WO2018149093A1 - Sound production device module and electronic product - Google Patents

Sound production device module and electronic product Download PDF

Info

Publication number
WO2018149093A1
WO2018149093A1 PCT/CN2017/094170 CN2017094170W WO2018149093A1 WO 2018149093 A1 WO2018149093 A1 WO 2018149093A1 CN 2017094170 W CN2017094170 W CN 2017094170W WO 2018149093 A1 WO2018149093 A1 WO 2018149093A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
module
sounding device
body portion
flexible circuit
Prior art date
Application number
PCT/CN2017/094170
Other languages
French (fr)
Chinese (zh)
Inventor
马宏达
谭飞
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201710086966.5A external-priority patent/CN107071661B/en
Priority claimed from CN201720330411.6U external-priority patent/CN206658293U/en
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2018149093A1 publication Critical patent/WO2018149093A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers

Definitions

  • the invention belongs to the technical field of electronic products, and in particular, the invention relates to a sounding device module and an electronic product.
  • the sounding device module is a component occupying a large space in an electronic product, and the sounding device module is generally in a flat rectangular structure.
  • Those skilled in the art attempt to reduce the space occupied by the sounding device module, for example, to reduce the width of the sounding device module, and to make the sounding device module tend to a strip structure.
  • an antenna is also provided on the sounding device module. In order to ensure the reliability of the antenna, the antenna is required to be as far as possible from the sounding device on the back of the sounding device module to avoid mutual interference. This design, in turn, requires the sounding device module to have a large volume so that the sounding device and the antenna can be separated from each other.
  • a sound emitting device module comprising: a sounding device a unit, a module housing and a flexible circuit board, wherein the sounding device is disposed in the module housing, and the body portion of the flexible circuit board is laid on an outer surface of the module housing.
  • the flexible circuit board has two single electrical connection regions extending from the body portion, and the two single electrical connection regions are configured to extend from the outer side of the module housing into the module housing, and The sounding device unit is electrically connected.
  • the outer surface of the module housing has a circuit board slot, and the body portion of the flexible circuit board is embedded in the circuit board slot.
  • the body portion of the flexible circuit board is adhesively fixed on an outer surface of the module housing.
  • the surface of the body portion of the flexible circuit board for bonding with the module housing is covered with a backing layer.
  • the module housing has a sidewall, and a body portion of the flexible circuit board is laid on the sidewall.
  • a first sound outlet is defined in a sidewall of the module housing, and the sounding device is disposed on a side of the module housing that is away from the first sound outlet.
  • the body portion of the flexible circuit board is laid on the outside of the side wall of the module housing away from the side of the first sound outlet.
  • the module housing includes a lower cover and an upper cover, the upper cover is configured to be fastened to the lower case, and the body portion of the flexible circuit board is laid on an outer surface of the lower case And a notch for avoiding the two electrical connection regions of the plurality of cells is disposed on the upper end surface of the sidewall of the lower casing, and the upper cover is correspondingly provided with a protrusion for blocking the notch.
  • an area of the outer surface of the module housing from the first sound outlet to the sounding device unit is an antenna clearance area, and an antenna is disposed in the antenna clearance area.
  • the invention also provides an electronic product comprising a product body and the sounding device module, wherein the product body has a sounder slot, and the sounding device module is disposed in the sounder slot.
  • the invention also provides an electronic product comprising a product body and the sounding device module, wherein the product body has a sounder slot, and the sounding device module is disposed in the sounder slot in;
  • a second sound outlet is disposed on a sidewall of the product body, a first sound outlet of the sounding device module is in communication with the second sound outlet, and the second body of the electronic product is
  • the area between the sound outlet to the sounding device unit is an antenna clearance area, and an antenna is disposed in the antenna clearance area.
  • the inventors of the present invention have found that in the prior art, the circuit traces of the sounding device module are basically disposed inside the module. These traces take up a large portion of the module's space.
  • those skilled in the art in designing a solution for reducing the volume of the sounding device module, start from the idea of how to modify the module housing structure and reduce the volume of the internal device. No consideration has been given to moving unnecessary internal components to the outside of the module, especially circuit traces. Therefore, the technical task to be achieved by the present invention has never been or is not expected by those skilled in the art, so the present invention is a new technical solution.
  • FIG. 1 is a schematic view showing the disassembly of a sound emitting device module provided by the present invention
  • FIG. 2 is a schematic diagram of plugging in a module housing of the sounding device module provided by the present invention
  • FIG. 3 is a side cross-sectional structural view of the sound emitting device module provided by the present invention.
  • Figure 4 is a partial enlarged view of Figure 3;
  • FIG. 5 is a schematic exploded view of a speaker module according to another embodiment of the present application.
  • Figure 6 is a combination view of the speaker module provided in Figure 5 - the first housing is not combined;
  • Figure 7 is a combination diagram of Figure 6;
  • Figure 8 is a cross-sectional view taken along line A-A of Figure 7;
  • Fig. 9 is a enlarged view of a portion B of Fig. 8;
  • the invention provides a sounding device module, which comprises at least a sounding device unit 1, a module housing and a flexible circuit board 3, as shown in FIG.
  • the module housing is configured to carry the sounding device unit 1 and the flexible circuit board 3, and the sounding device unit 1 is disposed inside the module housing, as shown in FIG. 2 .
  • the flexible circuit board 3 includes two regions of a single electrical connection region 31 and a body portion 32.
  • the body portion 32 of the flexible circuit board 3 is laid on the outer surface of the module housing as shown in FIG.
  • Two of the unit electrical connection regions 31 extend from the body portion 32 for electrically connecting to the sounding device unit 1, and the unit electrical connection region 31 can be external to the module housing.
  • the surface extends into the interior of the module housing to contact the pads or electrical connection points on the sounding device unit 1.
  • the module housing may be provided with corresponding holes for the unit electrical connection area 31 to extend from the outside of the housing to the inside of the housing to achieve electrical connection with the sounding device unit 1.
  • the circuit traces occupy the space inside the module housing.
  • the circuit board itself has a certain width, Moreover, a certain gap is required between the circuit board and the sounding device unit. This will increase the overall width of the module housing. If the body portion of the flexible circuit board is disposed on the outer surface of the module housing, the space may not be reserved in the module housing. The space saved can be reserved as an assembly space for other components, or the width of the module housing can be reduced to reduce the space occupied by the sounding device module as a whole.
  • the technical solution of the present invention is different from the conventional design ideas of the prior art, and adopts technical features that are not easily adopted by those skilled in the art. Moreover, the production process of the sounding device module provided by the present invention does not increase in difficulty, and is convenient for actual production.
  • the outer surface of the module housing may have a circuit board slot 21.
  • the circuit board slot 21 is for receiving the body portion 32 of the flexible circuit board 3, and the body portion 32 is embedded in the circuit board slot 21.
  • the circuit board slot 21 can function to position and fix the body portion 32.
  • the body portion 32 of the flexible circuit board 3 is prevented from being displaced, deformed, or worn.
  • the body portion 32 on the outer side of the module housing has a strip shape, and accordingly, the circuit board slot 21 also has a matching shape.
  • the body portion of the flexible circuit board may also be a rectangular sheet or other shape.
  • the board slot is preferably configured to match the shape of the flexible circuit board.
  • the flexible circuit board 3 can be fixed on the outer surface of the module housing in different manners, such as bonding, snapping, etc., which is not limited by the present invention.
  • the flexible circuit board 3 may be attached to the outer surface of the module housing by adhesive bonding.
  • the side surface of the body portion 32 for bonding with the module housing may be covered with a backing layer 4. The body portion 32 is adhered to the module housing by the adhesive layer 4.
  • the present invention does not limit the specific location of the flexible circuit board on the module housing, and may be selectively designed according to the performance and shape requirements of the specific product.
  • the flexible circuit board can be laid on the top or bottom surface of the module housing.
  • the module housing has a flat rectangular structure as a whole, and the module housing has a side wall.
  • the body portion 32 of the flexible circuit board 3 may be laid on the side wall.
  • the above-mentioned circuit board slots 21 are also correspondingly disposed on the side walls. Setting the flexible circuit board 3
  • the space occupied by the body portion 32 can be more effectively reduced on the side wall of the module housing, and conditions for reducing the volume of the sounding device module are provided.
  • a larger surface such as a top surface or a bottom surface of the module housing can be used to provide other components.
  • a first sound outlet 28 may be formed on a sidewall of the module housing.
  • the first sound outlet 28 is configured to enable sound generated by the sounding device unit 1 to be transmitted from the first sound outlet 28.
  • the first sound outlet 28 is disposed at the side wall position of the module housing, and can meet the special requirements of the electronic product for the performance and structure of the sounding device module.
  • the sounding device unit 1 can be disposed inside the side wall of the module housing away from the first sound outlet 28, as shown in FIG. 2 and FIG. Shown.
  • the body portion 32 is preferably laid on a side wall of the module housing on a side away from the first sound outlet 28, as shown in FIG.
  • the module housing may include a lower shell 29 and an upper cover 23, and the upper cover 23 is fastened to the lower shell 29 to form a complete module housing.
  • the flexible circuit board 3 may be laid on the outer surface of the lower case 29.
  • the upper end surface of the side wall of the lower case 29 may be provided with a notch for escaping the two electrical connection regions 31.
  • the unit electrical connection region 31 is configured to extend from the notch into the interior of the module housing.
  • the upper cover 23 can be correspondingly provided with a protrusion for blocking the notch.
  • This structural design provides a convenient assembly of the flexible circuit board 3, and there is no need to open a through hole for the single electrical connection region 31 to pass through the module housing.
  • the flexible circuit board 3 may further have an external electrical connection region 33 configured to be electrically connected to an external electronic device.
  • the sounding device module will eventually be assembled in the mobile phone, and the external electrical connection area 33 is used for electrical connection with the electrical connection point on the main body of the mobile phone. Thereby, the electrical signal on the main body of the mobile phone can be transmitted into the sounding device unit to realize sound generation.
  • the area between the first sound outlet 28 and the sounding device unit 1 on the outer surface of the module housing is the antenna clearance.
  • an antenna may be disposed in the clearance area.
  • the distribution position of the antenna needs to be separated from the sounding device unit, and the above-mentioned antenna clearance area can meet such mutually separated performance requirements.
  • the flexible circuit board Due to the flexible circuit board The body portion is disposed on the outer surface of the module housing, so that a part of the space is saved inside the module housing.
  • the assembly position of the sounding device unit can be moved to the saved space, thereby avoiding more space on the other side for setting the antenna. Therefore, the antenna can be disposed at a position where the first sound outlet is located.
  • the assembly position of the sounding device unit is offset to the side away from the sound outlet port, thereby better achieving the avoidance effect of the antenna and the single body.
  • the invention also provides an electronic product, which can be a mobile phone, a tablet computer or the like.
  • the electronic product includes a product body and the above sound emitting device module.
  • the product body may have a sounder slot, and the sounding device module is disposed in the sounder slot.
  • an electrical connection point on the electronic product can be disposed in the sounder slot, and when the sounding device module is assembled into the sounder slot, the two can directly form an electrical connection. Simplify the steps of assembly and electrical connection.
  • the invention also provides an electronic product, which also comprises a product body and a sounding device module, and the sounding device module is arranged in the sounder slot of the product body.
  • the first sound outlet is disposed on the sounding device module used in the electronic product.
  • a second sound outlet is further disposed on a sidewall of the product body.
  • the first sound outlet of the sounding device module is in communication with the second sound outlet.
  • the entire area of the main body of the electronic product from the second sound outlet to the sounding device unit may be an antenna clearance area. In the antenna clearance area, an antenna may be provided.
  • a speaker module includes a casing, and the casing is composed of a first casing 10 and a second casing 20 which are combined together, and the first casing 10 and the second casing
  • the speaker unit 30 is housed in a space surrounded by the body 20.
  • the speaker unit 30 divides the entire module cavity into two chambers, the front sound chamber 60 and the rear sound chamber 62.
  • the front sound chamber 60 is formed between the speaker unit 30 and the second housing 20, and the front sound chamber 60 is disposed in the second shell.
  • the sound hole 22 on the side wall of the body 20 communicates with the outside to radiate sound emitted from the speaker unit 30; the rear sound chamber 62 is formed between the speaker unit 30, the first housing 10 and the second housing 20.
  • the speaker module also includes a flexible circuit board 40 for electrically connecting the speaker unit 30 to an external circuit.
  • the flexible circuit board 40 includes a first body portion 46 and a second body portion 48 that are connected, and the first body portion 46 and the second body portion 48 are both strip-shaped structures. And the extension direction is the same. Both ends of the first main body portion 46 are bent and extended toward the same side and are provided with a pad portion 42. The two pad portions 42 are oppositely extended and electrically connected to the two pads of the speaker unit 30, respectively. One of the pad portions 42 is connected to the second body portion 48, and the extending direction is the same as the extending direction of the first body portion 46, and the second body portion 48 is disposed at the pad portion 42 away from the other pad portion 42.
  • the end of the second body portion 48 is provided with an outer connecting portion 44, and the outer connecting portion 44 is electrically connected to an external circuit.
  • the second main body portion 48 can also be directly connected to the first main body portion 46.
  • the second main body portion 48 and the one pad portion 42 are connected to each other, and the structure is simpler and the space is smaller. The preferred solution.
  • the first main body portion 46 is laid on the outer surface of the outer casing.
  • the first main body portion 46 is laid on the outer surface of one side wall of the second casing 20.
  • At least one of the two land portions 42 extends across the end of the side wall into the outer casing and is electrically connected to the speaker unit 30. In the present embodiment, it is preferred that both of the land portions 42 straddle the side wall.
  • the end portion extends into the outer casing and is electrically connected to the speaker unit 30.
  • the end portion of the side wall is respectively provided with a avoidance notch 28 corresponding to the portion of the two pad portions 42 extending into the outer casing.
  • the two pad portions 42 respectively from the two avoidance notches 28
  • the portion extends into the outer casing, and after the first casing 10 and the second casing 20 are combined, the rubber seal can be applied at the two avoidance notches 28.
  • the side wall on which the first main body portion 46 is laid is disposed opposite to the side wall on which the sound hole 22 is provided, and the first body portion 46 is laid on the side wall of the second casing 20 away from the sound hole 22.
  • the speaker unit 30 is disposed on the inner side of the side wall of the first body portion 46, that is, the speaker unit 30 is disposed on the inner side of the side wall of the second casing 20 away from the sound hole 22.
  • the second body portion 48 is laid inside the outer casing, and the outer connecting portion 44 passes out of the outer casing at the outer side of the outer casing. Between the speaker unit 30 and the side wall provided with the sound hole 22 is an antenna clearance area.
  • the sidewall of the second housing 20 corresponding to the first main body portion 46 is provided with a receiving groove 24 , and the first main body portion 46 is adhesively laid on the receiving groove through the adhesive layer 50 .
  • the shape and size of the accommodating groove 24 are adapted to the shape and size of the first main body portion 46, and the depth of the accommodating groove 24 is greater than or equal to that of the first main body portion 46 after the adhesive layer 50 is superposed.
  • the thickness of the first main body portion 46 does not protrude from the outer surface of the side wall of the second housing 20 after the first main body portion 46 is adhesively fixed into the accommodating groove 24.
  • the glue layer 50 may be glued, double-sided tape or back glue.
  • the glue layer 50 is preferably a backing glue disposed on the first body portion 46. It is more convenient and will not overflow.
  • a heat-melting column 26 is disposed at the bottom of the accommodating groove 24 .
  • two hot-melt columns 26 are disposed at two ends of the accommodating groove 24 , respectively.
  • a hot melt hole 49 is disposed in each of the positions of the first body portion 46 corresponding to the two heat-melting columns 26, and a relief hole 52 is disposed at a position corresponding to the heat-melting hole 49 on the glue layer 50.
  • the heat-melting column 26 passes through the escape hole 52 and the hot-melt hole 49, and a portion of the heat-melting column 26 exposed to the first body portion 46 is melted by a hot-melt process to form a small cap structure, and the first body portion 46 is stuck.
  • the accommodating groove 24 it is possible to avoid the defect that the first main body portion 46 is lifted due to failure of the adhesive layer 50 or poor adhesion.
  • the position of the first housing 10 corresponding to the speaker unit 30 is provided with a mounting hole 12, and the shape and size of the mounting hole 12 are matched with the bottom of the speaker unit 30.
  • the bottom of the speaker unit 30 (the basin of the magnetic circuit system) is located in the mounting hole 12, and the surface of the bottom of the speaker unit 30 is flush with the outer surface of the first housing 10 at which the mounting hole 12 is provided. Flat, can reduce the thickness of the speaker module.
  • the utility model adopts the internal and external FPCB routing mode, which saves the inner space of the speaker module, and satisfies the requirement of the speaker module width while avoiding interference between the speaker unit and the antenna clearance area, thereby ensuring the performance of the product, and also It satisfies the requirements of the structure and overall layout of the portable electronic device; and improves the intermediate frequency performance of the speaker module and improves the assembly efficiency.
  • An E1 a speaker module, comprising: a housing and a speaker unit housed in the housing, further comprising a flexible circuit board, wherein the flexible circuit board comprises a main body portion and an extension body extending from the main body portion Two pad portions electrically connected to the speaker unit, the body portion including an associated first body portion and a second body portion, the first body portion being laid on an outer surface of the outer casing, a second main body portion is laid inside the outer casing, and an end portion of the second main body portion is connected with an outer connecting portion electrically connected to an external circuit, the outer connecting portion is located outside the outer casing; the speaker unit It is disposed inside the portion of the outer casing that is away from the sound hole.
  • the speaker module according to E1 wherein the outer surface of the outer casing is provided with a recessed receiving groove, and the first main body portion is laid in the receiving groove.
  • the speaker module according to E2 wherein the bottom of the accommodating groove is provided with a heat-melting column, and the first body portion is provided with a hot-melt hole matched with the heat-melting column.
  • the speaker module according to E1 characterized in that at least one of the two pad portions is electrically connected to the speaker unit by the first body portion extending into the casing.
  • the speaker module according to any one of the examples of E1 to E6, wherein the sound emitting hole is defined in a sidewall of the outer casing, and the speaker unit is disposed away from the outer casing of the outer casing.
  • the inside of the side wall of one side of the sound hole, the first body portion is laid outside the side wall of the side of the outer casing away from the sound hole.
  • E9 The speaker module according to E8, wherein the outer casing comprises a first housing and a second housing joined together, the first main body portion being laid on one side of the second housing On the side wall, the end of the side wall is provided with a avoidance notch for the flexible circuit board to pass through.
  • the speaker module according to E9 wherein the first housing has a mounting hole at a position corresponding to the speaker unit, and a bottom of the speaker unit is located in the mounting hole.
  • the technical solution of the present invention is exemplified by taking the speaker module of the above structure as an example.
  • the technical solution of the present invention is not limited to the speaker module of the above structure, and can be applied to any one of the following.
  • the speaker module of the structure is especially suitable for a small-volume, complex-shaped speaker module, and those skilled in the art can apply the technical solution of the present invention to the invention according to the above embodiments without any creative labor.
  • any product that uses the FPCB routing method with internal and external bonding falls within the protection range of the present invention.

Abstract

Disclosed are a sound production device module and an electronic product. The sound production device module comprises a single sound production device, a module shell and a flexible circuit board; the single sound production device is provided in the module shell, the body part of the flexible circuit board is laid on the outer surface of the module shell, the flexible circuit board is provided with two single electric connection areas extending from the body part, and the two single electric connection areas are configured to stretch into the module shell from the outer side of the module shell so as to be electrically connected with the single sound production device. The present invention has a technical effect of saving the space of the sound production device module.

Description

发声装置模组和电子产品Sound device module and electronic products 技术领域Technical field
本发明属于电子产品技术领域,具体地,本发明涉及一种发声装置模组和电子产品。The invention belongs to the technical field of electronic products, and in particular, the invention relates to a sounding device module and an electronic product.
背景技术Background technique
近年来消费类电子产品的相关技术飞速发展,电子产品的性能显著提高,更新换代速度加快。消费者也对电子产品的性能要求越来越高。在现有技术中,例如手机、平板电脑等产品设备的发展趋势包括轻薄化、大电量等。在这种发展趋势下,需要限制产品设备整体的体积、厚度,但是,又需要为产品设备配置更大的电池。这种设计要求就造成了产品设备中的其它部件所配置的空间缩小。需要减小设备中各部件的体积。In recent years, the related technologies of consumer electronic products have developed rapidly, the performance of electronic products has been significantly improved, and the speed of updating has been accelerated. Consumers are also increasingly demanding the performance of electronic products. In the prior art, development trends of product devices such as mobile phones and tablet computers include thin and light, large power, and the like. Under this development trend, it is necessary to limit the overall volume and thickness of the product equipment, but it is also necessary to configure a larger battery for the product equipment. This design requirement results in a reduction in the space configured for other components in the product equipment. It is desirable to reduce the volume of the various components in the device.
发声装置模组是电子产品中占据空间较大的部件,发声装置模组通常呈扁平的类长方形结构。本领域技术人员尝试减小发声装置模组占据的空间,例如,减小发声装置模组的宽度,使发声装置模组趋向于条形结构。但是,在一些现有的设计中,发声装置模组上还设置有天线。为了保证天线的可靠性,要求天线尽可能的远离发声装置模组背部的发声器件,避免相互干扰。这种设计反而要求发声装置模组需要具有较大的体积,以使发声器件与天线能够相互隔开。The sounding device module is a component occupying a large space in an electronic product, and the sounding device module is generally in a flat rectangular structure. Those skilled in the art attempt to reduce the space occupied by the sounding device module, for example, to reduce the width of the sounding device module, and to make the sounding device module tend to a strip structure. However, in some existing designs, an antenna is also provided on the sounding device module. In order to ensure the reliability of the antenna, the antenna is required to be as far as possible from the sounding device on the back of the sounding device module to avoid mutual interference. This design, in turn, requires the sounding device module to have a large volume so that the sounding device and the antenna can be separated from each other.
所以,有必要对发声装置模组的结构进行改进,在保证发声装置模组的性能的情况下,节省发声装置模组的空间或缩小体积。Therefore, it is necessary to improve the structure of the sounding device module, and save the space or reduce the volume of the sounding device module while ensuring the performance of the sounding device module.
发明内容Summary of the invention
本发明的一个目的是提供一种发声装置模组的新技术方案。It is an object of the present invention to provide a new technical solution for a sounding device module.
根据本发明的第一方面,提供了一种发声装置模组,包括:发声装 置单体、模组壳体和柔性电路板,所述发声装置单体设置在所述模组壳体内,所述柔性电路板的本体部铺设在所述模组壳体的外表面上,所述柔性电路板具有从所述本体部上延伸出的两支单体电连接区,两支所述单体电连接区配置为从所述模组壳体的外侧伸入模组壳体内,与所述发声装置单体实现电连接。According to a first aspect of the present invention, a sound emitting device module is provided, comprising: a sounding device a unit, a module housing and a flexible circuit board, wherein the sounding device is disposed in the module housing, and the body portion of the flexible circuit board is laid on an outer surface of the module housing. The flexible circuit board has two single electrical connection regions extending from the body portion, and the two single electrical connection regions are configured to extend from the outer side of the module housing into the module housing, and The sounding device unit is electrically connected.
可选地,所述模组壳体的外表面上具有电路板槽,所述柔性电路板的本体部嵌于所述电路板槽中。Optionally, the outer surface of the module housing has a circuit board slot, and the body portion of the flexible circuit board is embedded in the circuit board slot.
可选地,所述柔性电路板的本体部粘接固定在所述模组壳体的外表面上。Optionally, the body portion of the flexible circuit board is adhesively fixed on an outer surface of the module housing.
可选地,所述柔性电路板的本体部用于与模组壳体粘接的表面上覆有背胶层。Optionally, the surface of the body portion of the flexible circuit board for bonding with the module housing is covered with a backing layer.
可选地,所述模组壳体具有侧壁,所述柔性电路板的本体部铺设在所述侧壁上。Optionally, the module housing has a sidewall, and a body portion of the flexible circuit board is laid on the sidewall.
可选地,所述模组壳体的侧壁上开设有第一出声口,所述发声装置单体靠设在所述模组壳体的远离所述第一出声口的一侧的侧壁内侧,所述柔性电路板的本体部铺设在模组壳体上远离所述第一出声口的一侧的侧壁外侧。Optionally, a first sound outlet is defined in a sidewall of the module housing, and the sounding device is disposed on a side of the module housing that is away from the first sound outlet. Inside the side wall, the body portion of the flexible circuit board is laid on the outside of the side wall of the module housing away from the side of the first sound outlet.
可选地,所述模组壳体包括下壳和上盖,所述上盖配置为能扣合在所述下壳上,所述柔性电路板的本体部铺设在所述下壳的外表面上,且所述下壳的侧壁的上端面上开设有用于避让两支所述单体电连接区的缺口,所述上盖上对应设置有封堵所述缺口的凸起。Optionally, the module housing includes a lower cover and an upper cover, the upper cover is configured to be fastened to the lower case, and the body portion of the flexible circuit board is laid on an outer surface of the lower case And a notch for avoiding the two electrical connection regions of the plurality of cells is disposed on the upper end surface of the sidewall of the lower casing, and the upper cover is correspondingly provided with a protrusion for blocking the notch.
可选地,所述模组外壳的外表面由第一出声口至发声装置单体之间的区域为天线净空区,所述天线净空区内设置有天线。Optionally, an area of the outer surface of the module housing from the first sound outlet to the sounding device unit is an antenna clearance area, and an antenna is disposed in the antenna clearance area.
本发明还提供了一种电子产品,包括产品主体和上述发声装置模组,所述产品主体上具有发声器槽,所述发声装置模组设置在所述发声器槽中。The invention also provides an electronic product comprising a product body and the sounding device module, wherein the product body has a sounder slot, and the sounding device module is disposed in the sounder slot.
本发明还提供了一种电子产品,包括产品主体和上述发声装置模组,所述产品主体上具有发声器槽,所述发声装置模组设置在所述发声器槽 中;The invention also provides an electronic product comprising a product body and the sounding device module, wherein the product body has a sounder slot, and the sounding device module is disposed in the sounder slot in;
在所述产品主体的侧壁上设有第二出声口,所述发声装置模组的第一出声口与所述第二出声口连通,所述电子产品主体的由所述第二出声口至所述发声装置单体之间的区域为天线净空区,在所述天线净空区内设置有天线。a second sound outlet is disposed on a sidewall of the product body, a first sound outlet of the sounding device module is in communication with the second sound outlet, and the second body of the electronic product is The area between the sound outlet to the sounding device unit is an antenna clearance area, and an antenna is disposed in the antenna clearance area.
本发明的发明人发现,在现有技术中,发声装置模组的电路走线基本是设置在模组内部。这些走线会占据很大一部分模组的空间。而本领域技术人员在设计缩小发声装置模组体积的方案时,是从如何改造模组壳体结构、缩小内部器件的体积等思路出发的。完全没有考虑过将不必要的内部部件移到模组外侧设置,尤其是电路走线。因此,本发明所要实现的技术任务是本领域技术人员从未想到的或者没有预期到的,故本发明是一种新的技术方案。The inventors of the present invention have found that in the prior art, the circuit traces of the sounding device module are basically disposed inside the module. These traces take up a large portion of the module's space. However, those skilled in the art, in designing a solution for reducing the volume of the sounding device module, start from the idea of how to modify the module housing structure and reduce the volume of the internal device. No consideration has been given to moving unnecessary internal components to the outside of the module, especially circuit traces. Therefore, the technical task to be achieved by the present invention has never been or is not expected by those skilled in the art, so the present invention is a new technical solution.
通过以下参照附图对本发明的示例性实施例的详细描述,本发明的其它特征及其优点将会变得清楚。Other features and advantages of the present invention will become apparent from the Detailed Description of the <RTIgt;
附图说明DRAWINGS
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例,并且连同其说明一起用于解释本发明的原理。The accompanying drawings, which are incorporated in FIG
图1是本发明提供的发声装置模组的零件拆解示意图;1 is a schematic view showing the disassembly of a sound emitting device module provided by the present invention;
图2是本发明提供的发声装置模组的模组壳体插接示意图;2 is a schematic diagram of plugging in a module housing of the sounding device module provided by the present invention;
图3是本发明提供的发声装置模组的侧面剖切结构示意图;3 is a side cross-sectional structural view of the sound emitting device module provided by the present invention;
图4是图3的局部放大图;Figure 4 is a partial enlarged view of Figure 3;
图5是本申请另一实施例提供的扬声器模组的分解结构示意图;FIG. 5 is a schematic exploded view of a speaker module according to another embodiment of the present application; FIG.
图6是图5提供的扬声器模组的组合图-第一壳体未组合;Figure 6 is a combination view of the speaker module provided in Figure 5 - the first housing is not combined;
图7是图6的组合图;Figure 7 is a combination diagram of Figure 6;
图8是图7的A-A线剖视图;Figure 8 is a cross-sectional view taken along line A-A of Figure 7;
图9是图8的B部发大图。 Fig. 9 is a enlarged view of a portion B of Fig. 8;
具体实施方式detailed description
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。Various exemplary embodiments of the present invention will now be described in detail with reference to the drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions and numerical values set forth in the embodiments are not intended to limit the scope of the invention unless otherwise specified.
以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本发明及其应用或使用的任何限制。The following description of the at least one exemplary embodiment is merely illustrative and is in no way
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论,但在适当情况下,所述技术、方法和设备应当被视为说明书的一部分。Techniques, methods and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but the techniques, methods and apparatus should be considered as part of the specification, where appropriate.
在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。In all of the examples shown and discussed herein, any specific values are to be construed as illustrative only and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。It should be noted that similar reference numerals and letters indicate similar items in the following figures, and therefore, once an item is defined in one figure, it is not required to be further discussed in the subsequent figures.
本发明提供了一种发声装置模组,其中至少包括发声装置单体1、模组壳体和柔性电路板3,如图1所示。所述模组壳体配置为用于承载发声装置单体1和柔性电路板3,所述发声装置单体1设置在所述模组壳体内部,如图2所示。The invention provides a sounding device module, which comprises at least a sounding device unit 1, a module housing and a flexible circuit board 3, as shown in FIG. The module housing is configured to carry the sounding device unit 1 and the flexible circuit board 3, and the sounding device unit 1 is disposed inside the module housing, as shown in FIG. 2 .
所述柔性电路板3包括单体电连接区31和本体部32两种区域。特别地,所述柔性电路板3的本体部32铺设在所述模组壳体的外表面上,如图2所示。两支所述单体电连接区31从所述本体部32上延伸出来,其用于与所述发声装置单体1进行电连接,单体电连接区31可以从模组的壳体的外表面伸入到模组壳体内部,从而接触到发声装置单体1上的焊盘或电连接点。所述模组壳体上可以配置有相应的孔道,以供单体电连接区31从壳体外侧延伸到壳体内侧,实现与发声装置单体1的电连接。The flexible circuit board 3 includes two regions of a single electrical connection region 31 and a body portion 32. In particular, the body portion 32 of the flexible circuit board 3 is laid on the outer surface of the module housing as shown in FIG. Two of the unit electrical connection regions 31 extend from the body portion 32 for electrically connecting to the sounding device unit 1, and the unit electrical connection region 31 can be external to the module housing. The surface extends into the interior of the module housing to contact the pads or electrical connection points on the sounding device unit 1. The module housing may be provided with corresponding holes for the unit electrical connection area 31 to extend from the outside of the housing to the inside of the housing to achieve electrical connection with the sounding device unit 1.
在传统的发声装置模组的设计中,电路走线会占据模组壳体内部的空间。例如,在发声装置模组的宽度方向上,线路板自身具有一定宽度, 而且线路板与发声装置单体之间需要有一定间隙。这样,就会增大模组壳体的整体宽度。而如果将柔性电路板的本体部设置在模组壳体的外表面上,则可以不用在模组壳体内预留上述空间。节省的空间可以保留作为其它部件的装配空间,或者,可以减小模组壳体的宽度,减小发声装置模组整体占据的空间。In the design of a conventional sounding device module, the circuit traces occupy the space inside the module housing. For example, in the width direction of the sounding device module, the circuit board itself has a certain width, Moreover, a certain gap is required between the circuit board and the sounding device unit. This will increase the overall width of the module housing. If the body portion of the flexible circuit board is disposed on the outer surface of the module housing, the space may not be reserved in the module housing. The space saved can be reserved as an assembly space for other components, or the width of the module housing can be reduced to reduce the space occupied by the sounding device module as a whole.
本发明的技术方案区别于现有技术的常规设计思路,采用了本领域技术人员不易采用的技术特征。而且,本发明提供的发声装置模组的生产工艺难度不会增加,便于实际生产。The technical solution of the present invention is different from the conventional design ideas of the prior art, and adopts technical features that are not easily adopted by those skilled in the art. Moreover, the production process of the sounding device module provided by the present invention does not increase in difficulty, and is convenient for actual production.
优选地,如图3、4所示,所述模组壳体的外表面上可以具有电路板槽21。所述电路板槽21用于容纳所述柔性电路板3的本体部32,所述本体部32嵌于所述电路板槽21中。电路板槽21能够对所述本体部32起到定位、固定的作用。防止柔性电路板3的本体部32错位、变形或者受到磨损。在图1-3所示的实施方式中,模组壳体外侧的本体部32呈条状,相应地,所述电路板槽21也为相匹配的形状。在其它实施方式中,所述柔性电路板的本体部也可以是矩形片状或其它形状。所述电路板槽优选配置为与柔性电路板的形状相匹配。Preferably, as shown in FIGS. 3 and 4, the outer surface of the module housing may have a circuit board slot 21. The circuit board slot 21 is for receiving the body portion 32 of the flexible circuit board 3, and the body portion 32 is embedded in the circuit board slot 21. The circuit board slot 21 can function to position and fix the body portion 32. The body portion 32 of the flexible circuit board 3 is prevented from being displaced, deformed, or worn. In the embodiment shown in FIGS. 1-3, the body portion 32 on the outer side of the module housing has a strip shape, and accordingly, the circuit board slot 21 also has a matching shape. In other embodiments, the body portion of the flexible circuit board may also be a rectangular sheet or other shape. The board slot is preferably configured to match the shape of the flexible circuit board.
在本发明不同的实施方式中,可以采用不同的方式将柔性电路板3固定在模组壳体的外表面上,例如粘接、卡接等,本发明不对此进行限制。可选地,如图3、4所示,柔性电路板3可以通过粘接固定的方式连接在所述模组壳体的外表面上。优选地,所述本体部32的用于与模组壳体粘接的一侧表面上可以覆有背胶层4。通过背胶层4将本体部32与模组壳体粘连。In the different embodiments of the present invention, the flexible circuit board 3 can be fixed on the outer surface of the module housing in different manners, such as bonding, snapping, etc., which is not limited by the present invention. Alternatively, as shown in FIGS. 3 and 4, the flexible circuit board 3 may be attached to the outer surface of the module housing by adhesive bonding. Preferably, the side surface of the body portion 32 for bonding with the module housing may be covered with a backing layer 4. The body portion 32 is adhered to the module housing by the adhesive layer 4.
可选地,本发明并不限制所述柔性电路板铺设在模组壳体上的具体位置,可以根据具体产品的性能、形状要求,进行选择设计。例如,可以将柔性电路板铺设在模组壳体的顶面或底面上。Optionally, the present invention does not limit the specific location of the flexible circuit board on the module housing, and may be selectively designed according to the performance and shape requirements of the specific product. For example, the flexible circuit board can be laid on the top or bottom surface of the module housing.
如图2-4所示,所述模组壳体整体呈扁平的长方体结构,模组壳体具有侧壁。优选地,所述柔性电路板3的本体部32可以铺设在所述侧壁上。上述电路板槽21也相应的设置在所述侧壁上。将柔性电路板3设置 在模组壳体的侧壁上能够更有效的降低本体部32占据的空间,为减小发声装置模组的体积提供条件。并且,模组壳体的顶面、底面等较大的表面可以用于设置其它部件。As shown in FIG. 2-4, the module housing has a flat rectangular structure as a whole, and the module housing has a side wall. Preferably, the body portion 32 of the flexible circuit board 3 may be laid on the side wall. The above-mentioned circuit board slots 21 are also correspondingly disposed on the side walls. Setting the flexible circuit board 3 The space occupied by the body portion 32 can be more effectively reduced on the side wall of the module housing, and conditions for reducing the volume of the sounding device module are provided. Moreover, a larger surface such as a top surface or a bottom surface of the module housing can be used to provide other components.
如图3所示,所述模组壳体的侧壁上可以开设有第一出声口28。所述第一出声口28配置为能使发声装置单体1产生的声音从第一出声口28传出。将第一出声口28设置在模组壳体的侧壁位置,能够适应电子产品对发声装置模组的性能和结构的特殊要求。特别地,在这种实施方式中,所述发声装置单体1可以靠设在所述模组壳体的远离所述第一出声口28的一侧的侧壁内侧,如图2、3所示。所述本体部32优选铺设在模组壳体上远离所述第一出声口28的一侧的侧壁上,如图3所示。As shown in FIG. 3, a first sound outlet 28 may be formed on a sidewall of the module housing. The first sound outlet 28 is configured to enable sound generated by the sounding device unit 1 to be transmitted from the first sound outlet 28. The first sound outlet 28 is disposed at the side wall position of the module housing, and can meet the special requirements of the electronic product for the performance and structure of the sounding device module. In particular, in this embodiment, the sounding device unit 1 can be disposed inside the side wall of the module housing away from the first sound outlet 28, as shown in FIG. 2 and FIG. Shown. The body portion 32 is preferably laid on a side wall of the module housing on a side away from the first sound outlet 28, as shown in FIG.
可选地,如图1、2所示,所述模组壳体可以包括下壳29和上盖23,所述上盖23扣合在所述下壳29上,构成完整的模组壳体。所述柔性电路板3可以铺设在下壳29的外表面上。特别地,所述下壳29的侧壁的上端面上可以开设有用于避让两支所述单体电连接区31的缺口。所述单体电连接区31配置为从所述缺口处伸入到模组壳体内部。当上盖23扣合在下壳29上时,能够将单体电连接区31封住。相应地,所述上盖23上可以对应设有封堵所述缺口的凸起。这种结构设计为柔性电路板3的装配提供了便捷,也无需在模组壳体上开设供单体电连接区31穿过的穿孔。Optionally, as shown in FIG. 1 and FIG. 2, the module housing may include a lower shell 29 and an upper cover 23, and the upper cover 23 is fastened to the lower shell 29 to form a complete module housing. . The flexible circuit board 3 may be laid on the outer surface of the lower case 29. In particular, the upper end surface of the side wall of the lower case 29 may be provided with a notch for escaping the two electrical connection regions 31. The unit electrical connection region 31 is configured to extend from the notch into the interior of the module housing. When the upper cover 23 is fastened to the lower case 29, the unit electrical connection region 31 can be sealed. Correspondingly, the upper cover 23 can be correspondingly provided with a protrusion for blocking the notch. This structural design provides a convenient assembly of the flexible circuit board 3, and there is no need to open a through hole for the single electrical connection region 31 to pass through the module housing.
可选地,如图1、2所示,所述柔性电路板3还可以具有外接电连接区33,所述外接电连接区33配置为用于与外界电子设备进行电连接。例如,所述发声装置模组最终会装配在手机中,则外接电连接区33用于与手机主体上的电连接点进行电连接。从而使手机主体上的电信号能够传入发声装置单体中,实现发声。Optionally, as shown in FIG. 1 and FIG. 2, the flexible circuit board 3 may further have an external electrical connection region 33 configured to be electrically connected to an external electronic device. For example, the sounding device module will eventually be assembled in the mobile phone, and the external electrical connection area 33 is used for electrical connection with the electrical connection point on the main body of the mobile phone. Thereby, the electrical signal on the main body of the mobile phone can be transmitted into the sounding device unit to realize sound generation.
特别地,在壳体侧壁上配置有第一出声口的实施方式中,所述模组外壳的外表面上由第一出声口28到发声装置单体1之间的区域为天线净空区,在所述净空区内可以设置有天线。为了避免金属件对天线产生干扰,所述天线的分布位置需要与发声装置单体相隔开,上述天线净空区能够符合这种相互隔开的性能要求。在本发明的技术方案中,由于柔性电路板的 本体部设置在模组壳体外表面上,所以模组壳体内部节省出一部分空间。所述发声装置单体的装配位置可以向节省出的空间移动,从而在另一侧避让出更多的空间,用于设置天线。所以,所述天线可以设置在第一出声口所在的位置处。发声装置单体的装配位置向远离出声口的一侧偏移,更好的实现天线与单体的避让效果。In particular, in the embodiment in which the first sound outlet is disposed on the sidewall of the housing, the area between the first sound outlet 28 and the sounding device unit 1 on the outer surface of the module housing is the antenna clearance. In the area, an antenna may be disposed in the clearance area. In order to avoid interference of the metal parts to the antenna, the distribution position of the antenna needs to be separated from the sounding device unit, and the above-mentioned antenna clearance area can meet such mutually separated performance requirements. In the technical solution of the present invention, due to the flexible circuit board The body portion is disposed on the outer surface of the module housing, so that a part of the space is saved inside the module housing. The assembly position of the sounding device unit can be moved to the saved space, thereby avoiding more space on the other side for setting the antenna. Therefore, the antenna can be disposed at a position where the first sound outlet is located. The assembly position of the sounding device unit is offset to the side away from the sound outlet port, thereby better achieving the avoidance effect of the antenna and the single body.
本发明还提供了一种电子产品,可以是手机、平板电脑等。该电子产品中包括了产品主体和上述发声装置模组。所述产品主体上可以具有发声器槽,所述发声装置模组设置在所述发声器槽中。可选地,电子产品上的电连接点可以设置在所述发声器槽中,当发声装置模组装配到发声器槽中时,两者能够直接形成电连接。简化装配、电连接的步骤。The invention also provides an electronic product, which can be a mobile phone, a tablet computer or the like. The electronic product includes a product body and the above sound emitting device module. The product body may have a sounder slot, and the sounding device module is disposed in the sounder slot. Alternatively, an electrical connection point on the electronic product can be disposed in the sounder slot, and when the sounding device module is assembled into the sounder slot, the two can directly form an electrical connection. Simplify the steps of assembly and electrical connection.
本发明还提供了一种电子产品,同样包括了产品主体和发声装置模组,发声装置模组设置在产品主体的发声器槽中。特别地,这种电子产品中采用的发声装置模组上配置有上述第一出声口。所述产品主体的侧壁上还设置有第二出声口。所述发声装置模组的第一出声口与第二出声口相连通。电子产品主体的由所述第二出声口至发声装置单体之间的整片区域都可以是天线净空区。在该天线净空区内,可以设置有天线。The invention also provides an electronic product, which also comprises a product body and a sounding device module, and the sounding device module is arranged in the sounder slot of the product body. In particular, the first sound outlet is disposed on the sounding device module used in the electronic product. A second sound outlet is further disposed on a sidewall of the product body. The first sound outlet of the sounding device module is in communication with the second sound outlet. The entire area of the main body of the electronic product from the second sound outlet to the sounding device unit may be an antenna clearance area. In the antenna clearance area, an antenna may be provided.
本申请还提供了一种扬声器模组。如图5、图7和图8共同所示,一种扬声器模组,包括外壳,外壳由结合在一起的第一壳体10和第二壳体20构成,第一壳体10与第二壳体20围成的空间内收容有扬声器单体30。扬声器单体30将整个模组内腔分隔为前声腔60和后声腔62两个腔体,扬声器单体30与第二壳体20之间形成前声腔60,前声腔60通过设置在第二壳体20侧壁上的出声孔22与外界相通,将扬声器单体30发出的声音辐射出去;扬声器单体30、第一壳体10和第二壳体20之间形成后声腔62。扬声器模组还包括用于电连接扬声器单体30与外部电路的柔性电路板40。The application also provides a speaker module. As shown in FIG. 5, FIG. 7 and FIG. 8, a speaker module includes a casing, and the casing is composed of a first casing 10 and a second casing 20 which are combined together, and the first casing 10 and the second casing The speaker unit 30 is housed in a space surrounded by the body 20. The speaker unit 30 divides the entire module cavity into two chambers, the front sound chamber 60 and the rear sound chamber 62. The front sound chamber 60 is formed between the speaker unit 30 and the second housing 20, and the front sound chamber 60 is disposed in the second shell. The sound hole 22 on the side wall of the body 20 communicates with the outside to radiate sound emitted from the speaker unit 30; the rear sound chamber 62 is formed between the speaker unit 30, the first housing 10 and the second housing 20. The speaker module also includes a flexible circuit board 40 for electrically connecting the speaker unit 30 to an external circuit.
如图5、图6和图7共同所示,柔性电路板40包括相连接的第一主体部46和第二主体部48,第一主体部46和第二主体部48均为条状结构, 且延伸方向相同。第一主体部46的两端均向同一侧弯折延伸并设有焊盘部42,两焊盘部42相对伸出并分别与扬声器单体30的两个焊盘电连接,本实施方式中,其中的一个焊盘部42与第二主体部48相连接,且延伸方向与第一主体部46的延伸方向相同,第二主体部48设置在该焊盘部42远离另一焊盘部42的一端,第二主体部48的端部设有外连接部44,外连接部44与外部电路电连接。当然第二主体部48也可以直接与第一主体部46相连接,本实施方式将第二主体部48与一个焊盘部42相连接的结构更为简单,占用空间更小,为本实用新型的优选方案。As shown in FIG. 5, FIG. 6, and FIG. 7, the flexible circuit board 40 includes a first body portion 46 and a second body portion 48 that are connected, and the first body portion 46 and the second body portion 48 are both strip-shaped structures. And the extension direction is the same. Both ends of the first main body portion 46 are bent and extended toward the same side and are provided with a pad portion 42. The two pad portions 42 are oppositely extended and electrically connected to the two pads of the speaker unit 30, respectively. One of the pad portions 42 is connected to the second body portion 48, and the extending direction is the same as the extending direction of the first body portion 46, and the second body portion 48 is disposed at the pad portion 42 away from the other pad portion 42. At one end, the end of the second body portion 48 is provided with an outer connecting portion 44, and the outer connecting portion 44 is electrically connected to an external circuit. Of course, the second main body portion 48 can also be directly connected to the first main body portion 46. In this embodiment, the second main body portion 48 and the one pad portion 42 are connected to each other, and the structure is simpler and the space is smaller. The preferred solution.
如图5、图6和图7共同所示,第一主体部46铺设在外壳的外表面上,本实施方式中第一主体部46铺设在第二壳体20的一侧侧壁外表面上,两焊盘部42中的至少一个跨过该侧侧壁的端部延伸至外壳内与扬声器单体30电连接,本实施方式中优选两个焊盘部42均跨过该侧侧壁的端部延伸至外壳内与扬声器单体30电连接,该侧壁的端部对应两焊盘部42向外壳内延伸的部位分别设有一避让缺口28,两焊盘部42分别从两避让缺口28处延伸至外壳内,在第一壳体10与第二壳体20结合后,可在两避让缺口28处涂胶密封。铺设有第一主体部46的该侧侧壁与设有出声孔22的一侧侧壁相对设置,第一主体部46铺设在第二壳体20的远离出声孔22的一侧侧壁外侧,扬声器单体30靠设在第一主体部46铺设的侧壁内侧上,即扬声器单体30靠设在第二壳体20的远离出声孔22的一侧侧壁内侧。第二主体部48铺设在外壳的内部,外连接部44穿出外壳位于外壳的外侧。扬声器单体30与设有出声孔22的侧壁之间为天线净空区域。As shown in FIG. 5, FIG. 6, and FIG. 7, the first main body portion 46 is laid on the outer surface of the outer casing. In the present embodiment, the first main body portion 46 is laid on the outer surface of one side wall of the second casing 20. At least one of the two land portions 42 extends across the end of the side wall into the outer casing and is electrically connected to the speaker unit 30. In the present embodiment, it is preferred that both of the land portions 42 straddle the side wall. The end portion extends into the outer casing and is electrically connected to the speaker unit 30. The end portion of the side wall is respectively provided with a avoidance notch 28 corresponding to the portion of the two pad portions 42 extending into the outer casing. The two pad portions 42 respectively from the two avoidance notches 28 The portion extends into the outer casing, and after the first casing 10 and the second casing 20 are combined, the rubber seal can be applied at the two avoidance notches 28. The side wall on which the first main body portion 46 is laid is disposed opposite to the side wall on which the sound hole 22 is provided, and the first body portion 46 is laid on the side wall of the second casing 20 away from the sound hole 22. On the outer side, the speaker unit 30 is disposed on the inner side of the side wall of the first body portion 46, that is, the speaker unit 30 is disposed on the inner side of the side wall of the second casing 20 away from the sound hole 22. The second body portion 48 is laid inside the outer casing, and the outer connecting portion 44 passes out of the outer casing at the outer side of the outer casing. Between the speaker unit 30 and the side wall provided with the sound hole 22 is an antenna clearance area.
如图5和图9共同所示,第二壳体20的侧壁上对应第一主体部46的位置设有容置槽24,第一主体部46通过胶层50粘接铺设在容置槽24内,容置槽24的形状和尺寸与第一主体部46的形状和尺寸相适配,且本实施方式优选容置槽24的深度与大于或等于第一主体部46叠加胶层50后的厚度,即第一主体部46粘接固定到容置槽24内后,第一主体部46不凸出于第二壳体20的该侧侧壁的外表面。胶层50可选用胶水、双面胶或背胶,本实施方式中优选胶层50为设置在第一主体部46上的背胶,粘 接更为方便,且不会有溢胶。As shown in FIG. 5 and FIG. 9 , the sidewall of the second housing 20 corresponding to the first main body portion 46 is provided with a receiving groove 24 , and the first main body portion 46 is adhesively laid on the receiving groove through the adhesive layer 50 . The shape and size of the accommodating groove 24 are adapted to the shape and size of the first main body portion 46, and the depth of the accommodating groove 24 is greater than or equal to that of the first main body portion 46 after the adhesive layer 50 is superposed. The thickness of the first main body portion 46 does not protrude from the outer surface of the side wall of the second housing 20 after the first main body portion 46 is adhesively fixed into the accommodating groove 24. The glue layer 50 may be glued, double-sided tape or back glue. In the embodiment, the glue layer 50 is preferably a backing glue disposed on the first body portion 46. It is more convenient and will not overflow.
如图5和图7共同所示,在容置槽24的底部设有热熔柱26,本实施方式中热熔柱26共设有两个,分别设置在容置槽24的两端部,第一主体部46上对应两热熔柱26的位置各设有一热熔孔49,同时胶层50上对应热熔孔49的位置设有避让孔52。在组装时,热熔柱26穿过避让孔52和热熔孔49,通过热熔工艺将热熔柱26露出第一主体部46的部分融化形成一小帽结构,将第一主体部46卡在容置槽24内,能够避免第一主体部46因胶层50失效或粘接不牢而翘起的不良。As shown in FIG. 5 and FIG. 7 , a heat-melting column 26 is disposed at the bottom of the accommodating groove 24 . In the present embodiment, two hot-melt columns 26 are disposed at two ends of the accommodating groove 24 , respectively. A hot melt hole 49 is disposed in each of the positions of the first body portion 46 corresponding to the two heat-melting columns 26, and a relief hole 52 is disposed at a position corresponding to the heat-melting hole 49 on the glue layer 50. At the time of assembly, the heat-melting column 26 passes through the escape hole 52 and the hot-melt hole 49, and a portion of the heat-melting column 26 exposed to the first body portion 46 is melted by a hot-melt process to form a small cap structure, and the first body portion 46 is stuck. In the accommodating groove 24, it is possible to avoid the defect that the first main body portion 46 is lifted due to failure of the adhesive layer 50 or poor adhesion.
如图5和图7共同所示,第一壳体10上对应扬声器单体30的位置设有安装孔12,安装孔12的形状和尺寸与扬声器单体30的底部相适配,当扬声器模组组装完成后,扬声器单体30的底部(磁路系统的盆架)位于安装孔12内,且扬声器单体30底部的表面与设有安装孔12处的第一壳体10的外表面齐平,可降低扬声器模组的厚度。As shown in FIG. 5 and FIG. 7, the position of the first housing 10 corresponding to the speaker unit 30 is provided with a mounting hole 12, and the shape and size of the mounting hole 12 are matched with the bottom of the speaker unit 30. After assembly of the assembly, the bottom of the speaker unit 30 (the basin of the magnetic circuit system) is located in the mounting hole 12, and the surface of the bottom of the speaker unit 30 is flush with the outer surface of the first housing 10 at which the mounting hole 12 is provided. Flat, can reduce the thickness of the speaker module.
本实用新型采用内外结合的FPCB走线方式,节省了扬声器模组的内部空间,在满足扬声器模组宽度要求的同时避免了扬声器单体与天线净空区相干涉,保证了产品的性能,同时还满足了便携式电子设备的结构和总体布局的要求;且提升了扬声器模组的中频性能,提高了组装效率。The utility model adopts the internal and external FPCB routing mode, which saves the inner space of the speaker module, and satisfies the requirement of the speaker module width while avoiding interference between the speaker unit and the antenna clearance area, thereby ensuring the performance of the product, and also It satisfies the requirements of the structure and overall layout of the portable electronic device; and improves the intermediate frequency performance of the speaker module and improves the assembly efficiency.
通过上面的描述,可以知道本发明至少包括如下几个方面的内容。From the above description, it can be understood that the present invention includes at least the following aspects.
E1、扬声器模组,包括外壳及收容在所述外壳内的扬声器单体,还包括柔性电路板,其特征在于,所述柔性电路板包括主体部和由所述主体部上延伸出的用于与所述扬声器单体电连接的两个焊盘部,所述主体部包括相连的第一主体部和第二主体部,所述第一主体部铺设在所述外壳的外表面上,所述第二主体部铺设在所述外壳的内部,所述第二主体部的端部连接有与外部电路电连接的外连接部,所述外连接部位于所述外壳的外侧;所述扬声器单体靠设在所述外壳的远离出声孔的部位内侧。An E1, a speaker module, comprising: a housing and a speaker unit housed in the housing, further comprising a flexible circuit board, wherein the flexible circuit board comprises a main body portion and an extension body extending from the main body portion Two pad portions electrically connected to the speaker unit, the body portion including an associated first body portion and a second body portion, the first body portion being laid on an outer surface of the outer casing, a second main body portion is laid inside the outer casing, and an end portion of the second main body portion is connected with an outer connecting portion electrically connected to an external circuit, the outer connecting portion is located outside the outer casing; the speaker unit It is disposed inside the portion of the outer casing that is away from the sound hole.
E2、根据E1所述的扬声器模组,其特征在于,所述外壳的外表面上设有凹陷的容置槽,所述第一主体部铺设在所述容置槽内。The speaker module according to E1, wherein the outer surface of the outer casing is provided with a recessed receiving groove, and the first main body portion is laid in the receiving groove.
E3、根据E2所述的扬声器模组,其特征在于,所述第一主体部通过 胶层粘接铺设在所述容置槽内。E3. The speaker module according to E2, wherein the first body portion passes The adhesive layer is laid in the receiving groove.
E4、根据E3所述的扬声器模组,其特征在于,所述容置槽的深度等于或大于所述第一主体部和所述胶层叠加后的厚度。The speaker module according to E3, wherein the depth of the accommodating groove is equal to or greater than a thickness of the first body portion and the glue layer after being superposed.
E5、根据E2所述的扬声器模组,其特征在于,所述容置槽的底部设有热熔柱,所述第一主体部上设有与所述热熔柱相配合的热熔孔。The speaker module according to E2, wherein the bottom of the accommodating groove is provided with a heat-melting column, and the first body portion is provided with a hot-melt hole matched with the heat-melting column.
E6、根据E1所述的扬声器模组,其特征在于,所述外壳具有侧壁,所述第一主体部铺设在所述侧壁上。E6. The speaker module according to E1, wherein the outer casing has a side wall, and the first main body portion is laid on the side wall.
E7、根据E1所述的扬声器模组,其特征在于,所述两个焊盘部至少有一个由所述第一主体部延伸入所述外壳内与所述扬声器单体电连接。The speaker module according to E1, characterized in that at least one of the two pad portions is electrically connected to the speaker unit by the first body portion extending into the casing.
E8、根据E1至E6任一实例所述的扬声器模组,其特征在于,所述外壳的侧壁上开设有所述出声孔,所述扬声器单体靠设在所述外壳的远离所述出声孔的一侧的侧壁内侧,所述第一主体部铺设在所述外壳的远离所述出声孔的一侧的侧壁外侧。The speaker module according to any one of the examples of E1 to E6, wherein the sound emitting hole is defined in a sidewall of the outer casing, and the speaker unit is disposed away from the outer casing of the outer casing. The inside of the side wall of one side of the sound hole, the first body portion is laid outside the side wall of the side of the outer casing away from the sound hole.
E9、根据E8所述的扬声器模组,其特征在于,所述外壳包括结合在一起的第一壳体和第二壳体,所述第一主体部铺设在所述第二壳体的一侧侧壁上,该所述侧壁的端部设有供所述柔性电路板穿过的避让缺口。E9. The speaker module according to E8, wherein the outer casing comprises a first housing and a second housing joined together, the first main body portion being laid on one side of the second housing On the side wall, the end of the side wall is provided with a avoidance notch for the flexible circuit board to pass through.
E10、根据E9所述的扬声器模组,其特征在于,所述第一壳体上对应所述扬声器单体的位置设有安装孔,所述扬声器单体的底部位于所述安装孔内。The speaker module according to E9, wherein the first housing has a mounting hole at a position corresponding to the speaker unit, and a bottom of the speaker unit is located in the mounting hole.
本说明书仅是以上述结构的扬声器模组为例对本实用新型的技术方案进行举例说明,实际应用中本实用新型的技术方案并不仅限于上述结构的扬声器模组中,其可应用于任何一种结构的扬声器模组中,尤其适用于小体积、复杂外形的扬声器模组,本领域的技术人员根据上述实施例的阐述,不需要付出任何创造性的劳动就可以将本实用新型的技术方案应用到其它结构的扬声器模组中,故无论扬声器模组的其它结构是否与上述实施例的相同,只要是采用内外结合的FPCB走线方式的产品均落入本实用新型的保护范围内。In the present specification, the technical solution of the present invention is exemplified by taking the speaker module of the above structure as an example. In practical applications, the technical solution of the present invention is not limited to the speaker module of the above structure, and can be applied to any one of the following. The speaker module of the structure is especially suitable for a small-volume, complex-shaped speaker module, and those skilled in the art can apply the technical solution of the present invention to the invention according to the above embodiments without any creative labor. In other configurations of the speaker module, regardless of whether the other structure of the speaker module is the same as that of the above embodiment, any product that uses the FPCB routing method with internal and external bonding falls within the protection range of the present invention.
虽然已经通过例子对本发明的一些特定实施例进行了详细说明,但 是本领域的技术人员应该理解,以上例子仅是为了进行说明,而不是为了限制本发明的范围。本领域的技术人员应该理解,可在不脱离本发明的范围和精神的情况下,对以上实施例进行修改。本发明的范围由所附权利要求来限定。 Although specific embodiments of the invention have been described in detail by way of example, It is to be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (10)

  1. 一种发声装置模组,其特征在于,包括:发声装置单体、模组壳体和柔性电路板,所述发声装置单体设置在所述模组壳体内,所述柔性电路板的本体部铺设在所述模组壳体的外表面上,所述柔性电路板具有从所述本体部上延伸出的两支单体电连接区,两支所述单体电连接区配置为从所述模组壳体的外侧伸入模组壳体内,与所述发声装置单体实现电连接。A sounding device module, comprising: a sounding device unit, a module housing and a flexible circuit board, wherein the sounding device is separately disposed in the module housing, and the body portion of the flexible circuit board Laying on an outer surface of the module housing, the flexible circuit board has two single electrical connection regions extending from the body portion, and the two single electrical connection regions are configured to be The outer side of the module housing extends into the module housing to electrically connect with the sounding device unit.
  2. 根据权利要求1所述的发声装置模组,其特征在于,所述模组壳体的外表面上具有电路板槽,所述柔性电路板的本体部嵌于所述电路板槽中。The sound emitting device module according to claim 1, wherein the outer surface of the module housing has a circuit board slot, and the body portion of the flexible circuit board is embedded in the circuit board slot.
  3. 根据权利要求1所述的发声装置模组,其特征在于,所述柔性电路板的本体部粘接固定在所述模组壳体的外表面上。The sound emitting device module according to claim 1, wherein the body portion of the flexible circuit board is adhesively fixed to an outer surface of the module housing.
  4. 根据权利要求3所述的发声装置模组,其特征在于,所述柔性电路板的本体部用于与模组壳体粘接的表面上覆有背胶层。The sound emitting device module according to claim 3, wherein the surface of the body portion of the flexible circuit board for bonding to the module housing is covered with a backing layer.
  5. 根据权利要求1所述的发声装置模组,其特征在于,所述模组壳体具有侧壁,所述柔性电路板的本体部铺设在所述侧壁上。The sound emitting device module according to claim 1, wherein the module housing has a side wall, and a body portion of the flexible circuit board is laid on the side wall.
  6. 根据权利要求1-5任一所述的发声装置模组,其特征在于,所述模组壳体的侧壁上开设有第一出声口,所述发声装置单体靠设在所述模组壳体的远离所述第一出声口的一侧的侧壁内侧,所述柔性电路板的本体部铺设在模组壳体上远离所述第一出声口的一侧的侧壁外侧。The sound emitting device module according to any one of claims 1 to 5, wherein a first sound outlet is opened on a side wall of the module housing, and the sounding device is disposed on the mold The inner side of the side wall of the side of the group housing away from the first sound outlet, the body portion of the flexible circuit board is laid on the side of the side wall of the module housing away from the side of the first sound outlet .
  7. 根据权利要求1所述的发声装置模组,其特征在于,所述模组壳体包括下壳和上盖,所述上盖配置为能扣合在所述下壳上,所述柔性电路板的本体部铺设在所述下壳的外表面上,且所述下壳的侧壁的上端面上开设有用于避让两支所述单体电连接区的缺口,所述上盖上对应设有封堵所述缺口的凸起。The sound emitting device module according to claim 1, wherein the module housing comprises a lower case and an upper cover, and the upper cover is configured to be fastened to the lower case, the flexible circuit board a body portion is disposed on an outer surface of the lower case, and an upper end surface of the side wall of the lower case is provided with a notch for avoiding two of the single electrical connection regions, and the upper cover is correspondingly disposed The protrusion of the notch is blocked.
  8. 根据权利要求6所述的发声装置模组,其特征在于,所述模组外壳的外表面上由第一出声口至发声装置单体之间的区域为天线净空区,在所述天线净空区内设置有天线。 The sounding device module according to claim 6, wherein an area between the first sound outlet and the sounding device unit on the outer surface of the module casing is an antenna clearance area, and the antenna clearance is performed. An antenna is provided in the area.
  9. 一种电子产品,其特征在于,包括产品主体和权利要求1-8任一所述的发声装置模组,所述产品主体上具有发声器槽,所述发声装置模组设置在所述发声器槽中。An electronic product, comprising: a product body and the sounding device module according to any one of claims 1-8, wherein the product body has a sounder slot, and the sounding device module is disposed on the sounder In the slot.
  10. 一种电子产品,其特征在于,包括产品主体和权利要求1-7任一所述的发声装置模组,所述产品主体上具有发声器槽,所述发声装置模组设置在所述发声器槽中;An electronic product, comprising: a product body and the sounding device module according to any one of claims 1 to 7, wherein the product body has a sounder slot, and the sounding device module is disposed on the sounder In the slot;
    在所述产品主体的侧壁上设有第二出声口,所述发声装置模组的第一出声口与所述第二出声口连通,所述电子产品主体的由所述第二出声口至所述发声装置单体之间的区域为天线净空区,在所述天线净空区内设置有天线。 a second sound outlet is disposed on a sidewall of the product body, a first sound outlet of the sounding device module is in communication with the second sound outlet, and the second body of the electronic product is The area between the sound outlet to the sounding device unit is an antenna clearance area, and an antenna is disposed in the antenna clearance area.
PCT/CN2017/094170 2017-02-17 2017-07-24 Sound production device module and electronic product WO2018149093A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201710086966.5 2017-02-17
CN201710086966.5A CN107071661B (en) 2017-02-17 2017-02-17 sound generating device module and electronic product
CN201720330411.6U CN206658293U (en) 2017-03-30 2017-03-30 Loudspeaker module
CN201720330411.6 2017-03-30

Publications (1)

Publication Number Publication Date
WO2018149093A1 true WO2018149093A1 (en) 2018-08-23

Family

ID=63169112

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/094170 WO2018149093A1 (en) 2017-02-17 2017-07-24 Sound production device module and electronic product

Country Status (1)

Country Link
WO (1) WO2018149093A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203086728U (en) * 2013-01-18 2013-07-24 歌尔声学股份有限公司 Acoustic module
CN203181198U (en) * 2013-01-23 2013-09-04 福兴达科技实业(深圳)有限公司 Side-sounding sound cavity structure
CN203193823U (en) * 2013-01-18 2013-09-11 歌尔声学股份有限公司 Acoustics module
US8885867B1 (en) * 2013-06-10 2014-11-11 Acer Incorporated Portable electronic device
CN205584486U (en) * 2016-05-05 2016-09-14 广东欧珀移动通信有限公司 Speaker subassembly and mobile terminal

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203086728U (en) * 2013-01-18 2013-07-24 歌尔声学股份有限公司 Acoustic module
CN203193823U (en) * 2013-01-18 2013-09-11 歌尔声学股份有限公司 Acoustics module
CN203181198U (en) * 2013-01-23 2013-09-04 福兴达科技实业(深圳)有限公司 Side-sounding sound cavity structure
US8885867B1 (en) * 2013-06-10 2014-11-11 Acer Incorporated Portable electronic device
CN205584486U (en) * 2016-05-05 2016-09-14 广东欧珀移动通信有限公司 Speaker subassembly and mobile terminal

Similar Documents

Publication Publication Date Title
US10264336B2 (en) Electronic device and conductive structure
CN103747398A (en) Loudspeaker module and electronic device comprising the loudspeaker module
EP2632171B1 (en) Loudspeaker housing and mobile terminal device
CN111148403B (en) Mobile terminal and heat dissipation shielding structure
CN106303863B (en) Loudspeaker sound outlet structure for mobile terminal and mobile terminal
JP2015080205A5 (en)
US9197961B2 (en) Portable electronic device with internal speaker
TWM542913U (en) Notebook computer
JP2003007282A (en) Battery
RU2011112981A (en) PORTABLE COMPUTER
CN207677986U (en) A kind of loud speaker module
CN214228464U (en) Electronic device
CN107071661B (en) sound generating device module and electronic product
WO2019128389A1 (en) Loudspeaker module and electronic device
CN108430030B (en) Loudspeaker enclosure and method of assembling the same
CN205005229U (en) Terminal with microphone
CN106374961B (en) Mobile terminal
US7998557B2 (en) Shell assembly
WO2018149093A1 (en) Sound production device module and electronic product
CN106911976B (en) Sound production device module
WO2014148089A1 (en) Portable device
CN207339957U (en) A kind of electronic equipment
WO2015033530A1 (en) Electronic apparatus
CN202232000U (en) Consumer electric product and moisture-inhibiting sealing structure
JP2011182199A (en) Antenna apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17896796

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17896796

Country of ref document: EP

Kind code of ref document: A1