WO2018131709A1 - Base member having increased surface hydrophobicity or hydrophilicity - Google Patents

Base member having increased surface hydrophobicity or hydrophilicity Download PDF

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WO2018131709A1
WO2018131709A1 PCT/JP2018/000972 JP2018000972W WO2018131709A1 WO 2018131709 A1 WO2018131709 A1 WO 2018131709A1 JP 2018000972 W JP2018000972 W JP 2018000972W WO 2018131709 A1 WO2018131709 A1 WO 2018131709A1
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substrate
treatment
self
compound
group
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PCT/JP2018/000972
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French (fr)
Japanese (ja)
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宮原 鐘一
伸也 田光
昌宏 仲山
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仲山貴金属鍍金株式会社
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Priority to JP2018561446A priority Critical patent/JPWO2018131709A1/en
Publication of WO2018131709A1 publication Critical patent/WO2018131709A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • C25D11/18After-treatment, e.g. pore-sealing
    • C25D11/24Chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N37/00Details not covered by any other group of this subclass

Definitions

  • the present invention relates to a substrate having a surface modified so as to increase the hydrophobicity or hydrophilicity of the surface and a method for producing the same. More specifically, the present invention relates to a surface of a substrate formed of a solid material such as a metal material, a ceramic material, or a synthetic resin material from a super-water-repellent to a super-hydrophilic property using a method that can be easily carried out industrially. The present invention relates to a surface modification method that can be modified so as to exhibit desired water repellency or hydrophilicity, and a substrate whose surface properties are modified by the method.
  • ⁇ -TAS Total Analysis System
  • the wall portion (bank portion) around the channel has high water repellency. Therefore, in order to produce a highly practical ⁇ -TAS, it is necessary to apply a treatment for locally modifying the surface characteristics of various substrates made of solid materials to be water-repellent or hydrophilic. .
  • Patent Document 1 discloses a surface property modification method capable of modifying the surface properties of a metal substrate so as to exhibit high water repellency.
  • Patent Document 1 a substrate-adsorbing compound having an adsorptive group exhibiting adsorptivity to a solid surface and a chain hydrophobic group, a functional group, and a chain hydrophobic group are substantially adsorbed on the solid surface.
  • a self-assembled unit consisting of an adsorbing compound and a non-adsorbing compound on the surface of a solid such as a metal substrate and having a functional group exposed on the surface.
  • a method for modifying a solid surface by forming a layer film (SAM) is described.
  • the water contact angle ranges from 88 ° to 132 ° by applying the above modification to the surface of a glass plate having a gold surface with a water contact angle of 25 °. There is a description that a modified surface can be obtained.
  • Patent Document 2 discloses a surface property modification method capable of modifying a surface property of a substrate in a wide range so as to exhibit desired physical properties from superhydrophobic to superhydrophilic.
  • Patent Document 2 discloses a metal composite substrate having a shape of a removal trace-like hole of a supramolecular organization having a fractal surface structure, and a surface of which is flake-like, and a self-assembled monolayer provided on the surface.
  • a functional metal composite substrate comprising a functional thin film that is either (SAM) or a polymer thin film is disclosed.
  • a fullerene structure (supermolecular structure) produced using a fullerene derivative having a specific chemical structure is used as a template, and this structure is transferred to a metal material.
  • a method of forming a substrate having a shape of a removal trace-like hole of a supramolecular organization is disclosed.
  • Patent Document 2 has a description that the metal composite substrate produced by the method disclosed therein exhibits controlled wettability from super / high hydrophilicity to super / high water repellency, As an example, an example is disclosed in which a metal composite substrate is produced by using the method described in this document and the contact angle with water is measured. Specifically, it can be seen that a substrate having surface characteristics exhibiting super-water-repellency of about 157 ° can be obtained from super-hydrophilicity having a contact angle with water of about 11 °.
  • water repellency is defined as 90 ° or more, high water repellency when 110 ° or more but less than 150 °, and super water repellency when 150 ° or more. is doing. However, there is no detailed description on the super / high hydrophilicity.
  • Patent Document 2 by utilizing the method disclosed therein, a substrate having a controlled wettability from the super / high hydrophilicity to the super / high water repellency can be produced on the surface.
  • the method described in Patent Document 2 uses a fullerene structure (supermolecular structure) in which fullerene derivatives are organized as a template to transfer the structure of the supermolecular structure to a metal material.
  • the porous metal substrate is produced by a method of obtaining a removal trace-like pore shape of a supramolecular structure having a fractal surface structure, and the surface is a flaky metal. It is a composite substrate. Therefore, this metal composite substrate manufacturing method is an industrially easy method for expressing wettability controlled from super / high hydrophilicity to super / high water repellency on the surface of the substrate itself made of various materials. I can't say that.
  • the main object of the present invention is to industrially develop the wettability controlled as desired from the super / high hydrophilicity to the super / high water repellency on the surfaces of various prefabricated substrates. It is to provide an easily available method.
  • the inventor of the present invention has continued research to develop an industrially easy-to-use method for developing controlled wettability from the super / high hydrophilicity to the super / high water repellency on the substrate surface. .
  • a continuous fine uneven surface is formed on the substrate surface by performing precious metal plating treatment under conditions different from the plating treatment conditions for forming a normal smooth plating layer on the substrate surface.
  • SAM Self-Assembled Monolayer
  • the inventor then formed a base metal plating layer having a continuous fine uneven surface on the substrate surface instead of the noble metal plating layer having the continuous fine uneven surface, and then It has also been found that a thin noble metal plating layer having a continuous fine irregular surface on the surface of the substrate can also be produced by utilizing the method for forming a noble metal plating layer thereon. That is, also by this method, when a self-assembled monolayer is laminated on the surface of a thin noble metal plating layer having continuous fine irregularities generated on the surface of the substrate, similarly, the hydrophobicity or hydrophilicity of the substrate surface is increased. It has been found that it can be significantly increased.
  • the inventor further forms a base metal plating layer having a continuous fine uneven surface on the substrate surface instead of the noble metal plated layer having a continuous fine uneven surface, and self-organizes on the base metal plated layer. It has also been found that the hydrophobicity or hydrophilicity of the substrate surface can be remarkably enhanced by a method of directly forming a monomolecular film.
  • a precious metal or base metal plating layer having a continuous fine uneven surface was formed on the surface of the substrate, and self-organized on the uneven surface of the surface of the plated layer.
  • a method of generating a self-assembled monolayer on the fine uneven surface of the substrate can significantly increase the hydrophobicity or hydrophilicity of the substrate surface. I also found what I can do.
  • the structure of the supramolecular structure is transferred to a metal material by using the fullerene structure (supermolecular structure) in which fullerene derivatives are organized as described in Patent Document 2 as a template.
  • a porous substrate manufactured by the above method which has a shape of a removal trace-like hole of a supramolecular structure having a fractal surface structure, and even if the surface is not a flaky metal composite substrate, it is industrially implemented.
  • a substrate surface having continuous fine irregularities formed by roughening plating treatment that is easy to use is used, or is formed by using normal chemical roughening treatment or physical roughening treatment
  • a SAM can be generated on the continuous fine uneven surface, and the substrate can be formed in a desired manner from super / high hydrophilicity to super / high water repellency. Surface characteristics It has been found that can be converted to a substrate having.
  • the substrate by subjecting the surface of the substrate to chemical roughening or physical roughening, the substrate is converted into a substrate having a continuous fine uneven surface on the surface, and There is provided a substrate with a modified surface, which is obtained by subjecting a surface of the substrate having a continuous fine uneven surface to a treatment for generating a self-assembled monolayer.
  • the supramolecule formed by organizing fullerene derivatives as described in Patent Document 2 is used in the chemical roughening treatment or physical roughening treatment in the present invention. It does not include a process for producing a substrate having the shape of a removal trace-like pore of a supramolecular structure having a porous and fractal surface structure obtained by transferring the structure as a template.
  • the surface of the substrate is subjected to a chemical surface roughening treatment or a physical surface roughening treatment to convert the substrate into a substrate having a continuous fine uneven surface on the surface.
  • a method for increasing the hydrophobicity or hydrophilicity of a substrate surface comprising a step and a step of subjecting the surface of the substrate to a surface having a continuous fine irregular surface to form a self-assembled monolayer.
  • the fullerene derivative as described in Patent Document 2 is also formed in the chemical roughening treatment or the physical roughening treatment in the above method of the present invention.
  • This method does not include a process for producing a substrate having a shape of removal trace-like pores of a supramolecular structure having a porous and fractal surface structure obtained by transferring the supramolecular structure as a template.
  • the present invention by forming a self-assembled monolayer on the surface of the substrate on which a continuous fine uneven surface is formed on the surface by a normal chemical roughening treatment or physical roughening treatment,
  • the reason why the surface of the substrate is remarkably improved in hydrophobicity or hydrophilicity as compared with the case where the self-assembled monolayer is simply laminated on the surface is not clear at present, but the present inventor
  • the substrate surface is roughened, and continuous fine irregularities are formed on the surface.
  • a hydrophobic group or a hydrophilic group is formed at or near one end of the self-assembled monolayer. It is estimated that this is because the amount of the substrate-adhering molecules provided on the surface of the substrate (that is, the number of molecules actually adhering to the substrate) significantly increased.
  • the constituent molecules of the molecular film can be densely attached to the fine concavo-convex surface with high orientation, and the hydrophobic group or functional group provided at the other end is aligned and exposed to the outside. It is estimated that this is because the SAM film (several ⁇ m thick) is formed, and as a result, the effects shown in Young's formula or Wenzel's formula appear.
  • the contact angle with water is used as an index
  • the water repellency is 90 ° or more
  • the water repellency is 110 ° or more and less than 150 °
  • the water repellency is high.
  • the super water-repellent property is 150 ° or more.
  • the contact angle with water is used as an index
  • the case of less than 90 ° is defined as hydrophilic
  • the case of less than 70 °, 30 ° or more is defined as highly hydrophilic
  • the case of less than 30 ° is defined as superhydrophilic.
  • Chemical roughening treatment or physical roughening treatment is performed by plating treatment (chemical plating treatment), chemical etching (substrate surface is subjected to chemical corrosion agent, electrolytic polishing or high temperature heating in vacuum, etc.)
  • the treatment selected from the group consisting of anodizing treatment, anodizing treatment, and laser irradiation, or a combination thereof.
  • Chemical roughening treatment or physical roughening treatment is performed by laminating a base metal plating layer having continuous fine unevenness by base metal plating treatment on the substrate surface, and a base metal having continuous fine unevenness.
  • the chemical roughening treatment or the physical roughening treatment is a noble metal plating treatment represented by at least a gold plating treatment.
  • the chemical roughening treatment or the physical roughening treatment is at least a noble metal plating treatment represented by a gold plating treatment, and the thickness of the noble metal plating layer to be generated is in the range of 0.05 to 10 ⁇ m. Preferably, it is in the range of 0.1-6 ⁇ m, particularly preferably in the range of 0.5-5 ⁇ m.
  • the substrate is a metal substrate such as an aluminum plate, a stainless steel plate, a copper plate, or a titanium metal plate.
  • the substrate is a ceramic substrate such as a glass plate or a silica plate.
  • the substrate is a plastic substrate.
  • the base is a metal base, a ceramic base, or a plastic base provided with a noble metal layer or subjected to base metal plating or noble metal plating.
  • the average value of the full width at half maximum and height of the convex portions constituting the continuous fine uneven surface is in the range of 0.005 to 100 ⁇ m, preferably 0.01 to 10 ⁇ m, particularly preferably 0.05 to 5 ⁇ m. It is in the range.
  • the convex part which comprises a continuous fine uneven surface has a substantially cone shape.
  • the substrate is a plate-shaped substrate, a rod-shaped substrate, or a tubular substrate.
  • the self-assembled monolayer has a thiol group at one end and a hydrophilic group at the other end, a disulfide compound having a carboxyl group at both ends, a carboxyl group at one end, Selected from the group consisting of a compound having a bromine atom at the other end and a thiol compound, alkanethiol compound produced by the reaction of thiourea, and a compound having a carboxyl group at one end and a hydrophobic group at the other end It is made up of compounds.
  • the self-assembled monolayer has a thiol group at one end, a hydrophilic group at the other end, a disulfide compound having a carboxyl group at both ends, a carboxyl group at one end, It is composed of a sulfur atom-containing compound selected from the group consisting of thiol compounds produced by the reaction of a compound having a bromine atom at the other end with thiourea, and has a hydrophilic surface with an enhanced surface of the self-assembled monolayer Indicates.
  • the self-assembled monolayer is composed of an alkanethiol compound or a compound having a carboxyl group at one end and a hydrophobic group at the other end, and the surface of the self-assembled monolayer is increased.
  • the hydrophobicity is shown.
  • a fullerene structure in which fullerene derivatives are organized is used as a template, and the structure of the supramolecular tissue is transferred.
  • a self-assembled monolayer (SAM) is formed on the surface using a method of forming continuous fine irregularities by chemical or physical roughening, including plating that is easy to implement.
  • SAM self-assembled monolayer
  • the surface of the gold foil with a smooth surface is used as a base, and the surface of the base is subjected to a plating treatment using a gold plating solution containing potassium gold cyanide at a concentration of 10 g / L in terms of gold and a current density of 2 A / dm 2.
  • 4 is an electron micrograph ( ⁇ 3000) of the surface of a substrate on which a gold plating layer having continuous fine irregularities is generated, and then a self-assembled monolayer is formed on the irregular surface. It is a figure which shows the result of having observed the contact angle of the water droplet with the microscope, after dripping 5 microliters of pure waters on the surface of the base
  • the surface of the gold foil with a smooth surface is used as a base, and the surface of the base is plated with a gold plating solution containing potassium gold cyanide at a concentration of 5 g / L in terms of gold and the current density is 100 mA / dm 2.
  • 4 is an electron micrograph ( ⁇ 3000) of the surface of a substrate on which a gold plating layer having continuous fine irregularities is generated, and then a self-assembled monolayer is formed on the irregular surface. It is a figure which shows the result of having observed the contact angle of the water droplet with the microscope, after dripping 5 microliters of pure waters on the surface of the base
  • the surface of the gold foil with a smooth surface is used as a base, and the surface of the base is plated with a gold plating solution containing potassium gold cyanide at a concentration of 2 g / L in terms of gold and the current density is 3 A / dm 2.
  • 4 is an electron micrograph ( ⁇ 3000) of the surface of a substrate on which a gold plating layer having continuous fine irregularities is generated, and then a self-assembled monolayer is formed on the irregular surface. It is a figure which shows the result of having observed the contact angle of the water droplet with the microscope, after dripping 5 microliters of pure waters on the surface of the base
  • the surface of the platinum foil having a smooth surface is used as a base, and the surface of the base is subjected to a plating treatment using a platinum plating solution containing dinitrodiamine platinum at a concentration of 10 g / L in terms of platinum and a current density of 3 A / dm 2.
  • 4 is an electron micrograph ( ⁇ 3000) of the surface of a substrate in which a platinum plating layer having continuous fine irregularities is generated, and then a self-assembled monolayer is formed on the irregular surface. It is a figure which shows the result of having observed the contact angle of the water droplet with the microscope, after dripping 5 microliters of pure waters on the surface of the base
  • Example 8 It is an electron micrograph of the fine uneven surface of the plating layer which consists of the lamination nickel plating layer and thin gold plating layer which were generated on the base in Example 8. It is a laser microscope photograph (3D photograph) of the surface of a stearic acid self-assembled monolayer on the surface of an etched copper plate (etched for 45 seconds) produced in Example 9. It is a laser microscope photograph (3D photograph) of the surface of a stearic acid self-assembled monolayer on the surface of an etched copper plate (etched for 75 seconds) produced in Example 10. It is a laser microscope photograph (3D photograph) of the surface of a stearic acid self-assembled monolayer on the surface of an etched titanium plate (etched for 10 minutes) produced in Example 11.
  • the substrate used in the present invention is made of a material that shows a solid at a normal temperature, and is generally a precious metal such as gold or platinum, a metal such as iron, copper, nickel, titanium (titanium metal), a base metal such as brass, or glass.
  • the substrate is made of ceramic such as silica, but depending on the purpose, a substrate made of plastic or various composite materials can be used. These substrates may be pretreated (including the formation of a film) using a plating treatment or the like in advance if desired. Since specific examples of the substrate are described in Patent Document 1 and Patent Document 2, the description of these Patent Documents is described in this specification.
  • the substrate may be a plate-shaped substrate, a rod-shaped substrate, or a tubular substrate.
  • the plate-like substrate may have a flat surface, or may have an entire or partial curved surface.
  • various structures may be formed on the surface of the substrate like a chemical / biochemical analysis integrated system called ⁇ -TAS (Total Analysis System).
  • the means for forming a continuous fine uneven surface on the surface of the substrate there is no particular limitation on the means for forming a continuous fine uneven surface on the surface of the substrate, and a chemical roughening treatment (including chemical plating treatment) or a physical rough surface that can be easily adopted as a normal industrial treatment. Is used.
  • the chemical roughening treatment or physical roughening treatment that can be used in the present invention includes the above-described plating treatment (especially chemical plating treatment) and chemical etching treatment (especially using chemicals to roughen the substrate surface). Treatment), anodization treatment, laser irradiation treatment, and the like, but are not limited thereto.
  • the plating treatment is usually a treatment for forming a plating layer having a smooth surface, but the plating conditions (chemical composition of the plating solution, chemical component concentration in the plating solution, current density, plating treatment time, etc.) are adjusted. Those skilled in the art know that a plating layer having a non-smooth surface is formed. Further, various chemical roughening treatments or physical roughening treatments may be used in combination.
  • a base metal plating layer eg, nickel plating layer
  • a thin noble metal plating layer is then formed on the surface of the base metal plating layer.
  • a method of forming a noble metal plating layer in which continuous minute irregularities are finally formed on the surface can be advantageously used. When this method is used, the amount of expensive noble metal used can be suppressed, so that the method of the present invention is a very advantageous method for industrial implementation.
  • the thickness of the produced noble metal plating layer is preferably in the range of 0.05-10 ⁇ m, more preferably 0.1 It is in the range of ⁇ 6 ⁇ m, particularly preferably in the range of 0.5-5 ⁇ m.
  • the average value of the full width at half maximum and the height of the convex portions constituting the continuous fine irregular surface formed on the substrate surface is preferably in the range of 0.005 to 100 ⁇ m, more preferably It is in the range of 0.01-10 ⁇ m, particularly preferably in the range of 0.05-5 ⁇ m.
  • a chain molecule having a hydrophobic group or hydrophilic group at one end or in the vicinity thereof and a polar group having a strong affinity for the substrate surface in the other end or in the vicinity or in the molecule is mainly used as a liquid phase.
  • the method of forming a self-assembled monolayer (SAM) on the surface of a substrate by reacting with a substrate has been known for some time as a technique for modifying the surface characteristics of the substrate.
  • SAM self-assembled monolayer
  • Examples of compounds (chain molecules) constituting the self-assembled monolayer formed on the roughened substrate of the present invention include the following compounds.
  • a self-assembled monolayer is provided with a thiol group at one end. It is formed by the reaction of a compound with a hydrophilic group at the other end, a disulfide compound with a carboxyl group at both ends, a compound having a carboxyl group at one end and a bromine atom at the other end, and thiourea It is desirable to comprise a sulfur atom-containing compound selected from the group consisting of thiol compounds.
  • the self-assembled monolayer may be converted to an alkanethiol compound or a carboxyl at one end. It is desirable to comprise a compound having a group and a hydrophobic group at the other end.
  • Example 1 A gold foil having a smooth surface was used as a base, and the surface of the base was plated using the following gold plating solution to form a gold plating layer having continuous fine irregularities on the surface.
  • Gold plating solution composition pH 6-8): Potassium cyanide potassium 10g / L (as gold) Potassium dihydrogen phosphate 60g / L Potassium citrate 60g / L Temperature: 60 ° C Current density: 2 A / dm 2 Energizing time: 5 minutes
  • FIG. 1 shows an electron micrograph ( ⁇ 3000) of the obtained substrate surface. It is observed that continuous fine irregularities are formed on the surface.
  • FIG. 2 shows the result of observing the contact angle of water droplets with a microscope after 5 ⁇ L of pure water was dropped on the surface of the substrate shown in FIG. As can be seen from FIG. 2, the observed contact angle was 157 °.
  • Example 2 By performing the same plating treatment as in Example 1 except that the gold concentration of the gold plating solution composition was changed to 5 g / L and the current density was changed to 100 mA / dm 2 , the gold plating layer (thickness) having unevenness on the surface : About 3 ⁇ m) was obtained, and then a self-assembled monolayer was formed on the surface of the substrate by the method described in Example 1.
  • FIG. 3 shows an electron micrograph ( ⁇ 3000) of the obtained substrate surface. It is observed that continuous fine irregularities (average value of half width and height of convex portion: about 1 ⁇ m) are formed on the surface.
  • the result of observing the contact angle of the substrate surface shown in FIG. 3 with water by the method described in Example 1 is shown in FIG. As can be seen from FIG. 4, the observed contact angle was 147 °.
  • Example 3 Except for changing the gold concentration of the gold plating solution to 2 g / L and changing the current density to 3 A / dm 2 , the same plating treatment as in Example 1 was performed to generate a gold plating layer having irregularities on the surface. After obtaining the substrate, a self-assembled monolayer was formed on the surface of the substrate by the method described in Example 1.
  • FIG. 5 shows an electron micrograph ( ⁇ 3000) of the obtained substrate surface. It is observed that continuous fine irregularities are formed on the surface.
  • FIG. 6 shows the result of observing the contact angle of the surface of the substrate shown in FIG. 5 with water by the method described in Example 1. As can be seen from FIG. 6, the observed contact angle was 161 °.
  • Platinum plating solution composition (pH 9-10): Dinitrodiamine platinum 10g / L (as platinum) Ammonium nitrate 100g / L Sodium nitrite 10g / L Ammonium hydroxide 55g / L Potassium citrate 60g / L Temperature: 90 ° C Current density: 3 A / dm 2 Energizing time: 5 minutes
  • FIG. 7 shows an electron micrograph ( ⁇ 3000) of the obtained substrate surface. It is observed that continuous fine irregularities are formed on the surface.
  • FIG. 8 shows the result of observing the contact angle of water droplets with a microscope after 5 ⁇ L of pure water was dropped on the surface of the substrate shown in FIG. As can be seen from FIG. 8, the observed contact angle was 137 °.
  • Example 5 An aluminum plate with a smooth surface is used as a base, and the surface of the base is subjected to anodization and alkali etching to form a continuous fine uneven surface, and the aluminum plate with the uneven surface formed is immersed in a stearic acid solution. By doing so, a self-assembled monolayer was formed. When the contact angle of the surface of the obtained self-assembled monolayer with respect to water was observed by the same method as in Example 1, a contact angle exceeding 150 ° was observed.
  • Example 6 Using a brass plate having a smooth surface and nickel plating having a thickness of 0.5 to 3 ⁇ m, an uneven surface was formed on the surface of the substrate by laser treatment.
  • the substrate on which the irregular surface was formed was immersed in 3 mM 15-carboxy-1-pentadecanethiol (ethanol solution) for 16 hours to form a self-assembled monolayer.
  • the contact angle with water was determined to be less than 15 °.
  • Example 7 Using a brass plate having a smooth surface and nickel plating having a thickness of 0.5 to 3 ⁇ m, an uneven surface was formed on the surface of the substrate by laser treatment.
  • the substrate on which the uneven surface was formed was immersed in 3 mM 2-aminoethanethiol (ethanol solution) for 16 hours to form a self-assembled monolayer.
  • the contact angle with water was determined to be less than 15 °.
  • Example 8 On the surface (contact angle: 90 ° or less) of a smooth stainless steel plate (SUS304 plate), a first nickel plating layer is first formed using a wood bath and a watt bath, and then a second layer using a chloride bath. By generating a nickel plating layer of the eye, a multilayer nickel plating layer having continuous fine irregularities on the surface is generated, and then a continuous layer of a thin layer is formed using a cyanide plating bath on the surface of the multilayer nickel plating layer. A gold plating layer (thickness: about 0.1 ⁇ m) having fine irregularities was generated. An electron micrograph of the surface of the gold plating layer of the obtained substrate is shown in FIG.
  • Example 9 The surface of a copper plate with a smooth surface (contact angle: 90 ° or less) was etched at 50 ° C. for 45 seconds using an aqueous etchant solution (ammonium persulfate 100 g / L, 2-methylpyridine 5 g / L, methylsulfonic acid 20 g / L). Etching was performed to obtain a copper plate having a roughened surface. Next, a self-assembled monolayer of stearic acid was formed on the roughened surface of the copper plate.
  • FIG. 10 shows a laser micrograph (3D photograph) of the surface of the self-assembled monolayer of the obtained copper plate.
  • Example 10 A self-assembled monolayer of stearic acid was formed on the surface of the copper plate in the same manner as in Example 9 except that the etching time was changed to 75 seconds.
  • a laser micrograph (3D photograph) of the surface of the self-assembled monolayer of the obtained copper plate is shown in FIG. After 5 ⁇ L of pure water was dropped on the surface of the self-assembled monolayer on the copper plate by the same method as in Example 1, the contact angle of the water droplet was observed with a microscope. As a result, the contact angle was 148 °. It was confirmed.
  • Example 11 The surface of the titanium metal plate having a smooth surface (contact angle: 90 ° or less) is etched at 120 ° C. for 10 minutes using an aqueous etchant solution (hydrofluoric acid 10% by mass, nitric acid 30% by mass). A roughened titanium metal plate was obtained. Next, a self-assembled monolayer of stearic acid was formed on the roughened surface of the titanium metal plate.
  • FIG. 11 shows a laser micrograph (3D photograph) of the surface of the self-assembled monomolecular film of the obtained titanium metal plate. After dropping 5 ⁇ L of pure water onto the surface of the self-assembled monolayer on the titanium metal plate by the same method as in Example 1, the contact angle of the water droplet was observed with a microscope. It was confirmed that.

Abstract

[Problem] To provide an industrially easily practicable surface modification method for a base member by which a surface of the base member can be modified to exhibit a wide range of hydrophobicity or hydrophilicity including ultra hydrophobicity and ultra hydrophilicity. [Solution] A surface modification method for a base member comprises performing: a step of subjecting a surface of a base member to a chemical surface roughening treatment or a physical surface roughening treatment, such as a surface roughening treatment using a plating treatment, to convert the base member into a base member having a continuous fine irregular face on a surface thereof; and a step of forming a self-assembled monolayer on the surface of the base member having the continuous fine irregular face.

Description

表面の疎水性もしくは親水性が高められた基体Substrate with improved surface hydrophobicity or hydrophilicity
 本発明は、表面の疎水性もしくは親水性が高められるように改質された表面を有する基体及びその製造方法に関する。更に詳しくは、本発明は、金属材料、セラミック材料あるいは合成樹脂材料などの固体材料から形成された基体の表面を、工業的に容易に実施できる方法を用いて超撥水性から超親水性までの所望の撥水性もしくは親水性を示すように改質することができる表面改質方法及び当該方法により表面特性が改質された基体に関する。 The present invention relates to a substrate having a surface modified so as to increase the hydrophobicity or hydrophilicity of the surface and a method for producing the same. More specifically, the present invention relates to a surface of a substrate formed of a solid material such as a metal material, a ceramic material, or a synthetic resin material from a super-water-repellent to a super-hydrophilic property using a method that can be easily carried out industrially. The present invention relates to a surface modification method that can be modified so as to exhibit desired water repellency or hydrophilicity, and a substrate whose surface properties are modified by the method.
 近年、μ-TAS(Total Analysis System)と呼ばれる化学・生化学分析総合システムが開発され、微量の体液(例、血液)の分析そして各種の微量成分の分析や微量成分間の化学反応の実施に利用されるようになっている。このμ-TASは、ガラスなどの小さなサイズの基体(チップ)の表面に微小な流路(マイクロチャンネル)を形成し、その微小な流路を反応容器として利用することにより微量な試料の生化学反応や化学反応を実施することを主な目的として開発された器具である。上記の微小な流路に微量の体液などの試料液を供給する場合には、流路の表面(特に流路底面)が高い親水性を持つことが望ましく、また流路からの試料液の漏出を防ぐためには、その流路の周囲の壁部(堤部)は高い撥水性を持つことが望ましい。従って、実用性の高いμ-TASを作製するためには、固体材料からなる各種の基体の表面の特性を局所的に撥水性あるいは親水性に改質する処理を施しておくことが必要となる。 In recent years, an integrated chemical and biochemical analysis system called μ-TAS (Total Analysis System) has been developed to analyze trace body fluids (eg, blood), various trace components, and conduct chemical reactions between trace components. It has come to be used. This μ-TAS forms a micro flow channel (micro channel) on the surface of a small-sized substrate (chip) such as glass, and uses the micro flow channel as a reaction container to biochemically analyze a small amount of sample. It is an instrument developed mainly for carrying out reactions and chemical reactions. When supplying a sample liquid such as a small amount of body fluid to the above minute flow path, it is desirable that the surface of the flow path (especially the bottom surface of the flow path) has high hydrophilicity, and leakage of the sample liquid from the flow path. In order to prevent this, it is desirable that the wall portion (bank portion) around the channel has high water repellency. Therefore, in order to produce a highly practical μ-TAS, it is necessary to apply a treatment for locally modifying the surface characteristics of various substrates made of solid materials to be water-repellent or hydrophilic. .
 固体材料からなる基体の表面特性改質方法としては様々な方法が知られているが、その代表的な方法として、基体の表面に自己組織化単層膜(Self-assembled monolayer、通称SAM)を形成する方法がしられている。例えば、金属製の基体の表面の特性を高い撥水性を示すように改質することのできる表面特性改質方法について、特許文献1に記載が見られる。 Various methods are known for modifying the surface properties of a substrate made of a solid material. As a typical method, a self-assembled monolayer (commonly known as SAM) is formed on the surface of the substrate. There is a method of forming. For example, Patent Document 1 discloses a surface property modification method capable of modifying the surface properties of a metal substrate so as to exhibit high water repellency.
 特許文献1には、固体表面への吸着性を示す吸着性基と鎖状疎水性基とを有する基体吸着性化合物と官能基と鎖状疎水性基とを有し実質的に固体表面に吸着性を示さない基体非吸着性化合物とを組み合わせて用い、金属製基体などの固体の表面に吸着性化合物と非吸着性化合物とからなり、表面に官能基が露出した状態にある自己組織化単層膜(SAM)を形成することによって固体表面を改質する方法が記載されている。この特許文献1の実施例には、水接触角が25°の金表面を持つガラス板の表面に上記の改質を施すことにより、水接触角が、88°から132°の範囲にある様々な改質表面が得られることの記載がある。 In Patent Document 1, a substrate-adsorbing compound having an adsorptive group exhibiting adsorptivity to a solid surface and a chain hydrophobic group, a functional group, and a chain hydrophobic group are substantially adsorbed on the solid surface. A self-assembled unit consisting of an adsorbing compound and a non-adsorbing compound on the surface of a solid such as a metal substrate and having a functional group exposed on the surface. A method for modifying a solid surface by forming a layer film (SAM) is described. In the example of this patent document 1, the water contact angle ranges from 88 ° to 132 ° by applying the above modification to the surface of a glass plate having a gold surface with a water contact angle of 25 °. There is a description that a modified surface can be obtained.
 一方、基体の表面の特性を超撥水性から超親水性まで所望の物理的性質を示すように広い範囲で改質することのできる表面特性改質方法については、特許文献2に開示がある。 On the other hand, Patent Document 2 discloses a surface property modification method capable of modifying a surface property of a substrate in a wide range so as to exhibit desired physical properties from superhydrophobic to superhydrophilic.
 特許文献2には、フラクタル表面構造を持つ超分子組織体の除去痕跡様孔の形状を有し、その表面がフレーク状である金属複合基板と、その表面に設けられた自己組織化単分子膜(SAM)または高分子薄膜のいずれかである機能性薄膜を含む機能性金属複合基板が開示されている。そして、上記の金属複合基板の製造方法として、特定の化学構造を持つフラーレン誘導体を用いて作製されたフラーレン構造体(超分子組織体)をテンプレートとして用いて、この構造体を金属材料に転写成形することにより、超分子組織体の除去痕跡様孔の形状を備えた基体とする方法が開示されている。 Patent Document 2 discloses a metal composite substrate having a shape of a removal trace-like hole of a supramolecular organization having a fractal surface structure, and a surface of which is flake-like, and a self-assembled monolayer provided on the surface. A functional metal composite substrate comprising a functional thin film that is either (SAM) or a polymer thin film is disclosed. As a method of manufacturing the above-mentioned metal composite substrate, a fullerene structure (supermolecular structure) produced using a fullerene derivative having a specific chemical structure is used as a template, and this structure is transferred to a metal material. Thus, a method of forming a substrate having a shape of a removal trace-like hole of a supramolecular organization is disclosed.
  そして、特許文献2には、そこに開示された方法により作製された金属複合基板は、超/高親水性から超/高撥水性まで制御された濡れ性が発現するとの趣旨の記載があり、その実施例として、当該文献に記載の方法を利用することによって金属複合基板を作製し、水に対する接触角を測定した例が開示されている。これを具体的に云うと、水に対する接触角が、約11°の超親水性から、約157°の超撥水性を示す表面特性を持つ基板を得ることができたことの記載が見られる。なお、この文献の[0051]では、水との接触角を指標として、90°以上である場合を撥水性、110°以上150°未満を高撥水性、そして150°以上を超撥水性と定義している。ただし、超/高親水性に関する詳しい説明の記載は見られない。 Patent Document 2 has a description that the metal composite substrate produced by the method disclosed therein exhibits controlled wettability from super / high hydrophilicity to super / high water repellency, As an example, an example is disclosed in which a metal composite substrate is produced by using the method described in this document and the contact angle with water is measured. Specifically, it can be seen that a substrate having surface characteristics exhibiting super-water-repellency of about 157 ° can be obtained from super-hydrophilicity having a contact angle with water of about 11 °. In [0051] of this document, when the contact angle with water is used as an index, water repellency is defined as 90 ° or more, high water repellency when 110 ° or more but less than 150 °, and super water repellency when 150 ° or more. is doing. However, there is no detailed description on the super / high hydrophilicity.
特開2007-270278号公報JP 2007-270278 A 特開2010-99817号公報JP 2010-99817 A
 前述のように、特許文献2には、そこに開示の方法を利用することにより、表面に超/高親水性から超/高撥水性まで制御された濡れ性を示す基板を作製することができるとの趣旨の記載があり、その実施例も記載されている。しかしながら、この特許文献2に記載の方法は、前述のように、フラーレン誘導体が組織化されたフラーレン構造体(超分子組織体)をテンプレートとして用いることにより金属材料に超分子組織体の構造を転写して多孔性の金属基板を作製する方法であって、その作製方法により得られるのは、フラクタル表面構造を持つ超分子組織体の除去痕跡様孔の形状を有し、表面がフレーク状で金属複合基板である。従って、この金属複合基板の作製方法は、各種材料からなる基板自体の表面に超/高親水性から超/高撥水性まで制御された濡れ性を発現させるための工業的な利用が容易な方法と云うことはできない。 As described above, in Patent Document 2, by utilizing the method disclosed therein, a substrate having a controlled wettability from the super / high hydrophilicity to the super / high water repellency can be produced on the surface. There is a description to the effect, and examples thereof are also described. However, as described above, the method described in Patent Document 2 uses a fullerene structure (supermolecular structure) in which fullerene derivatives are organized as a template to transfer the structure of the supermolecular structure to a metal material. The porous metal substrate is produced by a method of obtaining a removal trace-like pore shape of a supramolecular structure having a fractal surface structure, and the surface is a flaky metal. It is a composite substrate. Therefore, this metal composite substrate manufacturing method is an industrially easy method for expressing wettability controlled from super / high hydrophilicity to super / high water repellency on the surface of the substrate itself made of various materials. I can't say that.
 従って、本発明の主な課題は、各種の予め作製された基板の表面に超/高親水性から超/高撥水性に至るまで、所望に従って制御された濡れ性を発現させるための工業的に容易に利用できる方法を提供することにある。 Therefore, the main object of the present invention is to industrially develop the wettability controlled as desired from the super / high hydrophilicity to the super / high water repellency on the surfaces of various prefabricated substrates. It is to provide an easily available method.
 本発明の発明者は、基板表面に超/高親水性から超/高撥水性まで制御された濡れ性を発現させるための工業的な利用が容易な方法を開発するために研究を続けてきた。そして、その研究の結果、まず、基板表面に、通常の平滑なメッキ層を形成するメッキ処理条件とは異なる条件にて貴金属メッキ処理を行なうことによって基体表面に連続的な微細凹凸面(粗面)を有する貴金属メッキ層を生成させ、次いでこのように連続的かつ微細な凹凸が形成された貴金属メッキ層の表面に自己組織化単分子膜(Self-Assembled Monolayer、SAM)を形成する方法によっても、基板表面の疎水性もしくは親水性を顕著に高めることができることを見出した。 The inventor of the present invention has continued research to develop an industrially easy-to-use method for developing controlled wettability from the super / high hydrophilicity to the super / high water repellency on the substrate surface. . As a result of the research, first, a continuous fine uneven surface (rough surface) is formed on the substrate surface by performing precious metal plating treatment under conditions different from the plating treatment conditions for forming a normal smooth plating layer on the substrate surface. And a method of forming a self-assembled monolayer (Self-Assembled Monolayer, SAM) on the surface of the noble metal plating layer thus formed with continuous and fine irregularities. The present inventors have found that the hydrophobicity or hydrophilicity of the substrate surface can be remarkably increased.
 本発明者は次いで、上記の連続的な微細凹凸面を有する貴金属メッキ層をの代わりに、基板表面に、先ず連続的な微細凹凸面を有する卑金属メッキ層を形成し、その後この卑金属メッキ層の上に貴金属メッキ層を形成する方法に利用することによっても、基体の表面に連続的な微細凹凸面を有する薄い貴金属メッキ層を生成させることができることも見出した。すなわち、この方法によっても、基体の表面に生成した連続的な微細凹凸面を有する薄い貴金属メッキ層の表面に自己組織化単分子膜を積層すると、同様に、基板表面の疎水性もしくは親水性を顕著に高めることができることが判明した。 The inventor then formed a base metal plating layer having a continuous fine uneven surface on the substrate surface instead of the noble metal plating layer having the continuous fine uneven surface, and then It has also been found that a thin noble metal plating layer having a continuous fine irregular surface on the surface of the substrate can also be produced by utilizing the method for forming a noble metal plating layer thereon. That is, also by this method, when a self-assembled monolayer is laminated on the surface of a thin noble metal plating layer having continuous fine irregularities generated on the surface of the substrate, similarly, the hydrophobicity or hydrophilicity of the substrate surface is increased. It has been found that it can be significantly increased.
 本発明者は更にまた、基板表面に、連続的な微細凹凸面を有する貴金属メッキ層の代わりに、連続的な微細凹凸面を有する卑金属メッキ層を形成し、その卑金属メッキ層の上に自己組織化単分子膜を直接生成させる方法によっても、基板表面の疎水性もしくは親水性を顕著に高めることができることも見出した。 The inventor further forms a base metal plating layer having a continuous fine uneven surface on the substrate surface instead of the noble metal plated layer having a continuous fine uneven surface, and self-organizes on the base metal plated layer. It has also been found that the hydrophobicity or hydrophilicity of the substrate surface can be remarkably enhanced by a method of directly forming a monomolecular film.
 本発明者は更に研究を続け、その結果、上記の基体の表面に連続的な微細凹凸面を有する貴金属あるいは卑金属のメッキ層を形成し、そのめっき層の表面の凹凸面の上に自己組織化単分子膜を形成する方法に限らず、各種の一般的な化学的粗面化処理(例、化学エッチング)あるいは物理的粗面化処理(例、レーザ照射処理、プラズマ処理)を利用することにより基板表面に連続的な微細凹凸面を形成した後、その基体の微細凹凸面の上に自己組織化単分子膜を生成させる方法によっても、基板表面の疎水性もしくは親水性を顕著に高めることができることも見出した。 The present inventor continued further research, and as a result, a precious metal or base metal plating layer having a continuous fine uneven surface was formed on the surface of the substrate, and self-organized on the uneven surface of the surface of the plated layer. Not only by the method of forming a monomolecular film, but by using various general chemical roughening treatments (eg, chemical etching) or physical roughening treatments (eg, laser irradiation treatment, plasma treatment) Even after forming a continuous fine uneven surface on the substrate surface, a method of generating a self-assembled monolayer on the fine uneven surface of the substrate can significantly increase the hydrophobicity or hydrophilicity of the substrate surface. I also found what I can do.
 即ち、本発明者の研究により、特許文献2に記載の、フラーレン誘導体が組織化されたフラーレン構造体(超分子組織体)をテンプレートとして用いることにより超分子組織体の構造を金属材料に転写する方法で作製された多孔性の基板であって、フラクタル表面構造を持つ超分子組織体の除去痕跡様孔の形状を有し、表面がフレーク状の金属複合基板でなくても、工業的な実施が容易な粗面化めっき処理により形成した連続的な微細凹凸面を有する基板表面を用いても、あるいは通常の化学的粗面化処理もしくは物理的粗面化処理を利用して形成された連続的な微細凹凸面を有する基板表面を用いることによっても、それらの連続的な微細凹凸面の上にSAMを生成させて、基板を、超/高親水性から超/高撥水性までの所望の表面特性を持つ基板に変換することができることが判明した。 That is, the structure of the supramolecular structure is transferred to a metal material by using the fullerene structure (supermolecular structure) in which fullerene derivatives are organized as described in Patent Document 2 as a template. A porous substrate manufactured by the above method, which has a shape of a removal trace-like hole of a supramolecular structure having a fractal surface structure, and even if the surface is not a flaky metal composite substrate, it is industrially implemented. Even if a substrate surface having continuous fine irregularities formed by roughening plating treatment that is easy to use is used, or is formed by using normal chemical roughening treatment or physical roughening treatment By using a substrate surface having a typical fine uneven surface, a SAM can be generated on the continuous fine uneven surface, and the substrate can be formed in a desired manner from super / high hydrophilicity to super / high water repellency. Surface characteristics It has been found that can be converted to a substrate having.
 従って、本発明により、基体の表面に、化学的粗面化処理あるいは物理的粗面化処理を施すことにより、その基体を、表面に連続的な微細凹凸面を持つ基体に変換する処理、そしてその基体の連続的な微細凹凸面を持つ表面に自己組織化単分子膜を生成させる処理を施してなる、表面が改質された基体が提供される。なお、念のため云えば、本発明における化学的粗面化処理あるいは物理的粗面化処理には、特許文献2に記載されているような、フラーレン誘導体が組織化されて形成された超分子組織体をテンプレートとして転写することにより得られた多孔性かつフラクタル表面構造を持つ超分子組織体の除去痕跡様孔の形状を持つ基体の製造のための処理を含まない。 Therefore, according to the present invention, by subjecting the surface of the substrate to chemical roughening or physical roughening, the substrate is converted into a substrate having a continuous fine uneven surface on the surface, and There is provided a substrate with a modified surface, which is obtained by subjecting a surface of the substrate having a continuous fine uneven surface to a treatment for generating a self-assembled monolayer. As a precaution, the supramolecule formed by organizing fullerene derivatives as described in Patent Document 2 is used in the chemical roughening treatment or physical roughening treatment in the present invention. It does not include a process for producing a substrate having the shape of a removal trace-like pore of a supramolecular structure having a porous and fractal surface structure obtained by transferring the structure as a template.
 また、本発明により、基体の表面に、化学的粗面化処理あるいは物理的粗面化処理を施すことにより、その基体を、表面に連続的な微細凹凸面を持つ基体に変換する処理を施す工程、そしてその基体の連続的な微細凹凸面を持つ表面に自己組織化単分子膜を生成させる処理を施す工程を含む、基体表面の疎水性もしくは親水性を高める方法も提供される。なお、念のため云えば、本発明の上記方法における化学的粗面化処理あるいは物理的粗面化処理にも、特許文献2に記載されているような、フラーレン誘導体が組織化されて形成された超分子組織体をテンプレートとして転写することにより得られた多孔性かつフラクタル表面構造を持つ超分子組織体の除去痕跡様孔の形状を持つ基体の製造のための処理を含まない。 Further, according to the present invention, the surface of the substrate is subjected to a chemical surface roughening treatment or a physical surface roughening treatment to convert the substrate into a substrate having a continuous fine uneven surface on the surface. There is also provided a method for increasing the hydrophobicity or hydrophilicity of a substrate surface, comprising a step and a step of subjecting the surface of the substrate to a surface having a continuous fine irregular surface to form a self-assembled monolayer. As a precaution, the fullerene derivative as described in Patent Document 2 is also formed in the chemical roughening treatment or the physical roughening treatment in the above method of the present invention. This method does not include a process for producing a substrate having a shape of removal trace-like pores of a supramolecular structure having a porous and fractal surface structure obtained by transferring the supramolecular structure as a template.
 なお、本発明に従って、通常の化学的粗面化処理あるいは物理的粗面化処理により表面に連続的な微細凹凸面が形成された基体の表面に自己組織化単分子膜を形成することにより、基体表面が、その表面に単に自己組織化単分子膜を積層した場合に比べて顕著に疎水性もしくは親水性が高められる理由については、現在のところ明確とは云えないが、本発明者は、基板表面が粗面化されて、その表面に連続的な微細凹凸が形成され、その結果、自己組織化単分子膜を構成する、一方の端部もしくはその付近に疎水性基あるいは親水性基を備えた基体付着性の分子の基体表面への付着量(すなわち、実際に付着する基体付着性の分子の個数)が顕著に高まったためであろうと推定している。 In accordance with the present invention, by forming a self-assembled monolayer on the surface of the substrate on which a continuous fine uneven surface is formed on the surface by a normal chemical roughening treatment or physical roughening treatment, The reason why the surface of the substrate is remarkably improved in hydrophobicity or hydrophilicity as compared with the case where the self-assembled monolayer is simply laminated on the surface is not clear at present, but the present inventor The substrate surface is roughened, and continuous fine irregularities are formed on the surface. As a result, a hydrophobic group or a hydrophilic group is formed at or near one end of the self-assembled monolayer. It is estimated that this is because the amount of the substrate-adhering molecules provided on the surface of the substrate (that is, the number of molecules actually adhering to the substrate) significantly increased.
 また、表面積が増加した分、基体表面に付着する自己組織化単分子膜の構成分子の付着量が高まるとともに、連続的な微細凹凸面の微細な凹凸構造に妨げられることなく、自己組織化単分子膜(SAM)の構成分子が微細凹凸面に高い配向性にて緻密に付着することが可能となり、他方の端部に備えられた疎水性基あるいは官能基が外側に整列露出した極薄のSAM膜(数μm厚)が生成し、その結果、Youngの式あるいはWenzelの式等に示される効果が発現するためであろうと推定している。 In addition, as the surface area increases, the amount of the constituent molecules of the self-assembled monolayer adhering to the substrate surface increases, and the self-assembled monolayer is not hindered by the fine uneven structure of the continuous fine uneven surface. The constituent molecules of the molecular film (SAM) can be densely attached to the fine concavo-convex surface with high orientation, and the hydrophobic group or functional group provided at the other end is aligned and exposed to the outside. It is estimated that this is because the SAM film (several μm thick) is formed, and as a result, the effects shown in Young's formula or Wenzel's formula appear.
 なお、本明細書では、特許文献2に記載の定義に準じて、水との接触角を指標として、90°以上である場合を撥水性、110°以上、150°未満を高撥水性、そして150°以上を超撥水性とする。同様に、水との接触角を指標として、90°未満である場合を親水性、70°未満、30°以上である場合を高親水性、そして30°未満である場合を超親水性と定義する。 In the present specification, according to the definition described in Patent Document 2, the contact angle with water is used as an index, the water repellency is 90 ° or more, the water repellency is 110 ° or more and less than 150 °, and the water repellency is high. The super water-repellent property is 150 ° or more. Similarly, when the contact angle with water is used as an index, the case of less than 90 ° is defined as hydrophilic, the case of less than 70 °, 30 ° or more is defined as highly hydrophilic, and the case of less than 30 ° is defined as superhydrophilic. To do.
 本発明の表面の疎水性もしくは親水性が高められた基体及びその製造方法の好ましい態様を以下に記載する。
(1)化学的粗面化処理あるいは物理的粗面化処理が、めっき処理(化学めっき処理)、化学的エッチング(基体表面を、化学腐食剤、電解研磨あるいは真空中高温加熱などを施し粗面化する処理)、陽極酸化処理、及びレーザ照射からなる群から選ばれる処理又はそれらの組み合わせである。
(2)化学的粗面化処理あるいは物理的粗面化処理が、基体表面への卑金属めっき処理による連続的な微細凹凸を有する卑金属めっき層の積層処理と、その連続的な微細凹凸を有する卑金属めっき層の表面への貴金属めっき層の積層処理との組み合わせにより行われる処理である。
(3)化学的粗面化処理あるいは物理的粗面化処理が、少なくとも金めっき処理に代表される貴金属めっき処理である。
(4)化学的粗面化処理あるいは物理的粗面化処理が、少なくとも金めっき処理に代表される貴金属めっき処理であって、生成する貴金属めっき層の厚さが、0.05-10μmの範囲、好ましくは0.1-6μmの範囲、特に好ましくは0.5ー5μmの範囲にある。
(5)基体が、アルミニウム板、ステンレススチール板、銅板、チタン金属板などの金属製基体である。
(6)基体がガラス板、シリカ板などのセラミック製基体である
(7)基体がプラスチック製基体である。
(8)基体が、貴金属層を備えた、あるいは卑金属めっき処理もしくは貴金属めっき処理を施した金属製基体、セラミック製基体、もしくはプラスチック製基体である。
(9)連続的な微細凹凸面を構成する凸部の半値幅と高さの平均値がいずれも0.005-100μmの範囲、好ましくは0.01-10μm、特に好ましくは0.05-5μmの範囲にある。
(10)連続的な微細凹凸面を構成する凸部が略円錐形状にある。
(11)基体が板状基体、棒状基体もしくは管状基体である。
(12)自己組織化単分子膜が、一方の末端にチオール基を持ち、他方の末端に親水性基を持つ化合物、両末端にカルボキシル基を持つジスルフィド化合物、一方の末端にカルボキシル基を持ち、他方の末端に臭素原子を持つ化合物とチオ尿素との反応により生成したチオール化合物、アルカンチオール化合物、そして一方の末端にカルボキシル基を持ち、他方の末端に疎水性基を持つ化合物からなる群より選ばれる化合物から構成されている。
(13)自己組織化単分子膜が、一方の末端にチオール基を持ち、他方の末端に親水性基を持つ化合物、両末端にカルボキシル基を持つジスルフィド化合物、一方の末端にカルボキシル基を持ち、他方の末端に臭素原子を持つ化合物とチオ尿素との反応により生成したチオール化合物からなる群より選ばれる硫黄原子含有化合物から構成されていて、自己組織化単分子膜の表面が高められた親水性を示す。
(14)自己組織化単分子膜が、アルカンチオール化合物もしくは一方の末端にカルボキシル基を持ち、他方の末端に疎水性基を持つ化合物から構成されていて、自己組織化単分子膜の表面が高められた疎水性を示す。
The preferred embodiments of the substrate having improved hydrophobicity or hydrophilicity on the surface of the present invention and the production method thereof will be described below.
(1) Chemical roughening treatment or physical roughening treatment is performed by plating treatment (chemical plating treatment), chemical etching (substrate surface is subjected to chemical corrosion agent, electrolytic polishing or high temperature heating in vacuum, etc.) The treatment selected from the group consisting of anodizing treatment, anodizing treatment, and laser irradiation, or a combination thereof.
(2) Chemical roughening treatment or physical roughening treatment is performed by laminating a base metal plating layer having continuous fine unevenness by base metal plating treatment on the substrate surface, and a base metal having continuous fine unevenness. This is a treatment performed in combination with a lamination treatment of a noble metal plating layer on the surface of the plating layer.
(3) The chemical roughening treatment or the physical roughening treatment is a noble metal plating treatment represented by at least a gold plating treatment.
(4) The chemical roughening treatment or the physical roughening treatment is at least a noble metal plating treatment represented by a gold plating treatment, and the thickness of the noble metal plating layer to be generated is in the range of 0.05 to 10 μm. Preferably, it is in the range of 0.1-6 μm, particularly preferably in the range of 0.5-5 μm.
(5) The substrate is a metal substrate such as an aluminum plate, a stainless steel plate, a copper plate, or a titanium metal plate.
(6) The substrate is a ceramic substrate such as a glass plate or a silica plate. (7) The substrate is a plastic substrate.
(8) The base is a metal base, a ceramic base, or a plastic base provided with a noble metal layer or subjected to base metal plating or noble metal plating.
(9) The average value of the full width at half maximum and height of the convex portions constituting the continuous fine uneven surface is in the range of 0.005 to 100 μm, preferably 0.01 to 10 μm, particularly preferably 0.05 to 5 μm. It is in the range.
(10) The convex part which comprises a continuous fine uneven surface has a substantially cone shape.
(11) The substrate is a plate-shaped substrate, a rod-shaped substrate, or a tubular substrate.
(12) The self-assembled monolayer has a thiol group at one end and a hydrophilic group at the other end, a disulfide compound having a carboxyl group at both ends, a carboxyl group at one end, Selected from the group consisting of a compound having a bromine atom at the other end and a thiol compound, alkanethiol compound produced by the reaction of thiourea, and a compound having a carboxyl group at one end and a hydrophobic group at the other end It is made up of compounds.
(13) The self-assembled monolayer has a thiol group at one end, a hydrophilic group at the other end, a disulfide compound having a carboxyl group at both ends, a carboxyl group at one end, It is composed of a sulfur atom-containing compound selected from the group consisting of thiol compounds produced by the reaction of a compound having a bromine atom at the other end with thiourea, and has a hydrophilic surface with an enhanced surface of the self-assembled monolayer Indicates.
(14) The self-assembled monolayer is composed of an alkanethiol compound or a compound having a carboxyl group at one end and a hydrophobic group at the other end, and the surface of the self-assembled monolayer is increased. The hydrophobicity is shown.
 本発明の方法を利用することにより、特許文献2に記載の「フラーレン誘導体が組織化されたフラーレン構造体(超分子組織体)をテンプレートとして用いることにより超分子組織体の構造が転写された作製された多孔性の基板であって、フラクタル表面構造を持つ超分子組織体の除去痕跡様孔の形状を有し、表面がフレーク状の金属複合基板」を利用しなくとも、基板表面に、工業的な実施が容易なめっき処理を含む化学的粗面化処理あるいは物理的粗面化処理による連続的な微細凹凸面を形成する方法を利用し、その表面に自己組織化単分子膜(SAM)を生成させることにより、基板の疎水性もしくは親水性が高められ、その結果、超/高親水性から超/高撥水性までの所望の表面特性を持つ基板の作製が可能となる。 By using the method of the present invention, “a fullerene structure in which fullerene derivatives are organized (supermolecular tissue) is used as a template, and the structure of the supramolecular tissue is transferred. Porous substrate with a fractal surface structure and the shape of traces of supramolecular structures, and without using a flaky metal composite substrate. A self-assembled monolayer (SAM) is formed on the surface using a method of forming continuous fine irregularities by chemical or physical roughening, including plating that is easy to implement As a result, the hydrophobicity or hydrophilicity of the substrate is increased, and as a result, it is possible to produce a substrate having desired surface characteristics from super / high hydrophilicity to super / high water repellency.
表面が平滑な金箔表面を基体とし、この基体の表面に、シアン化金カリウムを金換算で10g/Lの濃度で含む金メッキ液を用い、電流密度を2A/dm2としたメッキ処理を施すことにより連続的な微細凹凸に有する金メッキ層を生成させ、次いでその凹凸面の上に自己組織化単分子膜を形成した基体の表面の電子顕微鏡写真(×3000)である。The surface of the gold foil with a smooth surface is used as a base, and the surface of the base is subjected to a plating treatment using a gold plating solution containing potassium gold cyanide at a concentration of 10 g / L in terms of gold and a current density of 2 A / dm 2. 4 is an electron micrograph (× 3000) of the surface of a substrate on which a gold plating layer having continuous fine irregularities is generated, and then a self-assembled monolayer is formed on the irregular surface. 図1の基体の表面に純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果を示す図である。It is a figure which shows the result of having observed the contact angle of the water droplet with the microscope, after dripping 5 microliters of pure waters on the surface of the base | substrate of FIG. 表面が平滑な金箔表面を基体とし、この基体の表面に、シアン化金カリウムを金換算で5g/Lの濃度で含む金メッキ液を用い、電流密度を100mA/dm2としたメッキ処理を施すことにより連続的な微細凹凸に有する金メッキ層を生成させ、次いでその凹凸面の上に自己組織化単分子膜を形成した基体の表面の電子顕微鏡写真(×3000)である。The surface of the gold foil with a smooth surface is used as a base, and the surface of the base is plated with a gold plating solution containing potassium gold cyanide at a concentration of 5 g / L in terms of gold and the current density is 100 mA / dm 2. 4 is an electron micrograph (× 3000) of the surface of a substrate on which a gold plating layer having continuous fine irregularities is generated, and then a self-assembled monolayer is formed on the irregular surface. 図3の基体の表面に純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果を示す図である。It is a figure which shows the result of having observed the contact angle of the water droplet with the microscope, after dripping 5 microliters of pure waters on the surface of the base | substrate of FIG. 表面が平滑な金箔表面を基体とし、この基体の表面に、シアン化金カリウムを金換算で2g/Lの濃度で含む金メッキ液を用い、電流密度を3A/dm2としたメッキ処理を施すことにより連続的な微細凹凸に有する金メッキ層を生成させ、次いでその凹凸面の上に自己組織化単分子膜を形成した基体の表面の電子顕微鏡写真(×3000)である。The surface of the gold foil with a smooth surface is used as a base, and the surface of the base is plated with a gold plating solution containing potassium gold cyanide at a concentration of 2 g / L in terms of gold and the current density is 3 A / dm 2. 4 is an electron micrograph (× 3000) of the surface of a substrate on which a gold plating layer having continuous fine irregularities is generated, and then a self-assembled monolayer is formed on the irregular surface. 図5の基体の表面に純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果を示す図である。It is a figure which shows the result of having observed the contact angle of the water droplet with the microscope, after dripping 5 microliters of pure waters on the surface of the base | substrate of FIG. 表面が平滑な白金箔表面を基体とし、この基体の表面に、ジニトロジアミン白金を白金換算で10g/Lの濃度で含む白金メッキ液を用い、電流密度を3A/dm2としたメッキ処理を施すことにより連続的な微細凹凸に有する白金メッキ層を生成させ、次いでその凹凸面の上に自己組織化単分子膜を形成した基体の表面の電子顕微鏡写真(×3000)である。The surface of the platinum foil having a smooth surface is used as a base, and the surface of the base is subjected to a plating treatment using a platinum plating solution containing dinitrodiamine platinum at a concentration of 10 g / L in terms of platinum and a current density of 3 A / dm 2. 4 is an electron micrograph (× 3000) of the surface of a substrate in which a platinum plating layer having continuous fine irregularities is generated, and then a self-assembled monolayer is formed on the irregular surface. 図7の基体の表面に純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果を示す図である。It is a figure which shows the result of having observed the contact angle of the water droplet with the microscope, after dripping 5 microliters of pure waters on the surface of the base | substrate of FIG. 実施例8で基体上に生成した積層ニッケルめっき層と薄層金めっき層とからなるめっき層の微細凹凸面の電子顕微鏡写真である。It is an electron micrograph of the fine uneven surface of the plating layer which consists of the lamination nickel plating layer and thin gold plating layer which were generated on the base in Example 8. 実施例9で作製した、エッチング済(45秒間エッチング)の銅板の表面にステアリン酸自己組織化単分子膜の表面のレーザー顕微鏡写真(3D写真)である。It is a laser microscope photograph (3D photograph) of the surface of a stearic acid self-assembled monolayer on the surface of an etched copper plate (etched for 45 seconds) produced in Example 9. 実施例10で作製した、エッチング済(75秒間エッチング)の銅板の表面にステアリン酸自己組織化単分子膜の表面のレーザー顕微鏡写真(3D写真)である。It is a laser microscope photograph (3D photograph) of the surface of a stearic acid self-assembled monolayer on the surface of an etched copper plate (etched for 75 seconds) produced in Example 10. 実施例11で作製した、エッチング済(10分間エッチング)のチタン板の表面にステアリン酸自己組織化単分子膜の表面のレーザー顕微鏡写真(3D写真)である。It is a laser microscope photograph (3D photograph) of the surface of a stearic acid self-assembled monolayer on the surface of an etched titanium plate (etched for 10 minutes) produced in Example 11.
 次に、本発明を実施するための各種の材料および処理方法などを詳しく説明する。 Next, various materials and processing methods for carrying out the present invention will be described in detail.
 本発明で用いられる基体は通常の温度で固体を示す材料からなり、一般には、金や白金などの貴金属、鉄、銅、ニッケル、チタン(チタン金属)、真鍮などの卑金属などの金属、あるいはガラス、シリカなどのセラミックから形成された基板であるが、目的によっては、プラスチック製あるいは各種の複合材料からなる基体を用いることができる。これらの基体は、所望により、予めめっき処理などを利用した前処理(被膜の形成を含む)が施されていてもよい。なお、基体の具体的な例については、特許文献1や特許文献2に記載があるので、それらの特許文献の記載を本明細書の記載とする。 The substrate used in the present invention is made of a material that shows a solid at a normal temperature, and is generally a precious metal such as gold or platinum, a metal such as iron, copper, nickel, titanium (titanium metal), a base metal such as brass, or glass. The substrate is made of ceramic such as silica, but depending on the purpose, a substrate made of plastic or various composite materials can be used. These substrates may be pretreated (including the formation of a film) using a plating treatment or the like in advance if desired. Since specific examples of the substrate are described in Patent Document 1 and Patent Document 2, the description of these Patent Documents is described in this specification.
 基体は、板状基体、棒状基体もしくは管状基体のいずれであっても良い。板状基体は表面が平面であっても、全体的もしくは部分的な曲面を備えていても良い。また、μ-TAS(Total Analysis System)と呼ばれる化学・生化学分析総合システムのように、基体表面に各種の構造物が形成されていても良い。 The substrate may be a plate-shaped substrate, a rod-shaped substrate, or a tubular substrate. The plate-like substrate may have a flat surface, or may have an entire or partial curved surface. In addition, various structures may be formed on the surface of the substrate like a chemical / biochemical analysis integrated system called μ-TAS (Total Analysis System).
 本発明で基体表面に連続的な微細凹凸面を形成する手段に特に限定はなく、通常の工業的処理として採用が容易な化学的粗面化処理(化学めっき処理も含む)あるいは物理的粗面化処理が利用される。 In the present invention, there is no particular limitation on the means for forming a continuous fine uneven surface on the surface of the substrate, and a chemical roughening treatment (including chemical plating treatment) or a physical rough surface that can be easily adopted as a normal industrial treatment. Is used.
 本発明で利用可能な化学的粗面化処理あるいは物理的粗面化処理としては、前述のめっき処理(特に化学めっき処理)、化学的エッチング処理(特に化学薬品を用いて基体表面を粗面化する処理)、陽極酸化処理、レーザ照射処理などを挙げることができるが、これらに限定されるものではない。なお、めっき処理は、通常は平滑表面を持つめっき層を形成する処理であるが、めっき条件(めっき液の化学組成、めっき液中の化学成分濃度、電流密度、めっき処理時間等)を調整することにより表面が平滑ではないめっき層が形成されることは当業者が知るところである。また、各種の化学的粗面化処理あるいは物理的粗面化処理を組み合わせて用いることもできる。 The chemical roughening treatment or physical roughening treatment that can be used in the present invention includes the above-described plating treatment (especially chemical plating treatment) and chemical etching treatment (especially using chemicals to roughen the substrate surface). Treatment), anodization treatment, laser irradiation treatment, and the like, but are not limited thereto. The plating treatment is usually a treatment for forming a plating layer having a smooth surface, but the plating conditions (chemical composition of the plating solution, chemical component concentration in the plating solution, current density, plating treatment time, etc.) are adjusted. Those skilled in the art know that a plating layer having a non-smooth surface is formed. Further, various chemical roughening treatments or physical roughening treatments may be used in combination.
 また、金属製基体などの基体の表面に、予め表面に連続的な微細凹凸を有する卑金属めっき層(例、ニッケルめっき層)を生成させた後、次いでその卑金属メッキ層の表面に薄い貴金属めっき層を形成することにより、最終的に表面に連続的な微小凹凸が形成された貴金属めっき層を形成させる方法も有利に利用できる。この方法を利用した場合には、高価な貴金属の使用量を抑制することが可能になるため、本発明の方法は、工業的な実施のためには非常に有利な方法となる。 In addition, after a base metal plating layer (eg, nickel plating layer) having continuous fine irregularities on the surface of a base such as a metal base is generated in advance, a thin noble metal plating layer is then formed on the surface of the base metal plating layer. A method of forming a noble metal plating layer in which continuous minute irregularities are finally formed on the surface can be advantageously used. When this method is used, the amount of expensive noble metal used can be suppressed, so that the method of the present invention is a very advantageous method for industrial implementation.
 粗面化処理が、金めっき処理に代表される貴金属めっき処理である場合、生成する貴金属めっき層の厚さは、0.05-10μmの範囲にあることが好ましく、さらに、好ましくは0.1-6μmの範囲にあり、特に好ましくは0.5ー5μmの範囲にある。
 また、基体表面に形成される連続的な微細凹凸面を構成する凸部の半値幅と高さの平均値は、いずれについても、0.005-100μmの範囲にあることが好ましく、さらに好ましくは0.01-10μmの範囲に、特に好ましくは0.05-5μmの範囲にある。
When the roughening treatment is a noble metal plating treatment typified by a gold plating treatment, the thickness of the produced noble metal plating layer is preferably in the range of 0.05-10 μm, more preferably 0.1 It is in the range of −6 μm, particularly preferably in the range of 0.5-5 μm.
Further, the average value of the full width at half maximum and the height of the convex portions constituting the continuous fine irregular surface formed on the substrate surface is preferably in the range of 0.005 to 100 μm, more preferably It is in the range of 0.01-10 μm, particularly preferably in the range of 0.05-5 μm.
 一方の端部もしくはその近傍に疎水性基あるいは親水性基を持ち、他方の端部もしくはその近傍あるいは分子内に基体表面に強い親和性を持つ極性基を持つ鎖状分子を用い、主として液相にて反応させて基体表面に自己組織化単分子膜(SAM)を形成する方法は、基体の表面特性を改質する技術として以前より知られており、例えば、前記の特許文献1や特許文献2に詳しい記載がある。従って、特許文献1や特許文献2の記載内容は本明細書の記載とする。 A chain molecule having a hydrophobic group or hydrophilic group at one end or in the vicinity thereof and a polar group having a strong affinity for the substrate surface in the other end or in the vicinity or in the molecule is mainly used as a liquid phase. The method of forming a self-assembled monolayer (SAM) on the surface of a substrate by reacting with a substrate has been known for some time as a technique for modifying the surface characteristics of the substrate. For example, the above-mentioned Patent Document 1 and Patent Document There is a detailed description in 2. Therefore, the contents described in Patent Document 1 and Patent Document 2 are described in this specification.
 本発明の粗面化処理された基板の上に形成される自己組織化単分子膜を構成する化合物(鎖状分子)の例としては、下記の化合物を挙げることができる。 Examples of compounds (chain molecules) constituting the self-assembled monolayer formed on the roughened substrate of the present invention include the following compounds.
 一方の末端にチオール基を持ち、他方の末端に親水性基を持つ化合物;
 両末端にカルボキシル基を持つジスルフィド化合物;
 一方の末端にカルボキシル基を持ち、他方の末端に臭素原子を持つ化合物とチオ尿素との反応により生成したチオール化合物;
 アルカンチオール化合物、そして一方の末端にカルボキシル基を持ち、他方の末端に疎水性基を持つ化合物。
A compound having a thiol group at one end and a hydrophilic group at the other end;
Disulfide compounds having carboxyl groups at both ends;
A thiol compound formed by the reaction of a compound having a carboxyl group at one end and a bromine atom at the other end with thiourea;
An alkanethiol compound and a compound having a carboxyl group at one end and a hydrophobic group at the other end.
 なお、粗面化処理された基体に設けられる自己組織化単分子膜の表面が高められた親水性を示すようにするためには、自己組織化単分子膜を、一方の末端にチオール基を持ち、他方の末端に親水性基を持つ化合物、両末端にカルボキシル基を持つジスルフィド化合物、一方の末端にカルボキシル基を持ち、他方の末端に臭素原子を持つ化合物とチオ尿素との反応により生成したチオール化合物からなる群より選ばれる硫黄原子含有化合物から構成することが望ましい。 In order for the surface of the self-assembled monolayer provided on the roughened substrate to exhibit enhanced hydrophilicity, a self-assembled monolayer is provided with a thiol group at one end. It is formed by the reaction of a compound with a hydrophilic group at the other end, a disulfide compound with a carboxyl group at both ends, a compound having a carboxyl group at one end and a bromine atom at the other end, and thiourea It is desirable to comprise a sulfur atom-containing compound selected from the group consisting of thiol compounds.
 粗面化処理された基体に設けられる自己組織化単分子膜の表面が高められた疎水性を示すようにするためには、自己組織化単分子膜を、アルカンチオール化合物もしくは一方の末端にカルボキシル基を持ち、他方の末端に疎水性基を持つ化合物から構成することが望ましい。 In order for the surface of the self-assembled monolayer provided on the roughened substrate to exhibit an increased hydrophobicity, the self-assembled monolayer may be converted to an alkanethiol compound or a carboxyl at one end. It is desirable to comprise a compound having a group and a hydrophobic group at the other end.
[実施例1]
 表面が平滑な金箔を基体とし、この基体の表面に下記の金めっき液を用いてめっき処理を施すことにより表面に連続的な微細凹凸に有する金めっき層を生成させた。
 金めっき液組成(pH 6~8):
  シアン化金カリウム 10g/L(金として)
  リン酸二水素カリウム 60g/L
  クエン酸カリウム 60g/L
 温度:60℃
 電流密度:2A/dm2
 通電時間:5分間
[Example 1]
A gold foil having a smooth surface was used as a base, and the surface of the base was plated using the following gold plating solution to form a gold plating layer having continuous fine irregularities on the surface.
Gold plating solution composition (pH 6-8):
Potassium cyanide potassium 10g / L (as gold)
Potassium dihydrogen phosphate 60g / L
Potassium citrate 60g / L
Temperature: 60 ° C
Current density: 2 A / dm 2
Energizing time: 5 minutes
 次いでオクタデカンチオール3mM溶液を用い、この溶液に上記の金めっき層を含む基体を48時間浸漬させたのち乾燥させることにより、基体の金めっき層の凹凸面の上にオクタデカンチオールの自己組織化単分子膜を生成させた。得られた基体表面の電子顕微鏡写真(×3000)を図1に示す。表面に連続的な微細凹凸が形成されていることが観察される。
 図1に示した基体の表面に純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果を図2に示す。図2から分かるように、観察された接触角は157°であった。
Next, the octadecanethiol 3 mM solution was used, and the substrate containing the above gold plating layer was immersed in this solution for 48 hours and then dried, so that the self-organized monomolecule of octadecanethiol was formed on the uneven surface of the gold plating layer of the substrate. A membrane was formed. FIG. 1 shows an electron micrograph (× 3000) of the obtained substrate surface. It is observed that continuous fine irregularities are formed on the surface.
FIG. 2 shows the result of observing the contact angle of water droplets with a microscope after 5 μL of pure water was dropped on the surface of the substrate shown in FIG. As can be seen from FIG. 2, the observed contact angle was 157 °.
[実施例2]
 金メッキ液組成の金濃度を5g/Lに変更し、電流密度を100mA/dm2に変更した以外は、実施例1と同じメッキ処理を実施することにより、表面に凹凸に有する金メッキ層(厚さ:約3μm)を生成させた基体を得た後、この基体の表面に、同じく実施例1記載の方法により自己組織化単分子膜を形成した。得られた基体表面の電子顕微鏡写真(×3000)を図3に示す。表面に連続的な微細凹凸(凸部の半値幅と高さの平均値:約1μm)が形成されていることが観察される。
 図3に示した基体の表面の水に対する接触角を実施例1に記載の方法により観察した結果を図4に示す。図4から分かるように、観察された接触角は147°であった。
[Example 2]
By performing the same plating treatment as in Example 1 except that the gold concentration of the gold plating solution composition was changed to 5 g / L and the current density was changed to 100 mA / dm 2 , the gold plating layer (thickness) having unevenness on the surface : About 3 μm) was obtained, and then a self-assembled monolayer was formed on the surface of the substrate by the method described in Example 1. FIG. 3 shows an electron micrograph (× 3000) of the obtained substrate surface. It is observed that continuous fine irregularities (average value of half width and height of convex portion: about 1 μm) are formed on the surface.
The result of observing the contact angle of the substrate surface shown in FIG. 3 with water by the method described in Example 1 is shown in FIG. As can be seen from FIG. 4, the observed contact angle was 147 °.
[実施例3]
 金メッキ液組成の金濃度を2g/Lに変更し、電流密度を3A/dm2に変更した以外は、実施例1と同じメッキ処理を実施することにより、表面に凹凸に有する金メッキ層を生成させた基体を得た後、この基体の表面に、同じく実施例1記載の方法により自己組織化単分子膜を形成した。得られた基体表面の電子顕微鏡写真(×3000)を図5に示す。表面に連続的な微細凹凸が形成されていることが観察される。
 図5に示した基体の表面の水に対する接触角を実施例1に記載の方法により観察した結果を図6に示す。図6から分かるように、観察された接触角は161°であった。
[Example 3]
Except for changing the gold concentration of the gold plating solution to 2 g / L and changing the current density to 3 A / dm 2 , the same plating treatment as in Example 1 was performed to generate a gold plating layer having irregularities on the surface. After obtaining the substrate, a self-assembled monolayer was formed on the surface of the substrate by the method described in Example 1. FIG. 5 shows an electron micrograph (× 3000) of the obtained substrate surface. It is observed that continuous fine irregularities are formed on the surface.
FIG. 6 shows the result of observing the contact angle of the surface of the substrate shown in FIG. 5 with water by the method described in Example 1. As can be seen from FIG. 6, the observed contact angle was 161 °.
[実施例4]
 表面が平滑な白金箔を基体とし、この基体の表面に下記の白金メッキ液を用い、メッキ処理を施すことにより凹凸に有する白金メッキ層を生成させた。
 白金メッキ液組成(pH 9~10):
  ジニトロジアミン白金 10g/L(白金として)
  硝酸アンモニウム 100g/L
  亜硝酸ナトリウム 10g/L
  水酸化アンモニウム 55g/L
  クエン酸カリウム 60g/L
 温度:90℃
 電流密度:3A/dm2
 通電時間:5分間
[Example 4]
Using a platinum foil having a smooth surface as a base, the following platinum plating solution was applied to the surface of the base, and a platinum plating layer having irregularities was formed by plating.
Platinum plating solution composition (pH 9-10):
Dinitrodiamine platinum 10g / L (as platinum)
Ammonium nitrate 100g / L
Sodium nitrite 10g / L
Ammonium hydroxide 55g / L
Potassium citrate 60g / L
Temperature: 90 ° C
Current density: 3 A / dm 2
Energizing time: 5 minutes
 次いでオクタデカンチオール3mM溶液を用い、この溶液に上記の白金メッキ層形成基体を48時間浸漬させたのち乾燥させることにより、基体の白金メッキ層の凹凸面の上に自己組織化単分子膜を形成した。得られた基体表面の電子顕微鏡写真(×3000)を図7に示す。表面に連続的な微細凹凸が形成されていることが観察される。
 図7に示した基体の表面に純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果を図8に示す。図8から分かるように、観察された接触角は137°であった。
Next, a 3 mM octadecanethiol solution was used, and the platinum plating layer-forming substrate was immersed in this solution for 48 hours and then dried to form a self-assembled monolayer on the uneven surface of the platinum plating layer of the substrate. . FIG. 7 shows an electron micrograph (× 3000) of the obtained substrate surface. It is observed that continuous fine irregularities are formed on the surface.
FIG. 8 shows the result of observing the contact angle of water droplets with a microscope after 5 μL of pure water was dropped on the surface of the substrate shown in FIG. As can be seen from FIG. 8, the observed contact angle was 137 °.
[実施例5]
 表面が平滑なアルミニウム板を基体とし、この基体の表面に陽極酸化処理とアルカリエッチングとを施して連続的な微細凹凸面を形成し、この凹凸面が形成されたアルミニウム板をステアリン酸溶液に浸漬させることにより、自己組織化単分子膜を形成した。得られた自己組織化単分子膜の表面の水に対する接触角を実施例1と同じ方法により観察したところ、150°を越える接触角が観察された。
[Example 5]
An aluminum plate with a smooth surface is used as a base, and the surface of the base is subjected to anodization and alkali etching to form a continuous fine uneven surface, and the aluminum plate with the uneven surface formed is immersed in a stearic acid solution. By doing so, a self-assembled monolayer was formed. When the contact angle of the surface of the obtained self-assembled monolayer with respect to water was observed by the same method as in Example 1, a contact angle exceeding 150 ° was observed.
[実施例6]
 表面が平滑な黄銅板に厚さ0.5~3μmのニッケルめっきを施した基体を用い、この基体の表面にレーザ処理により凹凸面を形成した。この凹凸面が形成された基体を15-カルボキシ-1-ペンタデカンチオール3mM(エタノール溶液)に16時間浸漬させて、自己組織化単分子膜を形成した。得られた自己組織化単分子膜の表面の実施例1と同様な方法により純水を滴下したところ、水は素早く広がった。従って、水に対する接触角は15°未満であると判断された。
[Example 6]
Using a brass plate having a smooth surface and nickel plating having a thickness of 0.5 to 3 μm, an uneven surface was formed on the surface of the substrate by laser treatment. The substrate on which the irregular surface was formed was immersed in 3 mM 15-carboxy-1-pentadecanethiol (ethanol solution) for 16 hours to form a self-assembled monolayer. When pure water was dropped by the same method as in Example 1 on the surface of the obtained self-assembled monolayer, the water spread quickly. Therefore, the contact angle with water was determined to be less than 15 °.
[実施例7]
 表面が平滑な黄銅板に厚さ0.5~3μmのニッケルめっきを施した基体を用い、この基体の表面にレーザ処理により凹凸面を形成した。この凹凸面が形成された基体を2-アミノエタンチオール3mM(エタノール溶液)に16時間浸漬させて、自己組織化単分子膜を形成した。得られた自己組織化単分子膜の表面の実施例1と同様な方法により純水を滴下したところ、水は素早く広がった。従って、水に対する接触角は15°未満であると判断された。
[Example 7]
Using a brass plate having a smooth surface and nickel plating having a thickness of 0.5 to 3 μm, an uneven surface was formed on the surface of the substrate by laser treatment. The substrate on which the uneven surface was formed was immersed in 3 mM 2-aminoethanethiol (ethanol solution) for 16 hours to form a self-assembled monolayer. When pure water was dropped by the same method as in Example 1 on the surface of the obtained self-assembled monolayer, the water spread quickly. Therefore, the contact angle with water was determined to be less than 15 °.
[実施例8]
 表面が平滑なステンレス板(SUS304板)の表面(接触角:90°以下)に、まずウッド浴とワット浴とを用いて一層目のニッケルめっき層を生成させ、次いで塩化浴を用いて二層目のニッケルめっき層を生成させることにより、表面に連続的な微細凹凸を有する積層ニッケルめっき層を生成させ、次いで、この積層ニッケルめっき層の表面にシアン化めっき浴を用いて薄層の連続的な微細凹凸を持つ金めっき層(厚さ:約0.1μm)を生成させた。得られた基体の金めっき層の表面の電子顕微鏡写真を図9に示す。表面に、凸部が略円錐形状の連続的な微細凹凸(主な凸部の高さ:約0.9μm-約1.6μm)が生成していることが観察される。
 作製した積層ニッケルめっき層と薄層金めっき層とが順次形成された基板について、実施例1と同様の処理を利用して、金めっき層表面にオクタデカンチオールの自己組織化単分子膜を生成させた。
 基板上の自己組織化単分子膜の表面に、実施例1と同様な方法により純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果を、接触角は154°(10回の測定の平均値)であることが確認された。
[Example 8]
On the surface (contact angle: 90 ° or less) of a smooth stainless steel plate (SUS304 plate), a first nickel plating layer is first formed using a wood bath and a watt bath, and then a second layer using a chloride bath. By generating a nickel plating layer of the eye, a multilayer nickel plating layer having continuous fine irregularities on the surface is generated, and then a continuous layer of a thin layer is formed using a cyanide plating bath on the surface of the multilayer nickel plating layer. A gold plating layer (thickness: about 0.1 μm) having fine irregularities was generated. An electron micrograph of the surface of the gold plating layer of the obtained substrate is shown in FIG. It is observed that continuous fine irregularities (the height of the main convex portion: about 0.9 μm to about 1.6 μm) are generated on the surface.
Using the same processing as in Example 1, a self-assembled monomolecular film of octadecanethiol was formed on the surface of the gold plating layer on the substrate on which the laminated nickel plating layer and the thin gold plating layer were sequentially formed. It was.
After 5 μL of pure water was dropped on the surface of the self-assembled monolayer on the substrate by the same method as in Example 1, the contact angle of the water droplet was observed with a microscope. It was confirmed that the average value of the measurement of the first time).
[実施例9]
 表面が平滑な銅板の表面(接触角:90°以下)を、エッチング剤水溶液(過硫酸アンモニウム100g/L、2-メチルピリジン5g/L、メチルスルホン酸20g/L)用いて、50℃、45秒間のエッチングを行い、表面が粗面化された銅板を得た。次いで、この銅板の粗面化された表面にステアリン酸の自己組織化単分子膜を生成させた。得られた銅板の自己組織化単分子膜表面のレーザー顕微鏡写真(3D写真)を図10に示す。
 上記銅板上の自己組織化単分子膜の表面に、実施例1と同様な方法により純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果、接触角は134°であることが確認された。
[Example 9]
The surface of a copper plate with a smooth surface (contact angle: 90 ° or less) was etched at 50 ° C. for 45 seconds using an aqueous etchant solution (ammonium persulfate 100 g / L, 2-methylpyridine 5 g / L, methylsulfonic acid 20 g / L). Etching was performed to obtain a copper plate having a roughened surface. Next, a self-assembled monolayer of stearic acid was formed on the roughened surface of the copper plate. FIG. 10 shows a laser micrograph (3D photograph) of the surface of the self-assembled monolayer of the obtained copper plate.
After 5 μL of pure water was dropped on the surface of the self-assembled monolayer on the copper plate by the same method as in Example 1, the contact angle of the water droplet was observed with a microscope. As a result, the contact angle was 134 °. It was confirmed.
[実施例10]
 エッチング処理時間を75秒間に変えた以外は、実施例9と同様にして、銅板の表面にステアリン酸の自己組織化単分子膜を生成させた。得られた銅板の自己組織化単分子膜表面のレーザー顕微鏡写真(3D写真)を図11に示す。
 上記銅板上の自己組織化単分子膜の表面に、実施例1と同様な方法により純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果、接触角は148°であることが確認された。
[Example 10]
A self-assembled monolayer of stearic acid was formed on the surface of the copper plate in the same manner as in Example 9 except that the etching time was changed to 75 seconds. A laser micrograph (3D photograph) of the surface of the self-assembled monolayer of the obtained copper plate is shown in FIG.
After 5 μL of pure water was dropped on the surface of the self-assembled monolayer on the copper plate by the same method as in Example 1, the contact angle of the water droplet was observed with a microscope. As a result, the contact angle was 148 °. It was confirmed.
[実施例11]
 表面が平滑なチタン金属板の表面(接触角:90°以下)を、エッチング剤水溶液(フッ化水素酸10質量%、硝酸30質量%)用いて、120℃、10分間のエッチングを行い、表面が粗面化されたチタン金属板を得た。次いで、このチタン金属板の粗面化された表面にステアリン酸の自己組織化単分子膜を生成させた。得られたチタン金属板の自己組織化単分子膜表面のレーザー顕微鏡写真(3D写真)を図11に示す。
 上記チタン金属板上の自己組織化単分子膜の表面に、実施例1と同様な方法により純水5μLを滴下した後、マイクロスコープにて水滴の接触角を観察した結果、接触角は120°であることが確認された。
[Example 11]
The surface of the titanium metal plate having a smooth surface (contact angle: 90 ° or less) is etched at 120 ° C. for 10 minutes using an aqueous etchant solution (hydrofluoric acid 10% by mass, nitric acid 30% by mass). A roughened titanium metal plate was obtained. Next, a self-assembled monolayer of stearic acid was formed on the roughened surface of the titanium metal plate. FIG. 11 shows a laser micrograph (3D photograph) of the surface of the self-assembled monomolecular film of the obtained titanium metal plate.
After dropping 5 μL of pure water onto the surface of the self-assembled monolayer on the titanium metal plate by the same method as in Example 1, the contact angle of the water droplet was observed with a microscope. It was confirmed that.

Claims (12)

  1.  基体の表面に、化学的粗面化処理あるいは物理的粗面化処理を施すことにより、その基体を、表面に連続的な微細凹凸面を持つ基体に変換する処理、そしてその基体の連続的な微細凹凸面を持つ表面に自己組織化単分子膜を生成させる処理を施してなる、表面が改質された基体。 By subjecting the surface of the substrate to a chemical or physical surface roughening treatment, the substrate is converted into a substrate having a continuous fine uneven surface on the surface; A substrate with a modified surface, which is obtained by subjecting a surface having a fine uneven surface to a process for producing a self-assembled monolayer.
  2.  化学的粗面化処理あるいは物理的粗面化処理が、めっき処理、化学的エッチング、陽極酸化処理、及びレーザ照射からなる群から選ばれる処理又はそれらの組み合わせである請求項1に記載の基体。 2. The substrate according to claim 1, wherein the chemical roughening treatment or the physical roughening treatment is a treatment selected from the group consisting of plating treatment, chemical etching, anodizing treatment, and laser irradiation, or a combination thereof.
  3.  化学的粗面化処理あるいは物理的粗面化処理が、少なくとも金メッキ処理を含む請求項1に記載の基体。 The substrate according to claim 1, wherein the chemical roughening treatment or the physical roughening treatment comprises at least a gold plating treatment.
  4.  化学的粗面化処理あるいは物理的粗面化処理が、基体表面への卑金属めっき処理による連続的な微細凹凸を有する卑金属めっき層の積層処理と、その連続的な微細凹凸を有する卑金属めっき層の表面への貴金属めっき層の積層処理との組み合わせにより行われる処理である、請求項1に記載の基体。 The chemical surface roughening treatment or the physical surface roughening treatment is carried out by laminating a base metal plating layer having continuous fine unevenness by base metal plating treatment on the surface of the substrate, and a base metal plating layer having continuous fine unevenness. The base | substrate of Claim 1 which is a process performed by the combination with the lamination | stacking process of the noble metal plating layer to the surface.
  5.  基体が金属製基体もしくはセラミック製基体である請求項1乃至3の内のいずれかの項に記載の基体。 The substrate according to any one of claims 1 to 3, wherein the substrate is a metal substrate or a ceramic substrate.
  6.  凹凸面を構成する凸部の半値幅と高さの平均値がいずれも0.005~100μmの範囲にある請求項1乃至5の内のいずれかの項に記載の基体。 6. The substrate according to any one of claims 1 to 5, wherein the average value of the half width and height of the convex portions constituting the irregular surface is in the range of 0.005 to 100 μm.
  7.  基体が板状基体、棒状基体もしくは管状基体である請求項1乃至6の内のいずれかの項に記載の基体。 The substrate according to any one of claims 1 to 6, wherein the substrate is a plate-shaped substrate, a rod-shaped substrate, or a tubular substrate.
  8.  自己組織化単分子膜が、一方の末端にチオール基を持ち、他方の末端に親水性基を持つ化合物、両末端にカルボキシル基を持つジスルフィド化合物、一方の末端にカルボキシル基を持ち、他方の末端に臭素原子を持つ化合物とチオ尿素との反応により生成したチオール化合物、アルカンチオール化合物、そして一方の末端にカルボキシル基を持ち、他方の末端に疎水性基を持つ化合物からなる群より選ばれる化合物から構成されている請求項1乃至7の内のいずれかの項に記載の基体。 A self-assembled monolayer that has a thiol group at one end and a hydrophilic group at the other end, a disulfide compound that has a carboxyl group at both ends, a carboxyl group at one end, and the other end A compound selected from the group consisting of a thiol compound, an alkanethiol compound produced by the reaction of a compound having a bromine atom with thiourea, and a compound having a carboxyl group at one end and a hydrophobic group at the other end The substrate according to any one of claims 1 to 7, which is configured.
  9.  自己組織化単分子膜が、一方の末端にチオール基を持ち、他方の末端に親水性基を持つ化合物、両末端にカルボキシル基を持つジスルフィド化合物、一方の末端にカルボキシル基を持ち、他方の末端に臭素原子を持つ化合物とチオ尿素との反応により生成したチオール化合物からなる群より選ばれる硫黄原子含有化合物から構成されていて、自己組織化単分子膜の表面が高められた親水性を示す請求項1乃至7の内のいずれかの項に記載の基体。 A self-assembled monolayer that has a thiol group at one end and a hydrophilic group at the other end, a disulfide compound that has a carboxyl group at both ends, a carboxyl group at one end, and the other end A compound comprising a sulfur atom-containing compound selected from the group consisting of thiol compounds formed by the reaction of a compound having a bromine atom with thiourea, and having an improved hydrophilic property on the surface of the self-assembled monolayer Item 8. The substrate according to any one of Items 1 to 7.
  10.  自己組織化単分子膜が、アルカンチオール化合物もしくは一方の末端にカルボキシル基を持ち、他方の末端に疎水性基を持つ化合物から構成されていて、自己組織化単分子膜の表面が高められた疎水性を示す請求項1乃至7の内のいずれかの項に記載の基体。 The self-assembled monolayer is composed of an alkanethiol compound or a compound having a carboxyl group at one end and a hydrophobic group at the other end, and the surface of the self-assembled monolayer is enhanced. The substrate according to any one of claims 1 to 7, which exhibits properties.
  11.  基体の表面に、化学的粗面化処理あるいは物理的粗面化処理を施すことにより、その基体を、表面に連続的な微細凹凸面を持つ基体に変換する処理を施す工程、そしてその基体の連続的な微細凹凸面を持つ表面に自己組織化単分子膜を生成させる処理を施す工程を含む、基体表面の疎水性もしくは親水性を高める方法。 A step of subjecting the surface of the substrate to a chemical roughening treatment or a physical roughening treatment to convert the substrate into a substrate having a continuous fine uneven surface on the surface; A method for increasing the hydrophobicity or hydrophilicity of a substrate surface, comprising a step of performing a treatment for generating a self-assembled monolayer on a surface having a continuous fine uneven surface.
  12.  化学的粗面化処理あるいは物理的粗面化処理が、めっき処理、化学エッチング、及びレーザ照射照射からなる群から選ばれる処理又はそれら組み合わせである請求項11に記載の方法。 The method according to claim 11, wherein the chemical roughening treatment or the physical roughening treatment is a treatment selected from the group consisting of plating treatment, chemical etching, and laser irradiation or a combination thereof.
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