WO2018126873A1 - 一种触控基板及其制作方法、触控显示装置 - Google Patents

一种触控基板及其制作方法、触控显示装置 Download PDF

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Publication number
WO2018126873A1
WO2018126873A1 PCT/CN2017/116538 CN2017116538W WO2018126873A1 WO 2018126873 A1 WO2018126873 A1 WO 2018126873A1 CN 2017116538 W CN2017116538 W CN 2017116538W WO 2018126873 A1 WO2018126873 A1 WO 2018126873A1
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Prior art keywords
touch
insulating layer
disposed
area
layer
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PCT/CN2017/116538
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English (en)
French (fr)
Inventor
范文金
张雷
郭总杰
张志�
贺晓悦
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/067,919 priority Critical patent/US11360610B2/en
Publication of WO2018126873A1 publication Critical patent/WO2018126873A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Definitions

  • the present invention relates to the field of display and touch technologies, and in particular, to a touch substrate, a method for fabricating the same, and a touch display device.
  • touch screens have been widely used in daily life.
  • the most popular is the capacitive touch screen.
  • the touch screen calculates the position of the finger by the current generated by the capacitance change.
  • the touch substrate includes a touch area and a peripheral area.
  • the touch area is an area that the user can see and touch the image
  • the peripheral area includes a plurality of signal lines for providing a control signal for the touch electrodes disposed in the touch area and transmitting the collected by the touch electrodes. Touch signal.
  • the touch resolution of the touch screen is required to be increased, and the uneven distribution of the capacitance around the touch screen has a greater impact on product quality and performance.
  • the present invention provides a touch substrate and a manufacturing method thereof for at least partially improving the problem of uneven distribution of capacitance in a touch area of a conventional touch substrate.
  • a touch substrate including a touch area and a peripheral area surrounding the touch area.
  • Signal lines and shielding lines are disposed in the peripheral area, and the shielding lines are used to shield interference of the signal lines to the touch area.
  • At least a portion of the shielded wire may be disposed in the Between the signal trace and the touch area.
  • the touch substrate may further include: a substrate; a conductive layer disposed on the substrate, the conductive layer being partially disposed in the touch area and the peripheral area, Electrically connected to the touch electrode disposed in the touch area; a first insulating layer on the conductive layer, and a first via hole disposed in the first insulating layer to expose the first via a conductive layer under the insulating layer; and a metal pattern layer on the first insulating layer, the metal pattern layer including the signal trace and the shield line.
  • the signal trace may be electrically connected to a conductive layer disposed under the first insulating layer through a first via in the first insulating layer.
  • the touch substrate may further include: a substrate; a metal pattern layer disposed on the substrate, the metal pattern layer including the signal trace and the shield line; a first insulating layer on the metal pattern layer, and a second via hole is disposed in the first insulating layer to expose a signal trace disposed under the first insulating layer; and located in the first insulating layer
  • the conductive layer is partially disposed on the touch area and the peripheral area to be electrically connected to the touch electrodes disposed in the touch area.
  • the signal trace may be electrically connected to a conductive layer disposed above the first insulating layer through a second via in the first insulating layer.
  • the width of the shield line may be 300 ⁇ m or more and 500 ⁇ m or less, or the width of the shield line may be 150 ⁇ m or more and less than 300 ⁇ m.
  • the shield wire may be provided with an opening.
  • no signal trace may be disposed on a side of the opening away from the touch area.
  • the touch substrate may further include: a grounding device located at a periphery of the signal trace.
  • the grounding device can be electrically connected to the shielding wire.
  • At least one of the grounding device and the shield wire may be provided with an opening.
  • the grounding device may be provided with an opening, and signal wiring may not be disposed on both sides of the opening.
  • the peripheral area may also be provided for external use
  • the integrated circuit or the flexible printed circuit board is connected to the wiring area, the grounding end may be disposed on the connecting area, and the shielding line may be electrically connected to the grounding end.
  • the touch substrate may be a capacitive touch substrate.
  • a method of fabricating a touch substrate includes a touch area and a peripheral area surrounding the touch area, the method comprising: forming in the peripheral area Signal traces and shielded lines. At least a portion of the shield line is disposed between the signal trace and the touch area.
  • the method of fabricating a touch substrate may further include: forming a conductive layer on a substrate on which a black matrix is formed, the conductive layer being partially disposed in the touch area and the peripheral area Electrically connecting to the touch electrode disposed in the touch area; forming a first insulating layer on the conductive layer; forming a first via hole in the first insulating layer to expose the first via a conductive layer under the insulating layer; forming a metal layer on the first insulating layer, the metal layer filling the first via to electrically connect to the conductive layer under the first insulating layer; and the metal layer Patterning is performed to form the signal traces and the shield lines.
  • the signal trace may be electrically connected to a conductive layer disposed under the first insulating layer through a first via in the first insulating layer.
  • the method of fabricating a touch substrate may further include: forming a metal layer on a substrate on which a black matrix is formed; patterning the metal layer to form the signal trace and the a shielding line; forming a first insulating layer on the patterned metal layer; forming a second via hole in the first insulating layer to expose a signal trace disposed under the first insulating layer; A conductive layer is formed on the first insulating layer, and the conductive layer fills the second via to electrically connect to signal traces under the first insulating layer.
  • the peripheral area may include a wiring area for electrically connecting to an external integrated circuit or a flexible printed circuit board, and the method may further include: forming a ground end on the connection area And the shield wire is electrically connected to the ground terminal.
  • a touch display device including a touch substrate according to the present invention is provided.
  • FIG. 1 is a schematic plan view of a touch substrate according to an embodiment of the invention.
  • Figure 2 is a cross-sectional view taken along line A-A' of Figure 1;
  • FIG. 3 is a cross-sectional view of the touch substrate taken along line AA' of FIG. 1 according to another embodiment of the present invention.
  • FIG. 4 is a schematic plan view of a touch substrate according to another embodiment of the present invention.
  • FIG. 5 is a partially enlarged schematic view of a touch substrate according to another embodiment of the present invention.
  • FIG. 6 is a schematic flow chart of a method for fabricating a touch substrate according to an embodiment of the invention.
  • FIG. 7 is a schematic flow chart of a method for fabricating a touch substrate according to another embodiment of the invention.
  • the signal traces in the peripheral area of the touch substrate form a mutual capacitance with the components in the display area, resulting in the capacitance of the edge of the display area of the touch substrate.
  • the distribution is uneven, and the more the signal traces in the peripheral area, the larger the mutual capacitance, and the more uneven the capacitance distribution at the edge of the display area, which seriously affects product performance.
  • the invention provides a touch substrate and a manufacturing method thereof, which can at least partially solve the problem of uneven distribution of capacitance around the display area without increasing the cost and the process.
  • the directions “upper” and “lower” as referred to in the present invention are intended to indicate the directions in the drawings. For example, if the device in the drawing is flipped, Elements that are described as “below” other elements or features will be “above” the other elements or features.
  • the device can be additionally pointed (rotated 90 degrees or at other orientations) and the direction words used herein interpreted accordingly.
  • FIG. 1 is a schematic plan view of a touch substrate according to an embodiment of the invention
  • FIG. 2 is a cross-sectional view taken along line AA' of FIG.
  • the touch substrate includes a touch area 11 (an area surrounded by a broken line in FIG. 1) and a peripheral area 12 around the touch area.
  • Signal traces 121 and shield lines 122 are disposed in the peripheral region 12.
  • the shield line 122 is used to shield the signal trace 121 from interference to the touch area 12.
  • the touch substrate may include a substrate 101; a black matrix 102 disposed on the substrate 101; a metal layer 103 disposed on the black matrix 102; and a metal layer 103 disposed on the metal layer 103. a first insulating layer 104; a metal pattern layer disposed on the first insulating layer 104; and a second insulating layer 105 disposed on the metal pattern layer.
  • the metal pattern layer includes signal traces 121 and shield lines 122.
  • the first via 1041 is included in the first insulating layer 104.
  • the signal trace 121 is electrically connected to the metal layer 103 through the first via 1041.
  • the metal layer 103 is partially disposed on the touch area 11 and the peripheral area 12 to be electrically connected to the touch electrode 100 disposed in the touch area 11 .
  • the signal traces 121 are electrically connected to the touch electrodes 100 disposed in the touch area 11 via the corresponding metal layers 103.
  • a signal is formed between the peripheral area 12 and the touch area 11 via the signal traces 121, the metal layer 103 and the conductive path formed by the touch electrode 100 (for example, a control signal for controlling the touch electrode 100 and a control signal collected by the touch electrode) Transmission of touch signals).
  • FIG. 3 is a cross-sectional view of the touch substrate taken along line AA' of FIG. 1 according to another embodiment of the present invention.
  • the touch substrate may include a substrate 101; a black matrix 102 disposed on the substrate 101; a metal pattern layer disposed on the black matrix 102; and a layer disposed on the metal pattern layer An insulating layer 104; a metal layer 103 disposed on the first insulating layer 104; and a second insulating layer 105 disposed on the metal layer 103.
  • the metal pattern layer includes signal traces 121 and shield lines 122. .
  • a second via 1042 is included in the first insulating layer 104.
  • the signal trace 121 is electrically connected to the metal layer 103 through the second via 1042.
  • the metal layer 103 is partially disposed in the touch area 11 and the peripheral area 12 to It is electrically connected to the touch electrode 100 disposed in the touch area 11 .
  • the signal traces 121 are electrically connected to the touch electrodes 100 disposed in the touch area 11 via the corresponding metal layers 103.
  • a signal is formed between the peripheral area 12 and the touch area 11 via the signal traces 121, the metal layer 103 and the conductive path formed by the touch electrode 100 (for example, a control signal for controlling the touch electrode 100 and a control signal collected by the touch electrode) Transmission of touch signals).
  • the signal traces 121 and the shield lines 122 can be formed in the same layer (i.e., the metal pattern layer) and completed by one patterning process, thereby saving production time without increasing production cost.
  • one signal trace 121 is connected to a metal layer 103 corresponding thereto, it should be recognized that each of the signal traces 121 disposed in the peripheral trace 12 is respectively connected to the corresponding signal trace 121.
  • a metal layer 103 is provided to provide a control signal for the touch electrode 100 disposed in the touch area 11 and to transmit the touch signal collected by the touch electrode 100.
  • peripheral area 12 may also include a wiring area 123 that is electrically coupled to an external integrated circuit or flexible printed circuit board.
  • the connection area 123 is provided with a ground terminal 1231 and other terminals.
  • the ground terminal 1231 can be electrically connected to the shield line 122 to provide a ground potential to the shield line 122.
  • the width of the shield line 122 may be greater than or equal to 300 ⁇ m and less than or equal to 500 ⁇ m, or the width of the shielded line 122 may be greater than or equal to 150 ⁇ m and less than 300 ⁇ m.
  • the width of the shield line 112 may be greater than or equal to 300 ⁇ m and less than or equal to 500 ⁇ m.
  • the shielded line 122 is The width may be 150 ⁇ m or more and less than 300 ⁇ m.
  • the number of signal traces 121 is set according to the accuracy requirements of the product in the actual production process.
  • An example in which 14 signal traces 121 are provided in the peripheral area 12 is shown in FIG. 1, but the present invention is not limited thereto.
  • the touch substrate may be a capacitive touch substrate.
  • the shielded line 122 disposed in the peripheral area 12 of the capacitive touch substrate shields the signal trace 121 of the peripheral area 12, thereby reducing the peripheral area signal trace 121 and the touch area.
  • the touch electrodes 100 in the 11 generate mutual capacitance, so that the capacitance distribution of the edge area and the central area of the touch area 11 is more uniform, and the touch precision around the display area is improved.
  • the structure of the touch substrate illustrated in Figures 2 and 3 is merely illustrative of the invention and is not intended to limit the invention.
  • the touch substrate shown in Figures 2 and 3 can be realized by a 5MASK (five-time mask) process commonly used in glass surface fabrication sensors (On Glass Sensor, OGS).
  • the present invention is not limited thereto, and the touch substrate according to the present invention can also be realized by, for example, a 6MASK (five-time mask) process or the like according to other embodiments.
  • Figures 1, 2, and 3 are merely illustrative of touch substrate structures and wiring forms in accordance with embodiments of the present invention. According to other embodiments of the present invention, the touch substrate may further include other substrate structures and/or wiring forms. In addition, various modifications to the number, area, length, etc. of the traces are included within the scope of the present invention.
  • a portion of the shield line 122 is located between the signal trace 121 and the touch area 11, but the invention is not limited thereto. According to other embodiments of the present invention, the shield lines 122 may also be located entirely between the signal traces 121 and the touch areas 11.
  • the shield line 122 is located between the signal trace 121 and the touch area 11 so as to be generated between the signal traces 121 and the touch areas 11 on both sides thereof.
  • Mutual capacitance shielding improves the uneven distribution of edge capacitance in the touch area.
  • FIG. 4 is a schematic plan view of a touch substrate according to another embodiment of the present invention.
  • the shield line 122 may be provided with an opening 14 as compared with the embodiment shown in FIG.
  • no signal routing may be provided on the side of the opening 14 away from the touch area 11.
  • the opening 14 is such that the pattern formed by the shield line 122 does not have a closed loop. If there is a closed ring, it is easy to cause the long wire to collect free charges, and form an electronic oscillation in the touch area, which affects the touch performance.
  • FIG. 5 is a schematic plan view of a touch substrate according to another embodiment of the invention.
  • the touch substrate according to the embodiment may further include a grounding device 13 located at a periphery of the signal line 121 as compared with the embodiment shown in FIG. 1 .
  • the grounding device 13 is electrically connected to the shield line 122.
  • the grounding device 13 can be implemented as a ground line.
  • the grounding device 13 can shield the interference of the external signal on the touch substrate.
  • Shielding line 122 The grounding device 13 may be formed in the same layer and connected to each other, or may be connected by a via or the like to obtain a ground potential, so that it is not necessary to separately provide a grounding terminal for the shielded wire 122, which simplifies the production process and saves production costs.
  • an opening 14 is provided in both the shield line 122 and the grounding device 13.
  • the opening 14 is such that the pattern formed by the shield wire 122 and the grounding means 13 does not have a closed loop. If there is a closed ring, it is easy to cause the long wire to collect free charges, and form an electronic oscillation in the touch area, which affects the touch performance.
  • an opening may be provided only on one of the shield line 122 and the grounding device 13.
  • the opening 14 may be disposed at such a position in the shield line 122 and the grounding device 13, which causes the shielding effect of the shield line 122 on the signal trace 121 to be symmetrically distributed, thereby making the touch area 11
  • the capacitance is evenly distributed.
  • the touch substrate further includes a grounding device 13 located at a periphery of the signal line 121.
  • the signal traces 121 and the shield lines 122 may be formed in the same metal pattern layer.
  • the grounding device 13 may be formed in the same metal pattern layer as the signal traces 121 and the shield lines 122.
  • the grounding device 13 e.g., a metal casing
  • the touch substrate according to the present invention can be applied to various touch devices including, but not limited to, liquid crystal touch display devices.
  • FIG. 6 is a schematic flow chart of a method for fabricating a touch substrate according to an embodiment of the invention
  • FIG. 7 is a schematic flow chart of a method for fabricating a touch substrate according to another embodiment of the invention.
  • a method for fabricating a touch substrate according to an embodiment of the invention may include:
  • S601 forming a metal layer 103 on the substrate 101 on which the black matrix 102 is formed.
  • the metal layer 103 is partially disposed on the touch area 11 and the peripheral area 12 to be electrically connected to the touch electrode 100 disposed in the touch area 11. ;
  • S605 The metal layer is patterned to form signal traces 121 and shield lines 122.
  • the signal trace 121 is electrically connected to the metal layer 103 disposed under the first insulating layer 104 through the first via 1041 in the first insulating layer 104.
  • the black matrix 102 is used to form a light blocking region.
  • a metal pattern can be formed by a patterning process.
  • the metal pattern can be connected to the touch electrode 100 disposed in the touch area 11 .
  • the metal layer 103 may be formed using indium tin oxide (ITO). In the case where the touch electrode 100 is formed using ITO, the metal layer 103 and the touch electrode 100 can be completed by one patterning process.
  • ITO indium tin oxide
  • the second insulating layer 105 may also be formed on the metal pattern layer.
  • a method for fabricating a touch substrate according to another embodiment of the present invention may include:
  • S705 forming a metal layer 103 on the first insulating layer, the metal layer 103 filling the second via hole 1042 to be electrically connected to the signal trace 121 under the first insulating layer 104.
  • a second insulating layer 105 may also be formed on the metal layer 103.
  • the signal traces 121 and the shield lines 122 may be formed in the same layer (i.e., the metal pattern layer), and may be completed by one patterning process, which can save production time without increasing production cost.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)

Abstract

一种触控基板及其制作方法、触控显示装置。所述触控基板包括触控区（11）和围绕所述触控区（11）的外围区（12）。在所述外围区（12）设置有信号走线（121）和屏蔽线（122），所述屏蔽线（122）用于屏蔽所述信号走线（121）对所述触控区（11）的干扰。

Description

一种触控基板及其制作方法、触控显示装置
相关申请的交叉引用
本申请要求于2017年1月3日提交至中国知识产权局的中国专利申请NO.201710002807.2的优先权，所公开的内容以引用的方式合并于此。
技术领域
本发明涉及显示、触控技术领域，尤其涉及一种触控基板及其制作方法、触控显示装置。
背景技术
随着智能手机和平板电脑的迅猛发展，触控屏在日常生活中已经得到了广泛的应用。目前最流行的是电容式触控屏，当手指与屏幕接触时，触控屏就会通过电容变化所产生的电流来计算手指的位置。
一般来说，触控基板均包含触控区区和外围区。其中，触控区是用户能够看到图像并进行触摸的区域，外围区包括多条信号走线，用于为设置在触控区中的触控电极提供控制信号并传递由触控电极采集的触控信号。
随着触控屏的发展，要求触控屏的触控解析度增高，进而触控屏周边电容分布不均对产品品质和性能产生了更大的影响。
发明内容
本发明针对现有技术中存在的以上问题，提供了一种触控基板及其制作方法，用以至少部分地改善现有触控基板触控区电容分布不均的问题。
根据本发明的一个方面，提供一种触控基板，包括触控区和围绕所述触控区的外围区。在所述外围区设置有信号走线和屏蔽线，所述屏蔽线用于屏蔽所述信号走线对所述触控区的干扰。
根据本发明的实施例，所述屏蔽线的至少一部分可以设置在所 述信号走线和所述触控区之间。
根据本发明的实施例，所述触控基板还可以包括：衬底；设置在所述衬底上的导电层，所述导电层部分地设置在所述触控区和所述外围区，以电连接至设置在所述触控区中的触控电极；位于所述导电层上的第一绝缘层，并且所述第一绝缘层中设置有第一过孔以暴露设置在所述第一绝缘层下方的导电层；以及位于所述第一绝缘层上的金属图案层，所述金属图案层包括所述信号走线和所述屏蔽线。所述信号走线可以通过所述第一绝缘层中的第一过孔与设置在所述第一绝缘层下方的导电层电连接。
根据本发明的实施例，所述触控基板还可以包括：衬底；设置在所述衬底上的金属图案层，所述金属图案层包括所述信号走线和所述屏蔽线；位于所述金属图案层上的第一绝缘层，并且所述第一绝缘层中设置有第二过孔，以暴露设置在所述第一绝缘层下方的信号走线；以及位于所述第一绝缘层上的导电层，所述导电层部分地设置在所述触控区和所述外围区，以电连接至设置在所述触控区中的触控电极。所述信号走线可以通过所述第一绝缘层中的第二过孔与设置在所述第一绝缘层上方的导电层电连接。
根据本发明的实施例，所述屏蔽线的宽度可以大于等于300μm且小于等于500μm，或者所述屏蔽线的宽度可以大于等于150μm且小于300μm。
根据本公开的实施例，所述屏蔽线可以设置有开口。
根据本公开的实施例，在所述开口远离所述触控区的一侧可以不设置信号走线。
根据本公开的实施例，所述触控基板还可以包括：位于所述信号走线外围的接地装置。所述接地装置可以与所述屏蔽线电连接。
根据本公开的实施例，所述接地装置与所述屏蔽线中的至少之一可以设置有开口。
根据本公开的实施例，所述接地装置可以设置有开口，并且所述开口两侧可以不设置信号走线。
根据本公开的实施例，在所述外围区还可以设置有用于与外部 的集成电路或柔性印刷电路板进行连接的连线区，在所述连线区上可以设置接地端，并且所述屏蔽线可以电连接至所述接地端。
根据本公开的实施例，所述触控基板可以为电容式触控基板。
根据本发明的另一个方面，提供一种制作触控基板的方法，所述触控基板包括触控区和围绕所述触控区的外围区，所述方法包括：在所述外围区中形成信号走线和屏蔽线。所述屏蔽线的至少一部分设置在所述信号走线和所述触控区之间。
根据本公开的实施例，所述制作触控基板的方法还可以包括：在形成有黑矩阵的衬底上形成导电层，所述导电层部分地设置在所述触控区和所述外围区，以电连接至设置在所述触控区中的触控电极；在导电层上形成第一绝缘层；在所述第一绝缘层中形成第一过孔，以暴露设置在所述第一绝缘层下方的导电层；在第一绝缘层上形成金属层，所述金属层填充所述第一过孔，以电连接至所述第一绝缘层下方的导电层；以及对所述金属层进行图案化，以形成所述信号走线和所述屏蔽线。所述信号走线可以通过所述第一绝缘层中的第一过孔与设置在所述第一绝缘层下方的导电层电连接。
根据本公开的实施例，所述制作触控基板的方法还可以包括：在形成有黑矩阵的衬底上形成金属层；对所述金属层进行图案化，以形成所述信号走线和所述屏蔽线；在图案化的金属层上形成第一绝缘层；在所述第一绝缘层中形成第二过孔，以暴露设置在所述第一绝缘层下方的信号走线；以及在所述第一绝缘层上形成导电层，所述导电层填充所述第二过孔，以电连接至所述第一绝缘层下方的信号走线。
根据本公开的实施例，所述外围区可以包括用于与外部的集成电路或柔性印刷电路板电连接的连线区，并且所述方法还可以包括：在所述连线区上形成接地端，并且所述屏蔽线电连接至所述接地端。
根据本发明的另一方面，提供一种触控显示装置，包括根据本发明的触控基板。
附图说明
下面将通过参照附图详细描述本发明的示例性实施例，使本领 域的普通技术人员更清楚本发明的上述及其他特征和优点，附图中：
图1是根据本发明的实施例的触控基板的平面示意图；
图2是沿图1中A-A'线截取的剖面示意图；
图3是根据本发明另一实施例的触控基板沿图1中A-A'线截取的剖面示意图；
图4是根据本发明另一实施例的触控基板的平面示意图；
图5是根据本发明另一实施例的触控基板的局部放大示意图；
图6是根据本发明实施例的触控基板制作方法的示意流程图；以及
图7是根据本发明另一实施例的触控基板制作方法的示意流程图。
具体实施方式
在实现本发明的过程中，发明人发现现有技术至少存在以下问题：触控基板外围区中的信号走线会与显示区中的元件形成互容，导致触控基板的显示区边缘的电容分布不均，并且外围区中的信号走线越多互容就越大，显示区边缘的电容分布就越不均匀，严重影响产品性能。
本发明提供了触控基板及其制作方法，用以在不增加成本和工艺制程的前提下，至少部分地解决显示区周边电容分布不均的问题。
为了使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明作进一步地详细描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
下面结合附图详细介绍本发明具体实施例提供的触控基板和制作方法。
附图中各层的厚度以及区的大小、形状不反应各层和区的真实比例，其目的只是示意说明本发明内容。本发明中所提到的方向“上”和“下”旨在示出附图中的方向。例如，如果将附图中的装置翻转， 则被描述为“在”其他元件或特征“下方”的元件将随后位于其他元件或特征“上方”。装置可被另外地指向(旋转90度或在其他方位)并相应地解释这里使用的方向词。
图1是根据本发明实施例的触控基板的平面示意图，图2是沿图1中A-A'线截取的剖面示意图。
如图1和图2所示，根据本发明实施例的触控基板包括触控区11(图1中由虚线围绕的区域)和位于触控区周围的外围区12。在外围区12中设置有信号走线121和屏蔽线122。屏蔽线122用于屏蔽信号走线121对触控区12的干扰。
如图2所示，根据本发明实施例的触控基板可以包括衬底101；设置在衬底101上的黑矩阵102；设置在黑矩阵102上的金属层103；设置在金属层103上的第一绝缘层104；设置在第一绝缘层104上的金属图案层；以及设置在金属图案层上的第二绝缘层105。
金属图案层包括信号走线121和屏蔽线122。第一绝缘层104中包括第一过孔1041。信号走线121通过第一过孔1041电连接至金属层103。金属层103部分地设置在触控区11和外围区12，以电连接至设置在触控区11中的触控电极100。信号走线121经由相应的金属层103电连接至设置在触控区11中的触控电极100。外围区12与触控区11之间经由信号走线121、金属层103与触控电极100形成的导电通路进行信号(例如，对触控电极100进行控制的控制信号和由触控电极采集的触控信号)的传输。
图3是根据本发明另一实施例的触控基板沿图1中A-A'线截取的剖面示意图。
如图3所示，根据本实施例的触控基板可以包括衬底101；设置在衬底101上的黑矩阵102；设置在黑矩阵102上的金属图案层；设置在金属图案层上的第一绝缘层104；设置在第一绝缘层104上的金属层103；以及设置在金属层103上的第二绝缘层105。
金属图案层包括信号走线121和屏蔽线122。。在第一绝缘层104中包括第二过孔1042。信号走线121通过第二过孔1042电连接至金属层103。金属层103部分地设置在触控区11和外围区12，以 电连接至设置在触控区11中的触控电极100。信号走线121经由相应的金属层103电连接至设置在触控区11中的触控电极100。外围区12与触控区11之间经由信号走线121、金属层103与触控电极100形成的导电通路进行信号(例如，对触控电极100进行控制的控制信号和由触控电极采集的触控信号)的传输。
根据本发明的实施例，可以将信号走线121和屏蔽线122形成在同一层(即，金属图案层)中，并通过一次构图工艺完成，从而能够节约生产时间，不增加生产成本。
虽然在图2和图3中示出了，一条信号走线121连接至与其对应的一个金属层103，但应当认识到，设置在外围去12中的每条信号走线121分别连接至与其对应的一个金属层103，以便为设置在触控区11中的触控电极100提供控制信号并传递由触控电极100采集的触控信号。
根据本发明的实施例，如图1所示，外围区12还可以包括与外部的集成电路或柔性印刷电路板电连接的连线区123。连线区123上设置有接地端1231和其他端子。接地端1231可以与屏蔽线122电连接，以向屏蔽线122提供接地电位。
根据本发明的实施例，屏蔽线122的宽度可以大于等于300μm且小于等于500μm，或者，屏蔽线122的宽度可以大于等于150μm且小于300μm。
具体地，考虑到增加屏蔽线122对边框宽度的影响，对于常规产品，屏蔽线112的宽度可以大于等于300μm且小于等于500μm，对于窄边框产品，由于产品中布线空间较小，屏蔽线122的宽度可以大于等于150μm且小于300μm。
信号走线121的数量根据实际生产过程中对产品的精度需要进行设置。在图1中示出了在外围区12中设置14条信号走线121的示例，然而本发明不限于此。
根据本发明的实施例，触控基板可以为电容式触控基板。由于该电容式触控基板在外围区12中设置的屏蔽线122对外围区12的信号走线121进行了屏蔽，从而减少了外围区信号走线121同触控区 11内的触控电极100产生互容，使得触控区11的边缘区和中心区的电容分布更加均匀，提高了显示区周边的触控精确度。
应当认识到，图2和图3所示出的触控基板的结构仅仅用于解释本发明，而非对本发明的限定。图2和图3所示的触控基板可以通过玻璃表面制作传感器(On Glass Sensor，OGS)中常见的5MASK(五次掩模)工艺实现。然而本发明不限于此，根据其他实施例也可以通过例如6MASK(五次掩模)工艺等来实现根据本发明的触控基板。
还应当认识到，图1、图2和图3只是例举了根据本发明实施例的触控基板结构和布线形式。根据本发明的其他实施例，触控基板还可以包括其他基板结构和/或布线形式。此外，对走线的数量、面积、长度等的各种变换都包含在本发明保护的范围内。
根据本发明的实施例，屏蔽线122的一部分位于信号走线121和触控区11之间，然而本发明不限于此。根据本发明的其他实施例，屏蔽线122也可全部位于信号走线121和触控区11之间。
根据本发明实施例的触控基板，屏蔽线122的至少一部分位于信号走线121和触控区11之间，从而可以将位于其两侧的信号走线121和触控区11之间产生的互容屏蔽，从而改善触控区边缘电容分布不均的问题。
图4是根据本发明另一实施例的触控基板的平面示意图。
参见图4，与图1所示的实施例相比，在根据本实施例的触控基板中，屏蔽线122可以设置有开口14。此外，在开口14远离触控区11的一侧可以不设置信号走线。开口14使得屏蔽线122形成的图形不存在封闭的环形。如果存在封闭的环形，则容易导致长导线收集游离电荷，在触控区内形成电子振荡，影响触控性能。
图5是根据本发明另一实施例的触控基板的平面示意图。
参见图5，与图1所示的实施例相比，根据本实施例的触控基板还可以包括位于信号线121外围的接地装置13。接地装置13与屏蔽线122电连接。根据本发明的实施例，接地装置13可以实现为接地线。
接地装置13可以屏蔽外部信号对触控基板的干扰。屏蔽线122 可以与接地装置13形成在同一层并彼此连接，或者可以通过过孔等方式连接，以获得接地电位，从而无需单独为屏蔽线122提供接地端子，简化生产工艺，节省生产成本。
如图5所示，在屏蔽线122和接地装置13上均设置了开口14。开口14使得屏蔽线122和接地装置13形成的图形不存在封闭的环形。如果存在封闭的环形，则容易导致长导线收集游离电荷，在触控区内形成电子振荡，影响触控性能。根据本发明的实施例，可以仅在屏蔽线122和接地装置13二者之一上设置开口。
根据本发明的实施例，可以将开口14设置在屏蔽线122和接地装置13中的这样的位置处，其使得屏蔽线122对信号走线121的屏蔽作用对称分布，从而使触控区11的电容分布均匀。
如图5所示，在外围区中设置了多条信号走线121和一条屏蔽线122。该触控基板还包括位于信号线121外围的接地装置13。信号走线121和屏蔽线122可以形成在同一金属图案层中。接地装置13可以与信号走线121和屏蔽线122形成在同一金属图案层中。可替换地，可以单独制作接地装置13(例如，金属外壳)。
根据本发明的触控基板可以应用于各种触控装置，其包括(但不限于)液晶触控显示装置。
图6是根据本发明实施例的制作触控基板的方法的示意流程图，图7是根据本发明另一实施例的制作触控基板的方法的示意流程图。
参照图1、图2和图6，根据本发明实施例的制作触控基板的方法可以包括：
S601：在形成有黑矩阵102的衬底101上形成金属层103，金属层103部分地设置在触控区11和外围区12，以电连接至设置在触控区11中的触控电极100；
S602：在金属层103上形成第一绝缘层104；
S603：在第一绝缘层104中形成第一过孔1041，以暴露设置在第一绝缘层104下方的金属层103；
S604：在第一绝缘层104上形成金属层，所述金属层填充第一过孔1041，以电连接至第一绝缘层104下方的金属层103；以及
S605：对所述金属层进行图案化，以形成信号走线121和屏蔽线122。
信号走线121通过第一绝缘层104中的第一过孔1041与设置在第一绝缘层104下方的金属层103电连接。
黑矩阵102用于形成遮光区。在黑矩阵102上形成金属层103时，可以通过构图工艺形成金属图案。所述金属图案可以连接至设置在触控区11中的触控电极100。根据本发明的实施例，可以利用氧化铟锡(ITO)形成金属层103。在利用ITO形成触控电极100的情况下，金属层103和触控电极100可以通过一次构图工艺完成。
此外，如图2所述，还可以在金属图案层上形成第二绝缘层105。
参照图1、图3和图7，根据本发明另一实施例的制作触控基板的方法可以包括：
S701：在形成有黑矩阵102的衬底101上形成金属层；
S702：对所述金属层进行图案化，以形成信号走线121和屏蔽线122；
S703：在图案化的金属层上形成第一绝缘层104；
S704：在第一绝缘层104中形成第二过孔1042，以暴露设置在第一绝缘层104下方的信号走线121；以及
S705：在第一绝缘层上形成金属层103，金属层103填充第二过孔1042，以电连接至第一绝缘层104下方的信号走线121。
此外，如图3所示，还可以在金属层103上形成第二绝缘层105。
根据本发明的实施例，信号走线121和屏蔽线122可形成在同一层(即，金属图案层)中，并且可以通过一次构图工艺完成，能够节约生产时间，不增加生产成本。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (17)

  1. 一种触控基板，包括触控区和围绕所述触控区的外围区，
    其中，在所述外围区设置有信号走线和屏蔽线，所述屏蔽线用于屏蔽所述信号走线对所述触控区的干扰。
  2. 根据权利要求1所述的触控基板，其中，所述屏蔽线的至少一部分设置在所述信号走线和所述触控区之间。
  3. 根据权利要求1或2所述的触控基板，还包括：
    衬底；
    设置在所述衬底上的导电层，所述导电层部分地设置在所述触控区和所述外围区，以电连接至设置在所述触控区中的触控电极；
    位于所述导电层上的第一绝缘层，并且所述第一绝缘层中设置有第一过孔以暴露设置在所述第一绝缘层下方的导电层；以及
    位于所述第一绝缘层上的金属图案层，所述金属图案层包括所述信号走线和所述屏蔽线，
    所述信号走线通过所述第一绝缘层中的第一过孔与设置在所述第一绝缘层下方的导电层电连接。
  4. 根据权利要求1或2所述的触控基板，还包括：
    衬底；
    设置在所述衬底上的金属图案层，所述金属图案层包括所述信号走线和所述屏蔽线；
    位于所述金属图案层上的第一绝缘层，并且所述第一绝缘层中设置有第二过孔，以暴露设置在所述第一绝缘层下方的信号走线；以及
    位于所述第一绝缘层上的导电层，所述导电层部分地设置在所述触控区和所述外围区，以电连接至设置在所述触控区中的触控电极，
    其中，所述信号走线通过所述第一绝缘层中的第二过孔与设置在所述第一绝缘层上方的导电层电连接。
  5. 根据权利要求1所述的触控基板，其中，
    所述屏蔽线的宽度大于等于300μm且小于等于500μm，或者
    所述屏蔽线的宽度大于等于150μm且小于300μm。
  6. 根据权利要求1所述的触控基板，其中，所述屏蔽线设置有开口。
  7. 根据权利要求6所述的触控基板，其中，在所述开口远离所述触控区的一侧不设置信号走线。
  8. 根据权利要求1所述的触控基板，还包括：
    位于所述信号走线外围的接地装置，所述接地装置与所述屏蔽线电连接。
  9. 根据权利要求8所述的触控基板，其中，所述接地装置与所述屏蔽线中的至少之一设置有开口。
  10. 根据权利要求9所述的触控基板，其中，所述接地装置设置有开口，并且所述开口两侧不设置信号走线。
  11. 根据权利要求1所述的触控基板，其中，在所述外围区还设置有用于与外部的集成电路或柔性印刷电路板进行连接的连线区，在所述连线区上设置接地端，并且所述屏蔽线电连接至所述接地端。
  12. 根据权利要求1-11任一项所述的触控基板，其中，所述触控基板为电容式触控基板。
  13. 一种制作触控基板的方法，所述触控基板包括触控区和围绕所述触控区的外围区，所述方法包括：
    在所述外围区中形成信号走线和屏蔽线，
    其中，所述屏蔽线的至少一部分设置在所述信号走线和所述触控区之间。
  14. 根据权利要求13所述的制作触控基板的方法，还包括：
    在形成有黑矩阵的衬底上形成导电层，所述导电层部分地设置在所述触控区和所述外围区，以电连接至设置在所述触控区中的触控电极；
    在导电层上形成第一绝缘层；
    在所述第一绝缘层中形成第一过孔，以暴露设置在所述第一绝缘层下方的导电层；
    在第一绝缘层上形成金属层，所述金属层填充所述第一过孔，以电连接至所述第一绝缘层下方的导电层；以及
    对所述金属层进行图案化，以形成所述信号走线和所述屏蔽线，
    其中，所述信号走线通过所述第一绝缘层中的第一过孔与设置在所述第一绝缘层下方的导电层电连接。
  15. 根据权利要求13所述的制作触控基板的方法，还包括：
    在形成有黑矩阵的衬底上形成金属层；
    对所述金属层进行图案化，以形成所述信号走线和所述屏蔽线；
    在图案化的金属层上形成第一绝缘层；
    在所述第一绝缘层中形成第二过孔，以暴露设置在所述第一绝缘层下方的信号走线；以及
    在所述第一绝缘层上形成导电层，所述导电层填充所述第二过孔，以电连接至所述第一绝缘层下方的信号走线。
  16. 根据权利要求13所述的制作触控基板的方法，其中，
    所述外围区包括用于与外部的集成电路或柔性印刷电路板电连 接的连线区，并且所述方法还包括：
    在所述连线区上形成接地端，并且所述屏蔽线电连接至所述接地端。
  17. 一种触控显示装置，包括根据权利要求1-12中任一项所述的触控基板。
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