WO2018049635A1 - 一种触控压力检测模组和装置 - Google Patents
一种触控压力检测模组和装置 Download PDFInfo
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- WO2018049635A1 WO2018049635A1 PCT/CN2016/099155 CN2016099155W WO2018049635A1 WO 2018049635 A1 WO2018049635 A1 WO 2018049635A1 CN 2016099155 W CN2016099155 W CN 2016099155W WO 2018049635 A1 WO2018049635 A1 WO 2018049635A1
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- touch
- substrate
- pressure
- pressure sensing
- sensing component
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
- G06F3/0425—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means using a single imaging device like a video camera for tracking the absolute position of a single or a plurality of objects with respect to an imaged reference surface, e.g. video camera imaging a display or a projection screen, a table or a wall surface, on which a computer generated image is displayed or projected
- G06F3/0426—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means using a single imaging device like a video camera for tracking the absolute position of a single or a plurality of objects with respect to an imaged reference surface, e.g. video camera imaging a display or a projection screen, a table or a wall surface, on which a computer generated image is displayed or projected tracking fingers with respect to a virtual keyboard projected or printed on the surface
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/0418—Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
Definitions
- the present application belongs to the field of pressure detection technology, and in particular, to a touch pressure detecting module and device.
- Traditional touch screen mobile phones usually use virtual buttons based on capacitive touch technology.
- the working principle of the virtual button based on the capacitive touch technology is that when the finger touches the button area, the finger causes the electric field of the sensing electrode under the panel of the button area to change, and the electric field change is converted into a change of the current/voltage signal, which is then perceived and responded by the mobile phone.
- An embodiment of the present invention provides a touch pressure detecting device including a cover, a fingerprint recognition module, and a pressure sensing component; the pressure sensing component and the fingerprint recognition module are disposed on the cover Below, and the pressure sensing component is disposed adjacent to the fingerprint recognition module; the pressure sensing component includes a first substrate and a second substrate disposed opposite to each other; wherein, between the first substrate and the second substrate Having a variable gap; the fingerprint recognition module is subjected to external pressure pressing, the pressure transmission The pressure sensing assembly is applied such that the variable gap between the first substrate and the second substrate is pressed to change.
- An embodiment of the present invention further provides a touch terminal including a touch display assembly assembly, the touch display assembly assembly including a display module, a touch module, and a touch pressure detecting device as described above Wherein the touch display assembly assembly includes one end of the pressure sensing assembly secured to the middle frame by an elastomer.
- An embodiment of the present invention further provides a touch pressure detecting module including a connected pressure sensing component and a touch response component; the pressure sensing component is configured to output an electrical signal generated by the pressure to The touch response component is configured to calculate a capacitance change amount generated by the pressure sensing component under pressure according to the electrical signal, and calculate the pressure sensing component according to the capacitance change amount
- the pressure sensing component corresponds to at least one touch event, and the touch response component prestores a corresponding relationship between the pressure range and the touch event.
- the touch response component outputs a trigger signal; wherein the trigger signal corresponds to a pressure range in which the pressure is located.
- An embodiment of the present invention further provides a touch recognition device based on fingerprint recognition, comprising: a fingerprint recognition module, a main control chip, and a touch pressure detection module as described above; an output end of the touch response component Connected to the main control chip, when the fingerprint recognition module is pressed by external pressure, the pressure is transmitted to the pressure sensing component in the touch pressure detecting module; the main control chip is used to receive Determining whether the fingerprint recognition operation needs to be performed after the trigger signal of the touch pressure detecting module, and if so, generating a fingerprint identification instruction; the fingerprint identification module is configured to perform fingerprint identification after receiving the fingerprint identification instruction Operation, and sending the identified fingerprint information to the main control chip.
- An embodiment of the present invention further provides a pressure sensing based keyboard, comprising: a cover plate and a touch pressure detecting module as described above, wherein the pressure sensing component in the touch pressure detecting module is attached to The lower surface of the cover.
- the touch pressure detecting device of some embodiments of the present invention is configured to be disposed adjacent to the fingerprint recognition module, so that when the fingerprint recognition module is pressed by external pressure, Pressure is transmitted to the pressure sensing assembly to effect touch pressure detection. Therefore, the touch pressure detecting device according to the embodiment of the present invention needs to implement the pressure event response when the fingerprint recognition module performs the pressing operation, thereby effectively reducing the probability of misoperation, and at the same time, saving construction space.
- FIG. 1 is a schematic diagram showing the structure and application of a touch pressure detecting module based on a pressure sensing component according to an embodiment of the present invention
- FIGS. 2A-2B are schematic diagrams showing the principle of capacitive pressure detection according to an embodiment of the present invention.
- FIG. 3 is a schematic diagram of a button touch of a touch pressure detecting module based on a pressure sensing component according to an embodiment of the present invention
- FIG. 4A is a schematic diagram showing an equivalent circuit of a capacitive pressure sensing component according to an embodiment of the present invention.
- 4B is a schematic diagram of an equivalent circuit when a capacitive pressure sensing component according to an embodiment of the present invention is subjected to pressure;
- FIG. 5 is a schematic diagram of connection between a touch pressure detecting module and a main control chip based on a self-capacitance pressure sensing component
- FIG. 6 is a schematic diagram of connection between a touch pressure detecting module and a main control chip based on a mutual capacitance type pressure sensing component
- FIG. 7 is a schematic diagram of a composition of a touch recognition device based on fingerprint recognition according to an embodiment of the present invention.
- FIG. 8 is a schematic diagram showing the workflow of the above-described fingerprint recognition based touch device
- FIG. 9-14 are schematic structural diagrams of a touch terminal based on touch pressure detection
- 15A-E are schematic diagrams showing a connection structure between a cover of a touch terminal and a fingerprint recognition module
- 16A-D are a first substrate and a second base based on a self-capacitance pressure sensing component in a touch terminal Schematic diagram of the top view of the board;
- 17A is a schematic top plan view of a first substrate and a second substrate based on a mutual capacitance type pressure sensing component in a touch terminal;
- 17B-C are schematic top plan views of a first electrode and a second electrode of a first substrate based on a mutual capacitance type pressure sensing component in a touch terminal;
- FIG. 18 is a schematic diagram of a connection structure of a touch display component assembly and a middle frame in a touch terminal;
- 19 is a schematic cross-sectional view of a pressure sensing based keyboard and a key touch diagram of an embodiment of the present invention.
- FIG. 1 is a schematic diagram showing the structure and application of a touch pressure detecting module based on a pressure sensing component according to an embodiment of the present invention.
- the touch pressure detecting module includes a connected touch response component 1 .
- the pressure sensing component 2 the touch pressure detecting module can be placed in the mobile terminal shown in FIG. 1, such as a mobile phone, wherein the touch response component 1 is used to detect that the pressure sensing component 2 is subjected to external pressing. Pressure, and can decide whether to respond according to pressure.
- the pressure sensing component 2 is configured to output an electrical signal generated by the pressure to the touch response component 1 .
- the touch response component 1 is configured to calculate a capacitance change amount generated by the pressure sensing component 2 under pressure according to the received electrical signal, and calculate a pressure received by the pressure sensing component according to the capacitance change amount.
- Embodiments of the present invention utilize a capacitive principle to detect the magnitude of pressure.
- K is a constant
- ⁇ represents the dielectric constant between the two substrates
- S represents the substrate area
- d represents the distance between the two substrates.
- FIG. 2B when an external force is applied to the parallel plate capacitor, one or both of the substrates are deformed, thereby changing the distance between the two substrates. For example, the distance between the two substrates is reduced from D1 to D2.
- Parallel plate capacitor The capacitance changes at this time.
- the chip detects the change in the capacitance value through the circuit to calculate the magnitude of the applied pressure.
- the principle of capacitance detection includes self-capacitance detection and mutual capacitance detection. Applying a driving signal (transmission and reception signal) to the first substrate of the two substrates, the second substrate is grounded, and the driving signal of the first substrate is self-receiving to detect a capacitance change between the first substrate and the second substrate, which is a self-capacitance Pressure detection.
- the first substrate is connected to the driving channel, the driving signal is applied to the first substrate, the second substrate is connected to the sensing channel, and the sensing signal is received through the sensing channel, and the mutual capacitance change between the driving channel and the sensing channel is detected as a mutual capacitance principle.
- the following description is mainly made by using a self-capacitance detection method.
- embodiments of the present invention include, but are not limited to, a self-capacitance detection method.
- the pressure sensing component in the embodiment of the present invention may adopt any one of a self-capacitance or a mutual capacitance type pressure detecting method.
- the principle of self-capacitance pressure detection and mutual capacitance type pressure detection is that when the gap between the two capacitor substrates constituting the self-capacitance pressure detecting structure or the mutual capacitance type pressure detecting structure is changed by external pressing, the pressure detecting structure is The capacitance changes accordingly, and the change of the gap size is positively correlated with the magnitude of the pressure. That is, under certain conditions, the greater the pressure, the greater the variation of the gap in the pressure sensing component, and the greater the capacitance change of the pressure sensing component.
- the pressure sensing component 2 in the following is mainly a self-capacitance pressure detection mode.
- some technical contents are also exemplified in the mutual capacitance pressure detection mode. .
- a typical Android phone has three virtual touch buttons based on capacitive touch technology.
- the three side-by-side rectangular boxes in Figure 1 represent three pressure sensing components 2, and each pressure sensing component 2 is equivalent to a button for Perform a button function.
- the number of the pressure sensing components 2 can be determined according to actual needs. For example, when only one button needs to be set on the main panel of the mobile phone, only one pressure sensing component 2 is needed in the touch pressure detecting module.
- each of the rectangular frames has two pins (where the pressure sensing component 2 is exemplified by mutual capacitance), and the two pins are respectively connected to the driving channels of the touch response component 1. And sensing channels.
- the touch response component 1 respectively inputs excitation signals to one of the pins of the respective pressure sensing components 2, and receives the respective pressure sensing components 2 through the other pins of the respective pressure sensing components 2 An electrical signal generated by external compression.
- the touch response component 1 can calculate the capacitance change amount of each pressure sensing component 2 according to the change of the electrical signals of the respective pressure sensing components 2, and then calculate the pressure received by each pressure sensing component 2.
- each pressure sensing component 2 When the pressure sensing component adopts a self-capacitance pressure detecting structure, one of the pins of each pressure sensing component 2 serves as a signal transceiving pin and is connected to the touch response component 1, and the other pin of the pressure sensing component 2 Ground.
- the touch response component 1 inputs an excitation signal to the pressure sensing component 2 through a signal transceiving pin connected to the pressure sensing component 2, and receives an electrical signal generated by the external pressure by the pressure sensing component 2 through the signal transceiving pin. .
- the touch response component 1 can calculate the capacitance change amount of each pressure sensing component 2 according to the change of the electrical signals of the respective pressure sensing components 2, and then calculate the pressure received by each pressure sensing component 2.
- the pressure of the finger unconsciously touching the button is less than 100g, and the pressure of the finger consciously pressing the button is greater than 200g. Therefore, in order to avoid erroneous operation, when the pressure received by the pressure sensing component 2 is greater than the first set threshold (for example, 200 g), the trigger signal of the touch event corresponding to the pressure sensing component 2 is output, otherwise The trigger signal is output, thereby reducing the probability of occurrence of an erroneous operation caused by an unintentional touch.
- the touch response component 1 can simultaneously detect the pressures received by the respective pressure sensing components 2, or can also detect the pressures received by the respective pressure sensing components 2 in turn, which are the embodiments of the present invention. No restrictions.
- each of the pressure sensing components 2 can also correspond to a plurality of touch events.
- the pressure range of each pressure sensing component 2 can be pre-stored within the touch response component 1 and the pressure range is The correspondence between touch events.
- the touch response component 1 outputs a trigger signal corresponding to the pressure range corresponding to the pressure range. .
- the pressure P greater than the first set threshold may be divided into three pressure ranges: P ⁇ P1, P1 ⁇ P ⁇ P2, P ⁇ P2, for a certain pressure sensing component 2, when P ⁇ P1 corresponds to the first A touch event, when P1 ⁇ P ⁇ P2 corresponds to the second touch event, and P ⁇ P2 corresponds to the third touch event. If the pressure P received by the pressure sensing component 2 is in the range of P ⁇ P1, the touch response component 1 outputs a trigger signal of the first touch event, if the pressure P of the pressure sensing component 2 is The range of the touch response component 1 is a trigger signal of the second touch event.
- the touch response component is in the range of P1 ⁇ P ⁇ P2. 1 Output a trigger signal of the third touch event. In this way, different operations can be performed according to the pressure on the same button, such as tapping for preview and pressing for open, similar to the pressure-sensitive touch screen responding to different pressures.
- FIG. 3 is a schematic diagram of a button touch of a touch pressure detecting module based on a pressure sensing component according to an embodiment of the present invention.
- the pressure sensing component 2 is not directly touched by the finger 5 , and the finger 5
- the pressure sensing component 2 is provided with a cover 3 (such as a cover of a mobile phone), the cover 3 and the pressure sensing component 2 are pasted by the bonding glue 4, and the finger 5 is passed through the touch cover 3
- the pressure sensing assembly 2 applies pressure.
- the finger 5 touches the cover 3 pressure is applied to the cover 3, and pressure is transmitted to the pressure sensing unit 2 through the cover 3 and the bonding glue 4, thereby transmitting pressure to the pressure sensing unit 2.
- the finger can also directly touch the pressure sensing component 2, which is not limited in the embodiment of the present invention.
- FIG. 4A is a schematic diagram of an equivalent circuit of a capacitive pressure sensing component
- FIG. 4B is a schematic diagram of an equivalent circuit when a capacitive pressure sensing component is under pressure.
- 3A, 4B when the finger 5 touches the cover 3, the pressure is transmitted to the pressure sensing component 2 through the cover 3 and the bonding glue 4, so that the pressure sensing component 2 is subjected to pressure, so that the pressure sensing component 2 is The capacitance C 0 changes, and the amount of change is ⁇ C, that is, the capacitance of the pressure sensing component 2 changes from C 0 to C 0 + ⁇ C.
- FIG. 5 is a schematic diagram showing the connection between the touch pressure detecting module and the main control chip 7 based on the self-capacitance pressure sensing component.
- the touch response component 1 includes a processor unit 105, an excitation signal circuit unit 102, a preamplifier unit 103, an analog to digital conversion circuit unit 104, and a transceiving switch 106.
- the processor unit 105 is connected to the input end of the excitation signal circuit unit 102.
- the output end of the excitation signal circuit unit 102 is connected to the first end of the transceiving switch 106, and the second end of the transceiving switch 106 and one end of the pressure sensing component 2 are connected.
- the third end of the transmission/reception changeover switch 106 is connected to the input end of the preamplifier unit 103, and the output end of the preamplifier unit 103 is connected to the input end of the analog to digital conversion circuit unit 104, and the output end of the analog to digital conversion circuit unit 104. It is connected to the processor unit 105.
- Processor unit 105 The control excitation signal circuit unit 102 inputs a driving signal to the pressure sensing component 2 through the transceiver switching switch 106, and the electrical signal outputted by the pressure sensing component 2 is input to the preamplifier unit 103 through the transceiving switch 106, and is amplified by the preamplifier unit 103.
- the analog-to-digital conversion circuit unit 104 is input and converted into a digital signal by the analog-to-digital conversion circuit unit 104, and then input to the processor unit 105.
- the processor unit 105 calculates the amount of change in capacitance of the pressure sensing unit 2 based on the change in the digital signal, and calculates the pressure received by the pressure sensing unit 2 based on the amount of change in capacitance.
- the transceiver switching switch 106 can be directly connected to the input of the preamplifier unit 103.
- the multiplexer switching unit 101 is required to be added to the touch response component 1.
- the multiplexer switch unit 101 is equivalent to a multi-channel input/output switch, and the multiplexer switch unit 101 can support pressure detection of a plurality of channels (i.e., a plurality of pressure sensing components 2).
- the transceiving switch 106 is connected to the input terminal of the preamplifier unit 103 through the multiplexing switch unit 101.
- FIG. 6 is a schematic diagram showing the connection between the touch pressure detecting module and the main control chip 7 based on the mutual capacitance type pressure sensing component.
- one end of the pressure sensing component 2 is connected to the output end of the excitation signal circuit unit 102, and the other end of the pressure sensing component 2 is connected to the input end of the preamplifier unit 103, thereby implementing the touch response component 1
- a drive signal is applied to the drive electrodes of the pressure sensing assembly 2 and an induced signal is received through the sense electrodes of the pressure sensing assembly 2. If there is only one pressure sensing component 2, the pressure sensing component 2 can be directly connected to the input of the preamplifier unit 103.
- the multiplexer switching unit 101 When there are a plurality of pressure sensing components 2 in the touch pressure detecting module, the multiplexer switching unit 101 is added to the touch response component 1.
- the multiplexer switch unit 101 is equivalent to a multi-channel input/output switch, and the multiplexer switch unit 101 can support pressure detection of a plurality of channels (i.e., a plurality of pressure sensing components 2).
- each of the pressure sensing units 2 is connected to the input terminal of the preamplifier unit 103 through the multiplexing switch unit 101.
- the electronic device with the traditional mechanical button can adopt the above-mentioned touch pressure detecting module, for example, an electronic device such as a mobile phone, a tablet, a portable/desktop computer, and the electronic device with the fingerprint button on the keyboard can also adopt the above touch pressure detecting module. .
- the touch pressure detecting module can be combined with the fingerprint recognition module 6 to obtain a fingerprint recognition based touch device, and the fingerprint recognition based touch device includes the touch pressure detection module.
- the fingerprint recognition module 6 is pressed by external pressure, the pressure is transmitted to the pressure sensing component 2 in the touch pressure detecting module.
- the output end of the touch response component 1 in the touch pressure detecting module is connected to the main control chip 7.
- the main control chip 7 is configured to determine whether a fingerprint recognition operation needs to be performed after receiving the trigger signal of the touch pressure detecting module 1 , and if yes, generate a fingerprint recognition instruction, and then the fingerprint recognition module 6 receives the fingerprint identification instruction.
- the fingerprint recognition operation is performed, and the recognized fingerprint information is sent to the main control chip 7.
- the fingerprint recognition module 6 is in a sleep state before receiving the fingerprint recognition instruction; after receiving the fingerprint recognition instruction, the sleep state is exited to perform a fingerprint recognition operation. After the recognized fingerprint information is transmitted to the main control chip 7, the fingerprint recognition module 6 enters the sleep state again.
- the workflow of the fingerprint recognition based touch device is as follows:
- Step 801 The fingerprint recognition module 6 enters a sleep state, and then proceeds to step 802.
- Step 802 The touch response component 1 detects the pressure received by the pressure sensing component 2 according to the set frequency, determines whether the pressure received on the pressure sensing component 2 is greater than a first set threshold, and when the pressure is greater than the first set threshold Go to step 803 and return to step 801 when the pressure is less than or equal to the first set threshold.
- Step 803 The touch response component 1 sends a trigger signal corresponding to the touch event of the pressure sensing component 2 to the main control chip 7, and then proceeds to step 804.
- Step 804 The main control chip 7 determines whether the fingerprint recognition operation needs to be performed in response to the touch event. When it is determined that the fingerprint recognition operation needs to be performed, the process proceeds to step 805. When the fingerprint recognition operation is not required, the process returns to step 801.
- Step 805 The main control chip 7 issues a fingerprint identification instruction to the fingerprint recognition module 6, and then proceeds to step 806.
- Step 806 After receiving the fingerprint recognition instruction issued by the main control chip 7, the fingerprint recognition module 6 exits the sleep state and performs the fingerprint recognition operation, and sends the identified fingerprint information to the main control chip 7 at the same time. Then return to step 801.
- the main control chip 7 determines the response to the touch according to the touch event in the received trigger signal. Whether the fingerprint recognition needs to be enabled during the event, and the main control chip 7 sends the fingerprint recognition instruction to the fingerprint recognition module 6 only when the fingerprint recognition needs to be enabled in response to the touch event. Therefore, the fingerprint recognition module 6 is mostly in a sleep state, and only when a touch event occurs (ie, the trigger signal of the touch control event is received by the master chip 7) and the fingerprint needs to be recognized (ie, the master chip 7 determines the response touch). When the control event needs to perform the fingerprint recognition operation, the fingerprint recognition module 6 is woken up and performs the fingerprint recognition operation, thereby reducing the system power consumption of the touch recognition based touch device.
- step 802 is mainly used to detect the pressing force on the pressure sensing component to prevent the erroneous operation caused by the unintentional touch, only when the pressing force of the pressure sensing component reaches a certain intensity.
- the trigger signal of the touch event is sent to the main control chip, thereby reducing the probability of occurrence of an erroneous operation caused by the unintentional touch of the button.
- the touch pressure detecting module comprises: a connected pressure sensing component 2 and a touch response component 1 , wherein the pressure sensing component 2 is configured to output the electrical signal generated by the pressure to the touch response component 1 , and the touch response
- the component 1 is configured to calculate the amount of capacitance change generated by the pressure sensing component 2 according to the electrical signal, and calculate the pressure of the pressure sensing component according to the capacitance variation.
- the touch pressure detecting module herein
- the logic functions of the pressure sensing component 2 and the touch response component 1 are the same as those of the pressure sensing component and the touch response component in the touch pressure detecting module described above. Therefore, the touch is not described herein.
- the touch mode of the touch pressure detecting module of the present embodiment includes, but is not limited to, the touch mode of the touch pressure detecting module described above.
- the embodiment focuses on the structure of the touch pressure detecting device based on the touch pressure detecting module described above, and the structure of the pressure sensing component 2 of the touch pressure detecting device disclosed in this embodiment The same applies to the structure of the pressure sensing unit 2 of the touch pressure detecting module described above.
- the pressure sensing assembly 2 includes: a first substrate and a second substrate disposed opposite to each other, and a variable gap between the first substrate and the second substrate. Wherein, the variable gap changes due to the pressure sensing component 2 being pressed, and the touch response component 1 is configured to calculate the pressure received by the pressure sensing component 2 according to the electrical signal generated by the change of the variable gap.
- the touch terminal is, for example, a mobile phone.
- the touch terminal includes a cover 3 , a middle frame 8 , and a fingerprint recognition module 6 .
- the pressure sensing component 2 and the fingerprint recognition module 6 are disposed under the cover 3, that is, the pressure sensing component 2 and the fingerprint recognition module 6 are disposed between the cover 3 and the middle frame 8.
- the pressure sensing component 2 is disposed adjacent to the fingerprint recognition module 6.
- the pressure sensing component 2 is disposed on both sides of the fingerprint recognition module 6, or in the embodiment shown in FIG. 10, the pressure sensing component 2 is disposed in the fingerprint recognition module 6.
- the cover plate 3 can be a glass cover of the touch screen, and the bottom surface of the cover plate 3 (ie, the surface facing the middle frame 8) can be formed with a recessed portion in the area where the fingerprint recognition module 6 is located, wherein the fingerprint recognition module 6 can It is housed in the recessed portion and is fixed to the inner wall of the recessed portion by the bonding glue 4.
- the cover 3 can provide a finger pressing and fingerprint collection interface for the fingerprint recognition module 6. The user can press the finger to the surface of the cover 3 when fingerprint recognition is required, and the fingerprint recognition module 6 passes through the cover 3 The fingerprint information of the user's finger is collected.
- the touch terminal Since the fingerprint recognition module 6 is disposed under the glass cover of the touch screen, the touch terminal does not need to be opened in the cover 3 to receive the fingerprint recognition module 6, and there is no need to provide an additional ceramic cover, a glass cover or a sapphire cover.
- the board thus constitutes an Invisible Fingerprint Sensor (IFS) structure.
- IFS Invisible Fingerprint Sensor
- the assembly 2 causes the variable gap between the first substrate 20 and the second substrate 21 to be pressed to be changed.
- the pressure sensing component can be set in any of the following manners. As shown in Figure 9 The first substrate 20 of the pressure sensing component 2 is disposed on the cover 3, and the second substrate 21 of the pressure sensing component 2 is disposed in the middle frame 8. In an alternative embodiment, the positions of the first substrate 20 and the second substrate 21 in FIG. 9 may be interchanged, that is, as shown in FIG.
- the first substrate 20 of the pressure sensing assembly is disposed in the middle frame 8
- the two substrates 21 are disposed on the cover plate 3.
- the first substrate 20 and the second substrate 21 of the pressure sensing assembly may also be disposed between the fingerprint recognition module 6 and the middle frame 8.
- the first substrate 20 of the pressure sensing component is disposed on the fingerprint recognition module 6, the second substrate 21 is disposed in the middle frame 8, or the positions of the first substrate 20 and the second substrate 21 in FIG. 10 are mutually
- the first substrate 20 of the pressure sensing component is disposed in the middle frame, and the second substrate 21 is disposed in the fingerprint recognition module 6.
- the first substrate 20 of each pressure sensing component 2 is disposed, for example, on the cover 3 and distributed on two mutually symmetric sides of the fingerprint recognition module 6.
- the multiplexer switch unit 101 shown in FIG. 5 or FIG. 6 can be added to the touch response component 1.
- the multiplexer switch unit 101 is equivalent to a multi-channel input/output switch, and the multiplexer switch unit 101 can support pressure detection of a plurality of channels (i.e., a plurality of pressure sensing components 2).
- the pressure sensing assembly 2 has a variable gap between the first substrate 20 and the second substrate 21.
- the variable gap may be an air gap, or an insulating elastomer such as an elastic foam may be filled between the first substrate 20 and the second substrate 21.
- the cover plate 3 and the pressure sensing component 2 are bonded together by the bonding glue 4, and the bonding glue 4 can be, for example, a backing glue.
- the finger applies pressure to the pressure sensing assembly 2 through the touch cover 3.
- pressure is applied to the cover plate 3, and the pressure is transmitted to the pressure sensing assembly 2 through the cover plate 3 and the bonding glue 4, thereby transmitting pressure to the pressure sensing assembly 2, thereby transmitting pressure.
- the variable gap of the sensing assembly 2 changes due to the pressure of the cover plate 3.
- the variable gap becomes smaller under the action of pressure, so that the capacitance between the first substrate 20 and the second substrate 21 increases, and the touch response component 1 detects the capacitance value on the pressure sensing component 2 at a specific frequency.
- the touch response component 1 issues a trigger signal to the master chip 7.
- the second substrate 21 of the pressure sensing assembly 2 is fixed to the middle frame 8.
- the first substrate 20 and the second substrate 21 A variable gap can be formed by the gap between the cover 3 and the middle frame 8.
- the variable gap is an air gap
- the second substrate 21 can be implemented as a separate ground layer independently of the touch pressure detecting module. Therefore, the second substrate 21 realized by the ground layer can be separately fixed to the middle frame. 8, for example, attached to the middle frame 8 by the bonding glue 4.
- the shielding layer 9 can be added in the touch terminal. As shown in FIG. 9, the shielding layer 9 is disposed between the cover plate 3 and the first substrate 20 of the pressure sensing assembly 2 to shield the interference caused by the finger touch.
- the first substrate 20 as a transceiving electrode can be fabricated using a flexible wiring board.
- a flexible wiring board including two layers of wiring may be employed, one of which is used to fabricate the first substrate 20 and the other layer is the shielding layer 9, wherein the shielding layer 9 is grounded.
- the first substrate 20 and the shielding layer 9 can also be fabricated by using a double-layered indium tin oxide (ITO)/silver film (AG film) material, and the circuit structure thereof is similar to the flexible circuit board structure, and details are not described herein again.
- ITO indium tin oxide
- AG film aluminum film
- the external capacitive touch screen is widely used compared to the Oncell/Incell touch display.
- the cover of the external capacitive touch screen is usually provided with a trace layer.
- the pressure sensing component 2 and the wiring layer on the cover 3 can be combined to save cost and simplify the manufacturing process.
- the touch terminal adopts a display mode of G-Film (Glass-Film, glass plus film structure), OGS (One Glass Solution, integrated touch) or SITO (Single Indium Tin Oxid) structure.
- the shielding layer 9 (ground layer GND) can be formed in the wiring layer, so that only the single substrate flexible circuit board is used to fabricate the first substrate 20 of the pressure sensing component 2, and the flexible circuit board is assembled to the touch.
- the terminal is controlled, it is not necessary to consider whether the shielding layer 9 in the two-layer flexible circuit board is above the layer where the first substrate 20 is located, which is advantageous for simplifying the generation process and reducing the cost.
- FIG. 12 is a schematic diagram showing the structure of a shielding layer disposed in a display module of a G-Film structure.
- the wiring layer 30 includes an optical Clear Adhesive (OCA) layer 301 and a first thin film layer 302.
- OCA optical Clear Adhesive
- the first film layer 302 is provided with a touch channel trace layer 3020 and a ground layer, and the ground layer can be multiplexed into the shield layer 9.
- FIG. 13 is a schematic diagram showing the structure of the shielding layer 9 and the first substrate 20 in the touch display module of the G-FilmFilm structure, wherein the shielding layer 9 is located above the first substrate 20.
- the wiring layer 30 includes an optical Clear Adhesive (OCA) layer 301 , a first thin film layer 302 , and a second thin film layer 303 , and a first thin film layer 302 and a second thin film layer 303 are further disposed between Another layer of OCA layer 301.
- OCA optical Clear Adhesive
- a ground layer is disposed in the first film layer 302. The ground layer can be multiplexed into the shielding layer 9.
- the first film layer 302 and the second film layer 303 are respectively provided with a touch channel wiring layer 3020, and the second film.
- the first substrate 20 of the pressure sensing assembly 2 can also be disposed in the layer 303.
- the pressure sensing assembly 2 may also be disposed between the wiring layer 30 and the middle frame.
- the first substrate 20 of the pressure sensing assembly 2 can be disposed on the routing layer 30, and the second substrate 21 is disposed in the middle frame.
- the first substrate of the pressure sensing assembly 20 is disposed in the middle frame, and the second substrate is disposed on the wiring layer 30.
- the shielding layer 9 and the wiring layer 30 may also be disposed independently of each other. In this case, the shielding layer 9 may be disposed between the first substrate 20 and the wiring layer 30.
- FIG. 10 is a schematic structural diagram of a touch terminal in which the first substrate 20 and the second substrate 21 of the pressure sensing component 2 are disposed between the fingerprint recognition module 6 and the middle frame 8.
- the fingerprint recognition module 6 includes a fingerprint identification chip 60 and a reinforcing steel sheet, and the reinforcing steel sheet is multiplexed into the shielding layer 9.
- the fingerprint recognition chip 60 is disposed between the cover plate 3 and the reinforcing steel sheet, and the first substrate 20 and the second substrate 21 of the pressure sensing assembly 2 are both located under the fingerprint recognition chip 60.
- the reinforcing steel sheet of the fingerprint recognition module 6 and the first substrate 20 or the second substrate 21 of the pressure sensing assembly 2 may be combined to simplify the generation process.
- the reinforcing steel sheet directly under the fingerprint recognition chip 60 is grounded, and the reinforcing steel is The sheet can be used to secure and carry components. At the same time, since the reinforcing steel sheet is grounded, it can be used as the shield layer 9 of the first substrate 20.
- the first substrate 20 of the pressure sensing component 2 may also be attached to the middle frame 8 by the bonding glue 4, and at this time, the reinforcing steel sheet serves as the second substrate of the pressure sensing component 2.
- 21 ground electrode
- an excitation signal may be injected into the reinforcing steel sheet so that the reinforcing steel sheet serves as the first substrate 20 of the pressure sensing assembly 2, thereby forming a parallel plate capacitance with the ground layer on the middle frame 8, and the fingerprint identification chip 60 can then be the shielding layer 9 of the first substrate 20 of the pressure sensing assembly 2.
- Thinning. 15A-15D respectively illustrate four solutions for thinning the cover plate, wherein, in FIGS. 15A and 15B, the lower surface and the upper surface of the cover plate 3 corresponding to the area of the fingerprint recognition module 6 are respectively provided with blind holes. In FIG. 15C, the upper and lower surfaces of the cover 3 corresponding to the area of the fingerprint recognition module 6 are provided with blind holes. In FIG. 15D, the cover 3 is provided with a through hole corresponding to the fingerprint recognition module 6.
- FIG. 15A-15D respectively illustrate four solutions for thinning the cover plate, wherein, in FIGS. 15A and 15B, the lower surface and the upper surface of the cover plate 3 corresponding to the area of the fingerprint recognition module 6 are respectively provided with blind holes. In FIG. 15C, the upper and lower surfaces of the cover 3 corresponding to the area of the fingerprint recognition module 6 are provided with blind holes. In FIG. 15D, the cover 3 is provided with a through hole corresponding to the fingerprint recognition module 6.
- the cover 3 may not be thinned. At this time, the upper and lower surfaces of the cover 3 corresponding to the area of the fingerprint recognition module 6 need not be blind holes or through holes.
- the reinforcing steel sheet of the fingerprint recognition module 6 is multiplexed into the second substrate 21 of the pressure sensing assembly 2, and the first substrate 20 of the pressure sensing assembly is attached to the reinforcing steel by the bonding glue 4.
- the fingerprint recognition chip 60 is attached to the cover 3 by the bonding glue 4 .
- the first substrate 20 of the pressure sensing component 2 adopts a solid rectangular shape to meet the requirement of the touch response component 1 for capacitance variation.
- the first substrate 20 is reduced.
- the capacitance to ground which can increase the amount of change in the detected capacitance value. This requires designing the shape of the first substrate 20.
- the second substrate 21 is a ground electrode, and therefore, the second substrate 21 can be any shape that is grounded.
- the shape of the first substrate 20 is a rectangle.
- the shape of the first substrate 20 is a square shape, as shown in FIG. 16C, the shape of the first substrate 20.
- the glyph is formed by digging a small solid rectangle at the center of the large solid rectangle.
- the shape of the first substrate 20 is a polygonal line shape.
- the first substrate 20 and the second substrate 21 of the mutual capacitance type pressure sensing assembly 2 are parallel to each other and are rectangular, wherein the first substrate 20 is connected to the touch.
- the second substrate 21 is connected to the sensing channel of the touch response component 1 .
- the first substrate 20 may also be designed such that the first substrate 20 includes the first electrode 201 and the second electrode 202 arranged in the same plane in a back shape, and the second substrate 21 is grounded, and The two substrates 21 and the first substrate 20 constitute a parallel plate capacitor.
- FIG. 17A the first substrate 20 and the second substrate 21 of the mutual capacitance type pressure sensing assembly 2 are parallel to each other and are rectangular, wherein the first substrate 20 is connected to the touch.
- the second substrate 21 is connected to the sensing channel of the touch response component 1 .
- the first substrate 20 may also be designed such that the first substrate 20 includes the first electrode 201 and the second electrode 202 arranged in the same plane in a back shape, and the second substrate 21 is grounded, and The two substrates 21 and the
- the first substrate 20 may also be designed such that the first substrate 20 includes a first electrode 201 and a second electrode 202 each arranged in an E-shape in the same plane, and the first electrode 201 and the first electrode The two electrodes 202 are in mesh with each other, and the second substrate 21 is grounded, and the first substrate 20 and the second substrate 21 constitute a parallel plate capacitor.
- the above is merely an example, and the shape and positional relationship of the first substrate 20 and the second substrate 21 are not limited thereto.
- the touch terminal described above further includes: a display module and a touch module.
- the cover, the touch module, the display module, and the touch pressure detecting module constitute a touch display assembly.
- the touch display assembly is usually fixed by a dispensing process and a middle frame of the touch terminal, that is, the periphery of the touch display assembly (for example, the periphery of the cover) is glued and fixed to the middle frame.
- the touch display assembly assembly is assembled by using the dispensing process, when the finger is pressed over the cover, the physical shape variable that can be caused in the area where the fingerprint recognition module is located (ie, the button area) is very small, generally, 1 kg.
- the physical deformation that pressure can produce is less than 10 microns. In the case of very small physical deformation variables, it is necessary to have a high performance of the touch response component to detect a very small deformation signal, and to divide the very small deformation space into multiple pressure levels, resulting in more computational difficulty. high.
- the touch display assembly assembly includes one end of the pressure sensing assembly (ie, the first substrate is disposed and One end of the second substrate is fixed to the middle frame by the elastic body 42 and the rest of the touch display assembly assembly It can still be fixed to the middle frame by a dispensing layer 41, such as a compressed double-sided taped foam material.
- the touch terminal adopting the fixed structure of the touch display component assembly not only ensures the reliability of assembly of the touch display component assembly, but also increases the touch display component assembly when the fingerprint recognition module area is under pressure.
- Physical shape variable After actual testing, under the pressure of 1 kg, the physical shape variable of the touch display assembly assembly using the elastic body combined with the middle frame is equivalent to several times the physical shape variable of the touch display assembly assembly using the dispensing process.
- the touch recognition component and the fingerprint recognition chip of the fingerprint recognition module may be integrated on the same physical chip.
- the touch response component and the touch chip of the touch module may be integrated on the same physical chip. Therefore, the number of chips in the touch terminal can be reduced, which is advantageous for simplifying the production process of the touch terminal.
- the keyboard includes a cover 3 and the touch pressure detecting module, and each pressure sensing component 2 of the touch pressure detecting module is pasted with a bonding glue 4 Fitted on the lower surface of the cover 3, each pressure sensing assembly 2 represents a button.
- a button needs to be clicked, only the position on the cover 3 directly above the corresponding pressure sensing component 2 needs to be touched, and the appropriate pressure is applied to trigger the button.
- a program instructing related hardware may be completed by a program instructing related hardware, and the program is stored in a storage medium, and includes a plurality of instructions for making a device (which may be a single chip microcomputer). , a chip, etc. or a processor performs all or part of the steps of the methods described in various embodiments of the present application.
- the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like. .
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Abstract
本发明涉及压力检测技术,公开了一种触控压力检测装置。所述触控压力检测装置包括:盖板、指纹识别模组和压力传感组件;所述压力传感组件和所述指纹识别模组设置在所述盖板的下方,且所述压力传感组件邻近于所述指纹识别模组设置;所述压力传感组件包括相对设置的第一基板和第二基板;其中,所述第一基板和第二基板之间具有可变间隙;所述指纹识别模组在受到外部的压力按压时,所述压力传递到所述压力传感组件而使得所述第一基板和第二基板之间的可变间隙受压而发生改变。
Description
本申请属于压力检测技术领域,尤其涉及一种触控压力检测模组和装置。
传统的触摸屏手机,通常采用基于电容触控技术的虚拟按键。基于电容触控技术的虚拟按键的工作原理为,当手指接触按键区域,手指引起按键区域面板下方感应电极的电场变化,电场变化转化为电流/电压信号的变化,继而被手机感知并响应。
发明人在实现本发明的过程中发现,上述技术的问题非常容易出现误操作,例如:1、当手指无意识轻触按键时,按键即有响应;2、手机装在身上,无意的身体轻触按键,按键即有响应。在上述场景中用户均无意愿触控按键,此时的按键响应会引起用户困扰。
发明内容
本发明部分实施例的目的在于提供一种触控压力检测模组和装置,以解决现有技术中采用基于电容触控技术的虚拟按键容易出现误操作的问题。
本发明的一个实施例提供了一种触控压力检测装置,包括盖板、指纹识别模组和压力传感组件;所述压力传感组件和所述指纹识别模组设置在所述盖板的下方,且所述压力传感组件邻近于所述指纹识别模组设置;所述压力传感组件包括相对设置的第一基板和第二基板;其中,所述第一基板和第二基板之间具有可变间隙;所述指纹识别模组在受到外部的压力按压时,所述压力传递
到所述压力传感组件而使得所述第一基板和第二基板之间的可变间隙受压而发生改变。
本发明的一个实施例还提供了一种触控终端,包括触控显示组件总成,所述触控显示组件总成包括显示模组、触控模组和如上所述的触控压力检测装置;其中,所述触控显示组件总成包含所述压力传感组件的一端通过弹性体固定于所述中框。
本发明的一个实施例还提供了一种触控压力检测模组,包括相连接的压力传感组件和触控响应组件;所述压力传感组件用于将受到压力而产生的电信号输出至所述触控响应组件;所述触控响应组件用于根据所述电信号计算所述压力传感组件受到压力而产生的电容变化量,并根据所述电容变化量计算所述压力传感组件受到的压力;其中,所述压力传感组件对应至少一个触控事件,所述触控响应组件内预存有压力范围与触控事件的对应关系,当所述压力大于第一设定阈值时,所述触控响应组件输出触发信号;其中所述触发信号与所述压力所处的压力范围对应。
本发明的一个实施例还提供了一种基于指纹识别的触控装置,包括:指纹识别模组、主控芯片以及如上所述的触控压力检测模组;所述触控响应组件的输出端与所述主控芯片连接,在所述指纹识别模组受外部压力按压时,所述压力传递至所述触控压力检测模组中的压力传感组件;所述主控芯片用于在接收到所述触控压力检测模组的触发信号之后判断是否需要执行指纹识别操作,若是,则生成一指纹识别指令;所述指纹识别模组用于在接收到所述指纹识别指令后执行指纹识别操作,并将识别到的指纹信息发送给所述主控芯片。
本发明的一个实施例还提供了一种基于压力感应的键盘,包括盖板和如前文所述的触控压力检测模组,所述触控压力检测模组中的压力传感组件贴合在所述盖板的下表面。
本发明部分实施例的触控压力检测装置通过将压力传感组件邻近于指纹识别模组设置,从而实现在所述指纹识别模组在受到外部的压力按压时,所述
压力传递到所述压力传感组件而实现触摸压力检测。因此,采用本发明实施例的触控压力检测装置需要在指纹识别模组进行按压操作时才能实现压力事件的响应,从而有效降低了误操作几率,同时,有利于节省结构空间。
一个或多个实施例通过与之对应的附图中的图片进行示例性说明,这些示例性说明并不构成对实施例的限定,附图中具有相同参考数字标号的元件表示为类似的元件,除非有特别申明,附图中的图不构成比例限制。
图1是根据本发明实施方式提供的基于压力传感组件的触控压力检测模组的结构及应用示意图;
图2A-2B是根据本发明实施方式提供的电容式压力检测原理示意图;
图3是根据本发明实施方式提供的基于压力传感组件的触控压力检测模组的按键触摸示意图;
图4A是本发明实施方式提供的电容式压力传感组件的等效电路示意图;
图4B是本发明实施方式提供的电容式压力传感组件受到压力时的等效电路示意图;
图5是基于自电容式压力传感组件的触控压力检测模组与主控芯片的连接示意图;
图6是基于互电容式压力传感组件的触控压力检测模组与主控芯片的连接示意图;
图7是根据本发明实施方式提供的基于指纹识别的触控装置的组成示意图;
图8是根据上述基于指纹识别的触控装置的工作流程示意图;
图9-14是基于触控压力检测的触控终端的结构示意图;
图15A-E是触控终端的盖板与指纹识别模组连接结构示意图;
图16A-D是触控终端中基于自电容式压力传感组件的第一基板和第二基
板的俯视结构示意图;
图17A是触控终端中基于互电容式压力传感组件的第一基板和第二基板的俯视结构示意图;
图17B-C是触控终端中基于互电容式压力传感组件的第一基板的第一电极和第二电极的俯视结构示意图;
图18是触控终端中触控显示组件总成和中框的连接结构示意图;
图19是本发明实施方式提供的基于压力感应的键盘的剖面结构及按键触摸示意图。
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明部分实施例进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
图1所示为本发明实施例提供的基于压力传感组件的触控压力检测模组的结构及应用示意图,根据图1所示,触控压力检测模组包括相连接的触控响应组件1和压力传感组件2,该触控压力检测模组可置于图1所示的移动终端中,例如手机,其中,触控响应组件1用于检测压力传感组件2由于外部按压而受到的压力,并可根据压力决定是否予以响应。
其中,压力传感组件2用于将受压而产生的电信号输出至触控响应组件1。触控响应组件1用于根据接收到的电信号计算压力传感组件2受压而产生的电容变化量,并根据电容变化量计算压力传感组件受到的压力。
本发明实施例利用电容式原理来检测压力的大小。如图2A所示为平行板电容结构,平行板电容公式C=εS/Kd,其中K是常数,ε表示两基板之间的介电常数,S表示基板面积,d代表两基板间的距离。如图2B所示,当有外力施加在平行板电容上时,会导致其中一个基板或者两个基板发生形变,进而改变两基板间的距离,例如两基板间的距离从D1减小为D2。根据平行板电容公
式,此时的电容发生改变。芯片通过电路检测出电容值的变化进而计算出所施加压力的大小。
一般而言,电容检测原理包括自电容式检测和互电容式检测。向两个基板中的第一基板施加驱动信号(收发信号),第二基板接地,第一基板的驱动信号自打自收即可检测第一基板与第二基板间的电容变化,此为自电容式压力检测。将第一基板接驱动通道,向第一基板施加驱动信号,将第二基板接感应通道,通过感应通道接收感应信号,检测驱动通道和感应通道间的互电容的变化的方式为互电容式原理。后续内容中主要以采用自电容式原理的检测方式进行说明,然而,本发明实施例包括但不限于自电容式检测方式。
本发明实施例中的压力传感组件可以采用自电容式或者互电容式压力检测方式的任意一种。自电容式压力检测以及互电容式压力检测的原理均为当构成自电容式压力检测结构或者互电容式压力检测结构的两电容基板之间的间隙由于受到外部按压发生变化时,压力检测结构的电容相应发生变化,并且间隙大小的变化与压力的大小呈正相关,即在一定条件下,压力越大,压力传感组件内间隙的变化越大,压力传感组件的电容变化越大。后续内容中的压力传感组件2主要以自电容式压力检测方式为例,但为了更好理解本发明实施例提供的技术方案,有部分技术内容也以互电容式压力检测方式进行示例性说明。
一般的安卓手机有三个基于电容触控技术的虚拟触控按键,图1中的三个并排的矩形框表示三个压力传感组件2,每个压力传感组件2相当于一个按键,用于执行一个按键的功能。实际应用中,压力传感组件2的数量可根据实际需要确定,例如当手机的主面板上只需设置一个按键时,触控压力检测模组中只需要一个压力传感组件2即可。
在图1所示的实施例中,每个矩形框有两个引脚引出(此处压力传感组件2以互电容式为例),两个引脚分别连接触控响应组件1的驱动通道和感应通道。触控响应组件1分别向各个压力传感组件2的其中一个引脚输入激励信号,再通过各个压力传感组件2的另一个引脚接收各个压力传感组件2由于受
外部按压而产生的电信号。触控响应组件1根据各个压力传感组件2的电信号的变化就可以计算出各个压力传感组件2的电容变化量,继而计算出各个压力传感组件2受到的压力。
当压力传感组件采用自电容式压力检测结构时,每一个压力传感组件2的其中一个引脚作为信号收发引脚并连接于触控响应组件1,压力传感组件2的另一个引脚接地。触控响应组件1通过连接于压力传感组件2的信号收发引脚向压力传感组件2输入激励信号,并通过该信号收发引脚接收压力传感组件2由于受外部按压而产生的电信号。触控响应组件1根据各个压力传感组件2的电信号的变化就可以计算出各个压力传感组件2的电容变化量,继而计算出各压力传感组件2受到的压力。
一般而言,手指无意识触碰按键的压力小于100g,而手指有意识按压按键的压力大于200g。因此,为避免误操作,设定当压力传感组件2受到的压力大于第一设定阈值(例如200g)时,才输出与该压力传感组件2对应的触控事件的触发信号,否则不输出该触发信号,从而降低无意识触碰时产生的误操作的发生几率。当有多个压力传感组件2时,触控响应组件1可以同时检测各个压力传感组件2受到的压力,或者也可以轮流检测各个压力传感组件2受到的压力,本发明实施例对这些不作限制。
在一个实施例中,每个压力传感组件2还可对应多个触控事件,这时,在触控响应组件1内部可以预存每个压力传感组件2受到的压力所处的压力范围与触控事件的对应关系。此时,对于任何一个压力传感组件2,当该压力传感组件2受到的压力大于第一设定阈值时,触控响应组件1输出压力所处的压力范围对应的触控事件的触发信号。例如,可将大于第一设定阈值的压力P划分为三个压力范围:P<P1、P1≤P<P2、P≥P2,对于某一压力传感组件2,当P<P1时对应第一触控事件,P1≤P<P2时对应第二触控事件,P≥P2时对应第三触控事件。如果该压力传感组件2受到的压力P所处的范围为P<P1,则触控响应组件1输出第一触控事件的触发信号,如果该压力传感组件2受到的压力P所处
的范围为P1≤P<P2,则触控响应组件1输出第二触控事件的触发信号,如果该压力传感组件2受到的压力P所处的范围为P≥P2,则触控响应组件1输出第三触控事件的触发信号。通过这种方式可以实现在同一按键上根据压力大小执行不同的操作,比如轻按为预览,重按为打开,类似于压力感应触摸屏对不同压力的响应。
图3所示为本发明实施例提供的基于压力传感组件的触控压力检测模组的一种按键触摸示意图,由图3可以看出,压力传感组件2并非由手指5直接触摸,手指5触摸时,压力传感组件2上设置有盖板3(如手机的盖板),盖板3与压力传感组件2之间通过贴合胶4贴合,手指5通过触摸盖板3对压力传感组件2施加压力。当手指5触摸盖板3时,对盖板3施加压力,压力通过盖板3、贴合胶4传递到压力传感组件2,从而将压力传递到压力传感组件2上。在一些实施例中,手指也可以直接触摸压力传感组件2,本发明实施例对这些不做限制。
图4A所示为电容式压力传感组件的等效电路示意图,图4B所示为电容式压力传感组件受到压力时的等效电路示意图。结合图3、4A、4B,当手指5触摸盖板3,压力通过盖板3、贴合胶4传递到压力传感组件2,使压力传感组件2受到压力,使压力传感组件2的电容C0产生变化,变化量为ΔC,即压力传感组件2的电容从C0变化为C0+ΔC。
图5所示为基于自电容式压力传感组件的触控压力检测模组与主控芯片7的连接示意图。根据图5所示,触控响应组件1包括处理器单元105、激励信号电路单元102、前级放大单元103、模数转换电路单元104、收发切换开关106。处理器单元105与激励信号电路单元102的输入端连接,激励信号电路单元102的输出端与收发切换开关106的第一端连接,收发切换开关106的第二端与压力传感组件2的一端连接,收发切换开关106的第三端与前级放大单元103的输入端连接,前级放大单元103的输出端与模数转换电路单元104的输入端连接,模数转换电路单元104的输出端与处理器单元105连接。处理器单元105
控制激励信号电路单元102通过收发切换开关106向压力传感组件2输入驱动信号,压力传感组件2输出的电信号通过收发切换开关106输入前级放大单元103,经前级放大单元103放大后输入模数转换电路单元104,并经模数转换电路单元104转换为数字信号后输入处理器单元105。处理器单元105根据数字信号的变化计算压力传感组件2的电容变化量,并根据电容变化量计算压力传感组件2受到的压力。
如果只有一个压力传感组件2,收发切换开关106可直接与前级放大单元103的输入端连接。当有多个压力传感组件2时,触控响应组件1中需加入多路复用开关单元101。多路复用开关单元101相当于是一个多通道的输入输出开关,通过多路复用开关单元101可以支持多个通道(即多个压力传感组件2)的压力检测。这时,如图5所示,收发切换开关106需通过多路复用开关单元101与前级放大单元103的输入端连接。
图6所示为基于互电容式压力传感组件的触控压力检测模组与主控芯片7的连接示意图。根据图6所示,压力传感组件2的一端与激励信号电路单元102的输出端连接,压力传感组件2的另一端与前级放大单元103的输入端连接,从而实现触控响应组件1向压力传感组件2的驱动电极施加驱动信号,并通过压力传感组件2的感应电极接收感应信号。如果只有一个压力传感组件2,压力传感组件2可直接与前级放大单元103的输入端连接。当触控压力检测模组存在多个压力传感组件2时,触控响应组件1中需加入多路复用开关单元101。多路复用开关单元101相当于是一个多通道的输入输出开关,通过多路复用开关单元101可以支持多个通道(即多个压力传感组件2)的压力检测。这时,如图6所示,各个压力传感组件2需通过多路复用开关单元101与前级放大单元103的输入端连接。
具有传统机械按键的电子设备均可采用上述触控压力检测模组,例如,手机、平板、便携式/台式电脑等电子设备,并且键盘包含指纹按键的电子设备也可采用上述触控压力检测模组。
如图7所示,上述触控压力检测模组还可与指纹识别模组6结合,从而得到一种基于指纹识别的触控装置,该基于指纹识别的触控装置包括上述触控压力检测模组、指纹识别模组6和主控芯片7。在指纹识别模组6受外部压力按压时,压力传递至触控压力检测模组中的压力传感组件2。触控压力检测模组中的触控响应组件1的输出端与主控芯片7连接。主控芯片7用于在接收到触控压力检测模组1的触发信号之后判断是否需要执行指纹识别操作,若是,则生成一指纹识别指令,然后指纹识别模组6在接收到该指纹识别指令后执行指纹识别操作,并将识别到的指纹信息发送给主控芯片7。其中,指纹识别模组6在接收到该指纹识别指令之前处于休眠状态;当接收到该指纹识别指令后,退出休眠状态进行指纹识别操作。当将识别到的指纹信息发送给主控芯片7之后,指纹识别模组6再次进入休眠状态。
如图8所示,该基于指纹识别的触控装置的工作流程如下:
步骤801、指纹识别模组6进入休眠状态,然后进入步骤802。
步骤802、触控响应组件1按设定频率检测压力传感组件2受到的压力,判断压力传感组件2上受到的压力是否大于第一设定阈值,并在压力大于第一设定阈值时,进入步骤803,在压力小于或者等于第一设定阈值时,返回步骤801。压力检测频率设定得越高,压力检测的实时性就越好。
步骤803、触控响应组件1向主控芯片7发送与压力传感组件2的触控事件相对应的触发信号,然后进入步骤804。
步骤804、主控芯片7判断响应于触控事件时是否需要执行指纹识别操作,当判断出需要执行指纹识别操作时,进入步骤805,不需要执行指纹识别操作时,返回步骤801。
步骤805、主控芯片7向指纹识别模组6发出指纹识别指令,然后进入步骤806。
步骤806:指纹识别模组6接收到主控芯片7发出的指纹识别指令后退出休眠状态并执行指纹识别操作,同时,将识别到的指纹信息发送给主控芯片7,
然后返回步骤801。
根据该基于指纹识别的触控装置的工作流程,触控响应组件1发送触发信号给主控芯片7后,主控芯片7才会根据接收到的触发信号中的触控事件判断响应该触控事件时是否需要启用指纹识别,而只有当响应触控事件需要启用指纹识别时主控芯片7才会向指纹识别模组6发送指纹识别指令。因此,指纹识别模组6大部分情况处于休眠状态,只有在有触控事件发生(即主控芯片7接收到触控事件的触发信号)以及需要识别指纹(即主控芯片7判断出响应触控事件需要执行指纹识别操作)时指纹识别模组6才会被唤醒并执行指纹识别操作,因此,可降低基于指纹识别的触控装置的系统功耗。
同时,上述工作流程中,步骤802主要用于检测对压力传感组件的按压力度,以防止无意识的触摸所引起的误操作,只有当对压力传感组件的按压力度达到特定强度时,才会向主控芯片发送触控事件的触发信号,由此可降低无意识触摸按键时导致的误操作的发生几率。
前文描述了基于压力传感组件2的触控压力检测模组的结构及其应用,下文将详细描述与前文的触控压力检测模组的结构相类似的另一种触控压力检测模组的结构及其应用。该触控压力检测模组包括:相连接的压力传感组件2和触控响应组件1,压力传感组件2用于将受压而产生的电信号输出至触控响应组件1,触控响应组件1用于根据电信号计算压力传感组件2受压而产生的电容变化量,并根据电容变化量计算压力传感组件受到的压力,可以看出,此处的触控压力检测模组的压力传感组件2和触控响应组件1的逻辑功能与前文所述的触控压力检测模组中的压力传感组件和触控响应组件的逻辑功能相同,因此,此处不再赘述触控压力检测模组中的压力传感组件2和触控响应组件1的连接结构及相互间的信号流向。然而,本实施例的触控压力检测模组的触控方式包括但不限于前文所述的触控压力检测模组的触控方式。
本实施例重点在于揭示基于上文所述的触控压力检测模组的触控压力检测装置的结构,本实施例所揭示的触控压力检测装置的压力传感组件2的结构
同样适用于前文所述的触控压力检测模组的压力传感组件2的结构。本实施例中,压力传感组件2包括:相对设置的第一基板和第二基板,第一基板和第二基板之间具有可变间隙。其中,该可变间隙由于压力传感组件2受压而发生变化,触控响应组件1用于根据由该可变间隙的变化而产生的电信号计算压力传感组件2受到的压力。
结合上文所述,当将上述触控压力检测装置应用于终端时,可以得到一种触控终端。举例而言,该触控终端例如为手机。请参阅图9和图10,该触控终端包括:盖板3、中框8以及指纹识别模组6。其中,压力传感组件2和指纹识别模组6均设置在盖板3的下方,即压力传感组件2和指纹识别模组6设置于盖板3和中框8之间。其中,压力传感组件2邻近于指纹识别模组6进行设置。比如在图9所示的实施例中,压力传感组件2设置在指纹识别模组6的两侧,或者在图10所示的实施例中,压力传感组件2设置在指纹识别模组6的下方。
并且,盖板3可以为触摸屏的玻璃盖板,盖板3的底面(即朝向所述中框8的表面)在指纹识别模组6所在区域可以形成有凹陷部,其中指纹识别模组6可以收容在凹陷部之中,并通过贴合胶4贴合固定到凹陷部的内壁。采用这种结构,盖板3可以为指纹识别模组6提供手指按压及指纹采集界面,用户在需要进行指纹识别时可以将手指按压到盖板3的表面,指纹识别模组6通过盖板3采集到用户手指的指纹信息。由于指纹识别模组6设置在触摸屏的玻璃盖板下方,因此该触控终端无需在盖板3开孔以收容指纹识别模组6,也无需设置额外的陶瓷盖板、玻璃盖板或者蓝宝石盖板,从而构成隐藏式指纹识别传感器(Invisible Fingerprint Sensor,IFS)结构。
由于压力传感组件2邻近于指纹识别模组6设置,当指纹识别模组6受外部压力按压时,压力通过盖板3或者指纹识别模组6传递至触控压力检测模组的压力传感组件2而使得第一基板20和第二基板21之间的可变间隙受压而发生改变。其中,压力传感组件的设置方式可以采用如下任意一种。如图9所
示,压力传感组件2的第一基板20设置于盖板3,该压力传感组件2的第二基板21设置于中框8。在一种替代的实施例中,图9中第一基板20和第二基板21的位置可以互换,即如图11所示,压力传感组件的第一基板20设置于中框8,第二基板21设置于盖板3。在另一种替代的实施例中,压力传感组件的第一基板20和第二基板21还可以均设置于指纹识别模组6和中框8之间。如图10所示,压力传感组件的第一基板20设置于指纹识别模组6,第二基板21设置于中框8,或者将图10中第一基板20和第二基板21的位置互换,即将压力传感组件的第一基板20设置于中框,第二基板21设置于指纹识别模组6。
当触控压力检测模组中包括多个压力传感组件时,各个压力传感组件2的第一基板20例如设置于盖板3且分布于指纹识别模组6的互相对称的两侧。此时,触控响应组件1中可以加入图5或者图6所示的多路复用开关单元101。多路复用开关单元101相当于是一个多通道的输入输出开关,通过多路复用开关单元101可以支持多个通道(即多个压力传感组件2)的压力检测。
如图9和图10所示,压力传感组件2的第一基板20和第二基板21之间具有可变间隙。在实际应用中,该可变间隙可以为空气间隙,或者还可以在第一基板20和第二基板21之间填充绝缘弹性体,例如弹性泡棉。
盖板3与压力传感组件2之间通过贴合胶4贴合,贴合胶4例如可以采用背胶。手指通过触摸盖板3对压力传感组件2施加压力。当手指触摸盖板3时,对盖板3施加压力,压力通过盖板3、贴合胶4传递到压力传感组件2,从而将压力传递到压力传感组件2上,由此,压力传感组件2的可变间隙由于盖板3受压而发生变化。通常,可变间隙在压力的作用下变小使得第一基板20和第二基板21之间的电容增大,触控响应组件1以特定频率对压力传感组件2上的电容值进行检测,当可变间隙减小到特定程度时,触控响应组件1向主控芯片7发出触发信号。
如图9所示,当压力传感组件2的第一基板20固定于盖板3时,该压力传感组件2的第二基板21固定于中框8。这样,第一基板20和第二基板21之
间可以利用盖板3和中框8之间的间隙形成可变间隙。当可变间隙为空气间隙时,第二基板21可以独立于触控压力检测模组,以单独的一层接地层来实现,因此,可以将接地层实现的第二基板21单独固定于中框8,例如通过贴合胶4贴合于中框8。
在图9所示的实施例中,当作为收发电极的第一基板20固定于盖板3时,压力传感组件2容易受到盖板3上方手指的触摸干扰,引起压力传感组件2上电容值的变化,而触控响应组件1无法分辨该电容变化是手指触摸引起还是手指按压引起,继而可能影响触控响应组件1判断的准确性。因此,可以在触控终端中增加屏蔽层9,如图9所示,屏蔽层9设置于盖板3和压力传感组件2的第一基板20之间,来屏蔽手指触摸引起的干扰。
在实际应用中,作为收发电极的第一基板20可以采用柔性线路板制作。例如可以采用包括有两层线路的柔性线路板,其中一层用于制作第一基板20,另一层为屏蔽层9,其中屏蔽层9接地。当然,第一基板20和屏蔽层9也可以采用双层的氧化铟锡(ITO)/银膜(AG Film)材料来制作,其电路结构类似于柔性线路板结构,此处不再赘述。
目前,相对于Oncell/Incell式的触控显示屏,外挂式电容触控屏的使用十分广泛。外挂式电容触控屏的盖板上通常设置有走线层。如图12、图13所示,可以将压力传感组件2与盖板3上的走线层结合在一起,从而有利于节省成本,简化生成工艺。例如,当触控终端采用G-Film(Glass-Film,玻璃加薄膜结构)、OGS(One Glass Solution,一体化触控)或者SITO(Single Indium Tin Oxid,单层氧化铟锡)结构的显示模组时,则可以把屏蔽层9(地层GND)制作在走线层内,这样,只需要采用单层柔性线路板制作压力传感组件2的第一基板20,并且在组装柔性线路板至触控终端时,也不需要考虑两层柔性线路板中的屏蔽层9是否在第一基板20所在层的上方,有利于简化生成工艺、降低成本。
图12所示为G-Film结构的显示模组中设置屏蔽层的结构示意图,对于如OGS,SITO类型的显示模组中设置屏蔽层的方式则不再一一进行举例。图
12中,走线层30包括光学胶带(Optical Clear Adhesive,简称OCA)层301以及第一薄膜层302。其中第一薄膜层302中设置有触摸通道走线层3020以及接地层,该接地层可以复用为屏蔽层9。
又或者,当终端包括G-FilmFilm(Glass-FilmFilm,玻璃加双层薄膜结构)结构的显示模组时,还可以把屏蔽层9、压力传感组件2的第一基板20完全制作在走线层30内。如图13所示为G-FilmFilm结构的触控显示模组中设置屏蔽层9和第一基板20的结构示意图,其中,屏蔽层9位于第一基板20上方。图13中,走线层30包括:光学胶带(Optical ClearAdhesive,简称OCA)层301、第一薄膜层302以及第二薄膜层303,第一薄膜层302和第二薄膜层303之间还设置有另一层OCA层301。其中第一薄膜层302中设置有接地层,该接地层可以复用为屏蔽层9,第一薄膜层302和第二薄膜层303中均设置有触摸通道走线层3020,同时,第二薄膜层303中还可以设置压力传感组件2的第一基板20。
在实际应用中,当盖板3上设置有走线层30时,压力传感组件2还可以设置于走线层30和中框之间。在一个实施例中,压力传感组件2的第一基板20可以设置于走线层30,且第二基板21设置于中框,在一个替代的实施例中,压力传感组件的第一基板20设置于中框,第二基板设置于走线层30。在一些替代的实施例中,屏蔽层9和走线层30也可以相互独立设置,此时,屏蔽层9可以设置于第一基板20和走线层30之间。
如图10所示为将压力传感组件2的第一基板20和第二基板21设置于指纹识别模组6和中框8之间的触控终端的结构示意图。一般而言,指纹识别模组6包括:指纹识别芯片60和补强钢片,该补强钢片复用为屏蔽层9。指纹识别芯片60设置于盖板3和补强钢片之间,压力传感组件2的第一基板20和第二基板21均位于指纹识别芯片60下方。在实际应用中,可以将指纹识别模组6的补强钢片和压力传感组件2的第一基板20或者第二基板21相结合,以简化生成工艺。通常,指纹识别芯片60正下方的补强钢片是接地的,且该补强钢
片可以用于固定和承载元器件。同时,由于该补强钢片接地,所以可以将其作为第一基板20的屏蔽层9。
或者,如图14所示,压力传感组件2的第一基板20也可以通过贴合胶4贴合于中框8,此时,补强钢片则作为压力传感组件2的第二基板21(接地电极)。再或者,还可以向补强钢片注入激励信号,使补强钢片充当压力传感组件2的第一基板20,从而与中框8上的接地层形成平行板电容,此时指纹识别芯片60则可以成为压力传感组件2的第一基板20的屏蔽层9。通过将指纹识别模组6和压力传感组件2的第一基板20或者第二基板21相结合,可以简化生成工艺,节约成本。
上文所述的触控终端中,将指纹识别模组和触控压力检测模组的压力传感组件相结合时,为了提高指纹识别模组的信号量以及信噪比,需要对盖板进行减薄。如图15A-15D分别示出了盖板减薄的四种方案,其中,图15A和图15B,盖板3对应于指纹识别模组6的区域的下表面和上表面分别设有盲孔,图15C中,盖板3对应于指纹识别模组6的区域的上下表面均设有盲孔,图15D中,盖板3设置有对应于指纹识别模组6的通孔。当然,在实际应用中,如图15E所示,也可以不对盖板3进行减薄,此时,盖板3对应于指纹识别模组6的区域的上下表面无需开设盲孔或者通孔。图15A-15E中,指纹识别模组6的补强钢片复用为压力传感组件2的第二基板21,压力传感组件的第一基板20通过贴合胶4贴合于补强钢片,指纹识别芯片60通过贴合胶4贴合于盖板3。
根据上文所述的触控终端中,一般来说压力传感组件2的第一基板20采用实心矩形的形状即可满足触控响应组件1对于电容变化量的要求。但在实际应用中,当需要提高检测精度时,就需要减小第一基板20和第二基板21之间的寄生电容,对于自电容式压力检测结构而言,即是减小第一基板20的对地电容,从而可以增大检测到的电容值变化量。这就需要对第一基板20的形状进行设计,对自电容式压力检测结构而言,第二基板21为接地电极,因此,第二基板21可以为接地的任意形状。
以自电容式为例,如图16A所示,第一基板20的形状为矩形,如图16B所示,第一基板20的形状为口字形,如图16C所示,第一基板20的形状为回字形,回字形是通过在大的实心矩形的中心挖去一个小的实心矩形而形成的。如图16D所示,第一基板20的形状为折线形。
再以互电容式为例,如图17A所示,采用互电容式的压力传感组件2的第一基板20和第二基板21相互平行且均呈矩形,其中,第一基板20连接于触控响应组件1的驱动通道,第二基板21连接于触控响应组件1的感应通道。或者,如图17B所示,第一基板20还可以设计为:第一基板20包括呈回字形布置于同一平面内的第一电极201和第二电极202,而第二基板21接地,并且第二基板21和第一基板20构成平行板电容。又或者,如图17C所示,第一基板20还可以设计为:第一基板20包括均呈E字形布置于同一平面内的第一电极201和第二电极202,且第一电极201和第二电极202相互啮合,而第二基板21接地,并且第一基板20和第二基板21构成平行板电容。以上仅是举例说明,第一基板20和第二基板21的形状和位置关系不限于此。
一般而言,上文所述的触控终端中还包括:显示模组、触控模组。通常,盖板、触控模组、显示模组以及触控压力检测模组组成触控显示组件总成。触控显示组件总成通常是通过点胶工艺与触控终端的中框结合固定的,即触控显示组件总成的四周(例如盖板的四周)均点胶固定于中框。采用该种点胶工艺装配触控显示组件总成时,手指按压盖板上方时,在指纹识别模组所在区域(即按键区域)能够引起的物理形变量非常小,一般而言,1公斤的压力可以产生的物理形变要小于10微米。在物理形变量非常小的情况下,就需要触控响应组件具有较高的性能才能检测出十分微小的形变信号,并且再将十分微小的形变空间划分成多个压力等级时,导致计算难度更高。
为了增大单位压力下触控显示组件总成的物理形变量,在一个实施例中,如图18所示,触控显示组件总成包含压力传感组件的一端(即设置有第一基板和第二基板的一端)通过弹性体42固定于中框,触控显示组件总成的其余部分
仍然可以通过点胶层41固定于中框,该弹性体例如为压缩的双面带胶泡棉材料。采用该种触控显示组件总成固定结构的触控终端既保证了触控显示组件总成组装的可靠性,同时还可以增大触控显示组件总成在指纹识别模组区域受压时的物理形变量。经过实际测试,在1公斤压力下,采用弹性体结合于中框的触控显示组件总成的物理形变量相当于采用点胶工艺的触控显示组件总成的物理形变量的数倍。
在实际应用中,上文所述的触控终端中,触控响应组件与指纹识别模组的指纹识别芯片可以集成于同一物理芯片上。或者,还可以将触控响应组件与触控模组的触控芯片集成于同一物理芯片上。从而,可以减少触控终端中芯片的数目,有利于简化触控终端的生产工艺。
如上文所述,当将上述触控压力检测模组应用于键盘时,可以得到一种基于压力感应的键盘。根据图19所示的该键盘的剖面结构及按键触摸示意图,该键盘包括盖板3及上述触控压力检测模组,触控压力检测模组的各个压力传感组件2利用贴合胶4贴合在盖板3的下表面,每一个压力传感组件2表示一个按键。需要点击某一按键时,只需要触摸盖板3上的位于相应压力传感组件2正上方的位置,并施加适当压力即可实现按键触发。
上面各种方法的步骤划分,只是为了描述清楚,实现时可以合并为一个步骤或者对某些步骤进行拆分,分解为多个步骤,只要包含相同的逻辑关系,都在本专利的保护范围内;对算法中或者流程中添加无关紧要的修改或者引入无关紧要的设计,但不改变其算法和流程的核心设计都在该专利的保护范围内。
本领域技术人员可以理解实现上述实施例方法中的全部或部分步骤是可以通过程序来指令相关的硬件来完成,该程序存储在一个存储介质中,包括若干指令用以使得一个设备(可以是单片机,芯片等)或处理器(processor)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括:U盘、移动硬盘、只读存储器(ROM,Read-Only Memory)、随机存取存储器(RAM,Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
最后应说明的是:以上实施例仅用以说明本申请的技术方案,而非对其限制;尽管参照前述实施例对本申请进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。
Claims (18)
- 一种触控压力检测装置,其特征在于,包括:盖板、指纹识别模组和压力传感组件;所述压力传感组件和所述指纹识别模组设置在所述盖板的下方,且所述压力传感组件邻近于所述指纹识别模组设置;所述压力传感组件包括相对设置的第一基板和第二基板;其中,所述第一基板和第二基板之间具有可变间隙;所述指纹识别模组在受到外部的压力按压时,所述压力传递到所述压力传感组件而使得所述第一基板和第二基板之间的可变间隙受压而发生改变。
- 如权利要求1所述的触控压力检测装置,其特征在于,所述盖板的底面形成有凹陷部,所述指纹识别模组收容在所述凹陷部之中,所述盖板为所述指纹识别模组提供指纹采集界面。
- 如权利要求2所述的触控压力检测装置,其特征在于,所述盖板为触摸屏的玻璃盖板,所述触控压力检测装置还包括中框;所述第一基板和所述第二基板设置于所述盖板和所述中框之间。
- 根据权利要求3所述的触控压力检测装置,其特征在于,所述压力传感组件的第一基板设置于所述盖板且所述第二基板设置于所述中框;或者,所述压力传感组件的第一基板设置于所述中框且所述第二基板设置于所述盖板;或者,所述压力传感组件的第一基板设置于所述指纹识别模组,且所述第二基板设置于所述中框;或者,所述压力传感组件的第一基板设置于所述中框,所述第二基板设置于所述指纹识别模组。
- 根据权利要求3所述的触控压力检测装置,其特征在于,所述触控终端还包括走线层,所述走线层设置于所述盖板的下方;所述压力传感组件采用如下任意一种方式设置:所述压力传感组件的第一基板设置于所述走线层且所述第二基板设置于所 述中框;或者,所述压力传感组件的第一基板设置于所述中框且所述第二基板设置于所述走线层;
- 根据权利要求3至5任意一项所述的触控压力检测装置,其特征在于,所述触控终端还包括屏蔽层,且所述第一基板包括所述压力传感组件的收发电极;所述屏蔽层和所述压力传感组件的第一基板采用如下任意一种方式设置:当所述盖板下方未设置走线层时,所述屏蔽层设置于所述盖板和所述第一基板之间,且所述屏蔽层和所述第一基板均位于所述盖板下方;当所述盖板下方设置有走线层时,所述屏蔽层设置于所述走线层内,且所述第一基板设置于所述走线层下方;或者,所述屏蔽层和所述第一基板均设置于所述走线层内,且所述第一基板位于所述屏蔽层下方;或者,所述屏蔽层设置于所述走线层和所述第一基板之间,且所述屏蔽层和所述走线层均位于所述盖板下方。
- 根据权利要求3至6任一项所述的触控压力检测装置,其特征在于,所述指纹识别模组包括:指纹识别芯片和补强钢片;所述指纹识别芯片设置于所述盖板和所述补强钢片之间;所述压力传感组件与所述指纹识别模组之间采用如下任意一种方式设置:所述压力传感组件的第一基板设置于所述补强钢片下方,且所述第二基板设置于所述中框;或者,所述补强钢片接地并复用为所述压力传感组件的第二基板,且所述第一基板设置于所述中框,其中所述第二基板包括所述压力传感组件的接地电极;或者,所述补强钢片连接于所述触控响应组件并复用为所述压力传感组件的第一基板,且所述第二基板设置于所述中框,其中所述第一基板包括所述压力传感 组件的收发电极。
- 根据权利要求1至7任意一项所述的触控压力检测装置,其特征在于,所述第二基板包括所述压力传感组件的接地电极且所述第一基板包括所述压力传感组件的收发电极,所述第一基板呈如下任意一种形状:矩形、口字形、回字形、折线形。
- 根据权利要求1至7任意一项所述的触控压力检测装置,其特征在于,所述第一基板和所述第二基板相互平行且均呈矩形,且所述第一基板连接于所述触控响应组件的驱动通道,所述第二基板连接于所述触控响应组件的感应通道;或者,所述第一基板包括呈回字形布置于同一平面内的第一电极和第二电极,且所述第二基板接地;或者,所述第一基板包括均呈E字形布置于同一平面内的第一电极和第二电极,且所述第一电极和第二电极相互啮合,所述第二基板接地;其中,所述第一电极连接于所述触控响应组件的驱动通道,所述第二电极连接于所述触控响应组件的感应通道。
- 一种触控终端,其特征在于,所述触控终端包括触控显示组件总成,所述触控显示组件总成包括显示模组、触控模组和如权利要求1至9中任一项所述的触控压力检测装置;其中,所述触控显示组件总成包含所述压力传感组件的一端通过弹性体固定于所述中框。
- 根据权利要求10所述的触控终端,其特征在于,所述触控压力检测装置还包括与所述压力传感组件相连接的触控响应组件,所述压力传感组件在所述第一基板和第二基板之间的可变间隙受压发生改变时电容发生变化并输出相应的电信号,所述触控响应组件用于根据所述电信号计算所述压力传感组件受压而产生的电容变化量,并根据所述电容变化量计算所述压力传感组件受到的压力。
- 根据权利要求11所述的触控终端,其特征在于,所述触控响应组件与所述指纹识别模组的指纹识别芯片集成于同一物理芯片上;或者,所述触控响应组件与所述触控模组的触控芯片集成于同一物理芯片上。
- 一种触控压力检测模组,其特征在于,包括相连接的压力传感组件和触控响应组件;所述压力传感组件用于将受到压力而产生的电信号输出至所述触控响应组件;所述触控响应组件用于根据所述电信号计算所述压力传感组件受到压力而产生的电容变化量,并根据所述电容变化量计算所述压力传感组件受到的压力;其中,所述压力传感组件对应至少一个触控事件,所述触控响应组件内预存有压力范围与触控事件的对应关系,当所述压力大于第一设定阈值时,所述触控响应组件输出触发信号;其中所述触发信号与所述压力所处的压力范围对应。
- 根据权利要求13所述的触控压力检测模组,其特征在于,所述压力传感组件有多个,所述触控响应组件分别检测各个压力传感组件受到的压力。
- 根据权利要求14所述的触控压力检测模组,其特征在于,所述触控响应组件还包括多路复用开关单元和前级放大单元,各个压力传感组件分别通过所述多路复用开关单元与所述前级放大单元的输入端连接。
- 一种基于指纹识别的触控装置,其特征在于,包括:指纹识别模组、主控芯片以及如权利要求13-15中任一项所述的触控压力检测模组;所述触控响应组件的输出端与所述主控芯片连接,在所述指纹识别模组受外部压力按压时,所述压力传递至所述触控压力检测模组中的压力传感组件;所述主控芯片用于在接收到所述触控压力检测模组的触发信号之后判断是否需要执行指纹识别操作,若是,则生成一指纹识别指令;所述指纹识别模组用于在接收到所述指纹识别指令后执行指纹识别操作,并将识别到的指纹信息发送给所述主控芯片。
- 根据权利要求16所述的基于指纹识别的触控装置,其特征在于,所述指纹识别模组在接收到所述指纹识别指令之前处于休眠状态,在接收到所述指 纹识别指令后,退出休眠状态并执行指纹识别操作,并且在将识别到的指纹信息发送给所述主控芯片之后,再次进入休眠状态。
- 一种基于压力感应的键盘,其特征在于,包括盖板和如权利要求13至15任一项所述的触控压力检测模组,所述触控压力检测模组中的压力传感组件贴合在所述盖板的下表面。
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