WO2018112694A1 - Capacitor, flat-panel display, and capacitor manufacturing method - Google Patents

Capacitor, flat-panel display, and capacitor manufacturing method Download PDF

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Publication number
WO2018112694A1
WO2018112694A1 PCT/CN2016/110739 CN2016110739W WO2018112694A1 WO 2018112694 A1 WO2018112694 A1 WO 2018112694A1 CN 2016110739 W CN2016110739 W CN 2016110739W WO 2018112694 A1 WO2018112694 A1 WO 2018112694A1
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Prior art keywords
connection
unit
electrode
electrodes
capacitor
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PCT/CN2016/110739
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French (fr)
Chinese (zh)
Inventor
赵继刚
袁泽
余晓军
魏鹏
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深圳市柔宇科技有限公司
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Priority to PCT/CN2016/110739 priority Critical patent/WO2018112694A1/en
Publication of WO2018112694A1 publication Critical patent/WO2018112694A1/en

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics

Abstract

A capacitor, comprising a first electrode layer (10) and a second electrode layer (20) oppositely arranged, and an insulation layer (30) between the first electrode layer (10) and the second electrode layer (20). The first electrode layer (10) comprises at least two first electrodes (1001) and at least one first connection electrode (1002), and each first connection electrode (1002) is connected to two adjacent first electrodes (1001). The second electrode layer (20) comprises at least two second electrodes (2001) and at least one second connection electrode (2002), and each second connection electrode (2002) is connected to two adjacent second electrodes (2001). The second electrodes (2001) directly face the first electrodes (1001), respectively. Orthographic projections of the second electrodes (2001) on the first electrode layer (10) cover the first electrodes (1001), respectively. An orthographic projection of the second connection electrode (2002) on the first electrode layer (10) does not overlap the first connection electrode (1002). The present invention prevents short-circuit failures between the first connection electrode (1002) and the second connection electrode (2002) introduced by molten metal or metal residues generated during a laser cutting process, thus improving the repair success rate.

Description

Capacitor, flat panel display and capacitor manufacturing method Technical field

The present application relates to the field of display technologies, and in particular, to a method for fabricating a capacitor, a flat panel display, and a capacitor.

Background technique

Capacitance is a commonly used electronic device in flat panel displays. The conventional capacitor structure consists of two layers of metal and an insulating layer sandwiched between two layers of metal and isolated from two layers of metal. In the preparation of the capacitor, in the thin film deposition process or other processes, the surface of the substrate, the electrode layer or the insulating layer is liable to cause a problem that the two layers of metal are in contact with each other and short-circuit occurs, so that the function of the capacitor is completely invalid, which affects the quality of the flat panel display. In the production process of capacitors, how to repair defective capacitors on the production line is particularly important to reduce production costs.

In the prior art, the repair method of the defective capacitor is to use laser cutting to remove the short-circuited portion, but in the position where the capacitor is laser-cut, a new short circuit is easily generated between the two layers of metal due to the contact of the molten metal or the metal residue. Poor, causing secondary failure, resulting in maintenance failure, capacitor repair success rate is low, resulting in material waste, increasing production costs.

Summary of the invention

The technical problem to be solved by the present application is to provide a capacitor, a flat panel display and a capacitor manufacturing method for solving the problem that a new short circuit defect is easily generated between two layers of metal due to the contact of molten metal or metal residues in the prior art. Caused by secondary failure, resulting in maintenance failure, capacitor repair success rate is low, resulting in material waste, increasing production costs.

In order to solve the above technical problem, the present application provides a capacitor including a first electrode layer, a second electrode layer, and an insulating layer between the first electrode layer and the second electrode layer. The first electrode layer includes at least two first electrodes and at least one first connection electrode, each of the first connection electrodes connecting two adjacent first electrodes, and the second electrode layer includes at least two a second electrode and at least one second connecting electrode, each of the second connecting electrodes connecting two adjacent second electrodes, each of the second electrodes facing each of the first electrodes, a second electrode at the first An orthographic projection on the electrode layer respectively covers the first electrode, and an orthographic projection of each of the second connection electrodes on the first electrode layer does not intersect the second connection electrode.

Wherein each of the first electrode, the insulating layer and the second electrode facing the first electrode are stacked to form a sub-capacitor unit, each of the first connecting electrode, the insulating layer and corresponding The second connecting electrodes of the first connecting electrodes are stacked to form a connecting unit; the number of the sub-capacitor units is at least three, including a first sub-capacitor unit, a second sub-capacitor unit and a third sub-capacitor unit; The number of the connecting units is at least two, including a first connecting unit and a second connecting unit; the first sub-capacitor unit is connected to the second sub-capacitor unit by the first connecting unit, the second sub-unit The capacitor unit is connected to the third sub-capacitor unit through the second connecting unit, and the first sub-capacitor unit and the third sub-capacitor unit are respectively located on two adjacent sides of the second sub-capacitor unit.

The sub-capacitor unit further includes a fourth sub-capacitor unit, the connection unit further includes a third connection unit and a fourth connection unit, the first connection unit, the second connection unit, and the third connection The unit and the fourth connection unit array are arranged to form a matrix of 2*2, and the third sub-capacitor unit is connected to the fourth sub-capacitor unit by the third connection unit, and the fourth sub-capacitor unit passes the The fourth connection unit is connected to the first sub-capacitor unit.

The sub-capacitor unit further includes a fifth sub-capacitor unit and a sixth sub-capacitor unit, the connection unit further includes a fifth connection unit, a sixth connection unit, and a seventh connection unit, the first connection unit, the The second connection unit, the third connection unit, the fourth connection unit, the fifth connection unit, and the sixth connection unit array are arranged to form a matrix of 2*3, and the second sub-capacitor unit passes The fifth connection unit is connected to the fifth sub-capacitor unit, the fifth sub-capacitor unit is connected to the sixth sub-capacitor unit through the sixth connection unit, and the sixth sub-capacitor unit passes the seventh The connecting unit is connected to the third sub-capacitor unit.

The sub-capacitor unit further includes a seventh sub-capacitor unit, the connection unit further includes an eighth connection unit, and the seventh sub-capacitor unit is connected to the fifth sub-capacitor unit by the eighth connection unit. The seventh sub-capacitor unit is located on a side of the fifth sub-capacitor unit that faces away from the sixth sub-capacitor unit.

The sub-capacitor unit further includes an eighth sub-capacitor unit and a ninth sub-capacitor unit, the connection unit further includes a ninth connection unit, a tenth connection unit, an eleventh connection unit, and a twelfth connection unit. a first connection unit, the second connection unit, the third connection unit, the fourth connection unit, the fifth connection unit, the sixth connection unit, the seventh sub-capacitor unit, Description The eighth sub-capacitor unit and the ninth sub-capacitor unit array are arranged to form a matrix of 3*3, and the eighth sub-capacitor unit is connected to the second sub-capacitor unit by the ninth connecting unit, the ninth sub-unit The capacitor unit is connected to the first sub-capacitor unit through the tenth connection unit, and the seventh sub-capacitor unit is connected to the eighth sub-capacitor unit through the eleventh connection unit, and the eighth sub-capacitor unit passes The twelfth connection unit is connected to the ninth sub-capacitor unit.

Wherein, the first electrode layer further includes a first lead, the first lead is used to connect the first connection electrode to a power source, and the second electrode layer further includes a second lead, the second lead is used The second connection electrode is connected to the power source.

The first connecting electrode, the insulating layer and the second connecting electrode corresponding to the first connecting electrode are stacked to form a connecting unit, and the first lead and the second lead are respectively connected The first connecting electrode of the connecting unit and the second connecting electrode.

Each of the first connection electrode, the insulating layer, and the second connection electrode corresponding to the first connection electrode are stacked to form a connection unit, and the first lead and the second lead are respectively connected differently The first connection electrode of the connection unit and the second connection electrode.

The application also provides a flat panel display comprising the capacitor of any of the above.

The application also provides a method for manufacturing a capacitor, comprising:

Depositing a metal or metal alloy material on the substrate to form a first electrode layer;

Photolithographic etching and stripping the first electrode layer to form at least two first electrodes and at least one first connection electrode, each of the first connection electrodes connecting two adjacent first electrodes;

Depositing a non-metal material on the side of the first electrode layer facing away from the substrate to form an insulating layer;

Depositing a metal or metal alloy material on the side of the insulating layer facing away from the first electrode layer to form a second electrode layer;

Photolithographic etching and stripping of the second electrode layer to form at least two second electrodes and at least one second connection electrode, each of the second connection electrodes connecting two adjacent second electrodes, each of the The two electrodes are respectively opposite to the first electrodes, and the orthographic projections of the second electrodes on the first electrode layer respectively cover the first electrodes, and each of the second connection electrodes is in the first electrode layer The upper orthographic projections are not intersected with the second connecting electrode.

In the process of fabricating the first electrode and the first connecting electrode on the first electrode layer, the number of the first electrodes is at least three, and the number of the first connecting electrodes is to There are two less, and two of the first electrodes are respectively connected to adjacent sides of the other of the first electrodes through the first connection electrodes.

In the process of fabricating the first electrode and the first connection electrode on the first electrode layer, the number of the first electrodes is at least four, and the number of the first connection electrodes is At least four, wherein the four first electrodes are arranged to form a matrix of 2*2, and each of the first connection electrodes is respectively connected between two adjacent first electrodes.

In the process of fabricating the first electrode and the first connection electrode on the first electrode layer, the number of the first electrodes is at least six, and the number of the first connection electrodes is At least seven, wherein the six first electrodes are arranged to form a 2*3 matrix, and each of the first connection electrodes is respectively connected between two adjacent first electrodes.

In the process of fabricating the first electrode and the first connection electrode on the first electrode layer, the number of the first electrodes is at least seven, and the number of the first connection electrodes is At least eight, wherein the six first electrodes are arranged to form a matrix of 2*3, each of the first connection electrodes being respectively connected between two adjacent first electrodes, and the other of the first The electrode is connected to one side of the first electrode facing away from the other of the first electrodes by the first connection electrode.

The number of the first electrodes formed in the process of forming the first electrode and the first connection electrode on the first electrode layer is at least nine, and the number of the first connection electrodes is At least twelve, wherein the nine first electrodes are arranged to form a matrix of 3*3, and each of the first connection electrodes is respectively connected between two adjacent first electrodes.

The method further includes:

Depositing a metal or metal alloy material on the substrate to form a first lead, the first lead is located at the first electrode layer, and the first lead is connected to the first connection electrode and a power source; Depositing a metal or metal alloy material away from the first electrode side to form a second lead, the second lead is located at the second electrode layer, and the second lead is connected to the second connection electrode and the power source The first lead and the second lead are used to electrically connect the first electrode layer and the second electrode layer to the power source, respectively.

Wherein, in the process of fabricating the first lead and the second lead, the first connecting electrode of the first lead connection and the second connecting electrode of the second lead are respectively connected to each other Two of the first electrodes and two of the second electrodes.

Wherein, in the process of fabricating the first lead and the second lead, the first lead connection The first connecting electrode and the second connecting electrode connected to the second lead are respectively connected to two corresponding first electrodes and two second electrodes.

The beneficial effects of the present application are as follows: the first electrode layer is divided into a plurality of first electrodes, and the second electrode layer is divided into a plurality of second electrodes, and each of the first electrodes is connected by a first connection electrode, and between the second electrodes Connected by the second connecting electrode, each of the first electrodes cooperates with a second electrode, and when a pair of the first electrode and the second electrode generate a short circuit defect, the laser is performed at the first connecting electrode and the second connecting electrode position. Cutting, separating the shorted pair of first electrodes and the second electrodes from the other first electrodes and the second electrodes, since the orthographic projections of the second connecting electrodes on the first electrode layer do not intersect with the second connecting electrodes, The molten metal or metal residue generated by the laser cutting process does not cause a new short circuit failure between the first connecting electrode and the second connecting electrode, and the repair success rate is high, and the production cost is reduced.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings to be used in the embodiments will be briefly described below. Obviously, the drawings in the following description are only some embodiments of the present application, Those skilled in the art can also obtain other drawings based on these drawings without paying any creative work.

FIG. 1 is a schematic structural diagram of a capacitor provided in Embodiment 1 of the present application.

2 is a cross-sectional view of a capacitor according to Embodiment 1 of the present application.

FIG. 3 is a cross-sectional view of the capacitor b-b according to the first embodiment of the present application.

FIG. 4 is a schematic structural diagram of a capacitor provided in Embodiment 2 of the present application.

FIG. 5 is a schematic structural diagram of a capacitor provided in Embodiment 3 of the present application.

FIG. 6 is a schematic structural diagram of a capacitor provided in Embodiment 4 of the present application.

FIG. 7 is a schematic structural diagram of a capacitor provided in Embodiment 5 of the present application.

FIG. 8 is a schematic structural diagram of a capacitor provided in Embodiment 6 of the present application.

9 to FIG. 11 are schematic diagrams showing the structure of a capacitor provided in Embodiment 7 of the present application.

FIG. 12 to FIG. 15 are schematic diagrams showing a capacitor laser cutting process according to an embodiment of the present application.

FIG. 16 to FIG. 17 are schematic diagrams showing processes of a method for fabricating a capacitor according to an embodiment of the present application.

detailed description

The technical solutions in the embodiments of the present application are clearly and completely described in the following with reference to the drawings in the embodiments of the present application. It is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without departing from the inventive scope are the scope of the present application.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 together. FIG. 2 and FIG. 3 respectively show a-a cross-sectional view and b-b cross-sectional view of the capacitor shown in FIG. 1 . The capacitor provided in the first embodiment of the present application is located on the substrate 40. Specifically, the capacitor includes a first electrode layer 10, a second electrode layer 20, and an insulation between the first electrode layer 10 and the second electrode layer 20. The layer 30, the insulating layer 30 isolates the first electrode layer 10 and the second electrode layer 20 from each other to prevent the first electrode layer 10 and the second electrode layer 20 from coming into contact with each other to cause a short circuit. The first electrode layer 10 includes at least two first electrodes 1001 and at least one first connection electrode 1002, and each of the first connection electrodes 1002 connects two adjacent first electrodes 1001, that is, when a first electrode 1001 or a first When the connection electrode 1002 is connected to the power source, the entire first electrode layer 10 is electrically connected to the power source; the second electrode layer 20 includes at least two second electrodes 2001 and at least one second connection electrode 2002, and each of the second connection electrodes 2002 connects two adjacent second electrodes 2001, that is, when one second electrode 2001 or one second connection electrode 2002 is connected to the power source, the entire second electrode layer 20 is electrically connected to the power source. In this embodiment, the number of the first electrodes 1001 is two, the number of the second electrodes 2001 is two, the number of the first connection electrodes 1002 is one, and the number of the second connection electrodes 2002 is one. Further, each of the second electrodes 2001 is opposite to each of the first electrodes 1001, and the orthographic projections of the second electrodes 2001 on the first electrode layer 10 respectively cover the first electrodes 1001, that is, each of the first electrodes 1001 corresponds to one The two electrodes 2001 cooperate with it and function to realize the capacitance; the orthographic projections of the second connection electrodes 2002 on the first electrode layer 10 do not intersect with the second connection electrode 2002, when a certain pair of first electrodes 1001 and When the two electrodes 2001 are short-circuited, laser cutting is performed at the positions of the first connection electrode 1002 and the second connection electrode 2002, and the short-circuited pair of first electrodes 1001 and the second electrodes 2001 and the other first electrodes 1001 and the second electrodes are performed. In 2001, since the orthographic projection of each of the second connection electrodes 2002 on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause the first connection electrode 1002 and the first connection electrode The second connection electrode 2002 has a new short circuit failure, and the repair success rate is high, which reduces the production cost.

Further, each of the first electrode 1001, the insulating layer 30, and the second electrode layer 20 facing the first electrode 1001 are stacked to form a sub-capacitor unit, and each of the first connecting electrode 1002, the insulating layer 30, and the corresponding first connecting electrode The second connection electrodes 2002 of 1002 are stacked to form one connection unit, and each adjacent two sub-capacitors The units are connected to each other by a connecting unit. In this embodiment, the sub-capacitor unit includes a first sub-capacitor unit 101 and a second sub-capacitor unit 102. The connection unit includes a first connection unit 201, and the first connection unit 201 is connected to the first sub-capacitor unit 101 and the second sub-capacitor unit. 102. When the first electrode 1001 of the first sub-capacitor unit 101 or the second sub-capacitor unit 102 and the second electrode 2001 generate a short-circuit defect, the first connection unit 201 is laser-cut, and the first sub-capacitor unit 101 and the second sub-unit are When the capacitor unit 102 is disconnected, the sub-capacitor unit that is not short-circuited can be kept in normal operation, thereby avoiding the direct disposal of the entire capacitor and reducing the production cost. Since the orthographic projection of the second connection electrode 2002 on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause a new short circuit defect inside the first connection unit 201. The success rate of repair is high, which reduces production costs.

4 is a schematic structural diagram of a capacitor according to Embodiment 2 of the present application. As shown in the figure, the sub-capacitor unit includes a first sub-capacitor unit 101, a second sub-capacitor unit 102, and a third sub-capacitor unit 103. The connection unit includes a first connection. The first sub-capacitor unit 101 is connected to the second sub-capacitor unit 102 via the first connection unit 201, and the second sub-capacitor unit 102 is connected to the third sub-capacitor unit 103 via the second connection unit 202. One sub-capacitor unit 101 and third sub-capacitor unit 103 are respectively located on two adjacent sides of the second sub-capacitor unit 102. Specifically, the first sub-capacitor unit 101, the second sub-capacitor unit 102, and the third sub-capacitor unit 103 are of the same shape and size, and the sub-capacitor unit includes a pair of first sides and a pair of connecting a pair of first sides. a second side, that is, a second side is connected to each end of each first side, and a first side is connected to each end of each second side, and the first side, the second side, the first side, the second side Closed end to end to form a closed figure. One end of the first connecting unit 201 and one end of the second connecting unit 202 are respectively connected to a first side and a second side connected to the second sub-capacitor unit 102, and the other end of the first connecting unit 201 is connected to the first sub-capacitor unit 101. The other end of the second connecting unit 202 is connected to the third sub-capacitor unit 103, so that the first sub-capacitor unit 101 and the third sub-capacitor unit 103 are respectively located on two adjacent sides of the second sub-capacitor unit 102, satisfying the device-to-capacitance Design requirements for structural shapes.

When the first electrode 1001 and the second electrode 2001 of any one of the first sub-capacitor unit 101, the second sub-capacitor unit 102, and the third sub-capacitor unit 103 have a short-circuit defect, the laser-cut short-circuited sub-capacitor The unit is used to connect the connection unit of other sub-capacitor units, and the sub-capacitor unit is separated from other normally working sub-capacitor units, so that other un-short-circuited sub-capacitor units can be kept working normally, thereby avoiding direct scrapping of the entire capacitor and reducing production cost. . Since the orthographic projection of the second connection electrode 2002 of the cut connection unit on the first electrode layer 10 does not intersect with the second connection electrode 2002, the laser is cut. The molten metal or metal residue generated by the process does not cause a new short circuit defect inside the connected connecting unit, and the repair success rate is high, and the production cost is lowered.

FIG. 5 is a schematic structural diagram of a capacitor according to Embodiment 3 of the present application. As shown in the figure, the difference between this embodiment and the second embodiment is that the sub-capacitor unit further includes a fourth sub-capacitor unit 104, and the connection unit further includes a third connection unit. 203 and the fourth connecting unit 204, the first connecting unit 201, the second connecting unit 202, the third connecting unit 203, and the fourth connecting unit 204 are arranged in an array to form a matrix of 2*2, and the third sub-capacitor unit 103 is connected through the third connection. The unit 203 is connected to the fourth sub-capacitor unit 104, and the fourth sub-capacitor unit 104 is connected to the first sub-capacitor unit 101 via the fourth connection unit 204. When the first electrode 1001 and the second electrode 2001 of any one of the first sub-capacitor unit 101, the second sub-capacitor unit 102, the third sub-capacitor unit 103, and the fourth connection unit 204 are short-circuit defective, The laser capacitor short-circuited sub-capacitor unit is used to connect the connection unit of other sub-capacitor units, and the sub-capacitor unit is separated from other normally working sub-capacitor units to keep other un-short-circuited sub-capacitor units working normally, avoiding direct scrapping of the entire Capacitance reduces production costs. Since the orthographic projection of the second connection electrode 2002 of the cut connection unit on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause the inside of the connected connection unit to be cut. A new short circuit failure occurs, and the repair success rate is high, which reduces the production cost.

FIG. 6 is a schematic structural diagram of a capacitor according to Embodiment 4 of the present application. As shown in the figure, the difference between the embodiment and the third embodiment is that the sub-capacitor unit further includes a fifth sub-capacitor unit 105 and a sixth sub-capacitor unit 106. The unit further includes a fifth connection unit 205, a sixth connection unit 206, and a seventh connection unit 207, and the first connection unit 201, the second connection unit 202, the third connection unit 203, the fourth connection unit 204, and the fifth connection unit 205 And the array of the sixth connection unit 206 is arranged to form a matrix of 2*3, the second sub-capacitor unit 102 is connected to the fifth sub-capacitor unit 105 through the fifth connection unit 205, and the fifth sub-capacitor unit 105 is connected to the sixth connection unit 206 by the sixth connection unit 206. The sub-capacitor unit 106 and the sixth sub-capacitor unit 106 are connected to the third sub-capacitor unit 103 via the seventh connection unit 207. When the first electrode 1001 and the second electrode 2001 of any one of the sub-capacitor units have a short-circuit defect, the laser-cut short-circuited sub-capacitor unit is used to connect the connection unit of the other sub-capacitor unit, and the sub-capacitor unit and other normally working sub-capacitors By blocking the capacitor unit, other sub-capacitor units that are not short-circuited can be kept in normal operation, thereby avoiding the direct disposal of the entire capacitor and reducing the production cost. Since the orthographic projection of the second connection electrode 2002 of the cut connection unit on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause A new short circuit failure occurs inside the connected connecting unit, and the repair success rate is high, which reduces the production cost.

FIG. 7 is a schematic structural diagram of a capacitor according to Embodiment 5 of the present application. As shown in the figure, the difference between the embodiment and the fourth embodiment is that the sub-capacitor unit further includes a seventh sub-capacitor unit 107, and the connection unit further includes an eighth connection unit. 208. The seventh sub-capacitor unit 107 is connected to the fifth sub-capacitor unit 105 via the eighth connection unit 208. The seventh sub-capacitor unit 107 is located on a side of the fifth sub-capacitor unit 105 that faces away from the sixth sub-capacitor unit 106. Specifically, each sub-capacitor unit is a structure having the same shape and size, and the sub-capacitor unit includes a pair of first sides and a pair of second sides connecting the pair of first sides, that is, one end of each of the first sides is connected The second side has a first side connected to each end of the second side, and the first side, the second side, the first side and the second side are connected end to end to form a closed figure. One end of the fifth connecting unit 205, one end of the sixth connecting unit 206, and one end of the eighth connecting unit 208 are respectively connected to a first side, a second side and a first side connected to the fifth sub-capacitor unit 105, and a sixth The other end of the connecting unit 206 is connected to the sixth sub-capacitor unit 106, and the other end of the eighth connecting unit 208 is connected to the seventh sub-capacitor unit 107, so that the sixth sub-capacitor unit 106 and the seventh sub-capacitor unit 107 are located in the fifth sub-capacitor. The opposite sides of the unit 105 meet the design requirements of the device for the shape of the capacitor structure.

When the first electrode 1001 and the second electrode 2001 of any one of the sub-capacitor units have a short-circuit defect, the laser-cut short-circuited sub-capacitor unit is used to connect the connection unit of the other sub-capacitor unit, and the sub-capacitor unit and other normally working sub-capacitors By blocking the capacitor unit, other sub-capacitor units that are not short-circuited can be kept in normal operation, thereby avoiding the direct disposal of the entire capacitor and reducing the production cost. Since the orthographic projection of the second connection electrode 2002 of the cut connection unit on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause the inside of the connected connection unit to be cut. A new short circuit failure occurs, and the repair success rate is high, which reduces the production cost.

FIG. 8 is a schematic structural diagram of a capacitor according to Embodiment 6 of the present application. As shown in the figure, the difference between the embodiment and the fifth embodiment is that the sub-capacitor unit further includes an eighth sub-capacitor unit 108 and a ninth sub-capacitor unit 109. The unit further includes a ninth connection unit 209, a tenth connection unit 210, an eleventh connection unit 211, and a twelfth connection unit 212, a first connection unit 201, a second connection unit 202, a third connection unit 203, and a fourth connection. The cells 204, the fifth connecting unit 205, the sixth connecting unit 206, the seventh sub-capacitor unit 107, the eighth sub-capacitor unit 108, and the ninth sub-capacitor unit 109 are arranged in an array to form a matrix of 3*3, and the eighth sub-capacitor unit 108 The second sub-capacitor unit 102 is connected through the ninth connecting unit 209, and the ninth sub-capacitor unit 109 is connected to the first sub-capacitor unit 101 through the tenth connecting unit 210, and the seventh sub-capacitor unit 107 The eighth sub-capacitor unit 108 is connected through the eleventh connection unit 211, and the eighth sub-capacitor unit 108 is connected to the ninth sub-capacitor unit 109 through the twelfth connection unit 212. When the first electrode 1001 and the second electrode 2001 of any one of the sub-capacitor units have a short-circuit defect, the laser-cut short-circuited sub-capacitor unit is used to connect the connection unit of the other sub-capacitor unit, and the sub-capacitor unit and other normally working sub-capacitors By blocking the capacitor unit, other sub-capacitor units that are not short-circuited can be kept in normal operation, thereby avoiding the direct disposal of the entire capacitor and reducing the production cost. Since the orthographic projection of the second connection electrode 2002 of the cut connection unit on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause the inside of the connected connection unit to be cut. A new short circuit failure occurs, and the repair success rate is high, which reduces the production cost.

The first electrode layer 10 is divided into a plurality of first electrodes 1001, and the second electrode layer 20 is divided into a plurality of second electrodes 2001. The first electrodes 1001 are connected by a first connection electrode 1002, and between the second electrodes 2001. Connected by the second connection electrode 2002, each of the first electrodes 1001 cooperates with one of the second electrodes 2001, and when a certain pair of first electrodes 1001 and the second electrodes 2001 are short-circuited, at the first connection electrodes 1002 and The position of the two connection electrodes 2002 is laser-cut, and the short-circuited pair of first electrodes 1001 and the second electrodes 2001 are separated from the other first electrodes 1001 and the second electrodes 2001, since each of the second connection electrodes 2002 is on the first electrode layer 10 The front projections are not intersected with the second connection electrode 2002, and the molten metal or metal residue generated by the laser cutting process does not cause a new short circuit failure between the first connection electrode 1002 and the second connection electrode 2002, and the maintenance success rate is high and the reduction is high. Production costs.

Referring to FIG. 9 , FIG. 10 and FIG. 11 , the capacitor provided in the seventh embodiment of the present application is different from the other embodiments in that the first electrode layer 10 further includes a first lead 501 , and the first lead 501 is connected to the first Connecting the electrode 1002 and the power source, the second electrode layer 20 further includes a second lead 502, and the second lead 502 is connected to the second connection electrode 2002 and the power source. Since the sub-capacitor units are connected to each other through the connection unit, the first lead 501 and The second lead 502 electrically connects the first electrode layer 10 and the second electrode layer 20 to a power source, respectively, to energize the capacitor.

In one embodiment, the first lead 501 and the second lead 502 are respectively connected to the first connection electrode 1002 and the second connection electrode 2002 of the same connection unit. Specifically, taking the capacitor of the fourth embodiment as an example, as shown in FIG. 9, the first lead 501 and the second lead 502 are both connected to the second connecting unit 202, that is, the first lead 501 is connected to the first connecting unit 202. The electrode 1002 is connected to the power source, and the second lead 502 is connected to the second connection electrode 2002 of the second connection unit 202 and the power source. The capacitor passes through the first lead 501 and the second lead Other electronic devices are connected before the 502 is connected to the power source. Changing the positions of the first lead 501 and the second lead 502 can coordinate the position of the electronic device to meet the design requirements of the device.

In another embodiment, the first lead 501 and the second lead 502 are respectively connected to the first connection electrode 1002 and the second connection electrode 2002 of different connection units. Specifically, taking the capacitor of the fourth embodiment as an example, as shown in FIG. 10, the first lead 501 is connected to the first connection electrode 1002 of the third connection unit 203, and the second lead 502 is connected to the second connection unit 202. The second connection electrode 2002; or, as shown in FIG. 11, the first lead 501 is connected to the first connection electrode 1002 of the fourth connection unit 204, and the second lead 502 is connected to the second connection electrode 2002 of the second connection unit 202. The capacitors are connected to other electronic devices before the first lead 501 and the second lead 502 are connected to the power source. Changing the positions of the first lead 501 and the second lead 502 can coordinate the position of the electronic device to meet the design requirements of the device.

12 to FIG. 15, when the first electrode 1001 and the second electrode 2001 of any one of the sub-capacitor units have a short-circuit defect, the laser-cut short-circuited sub-capacitor unit is used to connect the connection units of the other sub-capacitor units, and the sub-capacitor is connected. The unit is separated from other normally working sub-capacitor units to keep other un-short-circuited sub-capacitor units working properly, avoiding the direct scrapping of the entire capacitor and reducing production costs. Specifically, when the first capacitor sub-unit is short-circuited, the second connecting unit 202 and the fourth connecting unit 204 are laser-cut, and the first capacitor sub-unit is separated from the other capacitor sub-units to keep the other sub-capacitor units working normally; When the second capacitor subunit is short-circuited, the first connecting unit 201 and the second connecting unit 202 are laser-cut, and the first lead 501 and the second lead 502 are left, and the second capacitor sub-unit is separated from the other capacitor sub-units. Keeping the other sub-capacitor units working normally; when the third capacitor sub-units have a short-circuit defect, the second connecting unit 202 and the third connecting unit 203 are laser-cut, and the first lead 501 and the second lead 502 are left, and the third capacitor is left. The subunit is separated from the other capacitor subunits to keep the other subcapacitor units working normally; when the fourth capacitor subunits have a short circuit failure, the third connection unit 203 and the fourth connection unit 204 are laser cut, and the first lead 501 is retained and The second lead 502 separates the fourth capacitor sub-unit from the other capacitor sub-units to keep the other sub-capacitor units working normally. Since the orthographic projection of the second connection electrode 2002 of the cut connection unit on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause the inside of the connected connection unit to be cut. A new short circuit failure occurs, and the repair success rate is high, which reduces the production cost.

The application also provides a flat panel display comprising the capacitor provided by any of the above embodiments. The first electrode layer 10 of the capacitor used in the flat panel display is divided into a plurality of first electrodes 1001, and the second electrode layer 20 is divided into a plurality of second electrodes 2001, and each of the first electrodes 1001 is connected by a first connection electrode 1002, and each of the second electrodes 2001 is connected by a second connection electrode 2002, and each of the first electrodes 1001 corresponds to one The two electrodes 2001 cooperate to work. When a pair of the first electrode 1001 and the second electrode 2001 are short-circuited, laser cutting is performed at the positions of the first connecting electrode 1002 and the second connecting electrode 2002, and the short-circuited pair of first electrodes 1001 Separating from the second electrode 2001 and the other first electrodes 1001 and the second electrodes 2001, since the orthographic projections of the respective second connection electrodes 2002 on the first electrode layer 10 do not intersect with the second connection electrodes 2002, the laser cutting process is generated. The molten metal or metal residue does not cause a new short circuit failure between the first connection electrode 1002 and the second connection electrode 2002, and the repair success rate is high, which reduces the production cost.

Referring to FIG. 16, the present application further provides a method for fabricating a capacitor, and the specific steps are as follows:

S101, depositing a metal or metal alloy material on the substrate 40 to form the first electrode layer 10.

A metal or metal alloy of Mo, Al, Cu or the like is deposited on the substrate 40 to form a flat first electrode layer 10 for subsequent processing.

S102, lithography etching and stripping the first electrode layer 10 form at least two first electrodes 1001 and at least one first connection electrode 1002, and each of the first connection electrodes 1002 connects the adjacent two first electrodes 1001.

Referring to FIG. 17, the first electrode layer 10 is photolithographically etched and the material of the portion of the first electrode layer 10 is stripped, and the remaining portion of the first electrode layer 10 forms at least two first electrodes 1001 and at least one first connection electrode 1002. The adjacent two first electrodes 1001 do not directly intersect but are connected by a first connection electrode 1002. By laser cutting the first connection electrode 1002, the two first electrodes 1001 that are originally connected can be directly disconnected, so that the two adjacent first electrodes 1001 are not electrically connected.

S103, depositing a non-metal material on the side of the first electrode layer 10 facing away from the substrate 40 to form the insulating layer 30.

A non-metal material or a metal oxide such as SiNx, SiOx, an organic material or the like is deposited on the surface of the first electrode layer 10 to form an insulating layer 30 for isolating the first electrode layer 10 and a second layer to be deposited on the surface of the insulating layer 30. Electrode layer 20 to form a complete capacitor structure.

S104, depositing a metal or metal alloy material on the side of the insulating layer 30 facing away from the first electrode layer 10 to form the second electrode layer 20.

A metal or metal alloy of Mo, Al, Cu or the like is deposited on the insulating layer 30 to form a flat second electrode layer 20 for subsequent processing.

S105, lithographic etching and stripping of the second electrode layer 20 form at least two second electrodes 2001 and at least one second connection electrode 2002.

The second electrode layer 20 is photolithographically etched and the material of the second electrode layer 20 is peeled off, and the remaining portion of the second electrode layer 20 forms at least two second electrodes 2001 and at least one second connection electrode 2002 adjacent to each other. The two second electrodes 2001 do not directly intersect but are connected by a second connection electrode 2002. By laser cutting the second connection electrode 2002, the two adjacent second electrodes 2001 can be directly disconnected, so that the two adjacent second electrodes 2001 are not electrically connected.

Further, each of the second connection electrodes 2002 is connected to two adjacent second electrodes 2001, and each of the second electrodes 2001 is opposite to each of the first electrodes 1001, and the orthographic projections of the second electrodes 2001 on the first electrode layer 10 are respectively The first electrode 1001 is covered, and the orthographic projections of the second connection electrodes 2002 on the first electrode layer 10 do not intersect with the second connection electrode 2002.

The first electrode layer 10 is divided into a plurality of first electrodes 1001, and the second electrode layer 20 is divided into a plurality of second electrodes 2001. The first electrodes 1001 are connected by a first connection electrode 1002, and between the second electrodes 2001. Connected by the second connection electrode 2002, each of the first electrodes 1001 cooperates with one of the second electrodes 2001, and when a certain pair of first electrodes 1001 and the second electrodes 2001 are short-circuited, at the first connection electrodes 1002 and The position of the two connection electrodes 2002 is laser-cut, and the short-circuited pair of first electrodes 1001 and the second electrodes 2001 are separated from the other first electrodes 1001 and the second electrodes 2001, since each of the second connection electrodes 2002 is on the first electrode layer 10 The front projections are not intersected with the second connection electrode 2002, and the molten metal or metal residue generated by the laser cutting process does not cause a new short circuit failure between the first connection electrode 1002 and the second connection electrode 2002, and the maintenance success rate is high and the reduction is high. Production costs.

With reference to FIG. 4, in one embodiment, in the process of fabricating the first electrode 1001 and the first connection electrode 1002 on the first electrode layer 10, the number of the first electrodes 1001 is at least three, forming the first connection electrode 1002. The number of the first electrodes 1001 is respectively connected to the adjacent sides of the other first electrode 1001 through the first connection electrode 1002. When a first electrode 1001 and the corresponding second electrode 2001 generate a short circuit defect, the first connection electrode 1002 and the second connection electrode 2002 are laser-cut, and the short-circuited first electrode 1001 and the corresponding second electrode 2001 are not short-circuited. The first electrode 1001 and the corresponding second electrode 2001 are separated, so that the first electrode 1001 and the corresponding second electrode 2001 that are not short-circuited can be normally operated, thereby avoiding direct scrapping of the entire capacitor and reducing the production cost. Since the orthographic projection of the second connection electrode 2002 on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause a new short circuit defect inside the first connection unit 201. The success rate of repair is high, which reduces production costs.

With reference to FIG. 5, in one embodiment, in the process of fabricating the first electrode 1001 and the first connection electrode 1002 on the first electrode layer 10, the number of the first electrodes 1001 is at least four, forming the first connection electrode 1002. The number is at least four, and four of the first electrodes 1001 are arranged to form a matrix of 2*2. When a first electrode 1001 and the corresponding second electrode 2001 generate a short circuit defect, the first connection electrode 1002 and the second connection electrode 2002 are laser-cut, and the short-circuited first electrode 1001 and the corresponding second electrode 2001 are not short-circuited. The first electrode 1001 and the corresponding second electrode 2001 are separated, so that the first electrode 1001 and the corresponding second electrode 2001 that are not short-circuited can be normally operated, thereby avoiding direct scrapping of the entire capacitor and reducing the production cost. Since the orthographic projection of the second connection electrode 2002 on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause a new short circuit defect inside the first connection unit 201. The success rate of repair is high, which reduces production costs.

With reference to FIG. 6, in one embodiment, in the process of fabricating the first electrode 1001 and the first connection electrode 1002 on the first electrode layer 10, the number of the first electrodes 1001 is at least six, forming the first connection electrode 1002. The number of the first electrodes 1001 is arranged to form a matrix of 2*3, and each of the first connection electrodes 1002 is connected between the adjacent two first electrodes 1001. When a first electrode 1001 and the corresponding second electrode 2001 generate a short circuit defect, the first connection electrode 1002 and the second connection electrode 2002 are laser-cut, and the short-circuited first electrode 1001 and the corresponding second electrode 2001 are not short-circuited. The first electrode 1001 and the corresponding second electrode 2001 are separated, so that the first electrode 1001 and the corresponding second electrode 2001 that are not short-circuited can be normally operated, thereby avoiding direct scrapping of the entire capacitor and reducing the production cost. Since the orthographic projection of the second connection electrode 2002 on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause a new short circuit defect inside the first connection unit 201. The success rate of repair is high, which reduces production costs.

With reference to FIG. 7, in one embodiment, in the process of fabricating the first electrode 1001 and the first connection electrode 1002 on the first electrode layer 10, the number of the first electrodes 1001 is at least seven, and the first connection electrode 1002 is formed. The number of the first electrodes 1001 is arranged to form a matrix of 2*3, and each of the first connection electrodes 1002 is respectively connected between two adjacent first electrodes 1001, and the other first electrode 1001 The first connection electrode 1002 is connected to one side of the first electrode 1001 facing away from the other row of the first electrodes 1001. When a first electrode 1001 and the corresponding second electrode 2001 generate a short circuit defect, the first connection electrode 1002 and the second connection electrode 2002 are laser-cut, and the short-circuited first electrode 1001 and the corresponding second electrode 2001 are not short-circuited. The first electrode 1001 and the corresponding second electrode 2001 are separated, The first electrode 1001 and the corresponding second electrode 2001 that are not short-circuited can be normally operated, thereby avoiding directly scrapping the entire capacitor and reducing the production cost. Since the orthographic projection of the second connection electrode 2002 on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause a new short circuit defect inside the first connection unit 201. The success rate of repair is high, which reduces production costs.

With reference to FIG. 8, in one embodiment, in the process of fabricating the first electrode 1001 and the first connection electrode 1002 on the first electrode layer 10, the number of the first electrodes 1001 is at least nine, forming the first connection electrode 1002. The number of the first electrodes 1001 is arranged to form a matrix of 3*3, and each of the first connection electrodes 1002 is respectively connected between the adjacent two first electrodes 1001. When a first electrode 1001 and the corresponding second electrode 2001 generate a short circuit defect, the first connection electrode 1002 and the second connection electrode 2002 are laser-cut, and the short-circuited first electrode 1001 and the corresponding second electrode 2001 are not short-circuited. The first electrode 1001 and the corresponding second electrode 2001 are separated, so that the first electrode 1001 and the corresponding second electrode 2001 that are not short-circuited can be normally operated, thereby avoiding direct scrapping of the entire capacitor and reducing the production cost. Since the orthographic projection of the second connection electrode 2002 on the first electrode layer 10 does not intersect with the second connection electrode 2002, the molten metal or metal residue generated by the laser cutting process does not cause a new short circuit defect inside the first connection unit 201. The success rate of repair is high, which reduces production costs.

In this embodiment, the capacitor manufacturing method further includes: depositing a metal or metal alloy material on the substrate 40 to form a first lead 501, the first lead 501 is located on the first electrode layer 10, and the first lead 501 is connected to the first connecting electrode 1002. And a power source; a metal or metal alloy material is deposited on the side of the insulating layer 30 away from the first electrode 1001 to form a second lead 502, the second lead 502 is located on the second electrode layer 20, and the second lead 502 is connected to the second connection electrode 2002 and the power source. Since the sub-capacitor units are connected to each other through the connection unit, the first lead 501 and the second lead 502 electrically connect the first electrode layer 10 and the second electrode layer 20 to the power source, respectively, to energize the capacitor.

In one embodiment, in the process of fabricating the first lead 501 and the second lead 502, the first connecting electrode 1002 connected to the first lead 501 and the second connecting electrode 2002 connected to the second lead 502 are respectively connected to the corresponding two The first electrode 1001 and the two second electrodes 2001. Specifically, taking the capacitor of the fourth embodiment as an example, in conjunction with FIG. 9, the first lead 501 and the second lead 502 are respectively connected to the first connecting electrode 1002 and the second connecting electrode 2002 of the same connecting unit. The first lead 501 and the second lead 502 are both connected to the second connecting unit 202, that is, the first lead 501 is connected to the first connecting electrode 1002 of the second connecting unit 202 and The second lead 502 is connected to the second connection electrode 2002 of the second connection unit 202 and the power source. The capacitors are connected to other electronic devices before the first lead 501 and the second lead 502 are connected to the power source. Changing the positions of the first lead 501 and the second lead 502 can coordinate the position of the electronic device to meet the design requirements of the device.

In another embodiment, in the process of fabricating the first lead 501 and the second lead 502, the first connecting electrode 1002 connected to the first lead 501 and the second connecting electrode 2002 connected to the second lead 502 are respectively connected to each other. Two first electrodes 1001 and two second electrodes 2001. Specifically, taking the capacitor of the fourth embodiment as an example, the first lead 501 and the second lead 502 are respectively connected to the first connection electrode 1002 and the second connection electrode 2002 of different connection units. 10, the first lead 501 is connected to the first connection electrode 1002 of the third connection unit 203, and the second lead 502 is connected to the second connection electrode 2002 of the second connection unit 202; or, in conjunction with FIG. 11, the first lead 501 is connected to the first connection electrode 1002 of the fourth connection unit 204, and the second lead 502 is connected to the second connection electrode 2002 of the second connection unit 202. The capacitors are connected to other electronic devices before the first lead 501 and the second lead 502 are connected to the power source. Changing the positions of the first lead 501 and the second lead 502 can coordinate the position of the electronic device to meet the design requirements of the device.

12 to FIG. 15, when the first electrode 1001 and the second electrode 2001 of any one of the sub-capacitor units have a short-circuit defect, the laser-cut short-circuited sub-capacitor unit is used to connect the connection units of the other sub-capacitor units, and the sub-capacitor is connected. The unit is separated from other normally working sub-capacitor units to keep other un-short-circuited sub-capacitor units working properly, avoiding the direct scrapping of the entire capacitor and reducing production costs. Specifically, when the first capacitor sub-unit is short-circuited, the second connecting unit 202 and the fourth connecting unit 204 are laser-cut, and the first capacitor sub-unit is separated from the other capacitor sub-units to keep the other sub-capacitor units working normally; When the second capacitor subunit is short-circuited, the first connecting unit 201 and the second connecting unit 202 are laser-cut, and the first lead 501 and the second lead 502 are left, and the second capacitor sub-unit is separated from the other capacitor sub-units. Keeping the other sub-capacitor units working normally; when the third capacitor sub-units have a short-circuit defect, the second connecting unit 202 and the third connecting unit 203 are laser-cut, and the first lead 501 and the second lead 502 are left, and the third capacitor is left. The subunit is separated from the other capacitor subunits to keep the other subcapacitor units working normally; when the fourth capacitor subunits have a short circuit failure, the third connection unit 203 and the fourth connection unit 204 are laser cut, and the first lead 501 is retained and The second lead 502 separates the fourth capacitor sub-unit from the other capacitor sub-units to keep the other sub-capacitor units working normally. Due to the cut connection list The orthographic projection of the second connection electrode 2002 on the first electrode layer 10 does not intersect with the second connection electrode 2002, and the molten metal or metal residue generated by the laser cutting process does not cause a new short circuit defect inside the connected connection unit. The repair success rate is high, which reduces the production cost.

The foregoing is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalents within the technical scope disclosed in the present application. Modifications or substitutions are intended to be included within the scope of the present application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims.

Claims (19)

  1. A capacitor, wherein the capacitor includes a first electrode layer, a second electrode layer, and an insulating layer between the first electrode layer and the second electrode layer, the first electrode layer includes At least two first electrodes and at least one first connection electrode, each of the first connection electrodes connecting two adjacent first electrodes, the second electrode layer comprising at least two second electrodes and at least one a second connection electrode, each of the second connection electrodes is connected to two adjacent second electrodes, each of the second electrodes is opposite to each of the first electrodes, and the second electrode is in the An orthographic projection on an electrode layer respectively covers the first electrode, and an orthographic projection of each of the second connection electrodes on the first electrode layer does not intersect the second connection electrode.
  2. The capacitor according to claim 1, wherein each of said first electrode, said insulating layer and said second electrode facing said first electrode are laminated to form a sub-capacitor unit, each of said first The connection electrode, the insulating layer and the second connection electrode corresponding to the first connection electrode are stacked to form a connection unit; the number of the sub-capacitance units is at least three, including the first sub-capacitor unit and the second sub-capacitor a capacitor unit and a third sub-capacitor unit; the number of the connection units is at least two, including a first connection unit and a second connection unit; and the first sub-capacitor unit is connected to the second by the first connection unit a sub-capacitor unit, wherein the second sub-capacitor unit is connected to the third sub-capacitor unit by the second connecting unit, wherein the first sub-capacitor unit and the third sub-capacitor unit are respectively located in the second sub-capacitor The adjacent sides of the unit.
  3. The capacitor according to claim 2, wherein the sub-capacitor unit further comprises a fourth sub-capacitor unit, the connection unit further comprising a third connection unit and a fourth connection unit, the first connection unit, the first The second connection unit, the third connection unit, and the fourth connection unit array are arranged to form a matrix of 2*2, and the third sub-capacitor unit is connected to the fourth sub-capacitor unit by the third connection unit. The fourth sub-capacitor unit is connected to the first sub-capacitor unit through the fourth connection unit.
  4. The capacitor according to claim 3, wherein the sub-capacitor unit further comprises a fifth sub-capacitor unit and a sixth sub-capacitor unit, the connection unit further comprising a fifth connection unit, a sixth connection unit, and a seventh connection unit The first connection unit, the second connection unit, the third connection unit, the fourth connection unit, the fifth connection unit, and the sixth connection unit array are arranged to form a matrix of 2*3 The second sub-capacitor unit is connected to the fifth sub-capacitor unit through the fifth connecting unit, The fifth sub-capacitor unit is connected to the sixth sub-capacitor unit through the sixth connection unit, and the sixth sub-capacitor unit is connected to the third sub-capacitor unit through the seventh connection unit.
  5. The capacitor according to claim 4, wherein said sub-capacitor unit further comprises a seventh sub-capacitor unit, said connection unit further comprising an eighth connection unit, said seventh sub-capacitor unit being connected by said eighth connection unit The fifth sub-capacitor unit is located at a side of the fifth sub-capacitor unit that faces away from the sixth sub-capacitor unit.
  6. The capacitor according to claim 5, wherein the sub-capacitor unit further comprises an eighth sub-capacitor unit and a ninth sub-capacitor unit, the connection unit further comprising a ninth connection unit, a tenth connection unit, and an eleventh connection a unit and a twelfth connection unit, the first connection unit, the second connection unit, the third connection unit, the fourth connection unit, the fifth connection unit, the sixth connection unit, The seventh sub-capacitor unit, the eighth sub-capacitor unit, and the ninth sub-capacitor unit array are arranged to form a matrix of 3*3, and the eighth sub-capacitor unit is connected to the first through the ninth connecting unit a second sub-capacitor unit, wherein the ninth sub-capacitor unit is connected to the first sub-capacitor unit through the tenth connection unit, and the seventh sub-capacitor unit is connected to the eighth sub-capacitor through the eleventh connection unit And the eighth sub-capacitor unit is connected to the ninth sub-capacitor unit by the twelfth connecting unit.
  7. The capacitor of claim 1 wherein said first electrode layer further comprises a first lead for connecting said first connection electrode to a power source, said second electrode layer further comprising Two leads for connecting the second connection electrode to the power source.
  8. The capacitor according to claim 7, wherein each of said first connection electrode, said insulating layer and said second connection electrode corresponding to said first connection electrode are laminated to form a connection unit, said first lead The first connecting electrode and the second connecting electrode of the same connecting unit are respectively connected to the second lead.
  9. The capacitor according to claim 7, wherein each of said first connection electrode, said insulating layer and said second connection electrode corresponding to said first connection electrode are laminated to form a connection unit, said first lead The first connection electrode and the second connection electrode of the connection unit different from each other are connected to the second lead.
  10. A flat panel display, wherein the flat panel display comprises the capacitor of any one of claims 1 to 9.
  11. A method of manufacturing a capacitor, comprising:
    Depositing a metal or metal alloy material on the substrate to form a first electrode layer;
    Photolithographic etching and stripping the first electrode layer to form at least two first electrodes and at least one first connection electrode, each of the first connection electrodes connecting two adjacent first electrodes;
    Depositing a non-metal material on the side of the first electrode layer facing away from the substrate to form an insulating layer;
    Depositing a metal or metal alloy material on the side of the insulating layer facing away from the first electrode layer to form a second electrode layer;
    Photolithographic etching and stripping of the second electrode layer to form at least two second electrodes and at least one second connection electrode, each of the second connection electrodes connecting two adjacent second electrodes, each of the The two electrodes are respectively opposite to the first electrodes, and the orthographic projections of the second electrodes on the first electrode layer respectively cover the first electrodes, and each of the second connection electrodes is in the first electrode layer The upper orthographic projections are not intersected with the second connecting electrode.
  12. The method of manufacturing a capacitor according to claim 11, wherein in the process of fabricating the first electrode and the first connection electrode on the first electrode layer, the number of the first electrodes is at least three The number of the first connection electrodes is at least two, wherein two of the first electrodes are respectively connected to adjacent sides of the other of the first electrodes through the first connection electrodes.
  13. The capacitor according to claim 11, wherein in the process of fabricating the first electrode and the first connection electrode on the first electrode layer, the number of the first electrodes is at least four, forming The number of the first connection electrodes is at least four, wherein four of the first electrodes are arranged to form a matrix of 2*2, and each of the first connection electrodes is respectively connected to two adjacent first electrodes between.
  14. The capacitor according to claim 11, wherein in the process of fabricating the first electrode and the first connection electrode on the first electrode layer, the number of the first electrodes is at least six, forming The number of the first connection electrodes is at least seven, wherein the six first electrodes are arranged to form a matrix of 2*3, and each of the first connection electrodes is respectively connected to two adjacent first electrodes between.
  15. The capacitor according to claim 11, wherein in the process of fabricating the first electrode and the first connection electrode on the first electrode layer, the number of the first electrodes is at least seven, forming The number of the first connection electrodes is at least eight, wherein the six first electrodes are arranged to form a matrix of 2*3, and each of the first connection electrodes is respectively connected to two adjacent first electrodes Between the other, the first electrode is connected to one side of the first electrode facing away from the other row of the first electrode through the first connection electrode.
  16. The capacitor according to claim 11, wherein in the process of fabricating the first electrode and the first connection electrode on the first electrode layer, the number of the first electrodes is at least nine, forming The number of the first connection electrodes is at least twelve, wherein the nine first electrodes are arranged to form a matrix of 3*3, and each of the first connection electrodes is respectively connected to two adjacent ones of the first Between the electrodes.
  17. The method of manufacturing a capacitor according to claim 11, wherein the method further comprises:
    Depositing a metal or metal alloy material on the substrate to form a first lead, the first lead is located at the first electrode layer, and the first lead is connected to the first connection electrode and a power source; Depositing a metal or metal alloy material away from the first electrode side to form a second lead, the second lead is located at the second electrode layer, and the second lead is connected to the second connection electrode and the power source The first lead and the second lead are used to electrically connect the first electrode layer and the second electrode layer to the power source, respectively.
  18. The method of fabricating a capacitor according to claim 17, wherein in the process of fabricating the first lead and the second lead, the first connecting electrode and the second lead connected to the first lead The connected second connection electrodes respectively connect the corresponding two of the first electrodes and the two of the second electrodes.
  19. The method of fabricating a capacitor according to claim 17, wherein in the process of fabricating the first lead and the second lead, the first connecting electrode and the second lead connected to the first lead The connected second connection electrodes are respectively connected to the two corresponding first electrodes and the two second electrodes.
PCT/CN2016/110739 2016-12-19 2016-12-19 Capacitor, flat-panel display, and capacitor manufacturing method WO2018112694A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/110739 WO2018112694A1 (en) 2016-12-19 2016-12-19 Capacitor, flat-panel display, and capacitor manufacturing method

Applications Claiming Priority (2)

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CN201680042989.XA CN107980167A (en) 2016-12-19 2016-12-19 The production method of capacitance, flat-panel monitor and capacitance
PCT/CN2016/110739 WO2018112694A1 (en) 2016-12-19 2016-12-19 Capacitor, flat-panel display, and capacitor manufacturing method

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US20090073335A1 (en) * 2004-11-17 2009-03-19 Sharp Kabushiki Kaisha Active matrix substrate and display device
JP2009139699A (en) * 2007-12-07 2009-06-25 Sony Corp Luminous type display device
CN202013811U (en) * 2010-11-03 2011-10-19 上海祯显电子科技有限公司 Precision matrix flat capacitor
CN102326193A (en) * 2010-05-13 2012-01-18 松下电器产业株式会社 Display device and method for manufacturing same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090073335A1 (en) * 2004-11-17 2009-03-19 Sharp Kabushiki Kaisha Active matrix substrate and display device
JP2009139699A (en) * 2007-12-07 2009-06-25 Sony Corp Luminous type display device
CN102326193A (en) * 2010-05-13 2012-01-18 松下电器产业株式会社 Display device and method for manufacturing same
CN202013811U (en) * 2010-11-03 2011-10-19 上海祯显电子科技有限公司 Precision matrix flat capacitor

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