WO2017217171A1

WO2017217171A1 - Ic-embedded device

Info

Publication number: WO2017217171A1
Application number: PCT/JP2017/018445
Authority: WO
Inventors: 勝己谷口
Original assignee: 株式会社村田製作所
Priority date: 2016-06-14
Filing date: 2017-05-17
Publication date: 2017-12-21

Abstract

The purpose of the present invention is to implement an IC-embedded device with which: a region is ensured wherein required information is displayed; touch operation of said device is simple; and a high degree of security is achieved. Provided is an IC-embedded card (10) which is an IC-embedded device, comprising a substrate (100), a touch sensor (400), a plurality of ICs (201, 202), and a light emitting member further comprising a plurality of light emitting elements (510). The touch sensor (400) is embedded in the substrate (100), and detects an operation input upon the surface of the substrate (100). The ICs (201, 202) are embedded in the substrate (100). The plurality of light emitting elements (510) are embedded in the substrate (100), are controlled by the IC (201) or the IC (202) to emit light, and project the touch sensor (400) upon the surface.

Description

IC built-in device

The present invention relates to an IC built-in device having a touch operation receiving function.

IC card is one of the devices with built-in IC. In general, various information such as a photograph of the owner, the name of the owner, and a card number is described on the surface of the IC card. Furthermore, at present, as shown in Patent Document 1, the IC card performs various functions by external power feeding.

The IC card described in Patent Document 1 includes a touch input unit and a display unit together with an IC. The touch input unit and the display unit operate by external power feeding. The IC is built in the card base. The touch input unit and the display unit are arranged on the surface of the card base so as to be visible from the outside.

JP 2014-142750 A

However, as shown in Patent Document 1, when functional units such as a touch input unit and a display unit are arranged on the surface of the IC card, a display area of information related to the above-described IC card is limited. . As a result, necessary information may not be displayed.

Also, when the touch input unit is exposed on the surface, others other than the owner can easily know that the IC card has a touch input function. That is, the other person can easily know that the IC card has a functional unit that requires a predetermined security.

On the other hand, a configuration in which the touch input unit is built in the IC card so that the touch input unit cannot be seen from the outside is also conceivable. However, with this configuration, the owner cannot confirm the position of the touch input unit, and the touch operation becomes difficult.

Therefore, an object of the present invention is to provide an IC built-in device that secures an area for displaying necessary information, is easy to touch, and has high security.

The IC built-in device of the present invention includes a base, a touch sensor, an IC, and a light emitting member. The touch sensor is built in the base and detects an operation input to the surface of the base. The IC is built in the base. The light emitting member is built in the base body, light emission is controlled by the IC, and the touch sensor is projected onto the surface.

In this configuration, when the light emitting member is not emitting light, the touch sensor is not easily seen from the surface side. When the light emitting member emits light, the touch sensor is easily visually recognized from the surface side.

Further, the IC built-in device of the present invention preferably has the following configuration. The IC built-in device has an information display part on the surface on which information different from information suggesting the operation of the touch sensor is described. The information display unit is arranged to include an area overlapping the touch sensor when the base is viewed from the front side.

This configuration ensures a wide area for the information display section on the surface of the IC built-in device.

Further, the IC built-in device of the present invention preferably has the following configuration. The IC built-in device further includes an antenna conductor that is built in the base body and transmits / receives a radio signal. The antenna conductor is connected to the IC. As the light emission control, the IC causes the light emitting member to emit light by the voltage supplied through the antenna conductor.

In this configuration, the light emitting member emits light by external wireless power feeding. Thereby, it is easy to reduce the size and thickness of the IC-embedded device.

Further, the IC built-in device of the present invention preferably has the following configuration. The IC built-in device includes an auxiliary information display unit that projects information suggesting the operation of the touch sensor onto the surface by light emission of the light emitting member, between the surface of the substrate and the touch sensor.

In this configuration, information indicating the operation of the touch sensor is not displayed on the surface of the IC built-in device when no light is emitted. At the time of light emission, information suggesting the operation of the touch sensor is displayed on the surface of the IC built-in device.

In the IC built-in device of the present invention, the IC may perform light emission control in which only the touch position detected by the touch sensor is projected on the surface.

In this configuration, the touch position is easily visually recognized.

In the IC built-in device of the present invention, the base is preferably a card in which a plurality of resin layers are laminated.

In this configuration, the IC built-in device is reduced in size and thickness. If it becomes this structure, the merit of this invention that the area | region of an information display part is ensured will become large.

In the present invention, the light emitting member is preferably a light emitting diode disposed on the opposite side of the surface with the touch sensor interposed therebetween.

In this configuration, the power for light emission in the IC built-in device can be reduced, and the structure for projecting the touch sensor onto the surface is simplified. Therefore, this configuration works more effectively when the IC built-in device is a card.

According to this invention, the IC built-in device can secure a wide area for displaying necessary information. Furthermore, the IC built-in device can realize high security related to the touch operation while realizing easy touch operation on the IC built-in device.

1 is an exploded perspective view of an IC built-in card according to a first embodiment of the present invention. (A), (B), (C), (D) is an exploded plan view of the IC built-in card according to the first embodiment of the present invention. (A), (B) is an external perspective view of the IC built-in card according to the first embodiment of the present invention. It is an equivalent circuit diagram of the IC built-in card according to the first embodiment of the present invention. (A), (B), (C), (D), (E) are exploded plan views of the IC built-in card according to the second embodiment of the present invention. (A) and (B) are the external appearance perspective views of the IC built-in card based on the 2nd Embodiment of this invention. It is an equivalent circuit diagram of the IC built-in card according to the third embodiment of the present invention. It is an external appearance perspective view of the IC built-in card based on the 3rd Embodiment of this invention.

The IC built-in card corresponding to the IC built-in device according to the first embodiment of the present invention will be described with reference to the drawings. In the following embodiments including this embodiment, an IC built-in card is shown as an example of an IC built-in device. However, even if the shape of the substrate is not a card shape, the configuration of the present invention can be applied to obtain the effects of the present invention. However, the configuration of the present invention works more effectively as the substrate is smaller and thinner as in the case where the shape of the substrate is a card shape.

FIG. 1 is an exploded perspective view of an IC built-in card according to the first embodiment of the present invention. FIG. 2 is an exploded plan view of the IC built-in card according to the first embodiment of the present invention. 2A shows the first layer of the substrate, FIG. 2B shows the second layer of the substrate, FIG. 2C shows the third layer of the substrate, and FIG. Indicates the fourth layer of the substrate. 3A and 3B are external perspective views of the IC built-in card according to the first embodiment of the present invention. FIG. 2A shows a non-light emission state, and FIG. 2B shows a light emission time.

As shown in FIGS. 1, 2A to 2D, 3A, and 3B, the IC built-in card 10 includes a base 100, an antenna conductor 30, an IC 201, an IC 202, a touch sensor 400, A plurality of light emitting elements 510 are provided. The plurality of light emitting elements 510 correspond to the “light emitting member” of the present invention.

The substrate 100 includes a plurality of

resin layers

101, 102, 103, 104. The resin layer 101 is the first layer of the substrate 100, the resin layer 102 is the second layer of the substrate 100, the resin layer 103 is the third layer of the substrate 100, and the resin layer 104 is the fourth layer of the substrate 100. is there. The plurality of

resin layers

101, 102, 103, and 104 are made of an insulating material. The substrate 100 is a laminate in which a plurality of resin layers 101-104 are laminated. The substrate 100 has a card shape. That is, the planar shape of the substrate 100 is a polygon or a circle (in this embodiment, a quadrangle), and the thickness of the substrate 100 is small. For example, the thickness is small as compared with the quadratic orthogonal two sides forming the plane of the substrate 100.

The plurality of resin layers 101 to 104 are laminated in order of the resin layer 101, the resin layer 102, the resin layer 103, and the resin layer 104 from the surface side of the substrate 100. The light transmittance of the resin layer 101 is higher than the light transmittance of the plurality of resin layers 102-104. However, the light transmittance of the resin layer 101 is a light transmittance in which the structure in the base body 100 cannot be visually recognized unless light is transmitted from the inside of the base body 100 to the surface. On the other hand, the plurality of resin layers 102-104 have such a light transmittance that even if light is emitted inside the base body 100, this light does not leak to other than the surface side. As an example of a specific material, the resin layer 101 is made of ABS resin. The plurality of resin layers 102-104 are made of a liquid crystal polymer.

Next, a specific configuration of each resin layer 101-104 of the base body 100 will be described. In order to make the description easy to understand, the description will be made from the back side of the base body 100, that is, the resin layer 104, the resin layer 103, the resin layer 102, and the resin layer 101 in this order.

As shown in FIG. 1 and FIG. 2D, IC 201, IC 202, and a plurality of light emitting elements 510 are arranged on the surface of the resin layer 104. One of the IC 201 and the IC 202 can be omitted. The plurality of light emitting elements 510 correspond to the “light emitting member” of the present invention.

The plurality of light emitting elements 510 are arranged in a predetermined arrangement pattern in plan view of the resin layer 104 (base 100). For example, the plurality of light emitting elements 510 are two-dimensionally arranged in plan view. The plurality of light emitting elements 510 are preferably light emitting diodes. The plurality of light emitting elements 510 may not be light emitting diodes. However, when the plurality of light-emitting elements 510 are light-emitting diodes, the light-emitting elements can be reduced and the power for light emission can be reduced.

The plurality of

ICs

201 and 202 are arranged in an area different from the arrangement area of the plurality of light emitting elements 510 in a plan view of the resin layer 104 (base 100).

As shown in FIGS. 1 and 2C, an antenna conductor 30 is formed on the surface of the resin layer 103. The antenna conductor 30 is a linear loop conductor. The antenna conductor 30 is disposed in the vicinity of each side of the resin layer 103 and along each side.

1 and 2C, the resin layer 103 has a plurality of through

holes

131, 132, and 133 formed therein. As shown in FIGS. 1, 2C, and 2D, the through hole 131 includes the IC 201 in a plan view in a state of the base 100 (a state in which the resin layers 101 to 104 are laminated). Placed in position. The through hole 132 is arranged at a position including the IC 202 in a plan view in the state of the base body 100. The through hole 133 is disposed at a position including the plurality of light emitting elements 510 in a plan view in the state of the base body 100.

1 and 2B, the resin layer 102 includes a touch sensor 400. The touch sensor 400 includes a plurality of touch detection conductors 410 and a translucent part 420.

The plurality of touch detection conductors 410 are arranged in a predetermined arrangement pattern in plan view of the resin layer 102 (base 100). For example, the plurality of touch detection conductors 410 are two-dimensionally arranged in plan view.

The translucent part 420 is realized by making the transmissivity of a part of the resin layer 102 different from other parts. The light transmittance of the light transmitting portion 420 is higher than the light transmittance of the resin layer 102. The translucent part 420 transmits light from the resin layer 103 side to the resin layer 101 side (surface side of the base body 100) with a low attenuation. The translucent part 420 has a shape including the arrangement region of the plurality of touch detection conductors 410 in plan view of the resin layer 102 (base 100).

As shown in FIGS. 1, 2B, and 2C, the touch sensor 400 overlaps the through-hole 133 in a plan view in the state of the base body 100. In other words, as shown in FIGS. 1, 2B, and 2D, the touch sensor 400 overlaps an area where the plurality of light emitting elements 510 are arranged in a plan view in the state of the base body 100. ing. Thus, by providing the resin layer 103 with the through

holes

131, 132, and 133, the base body 100 can be thinned. Further, by providing the resin layer 103 with the through hole 133, the light emitted from the plurality of light emitting elements 510 is transmitted through the resin layer 102.

A plurality of

information display portions

111, 112, 113, 114, 115 (111-115) are provided on the surface of the resin layer 101. The plurality of information display units 111 to 115 are print objects made up of characters or images printed on the surface of the resin layer 101 or pasted objects made up of images or photos attached to the surface of the resin layer 101.

The plurality of information display portions 111 to 115 are arranged in a predetermined pattern on the surface of the resin layer 101. The region where the plurality of information display portions 111-115 are arranged is the entire surface of the resin layer 101. The information display unit 111 is a pasted object, for example, a photograph. Each of the information display units 112-115 is a print object, for example, a character.

As shown in FIG. 2A, FIG. 2B, and FIG. 3B, at least a part of the plurality of information display portions 113-115 is viewed from the surface side of the substrate 100 (in plan view). , Which overlaps the touch sensor 400. The information display portions 113 to 115 are regions with high translucency.

As shown in FIGS. 2A, 2B, and 3B, the plurality of

information display units

111 and 112 do not overlap the touch sensor 400 in plan view of the base body 100. The

information display units

111 and 112 do not need to be regions with high light transmittance, and may be regions with low light transmittance.

With such a configuration, when the plurality of light emitting elements 510 emit light, this light is transmitted through the light transmitting portion 420 of the touch sensor 400 and projected onto the surface of the substrate 100. And since the resin layer 101 which forms the surface of the base | substrate 100 has high translucency, this light is radiate | emitted to the surface side of the base | substrate 100, and the holder of the IC built-in card | curd 10 can visually recognize this light. At this time, since the plurality of touch detection conductors 410 have a low transmissivity compared to the light transmitting portion 420, when the plurality of light emitting elements 510 emit light, shadows of the plurality of touch detection conductors 410 are formed on the surface of the base 100. Reflect. Therefore, the holder of the IC built-in card 10 can visually recognize the positions of the plurality of touch detection conductors 410.

The IC built-in card 10 having such a configuration realizes the circuit shown in FIG. FIG. 4 is an equivalent circuit diagram of the IC built-in card according to the first embodiment of the present invention.

The antenna conductor 30 forms a loop antenna. Both ends of the antenna conductor 30 are connected to the control IC 20. The control IC 20 is realized by the IC 201 and the IC 202 shown in FIGS. 1 and 2D. The control IC 20 is connected to the touch detection unit 40 and the light emitting member 50. The touch detection unit 40 includes a plurality of touch detection conductors 410 of the touch sensor 400 illustrated in FIGS. 1 and 2D. The touch detection unit 40 detects a touch position on the surface of the base body 100 by an electrostatic method or a resistance method. The light emitting member 50 includes a plurality of light emitting elements 510 shown in FIGS. 1 and 2D.

The control IC 20 is activated when wireless power feeding (non-contact power feeding) is performed from the outside via the antenna conductor 30. After activation, the control IC 20 controls the light emission of the light emitting member 50 and causes the plurality of light emitting elements 510 to emit light.

Further, the control IC 20 acquires the touch position detected by the touch detection unit 40 and executes a predetermined process. For example, the control IC 20 executes a process with high security using the touch position. As a specific example, the control IC 20 has high security such as accepting an input of a personal identification number using the touch position and collating the personal identification number by wireless communication (non-contact communication) using the antenna conductor 30. Execute the process.

Since the IC built-in card 10 having such a structure has the above-described structure, as shown in FIG. 3A, if the plurality of light emitting elements 510 are not emitting light, Only a plurality of information display sections 111-115 are displayed. The touch sensor 400 is not displayed on the surface of the IC built-in card 10. Therefore, the holder of the IC built-in card 10 can visually recognize only the characters and images described in the plurality of information display units 111 to 115 and cannot visually recognize the touch sensor 400.

On the other hand, when the plurality of light emitting elements 510 emit light by the above-described light emission control, the touch sensor 400 is projected on the surface of the IC built-in card 10 as shown in FIG. Further, the shadows of the plurality of touch detection conductors 410 are displayed on the surface of the IC built-in card 10. Therefore, the holder of the IC built-in card 10 can visually recognize the touch sensor 400 and the plurality of touch detection conductors 410 disposed inside the base body 100.

As described above, by using the configuration of the present embodiment, the owner's general information (general card number, name, photo, and other relatively low security information) is transferred to the surface of the IC built-in card 10. be written. At this time, the area in which the general information is described is not easily limited by the area in which the touch sensor 400 is disposed. Therefore, an area for describing general information on the surface of the IC built-in card 10 can be widened, and more general information can be described. This general information corresponds to “information different from information suggesting operation of the touch sensor” of the present invention.

On the other hand, security information (information with relatively high security such as the position of a touch sensor for inputting a password) is not displayed on the surface of the IC built-in card 10 unless the plurality of light emitting elements 510 emit light. That is, simply holding the IC built-in card 10 cannot easily recognize that the IC built-in card 10 has a function for realizing high security.

And security information (information with relatively high security such as the position of a touch sensor for inputting a password) is displayed on the surface of the IC built-in card 10 when a plurality of light emitting elements 510 emit light. That is, for example, when the IC built-in card 10 is placed in or close to a predetermined device and power is supplied to the IC built-in card 10, the plurality of light emitting elements 510 emit light, and the holder can easily touch the touch position of the touch sensor 400. Visible to. Thereby, the holder can easily perform a touch operation.

The IC built-in card 10 having such a configuration can be manufactured by the following method.

First, for each of the plurality of

resin layers

102, 103, 104, conductor patterning, formation of through holes, mounting of components, and the like are performed. Specifically, the touch sensor 400 is formed on the resin layer 102. The antenna conductor 30 is formed on the resin layer 103, and a plurality of through

holes

131, 132, and 133 are formed. IC 201, IC 202, and a plurality of light emitting elements 510 are mounted on the resin layer 104.

A plurality of

resin layers

102, 103, 104 are laminated and heated and pressed. At this time, by providing the through

holes

131, 132, and 133, the IC 201, IC 202, and the plurality of light emitting elements 510 are accommodated in the through

holes

131, 132, and 133, respectively, and include the plurality of

resin layers

102, 103, and 104. The thickness of the laminate is reduced.

Then, the resin layer 101 in which the plurality of information display portions 111 to 115 are arranged is attached to the surface of the laminate composed of the plurality of

resin layers

102, 103, and 104 (the surface of the resin layer 102).

Thus, by using the manufacturing method in the present embodiment, the thin IC built-in card 10 can be easily manufactured.

Next, an IC built-in card according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 5 is an exploded plan view of an IC built-in card according to the second embodiment of the present invention. 5A shows the first layer of the substrate, FIG. 5B shows the fifth layer of the substrate, FIG. 5C shows the second layer of the substrate, and FIG. Shows the third layer of the substrate, and FIG. 5E shows the fourth layer of the substrate. 6A and 6B are external perspective views of the IC built-in card according to the second embodiment of the present invention. FIG. 5A shows a non-light emission state, and FIG. 5B shows a light emission time.

As shown in FIG. 5, the IC built-in card 10A according to this embodiment is different from the IC built-in card 10 according to the first embodiment in that a resin layer 105 is added. Other configurations of the IC built-in card 10A are the same as those of the IC built-in card 10 according to the first embodiment, and the description of the same portions is omitted.

IC built-in card 10 </ b> A includes a resin layer 105. The resin layer 105 is the fifth layer of the base. The resin layer 105 is disposed between the resin layer 101 and the resin layer 102. The resin layer 105 includes a plurality of auxiliary information display units 610. The plurality of auxiliary information display portions 610 are portions that display information that is auxiliary to the touch operation, and are portions that display information with higher security than general information. For example, as shown in FIG. 6B, a symbol mark such as a number. In the resin layer 105, the light transmittance of the plurality of auxiliary information display portions 610 is lower than the light transmittance of a region different from the plurality of auxiliary information display portions 610. For example, the plurality of auxiliary information display units 610 are realized by through holes formed in the resin layer 105.

The plurality of auxiliary information display units 610 overlap with the plurality of touch detection conductors 410 in plan view.

With such a configuration, as shown in FIG. 6B, a plurality of auxiliary information display units 610 are projected onto the surface of the substrate 100 during light emission. Therefore, the holder can visually recognize a plurality of auxiliary information display units 610. Thereby, the holder can perform a touch operation more easily.

In addition, it is preferable that the transmissivity of the area | region different from the some auxiliary information display part 610 in the resin layer 105 is very low. Accordingly, the plurality of auxiliary information display units 610 are projected more clearly on the surface of the base body 100. Therefore, the holder can visually recognize the plurality of auxiliary information display units 610 more clearly and easily.

Next, an IC built-in card according to a third embodiment of the present invention will be described with reference to the drawings. FIG. 7 is an equivalent circuit diagram of an IC built-in card according to the third embodiment of the present invention. FIG. 8 is an external perspective view of an IC built-in card according to the third embodiment of the present invention. FIG. 8 shows a state where the touch position is detected.

The IC built-in card 10B according to the present embodiment is different from the IC built-in card 10A according to the second embodiment in the connection configuration of a plurality of light emitting elements 510. Other configurations of the IC built-in card 10B are the same as those of the IC built-in card 10A according to the second embodiment, and the description of the same portions is omitted.

The IC built-in card 10B includes a plurality of light emitting elements 510 (1) -510 (n). In the example of FIG. 7, n = 12. The plurality of light emitting elements 510 (1) -510 (n) are individually connected to the control IC 20.

When the control IC 20 acquires the touch position (the position where the finger F in FIG. 8 touches the surface of the IC built-in card 10B) from the touch detection unit 40, the control IC 20 switches the light emitting elements 510 (1) -510 (n) according to the touch position. The light emission control for selecting and emitting light is performed. For example, as shown in FIG. 8, when the touch operation of the touch detection conductor 410 at the position corresponding to “1” of the plurality of auxiliary information display units 610 is detected, the light emitting element 510 (1) at the position corresponding to these is emitted. Let

By performing such a configuration and light emission control, the holder can easily recognize the touch position. Thereby, the holder can perform a touch operation more easily and reliably.

In each of the above-described embodiments, the touch sensor 400 and the arrangement region of the plurality of light emitting elements 510 overlap each other when the base (IC built-in card) is viewed in plan. That is, the mode in which the plurality of light emitting elements 510 are arranged on the opposite side of the surface of the substrate with the touch sensor 400 interposed therebetween is shown. However, an aspect in which the plurality of light emitting elements 510 are arranged at positions that do not overlap with the touch sensor 400 in the base body 100 and a position in which the plurality of light emitting elements 510 are not opposite to the surface of the base body with the touch sensor 400 interposed therebetween. It is also possible to use the embodiment. In this case, a light guide member that guides light emitted from the plurality of light emitting elements 510 to the touch sensor 400 may be provided.

Further, in the aspect in which the entire touch sensor 400 described above is projected onto the surface of the substrate, the number of the light emitting elements may be one, and the number of the touch detection conductors 410 may not be matched.

10, 10A, 10B: IC built-in card 20: control IC
30: Antenna conductor 40: Touch detection unit 50: Light emitting member 100:

Substrate

101, 102, 103, 104, 105:

Resin layer

111, 112, 113, 114, 115:

Information display unit

131, 132, 133: Through hole 201 202: IC
400: Touch sensor 410: Touch detection conductor 420: Translucent part 510: Light emitting element 610: Auxiliary information display part

Claims

A substrate;
A touch sensor that is built in the base and detects a touch operation on the surface of the base;
An IC built in the substrate;
A light emitting member built in the base body, light emission controlled by the IC, and projecting the touch sensor onto the surface;
IC built-in device.
An information display unit on which information different from information suggesting the operation of the touch sensor is described is provided on the surface,
The information display unit is disposed including an area overlapping the touch sensor when the base is viewed from the front side.
The IC built-in device according to claim 1.
An antenna conductor incorporated in the base body;
The antenna conductor is connected to the IC;
The IC causes the light emitting member to emit light by power feeding through the antenna conductor as the light emission control.
The IC built-in device according to claim 2.
An auxiliary information display unit that projects information suggesting operation of the touch sensor onto the surface by light emission of the light emitting member is provided between the surface of the base and the touch sensor.
The IC built-in device according to claim 2 or 3.
The IC performs the light emission control in which only the touch position detected by the touch sensor is projected onto the surface.
The IC built-in device according to any one of claims 1 to 4.
The base is a card in which a plurality of resin layers are stacked.
The IC built-in device according to claim 2.
The light emitting member is a light emitting diode disposed on the opposite side of the surface across the touch sensor.
The IC built-in device according to any one of claims 1 to 6.