WO2018037327A1

WO2018037327A1 - Soldering Quality Detection Platform

Info

Publication number: WO2018037327A1
Application number: PCT/IB2017/055036
Authority: WO
Inventors: Lei Zhou; Dandan Zhang; Roberto Francisco-Yi LU; Hongzhou SHEN; Jian ZENG
Original assignee: Tyco Electronics Shanghai Co Ltd; Tyco Electronics Dongguan Ltd; Tyco Electronics UK Ltd; TE Connectivity Corp
Current assignee: Tyco Electronics Shanghai Co Ltd; Tyco Electronics Dongguan Ltd; Tyco Electronics UK Ltd; TE Connectivity Corp
Priority date: 2016-08-23
Filing date: 2017-08-21
Publication date: 2018-03-01
Anticipated expiration: 2019-02-23
Also published as: US10955363B2; DE112017004207T5; US20190187070A1; CN107764822A; CN107764822B; JP2019525191A; JP6727409B2; DE112017004207B4

Abstract

The present disclosure discloses a soldering quality detection platform including: a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldering product to be detected; a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldering product to be detected; and a judgment device adapted to determine whether a soldering quality is qualified based on the acquired 2D and 3D images of the soldered region of the soldering product. In various embodiments according to the present disclosure, it is determined whether the soldering quality of the soldering product is qualified based on both the 2D and 3D image information of the soldered region of the soldering product, thereby improving accuracy of the judgment.

Description

Soldering Quality Detection Platform

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Chinese Patent Application No.CN201610710653.8 filed on August 23, 2016 in the State Intellectual Property Office of China, the whole disclosure of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

Field of the Invention

The present disclosure relates to a soldering quality detection platform.

Description of the Related Art

In the prior arts, it is generally determined whether a soldering quality of the soldering product is qualified by human eyes. This judgment made by the human eyes, however, has quite high error rate and very low efficiency. Therefore, in recent years, there has been proposed a technical scheme for determining whether the soldering quality of the soldering product is qualified by machine vision. In the prior arts, a 2D (two-dimensional) image of a soldered region (solder joint) of a soldering product to be detected is usually capture by a 2D camera, and then a computer determines whether the soldering quality is qualified based on the captured 2D image information of the soldered region of the soldering product. However, the 2D image information of the soldered region of the soldering product can only reflects information of the soldered region of the soldering product such as a shape and size of a two-dimensional projection profile thereof, and can not reflect information of the soldered region of the soldering product such as a three-dimensional shape and size thereof. Therefore, the technical solution of determining whether the soldering quality is qualified only based on the 2D image information is still prone to erroneous judgment and thus reduces accuracy of the judgment.

SUMMARY OF THE INVENTION

The present disclosure has been made to solve at least one of the above problems and drawbacks existing in the prior arts.

According to one aspect of the present disclosure, there is provided a soldering quality detection platform, comprising: a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldering product to be detected; a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldering product to be detected; and a judgment device adapted to determine whether a soldering quality is qualified based on the acquired 2D and 3D images of the soldered region of the soldering product.

According to an exemplary embodiment of the present disclosure, the soldering quality detection platform further comprises a display device adapted to display a judgment result obtained by the judgment device.

According to another exemplary embodiment of the present disclosure, the 2D image acquisition device comprises a 2D camera system adapted to capture the 2D image of the soldered region of the soldering product to be detected. The 2D camera system comprises a 2D camera and an illumination light source.

According to a further another exemplary embodiment of the present disclosure, the 3D image acquisition device comprises a 3D camera system adapted to capture the 3D image of the soldered region of the soldering product to be detected. The 3D camera system comprises a stereoscopic camera and a laser camera.

According to a yet another exemplary embodiment of the present disclosure, the soldering quality detection platform further comprises a support cabinet having a first accommodation chamber and a second accommodation chamber vertically spaced apart from each other. The 2D image acquisition device and the 3D image acquisition device are installed in the first accommodation chamber, and the display device is mounted in the second accommodation chamber.

According to a still another exemplary embodiment of the present disclosure, the soldering quality detection platform further comprises a carrier adapted to be loaded with the soldering product to be detected.

According to a further another exemplary embodiment of the present disclosure, the soldering quality detection platform further comprises a tray adapted to be loaded with the carrier.

According to a yet another exemplary embodiment of the present disclosure, one of the carrier and the tray is formed with a plurality of positioning holes, and the other thereof is formed with a plurality of positioning pins. The plurality of positioning pins are adapted to be fitted in the plurality of positioning holes, respectively, so as to position the carrier on the tray.

According to a still another exemplary embodiment of the present disclosure, the carrier is provided with a clamp adapted to clamp and secure the soldering product to be detected.

According to a yet another exemplary embodiment of the present disclosure, the soldering product to be detected comprises a cable and a circuit board. The cable comprises a plurality of wires, conductors of which are soldered onto the circuit board. The carrier is provided with a first clamp for clamping the cable, a second clamp for clamping the plurality of wires, a third clamp for clamping the conductors of the plurality of wires, and a fourth clamp for clamping the circuit board.

According to a still another exemplary embodiment of the present disclosure, the tray is slidably mounted in the first accommodation chamber of the support cabinet to move between a loading station, a 2D detection station, a 3D detection station and an unloading station. When the tray is moved to the loading station, the tray is in an unobstructed state so as to mount the carrier loaded with the soldering product to be detected onto the tray. When the tray is moved to the 2D detection station, the soldering product to be detected on the tray is located immediately below the 2D image acquisition device. When the tray is moved to the 3D detection station, the soldering product to be detected on the tray is located immediately below the 3D image acquisition device. When the tray is moved to the unloading station, the tray is in an unobstructed state so as to remove the carrier loaded with the soldering product to be detected from the tray.

According to a further another exemplary embodiment of the present disclosure, the soldering quality detection platform further comprises a drive mechanism adapted to drive the tray to move between the loading station, the 2D detection station, the 3D detection station and the unloading station. According to a yet another exemplary embodiment of the present disclosure, the carrier is adapted to simultaneously be loaded with a plurality of soldering products to be detected so that a soldering quality detection of the plurality of soldering products to be detected is capable of being completed during a single detection process.

According to a still another exemplary embodiment of the present disclosure, the soldering quality detection platform further comprises: a human-machine interaction interface adapted to set operating parameters of the 2D image acquisition device and the 3D image acquisition device; a detection start button adapted to activate the 2D image acquisition device and the 3D image acquisition device to perform the soldering quality detection; and a state display lamp adapted to display current operating state of the soldering quality detection platform.

According to a further another exemplary embodiment of the present disclosure, the soldering quality detection platform further comprises an electric control cabinet onto which the human-machine interaction interface, the detection start button and the state display lamp are mounted.

According to a yet another exemplary embodiment of the present disclosure, the soldering quality detection platform further comprises a safety light curtain protection device comprising a light emitter emitting a light to cover an opening of the first accommodation chamber of the support cabinet in a manner of a light curtain, and a light receiver receiving the light emitted from the light emitter. The soldering quality detection platform immediately stops the detection to protect the safety of an operator when the safety light curtain protection device detects that an object is entering the light curtain.

According to a still another exemplary embodiment of the present disclosure, the light emitter and the light receiver of the safety curtain detector are mounted on side frames at both sides of the opening of the first accommodation chamber of the support cabinet, respectively.

In the foregoing embodiments according to the present disclosure, it is determined whether the soldering quality of the soldering product is qualified based on both the 2D and 3D image information of the soldered region of the soldering product, thereby improving accuracy of the judgment. Other objects and advantages of the present disclosure will become apparent from the following description of the present disclosure when taken in conjunction with the accompanying drawings, and may give a comprehensive understanding of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which:

Fig. 1 shows a schematic perspective view of a soldering quality detection platform according to an exemplary embodiment of the present disclosure;

Fig. 2 shows an enlarged schematic view of a carrier of the soldering quality detection platform shown in Fig. 1; and

Fig. 3 shows an operation process of the soldering quality detection platform shown in Fig. 1.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION

The technical solution of the present disclosure will be described hereinafter in further detail with reference to the following embodiments, taken in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar parts. The description of the embodiments of the present disclosure hereinafter with reference to the accompanying drawings is intended to explain the general inventive concept of the present disclosure and should not be construed as a limitation to the present disclosure.

In addition, in the following detailed description, for the sake of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may also be practiced without these specific details. In other instances, well-known structures and devices are illustrated schematically in order to simplify the drawing. According to a general concept of the present invention, there is provided a soldering quality detection platform, comprising: a 2D image acquisition device adapted to acquire a 2D image of soldered region of a soldering product to be detected; a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldering product to be detected; and a judgment device adapted to determine whether a soldering quality is qualified based on the acquired 2D and 3D images of the soldered region of the soldering product.

Fig. 1 shows a schematic perspective view of a soldering quality detection platform according to an exemplary embodiment of the present disclosure.

As shown in Fig. 1, in the illustrated embodiment, the soldering quality detection platform mainly comprises: a 2D (two-dimensional) image acquisition device 200, 210; a 3D (three-dimensional) image acquisition device 300; and a judgment device (not shown). The 2D image acquisition device 200, 210 is adapted to acquire a 2D image of soldered region of the soldering product 10, 20 to be detected. The 3D image acquisition device 300 is adapted to acquire a 3D image of the soldered regions of the soldering product 10, 20 to be detected. The judgment device is adapted to determine whether a soldering quality is qualified based on the acquired 2D and 3D images of the soldered region of the soldering product.

In an exemplary embodiment of the present disclosure, as shown in Fig.l, the soldering quality detection platform further comprises a display device 500 adapted to display a judgment result obtained by the judgment device.

In an exemplary embodiment of the present disclosure, the judgment device as described above may include a computer. The display device 500 may be a display connected to the computer.

In an exemplary embodiment of the present disclosure, as shown in Fig. l, the 2D image acquisition device 200, 210 is a 2D camera system adapted to capture the 2D image of the soldered region of the soldering product 10, 20 to be detected. In the illustrated embodiment, the 2D camera system comprises a 2D camera 200 and an illumination light source 210.

In an exemplary embodiment of the present disclosure, as shown in Fig. l, the 3D image acquisition device 300 as described above is a 3D camera system adapted to capture a 3D image of the soldered region of the soldering product 10, 20 to be detected. In the illustrated embodiment, the 3D camera system comprises a stereoscopic camera and a laser camera.

In an exemplary embodiment of the present disclosure, as shown in FIG. 1, the soldering quality detection platform further comprises a support cabinet 100 including a first accommodation chamber 101 and a second accommodation chamber 102 vertically spaced apart from each other. The first accommodation chamber 101 is located below the second accommodation chamber 102. The 2D image acquisition device 200, 210 and the 3D image acquisition device 300 are installed in the first accommodation chamber 101. The display device 500 is mounted in the second accommodation chamber 102.

Fig. 2 shows an enlarged schematic view of a carrier 400 of the soldering quality detection platform as shown in Fig. l.

In an exemplary embodiment of the present disclosure, as shown in Figs. 1 and 2, the soldering quality detection platform further comprises a carrier 400 adapted to be loaded with the soldering product 10, 20 to be detected.

In an exemplary embodiment of the present disclosure, as shown in Figs. 1 and 2, the soldering quality detection platform further comprises a tray 110 adapted to load the carrier 400.

As shown in Figs. 1 and 2, in the illustrated embodiment, one of the carrier 400 and the tray 110 is formed with a plurality of positioning holes 401, and the other thereof is formed with a plurality of positioning pins (not shown) adapted to be fitted within the plurality of positioning holes 401, respectively, so as to position the carrier 400 onto the tray 110.

As best shown in Fig. 2, in the illustrated embodiment, the carrier 400 is provided with a clamp 410, 411, 412, 420 adapted to clamp and secure the soldering product 10, 20 to be detected.

In the illustrated embodiment, as shown in Fig. 2, the soldering product 10, 20 to be detected comprises a cable 10 and a circuit board 20. The cable 10 comprises a plurality of wires 11, conductors 12 of which are soldered onto the circuit board 20. The carrier 400 is provided with a first clamp 410 for clamping the cable 10, a second clamp 411 for clamping the plurality of wires 11, a third clamp 412 for clamping the conductors 12 of the plurality of wires 11, and a fourth clamp 420 for clamping the circuit board 20.

In an exemplary embodiment of the present disclosure, as shown in Fig. l, the tray 110 is slidably mounted in the first accommodation chamber 101 of the support cabinet 100 to move between a loading station, a 2D detection station, a 3D detection station and an unloading station. When the tray 110 is moved to the loading station, the tray 110 is in an unobstructed state so as to mount the carrier 400 loaded with the soldering product 10, 20 to be detected onto the tray 110. When the tray 110 is moved to the 2D detection station, the soldering product 10, 20 to be detected on the tray 110 is located immediately below the 2D image acquisition device 200, 210. When the tray 110 is moved to the 3D detection station, the soldering product 10, 20 to be detected on the tray 110 is located immediately below the 3D image acquisition device 300. When the tray 110 is moved to the unloading station, the tray 110 is in the unobstructed state so as to remove the carrier 400 loaded with the soldering product 10, 20 to be detected from the tray 110.

Although not shown, in an exemplary embodiment of the present disclosure, the soldering quality detection platform may also comprise a drive mechanism adapted to drive the tray 110 to move between the loading station, the 2D detection station, the 3D detection station and the unloading station.

In an exemplary embodiment of the present disclosure, as shown in FIG. 2, the carrier 400 is adapted to be simultaneously loaded with a plurality of soldering products 10, 20 to be detected, such that the soldering quality detection of the plurality of soldering product to be detected can be completed during a single detection process. In the embodiment shown in Fig. 2, the carrier 400 is simultaneously loaded with two soldering products 10, 20 to be detected.

With continued reference to Fig. l, in the illustrated embodiment, the soldering quality detection platform may further comprise: a human- machine interaction interface 610 adapted to set operating parameters of the 2D image acquisition device 200, 210 and the 3D image acquisition device 300; a detection start button 620 adapted to activate the 2D image acquisition device 200, 210 and the 3D image acquisition device 300 to perform the soldering quality detection; and a state display lamp 630 adapted to display current operating state of the soldering quality detection platform.

With continued reference to Fig. l, in the illustrated embodiment, the soldering quality detection platform may also comprise an electric control cabinet 600. Thus, the aforementioned human-machine interaction interface 610, the detection start button 620, and the state display lamp 630 may be mounted onto the electronic control cabinet 600.

As shown in Fig. 1, in the illustrated embodiment, the soldering quality detection platform also comprises a safety light curtain protection device 700. The safety light curtain protection device 700 comprises a light emitter emitting a light to cover an opening of the first accommodation chamber 101 of the support cabinet 100 in a manner of a light curtain, and a light receiver receiving the light emitted from the light emitter. Thus, when the safety light curtain protection device 700 detects that an object is entering the light curtain, the soldering quality detection platform will immediately stop the detection to protect the safety of an operator.

As shown in Fig. 1, in the illustrated embodiment, the light emitter and the light receiver of the safety curtain detector 700 are mounted on side frames at both sides of the opening of the first accommodation chamber 101 of the support cabinet 100, respectively.

Fig. 3 shows the operation process of the soldering quality detection platform shown in Fig. 1. A complete detection process will be described in detail below with reference to Figs. 1-3.

Firstly, as shown in Fig. 2, loading two soldering products 10, 20 (hereinafter referred as a first soldering product and a second soldering product) to be detected onto the carrier 400,

then, moving the tray 110 to the loading station;

then, placing the carrier 400 loaded with the two soldering products 10, 20 to be detected onto the tray 110;

then, positioning the carrier 400 on the tray 110 with positioning pins precisely;

then, moving the tray 110 to the detection station;

then, pressing the detection start button 620 to perform the detection;

then, moving the first soldering product 10 on the tray 110 to the 3D detection station; then, moving the first soldering product 10 on the tray 110 to the 2D detection station; then, moving the second soldering product 20 on the tray 110 to the 3D detection station;

then, moving the second soldering product 20 on the tray 110 to the 2D detection station;

then, determining whether the soldering quality is qualified based on the acquired 2D and 3D images of the soldered regions of the soldering products 10, 20 and displaying the judgment result;

then, moving the tray 110 to the unloading station;

then, removing the carrier 400 from the tray 110;

Finally, removing the soldering products 10, 20 from the carrier 400.

In this way, the soldering quality detection of the two soldering products 10, 20 is completed.

It should be appreciated by those skilled in this art that the above embodiments are intended to be illustrative, and many modifications may be made to the above embodiments by those skilled in this art, and various structures described in various embodiments may be freely combined with each other without conflicting in configuration or principle.

Although the present disclosure has been described hereinbefore in detail with reference to the attached drawings, it should be appreciated that the disclosed embodiments in the attached drawings are intended to illustrate the preferred embodiments of the present disclosure by way of example, and should not be construed as limitation to the present disclosure.

Although several exemplary embodiments have been shown and described, it would be appreciated by those skilled in the art that various changes or modifications may be made to these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined by the claims and their equivalents.

It should be noted that, the word "comprise" doesn't exclude other elements or steps, and the word "a" or "an" doesn't exclude more than one. In addition, any reference numerals in the claims should not be interpreted as the limitation to the scope of the present disclosure.

Claims

What is claimed is,

1. A soldering quality detection platform comprising:

a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldering product to be detected;

a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldering product to be detected; and

a judgment device adapted to determine whether a soldering quality is qualified based on the acquired 2D and 3D images of the soldered region of the soldering product.

2. The soldering quality detection platform according to claim 1, further comprising a display device adapted to display a judgment result obtained by the judgment device.

3. The soldering quality detection platform according to claim 2, wherein

the 2D image acquisition device comprises a 2D camera system adapted to capture the 2D image of the soldered region of the soldering product to be detected; and

the 2D camera system comprises a 2D camera and an illumination light source.

4. The soldering quality detection platform according to claim 3, wherein

the 3D image acquisition device comprises a 3D camera system adapted to capture the 3D image of the soldered region of the soldering product to be detected; and

the 3D camera system comprises a stereoscopic camera and a laser camera.

5. The soldering quality detection platform according to claim 4, further comprising a support cabinet having a first accommodation chamber and a second accommodation chamber vertically spaced apart from each other, wherein

the 2D image acquisition device and the 3D image acquisition device are installed in the first accommodation chamber; and

the display device is mounted in the second accommodation chamber.

6. The soldering quality detection platform according to claim 5, further comprising a carrier adapted to be loaded with the soldering product to be detected.

7. The soldering quality detection platform according to claim 6, further comprising a tray adapted to be loaded with the carrier.

8. The soldering quality detection platform according to claim 7, wherein

one of the carrier and the tray is formed with a plurality of positioning holes, and the other thereof is formed with a plurality of positioning pins; and

the plurality of positioning pins are adapted to be fitted within the plurality of positioning holes, respectively, so as to position the carrier on the tray.

9. The soldering quality detection platform according to claim 8, wherein

the carrier is provided with a clamp adapted to clamp and secure the soldering product to be detected.

10. The soldering quality detection platform according to claim 9, wherein

the soldering product to be detected comprises a cable and a circuit board;

the cable comprises a plurality of wires, conductors of which are soldered onto the circuit board; and

the carrier is provided with a first clamp for clamping the cable, a second clamp for clamping the plurality of wires, a third clamp for clamping the conductors of the plurality of wires, and a fourth clamp for clamping the circuit board.

11. The soldering quality detection platform according to claim 7, wherein

the tray is slidably mounted in the first accommodation chamber of the support cabinet to move between a loading station, a 2D detection station, a 3D detection station and an unloading station;

when the tray is moved to the loading station, the tray is in an unobstructed state so as to mount the carrier loaded with the soldering product to be detected onto the tray;

when the tray is moved to the 2D detection station, the soldering product to be detected on the tray is located immediately below the 2D image acquisition device;

when the tray is moved to the 3D detection station, the soldering product to be detected on the tray is located immediately below the 3D image acquisition device; and

when the tray is moved to the unloading station, the tray is in an unobstructed state so as to remove the carrier loaded with the soldering product to be detected from the tray.

12. The soldering quality detection platform according to claim 11, further comprising a drive mechanism adapted to drive the tray to move between the loading station, the 2D detection station, the 3D detection station and the unloading station.

13. The soldering quality detection platform according to claim 11, wherein

the carrier is adapted to simultaneously be loaded with a plurality of soldering products to be detected so that a soldering quality detection of the plurality of soldering products to be detected is capable of being completed during a single detection process.

14. The soldering quality detection platform according to claim 11, further comprising: a human-machine interaction interface adapted to set operating parameters of the 2D image acquisition device and the 3D image acquisition device;

a detection start button adapted to activate the 2D image acquisition device and the 3D image acquisition device to perform the soldering quality detection; and

a state display lamp adapted to display current operating state of the soldering quality detection platform.

15. The soldering quality detection platform according to claim 14, further comprising an electric control cabinet onto which the human-machine interaction interface, the detection start button and the state display lamp are mounted.

16. The soldering quality detection platform according to claim 5, further comprising a safety light curtain protection device comprising a light emitter emitting a light to cover an opening of the first accommodation chamber of the support cabinet in a manner of a light curtain, and a light receiver receiving the light emitted from the light emitter,

wherein the soldering quality detection platform immediately stops the detection to protect the safety of an operator when the safety light curtain protection device detects that an object is entering the light curtain.

17. The soldering quality detection platform according to claim 16, wherein

the light emitter and the light receiver of the safety curtain detector are mounted on side frames at both sides of the opening of the first accommodation chamber of the support cabinet, respectively.