WO2018161570A1 - 载台及其切割方法、加工设备 - Google Patents

载台及其切割方法、加工设备 Download PDF

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Publication number
WO2018161570A1
WO2018161570A1 PCT/CN2017/106518 CN2017106518W WO2018161570A1 WO 2018161570 A1 WO2018161570 A1 WO 2018161570A1 CN 2017106518 W CN2017106518 W CN 2017106518W WO 2018161570 A1 WO2018161570 A1 WO 2018161570A1
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WO
WIPO (PCT)
Prior art keywords
carrier substrate
stage
carrier
foreign matter
cutting
Prior art date
Application number
PCT/CN2017/106518
Other languages
English (en)
French (fr)
Inventor
陶胜
朱文龙
徐清阳
李昀泽
汪祖良
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/780,480 priority Critical patent/US20210162554A1/en
Priority to EP17872885.3A priority patent/EP3593934B1/en
Publication of WO2018161570A1 publication Critical patent/WO2018161570A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor
    • B23Q5/22—Feeding members carrying tools or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby

Definitions

  • At least one embodiment of the present disclosure is directed to a stage for a cutting process, a cutting method thereof, and a processing apparatus.
  • foreign matter on the stage needs to be removed after the cutting process. If the foreign matter on the stage is not cleaned, the foreign object may scratch the plate when the plate on the stage is subjected to a cutting process, for example, and the portion of the plate corresponding to the foreign object may be lifted to make the plate uneven. , causing the flatness of the flat plate during the cutting process to be inaccurate or fragmentation, thereby affecting the cutting yield of the flat plate.
  • the current stage structure is provided with a device for removing foreign matter, its ability to remove foreign matter on the stage is limited, which makes it difficult to improve the cutting yield of the product, and the complicated design structure of the current stage leads to limited automation capability. Affect production capacity.
  • At least one embodiment of the present disclosure provides a stage for a cutting process, comprising: a carrier substrate and a driving unit disposed on the carrier substrate, the driving unit configured to drive the carrier substrate around the carrier substrate The first direction within the panel is rotated to remove foreign matter on the carrier substrate.
  • the angle of rotation of the carrier substrate ranges from 0 to 360 degrees.
  • a stage provided by at least one embodiment of the present disclosure may further include a carrier plate disposed on the carrier substrate and a conveyor belt disposed on the carrier substrate, wherein the conveyor belt is configured to convey the carrier plate.
  • the carrier substrate is provided with a first card plate that limits the carrier.
  • a stage provided by at least one embodiment of the present disclosure may further include a cover plate disposed on the carrier, wherein the cover plate is configured to support a fixed plate to be cut.
  • the carrier board is provided with a second card plate that is limited to the cover plate.
  • an angle between a surface of the second card plate remote from the carrier substrate and a surface of the cover plate is an obtuse angle.
  • the cover plate is provided with a plurality of openings to provide vacuum adsorption.
  • the stage provided by at least one embodiment of the present disclosure may further include a recycling unit disposed on at least one side of the carrier substrate, wherein the recycling unit is configured to recover foreign matter on the carrier substrate.
  • At least one embodiment of the present disclosure provides a processing apparatus comprising the stage described in any of the above embodiments.
  • At least one embodiment of the present disclosure provides a cutting method according to the stage applied to any of the above embodiments, comprising: placing an object to be cut on the stage and performing a cutting operation; removing the cut a subsequent object; controlling the driving unit to rotate the carrier substrate to remove foreign matter on the carrier substrate.
  • the cutting method provided by at least one embodiment of the present disclosure may further include: performing at least one counterclockwise and/or clockwise reciprocating with each of the fixed angles after the carrier substrate is rotated to at least one fixed angle. motion.
  • the value of the fixed angle includes 20 degrees, 45 degrees, 85 degrees, or 95 degrees.
  • the counterclockwise and/or clockwise reciprocating motion of the carrier substrate has a deflection angle of no more than 5 degrees.
  • Figure 1a is a schematic structural view of a stage for a cutting process
  • Figure 1b is a schematic structural view of another stage for a cutting process
  • Figure 1c is a schematic structural view of another stage for a cutting process
  • FIG. 2a is a side view of a stage for a cutting process according to an embodiment of the present disclosure
  • Figure 2b is a top plan view of the stage for the cutting process shown in Figure 2a;
  • FIG. 3 is a process diagram of an operation method of a stage for a cutting process according to an embodiment of the present disclosure
  • 4a-4e are process diagrams for removing foreign matter on a stage according to an embodiment of the present disclosure.
  • the method of removing foreign matter on the stage may include air gun cleaning, brush cleaning, and belt drive cleaning.
  • the above method of removing foreign matter on the stage has the problems of labor, brush and belt damage, difficulty in cleaning, etc., and cannot be Automated production while increasing the cutting yield of the stage to products such as flat panels.
  • Figure 1a is a schematic view of the structure of a stage for a cutting process in which the means for removing foreign matter is air gun cleaning.
  • the means for removing foreign matter is air gun cleaning.
  • the useful sub-board is removed, and the remaining flat scrap waste on the stage is the foreign matter 2, which is passed through the air gun 3.
  • the foreign matter 2 on the table 1 is blown into the collecting tank 4 provided around the table 1 to effect cleaning of the table 1 of the stage.
  • This method is mainly applied to the semi-automatic carbon dioxide laser single-cutting machine.
  • the use of the air gun requires manual operation, so this method is labor-intensive, and the automated production operation of the stage cannot be realized, and the cost is increased.
  • Figure 1b is a schematic view of another structure of a stage for a cutting process in which the means for removing foreign matter is brush cleaning.
  • a single cut-out sub-board is removed, and the remaining waste, such as foreign matter, may fall on the workbench or the belt for transport, and then, for example, as shown in FIG. 1b.
  • the brush 6 sweeps the foreign matter 2 on the table or belt 5 (shown as the belt 5).
  • This method is mainly applied to the cutter wheel cutting machine in the TFT (thin film transistor) display industry.
  • the brush 6 may have residual or scattered foreign matter 2, affecting the stability of the device, and the brush 6 The loss during the process of sweeping foreign matter 2 is more serious.
  • Fig. 1c is a schematic view showing the structure of another stage for the cutting process, and the manner in which the stage removes foreign matter is belt drive cleaning.
  • the foreign matter 2 scattered on the belt 5 will slide off by itself.
  • this method causes a problem that the belt 5 is easily worn during the process of removing the foreign matter 2, and the foreign matter 2 having a small volume may still adhere to the belt 5 without falling, so that this method cannot completely remove the foreign matter 2
  • the purpose, and because it is easy to consume materials, the cost is greater.
  • At least one embodiment of the present disclosure provides a stage for a cutting process, a cutting method thereof, and a processing apparatus.
  • the stage includes a carrier substrate and a drive unit disposed on the carrier substrate, wherein the drive unit is configured to drive the carrier substrate to rotate about a first direction within the face of the carrier substrate to remove foreign matter on the carrier substrate.
  • the first direction is a direction that lies within the surface of the carrier substrate and is parallel to the surface of the carrier substrate. That is, the first direction is a rotation axis of the bearing substrate, because the carrier substrate is in the shape of a flat plate, and the rotation axis thereof may be any direction parallel to the plane thereof, which is not limited in the disclosure to facilitate carrying.
  • the substrate is preferably rotated.
  • the driving unit disposed in the stage can drive the rotation of the carrier substrate to automatically slide the foreign matter on the carrier substrate, thereby realizing automatic cleaning of the foreign object on the stage and improving the cutting yield of the product.
  • FIG. 2a is a side view of a stage for a cutting process according to an embodiment of the present disclosure.
  • the stage includes a carrier substrate 100 and a driving unit 200 disposed on the carrier substrate 100.
  • the driving unit 200 can drive the carrier substrate 100 to rotate about the first direction 800 to tilt the carrier substrate 100 such that the foreign matter on the carrier substrate 100 slides off by itself, wherein the first direction 800 is within the board surface of the carrier substrate 100 and with the carrier substrate
  • the plate faces of 100 are parallel; as shown in FIG. 2b, the first direction 800 may be the width direction of the stage, that is, the axial direction of the example of the driving unit 200 in the drawing, and FIG. 2a is the stage along the stage shown in FIG. 2b. Side view of a direction 800.
  • the stage provided by the present disclosure is a cutting process for any object
  • the object to be cut may be a flat plate
  • the flat plate may be an uncut entire display substrate (motherboard)
  • the substrate may include a plurality of juxtaposed daughter boards (an array substrate or a color film substrate for one display panel) and a dummy region (Dummy) disposed around the daughter board, and the daughter board and the dummy area are separated and sub-processed during the cutting process After the board is removed, the dummy area remains on the carrier substrate 100 to become waste (foreign matter) to be removed.
  • the driving unit 200 drives the carrier substrate 100 to rotate about the first direction 800 to cause the carrier substrate 100 to tilt from the horizontal direction.
  • the foreign matter on the carrier substrate 100 is affected by gravity and will slide off from the carrier substrate 100. .
  • the structure of the stage structure for removing foreign matter is simple, the degree of automation is high, the consumables are small, and no human intervention is required, and the production cost is reduced while increasing the production capacity.
  • the object on which the cutting process is performed is not limited to a flat plate
  • the type of the flat plate is not limited to the above display substrate, and may be a display panel, a glass substrate, a flexible substrate, or the like, and an embodiment of the present disclosure.
  • the type of the flat plate on which the cutting process is performed is not limited.
  • the contents of the following embodiments of the present disclosure will be described by taking the object of the cutting process on the stage as a flat plate as an example.
  • the driving direction of the driving unit 200 to drive the carrier substrate 100 is not limited to clockwise rotation based on the first direction 800 as shown in FIG. 2b, and counterclockwise rotation may be performed based on the first direction; 200 is not limited to being disposed in the middle of the carrier substrate 100 as shown in FIG. 2a, and may be disposed at, for example, either end of the carrier substrate 100.
  • the center of rotation of the carrier substrate 100 is not limited to the position of the driving unit 200, as long as the driving is performed.
  • the unit 200 can make the bearing substrate 100 tilt, for example, about the first direction 800, so as to obtain the technical effect that the foreign object slips off by itself, such as weight loss, thereby improving the automatic cleaning of the stage by the device.
  • the drive unit 200 can be implemented in a variety of manners, such as a rotating electrical machine.
  • the rotating electrical machine may include a control motor or a power motor or the like.
  • the control motor may be, for example, a servo motor, a stepping motor, or a torque motor, etc.;
  • the power motor may be, for example, a direct current motor, an asynchronous motor, or a synchronous motor.
  • the drive unit can be placed next to or separately from the carrier substrate. When the two are separately arranged, the driving unit can drive the carrier substrate to rotate around a rotating shaft by means of a chain, a belt, a gear or the like.
  • the type of the driving unit 200 and the specific working mode are not limited, as long as the driving unit 200 can drive the carrier substrate 100 to rotate.
  • the panel to be cut may be a metal panel, a non-metallic panel, or a panel formed with functional components.
  • the metal panel may be, for example, an electrogalvanized steel sheet, a hot dip galvanized steel sheet, an galvanized steel sheet or a copper plate, etc.
  • the non-metal panel may be, for example, a glass panel, a quartz panel, a ceramic panel, a plastic panel or a silicone panel
  • the panel having the functional components may be, for example, a liquid crystal display panel, an OLED display panel, or an electronic paper display panel.
  • the range of angles at which the driving unit 200 can drive the rotation of the carrier substrate is not limited, that is, the range of the rotation of the carrier substrate 100 may include 0 to 360 degrees, and for example, 0 to 180 degrees, or 0 to 90, for example, 60 to 80 degrees.
  • the gravity will completely act on the sliding of the foreign matter without being affected by the resistance such as friction, in which case the foreign matter on the substrate is carried. Easier to be cleared.
  • the angle of the unsupported state of the carrier substrate is zero degrees, the angle of the vertical unrotated state is 90 degrees, and the angle of the full flip is 180 degrees, the angle may be a clockwise rotation angle or a counterclockwise rotation.
  • the angle such as 0 degrees when the carrier substrate is horizontally facing up, is 90 degrees in the vertical state, 180 degrees in the horizontal state, and so on.
  • the stage may further include a carrier 300 disposed on the carrier substrate 100.
  • the carrier 300 can be used to support a panel to be cut.
  • the carrier 300 can be a rigid substrate such as a metal substrate, which can provide support for the flat plate while avoiding bending of the flat plate during, for example, the conveying or cutting process, thereby ensuring that the cutting points of the flat plate are in the same plane, thereby improving the flat cutting. rate.
  • the flat plate is subjected to a process such as cutting on the carrier 300, so that foreign matter falls on the carrier.
  • the above-described stage cleaning operation on the carrier substrate should be to remove foreign matter on the carrier.
  • the stage may further include a conveyor belt 700 disposed on the carrier substrate 100.
  • the conveyor belt 700 is configured to transport the carrier 300 so that the automation capabilities of the stage can be increased.
  • the conveyor belt 700 transports the cleaned carrier 300 to the next process, for example, the process may be to place a new tablet to be processed on the carrier 300, and then the conveyor 700 will carry the plate.
  • the carrier 300 is transferred to the carrier substrate 100, and then the process flow such as cutting, cleaning, and the like is continued.
  • the conveyor belt 700 After the conveyor belt 700 is set in the stage, automation between different process flows can be realized on the basis of automatic operation such as cutting and cleaning, which saves cost and improves production efficiency.
  • Embodiments of the present disclosure do not limit the manner in which the conveyor belt 700 is transported.
  • the manner of transport of the conveyor belt 700 may include belt transmission, gear transmission, chain transmission, cylinder expansion, wheel transmission, and the like.
  • the carrier substrate 100 may further be provided with a fixing structure of the first card board 500 or the boss or the like that limits the carrier board 300.
  • the fixed structure such as the first card board 500
  • the first card board 500 can not only secure the carrier 300 to the carrier substrate 100, but can also accurately position the carrier 300.
  • the first card board 500 may fix the carrier 300 to prevent loosening or sliding; the process of cutting the board on the carrier 300, for example, is performed.
  • the first card board 500 can limit the carrier board 300 to the position required by the specific process, thereby ensuring the precision of the cutting process.
  • the first card board 500 is formed separately from the carrier substrate 100 and then assembled together or integrally formed.
  • the manner in which the stage holds the flat plate to be cut is not limited.
  • the stage can be fixed to the flat plate.
  • the flat plate can be fixed by vacuum suction.
  • Figure 2b is a top plan view of the stage for the cutting process shown in Figure 2a.
  • the stage may further include a cover plate 400 disposed on the carrier, and the cover plate 400 may be supported and fixed, for example. The plate being cut.
  • a plurality of openings 410 for providing vacuum suction may be disposed on the cover plate 400, and the openings 410 may be in communication with a vacuum suction device, for example.
  • the flat plate 400 when the flat plate 400 is placed on the cover plate 400, the flat plate can be fixed to the cover plate 400 by vacuum suction provided by the cover plate 400 during the process of transporting the carrier plate 300 and the components thereon.
  • the vacuum suction can also fix the flat plate on the cover plate 400, thereby preventing problems such as poor cutting caused by the movement of the flat plate by, for example, cutting of the cutter wheel.
  • the cover 400 may also be provided with a structure such as electrostatic adsorption to fix the flat plate on the cover 400, thereby preventing the flat plate from moving.
  • the carrier board 300 may further be provided with a second card board 600 for fixing the cover plate 400.
  • the second card board 600 can both fix the cover plate 400 to the carrier 300 and limit the cover 400.
  • the second card board 600 can fix the cover plate 400 to prevent loosening or sliding; the process of cutting the flat plate on the cover plate 400, for example, The second card plate 600 can limit the cover plate 400 to the position required by the specific process, thereby ensuring the precision of the cutting process.
  • the surface of the second card board 600 remote from the carrier substrate 100 may be disposed as a slope, that is, a surface of the second card board 600 away from the carrier substrate 100.
  • the angle with the surface of the cover 400 may be an obtuse angle so that foreign matter on the cover 400 is easily slipped.
  • the driving unit 200 drives the carrier substrate 100 to rotate to cause the foreign matter on the cover plate 400 to slip, when the foreign matter slips to the edge of the cover 400, due to the second card board
  • the cover 400 needs to be fixed, so that it protrudes above the cover 400 to block the falling foreign matter, and when the angle A between the oblique side 610 of the second card 600 and the cover 400 is an obtuse angle, the first The resistance of the second card 600 to the sliding of the foreign matter is reduced to allow the foreign matter to easily slide off the cover 400.
  • the oblique side 610 is not limited to the straight line shown in FIG. 2a, and may be a shape such as an arc, as long as the angle A between the tangent line of the portion of the oblique side 610 close to the cover 400 and the cover 400 is An obtuse angle can be used.
  • the number of the second card plates 600 having the inclined surface as shown in FIG. 2a in the stage is not limited.
  • the second card plate 600 on the stage may be configured to have a beveled structure; one of the second card plates 600 of the stage may also be provided with a beveled structure.
  • the position of the second card 600 having the slope may be located at a position where the foreign object slips.
  • the second card plate 600 having a cross section may be adjacent to the recovery unit 90 in the following embodiment to facilitate the sliding of foreign matter from the stage into the recovery unit 90.
  • the specific position of the cover 400 is not limited.
  • the cover plate 400 may be disposed on the carrier 300 or may be disposed on the carrier substrate 100 as long as the cover 400 can provide vacuum adsorption or the like to fix the plate.
  • the cover 400 may be disposed on the carrier 300; when the carrier substrate 100 of the stage provided by the embodiment of the present disclosure is provided When the carrier 300 is not provided, the cover 400 can be directly disposed on the carrier substrate 100.
  • the first card 500 is used to fix the cover 400, and the shape and the like of the first card 500 can be referred to.
  • the stage may further include a recovery unit 90, and the recovery unit 90 may be disposed on a side of the stage on which the carrier substrate 100 is disposed, and the recovery unit 90 may be recycled.
  • the foreign matter that has been removed from the substrate 100 is carried.
  • the recycling unit 90 can be a crushing machine, which can crush the foreign matter falling on the bearing substrate, can reduce the space occupied by the foreign matter and facilitate transportation.
  • the stage of this embodiment may also be provided with a recovery unit on both sides.
  • the roughness of the surface in contact with the flat plate to be cut is required to be high.
  • the surface of the cover 400 away from the carrier substrate 100 has a high microscopic roughness and a low macroscopic roughness, and the microscopic cover is microscopic.
  • the high surface roughness prevents the micro foreign matter on the cover from being easily slipped due to the adsorption effect, and the roughness of the macro upper cover surface is low, and the flat plate can be smoothly placed on the cover 400 to ensure the cutting during the cutting process, for example.
  • the positioning is accurate and the flat plate is not scratched, thereby improving the cutting yield while improving the ability of the foreign object to slide down.
  • At least one embodiment of the present disclosure provides a processing apparatus including the stage provided in any of the above embodiments.
  • the processing apparatus can also include a cutting head that can be used to cut a flat plate on the carrier substrate.
  • the cutting head can be a device or device such as a cutter wheel cutting head, a wire cutting head, or a laser cutting head.
  • At least one embodiment of the present disclosure provides a cutting method for a stage, the method comprising: setting an object to be cut on a stage and performing a cutting operation thereof; removing the object after cutting; and controlling the driving unit to rotate the carrier substrate to The foreign matter on the carrier substrate is removed.
  • the drive unit provided on the stage can drive the rotation of the stage to automatically slide the foreign objects on the stage, which can improve the automation capability of the stage and the removal rate of foreign matter.
  • FIG. 3 is a process diagram of an operation method of a stage for a cutting process according to an embodiment of the present disclosure.
  • the cutting method of the stage provided by at least one embodiment of the present disclosure may include the following process:
  • the plate to be cut is placed on the stage and cut.
  • the tablet may include at least one daughter board and a dummy area disposed at a periphery of the daughter board.
  • the stage separates the daughter board from the dummy area by a cutting process.
  • the cut plate (sub-board) is removed, and the foreign matter that has been cut remains on the stage.
  • the daughter board can be removed by the adsorption device, which can reduce the scratch of the daughter board during the movement.
  • the dummy area that is cut and separated in the flat plate remains as a foreign matter on the carrier substrate.
  • the drive unit is controlled to drive the carrier substrate to rotate.
  • the method for removing foreign matter is simple and does not require human intervention, and the automatic operation capability of the loading platform is easily improved.
  • the cutting method provided by at least one embodiment of the present disclosure, after the carrier substrate is rotated to at least one fixed angle, at least one counterclockwise and/or clockwise reciprocating motion is made with reference to each of the fixed angles.
  • This reciprocating motion can be understood as the drive unit driving the carrier substrate to shake at each fixed angle, which can make the foreign matter on the carrier substrate loose and easier to slip.
  • the method has a more thorough effect of removing foreign matter and makes the cutting yield of the stage to the plate higher.
  • the current method of cleaning the foreign objects on the stage by using a brush, an air gun, etc. can make the cutting yield of the stage reach 99.2% to 99.5%, and the cutting method provided by the above embodiment of the present disclosure cleans the foreign matter.
  • the operation mode can make the cutting yield of the stage to the flat plate reach about 99.5% and above.
  • the fixed angle of the rotation of the carrier substrate may range from 0 to 360 degrees, that is, the driving unit may drive the carrier substrate to rotate and fix to any angle.
  • the value of the fixed angle can be about 20 degrees, about 45 degrees, about 85 degrees, or about 95 degrees, and the like.
  • FIGS. 4a-4e are process diagrams for removing foreign matter on a stage according to an embodiment of the present disclosure.
  • the value of the fixed angle at which the substrate is rotated may be about 20 degrees, about 45 degrees, about 85 degrees, or about 95 degrees.
  • the process of removing the foreign matter by the stage may include the following process. .
  • the drive unit 200 has not yet driven the carrier substrate 100 to rotate.
  • the stage at this time has completed the cutting of the flat plate and takes off the sub-board on the carrier substrate 100, and the foreign matter being cut remains on the carrier substrate 100.
  • the deflection angle of the carrier substrate 100 is 0 degrees.
  • the driving unit 200 stops when the carrier substrate 100 is rotated clockwise and rotated to an angle of 20 degrees with respect to the horizontal position, and then, for example, a reciprocating motion can be performed.
  • the carrier substrate 100 is in an initial position at a position 20 degrees with respect to the horizontal position, and the process of the reciprocating motion may be one or a combination of the following processes: the carrier substrate 100 is rotated clockwise by an angle and then rotated counterclockwise and Returning to the initial position; or the carrier substrate 100 is rotated counterclockwise by an angle and then rotated clockwise and returned to the initial position; or the carrier substrate 100 is rotated clockwise by an angle and then rotated counterclockwise and through the initial position at an angle, then clockwise Return to the initial position; or the carrier substrate 100 is rotated counterclockwise by an angle and then rotated clockwise through the initial position by an angle and then counterclockwise back to the initial position.
  • the reciprocating motion is not limited to one time, and may be multiple times. Illustratively, in this
  • the driving unit 200 is not limited to the clockwise rotation of the driving carrier substrate 100 as shown in FIGS. 4a to 4b, and the carrier substrate 100 may be driven to rotate counterclockwise first. Next, the process of the cutting method in the following embodiments of the present disclosure will be described by taking the driving unit 200 to drive the carrier substrate 100 to perform clockwise rotation as an example.
  • Excessive magnitude of the drive unit 200 driving the carrier substrate 100 for reciprocation may result in loosening of components on the carrier substrate 100, such as the carrier 300 or the like.
  • the counterclockwise and/or clockwise reciprocating motion of the carrier substrate 100 may have a deflection angle of no more than 5 degrees, within which the components such as the carrier 300 may be avoided. Since the amplitude of the reciprocating motion is too large and loose, the foreign matter on the carrier substrate 100 can be loosened and more easily slipped.
  • the driving unit 200 drives the carrier substrate 100 to rotate and rotate to an angle of 45 degrees to stop, and then, for example, can perform a reciprocating motion.
  • a 45 degree deflection angle and reciprocating motion may cause larger foreign matter remaining on the carrier substrate 100 and/or a portion of smaller foreign matter to slip.
  • the operation process corresponding to FIG. 4b may be omitted, and the operation process corresponding to FIG. 4c may be directly performed after the operation process corresponding to FIG. 4a ends, thereby making Large or large foreign objects slip off at once.
  • the deflection angle of the carrier substrate 100 is large, for example, a large foreign matter having a large mass may have a large sliding speed, which may scratch the surface through which it passes.
  • a large foreign object may cause scratches on the surface of the cover 400.
  • the driving unit 200 stops when the carrier substrate 100 is rotated and rotated to a fixed angle of 85 degrees, and then, for example, can perform a reciprocating motion.
  • a deflection angle of 85 degrees and reciprocation may cause small pieces of foreign matter and/or partially debris-type foreign matter remaining on the carrier substrate 100 to slip.
  • the driving unit 200 stops when the carrier substrate 100 is rotated and rotated to a fixed angle of 95 degrees, and then, for example, can perform a reciprocating motion.
  • the gravity of the foreign matter on the carrier substrate 100 can all act on the sliding of the foreign matter (in this case, falling) without being subjected to resistance such as friction. The effect of the remaining foreign matter on the carrier substrate 100 can be removed during this process.
  • At least one embodiment of the present disclosure provides a stage for a cutting process, a cutting method thereof, a processing apparatus, and may have at least one of the following effects:
  • At least one embodiment of the present disclosure provides a stage for a cutting process, and a driving unit provided on the stage can drive the stage to rotate to automatically slide the foreign matter on the stage, thereby facilitating lifting of the stage to remove foreign matter. Clearance and automation capabilities.
  • a conveyor belt is disposed in the stage, which can automatically transfer the plate to be cut between different processes, and improve the automatic circulation capability of the stage. And cutting process capacity.

Abstract

一种用于切割工艺的载台及其切割方法、加工设备，包括：承载基底(100)和设置于所述承载基底(100)上的驱动单元(200)，所述驱动单元(200)配置为驱动所述承载基底(100)绕位于所述承载基底(100)的板面内的第一方向(800)旋转以清除所述承载基底(100)上的异物(2)。该载台中设置的驱动单元(200)可以驱动承载基底(100)旋转以实现承载基底(100)上的异物(2)自动滑落，提高载台清除异物的清除率和自动化能力，提高产品的切割良率。

Description

载台及其切割方法、加工设备
本申请要求于2017年3月10日递交的中国专利申请第201710142618.5号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开至少一个实施例涉及一种用于切割工艺的载台及其切割方法、加工设备。
背景技术
对于当前的用于切割工艺的载台，在其进行切割工艺之后需要对载台上的异物进行清除。如果载台上的异物未被清除干净，在对载台上的平板例如进行切割工艺时，这些异物可能会对该平板造成划伤，而且平板的对应于异物的部分会翘起使得平板放置不平，导致平板在切割过程中定位不准或者产生破片，从而影响平板的切割良率。
虽然当前的载台结构中设置有对异物清除的装置，但是其对载台上异物的清除能力有限，从而难以提升产品切割良率，而且当前的载台复杂的设计结构导致其自动化能力有限，影响产能。
发明内容
本公开至少一个实施例提供一种用于切割工艺的载台，包括：承载基底以及设置于所述承载基底上的驱动单元，所述驱动单元配置为驱动所述承载基底绕位于所述承载基底的板面内的第一方向旋转以清除所述承载基底上的异物。
例如，在本公开至少一个实施例提供的载台中，所述承载基底旋转的角度范围包括0～360度。
例如，本公开至少一个实施例提供的载台还可以包括设置于所述承载基底上的载板以及设置于所述承载基底上的传送带，其中，所述传送带设置为传送所述载板。
例如，在本公开至少一个实施例提供的载台中，所述承载基底上设置有对所述载板限位的第一卡板。
例如，本公开至少一个实施例提供的载台还可以包括设置于所述载板上的盖板，其中，所述盖板配置为支撑固定待被切割的平板。
例如，在本公开至少一个实施例提供的载台中，所述载板上设置有限位所述盖板的第二卡板。
例如，在本公开至少一个实施例提供的载台中，所述第二卡板的远离所述承载基底的表面与所述盖板的表面的夹角为钝角。
例如，在本公开至少一个实施例提供的载台中，所述盖板上设置有多个开孔以提供真空吸附。
例如，本公开至少一个实施例提供的载台还可以包括设置于所述承载基底至少一侧的回收单元，其中，所述回收单元配置为回收所述承载基底上的异物。
本公开至少一个实施例提供一种加工设备，包括上述任一实施例中所述的载台。
本公开至少一个实施例提供一种根据应用于上述任一实施例中所述的载台的切割方法，包括：在所述载台上放置待切割物体并对其进行切割操作；移除被切割后的物体；控制所述驱动单元带动所述承载基底旋转以清除所述承载基底上的异物。
例如，本公开至少一个实施例提供的切割方法还可以包括：当所述承载基底旋转至至少一个固定角度后，以每个所述固定角度为基准做至少一次逆时针和/或顺时针的往复运动。
例如，在本公开至少一个实施例提供的切割方法中，所述固定角度的数值包括20度、45度、85度或95度。
例如，在本公开至少一个实施例提供的切割方法中，所述承载基底的逆时针和/或顺时针的往复运动的偏转角度不大于5度。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1a为一种用于切割工艺的载台的结构示意图；
图1b为另一种用于切割工艺的载台的结构示意图；
图1c为另一种用于切割工艺的载台的结构示意图；
图2a为本公开一实施例提供的一种用于切割工艺的载台的侧视图；
图2b为图2a所示的用于切割工艺的载台的俯视图；
图3为本公开一实施例提供的用于切割工艺的载台的操作方法的过程图；以及
图4a～4e为本公开一实施例提供的一种清除载台上异物的过程图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
对载台上异物清除的方式可以包括气枪清理、毛刷清理以及皮带传动清理等，以上对载台上异物清除的方式存在耗费人力、毛刷及传送带损坏、难以清理干净等问题，而且无法在实现自动化生产的同时提升载台对产品例如平板的切割良率。
图1a为一种用于切割工艺的载台的结构示意图，该载台清除异物的方式为气枪清理。例如图1a所示，在载台上进行加工作业例如切割平板之后，将有用的子板取走，载台上剩余切割平板废料即异物2，通过气枪3将这 些工作台1上的异物2吹入设置于工作台1周围的收集槽4中以实现对载台的工作台1的清洁。此方式主要应用于半自动式二氧化碳激光单体切割机中，气枪的使用需要人工进行操作，所以此方法耗费人力，无法实现载台的自动化生产作业，而且增加成本。
图1b为另一种用于切割工艺的载台的结构示意图，该载台清除异物的方式为毛刷清理。在载台上进行例如切割平板的工艺后，先取走单个的切割完成的子板，剩余的废料例如异物会落在工作台或者传送用的皮带上，然后，例如如图1b所示，通过毛刷6将工作台或皮带5(图示为皮带5)上的异物2扫除。此方法主要应用于TFT(薄膜晶体管)显示行业中的刀轮切割机中，毛刷6在扫除异物2的过程中会出现异物2残留或散落的情况，影响设备的稳定性，而且毛刷6在扫除异物2过程中的损耗比较严重。
图1c为另一种用于切割工艺的载台的结构示意图，该载台清除异物的方式为皮带传动清理。例如如图1c所示，在皮带5的传动过程中，散落在皮带5上的异物2会自行滑落。但是，此方法在清除异物2的过程中，会产生皮带5易磨损的问题，而且体积较小的异物2可能仍然附着在皮带5上而没有掉落，所以，此方法不能取得完全清除异物2的目的，而且因为容易耗费材料，成本较大。
本公开至少一实施例提供一种用于切割工艺的载台及其切割方法、加工设备。该载台包括承载基底和设置在承载基底上的驱动单元，其中，驱动单元配置为驱动承载基底绕位于承载基底的板面内的第一方向旋转以清除承载基底上的异物。例如，第一方向为位于承载基底板面内并与该承载基底板面平行的方向。即所述第一方向为所述承载基底旋转的旋转轴，因为所述承载基底为平板状，其旋转轴可以为其平面内与其平行的任意方向，本公开对此不做限定，以便于承载基板旋转为宜。该载台中设置的驱动单元可以驱动承载基底旋转以实现承载基底上的异物自动滑落，从而可以实现载台对异物的自动化清理，并提高产品的切割良率。
下面，结合附图对根据本公开至少一个实施例中的一种用于切割工艺的载台及其切割方法进行说明。
本公开至少一个实施例提供一种用于切割工艺的载台，图2a为本公开一实施例提供的一种用于切割工艺的载台的侧视图。例如，如图2a所示，该载台包括承载基底100以及设置于承载基底100上的驱动单元200，该 驱动单元200可以驱动承载基底100绕第一方向800旋转以使得承载基底100倾斜，从而使得承载基底100上的异物自行滑落，其中第一方向800为位于承载基底100的板面内并且与承载基底100的板面平行；参见图2b所示，第一方向800可以为载台的宽度方向，也即图中驱动单元200的示例的轴向方向，图2a为图2b所示的载台沿第一方向800的侧视图。
示例性的，例如本公开提供的载台为用于对任何物体的切割工艺，例如该待被切割的物体可以为平板，该平板可以为未切割的整张显示基板(母板)，该显示基板可以包括多个并列的子板(用于一个显示面板的阵列基板或彩膜基板)和设置在子板周围的虚设区域(Dummy)，在切割工艺过程中，子板和虚设区域分离并且子板被取走之后，虚设区域残留在承载基底100上成为待清除废料(异物)。以例如第一方向800为基准，驱动单元200驱动承载基底100绕第一方向800旋转以使得承载基底100从水平方向开始倾斜，承载基底100上的异物受重力影响会从承载基底100上自行滑落。该载台结构清除异物的方式简单，自动化程度高、耗材少而且不需要人为干预，在提高产能的同时降低生产成本。
在本公开的实施例中，载台上进行切割工艺的物体不限于平板，而且平板的类型不限于上述的显示基板，还可以为显示面板，玻璃基板，柔性基板等等，本公开的实施例对载台上进行切割工艺的平板的类型不做限定。下面，以载台上进行切割工艺的对象为平板为例，对本公开下述实施例中的内容进行说明。
需要说明的是，驱动单元200驱动承载基底100的旋转方向不限于如图2b所示的以第一方向800为基准做顺时针旋转，也可以以第一方向为基准做逆时针旋转；驱动单元200不限于设置在如图2a所示的设置在承载基底100的中间，也可以设置于例如承载基底100的任一一端，承载基底100旋转的中心也不限于驱动单元200所在位置，只要驱动单元200可以使得承载基底100倾斜例如绕第一方向800旋转，即可取得异物因例如失重等自行滑落从而提高设备自动化清理载台的技术效果。
例如，在本公开至少一个实施例中，驱动单元200可以多种方式实现，例如可以为旋转电机。例如该旋转电机可以包括为控制电动机或者功率电动机等。控制电动机例如可以为伺服电动机、步进电动机或者力矩电动机等；功率电动机例如可以为直流电动机、异步电动机或者同步电动机等。 驱动单元可以紧邻承载基底设置，也可以与之分开设置。当二者分开设置时，驱动单元可以通过链条、皮带、齿轮等方式带动承载基底绕一转轴旋转。在本公开的实施例中，对驱动单元200的类型及具体化工作方式不做限制，只要驱动单元200可以驱动承载基底100旋转即可。
例如，在本公开至少一个实施例中，待被切割的平板可以为金属面板、非金属面板或者形成有功能部件的面板。示例性的，金属面板例如可以为电镀锌钢板、热浸锌钢板、镀铝锌钢板或者紫铜板等；非金属面板例如可以为玻璃面板、石英面板、陶瓷面板、塑料面板或硅胶面板等；形成有功能部件的面板例如可以为液晶显示面板、OLED显示面板或电子纸显示面板等。
例如，在本公开的实施例中，对驱动单元200可以驱动承载基底旋转的角度范围不做限制，即承载基底100旋转的角度范围可以包括0～360度，又例如，0～180度，或者0～90，例如60～80度等。示例性的，以上述的第一方向为基准，当承载基底旋转的范围超过90度时，重力将完全作用于异物的滑落而不受摩擦等阻力的影响，在此情况下承载基底上的异物更容易被清除。当所述承载基底未进行旋转状态的角度为零度，垂直未旋转状态的角度为90度，完全翻转的角度为180度，所述角度可以为顺时针旋转的角度，也可以是逆时针旋转的角度，如当所述承载基底为水平状态正面朝上时为0度，则竖直状态为90度，水平状态背面朝上为180度，以此类推。
例如，在本公开至少一个实施例中，如图2a所示，载台还可以包括设置在承载基底100上的载板300。例如，该载板300可以用于支撑待被切割的平板。该载板300可以为刚性基板例如金属基板，可以在为平板提供支撑的同时避免平板在例如传送或切割工艺过程中产生弯曲，从而可以保证平板的切割点位处于同一平面内，提高平板切割良率。
需要说明的是，例如，在载台的承载基底100上设置有载板300的情况下，平板是在载板300上进行例如切割等工艺的，所以异物是落在在载板上的。在此情况下，上述的载台对承载基底上的异物清除操作应当为清除位于载板上的异物。
例如，在本公开至少一个实施例中，如图2a所示，载台还可以包括设置于承载基底100上的传送带700。例如，该传送带700设置为可以传送载板300，从而可以提升载台的自动化能力。示例性的，当载台结束对 载板300上的异物清除的操作后，传送带700将清洁的载板300传送至下一工序，例如该工序可以为在载板300上放置新的待处理平板，然后传送带700将载有平板的载板300传送至承载基底100上，然后再继续进行例如切割、清除等工艺流程。载台中设置传送带700后，在实现切割、清除等操作自动化的基础上还可以实现不同工艺流程之间的自动化，节省成本并提高生产效率。本公开的实施例对传送带700的传送方式不做限制，例如，传送带700的传送方式可以包括皮带传动、齿轮传动、链条传动、气缸伸缩、轮式传动等。
例如，在本公开至少一个实施例提供的载台中，如图2a所示，承载基底100上还可以设置有对载板300限位的第一卡板500或凸台等的固定结构。例如，该固定结构例如第一卡板500不仅可以将载板300固定在承载基底100上，而且还可以对载板300准确限位。示例性的，在驱动单元200驱动承载基底100旋转的过程中，第一卡板500可以固定载板300以防其发生松动或滑落；在对载板300上的平板例如进行切割工艺处理的过程中，第一卡板500可以将载板300限制在具体工艺所要求的位置上，从而保证切割工艺的精度。例如，第一卡板500与承载基底100分开形成然后组装在一起，或者一体形成。
在本公开的实施例中，对载台固定待切割的平板的方式不做限制。例如，载台对平板的固定方式有多种，为提高载台的自动化能力，例如可以使用真空吸附的方式对平板进行固定。
图2b为图2a所示的用于切割工艺的载台的俯视图。例如，在本公开至少一个实施例提供的载台中，如图2a和图2b所示，该载台还可以进一步包括设置在在载板上的盖板400，该盖板400可以支撑固定例如待被切割的平板。盖板400上可以设置多个用以提供真空吸附的开孔410，这些开孔410例如可以与真空抽吸设备相通。示例性的，例如当盖板400上放置待被切割的平板后，在传送带700传动载板300及其上的部件的过程中，通过盖板400提供的真空吸附可以将平板固定在盖板400上以防止平板移动；在对平板进行加工处理例如切割工艺过程中，真空吸附也可以将平板固定在盖板400上，可以防止因例如刀轮切割使得平板移动而导致的切割不良等问题。盖板400还可以设置有静电吸附等结构以将平板固定在盖板400上，从而防止平板移动。
例如，在本公开至少一个实施例提供的载台中，如图2a所示，载板300上还可以设置有固定盖板400的第二卡板600。该第二卡板600既可以将盖板400固定在载板300上又可以对盖板400进行限位。示例性的，在驱动单元200驱动承载基底100旋转的过程中，第二卡板600可以固定盖板400以防其发生松动或滑落；在对盖板400上的平板例如进行切割工艺处理的过程中，第二卡板600可以将盖板400限制在具体工艺所要求的位置上，从而保证切割工艺的精度。
例如，在本公开至少一个实施例提供的载台中，如图2a所示，第二卡板600的远离承载基底100的表面可以设置为斜面，即第二卡板600的远离承载基底100的表面与盖板400的表面的夹角可以为钝角，以便于盖板400上的异物容易滑落。示例性的，例如载台在完成对平板的切割工艺之后，驱动单元200驱动承载基底100转动以使得盖板400上的异物滑落，当异物滑落至盖板400的边缘时，因第二卡板600需要对盖板400进行固定，所以其突出于盖板400之上而对滑落的异物进行阻挡，而当第二卡板600的斜边610与盖板400的夹角A为钝角时，第二卡板600对异物滑落的阻力减小从而可以使得异物容易从盖板400上滑落。需要说明的是，斜边610不限于图2a中所示的直线，也可以为弧线等形状，只要斜边610的靠近盖板400的部分的切线与盖板400之间的夹角A为钝角即可。
需要说明的是，在本公开的实施例中，对载台中具有如图2a所示的斜面的第二卡板600的数量不做限制。示例性的，可以将载台上的第二卡板600都设置为具有斜面的结构；也可以将载台的第二卡板600中的一个设置为具有斜面的结构。具有斜面的第二卡板600的位置可以位于异物滑落的位置。示例性的，该具有截面的第二卡板600可以靠近下述实施例中的回收单元90，以便于异物从载台上滑落至回收单元90中。
在本公开的实施例中，对盖板400的具体化设置位置不做限制。例如，盖板400可以设置于载板300上，也可以设置在承载基底100上，只要盖板400可以提供真空吸附等手段以固定平板即可。示例性的，当本公开实施例提供的载台的承载基底100上设置有载板300时，盖板400可以设置于载板300上；当本公开实施例提供的载台的承载基底100上未设置有载板300时，盖板400可以直接设置于承载基底100上，在此情况下，第一卡板500则用于固定盖板400，而第一卡板500的形状等特征可以参考如 图2a所示的第二卡板600的设计结构。
例如，在本公开至少一个实施例中，如图2a所示，载台还可以包括回收单元90，回收单元90可以设置在载台的设置有承载基底100的一侧，该回收单元90可以回收承载基底100上被清除下来的异物。示例性的，该回收单元90可以为碎压机，可以将承载基底上滑落的异物进行碎压处理，可以减少异物占用空间并便于运输。该实施例的载台还可以在两侧都设置有回收单元。
需要说明的是，在本公开实施例提供的载台中，对与待切割平板接触的表面的粗糙度要求较高。示例性的，例如以上述实施例中设置有盖板400的载台为例，盖板400的远离承载基底100的表面在微观上的粗糙度高而在宏观上粗糙度低，微观上盖板表面的粗糙度高可以防止盖板上的微型异物因吸附作用而不易滑落，宏观上盖板表面的粗糙度低又可以保证在例如切割工艺过程中，平板在盖板400上平稳放置以保证切割的定位准确而且平板不会被划伤，从而在提高异物滑落能力的同时保证切割良率。
本公开至少一实施例提供一种加工设备，该加工设备包括上述任一实施例中提供的载台。
例如，在本公开至少一个实施例中，加工设备还可以包括切割头，该切割头可以用于切割位于承载基底上的平板。例如，该切割头可以为刀轮切割头、线切割头或者激光切割头等器件或装置。
本公开至少一实施例提供一种载台的切割方法，该方法包括：在载台上设置待切割物体并对其进行切割操作；移除被切割后的物体；控制驱动单元带动承载基底旋转以清除所述承载基底上的异物。载台上设置的驱动单元可以驱动载台旋转以实现载台上的异物自动滑落，可以提升载台的自动化能力以及对异物的清除率。
下面，以该待被切割物体为平板为例，对本公开下述实施例中的载台的切割方法进行说明。
图3为本公开一实施例提供的用于切割工艺的载台的操作方法的过程图。例如，如图3所示，本公开至少一个实施例提供的载台的切割方法可以包括如下过程：
在载台上设置待切割平板并对其进行切割操作。
例如，该平板可以包括至少一个子板和设置于子板外围的虚设区域， 载台通过切割工艺将子板和虚设区域分离。
移除被切割后的平板(子板)，载台上剩余被切割下的异物。
例如，可以通过吸附装置将子板取走，该方法可以降低子板在移动过程中的划伤。平板中被切割而分离出的虚设区域作为异物留在承载基底上。
控制驱动单元以带动承载基底旋转。
驱动单元带动承载基底旋转后，因承载基底倾斜，承载基底上的异物会自行滑落，该清除异物的方式简单且不需人为干预，易于提高载台的自动化操作能力。
例如，在本公开至少一个实施例提供的切割方法中，当承载基底旋转至至少一个固定角度后，以每个所述固定角度为基准做至少一次逆时针和/或顺时针的往复运动。该往复运动可以理解为驱动单元驱动承载基底在每个固定角度处抖动，该方式可以使得承载基底上的异物松动而更容易滑落。该方法与当前的清除载台上的异物的方式相比较，其清除异物的效果更彻底，并且使得载台对平板的切割良率更高。例如，以当前的毛刷、气枪等清理载台上异物的方式为例，其可以使得载台的切割良率达到99.2％～99.5％，而本公开上述实施例提供的切割方法的清理异物的操作方式可以使得载台对平板的切割良率达到约99.5％及以上。
例如，在本公开至少一个实施例提供的切割方法中，承载基底旋转的固定角度的取值范围可以为0～360度，即驱动单元可以带动承载基底旋转并固定至任一角度。例如，该固定角度的数值可以为约20度、约45度、约85度或约95度等。当承载基底在上述优选的固定角度皆进行往复运动时，承载基底上的异物的被清除率最高，而载台对平板的切割良率也可以达到约99.8％以上。
图4a～4e为本公开一实施例提供的一种清除载台上异物的过程图。下面，如图4a～4e所示，以承载基底旋转的固定角度的数值可以为约20度、约45度、约85度或约95度为例，载台对异物的清除过程可以包括如下过程。
如图4a所示，此时驱动单元200还未驱动承载基底100旋转。例如，此时的载台已经完成对平板的切割并取走承载基底100上的子板，而被切割下的异物残留在承载基底100上。以此状态下的承载基底100处于水平位置为例，承载基底100的偏转角度为0度。
如图4b所示，驱动单元200驱动承载基底100顺时针旋转并旋转至相对水平位置的角度20度时停止，然后例如可以进行一次往复运动。示例性的，以承载基底100处于相对于水平位置20度的位置为初始位置，该往复运动的过程可以是如下过程的一种或者组合：承载基底100顺时针旋转一定角度然后再逆时针旋转并回复至初始位置；或者承载基底100逆时针旋转一定角度然后再顺时针旋转并回复至初始位置；或者承载基底100顺时针旋转一定角度然后再逆时针旋转并经过初始位置一定角度，然后再顺时针回复至初始位置；或者承载基底100逆时针旋转一定角度然后再顺时针旋转并经过初始位置一定角度，然后再逆时针回复至初始位置。该往复运动运动不限于一次，也可以为多次。示例性的，在该过程中，承载基底100的偏转角度较小，主要是为了能够使得清除承载基底100上的大块异物滑落。
驱动单元200不限于如图4a至图4b所示的驱动承载基底100顺时针旋转，也可以驱动承载基底100先做逆时针旋转。下面，以驱动单元200驱动承载基底100先做顺时针旋转为例，对本公开下述实施例中的切割方法的过程进行说明。
驱动单元200驱动承载基底100做往复运动的幅度过大可能会导致承载基底100上的构件例如载板300等的松动。例如，在本公开至少一个实施例中，承载基底100的逆时针和/或顺时针的往复运动的偏转角度可以不大于5度，在此角度范围内，既可以避免载板300等构件不会因为往复运动的幅度过大而松动，又可以使得承载基底100上的异物松动而更容易滑落。
如图4c所示，驱动单元200驱动承载基底100旋转并旋转至角度为45度时停止，然后例如可以进行一次往复运动。示例性的，在该过程中，45度的偏转角度及往复运动可以使得承载基底100上剩余的较大异物和/或部分较小异物滑落。
需要说明的是，在本公开的实施例中，例如可以省略如图4b所对应的操作过程，而可以在图4a所对应的操作过程结束后直接进行图4c所对应的操作过程，从而使得较大块或大块的异物一次性滑落。但是在此过程中，因承载基底100的偏转角度较大，例如质量较大的大块异物的滑落速度会较大，可能会划伤其经过的表面。示例性的，在例如承载基底100上 设置有盖板400的情况下，大块异物可能会对盖板400的表面造成划伤。
如图4d所示，驱动单元200驱动承载基底100旋转并旋转至固定角度85度时停止，然后例如可以进行一次往复运动。示例性的，在该过程中，85度的偏转角度及往复运动可以使得承载基底100上剩余的小块异物和/或部分碎屑型的异物滑落。
如图4e所示，驱动单元200驱动承载基底100旋转并旋转至固定角度95度时停止，然后例如可以进行一次往复运动。示例性的，当承载基底旋转至95度的固定角度后，承载基底100上异物所受的重力可以全部作用于异物的滑落(在此情况下为掉落)而不会受到例如摩擦力等阻力的影响，在此过程中，承载基底100上剩余的异物可以被清除干净。
本公开至少一个实施例提供一种用于切割工艺的载台及其切割方法、加工设备，并且可以具有以下至少一项有益效果：
(1)本公开至少一个实施例提供一种用于切割工艺的载台，该载台上设置的驱动单元可以驱动载台旋转以实现载台上的异物自动滑落，便于提升载台清除异物的清除率和自动化能力。
(2)在本公开至少一个实施例提供的一种用于切割工艺的载台中，载台中设置有传送带，可以实现待被切割平板在不同工序之间的自动传送，提高载台的自动循环能力和切割工艺产能。
对于本公开，还有以下几点需要说明：
(1)本发明实施例附图只涉及到与本发明实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本发明的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。
(3)在不冲突的情况下，本发明的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (13)

  1. 一种用于切割工艺的载台，包括：
    承载基底；
    设置于所述承载基底上的驱动单元，所述驱动单元配置为驱动所述承载基底绕位于所述承载基底的板面内的第一方向旋转以清除所述承载基底上的异物。
  2. 根据权利要求1所述的载台，还包括：
    设置于所述承载基底上的载板以及
    设置于所述承载基底上的传送带，
    其中，所述传送带设置为传送所述载板。
  3. 根据权利要求1或2所述的载台，其中，所述承载基底上设置有对所述载板限位的第一卡板。
  4. 根据权利要求2-3中任一所述的载台，还包括：
    设置于所述载板上的盖板，
    其中，所述盖板配置为支撑固定待被切割的平板。
  5. 根据权利要求4所述的载台，其中，所述载板上设置有限位所述盖板的第二卡板。
  6. 根据权利要求5所述的载台，其中，所述第二卡板的远离所述承载基底的表面与所述盖板的表面的夹角为钝角。
  7. 根据权利要求4-6中任一项所述的载台，其中，所述盖板上设置有多个开孔以提供真空吸附。
  8. 根据权利要求1-7中任一所述的载台，还包括：
    设置于所述承载基底至少一侧的回收单元，
    其中，所述回收单元配置为回收所述承载基底上的异物。
  9. 一种加工设备，包括权利要求1-8中任一所述的载台。
  10. 一种应用于权利要求1-8中任一所述的载台的切割方法，包括：
    在所述载台上放置待切割物体并对其进行切割操作；
    移除被切割后的物体；
    控制所述驱动单元带动所述承载基底旋转以清除所述承载基底上的异物。
  11. 根据权利要求10所述的切割方法，还包括：
    当所述承载基底旋转至至少一个固定角度后，以每个所述固定角度为基准做至少一次逆时针和/或顺时针的往复运动。
  12. 根据权利要求11所述的切割方法，其中，所述固定角度的数值包括20度、45度、85度或95度。
  13. 根据权利要求11-12中任一所述的切割方法，其中，所述承载基底的逆时针和/或顺时针的往复运动的偏转角度不大于5度。
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