2所述的光伏组件,其中,所述蜂窝芯层为金属或树脂。
- 根据权利要求2或5所述的光伏组件,其中,所述第二基板层的材质为金属或树脂。
- 根据权利要求2所述的光伏组件,其中,所述第一绝缘层为绝缘涂层或绝缘薄膜层。
- 根据权利要求2或7所述的光伏组件,其中,当所述第一绝缘层为绝缘薄膜层时,所述绝缘薄膜层与所述第一基板层之间采用胶粘剂粘接。
- 根据权利要求2所述的光伏组件,还包括第二绝缘层,所述第二基板层位于所述蜂窝芯层和第二绝缘层之间。
- 根据权利要求1~9中任意一项所述的光伏组件,其中,所述背板上开设有用于安装所述光伏组件的安装孔,所述安装孔依次贯穿所述第一基板层、所述蜂窝芯层和所述第二基板层,所述光伏组件通过夹具、粘结胶或所述安装孔进行安装。
- 根据权利要求1~9中任意一项权利要求所述的光伏组件,其中,所述背板上开设有用于供汇流条穿过的引线孔,所述引线孔依次贯穿所述第一基板层、所述蜂窝芯层和所述第二基板层,所述汇流条的引出线上包覆有绝缘漆或绝缘膜。
- 根据权利要求2所述的光伏组件,其中,所述透明前板为下述之一:透明氟树脂薄膜,透明氟树脂薄膜与硬质封装材料的复合膜,以及透明氟树脂薄膜通过胶粘剂或通过封装材料粘结在透明硬性基材上制成的复合膜。
- 根据权利要求2所述的光伏组件,其中,所述透明硬性基材包括聚对苯二甲酸乙二醇酯PET、聚对苯二甲酸丁二醇酯PBT或聚碳酸酯PC。所述封装材料,为热塑性材料,包括聚烯烃弹性体、聚乙烯醇以及乙烯-醋酸乙烯共聚物。
- 根据权利要求2所述的光伏组件,还包括:设置在所述透明前板与第一封装层之间的玻璃纤维。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710679321.2A CN109390422B (zh) | 2017-08-10 | 2017-08-10 | 一种轻质光伏组件 |
CN201710679321.2 | 2017-08-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019029121A1 true WO2019029121A1 (zh) | 2019-02-14 |
Family
ID=65270871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/070076 WO2019029121A1 (zh) | 2017-08-10 | 2018-01-03 | 光伏组件 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN109390422B (zh) |
WO (1) | WO2019029121A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110400853A (zh) * | 2019-07-29 | 2019-11-01 | 上迈(镇江)新能源科技有限公司 | 光伏组件用轻质背板及其应用的光伏组件和其制备方法 |
CN110491961B (zh) * | 2019-07-29 | 2021-08-10 | 上迈(镇江)新能源科技有限公司 | 一种连续复合成型的轻质光伏组件及其连续复合成型设备 |
CN114512561B (zh) * | 2022-01-28 | 2024-02-27 | 东方日升新能源股份有限公司 | 光伏层压试样、电池片与胶膜粘接强度的测试方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202094162U (zh) * | 2011-06-23 | 2011-12-28 | 上海精锐金属建筑系统有限公司 | 一种太阳能电池板的背板散热结构 |
CN102437212A (zh) * | 2011-11-22 | 2012-05-02 | 北京航空航天大学 | 一种光电-热电一体化电池组件 |
CN103187471A (zh) * | 2011-12-30 | 2013-07-03 | 苏州中来光伏新材股份有限公司 | 一种刚性太阳电池背板及其加工工艺 |
CN203230074U (zh) * | 2013-03-21 | 2013-10-09 | 江苏勤丰新材料科技有限公司 | 适用于幕墙的太阳能蜂窝板 |
CN203415598U (zh) * | 2013-09-06 | 2014-01-29 | 成都旭双太阳能科技有限公司 | 一种非晶硅薄膜太阳能蜂窝型中空光伏组件 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2365052Y (zh) * | 1998-09-11 | 2000-02-23 | 浙江黄岩中意塑料厂 | 蜂窝纸板的开槽纸芯 |
CN202839685U (zh) * | 2012-09-06 | 2013-03-27 | 武汉日新科技股份有限公司 | 新型出极方式的建材型光伏构件 |
CN104362202A (zh) * | 2014-11-12 | 2015-02-18 | 南京协凯科技有限公司 | 一种光伏板组件 |
CN104538472A (zh) * | 2014-12-17 | 2015-04-22 | 无锡德鑫太阳能电力有限公司 | 一种太阳能电池组件 |
US20160343892A1 (en) * | 2015-05-18 | 2016-11-24 | Gixia Group Co. | Solar cell module and manufacturing method of same |
-
2017
- 2017-08-10 CN CN201710679321.2A patent/CN109390422B/zh active Active
-
2018
- 2018-01-03 WO PCT/CN2018/070076 patent/WO2019029121A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202094162U (zh) * | 2011-06-23 | 2011-12-28 | 上海精锐金属建筑系统有限公司 | 一种太阳能电池板的背板散热结构 |
CN102437212A (zh) * | 2011-11-22 | 2012-05-02 | 北京航空航天大学 | 一种光电-热电一体化电池组件 |
CN103187471A (zh) * | 2011-12-30 | 2013-07-03 | 苏州中来光伏新材股份有限公司 | 一种刚性太阳电池背板及其加工工艺 |
CN203230074U (zh) * | 2013-03-21 | 2013-10-09 | 江苏勤丰新材料科技有限公司 | 适用于幕墙的太阳能蜂窝板 |
CN203415598U (zh) * | 2013-09-06 | 2014-01-29 | 成都旭双太阳能科技有限公司 | 一种非晶硅薄膜太阳能蜂窝型中空光伏组件 |
Also Published As
Publication number | Publication date |
---|---|
CN109390422A (zh) | 2019-02-26 |
CN109390422B (zh) | 2022-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20160343892A1 (en) | Solar cell module and manufacturing method of same | |
US20080283117A1 (en) | Solar Cell Module and Method of Manufacturing Solar Cell Module | |
JP5891375B2 (ja) | 光起電力モジュール | |
US20110315191A1 (en) | Method for manufacturing semiconductor device | |
JPH1093124A (ja) | 太陽電池モジュール | |
WO2019029121A1 (zh) | 光伏组件 | |
WO2012056941A1 (ja) | 太陽電池モジュールおよびその製造方法 | |
US9543459B2 (en) | Flexible solar cell apparatus and method of fabricating the same | |
JP2015195417A (ja) | 光起電モジュール製造方法およびトップシート構造製造方法 | |
JP2011032451A (ja) | 複合粘着テープ及びそれを用いた太陽電池モジュール | |
JPH0945951A (ja) | 太陽電池モジュール | |
JP2007253463A (ja) | 太陽電池モジュール用表面保護シート | |
WO2013121549A1 (ja) | 太陽電池モジュール及びその製造方法 | |
JP4066271B2 (ja) | 薄膜太陽電池モジュールの製造方法とその製造装置 | |
TWI583014B (zh) | 太陽能模組及其製造及重工方法 | |
JP2012204458A (ja) | 太陽電池モジュールの製造方法 | |
TW201125140A (en) | Solar cell module | |
US20090308447A1 (en) | Photovoltaic module with at least one crystalline solar cell | |
WO2019128085A1 (zh) | 太阳能电池板 | |
US20150000734A1 (en) | Solar cell module and method of fabricating the same | |
CN217691187U (zh) | 一种单玻光伏组件 | |
US20120325292A1 (en) | Solar cell module, back sheet structure thereof and manufacturing method thereof | |
CN218069867U (zh) | 一种新型耐候增强型光伏背板和光伏组件 | |
JP2001267596A (ja) | 太陽電池モジュール及びその製造方法 | |
CN211743169U (zh) | 一种太阳能电池背板以及太阳能电池组件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18844841 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18844841 Country of ref document: EP Kind code of ref document: A1 |